Capacitor device

Abstract

To provide a capacitor device in which the excessive increase of heat received in a capacitor is suppressed.SOLUTION: A capacitor device includes a capacitor component 5A including a capacitor 30 having a first electrode 33 and a second electrode 35, capacitor bus bars 15 and 25 having one end connected to the first electrode or the second electrode and the other end connected electrically to an electric component 6, and a case 40 having an opening part 46 for exposing a part of the capacitor bus bars and internally housing the capacitor and the capacitor bus bars, and a cooler 80 having a counter surface 70A facing the opening part in one direction and allowing a coolant to flow therein. Exposed parts 190 and 290, which are the capacitor bus bars exposed from the opening part, are in contact with the counter surface.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The disclosure described in this specification relates to a capacitor device.

Background Art

[0002] The power conversion device according to Patent Document 1 includes a cooler, a capacitor module, and a heat radiating metal body. The capacitor module includes a capacitor element, a capacitor case, a positive electrode side bus bar, and a negative electrode side bus bar. The capacitor case houses the capacitor element via a filling resin. A heat radiating metal body is disposed inside the capacitor case. The heat radiating metal body and the bus bar are thermally connected via the filling resin. The heat radiating metal body is thermally connected to the cooling surface of the cooler.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the configuration of Patent Document 1, a positive electrode side bus bar and a negative electrode side bus bar are connected to the capacitor element. Further, the heat accompanying the current flowing through the bus bar is radiated to the cooler via the filling resin and the heat radiating metal body. Since the filling resin and the heat radiating metal body are interposed between the bus bar and the cooler, it is difficult for the heat to be radiated from the bus bar to the cooler.

[0005] Therefore, an object of the present disclosure is to provide a capacitor device with improved heat dissipation.

Means for Solving the Problems

[0006] A capacitor device according to an aspect of the present disclosure is A capacitor (30) having a first electrode (33) and a second electrode (35), A capacitor busbar (15, 25) has one end connected to the first or second electrode and the other end electrically connected to an electrical component (6), A case (40) has an opening (46) that exposes a portion of the capacitor busbar, and houses a capacitor and a capacitor busbar inside. A capacitor component (5A) equipped with, It has opposing surfaces (70A) with openings facing each other in one direction (TD), and , to cool capacitor components Cooler (80) and 、 Power busbars (11, 21) connected to power supply (2) And, equipped with, The exposed portions (190, 290), which are capacitor busbars exposed from the opening, are in contact with the opposing surface. 、 The power busbar is located between the opening and the cooler. It is. A capacitor device according to another aspect of this disclosure is: A capacitor (30) having a first electrode (33) and a second electrode (35), A capacitor busbar (15, 25) has one end connected to the first or second electrode and the other end electrically connected to an electrical component (6), A case (40) has an opening (46) that exposes a portion of the capacitor busbar, and houses a capacitor and a capacitor busbar inside. A capacitor component (5A) equipped with, It comprises a cooler (80) having opposing surfaces (70A) with openings facing each other in one direction (TD), and through which a refrigerant flows, The exposed portions (190, 290), which are capacitor busbars exposed from the opening, are in contact with the opposing surface. The system further comprises a main section (12, 22) provided between the power supply (2) and the electrical components, which electrically connects the power supply and the electrical components, and a power busbar (11, 21) having capacitor path connection terminals (12E, 22E) provided on the main section and connected to the capacitor busbar, The power busbar is located between the opening and the cooler. The power busbar is in contact with the opposite surface.

[0007] Because the exposed parts (190, 290) are in contact with the opposing surface (70A), the heat from the capacitor busbars (15, 25) is efficiently dissipated to the cooler (80). This makes it possible to provide a capacitor device with improved heat dissipation.

[0008] The reference numbers in parentheses above merely indicate the correspondence with the configurations described in the embodiments below, and do not in any way limit the technical scope. [Brief explanation of the drawing]

[0009] [Figure 1] It is a schematic diagram for explaining the connection form of a power conversion device on which a capacitor device is mounted. [Figure 2] It is a partial cross-sectional view of a capacitor device. [Figure 3] It is a perspective view of a capacitor device. [Figure 4] It is a perspective view of a capacitor component. [Figure 5] It is a plan view of a capacitor component. [Figure 6] It is a cross-sectional view of the capacitor device along the line VI-VI in FIG. 5. [Figure 7] It is a perspective view of a capacitor component excluding the coating member. [Figure 8] It is a perspective view of a capacitor component excluding the case as viewed from the first electrode side. [Figure 9] It is a perspective view of a capacitor component excluding the main path portion as viewed from the second electrode side. [Figure 10] It is a cross-sectional view of the capacitor device according to the second embodiment.

Modes for Carrying Out the Invention

[0010] Hereinafter, a plurality of modes for carrying out the present disclosure will be described with reference to the drawings. In each mode, the same reference numerals may be assigned to the parts corresponding to those described in the preceding mode, and redundant descriptions may be omitted. When only a part of the configuration is described in each mode, other modes described previously can be applied to the other parts of the configuration.

[0011] In addition, not only combinations of parts clearly indicated as combinable in each embodiment are possible, but also embodiments, embodiments and modification examples, and modification examples can be partially combined with each other as long as there is no problem with the combination, even if not explicitly stated.

[0012] (First Embodiment) Figure 1 is a schematic diagram illustrating the electrical connection configuration of a power converter 1 equipped with a capacitor device 5 having a capacitor 30. The power converter 1 is installed in an in-vehicle system. The power converter 1 includes a capacitor device 5 and an inverter 6 as an electrical component. The inverter 6 will be described first. The inverter 6 includes, as an example, a three-phase semiconductor module 7. The inverter 6 includes a U-phase semiconductor module 7A, a V-phase semiconductor module 7B, and a W-phase switch module 7C as the three-phase semiconductor module 7. The inverter 6 performs power conversion of the power input from the high-voltage battery 2. The converted power is supplied to the motor generator 9. The high-voltage battery 2 is sometimes referred to as the power source.

[0013] The inverter 6 converts the DC power supplied from the high-voltage battery 2 into AC power by switching the semiconductor elements 8 of the semiconductor module 7 on and off. The high-voltage battery 2 is, for example, multiple rechargeable batteries. The rechargeable batteries can be lithium-ion batteries, nickel-metal hydride batteries, or organic radical batteries.

[0014] The motor-generator 9 includes a three-phase AC rotating electric machine, i.e., a three-phase AC motor. The motor-generator 9 functions as an electric motor, which is the driving source for the vehicle. The motor-generator 9 functions as a generator during regeneration. The inverter 6 performs power conversion between the high-voltage battery 2 and the motor-generator 9.

[0015] A capacitor device 5 is connected to the input side of the inverter 6. The capacitor device 5 is connected to the high-voltage battery 2 on its input side. The capacitor device 5 has a capacitor 30. The capacitor 30 primarily smooths the DC voltage supplied from the high-voltage battery 2. The capacitor 30 is connected between a first high-voltage line 10, which connects the high-voltage battery 2 and the inverter 6 on the high-potential side, and a second high-voltage line 20, which connects the high-voltage battery 2 and the inverter 6 on the low-potential side.

