Adhesive tape for semiconductor processing

Abstract

To provide an energy ray curable adhesive tape for semiconductor processing with excellent peelability to transport means before energy ray irradiation.SOLUTION: An adhesive tape 10 for semiconductor processing has a base material 1 and an energy ray curable adhesive layer 2 disposed on one side of the base material, the tack force measured by the probe tack test at a contact load of 0.098 N and a contact time of 30 seconds is 5.0 N or less and the peel strength to SUS rolls satisfies at least one of the following (i) and (ii). (i) The peel strength to a SUS roll at a tensile speed of 300 mm / min is 1.5 N / 20 mm or less. (ii) The peel strength to a SUS roll at a tensile speed of 1000 mm / min is 1.5 N / 20 mm or less.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to an adhesive tape for semiconductor processing.

Background Art

[0002] In the manufacturing process of semiconductors, in the dicing process of cutting a wafer into chips, an adhesive tape for semiconductor processing called a dicing tape is used to protect and fix the wafer and the chips.

[0003] For an adhesive tape for semiconductor processing, it is required that during the processing step, the wafer and chips can be fixed with sufficient adhesive force, and after the processing step, the chips can be easily peeled off without being damaged.

[0004] As such an adhesive tape for semiconductor processing, for example, the development of energy ray-curable adhesive tapes has been actively carried out (for example, Patent Documents 1 to 4).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Patent Document 4

Summary of the Invention

Problems to be Solved by the Invention

[0006] The above energy ray-curable adhesive tape can reduce the adhesive force by curing the adhesive layer by irradiation with energy rays, but it is an adhesive tape that can firmly fix the wafer and chips during the processing step before irradiation with energy rays.

[0007] In recent years, with the increasing resolution and complexity of wafers and chips, adhesive tapes for semiconductor processing require higher adhesive strength. However, if the adhesive strength of semiconductor processing adhesive tapes is too high, they may adhere tightly to transport means such as transport rolls and chucks. In this case, transporting the semiconductor processing adhesive tape becomes difficult.

[0008] To address this problem, measures have been taken to modify the conveying means. For example, known methods include applying particulate non-adhesive components to the conveying means, applying a silicone resin coating or fluororesin coating, or wrapping a silicone resin layer or fluororesin layer around it. However, even when the conveying means is modified according to the semiconductor processing adhesive tape used, if the semiconductor processing adhesive tape is changed, depending on the type of adhesive layer of the semiconductor processing adhesive tape, sticking to the conveying means may still occur.

[0009] Furthermore, the adhesion of semiconductor processing adhesive tape to such transport means can occur not only during the semiconductor manufacturing process using the aforementioned semiconductor processing adhesive tape, but also during the manufacturing process of the semiconductor processing adhesive tape itself.

[0010] This disclosure has been made in view of the above circumstances, and its main purpose is to provide an energy-ray curable adhesive tape that exhibits excellent peelability from a transport means before energy-ray irradiation. [Means for solving the problem]

[0011] One embodiment of the present disclosure provides an adhesive tape for semiconductor processing, comprising a base material and an energy-ray curable adhesive layer disposed on one surface of the base material, wherein the tack force measured by a probe tack test under the conditions of a contact load of 0.098 N and a contact time of 30 seconds is 5.0 N or less, and the peel strength against a SUS roll satisfies at least one of the following (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 1.5 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 1.5 N / 20 mm or less.

[0012] Another embodiment of the present disclosure provides an adhesive tape for semiconductor processing, comprising a substrate and an energy-ray curable adhesive layer disposed on one surface of the substrate, wherein the tack force measured by a probe tack test under the conditions of a contact load of 0.98 N and a contact time of 30 seconds is 5.0 N or less, and the peel strength against a SUS roll satisfies at least one of the following (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 2.0 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 2.0 N / 20 mm or less. [Effects of the Invention]

[0013] The adhesive tape for semiconductor processing described herein has the effect of having excellent peelability from the transport means before energy ray irradiation. [Brief explanation of the drawing]

[0014] [Figure 1] This is a schematic cross-sectional view showing an example of an adhesive tape for semiconductor processing in this disclosure. [Figure 2] This is a process diagram illustrating a semiconductor manufacturing method. [Figure 3] This is a process diagram illustrating a semiconductor manufacturing method. [Figure 4] This is a schematic diagram illustrating the process of cutting adhesive tape used for semiconductor processing. [Figure 5] This is a schematic diagram illustrating the process of transporting excess portions of adhesive tape used for semiconductor processing. [Figure 6]It is a schematic front view and side view illustrating a peeling jig used for measuring the peeling strength against a SUS roll. [Figure 7] It is a schematic diagram explaining a method for measuring the peeling strength against a SUS roll.

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present disclosure will be described while referring to the drawings and the like. However, the present disclosure can be implemented in many different modes and should not be construed as being limited to the description of the embodiments exemplified below. Also, for the purpose of making the description clearer, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual form, but this is merely an example and the interpretation of the present disclosure should not be limited. Also, in this specification and each figure, elements that are the same as those described above with respect to the already shown figures may be denoted by the same reference numerals, and detailed description may be omitted as appropriate.

[0016] In this specification, when expressing the mode of arranging one member on another member, when simply described as "above" or "below", unless otherwise specified, it includes both the case of arranging another member directly above or directly below so as to contact one member, and the case of arranging another member above or below one member through yet another member. Also, in this specification, when expressing the mode of arranging one member on the surface of another member, when simply described as "on the surface", unless otherwise specified, it includes both the case of arranging another member directly above or directly below so as to contact one member, and the case of arranging another member above or below one member through yet another member.

[0017] The inventors of this disclosure have diligently investigated the relationship between adhesive properties and adhesion to conveying means in adhesive tapes for semiconductor processing. They found that there is no correlation between the adhesive strength of the adhesive tape for semiconductor processing and adhesion to the conveying means. On the other hand, they found that there is a correlation between the tack of the adhesive tape for semiconductor processing and adhesion to the conveying means. Here, adhesive strength is considered an indicator of permanent adhesion. On the other hand, tack is considered an indicator of instantaneous adhesion. In the manufacturing process of adhesive tapes for semiconductor processing and the manufacturing process of semiconductors using adhesive tapes for semiconductor processing, the time that the adhesive layer of the adhesive tape for semiconductor processing is in contact with the conveying means is usually very short compared to the time that the adhesive layer of the adhesive tape for semiconductor processing is in contact with the adherend. Therefore, the inventors of this disclosure focused on instantaneous adhesion. Furthermore, in addition to tack, they also focused on the peel strength against a SUS roll that mimics a conveying roll as an indicator of instantaneous adhesion, and found that by using these as indicators, adhesion to the conveying means can be appropriately evaluated. This disclosure was completed based on these findings.

[0018] The adhesive tape for semiconductor processing described herein will be described in detail in two embodiments.

[0019] A. First Embodiment The semiconductor processing adhesive tape of this embodiment is a semiconductor processing adhesive tape having a base material and an energy ray curable adhesive layer disposed on one side of the base material, wherein the tack force measured by a probe tack test under the conditions of a contact load of 0.098 N and a contact time of 30 seconds is 5.0 N or less, and the peel strength against a SUS roll satisfies at least one of the following (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 1.5 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 1.5 N / 20 mm or less.

[0020] Figure 1 is a schematic cross-sectional view illustrating the semiconductor processing adhesive tape of this embodiment. The semiconductor processing adhesive tape 10 in Figure 1 has a base material 1 and an energy-ray curable adhesive layer 2 disposed on one side of the base material 1. In the semiconductor processing adhesive tape 10 of this embodiment, the tack force measured by a probe tack test under the conditions of a contact load of 0.098 N and a contact time of 30 seconds is less than or equal to a predetermined value. Furthermore, in the semiconductor processing adhesive tape 10 of this embodiment, the peel strength against a SUS roll satisfies at least one of the above (i) and (ii).

