Space transformer configured for use in a probe system, probe system including a space transformer, and related methods

Abstract

Disclosed herein are a space transformer configured for use in a probe system to facilitate electrical communication with a device under test (DUT), a probe system including the space transformer, and an associated method. The space transformer includes a dielectric, a plurality of first electrical contacts supported by the dielectric, and a plurality of second electrical contacts supported by the dielectric. The space transformer also includes a conductive radio frequency (RF) signal-modifying trace. The space transformer further includes an RF electrical signal-modifying structure in electrical communication with the conductive RF signal-modifying trace. The RF electrical signal-modifying structure is configured to receive the RF electrical signal from an input region of the conductive RF signal-modifying trace and emit the modified RF electrical signal to an output region of the conductive RF signal-modifying trace. The RF electrical signal-modifying structure includes a coupler.

Description

Technical Field

[0001] [Related Applications] This application claims the priority of U.S. Patent Application No. 18 / 737,250 filed on June 7, 2024 and U.S. Provisional Patent Application No. 63 / 472,444 filed on June 12, 2023, the entire disclosure of which is incorporated herein by reference.

[0002] This disclosure relates to a space transformer configured to be utilized in a probe system, a probe system including the space transformer, and related methods.

Background Art

[0003] In the electronics industry, space transformers are often utilized to adapt or transform a plurality of conductive traces from a first relative spacing or first pitch spacing to a second relative spacing or second pitch spacing. The first relative spacing may be related to a first hardware and / or a first manufacturing technology, and the second relative spacing may be related to a second hardware and / or a second manufacturing technology. As an example, a space transformer can be utilized to adapt electrical traces that may exist on a printed circuit board (i.e., a first hardware and / or a first manufacturing technology) to electrical traces that may exist on an integrated circuit device (i.e., a second hardware and / or a second manufacturing technology).

Summary of the Invention

Problems to be Solved by the Invention

[0004] In probe systems, space transformers can be used to at least partially transition signals from relatively macro-scale structures that may exist at the connection point with the signal generation and analysis assembly used to generate electrical signals to relatively micro-scale structures such as contact pads on the device under test (DUT). In some situations, it may be desirable to supply and / or receive high-frequency electrical signals, such as radio frequency (RF) and / or millimeter-wave (mm-wave) electrical signals, to the DUT. However, such high-frequency electrical signals can degrade as the transmission distance increases and / or based on the electromagnetic environment during the transmission of a given high-frequency electrical signal. This can make it difficult, or even impossible, to transport specific high-frequency signals from the signal generation and analysis assembly to the DUT using conventional probe systems, including conventional space transformers. Therefore, improved space transformers and related methods configured for use in probe systems are needed. [Means for solving the problem]

[0005] Disclosed herein are a space transformer configured for use in a probe system to facilitate electrical conduction with a device under test (DUT), a probe system including the space transformer, and associated methods. The space transformer includes a dielectric, a plurality of first electrical contacts supported by the dielectric and arranged at least one first pitch interval, and a plurality of second electrical contacts supported by the dielectric and arranged at at least one second pitch interval smaller than the minimum first pitch interval. The space transformer also includes a plurality of conductive signal-transmission traces supported by the dielectric. Each conductive signal-transmission trace extends between a corresponding first electrical contact of the plurality of first electrical contacts and a corresponding second electrical contact of the plurality of second electrical contacts, electrically interconnecting them. The space transformer also includes a conductive radio frequency (RF) signal-changing trace, which is electrically conductive to the RF signal-changing second electrical contacts of the plurality of second electrical contacts and is configured to conduct to the DUT and carry RF electrical signals. The space transformer further includes an RF electrical signal changing structure that is electrically conductive to a conductive RF signal changing trace. The RF electrical signal changing structure is configured to receive an RF electrical signal from the input region of the conductive RF signal changing trace and emit a changed RF electrical signal to the output region of the conductive RF signal changing trace. The RF electrical signal changing structure includes a coupler configured to receive an RF electrical signal from the DUT in the form of a first RF electrical signal, receive a second RF electrical signal from the DUT, and couple the first RF electrical signal and the second RF electrical signal together to generate a changed RF electrical signal in the form of a first changed RF electrical signal and a second changed RF electrical signal. [Brief explanation of the drawing]

[0006] [Figure 1] This is a schematic diagram of an example of a space transformer that may be included in the probe head assembly of a probe system according to this disclosure. [Figure 2] This is a more detailed diagram of an example of a part of a probe system, including a probe head assembly including a space transformer, as disclosed herein. [Figure 3] This is a more detailed diagram of an example of a part of a probe system, including a probe head assembly including a space transformer, as disclosed herein. [Figure 4] This disclosure provides an example of a relatively low-frequency directional coupler that may be used in space transformers. [Figure 5] This disclosure provides an example of a relatively high-frequency directional coupler that may be used in space transformers. [Figure 6] This disclosure presents an example of a branch line coupler that may be used in a space transformer. [Figure 7] This disclosure presents an example of an orthogonal hybrid coupler that may be used in space transformers. [Figure 8] This flowchart shows an example of a method for testing a device under test (DUT) using a probe system including a space transformer, as disclosed herein. [Modes for carrying out the invention]

[0007] Figures 1 to 8 show examples of probe systems 10, probe head assemblies 100, space transformers 110, and / or methods 300 according to the present disclosure. Elements serving similar, or at least substantially similar, purposes are denoted by the same reference numerals in each of Figures 1 to 8, and these elements may not be described in further detail herein with reference to each of Figures 1 to 8. Similarly, not all elements may be denoted in each of Figures 1 to 8, but their associated reference numerals may be used herein for consistency. Elements, components, and / or features described herein with reference to one or more of Figures 1 to 8 may be included in and / or used together with any of Figures 1 to 8 without departing from the scope of the present disclosure. Generally, elements that are likely to be included in a particular embodiment are shown with solid lines, and optional elements are shown with dashed lines. However, elements shown with solid lines may not be essential in all embodiments, and in some embodiments they may be omitted without departing from the scope of the present disclosure.

[0008] Figure 1 is a schematic diagram of an example of a space transformer 110 that may be included in the probe head assembly 100 of the probe system 10 according to this disclosure, while Figures 2 and 3 are more detailed diagrams of a subset of the probe system 10 including the space transformer 110, according to this disclosure.

[0009] As shown collectively in Figures 1 to 3, with particular reference to Figure 1, the space transformer 110 includes a dielectric 120, a plurality of first electrical contacts 130, and a plurality of second electrical contacts 140. The first electrical contacts 130 are supported by the dielectric 120 and are arranged at least one first pitch spacing 132, and the second electrical contacts 140 are supported by the dielectric 120 and are arranged at at least one second pitch spacing 142 that is different from or smaller than the at least one first pitch spacing.

