Substrate processing equipment
The substrate processing apparatus addresses non-uniform processing by using a movable body to generate controlled flow patterns, achieving uniform and efficient substrate processing through consistent liquid flow and reaction product distribution.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- KIOXIA CORP
- Filing Date
- 2023-03-13
- Publication Date
- 2026-06-30
AI Technical Summary
Existing substrate processing apparatuses face challenges in achieving uniform and efficient processing of substrates due to variations in processing liquid flow velocity and concentration distribution, leading to non-uniform substrate processing.
A substrate processing apparatus with a movable body within the processing liquid that generates controlled flow patterns by moving in vertical or horizontal directions, creating uniform liquid flow across the substrate surface.
The apparatus ensures uniform and efficient processing by minimizing variations in processing liquid flow velocity and reaction product concentration, enhancing processing consistency across the entire substrate surface.
Smart Images
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Abstract
Description
Technical Field
[0004] , , , , , , , , , , ,<000001The substrate processing apparatus of the embodiment comprises a processing tank in which a plurality of substrates to be processed by a processing liquid are arranged in a first direction with their substrate surfaces facing substantially horizontally, a first region in which the plurality of substrates are processed by the processing liquid, a second region provided near the first region, and a third region provided between the first region and the second region so as to be movable for the processing liquid, a movable body positioned in the processing liquid within the second region of the processing tank and moving to create a flow in the processing liquid, and a moving mechanism for moving the movable body. [Brief explanation of the drawing]
[0006] [Figure 1] This is a front view showing a partial cross-section of the substrate processing apparatus according to the first embodiment. [Figure 2] This figure shows the flow of the first processing liquid in the substrate processing apparatus shown in Figure 1. [Figure 3] This figure shows the flow of the second processing liquid in the substrate processing apparatus shown in Figure 1. [Figure 4] This figure shows the numerical analysis results of the flow of the processing liquid in the substrate processing apparatus shown in Figure 1. [Figure 5] This figure shows the flow rate distribution of the processing liquid in the substrate processing apparatus shown in Figure 1. [Figure 6] This figure shows the concentration distribution of silica as a reaction product in the substrate processing apparatus shown in Figure 1. [Figure 7] This figure shows the numerical analysis results of the flow of the processing liquid in the comparative substrate processing apparatus. [Figure 8] This figure shows the flow rate distribution of the processing liquid in the substrate processing apparatus of the comparative example. [Figure 9] This figure shows the concentration distribution of silica as a reaction product in the substrate processing apparatus of the comparative example. [Figure 10] This figure shows the concentration distribution of silica as a reaction product when the substrate arrangement in the substrate processing apparatus shown in Figure 1 is rotated by 90 degrees. [Figure 11] This is a front view showing a partial cross-section of the substrate processing apparatus of the second embodiment. [Figure 12] This figure shows the numerical analysis results of the flow of the processing liquid in the substrate processing apparatus shown in Figure 11. [Figure 13] This figure shows the flow rate distribution of the processing liquid in the substrate processing apparatus shown in Figure 11. [Figure 14] This figure shows the concentration distribution of silica as a reaction product in the substrate processing apparatus shown in Figure 11. [Figure 15] This is a front view showing a partial cross-section of the substrate processing apparatus according to the third embodiment. [Figure 16] This figure shows the numerical analysis results of the flow of the processing liquid in the substrate processing apparatus shown in Figure 15. [Figure 17] This figure shows the flow rate distribution of the processing liquid in the substrate processing apparatus shown in Figure 15. [Figure 18] This figure shows the concentration distribution of silica as a reaction product in the substrate processing apparatus shown in Figure 15. [Modes for carrying out the invention]
[0007] The substrate processing apparatus of the embodiment will be described below with reference to the drawings. In each embodiment, substantially identical components are denoted by the same reference numerals, and their descriptions may be partially omitted. The drawings are schematic, and the relationship between thickness and planar dimensions, the ratio of thickness of each part, etc., may differ from those in reality.
[0008] (First embodiment) Figure 1 is a front view showing a partial cross-section of a substrate processing apparatus according to the first embodiment. The substrate processing apparatus 1 shown in Figure 1 is a batch-type processing apparatus that processes multiple substrates W at once with a processing liquid, and comprises a processing tank 10 for storing the processing liquid, a movable body 20 positioned within the processing liquid stored in the processing tank 10 and moving to create a flow in the processing liquid, and a moving mechanism 30 for moving the movable body 20. The specific configuration of each part will be described in detail below.
