Method for manufacturing cut products, fixed jig, and cutting apparatus

Abstract

To provide a manufacturing method of a cut product, a fixing jig, and a cutting device, in which only a desired cut product can be sucked and conveyed, and the other cut product does not move.SOLUTION: A manufacturing method of a cut product Sc includes: a singulation step of singulating an object to be cut into the plurality of cut products Sc by a cutting mechanism; a fixing step of collectively transferring and fixing the plurality of cut products Sc to the fixing jig 75 while maintaining the arrangement of the singulated plurality of cut products Sc; a first conveyance step of releasing only the fixing of a first cut product group Sc1 composed of a part of the cut products Sc among the plurality of cut products Sc fixed to the fixing jig 75, and sucking the first cut product group Sc1 by a conveyance mechanism 15 to convey it to a housing part; after the first conveying step, a second conveying step of releasing the fixing of a second cut product group Sc2 composed of a part of the cut products Sc different from the first cut product group Sc1 among the plurality of cut products Sc fixed to the fixing jig 75, and sucking and conveying the second cut product group Sc2 by the conveying mechanism 15 to the housing part.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing cut products, a fixing jig, and a cutting device.

Background Art

[0002] Generally, a substrate on which semiconductor chips or the like are fixed is resin-sealed and then cut into individual pieces to be used as electronic components. Conventionally, there is known a cutting device that cuts a resin-sealed substrate into electronic components, performs cleaning, drying, and inspection on the electronic components, and then adsorbs, transports, and stores the electronic components in a storage section.

[0003] Patent Document 1 discloses a cutting device having a transport mechanism that cuts a resin-sealed substrate (sealed substrate in Patent Document 1), places a plurality of cut products (electronic components in Patent Document 1) obtained by fragmentation on a mounting table (table in Patent Document 1) in a staggered manner, and then adsorbs and transports the plurality of cut products one by one in a row. In the cutting device of Patent Document 1, when adsorbing and transporting the plurality of cut products one by one in a row, the plurality of cut products are not fixed to the mounting table. Note that "placing in a staggered manner" means a state in which a plurality of cut products are placed at positions corresponding to one color of a checkered pattern.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] For example, when a resin-encapsulated substrate with a film attached is cut to form multiple cut pieces, the burrs on the film after cutting may come into contact with adjacent cut pieces in all directions, causing them to connect. In such cases, if multiple cut pieces are picked up and transported alternately, as in the cutting device described in Patent Document 1, the cut pieces adjacent to the picked-up cut piece in all directions (non-picked) that are connected via the burrs may be transported together with the picked-up cut piece, indicating room for improvement. Furthermore, even if the non-picked cut pieces are not transported, they may be dragged by the burrs and move from their original positions, indicating room for improvement.

[0006] Therefore, there is a need for a method of manufacturing cut pieces, a fixing jig, and a cutting device that can pick up and transport only the desired cut pieces without moving other cut pieces. [Means for solving the problem]

[0007] One embodiment of the method for manufacturing cut products according to the present disclosure includes: a fragmentation step of fragmenting an object to be cut into a plurality of cut products by cutting it with a cutting mechanism; a fixing step of transporting the plurality of fragmented cut products together while maintaining the arrangement of the plurality of fragmented cut products and fixing them to a fixing jig; a first transport step of releasing only the fixing of a first group of cut products consisting of some of the plurality of cut products fixed to the fixing jig, and transporting the first group of cut products to a storage unit by a transport mechanism; and a second transport step of releasing the fixing of a second group of cut products consisting of some of the plurality of cut products fixed to the fixing jig that are different from the first group of cut products, and transporting the second group of cut products to the storage unit by the transport mechanism.

[0008] One embodiment of the fixing jig according to the present disclosure is a fixing jig for fixing a plurality of cut pieces obtained by cutting the cutting portions of an object to be cut which has a plurality of intersecting linear cutting portions, while maintaining their arrangement after cutting, and having a plurality of suction holes that enable the placement of the plurality of cut pieces to be fixed individually by sucking in air, and having a first suction path and a second suction path that enable the air sucked in independently of each other to flow, each of the plurality of suction holes being connected to either the first suction path or the second suction path, and the suction holes corresponding to each of the plurality of cut pieces that are not adjacent to each other are connected to either the first suction path or the second suction path.

[0009] One embodiment of the cutting apparatus according to this disclosure comprises a cutting mechanism that cuts the cutting portions of a plate-shaped object to be cut, which has a plurality of intersecting linear cutting portions, to divide it into a plurality of cut pieces, and a mounting table including the above-mentioned fixing jig. [Effects of the Invention]

[0010] According to embodiments of this disclosure, it is possible to provide a method for manufacturing cut pieces, a fixing jig, and a cutting apparatus that can adsorb and transport only the desired cut pieces while preventing other cut pieces from moving. [Brief explanation of the drawing]

[0011] [Figure 1] This is a perspective view showing a pre-formed circuit board and electronic components. [Figure 2] This is a plan view of the cutting device. [Figure 3] This is a plan view showing the configuration of the first plate. [Figure 4] This is a plan view showing the configuration of the second panel. [Figure 5] This is a plan view showing the configuration of the third panel. [Figure 6] This is a plan view showing the configuration of the fourth panel. [Figure 7] This is a plan view showing the configuration of the base. [Figure 8]This is a cross-sectional view of the mounting platform. [Figure 9] This is an explanatory diagram illustrating the state of suction of the first and second groups of cut pieces to the mounting table. [Modes for carrying out the invention]

[0012] The embodiments of the method for manufacturing cut products, the fixing jig, and the cutting apparatus according to this disclosure will be described in detail below with reference to the drawings. The embodiments described below are illustrative examples for explaining the method for manufacturing cut products, the fixing jig, and the cutting apparatus, and do not limit the method for manufacturing cut products, the fixing jig, and the cutting apparatus to these embodiments only. Therefore, the method for manufacturing cut products, the fixing jig, and the cutting apparatus according to this disclosure can be implemented in various forms without departing from the gist of the invention.

[0013] Substrates on which semiconductor chips and other elements are fixed are encapsulated in resin, then cut into individual pieces for use as electronic components. A specialized cutting device is used to cut the resin-encapsulated substrate.

[0014] Resin encapsulation of a substrate is performed by fixing the substrate to a mold (not shown) of a resin molding apparatus and then resin molding the substrate with molten resin supplied into the mold. The molten resin may be either a thermoplastic resin or a thermosetting resin. Thermosetting resins decrease in viscosity when heated, and further heating causes polymerization and hardening, resulting in a cured resin. When resin encapsulating a substrate on which elements such as semiconductor chips are fixed, it is desirable to use a thermosetting resin. The encapsulated resin protects the elements fixed to the substrate.

[0015] [Construction of the pre-molded substrate] The molded substrate Sb (an example of an object to be cut) cut by the cutting device 1 (see Figure 2) in this embodiment is a lead frame 63 on which a plurality of elements 61 are fixed, as shown in Figure 1. A resin layer 65 is formed on the side of the lead frame 63 on which the plurality of elements 61 are fixed by resin encapsulation, and a protective film 67 (an example of a film) is attached on this resin layer 65. The elements 61 are, for example, integrated circuits (semiconductor chips). The protective film 67 has an adhesive layer (not shown) made of adhesive or the like on its back surface, which allows it to adhere to the resin layer 65. Electrodes (not shown) are formed on the lead frame 63 and are electrically connected to the elements 61. The electrodes are exposed on the side of the lead frame 63 opposite to the resin layer 65.

[0016] In FIG. 1, a plurality of intersecting linear two-dot chain lines represent a cutting portion 68 that is cut by a cutting device 1 described later. In FIG. 1, the three lines slanting upward to the right represent electronic components Sc (an example of cut products) after being cut from the formed substrate Sb by the cutting device 1 of the present embodiment. Examples of the substrate include, in addition to the lead frame 63, semiconductor substrates such as silicon wafers, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, and the like. The substrate may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). In the substrate, wiring may already be provided or may not be provided. One electronic component Sc has one element 61. Examples of the electronic component Sc include BGA (Ball Grid Array), LGA (Land Grid Array), CSP (Chip Size Package), LED (Light Emitting Diode), and QFN (Quad Flat No-leaded). Further, the formed substrate Sb according to the present embodiment is not limited to the lead frame 63 in which the element 61 is fixed and resin-sealed. The formed substrate Sb may be, for example, a resin-sealed wiring board in which the element 61 is not fixed and single-layer or multi-layer wiring is provided. Further, the object to be cut according to the present embodiment is not limited to the formed substrate Sb, and may be a substrate without resin sealing.

