Vehicle light-emitting element, vehicle light-emitting element package, vehicle light source unit, vehicle lighting unit, vehicle lighting

Abstract

To provide a vehicle light emitting element, a vehicle light emitting element package, a vehicle light source unit, a vehicle lamp unit, and a vehicle lamp which can provide a high heat discharge effect.SOLUTION: A vehicle light emitting element 1A includes: a heat discharge substrate 2; a laminate unit 3 joined to one surface of the heat discharge substrate 2 at one surface; and a light emitting surface 4 as another surface of the laminate unit 3, the light emitting surface 4 emitting light by supplying power to the laminate unit 3. The laminate unit 3 includes: an electrode layer 34 on the light emitting surface 4 side; a metal bonding layer 36 joined to one surface of the heat discharge substrate 2; and an insulation layer 60 laminated between the electrode layer 34 and the metal bonding layer 36. Since the insulation layer 60 can join another surface of the heat discharge substrate 2 to a heat sink 200, a high heat discharge effect can be obtained.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] This invention relates to a vehicle light-emitting element, a vehicle light-emitting element package, a vehicle light source unit, a vehicle lamp unit, and a vehicle lamp.

Background Art

[0002] As a vehicle light-emitting element, for example, there is one shown in Patent Document 1 below. Hereinafter, Patent Document 1 will be described.

[0003] The optoelectronic semiconductor chip (hereinafter referred to as "semiconductor chip") of Patent Document 1 includes a carrier (heat dissipation substrate) made of semiconductor, and a semiconductor body having a semiconductor laminate, one surface (lower surface) of which is disposed on one surface (upper surface) of the carrier, and the carrier and the semiconductor body are electrically connected. When power is supplied to the semiconductor body through the carrier, the other surface (upper surface) of the semiconductor body emits light.

[0004] The carrier is used as a substrate on the back surface of the semiconductor chip and also as a heat dissipation substrate. Further, as the carrier, a semiconductor having a low coefficient of thermal expansion and a high thermal conductivity, for example, silicon (Si) is used.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, the semiconductor chip described in Patent Document 1 uses a semiconductor as a carrier, and moreover, the carrier and the semiconductor body are electrically connected. For this reason, it is impossible to directly bond (connect) the other side (bottom surface) of the carrier of the semiconductor chip described in Patent Document 1 to the heat sink of a conductive heat dissipation member, and it is necessary to interpose an insulator (insulating layer) between the carrier and the heat sink. As a result, the semiconductor chip described in Patent Document 1 has a problem in obtaining a high heat dissipation effect.

[0007] The problem that this invention aims to solve is to provide a vehicle light-emitting element, a vehicle light-emitting element package, a vehicle light source unit, a vehicle lighting unit, and a vehicle lighting fixture that can achieve a high heat dissipation effect. [Means for solving the problem]

[0008] The vehicle light-emitting element of this invention comprises a heat dissipation substrate, a laminated portion whose one surface is bonded to one surface of the heat dissipation substrate, and a light-emitting surface on the other surface of the laminated portion that emits light when power is supplied to the laminated portion, wherein the laminated portion has an electrode layer on the light-emitting surface side, a metal bonding layer bonded to one surface of the heat dissipation substrate, and an insulating layer laminated between the electrode layer and the metal bonding layer.

[0009] In the vehicle light-emitting element of this invention, it is preferable that the laminated portion comprises a first semiconductor layer having a light-emitting surface on one side, a light-emitting layer laminated on the other side of the first semiconductor layer, a second semiconductor layer laminated on the light-emitting layer, an electrode layer laminated on the second semiconductor layer, at least one rod provided between the electrode layer and the first semiconductor layer, electrically connecting the electrode layer and the first semiconductor layer and electrically insulated from the light-emitting layer and the second semiconductor, an insulating layer laminated on the electrode layer, a metal bonding layer laminated on the insulating layer, a first electrode provided on the electrode layer, and a second electrode provided on the second semiconductor layer.

[0010] In the vehicle light-emitting element of this invention, it is preferable that a reflective layer is laminated between the second semiconductor layer and the electrode layer.

[0011] In the vehicle light-emitting element of this invention, a barrier layer is laminated between the second semiconductor layer and the reflective layer, and between the reflective layer and the electrode layer, and a barrier layer is provided between the rod and the light-emitting layer, the second semiconductor layer and the reflective layer.

[0012] In the vehicle light-emitting element of this invention, it is preferable that the heat dissipation substrate is made of silicon, which is a semiconductor with high thermal conductivity.

[0013] In the vehicle light-emitting device of this invention, it is preferable that the first electrode is provided on one side of the light-emitting surface and the second electrode is provided on the other side of the light-emitting surface.

[0014] In the vehicle light-emitting device of this invention, it is preferable that the first electrode and the second electrode are provided on one side of the light-emitting surface, respectively.

[0015] The vehicle light-emitting element package of this invention is characterized by comprising: at least one vehicle light-emitting element of this invention; a thermal pad on which the other surface of the heat dissipation substrate of the vehicle light-emitting element is bonded to one surface; a first surface electrode and a second surface electrode arranged side by side in the plane direction of one surface of the thermal pad; a conductive member that electrically connects the laminated portion of the vehicle light-emitting element to one surface of the first surface electrode and one surface of the second surface electrode; a package made of an insulating material that electrically insulates and holds the thermal pad, the first surface electrode and the second surface electrode from each other, and opens the other side of the thermal pad while closing the other side of the first surface electrode and the other side of the second surface electrode; a phosphor provided on at least the light-emitting surface of the vehicle light-emitting element; an exposed surface of the vehicle light-emitting element that is not covered by the thermal pad and the phosphor, one surface of the thermal pad, a part of one surface of the first surface electrode and the second surface electrode, and the conductive member.

[0016] In the vehicle light-emitting element package of this invention, it is preferable that the thermal pad is made from a thin metal plate with high thermal conductivity.

[0017] In the vehicle light-emitting element package of this invention, it is preferable that a bonding member made of a material with high thermal conductivity is interposed between the heat dissipation substrate of the vehicle light-emitting element and one surface of the thermal pad.

[0018] In the vehicle light-emitting element package of this invention, it is preferable that the first surface electrode is located on one side of the thermal pad, and the second surface electrode is located on the other side of the thermal pad.

[0019] In the vehicle light-emitting element package of this invention, it is preferable that the first surface electrode and the second surface electrode are each arranged on one side of the thermal pad.

[0020] The vehicle light source unit of this invention is characterized by comprising at least one vehicle light-emitting element package of this invention, a heat sink member on which the other side of the thermal pad of the vehicle light-emitting element package is bonded to the mounting surface, a circuit board attached to the mounting surface of the heat sink member, and an electrical connection member that electrically connects the first surface electrode and the second surface electrode of the vehicle light-emitting element package and the circuit board.

[0021] In the vehicle light source unit of this invention, it is preferable that an adhesive member made of a material with high thermal conductivity is interposed between the other side of the thermal pad of the vehicle light-emitting element package and the mounting surface of the heat sink member.

[0022] The vehicle lighting unit of this invention is characterized by comprising: a vehicle light source unit of this invention; a connector member for electrically connecting the circuit board of the vehicle light source unit to a power supply source; and an optical member for emitting light emitted from the vehicle light source unit as a vehicle light distribution pattern.

[0023] The vehicle lamp of this invention is a vehicle lamp equipped on a vehicle, and includes a vehicle lamp unit of this invention and a lamp chamber forming member that forms a lamp chamber, and is characterized in that the vehicle lamp unit is disposed inside the lamp chamber.

Advantages of the Invention

[0024] The light-emitting element for vehicle, the light-emitting element package for vehicle, the light source unit for vehicle, the lamp unit for vehicle, and the vehicle lamp of this invention can obtain a high heat dissipation effect.

Brief Description of the Drawings

[0025] [Figure 1] FIG. 1 is a front view (viewed in the direction of arrow I in FIG. 2) showing Embodiment 1 of the light-emitting element for vehicle according to this invention. [Figure 2] FIG. 2 is a longitudinal sectional view (sectional view taken along line II-II in FIG. 1) showing the light-emitting element for vehicle of Embodiment 1. [Figure 3] FIG. 3 is an explanatory view (longitudinal sectional view corresponding to FIG. 2) showing the manufacturing process of the light-emitting element for vehicle of Embodiment 1. FIG. 3(A) is an explanatory view showing the first manufacturing process (the process of growing a stacked portion on a sapphire substrate). FIG. 3(B) is an explanatory view showing the second manufacturing process (the process of bonding (connecting) one surface of the substrate to the stacked portion grown on the sapphire substrate via a metal bonding layer). FIG. 3(C) is an explanatory view showing the third manufacturing process (the process of rotating the sapphire substrate, the stacked portion, the substrate, and the metal bonding layer by 180°, and removing the sapphire substrate from the stacked portion, the substrate, and the metal bonding layer). FIG. 3(D) is an explanatory view showing the fourth manufacturing process (the process of performing etching twice). [Figure 4] FIG. 4 is an explanatory view showing Embodiment 1 of the light-emitting element package for vehicle according to this invention. FIG. 4(A) is a front view (viewed in the direction of arrow IVA in FIG. 4(B)) showing the light-emitting element package for vehicle of Embodiment 1. FIG. 4(B) is a longitudinal sectional view (sectional view taken along line IVB-IVB in FIG. 4(A)) showing the light-emitting element package for vehicle of Embodiment 1. [Figure 5]Figure 5 is an explanatory diagram showing Embodiment 2 of the vehicle light-emitting element package according to the present invention. Figure 5(A) is a front view (viewed along the VA arrow in Figure 5(B)) of the vehicle light-emitting element package of Embodiment 2. Figure 5(B) is a longitudinal cross-sectional view (cross-sectional view along the VB-VB line in Figure 5(A)) of the vehicle light-emitting element package of Embodiment 2. [Figure 6] Figure 6 is an explanatory diagram showing Embodiment 1 of the vehicle light source unit according to the present invention. Figure 6(A) is a perspective view showing the vehicle light source unit of Embodiment 1. Figure 6(B) is an exploded perspective view showing the vehicle light source unit of Embodiment 1. [Figure 7] Figure 7 is a longitudinal cross-sectional view (cross-sectional view along line VII-VII in Figure 6(A)) showing the vehicle light source unit of Embodiment 1. [Figure 8] Figure 8 is a front view (viewed from the front of the vehicle) of an embodiment of the vehicle lighting device according to this invention, showing the device in use. [Figure 9] Figure 9 is an exploded perspective view showing Embodiment 1 of the vehicle lighting unit according to the present invention. [Figure 10] Figure 10 is an explanatory diagram showing the light distribution pattern for a vehicle emitted from a vehicle lighting unit of Embodiment 1. Figure 10(A) is an explanatory diagram showing the low beam light distribution pattern. Figure 10(B) is an explanatory diagram showing the high beam light distribution pattern. [Figure 11] Figure 11 is a front view (enlarged front view of part XI in Figure 13) showing Embodiment 3 of the vehicle light-emitting element package according to the present invention. [Figure 12] Figure 12 is a vertical cross-sectional view (cross-sectional view along line XII-XII in Figure 8) showing an embodiment of a vehicle lighting device according to the present invention and an embodiment 2 of a vehicle lighting device unit according to the present invention. [Figure 13] Figure 13 is an exploded perspective view showing a vehicle lighting unit according to Embodiment 2. [Figure 14]Figure 14 is an explanatory diagram showing the variable-beam light distribution pattern emitted from a vehicle lighting unit of Embodiment 2. Figure 14(A) is an explanatory diagram showing the variable-beam light distribution pattern emitted from the vehicle lighting unit of the vehicle lighting unit on the left. Figure 14(B) is an explanatory diagram showing the variable-beam light distribution pattern emitted from the vehicle lighting unit of the vehicle lighting unit on the right. Figure 14(C) is an explanatory diagram showing a state in which a portion of the variable-beam light distribution pattern emitted from the vehicle lighting unit of the vehicle lighting unit on the left is turned off (dimmed). Figure 14(D) is an explanatory diagram showing a state in which a portion of the variable-beam light distribution pattern emitted from the vehicle lighting unit of the vehicle lighting unit on the right is turned off (dimmed). [Figure 15] Figure 15 is a front view (viewed from arrow XV in Figure 16(A)) showing Embodiment 2 of the vehicle light-emitting element according to the present invention. [Figure 16] Figure 16(A) is a longitudinal cross-sectional view (cross-sectional view along the line XVIA-XVIA in Figure 15) showing the vehicle light-emitting element of Embodiment 2. Figure 16(B) is a longitudinal cross-sectional view (cross-sectional view along the line XVIB-XVIB in Figure 15) showing the vehicle light-emitting element of Embodiment 2. Figure 16(C) is a longitudinal cross-sectional view (cross-sectional view along the line XVIC-XVIC in Figure 15) showing the vehicle light-emitting element of Embodiment 2. [Figure 17] Figure 17 is a front view (corresponding to Figure 4(A)) showing Embodiment 4 of the vehicle light-emitting device package according to the present invention. [Figure 18] Figure 18(A) is a longitudinal cross-sectional view (cross-sectional view along line XVIIIA-XVIIIA in Figure 17) showing the vehicle light-emitting element package of Embodiment 4. Figure 18(B) is a longitudinal cross-sectional view (cross-sectional view along line XVIIIB-XVIIIB in Figure 17) showing the vehicle light-emitting element package of Embodiment 4. [Figure 19] Figure 19 is a front view (corresponding to Figure 11) showing Embodiment 5 of the vehicle light-emitting device package according to the present invention. [Modes for carrying out the invention]

