Carrier film

Abstract

To overcome a problem that according to an existing lamination method, it is difficult to combine removal of air bubbles and the followability of an embedding material.SOLUTION: A lamination method of a laminate device, which has a first chamber and a second chamber in which airflow in the chambers is blocked by a thin film member, and a substrate material and a film material are overlapped between a first press plate and a thin film member and transported in this state, comprises steps of: evacuating the first chamber and pressurizing the second chamber to press the film material to the base material by a thin film member to pressurize (S3); pressurizing in a direction where the base material and the film material are sandwiched by a first press plate and a second press plate to mold a molding (S4, S5); and pressurizing the first chamber and evacuating the second chamber to peel the thin film member from the molding (S6).SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a laminating apparatus, a laminating method, and a molded product manufacturing method for laminating a form material for filling irregularities on a substrate material having irregularities on its surface, for example.

Background Art

[0002] In recent years, in semiconductor devices, the multilayer formation of wiring layers for forming wiring layers has been progressing. In such a multilayer wiring substrate, a method of forming an interlayer insulating film formed between layers by attaching it by pressing may be employed. Therefore, a laminating apparatus for laminating a film material serving as an interlayer insulating film on a substrate material on which such an electronic circuit is formed has been proposed. An example of such a laminating apparatus is disclosed in Patent Document 1.

[0003] The laminating apparatus described in Patent Document 1 carries a circuit board into a vacuum laminating apparatus together with upper and lower carrier films, and by bringing the upper plate and the lower plate into contact with each other, an upper laminating and molding space is partitioned and formed between the upper plate and the upper carrier film, and a lower laminating and molding space is partitioned and formed between the lower plate and the lower carrier film. Both the upper laminating and molding space and the lower laminating and molding space are depressurized, and then the circuit board is pressed by the carrier film by continuing the depressurization of one laminating and molding space while pressurizing the other laminating and molding space.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The lamination apparatus described in Patent Document 1 has the advantage of allowing the filling material to conform well to narrow recesses between wiring because it applies air pressure to the circuit board. However, the lamination apparatus described in Patent Document 1 has the problem that it is not possible to apply high pressure to the film material being laminated, resulting in air bubbles remaining in narrow recesses that are not visible to the naked eye.

[0006] This invention has been made in view of the above circumstances, and aims to improve the ability to remove air bubbles while achieving high conformability when embedding a film material into a substrate material. [Means for solving the problem]

[0007] A lamination apparatus according to one embodiment is a lamination apparatus for forming a molded product in which a film material is laminated onto a substrate material, comprising: a chamber composed of a combination of an upper case and a lower case; a first press plate and a second press plate provided at mutually opposing positions within the chamber; a pressurizing mechanism that applies pressure to the molded product by changing the relative distance between the first press plate and the second press plate; a diaphragm positioned between the first press plate and the second press plate, facing the lamination surface on which the film material is laminated onto the substrate material, and dividing the chamber into a first chamber where the transport positions for the substrate material and the film material are set and a second chamber from which the airflow is blocked from the first chamber; and a mechanism that separates the first chamber and the second chamber. The pressurized device includes a pressure adjustment mechanism for reducing or increasing pressure, and a control unit for controlling the pressure adjustment mechanism and the pressurizing mechanism. The control unit performs the following steps: a diaphragm pressurizing step in which, with the substrate material and the film material positioned between the first and second press plates, the pressure of the first chamber is reduced and the pressure of the second chamber is increased, thereby pressing the film material against the substrate material with the diaphragm; a pressing step in which the substrate material and the film material are pressed between the first and second press plates in a direction that causes them to be sandwiched together to form the molded product; and a peeling step in which, with the first and second press plates spaced further apart than in the pressing step, the pressure of the first chamber is increased and the pressure of the second chamber is reduced, thereby peeling the diaphragm from the molded product.

