Combining multiple ultrasonic beam skews

Abstract

Techniques for ultrasonic inspection using different beam skews arranged within a group are described. For example, the techniques described herein can group multiple different beam skews within a single group as part of a single channel, resulting in simpler processing and calibration. The techniques also describe a new scan image that shows different beam skews together so that an analyst can easily select and switch between different beam skews.

Description

Technical Field

[0001] Claim of Priority This patent application claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 365,047, filed on May 20, 2022, and titled "METHOD FOR COMBINING MULTIPLE PHASED ARRAY ULTRASONIC BEAM SKEW FOCAL LAWS INTO A SINGLE GROUP", which is hereby incorporated by reference in its entirety.

[0002] This application relates to ultrasonic inspection.

Background Art

[0003] Phased Array Ultrasonic Testing (PAUT) is an advanced non-destructive testing technique that utilizes a set of ultrasonic testing (UT) probes consisting of a number of small elements, each of which is individually pulsed at a computer-calculated timing and can be used to inspect more complex shapes that are difficult and much slower to inspect with a single probe. PAUT can be used to inspect almost all materials for which conventional UT methods such as weld inspection, crack detection, and corrosion monitoring are utilized, and can be used in a wide range of industries including aerospace, power generation, petrochemical, metal billet and tubular product suppliers, pipeline construction and maintenance, structural metals, and general manufacturing.

[0004] Compared to other forms of UT, PAUT has several advantages. (i) PAUT can be performed more quickly than other forms of UT. (ii) It has high reproducibility and can thus be easily used for repeated scans. (iii) By sequentially emitting beams at different angles, PAUT can create a detailed and accurate cross-section of a component. (iv) PAUT inspections can sweep the beam without moving the probe, making it particularly useful when there is little room for mechanical scanning.

Summary of the Invention

[0005] Examples described herein relate to methods, systems, and computer program products for ultrasound imaging having different beam skews. Examples include receiving scan control parameters including beam skew configurations for a group of beam skews arranged in a group; performing calibration for each of the beam skews for the group of beam skews; establishing calibration values ​​for at least one other beam skew among the group of beam skews based on the calibration performed for each beam skew; and receiving data indicating electrical response signals induced by scanning an object, wherein the scanning is based on scan control parameters, and the received data indicating electrical response signals corresponding to the group of beam skews in the channel is used to generate data for presentation. [Brief explanation of the drawing]

[0006] The subject matter of this specification can be better understood by referring to the following description in conjunction with the accompanying drawings. The drawings are not intended to limit the claims contained herein. For clarity, not all elements may be labeled in all drawings. The drawings are not necessarily to scale and instead focus on illustrating embodiments, principles, and concepts. Accordingly, the features and advantages of this disclosure will be better revealed by the following detailed description of its embodiments in conjunction with the accompanying drawings.

[0007] [Figure 1A] A block diagram illustrating a system for ultrasonic defect screening according to an exemplary embodiment of the subject matter. [Figure 1B] This document illustrates different probe types by exemplary embodiments of this subject. [Figure 1C] This exhibits a graphical representation of different types of scan data according to an exemplary embodiment of this subject. [Figure 2A]An example of a probe performing beam steering in top view and isometric view, according to an exemplary embodiment of this subject, is illustrated. [Figure 2B] Exemplary B-scan images from different beams in beam steering inspection are shown according to exemplary embodiments of this subject. [Figure 3] A flowchart illustrating a method for performing inspection using beam steering inspection, according to an exemplary embodiment of this subject, is provided. [Figure 4] This section illustrates an exemplary beam skew configuration based on an exemplary embodiment of the subject matter. [Figure 5] An example of a T-scan is illustrated by an exemplary embodiment of this subject. [Figure 6] An example of a display layout based on an exemplary embodiment of this subject will be illustrated. [Figure 7] An example of a display layout based on an exemplary embodiment of this subject will be illustrated. [Modes for carrying out the invention]

[0008] Phased array ultrasound (PAUT) test data (e.g., indexes) typically contain geometric echoes, which can complicate the search for genuine defect echoes. In practice, test analysts face challenging tasks that may involve balancing performance. A trade-off may exist between the test throughput performed by individual analysts and the thoroughness of the tests.