[0016] A motor generator 9 is connected to the output side of the inverter 6. The semiconductor module 7 described above, as an example, has two IGBTs and two diodes 8A, which are semiconductor elements 8. The diodes 8A are connected in antiparallel to the semiconductor elements 8. The two semiconductor elements 8 are connected in series between the first high-voltage line 10 and the second high-voltage line 20.

[0017] A collector terminal connected to the first high-voltage line 10 is connected to the collector electrode of one of the two semiconductor elements 8, which is located on the high-potential side. An emitter terminal connected to the second high-voltage line 20 is connected to the emitter electrode of one of the two semiconductor elements 8, which is located on the low-potential side. Motor terminals connected to the motor generator 9 are connected to the emitter electrode of the high-potential semiconductor element 8 and the collector electrode of the low-potential semiconductor element 8.

[0018] <Mechanical configuration of a capacitor device> Next, the mechanical configuration of the capacitor device 5 will be described. The capacitor device 5 comprises a capacitor component 5A and a cooler 80. The capacitor component 5A has a first high-voltage line 10, a second high-voltage line 20, a capacitor 30, a case 40, a sealing member 50, and a connecting member 90. The cooler 80 is a cooling device for cooling the capacitor component 5A.

[0019] The first high-voltage line 10 and the second high-voltage line 20 are soldered to the capacitor 30. The case 40 is a box-shaped enclosure with a storage space 44 for housing these components. The case 40 is, for example, made primarily of resin. The case 40 houses a portion of the first high-voltage line 10, a portion of the second high-voltage line 20, the capacitor 30, and the sealing member 50. The portion of the first high-voltage line 10, a portion of the second high-voltage line 20, and the capacitor 30 are fixed to the case 40 via the sealing member 50. The sealing member 50 is, for example, epoxy resin. The connecting member 90 will be described later.

[0020] Next, the drawings will be described. Figure 2 is a partial cross-sectional view of the capacitor device 5. Figure 3 is a perspective view of the capacitor device 5. Figure 4 is a perspective view of the capacitor component 5A. Figure 5 is a plan view of the capacitor component 5A. Figure 6 is a cross-sectional view of the capacitor component 5A along the line VI-VI in Figure 5. Figure 7 is a perspective view of the capacitor component 5A excluding the covering members 11A and 21A. Figure 8 is a perspective view of the capacitor component 5A excluding the case 40, as seen from the first electrode 33 side. Figure 9 is a perspective view of the capacitor component 5A excluding the main path portions 11 and 21, as seen from the second electrode 35 side.

[0021] Regarding direction, the thickness direction of the bottom wall 41 of case 40 is sometimes referred to as the thickness direction TD, or unidirectional TD. The depth direction perpendicular to the thickness direction TD is sometimes referred to as the depth direction DP. The width direction perpendicular to the thickness direction TD and the depth direction DP is sometimes referred to as the width direction WD. The width direction WD corresponds to the direction in which the high-voltage battery 2, capacitor component 5A, and inverter 6 are aligned. The direction perpendicular to the thickness direction TD is sometimes referred to as the planar direction. The planar direction is the direction along the width direction WD and the depth direction DP.

[0022] <Capacitor> Capacitor 30 has, for example, six capacitor elements 31. However, the number of capacitor elements 31 is not limited to six. Capacitor elements 31 are film capacitors. A film capacitor is made by winding a dielectric film so that metal-deposited electrodes are provided on the dielectric film and the metal-deposited electrodes face each other. Metallic electrodes are formed on both ends of the film capacitor by thermal spraying of metal. One metallic electrode is electrically connected to the metallic electrode. The other metallic electrode is electrically connected to the metal-deposited electrode. In the drawing, capacitor 30 is shown as metal by hatching for convenience.

[0023] The capacitor element 31 is a three-dimensional shape with a fixed volume. The capacitor element 31 may be provided in three-dimensional shapes such as a cylinder, elliptical cylinder, polygonal prism, cube, or rectangular prism. The capacitor element 31 has at least two end faces 32, 34 and a side surface 36. One end face 32, 34 of the capacitor element 31 with respect to the thickness direction TD is called the first end face 32. The metallic electrode provided on the first end face 32 is called the first electrode 33. The other end face 32, 34 of the capacitor element 31 with respect to the thickness direction TD is called the second end face 34. The metallic electrode provided on the second end face 34 is called the second electrode 35.

[0024] The first electrode 33 and the second electrode 35 are provided separated by respect to the thickness direction TD. The side surface 36 connects the first end face 32 and the second end face 34. The side surface 36 extends along the edges of the first end face 32 and the second end face 34. It can also be said that the side surface 36 extends circumferentially along the edges of the first end face 32 and the second end face 34, with an axis along the thickness direction TD.

[0025] The six capacitor elements 31 are arranged in two rows and three columns in the storage space 44 of the case 40. The six capacitor elements 31 are arranged in two rows with respect to the width direction WD and in three columns with respect to the depth direction DP. The six capacitor elements 31 are connected in parallel by electrical wiring (not shown). The direction in which the two electrodes 33 and 35 of each of the six capacitor elements 31 are aligned is equal to the thickness direction TD. The first electrode 33 of each of the six capacitor elements 31 is provided on one end of the thickness direction TD. The second electrode 35 of each of the six capacitor elements 31 is provided on the other end of the thickness direction TD.

[0026] <Case> The above-described case 40 has a thin bottom wall 41 in the thickness direction TD and a side wall 42 that rises annularly from the bottom wall 41. The side wall 42 comprises a first wall portion 42A and a third wall portion 42C aligned in the depth direction DP, and a second wall portion 42B and a fourth wall portion 42D aligned in the width direction WD. The first wall portion 42A, the second wall portion 42B, the third wall portion 42C, and the fourth wall portion 42D are continuous in an annular shape in this order clockwise.

[0027] The storage space 44 is partitioned by the bottom wall 41 and the side walls 42. Furthermore, an opening 46 that opens in the thickness direction TD is partitioned by the side wall end 45 of the side wall 42, away from the bottom wall 41. A capacitor 30 is provided in the case 40 such that the first electrode 33 faces the bottom wall 41 and the second electrode 35 faces the opening 46. However, the arrangement of the capacitor 30 in the case 40 is not limited to this. Other embodiments will be described later.

[0028] <First High-Voltage Line> As an example, the first high-voltage line 10 is formed by bending a thin, plate-like busbar. As shown in Figure 8, the first high-voltage line 10 has a first main path section 11 and a first capacitor path section 15. The first main path section 11 is a current-carrying path that connects the high-potential side electrode of the high-voltage battery 2, the high-potential side collector electrode of the inverter 6, and the first capacitor path section 15. The first main path section 11 is sometimes referred to as the first power supply path section because it is a path connected to the high-voltage battery 2. Furthermore, the first capacitor path section 15 is sometimes referred to as the first capacitor busbar. The first main path section 11 is sometimes referred to as the first power supply busbar.

