Vacuum processing apparatus and vacuum processing method

Abstract

To provide a vacuum treatment apparatus and a vacuum treatment method capable of obtaining a desired film thickness distribution within a substrate surface in a technology of arranging a film deposition area and a non-film deposition area.SOLUTION: In order to attain the objective above, a vacuum treatment apparatus according to an aspect of the invention includes a slit part for cutting a coating film that is formed on a surface to be deposited and a substrate that is a ground part of the coating film formed on the surface to be deposited in a reduced-pressure atmosphere, the substrate having the coating film including an alkaline metal or an alkaline earth metal formed on a sheet shaped surface to be deposited of the substrate exposed from a mask member.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a vacuum processing apparatus and a vacuum processing method.

Background Art

[0002] With the development of mobile devices such as mobile phones and smartphones, lithium batteries installed in these devices have attracted attention. In the manufacturing process of lithium batteries, the process of forming lithium metal on a substrate is particularly important. For example, as a film forming apparatus for forming lithium metal on a substrate, there is a film forming apparatus that forms a thin film of an evaporation material on the substrate while winding the substrate unwound from a pay-out roller around a main roll, and winds up the substrate by a take-up roller.

[0003] In the industry dealing with such film forming apparatuses, depending on the intended use of the substrate on which the thin film is formed, etc., there is a need to provide a film forming region where the thin film is formed and a non-film forming region where the thin film is not formed in the film forming process. In the technique of providing a film forming region and a non-film forming region, a shielding plate (mask plate) that shields the evaporation material in front of the substrate so that no thin film is formed in the non-film forming region is used (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, even when the evaporation material is shielded using the shielding plate, the evaporation material may leak around between the shielding plate and the substrate, and the evaporation material may adhere to the non-film forming region. In this case, a desired film thickness distribution cannot be obtained within the substrate surface.

[0006] In view of the above circumstances, the object of the present invention is to provide a vacuum processing apparatus and a vacuum processing method that can obtain a desired film thickness distribution in the plane of a substrate in a film deposition technology that provides a film deposition region and a non-film deposition region. [Means for solving the problem]

[0007] To achieve the above objective, a vacuum processing apparatus according to one embodiment of the present invention is provided with a slit portion for cutting, in a reduced-pressure atmosphere, the coating formed on the film-forming surface of a sheet-like substrate exposed from a mask member and the substrate that forms the base portion of the coating formed on the film-forming surface.

[0008] Such a vacuum processing device allows for the acquisition of a desired film thickness distribution within the plane of the substrate.

[0009] The vacuum apparatus described above may further include a film-forming unit for forming the above-mentioned film on the substrate in a reduced-pressure atmosphere.

[0010] Such a vacuum processing device allows for the acquisition of a desired film thickness distribution within the plane of the substrate.

[0011] The vacuum apparatus described above may further include a surface treatment unit for modifying the surface of the coating formed on the substrate or the cut surface of the coating cut by the slit.

[0012] Such a vacuum processing apparatus allows for the acquisition of a desired film thickness distribution within the surface of the substrate, and furthermore, surface oxidation of the coating is suppressed.

[0013] The vacuum apparatus described above may include a first processing chamber for housing the deposition source included in the film-forming section, a second processing chamber for housing the slit section, and a third processing chamber for forming a gas atmosphere for the processing gas applied to the surface treatment section.

[0014] Such a vacuum processing apparatus allows for the acquisition of a desired film thickness distribution within the surface of the substrate, and furthermore, surface oxidation of the coating is suppressed.

[0015] To achieve the above objective, in a vacuum processing method according to one embodiment of the present invention, A sheet-like substrate is exposed from a mask member in a reduced-pressure atmosphere, and a coating containing an alkali metal or alkaline earth metal is formed on the film-forming surface of the substrate exposed from the mask member. The film formed on the film-forming surface and the substrate that forms the base of the film formed on the film-forming surface are cut in a reduced-pressure atmosphere.

[0016] This vacuum processing method allows for the acquisition of a desired film thickness distribution within the plane of the substrate.

[0017] In the vacuum treatment method described above, the surface of the coating formed on the substrate or the cut surface of the cut coating may be modified.

