Vertical light-emitting diode package structure and method for manufacturing the same

Abstract

To provide a vertical light-emitting diode package structure and a manufacturing method thereof.SOLUTION: A vertical light-emitting diode package structure includes a first structural layer including a first substrate and a first light-emitting element, a second structural layer including a second substrate and a second light-emitting element and connected to the first structural layer, and a third structural layer including a third substrate and a third light-emitting element. The third structural layer is connected to the second structural layer to make the second structural layer be arranged between the first structural layer and the third structural layer. The first light-emitting element, the second light-emitting element and the third light-emitting element are respectively disposed on upper surfaces of the first substrate, the second substrate and the third substrate. Thus, a structure size after packaging is effectively reduced, a die bonding process is simplified, and difficulties in tests and repairs can be reduced.SELECTED DRAWING: Figure 1A

Description

Technical Field

[0001] The present invention relates to a light emitting diode package structure, and particularly to a vertical light emitting diode package structure and a manufacturing method thereof that can improve the convenience of manufacturing and reduce the size.

Background Art

[0002] A well-known light emitting diode package structure fixes a light emitting diode and a dummy plug to a substrate, electrically connects the light emitting diode and the dummy plug, and then performs a colloidal package. However, in the well-known package structure, the light emitting diodes are arranged horizontally, that is, light emitting diodes of different colors must be arranged separately in the horizontal direction, and the volume of the package structure is too large to realize miniaturization.

Summary of the Invention

Means for Solving the Problems

[0003] According to one aspect of the present invention, a first structural layer includes a first substrate having an upper surface and a lower surface opposite to the upper surface, four first conductive members each penetrating from the upper surface to the lower surface of the first substrate, a first light-emitting element provided on the end face located on the upper surface of one of the first conductive members and electrically connected, and a first dummy plug provided on the end face located on the upper surface of the other of the first conductive members and electrically connected; a second substrate having an upper surface and a lower surface opposite to the upper surface, three second conductive members each penetrating from the upper surface to the lower surface of the second substrate and electrically connected to three of the first conductive members that do not have a first light-emitting element, a second light-emitting element provided on the end face located on the upper surface of one of the second conductive members and electrically connected, and the other of the second conductive members, A vertical light-emitting diode package structure is provided, comprising: a second structural layer connected to a first structural layer, including a second dummy plug provided on the end face located on the surface and electrically connected; a third substrate having an upper surface and a lower surface facing the upper surface; two third conductive members each penetrating from the upper surface to the lower surface of the third substrate and electrically connected to two of the second conductive members that do not have a second light-emitting element; a third light-emitting element provided on the end face located on the upper surface of one of the third conductive members and electrically connected; and a third dummy plug provided on the end face located on the upper surface of the other of the third conductive members and electrically connected; wherein the third structural layer is connected to the second structural layer such that the second structural layer is located between the first structural layer and the third structural layer.

[0004] According to the vertical light-emitting diode package structure described above, the second conductive member may be positioned in conjunction with three of the first conductive members that do not have a first light-emitting element, and the third conductive member may be positioned in conjunction with two of the second conductive members that do not have a second light-emitting element.

[0005] According to the vertical light-emitting diode package structure described above, the second conductive member may be positioned in alignment with three of the first conductive members, the third conductive member may be positioned in alignment with two of the second conductive members, and the first light-emitting element, the second light-emitting element, and the third light-emitting element may be positioned in alignment with each other.

[0006] According to the vertical light-emitting diode package structure described above, the first conductive members may be arranged in a 2x2 matrix.

[0007] According to the vertical light-emitting diode package structure described above, the first light-emitting element may be a red light-emitting element, the second light-emitting element may be a green light-emitting element, and the third light-emitting element may be a blue light-emitting element.