[0017] In FIG. 1, the electronic component Sc (diagonally upward to the right) that has been cut shows a state where burrs 67a remain on the protective film 67, and the burrs 67a are connected to the protective films 67 of other adjacent electronic components Sc (or the remaining formed substrate Sb) in the front, back, left, and right directions. That is, the electronic component Sc is connected to other adjacent electronic components Sc (or the remaining formed substrate Sb) in the front, back, left, and right directions via the burrs 67a. Here, the fact that the electronic components Sc are "connected" does not mean that the protective film 67 is not completely cut, but rather that the adhesive layer of the burrs 67a of one electronic component Sc generated by the cutting of the protective film 67 is in contact with the protective film 67 or the burrs 67a of other adjacent electronic components Sc (or the remaining formed substrate Sb before being separated into individual pieces) in the front and / or left and right directions, exerting an adhesive force.

[0018] 〔Configuration of Cutting Device〕 FIG. 2 is a plan view schematically showing the cutting device 1 according to the present embodiment. The cutting device 1 is configured to separate a plurality of electronic components Sc (see FIG. 1) by cutting the formed substrate Sb. Hereinafter, of the two surfaces of the formed substrate Sb, the surface that is resin-sealed and protected by the protective film 67 (the surface on the side where the resin layer 65 and the protective film 67 are arranged in FIG. 1) is referred to as the front surface, and the surface opposite to the front surface (the surface on the side where the electrodes are arranged in FIG. 1) is referred to as the back surface. Note that the Z direction shown in FIG. 2 is the vertical direction, the arrangement direction of the cutting module A1 and the inspection and storage module B1 is the X direction, and the direction perpendicular to the X direction and the Z direction (the depth direction of each module) is the Y direction.

[0019] The cutting device 1 includes a cutting module A1 and an inspection and storage module B1. The cutting module A1 manufactures a plurality of electronic components Sc by cutting the formed substrate Sb. The inspection and storage module B1 inspects each of the plurality of manufactured electronic components Sc, and then stores each electronic component Sc in a good product tray 15a (an example of a storage unit) or a defective product tray 15b (an example of a storage unit). In the cutting device 1, the cutting module A1 and the inspection and storage module B1 are detachable and interchangeable with each other.

[0020] The control unit 50 of the cutting device 1 includes a processor such as a CPU (Central Processing Unit) and a storage device such as RAM (Random Access Memory) or ROM (Read Only Memory). The control unit 50 controls the operation of each part of the cutting module A1 and inspection storage module B1 of the cutting device 1 by executing a control program stored in the storage device using the processor. Unless otherwise specified, the operation of the cutting device 1 described below is performed based on operation commands from the control unit 50. In the following description, the operation commands of the control unit 50 will be omitted in principle, and will be described as necessary. In this embodiment of the cutting device 1, the control unit 50, monitor 20, and sound output unit 25 are provided in the cutting module A1, but they may be provided in the cutting device 1 or in the inspection storage module B1.

[0021] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6 (an example of a cutting mechanism), and a transfer unit 7. The cutting module A1 also includes a part of the first vacuum pump D1 and a second vacuum pump D2. The cutting device 1 may also be equipped with a water circulation device for circulating water. The water circulation device is used, for example, to circulate cooling water to cool the motor 6a, or to circulate cutting water and cleaning water used for cutting.

[0022] The substrate supply unit 3 supplies the molded substrates Sb one by one to the positioning unit 4 by pushing them out one by one from the magazine M1 which contains multiple molded substrates Sb, with the surface (the side on which the protective film 67 is placed) facing downwards.

[0023] The positioning unit 4 positions the molded substrate Sb extruded from the substrate supply unit 3 onto the rail unit 4a. After that, the positioning unit 4 transfers the positioned molded substrate Sb to the cutting table 5.

[0024] The cutting table 5 holds the molded substrate Sb to be cut. In this embodiment, the cutting module A1 has two cutting tables 5. A second vacuum pump D2 is connected to each of the two cutting tables 5 through a second flow path VR2.

[0025] Each cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the molded substrate Sb, which has been transferred from the positioning unit 4, by suction from below. In this way, the molded substrate Sb is fixed to the cutting table 5. Each cutting table 5 is movable in the Y direction by the moving mechanism 5c.

[0026] The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in Figure 2 (i.e., rotate it in the XY plane of Figure 2). The movement mechanism 5c can move the holding member 5a along the Y axis in Figure 2. The θ1 direction is the direction of rotation around the Z axis.

[0027] The spindle section 6 comprises a motor 6a, a rotating shaft 6b, and a blade 8. The rotating shaft 6b outputs the rotational driving force of the motor 6a to the outside. The blade 8 is positioned at the tip of the rotating shaft 6b. The spindle section 6 rotates the rotating shaft 6b by the rotational driving force, and the blade 8 rotates as the rotating shaft 6b rotates. The blade 8 rotates at high speed to cut the molded substrate Sb along the cutting section 68 (see Figure 1), separating the molded substrate Sb into multiple electronic components Sc.

[0028] In this embodiment, the cutting module A1 has two spindle sections 6. The spindle sections 6 are movable along the X and Z axes in Figure 2. Alternatively, the cutting module A1 may have a configuration with only one spindle section 6.

[0029] The spindle section 6 is equipped with nozzles for cutting fluid, cooling water, and cleaning water (none of which are shown). The cutting fluid nozzles spray cutting fluid onto the rapidly rotating blade 8. The cooling water nozzles spray cooling water onto the blade 8 and the molded substrate Sb, which are heated by cutting. The cleaning water nozzles spray cleaning water to wash away cutting debris and the like. The cutting fluid, cooling water, and cleaning water are discharged outside the cutting module A1 after spraying.

[0030] The transfer unit 7 picks up all of the multiple electronic components Sc (21 in the example in Figure 1) that have been held and cut on the cutting table 5 from above and transfers them all at once to the inspection table 11 of the inspection storage module B1, maintaining their cut arrangement. The first vacuum pump D1 is connected to the transfer unit 7 through the first flow path VR1. The transfer unit 7 uses the first vacuum pump D1 to draw in air and pick up and hold all of the multiple electronic components Sc.

[0031] The inspection and storage module B1 mainly consists of an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement section 14, and an extraction section 15 (an example of a transport mechanism). The first optical inspection camera 12 may also be provided in the cutting module A1. Furthermore, the inspection and storage module B1 includes a part of the first vacuum pump D1. That is, the first vacuum pump D1 spans both the cutting module A1 and the inspection and storage module B1.

[0032] The inspection table 11 holds multiple electronic components Sc for optical inspection of the electronic components Sc. The inspection table 11 is movable along the X-axis in Figure 2. The inspection table 11 can also be inverted vertically. The inspection table 11 is provided with a holding member (not shown) that attracts and holds multiple electronic components Sc by suction from the first vacuum pump D1.

[0033] The first optical inspection camera 12 and the second optical inspection camera 13 image both sides (front and back) of the electronic component Sc. Various inspections of the electronic component Sc are performed based on the image data captured by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are positioned near the inspection table 11 to image the area above.

[0034] The placement unit 14 has a mounting table 70, and multiple inspected electronic components Sc (see Figure 1) are placed on the mounting table 70 all at once in their cut-out arrangement. The first vacuum pump D1 is connected to the mounting table 70 through the first flow path VR1. The configuration of the placement unit 14 will be described later.

[0035] The extraction unit 15 adsorbs and holds a portion of the multiple electronic components Sc placed in the placement unit 14 and transports them to a tray. Based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13, the extraction unit 15 sorts the electronic components Sc into "good" or "defective" products. Electronic components Sc determined to be good are transported to the good product tray 15a by the extraction unit 15, and electronic components Sc determined to be defective are transported to the defective product tray 15b by the extraction unit 15. The extraction unit 15 does not adsorb and transport all of the multiple electronic components Sc placed at once, but rather repeatedly adsorbs and transports a portion of the multiple electronic components Sc until all of the electronic components Sc are transported.

