Multilayer substrates, linked substrates, and semiconductor devices

Abstract

This laminated substrate comprises a frame-shaped first member constituted from organic resin, and a frame-shaped second member constituted from ceramic. In the laminated substrate, the first member and the second member are alternately laminated, and an inner frame part of the first member and an inner frame part of the second member are connected.

Description

Technical Field

[0001] The disclosed embodiments relate to a laminated substrate, a connection substrate, and a semiconductor device.

Background Art

[0002] Conventionally, as a substrate for a semiconductor device, a substrate made of an organic resin formed in a frame shape has been used (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] The laminated substrate of the present disclosure includes an organic resin Contains a frame-shaped first member and a frame-shaped second member made of ceramic. In the laminated substrate, the first member and the second member are laminated on each other, and the inner frame portion of the first member and the inner frame portion of the second member are connected.

Brief Description of the Drawings

[0005] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a laminated substrate according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along the line A-A shown in FIG. 1. [Figure 3] FIG. 3 is an enlarged cross-sectional view showing the configuration of the interface between the first member and the second member according to the embodiment. [Figure 4] FIG. 4 is an enlarged cross-sectional view showing the configuration of the inner wall of the first member according to the embodiment. [Figure 5] FIG. 5 is a perspective view showing an example of the configuration of a connection substrate according to the embodiment. [Figure 6] FIG. 6 is a perspective view showing another example of the configuration of a laminated substrate according to the embodiment. [Figure 7] Figure 7 is a cross-sectional view showing an example of the configuration of a semiconductor device according to the embodiment. [Figure 8] Figure 8 is a cross-sectional view showing an example of the configuration of a laminated substrate according to another embodiment 1. [Figure 9] Figure 9 is a cross-sectional view showing an example of the configuration of a laminated substrate according to another embodiment 2. [Figure 10] Figure 10 is a cross-sectional view showing an example of the configuration of a laminated substrate according to another embodiment 3. [Figure 11] Figure 11 is a cross-sectional view showing an example of the configuration of a laminated substrate according to another embodiment 4. [Figure 12] Figure 12 is a cross-sectional view showing an example of the configuration of a laminated substrate according to another embodiment 5. [Figure 13] Figure 13 is a cross-sectional view showing an example of the configuration of a laminated substrate according to another embodiment 6. [Figure 14] Figure 14 is a cross-sectional view showing an example of the configuration of a laminated substrate according to another embodiment 7. [Modes for carrying out the invention]

[0006] Conventionally, substrates made of organic resin molded into a frame shape have been used as substrates for semiconductor devices. However, the above-mentioned conventional technology had the problem that the substrate had low rigidity and was easily bent. This could lead to a decrease in the reliability of semiconductor devices.

[0007] Therefore, there is a need for technology that can overcome the aforementioned problems and improve the bending strength of laminated substrates.

[0008] Hereinafter, embodiments of the laminated substrate, linked substrate, and semiconductor device disclosed in this application will be described with reference to the attached drawings. However, this disclosure is not limited to the embodiments described below. Furthermore, each embodiment can be appropriately combined as long as the processing content is not inconsistent. Also, the same parts are denoted by the same reference numerals in each of the following embodiments, and redundant descriptions are omitted.

[0009] Furthermore, in the embodiments described below, expressions such as "alongside," "perpendicular," or "parallel" may be used, but these expressions do not require strict adherence to "alongside," "perpendicular," or "parallel." In other words, each of the above expressions allows for deviations such as manufacturing accuracy or installation accuracy.

[0010] <Embodiment> First, the configuration of the laminated substrate 1 according to the embodiment will be described with reference to Figures 1 to 4. Figure 1 is a perspective view showing an example of the configuration of the laminated substrate 1 according to the embodiment, and Figure 2 is a cross-sectional view taken along the line AA shown in Figure 1.