[0009] This specification describes techniques for performing PAUT using beam steering. Beam steering involves generating beams for inspecting an object to search for defects projected from a probe at different angles, and thus enabling the detection of defects at different locations and orientations within the object. The techniques described herein can simplify the inspection process for analysts (e.g., operators). For example, the techniques described herein can group multiple different beam skews within a single group as part of a single channel, resulting in simpler handling and calibration. The techniques also describe new scan images that show different beam skews together, allowing analysts to easily select and switch between different beam skews. Thus, the techniques can enable analysts to perform inspections in a simple and easy manner. Consequently, the techniques can provide savings in reducing the time associated with the inspection process and improve accuracy by reducing the possibility of missed or mischaracterized indicators.

[0010] Figure 1A is a block diagram illustrating a system 100 for ultrasonic defect screening according to an exemplary embodiment of the subject. System 100 includes several functional units, such as a processor 110, a pulser 115, a receiver 145, a probe (e.g., a transducer) 125, and a display device 150. As illustrated in Figure 1A, system 100 includes an instrument 105 having a processor 110, a pulser 115, a receiver 145, a display 150, and a memory 155. The pulser 115 can generate high-voltage electrical pulses. Driven by a trigger 120 from the pulser 115 under the control of the processor 110, the probe (e.g., a transducer) 125 generates high-frequency ultrasonic energy. The sound energy is introduced and propagates through the target 130 in the form of an incident wave 127. When there is a discontinuity or other indicator 135 (e.g., a crack) in the wavepath, some of the energy is reflected back from the defect surface as a reflected wave 137. The reflected wave 137 is converted into an electrical response signal 140 by the probe 125 and received by the receiver 145, which may convert the response signal 140 into scan data 140' (e.g., A scan data and scan axis position data). The processor 110 may then receive the scan data 140' for analysis. In some embodiments, the scan data 140' is analyzed in real time using the display 150 as it is received from the probe 125, and in other embodiments, the scan data 140' may be stored in memory 155 for offline analysis using the instrument display 150 or an external computer (not shown).

[0011] Figure 1B shows different probe types of probe 125. A linear probe includes a series of elements (e.g., carbon steel) distributed along the length corresponding to the active axis of the probe. A matrix probe includes elements positioned on both the active axis and the secondary axis of the probe. The beam can be steered using the delayed emission of the elements. Matrix probes can be provided in a rectangular arrangement (1.5D) with a different number of rows and columns of elements, or a square arrangement (2D) with an equal number of rows and columns of elements. In a single probe configuration, the probe transmits the incident wave 127 and also receives the reflected wave 137. In a dual probe configuration, transmission and reception are separated, with one probe transmitting the incident wave 127 and another probe, also positioned on the surface of the target 130, receiving the reflected wave 137. Wedge structures can also be coupled to the bottom surface of the probe to improve the acoustic propagation of ultrasound. Wedge structures can include rigid thermosetting polymers with known acoustic propagation properties (e.g., Rexolite®, available from C-Lec Plastics Inc.).

[0012] Figure 1C shows a graphic representation of different types of scan data 140'. The scan data 140' may include information about different scan axis positions 180 and ultrasonic axis positions 185. The scan axis may refer to a common axis shared by the probe 125 and the target 130 (e.g., the part being inspected) along the inspection path, for example, the path the probe 125 traverses along the target 130. For example, in the case of welding inspection, the scan axis may be defined as an axis parallel to the long axis of the weld line, and the scan axis defines the inspection path of the probe. The ultrasonic axis may refer to the direction of ultrasonic propagation (e.g., propagation of incident waves 127 and reflected waves 137), such that it is represented as rays toward or extending from echogenic features within the target 130 being inspected.

