Light-emitting device
The light-emitting device addresses bonding and stress issues by employing a substrate design with separate bonding members and coating films, enhancing bonding strength and light extraction efficiency.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- NICHIA CORP
- Filing Date
- 2025-01-16
- Publication Date
- 2026-06-25
AI Technical Summary
Existing light-emitting devices face challenges in strengthening the bonding force between the translucent member and the substrate while managing stress on the translucent member.
A light-emitting device design featuring a substrate with distinct upper surfaces, separate bonding members on these surfaces, and a translucent member joined with a first coating film in specific regions, allowing partial bonding and stress relief through a combination of bonding members and coating films.
The design enhances bonding strength between the translucent member and the substrate while reducing stress, improving stability and light extraction efficiency.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to a light-emitting device.
Background Art
[0002] In a light-emitting device, a configuration is known in which a light-emitting element is disposed in a recess provided in a substrate, and a translucent member is joined to the substrate so as to cover the upper part of the recess.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0004] An object of the present invention is to provide a light-emitting device capable of strengthening the bonding force between a translucent member and a substrate through a bonding member while relaxing the stress on the translucent member.
Means for Solving the Problems
[0005] According to one aspect of the present invention, a light-emitting device includes a substrate having a side wall portion with a first upper surface and a second upper surface surrounded by the side wall portion, a light-emitting element disposed on the second upper surface, a plurality of bonding members separately disposed on the first upper surface, a first region disposed above the first upper surface, and a second region disposed above the second upper surface, a translucent member joined to a part of the first upper surface by the bonding member, and a first coating film provided in the first region of the lower surface of the translucent member, and in the first region, there is a portion where the first coating film is not provided.
Effects of the Invention
[0006] According to the present invention, the light-emitting device can be made to relieve stress on the light-transmitting member while strengthening the bonding force between the light-transmitting member and the substrate via the bonding member. [Brief explanation of the drawing]
[0007] [Figure 1A] This is a schematic top view of a light-emitting device according to one embodiment of the present invention. [Figure 1B] This is a schematic bottom view of a light-emitting device according to one embodiment of the present invention. [Figure 2A] Figure 1 is a schematic cross-sectional view of the IIA-IIA line. [Figure 2B] This is a schematic cross-sectional view showing an enlarged view of the joining member and its surrounding portion in a light-emitting device according to one embodiment of the present invention. [Figure 3] This is a schematic top view of the substrate and light-emitting element of one embodiment of the present invention. [Figure 4] This is a schematic top view showing an example of the arrangement of bonding members in a light-emitting device according to one embodiment of the present invention. [Figure 5] This is a schematic bottom view of a translucent member according to one embodiment of the present invention. [Figure 6] This is a schematic cross-sectional view showing a partially enlarged view of a light-transmitting member according to one embodiment of the present invention. [Figure 7] This is a schematic exploded perspective view showing a jig for forming a first coating film on a translucent member according to one embodiment of the present invention. [Figure 8A] Figure 7 is a schematic bottom view of the jig and the translucent member housed in the jig. [Figure 8B] Figure 8A is a schematic cross-sectional view along the line VIIIB-VIIIB. [Figure 9] Figure 7 is a schematic perspective view of the jig and the translucent member housed within it, showing the upper surface. [Figure 10A] This is a schematic top view showing an example of the arrangement of bonding members in a light-emitting device according to one embodiment of the present invention. [Figure 10B] Figure 10A is a schematic cross-sectional view in the XB-XB region. [Figure 11]It is a schematic top view showing an arrangement example of a joining member in a light-emitting device according to an embodiment of the present invention.
Mode for Carrying Out the Invention
[0008] Hereinafter, embodiments will be described with reference to the drawings. In each drawing, the same components are denoted by the same reference numerals. Note that since each drawing schematically shows the embodiment, the scale, interval, or positional relationship of each member may be exaggerated, part of the member may be omitted, or an end view showing only the cut surface as a cross-sectional view may be used in some cases.
[0009] [First Embodiment] FIG. 1A is a schematic top view of a light-emitting device 1 according to the first embodiment of the present invention. FIG. 1B is a schematic bottom view of the light-emitting device 1. FIG. 2A is a schematic cross-sectional view taken along line IIA-IIA of FIG. 1. FIG. 2B is a schematic cross-sectional view showing an enlarged view of the joining member and its peripheral portion.
