Substrate processing equipment

Abstract

To easily remove a conductive film contained in a ruthenium adhered to an objective region.SOLUTION: A substrate processing apparatus includes: a substrate holding part that holds a substrate 9 to which a conductive film 93 containing a ruthenium is provided to at least a peripheral part; and a nobel metal part 51 that is formed by a nobel metal than the ruthenium, and comprises: a nobel metal part contact mechanism that makes an adjacent region where is adjacent to a predetermined objective region 911 in the conductive film 93 on the peripheral edge part contact the nobel metal part 51; and an electrolyte supply part that forms a state of contacting an electrolyte 71 to the objective region 911 and the noble metal part 51 by supplying the electrolyte 71 to the objective region 911 of the conductive film 93. Thus, the conductive film 93 containing the ruthenium adhered to the objective region 911 can be easily removed by using a galvanic corrosion.SELECTED DRAWING: Figure 7

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