[0011] As shown in Figure 1 and other figures, the laminated substrate 1 according to this embodiment has a first member 2 and a second member 3. The first member 2 is frame-shaped (square frame-shaped) and made of organic resin. The second member 3 is frame-shaped (square frame-shaped) and made of ceramic.

[0012] The organic resin constituting the first member 2 is, for example, one selected from the group consisting of epoxy resin, polyimide resin, cyclic olefin resin, and polyphenylene ether resin. The ceramic constituting the second member 3 is, for example, one selected from the group consisting of alumina, alumina-zirconia composite, mullite, aluminum nitride, silicon nitride, and silicon carbide.

[0013] Here, for example, with respect to alumina, this includes not only single-component metal oxides of alumina (Al2O3), but also so-called alumina ceramics, which are alumina with sintering aids added. Similarly, for alumina-zirconia composites, mullite, aluminum nitride, silicon nitride, and silicon carbide, ceramics containing sintering aids are selected as suitable materials.

[0014] In the laminated substrate 1 according to the embodiment, as shown in FIG. 2, the first member 2 and the second member 3 are laminated on each other. Further, in the embodiment, the inner frame portion 2a of the first member 2 and the inner frame portion 3a of the second member 3 are connected. As a result, an inner frame portion 1a including the inner frame portion 2a and the inner frame portion 3a is located inside the laminated substrate 1.

[0015] Here, in the embodiment, the frame-shaped laminated substrate 1 is composed of an organic resin-made first member 2 and a ceramic-made second member 3. Thereby, compared with a frame-shaped substrate composed only of an organic resin, the rigidity can be improved. Therefore, according to the embodiment, the bending strength of the frame-shaped substrate can be improved.

[0016] Further, in the embodiment, since the frame-shaped laminated substrate 1 is composed of the organic resin-made first member 2 and the ceramic-made second member 3, even if the substrate is made thinner than the case where the substrate is composed only of an organic resin, rigidity can be ensured without adding a separate reinforcing member.

[0017] As a result, the semiconductor device 20 (see FIG. 7) can be made thinner than securing the inner frame portion 1a used as the accommodation space for the semiconductor element 21 (see FIG. 7) only with an organic resin.

[0018] Further, in the embodiment, by forming the ceramic-made second member 3 into a frame shape, the volume of the second member 3 can be reduced by the amount of the inner frame portion 3a. Therefore, according to the embodiment, the laminated substrate 1 can be made lighter.

[0019] Further, in the embodiment, as shown in FIG. 2, the inner wall 2b of the first member 2 and the inner wall 3b of the second member 3 may both be parallel to the lamination direction D. Thereby, for example, when the semiconductor element 21 is a light-emitting element, when the light emitted from the semiconductor element 21 is reflected by the inner wall 2b or the inner wall 3b, the direction of reflection can be easily controlled.

[0020] Furthermore, in this embodiment, the inner wall 2b of the first member 2 and the inner wall 3b of the second member 3 may be flush with each other. This makes it easier to control the direction of reflection of light emitted from the semiconductor element 21, for example, when the semiconductor element 21 is a light-emitting element, because the inner wall 2b and the inner wall 3b form a single plane.

[0021] Here, the connection between the inner frame portion 2a of the first member 2 and the inner frame portion 3a of the second member 3 means that the space provided inside the first member 2 (first space) and the space provided inside the second member 3 (second space) form a single continuous space.

[0022] In this laminated substrate 1, the volume of the space inside the first member 2 (first space) and the volume of the space inside the second member 3 (second space) are the same.

[0023] Figure 3 is an enlarged cross-sectional view showing the configuration of the interface between the first member 2 and the second member 3 according to the embodiment. As shown in Figure 3, in the embodiment, the first member 2 and the second member 3 may be bonded together via carbon particles 4. That is, in the embodiment, the carbon particles 4 (boundary-type carbon particles 4) may be positioned so as to be in contact with both the first bonding surface 2d of the first member 2 and the second bonding surface 3d of the second member 3.

