Test pad

Abstract

To provide a test pad.SOLUTION: A test pad 120 of the present invention is installed on a substrate 110 with at least one circuit 130, and the test pad 120 is used to contact the probe's contact area. The test pad 120 has a groove 122 to limit the contact area to prevent a situation where the contact area slides out of the test pad 120.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a test pad, and more particularly to a test pad for preventing the probe from slipping out.

Background Art

[0002] A conventional circuit board 10 has a substrate 11 and a circuit layer 12. The circuit layer 12 has at least one circuit 12a and at least one test pad 12b, and a part of the circuit layer 12 is covered by a solder resist layer 13. When the substrate 11 warps, the test pad 12b follows and curves or tilts with the substrate 11 (see FIGS. 1 to 3).

Summary of the Invention

Problems to be Solved by the Invention

[0003] Referring to FIGS. 2 and 3, when the probe 20 of a test apparatus (for example, a probe card) is brought into contact with the test pad 12b for testing, if the substrate 11 is warped, the contact portion 21 of the probe 20 slips out of the test pad 12b, and the test fails. In order to prevent the situation where the contact portion 21 slips out of the test pad 12b, it is necessary to increase the pressing pressure of the probe 20 and crimp the probe 20 to the test pad 12b. However, the frictional force between the contact portion 21 and the test pad 12b also increases, and the contact portion 21 and the test pad 12b are worn, shortening the life of the probe 20 and the circuit board 10.

[0004] In addition, when the frictional force between the contact portion 21 and the test pad 12b increases, wear particles are generated on the contact portion 21 and / or the test pad 12b. When the wear particles adhere to the contact portion 21 or the test pad 12b, the test apparatus or the circuit board 10 shorts, reducing the product yield and test efficiency. To prevent short circuits, it is necessary to increase the cleaning frequency of the probe 20, but this reduces the test efficiency.

[0005] Therefore, the inventors believed that the above-mentioned shortcomings could be improved, and after diligent research, arrived at the present invention, which effectively improves the above-mentioned problems through a rational design.

[0006] The present invention has been made in view of these circumstances, and its object is to provide a test pad installed on a substrate, wherein the groove portion of the test pad prevents the contact portion of the probe from slipping off the test pad. [Means for solving the problem]

[0007] To solve the above problems, the test pad of the present invention employs the following means. (First aspect) This invention The A test pad according to one embodiment is installed on a substrate together with at least one circuit, and the test pad is used to bring the contact portion of a probe into contact with the substrate. The test pad is provided with at least one groove to limit the situation in which the contact portion slips away from the test pad, and the edge of the groove is used to bring the contact portion into contact with the substrate. The device further comprises a main body and a position limiting section, with the groove located between the main body and the position limiting section. The device further includes connecting parts, the ends of which are connected to the main body and the position-limiting part, respectively. The ends of the position-limiting part are connected to a circuit. A first virtual line passes through the position-limiting part, the connecting parts, and the main body, while a second virtual line passes through the position-limiting part, the groove, and the main body. An angle is provided between the first and second virtual lines. (Second aspect) A test pad according to a second aspect of the present invention is mounted on a substrate together with at least one circuit, and the test pad is used to bring the contact portion of a probe into contact with the substrate. The test pad is provided with at least one groove to limit the situation in which the contact portion slips away from the test pad, and the edge of the groove is used to bring into contact with the contact portion. The device further comprises a main body and a position limiting section, with the groove located between the main body and the position limiting section. The device further includes connecting parts, each connected to the main body and the position-limiting section, respectively. The ends of the position-limiting section are connected to a circuit. A first virtual line passes through the position-limiting section, the connecting parts, and the main body, while a second virtual line passes through the position-limiting section, the groove, and the main body. The first virtual line runs parallel to the second virtual line. (Third aspect) A test pad according to a third aspect of the present invention is mounted on a substrate together with at least one circuit, and the test pad is used to bring the contact portion of a probe into contact with the substrate. The test pad is provided with at least one groove to limit the situation in which the contact portion slips away from the test pad, and the edge of the groove is used to bring into contact with the contact portion. The device further comprises a main body and a position limiting section, with the groove located between the main body and the position limiting section. It has multiple grooves, each groove is not connected to the others, and there is at least one connecting part between each adjacent groove, with both ends of the connecting part connected to the main body and the position limiting part, respectively. [Effects of the Invention]

[0008] When the probe's contact portion comes into contact with the test pad, the present invention prevents the contact portion from slipping away from the test pad by limiting the contact portion with a groove.

