Electronic devices

Abstract

To provide a foldable electronic device having high heat dissipation performance. [Solution] The electronic device includes a display including a first region and a second region, a first housing forming a first space located behind the first region, a second housing forming a second space located behind the second region, a hinge assembly that enables the first region and the second region to be in a first state in which they form the same plane or a second state in which they face each other, and a plurality of front heat dissipation members that form a heat conduction path between the hinge assembly and the display.

Description

Technical Field

[0001] The present invention relates to an electronic device.

Background Art

[0002] In recent years, electronic devices have been transformed into shapes with various designs and functions, not only the uniform longitudinal shape to satisfy consumers' purchase needs. For example, electronic devices are being studied in a foldable type that can be deformed in size according to the usage state. As the performance of electronic devices improves, the improvement of the heat dissipation function to lower the internal temperature has emerged as a major problem.

[0003] The above information is provided only as background information to assist in understanding the disclosure of this specification. It is clarified that no determination or assertion has been made as to whether the above information is applied as prior art to the content disclosed in this specification.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An electronic device releases heat to the outside through a display. However, in the case of a foldable type of electronic device, since the exposed surface of the display decreases in the folded state, the internal temperature rises compared to the unfolded state. In the case of a foldable type of electronic device, a member having rigidity is provided separated around the folding axis so as to be folded in accordance with the folding operation. Such a separation structure can reduce the heat transfer rate between them.

[0005] An object of the present invention is to provide a foldable electronic device.

[0006] Another object of the present invention is to ensure high heat dissipation performance by dispersing heat throughout the electronic device.

[0007] The objective of this invention is to improve the heat dissipation effect through heat conduction. [Means for solving the problem]

[0008] An electronic device according to one aspect of the present invention includes a display including a first region and a second region; a first housing forming a first space located behind the first region; a second housing forming a second space located behind the second region; a hinge assembly causing the first and second regions to be in a first state where they form the same plane or in a second state where they face each other; and a plurality of forward heat dissipation members forming a heat conduction path between the hinge assembly and the display, wherein the hinge assembly includes a hinge plate set including a first hinge plate connected to the first housing and a second hinge plate connected to the second housing; a hinge that rotatably connects the first and second hinge plates about a folding axis; a hinge housing to which the hinge is fixed and which connects the hinge plate set; and a flexible circuit board, at least a portion of which is disposed between the hinge plate set and the hinge housing, with both ends extending into the first and second spaces, wherein the forward heat dissipation members are arranged on the surface of the hinge plate set so as to face the display.

[0009] An electronic device according to one embodiment of the present invention includes a display including a first region and a second region that can be folded via a folding axis; a first support plate located in the rear direction of the first region; a second support plate located in the rear direction of the second region; a hinge housing to which a hinge that rotates the first and second support plates around the folding axis is fixed and which is arranged along the folding axis and connects the first and second support plates; a first hinge plate connecting the hinge housing and the first support plate; and a second hinge plate connecting the hinge housing and the second support plate. The device includes a hinge plate set, a first printed circuit board positioned in the opposite direction to the first region with respect to the first support plate, a second printed circuit board positioned in the opposite direction to the second region with respect to the second support plate, a flexible circuit board positioned to traverse the first and second regions via the space between the hinge plate and the hinge housing and connecting the first and second printed circuit boards, and a first and second front heat dissipation member positioned between the hinge plate set and the display and forming heat conduction paths between the first and second regions of the display and the hinge plate set, respectively. [Effects of the Invention]

[0010] According to the present invention, the heat dissipation performance of an electronic device can be improved by distributing heat equally throughout the electronic device via a flexible circuit board that connects the folding regions of the electronic device and a thermally conductive member placed between the flexible circuit board and the display. [Brief explanation of the drawing]

[0011] [Figure 1] This is a block diagram of electronic devices in a network environment according to one embodiment of the present invention. [Figure 2A] This is a diagram illustrating the usage state of an electronic device according to one embodiment of the present invention. [Figure 2B]This is a diagram illustrating the usage state of an electronic device according to one embodiment of the present invention. [Figure 3A] This is a perspective view of a disassembled electronic device according to one embodiment of the present invention. [Figure 3B] This is a perspective view of a disassembled electronic device according to one embodiment of the present invention. [Figure 4A] This is a diagram showing the placement position of a front heat dissipation member in an electronic device according to one embodiment of the present invention. [Figure 4B] This is a diagram showing the placement of a rear heat dissipation member in an electronic device according to one embodiment of the present invention. [Figure 5A] This diagram shows the arrangement relationship between the front heat dissipation member and the rear heat dissipation member with respect to the hinge plate in an electronic device according to one embodiment of the present invention. [Figure 5B] Figure 5A is a cross-sectional view of the electronic device along the Vb-Vb line shown. [Figure 6A] This is a cross-sectional view of an electronic device according to one embodiment of the present invention in an unfolded state. [Figure 6B] This is a cross-sectional view of an electronic device according to one embodiment of the present invention in a folded state. [Figure 7A] This is a partially exploded perspective view showing a heat dissipation sheet placed between a display and a backplate in an electronic device according to one embodiment of the present invention. [Figure 7B] This figure shows the relative arrangement of the heat dissipation sheet and the front heat dissipation member in an electronic device according to one embodiment of the present invention. [Figure 7C] Figure 7B is a partial cross-sectional view of an electronic device along the VIIc-VIIc line shown in Figure 7B. [Figure 8A] This figure shows a hinge plate set according to one embodiment of the present invention placed in a hinge assembly. [Figure 8B] This is a partial perspective view showing a hinge plate set according to one embodiment of the present invention positioned in a hinge assembly. [Figure 8C] Figure 8A is a partial cross-sectional view of the electronic device along the VIIIc-VIIIc line shown. [Figure 9A]A partial cross-sectional view of an electronic device according to an embodiment of the present invention. [Figure 9B] A perspective view of a flexible circuit board according to an embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0012] Hereinafter, specific examples of embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the description with reference to the drawings, the same reference numerals are given to the same components regardless of the reference signs, and redundant descriptions thereof are omitted.

[0013] FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present invention.

[0014] Referring to FIG. 1, the electronic device 101 in the network environment 100 communicates with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network) or communicates with at least one of the external electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 communicates with the external electronic device 104 via the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an acoustic output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module 196, or an antenna module 197. In any embodiment, at least one of these components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more different components may be added. In any embodiment, some of these components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) may be integrated into one component (e.g., the display module 160).

[0015] Processor 120 executes software (e.g., program 140), for example, to control at least one other component (e.g., a hardware or software component) of the electronic device 101 connected to the processor 120 and perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, processor 120 stores instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, processes the instructions or data stored in volatile memory 132, and stores the resulting data in non-volatile memory 134. According to one embodiment, processor 120 includes main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor 121. For example, when the electronic device 101 includes main processor 121 and auxiliary processor 123, auxiliary processor 123 may use less power than main processor 121 or may be set to be specialized for a specified function. Auxiliary processor 123 may be implemented separately from or as part of main processor 121.

[0016] The auxiliary processor 123 controls, for example, at least part of the functions or states of at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) on behalf of the main processor 121 when the main processor 121 is inactive (e.g., sleep), or together with the main processor 121 when the main processor 121 is active (e.g., application execution). According to one embodiment, the auxiliary processor 123 (e.g., image signal processing unit or communication processor) may be embodied as part of other functionally related components (e.g., camera module 180 or communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., neural network processing unit) includes a hardware structure dedicated to processing an artificial intelligence model. The artificial intelligence model is generated through machine learning. Such learning may be performed, for example, as the electronic device 101 on which the artificial intelligence model is executed, or via a separate server (e.g., server 108). Learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. Artificial intelligence models include multiple artificial neural network layers. Artificial neural networks may be, but are not limited to, deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), deep Q-networks, or one of two or more combinations of the above.Artificial intelligence models may include software structures in addition to or as an alternative to hardware structures.

[0017] Memory 130 stores various data used by at least one component of the electronic device 101 (e.g., processor 120 or sensor module 176). The data includes, for example, software (e.g., program 140) and input or output data for instructions thereon. Memory 130 includes volatile memory 132 or non-volatile memory 134.

[0018] The program 140 is stored as software in memory 130 and includes, for example, an operating system 142, middleware 144, or an application 146.