[0026] Hereinafter, embodiments (examples) of the vehicle light-emitting element, vehicle light-emitting element package, vehicle light source unit, vehicle lighting unit, and vehicle lighting according to this invention will be described based on the drawings. In this specification and drawings, front, rear, top, bottom, left, and right refer to the front, rear, top, bottom, left, and right when the vehicle light-emitting element, vehicle light-emitting element package, vehicle light source unit, vehicle lighting unit, and vehicle lighting according to this invention are installed on a vehicle.

[0027] In the drawings, since they are schematic diagrams, only the main components are shown, and the depiction of components other than the main components is omitted, as well as some of the hatching. Hatching is omitted in Figures 3, 5(B), 16, and 18. In Figures 10 and 14, the reference numerals "VU-VD" indicate the top and bottom vertical lines of the screen, and the reference numerals "HL-HR" indicate the left and right horizontal lines of the screen.

[0028] (Description of the configuration of the vehicle light-emitting element 1A) The configuration of the vehicle light-emitting element 1A according to Embodiment 1 will be described below with reference to Figures 1 to 3. As shown in Figures 1 to 3, the vehicle light-emitting element 1A comprises a heat dissipation substrate (carrier) 2, a laminated portion (semiconductor chip, LED chip) 3, and a light-emitting surface 4. The front shape of the vehicle light-emitting element 1A (shape when the vehicle is viewed from the front of the vehicle) is a rectangular shape, as shown in Figure 1.

[0029] The heat dissipation substrate 2 is a heat dissipation substrate with a rectangular planar shape and is also used as the substrate on the back surface (bottom surface in Figure 2) of the laminated section 3. The heat dissipation substrate 2 is made of a semiconductor with a low coefficient of thermal expansion and high thermal conductivity, in this example, silicon (Si). However, other materials besides silicon, such as a metal plate with high thermal conductivity, may also be used for the heat dissipation substrate 2. A backside metal 20 made of a material with high thermal conductivity, such as gold (Au) in this example, is provided on one side of the heat dissipation substrate 2 (bottom surface in Figure 2).

[0030] One side of the laminated portion 3 (the bottom surface or back surface in Figure 2) is joined (connected) to the other side of the heat dissipation substrate 2 (the top surface in Figure 2) via the metal bonding layer 36 described later.

[0031] The light-emitting surface 4 is formed on the other side of the laminated section 3 (the top surface, or front surface in Figure 2), and emits light when power is supplied to the laminated section 3. The front shape of the light-emitting surface 4 is a rectangular shape, slightly smaller than the planar shape of the vehicle light-emitting element 1A.

[0032] The laminated portion 3 includes a first semiconductor layer 31, an emissive layer 30, a second semiconductor layer 32, a first barrier layer 51, a reflective layer 33, a second barrier layer 52 and a third barrier layer 53, an electrode layer 34 and a plurality of rods 35, an insulating layer 60 and a third insulating portion 63, a metal bonding layer 36, a first insulating portion 61 and a second insulating portion 62, a first electrode layer 71 and a first electrode 710, a second electrode layer 72 and a second electrode 720.

[0033] In this example, the first semiconductor layer 31 is an N-type semiconductor layer (N-clad layer; a layer of a mixture of GaN and Si), and has an emissive surface 4 on one side (the top surface in Figure 2).

[0034] In this example, the light-emitting layer 30 is made of indium gallium nitride (InGaN) and is laminated on the other side of the first semiconductor layer 31 (in Figure 2, the bottom side, i.e., the side opposite to the light-emitting surface 4).

[0035] In this example, the second semiconductor layer 32 is a P-type semiconductor layer (P-clad layer; a layer of a mixture of GaN and Mg) and is laminated on one side (the bottom side in Figure 2) of the light-emitting layer 30.

[0036] In this example, the first barrier layer 51 is made of an oxide of nickel (Ni), titanium (Ti), or tantalum (Ta), or a nitride such as titanium nitride (TiN), and is laminated on one side (the bottom side in Figure 2) of the second semiconductor layer 32.

[0037] In this example, the reflective layer 33 is made of a metal such as silver (Ag), aluminum (Al), or DBR, and is laminated on one surface (the bottom surface in Figure 2) of the first barrier layer 51.

[0038] The second barrier layer 52, like the first barrier layer 51, in this example is made of an oxide of nickel (Ni), titanium (Ti), or tantalum (Ta), or a nitride such as titanium nitride (TiN), and is laminated on one surface (the bottom surface in Figure 2) of the reflective layer 33.

[0039] The third barrier layer 53, like the first barrier layer 51 and the second barrier layer 52, in this example is made of an oxide of nickel (Ni), titanium (Ti), or tantalum (Ta), or a nitride such as titanium nitride (TiN), and is deposited on the walls of the through-holes (vias) opened in the light-emitting layer 30, the second semiconductor layer 32, the first barrier layer 51, the reflective layer 33, and the second barrier layer 52. The third barrier layer 53 is provided on the walls of the through-holes at the same time that the second barrier layer 52 is laminated on the reflective layer 33 after the through-holes have been opened in the light-emitting layer 30, the second semiconductor layer 32, the first barrier layer 51, and the reflective layer 33.

[0040] The electrode layer 34, like the first semiconductor layer 31, is an N-type semiconductor layer in this example and is laminated on one side (the bottom side in Figure 2) of the second barrier layer 52.

[0041] The multiple rods 35, like the first semiconductor layer 31 and the electrode layer 34, are N-type semiconductors in this example and are provided between the electrode layer 34 and the first semiconductor layer 31, electrically connecting the electrode layer 34 and the first semiconductor layer 31. Furthermore, the multiple rods 35 are electrically insulated from the light-emitting layer 30, the second semiconductor layer 32, and the reflective layer 33. That is, a third barrier layer 53 is provided between the multiple rods 35 and the light-emitting layer 30, the second semiconductor layer 32, and the reflective layer 33. The multiple rods 35 are provided by laminating the electrode layer 34 on the second barrier layer 52 and simultaneously interposing the third barrier layer 53 in the through holes. Note that a larger number of rods 35 is preferable because it increases the light-emitting efficiency of the light-emitting layer 30, but too many rods are undesirable because it reduces the light-emitting area of ​​the light-emitting layer 30. For this reason, the number of rods 35 should be an appropriate number. Alternatively, the number of rods 35 may be just one.

[0042] In this example, the insulating layer 60 is made of silicon dioxide (SiO2) or the like, and is laminated on one surface (the bottom surface in Figure 2) of the electrode layer 34. In this example, the thickness of the insulating layer 60 is less than 600 nm.

[0043] The insulating portion 63, like the insulating layer 60, is made of silicon dioxide (SiO2) or the like in this example, and is provided on the four sides of the following parts of the laminated portion 3. The parts on which the insulating portion 63 is provided on the four sides are the first semiconductor layer 31, the light-emitting layer 30, the second semiconductor layer 32, the first barrier layer 51, the reflective layer 33, the second barrier layer 52, the third barrier layer 53, the electrode layer 34 having multiple rods 35, and the insulating layer 60.

[0044] In this example, the metal bonding layer 36 is made of gold (Au), indium (In), titanium (Ti), etc., and is laminated on one surface (the bottom surface in Figure 2) of the insulating layer 60. The metal bonding layer 36 is interposed between the insulating layer 60 and the heat dissipation substrate 2.

[0045] The first insulating portion 61, like the insulating layer 60 and insulating portion 63, is in this example made of silicon dioxide (SiO2) or the like, and is provided on one side (the right side in Figure 2) of the first semiconductor layer 31, the light-emitting layer 30, the second semiconductor layer 32, and the reflective layer 33 that have been removed by etching.

[0046] The second insulating portion 62, like the insulating layer 60, insulating portion 63, and first insulating portion 61, is in this example made of silicon dioxide (SiO2) or the like, and is provided on the other side (left side in Figure 2) of the first semiconductor layer 31 and light-emitting layer 30 that have been removed by etching.

[0047] The first electrode layer 71 is a conductive material and is laminated on one side (the right side in Figure 2) of the electrode layer 34 (the top surface in Figure 2). The portion of the electrode layer 34 on one side is formed by etching away the portions of the first semiconductor layer 31, the light-emitting layer 30, the second semiconductor layer 32, and the reflective layer 33.

[0048] The first electrode 710 is a conductive material similar to the first electrode layer 71, and in this example, it consists of bonding pads, three of which are provided at equal intervals on one surface of the first electrode layer 71 (the top surface in Figure 2). As a result, the first electrode 710 is provided on one side of the light-emitting surface 4 (the right side in Figures 1 and 2).

[0049] The second electrode layer 72 is a conductive material similar to the first electrode layer 71 and the first electrode 710, and is laminated on one surface (the top surface in Figure 2) of the other side (the right side in Figure 2) of the second semiconductor layer 32. The other side of the second semiconductor layer 32 is formed by etching away the other side of the first semiconductor layer 31 and the light-emitting layer 30.

[0050] The second electrode 720 is a conductive material similar to the first electrode layer 71, the first electrode 710, and the second electrode layer 72. In this example, it consists of bonding pads, and three of them are provided at equal intervals on one surface of the second electrode layer 72 (the top surface in Figure 2). As a result, the second electrode 720 is provided on the other side of the light-emitting surface 4 (the left side in Figures 1 and 2).

[0051] (Explanation of the manufacturing process for vehicle light-emitting element 1A) The vehicle-mounted light-emitting element 1A is manufactured using a general LED manufacturing process. The manufacturing process for the vehicle-mounted light-emitting element 1A will be described below with reference to Figures 2 and 3.

[0052] In the first manufacturing process, as shown in Figure 3(A), a first semiconductor layer 31, an emissive layer 30, a second semiconductor layer 32, a first barrier layer 51, a reflective layer 33, a second barrier layer 52 and a third barrier layer 53, an electrode layer 34 and multiple rods 35, an insulating layer 60 and insulating portion 63, and a metal bonding layer 36 are sequentially deposited on the upper surface of a sapphire substrate (for example, a substrate wafer such as alumina (Al2O3) or GaN) 40 to form a laminated portion 3. That is, the laminated portion 3 (epitaxial) is sequentially deposited (grown) on the upper surface of the sapphire substrate 40 by an epitaxial crystal growth process using metal-organic vapor deposition (MOCVD).

[0053] In the second manufacturing step, as shown in Figure 3(B), one surface of the laminated portion 3 (the top surface in Figure 3) is joined to one surface of the heat dissipation substrate 2 (the bottom surface in Figure 2) via a metal bonding layer 36 (see the white arrow).