[0008] A lamination method according to one embodiment is a lamination method for a lamination apparatus having a first chamber and a second chamber, the airflow inside the chamber being blocked by a thin film member, a first press plate being placed in the first chamber, a second press plate being placed in the second chamber, and a substrate material and a film material being transported in a state where they are stacked between the first press plate and the thin film member, and the method comprises: a pressurizing step in which, with the substrate material and the film material positioned between the first press plate and the second press plate, the first chamber is depressurized and the second chamber is pressurized to press the film material against the substrate material with the thin film member and pressurize it; a pressing step in which a molded product is formed by pressurizing the substrate material and the film material in a direction in which they are sandwiched between the first press plate and the second press plate; and a peeling step in which, with the first press plate and the second press plate spaced further apart than in the pressing step, the first chamber is pressurized and the second chamber is depressurized to peel the thin film member from the molded product.

[0009] A molded product manufacturing method according to one embodiment is a method for manufacturing a molded product in a lamination apparatus having a first chamber and a second chamber in which the airflow in the chamber is blocked by a thin film member, a first press plate is placed in the first chamber and a second press plate is placed in the second chamber, and a substrate material and a film material are transported in a state where they are stacked between the first press plate and the thin film member, comprising a pressurizing step in which, with the substrate material and the film material positioned between the first press plate and the second press plate, the first chamber is depressurized and the second chamber is pressurized so that the thin film member presses the film material against the substrate material and pressurizes it between the first press plate and the second press plate at 0.1 MPa to 1.0 MPa, and a pressing step in which a molded product is formed by pressing the substrate material and the film material between the first press plate and the second press plate at 1.0 MPa to 5.0 MPa in the direction in which they are sandwiched together.

[0010] In one embodiment of the lamination apparatus, lamination method, and molded product manufacturing method, a film material is laminated onto a substrate material with high conformability by diaphragm pressurization, and then pressurization is performed to apply high pressure to the molded product. [Effects of the Invention]

[0011] According to one embodiment of the lamination apparatus and lamination method, it is possible to improve the ability to remove air bubbles while achieving high conformability when embedding a film material into a substrate material. [Brief explanation of the drawing]

[0012] [Figure 1] This is a diagram showing the configuration of the lamination apparatus according to Embodiment 1. [Figure 2] This is a detailed configuration diagram of the chamber according to Embodiment 1. [Figure 3] This is a flowchart illustrating the flow of the lamination process according to Embodiment 1. [Figure 4] This is a detailed configuration diagram of the chamber according to Embodiment 2. [Figure 5] This is a flowchart illustrating the flow of the lamination process according to Embodiment 2. [Figure 6] This is a detailed configuration diagram of the chamber according to Embodiment 3. [Figure 7] This is a flowchart illustrating the flow of the lamination process according to Embodiment 3. [Figure 8] This is a schematic diagram illustrating a first example of the structure of a carrier film according to Embodiment 4. [Figure 9] This is a schematic diagram illustrating a second example of the structure of the carrier film according to Embodiment 4. [Modes for carrying out the invention]

[0013] For clarity of explanation, the following descriptions and drawings have been omitted and simplified as appropriate. Furthermore, the same elements are denoted by the same reference numerals in each drawing, and redundant explanations have been omitted where necessary.

[0014] Embodiment 1 Fig. 1 shows a configuration diagram of a laminating apparatus 1 according to Embodiment 1. The laminating apparatus 1 according to Embodiment 1 laminates a film material on a substrate material. Here, in the following description, an example in which a circuit board A is used as the substrate material and a film material B is laminated on the wiring layer formation surface of the circuit board A will be described. That is, the wiring layer formation surface of the circuit board A becomes the lamination surface on which the film material B is laminated in the following description. Further, the circuit board A has fine wirings formed thereon, such as semiconductor chips, and has an uneven pattern on its surface with a predetermined depth and interval. And the film material B forms an insulating layer for insulating between wiring layers of a semiconductor chip, and insulates between wirings formed in one wiring layer and between wirings formed in different layers. This film material B is, for example, a thermosetting resin.

[0015] In addition, in Fig. 1, illustration of a hydraulic pressure sensor for measuring the pressure generated by a cylinder, a pneumatic pressure sensor for measuring the pressure in the chamber, and a vacuum sensor is omitted. However, it is needless to say that information from various sensors is required for actual control. Further, in the following description, terms such as a pressurized state and a depressurized state are used as the air pressure state in the chamber. The pressurized state means an air pressure state of not less than atmospheric pressure, and the depressurized state means an air pressure state of less than atmospheric pressure.