[0019] The input module 150 receives instructions or data used by components of the electronic device 101 (e.g., processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0020] The acoustic output module 155 outputs an acoustic signal to the outside of the electronic device 101. The acoustic output module 155 may include, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback or recording and playback. The receiver is used to receive incoming telephone calls. According to one embodiment, the receiver may be embodied separately from or as part of the speaker.

[0021] The display module 160 provides information visually to an external party (e.g., a user) outside of the electronic device 101. The display module 160 includes, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 includes a touch sensor configured to detect touches, or a pressure sensor configured to measure the intensity of the force generated by a touch.

[0022] The audio module 170 converts sound into electrical signals, and conversely, converts electrical signals into sound. According to one embodiment, the audio module 170 acquires sound via the input module 150 and outputs sound via the acoustic output module 155 or an external electronic device (e.g., electronic device 102) (e.g., speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0023] The sensor module 176 detects the operating state of the electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0024] Interface 177 supports one or more designated protocols used for the electronic device 101 to connect directly or wirelessly to an external electronic device (e.g., electronic device 102). According to one embodiment, interface 177 may include, for example, HDMI® (high definition multimedia interface), USB (universal serial bus) interface, SD card interface, or audio interface.

[0025] The connection terminal 178 includes a connector through which the electronic device 101 is physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connection terminal 178 includes, for example, an HDMI® connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0026] The haptic module 179 converts electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that the user can perceive through touch or kinesthetic sense. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0027] The camera module 180 captures still images and videos. According to one embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0028] The power management module 188 manages the power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be embodied, for example, as at least part of a PMIC (power management integrated circuit).

[0029] The battery 189 supplies power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0030] The communication module 190 assists in establishing a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and in executing communication through the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) or wireless communication. According to one embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). The relevant communication module among these communication modules communicates with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth®, WiFi® (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). These various types of communication modules may be incorporated into a single component (e.g., a single chip) or embodied in multiple separate components (e.g., multiple chips). The wireless communication module 192 verifies or authenticates the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., an International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.

[0031] The wireless communication module 192 supports 5G networks and next-generation communication technologies beyond 4G networks, such as NR (new radio access) technology. NR technology supports high-speed transmission of large amounts of data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports high-frequency bands (e.g., mmWave bands) to achieve high data transmission rates, for example. The wireless communication module 192 supports various technologies to ensure performance in high-frequency bands, such as beamforming, massive array multiplexing and multiple-output (massive MIMO (multiple-input and multiple-output)), full-dimensional multiplexing and multiplexing (FD-MIMO), array antennas, analog beamforming, or large-scale antennas. The wireless communication module 192 supports various requirements specified in the electronic device 101, external electronic devices (e.g., electronic device 104), or network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports a peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., 0.5 ms or less for both downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0032] The antenna module 197 transmits or receives signals or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module 197 includes an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In such a case, at least one antenna suitable for a communication scheme used in a communication network such as a first network 198 or a second network 199 may be selected from the plurality of antennas, for example, by the communication module 190. Signals or power are transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to one embodiment, other components besides the radiator (e.g., an RFIC (radio frequency integrated circuit)) may be further formed as part of the antenna module 197.

[0033] According to various embodiments, the antenna module 197 may form an mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board to support a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., the top or side surface) of the printed circuit board to transmit or receive signals in the specified high-frequency band.

[0034] At least some of the above components are connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., instructions or data) with each other.

[0035] According to one embodiment, commands or data are transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to a second network 199. Each of the external electronic devices 102 or 104 may be the same type of device as the electronic device 101 or a different type of device. According to one embodiment, all or part of the operations performed by the electronic device 101 may be performed by one or more external electronic devices 102, 104, or 108. For example, if the electronic device 101 must perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 may, instead of performing the function or service autonomously, or additionally, request one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive the request perform at least part of the requested function or service, or additional functions or services related to the request, and communicate the result of the execution to the electronic device 101. The electronic device 101 processes the results either as is or additionally and provides them as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology is used. The electronic device 101 provides ultra-low latency services using, for example, distributed computing or mobile edge computing. In other embodiments, the external electronic device 104 may include IoT (Internet of Things) devices. The server 108 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 may be included within the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0036] The electronic devices disclosed herein according to various embodiments are of various forms. These electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices according to embodiments of the present invention are not limited to the devices described above.

[0037] The various embodiments and the terminology used herein are not intended to limit us to embodiments that identify the technical features of the invention as described herein, but should be understood to include various modifications, equivalents, or substitutes of the applicable embodiments. In relation to the description of the drawings, similar or related reference numerals are used for similar or related components. The singular form of a noun corresponding to an item includes one or more of the item unless indicated otherwise in the relevant context. In this specification, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” includes any one of the items listed together with the applicable phrase in that phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first” or “second” are used merely to distinguish a component from other components and do not limit the component in any other respect (e.g., importance or order). When either component (e.g., component 1) is referred to as "coupled" or "connected" with or without the terms "functionally" or "communically" with or without such terms, it means that either component is connected to the other component directly (e.g., by wire), wirelessly, or via component 3.

[0038] As used in various embodiments of this specification, the term “module” may include units embodied in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module is a component configured as a whole, or the smallest unit or part thereof of a component performing one or more functions. For example, according to one embodiment, a module can be embodied in the form of an ASIC (application-specific integrated circuit).

[0039] Various embodiments of this specification can be implemented as software (e.g., program 140) containing one or more instruction words stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) invokes and executes at least one instruction from the one or more instruction words stored in the storage medium. This allows the machine to operate to perform at least one function depending on the at least one instruction word invoked. The one or more instruction words include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, "non-temporary" simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves). This term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0040] According to one embodiment, the methods according to the various embodiments disclosed herein are provided in a computer program product. The computer program product is traded as a commodity between a seller and a buyer. The computer program product is distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or online (e.g., downloaded or uploaded) via an application store (e.g., Play Store) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily generated in a device-readable storage medium such as the memory of a manufacturer's server, an application store server, or an intermediary server.

[0041] In various embodiments, each of the components described above (e.g., a module or a program) may include one or more individuals, and some of the individuals may be separated and placed in other components. In various embodiments, one or more components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component performs one or more functions of each of the multiple components in the same or similar manner as those performed by the respective components of the multiple components prior to the integration. In various embodiments, operations performed by a module, program or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order, omitted, or one or more other operations may be added.

[0042] Figures 2A and 2B show the usage state of an electronic device according to one embodiment of the present invention, and Figures 3A and 3B are exploded perspective views of the electronic device according to one embodiment of the present invention.

[0043] Referring to Figures 2, 3A, and 3B, an electronic device 20 according to one embodiment (for example, the electronic device 101 in Figure 1) can be modified in form depending on the usage conditions. For example, the electronic device 20 is provided in a foldable type that can be folded and unfolded at the user's discretion.

[0044] In one embodiment, the electronic device 20 includes a display 210, a backplate set 350, a first housing 220, a second housing 230, a hinge assembly 240, a printed circuit board 360, a front heat dissipation member 370, and a rear heat dissipation member 380. On the other hand, in this specification, the surface on which the display 210 is exposed to the outside is defined as the front of the electronic device 20 and the display 210, and the opposite surface of the front is defined as the rear of the electronic device 20 and the display 210. Furthermore, the surface surrounding the space between the front and rear of the electronic device 20 is defined as the side of the electronic device 20.

[0045] The display 210 displays visual information (e.g., text, video, and / or images) to the user. In one embodiment, at least a portion of the display 210 may be deformed into a planar or curved surface so that its own shape is deformed in response to the deformation of the electronic device 20. In one embodiment, the display 210 includes an axial region 213 where the folding axis A is located, a first region 211 located on one side of the axial region 213 (e.g., the left region of the axial region 213 in Figure 2A), and a second region 212 located on the other side of the axial region 213 (e.g., the right region of the axial region 213 in Figure 2A). In this case, the overall shape of the display 210 is deformed in response to the opening and closing operation of the electronic device 20 by adjusting the angle formed by the first region 211 and the second region 212 via the deformation of the axial region 213. For example, the display 210 may be transformed to a first state in which the first region 211 and the second region 212 form substantially the same plane (e.g., the unfolded state in Figure 2A), a second state in which the first region 211 and the second region 212 face each other (e.g., the folded state in Figure 2B), or an intermediate state in which the first region 211 and the second region 212 form a predetermined angle between the first and second states.