[0009] Other features of the present invention will be clarified by the description in this specification and the accompanying drawings.

Brief Description of the Drawings

[0010] [Figure 1] It is a plan view showing a conventional circuit board and test pads. [Figure 2] It is a plan view showing a conventional test pad. [Figure 3] It is a cross-sectional view showing a conventional test pad. [Figure 4] It is a plan view showing a circuit board and test pads according to Reference Example 1 of the present invention. [Figure 5] It is a plan view showing a test pad according to Reference Example 1 of the present invention. [Figure 6] It is a cross-sectional view showing a test pad according to Reference Example 1 of the present invention. [Figure 7] It is a plan view showing a test pad according to Reference Example 2 of the present invention. [Figure 8] It is a plan view showing a test pad according to the first embodiment of the present invention. [Figure 9] It is a plan view showing a test pad according to the second embodiment of the present invention. [Figure 10] It is a plan view showing a test pad according to the third embodiment of the present invention. [Figure 11] It is a plan view showing a test pad according to the third embodiment of the present invention.

Modes for Carrying Out the Invention

[0011] Hereinafter, embodiments of the test pad of the present invention will be described with reference to the drawings. However, the present invention is not limited to these embodiments, and members, materials, etc. described below can be variously modified within the scope of the gist of the present invention.

[0012] (Reference example 1) First, the test pad according to the present invention Reference example 1 will be described in detail with reference to FIGS. 4 to 6. The test pad 120 and at least one circuit 130 are mounted on a substrate 110, constituting a circuit board 100. The test pad 120 is connected to the circuit 130. A metal layer (not shown) mounted on the substrate 110 can be used to form the test pad 120 and circuit 130 through an etching process, and a portion of the circuit 130 is covered with a solder resist layer 140. The present invention does not limit the method of manufacturing the test pad 120 and circuit 130, and the material of the substrate 110 may be selected from polyimide (PI), polyethylene terephthalate (PET), glass, or silicon.

[0013] As shown in Figures 4 to 6, the test pad 120 is used to bring the contact portion 21 of the probe 20 of the test apparatus into contact with the test pad 120 and perform the test. The test pad 120 has at least one groove 122, which is used to restrict the contact portion 21 so as not to slip away from the test pad 120 during the test process. The shape of the groove 122 may be selected from various geometric shapes (see Figures 5, 7 to 11), and preferably the groove 122 is a closed groove but not a circular groove. As shown in Figure 6, the width W of the groove 122 is not greater than the outer diameter D of the contact portion 21 of the probe 20.

[0014] As shown in Figures 5 and 6, preferably the test pad 120 further comprises a main body 121 and a position limiting portion 123, with the groove 122 located between the main body 121 and the position limiting portion 123. The main body 121 is connected to the circuit 130, the groove 122 encloses the main body 121, the position limiting portion 123 encloses the groove 122, and the position limiting portion 123 is electrically connected to the main body 121. Reference example 1 Then, the end portion 123a of the position limiting portion 123 is connected to the circuit 130, and preferably, the area of ​​the main body 121 is not smaller than the area of ​​the groove portion 122. (Reference example 2) As shown in Figure 7, Reference example 2The end portion 123a of the position limiting portion 123 is connected to the main body 121.

[0015] As shown in Figures 5 and 6, when the contact portion 21 of the probe 20 comes into contact with the test pad 120, the groove 122 can restrict the displacement of the contact portion 21. When the probe 20 slides to the groove 122, the contact portion 21 comes into contact with the edge 122a of the groove 122, allowing the probe 20 to perform a test on the test pad 120.

[0016] (First Embodiment) As shown in Figure 8, 1 In this embodiment, the end 123a of the position limiting section 123 is connected to the circuit 130, and the test pad 120 further includes connecting sections 122c, both of which are connected to the main body 121 and the position limiting section 123, respectively. The first virtual line X passes through the position limiting section 123, the connecting section 122c, and the main body 121, and the second virtual line Y passes through the position limiting section 123, the groove 122, and the main body 121, with an angle A between the first virtual line X and the second virtual line Y. Figure 9 differs from Figure 8 in that the first virtual line X is parallel to the second virtual line Y.