[0010] The light-emitting device 1 according to the first embodiment of the present invention includes a substrate 10, a light-emitting element 20, a light-transmissive member 40, and a joining member 30.
[0011] As shown in FIG. 2A, the substrate 10 supports the light-emitting element 20. The substrate 10 includes an insulating base material, a first bottom surface wiring 71, a second bottom surface wiring 72, a first top surface wiring 81, and a second top surface wiring 82. The insulating base material is made of, for example, ceramic. Examples of the ceramic include aluminum nitride, aluminum oxide, and mullite. The substrate 10 has a side wall portion 15 having a first top surface 11 and a second top surface 12 surrounded by the side wall portion 15. A recess is defined by the inner wall surface 16 of the side wall portion 15 and the second top surface 12. The second top surface 12 is the bottom of the recess.
[0012] As shown in FIG. 1A, in a top view, the substrate 10 is substantially rectangular. The substantially rectangular shape is a shape including four sides and four corners. The corners can be a right angle, a rounded shape, or a shape in which a part is removed as shown in FIG. 1A.
[0013] As shown in FIG. 1B, the lower surface 13 of the substrate 10 has a first lower surface wiring 71 and a second lower surface wiring 72. An anode potential is applied to one of the first lower surface wiring 71 and the second lower surface wiring 72, and a cathode potential is applied to the other.
[0014] As shown in FIG. 2A, a light-emitting element 20 is disposed on the second upper surface 12 of the substrate 10. The light-emitting element 20 is located within a space 61 defined by the inner wall surface 16 of the side wall portion 15 of the substrate 10, the second upper surface 12, and the light-transmissive member 40.
[0015] The light-emitting element 20 emits, for example, ultraviolet light. The light-emitting device 1 of the present embodiment can be used, for example, for applications in which a resin material or a glass material is cured by the ultraviolet light emitted by the light-emitting element 20. Note that the light-emitting element 20 may emit visible light.
[0016] FIG. 3 is a top view of the substrate 10 and the light-emitting element 20.
[0017] The second upper surface 12 of the substrate 10 has a first upper surface wiring 81, a second upper surface wiring 82, and a third upper surface wiring 83. The light-emitting element 20 is disposed on the first upper surface wiring 81. A lower surface electrode is disposed on the lower surface of the light-emitting element 20. The lower surface electrode is joined to the first upper surface wiring 81 and electrically connected thereto via, for example, solder or a conductive paste.
[0018] In addition, an upper surface electrode is disposed on the upper surface of the light-emitting element 20. The upper surface electrode is electrically connected to the second upper surface wiring 82 via a metal wire (for example, an Au wire). One of the first upper surface wiring 81 and the second upper surface wiring 82 is electrically connected to one of the first lower surface wiring 71 and the second lower surface wiring 72 disposed on the lower surface 13 of the substrate 10, and the other of the first upper surface wiring 81 and the second upper surface wiring 82 is electrically connected to the other of the first lower surface wiring 71 and the second lower surface wiring 72.
[0019] An ESD (Electrostatic Discharge) protection diode 21 is positioned on the third upper wiring 83. The ESD protection diode 21 is, for example, a Zener diode. A bottom electrode is formed on the lower surface of the ESD protection diode 21. This bottom electrode is joined to the third upper wiring 83, for example, via solder or conductive paste, and is electrically connected to the third upper wiring 83. A top electrode is formed on the upper surface of the ESD protection diode 21. This top electrode is electrically connected to the second upper wiring 82 via a metal wire (for example, an Au wire). The third upper wiring 83 is electrically connected to the bottom wiring of the first lower wiring 71 and the second lower wiring 72 that is connected to the first upper wiring 81.
[0020] As shown in Figure 2A, the light-transmitting member 40 is placed on the base 10 so as to cover the space 61 in which the light-emitting element 20 is located. The light-transmitting member 40 protects the light-emitting element 20 from the outside. The light-transmitting member 40 is transparent to the light emitted by the light-emitting element 20. The light-transmitting member 40 is made of glass (e.g., borosilicate glass), sapphire, or the like.