[0016] As shown in Fig. 1, the laminating apparatus 1 according to Embodiment 1 includes a control unit 10, a hydraulic pump 11, a compressor 12, a vacuum pump 13, a chamber 14, a hydraulic valve H1, pneumatic valves P1 to P3, vacuum valves V1 to V3, and silencers SL1, SL2.

[0017] The chamber 14 will be described in detail with reference to FIG. 2. It has at least an upper case 20, a lower case 21, a thin film member (e.g., diaphragm 22), a first press plate (e.g., press plate 31), and a second press plate (e.g., press plate 41). The laminating device 1 also has a carrier film 23 for conveying a laminated product in which a circuit board A and a film material B to be laminated are overlapped within the chamber 14.

[0018] The chamber 14 is constituted by a combination of the upper case 20 and the lower case 21. At least one of the upper case 20 and the lower case 21 is configured to be movable in the vertical direction. For example, when moving the lower case 21 in the vertical direction, a hydraulic cylinder (not shown) for raising and lowering the lower case 21 is used.

[0019] In the chamber 14, the press plate 31 is disposed on the upper case 20 side, and the press plate 41 is disposed on the lower case 21 side. The press plate 31 is configured to be movable up and down within the upper case 20. In FIG. 1, the configuration for raising and lowering the press plate 31 is not shown. The press plate 41 is configured to be movable up and down by a hydraulic cylinder provided within the lower case 21. In the laminating device 1, with the upper case 20 and the lower case 21 separated, the carrier film 23 moves the laminated product to a position sandwiched between the press plate 31 and the press plate 41. Then, with the laminated product moved to a position sandwiched between the press plate 31 and the press plate 41, the laminating device 1 brings the upper case 20 and the lower case 21 into close contact, so that the chamber 14 becomes airtight and it is possible to pressurize or depressurize the inside.

[0020] The carrier film 23 should preferably have sufficient strength and flexibility to transport the laminated product. As the carrier film 23, PET or a film made of PET and elastomer can be used. In the example shown in Figure 1, the laminated surface of the circuit board A is placed facing the carrier film 23, and the film material B is placed between the circuit board A and the carrier film 23, thereby placing the laminated product on the carrier film 23. Alternatively, the circuit board A can be placed so that its laminated surface does not face the carrier film 23, and the film material B can be placed on top of its laminated surface.

[0021] The diaphragm 22 is positioned between the press plate 31 and the press plate 41, and is located opposite the lamination surface on which the film material B is laminated onto the circuit board A. In the example shown in Figure 1, the diaphragm 22 is provided on the lower case 21. The diaphragm 22 can also be provided on the upper case 20, but it must satisfy the condition that it is positioned between the press plate 31 and the press plate 41, and is located opposite the lamination surface on which the film material B is laminated onto the circuit board A. The diaphragm 22 divides the chamber into a first chamber CMB1 where the transport positions of the circuit board A and the film material B are set, and a second chamber CMB2 where the airflow is blocked from the first chamber CMB1. In this specification, an example is described in which a diaphragm 22 is used as a thin film member that blocks the airflow within the chamber 14 and divides the chamber 14 into a first chamber CMB1 and a second chamber CMB2. However, the thin film member may be a member that is at least partially fixed to the chamber at all times, such as the diaphragm 22, or it may be a member that is movable but fixed to the chamber 14 when the chamber 14 is formed, such as the carrier film 23.

[0022] The hydraulic pump 11 generates the hydraulic pressure supplied to the hydraulic cylinder that raises and lowers the press plate 41. The hydraulic valve H1 raises and lowers the press plate 41 by controlling the cylinder based on instructions from the control unit 10. The raising and lowering of the ram 44 is not limited to hydraulic pressure; it may also be done by pneumatic pressure or by a servo motor and ball screw. If the thickness of the circuit board A is to be set to a desired thickness, it is preferable to use the servo motor and ball screw method from the standpoint of ease of position control. In this case, the applied pressure can be controlled using a load cell.

[0023] The compressor 12 supplies compressed air to the first chamber CMB1 via piping connected to the pneumatic valve P1. The compressor 12 also supplies compressed air to the second chamber CMB2 via piping connected to the pneumatic valve P2. In the stacking apparatus 1, the control unit 10 controls the open / closed state of the pneumatic valves P1 and P2 to switch whether or not to pressurize the first chamber CMB1 and the second chamber CMB2.