[0013] A scan 160 may refer to the amplitude value of the reflected wave (amplitude axis) along the ultrasonic axis. B scan 165 may refer to the combined amplitude value (A scan value) along the scan axis. S scan 170 may refer to a sector scan of the amplitude value (A scan value) along the ultrasonic axis position for a sector at a given scan axis position. Other scans, such as C scan, may be included, which may refer to the combined amplitude value of each beam along the scan axis.

[0014] Figure 2A illustrates an example of a probe performing beam steering in top and isometric views. Probe 202 can generate multiple beams at different angles using the delay of the active element. For example, probe 202 can generate a first beam 204 at the nominal angle, a second beam 206 at -15°, and a third beam 208 at +15°. Figure 2B shows exemplary B-scan images from the different beams. As shown, B-scan images for beams at different angles can reveal different information about the target. Image 210 is the B-scan result corresponding to the first beam 204 at the nominal angle. Image 210 shows the weld route within the target. Image 212 is the B-scan result corresponding to the second beam 206 at -15°. Image 210 shows different characteristics of the target. Image 214 is the B-scan result corresponding to the third beam 208 at +15°. Image 214 shows different characteristics of the target. For example, orientation defects such as distorted ID cracks (or defects with different orientations) are better detected and sized by the third beam 208 at +15° compared to the first beam 204 at the nominal angle.

[0015] In some conventional systems, different beam skews are managed separately as individual skew groups, also known as beamsets. In these conventional systems, each beam skew is a separate channel, requiring its own handling, simulation, and calibration. This can lead to numerous steps for the operator. For example, in these conventional systems, the operator must set up a separate channel for each beam skew angle and calibrate each channel separately.

[0016] The subject of this invention includes a single group / beamset comprising multiple different beam skew angles, each having multiple beam angles, which can simplify preparation and management. Multiple beam skews can be arranged in the same group called a "3D sector scan" (also referred to as a "3D composite scan"). A 3D sector scan can support periodic sector scans as well as composite S-sector scans, which can further reduce the number of groups.

[0017] Furthermore, calibration can be performed on one of several different beam skew angles within a group, and the calibration result of one beam skew angle can be used for the other beam skew angles within the group. In other words, calibration of one beam skew angle or a subset of beam skew angles within a group is performed in contrast to individual calibration of each beam skew angle.

[0018] FIG. 3 illustrates a flow diagram of a method 300 of performing an inspection using beam steering. At operation 302, as described above, a probe or set of probes in a dual-probe configuration is placed on the object under test. At operation 304, scan plan control parameters are received from a user (e.g., engineer, operator). The scan plan control parameters may include an identification of primary axis elements, including a first element, a last element, and an amount of elements associated with the primary axis. The primary axis is associated with steering of the beam angle. The scan plan control parameters may include an identification of secondary axis elements, including a first element, a last element, and an amount of elements associated with the secondary axis. The secondary axis is associated with the steering skew angle. The scan plan control parameters may include primary axis control such as angle start, angle stop, and angle step.

[0019] In relation to beam skew, the scan plan control parameters include a beam skew configuration of the secondary axis, such as skew start, skew stop, and skew step. FIG. 4 illustrates an exemplary illustration of a beam skew configuration. Skew start may represent the angle of the first beam skew relative to the nominal skew (0°). In the example of FIG. 4, the skew start is set to -15°. Skew stop may represent the angle of the last beam skew relative to the nominal skew. In the example of FIG. 4, the skew stop is set to +15°. Skew step may represent the step size of the angle between beam skews. In the example of FIG. 4, the skew step is set to 5° such that there is a beam skew every 5° between the start skew and the stop skew (e.g., -15°, -10°, -5°, 0°, +5°, +10°, +15°). Each of these beam skews is placed in one group / beam set. That is, since it is part of the group / beam set, one channel is used for different beam skews. A single channel corresponds to a single group (beam set).