[0024] In this way, by having carbon particles 4, which have a lower Young's modulus compared to ceramic particles and metal particles, located in the bonding region between the first member 2 and the second member 3, it is possible to reduce the likelihood of the bonding region having a high Young's modulus.

[0025] In the laminated substrate 1 according to this embodiment, carbon particles 4 with a low specific gravity may be sparsely located between the first member 2 and the second member 3. In areas where carbon particles 4 are not present, the organic resin component of the first member 2 may be directly bonded to the second bonding surface 3d of the second member 3.

[0026] Furthermore, in the embodiment, the carbon particles 4 may have portions that have entered into a first recess 2d1 located on the first joining surface 2d of the first member 2 and a second recess 3d1 located on the second joining surface 3d of the second member 3. For example, in the embodiment, at the interface between the first member 2 and the second member 3, most of the carbon particles 4 may have entered into the first recess 2d1 and the second recess 3d1.

[0027] As a result, the carbon particles 4 are constrained by the first member 2 and the second member 3, making it difficult for the carbon particles 4 to detach from the laminated substrate 1 even if the entire laminated substrate 1 is deformed.

[0028] Furthermore, in this embodiment, the carbon particles 4 may penetrate more deeply into the first member 2 made of organic resin than into the second member 3 made of ceramic. In other words, the boundary-existing carbon particles 4 located at the boundary between the first member 2 and the second member 3 have a first portion 4a that penetrates into the first recess 2d1 and a second portion 4b that penetrates into the second recess 3d1. In the case of such boundary-existing carbon particles 4, it is preferable that the first portion 4a located on the first member 2 side is larger than the second portion 4b located on the second member 3 side.

[0029] As a result, the carbon particles 4 are more constrained to the first member 2, making it less likely for the carbon particles 4 to detach from the first member 2 even if the entire laminated substrate 1 is deformed.

[0030] Figure 4 is an enlarged cross-sectional view showing the structure of the inner wall 2b of the first member 2 according to the embodiment. As shown in Figure 4, the first member 2 according to the embodiment contains a plurality of inorganic fillers F. These inorganic fillers F include the carbon particles 4 (see Figure 3) described above and particles composed of inorganic components different from the carbon particles 4 (for example, silica).

[0031] Furthermore, in this embodiment, a resin layer 2b1 may be located on the surface of the inner wall 2b, which contains less inorganic filler F (i.e., more organic resin components) than the interior of the first member 2.

[0032] The thickness of the resin layer 2b1 is, for example, 0.1 μm or more and 5 μm or less. In other words, in this disclosure, "the interior of the first member 2" refers to a position deeper than 0.1 μm from the surface of the inner wall 2b.

[0033] For example, in this embodiment, a resin layer 2b1 made up of a continuous organic resin component (i.e., composed solely of organic resin components) may be located on the inner wall 2b of the first member 2. In this embodiment, the surface of this resin layer 2b1 may have a glossy finish.

[0034] This reduces the scattering of light incident on the semiconductor element 21 (see Figure 7) by the inner wall 2b, for example, when the semiconductor element 21 is an image sensor. Therefore, according to this embodiment, high-resolution images can be acquired.

[0035] Furthermore, the inorganic filler F may be exposed from the outer edge 2c of the first member 2 (see Figure 2). In other words, a resin layer with less inorganic filler F than the interior of the first member 2 does not need to be formed on the outer edge 2c of the first member 2.

[0036] Figure 5 is a perspective view showing an example of the configuration of the connecting substrate 10 according to the embodiment. As shown in Figure 5, the connecting substrate 10 according to the embodiment has multiple laminated substrates 1, as described above, arranged and connected along a plane perpendicular to the stacking direction D (see Figure 2). For example, multiple laminated substrates 1 are arranged in a matrix on the connecting substrate 10.

[0037] Furthermore, the connecting substrate 10 may have cutting lines (not shown) between adjacent second members 3. Such cutting lines may be located, for example, on the surface of a ceramic member formed by connecting multiple second members 3.