[0018] This vacuum processing method allows for the acquisition of a desired film thickness distribution within the surface of the substrate, and furthermore, suppresses surface oxidation of the coating. [Effects of the Invention]

[0019] As described above, the present invention provides a vacuum processing apparatus and a vacuum processing method that can obtain a desired film thickness distribution within the plane of a substrate in a film deposition technology that provides a film deposition region and a non-film deposition region. [Brief explanation of the drawing]

[0020] [Figure 1] Figures 1(a) and 1(b) are schematic diagrams showing an example of a vacuum processing apparatus according to this embodiment. Figure 1(c) is a schematic cross-section of the substrate and the coating formed on the substrate, indicated by the dashed area P in Figure 1(a). [Figure 2] Figures 2(a) and 2(b) are schematic diagrams showing another example of the vacuum processing apparatus according to this embodiment. [Figure 3]FIG. 3 is a schematic diagram showing yet another example of the vacuum processing apparatus of the present embodiment. [Figure 4] FIG. 4(a) is a schematic plan view when viewing the mask member, the substrate, and the main roller from the direction of the main roller from the film forming section. FIG. 4(b) is a graph schematically showing the film thickness distribution formed on the substrate in the central axis direction of the main roller.

Embodiments for Carrying Out the Invention

[0021] Hereinafter, embodiments of the present invention will be described with reference to the drawings. XYZ axis coordinates may be introduced in each drawing. Also, the same members or members having the same function may be given the same reference numerals, and the description may be omitted as appropriate after the description of such members. Further, the numerical values shown below are examples and are not limited to this example.

[0022] FIGS. 1(a) and (b) are schematic diagrams showing an example of the vacuum processing apparatus according to the present embodiment. In FIG. 1(a), the direction from roller 41 to roller 43 is taken as the X-axis direction, the direction of the central axis of each of rollers 41 to 43 and 45 is taken as the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction is taken as the Z-axis direction. For example, FIG. 1(a) shows an outline of the vacuum processing apparatus as viewed from the Y-axis direction. FIG. 1(b) shows an outline of the vacuum processing apparatus as viewed from the Z-axis direction. Further, FIG. 1(c) shows a schematic cross-section of the substrate and the film formed on the substrate indicated by the broken line area P in FIG. 1(a).

[0023] The vacuum processing apparatus 1A illustrated in FIGS. 1(a) and (b) performs processing of the substrate and the film under conditions of a reduced-pressure atmosphere of less than atmospheric pressure. The vacuum processing apparatus 1A includes a roller 41, a roller 42, a roller 43, a guide roller 45, and a slit section (slitter) 50. The roller 41, the roller 42, the roller 43, the guide roller 45, and the slit section 50 are housed in a vacuum container not shown. The reduced-pressure atmosphere is formed by an exhaust mechanism (not shown) such as a vacuum pump, vacuum piping, and joints. Each of the rollers 41, 42, and 43 includes a rotational drive mechanism (not shown) such as a motor.

[0024] In the examples shown in Figures 1(a) and 1(b), roller 41 functions as an unwinding roller, and rollers 42 and 43 function as winding rollers. For example, each of rollers 41, 42, and 43 is configured to rotate in the direction of the arrow at a predetermined rotational speed around its respective central axis. This allows the material to be processed 90, which is a coated substrate, to be transported from roller 41 toward roller 42 or roller 43 at a predetermined transport speed.

[0025] The object to be processed 90 is pre-wound onto the roller 41. When the object to be processed 90 is unwound from the roller 41 and passes through the slit portion 50, the slit portion 50 separates it into a main body portion 901 and an excess portion 902, with the cutting line 90L as the boundary. In the examples of Figures 1(a) and (b), the main body portion 901 corresponds to the central part of the object to be processed 90 in the width direction, and the excess portion 902 corresponds to both ends of the object to be processed 90 in the width direction. A coating 92 is formed on the main body portion 901 with a good thickness distribution in the Y-axis direction. The excess portion 902 includes a shielding portion in which the formation of the coating 92 is suppressed by a mask member, which will be described later.

[0026] The main body portion 901 that has passed through the slit portion 50 is stretched over the circumferential surface of the roller 43 via the guide roller 45 and is wound up by the roller 43. On the other hand, the excess portion 902 that has passed through the slit portion 50 is stretched over the circumferential surface of the roller 42 via the guide roller 45 and is wound up by the roller 42.