[0046] In one embodiment, the first region 211 and the second region 212 of the display 210 have a shape that is symmetrical overall with respect to the axial region 213. However, the first region 211 or the second region 212 may have a partially asymmetrical shape by including a notched region that is partially cut out so that other components (e.g., a camera, a sensor, etc.) can be exposed on the front surface of the electronic device 20.

[0047] On the other hand, the above-described division of the display 210 is illustrative, and the display 210 may be divided into multiple regions depending on the functions and structure required of the electronic device 20. For example, in Figure 2, the regions of the display 210 are divided based on a folding axis A parallel to the y-axis or a central region, but in other embodiments, the display 210 may be divided based on a different folding axis A (for example, a region parallel to the x-axis).

[0048] In one embodiment, the display 210 includes a display panel, a touch panel, a polarizing film, and a window layer. The display panel, touch panel, polarizing film, and window layer may be bonded together with a pressure-sensitive adhesive (PSA). In one embodiment, a cushion layer may be attached to the rear surface of the display panel to absorb impacts applied to the display 210.

[0049] In one embodiment, the display panel includes a display substrate, a plurality of display elements bonded to the display substrate, one or more conductive lines bonded to the display substrate and electrically connected to the plurality of display elements, and a thin film sealing layer.

[0050] The display substrate is formed from a flexible material, such as a plastic material like polyimide (PI), but the material of the display substrate is not limited to this and may include various materials with flexible properties. Multiple display elements are arranged on the display substrate to form some pixels. For example, multiple display elements are arranged in a matrix on the display substrate to form pixels of the display panel. In this case, the multiple display elements may include fluorescent or organic fluorescent materials that can express color. For example, the elements of display 210 include organic light-emitting diodes (OLEDs). Conductive lines include one or more gate signal lines or one or more data signal lines. For example, the conductive lines may include multiple gate signal lines and multiple data signal lines, and the multiple gate signal lines and multiple data signal lines may be arranged in a matrix. In this case, the multiple display elements are arranged adjacent to the points where the multiple lines intersect and are electrically connected to each line. A thin film sealing layer prevents the inflow of oxygen and moisture from the outside by covering the display substrate, the multiple display elements, and the conductive lines. In one embodiment, the thin film sealing layer can be formed by laminating one or more organic film layers and one or more inorganic film layers alternately.

[0051] In one embodiment, the touch panel may be integrally formed with or attached to the display panel. For example, the touch panel may be formed by patterning an aluminum metal mesh sensor onto a thin film sealing layer of the display panel.

[0052] In one embodiment, the polarizing film may be laminated between the display panel and the touch panel. The polarizing film can improve the visibility of the display 210. The polarizing film changes the phase of light transmitted through the display 210. For example, the polarizing film prevents reflection of light incident on the display panel by switching linearly polarized light to circularly polarized light or changing circularly polarized light to linearly polarized light.

[0053] The window layer may be formed from a transparent plastic film having high flexibility and high hardness. For example, the window layer may be formed from a polyimide (PI) or polyethylene terephthalate (PET) film. In one embodiment, the window layer may be formed from a multilayer including multiple plastic films.

[0054] The backplate set 350 supports the back of the display 210. In one embodiment, the backplate set 350 may be formed from a thin sheet and shaped to correspond to the display 210. In one embodiment, the backplate includes a first backplate 351 that supports the back of a first region 211 of the display 210, and a second backplate 352 that supports the back of a second region 212 of the display 210. In one embodiment, the first backplate 351 and the second backplate 352 are separated by a gap. For example, the first backplate 351 and the second backplate 352 are attached separately to the backs of the first region 211 and the second region 212 of the display 210 so as not to contact each other along the folding axis A. With such a structure, even when the backplate set 350 is attached to the display 210, it is possible to prevent interference with the folding operation of the display 210 with respect to the folding axis A.

[0055] In one embodiment, the first backplate 351 and the second backplate 352 may be formed of a conductive material, such as copper or a copper-containing alloy. In this case, each of the first backplate 351 and the second backplate 352 improves the impact resistance of the display 210 and at the same time serves as a heat transfer path for transferring heat to the first region 211 and the second region 212 of the display 210.

[0056] The first housing 220 and the second housing 230 form the exterior of the electronic device 20. In one embodiment, the first housing 220 and the second housing 230 are connected together with a hinge assembly 240 to form the rear of the electronic device 20. The first housing 220 and the second housing 230 each include a front, a rear, and sides that partially cover the space between the front and rear. In this case, the fronts of the first housing 220 and the second housing 230 are formed with a large area open so that the display 210 is exposed. On the other hand, the structure of the first housing 220 and the second housing 230 is not limited to the form and combination shown in Figure 3A, and may be embodied by other shapes and combinations and / or combinations of parts. For example, although Figure 3A shows the sides and rear of each housing formed integrally, each housing may be provided by the combination of separate members that cover the sides and rear of the electronic device 20, respectively.

[0057] In one embodiment, the first housing 220 and the second housing 230 fix and support the internal components of the electronic device 20. For example, the first housing 220 and the second housing 230 form a space on which a display 210, a hinge assembly 240, a printed circuit board 360, etc. are placed, and fix and support the placed components. In one embodiment, the first housing 220 forms a first space 221 located behind the first region 211 of the display 210, and the second housing 230 forms a second space 231 located behind the second region 212 of the display 210. The first space 221 and the second space 231, when combined with the first housing 220 and the second housing 230, form a single space on which the entire display 210 is placed.

[0058] The hinge assembly 240 enables the folding operation of the electronic device 20. In one embodiment, the hinge assembly 240 folds the first region 211 and the second region 212 of the display 210 around the folding axis A so that the first region 211 and the second region 212 are located on the same plane or are facing each other in a second state. The hinge assembly 240 includes a support plate 343 (first support plate 3431 and second support plate 3432), a hinge 341, a hinge housing 342, a hinge plate set 344, a first printed circuit board 361, a second printed circuit board 362, and a flexible circuit board 345.

[0059] In one embodiment, the first support plate 3431 and the second support plate 3432 are positioned in the direction of the rear of the first region 211 and the second region 212 of the display 210, respectively. For example, the first support plate 3431 and the second support plate 3432 are connected to the first housing 220 and the second housing 230, respectively, so as to be located on the rear of the display 210. In this case, the first support plate 3431 is connected to the first housing 220 so as to be inserted into the first space 221 formed by the first housing 220, and the second support plate 3432 is connected to the second housing 230 so as to be inserted into the second space 231 formed by the second housing 230. Each of the first support plate 3431 and the second support plate 3432 is formed in a portion that connects to the hinge housing 342 and includes through-holes 3431a and 3432a for the passage of a flexible circuit board 345, which will be described later.

[0060] The hinge 341 can rotate the first support plate 3431 and the second support plate 3432 around the folding axis A. In one embodiment, there may be one or more hinges 341. For example, there may be two hinges 341 as shown in Figure 3A. In this case, one or more hinges 341 may be positioned between the first support plate 3431 and the second support plate 3432. In one embodiment, when facing the front of the display 210, one or more hinges 341 are positioned to overlap the folding axis A. With the first support plate 3431 and the second support plate 3432 connected to the first housing 220 and the second housing 230, respectively, the hinge 341 can rotate the first housing 220 and the second housing 230 around the folding axis A via the first support plate 3431 and the second support plate 3432.

[0061] The hinge housing 342 rotatably connects the first support plate 3431 and the second support plate 3432 and fixes one or more hinges 341. The hinge housing 342 includes a front, a rear, and sides that partially enclose the space between the front and rear. In this case, the hinge housing 342 includes a housing space in which a portion of the front surface is recessed toward the rear surface. In one embodiment, the sides and rear surface of the hinge housing 342 include a curved shape. In this case, the curved shape formed by the hinge housing 342 has a straight shape when viewed from the longitudinal direction of the hinge housing 342 (e.g., the y-axis in Figure 3A), but has a shape substantially similar to a semicircle when viewed from a cross section perpendicular to the width direction (e.g., the x-axis in Figure 3A).

