Conductive pastes, cured products, and semiconductor devices

Abstract

To provide a conductive paste capable of providing a semiconductor device with a variation of mounting reliability mitigated.SOLUTION: A conductive paste includes a monomer (A), a polymer (B), a conductive particle (C) and a spacer particle (D). The spacer particle (D) has D50 of 5-100 μm, inclusive.SELECTED DRAWING: Figure 1

Claims

1. Monomer (A) and, Polymer (B) and Conductive particles (C) and Spacer particle (D), In a conductive paste containing, The D of the spacer particle (D) ５０ The size is between 5 μm and 100 μm. The conductive paste is applied to a substrate, heated at a constant rate from 30°C to 200°C for 60 minutes, then heated at 200°C for 2 hours, and then peeled off from the substrate. The resulting cured product, with a thickness of 1 mm, has a thermal conductivity λ in the thickness direction at 25°C measured by the laser flash method of 10 W / m·K or higher. A conductive paste in which a 250 μm thick cured product is obtained by applying the conductive paste to a substrate, raising the temperature from 30°C to 200°C at a constant rate over 60 minutes, then heating at 200°C for 2 hours, and then peeling it off the substrate, and the dynamic storage modulus E' determined by viscoelastic measurement at 25°C, tensile mode, and frequency of 10 Hz is 20 GPa or less.

2. In the conductive paste according to claim 1, A conductive paste in which the conductive particle (C) content is 50% by mass or more and 99% by mass or less.

3. In the conductive paste according to claim 1 or 2, A conductive paste in which the coefficient of variation Cv of the particle size of the spacer particles (D) is 20% or less.

4. In the conductive paste according to claim 1 or 2, The compressive fracture strength of the spacer particle (D) is 5 kg / mm². ２ That's all for conductive paste.

5. In the conductive paste according to claim 1 or 2, A conductive paste comprising a crosslinkable resin in which the spacer particles (D) have a divinylbenzene skeleton as their main chain.

6. In the conductive paste according to claim 1 or 2, A conductive paste wherein the polymer (B) contains a (meth)acrylic polymer.

7. In the conductive paste according to claim 1 or 2, A conductive paste wherein the polymer (B) has a glass transition temperature of -75°C or higher and 65°C or lower.

8. In the conductive paste according to claim 1 or 2, A conductive paste wherein the polymer (B) has a reactive group.

9. A conductive paste according to claim 1 or 2, A conductive paste wherein the monomer (A) contains a (meth)acrylic monomer.

10. A conductive paste according to claim 9, A conductive paste wherein the monomer (A) comprises a monofunctional (meth)acrylic monomer (A1) and a polyfunctional (meth)acrylic monomer (A2).

11. A conductive paste according to claim 1 or 2, Furthermore, a conductive paste containing a coupling agent.

12. A conductive paste according to claim 1 or 2, Furthermore, a conductive paste containing a radical polymerization initiator.

13. A conductive paste according to claim 1 or 2, A conductive paste used for die attachment.

14. A cured product of a conductive paste according to claim 1 or 2.

15. base material and A semiconductor element mounted on the substrate via an adhesive layer which is a cured product of the conductive paste described in claim 1 or 2, A semiconductor device equipped with a semiconductor device.

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