[0054] In the third manufacturing step, as shown in Figure 3(C), the sapphire substrate 40, the heat dissipation substrate 2, and the laminated section 3 are rotated 180° and inverted. The sapphire substrate 40 is removed from the light-emitting surface 4 of the first semiconductor layer 31 of the laminated section 3 (see the white arrow).

[0055] In the fourth manufacturing step, as shown in Figure 3(D), two etching steps (see white arrows) are performed to remove one side of the first semiconductor layer 31, the light-emitting layer 30, the second semiconductor layer 32, and the reflective layer 33, exposing one side of the electrode layer 34, and to remove the other side of the first semiconductor layer 31 and the light-emitting layer 30, exposing the other side of the second semiconductor layer 32.

[0056] In the fifth manufacturing step, as shown in Figure 2, a first insulating portion 61 is provided on one side surface of the first semiconductor layer 31, light-emitting layer 30, second semiconductor layer 32, and reflective layer 33 that have been removed by etching. In addition, a second insulating portion 62 is provided on the other side surface of the first semiconductor layer 31 and light-emitting layer 30 that have been removed by etching.

[0057] Furthermore, in the fifth manufacturing step, as shown in Figure 2, a first electrode layer 71 is stacked on one side (the top surface in Figure 2) of the electrode layer 34 exposed by etching, and three first electrodes 710 are provided at equal intervals on one side (the top surface in Figure 2) of the first electrode layer 71. In addition, a second electrode layer 72 is stacked on one side (the top surface in Figure 2) of the second semiconductor layer 32 exposed by etching, and three second electrodes 720 are provided at equal intervals on one side (the top surface in Figure 2) of the second electrode layer 72.

[0058] Furthermore, in the fifth manufacturing step, as shown in Figure 2, one end of three first wires 41, which serve as conductive members of the vehicle light-emitting element package 100A described later, as shown in Figures 4 and 5, is connected to the three first electrodes 710, and similarly, one end of three second wires 42, which serve as conductive members of the vehicle light-emitting element package 100A, is connected to the three second electrodes 720. In this example, the first wires 41 and second wires 42 are made of gold (Au), etc.

[0059] The vehicle light-emitting element 1A is manufactured through the first to fifth manufacturing processes described above.

[0060] (Explanation of the operation of the vehicle light-emitting element 1A) The vehicle light-emitting element 1A according to this embodiment 1 has the configuration described above, and its operation will be explained below.

[0061] Power is supplied to the three first wires 41 and the three second wires 42. As a result, electrons flow from the first wire 41 → first electrode 710 → first electrode layer 71 → electrode layer 34 → rod 35 → first semiconductor layer 31 → light-emitting layer 30 → second semiconductor layer 32 → second electrode layer 72 → second electrode 720 → second wire 42. Current flows in the opposite direction to the electrons, from the second wire 42 → second electrode 720 → second electrode layer 72 → second semiconductor layer 32 → light-emitting layer 30 → first semiconductor layer 31 → rod 35 → electrode layer 34 → first electrode layer 71 → first electrode 710 → first wire 41.

[0062] As a result, one surface (the top surface in Figure 2) and the other surface (the bottom surface in Figure 2) of the light-emitting layer 30 emit light. Light from one surface of the light-emitting layer 30 passes through the first semiconductor layer 31 and is emitted outwards from the light-emitting surface 4. On the other hand, light from the other surface of the light-emitting layer 30 passes through the second semiconductor layer 32 and the first barrier layer 51 and is reflected by the reflective layer 33. This reflected light again passes through the first barrier layer 51 and the second semiconductor layer 32, and further passes through the light-emitting layer 30 and the first semiconductor layer 31 and is emitted outwards from the light-emitting surface 4. As a result, the light-emitting surface 4 emits light in a rectangular shape when viewed from the front.

[0063] The heat generated in the light-emitting layer 30 of the laminated section 3 is mainly conducted from the second semiconductor layer 32 → first barrier layer 51 → reflective layer 33 → second barrier layer 52 → electrode layer 34 → insulating layer 60 → metal bonding layer 36 → heat dissipation substrate 2. The heat conducted to the heat dissipation substrate 2 is transferred, for example, via the thermal pad 100 of the vehicle light-emitting element package 100A (see Figure 4(B)) to the heat sink 200 of the heat dissipation member of the vehicle light source unit 200A (see Figures 6 and 7), and is released to the outside from the heat sink 200.

[0064] (Explanation of the effect of the vehicle light-emitting element 1A) The vehicle light-emitting element 1A according to this embodiment 1 has the configuration and operation described above, and its effects will be explained below.

[0065] The vehicle light-emitting element 1A according to this embodiment 1 comprises a heat dissipation substrate 2, a laminated portion 3, and a light-emitting surface 4. The laminated portion 3 has an electrode layer 34 on the light-emitting surface 4 side, a metal bonding layer 36 bonded to one surface of the heat dissipation substrate 2, and an insulating layer 60 laminated between the electrode layer 34 and the metal bonding layer 36. In other words, the vehicle light-emitting element 1A according to this embodiment 1 electrically insulates the electrode layer 34 on the light-emitting surface 4 side and the metal bonding layer 36 on the heat dissipation substrate 2 side by the insulating layer 60. As a result, the vehicle light-emitting element 1A according to this embodiment 1 can be directly bonded to the heat sink 200 of the heat dissipation member described later, which has conductivity, via a thermal pad 100 described later, which has high thermal conductivity and conductivity, without interposing an insulator (insulating layer).

[0066] Thus, the vehicle light-emitting element 1A according to this embodiment 1 does not require an insulator (insulating layer) to be interposed between the heat dissipation substrate 2 and the heat sink 200 of the heat dissipation member, unlike the semiconductor chip described in Patent Document 1. Therefore, the heat generated in the laminated portion 3 can be transferred to the heat sink 200 of the heat dissipation member via the heat dissipation substrate 2 and the thermal pad 100, resulting in a high heat dissipation effect. As a result, the vehicle light-emitting element 1A according to this embodiment 1 can use high power (for example, 1W or more) and emit light with high output (high luminosity, high brightness, high light quantity).

[0067] The vehicle light-emitting element 1A according to this embodiment 1 has a laminated portion 3 which is made up of a first semiconductor layer 31, an emissive layer 30, a second semiconductor layer 32, an electrode layer 34, a plurality of rods 35, an insulating layer 60, and a metal bonding layer 36. As a result, in the vehicle light-emitting element 1A according to this embodiment 1, the insulating layer 60 laminated between the electrode layer 34 and the metal bonding layer 36 can be made thin, for example, to less than 600 nm. Therefore, even if the thermal conductivity of the insulating layer 60 is low, the heat conduction from the laminated portion 3 to the heat dissipation substrate 2 is high (thermal resistance is low), and a high heat dissipation effect can be maintained.

[0068] In this embodiment 1, the vehicle light-emitting element 1A is configured such that an electrode layer 34, which is laminated with a light-emitting layer 30 and a second semiconductor layer 32 in between, and a first semiconductor layer 31 are electrically connected by a rod 35, a first electrode 710 is provided on the electrode layer 34, and a second electrode 720 is provided on the second semiconductor layer 32. As a result, in this embodiment 1, since there are no components such as a first wire 41 on the light-emitting surface 4 of one side of the first semiconductor layer 31, the efficiency of light extraction from the light-emitting surface 4 is increased, and the luminous efficiency of the light-emitting surface 4 can be increased.

[0069] The vehicle light-emitting element 1A according to this embodiment 1 is formed by laminating a reflective layer 33 between the second semiconductor layer 32 and the electrode layer 34. Therefore, the reflective layer 33 can reflect the light emitted from the light-emitting layer 30 towards the heat dissipation substrate 2 towards the light-emitting surface 4. As a result, the vehicle light-emitting element 1A according to this embodiment 1 can increase the luminous efficiency of the light-emitting surface 4.

[0070] The vehicle light-emitting element 1A according to this embodiment 1 has a first barrier layer 51 laminated between the second semiconductor layer 32 and the reflective layer 33, a second barrier layer 52 laminated between the reflective layer 33 and the electrode layer 34, and a third barrier layer 53 provided between the rod 35 and the light-emitting layer 30, the second semiconductor layer 32, and the reflective layer 33. As a result, the vehicle light-emitting element 1A according to this embodiment 1 can prevent deterioration of the electrical characteristics of the light-emitting layer 30, the second semiconductor layer 32, the reflective layer 33, the electrode layer 34, and the rod 35 due to the first barrier layer 51, the second barrier layer 52, and the third barrier layer 53, thereby improving durability.

[0071] In this embodiment 1, the vehicle light-emitting element 1A uses a semiconductor with high thermal conductivity, in this example silicon (Si), as the heat dissipation substrate 2. Therefore, the heat generated in the laminated portion 3 can be efficiently transferred via the heat dissipation substrate 2 to the conductor or semiconductor to which the heat dissipation substrate 2 is joined, thereby achieving a high heat dissipation effect.

[0072] Furthermore, the vehicle light-emitting element 1A according to this embodiment 1 uses a semiconductor, in this example silicon (Si), which is cheaper than expensive ceramics (such as aluminum nitride (AlN)), as the heat dissipation substrate 2. Therefore, compared to a heat dissipation substrate that uses expensive ceramics (such as aluminum nitride (AlN)), the manufacturing cost can be reduced.

[0073] In this embodiment 1, the vehicle light-emitting element 1A has a first electrode 710 provided on one side (right side) of the light-emitting surface 4, and a second electrode 720 provided on the other side (left side) of the light-emitting surface 4. As a result, when the vehicle light-emitting element 1A according to this embodiment 1 is incorporated into the vehicle light-emitting element package 100A described later in Figure 4, the first electrode 710 can be easily electrically connected to the first surface electrode 101 located on one side (right side) of the thermal pad 100 of the vehicle light-emitting element package 100A, and the second electrode 720 can be easily electrically connected to the second surface electrode 102 located on the other side (left side) of the thermal pad 100 of the vehicle light-emitting element package 100A. This simplifies the manufacturing process and reduces manufacturing costs.

[0074] Furthermore, when multiple vehicle light-emitting elements 1A according to this embodiment 1, for example three, are incorporated into the vehicle light-emitting element package 100B shown in Figure 5, the first electrode 710 of the right vehicle light-emitting element 1A can be easily electrically connected to the first surface electrode 101 located on one side (right side) of the thermal pad 100 of the vehicle light-emitting element package 100B, the second electrode 720 of the right vehicle light-emitting element 1A can be easily electrically connected to the first electrode 710 of the intermediate vehicle light-emitting element 1A, the second electrode 720 of the intermediate vehicle light-emitting element 1A can be easily electrically connected to the first electrode 710 of the left vehicle light-emitting element 1A, and the second electrode 720 of the left vehicle light-emitting element 1A can be easily electrically connected to the second surface electrode 102 located on the other side (left side) of the thermal pad 100 of the vehicle light-emitting element package 100B. This simplifies the manufacturing process of the multi-chip vehicle light-emitting element package 100B and reduces manufacturing costs.

[0075] Furthermore, when multiple vehicle light-emitting elements 1A according to this embodiment 1, for example four or more, are incorporated into the vehicle light-emitting element package 100C shown in Figure 11, the first electrodes 710 of the four or more vehicle light-emitting elements 1A can be easily electrically connected to the first surface electrode 101 located on one side (the right side of the light-emitting surface 4) of the vehicle light-emitting element package 100C, and the second electrodes 720 of the four or more vehicle light-emitting elements 1A can be easily electrically connected to the second surface electrode 102 located on the other side (the left side of the light-emitting surface 4) of the vehicle light-emitting element package 100C. This simplifies the manufacturing process of the multi-chip vehicle light-emitting element package 100C and reduces manufacturing costs.

[0076] (Description of the configuration of the vehicle light-emitting element package 100A) The configuration of the vehicle light-emitting element package 100A according to Embodiment 1 will be described below with reference to Figure 4. In Figure 4, the same reference numerals as in Figures 1 to 3 indicate the same components.