[0021] The light-transmitting member 40 can be one that functions as a lens to concentrate or diffuse the light emitted by the light-emitting element 20. For example, such a light-transmitting member 40 may have a shape having a convex portion 44, as shown in Figure 2A. The light-transmitting member 40 shown in Figure 1A also has a flange portion 45. In a top view, the flange portion 45 is located between the outer circumference of the convex portion 44 and the corners of the substantially rectangular base body 10. Four flange portions 45 are provided, corresponding to the four corners of the base body 10. In the example shown in Figure 2A, the light-transmitting member 40 has a shape having one convex portion 44 on its upper surface. The light-transmitting member 40 may have a shape having one concave portion on its upper surface, or it may be flat. Multiple convex and concave portions may be arranged.
[0022] As shown in Figure 2A, the lower surface 43 of the light-transmitting member 40 includes a first region 41 positioned above the first upper surface 11 of the base body 10 and a second region 42 positioned above the second upper surface 12. The second region 42 faces the upper surface of the light-emitting element 20, separated by a space 61.
[0023] As will be described later, the lower surface 43 of the translucent member 40 is joined to a part of the first upper surface 11 of the base body 10 by the joining member 30. That is, between the lower surface 43 of the translucent member 40 and the first upper surface 11 of the base body 10, there is a portion where the joining member 30 is located and a portion where the joining member 30 is not located. Figure 2A is an overall cross-sectional view of the light-emitting device 1, including the portion where the joining member 30 is not located. Figure 2B is an enlarged cross-sectional view of the portion where the joining member 30 is located.
[0024] Figure 4 is a top view showing an example of the arrangement of the joining member 30 in the light-emitting device 1 of this embodiment. In Figure 4, the inner wall surface 16 of the side wall portion 15 of the base body 10 is represented by a dashed line. That is, this dashed line is also the boundary between the first region 41 and the second region 42 of the light-transmitting member 40 in a top view.
[0025] The joining member 30 is, for example, a thermosetting resin member. The joining member 30 is placed on the first upper surface 11 of the base body 10 in an uncured state. Multiple joining members 30 are placed on the first upper surface 11, spaced apart from each other along the edges of the base body 10 in a plan view. The area occupied by the joining members 30 on the first upper surface 11 is not particularly limited as long as sufficient bonding strength between the translucent member 40 and the base body 10 can be ensured. Preferably, the proportion of the area occupied by the joining members 30 on the first upper surface 11 is, for example, 20% or more and 80% or less.
[0026] The following describes a method for joining the translucent member 40 and the base body 10 using the joining member 30. After placing the joining member 30 on the first upper surface 11, the translucent member 40 is placed on the base body 10 such that its lower surface 43 faces the upper part of the first upper surface 11 and the space 61. The uncured joining member 30 is placed between the lower surface 43 of the translucent member 40 and the first upper surface 11 of the base body 10. At this time, a portion of the uncured joining member 30 that has been crushed between the lower surface 43 of the translucent member 40 and the first upper surface 11 of the base body 10 spreads into the second region 42 of the translucent member 40. After this, the joining member 30 is cured, for example, by heating.
[0027] In its uncured state, the bonding member 30 may wet up from the first upper surface 11 onto the side surface of the translucent member 40. In this case, the cured bonding member 30 forms a so-called fillet, as shown in Figure 2B. This makes it possible to strengthen the bonding force between the translucent member 40 and the first upper surface 11 of the substrate 10.
[0028] Figure 4 shows an example in which two connecting members 30 are arranged on each side of the base body 10, but one or more connecting members 30 may be arranged on each side of the base body 10. Also, two adjacent connecting members 30 in the direction along the side of the base body 10 may be partially connected to each other. In the example shown in Figure 4, the connecting members 30 are not arranged at the four corners of the roughly rectangular base body 10 or on the perpendicular bisectors of the sides of the base body 10. Alternatively, as shown in Figure 11, they may be arranged at the four corners of the roughly rectangular base body 10 or in the center of the sides of the base body 10.