[0029] The first capacitor path 15 is an energizing path connecting the first electrode 33 of the capacitor 30 and the first main path 11. The first capacitor path 15 is a path in which one end is connected to the capacitor 30 and the other end is electrically connected to the inverter 6. The first capacitor path 15 can also be described as an energizing path in which current flows between the first electrode 33 of the capacitor 30 and the collector electrode on the high-potential side of the inverter 6.

[0030] The first main path section 11 and the first capacitor path section 15 are separate components. The first main path section 11 and the first capacitor path section 15 are connected via a connecting member 90. The connecting member 90 is, for example, a bolt. The first main path section 11 and the first capacitor path section 15 are electrically and mechanically connected via the connecting member 90. Note that the connecting member 90 is not limited to a bolt, as long as current is supplied to the first main path section 11 and the first capacitor path section 15. The connecting member 90 may also be solder, adhesive, or screws.

[0031] The first capacitor path 15 is soldered to the first electrode 33. A portion of the first capacitor path 15 is fixed to the case 40 by a sealing member 50. The remainder of the first capacitor path 15 and the first main path 11 are exposed from the case 40.

[0032] The first main path section 11 is, for example, a busbar made of a metal member. As will be explained later, the first main path section 11 is covered by covering members 11A and 21A. As shown in Figure 7, the first main path section 11 comprises a first main section 12, a first electrode terminal 12A, a first semiconductor connection terminal 12F, and a first capacitor path connection terminal 12E. The first electrode terminal 12A, the first semiconductor connection terminal 12F, and the first capacitor path connection terminal 12E are terminals provided on the first main section 12. The first main section 12 is electrically connected to the high-voltage battery 2, the inverter 6, and the capacitor 30 via the first electrode terminal 12A, the first semiconductor connection terminal 12F, and the first capacitor path connection terminal 12E. The first semiconductor connection terminal 12F is sometimes referred to as an electrical component connection terminal.

[0033] The first electrode terminal 12A is connected to the high-potential side electrode of the high-voltage battery 2. The first semiconductor connection terminal 12F is connected to the high-potential side collector electrode of the semiconductor module 7. The first semiconductor connection terminal 12F includes a first U-phase connection terminal 12B, a first V-phase connection terminal 12C, and a first W-phase connection terminal 12D. The first U-phase connection terminal 12B is connected to the high-potential side collector electrode of the U-phase semiconductor module 7A. The first V-phase connection terminal 12C is connected to the high-potential side collector electrode of the V-phase semiconductor module 7B. The first W-phase connection terminal 12D is connected to the high-potential side collector electrode of the W-phase switch module 7C. The first capacitor path connection terminal 12E is connected to the first main path connection terminal 18B of the first capacitor path section 15. The first main path connection terminal 18B will be explained in detail later.

[0034] The first capacitor path section 15 is, for example, a busbar made of a metal member. As shown in Figure 8, the first capacitor path section 15 comprises a first capacitor main section 16, a first capacitor connection terminal 18A, and a first main path connection terminal 18B. The first capacitor connection terminal 18A and the first main path connection terminal 18B are terminals provided on the first capacitor main section 16. The first capacitor connection terminal 18A is connected to the first electrode 33 of the capacitor 30. The first main path connection terminal 18B is connected to the first capacitor path connection terminal 12E of the first main path section 11. The first capacitor main section 16 is electrically connected to the inverter 6 and the capacitor 30 via the first capacitor connection terminal 18A and the first main path connection terminal 18B. The capacitor 30 is connected in parallel to the high-voltage battery 2.

[0035] <Second High-Voltage Line> As an example, the second high-voltage line 20 is formed by bending a thin, plate-like busbar. As shown in Figure 7, the second high-voltage line 20 has a second main path section 21 and a second capacitor path section 25. The second main path section 21 is a current-carrying path that connects the low-potential electrode of the high-voltage battery 2, the low-potential emitter electrode of the inverter 6, and the second capacitor path section 25. The second main path section 21 is sometimes referred to as the second power supply path section because it is a path connected to the high-voltage battery 2. Furthermore, the second capacitor path section 25 is sometimes referred to as the second capacitor busbar. The second main path section 21 is sometimes referred to as the second power supply busbar.

[0036] The second capacitor path 25 is an energizing path connecting the second electrode 35 of the capacitor 30 to the second main path 21. The second capacitor path 25 is a path in which one end is connected to the capacitor 30 and the other end is electrically connected to the inverter 6. The second capacitor path 25 can also be described as an energizing path through which current flows between the second electrode 35 of the capacitor 30 and the low-potential emitter electrode of the inverter 6.

[0037] The second main path section 21 and the second capacitor path section 25 are separate components. The second main path section 21 and the second capacitor path section 25 are electrically and mechanically connected via a connecting member 90. Note that the connecting member 90 is not limited to a bolt, as long as current is supplied to the second main path section 21 and the second capacitor path section 25. The connecting member 90 may also be solder, adhesive, or a screw.

[0038] The second capacitor path 25 is soldered to the second electrode 35. A portion of the second capacitor path 25 is fixed to the case 40 by a sealing member 50. The remainder of the second capacitor path 25 and the second main path 21 are exposed from the case 40.

[0039] The second main path section 21 is, for example, a busbar made of a metal member. As will be explained later, the second main path section 21 is covered by covering members 11A and 21A. As shown in Figure 7, the second main path section 21 comprises a second main section 22, a second electrode terminal 22A, a second semiconductor connection terminal 22F, and a second capacitor path connection terminal 22E. The second electrode terminal 22A, the second semiconductor connection terminal 22F, and the second capacitor path connection terminal 22E are terminals provided on the second main section 22. The second main section 22 is electrically connected to the high-voltage battery 2, the inverter 6, and the capacitor 30 via the second electrode terminal 22A, the second semiconductor connection terminal 22F, and the second capacitor path connection terminal 22E. The second semiconductor connection terminal 22F is sometimes referred to as an electrical component connection terminal.

[0040] The second electrode terminal 22A is connected to the low-potential electrode of the high-voltage battery 2. The second semiconductor connection terminal 22F is connected to the low-potential emitter electrode of the semiconductor module 7. The second semiconductor connection terminal 22F includes a second U-phase connection terminal 22B, a second V-phase connection terminal 22C, and a second W-phase connection terminal 22D. The second U-phase connection terminal 22B is connected to the low-potential emitter electrode of the U-phase semiconductor module 7A. The second V-phase connection terminal 22C is connected to the low-potential emitter electrode of the V-phase semiconductor module 7B. The second W-phase connection terminal 22D is connected to the low-potential emitter electrode of the W-phase switch module 7C. The second capacitor path connection terminal 22E is connected to the second main path connection terminal 28B of the second capacitor path section 25. The second main path connection terminal 28B will be explained in detail later.

