Notch detection device, resin molding apparatus, method for manufacturing resin molded product, and notch detection method

Abstract

To correctly detect the position of a notch in a plate-like object.SOLUTION: A notch detection device includes a mounted surface where a plate-like object having a notch is arranged, a sensor, and a processing part. The sensor is configured to be relatively rotated around a predetermined rotation axis along the outer peripheral edge of the object arranged on the mounted surface, repeatedly measures a distance between the rotation axis and the outer peripheral edge while being relatively rotated along the outer peripheral edge, and thereby acquires a series of distance data in a circumferential direction. The outer peripheral edge of the object extends so as to form a predetermined repetitive pattern in the circumferential direction, except for the part of the notch. The processing part divides the series of distance data acquired by the sensor into a plurality of groups corresponding to the repetitive pattern in the circumferential direction, and compares the divided distance data between the groups, and thereby detects the position of the notch.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a notch detection device, a resin molding device, a method for manufacturing a resin molded product, and a notch detection method.

Background Art

[0002] Patent Document 1 discloses a resin molding device for processing a wafer. In Patent Document 1, a notch called a notch is provided on the outer peripheral edge of the wafer, and the notch is used for positioning the wafer set in the lower mold during resin molding.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] As in the example of Patent Document 1, a notch may be provided in a plate-like object such as a wafer. The notch can be used in various applications, such as not only positioning the wafer as described above but also managing information regarding each chip by identifying each chip mounted on the wafer based on the position of the notch. In order to utilize the notch in such various applications, it is necessary to correctly detect the position of the notch when processing an object such as a wafer.

[0005] An object of the present invention is to provide a notch detection device, a resin molding device, a method for manufacturing a resin molded product, and a notch detection method capable of correctly detecting the position of a notch in a plate-like object.

Means for Solving the Problems

[0006] A notch detection device according to a certain aspect of the present invention comprises a mounting surface on which a plate-shaped object having a notch is placed, a sensor, and a processing unit. The sensor is configured to rotate relative to the outer edge of the object placed on the mounting surface around a predetermined axis of rotation, and acquires a series of distance data along the circumferential direction by repeatedly measuring the distance from the axis of rotation to the outer edge while rotating relative to the outer edge. The processing unit detects the position of the notch on the outer edge of the object based on the series of distance data acquired by the sensor. The outer edge of the object extends to form a predetermined repeating pattern along the circumferential direction, except for the notch portion. The processing unit divides the series of distance data into a plurality of groups corresponding to the repeating pattern along the circumferential direction, and detects the position of the notch by comparing the divided distance data among the groups.

[0007] A resin molding apparatus according to another aspect of the present invention comprises the above-described notch detection device and a mold. The object to be molded is placed in the mold such that the notch detected by the notch detection device is positioned at a predetermined location, and is molded with resin within the mold.

[0008] A method for manufacturing a resin molded article according to yet another aspect of the present invention is a method for manufacturing a resin molded article using the resin molding apparatus described above. This manufacturing method includes detecting the position of a notch with the notch detection device described above, arranging an object in a mold so that the notch detected by the notch detection device is positioned at a predetermined location, and molding the object with resin in the mold to manufacture a resin molded article.

[0009] A notch detection method according to yet another aspect of the present invention includes: rotating a sensor relative to the outer edge of a plate-shaped object having a notch around a predetermined axis of rotation; acquiring a series of distance data along the circumferential direction by repeatedly measuring the distance from the axis of rotation to the outer edge with the sensor while the sensor is rotating relative to the outer edge; and detecting the position of the notch on the outer edge based on the series of distance data acquired by the sensor. The outer edge of the object extends to form a predetermined repeating pattern along the circumferential direction, except for the portion with the notch. Detecting the position of the notch includes dividing the series of distance data into a plurality of groups corresponding to the repeating pattern along the circumferential direction, and detecting the position of the notch by comparing the divided distance data among the groups. [Effects of the Invention]

[0010] According to the present invention, the position of a notch in a plate-shaped object can be accurately detected. [Brief explanation of the drawing]

[0011] [Figure 1] This figure schematically shows a plan view of a resin molding apparatus according to one embodiment. [Figure 2] This is a plan view of a substrate before resin molding according to one embodiment. [Figure 3] This figure schematically shows a side view of a positioning mechanism according to one embodiment. [Figure 4] This is a schematic side cross-sectional view showing a portion of a press module before clamping according to one embodiment. [Figure 5] This is a schematic side cross-sectional view showing a portion of a press module after clamping according to one embodiment. [Figure 6] This is a cross-sectional view taken along the line VI-VI in Figure 4. [Figure 7] This is a flowchart showing the flow of a notch detection method according to one embodiment. [Figure 8A] This is an example of a graph showing a series of distance data points along the circumferential direction. [Figure 8B]This is an example of a graph that overlays graphs from multiple groups. [Figure 8C] This is an example of a graph showing the average values ​​of graphs for multiple groups. [Figure 8D] This is an example of a graph of the absolute value of a deviation. [Figure 9] This is a plan view of the substrate according to a modified example. [Modes for carrying out the invention]

[0012] Hereinafter, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, each drawing is schematically depicted with parts omitted or exaggerated as appropriate for ease of understanding.

[0013] [1. Configuration of the resin molding apparatus] Figure 1 is a schematic diagram showing a plan view of a resin molding apparatus 10 according to this embodiment. The resin molding apparatus 10 is configured to resin-molde an object using a resin material R1. An example of an object is a substrate 60 on which a large number of electronic components 61, such as semiconductor chips, are mounted. For example, in the resin molding apparatus 10, the side of the substrate 60 on which the electronic components 61 are mounted is resin-encapsulated (resin-molded) to produce a resin-molded substrate 60. In the following description, the substrate before resin molding (object to be molded) 60 may be denoted by reference numeral 60A, and the resin-molded substrate (resin-molded product) 60 may be denoted by reference numeral 60B to distinguish between the two.