[0021] Figures 2(a) to 2(f) are process diagrams showing an example of a semiconductor manufacturing method using semiconductor processing adhesive tape. First, as shown in Figure 2(a), semiconductor processing adhesive tape 10 is attached to a ring frame 21, and a wafer 11 is attached to the semiconductor processing adhesive tape 10. Next, as shown in Figure 2(b), the semiconductor processing adhesive tape 10 is cut along the ring frame 21. Next, as shown in Figure 2(c), a dicing process is performed to cut (dicing) the wafer 11 into chips 12. Next, as shown in Figure 2(d), an expansion process is performed to stretch the semiconductor processing adhesive tape 10 to widen the spacing between the chips 12. Next, although not shown, the adhesive strength is reduced by irradiating the energy ray curable adhesive layer of the semiconductor processing adhesive tape 10 with energy rays to harden it, and as shown in Figure 2(e), a pickup process is performed to peel the chips 12 from the semiconductor processing adhesive tape 10 and pick up the chips 12. Next, as shown in Figure 2(f), a mounting (die bonding) process is performed to bond the picked-up chip 12 to the substrate 30.

[0022] Figures 3(a) to 3(e) are process diagrams showing other examples of semiconductor manufacturing methods using semiconductor processing adhesive tape. First, as shown in Figure 3(a), semiconductor processing adhesive tape 10 is attached to a ring frame 21, and the wafer 11 is attached to the semiconductor processing adhesive tape 10. Next, as shown in Figure 3(b), the semiconductor processing adhesive tape 10 is cut along the ring frame 21. Next, as shown in Figure 3(c), a dicing process is performed to cut (dice) the wafer 11 into chips 12. Next, as shown in Figure 3(d), a transfer tape 40 is attached to the side of the chip 12 opposite to the semiconductor processing adhesive tape 10. Then, although not shown, the adhesive strength is reduced by irradiating the energy-ray curable adhesive layer of the semiconductor processing adhesive tape 10 with energy rays to cure it, and as shown in Figure 3(e), a transfer process is performed to peel the semiconductor processing adhesive tape 10 from the chip 12 and ring frame 21 and transfer the chip 12 and ring frame 21 to the transfer tape 40.

[0023] Here, for example, the adhesive tape for semiconductor processing is unwound from a winding body formed by winding the adhesive tape, and then sequentially sent to a peeling process in which the separator is peeled off from the adhesive tape as needed, an application process as shown in Figures 2(a) and 3(a), a cutting process as shown in Figures 2(c) and 3(c), and a removal process (not shown) in which the excess portion of the adhesive tape for semiconductor processing is wound up after cutting. In these processes, the adhesive layer of the adhesive tape for semiconductor processing may come into contact with conveying means such as conveying rolls and chucks.

[0024] Specifically, when cutting semiconductor processing adhesive tape using a fully automatic wafer mounter, as shown in Figures 2(b) and 3(b), the semiconductor processing adhesive tape 10 attached to the wafer 11 and ring frame 21 is cut by moving the cutter C in a circular motion, as shown in Figure 4(a). Then, as shown in Figures 4(b) to 4(c), the excess portion 10x of the semiconductor processing adhesive tape 10 is grasped up by a gripping member such as a chuck. Next, as shown in Figure 5, the excess portion 10x of the semiconductor processing adhesive tape 10 is transported by a transport roll and, although not shown, is wound up by a winding roll. Even when transporting the excess portion of the semiconductor processing adhesive tape in this way, the adhesive layer of the semiconductor processing adhesive tape may come into contact with the transport means.

[0025] Furthermore, the material used for conveying mechanisms such as conveyor rolls and chucks is often stainless steel (SUS).

[0026] In the semiconductor processing adhesive tape of this embodiment, adhesion to the transport means can be suppressed if the tack force measured by the probe tack test is below a predetermined value, and the peel strength against the SUS roll satisfies at least one of (i) and (ii) above. Therefore, the peelability of the semiconductor processing adhesive tape from the transport means can be improved. Furthermore, tearing of the semiconductor processing adhesive tape due to adhesion to the transport means can be suppressed, improving workability.

[0027] The following describes the various components of the adhesive tape for semiconductor processing in this embodiment.

[0028] 1. Characteristics of adhesive tapes for semiconductor processing (1) Tuck force measured by probe tuck test In the semiconductor processing adhesive tape of this embodiment, the tack force measured by a probe tack test under the conditions of a contact load of 0.098 N and a contact time of 30 seconds is 5.0 N or less, preferably 4.5 N or less, and more preferably 4.0 N or less. Because the tack force is within this range, the adhesive layer of the semiconductor processing adhesive tape can be easily peeled off even if it comes into contact with the transport means before energy ray irradiation. On the other hand, the tack force may be, for example, 0.1 N or more, or 0.4 N or more. Because the tack force is within this range, wafers and chips can be sufficiently fixed before energy ray irradiation.

[0029] In this embodiment, the tack force is a value measured by a probe tack test under the following conditions. In the probe tack test method, a cylindrical probe is brought into contact with the surface of the adhesive layer of the adhesive tape for semiconductor processing, then peeled off, and the maximum load at which it is peeled off is measured. This measurement is performed five times, and the average value is calculated to be the tack force. As a measuring device, for example, the tacking test machine "TAC-II" manufactured by RHESCA can be used.

[0030] (Measurement conditions) Contact speed: 30mm / min Contact load: 0.098N Contact time: 30 seconds Peeling speed: 600 mm / min Probe: Cylindrical diameter 5mm Probe material: SUS Probe temperature: 25℃ Stage temperature: 25℃ Measurement environment: 25±2℃, 40±5%RH

[0031] Means for controlling the tack force mentioned above include, for example, adjusting the components or composition contained in the adhesive layer, or adjusting the elastic modulus of the adhesive layer.

[0032] Specific methods for adjusting the components or composition contained in the adhesive layer include adjusting the molecular weight of the resin (main adhesive component), adjusting the molecular weight, content, and number of functional groups of the energy ray-curable compound, and adjusting the glass transition temperature of the additive. For example, increasing the molecular weight of the resin (main adhesive component) tends to decrease the tack force. Similarly, increasing the molecular weight of the energy ray-curable compound tends to decrease the tack force. Furthermore, decreasing the content of the energy ray-curable compound tends to decrease the tack force. Additionally, increasing the number of functional groups of the energy ray-curable compound allows for sufficient peelability after energy ray irradiation even with low content, resulting in a tendency for the tack force before energy ray irradiation to decrease. Finally, increasing the glass transition temperature of the additive tends to decrease the tack force.

[0033] In methods for adjusting the elastic modulus of the adhesive layer, there is a tendency for the tack force to decrease as the elastic modulus of the adhesive layer increases.

[0034] (2) Peel strength against SUS rolls In the semiconductor processing adhesive tape of this embodiment, the peel strength against a SUS roll satisfies at least one of the following (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 1.5 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 1.5 N / 20 mm or less.

[0035] The adhesive tape for semiconductor processing according to this embodiment may satisfy only (i), only (ii), or both (i) and (ii). In particular, it is preferable that the adhesive tape for semiconductor processing according to this embodiment satisfies both (i) and (ii).

[0036] The reason why the tensile speed differs between (i) and (ii) above is that the tensile speed is set appropriately in the semiconductor manufacturing process using semiconductor processing adhesive tape and in the manufacturing process of semiconductor processing adhesive tape. Therefore, there are two types of tensile speeds: low speed and high speed.

[0037] In the semiconductor processing adhesive tape that satisfies (i) above, the peel strength against a SUS roll at a tensile speed of 300 mm / min is 1.5 N / 20 mm or less, preferably 1.0 N / 20 mm or less.