[0020] Multiple active elements within the probe can be used to steer the beam in different axes. This can be applicable to both the primary and secondary axes of the probe. For example, two or more elements of the primary axis can be used to steer the angle, and two or more elements of the secondary axis can be used to steer the beam skew. In this example, at least four elements (2×2) are used for steering in both the primary and secondary axes.

[0021] Returning to FIG. 3, in operation 306, calibration can be performed for a group of beam skews. The calibration can include determining a time correction gain (TCG) value for a beam skew angle selected from the group of beam skews. The TCG value for the selected beam skew angle can be extrapolated for other beam skew angles within the group of beam skews. That is, the calibration of one beam skew can be used for the entire group of beam skews, and individual calibrations for each beam skew are not required. For example, the TCG value can be calculated for a nominal beam skew and extrapolated for other beam skews within the group.

[0022] In some examples, two or more beam skews within the group (but less than the total amount of beam skews within the group) can be calibrated. In these examples, interpolation can be used to provide calibration data for other beam skews within the group.

[0023] In operation 308, the scan of the test object is performed based on scan control parameters. For example, the probe can generate an incident wave based on the scan control parameters and penetrate the test object. The reflected wave from the test object's indicator can be received by the probe. The reflected wave can be converted into an electrical response signal.

[0024] In operation 310, scan data may be generated based on the response signal. The scan data may include A-scan, B-scan, C-scan, and S-scan data, as described above. The scan data may also include T-scan data associated with the beam skew result. A T-scan may refer to a secondary axial sector scan (beam steering) of amplitude values ​​(A-scan values) along the ultrasonic axial position for a sector at a given scan axis position. In a T-scan, a slice of data is displayed rather than a volume. A T-scan is related to the probe, not the object under test. A T-scan represents each 2D beam skew with respect to the UT axis and the scan axis. In some examples, the nominal skew, representing a 0° beam skew, may be placed in the center of the display.

[0025] S-scans and T-scans are similar in that they represent amplitudes from two or more beams relative to the ultrasonic axis for a given scan axis position. However, the difference between S-scans and T-scans is that an S-scan represents beams at different angles for a given beam skew, while a T-scan represents beams at different beam skews for a given beam angle. Each PAUT beam emitted in a 3D scan contains a unique set of refractive beam skew parameters. Consider an example: a primary axis with 5 beam skews can emit 30 refractive angles. That is, 30 (refractive angle beam) × 5 (beam skew) = 150 different beams are generated. An S-scan can show 30 refractive beams for a given beam skew, while a T-scan can show 5 beam skews for a given refractive angle. Therefore, a T-scan provides a different perspective and information than the other scan.

[0026] Figure 5 illustrates an example of a T-scan. As shown, the horizontal axis is the UT axis and the vertical axis is the scan axis. The scan axis can be updated at the scan position. Each beam skew is represented in 2D. The data cursor can select the active beam skew. In the example in Figure 5, a -5° beam skew is selected. The weld overlay can be refreshed from the data cursor value (skew angle). A T-scan can display a slice of data selected by the corresponding angle of the data cursor. A T-scan demonstrates an uncorrected technique that presents different beam skews in a single display. As described above, a T-scan can be 90° perpendicular to an S-scan.

[0027] Different beam skews can be grouped into a single group and therefore displayed on a single channel. Thus, multiple scans can be displayed alongside a T-scan, allowing the operator to select a specific beam skew and modify the display of other scans accordingly.

[0028] Figure 6 illustrates an example of a display layout. Display layout 602 includes sections for A-scan, B-scan, T-scan, and S-scan (ABTS). Display layout 604 includes sections for A-scan, B-scan, S-scan, and T-scan (ACST). Display layout 606 includes sections for C-scan, B-scan, T-scan, and S-scan (CBTS). As mentioned above, in response to the user selecting a specific beam skew in the T-scan section, the information in the other scan sections may be modified or updated to correspond to the selected beam skew.