[0024] The vacuum pump 13 removes air from the first chamber CMB1 through piping connected to the vacuum valve V1, thereby reducing the pressure in the first chamber CMB1. The vacuum pump 13 also removes air from the second chamber CMB2 through piping connected to the vacuum valve V2, thereby reducing the pressure in the second chamber CMB2. In the stacking apparatus 1, the control unit 10 controls the open / closed state of the vacuum valves V1 and V2 to switch whether or not to reduce the pressure in the first chamber CMB1 and the second chamber CMB2.

[0025] The pneumatic valve P3 is controlled by the control unit 10 to open when switching the second chamber CMB2 from a pressurized state to a depressurized state, and releases the exhaust air generated when switching from a pressurized state to a depressurized state to the outside. The vacuum valve V3 breaks the vacuum state of the first chamber CMB1 by taking in atmospheric air from the outside when switching the first chamber CMB1 from a depressurized state to a pressurized state. Silencers SL1 and SL2 are provided to reduce the noise generated by the input and output of air.

[0026] Here, the chamber 14 will be described in more detail. Figure 2 shows a detailed configuration diagram of the chamber according to Embodiment 1. Figure 2 schematically represents the configuration of the chamber 14, and the actual shape of the diaphragm 22 is flatter than shown in Figure 2. Figure 2 shows the state in which the product to be laminated has been transported into the chamber 14 and the chamber 14 is sealed. In Figure 2, an example is shown in which the laminated surface of the product to be laminated on the circuit board A is facing the carrier film 23, and the film material B is placed so as to be sandwiched between the carrier film 23 and the circuit board A.

[0027] As shown in Figure 2, the chamber 14 is composed of an upper case 20 and a lower case 21. The carrier film 23 extends between the upper case 20 and the lower case 21. The circuit board A and film material B, which will be laminated, are placed on the upper case 20 side of the carrier film 23.

[0028] A press plate 31 is provided inside the upper case 20. The press plate 31 may be configured to be able to move up and down within the upper case 20. In Figure 2, the press plate 31 is configured to be fixed. A surface elastic body 32 is provided on the surface of the press plate 31 that faces the circuit board A. It is desirable to use a material that combines heat resistance and flexibility for the surface elastic body 32, and for example, silicone rubber, fluororubber, polyimide, etc. can be used.

[0029] A diaphragm 22 is provided inside the upper case 20. The diaphragm 22 divides the chamber 14 into a first chamber CMB1, which is the transport position for the circuit board A and the film material B, and a second chamber CMB2, which is separated from the first chamber CMB1 by the airflow. The diaphragm 22 also expands toward the first chamber CMB1, applying pressure to press the film material B against the laminated surface of the circuit board A. It is desirable that the diaphragm 22 be made of a material that combines heat resistance and flexibility, such as silicone rubber or fluororubber. The thickness of the diaphragm 22 is, for example, 0.5 mm to 5.0 mm, and more preferably 1.0 mm to 3.0 mm. Furthermore, the hardness (Shore A hardness) of the diaphragm is, for example, 20 to 80 degrees, and more preferably 40 to 60 degrees. By making the hardness of the diaphragm 22 relatively soft, it can suitably follow the irregularities of the circuit board A. Furthermore, because the diaphragm 22 is flexible and stretchable, it does not interfere with the ram's movement or the pressure adjustment operation in the first and second pressing processes described later.

[0030] Furthermore, although Figure 2 shows an example in which the diaphragm 22 is provided as a separate component, the diaphragm 22 can also be substituted with the carrier film 23.

[0031] Furthermore, the upper case 20 is equipped with a press plate 41, a surface elastic body 42, a piston 43, and a ram 44. The piston 43 is the sliding part of a cylinder that displaces the press plate 41 toward the first chamber CMB1. One end of the ram 44 is joined to the piston 43, and the other end is joined to the press plate 41. The surface elastic body 42 is provided on the surface of the press plate 41 that faces the diaphragm 22. It is desirable to use a material that combines heat resistance and flexibility for the surface elastic body 42, and for example, silicone rubber, fluororubber, polyimide, etc. can be used.