[0038] In the semiconductor processing adhesive tape that satisfies (ii) above, the peel strength against a SUS roll at a tensile speed of 1000 mm / min is 1.5 N / 20 mm or less, preferably 1.0 N / 20 mm or less.

[0039] Here, the peel strength of the SUS roll is a value measured using a peeling jig with a SUS roll and a tensile testing machine.

[0040] As the peeling jig, a peeling jig used for the 90° peel test in accordance with JIS C6481:1996 (Test method for copper-clad laminates for printed wiring boards) is used. Specifically, the peeling jig used is the "J-PZ-200N" (Tensilon universal tester application) manufactured by A&D Corporation. Figure 6(a) is a schematic front view of the peeling jig, and Figure 6(b) is a schematic side view of the peeling jig. Figure 7 is a partially enlarged cross-sectional view of the vicinity of the SUS roll when semiconductor processing adhesive tape is attached to the peeling jig. As shown in Figures 6(a) and 6(b), the peeling jig 50 has four rolls R1 to R4. Of these rolls R1 to R4, the first roll R1, the second roll R2, and the third roll R3 are used to measure the peel strength against the SUS roll. The diameter d1 of the first roll R1 is 8±2 mm, the diameter d2 of the second roll R2 is 8±2 mm, and the diameter d3 of the third roll R3 is between 8 mm and 10 mm. The distance D between the center O1 of the first roll R1 and the center O2 of the second roll R2 is 26±1 mm. The height from the bottom surface of the peeling jig 50 to the center O1 of the first roll R1 is the same as the height from the bottom surface of the peeling jig 50 to the center O2 of the second roll R2.

[0041] Additionally, the Tensilon universal tester "RTF-1150-H" manufactured by A&D Company, Limited can be used as a tensile testing machine.

[0042] The peel strength against the SUS roll can be measured by the following method. First, the semiconductor processing adhesive tape is attached to a peeling jig. Specifically, as shown in Figure 7, the semiconductor processing adhesive tape 10 is positioned so that the surface of the semiconductor processing adhesive tape 10 on the base material 1 side is in contact with the first roll R1 and the third roll R3, and the surface of the semiconductor processing adhesive tape 10 on the adhesive layer 2 side is in contact with the second roll R2. Next, the semiconductor processing adhesive tape 10 is pulled upward at a 90° angle. This causes the adhesive layer 2 surface of the semiconductor processing adhesive tape 10 to wrap around the second roll R2. Then, the tip of the semiconductor processing adhesive tape 10 that has been pulled upward at a 90° angle is attached to a tensile testing machine (not shown). Next, the semiconductor processing adhesive tape 10 is pulled upward at a predetermined tensile speed at a 90° angle, and the maximum strength is measured. This measurement is performed five times, and the average value is calculated to be the peel strength against the SUS roll.

[0043] It is believed that the peeling jig described above is modeled after a conveyor roll. Furthermore, the measurement method described above can measure the peel strength when the adhesive tape for semiconductor processing is wrapped around the second roll of the peeling jig and then peeled off. Therefore, it is presumed that the adhesion to the conveyor can be appropriately evaluated by using the peel strength against the SUS roll measured using such a peeling jig as an indicator.

[0044] Means for controlling the peel strength of the above-mentioned SUS roll include, for example, adjusting the components or composition contained in the adhesive layer, adjusting the elastic modulus of the adhesive layer, and adjusting the Young's modulus of the substrate.

[0045] Specific methods for adjusting the components or composition contained in the adhesive layer include adjusting the molecular weight of the resin (main adhesive component), adjusting the molecular weight, content, and number of functional groups of the energy-ray curable compound, and adjusting the glass transition temperature of the additive. For example, increasing the molecular weight of the resin (main adhesive component) tends to decrease the peel strength. Similarly, increasing the molecular weight of the energy-ray curable compound tends to decrease the peel strength. Furthermore, decreasing the content of the energy-ray curable compound tends to decrease the peel strength. Additionally, increasing the number of functional groups of the energy-ray curable compound allows for sufficient peelability after energy irradiation even with a low content, resulting in a tendency for the peel strength before energy irradiation to decrease. Finally, increasing the glass transition temperature of the additive tends to decrease the peel strength.

[0046] In methods for adjusting the elastic modulus of an adhesive layer, increasing the elastic modulus of the adhesive layer tends to decrease the peel strength.

[0047] In methods for adjusting the Young's modulus of a substrate, there is a tendency for the peel strength to decrease as the Young's modulus of the substrate increases.

[0048] (3) Adhesion to SUS plate In the semiconductor processing adhesive tape of this embodiment, the adhesive force to the SUS plate is preferably 3.0 N / 25 mm or more, and more preferably 5.0 N / 25 mm or more. Having the adhesive force to the SUS plate within this range allows for sufficient fixation of wafers and divided chips to the semiconductor processing adhesive tape until energy rays are irradiated. On the other hand, there is no particular upper limit to the adhesive force to the SUS plate.

[0049] Here, the adhesive strength to the SUS plate can be measured in accordance with Method 1 of the JIS Z0237:2009 (Test Methods for Adhesive Tapes and Sheets) (a test method in which the tape and sheet are peeled off from the stainless steel test plate at a 180° angle at a temperature of 23°C and 50% humidity), by peeling the test piece in the longitudinal direction under the conditions of a width of 25 mm, a peeling angle of 180°, and a peeling speed of 300 mm / min. A SUS plate of SUS304, surface finish BA, thickness of 1.5 mm, and size of 100 mm x 150 mm can be used.

[0050] On the other hand, the adhesive strength of an energy-ray curable adhesive layer decreases as it hardens due to irradiation with energy rays. In the semiconductor processing adhesive tape of this embodiment, the adhesive strength to the SUS plate after energy ray irradiation is preferably 2.5 N / 25 mm or less, and more preferably 2.0 N / 25 mm or less. Because the adhesive strength to the SUS plate after energy ray irradiation is within the above range, the chip can be easily peeled off the semiconductor processing adhesive tape after energy ray irradiation. On the other hand, the lower limit of the adhesive strength to the SUS plate after energy ray irradiation is not particularly limited, but is, for example, 0.01 N / 25 mm or more.

[0051] Here, the adhesive strength to the SUS plate after energy ray irradiation can be measured by the following method. First, the adhesive layer of the semiconductor processing adhesive tape is irradiated with energy rays to harden it. In this case, for example, the energy rays can be irradiated from the substrate side of the semiconductor processing adhesive tape. Next, in accordance with Method 1 of the test method of JIS Z0237:2009 (Test method for adhesive tapes and adhesive sheets) (test method in which the tape and sheet are peeled off from the stainless steel test plate at a temperature of 23°C and humidity of 50%RH), the adhesive strength to the SUS plate after energy ray irradiation can be measured by peeling the test piece in the length direction under the conditions of a width of 25 mm, a peeling angle of 180°, and a peeling speed of 300 mm / min. The SUS plate can be a SUS304, surface finish BA, thickness of 1.5 mm, width of 100 mm, and length of 150 mm.

[0052] (4) Young's modulus In the semiconductor processing adhesive tape of this embodiment, the Young's modulus is, for example, 20 MPa or more, preferably 30 MPa or more, and particularly preferably 40 MPa or more. On the other hand, it is more preferably 500 MPa or less, and even more preferably 300 MPa or less. If the Young's modulus of the semiconductor processing adhesive tape is within the above range, the semiconductor processing adhesive tape can be made appropriately hard, so the peel strength against the SUS roll can be easily adjusted to fall within the above range. Furthermore, conveyance using the conveyor roll becomes easier. In addition, expandability can be improved. On the other hand, if the Young's modulus of the semiconductor processing adhesive tape is too low, the semiconductor processing adhesive tape becomes extremely soft, and there is a possibility that the semiconductor processing adhesive tape will tear during conveyance or expansion.