[0041] The second capacitor path section 25 is, for example, a busbar made of a metal material. As shown in Figure 9, the second capacitor path section 25 comprises a second capacitor main section 26, a second capacitor connection terminal 28A, and a second main path connection terminal 28B. The second capacitor connection terminal 28A and the second main path connection terminal 28B are terminals provided on the second capacitor main section 26. The second capacitor connection terminal 28A is connected to the second electrode 35 of the capacitor 30. The second main path connection terminal 28B is connected to the second capacitor path connection terminal 22E of the second main path section 21. The second capacitor main section 26 is electrically connected to the inverter 6 and the capacitor 30 via the second capacitor connection terminal 28A and the second main path connection terminal 28B.

[0042] <Cooler> As shown in Figure 6, the cooler 80 comprises a cooling stand 60 and a heat dissipation member 70. The cooling stand 60 is made of, for example, a metal material. The cooling stand 60 has a roughly cubic shape with a thin plate thickness in the thickness direction TD. A flow path for refrigerant is formed inside the cooling stand 60. The flow path extends in a planar direction along the outer surface 60A of the cooling stand 60. The flow path may extend in one direction inside the cooling stand 60, or it may extend while bending. The shape of the flow path is not limited.

[0043] Furthermore, a heat dissipation member 70 is provided on the outer surface 60A. The heat dissipation member 70 is, for example, a heat dissipation sheet, gap filler, heat dissipation grease, heat dissipation adhesive, etc. The heat dissipation member 70 has electrical insulating properties. For this reason, the heat dissipation member 70 is sometimes referred to as an insulating member. As an example, the heat dissipation member 70 is provided on the cooling stand 60 so as to cover the outer surface 60A. The heat dissipation member 70 is provided on the cooling stand 60 so as to overlap the outer surface 60A with respect to the thickness direction TD. However, the arrangement of the heat dissipation member 70 on the outer surface 60A is not limited to this. The heat dissipation member 70 may also be provided on a part of the outer surface 60A so as to contact the exposed parts 190 and 290 described later.

[0044] <Capacitor and first capacitor path> As shown in Figure 8, the first capacitor path portion 15 is provided on the capacitor 30 such that a portion of it overlaps with the first end face 32. The first capacitor main portion 16 extends along the first end face 32 and the side surface 36 of the capacitor 30. A portion of the first capacitor main portion 16 overlaps with the first end face 32 with respect to the thickness direction TD. A first exposure hole 18 for exposing the first electrode 33 is formed in the first overlapping portion 17 of the first capacitor main portion 16 that overlaps with the first end face 32.

[0045] A first capacitor connection terminal 18A, which is electrically connected to the first electrode 33, is provided on the edge that demarcates a portion of the first exposed hole 18 in the first overlapping portion 17. The first capacitor connection terminal 18A extends from the edge that demarcates a portion of the first exposed hole 18 toward the first electrode 33. The first capacitor connection terminal 18A and the first electrode 33 are connected by solder.

[0046] The main part 16 of the first capacitor includes, in addition to the first overlapping part 17, an extension part 19 provided at the end of the first overlapping part 17 and extending toward the second electrode 35 so as to move away from the first electrode 33. As an example, the extension part 19 includes a first extension part 19A, a second extension part 19B, a third extension part 19C, and a fourth extension part 19D. The first extension part 19A is provided at the end of the first overlapping part 17 on the side of the first wall part 42A. The second extension part 19B is provided at the end of the first overlapping part 17 on the side of the second wall part 42B. The third extension part 19C is provided at the end of the first overlapping part 17 on the side of the third wall part 42C. The fourth extension part 19D is provided at the end of the first overlapping part 17 on the side of the fourth wall part 42D.

[0047] The first extension 19A is provided near the center of the end of the first overlapping section 17 on the side of the first wall section 42A. The second extension 19B is provided broadly along the end of the first overlapping section 17 on the side of the second wall section 42B. The third extension 19C is provided near the center of the end of the first overlapping section 17 on the side of the third wall section 42C. The fourth extension 19D is provided broadly along the end of the first overlapping section 17 on the side of the fourth wall section 42D.

[0048] Furthermore, as shown in Figure 7, the extension 19 extends toward the second electrode 35 so as to move away from the first electrode 33, and at its tip toward the second electrode 35, it extends so as to move away from the capacitor 30. The tip of the extension 19 toward the second electrode 35 is exposed from the case 40. The portion of the extension 19 exposed from the opening 46 is sometimes referred to as the extended exposed portion 190. Since the extended exposed portion 190 is the portion of the first capacitor path 15 exposed from the opening 46, it may also be referred to as the first capacitor path exposed portion or the first capacitor busbar exposed portion.

[0049] The portion of the first extension 19A exposed from the case 40 may be referred to as the first exposed portion 191. The portion of the second extension 19B exposed from the case 40 may be referred to as the second exposed portion 192. The portion of the third extension 19C exposed from the case 40 may be referred to as the third exposed portion 193. The portion of the fourth extension 19D exposed from the case 40 may be referred to as the fourth exposed portion 194.

[0050] The first exposed portion 191 extends in the depth direction DP away from the case 40 at its front end. The second exposed portion 192 extends in the width direction WD away from the case 40 at its front end. The third exposed portion 193 extends in the depth direction DP away from the case 40 at its front end. The fourth exposed portion 194 extends in the width direction WD away from the case 40 at its front end. In each of the first to fourth exposed portions 191 to 194, the portion extending away from the case 40 spreads out along the planar direction. The portion of the exposed portion 190 that spreads out along the planar direction corresponds to the heat dissipation surface.

[0051] Furthermore, in the second exposed portion 192, as shown in Figure 9, a first notch 192C is provided near the center of the depth direction DP for passing the main portions 12 and 22 through. The portion of the second exposed portion 192 closer to the first wall portion 42A than the first notch 192C may be referred to as the second exposed portion 192A on the first wall side. The portion of the second exposed portion 192 closer to the third wall portion 42C than the first notch 192C may be referred to as the second exposed portion 192B on the third wall side.

[0052] Furthermore, in the second extension 19B, as shown in Figures 8 and 9, a first main path connection terminal 18B is provided on the third wall portion 42C side of the tip on the second electrode 35 side. The first main path connection terminal 18B is exposed from the case 40. In the second extension 19B, the second exposed portion 192A on the first wall portion side, the second exposed portion 192B on the third wall portion side, and the first main path connection terminal 18B are exposed from the case 40.

[0053] In the fourth exposed portion 194, as shown in Figure 9, a second notch 194C is provided near the center of the depth direction DP for passing the main portions 12 and 22 through. The portion of the fourth exposed portion 194 closer to the first wall portion 42A than the second notch 194C may be referred to as the fourth exposed portion 194A on the first wall side. The portion of the fourth exposed portion 194 closer to the third wall portion 42C than the second notch 194C may be referred to as the fourth exposed portion 194B on the third wall side.