[0010] The space transformer 110 also includes a plurality of conductive signal transmission traces 160. Each conductive signal transmission trace 160, which may also be referred to herein as a transmission trace 160, extends between a corresponding first electrical contact 130 and a corresponding second electrical contact 140, electrically interconnecting them. In other words, the transmission traces 160 are configured to carry electrical signals through the space transformer 110 and / or between the first electrical contact 130 and the second electrical contact 140.

[0011] The space transformer 110 also includes at least one conductive radio frequency (RF) signal change trace 180. The conductive radio frequency (RF) signal change trace 180, which may also be referred to herein as the signal change trace 180, is electrically connected to the RF signal change second electrical contact 144 of the second electrical contact 140 and / or electrically connected to the device under test (DUT) 32 to carry an RF or millimeter-wave (mm-wave) electrical signal.

[0012] The space transformer 110 further includes an RF electrical signal modification structure 190. The RF electrical signal modification structure 190 may also be referred to herein as the signal modification structure 190, and is configured to receive an RF electrical signal from the input region 182 of the signal modification trace 180 and / or to emit a modified RF electrical signal to the output region 184 of the signal modification trace.

[0013] Referring again to Figures 1 to 3 in general, and particularly to Figure 1, the space transformer 110 can be used within the probe system 10 to facilitate electrical conduction with the DUT 32 that may be formed on the substrate 30. Examples of the DUT 32 include semiconductor devices, electronic devices, and / or optoelectronic devices. Examples of the substrate 30 include wafers, silicon wafers, and semiconductor wafers.

[0014] The probe system 10 includes a chuck 12 that defines a support surface 14. The support surface 14 may be configured to support the DUT 32 and / or the substrate 30. Examples of the chuck 12 include a vacuum chuck, a temperature-controlled chuck, and / or an electrically shielded chuck.

[0015] The probe system 10 also includes a probe head assembly 100 which includes a space transformer 110. The probe system 10 further includes a signal generation and analysis assembly 20 which may be configured to supply a test signal 22 to the DUT 32 via the space transformer 110 and / or receive the resulting electrical signal from the DUT via the space transformer. Examples of the signal generation and analysis assembly 20 include a power supply, a DC power supply, an AC power supply, a function generator, an RF signal generator, a signal analyzer, and / or an RF signal analyzer.

[0016] During the operation of the probe system 10 and / or during testing of the DUT 32 using the probe system 10 including the space transformer 110 by method 300, a power signal may be supplied to the DUT via the space transformer, etc. As an example, the signal generation and analysis assembly 20 may generate a test signal 22 in the form of a power signal that can be supplied to the DUT 32 via the probe head assembly 100, the space transformer 110, and / or the probe 102.

[0017] RF electrical signals can also be received by a space transformer. For example, in response to the reception of a power signal, the DUT32 can generate an RF electrical signal 36, which can be received by the space transformer 110 via an RF signal modification second signal contact 144, etc. Subsequently, the RF electrical signal can be modified within the space transformer 110 using an RF electrical signal modification structure 190 to generate a modified RF electrical signal 194.

[0018] As an example, the input area 182 of the signal change trace 180 may receive the RF electrical signal 36 from the RF signal change second electrical contact 144 and supply the RF electrical signal to the signal change structure 190. The signal change structure 190 may receive the RF electrical signal, change the RF electrical signal to generate a changed RF electrical signal 194, and then supply the changed RF electrical signal to the output area 184 of the signal change trace 180.

[0019] In some examples, as shown in FIG. 1, the output region 184 can be electrically conductive with the corresponding first electrical contact 134 for RF signal modification, and / or can supply a modified RF electrical signal to the signal generation and analysis assembly 20 via the first electrical contact for RF signal modification. Additionally or alternatively, as shown in FIGS. 1-3, the second electrical contact 140 can include at least two second electrical contacts 144 for RF signal modification in the form of a second electrical contact 146 for RF signal reception and a second electrical contact 148 for RF signal emission. In such an example, the input region 182 can receive the RF electrical signal 36 from the second electrical contact 146 for RF signal reception, and can return the modified RF electrical signal to the DUT via the output region 184 and the second electrical contact 148 for RF signal emission.

[0020] By modifying the RF electrical signal 36 within the space transformer 110 to generate a modified RF electrical signal 194 and / or returning the modified RF electrical signal 194 to the DUT 32, several clear advantages can be obtained compared to conventional probe systems that do not modify the RF electrical signal within the space transformer and / or do not return the modified RF electrical signal to the DUT. For example, the distance traveled by the RF electrical signal and / or the distance traveled by the modified RF electrical signal can be shortened compared to such conventional probe systems. This can enable and / or facilitate a reduction in performance degradation based on distance, resistance, inductance, and / or capacitance in the RF electrical signal and / or modified RF electrical signal compared to such conventional probe systems. As another example, the probe system 10 including the space transformer 110 can enable and / or facilitate electrical testing of the DUT under conditions that more closely approximate the real-world use case of the DUT 32 compared to electrical testing that can be performed by such conventional probe systems. As yet another example, the selection and / or adjustment of structures included within the signal modification structure 190 as disclosed herein can enable and / or facilitate performance adjustment of the probe system 10 to a level that may not be possible with such conventional probe systems. As yet another example, by returning the modified RF electrical signal 194 to the DUT 32, the need for external tester resources within the probe system 10 and / or its signal generation and analysis assembly 20 can be reduced, thereby reducing the cost and / or complexity of the probe system.

[0021] Returning more comprehensively to FIGS. 1 - 3, the dielectric 120 can include and / or can be any suitable body that supports a first electrical contact 130, any suitable body that supports a second electrical contact 140, any suitable body that supports a transmission trace 160, any suitable body that supports a signal modification trace 180, any suitable body that supports a signal modification structure 190, any suitable body that spatially separates one or more of these structures from one or more of the other of these structures, and / or any suitable body that electrically insulates one or more of these structures from one or more of the other of these structures. As an example, the dielectric 120 can include and / or can be defined by a dielectric material and / or an electrical insulating material.