[0062] In one embodiment, the hinge housing 342 may be positioned between the first housing 220 and the second housing 230 along the folding axis A. The hinge housing 342 rotatably connects the first support plate 3431 and the second support plate 3432. For example, with respect to the folding axis A, the first support plate 3431 is rotatably connected to one side of the hinge housing 342 (e.g., the left side of the hinge housing 342 in Figure 3B), and the second support plate 3432 is rotatably connected to the other side of the hinge housing 342 (e.g., the right side of the hinge housing 342 in Figure 3B). In one embodiment, the hinge housing 342 covers the outer surface of the electronic device 20 so that the components of the hinge assembly 240, including the hinge 341, are not exposed to the outside. For example, the hinge housing 342 covers the space between the first housing 220 and the second housing 230. In one embodiment, the hinge housing 342 may be covered by the first housing 220 and the second housing 230 (for example, in the extended state shown in Figure 2A) or exposed to the outside to cover the space between the first housing 220 and the second housing 230 (for example, in the folded state shown in Figure 2B), depending on the operating state of the electronic device 20.

[0063] The hinge plate set 344 includes a first hinge plate 3441 connected to the first housing 220 and a second hinge plate 3442 connected to the second housing 230. For example, the first hinge plate 3441 connects a first support plate 3431 connected to the first housing 220 to the hinge housing 342, and the second hinge plate 3442 connects a second support plate 3432 connected to the second housing 230 to the hinge housing 342. In one embodiment, the hinge plate set 344 is positioned on the front of the hinge housing 342. In this case, the first hinge plate 3441 and the second hinge plate 3442 may be positioned symmetrically with respect to the folding axis A, in other words, facing each other when the electronic device 20 is folded. For example, the first hinge plate 3441 is located in the rear direction of the first region 211 of the display 210, and the second hinge plate 3442 is located in the rear direction of the second region 212 of the display 210, separated and connected to the hinge housing 342.

[0064] In one embodiment, the hinge plate set 344 covers the connection portion between the first support plate 3431 and the second support plate 3432 and the hinge housing 342, and also serves to protect the flexible circuit board 345 located in the hinge housing 342.

[0065] In one embodiment, the first printed circuit board 361 and the second printed circuit board 362 are arranged in the first space 221 formed by the first housing 220 and the second space 231 formed by the second housing 230, respectively. In this case, the first printed circuit board 361 is positioned in the direction opposite to the first region 211 of the display 210 with respect to the first support plate 3431, and the second printed circuit board 362 is positioned in the direction opposite to the second region 212 of the display 210 with respect to the second support plate 3432. Elements for realizing the functions of the electronic device 20 are mounted on each printed circuit board 360.

[0066] In one embodiment, the flexible circuit board 345 connects component elements arranged in the first space 221 and the second space 231. For example, the flexible circuit board 345 is arranged to traverse the first space 221 and the second space 231 and connects the first printed circuit board 361 and the second printed circuit board 362. In one embodiment, at least a portion of the flexible circuit board 345 may be arranged between the hinge plate set 344 and the hinge housing 342. For example, the flexible circuit board 345 includes a bending region provided in the housing space of the hinge housing 342. In this case, the portion of the flexible circuit board 345 extending to one end of the bending region passes between the first hinge plate 3441 and the hinge housing 342 and extends into the first space 221, and the portion extending to the other end of the bending region passes between the second hinge plate 3442 and the hinge housing 342 and extends into the second space 231. In one embodiment, both ends of the flexible circuit board 345 extending into the first space 221 and the second space 231 are connected to the first printed circuit board 361 and the second printed circuit board 362 via through-holes 3431a and 3432a formed in the first support plate 3431 and the second support plate 3432, respectively.

[0067] In one embodiment, one or more flexible circuit boards 345 may be provided. For example, the electronic device 20 includes two flexible circuit boards 345, as shown in Figures 3A and 3B. If multiple flexible circuit boards 345 are provided, the multiple flexible circuit boards 345 connect the first printed circuit board 361 and the second printed circuit board 362, respectively, spaced apart from each other.

[0068] The front heat dissipation member 370 and the rear heat dissipation member 380 form a heat transfer path inside the electronic device 20 so that heat generated inside the electronic device 20 can be dissipated throughout the electronic device 20. For example, the front heat dissipation member 370 and the rear heat dissipation member 380 form a heat conduction path inside the electronic device 20 so that heat generated in the internal components of the electronic device 20 is released through the display 210. In one embodiment, the front heat dissipation member 370 and the rear heat dissipation member 380 include a material with high thermal conductivity to efficiently transfer heat.

[0069] In one embodiment, the front heat dissipation member 370 forms a heat conduction path toward the display 210 with respect to the hinge plates 3441 and 3442 (for example, in the +z axis direction), and the rear heat dissipation member 380 forms a heat conduction path toward the opposite direction from the display 210 with respect to the hinge plates (first hinge plate 3441, second hinge plate 3442) (for example, in the -z axis direction).

[0070] Figure 4A is a diagram showing the placement position of the front heat dissipation member in an electronic device according to one embodiment of the present invention, and Figure 4B is a diagram showing the placement position of the rear heat dissipation member in an electronic device according to one embodiment of the present invention.

[0071] Referring to Figures 4A and 4B, in one embodiment, the front heat dissipation member 370 and the rear heat dissipation member 380 dissipate heat generated by components housed inside the electronic device 20 to the display 210 by thermal conduction. In one embodiment, the front heat dissipation member 370 and the rear heat dissipation member 380 form a heat conduction path connecting the flexible circuit board 345 to the display 210.

[0072] In one embodiment, the front heat dissipation member 370 forms a heat conduction path between the hinge plate set 344 and the display 210. The front heat dissipation member 370 is positioned on the surface of the hinge plate set 344 so as to face the display 210. In one embodiment, the front heat dissipation member 370 includes a first front heat dissipation member 371 positioned on the surface of a first hinge plate 3441, and a second front heat dissipation member 372 positioned on the surface of a second hinge plate 3442. In this case, the first front heat dissipation member 371 may be positioned between a first region 211 of the display 210 and the first hinge plate 3441, and the second front heat dissipation member 372 may be positioned between a second region 212 of the display 210 and the second hinge plate 3442.

[0073] In one embodiment, when the back of the display 210 is supported by a backplate set 350, the front heat dissipation member 370 may be positioned between the hinge plate set 344 and the backplate set 350. In this case, the front heat dissipation member 370 physically connects the hinge plate set 344 and the backplate set 350 to form a heat conduction path. For example, the first front heat dissipation member 371 has both sides in contact with the first hinge plate 3441 and the first backplate 351, respectively, and the second front heat dissipation member 372 has both sides in contact with the second hinge plate 3442 and the second backplate 352, respectively. With such a structure, the front heat dissipation member 370 forms a heat conduction path to the first region 211 and the second region 212 of the display 210, respectively. The backplate set 350 supports the display 210 in two separate regions, the first region 211 and the second region 212, via a first backplate 351 and a second backplate 352, which are separated from each other, in order to minimize interference with the folding of the display 210. In this case, the first front heat dissipation member 371 transfers heat to the first backplate 351, and the second front heat dissipation member 372 transfers heat to the second backplate 352, thereby enabling even heat distribution to the first region 211 and the second region 212 of the display 210.

[0074] In one embodiment, the first front heat dissipation member 371 and the second front heat dissipation member 372 may be arranged symmetrically with respect to the folding axis A. For example, the first front heat dissipation member 371 and the second front heat dissipation member 372 may be arranged at the same distance from the folding axis A when facing the front of the display 210. In one embodiment, there may be multiple first front heat dissipation members 371 and second front heat dissipation members 372, corresponding to the number of flexible circuit boards 345 provided in the electronic device 20. For example, as shown in Figure 4A, two first front heat dissipation members 371 are arranged on the front of the first hinge plate 3441, and two second front heat dissipation members 372 are arranged on the front of the second hinge plate 3442. In this case, the multiple first front heat dissipation members 371 and second front heat dissipation members 372 are arranged symmetrically with respect to the folding axis A, in other words, so that they face each other when the electronic device 20 is folded.