[0077] As shown in Figure 4, the vehicle light-emitting element package 100A comprises one vehicle light-emitting element 1A as shown in Figures 1 to 3, a thermal pad (lead frame) 100, a first surface electrode 101 and a second surface electrode 102, a first wire 41 and a second wire 42 as conductive members, a package 103, a phosphor 104, a sealing member 105, and a bonding member 106.

[0078] The thermal pad 100 is made from a material with high thermal conductivity, in this example, a metal component such as a copper alloy. The thermal pad 100 consists of a thin metal plate. One surface of the thermal pad 100 (the top surface in Figure 4(B)) is provided with a bonding member 106 for bonding the vehicle light-emitting element 1A. The bonding member 106 is made from a material with high thermal conductivity, in this example, a gold (Au) bump or a gold-tin alloy (AuSn) reflow. The back surface of the heat dissipation substrate 2 of the vehicle light-emitting element 1A is bonded to one surface of the thermal pad 100 via the bonding member 106 and the backside metal 20 on the back surface of the heat dissipation substrate 2. The backside metal 20, as mentioned above, is made from a material with high thermal conductivity, such as gold (Au), similar to the bonding member 106.

[0079] The first surface electrode 101 and the second surface electrode 102 are arranged side by side on both sides of the thermal pad 100 (left and right sides in Figure 4) in the planar direction of one surface of the thermal pad 100. In this example, the first surface electrode 101 is arranged side by side on the right side of the thermal pad 100, and the second surface electrode 102 is arranged side by side on the left side of the thermal pad 100. One surface of the first surface electrode 101 (top surface in Figure 4) and one surface of the second surface electrode 102 (top surface in Figure 4) are approximately flush with one surface of the thermal pad 100.

[0080] In this example, the first wire 41 and the second wire 42, which serve as conductive members, are gold (Au) wires, etc. The first wire 41 electrically connects one surface of the first surface electrode 101 to the first electrode 710 of the laminated portion 3 of the vehicle light-emitting element 1A, and the second wire 42 electrically connects one surface of the second surface electrode 102 to the second electrode 720 of the laminated portion 3 of the vehicle light-emitting element 1A.

[0081] In this example, package 103 is made of an insulating material such as epoxy. Package 103 holds the thermal pad 100, the first surface electrode 101, and the second surface electrode 102 while electrically insulating them from each other. Package 103 has an opening on the other side of the thermal pad 100 (the bottom side in Figure 4) and closes the other side (the bottom side in Figure 4) and the side (the side opposite to the side facing the thermal pad 100, which is the left side in Figure 4) of the first surface electrode 101, and the other side (the bottom side in Figure 4) and the side (the side opposite to the side facing the thermal pad 100, which is the right side in Figure 4) of the second surface electrode 102.

[0082] One side of the phosphor 104 (the bottom side in Figure 4) is bonded to at least the light-emitting surface 4 of the vehicle light-emitting element 1A via a light-transmitting adhesive. The phosphor 104 covers the light-emitting surface 4. The phosphor 104 is excited by, for example, blue light emitted from the light-emitting surface 4 of the vehicle light-emitting element 1A and emits yellow light, and the combination of this blue light and yellow light produces white light. The phosphor 104 emits light incident from one side to the outside through the emission surface 107 on the other side (the top side in Figure 4). Thus, the other side of the phosphor 104 is the emission surface 107 through which the light emitted from the light-emitting surface 4 is emitted to the outside. In addition to bonding with an adhesive, there is also a means of direct bonding (bonding by physical force) between the light-emitting surface 4 of the vehicle light-emitting element 1A and one side of the phosphor 104 by mirror polishing both surfaces, raising the temperature, and pressing them together.

[0083] In this example, the sealing member 105 is a white resin material (a mixture of silicone and titanium dioxide (TiO2)) and is opaque to light. The sealing member 105 seals the exposed surfaces of the vehicle light-emitting element 1A that are not covered by the thermal pad 100 and phosphor 104, i.e., the four sides of the heat dissipation substrate 2 and the laminated portion 3, one surface of the thermal pad 100, i.e., the surface to which the vehicle light-emitting element 1A is not bonded, a portion of one surface of the first surface electrode 101 and the second surface electrode 102, i.e., a portion adjacent to the thermal pad 100, and the first wire 41 and the second wire 42 as conductive members. The sealing member 105 prevents light (blue light) from leaking from the light-emitting surface 4 of the vehicle light-emitting element 1A.

[0084] Furthermore, the remaining portion of one side of the first surface electrode 101 and the second surface electrode 102 is exposed, neither sealed by the sealing member 105 nor blocked by the package 103. The exposed first surface electrode 101 and the second surface electrode 102 are electrically connected to the circuit board 210 of the vehicle light source unit 200A described later, via the electrical connection members 221 and 222 described later.

[0085] (Explanation of the operation of the vehicle light-emitting element package 100A) The vehicle light-emitting element package 100A according to this embodiment 1 has the configuration described above, and its operation will be explained below.

[0086] Power is supplied to the first surface electrode 101 and the second surface electrode 102. As a result, electrons flow from the first surface electrode 101 → first wire 41 → first electrode 710 (first electrode layer 71) → laminated portion 3 of the vehicle light-emitting element 1A → second electrode 720 (second electrode layer 72) → second wire 42 → second surface electrode 102. Current flows in the opposite direction to the electrons, from the second surface electrode 102 → second wire 42 → second electrode 720 (second electrode layer 72) → laminated portion 3 of the vehicle light-emitting element 1A → first electrode 710 (first electrode layer 71) → first wire 41 → first surface electrode 101. As a result, the light-emitting surface 4 of the vehicle light-emitting element 1A emits light, and that light is emitted to the outside from the emission surface 107 of the phosphor 104 of the vehicle light-emitting element package 100A.

[0087] The heat generated in the laminated portion 3 of the vehicle light-emitting element 1A is mainly transferred to the thermal pad 100 via the heat dissipation substrate 2. The heat conducted to the thermal pad 100 is then transferred to the heat sink 200 of the heat dissipation member of the vehicle light source unit 200A described later, and released to the outside from the heat sink 200.

[0088] (Explanation of the effects of the vehicle light-emitting element package 100A) The vehicle light-emitting element package 100A according to this embodiment 1 has the configuration and operation described above, and its effects will be explained below.

[0089] In this embodiment 1, the vehicle light-emitting element package 100A is electrically insulated from each other by a package 103 made of an insulating material, which insulates the thermal pad 100, the first surface electrode 101, and the second surface electrode 102. As a result, in this embodiment 1, the vehicle light-emitting element package 100A can bond the back surface of the heat dissipation substrate 2 of the vehicle light-emitting element 1A to one surface of the thermal pad 100, so that the entire back surface of the heat dissipation substrate 2 of the vehicle light-emitting element 1A can be used for heat dissipation.

[0090] As described above, the vehicle light-emitting element package 100A according to this embodiment 1 is configured such that the heat generated in the laminated portion 3 of the vehicle light-emitting element 1A is transferred to the heat sink 200 of the heat dissipation member described later via a thermal pad 100 with high thermal conductivity, thereby enabling high heat dissipation. As a result, the vehicle light-emitting element package 100A according to this embodiment 1 can use high power (for example, 1W or more) and emit light with high output (high luminosity, high brightness, high light quantity).

[0091] Furthermore, in this embodiment 1, since the other side of the thermal pad 100 of the vehicle light-emitting element package 100A is open from the package 103, the heat generated in the laminated portion 3 of the vehicle light-emitting element 1A can be transferred to the heat sink 200 of the heat dissipation member via the heat dissipation substrate 2 and the thermal pad 100 through a short heat transfer path, thereby achieving a high heat dissipation effect.

[0092] On the other hand, in the vehicle light-emitting element package 100A according to this embodiment 1, the laminated portion 3 of the vehicle light-emitting element 1A and the first surface electrode 101 and the second surface electrode 102 are electrically connected by the first wire 41 and the second wire 42. As a result, in the vehicle light-emitting element package 100A according to this embodiment 1, the vehicle light-emitting element 1A can be electrically connected to the circuit board 210 described later by electrically connecting the first surface electrode 101 and the second surface electrode 102 to the circuit board 210 described later via the electrical connection members 221 and 222 described later.

[0093] Furthermore, in this embodiment 1, the vehicle light-emitting element package 100A has its back and sides of the first surface electrode 101 and the second surface electrode 102 closed by the package 103. Therefore, even if the other side of the thermal pad 100 is joined to the heat sink 200 of the heat dissipation member described later, the package 103 electrically insulates the first surface electrode 101 and the second surface electrode 102 from the heat sink 200 of the heat dissipation member described later, and does not affect the electrical connection between the laminated portion 3 of the vehicle light-emitting element 1A and the first surface electrode 101 and the second surface electrode 102.

[0094] In this embodiment 1, the vehicle light-emitting element package 100A has a thermal pad 100 made from a thin metal plate. Therefore, the thermal expansion coefficient of the thermal pad 100 can be made close to that of the heat sink 200 of the heat dissipation member described later. As a result, when the thermal pad 100 is joined to the heat sink 200 of the heat dissipation member described later, no problems will occur due to the difference in thermal expansion coefficients between the thermal pad 100 and the heat sink 200 of the heat dissipation member described later.

[0095] Furthermore, in this embodiment 1, the vehicle light-emitting element package 100A has a thermal pad 100 made from a thin metal plate. Therefore, the area of ​​the thermal pad 100 can be arbitrarily adjusted, and by increasing the area of ​​the thermal pad 100, the thermal resistance of the thermal pad 100 can be reduced, thereby achieving a high heat dissipation effect.

[0096] In this embodiment 1, the vehicle light-emitting element package 100A has a bonding member 106 and backside metal 20 interposed between the back surface of the heat dissipation substrate 2 of the vehicle light-emitting element 1A and one surface of the thermal pad 100, which are made of materials with high thermal conductivity. Therefore, the heat generated in the laminated portion 3 of the vehicle light-emitting element 1A can be transferred to the heat sink 200 of the heat dissipation member via the heat dissipation substrate 2 and thermal pad 100, which have high thermal conductivity, and via the bonding member 106 and backside metal 20, thereby achieving a high heat dissipation effect.

[0097] In this embodiment 1, the vehicle light-emitting element package 100A has a first surface electrode 101 positioned on one side (right side) of the thermal pad 100, and a second surface electrode 102 positioned on the other side (right side) of the thermal pad 100. As a result, in this embodiment 1, when the back surface of the heat dissipation substrate 2 of the vehicle light-emitting element 1A is bonded to one surface of the thermal pad 100, the first electrode 710 of the vehicle light-emitting element 1A can be aligned with the first surface electrode 101, and the second electrode 720 of the vehicle light-emitting element 1A can be aligned with the second surface electrode 102.

[0098] As a result, in this embodiment 1, the vehicle light-emitting element package 100A can be easily electrically connected between the first surface electrode 101 and the first electrode 710 with the first wire 41, and between the second surface electrode 102 and the second electrode 720 with the second wire 42, thereby simplifying the manufacturing process and reducing manufacturing costs.

[0099] (Description of the configuration of the vehicle light-emitting element package 100B) The configuration of the vehicle light-emitting element package 100B according to Embodiment 2 will be described below with reference to Figure 5. In Figure 5, the same reference numerals as in Figures 1 to 4 indicate the same components.

[0100] The aforementioned vehicle light-emitting element package 100A uses one of the aforementioned vehicle light-emitting elements 1A. In contrast, the vehicle light-emitting element package 100B uses three of the aforementioned vehicle light-emitting elements 1A, electrically connected in series and arranged in a row (left-right direction). For this reason, the vehicle light-emitting element package 100B is longer in the left-right direction than the vehicle light-emitting element package 100A, allowing three vehicle light-emitting elements 1A to be arranged in the left-right direction.