[0022] It is within the scope of the present disclosure that the dielectric 120 can include a rigid or at least partially rigid dielectric and / or can be such a dielectric. Additionally or alternatively, it is also within the scope of the present disclosure that the dielectric 120 can include a flexible dielectric, at least partially flexible dielectric, elastic dielectric, and / or at least partially elastic dielectric and / or can be such a dielectric. Examples of the dielectric 120 include a dielectric film, a polyimide dielectric, a polyimide dielectric film, an organic dielectric, a multilayer organic (MLO) dielectric, an inorganic dielectric, a ceramic dielectric, a multilayer ceramic (MLC) dielectric, a single-layer dielectric, and / or a multilayer dielectric that can include a plurality of layers 122 as shown in FIG. 1.

[0023] The first electrical contact 130 may include any suitable structure that can be supported by the dielectric 120, any suitable structure that can define at least one first pitch spacing 132, any suitable structure that can define a plurality of different first pitch spacings 132, and / or any suitable structure that can function as an electrical interface between the space transformer 110 and one or more other components of the probe system 10. Examples of the first electrical contact 130 include a plurality of first electrical contact pads, a plurality of first electrical contact tips, a plurality of first conductors, a plurality of first conductive regions, a plurality of first metallic bodies, and / or a plurality of first metallic regions.

[0024] As explained, the first pitch interval 132 or the average of several different first pitch intervals 132 may differ from the second pitch interval 142 or the average of several different second pitch intervals 132. In particular, the first pitch interval 132 may be greater than the second pitch interval 142 and / or the second pitch interval 142 may be less than the first pitch interval 132. As an example, the first pitch interval may be at least a threshold pitch interval multiple of the second pitch interval. Examples of threshold pitch interval multiples include 2, 3, 4, 5, 10, 15, 20, 30, 40, 50, 75, or 100.

[0025] Similarly, the second electrical contact 140 may include any suitable structure that can be supported by the dielectric 120, any suitable structure that can define at least one second pitch spacing 142, any suitable structure that can define a plurality of different second pitch spacings 142, and / or any suitable structure that can function as an electrical interface between the space transformer 110 and the DUT 32 and / or between the space transformer and one or more other components of the probe system 10. Examples of the second electrical contact 140 include a plurality of second electrical contact pads, a plurality of second electrical contact tips, a plurality of second electrical probe tips, a plurality of second conductors, a plurality of second conductive regions, a plurality of second metallic bodies, and / or a plurality of second metallic regions.

[0026] In some examples, the second electrical contact 140 may be configured to contact or directly contact the DUT 32, for example, by contact with the DUT contact pad 34 of the DUT 32. In such examples, the second electrical contact 140 may be, and / or be, the probe 102 of the probe head assembly 100, as referred to herein. In some examples, the second electrical contact 140 may be configured to indirectly contact the DUT 32 via a probe 102, etc., that is electrically conductive with the second electrical contact 140. Such a configuration may enable and / or facilitate electrical conductivity between the probe system 10 and the DUT 32.

[0027] The transmission trace 160 may include any suitable structure that can be supported by the dielectric 120, any suitable structure that can extend between the corresponding first electrical contact and the corresponding second electrical contact, and / or any suitable structure that can electrically interconnect the corresponding first electrical contact and the corresponding second electrical contact. Examples of the transmission trace 160 include a metal signal transmission trace, an aluminum signal transmission trace, and / or a copper signal transmission trace.

[0028] One or more signal transmission traces 160 may be configured to supply power signals 166 to the DUT, such as electrically powering the DUT 32. Examples of power signals include direct current (DC) power and / or alternating current (AC) power. Additionally or alternatively, one or more signal transmission traces 160 may be configured to supply RF input electrical signals 162 corresponding to the DUT 32 and / or RF output electrical signals 164 corresponding to one or more other components of the probe system 10 from the DUT.

[0029] The signal change trace 180 may include any suitable structure that can be supported by the dielectric 120, any suitable structure that can define the input region 182, any suitable structure that can define the output region 184, any suitable structure that can electrically conduct to the first RF signal change electrical contact 134, any suitable structure that can electrically conduct to the second FR signal change electrical contact 144, any suitable structure that can electrically conduct to the second RF signal receiving electrical contact 146, any suitable structure that can electrically conduct to the second RF signal emitting electrical contact 148, and / or any suitable structure that can electrically conduct to the signal change structure 190. Examples of the signal change trace 180 include a metal signal change trace, an aluminum signal change trace, and / or a copper signal change trace. In some examples, the space transformer 110 includes one, i.e., a single signal change trace 180 and a corresponding signal change structure 190. However, this is not necessary for all examples, and in some examples, the space transformer 110 may include multiple signal change traces 180 and multiple corresponding signal change structures 190.

[0030] The signal modification structure 190 may include any suitable structure that can be supported by the dielectric 120, any suitable structure that can conduct to the signal modification trace 180, any suitable structure that can be configured to receive an RF electrical signal from the input region 182, any suitable structure that can be configured to generate a modified RF electrical signal, and / or any suitable structure that can be configured to output a modified RF electrical signal to the output region 184. The signal modification structure 190 can modify an RF electrical signal and / or generate a modified RF electrical signal in any suitable manner. For example, the signal modification structure 190 may be configured to direct an RF electrical signal as a modified RF electrical signal 194 to an output region 184, to reflect an RF electrical signal to an output region as a modified RF electrical signal, to change the frequency of an RF electrical signal to generate a modified RF electrical signal, to change the bandwidth of an RF electrical signal to generate a modified RF electrical signal, to split an RF electrical signal to generate a modified RF electrical signal, to amplify an RF electrical signal to generate a modified RF electrical signal, to combine an RF electrical signal with another signal to generate a modified RF electrical signal, and / or to combine an RF electrical signal with another signal to generate a modified RF electrical signal.

[0031] Examples of signal-modifying structures 190 include passive RF structures, composite passive RF structures, RF attenuators, RF couplers, resistors, capacitors, inductors, and / or splitters. In some examples, the signal-modifying structures 190 may be surface-mounted on the dielectric 120 and / or on at least one other structure of the space transformer 110, as shown in Figures 1 and 2. Additionally or alternatively, the signal-modifying structures 190 may include and / or be embedded components that are built into and / or sealed within the dielectric 120 and / or space transformer 110, such as being formed within and / or by the metallized layer 124 that may be formed between adjacent layers 122 of the space transformer, as shown in Figures 1 and 3.

[0032] Figures 3 to 7 show more detailed examples of signal-modifying structures 190 included in and / or usable with the space transformer 110 according to the present disclosure. More specifically, Figures 3 to 7 show examples of signal-modifying structures 190 in the form of a coupler 192 or a passive coupler that can be used to couple two signals together via a coupling interaction between the two signals and / or without requiring the use of other and / or external signals and / or energy sources.