[0075] In one embodiment, the rear heat dissipation member 380 forms a heat conduction path between the flexible circuit board 345 and the hinge plates 3441 and 3442. The rear heat dissipation member 380 is positioned on the back of the hinge plate set 344, in other words, on the opposite side of the hinge plate set 344 from where the front heat dissipation member 370 is located. In one embodiment, the rear heat dissipation member 380 may be positioned between the hinge plate set 344 and the hinge housing 342. In this case, the rear heat dissipation member 380 connects the flexible circuit board 345 and the hinge plate set 344 by being positioned so that at least a portion of it covers the flexible circuit board 345. In one embodiment, the rear heat dissipation member 380 includes a first rear heat dissipation member 381 positioned between the first hinge plate 3441 and the flexible circuit board 345, and a second rear heat dissipation member 382 positioned between the second hinge plate 3442 and the flexible circuit board 345. In one embodiment, the first rear heat dissipation member 381 has both sides in contact with the first hinge plate 3441 and the flexible circuit board 345, and the second rear heat dissipation member 382 has both sides in contact with the second hinge plate 3442 and the flexible circuit board 345. With this structure, the flexible circuit board 345 is positioned to pass between the first hinge plate 3441 and the second hinge plate 3442 and the hinge housing 342, and is connected to the first hinge plate 3441 and the second hinge plate 3442, respectively, via the first rear heat dissipation member 381 and the second rear heat dissipation member 382, ​​so that heat can be simultaneously transferred to the first hinge plate 3441 and the second hinge plate 3442.

[0076] In one embodiment, the flexible circuit board 345 may include a pair of fixing members 4451 for fixing to a first support plate 3431 and a second support plate 3432. The pair of fixing members 4451 cover a portion of the surface of the flexible circuit board 345 and are screwed to the support plates 3431 and 3432 via flanges that protrude outward. In one embodiment, the first hinge plate 3441 and the second hinge plate 3442 may include slots 4443 recessed into their back surfaces, in other words, the surfaces facing the flexible circuit board 345. In this case, the pair of fixing members 4451 are inserted into the corresponding slots 4443 formed in each hinge plate 3441 and 3442. With such a structure, the hinge plate set 344 and the flexible circuit board 345 are more firmly connected by being coupled via the slots 4443 and the fixing members 4451. In one embodiment, a rear heat dissipation member 380 may be located within the slots 4443. For example, the first rear heat dissipation member 381 is positioned in the slot 4443 of the first hinge plate 3441, and the second rear heat dissipation member 382 is positioned in the slot 4443 of the second hinge plate 3442.

[0077] In one embodiment, the first rear heat dissipation member 381 and the second rear heat dissipation member 382 are arranged symmetrically with respect to the folding axis A. For example, the first rear heat dissipation member 381 and the second rear heat dissipation member 382 may be arranged at the same distance apart with respect to the folding axis A. In one embodiment, if the electronic device 20 is provided with a plurality of flexible circuit boards 345, each of the first rear heat dissipation member 381 and the second rear heat dissipation member 382 may be provided in a quantity corresponding to the number of flexible circuit boards 345.

[0078] Figure 5A is a diagram showing the arrangement relationship between the front heat dissipation member and the rear heat dissipation member with respect to the hinge plate in an electronic device according to one embodiment of the present invention, and Figure 5B is a cross-sectional view of the electronic device along the Vb-Vb line in Figure 5A.

[0079] Referring to Figures 5A and 5B, an electronic device 50 according to one embodiment (for example, the electronic device 101 in Figure 1) can achieve multi-directional heat dissipation function via a flexible circuit board 545, a rear heat dissipation member 580, and a front heat dissipation member 570.

[0080] In one embodiment, the electronic device 50 transfers heat between a first space (e.g., the first space 221 in Figure 2A) and a second space (e.g., the second space 231 in Figure 2B) via a flexible circuit board 545. The first and second spaces of the electronic device 50 are separated by a folding axis (e.g., folding axis A in Figure 2A), and the first printed circuit board (e.g., the first printed circuit board 361 in Figure 3A) or the second printed circuit board (e.g., the second printed circuit board 362 in Figure 3B) located in each space is equipped with components that are major heat sources, such as an AP (application processor), a GPU (graphics processing unit), and a PMIC (power management IC). The flexible circuit board 545 is positioned to traverse the first and second spaces, and its ends are connected to the first and second printed circuit boards, thereby acting as a heat conduction path between the first and second spaces. For example, if the temperature of the first space is higher than the temperature of the second space, heat is dispersed from the first space to the second space via the flexible circuit board 545.

[0081] In one embodiment, the electronic device 50 embodies a heat dissipation function through the display 510 via the rear heat dissipation member 580 and the front heat dissipation member 570. Heat generated inside the electronic device 50 is released to the outside through the display 510. In one embodiment, the rear heat dissipation member 580 and the front heat dissipation member 570 perform the function of transferring heat from the back of the electronic device 50 towards the front (for example, along the z-axis in Figure 5B).

[0082] In one embodiment, the rear heat dissipation member 580 is connected to the flexible circuit board 545 and the hinge plate set 544 so as to be in contact with them, forming a heat conduction path. In this case, the heat generated in the first printed circuit board and the second printed circuit board is transferred to the flexible circuit board 545, and the heat transferred to the flexible circuit board 545 is transferred to the hinge plate set 544 via the rear heat dissipation member 580. In one embodiment, the hinge plate set 544 is divided into a first hinge plate 5441 and a second hinge plate 5442 with respect to the folding axis in order to realize the folding operation of the electronic device 50. In this case, the heat from the flexible circuit board 545 is transferred to the first hinge plate 5441 and the second hinge plate 5442, respectively, via the first front heat dissipation member 571 and the second front heat dissipation member 572.

[0083] In one embodiment, the front heat dissipation member 570 forms a heat conduction path between the hinge plate set 544 and the display 510. For example, the front heat dissipation member 570 physically contacts the hinge plate set 544 and the back plate set 550, transferring heat from the hinge plate set 544 to the back plate set 550. In one embodiment, the back plate set 550 is divided into a first back plate 551 and a second back plate 552, which support a first and second region of the display 510, respectively, so as not to interfere with the folding operation of the display 510. In this case, the first front heat dissipation member 571 transfers heat from the first hinge plate 5441 to the first back plate 551, and the second front heat dissipation member 572 transfers heat from the second hinge plate 5442 to the second back plate 552. In one embodiment, the heat transferred to the first backplate 551 and the second backplate 552 is conducted to the first and second regions, respectively, and released to the outside.

[0084] In one embodiment, the rear heat dissipation member 580 and the front heat dissipation member 570 may be arranged so as to overlap each other with the hinge plate set 544 in between. In other words, as shown in Figure 5A, the rear heat dissipation member 580 and the front heat dissipation member 570 may be arranged in positions that overlap each other with respect to the view from the front of the display 510. For example, the first front heat dissipation member 571 and the first rear heat dissipation member 581 are arranged so as to overlap with the first hinge plate 5441 in between, and the second front heat dissipation member 572 and the second rear heat dissipation member 582 are arranged so as to overlap with the second hinge plate 5442 in between. With such a structure, the heat conduction path through the hinge plate between the front heat dissipation member 570 and the rear heat dissipation member 580 is the shortest distance, so that heat from the flexible circuit board 545 can be efficiently transferred to the display 510.

[0085] Figure 6A is a cross-sectional view of an electronic device according to one embodiment of the present invention in an unfolded state, and Figure 6B is a cross-sectional view of an electronic device according to one embodiment of the present invention in a folded state.

[0086] Referring to Figures 6A and 6B, in one embodiment of the electronic device 60 (e.g., electronic device 101 in Figure 1), the distance between the display 610 and the hinge plate set 644 may change during the folding process. In one embodiment, the display 610 is spread out as shown in Figure 6A or folded as shown in Figure 6B, depending on the state of the electronic device 60. Such folding of the display 610 can be performed through deformation of the folding region (e.g., folding region 213 in Figure 2A) where the folding axis (e.g., folding axis A in Figure 2A) is located. In this case, the deformation of the folding region causes the distance between the display 610 and the hinge plate set 644 to change slightly depending on the folding state. In one embodiment, if the backplate set 650 is in contact with the back of the display 610, the distance between the backplate set 650 and the hinge plate set 644 also changes slightly in accordance with the folding operation of the electronic device 60. For example, as shown in Figure 6A, the second distance d2 between the first backplate 651 and the first hinge plate 6441 when the electronic device 60 is folded is smaller than the first distance d1 between the first backplate 651 and the first hinge plate 6441 when the electronic device 60 is unfolded, as shown in Figure 6B.