[0014] The substrate 60 is, but is not limited to, a thin, plate-shaped component called a wafer in this embodiment. The substrate 60 is composed of, for example, a semiconductor substrate such as a silicon wafer, a metal substrate, a resin substrate, a glass substrate, or a ceramic substrate. The substrate 60 may also be composed of, for example, a carrier used in FOWLP (Fan Out Wafer Level Packaging). The substrate 60 may or may not have wiring already applied to it.

[0015] FIG. 2 is a plan view of the substrate 60A before resin molding. As shown in FIG. 2, the substrate 60A includes a thin plate-shaped substrate body 62 and a number of electronic components 61 such as semiconductor chips integrated on the substrate body 62. A notch 63 is provided in the substrate 60A. In the example of FIG. 2, the notch 63 is formed in a V shape. The notch 63 is a notch provided in the outer peripheral edge P1 of the substrate 60A (that is, the substrate body 62) to indicate the position and direction of each electronic component 61 on the substrate body 62. Each electronic component 61 can be identified based on the position of the notch 63. In the present embodiment, the notch 63 is used for positioning the substrate 60A set in the mold 305 during resin molding.

[0016] As shown in FIG. 1, the resin molding apparatus 10 includes a release film module 110, a resin module 120, a press module 130, a transport module 140, and a control unit 150. Each module is configured to be detachable from an adjacent module. In the example of FIG. 1, the resin molding apparatus 10 includes one press module 130, but two or more press modules 130 may be included.

[0017] The control unit 150 is configured to control the entire resin molding apparatus 10. The control unit 150 controls, for example, the release film module 110, the resin module 120, the press module 130, and the transport module 140. The control unit 150 includes a hardware processor such as a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory), and is configured to perform information processing based on programs and various data. The control unit 150 may be implemented by multiple computers. Typically, the control unit 150 is located adjacent to modules 110, 120, 130, and 140, or within the same casing as modules 110, 120, 130, and 140, but at least a part of the control unit 150 may be located remotely. The control unit 150 is an example of a processing unit. Input devices such as buttons and touch panels (not shown) and a display (not shown) are connected to the control unit 150.

[0018] In the release film module 110, a release film 11 of a desired shape is produced. In the resin module 120, a resin material R1 is supplied onto the release film 11. In this embodiment, the resin material R1 is a liquid resin, but is not limited thereto; for example, it may be a powder or granular resin (granular resin). Also, although not limited thereto, the resin material R1 is typically a thermosetting resin.

[0019] In the press module 130, compression molding is performed with the substrate 60A, which has been transported by the transport module 140, and the release film 11, to which the resin material R1 has been supplied, positioned in a predetermined location on the mold 305. This produces a resin molded product, substrate 60B. The substrate 60B is transported by the transport module 140 and housed in a predetermined location (second housing section 146). Each module will be described in detail below.

[0020] The release film module 110 is configured to cut and separate a circular release film 11 from a long release film. The release film 11 is used to prevent the resin from adhering to the mold 305 after compression molding in the press module 130, and to facilitate the removal of the substrate 60B from the mold 305. As the material for the release film, a resin material having properties such as heat resistance, release properties, flexibility, and extensibility is used. For example, PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, or polyvinylidene chloride can be used.

[0021] The release film module 110 includes a moving mechanism 111, a film roll 112, and a film gripper 113. The moving mechanism 111 is located between the film roll 112 and the film gripper 113 in the direction of arrow Y. The moving mechanism 111 is configured to move between the release film module 110 and the resin module 120. The moving mechanism 111 is movable, for example, in the direction of arrow X and arrow Y.

[0022] A table 114 is positioned on the upper surface of the moving mechanism 111. The table 114 is a fixing base for fixing the release film 11. The release film pulled from the film roll 112 is fixed on the table 114. The film gripper 113 is configured to pull the release film from the film roll 112 and to fix the leading edge of the pulled-out release film. On the moving mechanism 111, the release film is cut by a cutter (not shown) to create a circular release film 11. For example, the release film 11 may be fixed to the upper surface of the table 114 by suction using a suction mechanism (not shown), such as a decompression pump, through a suction hole (not shown) formed on the upper surface of the table 114.

[0023] The resin module 120 is configured to supply resin material R1 onto the release film 11 and to transport the release film 11 on which the resin material R1 has been supplied to a predetermined position in the mold 305. The resin module 120 includes a supply mechanism 123, a resin loader 121, and a post-processing mechanism 122.

[0024] The supply mechanism 123 is configured to supply the resin material R1 to the release film 11 placed on the table 114 of the moving mechanism 111, with the table 114 of the moving mechanism 111 positioned downwards. The supply mechanism 123 is movable, for example, in the direction of arrow X and arrow Y. For example, the supply position of the resin material R1 on the release film 11 is adjusted by moving the supply mechanism 123 while the resin material R1 is being supplied. Alternatively, the supply position of the resin material R1 on the release film 11 may be adjusted by moving the table 114 of the moving mechanism 111 while the resin material R1 is being supplied. It is preferable that the supply mechanism 123 is configured to move relative to the table 114 when supplying the resin material R1.

[0025] The resin loader 121 and the post-processing mechanism 122 are configured as an integral part of the same unit. The resin loader 121 and the post-processing mechanism 122 are configured to move between the resin module 120, the press module 130, and the transport module 140 via rails 142.

[0026] The resin loader 121 is configured to hold the release film 11 by sucking its peripheral edge from above, and to move the release film 11 from the moving mechanism 111 to a predetermined position on the mold 305. The post-processing mechanism 122 is configured to clean the mold 305 and remove the release film 11 from the mold 305 after compression molding by the mold 305.

[0027] The transport module 140 is configured to transport the substrate 60A housed in the first housing section 145 to a predetermined position on the mold 305, and to transport the substrate 60B (resin molded product) manufactured in the press module 130 to the second housing section 146. The transport module 140 includes a substrate loader 141, a rail 142, a robot arm 143, the first housing section 145, the second housing section 146, and a positioning mechanism 147. In the transport module 140, for example, the substrate 60 is transported by the substrate loader 141, which holds the substrate 60, moving along the rail 142. The rail 142 extends across the areas of the transport module 140, the press module 130, and the resin module 120.