[0033] As an example, as shown in Figure 3, the signal modification structure 190 may be configured to receive a first RF electrical signal 38, which is an RF electrical signal 36, from a corresponding DUT contact pad 34 of the DUT 32 via a corresponding RF signal receiving second electrical contact 146, and may also be configured to receive a second RF electrical signal 40, which is an RF electrical signal 36, from a different corresponding contact pad of the DUT via another corresponding RF signal receiving second electrical contact 146. The first RF electrical signal and the second RF electrical signal are coupled together within the signal modification structure 190 to generate a first modified RF electrical signal 196, which is a modified RF electrical signal 194 that can be returned to another corresponding contact pad 34 of the DUT via a corresponding RF signal emitting second electrical contact 148, and a second modified RF electrical signal 194, which is a modified RF electrical signal 194 that can likewise be returned to yet another corresponding contact pad 34 of the DUT via another corresponding RF signal emitting second electrical contact 148.

[0034] The coupling of a first RF electrical signal and a second RF electrical signal can be achieved by any suitable method. For example, coupling can be achieved between the first RF electrical signal and the second RF electrical signal by capacitive, inductive, and / or electric field interaction. In a more detailed example, the coupler 192 may include a first transmission line 200 configured to carry the first RF electrical signal and a second transmission line 202 configured to carry the second RF electrical signal. The first and second transmission lines may be positioned relatively close to each other and / or close enough to facilitate the coupling of the first RF electrical signal and the second RF electrical signal.

[0035] Figures 4 and 5 show examples of signal modification structures 190 in the form of directional couplers, where Figure 4 shows a relatively low-frequency directional coupler that can be used in the configuration shown in Figure 3, and Figure 5 shows a relatively high-frequency directional coupler that can be used in the configuration shown in Figure 3. Relatively high-frequency directional couplers and / or relatively low-frequency directional couplers can be selected and / or used to provide a desired coupling frequency and / or desired coupling efficiency. Figure 6 is an example of a signal modification structure 190 in the form of a branch-line coupler that can be used in the configuration shown in Figure 3. Figure 8 is an example of a signal modification structure 190 in the form of an orthogonal hybrid coupler that can be used in the configuration shown in Figure 3.

[0036] Figure 8 is a flowchart illustrating an example of method 300 for testing a device under test (DUT) using a probe system including a space transformer, as disclosed herein. Method 300 includes the steps of supplying a power signal in 310 and receiving a radio frequency (RF) electrical signal in 320. Method 300 may also include the step of modifying the RF electrical signal in 330 and the step of returning the modified RF electrical signal in 340. Examples of DUTs, probe systems, and space transformers are disclosed herein with reference to DUT 32, probe system 10, and space transformer 110, respectively.

[0037] The step of supplying a power signal in 310 may include supplying a power signal to the DUT. This may also include supplying a power signal using, via, and / or utilizing a space transformer. The supply step in 310 can be performed in any suitable manner. As an example, as will be described in more detail herein, the probe system may include a signal generation and analysis assembly, and the supply step in 310 may include supplying a power signal using, via, and / or utilizing the signal generation and analysis assembly. An example of a signal generation and analysis assembly is disclosed herein with reference to signal generation and analysis assembly 20. An example of a power signal is disclosed herein with reference to test signal 22. As another example, as will also be described in more detail herein, the probe system may include a probe head assembly including a plurality of probes and a space transformer, and the supply step in 310 may include supplying a power signal using, via, and / or utilizing at least one of the probes from the probe head assembly and / or the plurality of probes. Examples of the probe head assembly and the plurality of probes are disclosed herein with reference to probe head assembly 100 and probe 102, respectively.

[0038] The step of receiving an RF electrical signal in 320 may include receiving an RF electrical signal from the DUT. The receiving step in 320 may be performed in response to the supply step in 310 and / or via and / or using a space transformer. The receiving step in 320 may be performed in any suitable manner. As an example, the receiving step in 320 may include receiving an RF electrical signal from the DUT via and / or using a probe head assembly and / or at least one probe from a plurality of probes. An example of an RF electrical signal is disclosed herein with reference to RF electrical signal 36.

[0039] The step of modifying the RF electrical signal 330 may include modifying the RF electrical signal to generate and / or produce a modified RF electrical signal. This may include modifying the RF electrical signal within a space transformer and / or modifying the RF electrical signal using, via and / or utilizing the RF electrical signal modification structure of the space transformer. Examples of RF electrical signal modification structures and modified RF electrical signals are disclosed herein with reference to RF electrical signal modification structure 190 and modified RF electrical signal 194, respectively.

[0040] The step of returning the modified RF electrical signal in 340 may include the step of returning the modified RF electrical signal to the DUT. This may include returning the modified RF electrical signal to the DUT via and / or using a space transformer, a probe head assembly, and / or at least one of a plurality of probes.

[0041] In some examples, the RF electrical signal may include and / or be the first RF electrical signal, an example of which is disclosed herein with reference to the first RF electrical signal 38, and the modified RF electrical signal may include and / or be the first modified RF electrical signal, an example of which is disclosed herein with reference to the first modified RF electrical signal 196. In some such examples, the receiving step of 320 may further include receiving the second RF electrical signal from the DUT, and the modifying step of 330 may further include modifying the second RF electrical signal using an RF electrical signal modification structure within the space transformer to generate the second modified RF electrical signal. Examples of the second RF electrical signal and the second modified RF electrical signal are disclosed herein with reference to the second RF electrical signal 40 and the second modified RF electrical signal 198, respectively. In some such examples, the modifying step of 330 may include combining the first RF electrical signal and the second RF electrical signal to generate and / or produce the first modified RF electrical signal and the second modified RF electrical signal. Similarly, in some such examples, the return step of 340 may include returning a second modified RF electrical signal to the DUT via a space transformer.

[0042] Method 300 offers clear advantages over conventional methods by not modifying the RF electrical signals within the space transformer, not returning modified RF electrical signals to the DUT, and / or not generating and / or creating the first modified RF electrical signals and the second modified RF electrical signals by coupling the first and second RF electrical signals together. For example, Method 300 can improve the signal-to-noise ratio by enabling and / or facilitating a shorter transmission distance for the corresponding RF electrical signals compared to conventional methods, and / or enabling testing of DUTs that could not be tested or reliably tested using conventional methods. As another example, by modifying the RF electrical signals within the space transformer, such as by coupling the first and second RF electrical signals together, the need for external tester resources can be reduced, and / or the cost and / or complexity of Method 300 can be reduced compared to conventional methods.