[0009] The processing tank 10 stores the processing liquid and accommodates a plurality of substrates W to be processed by the processing liquid in a state arranged in a predetermined direction. The processing tank 10 includes a first region A1 in which a plurality of substrates W are accommodated, a second region A2 provided in the vicinity of the first region A1, and a third region A3 provided between the first region A1 and the second region A2 so that the processing liquid can move. A partition plate 21 is provided between the first region A1 and the second region A2, and the partition plate 21 is provided so that the third region A3 exists between it and the bottom surface of the processing tank 10.
[0010] The plurality of substrates W are accommodated in a state where their substrate surfaces (the processing surface on which a device is formed on the substrate W or the back surface thereof) are oriented in a substantially horizontal direction, for example, in the first direction (indicated by the arrow D1 in the figure). The processing liquid is selected according to the processing of the substrate W. When performing an etching process on a semiconductor substrate applied as the substrate W, an etching liquid is used. As the etching liquid, various known etching liquids are stored in the processing tank 10. For example, when etching a silicon nitride film provided on a semiconductor substrate, an aqueous phosphoric acid solution heated to around 150 °C is used.
[0011] As the aqueous phosphoric acid solution as an etching liquid for the silicon nitride film, an aqueous solution of inorganic phosphoric acid (orthophosphoric acid) generally represented by H3PO4 is used. Instead of H3PO4 or in addition to H3PO4, H4P2O7 (pyrophosphoric acid), etc. may be used. The aqueous phosphoric acid solution may contain additives, etc. in order to increase the etching rate of silicon nitride. For example, phosphates such as alkali metal salts of phosphoric acid or organic phosphoric acids may be added. Here, the case where the substrate processing apparatus 1 is applied to a wet etching apparatus will be mainly described, but the substrate processing apparatus 1 is not limited to this and may be a substrate cleaning apparatus or the like.
[0012] A plurality of substrates W are supported in a state of being arranged in a predetermined direction (e.g., 1st direction D1) by a lifter 11 so as to be leaned in a substantially vertical direction, and are accommodated in a 1st region A1 of a processing tank 10, and a predetermined process such as an etching process is performed using a processing liquid stored in the processing tank 10. The lifter 11 can be lifted and lowered by a lifting unit (not shown) between a processing position (a processing region within the 1st region A1) where the substrate W is immersed in the processing liquid stored in the processing tank 10 and a standby position above the processing tank 10. The plurality of substrates W are supported by the lifter 11, and when the lifter 11 descends to the processing position, they are immersed in the processing liquid and a predetermined process such as an etching process is performed. The lifter 11 has a central support member 12 that supports the central portions of the lower edges of the plurality of substrates W and a pair of side support members 13A and 13B that support the sides of the plurality of substrates W, and is provided so as to be able to support the plurality of substrates W at a predetermined interval.
[0013] The processing tank 10 includes a circulation system having an overflow part 14 for circulating the processing liquid, a circulation pump 15, a processing liquid nozzle 16 for discharging the processing liquid, a 1st pipe 17 connecting the overflow part 14 and the circulation pump 15, and a 2nd pipe 18 connecting the circulation pump 15 and the processing liquid nozzle 16. Although not shown, the processing tank 10 may be provided with a processing liquid supply part for supplying the processing liquid, a processing liquid temperature adjustment part for adjusting the temperature of the processing liquid as necessary, etc. A filter for removing solid reaction products, etc. in the processing liquid may be provided in the circulation system. The overflow part 14 is provided at the upper edge part of the processing tank 10 and recovers the processing liquid that has overflowed from the upper edge of the processing tank 10 due to the circulation of the processing liquid. The processing liquid recovered by the overflow part 14 is sent to the circulation pump 15 via the 1st pipe 17. The processing liquid discharged from the circulation pump 15 is sent to the processing liquid nozzle 16 via the 2nd pipe 18. The processing liquid circulates by being discharged into the processing tank 10 from the processing liquid nozzle 16.
[0014] The processing tank 10 comprises a first region A1 having processing areas for multiple substrates W supported by a lifter 11, a second region A2 adjacent to the first region A1 along a second direction D2 that intersects the first direction D1 horizontally, and a third region A3 provided in the space between the first region A1 and the second region A2, and a partition plate 21 extending in a third direction D3 that intersects the first direction D1 perpendicularly, allowing the processing liquid to move between the first region A1 and the second region A2. Processing liquid is stored in both the first region A1 and the second region A2. Naturally, the third region A3 connecting the first region A1 and the second region A2 is also filled with processing liquid, and it is possible to circulate the processing liquid through it.