[0029] The joining member 30 is joined to the first upper surface 11 of the base body 10 and to the first region 41 of the lower surface 43 of the translucent member 40 facing the first upper surface 11. Furthermore, the joining member 30 is also joined to a part of the second region 42. The joining member 30 joined to a part of the second region 42 is located on the upper side within the space 61. It is preferable that the joining member 30 is not positioned in the region above the light-emitting element 20 in the second region 42. For example, in the example shown in Figure 3, the rectangular light-emitting element 20 is positioned rotated 45 degrees relative to the rectangular base body 10 when viewed from above. Each of the four corners of the light-emitting element 20 is positioned on the perpendicular bisector of the side of the base body 10. In contrast, the joining member 30 is not positioned on the perpendicular bisector of the side of the base body 10. This reduces the incidence of light from the light-emitting element 20 onto the joining member 30.
[0030] The joining member 30 is not placed over the entire surface of the first upper surface 11, but only partially. Due to this partial placement of the joining member 30, in the areas where the joining member 30 is not placed, as shown in Figure 2A, there is a gap 62 between the lower surface 43 of the translucent member 40 and the first upper surface 11 of the base body 10, provided by the lower surface 43 of the translucent member 40, the first upper surface 11 of the side wall portion 15, and the joining member 30. The gap 62 penetrates from the space 61 where the light-emitting element 20 is placed to the outside of the light-emitting device 1. That is, the space 61 where the light-emitting element 20 is placed becomes an airtight space with respect to the outside of the light-emitting device 1. In the example shown in Figure 4, three gaps 62 are provided on each side of the base body 10. Alternatively, there may be one gap 62 per side of the base body 10, or there may be two or four or more gaps 62. The height of the gap 62 (the thickness of the joining member 30 between the first upper surface 11 of the side wall portion 15 and the translucent member 40) can be, for example, 1 μm or more and 100 μm or less. Preferably, the height of the gap 62 is 10 μm or more and 50 μm or less. In the case of the first coating film 51 described later, the height of the gap 62 refers to the thickness of the joining member 30 between the first upper surface 11 of the side wall portion 15 and the lower surface of the first coating film 51.
[0031] According to this embodiment, by partially arranging the joining member 30 on the first upper surface 11, the stress applied to the light-transmitting member 40 can be reduced compared to when the joining member 30 is arranged over the entire surface of the first upper surface 11.
[0032] Furthermore, the joining member 30 is positioned not only in the first region 41 of the lower surface 43 of the translucent member 40 located above the first upper surface 11 of the base body 10, but also in the second region 42 located above the second upper surface 12, separated by a space 61. This increases the contact area between the joining member 30 and the lower surface 43 of the translucent member 40, thereby strengthening the bonding force between the joining member 30 and the translucent member 40. In other words, it strengthens the bonding force between the translucent member 40 and the base body 10 via the joining member 30.
[0033] Furthermore, as shown in Figure 4, the multiple joining members 30 include joining members 30 positioned on either side of the center of the lower surface 43 of the translucent member 40 in a plan view. That is, it is preferable that the joining members 30 are not biased to a particular region along the outer circumference of the base body 10. It is also preferable that the portion where the joining members 30 are not arranged is not biased to a particular region along the outer circumference of the base body 10. This makes it easier to suppress excessive stress, especially at the joint between the translucent member 40 and the base body 10, and to maintain a stable joint state.
[0034] A first coating film is placed on the lower surface 43 of the light-transmitting member 40, as described below.
[0035] Figure 5 is a bottom view of the light-transmitting member 40. In Figure 5, the first coating film 51 is shown as a filled-in area. Also in Figure 5, the boundary between the first region 41 and the second region 42 (the area where the inner wall surface 16 of the side wall portion 15 of the substrate 10 is located) is represented by a dashed line. Figure 6 is a schematic cross-sectional view showing a partially enlarged view of the light-transmitting member 40.