[0028] The first housing section 145 is configured to house the substrate 60A before resin molding, and the second housing section 146 is configured to house the resin-molded substrate 60B. The robot arm 143 removes the substrate 60A from the first housing section 145 and hands it over to the positioning mechanism 147.

[0029] Figure 3 is a schematic diagram showing a side view of the positioning mechanism 147. As shown in Figure 3, the positioning mechanism 147 includes a turntable 40, a shaft 41, a motor 42, and a sensor 43. The positioning mechanism 147 detects the position of a notch 63 on the outer peripheral edge P1 of the substrate 60A and positions the substrate 60A in the rotational direction (circumferential direction). That is, the positioning mechanism 147 adjusts the orientation of the rotational direction of the substrate 60A based on the position of the notch 63. Subsequently, the substrate 60A is transported to the molding die 305 by the robot arm 143 and the substrate loader 141 and set inside the molding die 305. At this time, the robot arm 143 and the substrate loader 141 transport the substrate 60A with the notch 63 fixed in a predetermined position relative to themselves. The substrate 60A is then set inside the molding die 305 so that the notch 63 is fixed in a predetermined position inside the molding die 305. This positions the rotational direction of the substrate 60A within the molding die 305.

[0030] The robot arm 143 places the substrate 60A, which has been removed from the first housing 145, onto the top surface of the turntable 40 (an example of a mounting surface). At this time, the substrate 60A is positioned on the turntable 40 with the mounting surface of the electronic components 61 facing upwards. The robot arm 143 also places the substrate 60A on the turntable 40 such that, in a plan view, the center C1 of the substrate 60A and the center C2 of the turntable 40 roughly coincide. In this embodiment, the turntable 40 is disc-shaped. In a plan view, the substrate 60A is larger than the turntable 40, and the outer circumference of the substrate 60A extends beyond the turntable 40 all around.

[0031] A shaft 41 is fixed to the underside of the turntable 40, coaxially with the turntable 40. The shaft 41 is connected to a motor 42, and the turntable 40 rotates around a predetermined axis of rotation A1 when the shaft 41 is rotationally driven by the motor 42. The rotation of the shaft 41 and the turntable 40 is controlled by a control unit 150 connected to the motor 42. The axis of rotation A1 passes through the center C2 of the turntable 40 in a plan view and extends in the vertical direction.

[0032] The sensor 43 includes a light source 431, a light receiver 432, and a frame 433. The frame 433 supports the light source 431 and the light receiver 432 so that they face each other with a gap between them. The light emitted by the light source 431 is detected by the light receiver 432 unless there is an obstruction between them. The frame 433 is positioned to the side of the turntable 40 so that the outer periphery of the substrate 60A, which is placed on the turntable 40, is inserted between the light source 431 and the light receiver 432. For example, the light receiver 432 includes a plurality of light-receiving elements that constitute an array, and the plurality of light-receiving elements are arranged radially with respect to the rotation axis A1. Alternatively, multiple light sources 431 may be provided and configured in an array facing the array of light-receiving elements.

[0033] The sensor 43 is configured to rotate relative to the rotation axis A1 along the outer peripheral edge P1 of the substrate 60A, which is placed on the turntable 40. In this embodiment, the sensor 43 is fixed, and the turntable 40 rotates around the rotation axis A1. However, the relative rotation described above may also be achieved by rotating only the sensor 43, or by rotating both the sensor 43 and the turntable 40.

[0034] The control unit 150 rotates the turntable 40 on which the substrate 60A is mounted. During this time (i.e., while the sensor 43 is rotating relative to the outer edge P1 of the substrate 60A), the sensor 43 repeatedly measures the distance from the rotation axis A1 to the outer edge P1 of the substrate 60A. More specifically, the control unit 150 causes the light source 431 to emit light and the light receiver 432 to detect the intensity of that light. The amount of light received by the light receiver 432 is reduced relative to the amount of light from the light source 431 if there is something blocking the light between the light source 431 and the light receiver 432. The more light is blocked, the less light is received by the light receiver 432. Here, as described above, the outer edge of the substrate 60A is inserted between the light source 431 and the light receiver 432, and this blocks the light from the light source 431 to the light receiver 432. Therefore, the longer the distance from the rotation axis A1 to the outer edge P1 of the substrate 60A, the greater the amount of light blocked, and the weaker the intensity of the light received by the light receiver 432. Conversely, the shorter the distance from the rotation axis A1 to the outer edge P1 of the substrate 60A, the less light is blocked, and the stronger the intensity of the light received by the light receiver 432. Consequently, the data of the light intensity received by the light receiver 432 becomes distance data indicating the distance from the rotation axis A1 to the outer edge P1 of the substrate 60A. The sensor 43 repeatedly acquires distance data by repeatedly measuring the intensity of the light received by the light receiver 432 while the substrate 60A is rotating around the rotation axis A1. In this way, the sensor 43 acquires a series of distance data along the circumferential direction with respect to the rotation axis A1. The control unit 150 detects the position of the notch 63 on the outer edge P1 of the substrate 60A based on the series of distance data acquired by the sensor 43. The control unit 150 then rotates the turntable 40 to rotate the substrate 60A so that the detected notch 63 is in a predetermined position, thereby positioning the substrate 60A in the rotational direction (circumferential direction).

[0035] Subsequently, the robot arm 143 retrieves the substrate 60A, which has been positioned in the rotational direction (circumferential direction) by the positioning mechanism 147, from the turntable 40 and hands it over to the substrate loader 141. More specifically, the robot arm 143 inverts the substrate 60A and places it on the upper surface of the substrate loader 141. As a result, the substrate 60A is held by the substrate loader 141 with the mounting surface of the electronic components 61 facing downwards. The substrate loader 141 transports the substrate 60A from a predetermined position near the robot arm 143 to a predetermined position on the mold 305, and hands over the substrate 60A to the mold 305 with the mounting surface of the electronic components 61 still facing downwards.

