Electronic packages and electronic devices

Abstract

To provide an electronic package which is adopted to a combination of a circuit board, an electronic device into which the electronic package is assembled, and a method of manufacturing the electronic package.SOLUTION: An electronic package 100 comprises: a substrate panel 2 that includes an upper-facing surface 21 and a lower-facing surface 22, and receives one or more electronic components; a filip chip 41 that is attached to the upper-facing surface of the substrate panel; a first mold structure 31 that extends over at least one part of the upper-facing surface of the substrate panel; and through-mold connections 50 that is provided on the upper-facing surface of the substrate panel, and is substantially formed from a conductive material which cannot re-flow. The first mold structure 31 substantially blocks one group of the through-mold connections 50. The one group of the through-mold connections 50 is exposed through the first mold structure 31.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] Incorporation by reference to priority applications All applications in which foreign or domestic priority claims are identified in the application data sheet filed together with this application are hereby incorporated by reference in accordance with 37 CFR 1.57.

[0002] This disclosure relates to an electronic package suitable for coupling to a circuit board. This disclosure also relates to an electronic device incorporating such an electronic package. This disclosure also relates to a method of manufacturing such an electronic package.

Background Art

[0003] Conventional electronic packages have a substrate, and on at least one side of the substrate, one or more electronic components or modules are attached. The electronic components / modules are attached to the substrate by well-known methods of surface mounting technology. An array of solder balls is arranged on the first side of the substrate so as to surround the electronic components / modules attached to the substrate. A molding structure is applied over the first side of the substrate so that an array of solder balls and the electronic components / modules are completely encapsulated under the outer surface of the molding structure. Subsequently, grinding or a similar operation is performed on the outer surface of the molding structure to expose an array of solder balls. Laser ablation or a similar process is also performed. Thereby, the molding material is locally removed in the vicinity of each of the array of solder balls, and a pit or groove surrounding each solder ball is defined. The grinding and ablation operations can deform the solder balls and / or remove material from the solder balls. Thereafter, the resulting electronic package can be coupled to a circuit board by soldering an array of solder balls of the electronic package to corresponding attachment locations on the circuit board.

Summary of the Invention

[0004] According to one embodiment, an electronic package is provided. The electronic package includes a substrate having a first side and a second side, configured to receive one or more electronic components; a first electronic component attached to the first side of the substrate; a first mold structure extending over at least a portion of the first side of the substrate; and a group of through-mold connections provided on the first side of the substrate, which are substantially formed from a non-reflowable conductive material, the first mold structure substantially encapsulates the group of through-mold connections, the group of through-mold connections being exposed through the first mold structure.

[0005] In one example, the first molded structure encloses at least a portion of the first electronic component.

[0006] In one example, the electronic package further includes a second electronic component attached to a second side of a substrate and a second molded structure extending over at least a portion of the second side of the substrate. In one example, the second molded structure encapsulates at least a portion of the second electronic component.

[0007] In one example, a non-reflowable conductive material has a melting point greater than 400 degrees Celsius, or greater than 500 degrees Celsius, or greater than 600 degrees Celsius, or greater than 700 degrees Celsius, or greater than 800 degrees Celsius, or greater than 900 degrees Celsius. In one example, a non-reflowable conductive material contains one or more of copper, nickel, gold, and silver, or consists of one or more of copper, nickel, gold, and silver.

[0008] In one example, the non-reflowable conductive material contains one or more of tin, antimony, and palladium, or consists of one or more of tin, antimony, and palladium.

[0009] In one example, a non-reflowable conductive material is formed from a non-solder material.

[0010] In one example, a non-reflowable conductive material is constructed for the purpose of soldering itself.

[0011] In one example, at least one of a group of through-mold connections is hollow. In one example, a filler is provided inside the hollow through-mold connection. In one example, the filler includes plastic.

[0012] In one example, the outer surface of the first mold structure does not have any grooves or trenches that define the perimeter of each through-mold connection or are adjacent to each through-mold connection.

[0013] In one example, at least one through-mold connection of a group of through-mold connections is recessed in a corresponding well defined in a first mold structure, and the surface of the through-mold connection is exposed by the well, defining the exposed surface of the through-mold connection. In one example, the well has a substantially uniform cross-sectional area along its depth, and this substantially uniform cross-sectional area is substantially the same as the area of ​​the exposed surface of the corresponding through-mold connection. In one example, the electronic package further includes a solder portion bonded to the exposed surface of at least one through-mold connection of the group of through-mold connections, the solder portion protruding from the corresponding well.

[0014] In one example, the exposed surface of at least one through-mold connection of a group of through-mold connections is substantially flush with the outer surface of the first molded structure. In one example, the exposed surface of at least one through-mold connection of a group of through-mold connections and the outer surface of the first molded structure jointly define a flat surface. In one example, the electronic package further includes a solder portion bonded to the exposed surface of at least one through-mold connection of a group of through-mold connections, the solder portion protruding from the first molded structure.

[0015] In one example, a group of through-mold connectors includes a group of pillars, each pillar extending away from the first side of the substrate. In one example, a group of through-mold connectors further includes a group of first flanges, each first flange positioned at the first end of a corresponding pillar in the group, and aligned to the first side of the substrate such that the pillar moves away from the first side of the substrate. In one example, the corresponding groups of pillars and first flanges are formed integrally as a single piece. In one example, a group of through-mold connectors further includes a group of second flanges, each second flange positioned at the second end of a corresponding pillar in the group, opposite to the first end, and the second flange is exposed through the first molded structure. In one example, the corresponding groups of pillars and second flanges are formed integrally as a single piece.

