Electronic modules and electronic equipment

Abstract

To prevent a reduction in image quality.SOLUTION: An electronic module comprises: a substrate that has a first face, a second face on the opposite side of the first face, and a side face intersecting the first face and the second face; an electronic component that is arranged opposite to the first face and has a pixel array in which a plurality of pixels are arrayed; and an inductor that is provided on the second face. A conductive wall part is provided between the intersection of the second face and the side face and the inductor, or on the side face. The height of the wall part in a direction perpendicular to the second face is larger than the height of the inductor, and the width of the wall part in a direction along the intersection is larger than the width of the inductor.SELECTED DRAWING: Figure 2

Description

Technical Field

[0006] , , , ,

[0001] The present invention relates to an electronic module.

Background Art

[0002] In electronic devices such as cameras and portable information terminals, an inductor may be used in a circuit of an electronic module including an imaging element or a display element. Patent Document 1 describes using an LC filter including an inductor and a capacitor to smooth the current flowing through the drive coil of the image blur correction device of a camera.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the form of Patent Document 1, there was a concern that the magnetic field generated from the inductor reaches the imaging element as magnetic noise and affects image quality degradation or the like.

[0005] Therefore, an object of the present invention is to suppress degradation of image quality. [[ID=4​​​​A means for solving the above problem is an electronic module comprising a substrate having a first surface, a second surface opposite to the first surface, and a side surface intersecting the first surface and the second surface; an electronic component having a pixel array in which a plurality of pixels are arranged, disposed opposite to the first surface; and an inductor provided on the second surface, wherein a conductive wall portion is provided between the intersection line of the second surface and the side surface and the inductor, or on the side surface, the height of the wall portion in the direction perpendicular to the second surface is greater than the height of the inductor, and the width of the wall portion in the direction along the intersection line is greater than the width of the inductor. [Effects of the Invention]

[0007] This technology offers advantages in suppressing the degradation of image quality. [Brief explanation of the drawing]

[0008] [Figure 1] A schematic diagram of an electronic module according to the first embodiment. [Figure 2] A top view of an electronic module according to the first embodiment. [Figure 3] (a) is a cross-sectional view along the line A-A' in Figure 2, and (b) is a view of (a) with the wall removed. [Figure 4] (a) is the simulation model, and (b) is a graph showing the simulation results. [Figure 5] Circuit diagram. [Figure 6] Disassembled perspective view of an electronic component. [Figure 7] Cross-sectional view of the substrate according to the second embodiment. [Figure 8] Front view of the imaging device according to the third embodiment. [Figure 9] A cross-sectional view of the imaging device according to the third embodiment. [Figure 10] A circuit diagram showing an example of the configuration of an image sensor according to the third embodiment. [Figure 11] A schematic diagram of an electronic component according to the third embodiment. [Figure 12]A cross-sectional view of an electronic component according to the third embodiment. [Modes for carrying out the invention]

[0009] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the embodiments described below are only one embodiment of the invention and are not limited thereto. Common components will be described with reference to multiple drawings, and components with common reference numerals will be omitted from description as appropriate. Different items with the same name can be distinguished by adding "item number ○," such as "item number 1," "item number 2," etc.

[0010] <First Embodiment> Figure 1 is a schematic diagram of the electronic module 200 according to this embodiment.

[0011] Figure 1(a) is a view of the electronic module 200 from the side of the substrate 201 (side 101), and Figure 1(b) is a view of the electronic module 200 from the side of the substrate 201 (side 102).

[0012] The substrate 201 consists of a surface 101, a surface 102 opposite to surface 101, and sides 107 and 108 that intersect surfaces 101 and 102. Surface 101 faces the electronic component 400, and the electronic module 200 includes the electronic component 400 and a holder 103 for the electronic component 400. Surface 102 is provided with inductors 241a, 241b, 241c and a wall 212, and is electrically connected to the FPC 55 via a connector 208.

[0013] Surface 102 is equipped with various control means, including the inductor 241 and conductor 242, as well as connectors for external terminals, circuits for processing wireless signals from the outside, and circuits for receiving and processing operation signals based on user operations.

[0014] The electronic component 400 has a pixel array 310 as an imaging area in which a plurality of pixels are arranged, and examples of the electronic component 400 include an image sensor. The image sensor is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor has a function of converting the light incident through the optical system 3 into an electrical signal. The electronic component 400 having the pixel array 310 as the imaging area includes an imaging device 300 and includes up to a package 360 that houses the image sensor. As the package 360, for example, a ceramic package can be used, but the package 360 is not necessarily required, and a substrate-integrated image sensor may be used.

[0015] By mounting the inductor 241 at the end of the substrate 201 as in this embodiment, the design freedom on the substrate 201 can be improved, and the wiring length can be shortened.

[0016] FIG. 2 is a top view of FIG. 1(b). Using FIG. 2, the inductors 241a, 241b, 241c that constitute the filter circuit and the wall portion 212 provided near the inductor 241 will be described.