[0036] Furthermore, the substrate loader 141 retrieves the resin-molded substrate 60B from the mold 305 with the mounting surface of the electronic components 61 facing downwards, and transfers it to the robot arm 143 indirectly or directly via another device. Upon receiving the substrate 60B, the robot arm 143 flips the substrate 60B over and places it into the second housing section 146. As a result, the substrate 60B is placed in the second housing section 146 with the resin-molded surface facing upwards.

[0037] Figures 4 and 5 are schematic side cross-sectional views showing a part of the press module 130. Figure 4 shows the state before mold clamping, and Figure 5 shows the state after mold clamping. As shown in Figures 4 and 5, the press module 130 includes an outer frame member 301, a fixed platen 310, a movable platen 330, and a molding die 305. An example of the molding die 305 is a metal mold. In this embodiment, the press module 130 is configured to manufacture a resin molded product (substrate 60B) by using a so-called compression molding method. However, the resin molding method is not limited to this, and the substrate 60B may be manufactured by another method, such as a transfer molding method, by changing the press module 130 to another molding module.

[0038] The outer frame member 301 is composed of tie bars (columns) or hold frames (plate members). When the outer frame member 301 is composed of tie bars, for example, it is composed of four tie bars arranged at the four corners. Each of the four tie bars extends in the vertical direction. When the outer frame member 301 is composed of hold frames, for example, it is composed of two hold frames arranged on the left and right sides. The wide surfaces of the two hold frames face each other in the left-right direction.

[0039] The fixed platen 310 is a rectangular plate-shaped member in plan view. The fixed platen 310 is fixed to the upper part of the outer frame member 301. The movable platen 330 is located inside the outer frame member 301 and below the fixed platen 310. The movable platen 330 is configured to move in the vertical direction. The movement of the movable platen 330 is achieved, for example, by a clamping mechanism (not shown). The clamping mechanism is achieved, for example, by a combination of a servo motor and a ball screw, or a combination of a hydraulic cylinder and a linkage mechanism.

[0040] The molding die 305 includes an upper die 320 and a lower die 340. The molding die 305 is positioned inside the outer frame member 301, between a fixed platen 310 and a movable platen 330. More specifically, the upper die 320 is fixed to the lower surface of the fixed platen 310, and the lower die 340 is fixed to the upper surface of the movable platen 330. As the movable platen 330 moves vertically, the lower die 340 also moves vertically along with the movable platen 330. The molding die 305 is clamped when the movable platen 330 rises.

[0041] The lower mold 340 includes a base plate 344, a bottom member 341, a spring 343, and a side member 342. The base plate 344 is a rectangular plate-shaped member in plan view. The base plate 344 is fixed to the upper surface of the movable platen 330. The bottom member 341 is a rectangular block-shaped member in plan view. The bottom member 341 is fixed to the upper surface of the base plate 344 and is located approximately in the center of the base plate 344. The side member 342 is a frame-shaped member that surrounds the bottom member 341. The side member 342 is fixed to the bottom member 341 via a plurality of springs 343.

[0042] The upper surface of the side member 342 is located above the upper surface of the bottom member 341, and a recess (cavity) is formed on the upper surface of the lower mold 340. The release film 11 on which the resin material R1 is placed is transported by the resin loader 121 and placed in this recess. The substrate 60A, which is received from the substrate loader 141, is placed on the lower surface of the upper mold 320. At this time, the substrate 60A is held on the lower surface of the upper mold 320 by means of suction or other methods, with the mounting surface of the electronic components 61 facing downwards. At this time, the control unit 150 controls the notch 63 to be positioned in a predetermined position on the lower surface of the upper mold 320. In other words, the control unit 150 controls the rotation direction (circumferential direction) of the substrate 60A held on the lower surface of the upper mold 320 to be in a predetermined direction, based on the position of the notch 63 detected by the positioning mechanism 147. As a result, the rotation direction of the substrate 60A is positioned within the molding die 305. Then, with the substrate 60A placed on the lower surface of the upper mold 320 and the release film 11 and resin material R1 placed in the recess of the lower mold 340, the mold 305 is clamped. As a result, the mounting surface of the electronic components 61 on the substrate 60A is resin-sealed. During resin sealing, the resin material R1 is appropriately heated by a heating mechanism (not shown).

[0043] Figure 6 is a cross-sectional view taken along line VI-VI in Figure 4. As shown in Figures 4 to 6, positioning pins 321 are provided on the lower surface of the upper mold 320. The substrate 60A is held on the lower surface of the upper mold 320 with the pins 321 aligned with the notches 63. More specifically, the substrate loader 141 transfers the substrate 60A to the upper mold 320 so that the pins 321 engage with the notches 63. This more reliably prevents movement, including rotation, of the substrate 60A within the mold 305 during resin molding, resulting in more stable resin molding.

[0044] Furthermore, to more reliably prevent movement, including rotation, of the substrate 60A, it is not necessary to insert the pin 321 into the notch 63. For example, one or more holes may be formed near the preferably outer periphery of the substrate 60A, and one or more pilot pins provided on the upper mold 320 may be inserted into these one or more holes. In this case, the control unit 150 can position the pilot pins relative to the holes by positioning the substrate 60A in the rotational direction on the lower surface of the upper mold 320 with respect to the position of the notch 63. Alternatively, as long as the substrate 60A is held fairly firmly on the lower surface of the upper mold 320 by means of suction or other methods, the positioning pins (including the pin 321 and pilot pins mentioned above) can be omitted.

[0045] Furthermore, the substrate 60A can be placed in the recess of the lower mold 340 with the mounting surface of the electronic components 61 facing upward, and the mold clamping of the molding die 305 can be performed while the resin material R1 is supplied onto the substrate 60A. In this case, positioning pins similar to the pins 321 or pilot pins described above can be provided on the lower mold 340.