[0016] In one example, a group of through-molded connections includes a group of ellipsoids, spheres, or a combination thereof.

[0017] In one example, at least one through-mold connector from a group of through-mold connectors is coupled to a corresponding conductive node provided on or embedded in a substrate. In one example, the conductive node includes a conductive pad provided on or embedded in a substrate. In one example, the conductive pad is soldered to the corresponding through-mold connector. In one example, the conductive pad and the corresponding through-mold connector are integrally formed as a single piece from a non-reflowable conductive material.

[0018] In one example, a group of through-molded connections substantially surrounds a first electronic component. In one example, the group of through-molded connections includes a first subgroup of through-molded connections and a second subgroup of through-molded connections, the first subgroup substantially surrounding the second subgroup.

[0019] In another embodiment, an electronic device is provided, comprising a circuit board for receiving one or more electronic packages, and an electronic package mounted on the circuit board, the electronic package comprising a substrate having a first side and a second side, configured to receive one or more electronic components, a first electronic component mounted on the first side of the substrate, a first mold structure extending over at least a portion of the first side of the substrate, and a group of through-mold connections provided on the first side of the substrate, substantially formed from a non-reflowable conductive material, the first mold structure substantially encapsulates the group of through-mold connections which are exposed through the first mold structure.

[0020] In one example, the electronic device is a wireless portable device.

[0021] In another embodiment, a method for manufacturing an electronic package is provided. This method includes the steps of: providing a substrate having a first side and a second side, the substrate being configured to receive one or more electronic components; arranging a group of through-mold connectors on the first side of the substrate, the through-mold connectors being substantially formed from a non-reflowable conductive material; attaching a first electronic component to the first side of the substrate; applying a first mold structure to the first side of the substrate so that the first mold structure extends over at least a portion of the first side of the substrate to substantially seal the group of through-mold connectors; and removing a portion of the first mold structure to expose the group of through-mold connectors.

[0022] In one example, the step of applying the first mold structure to the first side of the substrate includes sealing at least a portion of the first electronic component within the first mold structure.

[0023] In one example, the method further includes attaching a second electronic component to a second side of the substrate and applying a second molding structure to the second side of the substrate such that the second molding structure extends over the second side of the substrate. In one example, applying the second molding structure to the second side of the substrate includes encapsulating at least a portion of the second electronic component within the second molding structure.

[0024] In one example, the non-reflowable conductive material has a melting point greater than 400 degrees Celsius, or greater than 500 degrees Celsius, or greater than 600 degrees Celsius, or greater than 700 degrees Celsius, or greater than 800 degrees Celsius, or greater than 900 degrees Celsius. In one example, the non-reflowable conductive material includes any one or more of copper, nickel, gold, and silver, or consists of any one or more of copper, nickel, gold, and silver.

[0025] In one example, the non-reflowable conductive material includes any one or more of tin, antimony, and palladium, or consists of any one or more of tin, antimony, and palladium.

[0026] In one example, the non-reflowable conductive material is formed from a non-solder material.

[0027] In one example, the non-reflowable conductive material is configured for soldering to itself.

[0028] In one example, at least one through-mold connection of a group of through-mold connections is hollow. In one example, a filler is provided inside the hollow through-mold connection. In one example, the filler includes plastic.

[0029] In one example, the step of removing a portion of the first molding structure to expose a group of through-mold connections is such that no recess or groove exists on the outer surface of the first molding structure that defines the perimeter of each through-mold connection and is adjacent to each through-mold connection.

[0030] In one example, the step of removing a portion of the first mold structure includes causing ablation on an outer surface of the first mold structure. In one example, causing ablation on the outer surface of the first mold structure includes one or more of laser ablation and grinding.

[0031] In one example, the step of removing a portion of the first mold structure includes removing material of the first mold structure to form at least one well in the first mold structure, and a surface of a corresponding through-mold connection of a group of through-mold connections is exposed by the well and recessed into the well. In one example, removing material of the first mold structure to form a well in the mold structure includes forming the well to have a substantially uniform cross-sectional area along the depth of the well, and the substantially uniform cross-sectional area is substantially the same as an area of an exposed surface of a corresponding through-mold connection. In one example, the method further includes a step of bonding a solder portion to an exposed surface of at least one through-mold connection of a group of through-mold connections such that the solder portion protrudes from the well.

[0032] In one example, the step of removing a portion of the first mold structure includes removing material of the first mold structure such that an exposed surface of at least one through-mold connection of a group of through-mold connections is substantially flush with an outer surface of the first mold structure. In one example, the step of removing a portion of the first mold structure is such that an exposed surface of at least one through-mold connection of a group of through-mold connections and an outer surface of the first mold structure jointly define a flat surface. In one example, the method further includes a step of bonding a solder portion to an exposed surface of at least one through-mold connection of a group of through-mold connections such that the solder portion protrudes from the first mold structure.

[0033] In one example, a group of through-mold connectors includes a group of pillars, and the step of arranging the group of through-mold connectors on the first side of the substrate includes arranging each pillar of the group of pillars so as to extend away from the first side of the substrate. In one example, a group of through-mold connectors further includes a group of first flanges, each first flange positioned at the first end of a corresponding pillar among the group of pillars, and the step of arranging the group of through-mold connectors on the first side of the substrate further includes arranging each first flange on the first side of the substrate, with the pillars so as to move away from the first side of the substrate. In one example, corresponding members of the group of pillars and the group of first flanges are formed integrally as a single piece. In one example, a group of through-molded connections further includes a group of second flanges, each second flange positioned at the second end of a corresponding pillar among the group of pillars, opposite to the first end, and the step of removing a portion of the first molded structure to expose the group of through-molded connections includes exposing the second flanges through the first molded structure. In one example, the corresponding groups of pillars and second flanges are formed integrally as a single piece.