[0038] As a result, the connecting substrate 10 can be cut using the cutting line as the starting point, making it possible to easily manufacture multiple laminated substrates 1.

[0039] Furthermore, in this embodiment, the cutting line may or may not be located between adjacent first members 2. By having the cutting line located on the surface of the organic resin member formed by connecting multiple first members 2, multiple laminated substrates 1 can be manufactured even more easily.

[0040] If no cutting line is formed on the surface of the first member 2, it is preferable that the first member 2 has enough transparency (light transmission) to allow the cutting line provided on the second member 3 to be seen from the upper side of the first member 2. In other words, this connecting substrate 10 has a configuration in which the first member 2, which does not have a cutting line, is laminated on the second member 3, which has a cutting line.

[0041] If the cutting line is, for example, groove-shaped, the location of the groove-shaped cutting line may become a source of damage to the connecting substrate 10. However, since the first member 2 does not have a groove-shaped cutting line, the first member 2 is attached to the second member 3, which prevents the connecting substrate 10 from cracking or chipping.

[0042] Furthermore, if a groove-shaped cutting line is provided between the first member 2 and the second member 3, it is possible to prevent dust and other debris from adhering to the groove from the stage of manufacturing the connecting substrate to the stage of cutting it to obtain the laminated substrate 1.

[0043] Furthermore, if the first component 2 is transparent (light-transmitting), image recognition of the cutting line becomes possible, making it possible to automatically cut the connecting substrate 10 based on image recognition.

[0044] Furthermore, multiple first members 2 are connected. table Even if the cutting line is not located on the surface, the organic resin component is brittle, so multiple laminated substrates 1 can be manufactured without any particular problems.

[0045] Figure 6 is a perspective view showing another example of the configuration of the laminated substrate 1 according to the embodiment. In the example of Figure 6, the wiring layer 5 is located on the laminated substrate 1, which differs from the example of Figure 1. This wiring layer 5 is located, for example, on the surface 2e of the first member 2. Note that via wiring, internal wiring layers, etc. (not shown) may be electrically connected to the wiring layer 5.

[0046] In this way, the positioning of the wiring layer 5 on the laminated substrate 1 improves its function as a wiring substrate.

[0047] Figure 7 is a cross-sectional view showing an example of the configuration of the semiconductor device 20 according to the embodiment. As shown in Figure 7, the semiconductor device 20 according to the embodiment comprises a laminated substrate 1, a semiconductor element 21, a support plate 22, and bonding wires 23. The laminated substrate 1 shown in Figure 7 includes the wiring layer 5 described above.

[0048] The semiconductor element 21 is, for example, an LSI (Large Scale Integration), an image sensor, a light-emitting element, a quantum element, or an elastic wave element. The support plate 22 is, for example, a metal plate, and supports the semiconductor element 21. The support plate 22 is positioned, for example, to cover the bottom of the inner frame 1a, and the semiconductor element 21 is located at the bottom of the inner frame 1a.

[0049] The bonding wire 23 electrically connects the wiring layer 5 located on the laminated substrate 1 with the semiconductor element 21. Note that the component electrically connecting the wiring layer 5 and the semiconductor element 21 is not limited to the bonding wire 23; for example, a lead frame or the like may also be used.

[0050] Thus, by manufacturing the semiconductor device 20 using the laminated substrate 1 according to this embodiment, it becomes possible to realize a semiconductor device 20 with improved bending strength.

[0051] In the example shown in Figure 7, the semiconductor element 21 is supported by a support plate 22 located so as to cover the bottom of the inner frame portion 1a in the semiconductor device 20. However, this disclosure is not limited to such an example, and the semiconductor element 21 may be supported in any manner.