[0015] In the second region A2, plate-shaped movable bodies 20 are arranged along the first direction D1 and the second direction D2 so as to be located within the processing liquid. The movable bodies 20 are connected to a moving mechanism 30 via a drive shaft 22. The moving mechanism 30 moves the movable bodies 20, which are located within the processing liquid, in the vertical direction (third direction D3), and the movement of the movable bodies 20 generates a flow in the processing liquid. The movable bodies 20 are made of, for example, plate-shaped bodies and extend in the first direction D1 so as to correspond to the arrangement of multiple substrates W. By repeatedly moving such plate-shaped movable bodies 20 in the vertical direction (third direction D3) within the processing liquid, a flow is generated in the processing liquid in accordance with the movement of the movable bodies 20.
[0016] The flow of the processing liquid in the substrate processing apparatus 1 of the first embodiment will be described with reference to Figures 2 and 3. Figure 2 is a diagram showing the flow of the first processing liquid accompanying the downward movement of the movable body 20 in the substrate processing apparatus 1 shown in Figure 1, and Figure 3 is a diagram showing the flow of the second processing liquid accompanying the upward movement of the movable body 20 in the substrate processing apparatus 1 shown in Figure 1. As shown in Figure 2, when the movable body 20 is moved downward (descended), a downward flow F1 of the processing liquid is generated in the second region A2 as the movable body 20 moves. Following the flow F1 of the processing liquid, a flow F2 of the processing liquid is generated in the third region A3, and based on the flow F2, an upward flow F3 of the processing liquid is generated in the first region A1. Following the state shown in Figure 2, as shown in Figure 3, when the movable body 20 is moved upward (risen), an upward flow F4 of the processing liquid is generated in the second region A2 as the movable body 20 moves. Following the flow of processing liquid F4, a flow of processing liquid F5 is generated in the third region A3, and based on flow F5, a downward flow of processing liquid F6 is generated in the first region A1.
[0017] In this way, by moving the movable body 20 placed in the processing liquid of the second region A2 in the vertical direction, an upward flow F3 and a downward flow F6 of the processing liquid can be sequentially generated in the first region A1 where multiple substrates W are placed. Figure 4 shows the numerical analysis results of the processing liquid flow in the substrate processing apparatus 1 shown in Figure 1. As shown in Figure 4, it can be seen that the processing liquid flows in the same direction over a wide area of the substrate surface of the substrate W. By generating such a processing liquid flow over the substrate surface of the substrate W, it becomes possible to make the processing of the substrate W with the processing liquid uniform and efficient.
[0018] Figure 5 shows the flow velocity distribution of the processing liquid when using the substrate processing apparatus 1 shown in Figure 1. Figure 6 shows the concentration distribution of silica, a reaction product, when using the substrate processing apparatus 1 shown in Figure 1. Figures 5 and 6 show the flow velocity distribution of the processing liquid and the concentration distribution of silica, a reaction product, when phosphoric acid is used as the processing liquid. As shown in Figure 5, when using the substrate processing apparatus 1 of the embodiment, it can be seen that the variation in the flow velocity of the processing liquid is small, and the proportion of areas with fast or slow flow velocities is small. Furthermore, as shown in Figure 6, when using the substrate processing apparatus 1 of the embodiment, the variation in the concentration distribution of silica, a reaction product, is also small. These results show that, according to the substrate processing apparatus 1 of the embodiment, it is possible to make the processing of the entire substrate W with the processing liquid uniform and efficient.
[0019] In comparison with the substrate processing apparatus 1 of the above-described embodiment, we will examine the flow of the processing liquid in a conventional substrate processing apparatus in which a processing liquid injection nozzle is placed at the bottom of the processing tank and the processing liquid injected from the nozzle generates a flow of the processing liquid. Figure 7 shows the numerical analysis results of the processing liquid flow in a substrate processing apparatus as a comparative example. As shown in Figure 7, when a processing liquid is injected from an injection nozzle placed at the bottom of the processing tank and a flow of the processing liquid is generated by the injected processing liquid, in addition to the main upward flow of the processing liquid, a downward flow opposing the upward flow is generated. That is, a region of upward flow with a high flow velocity is created in the center, the flow velocity around it becomes slower, and a downward flow opposing the upward flow is generated. This is because the creation of a region of high flow velocity in the center makes it easier for a downward flow to form around it, so the surrounding region has an upward flow and a downward flow opposing each other. Therefore, the flow velocity in the surrounding region tends to be slower. As a result, in a conventional substrate processing apparatus, the flow velocity of the processing liquid across the entire surface of the substrate W tends to vary. This is a factor that reduces the uniformity of processing by the processing liquid across the entire surface of the substrate W.