[0017] The inductor 241 is an inductor component that is electrically connected to the coil 53 to be described later and constitutes a low-pass filter circuit. The inductor 241a is connected to the coil 53a, the inductor 241b is connected to the coil 53b, and the inductor 241c is connected to the coil 53c, respectively.

[0018] Inductors 241a, 241b, and 241c are electrically connected to the FPC 55 via a wiring pattern (not shown) and a connector 208. The internal windings of the inductors 241a, 241b, and 241c have their axial directions perpendicular to the surface of the substrate 201. Although the effects of this proposal can be obtained even if the internal winding direction of the inductors 241a, 241b, and 241c is parallel to the surface of the substrate 201, it is more desirable for the winding direction to be perpendicular to the surface.

[0019] The inductors 241a, 241b, and 241c are located on the substrate 201 near the connector 208, in the vicinity of the intersection line 204 between face 102 and side 107, and the intersection line 205 between face 102 and side 108. Here, intersection line 204 is a part of the edge of the substrate 201 that forms the notch 203. Intersection line 204 is, for example, the first intersection line, and intersection line 205 is, for example, the second intersection line. Also, side 107 is, for example, the first side, and side 108 is, for example, the second side.

[0020] Among inductors 241a, 241b, and 241c, inductor 241a is positioned closest to the intersection line 204. Wiring patterns and electronic components (not shown) are provided around inductors 241a, 241b, and 241c, and inductors 241a, 241b, and 241c are arranged at approximately equal intervals.

[0021] In this embodiment, a conductive wall portion 212 is provided between the inductor 241a and the intersection line 204, which is the closest intersection line to the inductor 241a. The wall portion 212 has a length in the direction parallel to the surface 102 that is greater than or equal to the width W1 of the inductor 241a in the direction along the intersection line 204. In the direction perpendicular to the surface 102 of the wall portion 212, the wall portion 212 has a size greater than or equal to the height of the inductor 241a.

[0022] Here, the wall portion 212 is made of a conductor, but it may also be a non-conductive material such as a gasket, electronic component, substrate, or resin coated with a conductive material. Here, the gasket is not a sealing material for fixing, but rather a gasket with a structure such as polyurethane foam covered with conductive cloth. Other gaskets that can shield noise can also be used, such as a clip gasket integrated with a clip, an arrowhead gasket that is easy to install by fitting it into the housing, or a thin film gasket.

[0023] Figure 3 is a cross-sectional view of Figure 2. Figure 3(a) shows the case with the wall portion 212 provided, and Figure 3(b) shows the case without the wall portion 212. The function of the wall portion 212 will be explained using Figure 3.

[0024] Magnetic fields 401 and 402 flow from inductor 241a in the direction of the arrows. Here, the magnetic fields are shown by two arrows, but a magnetic field is also generated in the other direction. The winding portion 307 of inductor 241a is made up of thin copper wire wound around it and has a winding axis perpendicular to the surface of the substrate 201.

[0025] The winding section 307 is wound around the core section 302 and electrically connected to a circuit (not shown). A magnetic material 303 is applied to the side surface of the winding section 307. This magnetic material 303 is provided to form a closed magnetic structure that confines the magnetic field leaking from the winding section 307 when combined with the core section 302. The magnetic material 303 may be a magnetic resin, which is a mixture of magnetic material and resin material.

[0026] Furthermore, although the magnetic material 303 is shown as separate from the winding portion 307 in Figure 3, it may be integrated with the core portion 302. Also, although the winding axis direction of the winding portion 307 is shown as perpendicular to the surface of the substrate 201, it may be parallel to the surface of the substrate 201.

[0027] The substrate 201 is provided with a wiring pattern 206 as a conductive layer. The substrate 201 is a multilayer circuit board, and electrical circuits and their respective wiring patterns are provided on the surface and inner layers. The wiring pattern 206 is a pattern that supplies a reference potential for the operation of each electrical circuit, and is composed of multiple layers. In order to maintain the same potential between each layer, multiple layers are connected by vias (not shown) to form the wiring pattern 206. In addition, wiring patterns necessary for each circuit may be provided between the multiple layers that make up the wiring pattern 206. As described above, the wiring pattern 206 is composed of multiple layers, but in Figure 3, it is schematically shown as a single layer to explain the flow of the magnetic field. The wiring pattern 206 is configured to cover at least the inductor 241a in the projection plane perpendicular to the surface of the substrate 201.

[0028] In this embodiment, the wiring pattern 206 is further extended to the intersection line 204. This configuration allows the magnetic field generated from the inductor 241a to be more effectively guided to the wall portion 212, thereby achieving a high magnetic field reduction effect.