[0008] According to another aspect of the present invention, the process includes: a first conductive member installation step of inserting four first conductive members through the upper surface to the lower surface of a first substrate; a first arrangement step of providing a first light-emitting element and a first dummy plug on the end faces of two of the first conductive members located on the upper surface of the first substrate, and forming electrical connections with the two first conductive members to obtain a first structural layer; a second conductive member installation step of inserting three second conductive members through the upper surface to the lower surface of a second substrate; a second arrangement step of providing a second light-emitting element and a second dummy plug on the end faces of two of the second conductive members located on the upper surface of the second substrate, and forming electrical connections with the two second conductive members to obtain a second structural layer; and two third conductive members The present invention provides a method for manufacturing a vertical light-emitting diode (LED) package structure, comprising: a third conductive member installation step of inserting the third conductive member through from the top surface to the bottom surface of the third substrate; a third arrangement step of providing the third light-emitting element and the third dummy plug on the end face of the third conductive member located on the top surface of the third substrate, respectively, and forming an electrical connection with the third conductive member to obtain a third structural layer; and an assembly step of stacking and connecting the first structural layer, the second structural layer, and the third structural layer in order, electrically connecting the second conductive member to three of the first conductive members that do not have the first light-emitting element, and electrically connecting the third conductive member to two of the second conductive members that do not have the second light-emitting element, thereby forming a vertical light-emitting diode package structure.

[0009] According to the manufacturing method of the vertical light-emitting diode package structure, the second conductive member may be provided in alignment with three of the first conductive members that do not have a first light-emitting element, and the third conductive member may be provided in alignment with two of the second conductive members that do not have a second light-emitting element.

[0010] According to the manufacturing method of the vertical light-emitting diode package structure, the second conductive member may be provided in alignment with three of the first conductive members, the third conductive member may be provided in alignment with two of the second conductive members, and the first light-emitting element, the second light-emitting element, and the third light-emitting element may be provided in alignment with each other.

[0011] According to the manufacturing method of the vertical light-emitting diode package structure, the first conductive members may be arranged in a 2x2 matrix.

[0012] According to the manufacturing method of the vertical light-emitting diode package structure, the first light-emitting element may be a red light-emitting element, the second light-emitting element may be a green light-emitting element, and the third light-emitting element may be a blue light-emitting element. [Brief explanation of the drawing]

[0013] [Figure 1A] This is a schematic perspective view of a vertical light-emitting diode package structure according to one embodiment of the present invention. [Figure 1B] Figure 1A is a schematic exploded view of the vertical light-emitting diode package structure. [Figure 2A] This is a schematic cross-sectional view of the vertical light-emitting diode package structure shown in Figure 1A, along the 2A-2A line segment. [Figure 2B] This is a schematic cross-sectional view of the vertical light-emitting diode package structure shown in Figure 1A, along the 2B-2B line segment. [Figure 3] This is a schematic perspective view of a vertical light-emitting diode package structure according to another embodiment of the present invention. [Figure 4A] Figure 3 is a schematic diagram of the bottom view of the first substrate. [Figure 4B] Figure 3 is a schematic diagram of the bottom view of the second substrate. [Figure 4C] Figure 3 is a schematic diagram of the bottom view of the third substrate. [Figure 5] This is a process flowchart for a manufacturing method of a vertical light-emitting diode package structure according to one embodiment of the present invention. [Figure 6A] This is a schematic cross-sectional view of each flow stage in the manufacturing method of a vertical light-emitting diode package structure. [Figure 6B] This is a schematic cross-sectional view of each flow stage in the manufacturing method of a vertical light-emitting diode package structure. [Figure 6C] This is a schematic cross-sectional view of each flow stage in the manufacturing method of a vertical light-emitting diode package structure. [Figure 6D] These are schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure. [Figure 6E] These are schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure. [Figure 6F] These are schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure. [Figure 6G] These are schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure. [Figure 6H] These are schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure. [Figure 7A] These are another set of schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure. [Figure 7B] These are another set of schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure. [Figure 7C] These are another set of schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure. [Figure 7D] These are another set of schematic cross-sectional views of each flow stage of a method for manufacturing a vertical light-emitting diode package structure.

Embodiments for Carrying Out the Invention

[0014] Hereinafter, each embodiment of the present invention will be examined in more detail. However, this embodiment is an application of various inventive concepts and can be specifically implemented within various different specific ranges. The specific embodiment is for the purpose of explanation only and is not limited to the scope of the disclosure.

[0015] Please refer to Figures 1A and 1B. Figure 1A is a perspective schematic of a vertical light-emitting diode package structure 100 of one embodiment of the present invention, and Figure 1B is an exploded schematic of the vertical light-emitting diode package structure 100 of Figure 1A. The vertical light-emitting diode package structure 100 includes a first structural layer 110, a second structural layer 120, and a third structural layer 130, wherein the second structural layer 120 is connected to the first structural layer 110, and the third structural layer 130 is connected to the second structural layer 120 such that the second structural layer 120 is located between the first structural layer 110 and the third structural layer 130.

