Release film for semiconductor encapsulation, marking film for semiconductor encapsulation, semiconductor package, and method for manufacturing a semiconductor package
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2021-03-25
- Publication Date
- 2026-06-23
AI Technical Summary
【0011】 本開示の一態様によれば、着色層を備え、半導体パッケージの表面に着色層が転写された際の半導体パッケージ表面の外観に優れる半導体封止用離型フィルムを提供することができる。また、本開示の一態様によれば、半導体封止用離型フィルムを用いた半導体パッケージ及びその製造方法を提供することができる。さらに、本開示の一態様によれば、半導体封止用離型フィルムの一部を構成する半導体封止用マーキングフィルムを提供することができる。 また、本開示の他の一態様によれば、半導体パッケージ表面への密着性に優れる最外層を有する半導体封止用離型フィルム並びにこの半導体封止用離型フィルムを用いた半導体パッケージ及びその製造方法を提供することができる。
Smart Images
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Abstract
Claims
1. It comprises a base material, a release layer, and a thermosetting colored layer in this order. The aforementioned colored layer contains a coloring agent, a thermosetting resin, and a curing agent. The thermosetting resin is a release film for semiconductor encapsulation containing an epoxy resin.
2. The semiconductor encapsulation release film according to claim 1, wherein the substrate comprises a polyester resin.
3. The semiconductor encapsulation release film according to claim 1 or claim 2, wherein the colored layer is transferred to the surface of the encapsulation resin layer of the semiconductor package.
4. The material comprises a base material, a release layer, and at least one functional layer in this order, wherein the outermost layer of the functional layer contains a thermosetting resin. The thermosetting resin is a release film for semiconductor encapsulation containing an epoxy resin.
5. The semiconductor encapsulation release film according to claim 4, wherein the functional layer is transferred to the surface of the encapsulation resin layer of the semiconductor package.
6. A semiconductor package is manufactured by compression molding using the aforementioned semiconductor encapsulation release film and a semiconductor encapsulation resin containing epoxy resin, under the conditions of a mold temperature of 165°C, a molding pressure of 6.86 MPa, and a molding time of 180 seconds, followed by thermal curing at a curing temperature of 175°C, under atmospheric pressure, and for a curing time of 120 minutes. Laser marking is performed on the surface of the functional layer transferred to the semiconductor package under the conditions of wavelength 1064 nm, intensity 4 W, scan speed 1000 mm / sec, and Q-switch frequency: 120 kHz. The semiconductor package described in claim 4 or claim 5 is characterized in that the laser-marked portion of the semiconductor package is cut into 100 squares of 1 mm each, adhesive tape having adhesive strength compliant with JIS K5600-5-6:1999 is applied to the cut portion, and within 5 minutes after application, the end of the adhesive tape is grasped and peeled off at an angle of 60° for 0.5 to 1.0 seconds, and the remaining portion of the functional layer in the peeled portion is 70 squares or more. Release film for sealing conductors.
7. The release film for semiconductor encapsulation according to any one of claims 4 to 6, wherein the functional layer includes a colored layer.
8. The semiconductor encapsulation release film according to claim 7, wherein the functional layer comprises the colored layer and a functional layer different from the colored layer as the outermost layer, in this order from the substrate side.
9. The semiconductor encapsulation release film according to claim 7 or claim 8, wherein the colored layer contains a coloring agent, a thermosetting resin, and a curing agent.
10. The release film for semiconductor encapsulation according to claim 9, wherein the thermosetting resin contained in the colored layer includes an epoxy resin.
11. The semiconductor encapsulation release film according to any one of claims 4 to 10, wherein the substrate comprises a polyester resin.
12. The semiconductor encapsulation release film according to any one of claims 4 to 11, wherein the storage modulus at 165°C of the cured product obtained by heat-treating the outermost layer under the conditions of a temperature of 165°C, a pressure of 6.86 MPa, and a time of 180 seconds is 0.1 GPa or more.
13. The semiconductor encapsulation release film according to any one of claims 4 to 12, wherein the outermost layer contains an inorganic filler, and the amount of the inorganic filler is 40% by mass or more based on the total mass of the outermost layer.
14. A semiconductor package comprising a semiconductor element, a sealing resin layer for sealing the semiconductor element, and a colored layer provided on the surface of the sealing resin layer, wherein the colored layer is a layer derived from the colored layer of the semiconductor encapsulation release film according to any one of claims 1 to 3.
15. A semiconductor package comprising a semiconductor element, a sealing resin layer for sealing the semiconductor element, and a functional layer provided on the surface of the sealing resin layer, wherein the functional layer is a layer derived from a functional layer of a semiconductor encapsulation release film according to any one of claims 4 to 13.
16. A method for manufacturing a semiconductor package, comprising the step of sealing a semiconductor element while arranging the semiconductor element and the semiconductor encapsulation release film in a mold such that the semiconductor element and the colored layer side of the semiconductor encapsulation release film described in any one of claims 1 to 3 face each other.
17. A method for manufacturing a semiconductor package, comprising the step of sealing a semiconductor element while arranging the semiconductor element and the semiconductor encapsulation release film in a mold such that the semiconductor element and the outermost layer of the semiconductor encapsulation release film described in any one of claims 4 to 13 face each other.