[0020] Figure 8 shows the flow rate distribution of the processing solution when using the substrate processing apparatus shown in Figure 7. Figure 9 shows the concentration distribution of silica, the reaction product, when using the substrate processing apparatus shown in Figure 7. As shown in Figure 8, when using the comparative example substrate processing apparatus, there is a large variation in the flow rate of the processing solution, and areas with fast and slow flow rates tend to occur. Furthermore, as shown in Figure 9, when using the comparative example substrate processing apparatus, there is also a large variation in the concentration distribution of silica, the reaction product. As a result, with the comparative example substrate processing apparatus, there is a large variation in the flow rate of the processing solution across the entire substrate W, and the uniformity of the substrate processing by the processing solution is low.
[0021] In the substrate processing apparatus 1 shown in Figure 1, multiple substrates W are arranged in a first direction D1 and housed in a first region A1. However, the arrangement direction of the multiple substrates W may be a second direction D2. That is, in the substrate processing apparatus 1 shown in Figure 1, the multiple substrates W may be arranged rotated by 90 degrees. As shown in Figure 4, since the processing liquid flows from bottom to top, the variation in the flow velocity of the processing liquid and the variation in the concentration distribution of silica, which is the reaction product, can be reduced regardless of whether the arrangement direction of the multiple substrates W is the first direction D1 or the second direction D2. Figure 10 shows the concentration distribution of silica as a reaction product when the arrangement of the substrates W in the substrate processing apparatus 1 shown in Figure 1 is rotated by 90 degrees. As shown in Figure 10, even when the arrangement of the substrates W is rotated by 90 degrees, the variation in the concentration distribution of silica can be reduced. This is clear from the comparison with Figure 6.
[0022] (Second embodiment) Figure 11 is a front view showing a partial cross-section of the substrate processing apparatus of the second embodiment. The substrate processing apparatus 1 shown in Figure 11 is a batch-type processing apparatus that processes multiple substrates W at once with a processing liquid, similar to the substrate processing apparatus 1 of the first embodiment, and comprises a processing tank 10 for storing the processing liquid, a movable body 20 positioned within the processing liquid stored in the processing tank 10 and moving to create a flow in the processing liquid, and a moving mechanism 30 for moving the movable body 20. In the following, the differences between the substrate processing apparatus 1 of the second embodiment shown in Figure 11 and the substrate processing apparatus 1 of the first embodiment shown in Figure 1 will be mainly described.
[0023] In the processing tank 10 of the substrate processing apparatus 1 shown in Figure 11, the second region A2 is located near the first region A1, which houses multiple substrates W, and is arranged alongside the first region A1 along the second direction D2. This is the same as the substrate processing apparatus 1 shown in Figure 1. However, there is no partition plate 21 between the first region A1 and the second region A2, and the area between the first region A1 and the second region A2 is designated as the third region A3. The multiple substrates W are housed with their substrate surfaces facing approximately horizontally, arranged along the first direction D1.
[0024] In the second region A2, a plate-shaped movable body 20 is positioned along the first direction D1 and the third direction D3 so as to be located within the processing liquid. The plate-shaped movable body 20 extends in the first direction D1 so that its plate surface faces the arrangement of multiple substrates W. The movable body 20 is connected to a moving mechanism 30 via a drive shaft 22. The moving mechanism 30 repeatedly moves the movable body 20, which is positioned within the processing liquid, in the second direction D2 (left-right direction in the figure), thereby generating a flow in the processing liquid due to the movement of the movable body 20. By repeatedly moving such a plate-shaped movable body 20 in the left-right direction (second direction D2) within the processing liquid, a flow is generated in the processing liquid in accordance with the movement of the movable body 20.