[0032] Furthermore, an air port AP1 is provided in the upper case 20. Airport AP1 is a connection port for introducing or discharging air into or out of the first chamber CMB1, and piping connected to the compressor 12 and vacuum pump 13 is connected to it. An air port AP2 is provided in the lower case 21. Airport AP2 is a connection port for introducing or discharging air into or out of the second chamber CMB2, and piping connected to the compressor 12 and vacuum pump 13 is connected to it.

[0033] The lamination apparatus 1 according to Embodiment 1 has a distinctive feature in its lamination procedure for laminating film material B onto circuit board A, in addition to the configuration of the chamber 14 described above. Therefore, Figure 3 shows a flowchart illustrating the flow of the lamination process according to Embodiment 1. The pressurization control and depressurization control in the procedure shown in Figure 3 are controlled by the control unit 10. Note that the flowcharts described below, including Figure 3, mainly show the important points in pressure control for the laminated product, and other control procedures may be included in between.

[0034] As shown in Figure 3, in the lamination apparatus 1 according to Embodiment 1, when the lamination process is started, the circuit board A is first transported between the press plate 31 and the press plate 41, which are pressurized positions (step S1). Subsequently, the lower case 21 is raised to seal the chamber 14, and the first chamber CMB1 and the second chamber CMB2 are reduced in pressure (step S2).

[0035] Subsequently, the lamination apparatus 1 performs a diaphragm pressurization process (step S3) in which the first chamber CMB1 is kept under reduced pressure and the second chamber CMB2 is pressurized. In step S3, the pneumatic valve P2 and vacuum valve V1 are opened, and the pneumatic valve P1 and vacuum valve V2 are closed. In step S3, the diaphragm 22 bulges out toward the first chamber CMB1, and pressurization is applied so that the film material B is sandwiched between the lamination surface of the circuit board A and the diaphragm 22. The surface pressure at this time depends on the type of molded product, but is atmospheric pressure or 1.0 MPa, more preferably around 0.1 MPa to 1.0 MPa. Through this diaphragm pressurization process, the film material B adheres to the irregularities formed on the lamination surface of the circuit board A with high conformability. This diaphragm pressurization process ends when a preset pressurization time has elapsed. Furthermore, after depressurizing both the first chamber CMB1 and the second chamber CMB2 in step S2, pressurizing the second chamber CMB2 causes the diaphragm 22 of the uneven circuit board A to be pressed against it in a way that conforms to its shape, thereby improving the conformability of the film material B to the surface.

[0036] Next, the lamination apparatus 1 performs a pressing process to form a molded product by applying pressure in a direction in which the circuit board A and film material B are sandwiched between the press plate 31 and the press plate 41. In Figure 3, this pressing process is shown divided into a first pressing process and a second pressing process. In the first pressing process, both the first chamber CMB1 and the second chamber CMB2 are reduced in pressure, and the ram 44 is pushed up to press the press plate 41 against the press plate 31 (step S4). In the first pressing process, the pressure in the second chamber CMB2 is reduced by first opening the pneumatic valve P3 to reduce the pressure in the second chamber CMB2, which was set to a pressure of atmospheric pressure or higher in step S3, to approximately atmospheric pressure, and then closing the pneumatic valve P3 and opening the vacuum valve V2 to reduce the pressure in the second chamber CMB2 to below atmospheric pressure. The pressure in the second chamber CMB2 in the first pressing process can be arbitrarily adjusted within a range that does not exceed the pressure in the diaphragm pressurizing process, but it is preferable to set it to a reduced pressure state of atmospheric pressure or lower. This first pressing process is terminated when a predetermined pressure is achieved by the cylinder.

[0037] In the second pressing step, the second chamber CMB2 is pressurized while maintaining the reduced pressure in the first chamber CMB1, and the ram 44 is pushed up in the first pressing step to press the press plate 41 more firmly against the press plate 31 (step S5). In this second pressing step, the surface pressure applied to the film material B is approximately 5 MPa. This second pressing step ends after a predetermined pressurization time has elapsed. In this pressing step, the circuit board A and the film material B are pressurized at high pressure in a vacuum atmosphere, so air bubbles that form between the circuit board A and the film material B are removed with high efficiency. Furthermore, if a small amount of air is introduced into the second chamber CMB2 beforehand, or if the ram is raised and the diaphragm 22, which is in close contact with the press plate 41, is pressed against the molded product, then the second chamber CMB2 is pressurized, the sides of the molded product can be pressed by the diaphragm 22. This prevents the phenomenon of film material B flowing out from the sides of the molded product, so-called molding defects due to resin leakage, and allows for the production of desired molded products more favorably. For this reason, it is preferable to divide the pressing process into a first pressing process and a second pressing process. Furthermore, the air pressure in the second chamber CMB2 in the second pressing process can be arbitrarily adjusted within a range that does not exceed the air pressure in the diaphragm pressurizing process, but it is preferable to set it to be equal to or greater than the air pressure in the second chamber CMB2 in the first pressing process.