[0029] Figure 7 illustrates an example of a display layout. The display layout includes sections for A-scan, B-scan, S-scan, and T-scan (ACST). Section 702 shows the T-scan using the selected skewed beam 704 indicated by the data cursor. Section 706 shows the A-scan data corresponding to the selected skewed beam. Section 708 shows the C-scan data corresponding to the selected skewed beam. Section 710 shows the S-scan data.

[0030] The processing (for example, performing one or more of the methods described herein) may be implemented in hardware, software, or a combination of both. The processing may be performed in a computer program running on a programmable computer / machine, each including a processor, a storage medium, or other products readable by the processor (including volatile and non-volatile memory and / or memory elements), at least one input device, and one or more output devices. The program code may be applied to data input using the input devices to perform the processing and generate output information. Memory may include a machine-readable medium storing one or more sets of data structures or instructions (e.g., software) that embody or utilize one or more of the techniques or functions described herein.

[0031] In some embodiments, the system may be embodied by one or more programmable processors that execute one or more computer programs to perform the functions of the system. In some other embodiments, all or part of the system may be implemented as special-purpose logic circuits (e.g., field-programmable gate arrays (FPGAs) and / or application-specific integrated circuits (ASICs)). In some other embodiments, all or part of the system may be implemented using electronic hardware circuits that include, for example, at least one of electronic devices such as processors, memory, programmable logic devices, or logic gates.

[0032] In one embodiment, the methods described herein are not limited to the specific examples described. In further embodiments, rather, any of the method steps may be rearranged, combined, deleted, or performed in parallel or sequentially, as necessary, to achieve the above results.

[0033] In some embodiments, the system may be executed by a data processing device (e.g., a programmable processor, a computer, or multiple computers) or implemented to control the operation of a data processing device (e.g., a programmable processor, a computer, or multiple computers) via a computer program product (e.g., a non-temporary machine-readable storage medium such as a non-temporary computer-readable medium). In certain embodiments, each such program may be implemented in a high-level procedural programming language or an object-oriented programming language for communication with the computer system. However, in certain other embodiments, the program may be implemented in assembly or machine code. In some embodiments, the language may be a compiled or interpreted language and may be deployed in any form, including as a standalone program or as modules, components, subroutines, or other units suitable for use in a computing environment. In some other embodiments, the computer program may be deployed to run on one or more computers at one site, or distributed across multiple sites and interconnected by a communication network.

[0034] The methods and apparatus of this disclosure may take at least partly the form of program code (i.e., instructions) embodied on a tangible, non-temporary medium such as a floppy disk, CD-ROM, hard drive, random-access or read-only memory, or any other machine-readable storage medium. When the program code is loaded onto a machine such as the computer in Figure 4 and executed, the machine becomes an apparatus for practicing examples of the subject matter of the present invention. When implemented on one or more general-purpose processors, the program code, in combination with such processors, provides a unique apparatus that operates similarly to a particular logic circuit. Thus, a general-purpose digital machine can be converted into a dedicated digital machine. In some other embodiments, the non-temporary machine-readable medium may include, but is not limited to, a hard drive, compact disk, flash memory, non-volatile memory, volatile memory, magnetic diskette, etc., but does not include temporary signals themselves.

[0035] The terms “machine-readable medium” or “machine-readable storage medium” may include any medium capable of storing, encoding, or holding instructions for execution by a machine, and capable of causing a machine to execute one or more of the technologies of this disclosure, or storing, encoding, or holding data structures used by or associated with such instructions. Examples of non-limiting machine-readable mediums include solid-state memory, as well as optical and magnetic media. Therefore, machine-readable mediums are not transient propagating signals. Specific examples of aggregated machine-readable mediums include non-volatile memory such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices, magnetic or other phase-shifting or state-shifting memory circuits, magnetic disks such as internal hard disks and removable disks, magneto-optical disks, and CD-ROM and DVD-ROM disks.