[0025] In this way, by repeatedly moving the movable body 20 placed in the processing liquid of the second region A2 in the left-right direction, leftward and rightward flows of the processing liquid can be sequentially generated in the first region A1 where multiple substrates W are placed. Figure 12 shows the numerical analysis results of the processing liquid flow in the substrate processing apparatus 1 shown in Figure 11. As shown in Figure 12, it can be seen that the processing liquid flows in the same direction over a wide area of the substrate surface of the substrate W. By generating such a flow of processing liquid over the substrate surface of the substrate W, it becomes possible to make the processing of the entire substrate W with the processing liquid uniform and efficient.
[0026] Figure 13 shows the flow velocity distribution of the processing liquid when using the substrate processing apparatus 1 shown in Figure 11. Figure 14 shows the concentration distribution of silica, a reaction product, when using the substrate processing apparatus 1 shown in Figure 11. Figures 13 and 14 show the flow velocity distribution of the processing liquid and the concentration distribution of silica, a reaction product, when phosphoric acid is used as the processing liquid. As shown in Figure 13, when using the substrate processing apparatus 1 of the embodiment, it can be seen that the variation in the flow velocity of the processing liquid is small, and the proportion of areas with fast or slow flow velocities is small. Furthermore, as shown in Figure 14, when using the substrate processing apparatus 1 of the embodiment, the variation in the concentration distribution of silica, a reaction product, is also small. These results show that, according to the substrate processing apparatus 1 of the embodiment, it is possible to make the processing of the entire substrate W with the processing liquid uniform and efficient.
[0027] (Third embodiment) Figure 15 is a front view showing a partial cross-section of the substrate processing apparatus of the third embodiment. The substrate processing apparatus 1 shown in Figure 15 is a batch-type processing apparatus that processes multiple substrates W at once with a processing liquid, similar to the substrate processing apparatus 1 of the first embodiment, and comprises a processing tank 10 for storing the processing liquid, a movable body 20 positioned within the processing liquid stored in the processing tank 10 and moving to create a flow in the processing liquid, and a moving mechanism 30 for moving the movable body 20. In the following, the differences between the substrate processing apparatus 1 of the third embodiment shown in Figure 15 and the substrate processing apparatus 1 of the first embodiment shown in Figure 1 will be mainly described. Note that some parts of the substrate processing apparatus 1 shown in Figure 15 that are the same as those shown in Figure 1 will be omitted from the description.
[0028] The processing tank 10 of the substrate processing apparatus 1 shown in Figure 15 comprises a first region A1 that stores processing liquid and accommodates a plurality of substrates W to be processed by the processing liquid arranged along a first direction D1, a second region A2 provided alongside the first region A1 along a third direction D3 (vertical direction), and a third region A3 provided between the first region A1 and the second region A2 so that the processing liquid can move. The second region A2 is located near the lower side of the first region A1. No partition plates or the like are provided between the first region A1 and the second region A2, and the space between the first region A1 and the second region A2 is designated as the third region A3.
[0029] In the second region A2, a plate-shaped movable body 20 is positioned below the first region A1 along the first direction D1 and the second direction D2 so as to be located within the processing liquid. The movable body 20 is connected to the moving mechanism 30 via drive shafts 22 provided at the four corners of the plate-shaped body. Instead of the drive shafts 22 provided at the four corners of the plate-shaped body, the movable body 20 may have a plate-shaped drive body provided on one side of the plate-shaped body. The moving mechanism 30 moves the movable body 20, which is positioned in the processing liquid, in the vertical direction (third direction D3), and generates a flow in the processing liquid due to the movement of the movable body 20. The movable body 20 is made up of, for example, a plate-shaped body, and its plate surface extends in the first direction D1 so as to face the arrangement of multiple substrates W. By repeatedly moving such a plate-shaped movable body 20 in the vertical direction (third direction D3) within the processing liquid, a flow is generated in the processing liquid in accordance with the movement of the movable body 20.
[0030] In this way, by repeatedly moving the movable body 20 placed in the processing liquid of the second region A2 in the vertical direction, upward and downward flows of the processing liquid can be sequentially generated in the first region A1 where multiple substrates W are placed. Figure 16 shows the numerical analysis results of the processing liquid flow in the substrate processing apparatus 1 shown in Figure 15. As shown in Figure 16, it can be seen that the processing liquid flows in the same direction over a wide area of the substrate surface of the substrate W. By generating such a flow of processing liquid over the substrate surface of the substrate W, it becomes possible to make the processing of the entire substrate W with the processing liquid uniform and efficient.