[0053] Here, the Young's modulus of adhesive tape for semiconductor processing can be measured in accordance with JIS K7127. The specific measurement conditions are shown below. As a tensile testing machine, for example, the "Tensilon RTF1150" manufactured by A&D Company, Limited can be used.

[0054] (Measurement conditions) • Test specimen: Test specimen type 5 • Chuck spacing: 60mm • Tensile speed: 100 mm / min ·Temperature: 23℃ ·Humidity: 50%RH

[0055] 2. Adhesive layer In this embodiment, the adhesive layer is disposed on one side of the substrate and is an energy-ray curable component. The adhesive strength of the energy-ray curable adhesive layer decreases as it hardens upon irradiation with energy rays. In the energy-ray curable adhesive layer, the initial adhesive strength allows wafers and divided chips to be fixed in place during the dicing process. Furthermore, in the pickup or transfer process, the adhesive strength decreases and peelability improves when the layer is hardened by irradiation with energy rays, allowing chips to be easily peeled off or transferred.

[0056] Examples of energy rays include far-ultraviolet, ultraviolet, near-ultraviolet, and infrared rays, as well as electromagnetic waves such as X-rays and gamma rays, and electron beams, proton beams, and neutron beams. Among these, ultraviolet rays and electron beams are preferred from the viewpoint of versatility, and ultraviolet rays are more preferred.

[0057] The adhesive layer is not particularly limited as long as it satisfies the above-mentioned tack force and peel strength against SUS rolls, and may contain, for example, at least a resin (main adhesive component) and an energy-ray curable compound. By containing an energy-ray curable compound in the adhesive layer, the adhesive force can be reduced by curing the energy-ray curable compound by irradiation with energy rays, and at the same time, the cohesive force is increased, making peeling easier.

[0058] (1) Resin (adhesive main component) Examples of resins (main adhesive components) include acrylic resins, polyester resins, polyimide resins, and silicone resins, which are commonly used as the main component of adhesives. Among these, acrylic resins are preferred. By using acrylic resins, adhesive residue and contamination on adherends such as electronic components can be reduced.

[0059] Therefore, the adhesive layer preferably contains at least an acrylic resin, an energy ray curable compound, and a crosslinking agent. Within the adhesive layer, the acrylic resin usually exists as a crosslinked body formed by crosslinking between acrylic resins with a crosslinking agent, but individual acrylic resins may also be included together with the crosslinked body.

[0060] (Acrylic resin) The acrylic resin is not particularly limited, and examples include (meth)acrylic acid polymers obtained by homopolymerizing (meth)acrylic acid esters, and (meth)acrylic acid copolymers obtained by copolymerizing (meth)acrylic acid esters with other monomers, with (meth)acrylic acid esters as the main component. Among these, (meth)acrylic acid copolymers are preferred. Specific examples of (meth)acrylic acid esters and other monomers are disclosed in Japanese Patent Application Publication No. 2012-31316. The other monomers can be used alone or in combination of two or more. Here, "main component" means a copolymerization ratio of 51% by mass or more, preferably 65% ​​by mass or more.

[0061] In particular, as acrylic resins, (meth)acrylic acid ester copolymers obtained by copolymerizing (meth)acrylic acid ester with copolymerizable hydroxyl group-containing monomers, or (meth)acrylic acid ester copolymers obtained by copolymerizing (meth)acrylic acid ester with copolymerizable hydroxyl group-containing monomers and carboxyl group-containing monomers, are preferably used.

[0062] In this specification, (meth)acrylic acid means at least one of acrylic acid and methacrylic acid.

[0063] The copolymerizable hydroxyl group-containing monomers and carboxyl group-containing monomers are not particularly limited, and for example, the hydroxyl group-containing monomers and carboxyl group-containing monomers disclosed in Japanese Patent Application Publication No. 2012-31316 can be used.

[0064] The weight-average molecular weight of the acrylic resin is preferably between 10,000 and 1,000,000, and more preferably between 200,000 and 800,000. By keeping the weight-average molecular weight of the acrylic resin within this range, sufficient initial adhesive strength can be achieved. Furthermore, adhesive residue and contamination on adherends such as electronic components can be reduced. On the other hand, if the weight-average molecular weight of the acrylic resin is too high, the adhesive layer may become hard and brittle.

[0065] Herein, in this specification, weight-average molecular weight is the polystyrene equivalent value measured by gel permeation chromatography (GPC). The weight-average molecular weight can be measured, for example, by using an HLC-8220GPC manufactured by Tosoh Corporation as the measuring instrument, TSKGEL-SUPERMULTIPORE-HZ-M manufactured by Tosoh Corporation as the column, THF as the solvent, and standard polystyrene with molecular weights of 1050, 5970, 18100, 37900, 96400, and 706000 as standards.

[0066] Furthermore, when the acrylic resin is a (meth)acrylic acid ester copolymer of a hydroxyl group-containing monomer and a carboxyl group-containing monomer copolymerizable with (meth)acrylic acid ester, the mass ratio of the hydroxyl group-containing monomer to the carboxyl group-containing monomer is preferably, for example, 51:49 to 100:0, and more preferably 75:25 to 100:0. If the mass ratio of each monomer is within the above range, an effective reduction in adhesive strength due to energy ray irradiation can be expected, and the generation of adhesive residue can be suppressed.

[0067] Furthermore, the acrylic resin may also be energy-ray curable, for example, it may have an energy-ray curable functional group in its side chain. Preferably, the energy-ray curable functional group has an ethylenically unsaturated bond, and specifically, examples include a (meth)acryloyl group, a vinyl group, an allyl group, and the like.

[0068] (2) Energy ray curable compounds Energy-ray curable compounds are not particularly limited as long as they polymerize upon irradiation with energy rays, and examples include compounds having energy-ray curable functional groups.

[0069] Examples of energy ray curable compounds include energy ray curable monomers, energy ray curable oligomers, and energy ray curable polymers. Note that energy ray curable polymers are polymers different from the resins (tack bases) mentioned above. Among these, energy ray curable oligomers are preferred from the viewpoint of balancing the adhesive strength before and after energy ray irradiation. Energy ray curable monomers, energy ray curable oligomers, and energy ray curable polymers may also be used in combination. For example, when an energy ray curable monomer is used in addition to an energy ray curable oligomer, when irradiated with energy rays, the adhesive layer can be cured by three-dimensional crosslinking to reduce the adhesive strength, while the cohesive force can be increased to prevent transfer to the chip side.

[0070] Examples of energy ray curable compounds include radical polymerizable compounds, cationic polymerizable compounds, and anionic polymerizable compounds. Among these, radical polymerizable compounds are preferred. They have a fast curing rate, can be selected from a wide variety of compounds, and their physical properties, such as adhesion before and after energy ray irradiation, can be easily controlled.

[0071] In energy-ray curable compounds, the number of energy-ray curable functional groups is preferably two or more per molecule, more preferably three or more, and even more preferably four or more. If the number of energy-ray curable functional groups is within the above range, the crosslinking density of the adhesive layer after energy-ray irradiation will be sufficient, thereby achieving the desired peelability. Furthermore, the occurrence of adhesive residue due to a decrease in cohesive force can be suppressed. Moreover, if an energy-ray curable compound has four or more of the above functional groups per molecule, the desired peelability can be obtained even with a lower content compared to an energy-ray curable compound having two of the above functional groups per molecule. Therefore, the tack force and peel strength against the SUS roll can be reduced before energy-ray irradiation. Furthermore, there is no particular upper limit to the number of energy-ray curable functional groups.

[0072] The energy ray curable compound is preferably a radical polymerizable oligomer, and more preferably a radical polymerizable polyfunctional oligomer. Examples of radical polymerizable oligomers include those disclosed in Japanese Patent Application Publication No. 2012-31316.

[0073] Furthermore, radical polymerizable oligomers and radical polymerizable monomers may be used as energy ray curable compounds, and in particular, radical polymerizable polyfunctional oligomers and radical polymerizable polyfunctional monomers may be used. Examples of radical polymerizable monomers include those disclosed in Japanese Patent Application Publication No. 2010-173091.