[0036] The bonding force between the first coating film 51 and the bonding member 30 is higher than the bonding force between the translucent member 40 and the bonding member 30. In other words, the affinity between the outermost surface material of the first coating film 51 and the material of the bonding member 30 is higher than the affinity between the material of the translucent member 40 and the material of the bonding member 30. As a result, the bonding force between the translucent member 40 and the substrate 10 via the bonding member 30 can be improved compared to the case where the bonding member 30 is bonded to the translucent member 40 without the first coating film 51. The above-mentioned effect of improving bonding force can be obtained by arranging the first coating film 51 in at least the first region 41. Examples of the first coating film 51 include metal layers made from single materials such as gold (Au), silver (Ag), copper (Cu), nickel (Ni), titanium (Ti), chromium (Gr), tin (Sn), aluminum (Al), palladium (Pd), platinum (Pt), rhodium (Rh), tungsten (W), molybdenum (Mo), and iron (Fe), as well as composite materials thereof, and at least one oxide selected from the group consisting of titanium oxide (TiO2), zirconium oxide (ZrO2), tantalum oxide (TaO2), and silicon oxide (SiO2).
[0037] In the example shown in Figure 5, the first coating film 51 is provided over the entire surface of the second region 42 on the lower surface 43 of the light-transmitting member 40 and over most of the first region 41. The proportion of the area occupied by the first coating film 51 in the first region 41 is preferably, for example, 70% to 95%. The first coating film 51 can be an anti-reflective film that suppresses the reflection of light from the light-emitting element 20 at the lower surface 43 of the light-transmitting member 40, and efficiently allows light from the light-emitting element 20 to enter the light-transmitting member 40.
[0038] If the first coating film 51 is an anti-reflective film, for example, it can be a multilayer film containing a first film 51a and a second film 51b that are alternately laminated and have different refractive indices. In this case, the first film 51a and the second film 51b are alternately laminated from the lower surface 43 side of the light-transmitting member 40, and the outermost surface of the first coating film 51 is the second film 51b. For example, the first film 51a is tantalum oxide (Ta2O5) and the second film 51b is silicon oxide (SiO2). Therefore, the outermost surface of the first coating film 51 is silicon oxide.
[0039] The bonding member 30 is bonded to the translucent member 40 via the outermost surface (second film 51b) of the first coating film 51. The affinity between the second film 51b, which is the outermost surface of the first coating film 51, and the resin of the bonding member 30 is higher than the affinity between the material of the translucent member 40 and the resin of the bonding member 30. This improves the bonding strength between the translucent member 40 and the substrate 10.
[0040] As shown in Figure 5, there is a portion 41a in the first region 41 of the lower surface 43 of the translucent member 40 where the first coating film 51 is not provided. Multiple portions 41a where the first coating film 51 is not provided are located on either side of the center of the lower surface 43 in a plan view. For example, as shown in Figure 4, the portion 41a where the first coating film 51 is not provided is located on the lower surface of the flange portion 45 of the translucent member 40. That is, the portions 41a where the first coating film 51 is not provided are located at the four corners of the roughly rectangular base body 10.
[0041] The flange portion 45 of the translucent member 40 and each of the four corners of the base body 10 have portions where the joining member 30 is not placed. On the lower surface 43 of the translucent member 40, the glass constituting the translucent member 40 is exposed in the portion 41a where the first coating film 51 is not provided. The joining member 30 is not placed in the exposed glass portion where its affinity with the joining member 30 is lower than that of the first coating film 51.
[0042] Light from the light-emitting element 20 enters the light-transmitting member 40 from a second region 42 on the lower surface 43 of the light-transmitting member 40 facing the space 61 in which the light-emitting element 20 is located. Therefore, when the first coating film 51 is to function as an anti-reflective film, it is preferable to place it in at least the second region 42. In this embodiment, by forming the first coating film 51 over the entire surface of the second region 42, light from the light-emitting element 20 can be efficiently incident onto the light-transmitting member 40 across the entire surface of the second region 42. This can improve the light extraction efficiency of the light-emitting device 1 by, for example, 2 to 4%.
[0043] The first region 41 of the translucent member 40 facing the first upper surface 11 of the substrate 10 is the region responsible for bonding to the substrate 10 via the bonding member 30, and light from the light-emitting element 20 hardly enters the translucent member 40 through the first region 41. Therefore, from the viewpoint of its function as an anti-reflective film, the first coating film 51 is unnecessary in the first region 41.