[0087] In one embodiment, the front heat dissipation member 671 is single-sidedly bonded to only one of either the backplate set 650 or the hinge plate set 644. For example, the front heat dissipation member 671 may be bonded to the surface of the hinge plate set 644, but detachably bonded to the surface of the backplate set 650. Such a structure prevents the backplate set 650 from being pulled in the direction of the hinge plates by the front heat dissipation member 671, even when the distance between the backplate set 650 and the hinge plate set 644 increases. Thus, the problem of the rear heat dissipation member 681 deforming the shape of the display 610 during the folding process is prevented.

[0088] In one embodiment, the rear heat dissipation member 681 may be double-sidedly bonded to the flexible circuit board 645 and the hinge plate set 644. In this case, the rear heat dissipation member 681 is formed from a thermally conductive material, but is formed to have greater rigidity than the front heat dissipation member 671. In one embodiment, the flexible circuit board 645 may change shape during the folding process of the electronic device 60. Because the flexible circuit board 645 has elastic force, it applies an external force to the display 610 during the process of changing shape. In this case, the rear heat dissipation member 681 absorbs the force caused by the deformation of the flexible circuit board 645, reduces the change in the distance between the flexible circuit board 645 and the hinge plate set 644, and minimizes the influence of the flexible circuit board 645 on the display 610.

[0089] In one embodiment, as shown in Figure 6B, when the electronic device 60 is folded, the externally exposed area of ​​the display 610 from which heat can be released decreases, and the temperature inside the electronic device 60 rises. In this case, the electronic device 60 can dissipate heat throughout the entire electronic device 60 by performing a heat dissipation function between the two folded spaces via the heat conduction path formed by the flexible circuit board 645, and by performing a heat dissipation function between the flexible circuit board 645 and the display 610 via the front heat dissipation member 671 and the rear heat dissipation member 681. Therefore, the temperature difference depending on the position of the electronic device 60 can be minimized.

[0090] Figure 7A is a partially exploded perspective view showing a heat dissipation sheet placed between the display and the backplate in an electronic device according to one embodiment of the present invention; Figure 7B is a diagram showing the relative arrangement of the heat dissipation sheet and the front heat dissipation member in an electronic device according to one embodiment of the present invention; and Figure 7C is a partially cross-sectional view of the electronic device along the VIIc-VIIc line in Figure 7B.

[0091] Referring to Figures 7A to 7C, an electronic device 70 according to one embodiment (for example, the electronic device 101 in Figure 1) includes a display 710, a backplate set 750, a hinge plate set 744, a flexible circuit board 745, a front heat dissipation member 770, a rear heat dissipation member 780, and a heat dissipation sheet 790.

[0092] The display 710 includes a first region 711 and a second region 712 that fold relative to a folding axis. The backplate set 750 is attached to the back of the display 710 and supports the display 710. The backplate set 750 includes a first backplate 751 that supports the first region 711 of the display 710 and a second backplate 752 that supports the second region 712 of the display 710. The first backplate 751 and the second backplate 752 are positioned separately around the folding axis A so as not to interfere with the folding operation of the display 710.

[0093] The heat dissipation sheet 790 may be placed between the display 710 and the backplate set 750. The heat dissipation sheet 790 is attached to the back of the display 710 using an adhesive. The heat dissipation sheet 790 ensures that the heat transferred to the display 710 via the backplate set 750 is evenly distributed in the direction of the surface. In one embodiment, the heat dissipation sheet 790 may include a material with high conductivity, such as graphite.

[0094] In one embodiment, the heat dissipation sheet 790 includes a first sheet portion 791 positioned between a first region 711 of the display 710 and a first backplate 751, a second sheet portion 792 positioned between a second region 712 of the display 710 and a second backplate 752, and one or more connecting portions 793 connecting the first sheet portion 791 and the second sheet portion 792. In one embodiment, the connecting portions 793 have a narrower width (for example, in the direction aligned with the folding axis A) than the first sheet portion 791 and the second sheet portion 792. In one embodiment, when a plurality of connecting portions 793 connect the first sheet portion 791 and the second sheet portion 792, an open space is formed between the plurality of connecting portions 793. With such a structure, the connecting portions 793 can perform the heat conduction function between the first sheet portion 791 and the second sheet portion 792 while minimizing interference with the folding operation of the display 710.

[0095] In one embodiment, the front heat dissipation member 770 may be positioned between the hinge plate set 744 and the back plate set 750. For example, the front heat dissipation member 770 includes a first front heat dissipation member 771 positioned between the first hinge plate and the first back plate 751, and a second front heat dissipation member 772 positioned between the second hinge plate and the second back plate 752. In one embodiment, the front heat dissipation member 770 may be positioned to face the connecting portion 793 across the back plate. In other words, as shown in Figure 7B, facing the front of the display 710, the front heat dissipation member 770 is positioned to overlap with the connecting portion 793 of the heat dissipation sheet 790. For example, the first front heat dissipation member 771 is positioned at the point where the connecting portion 793 and the first sheet portion 791 are connected, and the second front heat dissipation member 772 is positioned at the point where the connecting portion 793 and the second sheet portion 792 are connected. In one embodiment, when the heat dissipation sheet 790 includes a plurality of connecting portions 793, the first front heat dissipation member 771 and the second front heat dissipation member 772 are provided in multiple quantities corresponding to the positions of each of the plurality of connecting portions 793. For example, as shown in Figure 7B, when the heat dissipation sheet 790 includes three connecting portions 793, three first front heat dissipation members 771 and three second front heat dissipation members 772 are provided and arranged in positions corresponding to each connecting portion 793, with the backplate set 750 in between. With such a structure, heat is transferred from the heat dissipation sheet 790 to the portions adjacent to the connecting portions 793 via the front heat dissipation member 770, so that heat transfer between the first sheet portion 791 and the second sheet portion 792 is performed more rapidly. Therefore, heat is dispersed and released over the entire area of ​​the display 710.

[0096] Figure 8A is a diagram showing a hinge plate set according to one embodiment of the present invention placed in a hinge assembly, Figure 8B is a partial perspective view showing a hinge plate set according to one embodiment of the present invention placed in a hinge assembly, and Figure 8C is a partial cross-sectional view of the electronic device along the line VIIIc-VIIIc in Figure 8A.

[0097] Referring to Figures 8A to 8C, an electronic device 80 according to one embodiment (for example, the electronic device 101 in Figure 1) includes a display 810, a backplate set 850, a hinge plate set 844, a hinge housing 842, a flexible circuit board 845, and a front heat dissipation member 870. In one embodiment, the backplate set 850 is attached to the back of the display 810 to support the display 810. In one embodiment, the hinge plate set 844 includes a first hinge plate 8441 positioned on the back of a first region of the display 810 (for example, the first region 211 in Figure 2A), and a second hinge plate 8442 positioned on the back of a second region of the display 810 (for example, the second region 212 in Figure 2B). In one embodiment, the flexible circuit board 845 is positioned to pass between the hinge housing 842 and the hinge plate set 844. In one embodiment, the flexible circuit board 845 includes fixing members 8451a and 8451b that face the hinge plate set 844.

[0098] In one embodiment, the first hinge plate 8441 and the second hinge plate 8442 each include a first plate region A1 and a second plate region A2. In this case, each hinge plate conducts heat to the flexible circuit board 845 via the first plate region A1. In one embodiment, the first plate region A1 and the second plate region A2 may be made of different materials. In this case, the first plate region A1 may be made of a material with higher thermal conductivity than the second plate region A2. For example, the first plate region A1 may be made of a material such as aluminum or copper, and the second plate region A2 may be made of a material such as steel or stainless steel.

[0099] In one embodiment, each hinge plate 8441, 8442 directly contacts the flexible circuit board 845 via a first plate region A1. For example, the flexible circuit board 845 contacts the first plate region A1 of the first hinge plate 8441 via a first fixing member 8451a and the first plate region A1 of the second hinge plate 8442 via a second fixing member 8451b. In one embodiment, the first plate region A1 may have a greater thickness than the second plate region A2. For example, each hinge plate 8441, 8442 may be formed such that the first plate region A1 protrudes toward the flexible circuit board 845 compared to the second plate region A2. In this case, the front surfaces of the hinge plates 8441, 8442, i.e., the surfaces facing the backplate set 850, may be formed so that there is no step between the first plate region A1 and the second plate region A2.