[0027] The slit section 50 cuts the material to be processed 90 unwound from the roller 41 in a reduced-pressure atmosphere. The slit section 50 cuts the base material 91 and the coating 92 deposited on the base material 91. The slit section 50 is equipped with mechanical cutting means such as shear blades and laser blades, and optical cutting means such as laser processing. For example, the slit section 50 cuts the material to be processed 90 at the position of the cutting line 90L. As a result, the material to be processed 90 is separated into a main body 901 and a pair of excess parts 902.

[0028] As shown in Figure 1(c), the object to be processed 90 includes a base material 91 and a coating 92. The base material 91 is a sheet-like and elongated base material (thickness: 50 μm or less). The base material 91 is also flexible. For example, the base material 91 is a strip-shaped metal foil such as Cu, Al, Ni, or SUS steel, or a strip-shaped film such as OPP (stretched polypropylene) resin, PET (polyethylene terephthalate) resin, PPS (polyphenylene sulfite) resin, or PI (polyimide) resin. The coating 92 contains alkali metals such as Li and Na, or alkaline earth metals such as Mg and Ca. The coating 92 is formed on the film-forming surface of the base material 91 that is exposed from the mask member described later. The thickness of the coating 92 is 20 μm or less. The object to be processed 90 is applied, for example, to the negative electrode of a lithium battery.

[0029] Furthermore, the blades included in the slit portion 50, such as shear blades and razor blades, are made of materials that do not react easily with alkali metals or alkaline earth metals when the coating 92 is composed of alkali metals or alkaline earth metals. Examples of such materials include SUS steel, Fe, Ti, Si oxide, Al oxide, and Zr oxide.

[0030] Furthermore, the vacuum processing apparatus 1A may further include a surface treatment (surface inert treatment) for modifying the surface of the coating 92 formed on the substrate 91 or the cut surface of the coating 92 cut by the slit portion 50. For example, Figures 2(a) and 2(b) are schematic diagrams showing another example of the vacuum processing apparatus according to this embodiment.

[0031] For example, as shown in Figure 2(a), the vacuum processing apparatus 1A is divided by a partition wall 80 into a roller 41 and slit section 50 from which the object to be processed 90 is unwound, and rollers 42, 43 and guide roller 45. Rollers 41 and slit section 50 are housed in processing chamber 101. Rollers 42, 43 and guide roller 45 are housed in processing chamber 102. Processing chamber 101 and processing chamber 102 are separated by a partition wall 80.

[0032] The partition wall 80 is provided with gaps (slit holes) 80s through which the object to be processed 90, unwound from the roller 41, passes. The object to be processed 90, unwound from the roller 41, passes through the gaps 80s without contacting the partition wall 80 and is wound onto the rollers 42 and 43, respectively.

[0033] Furthermore, a processing gas is supplied to the processing chamber 102 by a gas introduction mechanism (not shown). The processing gas introduced into the processing chamber 102 is exhausted by another exhaust mechanism (not shown). In the vacuum processing apparatus 1A shown in Figure 2(a), the processing chamber 102, the gas introduction mechanism, and the other exhaust mechanism constitute a surface processing unit for modifying the surface of the coating 92 or the cross-section of the coating 92. The processing gas introduced into the processing chamber 102 creates a gas atmosphere of a predetermined pressure within the processing chamber 102.

[0034] Examples of the first gas introduced into the processing chamber 102 include CO, CO2, CO / Ar mixed gas, and CO2 / Ar mixed gas. By exposing the surface of the coating 92 or the cut surface of the coating 92 to these gases, a portion of each surface is modified. For example, a protective layer such as a carbonated layer is formed on the surface of the coating 92 or the cut surface of the coating 92. Here, the thickness of the protective layer is thinner than the thickness of the coating 92. By performing such surface modification, even if the object to be processed 90 is exposed to the atmosphere and comes into contact with dry air, the formation of a hydroxide layer or nitride layer is suppressed on the surface of the coating 92 or the cut surface of the coating 92.

[0035] Furthermore, before surface modification of the surface of the coating 92 or the cut surface of the coating 92 using the first gas, the surface of the coating 92 or the cut surface of the coating 92 may be exposed to O2 or an O2 / Ar mixed gas as a second gas. By using the second gas, an extremely thin oxide layer, thinner than the protective layer, is formed in advance as a base layer for the carbonated layer. This promotes the carbonation of the surface of the coating 92 or the cut surface of the coating 92, and a carbonated layer is stably formed on the surface of the coating 92 or the cut surface of the coating 92. Also, surface modification with the first gas may be performed in the treatment chamber 102, or a separate treatment chamber may be provided for surface modification with the second gas.