[0046] [2. Details of the circuit board shape] The shape of the substrate 60A according to this embodiment will be described in detail below with reference to Figure 2. However, the shape of the object to which the present invention is applied is not limited to the shape of the substrate 60A described herein.

[0047] The substrate body 62 included in the substrate 60A has a notch 63. The outer edge P1 of the substrate 60A (i.e., the substrate body 62) extends in a circumferential direction with respect to the center C1 in a plan view, except for the portion with the notch 63, to form a predetermined repeating pattern. In the example in Figure 2, four identical patterns PT1 to PT4 are repeated in this order along the circumferential direction. However, since pattern PT1 includes a notch 63, pattern PT1 has a different shape from the other patterns PT2 to PT4 only in the portion with the notch 63.

[0048] The substrate 60A has a rotationally symmetric shape in plan view, except for the notch 63. In the example in Figure 2, the outer edge P1 contains four patterns PT1 to PT4, and since it overlaps with itself every 90 degrees of rotation, it has a four-fold symmetric shape. In other words, the number of rotational symmetries is 4.

[0049] Patterns PT1 to PT4 each contain arc sections B1 to B4 and straight sections L1 to L4. Arc sections B1 to B4 are all arcs with respect to the center C1. Straight sections L1 to L4 all extend linearly, connecting the endpoints of two adjacent arc sections B1 to B4. However, straight section L1 is cut out at the notch 63. Even excluding the notch 63, the substrate 60A is not circular.

[0050] The shortest distance from the center C1 of the substrate 60A to the outer edge P1 is the distance between the center C1 and the straight sections L1 to L4. Therefore, in this embodiment, the shortest distance from the center C1 to the outer edge P1 is different from the distance from the center C1 to the notch 63 (the innermost end of the contour of the notch 63 along the radial direction).

[0051] Using the sensor 43 described above, a series of distance data indicating the distance from the rotation axis A1 to the outer edge P1 of the substrate 60A can be obtained along the circumferential direction with respect to the rotation axis A1. Therefore, if the substrate 60A is circular except for the notch 63, the position in the circumferential direction corresponding to the data showing the shortest distance among the series of distance data can be determined as the position of the notch 63 by aligning the rotation axis A1 with the center C1 of the substrate 60A. However, since the substrate 60A in this case is not circular, the position of the notch 63 cannot be detected using the above algorithm. According to the method described below, the position of the notch 63 can be correctly detected even for a non-circular substrate 60A.

[0052] [3. Method for manufacturing resin molded products] Next, a method for manufacturing a resin molded product (substrate 60B) using the resin molding apparatus 10 will be described. During the manufacturing process of the substrate 60B, the positioning mechanism 147 and the control unit 150 (an example of a notch detection device) described above detect the position of the notch 63 on the substrate 60A, and the rotational positioning of the substrate 60A is performed. Figure 7 is a flowchart showing the flow of the notch detection method. Below, the manufacturing method of the substrate 60B will be described, focusing on the process shown in Figure 7.

[0053] First, when the resin molding apparatus 10 is instructed to start manufacturing a resin molded product via an input device, the control unit 150 drives the robot arm 143. The robot arm 143 takes the substrate 60A from the first storage unit 145 and places the removed substrate 60A on the top surface of the turntable 40 of the positioning mechanism 147. At this time, the robot arm 143 aligns the substrate 60A so that its center C1 roughly coincides with the center C2 of the turntable 40. In this state, the process shown in Figure 7 begins.

[0054] In step S1, the control unit 150 drives the positioning mechanism 147 to acquire a series of distance data. More specifically, while rotating the turntable 40 around the rotation axis A1 (while rotating the sensor 43 relative to the turntable 40), the sensor 43 repeatedly measures the distance from the rotation axis A1 to the outer edge P1 of the substrate 60A. In this embodiment, the turntable 40 rotates at least once, during which time the light source 431 is emitted, and the intensity of the light emitted from the light source 431 is measured at short time intervals by the light receiver 432. This acquires a series of light intensity data, in other words, a series of distance data indicating the distance from the rotation axis A1 to the outer edge P1. The series of distance data includes a large number of datasets that associate data indicating the angle around the rotation axis A1 with data indicating the distance from the rotation axis A1 to the outer edge P1 at that angle. Information regarding the angle around the rotation axis A1 is acquired based on the rotation speed of the motor 42. These large number of datasets are acquired at small angular intervals between 0° and 360°. Therefore, the series of distance data acquired here is a set of data points along the circumferential direction with respect to the rotation axis A1. Note that the series of distance data acquired by sensor 43 may be data for more than one rotation of the turntable 40, but for the following calculations, distance data for one rotation is used.

[0055] In the following step S2, the control unit 150 corrects the series of distance data acquired in step S1. The series of distance data acquired in step S1 is a group of data arranged circumferentially with respect to the rotation axis A1, that is, with respect to the center C2 of the turntable 40. In step S2, this is converted into a group of data arranged circumferentially with respect to the center C1 of the substrate 60A. Note that if the center C1 of the substrate 60A and the center C2 of the turntable 40 coincide in a plan view when the substrate 60A is placed on the turntable 40, or if the difference between them is negligible even if they do not coincide, step S2 can be omitted.

[0056] When the points indicated by each dataset (a pair of data showing angle and distance relative to the center C2) included in the series of distance data before conversion are plotted on a polar coordinate plane, the shape of the outer edge P1 of the substrate 60A is drawn. By determining the center coordinate of the drawn outer edge P1, the coordinates of the center C1 of the substrate 60A can be calculated. The calculation of the center coordinate of the outer edge P1 can be done, for example, by geometric calculation or by image pattern matching. Then, by plotting each point indicated by the series of distance data before conversion on a polar coordinate plane with the calculated center C1 as the origin (i.e., calculating the angle around center C1 and the distance from center C1 for each point), the series of distance data before conversion can be converted into a series of data along the circumferential direction relative to center C1. Note that the method for converting the origin of the polar coordinate system from center C2 to center C1 is not limited to the procedure described here, but can be done by various methods obvious to those skilled in the art.