[0036] While the above examples have been described in some detail for the purpose of clarifying understanding, it will be clear that certain changes and modifications can be made within the scope of the appended claims. The scope of the present invention is limited only by the claims, and the invention encompasses a number of substitutes, modifications, and equivalents. In order to provide a complete understanding of the invention, many specific details are described in the above specification. These details are provided for illustrative purposes, and the invention can be practiced in accordance with the claims without some or all of these specific details. For clarification, technical materials known in the art related to the invention are not described in detail so as not to unnecessarily obscure the invention. Therefore, the above implementations should be considered illustrative and not limiting, and the invention is not limited to the details given herein, but can be modified within the scope of the appended claims and equivalents.

[0037] Various embodiments of the present disclosure are described with reference to the accompanying drawings. It should be understood that these exemplary embodiments are provided solely to enable those skilled in the art to better understand the present disclosure and then to further practice the invention, and are not intended to limit the scope of the present disclosure in any way. It should be noted that these drawings and descriptions are presented only as examples of embodiments, and based on this description, alternative embodiments may be envisioned that may have structures and methods as disclosed herein, and such alternative embodiments may be used without departing from the principles of the present disclosure claimed in this disclosure.

[0038] It should be noted that the flowcharts and block diagrams in the figures may illustrate devices, methods, architectures, functions, and operations that can be executed by computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, program segment, or part of code, which may contain one or more executable instructions for performing a specified logical function. It should be further noted that in some alternative implementations, the functions indicated in the blocks may occur in an order different from the order illustrated in the figures. For example, two blocks shown consecutively may be executed substantially in parallel or in reverse order, depending on the functions involved. It should also be noted that each block and combination of blocks in a block diagram or flowchart may be implemented by a dedicated hardware-based system for performing a specified function or operation, or by a combination of dedicated hardware and computer instructions.

[0039] The terms “comprise,” “include,” and their derived and similar expressions as used herein should be understood to be open (i.e., “comprising / including,” but not limited to these). The term “based on” means “at least partially based on,” the term “one embodiment” means “at least one embodiment,” and the term “another embodiment” indicates “at least one further embodiment.” Relevant definitions of other terms are provided.

[0040] In this document, the terms “a” or “an” are used to mean one or more, independently of any other instances or uses of “at least one” or “one or more,” as is common in patent literature. In this document, the term “or” is used to mean non-exclusive or, unless otherwise indicated, such that “A or B” includes “A but not B,” “B but not A,” and “A and B.” In this document, the terms “including” and “in which” are used as plain English synonyms for the terms “comprising” and “wherein,” respectively. Furthermore, in the following claims, the terms “including” and “wherein” are not limiting; that is, a system, device, article, composition, formulation, or process that includes elements in addition to those listed after such terms in a claim is still considered to fall within the scope of that claim. Moreover, in the following claims, terms such as “first,” “second,” and “third” are used merely as labels and are not intended to impose numerical requirements on their objects.

[0041] Examples of the methods described herein can be implemented in a machine or computer, at least in part. Some examples may include computer-readable or machine-readable media encoded with instructions that enable an electronic device to perform the methods described above. Implementations of such methods may include code, such as microcode, assembly language code, or higher-level language code. Such code may include computer-readable instructions for performing various methods. The code may form part of a computer program product. Furthermore, in one example, the code may be explicitly stored in one or more volatile, non-transient, or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of these tangible computer-readable media include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random-access memory (RAM), and read-only memory (ROM).

[0042] The above description is intended to be illustrative and not restrictive. For example, the examples (or one or more of their embodiments) described above may be used in combination with each other. Other implementations may be used by those skilled in the art who have considered the above description. The abstract is provided to enable readers to quickly confirm the nature of the technical disclosure. The abstract is submitted with the understanding that it is not to be used to interpret or limit the scope or meaning of the claims. Also, in the above detailed description, various features may be grouped together to streamline the disclosure. This should not be interpreted as meaning that any disclosed feature not claimed is essential to any claim. Rather, the subject matter of the invention may be less than all the features of a particular disclosed implementation. For this reason, the following claims are incorporated into the detailed description as examples or implementations, and each claim is intended to exist independently as a separate implementation, and such implementations may be combined with each other in various combinations or permutations. The scope of the invention should be determined by referring to the appended claims, together with the entire scope of equivalents to which such claims are entitled.