[0052] <Another embodiment> Next, various other embodiments will be described with reference to Figures 8 to 14. Figure 8 is a cross-sectional view showing an example of the configuration of the laminated substrate 1 according to another embodiment 1. As shown in Figure 8, the configuration of the inner wall 2b in the laminated substrate 1 according to another embodiment 1 differs from that of the above embodiment.

[0053] Specifically, in another embodiment 1, a portion of the inner wall 2b of the first member 2 may overlap the inner wall 3b of the second member 3. In other words, in another embodiment 1, a covering portion 2b2 is located on the second member 3 side of the inner wall 2b of the first member 2, and such covering portion 2b2 may cover a portion of the inner wall 3b of the second member 3 on the first member 2 side.

[0054] This improves the adhesion at the interface between the first member 2 and the second member 3. Furthermore, the restraining force between the first member 2 and the second member 3 increases when they undergo thermal expansion.

[0055] The configuration shown in Figure 8 can be formed, for example, by plastically deforming the uncured organic resin sheet, which will later become the first member 2, when it is laminated onto a second ceramic member 3 formed by sintering and then heated under pressure. In this case, the uncured organic resin sheet may be laminated in a state having an inner frame (a state having through holes).

[0056] Figure 9 is a cross-sectional view showing an example of the configuration of the laminated substrate 1 according to another embodiment 2. As shown in Figure 9, in the laminated substrate 1 according to another embodiment 2, the positions of the inner walls 2b and 3b are different from those of the above embodiment.

[0057] Specifically, in another embodiment 2, in a plan view, the area of ​​the inner frame portion 2a of the first member 2 may be larger than the area of ​​the inner frame portion 3a of the second member 3. For example, in another embodiment 2, the inner wall 2b of the first member 2 may be located outside the inner wall 3b of the second member 3.

[0058] As a result, the volume ratio of the first member 2 to the entire laminated substrate 1 becomes smaller, and the Young's modulus of the entire laminated substrate 1 becomes largely dependent on the ceramic second member 3. Therefore, according to another embodiment 2, the rigidity per unit volume can be improved.

[0059] Furthermore, in another embodiment 2, by increasing the area of ​​the inner frame portion 2a of the first member 2, for example, when the semiconductor element 21 (see Figure 7) is an image sensor, a wider range of light is captured by the semiconductor element 21. Therefore, according to another embodiment 2, it becomes possible to acquire images with higher resolution.

[0060] Figure 10 is a cross-sectional view showing an example of the configuration of the laminated substrate 1 according to another embodiment 3. As shown in Figure 10, in the laminated substrate 1 according to another embodiment 3, the configuration of the first member 2 differs from that of the other embodiment 2 described above.

[0061] Specifically, in another embodiment 3, a part of the first member 2 may flare outwards at the stepped portion 3b1 (the horizontal portion connected to the inner wall 3b) of the second member 3. In other words, in another embodiment 3, the covering portion 2b3 is located on the second member 3 side of the inner wall 2b of the first member 2, and such covering portion 2b3 may cover a part of the stepped portion 3b1 connected to the inner wall 3b of the second member 3.

[0062] This improves the adhesion at the interface between the first member 2 and the second member 3. Furthermore, as the bonding area of ​​the first member 2 to the second member 3 increases, the restraining force between the first member 2 and the second member 3 increases when they undergo thermal expansion.

[0063] The configuration shown in Figure 10 can be formed, for example, by plastically deforming the uncured organic resin sheet, which will later become the first member 2, when it is laminated onto a second ceramic member 3 formed by sintering and then heated under pressure. In this case, the uncured organic resin sheet may be laminated in a state having an inner frame (a state having through holes).

[0064] Figure 11 is a cross-sectional view showing an example of the configuration of the laminated substrate 1 according to another embodiment 4. As shown in Figure 11, in the laminated substrate 1 according to another embodiment 4, the positions of the outer edge portion 2c and the outer edge portion 3c are different from those of the above embodiment.