[0100] In one embodiment, the front heat dissipation member 870 may be positioned to contact the front surfaces of the hinge plates 8441 and 8442. The front heat dissipation member 870 includes a first front heat dissipation member 871 positioned on the front surface of the first hinge plate 8441, and a second front heat dissipation member 872 positioned on the front surface of the second hinge plate 8442. In one embodiment, each of the front heat dissipation members 871 and 872 is positioned on the opposite side of the portion of the hinge plates 8441 and 8442 that contacts the flexible circuit board 845. Heat from the flexible circuit board 845 is transferred to the front heat dissipation member 870 via the hinge plates 8441 and 8442.

[0101] Figure 9A is a partial cross-sectional view of an electronic device according to one embodiment of the present invention, and Figure 9B is a perspective view of a flexible circuit board according to one embodiment of the present invention.

[0102] Referring to Figures 9A and 9B, an electronic device 90 according to one embodiment includes a display 910, a backplate set 950, a hinge plate set 944, a front heat dissipation member 970, a rear heat dissipation member 980, and a flexible circuit board 945.

[0103] In one embodiment, the flexible circuit board 945 includes a pair of contact areas B1 and a bent area B2 that connects the pair of contact areas B1 and is bent into the hinge housing. In one embodiment, the pair of contact areas B1 may be located between the hinge housing 942 and the hinge plate set 944. The flexible circuit board 945 transfers heat to the hinge plate set 944 via the contact areas B1. In one embodiment, the flexible circuit board 945 includes a pair of fixing members 9451a, 9451b, respectively, located in the pair of contact areas B1. In this case, the contact areas B1 of the flexible circuit board 945 are fixed in position so as to be located between the hinge housing 942 and the hinge plate set 944 via the fixing members 9451a, 9451b. For example, the fixing members 9451a, 9451b may be connected to both sides of the hinge housing 942 and fixed to a plate (e.g., support plates 3431, 3432 in Figure 4B).

[0104] In one embodiment, the bent region B2 is folded into the internal housing space 9421 of the hinge housing 942. In this case, the shape of the bent region B2 may change due to the folding operation of the electronic device 90. The bent region B2 may have a sufficiently large length to accommodate the change in shape. In one embodiment, the bent region B2 is subjected to a relatively high and persistent stress compared to the contact region B1 in response to the change in shape due to the folding operation of the electronic device 90.

[0105] In one embodiment, the flexible circuit board 945 may be coated with a heat dissipation layer 9452 containing graphite material on at least a portion of the surface of the area excluding the bending region B2. Since stress is continuously applied to the bending region B2, the heat dissipation layer 9452 is coated on the surface of the area excluding the bending region B2, for example, the contact region B1. In this case, the heat dissipation layer 9452 improves the heat transfer efficiency between the contact region B1 and the hinge plate set 944. In one embodiment, at least a portion of the bending region B2 is in contact with the inner circumferential surface of the housing space 9421 of the hinge housing 942. In this case, since the heat dissipation layer 9452 is omitted from the surface of the bending region B2, heat is transferred to the hinge housing 942 via an exposed metal layer.

[0106] In various embodiments, the electronic device 20 includes a display 210 including a first region 211 and a second region 212; a first housing 220 forming a first space 221 located behind the first region 211; a second housing 230 forming a second space 231 located behind the second region 212; a hinge assembly 240 that causes the first region 211 and the second region 212 to be in a first state where they form substantially the same plane or a second state where they face each other; and a plurality of forward heat dissipation members 370 that form a heat conduction path between the hinge assembly 240 and the display 210. In various embodiments, the hinge assembly 240 includes a hinge plate set 344, which includes a first hinge plate 3441 connected to a first housing 220 and a second hinge plate 3442 connected to a second housing 230; a hinge 341 that rotatably connects the first hinge plate 3441 and the second hinge plate 3442 about a folding axis A; a hinge housing 342 to which the hinge 341 is fixed and which connects the hinge plate set 344; and a flexible circuit board 345, at least part of which is positioned between the hinge plate set 344 and the hinge housing 342, with both ends extending into a first space 221 and a second space 231; and a plurality of forward heat dissipation members 370 are positioned on the surface of the hinge plate set 344 so as to face the display 210.

[0107] In various embodiments, the display 210 and the hinge plate set 344 are further positioned and include a backplate set 350 made of a conductive material, the backplate set 350 including a first backplate 351 that supports the back of the first region 211, and a second backplate 352 that supports the back of the second region 212 and is separated from the first backplate 351.

[0108] The front heat dissipation member 370 includes a first front heat dissipation member 371 whose two sides are in contact with the first back plate 351 and the first hinge plate 3441, respectively, and a second front heat dissipation member 372 whose two sides are in contact with the second back plate 352 and the second hinge plate 3442, respectively.

[0109] In various embodiments, the front heat dissipation member 370 is single-sidedly bonded to only one of the backplate set 350 and the hinge plate set 344.

[0110] In various embodiments, the first front heat dissipation member 371 and the second front heat dissipation member 372 may be arranged symmetrically with respect to the folding axis A.

[0111] In various embodiments, the electronic device 70 further includes a heat dissipation sheet 790 disposed between the display 710 and the backplate set 750, the heat dissipation sheet 790 including a first sheet portion 791 disposed between a first region 711 and a first backplate 751, a second sheet portion 792 disposed between a second region 712 and a second backplate 752, and one or more connecting portions 793 disposed across the folding axis A and connecting the first sheet portion 791 and the second sheet portion 792, the front heat dissipation member 770 may be disposed opposite the connecting portions 793 with the backplate set 750 in between.

[0112] In various embodiments, the front heat dissipation member 370 may be positioned on either side of the backplate set 350, facing the flexible circuit board 345.

[0113] In various embodiments, the configuration may further include a plurality of rear heat dissipation members 380 that form a heat conduction path between the hinge plate set 344 and the flexible circuit board 345, the plurality of rear heat dissipation members 380 may include a first rear heat dissipation member 381 positioned between the first hinge plate 3441 and the flexible circuit board 345, and a second rear heat dissipation member 382 positioned between the second hinge plate 3442 and the flexible circuit board 345.

[0114] In various embodiments, the rear heat dissipation member 380 may be positioned so as to overlap with the front heat dissipation member 370, with the hinge plate set 344 in between.

[0115] In various embodiments, the rear heat dissipation member 380 and the heat dissipation member 370 are formed from a thermally conductive material, and the rear heat dissipation member 380 may have greater stiffness than the front heat dissipation member 370.

[0116] In various embodiments, the rear heat dissipation member 380 may be bonded on both sides (double-sided adhesion) to the hinge plate set 344 and the flexible circuit board 345, respectively.

[0117] In various embodiments, the first hinge plate 3441 and the second hinge plate 3442 each include a recessed slot 4443 formed on the surface facing the flexible circuit board 345, the flexible circuit board 345 includes a pair of fixing members 4451 that are inserted into the slots 4443 of the first hinge plate 3441 and the second hinge plate 3442, and the rear heat dissipation member 380 may be located within the slots 4443.

[0118] In various embodiments, the second gap d2 between the first backplate 651 and the first hinge plate 6441 in the second state may be smaller than the first gap d1 between the first backplate 6441 and the first hinge plate 651 in the first state.

[0119] In various embodiments, the first hinge plate 8441 and the second hinge plate 8442 include a first plate region A1 and a second plate region A2 made of a different material from the material of the first plate region, and the flexible circuit board may be positioned between the first plate region A1 and the hinge housing 842.

[0120] In various embodiments, the first plate region A1 may have a greater thickness than the second plate region A2 and may be in contact with the flexible circuit board 845.

[0121] In various embodiments, the flexible circuit board 945 includes a bendable region B2 that is folded into the hinge housing 942, and a heat dissipation layer 9452 containing graphite material may be coated on at least a portion of the surface of the region excluding the bendable region B2.

[0122] The electronic device 20 in various embodiments includes a display 210 comprising a first region 211 and a second region 212 that can be folded via a folding axis A; a first support plate 3431 located in the direction of the rear of the first region 211; a second support plate 3432 located in the direction of the rear of the second region 212; a hinge housing 342 fixed to which a hinge 341 is fixed for rotating the first support plate 3431 and the second support plate 3432 around the folding axis A and which is arranged along the folding axis A and connects the first support plate 3431 and the second support plate 3432; a first hinge plate 3441 connecting the hinge housing 342 and the first support plate 3431; and a second hinge plate 3442 connecting the hinge housing 342 and the second support plate 3432. The system may also include a hinge plate set 344, a first printed circuit board 361 positioned opposite to the first region 211 with respect to the first support plate 3431, a second printed circuit board 362 positioned opposite to the second region 212 with respect to the second support plate 3432, a flexible circuit board 345 positioned to cross the first region 211 and the second region 212 via the space between the hinge plate set 344 and the hinge housing 342, connecting the first printed circuit board 361 and the second printed circuit board 362, and a first forward heat dissipation member 371 and a second forward heat dissipation member 372 positioned between the hinge plate set 344 and the display 210, respectively, forming heat conduction paths between the first region 211 and the second region 212 of the display 210 and the hinge plate set 344.