[0043] As used herein, the term "and / or" between a first tangible object and a second tangible object means one of (1) the first tangible object, (2) the second tangible object, and (3) the first and second tangible objects. Similarly, multiple tangible objects listed together with "and / or" should be interpreted as "one or more" of the thus linked tangible objects. Tangible objects other than those specifically identified in the "and / or" clause may exist, whether or not they are related to those specifically identified. Therefore, as a non-restrictive example, a reference to "A and / or B," when used with open-ended phrases such as "equipped with," may in one embodiment refer to A only (optionally including tangible objects other than B), in another embodiment refer to B only (optionally including tangible objects other than A), and in yet another embodiment refer to both A and B (optionally including other tangible objects). These tangible objects may refer to elements, actions, structures, steps, operations, values, etc.

[0044] The phrase “at least one” as used herein with respect to a list of one or more tangible objects should be understood to mean at least one tangible object selected from any one or more of the tangible objects in the list of tangible objects, but not necessarily including at least one of every tangible object specifically enumerated in the list of tangible objects, nor excluding any combination of tangible objects in the list of tangible objects. This definition also allows for the existence of tangible objects other than those specifically identified in the list of tangible objects to which the phrase “at least one” refers, whether or not they have a relationship with the specifically identified entities. Therefore, as a non-restrictive example, “at least one of A and B” (or equivalently “at least one of A or B” or equivalently “at least one of A and / or B”) may, in one embodiment, refer to at least one, for example, any two or more A, without B (optionally including tangible objects other than B); in another embodiment, refer to at least one, for example, any two or more B, without A (optionally including tangible objects other than A); and in yet another embodiment, refer to at least one, for example, any two or more A and at least one, for example, any two or more B (optionally including other tangible objects). In other words, the phrases “at least one,” “one or more,” and “and / or” are open-ended expressions that function both conjunctively and delimitingly. For example, each of the expressions "at least one of A, B, and C", "at least one of A, B, or C", "one or more of A, B, and C", "one or more of A, B, or C", and "A, B, and / or C" can mean A alone, B alone, C alone, a combination of A and B, a combination of A and C, a combination of B and C, a combination of A, B, and C, and optionally a combination of any of the above with at least one other tangible object.

[0045] If any patent, patent application, or other reference is incorporated herein by reference and (1) defines a term in a manner inconsistent with either the non-incorporating portion of this disclosure or the other incorporating reference, and / or otherwise inconsistent with either portion, the non-incorporating portion of this disclosure shall prevail, and any term in that document or any disclosure incorporated from that document shall be valid only with respect to the reference in which the term is defined and / or the incorporated disclosure originally existed.

[0046] As used herein, the terms “adapted” and “configured” mean that an element, component, or other subject matter is designed and / or intended to perform a given function. Therefore, the use of the terms “adapted” and “configured” should be interpreted as meaning that a given element, component, or other subject matter is not merely “capable” of performing a given function, but is specifically selected, created, implemented, used, programmed, and / or designed for the purpose of performing that function. It is also within the scope of this disclosure that an element, component, and / or other described subject matter described as adapted to perform a particular function may also be described as configured to perform that function additionally or as a substitute, and vice versa.

[0047] The terms “for example,” “as an example,” and / or simply “example,” used herein, when applied in reference to one or more components, features, details, structures, embodiments, and / or methods provided herein, are intended to indicate that the described components, features, details, structures, embodiments, and / or methods are illustrative and non-exclusive examples of the components, features, details, structures, embodiments, and / or methods provided herein. Accordingly, the described components, features, details, structures, embodiments, and / or methods are not intended to be restrictive, necessary, or exclusive / exclusive, and other components, features, details, structures, embodiments, and / or methods, including those that are structurally and / or functionally similar and / or equivalent, are also within the scope of this disclosure.

[0048] As used herein, “at least substantially” may, when modifying a degree or relationship, include not only the “substantial” degree or relationship described but also the entire scope of the degree or relationship described. The substantial amount of the degree or relationship described may include at least 75% of the degree or relationship described. For example, an object formed at least substantially from a certain material includes an object in which at least 75% of the object is formed from that material, and also an object formed entirely from that material. As another example, a first length that is at least substantially the same length as a second length includes a first length that is no more than 75% of the second length, and also a first length that is the same length as the second length.

[0049] Exemplary and non-exclusive examples of space transformers, probe systems, and methods provided herein are presented in the following sections. It is within the scope of the invention that individual steps of the methods described herein, including those in the following sections, may be referred to as “steps” that perform the described operations, either additionally or alternatively.

[0050] A1. A space transformer configured for use in a probe system to facilitate electrical conductivity with the device under test (DUT), Dielectrics and A plurality of first electrical contacts supported by a dielectric and arranged at least one first pitch interval, A plurality of second electrical contacts supported by a dielectric and arranged at at least one second pitch spacing smaller than at least one first pitch spacing, A plurality of conductive signal transmission traces supported by a dielectric, wherein each conductive signal transmission trace extends between a corresponding first electrical contact of a plurality of first electrical contacts and a corresponding second electrical contact of a plurality of second electrical contacts, electrically interconnecting the two. Multiple second electrical contacts are electrically connected to the second electrical contacts for RF signal modification. Conductive high-frequency (RF) signal modification traces are configured to electrically conduct to the DUT and carry RF electrical signals. An RF electrical signal modification structure is electrically connected to a conductive RF signal modification trace and is configured to receive an RF electrical signal from the input region of the conductive RF signal modification trace and emit a modified RF electrical signal to the output region of the conductive RF signal modification trace. A space transformer equipped with [a certain feature].

[0051] A2. A space transformer as described in item A1, wherein the dielectric includes or is a rigid dielectric.

[0052] A3. A space transformer according to item A1 or A2, wherein the dielectric comprises or is a flexible dielectric.

[0053] A4. A space transformer described in any one of items A1 to A3, wherein the dielectric includes or is a dielectric film.

[0054] A5. A space transformer described in any one of items A1 to A4, wherein the dielectric includes or is a polyimide dielectric.

[0055] A6. A space transformer according to any one of items A1 to A5, wherein the dielectric includes or is a multilayer organic (MLO) dielectric.

[0056] A7. A space transformer according to any one of items A1 to A6, wherein the dielectric includes or is an organic dielectric.

[0057] A8. A space transformer described in any one of items A1 to A7, wherein the dielectric includes or is a ceramic dielectric.

[0058] A9. A space transformer according to any one of items A1 to A8, wherein the dielectric includes or is a multilayer ceramic (MLC) dielectric.

[0059] A10. A space transformer according to any one of the A1 to A9 clauses, wherein the dielectric includes or is a multilayer dielectric.

[0060] A11. A space transformer according to any one of A1 to A10, wherein the plurality of first electrical contacts include a plurality of first electrical contact pads or are a plurality of first electrical contact pads.

