Resin composition for encapsulation, and method for manufacturing a semiconductor package

Abstract

To provide a sealing resin composition excellent in yield of product of semiconductor package, because a sealing material with which a surface is uniformly polished when formed a sealing material on a substrate, further, because a wiring formed in the process thereafter can be formed accurately on the sealing material.SOLUTION: A sealing resin composition of the present invention is used for a wafer level package, and includes (A) an epoxy resin, (B) an inorganic filler, and (C) a carboxylic acid dispersant, and an amount of warpage of a cured product of the sealing resin composition measured under the following condition is 1.1 mm or less. (Conditions) Using a compression molding machine, the sealing resin composition was compression molded at 150°C for 300 seconds on a silicon wafer with a thickness of 775 μm and a diameter of 12 inches, and then Post Mold Cure (PMC) is performed at 150°C for 4 hours to obtain a 500 μm thick cured product of the sealing resin composition. Place the obtained silicon wafer with the obtained cured product so that the silicon wafer surface is in contact with a horizontal precision stone surface plate, and measure a height from the precision stone surface plate to the silicon wafer at 8 points that divide an outer periphery into 8 equal parts. An average value of the heights of the 8 points is defined as the wafer warpage amount [mm].SELECTED DRAWING: None

Claims

1. A sealing resin composition used in wafer-level packages, (A) Epoxy resin and (B) Inorganic fillers, (C) A carboxylic acid-based dispersant, The epoxy resin (A) contains a biphenyl aralkyl type epoxy resin. The inorganic filler (B) consists of silica. A sealing resin composition in which the cured product of the sealing resin composition measured under the following conditions has a curing amount of 1.1 mm or less. (conditions) Using a compression molding machine, the sealing resin composition is compression molded onto a silicon wafer with a thickness of 775 μm and a diameter of 12 inches at 150°C for 300 seconds. Then, a Post Mold Cure (PMC) is performed at 150°C for 4 hours to obtain a cured product of the sealing resin composition with a thickness of 500 μm. The obtained cured silicon wafer is placed so that the silicon wafer surface is in contact with a precision granite surface plate that is horizontal, and the height from the precision granite surface plate to the silicon wafer is measured at eight points, which are eight equal parts of the outer edge, and the average of these eight heights is taken as the wafer warp [mm].

2. The flexural modulus of the cured product of the aforementioned sealing resin composition is 8,000 N / mm² at room temperature (25°C). ２ 20,000N / mm or more ２ The encapsulating resin composition according to claim 1, which is as follows:

3. The cured product of the aforementioned sealing resin composition has a flexural strength of 40 N / mm at room temperature of 25°C. ２ The above is the sealing resin composition according to claim 1.

4. The sealing resin composition according to any one of claims 1 to 3, wherein the glass transition temperature of the cured product of the sealing resin composition is 100°C or higher.

5. The encapsulating resin composition according to any one of claims 1 to 4, wherein the carboxylic acid-based dispersant (C) comprises at least one compound represented by the following general formula (1). 【Chemistry 1】 (In general formula (1), R represents a carboxyl group, a hydroxyl group, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkylcarboxyl group having 1 to 5 carbon atoms, an alkoxycarboxyl group having 1 to 5 carbon atoms, an alkyl alcohol group having 1 to 5 carbon atoms, or an alkoxy alcohol group having 1 to 5 carbon atoms. Multiple Rs may be the same or different. X represents an oxygen atom, an alkylene group having 1 to 30 carbon atoms, a divalent linear hydrocarbon group having 1 to 30 carbon atoms with one or more double bonds, or a divalent linear hydrocarbon group having 1 to 30 carbon atoms with one or more triple bonds. Multiple Xs may be the same or different. n is an integer from 0 to 20, and m is an integer from 1 to 5.)

6. The encapsulating resin composition according to any one of claims 1 to 5, wherein the content of the carboxylic acid-based dispersant (C) is 0.05% by mass or more and 5.0% by mass or less.

7. The encapsulating resin composition according to any one of claims 1 to 6, further comprising a low-stress agent (D).

8. The encapsulating resin composition according to claim 7, wherein the low-stress agent (D) comprises a polyether-modified silicone oil.

9. A process of placing multiple semiconductor chips on a substrate, A step of sealing the semiconductor chip on the substrate on which the semiconductor chip is placed with a cured product of the sealing resin composition according to any one of claims 1 to 8, The process of separating the semiconductor chip into individual pieces, A method for manufacturing a semiconductor package that includes [the specified component].

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