[0029] Next, the paths of magnetic fields 401 and 402 will be explained. As mentioned above, the substrate 201 is provided with a wiring pattern 206. Therefore, due to the shielding effect of the wiring pattern 206, for the magnetic field to propagate to the side where the electronic component 400 is located, i.e., the opposite side of the substrate 201 as seen from the inductor 241a, it follows a path that bypasses the substrate 201, as shown in Figure 3(b). Magnetic fields 403 and 404, which bypass the substrate 201, pass through the nearest intersection 204 as seen from the inductor 241a in order to bypass the substrate 201. When this magnetic field reaches the electronic component 400, it links with the wiring loop consisting of various wirings such as GND wiring, matrix wiring, power wiring, and bonding wires provided on the package of the electronic component 400, thereby inducing an electromotive force in the wiring loop and generating magnetic noise. The generated magnetic noise affects the internal circuitry of the electronic component 400, degrading its functionality. In particular, in the case of an electronic component 400 having a pixel array 310 in which multiple pixels are arranged, a larger wiring loop is formed according to the size of the pixel area, which generates greater magnetic noise. For this reason, the diagonal length of the pixel array 310 is preferably 7 mm or more, and more preferably 10 mm or more. Doing so will allow the effects of this embodiment to be more fully realized. Also, if the pixel array 310 is too large, the effect of magnetic noise will be reduced, so the size of the pixel array 310 is preferably 1270 mm or less, and more preferably 410 mm or less. Furthermore, it is even more preferably 200 mm or less, and very preferably 60 mm or less. However, the size of the pixel array 310 is not particularly limited, and it is possible to reduce magnetic noise even with a pixel array outside the above range.

[0030] Here, noise refers not only to magnetic noise from the inductor 241, but also to magnetic noise generated from the FPC 55 and the components that hold the FPC 55, which can all be reduced.

[0031] In contrast, in Figure 3(a), which shows the configuration of this embodiment, a wall portion 212 is provided on the intersection line 204. As shown by magnetic fields 401 and 402, this wall portion 212 suppresses the propagation of the magnetic field generated from the inductor 241a by bypassing the substrate 201 and towards the side where the electronic component 400 is located. Therefore, by providing the wall portion 212, the magnetic field reaching the electronic component 400 is reduced.

[0032] Furthermore, since the shielding effect of the wall portion 212 alters the propagation of the magnetic field, it is desirable that the wall portion 212 has a thickness and conductivity greater than or equal to the skin thickness that provides a high shielding effect. The magnetic field generated from the inductor 241a originates from the winding portion 307 located inside. Therefore, in order to suppress the magnetic field generated from the inductor 241a, it is desirable that the height of the wall portion 212 in the direction perpendicular to the surface 102 be greater than or equal to the height h1 of the inductor 241a. In addition, by making the width of the wall portion 212 in the direction along the surface 102 greater than or equal to the width W1 of the inductor 241a, the magnetic field propagating to the electronic component 400 can be reduced.

[0033] Furthermore, it is preferable that the width of the wall portion 212 is greater than the sum of the width of the power supply portion that supplies power to the inductor 241a and the width W1 of the inductor 241a. By increasing the length of the width of the wall portion 212, even weak magnetic fields that bypass the wall portion 212 can be reduced. More specifically, it is preferable that the wall portion 212 is provided at a point where the straight-line distance between the intersection line 204 closest to the inductor 241a and the intersection line 205 second closest to the inductor 241a is shorter than the length L2.

[0034] In this embodiment, the wall portion 212 does not surround the inductor 241 in a plane with a height less than h1 from the surface 102, and there are places between the inductor 241 and the intersection lines of all sides where the wall portion 212 does not exist. That is, there is no conductive wall portion between the inductor 241 and the intersection line 205 that is greater than or equal to the height and width of the wall portion 212. Furthermore, there is no conductive wall portion that is away from the surface 102 and facing the surface 102, and the wall portion 212 is positioned so as not to overlap the inductor 241 in a direction perpendicular to the surface 102. If the wall portion 212 were to be arranged to surround the inductor 241, it would not be possible to surround the entire inductor 241 because the FPC 55 is provided. However, by not surrounding the inductor 241 with the wall portion 212, but instead providing it between the inductor 241a and the nearest intersection line 204, it is possible to sufficiently suppress noise.

[0035] In this embodiment, the wall portion 212 is provided along the entire intersection line 204 formed by the notch portion 203. With this configuration, most of the magnetic field that could not bypass the intersection line 204 returns to the inductor 241a. A small portion of the weak magnetic field will be directed towards the intersection line 205, which is the second closest to the inductor 241a. However, since it is located further away than the intersection line 204, the shielding effect of the substrate 201 reduces the magnetic field that reaches the electronic component 400. Here, we have described an embodiment in which the wall portion 212 is provided near the intersection line 204 closest to the inductor 241a, but even if it is provided at the second closest intersection line 205 instead of the intersection line 204, the influence of the magnetic field on the electronic component 400 can be reduced.

[0036] Up to this point, we have described the shielding effect of the wall portion 212, but in this embodiment, the wiring pattern 206 of the substrate 201 also has the effect of reducing magnetic field propagation to the electronic component 400. Since the magnetic field reduction effect of the wiring pattern 206 is due to the shielding effect of the wiring pattern 206, it is desirable that the wiring pattern 206 has a thickness and conductivity that is greater than or equal to the skin thickness. Here, the thickness of the wiring pattern 206 is the sum of the thicknesses of multiple layers connected by vias. Therefore, even if one layer is thinner than or equal to the skin thickness, it is acceptable as long as the sum of the thicknesses is sufficient. Also, it is acceptable to have a configuration in which wiring patterns or power supply layers necessary for other circuits are located between the multiple layers that make up the wiring pattern 206. As shown in Figure 3(a), it is desirable that the wall portion 212 is electrically connected to the wiring pattern 206 via pattern 207. With such a configuration, the shielding effect of the wiring pattern 206 and the wall portion 212 is increased, and magnetic noise can be reduced even further.

