Adhesive tape for semiconductor processing
JP7877999B2Active Publication Date: 2026-06-23DAI NIPPON PRINTING CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- DAI NIPPON PRINTING CO LTD
- Filing Date
- 2022-09-30
- Publication Date
- 2026-06-23
AI Technical Summary
Benefits of technology
【0012】 本開示における半導体加工用粘着テープは、柔軟性に優れ、かつ、破れにくいという効果を奏する。
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Abstract
To provide an adhesive tape for semiconductor processing with excellent flexibility and tear resistance.SOLUTION: An adhesive tape 10 for semiconductor processing has a base material 1 and an energy ray curable adhesive layer 2 disposed on one side of the base material, the tensile strength of the adhesive tape for semiconductor processing at 40% elongation is 200 N / 45 mm or less, the puncture strength after energy ray irradiation and 40% elongation is 7.2 N or more, and the adhesive strength to the SUS plate after energy beam irradiation is 1.4 N / 25 mm or less.SELECTED DRAWING: Figure 1
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Claims
[Claim 1] A semiconductor processing adhesive tape comprising a base material and an energy-ray curable adhesive layer disposed on one surface of the base material, The tensile strength at 40% elongation is 200 N / 45 mm or less. The penetration strength after energy ray irradiation and 40% elongation is 7.2 N or higher. An adhesive tape for semiconductor processing, having an adhesive strength of 1.4 N / 25 mm or less to a SUS plate after energy ray irradiation.