[0074] Examples of energy-ray curable compounds include (meth)acrylate monomers, (meth)acrylate oligomers, and (meth)acrylate polymers. Additionally, examples of energy-ray curable compounds such as urethane (meth)acrylate, polyester (meth)acrylate, and epoxy (meth)acrylate can also be used.

[0075] Furthermore, commercially available energy ray curable compounds may be used. For example, Mitsubishi Chemical's urethane acrylate "Shiko UV7620EA (molecular weight: 4100)"; Negami Kogyo's urethane acrylates "Art Resin UN-905 (molecular weight: 50000~210000)", "Art Resin UN-905DU1 (molecular weight: 26000)", "Art Resin UN-951SC (molecular weight: 12500)", "Art Resin UN-952 (molecular weight: 6500~9500)", "Art Resin UN-953 (molecular weight: 14000~40000)", "Art Resin UN-954 (molecular weight: 4200)", "Art Resin H-219 (molecular weight: 4100) Examples include: "25,000-50,000"; "Art Resin H-315M (molecular weight: 6,600)"; "Art Resin H-417M (molecular weight: 4,000)"; "8BR-600 (molecular weight: 100,000)" acrylic urethane polymer from Taisei Fine Chemical Co., Ltd.; "Unidic V-6850" polymer acrylate from DIC Corporation; "SMP-250AP (molecular weight: 20,000-30,000)" and "SMP-360A (molecular weight: 20,000-30,000)" acrylic polymers from Kyoeisha Chemical Co., Ltd.; and "HA7975" acrylic resin acrylate from Showa Denko Materials Co., Ltd.

[0076] Energy ray curable compounds may be used individually or in combination of two or more types.

[0077] Furthermore, by adjusting the molecular weight of the energy-ray-curable compound, it is possible to control the tack force and the peel strength against the SUS roll. For example, if the molecular weight of the energy-ray-curable compound is small, the tack force and the peel strength against the SUS roll tend to be large, and if the molecular weight of the energy-ray-curable compound is large, the tack force and the peel strength against the SUS roll tend to be small. The weight-average molecular weight of the energy-ray-curable compound is not particularly limited, but is preferably 3,000 or more, more preferably 3,500 or more, and even more preferably 4,100 or more. If the weight-average molecular weight of the energy-ray-curable compound is within the above range, the tack force and the peel strength against the SUS roll can be easily adjusted to be within a predetermined range. On the other hand, the weight-average molecular weight of the energy-ray-curable resin composition is preferably 50,000 or less, more preferably 30,000 or less, and even more preferably 10,000 or less. If the weight-average molecular weight of the energy-ray curable compound is within the above range, it will exhibit sufficient compatibility with the acrylic resin (adhesive base), the adhesive layer will exhibit the desired adhesive strength before energy irradiation, and after energy irradiation, the generation of adhesive residue will be suppressed, making it easily peelable. Furthermore, it is preferable that the adhesive layer contains an energy-ray curable compound with a weight-average molecular weight of 10,000 or more. On the other hand, it is preferable that the adhesive layer does not contain an energy-ray curable compound with a weight-average molecular weight of 3,000 or less.

[0078] Furthermore, by adjusting the content of the energy-ray curable compound, it is possible to control the tack force and the peel strength against the SUS roll. For example, if the content of the energy-ray curable compound is low, the tack force and the peel strength against the SUS roll tend to be low, and if the content of the energy-ray curable compound is high, the tack force and the peel strength against the SUS roll tend to be high. The content of the energy-ray curable compound is preferably 5 parts by mass or more and 150 parts by mass or less, more preferably 20 parts by mass or more and 100 parts by mass or less, and even more preferably 50 parts by mass or more and 80 parts by mass or less, per 100 parts by mass of resin (adhesive main). If the content of the energy-ray curable compound is within the above range, the crosslinking density of the adhesive layer after energy irradiation will be sufficient, so the desired peelability can be achieved. In addition, the occurrence of adhesive residue due to a decrease in cohesive force can be suppressed.

[0079] (3) Polymerization initiator The adhesive layer may contain a polymerization initiator in addition to the resin (adhesive base) and an energy-ray curable compound.

[0080] As polymerization initiators, general photopolymerization initiators can be used. Specifically, these include acetophenones, benzophenones, α-hydroxyketones, benzyl methyl ketals, α-aminoketones, and bisacylphosphine oxides. When urethane acrylate is used as the energy-ray curable compound, it is preferable that the polymerization initiator is a bisacylphosphine-based polymerization initiator. Since this polymerization initiator has heat resistance, even when energy-ray irradiation is performed through the substrate after applying the adhesive composition to the substrate, the energy-ray curable compound can be reliably cured.

[0081] The polymerization initiator preferably has absorption at wavelengths of 230 nm or higher, and more preferably at wavelengths of 300 nm to 400 nm. Such a polymerization initiator absorbs a broad range of energy rays with wavelengths of 300 nm or higher, and can efficiently generate active species that induce the polymerization reaction of energy ray-curable compounds. Therefore, energy ray-curable compounds can be efficiently cured even with a small amount of energy ray irradiation, and can be easily peeled off. Furthermore, as will be described later, resins can be used as the substrate, and many resins absorb energy rays up to about 300 nm but transmit energy rays with wavelengths of 300 nm or higher. Moreover, in recent years, LED lamps with wavelengths of 300 nm or higher are often used in energy ray irradiation devices. Therefore, by using a polymerization initiator that has absorption at wavelengths of 230 nm or higher, energy ray-curable compounds can be cured using energy rays that have been transmitted through the substrate.

[0082] The content of the polymerization initiator is preferably 0.01 parts by mass or more and 10 parts by mass or less, and more preferably 0.5 parts by mass or more and 6 parts by mass or less, per 100 parts by mass of the total of the resin (adhesive base) and the energy-ray curable compound. If the content of the polymerization initiator is less than the above range, the polymerization reaction of the energy-ray curable compound may not occur sufficiently, resulting in excessively high adhesive strength of the adhesive layer after energy-ray irradiation, and making it impossible to achieve peelability. On the other hand, if the content of the polymerization initiator exceeds the above range, the energy rays may only reach the vicinity of the energy-ray irradiation surface, resulting in insufficient curing of the adhesive layer. In addition, the cohesive force may decrease, which may cause adhesive residue to form.

[0083] (4) Crosslinking agent The adhesive layer may contain a crosslinking agent in addition to the resin (adhesive base) and the energy ray-curable compound.

[0084] The crosslinking agent is not particularly limited as long as it crosslinks at least between resins (adhesive bases), and can be appropriately selected depending on the type of resin (adhesive base), etc. Examples include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, and metal chelate-based crosslinking agents. Specific examples of isocyanate-based crosslinking agents and epoxy-based crosslinking agents are disclosed in Japanese Patent Application Publication No. 2012-31316. The crosslinking agent can be used alone or in combination of two or more types.

[0085] The crosslinking agent content can be appropriately set depending on the type of crosslinking agent. Preferably, the crosslinking agent content is 0.01 parts by mass or more and 15 parts by mass or less, and more preferably 0.01 parts by mass or more and 10 parts by mass or less, per 100 parts by mass of resin (main adhesive). If the crosslinking agent content is below the above range, adhesion may be poor, or the adhesive layer may undergo cohesive failure when peeling or transferring the chip, resulting in adhesive residue. On the other hand, if the crosslinking agent content exceeds the above range, the crosslinking agent may remain as unreacted monomers in the adhesive layer after energy ray irradiation, which may cause adhesive residue due to a decrease in cohesive force.

[0086] (5) Additives The adhesive layer may contain various additives as needed. Examples of additives include tackifiers, antistatic agents, plasticizers, silane coupling agents, metal chelating agents, surfactants, antioxidants, UV absorbers, colorants, preservatives, defoamers, and wettability modifiers.