[0054] <Capacitor and second capacitor path section> As shown in Figure 9, a second capacitor path 25 is provided on the capacitor 30 so as to overlap with the second end face 34. The second capacitor main portion 26 extends in the depth direction DP along the second end face 34 of the capacitor 30, repeating peaks and valleys. The portions of the second capacitor main portion 26 corresponding to the valleys overlap with the second end face 34 with respect to the thickness direction TD. The portions of the second capacitor main portion 26 corresponding to the valleys overlap with the second end face 34 with respect to the thickness direction TD and are sometimes referred to as the second overlapping portion 27. A second exposure hole 28 for exposing the second electrode 35 is formed in the second overlapping portion 27.

[0055] A second capacitor connection terminal 28A, which is electrically connected to the second electrode 35, is provided on the edge that demarcates a portion of the second exposed hole 28 in the second overlapping portion 27. The second capacitor connection terminal 28A extends from the edge that demarcates a portion of the second exposed hole 28 toward the second electrode 35. The second capacitor connection terminal 28A and the second electrode 35 are soldered together, for example.

[0056] As described above, the six capacitor elements 31 are arranged in a 2x3 grid in the storage space 44 of the case 40. The second overlapping portion 27 is provided so as to overlap the second end faces 34 of two capacitor elements 31 that are aligned in the width direction WD. The second capacitor main portion 26 comprises three second overlapping portions 27. One of the second overlapping portions 27, the first wall side second overlapping portion 271, is provided on the first wall side 42A. One of the second overlapping portions 27, the third wall side second overlapping portion 273, is provided on the third wall side 42C. An intermediate second overlapping portion 272 is provided between the first wall side second overlapping portion 271 and the third wall side second overlapping portion 273. Each second overlapping portion 27 is provided so as to overlap the second end faces 34 of two capacitor elements 31 that are aligned in the width direction WD. The three second overlapping portions 27 are spaced apart with respect to the depth direction DP.

[0057] Furthermore, the main part 26 of the second capacitor has four parts corresponding to peaks. Since parts of the peak-like parts are partially exposed from the opening 46, they are sometimes referred to as protruding exposed parts 290. Since the protruding exposed parts 290 are the parts of the second capacitor path 25 that are exposed from the opening 46, they are sometimes referred to as the second capacitor path exposed parts or the second capacitor busbar exposed parts.

[0058] A first protruding exposed portion 291, which is one of the protruding exposed portions 290, is provided at the end of the second overlapping portion 27 on the first wall portion 42A side, on the first wall portion 42A side. A second protruding exposed portion 292, which is one of the protruding exposed portions 290, is provided between the second overlapping portion 27 on the first wall portion 42A side and the adjacent second overlapping portion 27. A third protruding exposed portion 293, which is one of the protruding exposed portions 290, is provided between the second overlapping portion 27 on the third wall portion 42C side and the adjacent second overlapping portion 27. A fourth protruding exposed portion 294, which is one of the protruding exposed portions 290, is provided at the end of the second overlapping portion 27 on the third wall portion 42C side. The second capacitor main portion 26 is composed of four protruding exposed portions 290 and three second overlapping portions 27 arranged alternately and continuously with respect to the depth direction DP.

[0059] Furthermore, the first protruding exposed portion 291 and the fourth protruding exposed portion 294 extend away from each other with respect to the depth direction DP. The first protruding exposed portion 291 and the fourth protruding exposed portion 294 extend in a substantially L-shape when viewed from the width direction WD. The tips of the first protruding exposed portion 291 and the fourth protruding exposed portion 294 extend in the depth direction DP away from the case 40. The tips of the first protruding exposed portion 291 and the fourth protruding exposed portion 294 extend along the plane direction. The second protruding exposed portion 292 and the third protruding exposed portion 293 extend to connect two adjacent second overlapping portions 27 in the depth direction DP. The second protruding exposed portion 292 and the third protruding exposed portion 293 extend in a substantially U-shape when viewed from the width direction WD. The portions of the second protruding exposed portion 292 and the third protruding exposed portion 293 that connect two adjacent second overlapping portions 27 in the depth direction DP extend along the plane direction. The portion of the protruding exposed part 290 that extends in a planar direction corresponds to the heat dissipation surface.

[0060] In the width direction WD, the second protruding exposed portion 292 overlaps with the second exposed portion 192A on the first wall side and the fourth exposed portion 194A on the first wall side. In the width direction WD, the third protruding exposed portion 293 overlaps with the second exposed portion 192B on the third wall side and the fourth exposed portion 194B on the third wall side. In the depth direction DP, a gap 47 is formed between the second protruding exposed portion 292, the second exposed portion 192A on the first wall side and the fourth exposed portion 194A on the first wall side, and the third protruding exposed portion 293, the second exposed portion 192B on the third wall side and the fourth exposed portion 194B on the third wall side.

[0061] <Sealing material and capacitor path section> As described above, the first capacitor path 15 is soldered to the first electrode 33. The second capacitor path 25 is soldered to the second electrode 35. The capacitor 30, with the capacitor paths 15 and 25 soldered together, is housed in the storage space 44 of the case 40. The storage space 44 of the case 40 is filled with a sealing member 50. The sealing member 50 fixes the capacitor 30, with the capacitor paths 15 and 25 soldered together, to the case 40.

[0062] The capacitor 30, a portion of the first capacitor path 15, and a portion of the second capacitor path 25 are sealed by the sealing member 50. The remainder of the first capacitor path 15 and the remainder of the second capacitor path 25 are exposed from the sealing member 50. In the first capacitor path 15, the first overlapping portion 17 is sealed by the sealing member 50. The exposed portion 190 is exposed from the sealing member 50 and also exposed from the opening 46 of the case 40. In the second capacitor path 25, the second overlapping portion 27 is sealed by the sealing member 50. A portion of the protruding exposed portion 290 is exposed from the sealing member 50 and also exposed from the opening 46 of the case 40.

[0063] <Capacitor and main path section> As described above, the first electrode terminal 12A, the first semiconductor connection terminal 12F, and the first capacitor path connection terminal 12E are each provided on the first main part 12. As shown in Figure 7, the first main part 12 includes a first electrode side extension 13 with the first electrode terminal 12A provided at its end, and a first semiconductor side extension 14 with the first semiconductor connection terminal 12F and the first capacitor path connection terminal 12E provided at its end.

[0064] The first electrode-side extension 13 extends in the width direction WD. The first semiconductor-side extension 14 extends in the depth direction DP. A first electrode terminal 12A is provided at one end of the first electrode-side extension 13 in the width direction WD. The first semiconductor-side extension 14 is provided at the other end of the first electrode-side extension 13 in the width direction WD. In the first semiconductor-side extension 14, the first electrode-side extension 13 is provided near the center of the extension in the depth direction DP. The first electrode-side extension 13 and the first semiconductor-side extension 14 are continuous and made of the same material. A first capacitor path connection terminal 12E is provided at the end of the first semiconductor-side extension 14 in the depth direction DP. A first semiconductor connection terminal 12F is provided at an end of the first semiconductor-side extension 14 in the width direction WD that is different from the end to which the first electrode-side extension 13 is connected. The first main path 11 has a substantially T-shape when viewed from the thickness direction TD plane.