[0123] In various embodiments, the system may further include a first rear heat dissipation member 381 that forms a heat conduction path between the first hinge plate 3441 and the flexible circuit board 345, and a second rear heat dissipation member 382 that forms a heat conduction path between the second hinge plate 3442 and the flexible circuit board 345.

[0124] In various embodiments, the first front heat dissipation member 371 and the first rear heat dissipation member 381 may be arranged so as to overlap at least a portion of the first hinge plate 3441, and the second front heat dissipation member 372 and the second rear heat dissipation member 382 may be arranged so as to overlap at least a portion of the second hinge plate 3442.

[0125] In various embodiments, the backplate set 350 further includes a backplate set 350 that supports the back of the display 210, the backplate set 350 including a first backplate 351 on which a first region 211 of the display 210 is mounted, and a second backplate 352 on which a second region 212 of the display 210 is mounted and which is separated from the first backplate 351, and the first front heat dissipation member 371 and the second front heat dissipation member 372 may be in contact with the backplate set 350 and the hinge plate set 344 on both sides.

[0126] In various embodiments, the first front heat dissipation member 371 and the second front heat dissipation member 372 may be bonded to only one side of either the back plate set 350 or the hinge plate set 344.

[0127] Although embodiments of the present invention have been described in detail above with reference to the drawings, the present invention is not limited to the embodiments described above, and a person with ordinary skill in the art can apply various technical modifications and variations based on the above embodiments. For example, the described techniques may be performed in a different order than described, and / or the described components such as systems, structures, devices, and circuits may be combined or assembled in a different manner than described, or substituted and replaced by other components or equivalents, and still achieve suitable results. [Explanation of Symbols]

[0128] 20, 50, 60, 70, 80, 90, 101, 102 Electronic equipment 100 Network Environment 104 (External) Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary processors 130 memory 132 Volatile memory 134 Non-volatile memory 136 Interior memory 138 External memory 140 programs 142 Management Structure 144 Middleware 146 applications 150 Input Modules 155 Audio Output Module 160 display modules 170 Audio Modules 176 Sensor Modules 177 Interface 178 Connection terminals 179 Haptic Modules 180 Camera Module 188 Power Management Modules 189 Battery 190 Communication Module 192 Wireless Communication Module 194 Wired communication module 196 Subscriber Identification Module 197 Antenna Module 198 First Network 199 Second Network 210, 510, 610, 710, 810, 910 displays 211, 711 1st area 212, 712 2nd area 213 Axis area 220 First Housing 221 1st space 230 Second Housing 231 2nd space 240 Hinge Assembly 341 Hinge 342, 842, 942 Hinge Housing 343 Support Plate 3431 First support plate 3431a Through hole 3432 Second support plate 3432a Through hole 344, 544, 644, 744, 844, 944 Hinge Plate Set 3441, 5441, 6441, 8441 First hinge plate 3442, 5442, 8442 Second hinge plate 345, 545, 645, 745, 845, 945 Flexible Circuit Boards 350, 550, 650, 750, 850, 950 Backplate Set 351, 551, 651, 751 First backplate 352, 552, 652, 752 Second backplate 360 Printed Circuit Boards 361 First Printed Circuit Board 362 Second Printed Circuit Board 370, 570, 671, 770, 870, 970 Front heat dissipation members 371, 571, 771, 871 First front heat dissipation member 372, 572, 772, 872 Second front heat dissipation member 380, 580, 681, 780, 980 Rear heat dissipation member 381, 581 First rear heat dissipation member 382, 582 Second rear heat dissipation member 4443 slots 4451 Fixing member 790 Heat Dissipation Sheet 791 First Sheet Section 792 Second seat section 793 Connecting part 8451a, 9451a (First) Fixing Member 8451b, 9451b (Second) Fixing Member 9421 (Internal) Containment Space 9452 Heat dissipation layer

Claims

1. An electronic device, A display including a first region and a second region, A first housing forming a first space located on the back of the first region, A second housing forming a second space located on the back of the second region, A hinge assembly that causes the first region and the second region to be in a first state in which they form the same plane or in a second state in which they face each other, A plurality of forward heat dissipation members that form a heat conduction path between the hinge assembly and the display, Includes, The aforementioned hinge assembly is A hinge plate set including a first hinge plate connected to the first housing and a second hinge plate connected to the second housing, A hinge that connects the first hinge plate and the second hinge plate so as to be rotatable around a folding axis, A hinge housing to which the hinge is fixed and which connects the hinge plate set, A flexible circuit board, at least a portion of which is positioned between the hinge plate set and the hinge housing, with both ends extending into the first and second spaces, Includes, The electronic device is characterized in that the plurality of forward heat dissipation members are arranged on the surface of the hinge plate set so as to face the display.

2. The backplate set is positioned between the display and the hinge plate set and further includes a backplate set containing a conductive material, The aforementioned backplate set is A first backplate supporting the back surface of the first region, A second backplate supports the back surface of the second region and is separated from the first backplate, The electronic device according to claim 1, characterized by including the following:

3. The aforementioned front heat dissipation member is A first front heat dissipation member, the first front heat dissipation member having both sides in contact with the first back plate and the first hinge plate, respectively, A second front heat dissipation member, the second front heat dissipation member having both sides in contact with the second back plate and the second hinge plate, respectively, The electronic device according to claim 2, characterized by including the following:

4. The electronic device according to claim 3, characterized in that the forward heat dissipation member is cross-sectionally bonded (single-sided adhesion) to only one of the back plate set and the hinge plate set.

5. The electronic device according to claim 3, characterized in that the first front heat dissipation member and the second front heat dissipation member are arranged symmetrically with respect to the folding axis.

6. The system further includes a heat dissipation sheet placed between the display and the backplate set, The aforementioned heat dissipation sheet is A first sheet portion is disposed between the first region and the first backplate, A second sheet portion is disposed between the second region and the second backplate, It includes one or more connecting parts that are arranged to cross the folding axis and connect the first sheet part and the second sheet part, The electronic device according to claim 2, characterized in that the forward heat dissipation member is arranged to face the connecting portion with the backplate set in between.

7. The electronic device according to claim 2, characterized in that the forward heat dissipation member is arranged to face the flexible circuit board with the hinge plate set in between.

8. The system further includes a plurality of rear heat dissipation members that form a heat conduction path between the hinge plate set and the flexible circuit board, The aforementioned multiple rear heat dissipation members are A first rear heat dissipation member is disposed between the first hinge plate and the flexible circuit board, A second rear heat dissipation member is disposed between the second hinge plate and the flexible circuit board, The electronic device according to claim 1, characterized by including the following:

9. The electronic device according to claim 8, characterized in that the rear heat dissipation member is arranged to overlap with the front heat dissipation member, with the hinge plate set in between.

10. The rear heat dissipation member and the front heat dissipation member are formed from a thermally conductive material. The electronic device according to claim 8, characterized in that the rear heat dissipation member has greater rigidity than the front heat dissipation member.

11. The electronic device according to claim 8, characterized in that the rear heat dissipation member is bonded on both sides (double-sided adhesion) to the hinge plate set and the flexible circuit board, respectively.

12. The electronic device according to claim 1, characterized in that the second distance between the first backplate and the first hinge plate in the second state is smaller than the first distance between the first backplate and the first hinge plate in the first state.

13. The first hinge plate and the second hinge plate include a first plate region and a second plate region which includes a material different from the material of the first plate region. The electronic device according to claim 1, characterized in that the flexible circuit board is disposed between the first plate region and the hinge housing.

14. The electronic device according to claim 13, characterized in that the first plate region has a greater thickness than the second plate region and contacts the flexible circuit board.

15. The electronic device according to claim 1, characterized in that the flexible circuit board includes a bending region that is bent inside the hinge housing, and at least a portion of the surface of the region excluding the bending region is coated with a heat dissipation layer containing graphite material.

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