[0087] In these additives, the tack force and peel strength against the SUS roll can be controlled by adjusting the glass transition temperature of the additive. For example, as the glass transition temperature of the additive increases, the tack force and peel strength against the SUS roll tend to decrease. The glass transition temperature of the additive is not particularly limited, but is preferably -10°C or higher and 150°C or lower, and more preferably 5°C or higher and 100°C or lower. Additives with a glass transition temperature within the above range do not have tackiness at room temperature. Therefore, by including such additives, the tack force and peel strength against the SUS roll can be easily adjusted to fall within the above range. When the adhesive layer contains additives, it is preferable that the glass transition temperature of at least one additive is within the above range. In particular, it is preferable that the glass transition temperature of the adhesion modifier described later is within the above range.

[0088] Furthermore, the adhesive layer preferably contains an adhesion modifier. Examples of adhesion modifiers include acrylic block copolymers and polyester resins. Examples of acrylic block copolymers include the Clarity series from Kuraray (e.g., "LA4285 (Mw: approx. 65,000)", "LA2250 (Mw: approx. 67,000)", "LA2140 (Mw: approx. 125,000)", "LA3320 (Mw: approx. 115,000)", etc.) and NANOSTRENGTH from Arkema (e.g., "M22 (Mw: approx. 130,000)", "M22N (Mw: approx. 100,000 to 200,000)", "M52N (Mw: approx. 100,000)", etc.). Examples of polyester resins include the Byron series from Toyobo Co., Ltd. (e.g., "Byron 200 (Mn: approximately 17,000)", "Byron 600 (Mn: approximately 16,000)", etc.) and the Elitel series from Unitika Corporation (e.g., "Elitel UE3210 (Mw: approximately 20,000)", "Elitel UE9200 (Mw: approximately 15,000)", etc.).

[0089] (6) Storage modulus In this embodiment, the storage modulus of the adhesive layer at a temperature of 25°C and a frequency of 1 Hz is preferably, for example, 5 MPa or more, and more preferably 10 MPa or more. If the storage modulus of the adhesive layer is within the above range, the adhesive layer can be made moderately hard, so the tack force and the peel strength against the SUS roll can be easily adjusted to fall within the above range. On the other hand, the upper limit of the storage modulus is not particularly limited, but for example, it is preferably 50 MPa or less, and more preferably 40 MPa or less. If the storage modulus is within the above range, the hardness (modulus of elasticity) when peeling can be lowered, and the adhesive layer can be made moderately soft, so wafers and chips can be sufficiently fixed.

[0090] Here, the storage modulus is a value measured by a dynamic viscoelasticity analyzer (DMA). When measuring the storage modulus of an adhesive layer using a dynamic viscoelasticity analyzer (DMA), the adhesive layer is rolled up to create a cylindrical sample with a diameter of 5 mm to 7 mm and a height of 5 mm to 10 mm. First, the cylindrical sample is placed between the compression fixtures (parallel plates φ8 mm) of the dynamic viscoelasticity analyzer. Next, a compressive load is applied at a temperature of 25°C and a frequency of 1 Hz, and the dynamic viscoelasticity measurement is performed. As a dynamic viscoelasticity analyzer, for example, the RSA-3 manufactured by T.A. Instruments Japan can be used.

[0091] (7) Thickness and method of forming the adhesive layer The thickness of the adhesive layer should be such that sufficient adhesive strength is obtained and energy rays can penetrate to the interior. For example, it may be between 3 μm and 50 μm, or between 5 μm and 40 μm.

[0092] Methods for forming an adhesive layer include, for example, applying an adhesive composition onto a substrate, or applying an adhesive composition onto a separator to form an adhesive layer, and then bonding the adhesive layer and the substrate together.

[0093] 3. Base material In this embodiment, the base material is a member that supports the adhesive layer.

[0094] While the substrate is not particularly limited, it is preferable that the substrate is permeable to energy rays, as in the pickup or transfer process, energy rays are irradiated from the substrate side of the semiconductor processing adhesive tape to harden the adhesive layer and thereby reduce the adhesive strength of the adhesive layer.

[0095] The Young's modulus of the substrate is preferably, for example, 20 MPa to 500 MPa, more preferably 30 MPa to 300 MPa, and even more preferably 40 MPa to 150 MPa. If the Young's modulus of the substrate is within the above range, the substrate can be made moderately hard, so the peel strength against the SUS roll can be easily adjusted to fall within the above range. Furthermore, conveyance using the conveyor roll becomes easier. In addition, expandability can be improved. On the other hand, if the Young's modulus of the substrate is too low, the substrate becomes extremely soft, which may cause the adhesive tape for semiconductor processing to tear during conveyance or expansion.

[0096] Here, the Young's modulus of the substrate can be measured in accordance with JIS K7127. The specific measurement conditions are shown below. As a tensile testing machine, for example, the "Tensilon RTF1150" manufactured by A&D Company, Limited can be used.

[0097] (Measurement conditions) • Test specimen: Test specimen type 5 • Chuck spacing: 60mm • Tensile speed: 100 mm / min ·Temperature: 23℃ ·Humidity: 50%RH

[0098] The base material is preferably one that satisfies the above characteristics, and examples include olefin resins, vinyl chloride resins, polyester resins, urethane resins, polystyrene resins, polycarbonate resins, fluororesins, thermoplastic elastomers, and rubber-based materials. Examples of olefin resins include low-density polyethylene, high-density polyethylene, polypropylene, polybutene, polymethylpentene, polybutadiene, ethylene vinyl acetate copolymer, ionomer resin, ethylene (meth)acrylic acid copolymer, and ethylene (meth)acrylic acid ester copolymer. Examples of vinyl chloride resins include polyvinyl chloride and vinyl chloride copolymer. Examples of polyester resins include polyethylene terephthalate and polybutylene terephthalate. Examples of thermoplastic elastomers include olefin-based elastomers, vinyl chloride-based elastomers, polyester-based elastomers, styrene-based elastomers, urethane-based elastomers, acrylic-based elastomers, and amide-based elastomers. Examples of rubber-based materials include isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, acrylonitrile-butadiene rubber, butyl rubber, halogenated butyl rubber, acrylic rubber, urethane rubber, and polysulfide rubber. These may be used individually or in combination of two or more types.

[0099] In particular, olefin resins or vinyl chloride resins are preferred from the viewpoint of obtaining a base material with good expandability and workability. That is, it is preferable that the base material contains an olefin resin or vinyl chloride resin.

[0100] The base material may contain various additives as needed, such as plasticizers, fillers, antioxidants, light stabilizers, antistatic agents, lubricants, dispersants, flame retardants, and colorants.

[0101] The substrate may be, for example, a single layer or a multi-layered layer.

[0102] The adhesive layer side of the substrate may be surface-treated to improve adhesion with the adhesive layer. The surface treatment is not particularly limited and includes, for example, corona treatment, plasma treatment, ozone treatment, flame treatment, primer treatment, vapor deposition treatment, alkali treatment, etc.

[0103] The thickness of the substrate is not particularly limited and may be, for example, 20 μm to 500 μm, 40 μm to 350 μm, or 50 μm to 200 μm. If the thickness of the substrate is within the above range, it is possible to make a substrate that is easy to expand and has sufficient strength to prevent breakage.

[0104] 4. Other configurations The adhesive tape for semiconductor processing of this embodiment may have other components in addition to the substrate and adhesive layer described above, as needed.

[0105] The adhesive tape for semiconductor processing in this embodiment may have a separator on the side of the adhesive layer opposite to the substrate. The separator can protect the adhesive layer.

[0106] Furthermore, the semiconductor processing adhesive tape of this embodiment may have a primer layer between the substrate and the adhesive layer. The primer layer can improve the adhesion between the substrate and the adhesive layer.