[0044] However, according to this embodiment, as described above, the first coating film 51 is also formed on the first region 41 in order to increase the affinity with the joining member 30. That is, the first coating film 51 formed on the first region 41 functions as an adhesion film that enhances adhesion with the joining member 30. A film having anti-reflective properties and high adhesion can be formed on the lower surface 43 of the translucent member 40 in a single film formation process, as will be described later.
[0045] However, the first coating film 51 is not placed over the entire surface of the first region 41, but rather there is a portion 41a in the first region 41 where the first coating film 51 is not provided. As a result, compared to the case where the first coating film 51 is placed over the entire surface of the first region 41, the stress on the light-transmitting member 40 can be reduced and peeling of the first coating film 51 from the lower surface 43 of the light-transmitting member 40 can be suppressed.
[0046] Furthermore, by positioning the portion 41a where the first coating film 51 is not provided on either side of the center of the lower surface 43 in a plan view, the uneven distribution of stress on the translucent member 40 can be suppressed, and stress can be effectively relieved. For example, in the examples shown in Figures 4 and 5, the portion 41a where the first coating film 51 is not provided is not located in the region of the first area 41 that is below the convex portion 44. The portion 41a where the first coating film 51 is not provided is located at the four corners of the substantially rectangular base body 10, in the portions of the four flanges 45. By positioning the portion 41a where the first coating film 51 is not provided in such a location, the uneven distribution of stress on the translucent member 40 can be suppressed, and stress can be effectively relieved. The proportion of the area occupied by the portion 41a where the first coating film 51 is not provided in the first area 41 is not particularly limited, as long as the bonding strength between the translucent member 40 and the base body 10 can be ensured.
[0047] As shown in Figure 6, a second coating film 52, which functions as an anti-reflective coating, can be provided on the upper surface 44a (upper surface of the protrusion 44) of the light-transmitting member 40. The second coating film 52 suppresses reflection at the interface between the upper surface 44a of the light-transmitting member 40 and the outside (air) of the light-transmitting member 40, thereby increasing the efficiency of light extraction from the upper surface 44a of the light-transmitting member 40 to the outside.
[0048] The second coating film 52 is laminated alternately and includes a third film 52a and a fourth film 52b with different refractive indices. The third film 52a and the fourth film 52b are laminated alternately from the upper surface 44a side of the light-transmitting member 40, and the outermost surface of the second coating film 52 is the fourth film 52b. For example, the third film 52a is tantalum oxide (Ta2O5) and the fourth film 52b is silicon oxide (SiO2). Therefore, the outermost surface of the second coating film 52 is silicon oxide.
[0049] If the first coating film 51 is to be formed only on the first region 41 of the lower surface 43 of the light-transmitting member 40, it can be formed, for example, by using a mask and methods such as sputtering or vapor deposition. Next, with reference to Figures 7 to 9, a method for forming the first coating film 51 and the second coating film 52 on the light-transmitting member 40 will be described.
[0050] Figure 7 is an exploded perspective view schematically showing a jig 100 for forming a first coating film 51 and a second coating film 52 on a light-transmitting member 40. Figure 8A is a schematic bottom view of the jig 100 and the translucent member 40 housed within the jig 100. Figure 8B is a schematic cross-sectional view along the line VIIIB-VIIIB in Figure 8A. Figure 9 is a schematic perspective view of the jig 100 and the upper surface 44a side of the translucent member 40 housed in the jig 100. The material of the jig 100 is not particularly limited as long as it can hold the translucent member 40. For example, the jig 100 can be made of brass, stainless steel, etc.
[0051] The jig 100 has a first member 110 and a second member 120, both of which are plate-shaped. A first through hole 112 is formed in the center of the first member 110. The first member 110 is provided with four claw portions 111 that extend from the inner circumference of the first through hole 112 toward the center of the first through hole 112 in a plan view.
[0052] A second through-hole 122 is formed in the center of the second member 120. Around the second through-hole 122, four support portions 121 are provided, which are recessed and create a step between them and the surface 123 of the second member 120.
[0053] As shown in Figure 8B, the translucent member 40 is positioned between the first member 110 and the second member 120. The side of the flange portion 45 of the translucent member 40 facing the convex portion 44 is positioned on the support portion 121 of the second member 120. The convex portion 44 is exposed through the second through hole 122.