[0061] A12. A space transformer according to any one of items A1 to A11, wherein the plurality of first electrical contacts comprises a plurality of first electrical contact chips or is a plurality of electrical contact chips.

[0062] A13. A space transformer described in any one of sections A1 to A12, wherein the average of at least one first pitch interval or a number of different first pitch intervals is at least a threshold pitch interval multiple of the average of at least one second pitch interval or a number of different second pitch intervals, the threshold pitch interval multiple being 2, 3, 4, 5, 10, 15, 20, 30, 40, 50, 75, or 100.

[0063] A14. A space transformer as described in any one of sections A1 to A13, wherein the plurality of second electrical contacts include a plurality of second electrical contact pads or are a plurality of second electrical contact pads.

[0064] A15. A space transformer as described in any one of items A1 to A14, wherein the plurality of second electrical contacts include a plurality of second electrical contact tips or probe tips, or are a plurality of second electrical contact tips or probe tips.

[0065] A16. A space transformer as described in any one of sections A1 to A15, wherein a plurality of second electrical contacts are configured to make direct contact with the DUT to facilitate electrical conduction between the probe system and the DUT.

[0066] A17. A space transformer as described in any one of sections A1 to A16, wherein the plurality of conductive signal transfer traces include or are plurality of metallic signal transfer traces.

[0067] A18. A space transformer as described in any one of the A1 to A17 sections, wherein at least one of a plurality of conductive signal transmission traces is configured to supply a power signal from the probe system to the DUT.

[0068] A19. A space transformer as described in Section A18, wherein the power signal includes at least one of DC power and AC power.

[0069] A20. A space transformer as described in any one of the A1 to A19 sections, wherein at least one of a plurality of conductive signal transfer traces is configured to supply an RF input electrical signal corresponding to the DUT from a probe system.

[0070] A21. A space transformer as described in any one of the A1 to A20 sections, wherein at least one of a plurality of conductive signal transfer traces is configured to supply an RF output electrical signal from the DUT to a probe system.

[0071] A22. A space transformer as described in any one of paragraphs A1 to A21, wherein the conductive RF signal change trace includes or is a metallic signal change trace.

[0072] A23. A space transformer as described in any one of sections A1 to A22, wherein the space transformer includes a plurality of conductive RF signal change traces and a plurality of corresponding RF electrical signal change structures.

[0073] A24. A space transformer as described in any one of sections A1 to A23, wherein the output region is electrically connected to a plurality of first electrical contacts for RF signal conversion and is configured to carry a converted RF electrical signal to a probe system signal generation and analysis assembly.

[0074] A25. A space transformer as described in any one of sections A1 to A23, wherein the RF signal changing second electrical contact is an RF signal receiving second electrical contact that is electrically conductive to the input region, and the plurality of second electrical contacts include RF signal emitting second electrical contacts that are electrically conductive to the output region, and further, a conductive RF signal changing trace is configured to receive an RF electrical signal from the DUT via the RF signal receiving second electrical contact and supply a changed RF electrical signal to the DUT via the RF signal emitting second electrical contact.

[0075] A26. A space transformer as described in any one of paragraphs A1 to A25, wherein the RF electrical signal modification structure includes or is a coupler configured to receive an RF electrical signal from the DUT in the form of a first RF electrical signal, receive a second RF electrical signal from the DUT, and combine the first RF electrical signal and the second RF electrical signal to generate a modified RF electrical signal in the form of a first modified RF electrical signal and a second modified RF electrical signal.

[0076] A27. A space transformer as described in Section A26, wherein the space transformer is configured such that the RF electrical signal changing structure receives a first RF electrical signal from the DUT via a corresponding RF signal receiving second electrical contact from among a plurality of second electrical contacts, and receives a second RF electrical signal from the DUT via another corresponding RF signal receiving second electrical contact from among a plurality of second electrical contacts.

[0077] A28. A space transformer as described in Section A26 or A27, wherein the space transformer is configured to return a first modified RF electrical signal and a second modified RF electrical signal to the DUT or the corresponding DUT contact pad of the DUT.

[0078] A29. A space transformer as described in any one of paragraphs A26 to A28, wherein the space transformer is configured such that the RF electrical signal modification structure returns a first modified RF electrical signal to the DUT via a corresponding RF signal emitting second electrical contact from among a plurality of second electrical contacts, and returns a second modified RF electrical signal to the DUT via another corresponding RF signal emitting second electrical contact from among a plurality of second electrical contacts.

[0079] In the space transformer described in any one of the sections A26 to A29 of section A30, the coupler is: (i) Capacitive interaction between the first RF electrical signal and the second RF electrical signal, (ii) Inductive interaction between the first RF electrical signal and the second RF electrical signal, and (iii) Electric field interaction between the first RF electrical signal and the second RF electrical signal A space transformer configured to couple a first RF electrical signal and a second RF electrical signal together, comprising at least one of the following.

[0080] A31. A space transformer according to any one of paragraphs A26 to A30, wherein the coupler includes a first transmission line configured to carry a first RF electrical signal and a second transmission line configured to carry a second RF electrical signal, wherein the first and second transmission lines are positioned relatively close to each other to facilitate coupling of the first RF electrical signal and the second RF electrical signal.

[0081] A32. A space transformer described in any one of paragraphs A26 to A31, wherein the coupler includes or is a directional coupler.

[0082] A33. A space transformer described in any one of paragraphs A26 to A32, wherein the coupler includes or is a branch line coupler.

[0083] A34. A space transformer described in any one of paragraphs A26 to A33, wherein the coupler includes or is an orthogonal hybrid coupler.

[0084] A35. A space transformer described in any one of paragraphs A26 to A34, wherein the coupler includes or is a passive coupler.

[0085] A36. A space transformer described in any one of paragraphs A1 to A35, wherein the RF electrical signal changing structure includes or is a passive RF structure.

[0086] A37. A space transformer as described in any one of paragraphs A1 to A36, wherein the RF electrical signal changing structure includes or is a composite passive RF structure.

[0087] A38. A space transformer as described in any one of paragraphs A1 to A37, wherein the RF electrical signal changing structure includes or is an RF attenuator.

[0088] A39. A space transformer as described in any one of paragraphs A1 to A38, wherein the RF electrical signal changing structure includes or is an RF coupler.

[0089] A40. A space transformer described in any one of paragraphs A1 to A39, wherein the RF electrical signal changing structure includes or is a resistor.

[0090] A41. A space transformer described in any one of paragraphs A1 to A40, wherein the RF electrical signal changing structure includes or is a capacitor.