[0036] Furthermore, in this embodiment, as shown in Figure 2(b), the slit portion 50 is not limited to the processing chamber 101, but may also be provided in the processing chamber 102.

[0037] Furthermore, in this embodiment, as shown in Figure 2(c), in the surface modification treatment, the object to be treated 90 may be separated into the main body portion 901 and the excess portion 902 by a dicing blade, laser light, etc., while still wound on the roller 41 in the treatment chamber 101, without being unwound from the roller 41, and the surface modification treatment may be performed on the exposed side surface 90w of the main body portion 901.

[0038] This process also forms a protective film, such as a carbonated layer, on the cut surface of the coating 92. Furthermore, since the surface of the coating 92 is in a wound state, it is covered by the substrate 91, which suppresses hydroxylation or nitridation of the surface of the coating 92.

[0039] Furthermore, the vacuum apparatus may include a film-forming section for forming a coating 92 on the substrate 91 in a reduced-pressure atmosphere. For example, Figure 3 is a schematic diagram showing yet another example of the vacuum apparatus of this embodiment.

[0040] As an example of the vacuum processing apparatus 1B shown in Figure 3, a roll-to-roll type vacuum processing apparatus is provided. Vacuum processing apparatus 1B is just one example and is not limited to this example.

[0041] The vacuum processing apparatus 1B comprises a vacuum chamber 10, a film deposition section 20, a mask member 30, rollers 42, 43, guide rollers 45, 46, a main roller 47, and a slit section 50. The vacuum processing apparatus 1B also includes a rotational drive mechanism (motor) that rotates each of the rollers 42, 43, guide rollers 45, 46, and main roller 47 around their respective central axes. Furthermore, the vacuum processing apparatus 1B includes an exhaust mechanism and a gas supply mechanism. The substrate 91 is unwound from roller 46, wound and conveyed by the main roller 47, and then wound up by rollers 42 and 43, thereby being conveyed within the vacuum chamber 10 at a predetermined conveying speed. The vacuum processing apparatus 1B enables both vacuum film deposition and slit cutting in a reduced-pressure atmosphere, allowing for the safe and secure formation of lithium films with excellent film thickness uniformity without ignition.

[0042] The vacuum chamber 10 has a sealed structure. The vacuum chamber 10 is connected to an exhaust line L4 having a vacuum pump P4, thereby enabling the interior to be maintained in a predetermined reduced-pressure atmosphere. The vacuum processing apparatus 1B has a film deposition chamber 120, processing chambers 101, 1021, 1022, and a recovery chamber 140. The film deposition chamber 120 and processing chamber 101 are separated by a partition wall 801. Processing chamber 101, processing chambers 1021, 1022, and recovery chamber 140 are separated by a partition wall 802. Processing chambers 1022 and 1021 are separated by a partition wall 803. Processing chamber 1021 and recovery chamber 140 are separated by a partition wall 804.

[0043] The partition wall 801 is provided with an opening 801h so that a portion of the main roller 47 can enter the film deposition chamber 120 from the processing chamber 101 without contacting the partition wall 801. The opening 801h in the partition wall 801 also creates a gap between the main roller 47 and the partition wall 801. This gap becomes the space through which the substrate 91, wound and conveyed by the main roller 47, passes between the processing chamber 101 and the film deposition chamber 120.

[0044] Furthermore, the partition wall 802 is provided with a gap 802s through which the material to be processed 90 can pass. The partition wall 803 is provided with a gap 803s through which the material to be processed 90 can pass. The partition wall 804 is provided with a gap 804s through which the material to be processed 90 can pass.

[0045] The film deposition unit 20 is housed in the film deposition chamber 120 (first processing chamber). The film deposition unit 20 includes, for example, the evaporation source of the vacuum processing apparatus 1B. The film deposition unit 20 is composed of a resistance heating evaporation source, an induction heating evaporation source, or an electron beam heating evaporation source, etc. The film deposition unit 20 evaporates, for example, alkali metals or alkaline earth metals.