[0057] In the subsequent steps S3 to S5, the position of the notch 63 on the outer edge P1 of the substrate 60A is detected based on the series of distance data corrected in step S2. If step S2 is omitted, the same processing is performed on the series of distance data acquired in step S1 in steps S3 to S5. Figure 8A is an example of a graph of the series of distance data corrected in step S2. The horizontal axis shows the data number in chronological order, and the vertical axis shows the distance from the center C1 to the outer edge P1. In other words, the horizontal axis shows the angle around the center C1, i.e., the circumferential direction. The control unit 150 divides the series of distance data corrected in step S2 into multiple groups along the circumferential direction, and detects the position of the notch 63 by comparing the divided distance data among the groups.

[0058] In step S3, the control unit 150 divides the series of distance data corrected in step S2 into N groups along the circumferential direction. N is an integer greater than or equal to 2. In the example in Figure 8A, the series of distance data is divided into four groups G1 to G4. These groups G1 to G4 correspond to the repeating patterns PT1 to PT4 shown in Figure 2, respectively. In this example, N=4 because the shape of the substrate 60A is 4-fold symmetric. However, N does not need to match the number of rotational symmetries of the shape of the substrate 60A. For example, N can be an integer greater than or equal to 2 among the divisors of the number of rotational symmetries.

[0059] Each group G1 to G4 has M elements, from the 1st to the Mth element. M is an integer greater than or equal to 2. M can be the value obtained by dividing the number of data points (number of points) included in a series of distance data by the number of groups N. In this case, if the number of data points is not divisible by N, the remaining fraction of the data can be appropriately thinned out. The data to be thinned out can be, for example, data at the ends of the entire series of distance data, data near the boundaries between groups, etc. Note that even if measurement parameters such as the rotation speed of the turntable 40 and the receiving interval of the light receiver 432 are set in advance so that the number of data points included in a series of distance data (for one rotation of the turntable 40) is an integer multiple of N, a remainder may still occur. This is because the various commands for measurement from the control unit 150 are not always issued at strictly equal intervals.

[0060] In the subsequent step S4, the control unit 150 calculates the average value of the distances represented by the N elements belonging to each of the N groups for each sequence from the 1st to the Mth. That is, the average value of the N first elements (distances) included in each of the N groups is calculated, the average value of the N second elements (distances) is calculated, ..., and the average value of the N Mth elements (distances) is calculated. In other words, in step S4, the graphs of the N groups divided in step S3 are superimposed (see Figure 8B), and the average value of the N points within each group whose order along the horizontal axis matches is calculated (see Figure 8C).

[0061] In the subsequent step S5, the control unit 150 identifies the element with the largest deviation from the average value calculated in step S4 among the N × M elements (distances) belonging to the N groups. Figure 8D is a graph of the absolute values ​​of the deviations of the N × M elements (distances). Here, the average value compared to each of the N × M elements is the average value calculated for the same order as the element in question, from the average values ​​of the 1st to Mth elements calculated in step S4. That is, the difference is calculated by subtracting the average value of the 1st element calculated in step S4 from each distance shown by the N 1st element included in each of the N groups. Similarly thereafter, the difference is calculated by subtracting the average value of the 2nd element from each distance shown by the N 2nd elements, and so on, until the difference is calculated by subtracting the average value of the Mth element from each distance shown by the N Mth element. In other words, in step S5, the graph of the average value calculated in step S4 is subtracted from each graph of the N groups divided in step S3, and the element with the largest deviation is identified. The element with the largest deviation can be defined as the element whose absolute value of the deviation is the largest. In this case, out of N × M elements (distances), the element with the largest absolute value of the deviation is identified. The control unit 150 then detects the circumferential position of the element with the largest deviation, as the position of the notch 63. The position of the notch 63 is identified, for example, by the angle and distance indicated by the distance data corresponding to the element with the largest deviation among the series of distance data corrected in step S2. This completes the process shown in Figure 7.

[0062] After the position of the notch 63 is detected, the control unit 150 drives the positioning mechanism 147 again to adjust the rotational direction (circumferential direction) of the substrate 60A based on the detected position of the notch 63. More specifically, it rotates the turntable 40 so that the notch 63 is in a predetermined position along the circumferential direction. Then, the robot arm 143 retrieves the substrate 60A, whose notch 63 position has been adjusted, from the turntable 40 and transfers it to the mold 305 via the substrate loader 141. The control unit 150 controls the robot arm 143 and the substrate loader 141 to position the substrate 60A inside the mold 305 so that the notch 63 is in a predetermined position inside the mold 305.

[0063] After the substrate 60A is set in the mold 305, the control unit 150 clamps the mold 305. Then, the substrate 60A is molded with resin inside the mold 305 to produce a resin molded product (substrate 60B). The control unit 150 controls the substrate loader 141 and the robot arm 143 to retrieve the substrate 60B from the mold 305 and store it in the second storage unit 146. This completes the production of the resin molded product.

[0064] [4. Features] According to the resin molding apparatus 10 described above, the position of the notch 63 can be correctly detected. As a result, the object (substrate 60A) having the notch 63 can be correctly positioned.

[0065] [5. Variant] The embodiments described above are merely illustrative in all respects of the present invention, and the present invention is not limited to these embodiments. The embodiments described above can be improved or modified in various ways within the scope of the present invention. For example, the following modifications are possible. Various technical features described herein can be combined as appropriate within the spirit of the present invention.

[0066] <5-1> The shape of the object (substrate 60) excluding the notch 63 does not have to be rotationally symmetric. If a repeating pattern exists along the circumferential direction on the outer edge P1 excluding the notch 63, the notch 63 can be correctly detected using the same method as described above. For example, the shape of the object excluding the notch 63 may be a lineally symmetric shape as shown in Figure 9. In this case, in step S3, the series of distance data is divided equally into two groups, and in step S4, the graphs of the two groups are superimposed by inverting the graph of one group, and then the average value is calculated. The rest of the process is the same as in Figure 7.