[0034] In one example, a group of through-molded connections includes a group of ellipsoids, spheres, or a combination thereof.

[0035] In one example, the step of arranging a group of through-mold connectors on the first side of a substrate includes coupling at least one of the coupled group of through-mold connectors to a corresponding conductive node provided on or embedded in the substrate. In one example, the conductive node includes a conductive pad provided on or embedded in the substrate. In one example, the step of arranging a group of through-mold connectors on the first side of a substrate further includes soldering the conductive pad to the corresponding through-mold connector. In one example, the conductive pad and the corresponding through-mold connector are integrally formed as a single piece from a non-reflowable conductive material.

[0036] In one example, a group of through-molded connections substantially surrounds the first electronic component.

[0037] Further aspects, embodiments, and advantages of these typical aspects and embodiments are described below. The embodiments disclosed herein can be combined with other embodiments in any manner consistent with at least one of the principles disclosed herein, and references to “one embodiment,” “several embodiments,” “an alternative embodiment,” “various embodiments,” “one embodiment,” etc., are not necessarily mutually exclusive and are intended to indicate that certain features, structures, or characteristics described may be included in at least one embodiment. Not all such terms appearing herein necessarily refer to the same embodiment. [Brief explanation of the drawing]

[0038] Various aspects of at least one embodiment are described below with reference to accompanying drawings, which are not intended to be drawn to scale. The drawings are included to illustrate and further illustrate the various aspects and embodiments and are incorporated herein and form part thereof, but are not intended to define the limits of the invention. In the drawings, identical or substantially identical components shown in different drawings are represented by the same number. For clarity, not all components are marked in all drawings.

[0039] [Figure 1A-1D] This is a schematic cross-sectional view of an electronic package strip related to the background technology at various manufacturing stages. [Figure 2] This is a schematic cross-sectional view of the first example of an electronic package relating to multiple aspects of this disclosure. [Figure 3] Figure 2 is a schematic plan view of the electronic package. [Figure 4] This is a schematic cross-sectional view of a second example of an electronic package relating to multiple aspects of this disclosure. [Figure 5] This is a schematic cross-sectional view of the electronic package shown in Figure 2 or Figure 4, mounted on a circuit board of an electronic device. [Figure 6A] Figures 6A and 6B are schematic detail views of region 'A' of the electronic package mounted on the circuit board shown in Figure 5. Two examples of how through-mold connections are coupled to the substrate panel of the electronic package are shown. [Figure 6B] Figures 6A and 6B are schematic detail views of region 'A' of the electronic package mounted on the circuit board shown in Figure 5. Two examples of how through-mold connections are coupled to the substrate panel of the electronic package are shown. [Figures 7A-7D] This is a schematic perspective view of an alternative configuration for a through-molded connection. [Figures 8A-8F] This document presents a first example of the manufacturing steps for a method of manufacturing an electronic package relating to multiple aspects of this disclosure. [Figures 9A-9E] A second example of the manufacturing steps for a method of manufacturing an electronic package relating to multiple aspects of this disclosure is shown. [Figure 10] This disclosure relates to multiple aspects of an electronic package having one or more surface mount technology devices mounted on a substrate panel. [Figure 11] Further electronic packages relating to multiple aspects of this disclosure include having one or more surface mount technology devices mounted on a substrate panel. [Figure 12] Further electronic packages relating to multiple aspects of this disclosure include having one or more surface mount technology devices mounted on a substrate panel. [Figure 13] This document shows electronic packages implemented in wireless devices relating to multiple aspects of this disclosure. [Modes for carrying out the invention]

[0040] The various aspects and embodiments described herein relate to electronic packages, and more preferably to double-sided electronic packages for coupling to separate circuit boards. More specifically, the various aspects and embodiments described herein provide alternatives to the use of a single array of solder balls to facilitate the coupling of the electronic package to the separate circuit board. These alternatives to the use of a single array of solder balls may provide improved dimensional stability when heated, as well as improved mechanical performance when subjected to impact forces encountered during verification testing, transportation, or operational use of the package. Since the number of discrete manufacturing steps required to produce the electronic package can be reduced, it may be possible to reduce the time and cost of manufacturing each individual electronic package.

[0041] It should be understood that the embodiments of the packages, devices, and methods described herein are not limited to their application to the structural and arrangement details of the components described below or shown in the accompanying drawings. The packages, devices, and methods can be implemented in other embodiments and can be carried out or performed in various ways. Specific implementation examples are given herein for illustrative purposes only and are not intended to be limiting. Furthermore, the expressions and terms used herein are for illustrative purposes only and should not be considered limiting. The use herein of “includes,” “equips,” “has,” “contains,” and their variations means that they encompass the items and equivalents listed later, as well as additional items. References to “or” and “or” are interpreted inclusively, and any item described using “or” and “or” may refer to one, more than one, or all of the items described.

[0042] Figures 1A to 1D show cross-sectional views of individual electronic package strips 10 in the background technology at various fabrication stages. Each strip contains multiple electronic packages or units 10. The dashed lines in Figures 1A to 1D indicate the boundaries between adjacent electronic packages 10.