[0046] The deposition chamber 120 is connected to the exhaust line L4 and maintains a reduced pressure state. The processing chamber 101 is in communication with the deposition chamber 120 via an opening 801h. When the deposition chamber 120 is exhausted, the processing chamber 101 is also exhausted. The processing chamber 101 is not connected to the exhaust line L. Therefore, when the deposition chamber 120 is exhausted, a pressure difference is created in which the processing chamber 101 has a higher pressure than the deposition chamber 120. This pressure difference prevents the vapor flow 21 from entering the processing chamber 101 through the gap. If necessary, the processing chamber 101 may also be exhausted using the exhaust line.

[0047] A mask member 30 is installed between the film-forming section 20 and the main roller 47. The mask member 30 is positioned along the circumferential surface of the main roller 47 that protrudes from the processing chamber 101 into the film-forming chamber 120. The substrate 91, which is wound and conveyed on the main roller 47, passes between the main roller 47 and the mask member 30. The distance between the substrate 91 and the mask member 30 is set to, for example, 1 mm to 10 mm. When the substrate 91 is viewed from the film-forming section 20 in the direction of the main roller 47, the mask member 30 shields a portion of the substrate 91 (for example, both ends) and exposes the remaining portion (for example, the central portion) toward the film-forming section 20. As a result, the vapor flow 21 accumulates on the portion of the substrate 91 that is exposed toward the film-forming section 20, forming a processed object 90 on which a coating 92 is formed. The configuration of the mask member 30 as seen from the film-forming section 20 side will be described later.

[0048] The main roller 47 is positioned with a portion located in the film deposition chamber 120 and the remaining portion in the processing chamber 101. The main roller 47 faces the film deposition section 20. The main roller 47 winds and conveys the substrate 91 unwound by the roller 46, and feeds out the substrate 91 with the coating 92 formed on it, i.e., the object to be processed 90, toward the roller 42 or roller 43.

[0049] The main roller 47 is constructed in a cylindrical shape from a metal material such as stainless steel, iron, or aluminum. A temperature control mechanism (not shown) may be provided inside the main roller 47. The size of the main roller 47 is not particularly limited, but its width in the direction of the central axis 47c is set to be greater than the width of the base material 91.

[0050] The slit section 50 is housed in the processing chamber 101 (second processing chamber). The slit section 50 cuts the material to be processed 90 fed out from the main roller 47 in a reduced-pressure atmosphere. As described above, the slit section 50 cuts the material to be processed 90 at the position of the cutting line 90L (Figure 1(b)). As a result, the material to be processed 90 is separated into the main body 901 and a pair of excess parts 902 on both sides of the main body 901.

[0051] Roller 46 is located in the processing chamber 101. In the example shown in Figure 3, Roller 46 functions as an unwinding roller. The base material 91 is pre-wound onto Roller 46. The base material 91 is unwound from Roller 46 toward the main roller 47. Rollers 42 and 43 are located in the recovery chamber 140. The excess portion 902 of the material to be processed 90 that has passed through the slit portion 50 is stretched across the circumferential surface of Roller 42 via Guide Roller 45. The excess portion 902 is wound up by Roller 42. The main body portion 901 of the material to be processed 90 that has passed through the slit portion 50 is stretched across the circumferential surface of Roller 43 via Guide Roller 45. The main body portion 901 is wound up by Roller 43.

[0052] Furthermore, in the vacuum processing apparatus 1B, the object to be processed 90 (for example, the main body 901) that has passed through the slit portion 50 can be subjected to surface modification treatment before being wound onto the roller 42 or roller 43.

[0053] For example, the processing chamber 1022 is connected to a gas supply line L21 having a second gas supply source S2. The processing chamber 1022 is also connected to an exhaust line L22 having a vacuum pump P2. The processing chamber 1022 is supplied with a second gas from the gas supply line L21, and the processing chamber 1022 is maintained in a second gas atmosphere at a predetermined pressure by the exhaust line L22.

[0054] As a result, the surface or cut surface of the coating 92 is oxidized before the object to be processed 90 is wound onto the roller 42 or roller 43, and before the surface or cut surface of the coating 92 is carbonized. This forms an extremely thin oxide layer on the surface or cut surface of the coating 92.

[0055] Here, since processing chamber 1022 is in communication with processing chamber 101, when processing chamber 1022 is evacuated, processing chamber 101, which is not connected to the exhaust pump, is also evacuated. When the second gas introduced into processing chamber 1022 is evacuated by the vacuum pump P2, a pressure difference is created in which the pressure in processing chamber 101 becomes higher than the pressure in processing chamber 1022. This pressure difference prevents the second gas from entering processing chamber 101.

