Multilayer wiring board

The multilayer wiring board addresses low adhesion issues by incorporating grooves and functional layers with specific roughness ratios, enhancing adhesion and reliability for high-frequency applications.

JP7877692B2Active Publication Date: 2026-06-23TOPPAN HOLDINGS INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
TOPPAN HOLDINGS INC
Filing Date
2022-01-19
Publication Date
2026-06-23

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Abstract

To provide a multilayer wiring board that achieves excellent adhesion between two adjacent insulating layers.SOLUTION: A multilayer wiring board 1 is a plurality of insulating layers stacked on top of each other. On one of the two adjacent insulating layers, a groove part is provided on a surface adjacent to the other insulating layer. The surface of the other insulating layer adjacent to the one insulating layer includes a plurality of insulating layers in which a surface roughness Ra1 of a first surface area corresponding to the groove part is smaller than a surface roughness Ra2 of a second surface area corresponding to the other position, and a conductor layer including a wiring part in which the groove part is embedded.SELECTED DRAWING: Figure 2
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