[0036] The cutting device 1 further includes a monitor 20 and a sound output unit 25. The monitor 20 is configured to display an image. The monitor 20 is composed of a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor. The sound output unit 25 is configured to output sound. The sound output unit 25 is composed of a sound output device such as a speaker, buzzer or bell.

[0037] [Configuration of the layout section] Next, the arrangement section 14 will be described using Figures 2 to 8. As shown in Figure 2, the arrangement section 14 is composed of a mounting table 70, a first flow path VR1, a first vacuum pump D1, and a switching valve 78. In the arrangement section 14 in this embodiment, air is drawn in by the first vacuum pump D1 in order to attract and fix a plurality of electronic components Sc to the mounting table 70. The mounting table 70 has two independent suction paths through which the drawn-in air flows. In this embodiment, the electronic component cutting device 1 is composed of at least a cutting table 5, a spindle section 6, and a mounting table 70.

[0038] As shown in Figure 8, the mounting base 70 includes a fixing jig 75 and a base 76, with the fixing jig 75 being fixed to the base 76 by fixing members (screws, etc.). The fixing jig 75 includes a fourth plate 74, a third plate 73, a second plate 72, a first plate 71, and a contact plate 77, which are stacked in this order and integrated by adhesive or joining. The first to fourth plates 71 to 74 and the base 76 are all rectangular plates made of metal. Specifically, the first plate 71, the second plate 72, and the third plate 73 are made of stainless steel, and the fourth plate 74 and the base 76 are made of aluminum. The first plate 71, the second plate 72, and the third plate 73 are all approximately the same thickness. The fourth plate 74 and the base 76 are thicker than the combined thickness of the first plate 71, the second plate 72, and the third plate 73. The contact plate 77, when viewed along the Z direction, has a smaller area than the first plate 71 and is rectangular in shape. In this embodiment, the shorter side of the rectangle of the mounting base 70 is in the X direction, the longer side is in the Y direction, and the stacking direction of the base 76, fourth plate 74, third plate 73, second plate 72, first plate 71, and contact plate 77 is in the Z direction (see also Figure 2).

[0039] [Contact plate configuration] As shown in Figure 8, the contact plate 77 of the fixing jig 75 has an upper surface 77a (an example of a mounting surface) and a lower surface 77b, which is the surface opposite to the upper surface 77a. The contact plate 77 is a plate-shaped member on which a plurality of inspected electronic components Sc are fixed to the upper surface 77a. The contact plate 77 has suction holes 77c (an example of suction holes) with a circular cross-section that penetrate from the upper surface 77a to the lower surface 77b in order to attract each electronic component Sc. The suction holes 77c are formed at locations corresponding to each of the plurality of electronic components Sc fixed to the contact plate 77, and the number of suction holes 77c is the same as the number of fixed electronic components Sc. The plurality of suction holes 77c are arranged in parallel along the X and Y directions, respectively, and all have the same inner diameter. By making the contact plate 77 out of resin, it is possible to easily attract the electronic components Sc to the fixing jig 75 (contact plate 77) by suction.

[0040] [Structure of Board 1] As shown in Figure 3, the first plate 71 of the fixing jig 75 has a first upper surface 71a bonded to the lower surface 77b of the contact plate 77, and a first lower surface 71b which is the surface opposite to the first upper surface 71a. In Figures 3 to 5, the area enclosed by the dashed-dot line is the area where multiple electronic components Sc are fixed. In this embodiment, there are two areas enclosed by the dashed-dot line, but the shape is not limited to this, and there may be one area where multiple electronic components Sc are fixed, or there may be three or more. The area enclosed by the dashed-dot line is appropriately configured according to the number of areas where multiple electronic components Sc are fixed formed on one molded substrate Sb.

[0041] Multiple first suction holes 71c (an example of suction holes), which are circular through-holes for drawing in air, are formed in the first plate 71. Similar to the suction holes 77c of the contact plate 77, the first suction holes 71c are formed at locations corresponding to each of the multiple electronic components Sc, and the number of first suction holes 71c is the same as the number of fixed electronic components Sc. The multiple first suction holes 71c are arranged in parallel along the X and Y directions, and all have the same inner diameter. That is, when the first plate 71 and the contact plate 77 are stacked, through-holes consisting of suction holes 77c and first suction holes 71c are formed from the upper surface 77a of the contact plate 77 to the first plate 71. By drawing in air through the suction holes 77c and first suction holes 71c, each of the multiple electronic components Sc is attracted to and fixed to the first upper surface 71a of the first plate 71 of the mounting base 70.

[0042] Multiple first grooves 71d (an example of a first suction path) are formed on the first lower surface 71b of the first plate 71. The multiple first grooves 71d are formed at an angle in two directions with respect to the Y direction. Multiple first grooves 71d in the same direction are spaced apart from each other. Multiple first grooves 71d in the same direction are connected to each other via multiple first grooves 71d in the other direction that intersect them. Therefore, all of the multiple first grooves 71d are connected to each other. The groove depth of the first grooves 71d is, for example, about half the thickness of the first plate 71. In the following description of the first plate 71 to the base 76, when grooves and holes are said to be "connected", it means that air can flow through the grooves and holes.

[0043] The first groove 71d is formed parallel to the arrangement direction of a plurality of first suction holes 71c that are positioned at an oblique angle to each other, among a plurality of first suction holes 71c arranged in parallel along the X and Y directions. The first groove 71d and the plurality of first suction holes 71c positioned at an oblique angle to each other overlap when viewed along the Z direction. In this embodiment, the width of the first groove 71d is equal to or slightly larger than the inner diameter of the first suction holes 71c. That is, the plurality of first suction holes 71c that overlap in the first groove 71d penetrate from the first upper surface 71a of the first plate 71 to the first groove bottom 71d1 (see Figure 8) of the first groove 71d and are connected to the first groove 71d. Hereinafter, the first suction holes 71c that overlap in the first groove 71d among the plurality of first suction holes 71c will be referred to as the first suction hole 71c1 (an example of a suction hole).

[0044] The formation of multiple first grooves 71d results in the formation of first projections 71e in areas adjacent to the first grooves 71d but not in the first grooves 71d. The first projections 71e protrude from the first groove bottom 71d1 of the first grooves 71d, and the top surface of the first projections 71e is the first bottom surface 71b. The first projections 71e have a rhombic shape when viewed along the Z direction. Multiple first projections 71e are formed on the first bottom surface 71b of the first plate 71, and each first projection 71e is spaced apart from the others. This is because each of the multiple first projections 71e is demarcated by four first grooves 71d. Therefore, the multiple first projections 71e are arranged along two oblique directions relative to the direction in which the first grooves 71d extend, i.e., the X direction. In other words, between two first projections 71e located obliquely to each other, there is a first groove 71d that intersects with that oblique direction.

[0045] Each of the multiple first projections 71e has one first suction hole 71c. That is, the first suction hole 71c located on the first projection 71e penetrates from the first upper surface 71a to the first lower surface 71b of the first plate 71. Hereinafter, among the multiple first suction holes 71c, the first suction hole 71c located on the first projection 71e will be referred to as the first suction hole 71c2 (an example of a suction hole).

[0046] In summary, among the multiple first suction holes 71c arranged in parallel along the X and Y directions, a first suction hole 71c located adjacent to any first suction hole 71c1 in both the X and Y directions is the first suction hole 71c2, and a first suction hole 71c located diagonally to the first suction hole 71c1 is the first suction hole 71c1. Furthermore, among the multiple first suction holes 71c arranged in parallel along the X and Y directions, a first suction hole 71c located adjacent to any first suction hole 71c2 in both the X and Y directions is the first suction hole 71c1, and a first suction hole 71c located diagonally to the first suction hole 71c2 is the first suction hole 71c2.