[0017] Figure 9 (Second embodiment) and Figure 10 (Third embodiment) As shown, in other embodiments, the test pad 120 has a plurality of grooves 122b, and each groove 122b is not connected to one another. There is at least one connecting portion 122c between each adjacent groove 122b, and both ends of the connecting portion 122c are connected to the main body 121 and the position limiting portion 123, respectively. Preferably, the connecting portion 122c is located at the corner 121a of the main body 121 to increase the connection strength between the position limiting portion 123 and the main body 121.

[0018] When the contact portion 21 of the probe 20 contacts the test pad 120, the present invention restricts the contact portion 21 with a groove 122 to prevent the contact portion 21 from sliding away from the test pad 120. This solves the problem in the prior art where, in order to prevent the probe from sliding, the pressing pressure of the probe increases, causing wear on the contact portion and the test pad, resulting in a short circuit and an increased frequency of probe cleaning.

[0019] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The present invention may be modified and improved without departing from its spirit, and it goes without saying that equivalents thereof are included. [Explanation of Symbols]

[0020] 10 Circuit boards 11 circuit boards 12 circuit layers 12a circuit 12b Test Pad 13 Solder Resist Layer 20 probes 21 Contact area 100 circuit boards 110 circuit boards 120 Test Pads 121 Main Unit 121a corner 122 Groove 122a Edge 122b Groove 122c connection 123 Position limiting part 123a End 130 circuits 140 solder resist layers A inclusion angle D Outer diameter W width X First virtual line Y Second Virtual Line

Claims

1. A test pad that is installed on a circuit board together with at least one circuit and is used to make contact with the contact portion of a probe, The contact portion is provided with at least one groove to limit the situation in which the contact portion slips away from the test pad, and the edge of the groove is used to make contact with the contact portion. The device further comprises a main body and a position limiting portion, and the groove portion is located between the main body and the position limiting portion. A test pad further comprising connecting portions, the ends of which are connected to the main body and the position limiting portion, respectively, the ends of the position limiting portion being connected to the circuit, a first virtual line passing through the position limiting portion, the connecting portions, and the main body, a second virtual line passing through the position limiting portion, the groove portion, and the main body, and having a clamping angle between the first virtual line and the second virtual line.

2. A test pad that is installed on a circuit board together with at least one circuit and is used to make contact with the contact portion of a probe, The contact portion is provided with at least one groove to limit the situation in which the contact portion slips away from the test pad, and the edge of the groove is used to make contact with the contact portion. The device further comprises a main body and a position limiting portion, and the groove portion is located between the main body and the position limiting portion. A test pad further comprising connecting portions, the ends of which are respectively connected to the main body and the position limiting portion, the ends of which are connected to the circuit, a first virtual line passing through the position limiting portion, the connecting portions and the main body, a second virtual line passing through the position limiting portion, the groove portion and the main body, and the first virtual line being parallel to the second virtual line.

3. The test pad according to claim 1 or 2, characterized in that the width of the groove portion is not greater than the outer diameter of the contact portion.

4. The test pad according to claim 1 or 2, characterized in that the groove surrounds the main body.

5. The test pad according to claim 4, characterized in that the position limiting portion surrounds the groove portion.

6. The test pad according to claim 1 or 2, characterized in that the area of ​​the main body is not smaller than the area of ​​the groove.

7. A test pad that is installed on a circuit board together with at least one circuit and is used to make contact with the contact portion of a probe, The contact portion is provided with at least one groove to limit the situation in which the contact portion slips away from the test pad, and the edge of the groove is used to make contact with the contact portion. The device further comprises a main body and a position limiting portion, and the groove portion is located between the main body and the position limiting portion. A test pad comprising a plurality of grooves, wherein each groove is not connected to one another, and there is at least one connecting portion between adjacent grooves, and both ends of the connecting portion are connected to the main body and the position limiting portion, respectively.

8. The test pad according to claim 7, characterized in that the width of the groove portion is not greater than the outer diameter of the contact portion.

9. The test pad according to claim 7, characterized in that the area of ​​the main body is not smaller than the area of ​​the groove.

10. The test pad according to claim 7, characterized in that the connection portion is located at the corner of the main body.

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