[0065] Specifically, in another embodiment 4, in a plan view, the outer edge 2c of the first member 2 may be located outside the outer edge 3c of the second member 3. By positioning the first member 2, made of organic resin, to protrude outward from the second member 3, made of ceramic, the laminated substrate 1 becomes less likely to crack even if the semiconductor device 20 (see Figure 7) is subjected to mechanical impact such as dropping.

[0066] Therefore, according to another embodiment 4, the reliability of the semiconductor device 20 can be improved.

[0067] Figure 12 is a cross-sectional view showing an example of the configuration of a laminated substrate 1 according to another embodiment 5. As shown in Figure 12, in the laminated substrate 1 according to another embodiment 5, the area of ​​the inner frame portion 2a of the first member 2 may be larger than the area of ​​the inner frame portion 3a of the second member 3 in a plan view.

[0068] As a result, for example, if the semiconductor element 21 (see Figure 7) is an image sensor, a wider range of light is captured by the semiconductor element 21. Therefore, according to another embodiment 5, it becomes possible to acquire images with higher resolution.

[0069] Furthermore, in another embodiment 5, in a plan view, the outer edge 2c of the first member 2 may be located further out than the outer edge 3c of the second member 3. This makes the laminated substrate 1 less likely to crack even if the semiconductor device 20 (see Figure 7) is subjected to mechanical impact such as dropping.

[0070] Therefore, according to another embodiment 5, the reliability of the semiconductor device 20 can be improved.

[0071] Figure 13 is a cross-sectional view showing an example of the configuration of the laminated substrate 1 according to another embodiment 6. As shown in Figure 13, in the laminated substrate 1 according to another embodiment 6, the orientation of the inner wall 2b is different from that of the above embodiment.

[0072] Specifically, in another embodiment 6, the inner frame portion 2a of the first member 2 may become smaller as it approaches the second member 3. That is, in another embodiment 6, the inner wall 2b of the first member 2 may be inclined inward as it approaches the second member 3.

[0073] This makes it easier to control the direction of reflection when light emitted from the semiconductor element 21 is reflected by the inner wall 2b, for example, when the semiconductor element 21 is a light-emitting element.

[0074] In the example shown in Figure 13, the inner wall 2b of the first member 2 is inclined inward as it approaches the second member 3, but this disclosure is not limited to such an example. For example, the inner wall 2b of the first member 2 may be inclined outward as it approaches the second member 3.

[0075] Furthermore, the central portion of the inner wall 2b of the first member 2 in the stacking direction D may be located further outward than both ends in the stacking direction D. In other words, the inner wall 2b of the first member 2 may be curved in a concave shape in cross-sectional view.

[0076] Furthermore, the central portion of the inner wall 2b of the first member 2 in the stacking direction D may be located inward from both ends in the stacking direction D. In other words, the inner wall 2b of the first member 2 may be curved in a convex shape in cross-sectional view.

[0077] Furthermore, as shown in Figure 14, the surface 2e of the first member 2 may be inclined such that the thickness of the first member 2 is smaller on the inner wall 2b side than on the outer edge 2c side. Figure 14 is a cross-sectional view showing an example of the configuration of a laminated substrate 1 according to another embodiment 7.

[0078] Furthermore, the surface 2e of the first member 2 may be inclined such that the thickness of the first member 2 is greater on the inner wall 2b side than on the outer edge 2c side.

[0079] Although embodiments of the present disclosure have been described above, the present disclosure is not limited to the embodiments described above, and various modifications are possible without departing from the spirit thereof.

[0080] Further effects and other embodiments can be readily derived by those skilled in the art. Therefore, broader embodiments of this disclosure are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents.