[0047] Near the rectangular long side of the first lower surface 71b of the first plate 71, four first suction ends 71f are formed, connected to the first groove 71d. The first suction ends 71f are grooves of the same depth as the first groove 71d, and the groove bottoms of the first suction ends 71f are of the same depth as the first groove bottoms 71d1.

[0048] [Structure of the second board] As shown in Figure 4, the second plate 72 of the fixed jig 75 has a second upper surface 72a and a second lower surface 72b, which is the surface opposite to the second upper surface 72a. The second upper surface 72a of the second plate 72 has the same shape as the first lower surface 71b of the first plate 71. Specifically, when the second plate 72 and the first plate 71 are laminated, the second plate 72 has second grooves 72d (an example of a first suction path) that have the same shape as the first grooves 71d, at locations facing each of the multiple first grooves 71d of the first plate 71. The groove depth of the second grooves 72d is, for example, about half the thickness of the second plate 72. In addition, the second plate 72 has second protrusions 72e that have the same shape as the first protrusions 71e, at locations facing each of the multiple first protrusions 71e of the first plate 71. Furthermore, the second plate 72 has second suction ends 72f formed at locations opposite each of the four first suction ends 71f of the first plate 71, with the same shape as the first suction ends 71f. The second suction ends 72f are connected to the second groove 72d. The shapes of the second groove 72d, the second projection 72e, and the second suction end 72f are the same as the shapes of the first groove 71d, the first projection 71e, and the first suction end 71f, respectively, so a detailed explanation is omitted.

[0049] Each of the second projections 72e has one second suction hole 72c (an example of a suction hole) that penetrates from the second upper surface 72a to the second lower surface 72b of the second plate 72. The inner diameter of the second suction hole 72c is the same as the inner diameter of the adsorption suction hole 77c and the first suction hole 71c2. When the second plate 72, the first plate 71, and the contact plate 77 are stacked and viewed along the Z direction, the second suction hole 72c completely overlaps with the adsorption suction hole 77c and the first suction hole 71c2. That is, when the second plate 72, the first plate 71, and the contact plate 77 are stacked, a through hole consisting of the adsorption suction hole 77c, the first suction hole 71c2, and the second suction hole 72c is formed from the upper surface 77a of the contact plate 77 to the second lower surface 72b of the second plate 72.

[0050] However, the second plate 72 and the second upper surface 72a and the first lower surface 71b of the first plate 71 differ in the following respects. Specifically, the first groove 71d has a first suction hole 71c2 formed in the first groove bottom 71d1, but the second groove 72d has no through hole corresponding to the first suction hole 71c2 formed in the second groove 72d. Also, unlike the first suction end 71f, each of the four second suction ends 72f formed on the second upper surface 72a of the second plate 72 has a second suction end hole 72g (an example of a first suction path) that penetrates from the second groove bottom 72d1 to the second lower surface 72b. The inner diameter of the second suction end hole 72g is larger than the inner diameter of the second suction hole 72c, for example, about 8 times larger.

[0051] [Structure of the 3rd board] As shown in Figure 5, the third plate 73 of the fixed jig 75 has a third upper surface 73a and a third lower surface 73b, which is the surface opposite to the third upper surface 73a. On the third upper surface 73a of the third plate 73, when the third plate 73 and the second plate 72 are stacked, a third suction end hole 73g (an example of a first suction path) is formed, which penetrates from the third upper surface 73a to the third lower surface 73b of the third plate 73, at a location opposite each of the four second suction end holes 72g of the second plate 72. In other words, a total of four third suction end holes 73g are formed. The inner diameter of the third suction end hole 73g is the same as the inner diameter of the second suction end hole 72g. As a result, when the third plate 73 and the second plate 72 are stacked, a through hole consisting of a second suction end hole 72g and a third suction end hole 73g is formed from the bottom of the second groove 72d1 of the second plate 72 to the third lower surface 73b of the third plate 73.

[0052] Multiple third grooves 73d (an example of a second suction path) are formed on the third lower surface 73b of the third plate 73, parallel to the Y direction of the third plate 73. When the third plate 73 and the second plate 72 are stacked, third suction holes 73c (an example of a suction hole) with the same diameter as the second suction holes 72c are formed at locations opposite each of the multiple second suction holes 72c. The third grooves 73d are formed at positions where the third suction holes 73c penetrate from the third upper surface 73a of the third plate 73 to the third groove bottom 73d1 (see Figure 8), which is the bottom of the third groove 73d. Therefore, in the stacked state of the third plate 73, the second plate 72, the first plate 71, and the contact plate 77, through holes (an example of suction holes) consisting of interconnected suction holes 77c, the first suction hole 71c2, the second suction hole 72c, and the third suction hole 73c are arranged from the upper surface 77a of the contact plate 77 to the bottom 73d1 of the third groove 73d of the third plate 73, and are connected to the third groove 73d. Note that the third groove 73d is not connected to the third suction end hole 73g.

[0053] [Structure of the 4th board] As shown in Figure 6, the fourth plate 74 of the fixed jig 75 has a fourth upper surface 74a and a fourth lower surface 74b, which is the surface opposite to the fourth upper surface 74a. On the fourth upper surface 74a of the fourth plate 74, when the fourth plate 74 and the third plate 73 are stacked, a fourth suction end hole 74g (an example of a first suction path) is formed, which penetrates from the fourth upper surface 74a to the fourth lower surface 74b of the fourth plate 74, at a location opposite each of the four third suction end holes 73g of the third plate 73. In other words, a total of four fourth suction end holes 74g are formed. The inner diameter of the fourth suction end hole 74g is the same as the inner diameter of the third suction end hole 73g. As a result, when the fourth plate 74, the third plate 73, and the second plate 72 are stacked, through holes consisting of the second suction end hole 72g, the third suction end hole 73g, and the fourth suction end hole 74g are formed from the second groove bottom 72d1 of the second plate 72 to the fourth lower surface 74b of the fourth plate 74.

[0054] In the state where the fourth plate 74 and the third plate 73 are stacked, the fourth plate 74 has a suction region 74h which is the region opposite to the region where the multiple third grooves 73d of the third plate 73 are formed, and multiple fourth suction holes 74c (an example of a second suction path) are formed in the fourth plate 74, penetrating from the fourth upper surface 74a to the fourth lower surface 74b of the fourth plate 74. When viewed along the Z direction, the cross-sectional shape of the fourth suction holes 74c is rectangular or triangular. The fourth suction holes 74c are formed almost seamlessly throughout the entire suction region 74h.

[0055] Multiple beams 74i are formed between adjacent fourth suction holes 74c. The multiple beams 74i are formed at an angle in two directions with respect to the Y direction. Multiple beams 74i in the same direction are spaced apart from each other. Multiple beams 74i in the same direction are connected to each other via multiple beams 74i in the other direction that intersect them. The rectangular fourth suction hole 74c is partitioned by four beams 74i.

[0056] When the fourth plate 74 and the third plate 73 are stacked, the third lower surface 73b of the third plate 73 (the top surface of the wall that demarcates the third groove 73d) and the fourth upper surface 74a of the fourth plate 74 (the beam 74i) are in contact. However, the opening on the third lower surface 73b side of the third suction hole 73c is exposed at the bottom 73d1 of the third groove 73d. Therefore, even if the third lower surface 73b of the third plate 73 and the fourth upper surface 74a of the fourth plate 74 are in contact when the fourth plate 74 and the third plate 73 are stacked, the opening on the third lower surface 73b side of the third suction hole 73c is not blocked by the beam 74i of the fourth plate 74, and all of the third suction holes 73c and the fourth suction holes 74c are connected. Therefore, in the stacked state of the fourth plate 74, third plate 73, second plate 72, first plate 71, and contact plate 77, the through-holes consisting of the suction holes 77c, first suction holes 71c2, second suction holes 72c, and third suction holes 73c are connected to the fourth suction hole 74c from the upper surface 77a of the contact plate 77 to the fourth lower surface 74b of the fourth plate 74.