[0043] Figure 1A shows the fabricated state in which strip 1 is provided, and strip 1 includes a substrate panel 2 having an upward-facing surface 21 and a downward-facing surface 22. The upward-facing surface 21 and the downward-facing surface 22 form opposing surfaces of the substrate panel 2. The terms “upper” and “lower” are used here only to indicate the relative arrangement of different faces of the substrate panel 2 shown in Figures 1A to 1D, and it can be seen that during fabrication, strip 1 may be positioned in an orientation different from the orientation shown in Figures 1A to 1D. In the initial fabricated state (not shown), a mold structure 32 is applied so as to cover the downward-facing surface 22 of the substrate panel 2. For each of the multiple electronic packages 10, an electronic component 4 is attached to the upward-facing surface 21 of the substrate panel 2. For each of the multiple electronic packages 10, an array of solder balls 5 is arranged on the upward-facing surface 21 of the substrate panel 2. The array of solder balls 5 substantially surrounds the electronic component 4. Each solder ball 5 is coupled to a corresponding conductive pad (not shown) provided on the substrate panel 2. Multiple conductive pads form part of the conductive path of the substrate panel 2 to one or more electronic components attached to the substrate panel 2, for example, to electronic component 4.

[0044] Figure 1B shows the manufacturing state after the manufacturing state shown in Figure 1A. In the manufacturing state shown in Figure 1B, the mold structure 31 is applied so as to cover the upward surface 21 of the substrate panel 2, sealing the array of solder balls 5 and electronic components 4 for each electronic package unit 10 of the strip 1. As a result of applying the mold structure 31 to the substrate panel 2, the solder balls 5 and electronic components 4 are embedded beneath the flat outer surface 311 of the mold structure 31.

[0045] Figure 1C shows the manufacturing state after the manufacturing state shown in Figure 1B. In the manufacturing state shown in Figure 1C, a grinding operation is performed on the flat outer surface 311 of the mold structure 31, and material is removed from the mold structure to expose the solder balls 5. However, the grinding operation also removes some of the material of the solder balls 5, and the solder balls 5 may deform from their initial spherical state.

[0046] Figure 1D shows the manufacturing state after the manufacturing state shown in Figure 1C. In the manufacturing state shown in Figure 1D, a groove or ravine 312 is formed around each solder ball 5 by ablating the material from the mold structure 31. The ablation operation also removes some of the material from the solder ball 5 and / or deforms the solder ball 5. The groove or ravine 312 provides a reservoir to receive volatile components generated from each solder ball 5 during subsequent soldering to a separate circuit board. However, incorporating the groove or ravine 312 increases the pitch or spacing between adjacent solder balls 5. The mechanical interface between the array of solder balls 5 provided on the substrate panel 2 and each conductive pad may also define areas vulnerable to cracking when individual electronic package units of multiple electronic package units 10 are subjected to impact forces during verification tests (which may include one or more drop tests), during transport, or during operational use.

[0047] In a subsequent manufacturing process (not shown), individual electronic packages of the electronic package 10 are separated from the strip 1 along the dashed lines shown in Figures 1A to 1D, thereby forming a discrete electronic package 10.

[0048] Electronic packages and their characteristics

[0049] Figure 2 shows a schematic cross-sectional view of a first example of an electronic package 100 relating to multiple aspects of the present disclosure. The electronic package 100 has a substrate panel 2 which is generally flat in shape. The substrate panel 2 may have a laminated structure. The substrate panel 2 may include a ceramic substrate. The ceramic substrate may include a low-temperature co-fired ceramic substrate. However, it is understood that other materials may also be used to form the substrate panel 2. The substrate panel 2 has opposing first surfaces 21 and second surfaces 22.

[0050] A flip chip 41 is attached to the first surface 21 of the circuit board panel 2 by an array of solder balls (not shown).

[0051] A group of through-mold connectors 50 substantially surrounds the flip chip 41. In the example shown in Figure 2, the through-mold connectors 50 are optionally solid cylindrical pillars formed from copper. However, it is understood that the group of through-mold connectors 50 may instead be formed from any other suitable non-reflowable conductive material. Without limiting ourselves to examples, nickel, silver, and gold are examples of other suitable candidate materials for the non-reflowable conductive material of the through-mold connectors 50. A “non-reflowable conductive material” means a conductive material whose melting point is below the temperature required to reflow the solder material. Copper, nickel, silver, and gold have melting points of 1084 degrees Celsius, 1453 degrees Celsius, 961 degrees Celsius, and 1063 degrees Celsius, respectively. In contrast, known solder materials begin to reflow at any temperature between approximately 90 degrees Celsius and approximately 400 degrees Celsius, depending on their composition.

[0052] Figure 3 shows a schematic plan view of the electronic package 100 of Figure 2. As shown in Figure 3, a group of through-molded connectors 50, a first subgroup 50a and a second subgroup 50b, are arranged in a rectangular pattern around the flip chip 41. The through-molded connectors 50 of the first subgroup 50a surround the through-molded connectors of the second subgroup 50b. The rectangular arrangement of the through-molded connectors 50 of the first subgroup 50a and the second subgroup 50b corresponds to the rectangular profile of the flip chip 41. However, it is also understood that the profile and area enclosed by a group of through-molded connectors 50 will vary depending on the size of the electronic component (e.g., the flip chip 41) enclosed by the group of through-molded connectors 50.