[0038] Next, the lamination apparatus 1, with the press plate 31 and press plate 41 separated from the second pressing step, pressurizes the first chamber CMB1 and depressurizes the second chamber CMB2 to perform a peeling step in which the diaphragm 22 is peeled off from the molded product (step S6). After that, the lamination apparatus 1 lowers the lower case 21 to release the sealed state of the chamber 14 (step S7), and transports the molded circuit board A to the next stage (step S8), thus ending the lamination process.

[0039] As described above, in the lamination apparatus 1 according to Embodiment 1, after applying diaphragm pressure to tightly adhere the film material B to the small irregularities formed on the laminated surface of the circuit board A with high conformability, press pressure with high bubble removal capability is applied, thereby enabling the formation of a molded product in which very few bubbles are generated between the circuit board A and the film material B, and in which the film material B is sufficiently filled to the irregularities of the circuit board A.

[0040] Furthermore, in the lamination apparatus 1, the pressure state of the first chamber CMB1 and the second chamber CMB2 is controlled by valves, eliminating the need for a single pump to have both air supply and air discharge capabilities, thus allowing for a more compact apparatus.

[0041] Embodiment 2 Embodiment 2 describes a chamber 14a, which is another form of chamber 14. In the description of Embodiment 2, components that are the same as those in Embodiment 1 are denoted by the same reference numerals as in Embodiment 1 and their descriptions are omitted.

[0042] Figure 4 shows a detailed configuration diagram of the chamber 14a according to Embodiment 2. As shown in Figure 4, the chamber 14a according to Embodiment 2 is modified by replacing the press plates 31 and 41 with hot plates 31a and 41a. Embodiment 2 describes an example in which a hot plate is used as a temperature control member and the film material B is heated using the hot plate in the temperature control process. However, the film material B can be both heated and cooled, and the temperature supplied to the film material B from the temperature control unit can be changed depending on the specifications of the lamination apparatus and the type of material of the film material B. In other words, the temperature control process described below is performed to adjust the viscosity of the film material B.

[0043] The molding process using these heating plates 31a and 41a will now be described. Figure 5 shows a flowchart illustrating the flow of the lamination process according to Embodiment 2. As shown in Figure 5, in the lamination process according to Embodiment 2, a temperature adjustment process (step S11) is performed between the diaphragm pressurizing process (step S3) and the first press pressurizing process (step S4) of the lamination process according to Embodiment 1 shown in Figure 3. In the temperature adjustment process, the heating plates 31a and 41a are heated to warm the circuit board A and the film material B.

[0044] By incorporating such a heating process, the lamination method according to Embodiment 2 makes it easier to control the viscosity of the thermosetting resin film material B, thereby improving the embedding ability of the film material B into the irregularities of the circuit board A and shortening the time required for pressurization.

[0045] Embodiment 3 Embodiment 3 describes a chamber 14b, which is another form of the chamber 14 according to Embodiment 1. In the description of Embodiment 3, the same reference numerals as in Embodiment 1 are used for components that are the same as in Embodiment 1, and their descriptions are omitted.

[0046] Figure 6 shows a detailed configuration diagram of the chamber 14b according to Embodiment 3. As shown in Figure 6, the chamber 14b has a diaphragm 51 which can be considered as a second diaphragm when the diaphragm 22 of the chamber 14 is considered as the first diaphragm. The diaphragm 51 is positioned between the press plate 31 and the press plate 41, and is positioned opposite the first diaphragm (for example, the carrier film 23) with the circuit board A and the film material B in between. The diaphragm 51 divides the first chamber CMB1 into the first chamber CMB1 and the third chamber CMB3, which is separated from the first chamber CMB1 by the airflow. More specifically, in the chamber 14b, the region sandwiched between the carrier film 23 and the diaphragm 51 becomes the first chamber CMB1, and the region on the upper case 20 side of the third chamber CMB3 becomes the third chamber CMB3. In addition, in chamber 14b, an air port AP1 for the first chamber CMB1 is provided in the lower case 21, and an air port AP3 for the third chamber CMB3 is provided in the upper case 20.