[0057] [Base structure] As shown in Figure 7, the base 76 of the mounting table 70 has an upper surface 76a and a lower surface 76b which is the surface opposite to the upper surface 76a. On the upper surface 76a of the base 76, when the base 76 and the fourth plate 74 are stacked, bottomed holes 76g (an example of a first suction path) are formed from the upper surface 76a of the base 76 to the middle of the plate thickness direction of the base 76, at locations opposite each of the four fourth suction end holes 74g of the fourth plate 74. In other words, a total of four suction end holes 76g are formed. The inner diameter of the suction end holes 76g is the same as the inner diameter of the fourth suction end holes 74g. As a result, when the base 76, fourth plate 74, third plate 73, and second plate 72 are stacked, a bottomed hole consisting of a second suction end hole 72g, a third suction end hole 73g, a fourth suction end hole 74g, and a suction end hole 76g is formed from the bottom of the second groove 72d1 of the second plate 72 down to the base 76.

[0058] The base 76 has a first discharge hole 76m (an example of a first suction path), which is a closed hole with a circular cross-section, formed from the bottom surface 76b to partway along the thickness direction of the plate. In other words, the first discharge hole 76m does not penetrate to the top surface 76a. Between the top surface 76a and the bottom surface 76b of the base 76, there are multiple connecting holes 76p that connect the four suction end holes 76g and the first discharge hole 76m. Specifically, two closed connecting holes 76p, which are connecting holes 76p1 (an example of a first suction path), are formed along the X direction to connect two suction end holes 76g that are aligned along the X direction. In addition, two closed connecting holes 76p, which are connecting holes 76p2 (an example of a first suction path), are formed along the Y direction from the short side of the base 76 parallel to the X direction, so as to intersect and connect with each of the two connecting holes 76p1. Furthermore, two connection holes 76p, which are inclined with respect to the Y direction, are formed as connection holes 76p3 (an example of the first suction path), connecting the bottoms of the two connection holes 76p2 to the first discharge hole 76m. Plugs 76q are placed at the ends of the connection holes 76p1, 76p2, and 76p3 that are exposed from the base 76. The plugs 76q prevent the air flowing through the connection holes 76p from leaking to the outside of the mounting base 70.

[0059] On the upper surface 76a of the base 76, a recess 76d (an example of a second suction path) is formed at a location facing the suction region 74h of the fourth plate 74 when the base 76 and the fourth plate 74 are stacked. Multiple support parts 76e are formed in the recess 76d, spaced apart throughout it. The top surface of the support parts 76e is the upper surface 76a, and the support parts 76e support the suction region 74h on the fourth lower surface 74b side of the fourth plate 74. In addition, a second discharge hole 76n (an example of a second suction path) with a circular cross-section is formed in the recessed bottom 76d1 (see Figure 8), which is the bottom surface of the recess 76d of the base 76, and penetrates from the recessed bottom 76d1 to the lower surface 76b of the base 76.

[0060] As shown in Figure 8, with the base 76, fourth plate 74, third plate 73, second plate 72, first plate 71, and contact plate 77 stacked, the area from the upper surface 77a of the contact plate 77 to the lower surface 76b of the base 76 is connected by the suction holes 77c, the first suction hole 71c1, the space partitioned by the first groove 71d and the second groove 72d, the second suction end hole 72g, the third suction end hole 73g, the fourth suction end hole 74g, the suction end hole 76g, the connecting hole 76p1, the connecting hole 76p2, the connecting hole 76p3, and the first discharge hole 76m, allowing air to flow. Hereinafter, the air passage consisting of the space partitioned by the first groove 71d and the second groove 72d, the second suction end hole 72g, the third suction end hole 73g, the fourth suction end hole 74g, the suction end hole 76g, the connecting hole 76p1, the connecting hole 76p2, the connecting hole 76p3, and the first discharge hole 76m will be referred to as the first suction passage. The first suction passage is connected to the adsorption suction hole 77c and the first suction hole 71c1. As described above, the first suction hole 71c, which is positioned diagonally to the first suction hole 71c1, is the first suction hole 71c1. Therefore, the first suction passage is arranged to connect a plurality of first suction holes 71c1 that are positioned diagonally to each other when viewed along the Z direction.

[0061] Furthermore, with the base 76, fourth plate 74, third plate 73, second plate 72, first plate 71, and contact plate 77 stacked, the upper surface 77a of the contact plate 77 is connected to the lower surface 76b of the base 76 by the suction holes 77c, first suction holes 71c2, second suction holes 72c, third suction holes 73c, third groove 73d, fourth suction hole 74c, recess 76d, and second discharge hole 76n, allowing air to flow. Hereinafter, the air flow path consisting of the third groove 73d, fourth suction hole 74c, recess 76d, and second discharge hole 76n will be referred to as the second suction path. The second suction path is connected to the suction holes 77c, first suction holes 71c2, second suction holes 72c, and third suction holes 73c. As described above, the first suction port 71c, which is positioned diagonally to the first suction port 71c2, is the first suction port 71c2. Therefore, the second suction path is arranged to connect a plurality of first suction ports 71c2 that are positioned diagonally to each other when viewed along the Z direction.

[0062] The first branch channel VR11, which is part of the first channel VR1, is connected to the opening on the lower surface 76b of the base 76 of the first discharge port 76m. In other words, the first suction channel is connected to the first branch channel VR11. Also, the second branch channel VR12, which is part of the first channel VR1, is connected to the opening on the lower surface 76b of the base 76 of the second discharge port 76n. In other words, the second suction channel is connected to the second branch channel VR12. A switching valve 78 is connected to the ends of the first branch channel VR11 and the second branch channel VR12 opposite to the mounting base 70, and only one first channel VR1 is positioned between the switching valve 78 and the first vacuum pump D1 (see Figure 2). That is, the first branch channel VR11 and the second branch channel VR12 merge at the switching valve 78. In other words, the first channel VR1 branches into the first branch channel VR11 and the second branch channel VR12 at the switching valve 78 and is connected to the base 76. The switching valve 78 is controlled by the control unit 50 to switch between the flow and blockage (stopping flow) of air in the first branch channel VR11 and the flow and blockage (stopping flow) of air in the second branch channel VR12.

[0063] [Method of manufacturing electronic components] Next, a method for manufacturing electronic components Sc by cutting a molded substrate Sb using a cutting device 1 will be explained with reference to Figures 1, 2, 8, and 9. The method for manufacturing electronic components Sc includes a piece formation step, a fixing step, a first transport step, and a second transport step.

[0064] As shown in Figure 2, the individualization process is a process of individualizing the molded substrate Sb into multiple electronic components Sc by cutting it with the spindle unit 6. The fixing process is a process of transporting the multiple individualized electronic components Sc together while maintaining the arrangement of the multiple electronic components Sc and fixing them to the mounting table 70. The first transport process is a process of releasing the fixing of the first cut product group Sc1 (see Figure 9), which consists of some of the multiple electronic components Sc fixed to the mounting table 70, and using the extraction unit 15 to pick up the first cut product group Sc1 and transport it to the good product tray 15a or the defective product tray 15b. The second transport process is a process of releasing the fixing of the second cut product group Sc2 (see Figure 9), which consists of some of the electronic components Sc different from the first cut product group Sc1, which consists of multiple electronic components Sc fixed to the mounting table 70, and using the extraction unit 15 to pick up the second cut product group Sc2 and transport it to the good product tray 15a or the defective product tray 15b. Details of the first cut product group Sc1 and the second cut product group Sc2 will be described later.

[0065] First, the molded substrate Sb shown in Figure 1 is placed in the magazine M1 of the cutting device 1 shown in Figure 2, with the side (surface) to which the protective film 67 is attached facing downwards. The substrate supply unit 3 pushes out the molded substrate Sb one by one from the magazine M1 which contains multiple molded substrates Sb, and supplies the molded substrate Sb one by one to the positioning unit 4.

[0066] The positioning unit 4 positions the molded substrate Sb extruded from the substrate supply unit 3 onto the rail unit 4a. After that, the positioning unit 4 transfers the positioned molded substrate Sb to the cutting table 5.

[0067] After transferring the molded substrate Sb to the cutting table 5, or before transferring it, the second vacuum pump D2 is activated. When the second vacuum pump D2 is activated, the molded substrate Sb is attracted to the holding member 5a and fixed to the cutting table 5.