[0053] A first molded structure 31 extends over the first surface 21 of the substrate panel 2. The first molded structure 31 is optionally formed from an epoxy material. However, it is understood that other materials may be used instead to form the first molded structure 31. The first molded structure 31 substantially seals a group of through-mold connections 50 and generally defines a flat outer surface 311. In the example of Figure 2, the group of through-mold connections 50 are exposed by corresponding wells 313 defined in the first molded structure 31. In the example shown in Figure 2, each of the group of through-mold connections 50 has a corresponding well 313. Each pillar forming the group of through-mold connections 50 has opposing first end faces 51 and second end faces 52. The first end face 51 is coupled to a conductive node (not shown) defined on or within the substrate panel 2. Each pillar of the group of through-molded connectors 50 extends away from the first surface 21 of the substrate panel 2. The second end face 52 of each pillar of the group of through-molded connectors 50 is exposed by each well 313 and recessed into each well 313 so as to be visible. Each well 313 has a circular plane and a uniform cross-sectional area along the depth "d" of the well. The cross-sectional area of ​​the well 312 is substantially the same as the area of ​​each exposed end face 52 of the pillars forming the group of through-molded connectors 50. In an alternative embodiment of the embodiment in Figure 2, each of the group of through-molded connectors 50 is substantially flush with the outer surface 311 of the first molded structure 31.

[0054] As can be seen in Figure 2, the outer surface 311 of the first mold structure 31 does not have any grooves or trenches adjacent to each through-mold connection 50 that define the periphery of each through-mold connection 50. The absence of such grooves or trenches allows for a narrower spacing between adjacent through-mold connections 50. Adjacent through-mold connections 50 may have a pitch spacing "p" between approximately 300 micrometers and approximately 450 micrometers. The electronic package 100 may have a thickness "z" in the range of approximately 0.6 millimeters to approximately 0.8 millimeters.

[0055] In the example shown in Figure 2, the flip chip 41 is embedded beneath the flat outer surface 311 of the first mold structure 31. However, in other embodiments, the flip chip 41 may be exposed through the first mold structure 31. In some alternative embodiments, without being limited to examples, the outer surface 411 of the flip chip 41 may be substantially flush with the flat outer surface 311 of the first mold structure 31.

[0056] In the electronic package 100 of Figure 2, the semiconductor die 42 is attached to the second surface 22 of the substrate panel 2 using an array of solder balls (not shown). However, in alternative embodiments, it is understood that other forms of surface mount techniques, such as wire bonding, may be used to attach the semiconductor die 42 to the substrate panel 2. The filter 43 and other electronic components 44, 45 are also attached to the second surface 22 of the substrate panel 2 by any suitable form of surface mount technique. A second mold structure 32 extends over the second surface 22 of the substrate panel 2. In common with the first mold structure 31, the second mold structure 32 is also optionally formed from epoxy material. The semiconductor die 42, filter 43, and other electronic components 44, 45 are completely sealed beneath the outer surface 321 of the second mold structure 32.

[0057] The first mold structure 31 and the second mold structure 32 can help protect electronic components (e.g., flip chip 41, semiconductor die 42, filter 43) mounted on the substrate panel 2 from shock loads encountered during verification testing, transportation, or operational use. The dissipation of shock loads throughout the first mold structure 31 and the second mold structure 32 can help reduce the forces encountered by the electronic components.

[0058] Figure 4 shows a cross-sectional view of a second example of the electronic package 100'. Features common to the electronic package 100 shown in Figure 2 are represented by the same reference numerals. The electronic package 100' in Figure 4 differs from the electronic package 100 in Figure 2 in that a portion of the solder 7 is bonded to the exposed end faces 52 of the pillars that form a group of through-mold connections 50. In the example shown in Figure 4, the solder portion 7 protrudes from the outer surface 311 of the first mold structure 31. However, in other embodiments, the solder portion 7 may be substantially flush with the outer surface 311 of the first mold structure 31.

[0059] As can be seen in Figure 4, the outer surface 311 of the first mold structure 31 does not have any grooves or trenches that define the periphery of each through-mold connection portion 50 or are adjacent to each through-mold connection portion 50. Because there are no such grooves or trenches, the spacing between adjacent through-mold connection portions 50 can be narrowed, similar to the embodiment described above in relation to the example in Figure 2.

[0060] The electronic packages 100 and 100' shown in Figures 2 to 4 may be referred to as double-sided (DS) packages, based on the fact that the electronic components (e.g., flip chip 41, semiconductor die 42, filter 43) are mounted on the opposing sides 21 and 22 of the substrate panel 2.

[0061] The electronic packages 100, 100' in Figures 2 and 4 may be supplied to the customer for mounting on a circuit board such as the circuit board 8 shown in Figure 5. As will be described in detail in subsequent paragraphs of this disclosure, the circuit board 8 itself may form part of an electronic device such as a wireless device. Without limiting the examples, wireless devices may take the form of a mobile phone, a tablet computer, a smartwatch, and a laptop computer.

[0062] Figure 5 shows a cross-sectional view of the electronic packages 100, 100' when bonded to the circuit board 8. The electronic packages 100, 100' are shown inverted relative to the views in Figures 2 and 4. The electronic packages 100, 100' are bonded to the circuit board 8 using solder 70, with the second end faces 52 of each pillar forming a group of through-mold connections 50 bonded to corresponding mounting locations on the circuit board 8. The portion of solder 7 for the electronic package 100' in Figure 4 corresponds to solder 70. The electronic packages 100, 100' are mounted to the circuit board 8 such that a clearance "y" remains between the outer surface 311 of the first mold structure 31 and the circuit board 8. The clearance "y" may help protect the flip chip 41 from damage caused by bending or dropping. If the flip chip 41 is embedded beneath the outer surface 311 of the mold structure 31 (as shown in Figures 2 and 4), the material of the first mold structure 31 between the outer surface 311 and the outer surface 411 of the flip chip 41 may provide the flip chip with additional protection from loads applied by bending or dropping of the electronic packages 100, 100'. It is understood that the second mold structure 32 enclosing the semiconductor die 42, filter 43, and other electronic components 44, 45 may provide protection to these components from bending or dropping.