[0047] Next, the lamination method according to Embodiment 3 using chamber 14b will be described. Figure 7 shows a flowchart illustrating the flow of the lamination process according to Embodiment 3. As shown in Figure 7, the lamination process according to Embodiment 3 is the same as the lamination process according to Embodiment 1 described in Figure 3, but with steps S3 to S6 replaced by steps S21 to S25. In particular, a feature of the lamination process according to Embodiment 3 is the presence of two diaphragm pressurization steps.

[0048] As shown in Figure 7, in the lamination process according to Embodiment 3, after sealing the chamber 14b in step S2, a first diaphragm pressurizing process is performed in which the first chamber CMB1 is depressurized, the second chamber CMB2 is pressurized, and the third chamber CMB3 is brought to atmospheric pressure (step S21). Subsequently, as a second diaphragm pressurizing process, the first chamber CMB1 is depressurized, the second chamber CMB2 is pressurized, and the third chamber CMB3 is pressurized (step S22). Through this first and second diaphragm pressurizing process, the entire outer periphery of the circuit board A and film material B is covered by the diaphragm. Therefore, in Embodiment 3, the diaphragm surrounding the circuit board A and film material B prevents resin leakage of the film material B from leaking out of the circuit board A.

[0049] Next, in the lamination process according to Embodiment 3, a first pressing process is performed in which the ram 44 is raised while the first chamber CMB1 to the third chamber CMB3 are all under reduced pressure, thereby applying stronger pressure to the press plates 31 and 41 (step S23). After that, while maintaining the reduced pressure in the first chamber CMB1, the ram 44 is raised, and at the completion of the ram 44's rise or in a straight line to the completion of the rise, the second chamber CMB2 and the third chamber CMB3 are pressurized, thereby performing a second pressing process to increase the pressure applied to the circuit board A and the film material B (step S24). As a result, a molded product in which the film material B is laminated onto the circuit board A is completed.

[0050] Subsequently, in the lamination process according to Embodiment 3, the first chamber CMB1 is pressurized, and the second chamber CMB2 and the third chamber CMB3 are depressurized to perform a peeling process in which the diaphragm is peeled off from the molded product (step S25). After that, the lamination process according to Embodiment 3 is completed via steps S7 and S8, similar to Embodiment 1.

[0051] As described above, by using the chamber 14b according to Embodiment 3, the circuit board A and film material B can be surrounded by a diaphragm when pressurized, thus preventing resin leakage problems that occur when pressurized.

[0052] Embodiment 4 Embodiment 4 describes the carrier film 23 in detail. Embodiment 4 describes two forms of the carrier film 23. In the following description, the first example of the carrier film 23 will be referred to as carrier film 23a, and the second example as carrier film 23b.

[0053] Figure 8 shows a schematic diagram illustrating a first example (carrier film 23a) of the structure of a carrier film according to Embodiment 4. In Figure 8, the upper figure shows a top view of the carrier film 23a, and the lower figure shows a cross-sectional view of the carrier film 23a near the center in the short direction. As shown in Figure 8, the carrier film 23a has a structure in which a base film 61 and a mounting film 62 are superimposed. The mounting film 62 also has a hole sized to accommodate the object to be transported (for example, a circuit board A). Therefore, when the base film 61 and the mounting film 62 are bonded together, the carrier film 23a has a shape in which a recess is formed on the mounting surface into which the circuit board A is placed, into which the circuit board A fits.

[0054] Furthermore, Figure 9 shows a schematic diagram illustrating a second example (carrier film 23b) of the carrier film structure according to Embodiment 4. As shown in Figure 9, the shape of the holes provided in the support film 62 of the carrier film 23b differs from that of the carrier film 23a. Specifically, the outer circumference shape of the holes in the carrier film 23b has convex edges that protrude toward the object to be conveyed. In other words, the outer circumference shape of the holes in the carrier film 23b is corrugated.