[0068] When the molded substrate Sb is adsorbed and fixed onto the cutting table 5, the molded substrate Sb is imaged by the first position confirmation camera 5d to confirm its position. Subsequently, the cutting table 5 moves along the Y-axis toward the spindle unit 6. After the cutting table 5 moves below the spindle unit 6, the molded substrate Sb is cut along the cutting section 68 (see Figure 1) by moving the cutting table 5 and the spindle unit 6 relative to each other, thereby obtaining multiple individual electronic components Sc (fragmentation process). Subsequently, if necessary, the multiple electronic components Sc are imaged by the second position confirmation camera 6c to confirm the cut positions and widths of the multiple electronic components Sc.

[0069] After the cutting of the molded substrate Sb is complete, the cutting table 5 moves along the Y-axis away from the spindle 6 while holding the multiple individual electronic components Sc. During this movement process, the first cleaner 5e cleans and dries the back surfaces of the electronic components Sc.

[0070] Next, the transfer unit 7 picks up the electronic component Sc held on the cutting table 5 from above. The transfer unit 7 picks up the electronic component Sc and transfers it to the inspection table 11 of the inspection storage module B1. During this transfer process, the second cleaner 7a cleans and dries the surface of the electronic component Sc.

[0071] The inspection table 11 holds electronic components Sc for optical inspection of the electronic components Sc by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection table 11 is movable along the X-axis. The inspection table 11 can also be inverted vertically.

[0072] The first optical inspection camera 12 images the surface of the electronic component Sc as it is transferred to the inspection table 11 by the transfer unit 7. The transfer unit 7 then places the electronic component Sc on a holding member (not shown) on the inspection table 11. After the holding member has attracted the electronic component Sc, the inspection table 11 is inverted. After the inverted inspection table 11 moves above the second optical inspection camera 13, the back surface of the electronic component Sc is imaged by the second optical inspection camera 13.

[0073] Multiple inspected electronic components Sc are fixed together to the contact plate 77 of the fixing jig 75 of the mounting table 70 of the placement section 14, in the same arrangement as when they were cut by the spindle section 6. In this embodiment, the multiple electronic components Sc are fixed so that their back surfaces (the surfaces on which the electrodes are arranged in Figure 1) face the contact plate 77 of the fixing jig 75 of the mounting table 70, and are placed in contact with the contact plate 77 (see also Figure 8). Figure 9 shows multiple electronic components Sc arranged on the mounting table 70. The first cut component group Sc1 described above refers to a collection of multiple electronic components Sc arranged on the mounting table 70 that are positioned at an angle to each other (the cut portions 68 do not face each other), as indicated by the "x" marks in Figure 9. The second cut component group Sc2 refers to a collection of multiple electronic components Sc that are positioned at an angle to each other (the cut portions 68 do not face each other), as indicated by the "x" marks in Figure 9. In other words, each of the multiple electronic components Sc placed on the mounting base 70 belongs to either the first cut product group Sc1 or the second cut product group Sc2.

[0074] The suction holes corresponding to each of the multiple electronic components Sc that are not adjacent to each other are connected to either the first suction path or the second suction path. Specifically, the electronic components Sc of the first cut product group Sc1 that are not adjacent to each other are positioned above the holes connected to the first suction hole 71c1 among the suction holes 77c of the contact plate 77 connected to the first suction path. The electronic components Sc of the first cut product group Sc1 that are not adjacent to each other are positioned at an angle to each other. Similarly, the electronic components Sc of the second cut product group Sc2 that are not adjacent to each other are positioned above the holes connected to the first suction hole 71c2 among the suction holes 77c of the contact plate 77 connected to the second suction path. The electronic components Sc of the second cut product group Sc2 that are not adjacent to each other are positioned at an angle to each other. In other words, electronic components Sc from the second cut product group Sc2 are placed at positions adjacent to any electronic component Sc from the first cut product group Sc1 in both the X and Y directions, and electronic components Sc from the first cut product group Sc1 are placed at positions diagonally to the electronic component Sc from the first cut product group Sc1. To put it another way, the cut portions 68 (see Figure 1) cut by the spindle portion 6 of electronic components Sc from the first cut product group Sc1 and electronic components Sc from the second cut product group Sc2 that are adjacent to each other in the X or Y direction face each other. The cut portions 68 do not face each other when electronic components Sc from the first cut product group Sc1 or electronic components Sc from the second cut product group Sc2 are placed at positions diagonally to each other.

[0075] In this state, on the mounting table 70, the control unit 50 operates the first vacuum pump D1 and switches the switching valve 78 to draw air from both the first branch channel VR11 connected to the first suction path and the second branch channel VR12 connected to the second suction path. As a result, as shown in the left diagram of Figure 9, both the electronic components Sc of the first cut parts group Sc1 and the electronic components Sc of the second cut parts group Sc2 are attracted and fixed to the mounting table 70 (attraction ON).

[0076] Next, the control unit 50 switches the switching valve 78 so that suction from the first branch channel VR11 is stopped and suction from the second branch channel VR12 continues only. As a result, as shown in the right-hand diagram of Figure 9, the fixing of the first cut piece group Sc1 to the mounting table 70 is released (suction OFF), and the fixing of the second cut piece group Sc2 to the mounting table 70 continues (suction ON).

[0077] As shown in Figure 8, with the first cut product group Sc1 released from its attachment to the mounting table 70, the extraction unit 15 transports the multiple electronic components Sc included in the first cut product group Sc1, which are placed on the mounting table 70, to a tray (first transport step). The extraction unit 15 repeatedly picks up and transports some of the multiple electronic components Sc until all of the electronic components Sc of the first cut product group Sc1 are transported. At this time, since the multiple electronic components Sc of the second cut product group Sc2 are fixed to the mounting table 70, even if the electronic components Sc of the first cut product group Sc1 are connected to the electronic components Sc of the second cut product group Sc2 via the burrs 67a of the protective film 67, the transport of the electronic components Sc of the first cut product group Sc1 does not move the electronic components Sc of the second cut product group Sc2, and the burrs 67a detach from the electronic components Sc of the second cut product group Sc2 and are transported together with the electronic components Sc of the first cut product group Sc1.

[0078] Each electronic component Sc of the first cut product group Sc1, which is transported to the extraction unit 15, is transported and stored in either a good product tray 15a or a defective product tray 15b based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. That is, good electronic components Sc are stored in the good product tray 15a, and defective electronic components Sc are stored in the defective product tray 15b.

[0079] Once all the electronic components Sc included in the first cut product group Sc1 have been transported to the tray, the control unit 50 switches the switching valve 78 to stop suction from the second branch channel VR12 in addition to stopping suction from the first branch channel VR11. This releases the second cut product group Sc2 from being fixed to the mounting table 70 (suction OFF). Then, the extraction unit 15, similar to the first cut product group Sc1, separates the multiple electronic components Sc included in the second cut product group Sc2, which are placed on the mounting table 70, into good and defective products and transports them to the good product tray 15a and the defective product tray 15b (second transport process). At this time as well, the extraction unit 15 repeatedly suctions and transports some of the multiple electronic components Sc until all the electronic components Sc of the second cut product group Sc2 have been transported. As a result, all of the multiple electronic components Sc obtained by cutting the molded substrate Sb into individual pieces are transported and stored in either the good product tray 15a or the defective product tray 15b.

[0080] In this way, when transporting multiple electronic components Sc in the extraction unit 15, the multiple electronic components Sc of the first cut product group Sc1 are transported while the second cut product group Sc2 is fixed to the mounting table 70 by suction. Therefore, even if the burrs 67a of the protective film 67 of the electronic components Sc of the first cut product group Sc1 are connected to the protective film 67 or burrs 67a of the electronic components Sc of the second cut product group Sc2, which are positioned adjacent to each other in the X and / or Y directions, the electronic components Sc of the second cut product group Sc2 will not move from their fixed positions on the mounting table 70 when the electronic components Sc of the first cut product group Sc1 are transported. Therefore, the burrs 67a of the electronic components Sc of the first cut product group Sc1 are separated from the electronic components Sc of the second cut product group Sc2 and transported together with the electronic components Sc of the first cut product group Sc1. In this way, it becomes possible to suction and transport the electronic components Sc of the first cut product group Sc1 without moving the electronic components Sc of the second cut product group Sc2.