[0065] The first capacitor path connection terminal 12E is electrically and mechanically connected to the first main path connection terminal 18B via a connecting member 90. The connecting member 90 connecting the first capacitor path connection terminal 12E and the first main path connection terminal 18B is provided between the first semiconductor connection terminal 12F and the case 40 with respect to the width direction WD.

[0066] As described above, the second electrode terminal 22A, the second semiconductor connection terminal 22F, and the second capacitor path connection terminal 22E are each provided on the second main part 22. As shown in Figure 7, the second main part 22 includes a second electrode side extension 23 with the second electrode terminal 22A provided at its end, and a second semiconductor side extension 24 with the second semiconductor connection terminal 22F and the second capacitor path connection terminal 22E provided at its end.

[0067] The second electrode-side extension 23 extends in the width direction WD. The second semiconductor-side extension 24 extends in the depth direction DP. A second electrode terminal 22A is provided at one end of the second electrode-side extension 23 in the width direction WD. The second semiconductor-side extension 24 is provided at the other end of the second electrode-side extension 23 in the width direction WD. In the second semiconductor-side extension 24, the second electrode-side extension 23 is provided near the center of the extension in the depth direction DP. The second electrode-side extension 23 and the second semiconductor-side extension 24 are continuous and made of the same material. A second capacitor path connection terminal 22E is provided at the end of the second semiconductor-side extension 24 in the depth direction DP. A second semiconductor connection terminal 22F is provided at an end of the second semiconductor-side extension 24 in the width direction WD, different from the end to which the second electrode-side extension 23 is connected. The second main path 21 has a substantially T-shape when viewed from the thickness direction TD plane.

[0068] The second capacitor path connection terminal 22E is electrically and mechanically connected to the second main path connection terminal 28B via a connecting member 90. The connecting member 90 connecting the second capacitor path connection terminal 22E and the second main path connection terminal 28B is provided between the second semiconductor connection terminal 22F and the case 40 with respect to the width direction WD.

[0069] Furthermore, the first main path section 11 and the second main path section 21 are offset in the depth direction DP by the width of the electrode-side extension sections 13 and 23, and overlap in the thickness direction TD. The first electrode-side extension section 13 and the second electrode-side extension section 23 are adjacent with respect to the depth direction DP. The first electrode-side extension section 13 and the second electrode-side extension section 23 do not overlap with respect to the thickness direction TD. A part of the first semiconductor-side extension section 14 and a part of the second semiconductor-side extension section 24 overlap with respect to the thickness direction TD.

[0070] The first electrode-side extension 13 and the second electrode-side extension 23 are provided in the aforementioned gap 47. The first main path 11 and the second main path 21 are provided on the outside of the storage space 44 of the case 40. The first electrode-side extension 13 and the second electrode-side extension 23 are provided so as to overlap the side wall end 45 and the sealing member 50 with respect to the thickness direction TD.

[0071] Furthermore, the first main path section 11 and the second main path section 21 are covered by insulating covering members 11A and 21A. The covering members 11A and 21A are substantially T-shaped when viewed from the thickness direction TD. Electrode terminals 12A and 22A, semiconductor connection terminals 12F and 22F, and capacitor path connection terminals 12E and 22E are exposed from the covering members 11A and 21A. The main surfaces of the covering members 11A and 21A extend along the planar direction. The main surfaces of the covering members 11A and 21A correspond to the heat dissipation surfaces of the covering members 11A and 21A.

[0072] <Cooler and Pathway> As described above, the cooler 80 is a cooling device for cooling the capacitor component 5A. The cooler 80 comprises a cooling base 60 and a heat dissipation member 70. The heat dissipation member 70 is provided on the outer surface 60A of the cooling base 60. The heat dissipation member 70 extends in a planar direction along the outer surface 60A. The heat dissipation member 70 has an installation surface 70A on which the case 40 is provided. The capacitor component 5A is provided on the cooler 80 such that the side wall end 45 of the case 40 faces the installation surface 70A. For this reason, the installation surface 70A is sometimes referred to as the opposing surface.

[0073] The exposed portion 190 and the protruding exposed portion 290 are exposed through the opening 46. The first main path portion 11 and the second main path portion 21 are provided in the gap 47. The first electrode-side extension portion 13 and the second electrode-side extension portion 23 are provided between the side wall end portion 45 of the case 40 and the installation surface 70A with respect to the thickness direction TD. The first main path portion 11, the exposed portion 190, the second main path portion 21, and the protruding exposed portion 290 are provided on the installation surface 70A. The first main path portion 11 and the second main path portion 21 do not overlap with the exposed portion 190 and the protruding exposed portion 290 with respect to the thickness direction TD.

[0074] The first main path portion 11, the exposed portion 190, the second main path portion 21, and the protruding exposed portion 290 are each in contact with the mounting surface 70A. More precisely, the covering members 11A, 21A, the exposed portion 190, and the protruding exposed portion 290 are each in contact with the mounting surface 70A. As described above, the heat dissipation surfaces of the covering members 11A, 21A, the exposed portion 190, and the protruding exposed portion 290 extend along the planar direction. The mounting surface 70A extends along the planar direction. The capacitor component 5A is provided on the cooler 80 so that these heat dissipation surfaces and the mounting surface 70A are in close contact.

[0075] <Effects and Effects> In the following explanation of the effects, the first capacitor path section 15 and / or the second capacitor path section 25 may be referred to as capacitor path sections 15 and 25. The exposed section 190 and / or the protruding exposed section 290 may be referred to as exposed sections 190 and 290.

[0076] The capacitor device 5 comprises a capacitor component 5A and a cooler 80. The capacitor component 5A has capacitor path sections 15 and 25, a capacitor 30, and a case 40. The capacitor path sections 15 and 25 are paths in which one end is connected to the capacitor 30 and the other end is electrically connected to the inverter 6. The capacitor path sections 15 and 25 are paths through which current flows between the capacitor 30 and the inverter 6.

[0077] The case 40 has a thin bottom wall 41 in the thickness direction TD and a side wall 42 that rises annularly from the bottom wall 41. The bottom wall 41 and the side wall 42 define the storage space 44. An opening 46 that opens in the thickness direction TD is defined by the side wall end 45 of the side wall 42 that is away from the bottom wall 41. The capacitor path sections 15, 25 and the capacitor 30 are housed in the storage space 44 of the case 40. Exposed portions 190, 290, which are part of the capacitor path sections 15, 25, are exposed through the opening 46.

[0078] The cooler 80 is a cooling device for cooling the capacitor component 5A. The cooler 80 has a flow path formed inside for the refrigerant to flow. The capacitor component 5A is mounted on the cooler 80 such that the side wall end 45 of the case 40 faces the mounting surface 70A of the cooler 80. The exposed parts 190 and 290 are in contact with the mounting surface 70A.