[0101] The vehicle light-emitting element package 100B electrically connects the first electrode 710 of the right-hand vehicle light-emitting element 1A to the first surface electrode 101 located to the right of the thermal pad 100 of the vehicle light-emitting element package 100B using a first wire 41. The second electrode 720 of this right-hand vehicle light-emitting element 1A is electrically connected to the first electrode 710 of the intermediate vehicle light-emitting element 1A using a third wire 43, which acts as a conductive material. The second electrode 720 of this intermediate vehicle light-emitting element 1A is electrically connected to the first electrode 710 of the left-hand vehicle light-emitting element 1A using a fourth wire 44, which acts as a conductive material. The second electrode 720 of this left-hand vehicle light-emitting element 1A is electrically connected to the second surface electrode 102 located to the left of the thermal pad 100 of the vehicle light-emitting element package 100B using a second wire 42. In this way, the vehicle light-emitting element package 100B electrically connects the three vehicle light-emitting elements 1A in series.

[0102] (Explanation of the operation of the vehicle light-emitting element package 100B) The vehicle light-emitting element package 100B according to Embodiment 2 has the configuration described above, and its operation will be explained below.

[0103] Power is supplied to the first surface electrode 101 and the second surface electrode 102. As a result, electrons flow from the first surface electrode 101 → first wire 41 → laminated portion 3 of the right vehicle light-emitting element 1A → third wire 43 → laminated portion 3 of the middle vehicle light-emitting element 1A → fourth wire 44 → laminated portion 3 of the left vehicle light-emitting element 1A → second wire 42 → second surface electrode 102. Current flows in the opposite direction to the electrons, from the second surface electrode 102 → second wire 42 → laminated portion 3 of the left vehicle light-emitting element 1A → fourth wire 44 → laminated portion 3 of the middle vehicle light-emitting element 1A → third wire 43 → laminated portion 3 of the right vehicle light-emitting element 1A → first wire 41 → first surface electrode 101. As a result, the light-emitting surfaces 4 of the three vehicle light-emitting elements 1A each emit light.

[0104] The heat generated in the stacked portion 3 of the three vehicle light-emitting elements 1A is mainly transferred to the thermal pad 100 via the heat dissipation substrate 2. The heat conducted to the thermal pad 100 is then transferred to the heat sink of the heat dissipation member of the vehicle light source unit and released to the outside from the heat sink.

[0105] (Explanation of the effects of the vehicle light-emitting element package 100B) Since the vehicle light-emitting element package 100B according to this second embodiment has the configuration and operation described above, it can achieve the same effects as the vehicle light-emitting element package 100A according to the first embodiment. Since the vehicle light-emitting element package 100B according to this second embodiment uses three vehicle light-emitting elements 1A, the light-emitting area of ​​the light-emitting surface 4 can be increased.

[0106] (Description of a modified example of the vehicle light-emitting element package 100B) The vehicle light-emitting element package 100B according to this second embodiment uses three vehicle light-emitting elements 1A. However, in this invention, two vehicle light-emitting elements 1A, or four or more vehicle light-emitting elements 1A may be used. Moreover, the multiple vehicle light-emitting elements 1A may be arranged not only in a single row in the left-right direction, but also in multiple rows in the up-down direction, diagonally, or in a checkerboard pattern. In other words, the arrangement of the multiple vehicle light-emitting elements 1A is arbitrary.

[0107] (Description of the configuration of the vehicle light source unit 200A) The configuration of the vehicle light source unit 200A according to Embodiment 1 will be described below with reference to Figures 6 and 7. In Figures 6 and 7, the same reference numerals as in Figures 1 to 5 indicate the same components.

[0108] As shown in Figures 6 and 7, the vehicle light source unit 200A comprises one vehicle light-emitting element package 100A as shown in Figure 4, a heat sink 200 as a heat dissipation member, a circuit board 210, electrical connection members 221 and 222, an adhesive member 230, and screws 240.

[0109] The heat sink 200 is made of a material with high thermal conductivity, in this example, die-cast aluminum. The heat sink 200 has a disc-shaped plate portion 202 having a circular mounting surface 201, and a fin portion 203 integrally provided on the surface of the plate portion 202 opposite to the mounting surface 201.

[0110] The other side of the thermal pad 100 of the vehicle light-emitting element package 100A is joined (bonded) to the center of the mounting surface 201 by an adhesive member 230. Positioning pins 204 and screw holes 205 are provided at the four corners of the mounting surface 201. On one side of the plate portion 202 (the left side in Figure 6), there is a recess 206 into which the connector member 400 of the vehicle lighting unit 400A (described later) is fitted into the circuit board 210.

[0111] An opening 213 is provided in the center of the circuit board 210 into which the vehicle light-emitting element package 100A is inserted and set. Positioning holes 214 and screw holes 215 are provided at the four corners of the circuit board 210, corresponding to the positioning pins 204 and screw holes 205 of the heat sink 200.

[0112] A circuit 216 is provided on one side of the circuit board 210. The circuit 216 is provided with a first connection part 211 and a second connection part 212. The first connection part 211 is located on one side of the opening 213 (the right side in Figures 6 and 7). The second connection part 212 is located on the other side of the opening 213 (the left side in Figures 6 and 7).

[0113] The circuit board 210 is attached to the mounting surface 201 of the heat sink 200. Specifically, the circuit board 210 is attached to the mounting surface 201 by screwing screws 240 through the screw holes 215 of the circuit board 210 and into the screw holes 205 of the heat sink 200.

[0114] At this time, the positioning pins 204 of the heat sink 200 are fitted into the positioning holes 214 of the circuit board 210, and the circuit board 210 is positioned on the mounting surface 201. The other side of the circuit board 210 may be in direct contact with the mounting surface 201, or, as shown in Figure 7, an adhesive member 230 may be interposed. The adhesive member 230 is a material with high thermal conductivity, in this example, grease, solder, adhesive, etc.

[0115] Furthermore, the vehicle light-emitting element package 100A is inserted and set into the opening 213 of the circuit board 210. At this time, the first connection portion 211 of the circuit board 210 faces the first surface electrode 101 of the vehicle light-emitting element package 100A, and the second connection portion 212 of the circuit board 210 faces the second surface electrode 102 of the vehicle light-emitting element package 100A.

[0116] The first connection portion 211 and the first surface electrode 101 are electrically connected by an electrical connection member 221. The second connection portion 212 and the second surface electrode 102 are electrically connected by an electrical connection member 222. The electrical connection members 221 and 222 are made of conductive material, such as aluminum ribbon. An external holder may also be used.

[0117] (Explanation of the operation of the vehicle light source unit 200A) The vehicle light source unit 200A according to this embodiment 1 has the configuration described above, and its operation will be explained below.

[0118] Power is supplied to the first connection part 211 and the second connection part 212 of the circuit board 210 via the circuit 216. As a result, electrons flow from the first connection part 211 → electrical connection member 221 → first surface electrode 101 of the vehicle light-emitting element package 100A → first wire 41 → laminated part 3 of the vehicle light-emitting element 1A → second wire 42 → second surface electrode 102 of the vehicle light-emitting element package 100A → electrical connection member 222 → second connection part 212. Current flows in the opposite direction to the electrons, from the second connection part 212 → electrical connection member 222 → second surface electrode 102 → second wire 42 → laminated part 3 of the vehicle light-emitting element 1A → first wire 41 → first surface electrode 101 → electrical connection member 221 → second connection part 212. As a result, the light-emitting surface 4 of the vehicle light-emitting element 1A emits light, and that light is emitted to the outside from the emission surface 107 of the phosphor 104 of the vehicle light-emitting element package 100A.

[0119] The heat generated in the laminated portion 3 of the vehicle light-emitting element 1A is mainly transferred to the plate portion 202 of the heat sink 200 of the heat dissipation member via the heat dissipation substrate 2 of the vehicle light-emitting element 1A and the thermal pad 100 of the vehicle light-emitting element package 100A, and then released to the outside from the fin portion 203 of the heat sink 200.

[0120] (Explanation of the effects of the 200A vehicle light source unit) The vehicle light source unit 200A according to this embodiment 1 has the configuration and operation described above, and its effects will be explained below.

[0121] In this embodiment 1, the vehicle light source unit 200A has the other side of the thermal pad 100 of the vehicle light-emitting element package 100A bonded to the mounting surface 201 of the heat sink 200. This allows heat generated in the laminated portion 3 of the vehicle light-emitting element 1A to be efficiently transferred to the heat sink 200 of the heat dissipation member via the heat dissipation substrate 2 of the vehicle light-emitting element 1A and the thermal pad 100 of the vehicle light-emitting element package 100A, resulting in a high heat dissipation effect. As a result, the vehicle light source unit 200A in this embodiment 1 can use high power (for example, 1W or more) and emit light with high output (high luminosity, high brightness, high luminous quantity).

[0122] In this embodiment 1, the vehicle light source unit 200A has a thermal pad 100 with high thermal conductivity for the vehicle light-emitting element package 100A bonded to the mounting surface 201 of the heat sink 200. Therefore, FR4 can be used as the circuit board attached to the mounting surface 201 without using a metal PCB such as an aluminum substrate or copper plate. As a result, the vehicle light source unit 200A in this embodiment 1 can use FR4, which has low electrical connection costs, thus reducing manufacturing costs.

[0123] In this embodiment 1, the vehicle light source unit 200A can use a material as the heat sink 200 whose thermal expansion coefficient is close to that of the thermal pad 100 of the vehicle light-emitting element package 100A, thus eliminating the occurrence of problems due to the difference in thermal expansion coefficients between the heat sink 200 and the thermal pad 100.

[0124] In this embodiment 1, the vehicle light source unit 200A has an adhesive member 230 made of a material with high thermal conductivity interposed between the mounting surface 201 of the heat sink 200 and the other surface of the thermal pad 100 of the vehicle light-emitting element package 100A. As a result, the heat generated in the laminated portion 3 of the vehicle light-emitting element 1A can be efficiently transferred to the heat sink 200 of the heat dissipation member via the heat dissipation substrate 2 of the vehicle light-emitting element 1A and the thermal pad 100 of the vehicle light-emitting element package 100A, thereby achieving a high heat dissipation effect.

[0125] (Explanation of the configuration of vehicle lighting fixtures 300L and 300R) The configurations of the vehicle lighting fixtures 300L and 300R according to the embodiment will be described below with reference to Figures 8 and 11.

[0126] As shown in Figures 8 and 11, the vehicle lighting fixtures 300L and 300R in this embodiment are front combination lamps, and in this example they are mounted on the left and right sides of the front of the vehicle 300, respectively.

[0127] The left-side vehicle light fixture 300L, mounted on the left side of vehicle 300, and the right-side vehicle light fixture 300R, mounted on the right side of vehicle 300, each comprise a lamp housing 301 and a lamp lens 302 (a transparent outer cover) that form a light chamber 303, and an inner panel (inner housing) 304 and the vehicle light fixture units 400A and 400B described below, which are located inside the light chamber 303.

[0128] (Description of the configuration of the vehicle lighting unit 400A) The configuration of the vehicle lighting unit 400A according to Embodiment 1 will be described below with reference to Figures 9 and 10. In Figures 9 and 10, the same reference numerals as in Figures 1 to 8 indicate the same components.

[0129] As shown in Figures 9 and 10, the vehicle lighting unit 400A comprises the vehicle light source unit 200A shown in Figures 6 and 74, a connector member 400, and a lens 401 as an optical element.

[0130] The connector member 400 is detachably attached to the circuit board 210 of the vehicle light source unit 200A, thereby electrically connecting the circuit 216 of the circuit board 210 to a power supply (not shown) mounted on the vehicle 300.

[0131] The lens 401 emits light from the vehicle light source unit 200A to the outside in the form of a vehicle light distribution pattern, for example, the low beam light distribution pattern LP shown in Figure 10(A), or the high beam light distribution pattern HP shown in Figure 10(B).

[0132] The low beam light distribution pattern LP has an oblique cutoff line CL1 and a horizontal cutoff line CL2. The low beam light distribution pattern LP is formed by superimposing a first light distribution pattern SP in the central part of the high-luminance region, a second light distribution pattern (not shown) in the central part of the medium-luminance region, and a third light distribution pattern WP in the diffused part of the low-luminance region.