[0067] As another example, the shape of the object excluding the notch 63 may be circular. In this case as well, a repeating pattern can be said to exist along the circumferential direction on the outer edge P1 excluding the notch 63, and the notch 63 can be correctly detected using the same method as described above.

[0068] <5-2> In the above embodiment, the position of the notch 63 on the substrate 60A before resin molding was detected, but the position of the notch 63 on the resin-molded substrate 60B may be detected by a similar method.

[0069] <5-3> In the above embodiment, the information regarding the position of the notch 63 was used to position the substrate 60A that was set inside the mold 305. However, the information regarding the position of the notch 63 can also be used for other purposes.

[0070] For example, the position of the notch 63 can be detected and utilized not only when setting the substrate 60A in the mold 305, but also at any other point where it is necessary to position the object. These "any point" includes processes performed within the resin molding apparatus 10, as well as processes before the substrate 60A is loaded into the resin molding apparatus 10, and processes after the substrate 60B is unloaded from the resin molding apparatus 10. For example, the position of the notch 30 can be detected when the resin-molded substrate 60B is cut into multiple packages by a blade. In this case, fixing the position of the notch 30 on the resin-molded substrate 60B prevents accidental cutting of electronic components 61.

[0071] Furthermore, each electronic component 61 mounted on the substrate 60 can be identified based on the position of the notch 63. Therefore, when managing information about each electronic component 61 on the substrate 60, the information about the position of the notch 63 can be utilized. In this case, the position of the notch 63 can be detected using the method described above and that information can be utilized in any situation where it is necessary to identify each electronic component 61.

[0072] [6. Addendum] <Technology 1> (composition) A mounting surface on which a plate-shaped object having a notch is placed, A sensor configured to rotate relative to the outer edge of an object placed on the mounting surface around a predetermined axis of rotation, wherein the sensor acquires a series of distance data along the circumferential direction by repeatedly measuring the distance from the axis of rotation to the outer edge while rotating relative to the outer edge, A processing unit that detects the position of the notch on the outer edge based on the series of distance data acquired by the sensor, Equipped with, The outer edge extends in a manner that forms a predetermined repeating pattern along the circumferential direction, except for the notched portion. The processing unit divides the series of distance data into a plurality of groups corresponding to the repeating pattern along the circumferential direction, and detects the position of the notch by comparing the divided distance data among the groups. Notch detection device.

[0073] (Effects, etc.) According to this notch detection device, the series of distance data described above are divided into multiple groups corresponding to the repeating pattern along the circumferential direction, and the divided distance data are compared among the groups, thereby enabling the accurate detection of the notch position on a plate-shaped object.

[0074] <Technology 2> (composition) The object has a rotationally symmetrical shape, except for the notched portion. The notch detection device described in Technology 1.

[0075] (Effects, etc.) This notch detection device can accurately detect the position of a notch in an object that has a rotationally symmetric shape except for the notch itself.

[0076] <Technology 3> (composition) The object is non-circular except for the notched portion. A notch detection device according to Technology 1 or 2.

[0077] (Effects, etc.) This notch detection device can accurately detect the position of a notch in a non-circular object, excluding the notched portion itself.

[0078] <Technology 4> (composition) The shortest distance from the center of the object to the outer edge is different from the distance from the center to the notch. A notch detection device as described in any of technologies 1 to 3.

[0079] (Effects, etc.) This notch detection device can correctly detect the position of a notch in objects where the shortest distance from the center to the outer edge is different from the distance from the center to the notch.

[0080] <Technology 5> The processing unit corrects the series of distance data acquired by the sensor into a second series of distance data indicating multiple distances from the center of the object to its outer edge. For integers N and M greater than or equal to 2, the corrected second series of distance data is divided along the circumferential direction into N groups, each having elements 1 through M. For each sequence from the 1st to the Mth, calculate the average value of the N elements belonging to each of the N groups. Among the N × M elements belonging to the aforementioned N groups, identify the element that has the largest deviation from the average value for the same order, from the 1st to the Mth element. The circumferential position of the identified element is detected as the position of the notch. A notch detection device as described in any of Technology 1 to 4.

[0081] <Technology 6> (composition) A notch detection device as described in any of Technology 1 to 5, mold and Equipped with, The object is placed in the mold such that the notch detected by the notch detection device is positioned at a predetermined location, and is molded with resin within the mold. Resin molding equipment.

[0082] (Effects, etc.) This resin molding apparatus allows for the correct positioning of the notch within the mold during resin molding.

[0083] <Technology 7> (composition) A method for manufacturing a resin molded product using the resin molding apparatus described in Technical 6, The notch detection device detects the position of the notch, The object is placed inside the mold so that the notch detected by the notch detection device is positioned at the predetermined location, The process involves molding the object with resin within the mold and manufacturing the resin molded product. including, A method for manufacturing resin molded products.

[0084] (Effects, etc.) According to this method for manufacturing resin molded products, the position of a notch in a plate-shaped object can be correctly detected, and the notch can be correctly positioned within the mold based on the position of the notch.

[0085] <Technology 8> (composition) The sensor is rotated relative to the outer edge of a plate-shaped object having a notch, around a predetermined axis of rotation, While the sensor rotates relative to the outer edge, the distance from the axis of rotation to the outer edge is repeatedly measured by the sensor, thereby acquiring a series of distance data along the circumferential direction. Based on the series of distance data acquired by the sensor, the position of the notch on the outer edge is detected. Includes, The outer edge extends in a manner that forms a predetermined repeating pattern along the circumferential direction, except for the notched portion. Detecting the position of the notch includes dividing the series of distance data into a plurality of groups corresponding to the repeating pattern along the circumferential direction, and detecting the position of the notch by comparing the divided distance data among the groups. Notch detection method.