[0079] The inverter 6 is electrically connected to the capacitor 30 via capacitor paths 15 and 25. Ripple current flows from the inverter 6 through the capacitor paths 15 and 25. Consequently, the capacitor 30 generates heat. Furthermore, heat from the semiconductor module 7 is transferred to the capacitor 30 via the capacitor paths 15 and 25. As a result, there was a risk that the capacitor 30 would become too hot. In this embodiment, the exposed parts 190 and 290 are in contact with the mounting surface 70A. This allows the heat from the capacitor paths 15 and 25 to be efficiently dissipated to the cooler 80. This provides a capacitor device 5 with improved heat dissipation. It prevents the capacitor 30 from receiving too much heat.

[0080] The capacitor component 5A further includes main path sections 11 and 21 that connect the high-voltage battery 2, the inverter 6, and the capacitor path sections 15 and 25. The main path sections 11 and 21 are located between the side wall end 45 and the mounting surface 70A with respect to the thickness direction TD. The main path sections 11 and 21 are in contact with the mounting surface 70A. As a result, heat transferred from the high-voltage battery 2 to the main path sections 11 and 21 is efficiently dissipated to the cooler 80. Heat is less likely to be transferred from the high-voltage battery 2 to the capacitor 30 via the main path sections 11 and 21.

[0081] The main path sections 11 and 21 do not overlap with the exposed sections 190 and 290 in the thickness direction TD. This ensures sufficient contact area between the main path sections 11 and 21 and the mounting surface 70A. It also ensures sufficient contact area between the exposed sections 190 and 290 and the mounting surface 70A. Furthermore, it suppresses an increase in the size of the capacitor device 5 in the thickness direction TD.

[0082] The capacitor path sections 15 and 25 comprise four protruding exposed sections 290 and three second overlapping sections 27 that are arranged alternately in a continuous manner with respect to the depth direction DP. In the depth direction DP, a gap 47 is formed between the second protruding exposed section 292 and the third protruding exposed section 293. The main path sections 11 and 21 are provided in the gap 47. Because the main path sections 11 and 21 are actively provided in the gap 47, space can be used effectively. The increase in the size of the capacitor device 5 with respect to the thickness direction TD can be suppressed.

[0083] The main path sections 11 and 21 comprise a first main path section 11 and a second main path section 21. The first main path section 11 is an energizing path connecting the high-potential side electrode of the high-voltage battery 2, the high-potential side collector electrode of the inverter 6, and the first electrode 33 of the capacitor 30. The second main path section 21 is an energizing path connecting the low-potential side electrode of the high-voltage battery 2, the low-potential side emitter electrode of the inverter 6, and the second electrode 35 of the capacitor 30.

[0084] A first electrode-side extension 13, which is part of the first main path 11, and a second electrode-side extension 23, which is part of the second main path 21, are provided in the gap 47. The first electrode-side extension 13 and the second electrode-side extension 23 are adjacent with respect to the depth direction DP. The first electrode-side extension 13 and the second electrode-side extension 23 do not overlap with respect to the thickness direction TD. Contact area with the installation surface 70A can be secured for the first electrode-side extension 13. Contact area with the installation surface 70A can be secured for the second electrode-side extension 23.

[0085] The first main path connection terminal 18B and the first capacitor path connection terminal 12E are provided between the first semiconductor connection terminal 12F and the case 40 with respect to the width direction WD. The second main path connection terminal 28B and the second capacitor path connection terminal 22E are provided between the second semiconductor connection terminal 22F and the case 40 with respect to the width direction WD. This arrangement suppresses an increase in the size of the capacitor device 5 in the width direction WD.

[0086] The first main path section 11 and the first capacitor path section 15 are separate components. The first main path section 11 and the first capacitor path section 15 are connected via a connecting member 90. The second main path section 21 and the second capacitor path section 25 are separate components. The second main path section 21 and the second capacitor path section 25 are connected via a connecting member 90. Because the main path sections 11 and 21 and the capacitor path sections 15 and 25 are connected via a connecting member 90, the thermal resistance between the main path sections 11 and 21 and the capacitor path sections 15 and 25 is high. As a result, heat is not easily transferred from the main path sections 11 and 21 to the capacitor path sections 25 and 15.

[0087] A capacitor 30 is provided in the case 40 such that the first electrode 33 faces the bottom wall 41 and the second electrode 35 faces the opening 46. A portion of the first capacitor path 15 connected to the first electrode 33 is housed in the case 40. The remaining exposed portion 190 of the first capacitor path 15 is exposed through the opening 46. The exposed portion 190 is in contact with the mounting surface 70A. This allows heat accumulated on the bottom wall 41 side of the case 40 to be efficiently dissipated to the cooler 80.

[0088] A portion of the second capacitor path 25 connected to the second electrode 35 is housed in the case 40. The remaining protruding exposed portion 290 of the second capacitor path 25 is exposed through the opening. The exposed portion 190 and the protruding exposed portion 290 are in contact with the mounting surface 70A. As a result, heat is efficiently dissipated from the capacitor paths 15 and 25 regardless of the arrangement of the capacitor 30.

[0089] (Second Embodiment) In the first embodiment, a configuration was described in which the capacitor 30 is provided in a case 40 such that the first electrode 33 faces the bottom wall 41 and the second electrode 35 faces the opening 46. However, the arrangement of the capacitor 30 in the case 40 is not limited to this. Figure 10 is a cross-sectional view of the capacitor device 5 of the second embodiment. The capacitor 30 may also be provided in the case 40 such that the first electrode 33 and the second electrode 35 face the side wall 42.

[0090] One end of the first capacitor path 15 is connected to the first electrode 33. The other end of the first capacitor path 15 extends outwards from the opening 46, with its tip extending away from the capacitor 30. One end of the second capacitor path 25 is connected to the second electrode 35. The other end of the second capacitor path 25 extends outwards from the opening 46, with its tip extending away from the capacitor 30. The exposed portions 190 and 290 are in contact with the mounting surface 70A. This also produces a similar effect.

[0091] (Other variations) In the first embodiment, a configuration was described in which the capacitor path portions 15 and 25 are busbars made of metal members. However, the capacitor path portions 15 and 25 may be covered with a resin member or the like. For example, an insulating film may be provided on the surface of the capacitor path portions 15 and 25. In addition, in the first embodiment, a configuration was described in which a sealing member 50 is provided on the capacitor component 5A, but the sealing member 50 is not required to be provided on the capacitor component 5A.

[0092] In the first embodiment, a configuration in which the opening 46 is demarcated by the side wall end 45 was described, but the configuration of the opening 46 is not limited to this. For example, a part of the opening 46 may be provided in the side wall 42. Alternatively, a cover may be provided on the case 40 so as to cover the opening 46. The cover may be provided with an opening that communicates with the opening 46.

[0093] In the first embodiment, a configuration was described in which the cooler 80 has a cooling base 60 and a heat dissipation member 70, and the exposed parts 190 and 290 are in direct contact with the mounting surface 70A of the heat dissipation member 70. However, the configuration is not limited to the mounting surface 70A and the exposed parts 190 and 290 being in direct contact. The cooling base 60 and the heat dissipation member 70 may be integrated using the same material. A heat dissipation material such as thermal grease may be provided on the mounting surface 70A of the cooler 80. In other words, the cooler 80 and the exposed parts 190 and 290 may be indirectly in contact via a heat dissipation material such as thermal grease.