[0054] The first member 110 is placed on top of the surface 123 of the second member 120. As shown in Figure 8A, in a plan view of the lower surface 43 of the translucent member 40, the claw portion 111 of the first member 110 covers a portion of the lower surface 43 of the translucent member 40. Most of the lower surface 43 of the translucent member 40, other than the portion covered by the claw portion 111, is exposed through the first through hole 112. In this state, the first coating film 51 is formed on the lower surface 43 of the translucent member 40.
[0055] As a result, as shown in Figure 5, the first coating film 51 is not formed on a portion 41a of the lower surface 43 of the light-transmitting member 40, while the first coating film 51 is formed on the portion other than the portion 41a. The portion 41a on the lower surface 43 of the light-transmitting member 40 where the first coating film 51 is not formed is the portion that was covered by the claw portion 111 of the first member 110 in Figure 8A.
[0056] As shown in Figure 9, the upper surface 44a of the protrusion 44 is exposed from the second member 120. In this state, the second coating film 52 is formed on the upper surface 44a of the protrusion 44. At this time, the claw portion 111 of the first member 110 prevents the light-transmitting member 40 from falling out from the first member 110 side.
[0057] [Second Embodiment] Figure 10A is a top view showing an example of the arrangement of the joining member 30 in the light-emitting device of the second embodiment. Figure 10B is a schematic cross-sectional view along the XB-XB line in Figure 10A.
[0058] In the example shown in Figure 10B, the upper surface of the translucent member 140 is a flat surface. As shown in Figure 10A, the joining members 30 are located at the four corners of the substantially rectangular base body 10. In addition, the joining members 30 are positioned not only in the first region 141 of the lower surface 143 of the translucent member 140, which is located above the first upper surface 11 of the base body 10, but also in the second region 142, which is located above the second upper surface 12 of the base body 10, separated by a space 61. In the light-emitting device of this embodiment as well, stress on the translucent member 140 can be relieved and a stable bonding state can be maintained.
[0059] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. All forms that a person skilled in the art can implement by appropriately modifying the design based on the above-described embodiments of the present invention also fall within the scope of the present invention, insofar as they encompass the gist of the present invention. Furthermore, within the scope of the idea of the present invention, a person skilled in the art can conceive of various modifications and alterations, and these modifications and alterations also fall within the scope of the present invention. [Explanation of Symbols]
[0060] 1...Light-emitting device, 10...Substrate, 11...First upper surface, 12...Second upper surface, 15...Side wall portion, 20...Light-emitting element, 30...Joining member, 40...Translucent member, 41...First region, 42...Second region, 43...Bottom surface, 44...Protrusion, 44a...Upper surface, 51...First coating film, 51a...First film, 51b...Second film, 52...Second coating film, 52a...Third film, 52b...Fourth film, 61...Space, 62...Gap
Claims
1. A base having a side wall portion having a first upper surface and a second upper surface surrounded by the side wall portion, A light-emitting element arranged on the second upper surface, Multiple joining members are arranged at intervals from each other on the first upper surface, A translucent member having a lower surface including a first region positioned above the first upper surface and a second region positioned above the second upper surface, and being joined to a part of the first upper surface by the joining member, The first coating film, which is an anti-reflective film, is provided on the first and second regions of the lower surface of the light-transmitting member, Equipped with, A light-emitting device in which there is a portion of the first region where the first coating film is not provided.
2. The light-emitting device according to claim 1, wherein the joining member is joined to the first region on the lower surface of the light-transmitting member.
3. The light-emitting device according to claim 1 or 2, wherein the portion not provided with the first coating film is located on either side of the center of the lower surface of the light-transmitting member in a plan view of the lower surface.
4. In plan view, the base is approximately rectangular. The portion where the first coating film is not provided is located at the four corners of the substantially rectangular base, as described in claim 3.
5. The light-emitting device according to claim 1 or 2, wherein the joining member is not provided in the portion where the first coating film is not provided.
6. The light-emitting device according to claim 1 or 2, wherein the joining member is joined to the light-transmitting member via the outermost surface of the first coating film.
7. The light-emitting device according to claim 1 or 2, wherein the anti-reflective film is a multilayer film comprising a first film and a second film that are alternately laminated and have different refractive indices.