[0037] Furthermore, it is preferable that the inductor 241 is positioned so that it does not overlap with the pixel array 310 of the electronic component 400 via the substrate 201 in the direction in which the optical axis 4 extends. If magnetic noise penetrates from the inductor 241 through the substrate 201 to the surface 101 side, there is a risk that the electronic component 400 will be affected by the magnetic noise. For this reason, it is preferable to position the inductor 241 at a position different from the position facing the electronic component 400 in the direction in which the optical axis 4 extends. As shown in Figure 1(b), the substrate 201 is positioned so that it overlaps with the electronic component 400 and the pixel array 310 in the direction in which the optical axis 4 extends. The control means and circuits described above are mounted at the position facing the electronic component 400.

[0038] Length L1 is the distance between inductor 241a and intersection line 204. Length L2 represents the distance between inductors 241a, 241b, and 241c and intersection line 205. Here, length L1 is shorter than length L2. Therefore, among inductors 241a, 241b, and 241c, inductor 241a is closest to the intersection line on the substrate 201, and that intersection line is intersection line 204. In this case, it is preferable that length L1, which is the distance between inductor 241a and intersection line 204, is 5 mm or less. Length L1 does not necessarily have to be the distance from inductor 241a to intersection line 204, but is the distance from the inductor closest to the intersection line among inductors 241a, 241b, and 241c to the nearest intersection line.

[0039] The fact that the length L1 is within 5 mm allows the wall portion 212 to have a higher magnetic field reduction effect. This will be explained using Figure 4. Figure 4(a) is a schematic diagram of an electromagnetic field simulation model that analyzes the magnetic field reaching the opposite side of the inductor 501 when the length L3, which is the distance L3 between the intersection line 503 of the inductor 501 and the substrate 502, is changed.

[0040] The inductor 501 is mounted on the substrate 502, which is a roughly rectangular plate-shaped conductor made of copper with a thickness of 100 μm. The distance between the inductor 501 and the other intersection lines, excluding intersection line 503, is approximately 30 mm. The inductor 501 has a winding portion covered with a magnetic material, similar to the inductor 241a shown in Figure 3. The magnetic material portion corresponding to the core portion 302 has a relative permeability of 1000, and the magnetic material portion corresponding to magnetic material 303, located on the side of the winding, has a relative permeability of 500. The dimensions of the inductor 501 are approximately 3 mm in length, 3 mm in width, and 1.35 mm in height. The magnetic field observation surface 504 is a circular sheet with a diameter of 10 mm and is positioned parallel to the surface of the substrate 201. The position of the observation surface 504 is perpendicular to the surface of the substrate 201, and is located approximately 15 mm away from the substrate 201 on the opposite side from the inductor 501. A current of 54 mA at a frequency of 300 kHz is passed through the winding of inductor 501, and the magnetic field reaching the observation surface is being analyzed.

[0041] Figure 4(b) is a graph showing the simulation results, with the vertical axis representing the magnetic field reaching the observation surface 504 [nT] and the horizontal axis representing the distance L3 between the inductor 501 and the intersection line 503 [mm]. From Figure 4(b), it can be seen that as the length L3 increases, the magnetic field reaching the observation surface 504 decreases. This is because the shielding effect of the substrate 502 reduces the magnetic field that bypasses the intersection line 503 and reaches the observation surface 504. When the length L3 is 5 mm or more, the change in the magnetic field reaching the observation surface 504 with respect to distance is small. In contrast, when the distance is 5 mm or less, the magnetic field reaching the observation surface 504 changes rapidly with respect to distance. This is because when the distance is 5 mm or less, there is a particularly large amount of magnetic field that bypasses the intersection line 503 and reaches the observation surface 504. The wall section 212 has the effect of suppressing the magnetic field that bypasses the intersection line. In other words, a particularly high magnetic field suppression effect can be obtained by providing a wall when the magnetic field bypassing the intersection is large, and the distance between the inductor 501 and the intersection 503 is 5 mm or less. Therefore, when the length L1, which is the distance between the wall 212 and the intersection 204, is 5 mm or less, the wall 212 can have an even higher magnetic field reduction effect. Furthermore, it is preferable that the wall 212 is not located at a position between 6 mm and 20 mm from the inductor 241.

[0042] Next, the circuit 220 according to this embodiment will be described using Figure 5. The circuit 220 generates a drive signal based on an electrical signal corresponding to the drive amount of the electronic component 400 and sends the drive signal to the coil 53a. The circuit 220 is provided for each of the coils 53a, 53b, and 53c, but the circuit configuration is the same except for the output destination.