[0063] Once the electronic packages 100 and 100' are coupled to the circuit board 8, each of the through-mold connectors 50 provides a conductive path between the electronic packages 100 and 100' and the circuit board 8. Furthermore, the group of through-mold connectors 50 can also provide a thermal conduction path for heat to pass between the electronic packages 100 and 100' and the circuit board 8.

[0064] Figures 6A and 6B show schematic detail views of region "A" (see Figure 5) of the electronic packages 100, 100' that are inverted and coupled to the circuit board 8. Each figure shows an alternative embodiment of how a group of through-molded connectors 50 are attached to the first surface 21 of the substrate panel 2.

[0065] As shown in Figure 6A, a conductive pad 9 is attached to the first surface 21 of the substrate panel 2. A solder mask 91 may define the periphery of the pad 9. A through-mold connector 50i is attached to the conductive pad 9, and the solder mask 91 bonds the through-mold connector to the pad. More specifically, the first end face 51 of the pillar forming the through-mold connector 50 is attached to the conductive pad 9. The conductive pad 9 is optionally formed from copper and serves to provide a conductive interface or node between the electronic packages 100, 100' and the circuit board 8. However, it is also understood that the conductive pad 9 may be formed from any other suitable material that provides the desired level of electrical and / or thermal conductivity. The circuit board 8 similarly includes a conductive pad 81. Solder 70 plays a role in bonding the through-mold connector 50 to the conductive pad 81 (via the second end face 52). In this embodiment, the electronic packages 100, 100' are physically and electrically connected to the circuit board 8.

[0066] Figure 6B differs from the embodiment in Figure 6A in that the conductive pads 9 are integrally formed as a single piece with each through-mold connector 50. Therefore, in the illustrated embodiment, the need for a mechanical interface or joint between the through-mold connector 50 and the conductive pad 9 is eliminated. By integrating the conductive pad 9 and the through-mold connector 50 as a single piece, performance during verification tests such as drop tests may be improved compared to when soldering or other mechanical interfaces are used between the pad 9 and the through-mold connector 50.

[0067] Although not shown in the drawings, the substrate panel 2 includes conductive paths between conductive pads 9 and various electronic components such as flip chips 41, semiconductor dies 42, filters 43, and other electronic components 44, 45 that are mounted on the substrate panel 2. For example, the substrate panel 2 may be a printed circuit board including arrays of vias and / or conductive tracks.

[0068] Typical shape and profile of through-molded connection section

[0069] Figures 7A to 7D show various examples of different configurations for the through-molded connection 50. Figure 7A shows a through-molded connection 50' resembling an I-section, where the first flange 511 and the second flange 512 are positioned at opposing ends of an interconnecting pillar 513. The first flange 511 and the second flange 512 and the interconnecting pillar 513 are integrally formed as a single piece from copper or other suitable non-reflowable conductive material (as described above). Figure 7B shows a through-molded connection 50'' resembling a T-section, where the first flange 511 is positioned at one end of the pillar 513. The first flange 511 and the pillar 513 are integrally formed as a single piece from copper or other suitable non-reflowable conductive material (as described above). Figure 7C shows a through-molded connection 50''' corresponding to those illustrated and described with reference to embodiments in Figures 2 and 4. The through-mold connector 50''' is in the form of a solid cylindrical pillar 513 formed from copper or other suitable non-reflowable conductive material (as described above). Figure 7D shows a through-mold connector 50'''' whose shape, formed from copper or other suitable non-reflowable conductive material (as described above), is generally an ellipsoid. Understandably, through-mold connectors with profiles different from those shown in Figures 7A–7D may also be used.

[0070] Methods for manufacturing electronic packages

[0071] Figures 8A to 8F show examples of fabrication steps 1001, 1002, 1003, 1004, 1005, and 1006 used to manufacture electronic packages such as electronic packages 100, 100'. In the examples shown in these drawings, in the preceding steps (not shown), the electronic components, in the form of a semiconductor die 42, a filter 43, and other electronic components 44, 45, are mounted on the second surface 22 of the substrate panel 2. The die 42 is mounted by an array of solder balls (not shown), and the filter 43 and other electronic components 44, 45 are mounted by any suitable means of surface mount technology such as wire bonding. The second mold structure 32 is applied over the second surface 22 of the substrate panel 2 so as to seal the semiconductor die 42, the filter 43, and other electronic components 44, 45 beneath the outer surface 321 of the second mold structure 32. However, in other embodiments, it is understood that attaching the semiconductor die 42, filter 43, and other electronic components 44, 45 to the second surface 22 of the substrate panel 2 and applying the second mold structure 32 may be performed after the fabrication steps shown in Figures 8A to 8F.

[0072] Figure 8A shows the manufacturing step 1001 in which the substrate panel 2 is provided. As described in the preceding paragraphs, in the embodiment shown in Figure 8A, the substrate panel 2 is provided with a semiconductor die 42, a filter 43, and other electronic components 44, 45, which are pre-attached to the substrate panel 2 and sealed within the second mold structure 32.

[0073] Figure 8B shows manufacturing step 1002 in which a group of through-mold connectors 50 are arranged on the first surface 21 of the substrate panel 2. The group of through-mold connectors 50 are provided as a group of cylindrical pillars formed from copper or other conductive, non-reflowable material, as described above. As described above, each pillar of the through-mold connector 50 has opposing first end faces 51 and second end faces 52. Each pillar forming the through-mold connector 50 is arranged such that its first end face 51 is attached to the first surface 21 of the substrate panel 2, and the pillar extends away from the first surface of the panel. The group of through-mold connectors 50 may be coupled to a conductive pad 9, or to a through-mold connector 50 formed as a single piece integral with each conductive pad 9, as described above in relation to Figures 6A and 6B. The conductive pad 9 is not shown in any of Figures 8A to 8F.