[0133] The high beam light distribution pattern (HP) has an elliptical shape, extending from the central part of the high-luminance region to the peripheral part of the low-luminance region. In this example, there are five levels of luminance distribution from the central part of the high-luminance region to the peripheral part of the low-luminance region.

[0134] (Explanation of the operation of vehicle lighting fixtures 300L and 300R, and vehicle lighting unit 400A) The vehicle lighting fixtures 300L and 300R according to this embodiment, and the vehicle lighting unit 400A according to this embodiment 1, have the above configuration, and their operation will be described below.

[0135] Power is supplied from the connector member 400 of the vehicle lighting unit 400A to the vehicle light-emitting element package 100A via the circuit board 210 of the vehicle light source unit 200A. As a result, light is emitted from the emission surface 107 of the phosphor 104 of the vehicle light-emitting element package 100A.

[0136] Light emitted from the emission surface 107 of the phosphor 104 of the vehicle light-emitting element package 100A is emitted to the outside as a low-beam light distribution pattern LP or a high-beam light distribution pattern HP, after passing through the lens 401 of the vehicle lighting unit 400A. The low-beam light distribution pattern LP or high-beam light distribution pattern HP emitted to the outside from the lens 401 of the vehicle lighting unit 400A is then illuminated in front of the vehicle 300 via the lamp lenses 302 of the vehicle lighting fixtures 300L and 300R.

[0137] (Explanation of the effects of vehicle lighting fixtures 300L, 300R, and vehicle lighting unit 400A) The vehicle lighting fixtures 300L and 300R according to this embodiment, and the vehicle lighting unit 400A according to Embodiment 1, have the above-described configuration and operation, and their effects will be explained below.

[0138] The vehicle lighting fixtures 300L and 300R, and the vehicle lighting unit 400A according to this embodiment 1, use the vehicle light source unit 200A shown in Figures 6 and 7, thus achieving a high heat dissipation effect. As a result, the vehicle lighting fixtures 300L and 300R, and the vehicle lighting unit 400A according to this embodiment 1, can use high power and emit high-output light (high-brightness light).

[0139] (Description of the configuration of the vehicle light-emitting element package 100C) The configuration of the vehicle light-emitting element package 100C according to Embodiment 3 will be described below with reference to Figure 11. In Figure 11, the same reference numerals as in Figures 1 to 7 and 9 indicate the same components.

[0140] As shown in Figure 11, the vehicle light-emitting element package 100C of this embodiment 3 uses multiple vehicle light-emitting element packages 100A of embodiment 1, in this example, arranged in a single row (left-to-right direction) in a common package 103. In other words, the vehicle light-emitting element package 100C uses nine of the aforementioned vehicle light-emitting element packages 100A arranged in a single row (left-to-right direction).

[0141] The vehicle light-emitting element package 100C is constructed by arranging the first surface electrodes 101 of nine vehicle light-emitting element packages 100A in a row (left-right direction) on the upper side, arranging the second surface electrodes 102 of nine vehicle light-emitting element packages 100A in a row (left-right direction) on the lower side, and further interposing a common package 103 between the nine vehicle light-emitting element packages 100A.

[0142] In Figure 11, a total of four vehicle light-emitting elements 1A and vehicle light-emitting element packages 100A are shown, two on the left and two on the right, while the five intermediate vehicle light-emitting elements 1A and vehicle light-emitting element packages 100A are omitted from the illustration.

[0143] (Explanation of the operation of the vehicle light-emitting element package 100C) The vehicle light-emitting element package 100C according to Embodiment 3 has the configuration described above, and its operation will be explained below.

[0144] When power is supplied to the first surface electrodes 101 and second surface electrodes 102 of the nine vehicle light-emitting element packages 100A, as described above, the light-emitting surfaces 4 of the nine vehicle light-emitting elements 1A each emit light, and that light is emitted from the emission surfaces 107 of the nine vehicle light-emitting element packages 100A. By individually and arbitrarily controlling the power supply to the first surface electrodes 101 and second surface electrodes 102 of the nine vehicle light-emitting element packages 100A, light can be emitted from the emission surface 107 of any of the nine vehicle light-emitting element packages 100A.

[0145] The heat generated in the stacked portion of the nine vehicle light-emitting elements 1A is mainly transferred to the thermal pads of the nine vehicle light-emitting element packages 100A via a heat dissipation substrate. The heat conducted to the thermal pads is then transferred to the heat sink of the heat dissipation component of the vehicle light source unit and released to the outside from the heat sink.

[0146] (Explanation of the effects of the vehicle light-emitting element package 100C) The vehicle light-emitting element package 100C according to this third embodiment has the above-described configuration and operation, and can achieve the same effects as the vehicle light-emitting element package 100A according to the first embodiment and the vehicle light-emitting element package 100B according to the second embodiment. Since the vehicle light-emitting element package 100C according to this third embodiment uses nine vehicle light-emitting elements 1A, that is, nine vehicle light-emitting element packages 100A, by individually and arbitrarily controlling the power supply to the first surface electrode 101 and the second surface electrode 102 of the nine vehicle light-emitting element packages 100A, light can be emitted from the emission surface 107 of any of the nine vehicle light-emitting element packages 100A. As a result, the vehicle light-emitting element package 100C according to this third embodiment is optimal as a vehicle light source for a variable-light distribution type vehicle lighting unit (variable-light distribution type vehicle lighting).

[0147] (Description of the configuration of the vehicle light source unit 200B) The configuration of the vehicle light source unit 200B according to Embodiment 2 will be described below with reference to Figures 11 to 13. In Figures 11 to 13, the same reference numerals as in Figures 1 to 9 indicate the same components. In Figure 11, the first connection part 261, the second connection part 262, and the electrical connection members 271 and 272 are shown in pairs (two on each side) for a total of four (four on each side), similar to the vehicle light-emitting element 1A and vehicle light-emitting element package 100A in Figure 11, with the five (five on each side) in the middle being omitted from the illustration.

[0148] As shown in Figures 11 to 13, the vehicle light source unit 200B comprises one vehicle light-emitting element package 100C as shown in Figure 11, a heat sink 250 as a heat dissipation member, a circuit board 260, electrical connection members 271 and 272, an adhesive member (not shown), and a screw 280.

[0149] The heat sink 250, like the heat sink 200, is made of a material with high thermal conductivity, in this example, die-cast aluminum. The heat sink 250 has a rectangular plate portion 252 having a rectangular mounting surface 251, and a fin portion 253 integrally provided on the side of the plate portion 252 opposite to the mounting surface 251.

[0150] The other side of the thermal pad of the vehicle light-emitting element package 100C is joined (bonded) to the center of the upper edge of the mounting surface 251 by an adhesive member. First positioning pins 254 and first screw holes 255 are provided on both the left and right sides of the mounting surface 251. Second positioning pins 257 and second screw holes 258 are also provided on both the left and right edges of the mounting surface 251. On one side of the plate portion 252 (the left side in Figure 12), there is a recess 256 into which the connector member 400 of the vehicle lighting unit 400B described later is fitted into the circuit board 260.

[0151] An opening 263 is provided in the upper central part of the circuit board 260 into which the vehicle light-emitting element package 100C is inserted and set. Positioning holes 264 and screw holes 265 are provided on both the left and right upper sides of the circuit board 260, corresponding to the first positioning pins 254 and first screw holes 255 of the heat sink 250.

[0152] A circuit 266 is provided on one side of the circuit board 260. The circuit 266 is provided with nine first connection parts 261 and nine second connection parts 262. The nine first connection parts 261 are located on one side of the opening 263 (the upper side in Figure 11). The nine second connection parts 262 are located on the other side of the opening 263 (the lower side in Figure 11).

[0153] The circuit board 260 is attached to the mounting surface 251 of the heat sink 250 together with the first lens 410 described later. Specifically, the circuit board 260 and the first lens 410 are attached to the mounting surface 251 of the heat sink 250 by screwing the screw 280 through the screw through hole 413 of the first lens 410 and the screw through hole 265 of the circuit board 260 and screwing it into the first screw hole 255 of the heat sink 250.

[0154] At this time, the first positioning pin 254 of the heat sink 250 is fitted into the positioning hole 264 of the circuit board 260, and the circuit board 260 is positioned on the mounting surface 251. The other side of the circuit board 260 may be in direct contact with the mounting surface 251, or, as shown in Figure 7, an adhesive member may be interposed. The adhesive member is a material with high thermal conductivity, in this example, grease, solder, adhesive, etc.

[0155] Furthermore, vehicle light-emitting element packages 100C are inserted into the openings 263 of the circuit board 260. At this time, as shown in Figure 11, the nine first connection portions 261 of the circuit board 260 face the first surface electrodes 101 of the nine vehicle light-emitting element packages 100C, and the nine second connection portions 262 of the circuit board 260 face the second surface electrodes 102 of the nine vehicle light-emitting element packages 100C.

[0156] The nine first connection parts 261 and the nine first surface electrodes 101 are electrically connected by nine electrical connection members 271. Similarly, the nine second connection parts 262 and the nine second surface electrodes 102 are electrically connected by nine electrical connection members 272. The electrical connection members 271 and 272 are made of conductive material, such as aluminum ribbon. External holders may also be used.

[0157] (Explanation of the operation of the vehicle light source unit 200B) The vehicle light source unit 200B according to this embodiment 2 has the configuration described above, and its operation will be explained below.

[0158] Power is supplied to the first connection part 261 and the second connection part 262 of the circuit board 260 via the circuit 266. Then, electrons flow from the first connection part 261 → electrical connection member 271 → first surface electrode 101 of the vehicle light-emitting element package 100C → first wire 41 → laminated part 3 of the vehicle light-emitting element 1A → second wire 42 → second surface electrode 102 of the vehicle light-emitting element package 100C → electrical connection member 272 → second connection part 262. Current flows in the opposite direction to the electrons, from the second connection part 262 → electrical connection member 272 → second surface electrode 102 of the vehicle light-emitting element package 100C → second wire 42 → laminated part 3 of the vehicle light-emitting element 1A → first wire 41 → first surface electrode 101 of the vehicle light-emitting element package 100C → electrical connection member 271 → second connection part 262. As a result, the light-emitting surface 4 of the vehicle light-emitting element 1A emits light, and that light is emitted to the outside from the emission surface 107 of the phosphor 104 of the vehicle light-emitting element package 100A.

[0159] At this time, by individually and arbitrarily controlling the power supply to the nine first connection parts 261 and the second connection parts 262, light can be emitted from the emission surface 107 of the phosphor 104 of any of the nine vehicle light-emitting elements 1A.

[0160] The heat generated in the laminated portion 3 of the vehicle light-emitting element 1A is mainly transferred to the plate portion 252 of the heat sink 250 of the heat dissipation member via the heat dissipation substrate 2 of the vehicle light-emitting element 1A and the thermal pad 100 of the vehicle light-emitting element package 100C, and then released to the outside from the fin portion 253 of the heat sink 250.

[0161] (Explanation of the effects of the 200B vehicle light source unit) Since the vehicle light source unit 200B according to this embodiment 2 has the configuration and operation described above, it can achieve the same effects as the vehicle light source unit 200A according to embodiment 1.

[0162] The vehicle light source unit 200B according to this embodiment 2 uses a vehicle light-emitting element package 100C equipped with nine vehicle light-emitting elements 1A. By individually and arbitrarily controlling the power supply to the nine first connection parts 261 and second connection parts 262, light can be emitted from the emission surface 107 of the phosphor 104 of any of the nine vehicle light-emitting elements 1A. As a result, the vehicle light source unit 200B according to this embodiment 2 is optimal as a vehicle light source for a variable-beam vehicle lighting unit (variable-beam vehicle lighting).

[0163] (Description of the configuration of the vehicle lighting unit 400B) The configuration of the vehicle lighting unit 400B according to Embodiment 2 will be described below with reference to Figures 12 to 14. In Figures 12 to 14, the same reference numerals as in Figures 1 to 11 indicate the same components.