[0043] In circuit 220, the drive signal sent to coil 53a is output from the power supply wiring pattern 221 that supplies power to the driver IC, via driver IC 223. The output drive signal reaches coil 53a via circuit 240 and FPC 55. Driver IC 223 is also connected to GND wiring pattern 222.

[0044] To control the voltage of this drive signal, so-called PWM (Pulse Width Modulation) control is performed, which controls the duty cycle of the pulse width. PWM control controls the voltage by varying the duty cycle of a high-frequency AC signal. Therefore, the drive signal output from the driver IC 223 has a low-frequency DC current used for driving superimposed on it, along with harmonic AC currents due to the small amplitude PWM control drive frequency. Circuit 240 is provided to reduce this harmonic AC current flowing through coil 53a. Circuit 240 is a power conversion circuit, so-called low-pass filter circuit, composed of inductor 241a and capacitor 242a. However, a high-pass filter circuit or a band-pass filter circuit may also be used depending on the application.

[0045] Here, inductor 241 is described as an inductor mounted in a filter circuit, but it does not necessarily have to be an inductor mounted in a filter circuit. For example, it could be an inductor mounted in a voltage regulation circuit such as a DC-DC converter, a noise suppression inductor that suppresses the propagation of high-frequency noise, or an actuator inductor.

[0046] Figure 6(a) is a perspective view of the holding part 103, and Figure 6(b) is an exploded perspective view of the holding part 103. The holding part 103 according to this embodiment will be described using Figure 6. The holding part 103 consists of a movable part 50, an upper fixed part 60, and a lower fixed part 70.

[0047] The movable part 50 consists of an electronic component 400, a movable frame 51, coils 53a, 53b, and 53c, and an FPC 55.

[0048] The upper fixing portion 60 consists of an upper yoke 61 and magnets 62a, 62b, 62c, 62d, 62e, and 62f.

[0049] The lower fixing portion 70 consists of a base plate 71, main spacers 73a, 73b, and 73c, a lower yoke 75, and permanent magnets 76a, 76b, 76c, 76d, 76e, and 76f. Between the lower fixing portion 70 and the movable portion 50 are rolling balls 77a, 77b, and 77c that support the movable portion 50.

[0050] The upper yoke 61 and magnets 62a, 62b, 62c, 62d, 62e, and 62f, which are located on the upper fixing part 60, and the lower yoke 75 and magnets 76a, 76b, 76c, 76d, 76e, and 76f, which are located on the lower fixing part 70, form a magnetic circuit, creating a closed magnetic path. Magnets 62a, 62b, 62c, 62d, 62e, and 62f are adhesively fixed to the upper yoke 61 while being attracted to it. Similarly, magnets 76a, 76b, 76c, 76d, 76e, and 76f are adhesively fixed to the lower yoke 75 while being attracted to it. The magnets 62a and 62b, 62c and 62d, 62e and 62f, 76a and 76b, 76c and 76d, and 76e and 76f, which are adjacent to each other, are magnetized in different directions. Furthermore, the magnets 62a and 76a, 62b and 76b, 62c and 76c, 62d and 76d, 62e and 76e, and 62f and 76f, which are paired with magnets facing each other, are magnetized in the same direction. In this way, a strong magnetic flux density is generated in the four optical axis directions between the upper yoke 61 and the lower yoke 75.

[0051] Main spacers 73a, 73b, and 73c are positioned between the upper yoke 61 and the lower yoke 75 to maintain a predetermined distance. A movable part 50 is positioned between the upper yoke 61 and the lower yoke 75 with a gap between them. Rubber is installed on the cylindrical side surfaces of the main spacers 73a, 73b, and 73c, forming the mechanical ends (so-called stoppers) of the movable part.

[0052] The base plate 71 has holes to accommodate the magnets 76a, 76b, 76c, 76d, 76e, and 76f, and the surfaces of the magnets protrude from these holes. The base plate 71 and the lower yoke 75 are fixed together with screws (not shown), and the magnets 76a, 76b, 76c, 76d, 76e, and 76f, which are larger in thickness than the base plate 71, are fixed so that they protrude from the base plate 71.

[0053] The movable frame 51 is fitted with electronic components 400 and an FPC 55. Furthermore, coils 53a, 53b, and 53c are mounted on the lower fixed portion 70 side (negative Z-axis direction) of the FPC 55, and the FPC 55 supplies the power necessary for driving each coil 53a, 53b, and 53c.

[0054] The coils 53a, 53b, and 53c have their axial directions in the hollow portions formed by the windings approximately parallel to the optical axis 4, and are also positioned approximately on the same plane as the electronic component 400. Furthermore, a magnetic sensor (not shown) is mounted inside the hollow portions of the coils 53a, 53b, and 53c, which are inside the windings. The magnetic sensor (not shown) can detect the position of the movable part 50 when it moves in a plane approximately perpendicular to the optical axis 4 using the aforementioned magnetic circuit, and can use, for example, a Hall element. The magnetic sensor is also mounted on the FPC 55.