[0074] Figure 8C shows fabrication step 1003 in which the flip chip 41 is attached to the first surface 21 of the substrate panel 2 using an array of solder balls (not shown).

[0075] Figure 8D shows manufacturing step 1004 in which the first mold structure 31 is applied to the first surface 21 of the substrate panel 2 to seal a group of through-mold connections 50 and flip chips 41. In this manufacturing step 1004, the outer surface 411 of the flip chips 41 is embedded beneath the outer surface 311 of the first mold structure 31.

[0076] Figure 8E shows fabrication step 1005 in which a portion of the first mold structure 31 is removed and wells 313 are formed in the first mold structure 31 at each location of a group of through-mold connections 50. The second end faces 52 of each pillar forming the through-mold connections 50 are exposed by the wells 313 and recessed into the wells 313, so that the second end faces 52 are visible when looking into the wells. Laser ablation or a similar process is used to locally remove material from the first mold structure 31 to form each well 313. This exposes the through-mold connections 50. Upon completion of this fabrication step 1005, an electronic package 100 corresponding to that shown in Figure 2 is obtained.

[0077] Figure 8F shows fabrication step 1006 in which a portion of solder 7 is bonded to the second end faces 52 of each pillar forming a group of through-mold connections 50. This portion of solder 7 protrudes from the outer surface 311 of the first mold structure 31. As previously mentioned, this portion of solder 7 can facilitate subsequent bonding of a circuit board, such as the circuit board 8, to the electronic package. Upon completion of this fabrication step 1006, an electronic package 100' corresponding to that shown in Figure 4 is obtained.

[0078] It should be understood that manufacturing step 1003 may precede manufacturing step 1002, or may be performed substantially simultaneously with manufacturing step 1002.

[0079] Figures 9A to 9E show other example fabrication steps 1001', 1002', 1003', 1004', and 1005' used in the manufacture of the electronic package 100''. Fabrication steps 1001', 1002', 1003', and 1004' in Figures 9A to 9D correspond to steps 1001, 1002, 1003, and 1004 in Figures 8A to 8D, respectively. However, fabrication step 1005' shown in Figure 9E differs from fabrication step 1005 in Figure 8E in that the entire flat outer surface 311 of the first mold structure 31 is ablated by grinding or a similar process, gradually removing a thin layer of material from the outer surface of the first mold structure 31. Once the ablation step is complete, the flat outer surface 311 of the first mold structure 31 becomes substantially flush with the second end faces 52 of a group of through-mold connections 50.

[0080] The electronic packages 100, 100', and 100'' obtained from the fabrication steps described in relation to Figures 8A to 8F and Figures 9A to 9E may be coupled to the circuit board 8 as described above.

[0081] In other embodiments, a conformal shield layer (not shown) may be provided to cover one or both of the first mold structure 31 and the second mold structure 32. This shield layer defines electromagnetic interference shielding for the electronic packages 100, 100', and 100''.

[0082] Typical components mounted on the substrate panel of an electronic package.

[0083] It should be understood that the illustrated and described electronic packages 100, 100', 100' may use a variety of different electronic components mounted on the substrate panel 2. For example, Figure 10 shows a bifacial electronic package 1010 in one embodiment in which a semiconductor die is mounted on the first surface 21 of the substrate panel 2 by an array of solder balls, and other electronic components are mounted on the second surface 22 of the substrate panel by any suitable surface mount technique. As a further example, Figure 11 shows a bifacial electronic package 1012 in one embodiment in which one or more amplifiers and / or switches are mounted on the first surface 21 of the substrate panel 2, and a filter / filtering device is mounted on the second surface 22 of the substrate panel. As a further example, Figure 12 shows a bifacial electronic package 1013 in one embodiment in which one or more low-noise amplifier (LNA) modules and switches are mounted on the first surface 21 of the substrate panel 2, and a filter / filtering device is mounted on the second surface 22 of the substrate panel.

[0084] Typical devices incorporating electronic packages

[0085] Figure 13 shows an example of how the double-sided electronic package 100 can be mounted on an electronic device such as a wireless device 500. In the example of the wireless device 500 in Figure 13, the electronic package 100 may be an LNA or LNA-related module represented by a dashed line in Figure 13. For example, the LNA module 100 may include one or more LNAs 104, a bias / logic circuit 432, and a band selector switch 430. Some or all of such circuits can be mounted on a semiconductor die attached to the substrate panel 2 of the LNA module 100. In such an LNA module, some or all of the duplexer 400 can be attached to the substrate panel 2 to form a double-sided package having one or more of the features described herein.

[0086] Figure 13 further illustrates various features related to an example of a wireless device 500. Although not specifically shown in Figure 13, the electronic package 100 may instead take the form of a diversity receiver (RX) module instead of an LNA module. Alternatively, the electronic package 100 may take the form of a combination of a diversity RX module and an LNA module. It is also understood that a double-sided package 100 having one or more of the features described herein can be implemented in the wireless device 500 as a non-LNA module.

[0087] In an example of the wireless device 500, a power amplifier (PA) circuit 518 has multiple PAs, which provide an amplified RF signal to a switch 430 (via a duplexer 400), and the switch 430 can route the amplified RF signal to an antenna 524. The PA circuit 518 can receive an unamplified RF signal from a transceiver 514, which may be configured and operated in known manner.