[0107] 5.Applications The adhesive tape for semiconductor processing according to this embodiment can be suitably used as a dicing tape.

[0108] B. Second Embodiment The semiconductor processing adhesive tape of this embodiment is a semiconductor processing adhesive tape having a base material and an energy ray curable adhesive layer disposed on one side of the base material, wherein the tack force measured by a probe tack test under the conditions of a contact load of 0.98 N and a contact time of 30 seconds is 5.0 N or less, and the peel strength against a SUS roll satisfies at least one of the following (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 2.0 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 2.0 N / 20 mm or less.

[0109] Figure 1 is a schematic cross-sectional view illustrating the semiconductor processing adhesive tape of this embodiment. The semiconductor processing adhesive tape 10 in Figure 1 has a base material 1 and an energy-ray curable adhesive layer 2 disposed on one side of the base material 1. In the semiconductor processing adhesive tape 10 of this embodiment, the tack force measured by a probe tack test under the conditions of a contact load of 0.98 N and a contact time of 30 seconds is less than or equal to a predetermined value. Furthermore, in the semiconductor processing adhesive tape 10 of this embodiment, the peel strength against a SUS roll satisfies at least one of the above (i) and (ii).

[0110] In the semiconductor processing adhesive tape of this embodiment, adhesion to the transport means can be suppressed if the tack force measured by the probe tack test is below a predetermined value, and the peel strength against the SUS roll satisfies at least one of (i) and (ii) above. Therefore, the peelability of the semiconductor processing adhesive tape from the transport means can be improved. Furthermore, tearing of the semiconductor processing adhesive tape due to adhesion to the transport means can be suppressed, improving workability.

[0111] 1. Characteristics of adhesive tapes for semiconductor processing (1) Tuck force measured by probe tuck test In the semiconductor processing adhesive tape of this embodiment, the tack force measured by a probe tack test under the conditions of a contact load of 0.98 N and a contact time of 30 seconds is 5.0 N or less, preferably 4.5 N or less, and more preferably 4.0 N or less. Because the tack force is within this range, the adhesive layer of the semiconductor processing adhesive tape can be easily peeled off even if it comes into contact with the transport means before energy ray irradiation. On the other hand, the tack force may be, for example, 0.1 N or more, or 0.5 N or more. Because the tack force is within this range, wafers and chips can be sufficiently fixed before energy ray irradiation.

[0112] Here, the tack force is a value measured by the same method as the probe tack test described in "A. First Embodiment" above, except that the contact load is set to 0.98 N.

[0113] The reason why the contact load differs between the first and second embodiments is that the load when the conveying means contacts the semiconductor processing adhesive tape fluctuates during the semiconductor manufacturing process using semiconductor processing adhesive tape and the manufacturing process of semiconductor processing adhesive tape. Therefore, there are two types of contact loads: light load and heavy load.

[0114] In this disclosure, it is preferable that the adhesive tape for semiconductor processing satisfies both the tack force when the contact load is 0.098 N and the tack force when the contact load is 0.98 N.

[0115] (2) Peel strength against SUS rolls In the semiconductor processing adhesive tape of this embodiment, the peel strength against a SUS roll satisfies at least one of the following (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 2.0 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 2.0 N / 20 mm or less.

[0116] The peel strength and measurement method for SUS rolls are the same as those described in "A. First Embodiment" above, so a detailed explanation is omitted here.

[0117] Other characteristics of the adhesive tape for semiconductor processing in this embodiment are the same as those described in "A. First Embodiment" above, so their explanation is omitted here.

[0118] 2. Composition The adhesive layer, substrate, other components, and applications in this embodiment are the same as those described in "A. First Embodiment" above, so a detailed explanation is omitted here.

[0119] This disclosure is not limited to the embodiments described above. The embodiments described above are illustrative, and any configuration that is substantially identical to the technical idea described in the claims of this disclosure and achieves similar effects is included within the technical scope of this disclosure. [Examples]

[0120] The present disclosure will be further explained below with reference to examples and comparative examples.

[0121] [material] The materials used in the adhesive composition are shown below. • Acrylic adhesive main component (acrylic acid ester copolymer, weight-average molecular weight 800,000) ·UV-curable compound A (number of functional groups: 9, molecular weight: 4,100) ·UV-curable compound B (number of functional groups: 6, molecular weight: 4,200) ·UV-curable compound C (number of functional groups: 6, molecular weight: 20,000) ·UV-curable compound D (number of functional groups: 2, molecular weight: 3,000) ·Polymerization initiator (manufactured by IGM Resins BV, product name: Omnirad 819) • Crosslinking agent A (epoxy-based curing agent) • Crosslinking agent B (isocyanate-based curing agent)

[0122] [Example 1] An adhesive composition was prepared by diluting 100 parts by mass of an acrylic adhesive base, 40 parts by mass of UV-curable compound A, 30 parts by mass of UV-curable compound B, 0.35 parts by mass of a photopolymerization initiator, and 1.0 part by mass of crosslinking agent A with a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1:1) to a solid content of 20%, and thoroughly dispersing the mixture.

[0123] The adhesive composition was applied to a polyethylene terephthalate (PET) separator to a thickness of 20 μm after drying, and the mixture was dried in a 110°C oven for 3 minutes to form an adhesive layer.

[0124] Next, a substrate (polyvinyl chloride (PVC) film, Ronseal's "FV5-RP-TR-90", 90 μm thick) was laminated onto the adhesive layer, and then aged at 50°C for 3 days to produce an adhesive tape for semiconductor processing.

[0125] [Example 2] An adhesive composition was prepared as described below. An adhesive layer was formed in the same manner as in Example 1, except that the obtained adhesive composition was used, and an adhesive tape for semiconductor processing was manufactured. An adhesive composition was prepared by diluting 100 parts by mass of an acrylic adhesive main component, 70 parts by mass of UV-curable compound B, 0.35 parts by mass of a photopolymerization initiator, and 1.0 part by mass of crosslinking agent A with a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1:1) to a solid content of 20%, and thoroughly dispersing the mixture.

[0126] [Example 3] An adhesive composition was prepared as described below. An adhesive layer was formed in the same manner as in Example 1, except that the obtained adhesive composition was used, and an adhesive tape for semiconductor processing was manufactured. An adhesive composition was prepared by diluting 100 parts by mass of an acrylic adhesive main component, 70 parts by mass of UV-curable compound C, 0.35 parts by mass of a photopolymerization initiator, and 1 part by mass of crosslinking agent A with a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1:1) to a solid content of 20%, and thoroughly dispersing the mixture.

[0127] [Example 4] An adhesive composition was prepared as described below. An adhesive layer was formed in the same manner as in Example 1, except that the obtained adhesive composition was used, and an adhesive tape for semiconductor processing was manufactured. An adhesive composition was prepared by diluting 100 parts by mass of an acrylic adhesive base, 40 parts by mass of UV-curable compound A, 30 parts by mass of UV-curable compound B, 0.35 parts by mass of a photopolymerization initiator, and 5 parts by mass of crosslinking agent B with a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1:1) to a solid content of 20%, and thoroughly dispersing the mixture.

[0128] [Example 5] An adhesive composition was prepared as described below. An adhesive layer was formed in the same manner as in Example 1, except that the obtained adhesive composition was used, and an adhesive tape for semiconductor processing was manufactured. An adhesive composition was prepared by diluting 100 parts by mass of an acrylic adhesive main component, 60 parts by mass of UV-curable compound D, 0.3 parts by mass of a polymerization initiator, and 1 part by mass of crosslinking agent A with a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1:1) to a solid content of 20%, and thoroughly dispersing the mixture.

