Processing method and processing apparatus

JP7880692B2Active Publication Date: 2026-06-26DISCO CORP
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Patent Information

Application Number
JP2021196335
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-02
Publication Date
2026-06-26
Estimated Expiration
2041-12-02

AI Technical Summary

Technical Problem

Conventional processing methods and apparatuses face the issue of processing chips adhering to the holding member and potentially reattaching to the workpiece during processing, leading to contamination in subsequent processes.

Method used

A processing method and apparatus that utilize a holding member with an adhesive layer, where the adhesive strength is reduced using ultraviolet light before processing, and a combination of processing and cleaning water is supplied to prevent debris adherence, including the use of air in cleaning water to enhance debris removal.

Benefits of technology

Prevents processing debris from adhering to the holding member, thereby maintaining cleanliness and reducing contamination during processing operations.

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Patent Text Reader

Abstract

To prevent processed waste from adhering to a holding member when a workpiece is processed by using the holding member.SOLUTION: A processing method includes: a holding step in which a workpiece 200 supported by a holding member 211 on a frame 210 is held on a holding table 6; and a processing step in which the workpiece 200 held on the holding table 6 is processed by a process unit 20. In the processing step, washing water 700 is supplied to an exposed area 230 of the holding member 211 which is exposed between the workpiece 200 and the frame 210.SELECTED DRAWING: Figure 3
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Citation Information

Patent Citations

  • Wafer processing device

    CN207353224U

  • Dicing method

    JP2000164537A

  • Machining method for workpiece

    JP2002299295A

  • Processing method

    JP2012074658A

  • Method for cutting by cutting tool

    JP2013184240A