[0091] A42. A space transformer as described in any one of paragraphs A1 to A41, wherein the RF electrical signal changing structure includes or is an inductor.

[0092] A43. A space transformer described in any one of paragraphs A1 to A42, wherein the RF electrical signal changing structure includes or is a splitter.

[0093] A44. A space transformer as described in any one of A1 to A43, wherein the RF electrical signal changing structure includes or is a surface-mount component mounted on a dielectric.

[0094] A45. A space transformer as described in any one of sections A1 to A44, wherein the RF electrical signal changing structure includes or is an embedded component embedded in the dielectric, and optionally, the RF electrical signal changing structure is formed within the metallized layer of the space transformer.

[0095] A46. A space transformer as described in any one of sections A1 to A45, wherein the space transformer includes any suitable structure, function, and / or feature of any of the space transformers illustrated and / or described herein.

[0096] B1. A probe system configured to test a device under test (DUT), A chuck that defines a support surface configured to support a substrate including a DUT, A probe head assembly including a space transformer as described in any one of sections A1 to A46, It is a signal generation and analysis assembly, (i) supplying test signals to the DUT via a space transformer, and (ii) Receiving the result signal from the DUT via the space transformer A signal generation and analysis assembly configured to perform at least one of the following: Equipped with a probe system.

[0097] In the probe system described in item B2, B1, (i) The probe system includes the DUT, and (ii) The probe system includes a substrate containing the DUT, A probe system which is at least one of the following.

[0098] B3. A probe system in which the substrate is positioned on the support surface of the chuck, as described in item B2.

[0099] B4. A probe system according to any one of items B1 to B3, wherein the chuck includes at least one of a vacuum chuck, a temperature-controlled chuck, and an electrically shielded chuck.

[0100] B5. A probe system in which the probe head assembly comprises a plurality of probes configured to electrically contact the corresponding DUT contact pads of the DUT, in any one of the B1 to B4 sections.

[0101] In the probe system described in section B6, B5, the multiple probes are: (i) defined by a plurality of second electrical contacts, and (ii) A plurality of second electrical contacts are configured to electrically connect the corresponding second electrical contact to the corresponding DUT contact pad. A probe system which is at least one of the following.

[0102] C1. A method for testing a device under test (DUT) using a probe system including a space transformer, The steps include supplying a power signal to the DUT via a space transformer, In response to the supply step, the process includes receiving a radio frequency (RF) electrical signal from the DUT using a space transformer, The step involves modifying an RF electrical signal within a space transformer using the RF electrical signal modification structure of the space transformer, thereby generating a modified RF electrical signal. Methods that include...

[0103] A method according to item C1, further comprising the step of returning a modified RF electrical signal to the DUT via a space transformer.

[0104] A method according to Section C2 of Clause C3, wherein the RF electrical signal is a first RF electrical signal, the modified RF electrical signal is a first modified RF electrical signal, the receiving step comprises receiving a second RF electrical signal from a DUT, and the modifying step comprises modifying the second RF electrical signal using an RF electrical signal modification structure within a space transformer to generate a second modified RF electrical signal.

[0105] A method according to Section C3, wherein the return step includes returning a second modified RF electrical signal to the DUT via a space transformer.

[0106] A method according to Section C5, C3 or C4, wherein the modification step includes coupling a first RF electrical signal and a second RF electrical signal to generate a first modified RF electrical signal and a second modified RF electrical signal.

[0107] A method according to any one of the items C1 to C5, wherein the space transformer comprises any suitable structure, function, and / or feature of a space transformer described in any one of the items A1 to A46 or a probe system described in item B6. [Industrial applicability]

[0108] The space transformers, probe systems, and methods disclosed herein are applicable to the integrated circuit device manufacturing and testing industries.

[0109] The above disclosure is considered to encompass several distinct inventions having independent utility. Although each of these inventions is disclosed in a preferred form, numerous modifications are possible, so the specific embodiments disclosed and illustrated herein should not be considered in a restrictive sense. The subject matter of the present invention includes all novel and non-obvious combinations and subcombinations of the various elements, features, functions, and / or characteristics disclosed herein. Similarly, where a claim describes "one" or "first" element or its equivalent, such claim should be understood to include incorporating one or more of the above elements, and not to require or exclude two or more of the above elements.

[0110] The following claims are intended to specifically indicate novel and non-obvious particular combinations and subcombinations covering one of the disclosed inventions. Inventions embodied in other combinations and subcombinations of features, functions, elements, and / or properties may be claimed by amendment of these claims or by introducing new claims in this application or a related application. Such amended or new claims shall be deemed to be included in the subject matter of the inventions of this disclosure, regardless of whether they cover different inventions or the same invention, and regardless of whether their scope differs, broaders, narrows, or is equal to that of the original claims.

Claims

1. A space transformer configured for use in a probe system to facilitate electrical conductivity with a device under test (DUT), Dielectrics and A plurality of first electrical contacts supported by the dielectric and arranged at least one first pitch interval, A plurality of second electrical contacts supported by the dielectric and arranged at at least one second pitch interval smaller than the at least one first pitch interval, A plurality of conductive signal transmission traces supported by the dielectric, each conductive signal transmission trace extending between a corresponding first electrical contact among the plurality of first electrical contacts and a corresponding second electrical contact among the plurality of second electrical contacts, thereby electrically interconnecting the two, A conductive high-frequency (RF) signal changing trace is electrically connected to the RF signal changing second electrical contacts of the plurality of second electrical contacts and is configured to electrically connect to the DUT and carry the RF electrical signal, An RF electrical signal modification structure is electrically connected to the conductive RF signal modification trace, and is configured to receive the RF electrical signal from the input region of the conductive RF signal modification trace and emit the modified RF electrical signal to the output region of the conductive RF signal modification trace, the RF electrical signal modification structure includes a coupler configured to receive the RF electrical signal in the form of a first RF electrical signal from the DUT, receive a second RF electrical signal from the DUT, and combine the first RF electrical signal and the second RF electrical signal to generate the modified RF electrical signal in the form of a first modified RF electrical signal and generate a second modified RF electrical signal, and Equipped with, The aforementioned coupler is, (i) coupling between the first RF electrical signal and the second RF electrical signal via magnetic induction, and (ii) coupling between the first RF electrical signal and the second RF electrical signal via an electric field At least one of the following is configured to couple the first RF electrical signal and the second RF electrical signal together: The coupling via the electric field includes coupling via capacitance, in a space transformer.