[0016] Please also refer to Figures 2A and 2B. Figure 2A is a schematic cross-sectional view of the vertical light-emitting diode package structure 100 in Figure 1A along the line segment 2A-2A, and Figure 2B is a schematic cross-sectional view of the vertical light-emitting diode package structure 100 in Figure 1A along the line segment 2B-2B. The first structural layer 110 includes a first substrate 111, four first conductive members 112, a first light-emitting element 113, and a first dummy plug 114. The first substrate 111 has an upper surface and a lower surface opposite the upper surface. Each of the first conductive members 112 penetrates from the upper surface to the lower surface of the first substrate 111, thereby electrically connecting the elements located on both sides of the first substrate 111.

[0017] The first light-emitting element 113 is provided on and electrically connected to the upper end face of one of the first conductive members 112. The first dummy plug 114 is provided on and electrically connected to the upper end face of the other of the first conductive members 112. The first light-emitting element 113 and the first dummy plug 114 may be fixed to the first conductive member 112 via a conductive adhesive to achieve both structural and electrical connections and to further reduce the overall size of the first structural layer 110.

[0018] The second structural layer 120 includes a second substrate 121, three second conductive members 122, a second light-emitting element 123, and a second dummy plug 124. The second substrate 121 has an upper surface and a lower surface opposite the upper surface, and can have good light transmittance. Each of the second conductive members 122 penetrates from the upper surface to the lower surface of the second substrate 121. The second light-emitting element 123 is provided on the upper end face of one of the second conductive members 122 and is electrically connected. The second dummy plug 124 is provided on the upper end face of the other of the second conductive member 122 and is electrically connected. The element structure and installation method of the second structural layer 120 are the same as or similar to those of the first structural layer 110, so a description is omitted here.

[0019] Each second conductive member 122 is electrically connected to three of the first conductive members 112 that do not have the first light-emitting element 113. More specifically, the second conductive member 122 may be electrically connected to the first conductive member 112 via an end face located on the lower surface of the second substrate 121, or, to achieve both structural and electrical connection, the end face located on the lower surface of the second conductive member 122 may be in direct contact with the end face located on the upper surface of the first substrate 111 of the first conductive member 112 or the first dummy plug 114, and the connection may be made via a conductive adhesive.

[0020] The third structural layer 130 includes a third substrate 131, two third conductive members 132, a third light-emitting element 133, and a third dummy plug 134. The third substrate 131 has an upper surface and a lower surface opposite the upper surface, and can have good light transmittance. Each third conductive member 132 penetrates from the upper surface to the lower surface of the third substrate 131 and is electrically connected to two of the second conductive members 122 that do not have the second light-emitting element 123. The third light-emitting element 133 is provided on the upper end face of one of the third conductive members 132 and is electrically connected. The third dummy plug 134 is provided on the upper end face of the other of the third conductive member 132 and is electrically connected. The element structure and installation method of the third structural layer 130 are the same as or similar to those of the first structural layer 110 and the second structural layer 120, so a description is omitted here.

[0021] In particular, the second conductive member 122 may be positioned in conjunction with the three first conductive members 112 that do not have the first light-emitting element 113, the third conductive member 132 may be positioned in conjunction with the two second conductive members 122 that do not have the second light-emitting element 123, and the first conductive members 112 may be arranged in a 2x2 matrix. This contributes to reducing the difficulty of structural arrangement, shortens the distance between elements, and allows the first light-emitting element 113, the second light-emitting element 123, and the third light-emitting element 133 to emit light without interfering with each other.

[0022] Furthermore, the first light-emitting element 113 may be a red light-emitting element, the second light-emitting element 123 may be a green light-emitting element, and the third light-emitting element 133 may be a blue light-emitting element, or the area of ​​the first light-emitting element 113 may be larger than the area of ​​the second light-emitting element 123, and the area of ​​the second light-emitting element 123 may be larger than the area of ​​the third light-emitting element 133. This makes it possible to increase the light output of the first light-emitting element 113 and the second light-emitting element 123, which contributes to the color light mixing of the vertical light-emitting diode package structure 100.