[0056] Processing chamber 1021 is connected to a gas supply line L11 having a first gas supply source S1. Processing chamber 1021 is also connected to an exhaust line L12 having a vacuum pump P1. A first gas is supplied to processing chamber 1021 from the gas supply line L11, and processing chamber 1021 is maintained in a first gas atmosphere at a predetermined pressure by the exhaust line L12. The pressure in processing chamber 1021 may be set to be higher than or equal to the pressure in processing chamber 1022.

[0057] As a result, before the object to be processed 90 is wound onto the roller 42 or roller 43, and after the surface or cut surface of the coating 92 is oxidized, the surface or cut surface of the coating 92 is carbonated. This forms a carbonated layer on the surface or cut surface of the coating 92.

[0058] When surface modification is performed using the first or second gas, multiple guide rollers may be placed in either the treatment chamber 1022 or 1021 to adjust the path of the object to be treated 90 as it passes through either the treatment chamber 1022 or 1021 to any desired length. This allows the exposure time of the object to be treated 90 to the treatment gas as it passes through either the treatment chamber 1022 or 1021 to be set to any desired time.

[0059] With such a vacuum apparatus 1B, the formation of a film 92 on the substrate 91 in the film formation section 20, surface modification of the surface of the film 92 or the cut surface of the film 92 using a second gas, and surface modification of the surface of the film 92 or the cut surface of the film 92 using a first gas can be performed continuously. Alternatively, the formation of a film 92 on the substrate 91 in the film formation section 20 and surface modification of the surface of the film 92 or the cut surface of the film 92 using a second gas can be performed continuously.

[0060] The substrate 91 has a contact surface (back surface) 91r that contacts the main roller 47 and a film-forming surface 91d opposite to the contact surface 91r. The film-forming surface 91d of the substrate 91 that is wound and conveyed on the main roller 47 faces the film-forming section 20. The vapor flow 21 released from the film-forming section 20 accumulates on the film-forming surface 91d, and a coating 92 is formed on the substrate 91 on the main roller 47. In this embodiment, the processing chambers 1021 and 1022 that form the gas atmosphere of the processing gas applied to the surface processing section are collectively referred to as the third processing chamber.

[0061] Figure 4(a) is a schematic plan view of the mask member, substrate, and main roller as seen from the direction of the main roller from the film deposition section. Figure 4(b) is a schematic graph showing the film thickness distribution formed on the substrate in the direction of the central axis of the main roller. In Figure 4(b), the horizontal axis represents the position in the direction of the central axis of the main roller, and the vertical axis represents the film thickness (standard value). P1 and P2 are the positions of the edges of the substrate 91 in the width direction of the substrate 91.

[0062] The mask member 30 has a pair of mask portions 301 and 302. The pair of mask portions 301 and 302 are aligned in the direction of the central axis 47c. The central axis 47c is perpendicular to the conveying direction (arrow) in which the substrate 91 is wound and conveyed. Each of the pair of mask portions 301 and 302 is installed between the deposition source and the substrate 91. The pair of mask portions 301 and 302 shield both sides of the substrate 91 in the direction of the central axis 47c of the main roller 47. On both sides of the substrate 91, adhesion of the evaporated material to the substrate 91 is suppressed.

[0063] However, because metals like lithium have relatively low weight, when a vapor flow is formed, its direction of travel may be isotropic. As a result, even if the gap between the mask portions 301 and 302 and the base material 91 is made narrow, the metal vapor can easily spread to the back side of each of the mask portions 301 and 302.

[0064] Therefore, on both sides of the substrate 91, the evaporating material is not completely shielded by the mask member 30, and a film thickness distribution as shown in Figure 4(b) is formed. For example, in the exposed region 95 of the substrate 91 exposed from the mask member 30, the thickness distribution of the coating 92 is formed with excellent uniformity. However, in parts other than the exposed region 95, the thickness of the coating 92 decreases sharply as it approaches position P1 or position P2.

[0065] Therefore, in this embodiment, the area between positions P10 and P20, which are located slightly inward from both ends of the exposed area 95, is treated as the main body 901 (product portion) of the object to be processed 90 with excellent film thickness uniformity, and this main body 901 is recovered by the rotor 43. The main body 901 recovered by the rotor 43 is applied, for example, to a part of a lithium battery.