[0055] Here, the base film 61 and the layered film 62 may be made of the same material or different materials. Also, the number of films to be layered must be two or more.

[0056] The transported object, circuit board A, is placed on the carrier film, and the circuit board A fits into recesses formed on the film, preventing it from shifting on the carrier film. In other words, by using a carrier film with recesses into which the circuit board A fits, the accuracy of the relative position between the press plates 31 and 41 and the circuit board A can be improved, and uneven pressure on the circuit board A can be reduced.

[0057] Furthermore, the carrier film is used under tension in the transport direction (for example, the longitudinal direction). In this case, having a corrugated outer circumference shape, as in carrier film 23b, allows the tension to be distributed diagonally, preventing wrinkles from forming on the bottom surface of the recess. Also, by adopting a corrugated outer circumference shape, as in carrier film 23b, displacement of the circuit board A within the recess can be prevented, further improving positional accuracy.

[0058] Furthermore, by using different materials for the base film 61 and the mounting film 62, the effect of preventing wrinkles caused by tension applied in the conveying direction can be enhanced.

[0059] It should be noted that the present invention is not limited to the embodiments described above, and can be modified as appropriate without departing from the spirit of the invention.

[0060] (Note 1) base film and A mounting film is superimposed on the aforementioned base film and has a hole large enough to accommodate the object to be transported, A carrier film having [a certain characteristic].

[0061] (Note 2) The outer periphery shape of the hole is the carrier film as described in Appendix 1, wherein the contour edge of the hole has a convex edge that protrudes toward the object to be conveyed.

[0062] (Note 3) The base film and the aforementioned carrier film are carrier films as described in Appendix 1, formed from different materials.

[0063] (Note 4) The carrier film described in Appendix 1 also functions as a diaphragm that partitions the chamber in which molding is performed on the object to be conveyed. [Explanation of Symbols]

[0064] 1. Lamination device 10 Control Unit 11. Hydraulic pump 12 Compressors 13 Vacuum pump 14 Chambers 20 Upper case 21 Lower case 22 Diaphragm 23 Carrier Film 31, 41 Pressed plates 31a, 41a hot plate 32, 42 Surface elastic bodies 43 Pistons 44 Lamb 51 Diaphragm 61 Base film 62 Mounting film Circuit board A B Film material CMB1 First Chamber CMB2 Second Chamber CMB3 Third Chamber

Claims

1. A chamber formed by a combination of an upper case and a lower case, A first press plate and a second press plate are provided in the chamber at positions facing each other, A pressurizing mechanism that applies pressure to a molded product by changing the relative distance between the first press plate and the second press plate, A diaphragm is positioned between the first press plate and the second press plate, facing the laminated surface on which the film material is laminated onto the substrate material, and divides the chamber into a first chamber where the transport positions for the substrate material and the film material are set, and a second chamber where the airflow is blocked from the first chamber. A pressure adjustment mechanism for reducing or increasing the pressure of the first chamber and the second chamber, respectively. It comprises a control unit that controls the pressure adjustment mechanism and the pressurization mechanism, The control unit operates with the substrate material and the film material positioned between the first press plate and the second press plate. A diaphragm pressurizing step is performed by depressurizing the first chamber and pressurizing the second chamber, thereby pressing the film material against the substrate material with the diaphragm, A pressing step in which the substrate material and the film material are pressed in a direction in which they are sandwiched between the first press plate and the second press plate to form the molded product, With the first press plate and the second press plate separated from the pressing step, the first chamber is pressurized and the second chamber is depressurized to separate the diaphragm from the molded product in a peeling step, A carrier film applied to a lamination apparatus that performs lamination, base film and A mounting film is superimposed on the base film and has holes of a size that keeps the substrate material within a certain range on the carrier film, It has, A carrier film that transports the substrate material to a position sandwiched between the first press plate and the second press plate.

2. The carrier film according to claim 1, wherein the outer periphery shape of the hole has a convex side that protrudes toward the substrate material side of the outline of the hole.

3. The carrier film according to claim 1, wherein the base film and the aforementioned carrier film are formed from different materials.

4. The carrier film according to claim 1, wherein the base film functions as the diaphragm.

Images