[0023] The vertical light-emitting diode package structure 100 may further include two adhesive layers 115 and 125, which may be located between the first structural layer 110 and the second structural layer 120, and between the second structural layer 120 and the third structural layer 130, respectively, and the adhesive layers 115 and 125 can provide a protective effect to extend the life of the vertical light-emitting diode package structure 100. The vertical light-emitting diode package structure 100 may further include an adhesive layer 135 that can be provided on the upper surface of the third substrate 131 to cover the third light-emitting element 133 and the third dummy plug 134.

[0024] The vertical light-emitting diode package structure 100 may include two conductive layers 116 and 126 that can be located between the first structural layer 110 and the second structural layer 120, and between the second structural layer 120 and the third structural layer 130, respectively. Electrical conductivity can be achieved between the first structural layer 110, the second structural layer 120, and the third structural layer 130 via the conductive layers 116 and 126, eliminating the need to manufacture the circuit by wire bonding, further reducing the size, and improving process efficiency and yield. The vertical light-emitting diode package structure 100 may further include a conductive layer 136 that can be provided on the upper surface of the adhesive layer 135 for the vertical light-emitting diode package structure 100 to be electrically connected to the outside.

[0025] Please refer to Figure 3. Figure 3 is a schematic perspective view of a vertical light-emitting diode package structure 200 of another embodiment of the present invention. The vertical light-emitting diode package structure 200 is substantially the same as the vertical light-emitting diode package structure 100, the difference being that the second conductive members 222 may be positioned in conjunction with three of the first conductive members 212, the third conductive members 232 may be positioned in conjunction with two of the second conductive members 222, the first light-emitting element 213, the second light-emitting element 223, and the third light-emitting element 233 may be positioned in conjunction, and the first conductive members 212 may be arranged in a 2x2 matrix. By positioning the first light-emitting element 213, the second light-emitting element 223, and the third light-emitting element 233, a spatial color light mixing effect is achieved, expanding the range of applications of the vertical light-emitting diode package structure 200.

[0026] Please refer to Figures 4A, 4B, and 4C. Figure 4A is a schematic bottom view of the first substrate 211 in Figure 3, Figure 4B is a schematic bottom view of the second substrate 221 in Figure 3, and Figure 4C is a schematic bottom view of the third substrate 231 in Figure 3. Since the first light-emitting element 213, the second light-emitting element 223, and the third light-emitting element 233 are positioned in the same location, it is necessary to arrange the circuits of the second conductive member 222 and the third conductive member 232 on the bottom surfaces of the second substrate 221 and the third substrate 231, respectively, in order to ensure accurate conductivity of the circuits. As can be seen from Figures 3 and 4B, the second conductive member 222 in the upper right corner is blocked by the first light-emitting element 213, so it is necessary to form an electrical connection between the conductive extension member E1 and the first conductive member 212. Similarly, as can be seen from Figures 3 and 4C, the third conductive member 232 in the upper right corner is blocked by the second light-emitting element 223, so it is necessary to form an electrical connection between the conductive extending member E2 and the second conductive member 222.

[0027] Please refer to Figures 5, 6A, 6B, 6C, 6D, 6E, 6F, 6G, and 6H. Figure 5 is a process flowchart of the manufacturing method 300 for a vertical light-emitting diode package structure according to one embodiment of the present invention, and Figures 6A to 6H are schematic cross-sectional views of each flow stage of the manufacturing method 300 for a vertical light-emitting diode package structure. The manufacturing method 300 for a vertical light-emitting diode package structure includes steps 310, 320, 330, 340, 350, 360, and 370.

[0028] Step 310 is a first conductive member installation step in which four first conductive members 112 are each passed through the first substrate 111 from the top surface to the bottom surface. See Figure 6A. Here, taking the first substrate 111 as an example, the first substrate 111 may be a through-glass via (TGV) substrate, which can have good light transmittance and has through holes H for providing other elements, and the number and position of the through holes H can be adjusted according to the demand and are not limited in the present invention. See Figure 6B. The first conductive member 112 may be a copper column, so etching is not required and manufacturing costs can be reduced, and it may have a head portion whose width is larger than the diameter of the through hole H, and colloid may be filled between the first conductive member 112 and the through hole H and between the head portion and the top surface of the first substrate 111 in order to achieve the effect of fixing the first conductive member 112.