[0055] <Second Embodiment> Next, the electronic module 200 according to this embodiment will be described using Figure 7. Figure 7 is a cross-sectional view taken along the dashed line A-A' in Figure 2, in which a wall portion 213 is provided on the side surface 107.

[0056] This embodiment differs from the first embodiment in that the wall portion 212 is provided on the side surface 107 of the substrate 201. The arrow 405 in Figure 7 indicates the magnetic field flowing from the inductor 241a towards the wall portion 213. Note that the magnetic field generated from the inductor 241a is generated in a much larger quantity and more densely than shown in Figure 7. Also, it is generated in other directions, such as the opposite direction to the wall portion 212, but only representative examples are schematically shown in order to explain the change in magnetic field flow due to the wall portion 213.

[0057] In Figure 7, which shows the configuration of this embodiment, a wall portion 213 is provided on the side surface 107. The wall portion 213 has a length in the direction parallel to the surface of the substrate 201 that is greater than or equal to the width W1 of the inductor 241a in the direction along the intersection line 204. In addition, the height of the wall portion 212 in this embodiment is the height in the direction perpendicular to the side surface.

[0058] As indicated by arrow 405, the magnetic field generated from the inductor 241a is prevented from bypassing the intersection line 204 of the substrate 201 and propagating towards the side where the electronic component 400 is located. Therefore, by providing the wall portion 213, the magnetic field reaching the electronic component 400 is reduced. Since the propagation of the magnetic field is altered by the shielding effect of the wall portion 213, it is desirable that the wall portion 213 has a thickness and conductivity that is greater than or equal to the skin thickness that provides a high shielding effect. The thickness of the wall portion 213 here refers to its length in the direction perpendicular to the surface of the substrate 201.

[0059] As described above, in this embodiment, a wall portion 213 is provided on the side surface of the substrate 201. This configuration allows for control of the propagation of the magnetic field generated from the inductor 241a and reduces magnetic noise reaching the electronic component 400.

[0060] Furthermore, since there is no need to provide space for the wall portion 213 on the substrate 201, the substrate 201 can be made smaller.

[0061] <Third Embodiment> Next, an imaging device 1 will be described as an example of an electronic device equipped with the electronic module 200 according to the first and second embodiments.

[0062] Figure 8 is a front view of an imaging device 1, which is an example of an electronic device equipped with the electronic module 200 according to this embodiment. Figure 9 is a cross-sectional view of the imaging device 1.

[0063] The imaging device 1 consists of a housing 21 and a lens 22 that can be attached to the housing 21. The housing 21 houses electronic components 400, including an image sensor 300 that captures subject light that has passed through the lens 22, and a wiring board 500 on which the image sensor 300 is mounted. Here, the image sensor 300 is the silicon chip portion of the electronic component 400, and the image sensor 300 converts the light image formed on the light-receiving surface 301 into photoelectric signals and outputs pixel signals to the wiring board 500. In addition, a holding part 103 as a means of blur correction and a plurality of coils 104 that mechanically drive the holding part 103 are arranged. Each coil 104 generates a Lorentz force to drive the electronic component 400 in the direction opposite to the direction of hand shake. Here, the holding part 103 is an actuator as a vibration correction mechanism that corrects vibrations such as hand shake by making the electronic component 400 move in a plane substantially perpendicular to the optical axis 4, or by rotating it around the optical axis 4.

[0064] The lens 22 includes an optical system 202 that forms an optical image on the light-receiving surface 301 of the image sensor 300, and a coil 106, which is an example of an inductor element, that mechanically drives the optical system 202. The optical system 202 has a lens 210 located on the light-emitting side of the lens 22 and a lens 211 located on the light-injecting side. The lens 22 is provided with a mount 111 and a ring mount 209. The lens 210 is supported by the ring mount 209. The coil 106 is positioned so as not to obstruct the optical path from the optical system 202 to the light-receiving surface 301 of the image sensor 300, that is, as shown in Figure 8, it is located on the outer circumference of the image sensor 300 when viewed from the front.

[0065] Figure 10 is a circuit diagram showing an example of the configuration of the image sensor 300 according to this embodiment. The image sensor 300 shown in Figure 10 has an analog circuit 370 and a digital circuit 380. The analog circuit 370 has a pixel array 310, a vertical scanning circuit 306, and a peripheral circuit 305. The digital circuit 380 has a signal processing circuit 304. The following description will use the case where the pixel array 310, the vertical scanning circuit 306, the peripheral circuit 305, and the signal processing circuit 304 are arranged on the same plane as an example, but is not limited to this. A stacked structure may be adopted in which the pixel array 310, the vertical scanning circuit 306, the peripheral circuit 305, and the signal processing circuit 304 are each arranged on different planes in the Z direction.