[0081] [Another embodiment] The following describes another embodiment of the above-described embodiment. For the same components as in the above-described embodiment, the same terms and reference numerals will be used for explanation to facilitate understanding.

[0082] (1) In the above embodiment, the multiple electronic components Sc are arranged such that the side on which the electrodes are placed faces and contacts the first plate 71 of the mounting base 70, that is, they are placed on the mounting base 70 with the protective film 67 facing upwards. However, the protective film 67 may be arranged so that it faces and contacts the first plate 71.

[0083] (2) In the above embodiment, the multiple electronic components Sc were divided into a first cut product group Sc1 and a second cut product group Sc2. However, they may be divided into three or more cut product groups, provided that no electronic components Sc from the same cut product group are placed adjacent to each other in the X and Y directions. In this case, the suction paths also need to be formed according to the number of cut product groups.

[0084] (3) In the above embodiment, the electronic component Sc was placed and fixed on the contact plate 77 of the mounting base 70, but the contact plate 77 may be omitted and the electronic component Sc may be placed directly on the first plate 71.

[0085] (4) In the above embodiment, a first groove 71d is formed in the first plate 71 and a second groove 72d is formed in the second plate 72 to form a first suction path. However, if the pressure loss of the air to be drawn in the first suction path is sufficiently small, the first suction path may be formed in only one of the first groove 71d and the second groove 72d.

[0086] (5) In the above embodiment, one first suction hole 71c is provided for one electronic component Sc, but two or more first suction holes 71c may be provided for one electronic component Sc. Also, the number of first suction holes 71c1 and first suction holes 71c2 for one electronic component Sc may be different.

[0087] (6) In the above embodiment, the electronic components Sc of the first cut product group Sc1 were placed on the suction hole 77c connected to the first suction hole 71c1, and the electronic components Sc of the second cut product group Sc2 were placed on the suction hole 77c connected to the first suction hole 71c2, but the embodiment is not limited to this. The electronic components Sc of the first cut product group Sc1 may be placed on the suction hole 77c connected to the first suction hole 71c2, and the electronic components Sc of the second cut product group Sc2 may be placed on the suction hole 77c connected to the first suction hole 71c1.

[0088] (7) In the above embodiment, the protective film 67 was attached to only one side of the molded substrate Sb (object to be cut), but it may be attached to both sides.

[0089] (8) In the above embodiment, a protective film 67 was attached to the molded substrate Sb (object to be cut), but the cutting device 1 of the above embodiment is also effective for objects to be cut that do not have a protective film 67 attached. In particular, it is useful when the object to be cut is made of a material that is prone to generating burrs when the object to be cut is made into individual pieces, or when the burrs are large and the burrs of adjacent electronic components are prone to joining together.

[0090] [Summary of the above embodiment] The following describes the manufacturing method of the cut product (Sc), the fixed jig (75), and the cutting device (1) as described in the above embodiment.

[0091] <1> One embodiment of the method for manufacturing cut pieces (Sc) is a fragmentation step in which the object to be cut (Sb) is cut by a cutting mechanism (5,6) to form multiple cut pieces (Sc), a fixing step in which the multiple cut pieces (Sc) are transported together while maintaining the arrangement of the fragmented cut pieces (Sc) and fixed to a fixing jig (75), and fixing only a first group of cut pieces (Sc1) consisting of some of the multiple cut pieces (Sc) fixed to the fixing jig (75). The system includes a first transport step of releasing the fixing and using the transport mechanism (15) to pick up the first group of cut pieces (Sc1) and transport them to the storage sections (15a, 15b), and a second transport step of releasing the fixing of the second group of cut pieces (Sc2), which consists of some of the cut pieces (Sc) that are different from the first group of cut pieces (Sc1) among the multiple cut pieces (Sc) fixed to the fixed jig (75), using the transport mechanism (15) to pick up the second group of cut pieces (Sc2) and transport them to the storage sections (15a, 15b).

[0092] The present invention relates to a method for manufacturing cut pieces (Sc), which includes a first transport step in which only the fixing of a first group of cut pieces (Sc1), consisting of some of the cut pieces (Sc) from a plurality of cut pieces (Sc) fixed to a fixed jig (75), is released, and the first group of cut pieces (Sc1) is picked up by a transport mechanism (15) and transported to a storage section (15a, 15b); and a second transport step in which, after the first transport step, the fixing of a second group of cut pieces (Sc2), consisting of some of the cut pieces (Sc) different from the first group of cut pieces (Sc1), from a plurality of cut pieces (Sc) fixed to the fixed jig (75), is released, and the second group of cut pieces (Sc2) is picked up by a transport mechanism (15) and transported to a storage section (15a, 15b). Therefore, when transporting the cut pieces (Sc) included in the first group of cut pieces (Sc1), the cut pieces (Sc) included in the second group of cut pieces (Sc2) remain fixed to the fixed jig (75) by suction. Therefore, even if the cut pieces (Sc) in the first cut piece group (Sc1) and the cut pieces (Sc) in the second cut piece group (Sc2) remain connected for some reason after cutting, the occurrence of problems such as the cut pieces (Sc) in the second cut piece group (Sc2) being transported together with the cut pieces (Sc) in the first cut piece group (Sc1), or moving from their fixed location, is suppressed.

[0093] <2> the above <1> In the method for manufacturing the cut product (Sc) described above, it is preferable that the object to be cut (Sb) is in the shape of a plate, and that a protective film (67) is attached to at least one plate surface of the object to be cut (Sb).

[0094] When the film (67) is attached to the object to be cut (Sb), even after the object to be cut (Sb) has been cut, the burrs (67a) of the film (67) of the cut pieces (Sc) included in the first cut piece group (Sc1) may remain attached to the cut pieces (Sc) included in the second cut piece group (Sc2) while maintaining adhesive force. In such cases, when the cut pieces (Sc) included in the first cut piece group (Sc1) are transported, there is a risk that the cut pieces (Sc) included in the second cut piece group (Sc2) may be transported together, or that they may move from their fixed location. However, with the manufacturing method of the cut pieces (Sc) according to this embodiment, even if the cut pieces (Sc) included in the first cut piece group (Sc1) and the cut pieces (Sc) included in the second cut piece group (Sc2) remain connected after cutting, when the cut pieces (Sc) included in the first cut piece group (Sc1) are transported, the cut pieces (Sc) included in the second cut piece group (Sc2) remain fixed to the fixed jig (75). Therefore, problems such as the cut pieces (Sc) included in the second cut piece group (Sc2) being transported together or moving from their fixed location are suppressed.

[0095] <3> the above <1> or <2> In the method for manufacturing cut products (Sc) described above, the fixing jig (75) has a plurality of suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) that enable the placement of a plurality of cut products (Sc) to be individually fixed to the fixing jig (75) by suctioning air, and each of the plurality of suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) is connected to a first suction path or a second suction path that allows the air that has been sucked in independently to flow through each other, and it is preferable to stop the flow of air in the first suction path in the first transport step and to stop the flow of air in the second suction path in the second transport step.

[0096] According to this, by providing a first suction path and a second suction path and independently controlling the flow of air, it is possible to fix and release the cut pieces (Sc) included in the first cut piece group (Sc1) to and from the fixing jig (75), and to fix and release the cut pieces (Sc) included in the second cut piece group (Sc2) to and from the fixing jig (75).

[0097] <4> One embodiment of the fixing jig (75) is a fixing jig (75) for fixing multiple cut pieces (Sc) obtained by cutting the cut pieces (68) of a plate-shaped object to be cut (Sb) having a plurality of intersecting linear cutting sections (68), while maintaining their arrangement after cutting, and having a plurality of suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) that enable the placement of the multiple cut pieces (Sc) to be fixed individually by sucking air, and which can suck air independently of each other. It has a first suction path and a second suction path that can circulate the drawn air, and each of the multiple suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) is connected to either the first suction path or the second suction path, and the suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) corresponding to each of the multiple cut pieces (Sc) that are not adjacent to each other are connected to either the first suction path or the second suction path.