[0029] Refer to Figure 6C. Step 320 is a first arrangement step in which the first light-emitting element 113 and the first dummy plug 114 are respectively provided on the end faces of two of the first conductive members 112 located on the upper surface of the first substrate 111, and electrical connections are formed with the two first conductive members 112 to obtain the first structural layer 110. Refer to Figures 6D and 6E. After providing the first light-emitting element 113 and the first dummy plug 114, an adhesive layer 115 may be provided to cover the upper surface of the first substrate 111, the first light-emitting element 113 and the first dummy plug 114, and then holes may be made with a laser and a conductive layer 116 may be provided.

[0030] Step 330 is a second conductive member installation step in which three second conductive members 122 are each penetrated from the upper surface to the lower surface of the second substrate 121. Step 340 is a second arrangement step in which a second light-emitting element 123 and a second dummy plug 124 are each placed on the end faces of two of the second conductive members 122 that are located on the upper surface of the second substrate 121, and electrical connections are formed with these two second conductive members 122 to obtain the second structural layer 120. The details of steps 330 and 340 are the same as or similar to steps 310 and 320, respectively, so their explanation is omitted here.

[0031] Step 350 is a third conductive member installation step in which two third conductive members 132 are each inserted through the third substrate 131 from the top surface to the bottom surface. Step 360 is a third arrangement step in which a third light-emitting element 133 and a third dummy plug 134 are each placed on the end faces of the third conductive member 132 located on the top surface of the third substrate 131, and electrical connections are formed with the third conductive member 132 to obtain the third structural layer 130. The details of steps 350 and 360 are the same as or similar to steps 310 and 320, respectively, so their explanation is omitted here.

[0032] Step 370 is an assembly step in which the first structural layer 110, the second structural layer 120, and the third structural layer 130 are stacked and connected in order, the second conductive member 122 is electrically connected to three of the first conductive member 112 that do not have the first light-emitting element 113, and the third conductive member 132 is electrically connected to two of the second conductive member 122 that do not have the second light-emitting element 123, thereby forming a vertical light-emitting diode package structure 100. For details, please refer to Figures 6F to 6H. Conductive adhesive may be applied to the positions where the first structural layer 110, the second structural layer 120, and the third structural layer 130 are to be electrically connected, then they are aligned and stacked, pressed, and finally cut to obtain multiple vertical light-emitting diode package structures 100.

[0033] Please refer to Figures 7A, 7B, 7C, and 7D. Figures 7A to 7D are schematic cross-sectional views of each flow stage of the manufacturing method 300 for a vertical light-emitting diode package structure. In Figures 7A to 7D, the first conductive member 212, the second conductive member 222, and the third conductive member 232 are manufactured by a chemical plating method. For example, the first conductive member 212, the second conductive member 222, and the third conductive member 232 are formed by sputtering a seed layer C into a through-hole H of the first substrate 211, and then filling the through-hole H with chemical plating. As can be seen from Figure 7D, by adopting a chemical plating method, the thickness can be reduced, the size after packaging can be further reduced, and the complexity of the process can be reduced because there is no need to fill and fix with colloid.

[0034] As described above, the vertical light-emitting diode package structure of the present invention effectively reduces the structural size after packaging by stacking the first light-emitting element, the second light-emitting element, and the third light-emitting element in a vertical direction. Furthermore, by adopting independent packaging and a modular design, the die bonding process can be simplified, and the difficulty of testing and repair can be reduced.

[0035] Although the present invention has been disclosed in the examples described above, these examples are not intended to limit the present invention, and any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be based on the claims that are subsequently appended. [Explanation of symbols]

[0036] 100, 200: Vertical light-emitting diode package structure 110: 1st structural layer 111, 211: First board 112, 212: First conductive member 113, 213: First light-emitting element 114: First dummy plug 115, 125, 135: Adhesive layer 116, 126, 136: Conductive layer 120:Second structural layer 121, 221: Second board 122, 222: Second conductive member 123, 223: Second light-emitting element 124: Second dummy plug 130:Third structural layer 131, 231: Third board 132, 232: Third conductive member 133, 233: Third light-emitting element 134: Third dummy plug 300: Manufacturing method for vertical light-emitting diode package structure 310, 320, 330, 340, 350, 360, 370: Engineering E1, E2: Conductive extension in the component H: Connecting point C: シード layer