[0031] Figure 17 shows the flow velocity distribution of the processing liquid when using the substrate processing apparatus 1 shown in Figure 15. Figure 18 shows the concentration distribution of silica, the reaction product, when using the substrate processing apparatus 1 shown in Figure 15. Figures 17 and 18 show the flow velocity distribution of the processing liquid and the concentration distribution of silica, the reaction product, when phosphoric acid is used as the processing liquid. As shown in Figure 17, when using the substrate processing apparatus 1 of the embodiment, it can be seen that the variation in the flow velocity of the processing liquid is small, and the proportion of areas with fast or slow flow velocities is small. Furthermore, as shown in Figure 18, when using the substrate processing apparatus 1 of the embodiment, the variation in the concentration distribution of silica, the reaction product, is also small. These results show that, according to the substrate processing apparatus 1 of the embodiment, it is possible to make the processing of the entire substrate W with the processing liquid uniform and efficient.
[0032] In the substrate processing apparatus 1 shown in Figure 15, multiple substrates W are arranged in a first direction D1 and housed in a first region A1. However, the arrangement direction of the multiple substrates W may be a second direction D2. That is, in the substrate processing apparatus 1 shown in Figure 15, the multiple substrates W may be arranged rotated by 90 degrees. In this way, in the substrate processing apparatus 1 shown in Figure 15, the processing liquid flows from bottom to top and from top to bottom. Therefore, regardless of whether the arrangement direction of the multiple substrates W is the first direction D1 or the second direction D2, variations in the flow velocity of the processing liquid and variations in the concentration distribution of silica, which is a reaction product, can be reduced.
[0033] The configurations of each embodiment described above can be applied in combination, and some can also be replaced. Although several embodiments of the present invention have been described here, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as described in the claims. [Explanation of Symbols]
[0034] 1...Substrate processing device, 10...Processing tank, 11...Lifter, 14...Overflow section, 15...Circulation pump, 20...Moving body, 21...Partition plate, 22...Drive shaft, 30...Moving mechanism.
Claims
1. A processing tank comprising: a first region in which the processing of the multiple substrates by the processing liquid is carried out, a second region provided near the first region, and a third region provided between the first and second regions so as to allow the processing liquid to move; and a processing tank in which multiple substrates to be processed by the processing liquid are arranged in a first direction with their substrate surfaces facing substantially horizontally. A movable body is positioned within the processing liquid in the second region of the processing tank and moves to create a flow in the processing liquid, The system comprises a moving mechanism for moving the aforementioned moving body, The second region is provided adjacent to the first region along the first direction, or along a second direction that intersects the first direction horizontally. A partition plate is provided between the first region and the second region such that the third region is located between it and the bottom surface of the processing tank. The moving body is arranged along the first direction, The aforementioned moving mechanism is a substrate processing apparatus that moves the moving body along a third direction that intersects the first direction perpendicularly.
2. A processing tank comprising: a first region in which a plurality of substrates to be processed with a processing liquid are arranged in a first direction with their substrate surfaces facing substantially horizontally, and the processing of the plurality of substrates by the processing liquid is carried out; a second region provided near the first region; and a third region provided between the first region and the second region so as to be movable for the processing liquid, A movable body is positioned within the processing liquid in the second region of the processing tank and moves to create a flow in the processing liquid, The system comprises a moving mechanism for moving the aforementioned moving body, The second region is provided alongside the first region, with the third region in between, along a second direction that intersects the first direction horizontally. The moving body is arranged along the first direction, The aforementioned moving mechanism is a substrate processing apparatus that moves the moving body along the second direction.
3. A processing tank comprising: a first region in which a plurality of substrates to be processed with a processing liquid are arranged in a first direction with their substrate surfaces facing substantially horizontally, and the processing of the plurality of substrates by the processing liquid is carried out; a second region provided near the first region; and a third region provided between the first region and the second region so as to allow the processing liquid to move, A movable body is positioned within the processing liquid in the second region of the processing tank and moves to create a flow in the processing liquid, The system comprises a moving mechanism for moving the aforementioned moving body, The second region is provided alongside the first region, with the third region in between, along a third direction that intersects the first direction perpendicularly. The moving body is arranged along the first direction, The aforementioned moving mechanism is a substrate processing apparatus that moves the moving body along the third direction.
4. The substrate processing apparatus according to any one of claims 1 to 3, wherein the moving body comprises a plate-shaped body disposed in the processing liquid.