[0129] [Comparative Example 1] An adhesive composition was prepared as described below. An adhesive layer was formed in the same manner as in Example 1, except that the obtained adhesive composition was used, and an adhesive tape for semiconductor processing was manufactured. An adhesive composition was prepared by diluting 100 parts by mass of an acrylic adhesive base, 40 parts by mass of UV-curable compound A, 15 parts by mass of UV-curable compound C, 15 parts by mass of UV-curable compound D, 0.35 parts by mass of a photopolymerization initiator, and 1.0 part by mass of crosslinking agent A with a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1:1) to a solid content of 20%, and thoroughly dispersing the mixture.

[0130] [Comparative Example 2] An adhesive composition was prepared as described below. An adhesive layer was formed in the same manner as in Example 1, except that the obtained adhesive composition was used, and an adhesive tape for semiconductor processing was manufactured. An adhesive composition was prepared by diluting 100 parts by mass of an acrylic adhesive base, 70 parts by mass of UV-curable compound A, 0.35 parts by mass of a photopolymerization initiator, and 1 part by mass of crosslinking agent A with a mixed solvent of methyl ethyl ketone and toluene (mixing ratio 1:1) to a solid content of 20%, and thoroughly dispersing the mixture.

[0131] [evaluation] (1) Tuck force measured by probe tuck test The separator was peeled off from the semiconductor processing adhesive tape obtained above to expose the adhesive layer. The tack force was measured on the surface of the exposed adhesive layer using the probe tack test method described in "A. First Embodiment" above. The contact load was set to 0.098 N or 0.98 N.

[0132] (2) Peel strength against SUS rolls The separator was peeled off the semiconductor processing adhesive tape obtained above to expose the adhesive layer. The peel strength against the SUS roll was measured using the method described in "A. First Embodiment" above.

[0133] (3) Storage modulus The storage modulus of the adhesive layer of the semiconductor processing adhesive tape obtained above was measured using a dynamic viscoelasticity measuring device (RSA-3, manufactured by T.A. Instrument Japan Co., Ltd.). The adhesive layer was rolled into a cylindrical shape with a diameter of 5 mm to 7 mm and a height of 5 mm to 10 mm to serve as the measurement sample. The measurement conditions were a temperature of 25°C and a frequency of 1 Hz.

[0134] (4) Adhesion to SUS plate The adhesive strength of semiconductor processing adhesive tape to SUS plates was measured according to Method 1 of JIS Z0237:2009 (Test Methods for Adhesive Tapes and Adhesive Sheets) (a test method in which the tape and sheet are peeled off from a stainless steel test plate at a 180° angle at a temperature of 23°C and 50% humidity), under the conditions of a width of 25 mm, a peeling angle of 180°, and a peeling speed of 300 mm / min, by peeling the test piece in the longitudinal direction. The SUS plate used was SUS304, surface finish BA, thickness 1.5 mm, width 100 mm, and length 150 mm.

[0135] (5) Adhesion to SUS plate after UV irradiation The adhesive strength to the SUS plate after energy ray irradiation was measured in accordance with Method 1 of the JIS Z0237:2009 (Test Methods for Adhesive Tapes and Sheets) (Temperature 23°C, Humidity 50%RH, Test Method in which the tape and sheet are peeled off from the stainless steel test plate at a 180° angle). First, the separator was peeled off the semiconductor processing adhesive tape and attached to the SUS plate using a manual roller. An integrated light intensity of 500 mJ / cm was applied from the substrate side of the semiconductor processing adhesive tape. 2 The adhesive layer was cured by irradiating it with ultraviolet light. Next, the adhesive strength to the SUS plate after energy ray irradiation was measured by peeling the test piece in the length direction under the conditions of a width of 25 mm, a peeling angle of 180°, and a peeling speed of 300 mm / min. The SUS plate used was SUS304, surface finish BA, thickness 1.5 mm, width 100 mm, and length 150 mm.

[0136] [evaluation] A fully automated DFR film lamination machine (ATM-1100K, manufactured by Takatori Co., Ltd.) was used to continuously perform the process of laminating semiconductor processing adhesive tape onto silicon wafers. Specifically, the adhesive tape, measuring 180 mm in width and 50 m in length, was fed from a winding body, and the process of laminating it onto a 6-inch diameter silicon wafer while peeling off the separator was performed continuously. The work efficiency during this process was evaluated according to the following evaluation criteria.

[0137] [Evaluation Criteria] A: Continuous lamination of adhesive tapes for semiconductor processing is possible. B: Although the adhesive tape for semiconductor processing adheres to the transport roll, it is possible to continuously bond it to five or more wafers. C: The adhesive tape for semiconductor processing sticks to the transport roll, causing the operation to stop when the number of continuously applied sheets is 4 or less. D: The adhesive tape for semiconductor processing sticks to the transport roll, causing the operation to stop when the number of continuously applied sheets is two or less.

[0138] [Table 1]

[0139] As shown in Table 1, the semiconductor processing adhesive tapes of Examples 1 to 5 exhibited excellent peelability from the transport means before energy ray irradiation. On the other hand, in the comparative example, the semiconductor processing adhesive tape adhered to the transport roll, resulting in inferior peelability from the transport means compared to the examples.

[0140] In other words, the present disclosure provides the following inventions.

[0141] [1] A semiconductor processing adhesive tape comprising a base material and an energy ray curable adhesive layer disposed on one surface of the base material, Under the conditions of a contact load of 0.098 N and a contact time of 30 seconds, the tack force measured by the probe tack test is 5.0 N or less. A semiconductor processing adhesive tape having a peel strength against a SUS roll that satisfies at least one of the following conditions (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 1.5 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 1.5 N / 20 mm or less.

[0142] [2] A semiconductor processing adhesive tape comprising a base material and an energy ray curable adhesive layer disposed on one surface of the base material, Under the conditions of a contact load of 0.98 N and a contact time of 30 seconds, the tack force measured by the probe tack test is 5.0 N or less. A semiconductor processing adhesive tape having a peel strength against a SUS roll that satisfies at least one of the following conditions (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 2.0 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 2.0 N / 20 mm or less.

[0143] [3] The semiconductor processing adhesive tape according to [1] or [2], wherein the adhesive strength to a SUS plate is 5.0 N / 25 mm or more.

[0144] [4] An adhesive tape for semiconductor processing according to any one of [1] to [3], wherein the adhesive force to a SUS plate after energy ray irradiation is 2.0 N / 25 mm or less. [Explanation of symbols]

[0145] 1 … Base material 2 … Adhesive layer 10… Adhesive tape for semiconductor processing

Claims

1. A semiconductor processing adhesive tape comprising a base material and an energy-ray curable adhesive layer disposed on one surface of the base material, Under the conditions of a contact load of 0.098 N and a contact time of 30 seconds, the tack force measured by the probe tack test is 5.0 N or less. A semiconductor processing adhesive tape having a peel strength against a SUS roll that satisfies at least one of the following conditions (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 1.5 N / 20 mm or less. (ii) The peel strength against a SUS roll at a tensile speed of 1000 mm / min is 1.5 N / 20 mm or less.

2. A semiconductor processing adhesive tape comprising a base material and an energy-ray curable adhesive layer disposed on one surface of the base material, Under the conditions of a contact load of 0.98 N and a contact time of 30 seconds, the tack force measured by the probe tack test is 5.0 N or less. A semiconductor processing adhesive tape having a peel strength against a SUS roll that satisfies at least one of the following conditions (i) and (ii). (i) The peel strength against a SUS roll at a tensile speed of 300 mm / min is 2.0 N / 20 mm or less. (ii) The peel strength of the SUS roll at a tensile speed of 1000 mm / min is 2.0 N / 20 mm or less.

3. The semiconductor processing adhesive tape according to claim 1 or claim 2, wherein the adhesive strength to a SUS plate is 5.0 N / 25 mm or more.

4. The adhesive tape for semiconductor processing according to claim 1 or claim 2, wherein the adhesive strength to a SUS plate after energy ray irradiation is 2.0 N / 25 mm or less.

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