[0164] As shown in Figure 8, the vehicle lighting unit 400B is positioned inside the lamp chamber 303 of the left vehicle lighting unit 300L and inside the lamp chamber 303 of the right vehicle lighting unit 300R, respectively. As shown in Figures 12 and 13, the vehicle lighting unit 400B comprises the vehicle light source unit 200B, a connector member 400, a first lens 410 and a second lens 420 as optical elements, a lens holder 430, a control device (not shown), and screws 280 and 440.

[0165] As shown in Figure 14, the left and right vehicle lighting units 400B emit variable-distribution high-beam light patterns LADBP, RADBP to the outside. The vehicle lighting unit 400B is a variable-distribution vehicle lighting unit (lamp unit), and is a so-called ADB (Adaptive Driving Beam) type vehicle lighting unit (lamp unit).

[0166] The left and right vehicle lighting units 400B illuminate with the overall high beam light distribution pattern LADBP, RADBP (see Figure 14(A)(B)) when there are no vehicles ahead, such as oncoming or preceding vehicles.

[0167] On the other hand, the left and right vehicle lighting units 400B control the area where a vehicle is present to be darker than the surrounding area when a vehicle is present (see Figures 14(C) and 14(D)). In other words, the left and right vehicle lighting units 400B control the on / off, intensification, and dimming of the nine vehicle light-emitting elements 1A of the vehicle light source unit 200B using a control device, thereby turning off or dimming the partial light distribution pattern where a vehicle is present, and changing the overall high beam light distribution pattern LADBP, RADBP as shown in Figures 14(C) and 14(D).

[0168] The connector member 400 is detachably attached to the circuit board 260 of the vehicle light source unit 200B, thereby electrically connecting the circuit 266 of the circuit board 260 to a power supply (not shown) mounted on the vehicle 300.

[0169] The first lens 410 and the second lens 420 cause the light emitted from the vehicle light source unit 200B to emit a vehicle light distribution pattern, for example, the variable-beam light distribution patterns LADBP and RADBP shown in Figure 14, to the outside.

[0170] The first lens 410 has nine lens sections 411 arranged in a row (left-right direction) in its middle section. The nine lens sections 411 each face the nine vehicle light-emitting elements 1A of the vehicle light source unit 200B in a one-to-one correspondence.

[0171] Positioning holes 412 and screw holes 413 are provided on both the left and right sides of the first lens 410, corresponding to the positioning holes 264 and screw holes 265 of the circuit board 260 and the first positioning pins 254 and first screw holes 255 of the heat sink 250, respectively.

[0172] As described above, the first lens 410 is attached to the heat sink 250 together with the circuit board 260 by fastening it with screws 280. At this time, the first positioning pin 254 of the heat sink 250 is fitted into the positioning hole 412 of the first lens 410 and the positioning hole 264 of the circuit board 260, and the first lens 410 and the circuit board 260 are positioned and attached to the mounting surface 251 of the heat sink 250.

[0173] The second lens 420 is held in a lens holder 430 and attached to the heat sink 250 via the lens holder 430. The second lens 420 is a projection lens that projects the light emitted from the nine lens portions 411 of the first lens 410 as nine light distribution patterns (partial light distribution patterns).

[0174] The upper and lower ends of the second lens 420 are largely removed, and the front view shape of the second lens 420 is a horizontally elongated rectangle. Retaining protrusions 421 are integrally provided in the center of both the upper and lower end faces of the second lens 420. Retaining holes 422 are provided in the retaining protrusions 421.

[0175] The lens holder 430 is attached to the heat sink 250 while holding the second lens 420. The lens holder 430 shields (blocks) light other than the light emitted from the first lens 410 so that it does not emit from the lamp lens 302.

[0176] The lens holder 430 has a mounting plate portion 431 and a retaining frame portion 432. Positioning holes 433 are provided in the middle of both the left and right sides of the mounting plate portion 431, corresponding to the second positioning pins 257 of the heat sink 250. Screw through holes 434 are provided at both the upper and lower ends of both the left and right sides of the mounting plate portion 431, corresponding to the second screw holes 258 of the heat sink 250.

[0177] The retaining frame portion 432 is integrally provided with the central part of the front surface of the mounting plate portion 431. Retaining pins 435 are provided on both the upper and lower sides of the retaining frame portion 432, corresponding to the retaining holes 422 of the second lens 420. The second lens 420 is held in the lens holder 430 by fitting the second lens 420 into the retaining frame portion 432 and inserting the retaining pins 435 into the retaining holes 422 of the second lens 420 and crimping them.

[0178] The second lens 420 is attached to the mounting surface 251 of the heatsink 250 via a lens holder 430 using screws 440. Specifically, the second lens 420 and the lens holder 430 are attached to the mounting surface 251 of the heatsink 250 by screwing the screws 440 through the screw holes 434 of the lens holder 430 and into the second screw holes 258 of the heatsink 250.

[0179] At this time, the second positioning pin 257 of the heat sink 250 is fitted into the positioning hole 433 of the lens holder 430, and the second lens 420 and the lens holder 430 are positioned on the mounting surface 251 of the heat sink 250.

[0180] The control device is installed in the vehicle 300. The control device comprises a detection unit, a detection control unit, and a light on / off control unit. The detection unit consists of, for example, an imaging device (camera), a millimeter-wave radar, etc. The detection control unit calculates the position and distance of oncoming and preceding vehicles based on the detection signal from the detection unit and outputs the calculated signal to the light on / off control unit via an interface. The light on / off control unit controls the on / off, increasing / decreasing, and dimming of the nine vehicle light-emitting elements 1A of the vehicle lighting units 400B on both the left and right sides based on the calculated signal from the detection control unit.

[0181] (Explanation of the operation of vehicle lighting fixtures 300L and 300R, and vehicle lighting unit 400B) The vehicle lighting fixtures 300L and 300R according to this embodiment, and the vehicle lighting unit 400B according to this embodiment 2, have the above configurations, and their operation will be described below.

[0182] If the detection unit does not detect an oncoming vehicle or a preceding vehicle, the control device will irradiate the road surface from the left and right vehicle lighting units 400B with the overall high beam light distribution patterns LADBP and RADBP shown in Figures 14(A) and (B) through the lamp lenses 302 of the left and right vehicle lighting units 300L and 300R.

[0183] When the detection unit detects an oncoming vehicle or a vehicle ahead, the control device controls the left and right vehicle lighting units 400B to project high-beam light distribution patterns LADBP and RADBP, as shown in Figures 14(C) and 14(D), onto the road surface from the lamp lenses 302 of the left and right vehicle lighting units 300L and 300R.

[0184] The high beam light distribution patterns LADBP and RADBP shown in Figures 14(C) and (D) are controlled so that the area where a vehicle is located in front is darker than the surrounding area. Specifically, the high beam light distribution patterns LADBP and RADBP shown in Figures 14(C) and (D) turn off (dim down) the second and third partial light distribution patterns from the right side (HR side). This suppresses the illumination of dazzling light to the vehicle in front.

[0185] (Explanation of the effects of vehicle lighting fixtures 300L, 300R, and vehicle lighting unit 400B) The vehicle lighting fixtures 300L and 300R according to this embodiment, and the vehicle lighting unit 400B according to this embodiment 2, have the above-described configuration and operation, and their effects will be explained below.

[0186] The vehicle lighting unit 400B according to this embodiment 2 can achieve substantially the same effects as the vehicle lighting unit 400A according to embodiment 1.

[0187] In particular, the vehicle lighting fixtures 300L and 300R according to this embodiment, and the vehicle lighting unit 400B according to this embodiment 2, use the vehicle light source unit 200B shown in Figures 11 to 13. Therefore, light can be emitted from the emission surface 107 of the phosphor 104 of any of the nine vehicle light-emitting elements 1A. As a result, the vehicle lighting fixtures 300L and 300R according to this embodiment, and the vehicle lighting unit 400B according to this embodiment 2 are optimal as vehicle light sources for variable-beam vehicle lighting units (variable-beam vehicle lighting fixtures).

[0188] (Explanation of the configuration, operation, and effects of the vehicle light-emitting element 1B) The configuration of the vehicle light-emitting element 1B according to Embodiment 2 will be described below with reference to Figures 15 and 16. In Figures 15 and 16, the same reference numerals as in Figures 1 to 14 indicate the same components.

[0189] The vehicle light-emitting element 1A according to the above embodiment 1 has three first electrodes 710 provided at equal intervals on the first electrode layer 71 on one side of the light-emitting surface 4 (right side in Figures 1 and 2), and three second electrodes 720 provided at equal intervals on the second electrode layer 72 on the other side of the light-emitting surface 4 (left side in Figures 1 and 2).

[0190] In contrast, the vehicle light-emitting element 1B according to this embodiment 2 has three first electrode layers 71 provided at equal intervals on one side of the light-emitting surface 4 (the left side in Figures 15 and 16), and three first electrodes 710 are provided on each of these three first electrode layers 71. Furthermore, the vehicle light-emitting element 1B according to this embodiment 2 has two second electrode layers 72 provided at equal intervals and between the three first electrode layers 71 on one side of the light-emitting surface 4 (the left side in Figures 15 and 16), and two second electrodes 720 are provided on each of these two second electrode layers 72.

[0191] Since the vehicle light-emitting element 1B according to this embodiment 2 has the configuration described above, it can achieve substantially the same effects and benefits as the vehicle light-emitting element 1A according to embodiment 1.

[0192] In particular, the vehicle light-emitting element 1B according to this embodiment 2 has the first electrode 710 and the second electrode 720 provided on one side (left side) of the light-emitting surface 4. Therefore, when the vehicle light-emitting element 1B according to this embodiment 2 is incorporated into the vehicle light-emitting element package 100D described later, as shown in Figures 17 and 18, the first electrode 710 and the second electrode 720 can be easily electrically connected to the first surface electrode 101 and the second surface electrode 102, respectively, which are located on one side (left side) of the thermal pad 100 described later in the vehicle light-emitting element package 100D. This simplifies the manufacturing process and reduces manufacturing costs.

[0193] Furthermore, in this second embodiment, the vehicle light-emitting element 1B does not require the provision of the first electrode 710 and first electrode layer 71 and the second electrode 720 and second electrode layer 72 on the other side (right side) of the light-emitting surface 4. As a result, in this second embodiment, the vehicle light-emitting element 1B can omit the portion of the heat dissipation substrate 2 on the other side (right side) of the light-emitting surface 4, that is, the portion of the vehicle light-emitting element 1A in the first embodiment that provides the first electrode 710 and first electrode layer 71. This allows the heat dissipation substrate 2 to be made smaller, improving the yield in mass production and reducing manufacturing costs. Alternatively, in this second embodiment, the vehicle light-emitting element 1B can widen the portion of the light-emitting surface 4 on the other side (right side), thereby increasing the area of ​​the light-emitting surface 4 and improving the luminous efficiency of the light-emitting surface 4.

[0194] (Description of the structure, operation, and effects of the vehicle light-emitting element package 100D) The configuration of the vehicle light-emitting element package 100D according to Embodiment 4 will be described below with reference to Figures 17 and 18. In Figures 17 and 18, the same reference numerals as in Figures 1 to 16 indicate the same components.

[0195] The vehicle light-emitting element package 100A according to the above embodiment 1 is used with the first surface electrode 101 positioned on one side (right side) of the thermal pad 100 and the second surface electrode 102 positioned on the other side (right side) of the thermal pad 100.

[0196] In contrast, the vehicle light-emitting element package 100D according to this embodiment 4 is used with the first surface electrode 101 and the second surface electrode 102 arranged on one side (left side) of the thermal pad 100.

[0197] Since the vehicle light-emitting element package 100D according to this embodiment 4 has the configuration described above, it can achieve substantially the same effects and benefits as the vehicle light-emitting element 1A according to embodiment 1.

[0198] In particular, the vehicle light-emitting element package 100D according to this embodiment 4 has the first surface electrode 101 and the second surface electrode 102 provided on one side (left side) of the thermal pad 100. Therefore, when the vehicle light-emitting element 1B according to embodiment 2, which has the first electrode 710 and the second electrode 720 provided on one side (left side) of the light-emitting surface 4, is incorporated, the first surface electrode 101 and the second surface electrode 102 can be easily electrically connected to the first electrode 710 and the second electrode 720 of the vehicle light-emitting element 1B of embodiment 2, respectively. This simplifies the manufacturing process and reduces manufacturing costs.