[0088] The transceiver 514 may also be configured to process the received signal. Such a received signal can be routed from the antenna 524 to the LNA 104 via the duplexer 400. Various operations of the LNA 104 can be facilitated by the bias / logic circuit 432.

[0089] The transceiver 514 is shown to interact with the baseband subsystem 510. The baseband subsystem 510 is configured to provide a conversion between data and / or voice signals appropriate for the user and RF signals appropriate for the transceiver 514. The transceiver 514 is also shown to be connected to a power management component 506 configured to manage the power for the operation of the wireless device 500. Such a power management component can also control the operation of the baseband subsystem 510. The baseband subsystem 510 is shown to be connected to a user interface 502 to facilitate various inputs and outputs of voice and / or data given to and received from the user. The baseband subsystem 510 is also connected to a memory 504 configured to store data and / or instructions in order to facilitate the operation of the wireless device and / or to store information for the user. A certain number of other wireless device configurations may utilize one or more of the features described herein. For example, the wireless device does not need to be a multiband device. In other examples, the wireless device may include additional antennas such as diversity antennas, as well as additional connectivity features such as Wi-Fi, Bluetooth®, and GPS.

[0090] Please note that the drawings are for illustrative purposes only and are not to scale.

[0091] While several aspects of at least one embodiment have been described above, it should be understood that those skilled in the art will readily recall various modifications, alterations, and improvements. Such modifications, alterations, and improvements are intended to be part of this disclosure and to be within the scope of the invention. Therefore, the above description and drawings are merely illustrative, and the scope of the invention should be determined by the appropriate configuration of the appended claims and their equivalents.

Claims

1. It is an electronic package, A substrate having a first surface and a second surface, configured to receive one or more electronic components, The first electronic component mounted on the first surface, A first mold structure extending over at least a portion of the first surface, A group of through-molded connection portions provided on the first surface and Includes, The aforementioned group of through-molded connection portions are Formed from a non-reflowable conductive material, It is sealed by the first mold structure and exposed through the first mold structure. Through-mold connection part of the first lower group and through-mold connection part of the second lower group Includes, The second subgroup surrounds the first electronic component, and the first subgroup surrounds the second subgroup. Each through-mold connection is provided as a pillar in a corresponding well defined in the first mold structure, and the pillar is entirely sealed by the first mold structure except for its exposed end face, with the exposed end face recessed to a certain depth from the surface of the first mold structure, in an electronic package.

2. A second electronic component mounted on the second surface of the aforementioned substrate, A second mold structure extending on at least a portion of the second surface of the substrate and The electronic package of claim 1, further comprising:

3. The electronic package according to claim 1, wherein the non-reflowable conductive material has a melting point greater than 400 degrees Celsius.

4. The electronic package according to claim 3, wherein the non-reflowable conductive material comprises one or more of copper, nickel, gold, and silver, or consists of one or more of copper, nickel, gold, and silver.

5. The electronic package according to claim 1, wherein the non-reflowable conductive material is formed from a non-solder material.

6. The electronic package according to claim 1, wherein the outer surface of the first mold structure is free from any grooves or trenches that define the periphery of each of the group of through-mold connections and are adjacent to each through-mold connection.

7. The corresponding well has a uniform cross-sectional area along a certain depth of the corresponding well. The electronic package according to claim 1, wherein the uniform cross-sectional area is the same as the area of ​​the exposed end face of the through-molded connection portion.

8. The electronic package according to claim 1, wherein at least one of the group of through-mold connectors is coupled to a corresponding conductive node provided on or embedded in the substrate.

9. The electronic package of claim 8, wherein the corresponding conductive node includes a conductive pad provided on or embedded in the substrate.

10. The electronic package according to claim 9, wherein the conductive pad and the at least one through-mold connection portion are integrally formed as a single piece from the non-reflowable conductive material.

11. It is an electronic device, A circuit board configured to accept one or more electronic packages, The electronic package mounted on the circuit board and Includes, The electronic package includes a substrate having a first surface and a second surface, and configured to receive one or more electronic components. The electronic package further includes a first electronic component mounted on the first surface, a first molded structure extending over at least a portion of the first surface, and a group of through-mold connections provided on the first surface. The aforementioned group of through-molded connection portions are Formed from a non-reflowable conductive material, It is sealed by the first mold structure and exposed through the first mold structure. Through-mold connection part of the first lower group and through-mold connection part of the second lower group Includes, The second subgroup surrounds the first electronic component, and the first subgroup surrounds the second subgroup. Each through-mold connection is provided as a pillar in a corresponding well defined in the first mold structure, and the pillar is entirely sealed by the first mold structure except for its exposed end face, with the exposed end face recessed to a certain depth from the surface of the first mold structure, in an electronic device.

12. The one or more electronic components further include a second electronic component mounted on the second surface of the substrate. The electronic device of claim 11, wherein the electronic package further includes a second molded structure extending on at least a portion of the second surface of the substrate.

13. The electronic device according to claim 11, wherein the non-reflowable conductive material has a melting point greater than 400 degrees Celsius.

14. The electronic device according to claim 11, wherein the non-reflowable conductive material is formed from a non-solder material.

15. The electronic device according to claim 11, wherein the outer surface of the first mold structure is free from any grooves or trenches that define the periphery of each of the group of through-mold connections and are adjacent to each through-mold connection.

16. The corresponding well has a uniform cross-sectional area along a certain depth of the corresponding well. The electronic device according to claim 11, wherein the uniform cross-sectional area is the same as the area of ​​the exposed end face of the through-molded connection portion.

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