[0066] Furthermore, a carbonation treatment is employed as a surface modification treatment. This minimizes oxidation on the surface of the lithium metal film, for example, when a lithium film is applied as the coating 92. As a result, it is possible to improve battery characteristics while suppressing a decrease in lithium ion conductivity.

[0067] In this embodiment, in addition to the vacuum processing apparatuses 1A and 1B, a vacuum processing method using the vacuum processing apparatuses 1A and 1B is also provided.

[0068] For example, a sheet-like substrate 91 is exposed from a mask member 30 in a reduced-pressure atmosphere, and a coating 92 containing an alkali metal or alkaline earth metal is formed on the film-forming surface 91d of the substrate 91 exposed from the mask member 30. Next, the coating 92 formed on the film-forming surface 91d and the substrate 91 that serves as the base for the coating 92 formed on the film-forming surface 91d are cut in a reduced-pressure atmosphere. Furthermore, the surface of the coating 92 formed on the substrate 91 or the cut surface of the cut coating 92 is modified by a surface modification treatment.

[0069] Although embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above and can be modified in various ways. For example, the substrate 91 is not limited to a long length, but may be a rectangular plate. Also, the substrate 91 is not limited to a flexible substrate, but may be a rigid substrate. In this case, the film formation method is not limited to a roll-to-roll method, but may be a batch method. Each embodiment is not necessarily an independent form, and can be combined as much as technically possible. [Explanation of Symbols]

[0070] 1A, 1B... Vacuum processing equipment 10...Vacuum chamber 20…Film forming section 21... Steam flow 30… Mask component 41, 42, 43, 46... Laura 45... Guide roller 47…Main character Laura 47c…Central axis 50... Slit section 80, 801, 802, 803, 804... partition walls 80s, 802s, 803s, 804s…Gap 90...Objects to be processed 90W...side 90L…cutting line 91...Base material 91r…Contact surface 91d...film formation surface 901...Main body 902... Surplus 92...Coating 95...Exposed area 101, 102, 1021, 1022… Processing rooms 120…Deposition chamber 140...Collection Room 801h…Aperture P1, P2, P4... Vacuum pumps S1...First gas supply source S2...Second gas supply source L11, L21... Gas supply lines L12, L22, L4... Exhaust lines

Claims

1. A slit portion is provided for cutting the film formed on the film-forming surface of a sheet-like substrate exposed from a mask member, the substrate having a film containing an alkali metal or alkaline earth metal formed on it, in a reduced-pressure atmosphere, the film formed on the film-forming surface and the substrate which forms the base portion of the film formed on the film-forming surface. A surface treatment process that modifies the cut surface of the coating, which has been cut by the slit portion, by exposing it to the treatment gas in a gas atmosphere of the treatment gas, A vacuum processing apparatus equipped with the following.

2. In the vacuum apparatus described in claim 1, The system further comprises a film-forming unit that forms the coating on the substrate in a reduced-pressure atmosphere. Vacuum processing equipment.

3. In the vacuum apparatus described in claim 2, A first processing chamber containing a deposition source included in the aforementioned film formation section, A second processing chamber housing the aforementioned slit portion, A third processing chamber that forms a gas atmosphere for the processing gas applied to the surface processing section, has Vacuum processing equipment.

4. In the vacuum apparatus described in claim 1, A second processing chamber housing the aforementioned slit portion, A third processing chamber that forms a gas atmosphere for the processing gas applied to the surface processing section, has Vacuum processing equipment.

5. A sheet-like substrate is exposed from a mask member in a reduced-pressure atmosphere, and a coating containing an alkali metal or alkaline earth metal is formed on the film-forming surface of the substrate exposed from the mask member. The film formed on the film-forming surface and the substrate which forms the base portion of the film formed on the film-forming surface are cut by the slit portion in a reduced-pressure atmosphere. The cut surface of the coating, which has been cut by the slit portion, is modified by exposing it to the processing gas in a gas atmosphere containing the processing gas. Vacuum processing method.

6. A vacuum processing method according to claim 5, The cutting of the coating and the substrate is carried out in the second processing chamber that creates the reduced pressure atmosphere. The modification of the cut surface of the coating is carried out in a third treatment chamber where a gas atmosphere of the treatment gas for the modification is formed. Vacuum processing method.

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