[0199] Furthermore, the vehicle light-emitting element package 100D according to this embodiment 4 uses the vehicle light-emitting element 1B of embodiment 2, which does not require the provision of the first electrode 710 and first electrode layer 71 and the second electrode 720 and second electrode layer 72 on the other side (right side) of the light-emitting surface 4. As a result, the vehicle light-emitting element package 100D according to this embodiment 4 can omit the portion of the heat dissipation substrate 2 on the other side (right side) of the light-emitting surface 4, that is, the portion where the first electrode 710 and first electrode layer 71 of the vehicle light-emitting element 1A of embodiment 1 are provided, thereby making the heat dissipation substrate 2 smaller, improving the yield in mass production, and reducing manufacturing costs. Alternatively, the vehicle light-emitting element 1B according to embodiment 2 can widen the portion of the light-emitting surface 4 on the other side (right side), thereby widening the area of ​​the light-emitting surface 4 and improving the luminous efficiency of the light-emitting surface 4.

[0200] (Description of the structure, operation, and effects of the vehicle light-emitting element package 100E) The configuration of the vehicle light-emitting element package 100E according to Embodiment 5 will be described below with reference to Figure 19. In Figure 19, the same reference numerals as in Figures 1 to 18 indicate the same components.

[0201] As shown in Figure 19, the vehicle light-emitting element package 100E of this embodiment 5 uses multiple vehicle light-emitting element packages 100D of embodiment 4, in this example 20 units, arranged in two rows vertically and horizontally in a common package 103. In other words, the vehicle light-emitting element package 100E uses 20 of the aforementioned vehicle light-emitting element packages 100A arranged in two rows vertically and horizontally.

[0202] The vehicle light-emitting element package 100E is constructed by arranging the first surface electrodes 101 and second surface electrodes 102 of the upper 10 vehicle light-emitting element packages 100D in a single row (left-right direction) on the upper side, and arranging the first surface electrodes 101 and second surface electrodes 102 of the lower 10 vehicle light-emitting element packages 100D in a single row (left-right direction) on the lower side, and further interposing a common package 103 between the 20 vehicle light-emitting element packages 100D.

[0203] The vehicle light-emitting element package 100E is inserted into an opening 263 of a circuit board (not shown) and bonded together with the circuit board to the mounting surface of a heat sink (not shown). The first surface electrodes 101 of the 20 vehicle light-emitting element packages 100D of the vehicle light-emitting element package 100E are electrically connected to 20 first connection parts 261 of the circuit on the circuit board via 20 electrical connection members 271. The second surface electrodes 102 of the 20 vehicle light-emitting element packages 100D of the vehicle light-emitting element package 100E are electrically connected to 20 second connection parts 262 of the circuit on the circuit board via 20 electrical connection members 272.

[0204] (Explanation of the operation of the vehicle light-emitting element package 100E) The vehicle light-emitting element package 100E according to Embodiment 5 has the configuration described above, and its operation will be explained below.

[0205] When power is supplied to the first surface electrode 101 and the second surface electrode 102 of the 20 vehicle light-emitting element packages 100D, as described above, the light-emitting surfaces 4 of the 20 vehicle light-emitting elements 1A each emit light, and that light is emitted from the emission surfaces 107 of the 20 vehicle light-emitting element packages 100D. By individually and arbitrarily controlling the power supply to the first surface electrode 101 and the second surface electrode 102 of the 20 vehicle light-emitting element packages 100A, light can be emitted from the emission surface 107 of any of the 20 vehicle light-emitting element packages 100D.

[0206] The heat generated in the stacked portion of the 20 vehicle light-emitting elements 1A is mainly transferred to the thermal pads of the 20 vehicle light-emitting element packages 100D via a heat dissipation substrate. The heat conducted to the thermal pads is then transferred to the heat sink of the heat dissipation component of the vehicle light source unit and released to the outside from the heat sink.

[0207] (Explanation of the effects of the vehicle light-emitting element package 100E) The vehicle light-emitting element package 100E according to this embodiment 5 has the above-described configuration and operation, and can achieve the same effects as the vehicle light-emitting element packages 100A, 100B, 100C, and 100D according to embodiments 1, 2, 3, and 4. Since the vehicle light-emitting element package 100E according to this embodiment 5 uses 20 vehicle light-emitting elements 1A, i.e., 20 vehicle light-emitting element packages 100D, by individually and arbitrarily controlling the power supply to the first surface electrode 101 and the second surface electrode 102 of the 20 vehicle light-emitting element packages 100D, light can be emitted from the emission surface 107 of any of the 20 vehicle light-emitting element packages 100D. As a result, the vehicle light-emitting element package 100E according to this embodiment 5 is optimal as a vehicle light source for a variable-light-distribution type vehicle lighting unit (variable-light-distribution type vehicle lighting), similar to the vehicle light-emitting element package 100C according to embodiment 3. [Explanation of symbols]

[0208] 1A, 1B Vehicle-mounted light-emitting element 2. Heat dissipation board (carrier) 20 Backside Metal 3. Laminated section 30. Emitting layer 31. First semiconductor layer (N-type semiconductor layer) 32. Second semiconductor layer (P-type semiconductor layer) 33 Reflective layer 34 Electrode layer 35 rods 36 Metal bonding layer 4. Light-emitting surface 40 Sapphire substrates 41. First wire 42. Second wire 43 Third wire 44. Fourth wire 51. First barrier layer 52. Second barrier layer 53. Third Barrier Layer 60 Insulating layer 61 First insulating section 62 Second insulating section 63 Third insulating section 71 1st electrode layer (N-type electrode layer) 72 Second electrode layer (P-type electrode layer) 710 1st electrode (N type electrode) 720 2nd electrode (P type electrode) 100A, 100B, 100C, 100D, 100E Vehicle-mounted light-emitting device packages 100 Thermal Pads 101 1st surface electrode 102 2nd surface electrode 103 Packages 104 Phosphors 105 Sealing member 106 Joining member 107 Ejection surface 200A, 200B Vehicle Light Source Unit 200, 250 heatsink 201, 251 Implementation side 202, 252 plate part 203, 253 fin section 204 Positioning pins 254 First positioning pin 257 Second positioning pin 205 screw holes 255 First screw hole 258 Second screw hole 206, 256 recesses 210, 260 Circuit boards 211, 261 First connection section 212, 262 Second connection section 213, 263 openings 214, 264 positioning holes 215, 265 Screw through holes 216, 266 circuits 221, 222, 271, 272 Electrical connection components 230 Adhesive material 240, 280 screws 300 vehicles 300L Left-side vehicle light fixture 300R Right-side vehicle light 301 Lamp Housing 302 Lamp Lens 303 Light room 304 Inner Panel 400A, 400B Vehicle Lighting Unit 400 Connector components 401 Lens (Optical component) 410 First lens (optical component) 411 Lens section 412 Positioning holes 413 Screw through hole 420 Second lens (optical component) 421 Retaining protrusion 422 Retaining hole 430 Lens Holder 431 Mounting plate section 432 Retaining frame section 433 Positioning holes 434 Screw through hole 435 Retaining pins 440 screws CL1 Diagonal Cut Offline CL2 Horizontal Cutoff Line HL-HR Screen horizontal lines on the left and right HP High Beam Beam Distribution Pattern LP Low Beam Light Distribution Pattern LADBP Left-side variable beam pattern for high beam RADBP Right-side variable beam pattern for high beam SP 1st Light Distribution Pattern Vertical lines at the top and bottom of the VU-VD screen WP 3 Beam Pattern Z lens optical axis

Claims

1. Heat dissipation substrate and A laminated portion having one surface bonded to one surface of the heat dissipation substrate, The other side of the laminated portion is a light-emitting surface that emits light when power is supplied to the laminated portion, Equipped with, The aforementioned laminated portion is A metal bonding layer bonded to one surface of the heat dissipation substrate, The electrode layer on the light-emitting surface side is provided with respect to the metal bonding layer, An insulating layer is laminated between the electrode layer and the metal bonding layer, It has, The aforementioned laminated portion is A first semiconductor layer having the light-emitting surface on one side, A light-emitting layer stacked on the other side of the first semiconductor layer, A second semiconductor layer stacked on the aforementioned light-emitting layer, The electrode layer stacked on the second semiconductor layer, A rod is provided between the electrode layer and the first semiconductor layer, electrically connecting the electrode layer and the first semiconductor layer, and electrically insulated from the light-emitting layer and the second semiconductor layer, The insulating layer laminated on the electrode layer, The metal bonding layer laminated on the insulating layer, The first electrode provided in the electrode layer, The second electrode provided in the second semiconductor layer, It has, A reflective layer is laminated between the second semiconductor layer and the electrode layer. A barrier layer is laminated between the second semiconductor layer and the reflective layer, and between the reflective layer and the electrode layer, and a barrier layer is provided between the rod and the light-emitting layer, the second semiconductor layer and the reflective layer. A vehicle light-emitting element characterized by the above.

2. The heat dissipation substrate uses silicon, which is a semiconductor. The vehicle light-emitting element according to feature 1.

3. The first electrode is provided on one side of the light-emitting surface, The second electrode is provided on the other side of the light-emitting surface. The vehicle light-emitting element according to feature 1.

4. The first electrode and the second electrode are provided on one side of the light-emitting surface, The vehicle light-emitting element according to feature 1.

5. A vehicle light-emitting element according to any one of claims 1 to 4, A thermal pad on one side to which the other side of the heat dissipation substrate of the vehicle light-emitting element is bonded, The first surface electrode and the second surface electrode are arranged side by side in the planar direction on one surface of the thermal pad, A conductive member electrically connects the laminated portion of the vehicle light-emitting element with one surface of the first surface electrode and one surface of the second surface electrode, A package made of an insulating material, which electrically insulates and holds the thermal pad, the first surface electrode, and the second surface electrode from each other, and which has an opening on the other side of the thermal pad, while closing the other side of the first surface electrode and the other side of the second surface electrode, Among the vehicle light-emitting elements, at least a phosphor provided on the light-emitting surface of the vehicle light-emitting element, A sealing member that seals the exposed surface of the vehicle light-emitting element that is not covered with the thermal pad and the phosphor, one surface of the thermal pad, a part of one surface of the first surface electrode and the second surface electrode, and the conductive member, Equipped with, A vehicle light-emitting element package characterized by the following features.

6. The thermal pad is made from a metal component. The vehicle light-emitting element package according to feature 5.

7. A bonding member is interposed between the heat dissipation substrate and one surface of the thermal pad of the vehicle light-emitting element. The vehicle light-emitting element package according to feature 5.

8. The first surface electrode is positioned on one side of the thermal pad, The second surface electrode is located on the other side of the thermal pad. The vehicle light-emitting element package according to feature 5.

9. The first surface electrode and the second surface electrode are respectively positioned on one side of the thermal pad. The vehicle light-emitting element package according to feature 5.

10. A vehicle light-emitting device package according to claim 5, A heat sink member having the other side of the thermal pad of the vehicle light-emitting element package bonded to its mounting surface, The circuit board attached to the mounting surface of the heat sink member, An electrical connecting member electrically connects the first surface electrode and the second surface electrode of the vehicle light-emitting element package and the circuit board. Equipped with, A vehicle light source unit characterized by the following features.

11. An adhesive member is interposed between the other side of the thermal pad of the vehicle light-emitting element package and the mounting surface of the heat sink member. The vehicle light source unit according to claim 10.

12. A vehicle light source unit according to claim 10, A connector member that electrically connects the circuit board of the vehicle light source unit and the power supply source, An optical component that emits light from the aforementioned vehicle light source unit as a vehicle light distribution pattern, Equipped with, A vehicle lighting unit characterized by the following features.

13. Vehicle lighting equipment installed on a vehicle, A vehicle lighting unit according to claim 10, A lamp chamber forming member that forms the lamp chamber, Equipped with, The aforementioned vehicle lighting unit is located inside the lighting chamber. A vehicle lighting device characterized by the following features.

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