[0098] According to this, the suction holes (77c, 71c, 71c1, 71c2, 72c, 73c) of the fixing jig (75) corresponding to each of the multiple cut pieces (Sc) whose cutting sections (68) do not face each other are connected to either the first suction path or the second suction path. Therefore, by releasing the fixing of either the first or second suction path to the fixing jig (75), multiple cut pieces (Sc) whose cutting sections (68) do not face each other can be transported. Conversely, multiple cut pieces (Sc) whose cutting sections (68) face each other maintain a state where one of them is fixed to the fixing jig (75), so multiple cut pieces (Sc) will not be transported at the same time. Therefore, even if cut pieces (Sc) that are positioned adjacent to each other with their cutting sections (68) facing each other remain connected for some reason after being cut by the cutting mechanism (6), the occurrence of problems such as adjacent cut pieces (Sc) being transported together or moving from their fixed location is suppressed.

[0099] <5> the above <4> The fixing jig (75) described herein comprises a contact plate (77), a first plate (71), a second plate (72), a third plate (73), and a fourth plate (74), and is constructed by stacking the fourth plate (74), third plate (73), second plate (72), first plate (71), and contact plate (77) in this order from bottom to top, and the plate surface of the contact plate (77) opposite to the side on which the first plate (71) is stacked is the mounting surface (77a) on which the cut product (Sc) is placed, and the first suction path is the first plate ( Preferably, the first suction path is formed in at least one of the contact plate (77) and the second plate (72), the second suction path is formed in at least one of the third plate (73) and the fourth plate (74), the suction holes (77c, 71c, 71c1) connected to the first suction path are formed in the contact plate (77) and the first plate (71), and the suction holes (77c, 71c, 71c2, 72c, 73c) connected to the second suction path are formed extending from the contact plate (77) to the third plate (73).

[0100] According to this, a fixed jig (75) can be provided with a first suction path and a second suction path that are independent of each other, by a simple method of laminating multiple plates.

[0101] <6> the above <5> In the fixed jig (75) described above, the first suction path is preferably formed across the first plate (71) and the second plate (72).

[0102] According to this, a fixing jig (75) for cut pieces (Sc) can be obtained by increasing the cross-sectional area of ​​the flow path of the first suction path and reducing the pressure loss of the flowing air.

[0103] <7> the above <5> or <6> In the fixed jig (75) described above, a plurality of grooves (73d) are formed on the surface of the third plate (73) facing the fourth plate (74) as a second suction path, and it is preferable that the suction holes (77c, 71c, 71c2, 72c, 73c) connected to the second suction path are connected to the plurality of grooves (73d).

[0104] According to this, in the fixed jig (75), even if the third plate (73) and the fourth plate (74) are in contact when the third plate (73) and the fourth plate (74) are stacked, the suction holes (77c, 71c, 71c2, 72c, 73c) connected to the second suction path are connected to multiple grooves (73d), so the suction holes (77c, 71c, 71c2, 72c, 73c) will not be blocked by the fourth plate (74).

[0105] <8> One aspect of the cutting device (1) is a cutting mechanism (6) that cuts the cutting portions (68) of a plate-shaped object to be cut (Sb) having a plurality of intersecting linear cutting portions (68) to divide it into a plurality of cut pieces (Sc), and <4> from <7> The system comprises a mounting base (70) including a fixed jig (75) as described in any one of the above.

[0106] According to this, the cutting device (1) comprises a cutting mechanism (6) that cuts the cutting portion (68) of a plate-shaped object to be cut (Sb) to divide it into multiple cut pieces (Sc), and a mounting table (70) that includes a fixing jig (75) for fixing the cut pieces (Sc) after cutting. As a result, after moving the multiple cut pieces (Sc) while maintaining their arrangement and fixing them to the fixing jig (75) on the mounting table (70), the fixing to the fixing jig (75) of either the first suction path or the second suction path can be released, thereby allowing the transport of multiple cut pieces (Sc) whose cutting portions (68) are not facing each other. [Industrial applicability]

[0107] This disclosure can be used for methods of manufacturing cut products, fixed jigs, and cutting devices. [Explanation of Symbols]

[0108] 1: Cutting device 6: Spindle section (cutting mechanism) 15: Extraction section (transport mechanism) 15a: Tray for good quality products (storage section) 15b: Tray for defective products (storage section) 61: Element 67: Protective film (film) 68: Cutting section 70: Mounting platform 71: 1st board 71c, 71c1, 71c2: 1st suction hole (suction hole) 71d: First groove (first suction pathway) 72: 2nd board 72c: 2nd suction hole (suction hole) 72d: Second groove (first suction pathway) 72g: Second suction end port (first suction path) 73: 3rd board 73c: 3rd suction hole (suction hole) 73d: Third groove (second suction pathway) 73g: Third suction end port (first suction path) 74: 4th board 74c: Fourth suction port (second suction pathway) 74g: Fourth suction end port (first suction path) 75: Fixed Jig 76d: Recess (second suction pathway) 76g: Suction end port (first suction path) 76m: First discharge port (first suction path) 76n: Second discharge port (second suction path) 76p1: Connection port (first suction path) 76p2: Connection port (first suction path) 76p3: Connection port (first suction path) 77: Contact plate 77a: Top surface (mounting surface) 77c: Adsorption suction hole (suction hole) Sb: Pre-molded substrate (object to be cut) Sc:Electronic parts (cut products) Sc1: 1st cutting product group Sc2: 2nd cutting product group

Claims

1. A fixing jig for fixing multiple cut pieces obtained by cutting the cutting portions of an object to be cut, which has multiple intersecting linear cutting portions, while maintaining their arrangement after cutting, It has multiple suction holes that enable the individual fixing of multiple placed cut pieces by sucking in air, and also has a first suction path and a second suction path that enable the air that has been sucked in to flow independently of each other. Each of the multiple suction holes is connected to the first suction path or the second suction path, A fixed jig connected to either the first suction path or the second suction path, each of the suction holes corresponding to a plurality of cut pieces that are not adjacent to each other.

2. It comprises a contact plate, a first plate, a second plate, a third plate, and a fourth plate, The fourth plate, the third plate, the second plate, the first plate, and the contact plate are stacked in this order from bottom to top. The plate surface of the contact plate opposite to the side on which the first plate is laminated is the mounting surface on which the cut product is placed. The first suction path is formed in at least one of the first plate and the second plate, and the second suction path is formed in at least one of the third plate and the fourth plate. The fixing jig according to claim 1, wherein the suction holes connected to the first suction path are formed in the contact plate and the first plate, and the suction holes connected to the second suction path are formed extending from the contact plate to the third plate.

3. The fixing jig according to claim 2, wherein the first suction path is formed across the first plate and the second plate.

4. The fixing jig according to claim 2, wherein a plurality of grooves are formed on the surface of the third plate facing the fourth plate, and the suction holes connected to the second suction paths are connected to the plurality of grooves.

5. A cutting mechanism that cuts the cutting portions of a plate-shaped object to be cut, which has a plurality of intersecting linear cutting portions, to divide it into a plurality of individual cut pieces, A cutting device comprising a mounting base including a fixed jig according to any one of claims 1 to 4.

6. A method for manufacturing a cut product using the fixed jig described in Claim 1, A fragmentation step involves cutting the object to be cut using a cutting mechanism to divide it into multiple cut pieces, A fixing step of transporting the multiple cut pieces together while maintaining the arrangement of the multiple cut pieces and fixing them to the fixing jig, A first transport step involves releasing only a portion of the first group of cut pieces, which are fixed to the fixed jig, and using a transport mechanism to pick up the first group of cut pieces and transport them to a storage unit. A method for manufacturing cut products, comprising: a second transport step after the first transport step, in which the fixing of a second group of cut products consisting of a portion of the cut products fixed to the fixed jig that are different from the first group of cut products, and the transport mechanism adsorbs the second group of cut products and transports them to the storage section.

7. The method for manufacturing a cut product according to claim 6, wherein the object to be cut is in the shape of a plate, and a protective film is attached to at least one plate surface of the object to be cut.

8. The method for manufacturing a cut product according to claim 6 or 7, wherein in the first transport step, the flow of air in the first suction path is stopped, and in the second transport step, the flow of air in the second suction path is stopped.

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