[0066] The analog circuit 370 has an analog power supply wire 320 and an analog ground wire 330. The digital circuit 380 has a digital power supply wire 340 and a digital ground wire 350. Inside the image sensor 300, the analog power supply wire 320 and the digital power supply wire 340 are separated, and the analog ground wire 330 and the digital ground wire 350 are separated. Although not shown in the diagram, when viewed perpendicular to the light-receiving surface 301 of the image sensor 300, the analog power supply wire 320 and the analog ground wire 330 overlap, and the digital power supply wire 340 and the digital ground wire 350 overlap. The analog power supply wire 320 is connected to multiple analog power electrodes 321. The analog ground wire 330 is connected to multiple analog ground electrodes 331. The digital power supply wire 340 is connected to multiple digital power electrodes 341. The digital ground wire 350 is connected to multiple digital ground electrodes 351. Note that Figure 10 shows only one analog power electrode 321, one analog ground electrode 331, one digital power electrode 341, and one digital ground electrode 351.

[0067] The pixel array 310 includes a plurality of pixels 311 arranged in a two-dimensional matrix, i.e., in the row and column directions. The row direction is the horizontal direction in Figure 10. The column direction is the vertical direction in Figure 10. Each pixel 311 outputs a pixel signal as an analog signal, corresponding to the amount of light received. Each pixel 311 includes a photoelectric conversion unit and an amplification unit that outputs a signal based on the charge generated by the photoelectric conversion unit. Figure 10 shows a 2x4 pixel array 310 for simplification of the diagram, but the number of rows and columns of the pixel array 310 is not limited to this.

[0068] The vertical scanning circuit 306 performs drive control such as reset operation, storage operation, and signal readout operation of pixels 311 on a row-by-row basis. The peripheral circuit 305 includes a differential amplifier circuit that removes noise such as random noise and outputs the noise-free pixel signal as an analog signal. The signal processing circuit 304 processes the pixel signal according to the control of the vertical scanning circuit 306 and the peripheral circuit 305, converts it into a digital signal, and outputs the digital signal from the signal electrode 361 to the wiring board 500 in Figure 9.

[0069] Figure 11 is a schematic plan view of the electronic component 400 according to this embodiment. Figure 12 is a cross-sectional view of the electronic component 400 along line AA in Figure 11. Figure 12 shows a schematic side view of the cross-section of the electronic component 400. Figure 12 also schematically illustrates the GND wiring. The electronic component 400 includes an image sensor 300, a package 360, a wiring board 500, and a cover glass 603. In this embodiment, the wiring board 500 is a printed circuit board. The wiring board 500 has a conductor portion and an insulating portion. The conductor portion is made of a conductive metal material, such as copper or gold. The insulating portion is made of an electrically insulating insulating material, such as epoxy resin. In the case of a substrate-integrated electronic component 400, the electronic component 400 consists of an image sensor 300 and a wiring board 500 on which the image sensor 300 is directly mounted, with a cover glass 603 above the image sensor 300 and a support portion for supporting the cover glass 603. In the integrated circuit board electronic component 400, the wiring board 500 on which the image sensor 300 is mounted, the cover glass 603, and the support portion that supports the cover glass 603 correspond to the package 360. Here, directly mounting the image sensor 300 to the wiring board 500 means mounting the image sensor 300 to the wiring board 500 without using a package 360 ​​made of, for example, ceramic.

[0070] The wiring board 500 is a circuit board on which electronic components 400 are mounted, and is connected to the movable part 50, moving in accordance with vibrations caused by hand shake. The wiring board 500 is electrically connected to the circuit board 201 fixed to the housing 21 via the FPC 55.

[0071] The image sensor 300 is placed on the wiring board 500 and connected to the wiring board 500 by wire bonding. That is, the wiring of the image sensor 300 and the wiring of the wiring board 500 are electrically connected by multiple wires 610, which are multiple metal components as shown in Figure 11. Although the image sensor 300 is mounted on the wiring board 500 by wire bonding, it is not limited to this method and may also be mounted on the wiring board by flip-chip bonding. In this case, the image sensor and the wiring board are connected by multiple metal components such as multiple solder balls.

[0072] As shown in Figure 10, the analog circuit 370 of the image sensor 300 includes a pixel array 310 and an analog GND wiring 330 electrically connected to the pixel array 310. The wiring board 500 of the electronic component 400 according to this embodiment has a GND wiring 570 that serves as ground, as shown in Figure 12.

[0073] The GND wiring 570 is connected to multiple GND electrodes 531. The analog GND wiring 330 is connected to multiple analog GND electrodes 331. The multiple analog GND electrodes 331 and the multiple GND electrodes 531 are electrically connected by multiple wires 611. The multiple wires 611 are included in the multiple wires 610 in Figure 11.

[0074] Here, the imaging device 1 was described as an example of an electronic device, but the electronic module 200 according to this embodiment can be mounted on devices other than the imaging device 1. For example, it can be mounted on various electronic devices such as organic EL displays, EVFs (Electronic View Finders), and mobile phones.

[0075] The electronic component 400 has a pixel array 310 as a display area, in which multiple pixels are arranged. Examples of the electronic component 400 include a display. The display has the function of converting electrical signals into optical information. The electronic component 400 having a pixel array 310 as a display area may include a display element and a package that houses the display element.