[0094] In the first embodiment, a configuration in which the protruding portion 290 is in contact with the installation surface 70A was described, but the configuration is not limited to the protruding portion 290 being in contact with the installation surface 70A. For example, the protruding portion 290 does not have to be in contact with the installation surface 70A. The protruding portion 290 may be extended out of the case 40 from a position different from the opening 46.

[0095] Furthermore, although this disclosure is described in accordance with embodiments, it is understood that this disclosure is not limited to such embodiments or structures. This disclosure also includes various modifications and variations within the scope of equivalents. In addition, although various combinations and forms are shown in this disclosure, other combinations and forms that include one, more, or fewer of those elements also fall within the scope and concept of this disclosure. [Explanation of symbols]

[0096] 11 Power busbar, 11 First power busbar, 12 Main section, 12E Capacitor path connection terminal, 12F Electrical component connection terminal, 15 Capacitor busbar, 15 First capacitor busbar, 18B Main path connection terminal, 190 Exposed section, 190 Exposed section of first capacitor busbar, 2 Power supply, 21 Power busbar, 21 Second power busbar, 22 Main section, 22E Capacitor path connection terminal, 22F Electrical component connection terminal, 25 Capacitor busbar, 25 Second capacitor busbar, 28B Main path connection terminal, 290 Exposed section, 290 Exposed section of second capacitor busbar, 30 Capacitor, 33 First electrode, 35 Second electrode, 40 Case, 41 Bottom wall, 42 Side wall, 46 Opening, 47 Gap, 5A Capacitor component, 6 Electrical component, 60 cooling stand, 60A outer surface, 70 heat dissipation member, 70A opposing surface, 80 cooler, 90 connecting member, DP depth direction, TD one direction, WD width direction.

Claims

1. A capacitor (30) having a first electrode (33) and a second electrode (35), A capacitor busbar (15, 25) having one end connected to the first electrode or the second electrode and the other end electrically connected to an electrical component (6), A case (40) has an opening (46) that exposes a part of the capacitor busbar, and houses the capacitor and the capacitor busbar inside. A capacitor component (5A) having the following, The cooling device (80) has opposing surfaces (70A) where the openings face each other in one direction (TD), and cools the capacitor component. It comprises a power busbar (11, 21) connected to a power supply (2), The exposed portion (190, 290), which is the capacitor busbar exposed from the opening, is in contact with the opposing surface. The power busbar is a capacitor device provided between the opening and the cooler.

2. The capacitor device according to claim 1, wherein the exposed portion and the power busbar are non-overlapping with respect to the one direction.

3. The system comprises multiple exposed portions, Some of the multiple exposed portions are spaced apart with respect to the depth direction (DP) perpendicular to the one direction, The capacitor device according to claim 1 or 2, wherein a portion of the power busbar is provided in the gap (47) between two adjacent exposed portions, which are spaced apart in the depth direction.

4. The power busbar has a first power busbar (11) connected to a first capacitor busbar (15) connected to the first electrode, and a second power busbar (21) connected to a second capacitor busbar (25) connected to the second electrode. The first power busbar and the second power busbar are provided in the aforementioned gap. The capacitor device according to claim 3, wherein the first power busbar and the second power busbar provided in the gap are non-overlapping in the one direction.

5. A capacitor (30) having a first electrode (33) and a second electrode (35), A capacitor busbar (15, 25) having one end connected to the first electrode or the second electrode and the other end electrically connected to an electrical component (6), A case (40) has an opening (46) that exposes a part of the capacitor busbar, and houses the capacitor and the capacitor busbar inside. A capacitor component (5A) having the following, The system includes a cooler (80) having opposing surfaces (70A) where the openings face each other in one direction (TD), and through which a refrigerant flows. The exposed portion (190, 290), which is the capacitor busbar exposed from the opening, is in contact with the opposing surface. The system further comprises a main section (12, 22) provided between the power supply (2) and the electrical component, which electrically connects the power supply and the electrical component, and a power busbar (11, 21) having capacitor path connection terminals (12E, 22E) provided on the main section and connected to the capacitor busbar, The power busbar is provided between the opening and the cooler. The power busbar is a capacitor device in contact with the opposing surface.

6. The system comprises multiple exposed portions, Some of the multiple exposed portions are spaced apart with respect to the depth direction (DP) perpendicular to the one direction, Of the multiple exposed parts that are spaced apart in the depth direction, a portion of the power busbar is provided in the gap (47) between two adjacent parts. The power busbar has a first power busbar (11) connected to a first capacitor busbar (15) connected to the first electrode, and a second power busbar (21) connected to a second capacitor busbar (25) connected to the second electrode. The first power busbar and the second power busbar are provided in the aforementioned gap. The first power busbar and the second power busbar provided in the aforementioned gap are non-overlapping in the aforementioned one direction. The capacitor busbar is equipped with main path connection terminals (18B, 28B) that are connected to the capacitor path connection terminals, The power busbar is equipped with electrical component connection terminals (12F, 22F) that are connected to the electrical components, The capacitor device according to claim 5, wherein the capacitor path connection terminal and the main path connection terminal are provided between the case and the electrical component connection terminal with respect to the width direction (WD) which is perpendicular to the one direction and the depth direction.

7. The capacitor busbar and the power supply busbar are separate components. The capacitor device according to claim 6, further comprising a connecting member (90) for connecting the capacitor busbar and the power busbar.

8. The capacitor device according to claim 7, wherein the cooler comprises a cooling stand (60) through which a refrigerant flows, and an insulating heat dissipation member (70) provided on the outer surface (60A) of the cooling stand, having the opposing surfaces that overlap the outer surface in one direction.

9. The case has a bottom wall (41), a side wall (42), and the opening on the side wall end that is away from the bottom wall in one direction. The capacitor is housed in the case such that the first electrode is provided on the bottom wall side and the second electrode is provided on the opening side. A portion of the first capacitor busbar (15) connected to the first electrode in the capacitor busbar is exposed through the opening. The exposed portion has a first capacitor busbar exposed portion (190), which is the first capacitor busbar exposed from the opening, The capacitor device according to any one of claims 1, 2, or 5, wherein the exposed portion of the first capacitor busbar is in contact with the opposing surface.

10. A portion of the second capacitor busbar (25) connected to the second electrode in the capacitor busbar is exposed through the opening. The exposed portion further includes a second capacitor busbar exposed portion (290), which is the second capacitor busbar exposed from the opening. The capacitor device according to claim 9, wherein the exposed portion of the second capacitor busbar is in contact with the opposing surface.

11. The power busbar comprises electrode terminals (12A, 22A) connected to the power supply, The capacitor device according to any one of claims 1, 2, or 5, wherein the electrode terminals are located outside the opening and on the opposite side of the opening, with respect to semiconductor connection terminals (12F, 22F) that are connected to a semiconductor module, which is one of the electrical components.

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