Claims

1. A first structural layer comprising: a first substrate having an upper surface and a lower surface facing the upper surface; four first conductive members each penetrating from the upper surface to the lower surface of the first substrate; a first light-emitting element provided on and electrically connected to the end face of one of the four first conductive members located on the upper surface; and a first dummy plug provided on and electrically connected to the end face of another of the four first conductive members located on the upper surface; A second substrate having an upper surface and a lower surface facing the upper surface; three second conductive members each penetrating from the upper surface to the lower surface of the second substrate and each electrically connected to three of the four first conductive members that do not have the first light-emitting element; a second light-emitting element provided on and electrically connected to the end face of one of the three second conductive members located on the upper surface; and a second dummy plug provided on and electrically connected to the end face of the other one of the three second conductive members located on the upper surface, the second structural layer being connected to the first structural layer, A third structural layer comprising: a third substrate having an upper surface and a lower surface opposite to the upper surface; two third conductive members each penetrating from the upper surface to the lower surface of the third substrate and electrically connected to two of the three second conductive members that do not have the second light-emitting element; a third light-emitting element provided on and electrically connected to the end face of one of the two third conductive members located on the upper surface; and a third dummy plug provided on and electrically connected to the end face of the other of the two third conductive members located on the upper surface; Equipped with, The third structural layer is connected to the second structural layer such that the second structural layer is located between the first structural layer and the third structural layer. The three second conductive members are each positioned to align with the three of the four first conductive members that do not have the first light-emitting element, and the two third conductive members are each positioned to align with the two of the three second conductive members that do not have the second light-emitting element. The three second conductive members are each positioned to align with three of the four first conductive members, the two third conductive members are each positioned to align with two of the three second conductive members, and the first light-emitting element, the second light-emitting element, and the third light-emitting element are positioned to align with each other in this vertical light-emitting diode package structure.

2. The vertical light-emitting diode package structure according to claim 1, wherein the four first conductive members are arranged in a 2x2 matrix.

3. The vertical light-emitting diode package structure according to claim 1, wherein the first light-emitting element is a red light-emitting element, the second light-emitting element is a green light-emitting element, and the third light-emitting element is a blue light-emitting element.

4. A first conductive member installation step involves inserting four first conductive members through the first substrate from the top surface to the bottom surface, A first arrangement step involves providing the first light-emitting element and the first dummy plug on the end faces of two of the four first conductive members located on the upper surface of the first substrate, and forming electrical connections with the two first conductive members to obtain the first structural layer. The second conductive member installation step involves inserting three second conductive members through the second substrate from the top surface to the bottom surface, A second arrangement step involves providing the second light-emitting element and the second dummy plug on the end faces of two of the three second conductive members located on the upper surface of the second substrate, and forming electrical connections with the two second conductive members to obtain the second structural layer. A third conductive member installation step involves inserting two third conductive members through the third substrate from the top surface to the bottom surface, A third arrangement step involves providing the third light-emitting element and the third dummy plug on the end faces of the two third conductive members located on the upper surface of the third substrate, respectively, and forming electrical connections with the two third conductive members to obtain a third structural layer. An assembly step of stacking and connecting the first structural layer, the second structural layer, and the third structural layer in order, electrically connecting the three second conductive members to the three of the four first conductive members that do not have the first light-emitting element, and electrically connecting the two third conductive members to the two of the three second conductive members that do not have the second light-emitting element, thereby forming a vertical light-emitting diode package structure; A method for manufacturing a vertical light-emitting diode package structure including a vertical light-emitting diode.

5. The method for manufacturing a vertical light-emitting diode package structure according to claim 4, wherein the three second conductive members are each provided in alignment with the three of the four first conductive members that do not have the first light-emitting element, and the two third conductive members are each provided in alignment with the two of the three second conductive members that do not have the second light-emitting element.

6. The method for manufacturing a vertical light-emitting diode package structure according to claim 4, wherein the three second conductive members are each provided in alignment with three of the four first conductive members, the two third conductive members are each provided in alignment with two of the three second conductive members, and the first light-emitting element, the second light-emitting element, and the third light-emitting element are provided in alignment.

7. The method for manufacturing a vertical light-emitting diode package structure according to claim 5 or claim 6, wherein the four first conductive members are arranged in a 2x2 matrix.

8. The method for manufacturing a vertical light-emitting diode package structure according to claim 4, wherein the first light-emitting element is a red light-emitting element, the second light-emitting element is a green light-emitting element, and the third light-emitting element is a blue light-emitting element.

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