[0076] Examples of displays include LCDs (Liquid Crystal Displays) and OLEDs (Organic Light Emitting Diodes) that emit light from organic materials when voltage is applied. The substrate for the OLED may be glass, silicon, or resin, but silicon is preferred when the diagonal length of the pixel array 310 is 60 mm or less. As for transistors, for example, a TFT (Thin Film Transistor) having a semiconductor layer such as polycrystalline or amorphous is formed on an insulating substrate such as glass or resin. Alternatively, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) can be formed by implanting impurities into a single-crystal silicon substrate to form a source, drain, and channel.

[0077] The embodiments described above can be modified as appropriate without departing from the technical concept.

[0078] For example, multiple embodiments can be combined. Furthermore, some elements of at least one embodiment can be deleted or replaced.

[0079] Furthermore, new matters may be added to at least one embodiment. The disclosures of this specification include not only those explicitly stated herein, but also all matters that can be understood from this specification and the accompanying drawings.

[0080] Furthermore, the disclosures in this specification include the complements of the individual concepts described herein. That is, if this specification contains a statement such as "A is greater than B," then even if it omits a statement such as "A is not greater than B," it can be said that this specification discloses "A is not greater than B." This is because the statement "A is greater than B" presupposes that the case where "A is not greater than B" is being considered. [Explanation of Symbols]

[0081] 101 Page 1 102 2nd page 107 Side view 200 Electronic Modules 201 circuit board 204, 205 intersection line 212, 213 Wall section 241 Inductors 400 Electronic Components

Claims

1. A substrate having a first surface, a second surface opposite to the first surface, and a side surface intersecting the first surface and the second surface, An electronic component having a pixel array in which multiple pixels are arranged, and positioned opposite the first surface, An electronic module comprising an inductor provided on the second surface, A conductive wall is provided between the intersection line of the second surface and the side surface and the inductor, or on the side surface. An electronic module characterized in that the height of the wall portion in the direction perpendicular to the second surface is greater than the height of the inductor, and the width of the wall portion in the direction along the intersection line is greater than the width of the inductor.

2. The electronic module according to claim 1, wherein the substrate has a plurality of sides including the sides that intersect the first surface and the second surface, and the plurality of intersection lines between the second surface and the plurality of sides include a first intersection line and a second intersection line that is further from the inductor than the first intersection line, and the wall portion is provided between the first intersection line and the inductor.

3. The electronic module according to claim 2, wherein the first intersection is the intersection closest to the inductor among the plurality of intersections.

4. The electronic module according to claim 2 or 3, characterized in that the distance between the inductor and the first intersection line is 5 mm or less.

5. The electronic module according to any one of claims 2 to 4, characterized in that there is no conductive wall between the inductor and the second intersection line having a height greater than or equal to the height of the wall and a width greater than or equal to the width of the wall.

6. The electronic module according to any one of claims 1 to 5, characterized in that the wall portion does not surround the inductor in a plane with a height less than the height of the inductor from the second surface.

7. The electronic module according to any one of claims 1 to 6, characterized in that there is no conductive wall portion that is separated from the second surface and facing the second surface at a position below the height of the wall portion in a direction perpendicular to the second surface.

8. The electronic module according to any one of claims 1 to 7, characterized in that the wall portion does not overlap the inductor in a direction perpendicular to the second surface.

9. The electronic module according to claim 1, characterized in that the wall portion does not exist within a range of 6 mm to 20 mm from the inductor.

10. The electronic module according to claim 1, wherein the substrate has a plurality of sides intersecting the first surface and the second surface, the plurality of sides including a first side and a second side which is further from the inductor than the first side, and the wall portion is provided on the first side.

11. The electronic module according to claim 10, wherein the first side surface is the side surface closest to the inductor among the plurality of side surfaces.

12. The electronic module according to any one of claims 1 to 11, characterized in that the wall portion is electrically connected to the conductive layer of the substrate.

13. The electronic module according to any one of claims 1 to 12, characterized in that the inductor is included in a power conversion circuit.

14. The electronic module according to any one of claims 1 to 13, characterized in that the inductor is included in the filter circuit.

15. The electronic module according to any one of claims 1 to 14, characterized in that the diagonal length of the pixel array is 10 mm or more and 60 mm or less.

16. The electronic module according to any one of claims 1 to 15, characterized in that the inductor is provided in a position that does not overlap the pixel array in a direction perpendicular to the second surface.

17. The electronic module according to any one of claims 1 to 16, characterized in that the wall portion is a non-conductive member covered with a conductive material.

18. The electronic module according to claim 17, characterized in that the wall portion is made of a gasket.

19. The electronic module according to any one of claims 1 to 18, characterized in that the wall portion is bonded to the substrate.

20. The electronic module according to any one of claims 1 to 19, characterized in that it comprises an actuator for moving the aforementioned electronic component.

21. The electronic module according to claim 20, characterized in that the actuator is a vibration compensation mechanism.

22. The electronic module according to any one of claims 1 to 21, characterized in that the aforementioned electronic component includes an image sensor.

23. An electronic module according to any one of claims 1 to 22, An electronic device comprising a housing that houses the aforementioned electronic module.

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