[0081] Furthermore, this technology can also be configured as follows. (1) Organic resins Contains A frame-shaped first member, A frame-like second member made of ceramic, Equipped with, The first member and the second member are stacked on top of each other, The inner frame portion of the first member and the inner frame portion of the second member are connected. Multilayer substrate. (2) In a plan view, the area of ​​the inner frame portion of the first member is larger than the area of ​​the inner frame portion of the second member. The laminated substrate described in (1) above. (3) In a plan view, the outer edge of the first member is located further out than the outer edge of the second member. The laminated substrate as described in (1) or (2) above. (4) The first member and the second member are joined together via a plurality of carbon particles. A laminated substrate as described in any one of (1) to (3) above. (5) The first member and the second member Adhesion It has a first joining surface and a first recess provided on the first joining surface, The second member has a second bonding surface that is bonded to the first bonding surface, and a second recess provided on the second bonding surface. The plurality of carbon particles include boundary-existing carbon particles that penetrate the first recess and the second recess. The laminated substrate described in (4) above. (6) The boundary-existing carbon particle has a first portion that fits into the first recess and a second portion that fits into the second recess. The first part is larger than the second part. The laminated substrate described in (5) above. (7) The first member has an inorganic filler, On the surface of the inner wall of the first member, there is a resin layer with less inorganic filler than the interior of the first member. A laminated substrate as described in any one of (1) to (6) above. (8) The inner frame portion of the first member becomes smaller as it approaches the second member. A laminated substrate as described in any one of (1) to (7) above. (9) Multiple laminated substrates described in any one of (1) to (8) above are arranged and connected along a plane perpendicular to the stacking direction, A cutting line is located between the two adjacent second members. Connecting substrate. (10) A laminated substrate as described in any one of (1) to (8) above, A wiring layer located on the aforementioned laminated substrate, A semiconductor element electrically connected to the aforementioned wiring layer, A semiconductor device equipped with a semiconductor device. [Explanation of symbols]

[0082] 1. Multilayer substrate 2. First Member 2a Inner frame 2b Inner wall 2b1 Resin layer 2c Outer edge 2d 1st joint surface 2d1 First recess 3. Second Member 3a Inner frame section 3b Inner wall 3c Outer edge 3d second joint surface 3d1 Second recess 4 carbon particles 4a Part 1 4b 2nd part 5 wiring layer 10 Linked substrates 20 Semiconductor equipment 21 Semiconductor devices D Stacking direction F Inorganic filler

Claims

1. A frame-shaped first member containing an organic resin, A frame-shaped second member made of ceramic, Equipped with, The first member and the second member are stacked on top of each other, An internal wiring layer is located inside the first member. The first space provided inside the first member and the second space provided inside the second member form a single continuous space. In a plan view, the area of ​​the first space is larger than the area of ​​the second space. Multilayer substrate.

2. The first covering portion is located on the side of the second member on the inner wall of the first member, The first covering portion covers a part of the horizontal portion connected to the inner wall of the second member. The laminated substrate according to claim 1.

3. In a plan view, the outer edge of the first member is located further out than the outer edge of the second member. The laminated substrate according to claim 1.

4. A frame-shaped first member containing an organic resin, A frame-shaped second member made of ceramic, Equipped with, The first member and the second member are stacked on top of each other, An internal wiring layer is located inside the first member. The first space provided inside the first member and the second space provided inside the second member form a single continuous space. A second covering portion is located on the inner wall of the first member on the side of the second member. The second covering portion covers a portion of the inner wall of the second member that is on the side of the first member. Multilayer substrate.

5. The first member has an inorganic filler, On the surface of the inner wall of the first member, there is a resin layer with less inorganic filler than the interior of the first member. The laminated substrate according to claim 1.

6. The first space narrows as it approaches the second member. The laminated substrate according to claim 1.

7. Multiple laminated substrates according to any one of claims 1 to 6 are arranged and connected along a plane perpendicular to the stacking direction, A cutting line is located between the two adjacent second members. Connecting substrate.

8. A laminated substrate according to any one of claims 1 to 6, A wiring layer located on the aforementioned laminated substrate, A semiconductor element electrically connected to the aforementioned wiring layer, A semiconductor device equipped with a semiconductor device.

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