2. A space transformer configured for use in a probe system to facilitate electrical conductivity with a device under test (DUT), Dielectrics and A plurality of first electrical contacts supported by the dielectric and arranged at least one first pitch interval, A plurality of second electrical contacts supported by the dielectric and arranged at at least one second pitch interval smaller than the at least one first pitch interval, A plurality of conductive signal transmission traces supported by the dielectric, each conductive signal transmission trace extending between a corresponding first electrical contact among the plurality of first electrical contacts and a corresponding second electrical contact among the plurality of second electrical contacts, thereby electrically interconnecting the two, A conductive high-frequency (RF) signal changing trace is electrically connected to the RF signal changing second electrical contacts of the plurality of second electrical contacts and is configured to electrically connect to the DUT and carry the RF electrical signal, An RF electrical signal modification structure is electrically connected to the conductive RF signal modification trace, and is configured to receive the RF electrical signal from the input region of the conductive RF signal modification trace and emit the modified RF electrical signal to the output region of the conductive RF signal modification trace, the RF electrical signal modification structure includes a coupler configured to receive the RF electrical signal in the form of a first RF electrical signal from the DUT, receive a second RF electrical signal from the DUT, and combine the first RF electrical signal and the second RF electrical signal to generate the modified RF electrical signal in the form of a first modified RF electrical signal and generate a second modified RF electrical signal, and Equipped with, The coupler is a space transformer comprising a first transmission line configured to carry the first RF electrical signal and a second transmission line configured to carry the second RF electrical signal, wherein the first and second transmission lines are positioned in close proximity to each other to facilitate coupling of the first RF electrical signal and the second RF electrical signal.

3. A space transformer according to claim 1, wherein the space transformer is configured such that the RF electrical signal changing structure receives the first RF electrical signal from the DUT via a corresponding RF signal receiving second electrical contact among the plurality of second electrical contacts, and receives the second RF electrical signal from the DUT via another corresponding RF signal receiving second electrical contact among the plurality of second electrical contacts.

4. A space transformer according to claim 1, wherein the space transformer is configured to return the first modified RF electrical signal and the second modified RF electrical signal to the corresponding DUT contact pad of the DUT.

5. A space transformer according to claim 1, wherein the space transformer is configured such that the RF electrical signal modification structure returns the first modified RF electrical signal to the DUT via a corresponding RF signal emission second electrical contact from among the plurality of second electrical contacts, and returns the second modified RF electrical signal to the DUT via another corresponding RF signal emission second electrical contact from among the plurality of second electrical contacts.

6. A space transformer according to claim 1, wherein the coupler includes a first transmission line configured to carry the first RF electrical signal and a second transmission line configured to carry the second RF electrical signal, wherein the first transmission line and the second transmission line are positioned in close proximity to each other to facilitate coupling of the first RF electrical signal and the second RF electrical signal.

7. A space transformer according to claim 1, wherein the coupler includes a directional coupler.

8. A space transformer according to claim 1, wherein the coupler includes a branch line coupler.

9. A space transformer according to claim 1, wherein the coupler includes a 90-degree hybrid coupler.

10. A space transformer according to claim 1, wherein the coupler includes a passive coupler.

11. A space transformer according to claim 1, wherein the dielectric is a rigid dielectric.

12. A space transformer according to claim 1, wherein the dielectric is a flexible dielectric.

13. A space transformer according to claim 1, wherein the dielectric is a dielectric film.

14. A space transformer according to claim 1, wherein the plurality of first electrical contacts include a plurality of first electrical contact pads.

15. A space transformer according to claim 1, wherein the plurality of first electrical contacts include a plurality of first electrical contact chips.

16. A space transformer according to claim 1, wherein the plurality of second electrical contacts include a plurality of second electrical contact pads.

17. A space transformer according to claim 1, wherein the plurality of second electrical contacts include a plurality of probe tips.

18. A space transformer according to claim 1, wherein the plurality of second electrical contacts are configured to directly contact the DUT in order to facilitate electrical conduction between the probe system and the DUT.

19. A space transformer according to claim 1, wherein the space transformer includes a plurality of conductive RF signal modification traces and a plurality of corresponding RF electrical signal modification structures.

20. A space transformer according to claim 1, wherein the at least one first pitch interval is at least a threshold pitch interval multiple of the at least one second pitch interval, and the threshold pitch interval multiple is 2.

21. In the space transformer according to claim 1, the RF electrical signal changing structure is (i) Surface mount components mounted on the dielectric, (ii) Built-in components embedded in the dielectric, and (iii) Structure formed by the metallized layer of the space transformer A space transformer that includes at least one of the following.

22. A probe system configured to test a device under test (DUT), A chuck that defines a support surface configured to support the substrate including the DUT, A probe head assembly comprising a space transformer according to any one of claims 1 to 21, This is a signal generation and analysis assembly. (i) supplying test signals to the DUT via a space transformer, and (ii) Receiving the result signal from the DUT via the space transformer A signal generation and analysis assembly configured to perform at least one of the following: Equipped with a probe system.

23. In the probe system according to claim 22, the probe head assembly includes a plurality of probes configured to electrically contact the corresponding DUT contact pads of the DUT, the plurality of probes (i) including a plurality of second electrical contacts, (ii) The plurality of second electrical contacts are configured to electrically connect the corresponding second electrical contact to the corresponding DUT contact pad. A probe system which is at least one of the following.

24. A method for testing a device under test (DUT) using a probe system including a space transformer, The steps include supplying a power signal to the DUT via the space transformer, In response to the supply step, the space transformer is used to receive a radio frequency (RF) electrical signal from the DUT, The steps include: modifying the RF electrical signal within the space transformer using the RF electrical signal modification structure of the space transformer, thereby generating the modified RF electrical signal; and The method includes the step of returning the modified RF electrical signal to the DUT via the space transformer, The RF electrical signal is a first RF electrical signal, the modified RF electrical signal is a first modified RF electrical signal, the receiving step includes receiving a second RF electrical signal from the DUT, and the modifying step includes modifying the second RF electrical signal using the RF electrical signal modification structure within the space transformer to generate a second modified RF electrical signal. The modification step includes coupling the first RF electrical signal and the second RF electrical signal together to generate the first modified RF electrical signal and the second modified RF electrical signal, The aforementioned coupler is, (i) coupling between the first RF electrical signal and the second RF electrical signal via magnetic induction, and (ii) coupling between the first RF electrical signal and the second RF electrical signal via an electric field At least one of the following is configured to couple the first RF electrical signal and the second RF electrical signal together: The coupling via the electric field includes a method that includes coupling via capacitance.

25. A method according to claim 24, wherein the return step includes returning the second modified RF electrical signal to the DUT via the space transformer.

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