[0086] (Effects, etc.) According to this notch detection method, the series of distance data described above are divided into multiple groups corresponding to the repeating pattern along the circumferential direction, and the divided distance data are compared among the groups, thereby enabling the accurate detection of the notch position on a plate-shaped object. [Explanation of Symbols]

[0087] 10 Resin molding equipment 147 Positioning mechanism 150 Control Unit (Processing Unit) 305 Molding mold 320 upper mold 321 pins 340 Lower mold 40 Turntables 41 shaft 42 motors 43 Sensors 431 Light source 432 Photoreceiver 433 frames 60, 60A, 60B substrate (object) 61 Electronic Components 62 Main board 63 Notches P1 outer edge PT1~PT4 Repeating Pattern A1 Rotation axis C1 Center of the substrate C2 Center of the rotating platform B1~B4 Arc section L1~L4 Straight line part Groups G1-G4 R1 Resin Material

Claims

1. A mounting surface on which a plate-shaped object having a notch is placed, A sensor configured to rotate relative to the outer edge of an object placed on the mounting surface around a predetermined axis of rotation, wherein the sensor acquires a series of distance data along the circumferential direction by repeatedly measuring the distance from the axis of rotation to the outer edge while rotating relative to the outer edge, A processing unit that detects the position of the notch on the outer edge based on the series of distance data acquired by the sensor, Equipped with, The outer edge, excluding the notched portion, includes a plurality of identical predetermined repeating patterns and extends sequentially along the circumferential direction to repeatedly form the identical predetermined repeating patterns. The processing unit divides the series of distance data into a plurality of groups corresponding to the plurality of identical predetermined repeating patterns along the circumferential direction, and detects the position of the notch by comparing the divided distance data among the groups. Each of the repeating patterns includes an arc portion and a straight portion. The number of repeating patterns is the same as the number of groups. Notch detection device.

2. The object has a rotationally symmetrical shape, except for the notched portion. The notch detection device according to claim 1.

3. The shortest distance from the center of the object to the outer edge is different from the distance from the center to the notch. The notch detection device according to claim 1.

4. A mounting surface on which a plate-shaped object having a notch is placed, A sensor configured to rotate relative to the outer edge of an object placed on the mounting surface around a predetermined axis of rotation, wherein the sensor acquires a series of distance data along the circumferential direction by repeatedly measuring the distance from the axis of rotation to the outer edge while rotating relative to the outer edge, A processing unit that detects the position of the notch on the outer edge based on the series of distance data acquired by the sensor, Equipped with, The outer edge extends in a manner that forms a predetermined repeating pattern along the circumferential direction, except for the notched portion. The processing unit divides the series of distance data into a plurality of groups corresponding to the repeating pattern along the circumferential direction, and detects the position of the notch by comparing the divided distance data among the groups. The processing unit corrects the series of distance data acquired by the sensor into a second series of distance data indicating multiple distances from the center of the object to its outer edge. For integers N and M of 2 or more, the corrected second series of distance data is divided along the circumferential direction into N groups, each having elements 1 through M. For each sequence from the 1st to the Mth, calculate the average value of the N elements belonging to each of the N groups. Among the N × M elements belonging to the aforementioned N groups, identify the element that has the largest deviation from the average value for the same order, from the 1st to the Mth element. The circumferential position of the identified element is detected as the position of the notch. Notch detection device.

5. The object has a rotationally symmetric shape except for the notched portion. The notch detection device according to claim 4.

6. The object is non-circular except for the notched portion. The notch detection device according to claim 4.

7. The shortest distance from the center of the object to the outer edge is different from the distance from the center to the notch. The notch detection device according to claim 4.

8. A notch detection device according to any one of claims 1 to 7, mold and Equipped with, The object is placed in the mold such that the notch detected by the notch detection device is positioned at a predetermined location, and is molded with resin within the mold. Resin molding equipment.

9. A method for manufacturing a resin molded product using the resin molding apparatus described in claim 8, The notch detection device detects the position of the notch, The object is placed inside the mold so that the notch detected by the notch detection device is positioned at the predetermined location, The process involves molding the object with resin within the mold and manufacturing the resin molded product. including, A method for manufacturing resin molded products.

10. The sensor is rotated relative to the outer edge of a plate-shaped object having a notch, around a predetermined axis of rotation, While the sensor rotates relative to the outer edge, the distance from the axis of rotation to the outer edge is repeatedly measured by the sensor, thereby acquiring a series of distance data along the circumferential direction. Based on the series of distance data acquired by the sensor, the position of the notch on the outer edge is detected. Includes, The outer edge, excluding the notched portion, includes a plurality of identical predetermined repeating patterns and extends sequentially along the circumferential direction to repeatedly form the identical predetermined repeating patterns. Detecting the position of the notch involves dividing the series of distance data into a plurality of groups corresponding to the plurality of identical predetermined repeating patterns along the circumferential direction, and detecting the position of the notch by comparing the divided distance data among the groups. Each of the repeating patterns includes an arc portion and a straight portion. The number of repeating patterns is the same as the number of groups. Notch detection method.

11. The sensor is rotated relative to the outer edge of a plate-shaped object having a notch around a predetermined axis of rotation, While the sensor rotates relative to the outer edge, the distance from the axis of rotation to the outer edge is repeatedly measured by the sensor, thereby acquiring a series of distance data along the circumferential direction. Based on the series of distance data acquired by the sensor, the position of the notch on the outer edge is detected. Includes, The outer edge extends in a manner that forms a predetermined repeating pattern along the circumferential direction, except for the notched portion. Detecting the position of the notch involves dividing the series of distance data into a plurality of groups corresponding to the repeating pattern along the circumferential direction, and detecting the position of the notch by comparing the divided distance data among the groups. Detecting the position of the aforementioned notch means The series of distance data acquired by the sensor is corrected into a second series of distance data indicating multiple distances from the center of the object to its outer edge. For integers N and M of 2 or more, the corrected second series of distance data is divided into N groups, each having elements 1 through M along the circumferential direction. For each sequence from the 1st to the Mth, calculate the average value of the N elements belonging to each of the N groups, To identify the element among the N × M elements belonging to the aforementioned N groups that has the largest deviation from the average value for the same order, from the 1st to the Mth element. This includes detecting the circumferential position of the identified element as the position of the notch, Notch detection method.

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