Photosensitive or radiation-sensitive resin composition, photosensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic devices.

Abstract

Provided is an actinic-ray-sensitive or radiation-sensitive resin composition containing: a resin (P) that has (A) a repeating unit represented by a specific general formula (a) and having a group which breaks down by the action of an acid, thereby generating carboxylic acid, and (B) a repeating unit represented by a specific general formula (b) and having a group which breaks down under exposure to actinic rays or radiation, thereby generating acid; and a solvent, wherein the content of solvent having a boiling point of 150°C or higher with restpect to the total amount of the solvent is 45 mass % or more. Also provided are an actinic ray-sensitive or radiation-sensitive film, a method for forming a pattern, and a method for producing an electronic device that use the actinic-ray-sensitive or radiation-sensitive resin composition.

Claims

1. A photosensitive or radiation-sensitive resin composition containing a resin (P) having the following repeating units (A) and (B), and a solvent, A photosensitive or radiation-sensitive resin composition in which the content of a solvent with a boiling point of 150°C or higher is 45% by mass or more relative to the total amount of the aforementioned solvent. (A) Repeating units represented by the following general formula (a), having a group that decomposes under the action of an acid to produce a carboxylic acid. (B) Repeating units represented by the following general formula (b), having a group that decomposes upon irradiation with active light or radiation to produce acid. 【Chemistry 1】 In general formula (a), R １１ ~R １３ Each of these independently represents a hydrogen atom, an organic group, or a halogen atom. L １１ This represents a divalent aromatic ring group. R １４ ~R １６ Each of these independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, or an alkynyl group. １４ ~R １６ Two of them may be connected to each other to form a ring. R １４ When R is a hydrogen atom, １５ at least one of R １６ represents an alkenyl group. R １４ and R １５ When R is a methyl group, １４ ~R １６ If two of them are not connected to each other, R １６ * represents substituents other than methyl and ethyl groups. In general formula (b), R １７ ~R １９ Each of these independently represents a hydrogen atom, an organic group, or a halogen atom. L １２ This represents a single bond, an alkylene group, an alkenylene group, an alkynylene group, a divalent aliphatic hydrocarbon ring group, a divalent aromatic ring group, or a group formed by a combination of these. Z １１ This represents the site that becomes a sulfonic acid group, imido acid group, or methido acid group upon irradiation with active light or radiation.

2. The photosensitive or radiation-sensitive resin composition according to claim 1, wherein the repeating unit (B) is a repeating unit represented by any of the following general formulas (b-1) to (b-4). 【Chemistry 2】 In general formula (b-1), R ２１ ~R ２３ Each of these independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, or an alkoxycarbonyl group. L ２１ The symbol represents a single bond, an alkylene group, an alkenylene group, an alkynylene group, a divalent aliphatic hydrocarbon ring group, or a divalent aromatic ring group, or a group formed by a combination of these. In general formula (b-2), R ２４ ~R ２６ Each of these independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group. L ２２ This represents a single bond, an alkylene group, an alkenylene group, an alkynylene group, a divalent aliphatic hydrocarbon ring group, or a divalent aromatic ring group, or a group formed by a combination of these. In general formula (b-3), R ２７ ~R ２９ Each of these independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group. L ２３ This represents a single bond, an alkylene group, an alkenylene group, an alkynylene group, a divalent aliphatic hydrocarbon ring group, a divalent aromatic ring group, or a group formed by a combination of these. X ２１ is -CO- or -SO ２ It represents -. R ２１０ represents a substituent. In general formula (b-4), R ２１１ ~R ２１３ Each of these independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group. L ２４ This represents a single bond, an alkylene group, an alkenylene group, an alkynylene group, a divalent aliphatic hydrocarbon ring group, a divalent aromatic ring group, or a group formed by a combination of these. X ２２ ~X ２４ These are, independently, -CO- or -SO-. ２ It represents -. R ２１４ and R ２１５ Each of these independently represents a substituent. M ＋ This represents an organic onium ion.

3. L in general formulas (b-1) to (b-4) ２１ ~L ２４ The photosensitive or radiation-sensitive resin composition according to claim 2, wherein each independently represents a single bond or a divalent aromatic ring group.

4. The photosensitive or radiation-sensitive resin composition according to claim 2, wherein the repeating unit (B) is a repeating unit represented by the general formula (b-2).

5. L in the above general formula (b-2) ２２ The photosensitive or radiation-sensitive resin composition according to claim 4, wherein the group is a phenylene group.

6. L of the above repeating unit (A) １１ A photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5, wherein the group is a phenylene group.

7. The R of the above repeating unit (A) １４ ~R １６ A photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5, wherein the total number of carbon atoms contained therein is 5 to 9.

8. The R of the above repeating unit (A) １４ ~R １６ The photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5, wherein each independently represents an alkyl group or an alkenyl group. １４ ~R １６ Two of these may be connected to each other to form a ring. １４ and R １５ When R is a methyl group, １４ ~R １６ If two of them are not connected to each other, R １６ * represents substituents other than methyl and ethyl groups.

9. The photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5, wherein the content of the repeating unit (A) is 25 mol% to 55 mol% with respect to the total repeating units of the resin (P).

10. The photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5, wherein the resin (P) further comprises a repeating unit (C) represented by the following general formula (c). 【Transformation 3】 In general formula (c), R ６１ ~R ６３ Each of these independently represents a hydrogen atom, an organic group, or a halogen atom. However, R ６２ It may also be bonded to Ar to form a ring, in which case R ６２ This represents a single bond or an alkylene group. L represents a single bond or a divalent linking group. Ar represents an aromatic ring group with (k+1) valency, R ６２ When it combines with another compound to form a ring, it represents a (k+2) valent aromatic ring group. k represents an integer between 1 and 5.

11. The photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5, wherein the content of a solvent with a boiling point of 150°C or higher relative to the total amount of the aforementioned solvent is 90% by mass or more.

12. The photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5, wherein the solvent with a boiling point of 150°C or higher contains a solvent having a hydroxyl group.

13. A photosensitive or radiation-sensitive film formed from a photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5.

14. A pattern forming method comprising: a photosensitive or radiation-sensitive film forming step of forming a photosensitive or radiation-sensitive film using a photosensitive or radiation-sensitive resin composition according to any one of claims 1 to 5; an exposure step of exposing the photosensitive or radiation-sensitive film; and a development step of developing the exposed photosensitive or radiation-sensitive film using a developer.

15. A method for manufacturing an electronic device, comprising the pattern formation method described in claim 14.

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