Claims

1. An ultrasound examination method using different beam skews, Receiving scan control parameters including beam skew configurations for multiple beam skews arranged in a group, Performing calibration for each of the aforementioned multiple beam skews, Based on the calibration performed for each of the beam skews, a calibration value is established for at least one other beam skew among the plurality of beam skews. Receiving data indicating an electrical response signal induced by scanning an object, wherein the scanning is based on the scan control parameters, and the receiving is based on the scan control parameters. A method comprising generating data for presentation based on the data showing electrical response signals corresponding to the plurality of beam skews in the channel.

2. The method according to claim 1, further comprising generating a scan image showing the group of the plurality of beam skews.

3. The method according to claim 2, wherein the scan image includes a horizontal axis corresponding to the ultrasonic test axis and a vertical axis corresponding to the scan axis.

4. The method according to claim 2, wherein the scan image represents each of the plurality of beam skews of the group in two dimensions.

5. The method according to claim 4, further comprising receiving an active beam skew selection based on the scan image.

6. The method according to claim 5, further comprising displaying a slice of data corresponding to the selected active beam skew.

7. The method according to claim 6, wherein the display includes a layout having a plurality of scans associated with the selected active beam skew.

8. It is a system, One or more processors of the machine, The machine comprises memory, the memory stores instructions, and when an instruction is executed by one or more processors, the machine Receiving scan control parameters including beam skew configurations for multiple beam skews arranged in a group, Performing calibration for each of the aforementioned multiple beam skews, Based on the calibration performed for each of the beam skews, a calibration value is established for at least one other beam skew among the plurality of beam skews. Receiving data indicating an electrical response signal induced by scanning an object, wherein the scanning is based on the scan control parameters, and A system that causes the system to perform an operation including generating data for presentation based on the data showing electrical response signals corresponding to the plurality of beam skews in the channel.

9. The aforementioned operation, The system according to claim 8, further comprising generating a scan image showing the group of the plurality of beam skews.

10. The system according to claim 9, wherein the scan image includes a horizontal axis corresponding to the ultrasonic test axis and a vertical axis corresponding to the scan axis.

11. The system according to claim 9, wherein the scan image represents each of the plurality of beam skews of the group in two dimensions.

12. The aforementioned operation, The system according to claim 11, further comprising receiving an active beam skew selection based on the scan image.

13. The aforementioned operation, The system according to claim 12, further comprising displaying a slice of data corresponding to the selected active beam skew.

14. The system according to claim 13, wherein the operation includes a layout in which the display has a plurality of scans associated with the selected active beam skew.

15. A machine-readable storage medium, which, when executed by a machine, the machine, Receiving scan control parameters including beam skew configurations for multiple beam skews arranged in a group, Performing calibration for each of the aforementioned multiple beam skews, Based on the calibration performed for each of the beam skews, a calibration value is established for at least one other beam skew among the plurality of beam skews. Receiving data indicating an electrical response signal induced by scanning an object, wherein the scanning is based on the scan control parameters, and A machine-readable storage medium that causes the generation of data for presentation based on the data indicating electrical response signals corresponding to the plurality of beam skews within the channel.

16. The machine-readable storage medium according to claim 15, further comprising generating a scan image showing the group of the plurality of beam skews.

17. The machine-readable storage medium according to claim 16, wherein the scanned image includes a horizontal axis corresponding to the ultrasonic test axis and a vertical axis corresponding to the scan axis.

18. The machine-readable storage medium according to claim 16, wherein the scanned image represents each of the plurality of beam skews of the group in two dimensions.

19. The machine-readable storage medium according to claim 18, further comprising receiving an active beam skew selection based on the scan image.

20. The machine-readable storage medium according to claim 19, further comprising displaying a slice of data corresponding to the selected active beam skew.

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