wiring

Abstract

The wiring material can be transformed into various shapes. [Solution] The wiring material 100 comprises a base material 30 that is long and flexible in the direction of the Y axis, and a plurality of wirings 40 that are installed on the base material 30 and extend in the direction of the Y axis. In a first region of the base material 30, which is a part in the direction of the Y axis, a plurality of slits 32 are formed in parallel in the direction of the X axis that intersects the Y axis, along the direction of the Y axis.

Description

Technical Field

[0006] , , ,

[0005] , , , , ,

[0001] The present disclosure relates to a wiring material.

Background Art

[0002] There has conventionally been proposed a wiring material in which a plurality of wirings are formed on a flexible base material. For example, Patent Document 1 discloses a flexible printed circuit board including a flexible base material and a conductor layer formed on the surface of the base material.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Conventional flexible printed circuit boards can be easily bent in the out-of-plane direction (the direction intersecting the in-plane direction), while deformation in other modes such as in-plane bending or torsional deformation, for example, is not easy. In view of the above circumstances, one aspect of the present disclosure aims to deform the wiring material into various shapes.

Means for Solving the Problems

[0005] A wiring material according to one aspect of the present disclosure is a wiring material including a base material that is long in a first direction and has flexibility, and a plurality of wirings that are installed on the base material and extend in the first direction, wherein in a first region that is a part of the base material in the first direction, a plurality of slits along the first direction are formed in parallel in a second direction intersecting the first direction.

Brief Description of the Drawings

[0006] [Figure 1] It is a plan view of a wiring material according to a basic form. [Figure 2]This is a cross-sectional view of line aa in Figure 1. [Figure 3] This is a plan view of the wiring material in embodiment A1 of the first embodiment. [Figure 4] Figure 3 is a cross-sectional view of line bb. [Figure 5] This is a plan view illustrating the deformed state of wiring material. [Figure 6] This is a plan view illustrating the deformed state of wiring material. [Figure 7] This is a plan view illustrating the deformed state of wiring material. [Figure 8] This is a plan view illustrating the deformed state of wiring material. [Figure 9] This is a plan view illustrating the deformed state of wiring material. [Figure 10] This is an explanatory diagram of a method for imparting a bend to wiring materials. [Figure 11] This is a perspective view of a wiring material manufacturing apparatus. [Figure 12] This is a plan view of the wiring material in embodiment A2 of the first embodiment. [Figure 13] This is a plan view of the wiring material in embodiment A3 of the first embodiment. [Figure 14] This is a plan view of the wiring material in embodiment A4 of the first embodiment. [Figure 15] This is a plan view of the wiring material in embodiment A5 of the first embodiment. [Figure 16] This is an enlarged plan view of the end of the slit in aspect A6 of the first embodiment. [Figure 17] This is a magnified plan view of the end of the slit in a modified example of embodiment A6. [Figure 18] This is a magnified plan view of the end of the slit in a modified example of embodiment A6. [Figure 19] This is a magnified plan view of the end of the slit in a modified example of embodiment A6. [Figure 20] This is an enlarged plan view of the end of the slit in aspect A7 of the first embodiment. [Figure 21]It is a plan view showing an enlarged end portion of a slit in a modification of Aspect A7. [Figure 22] It is a plan view showing an enlarged end portion of a slit in a modification of Aspect A7. [Figure 23] It is a plan view showing an enlarged end portion of a slit in Aspect A8 of the first embodiment. [Figure 24] It is a plan view showing an enlarged end portion of a slit in a modification of Aspect A8. [Figure 25] It is a plan view showing an enlarged end portion of a slit in a modification of Aspect A8. [Figure 26] It is a plan view showing an enlarged end portion of a slit in a modification of Aspect A8. [Figure 27] It is a plan view showing an enlarged end portion of a slit in a modification of Aspect A8. [Figure 28] It is an explanatory view of a stress measurement method regarding the effect of the fracture suppression structure. [Figure 29] It is a measurement result of the stress distribution in the wiring material. [Figure 30] It is a plan view showing an enlarged end portion of a slit in Aspect A9 of the first embodiment. [Figure 31] It is a plan view of the wiring material in Aspect A10. [Figure 32] It is a plan view of the wiring material in Aspect A10. [Figure 33] It is a plan view of the wiring material in Aspect A10. [Figure 34] It is a plan view of the wiring material in Aspect A10. [Figure 35] It is a plan view of the wiring material in Aspect A10. [Figure 36] It is a plan view of the wiring material in Aspect A10. [Figure 37] It is a plan view of the wiring material in Aspect A10. [Figure 38] It is a plan view of the wiring material in Aspect B1 of the second embodiment. [Figure 39] It is an example of use of the wiring material according to Aspect B1. [Figure 40]This is a plan view of the wiring material in embodiment B2 of the second embodiment. [Figure 41] Figure 40 is a cross-sectional view of the cc line. [Figure 42] This is an explanatory diagram of the process for forming the covering portion. [Figure 43] This is a plan view of the wiring material in embodiment B3 of the second embodiment. [Figure 44] This is an example of the use of wiring material according to embodiment B3. [Figure 45] This is an example of the use of wiring material according to embodiment B3. [Figure 46] This is a partial plan view of the wiring material in embodiment B4 of the second embodiment. [Figure 47] This is a partial plan view of the wiring material in embodiment B4 of the second embodiment. [Figure 48] This is a partial plan view of the wiring material in embodiment B5 of the second embodiment. [Figure 49] This is a partial plan view of the wiring material in embodiment B5 of the second embodiment. [Figure 50] This is a side view of the wiring material in embodiment C1 of the third embodiment. [Figure 51] This is an explanatory diagram of the process for manufacturing wiring materials according to embodiment C1. [Figure 52] This is an example of the use of wiring material according to embodiment C1. [Figure 53] This is a plan view of the wiring material in embodiment C2 of the third embodiment. [Figure 54] This is an explanatory diagram of a method for forming the retaining member of the third embodiment. [Figure 55] This is a plan view of the wiring material in embodiment D1 of the fourth embodiment. [Figure 56] This is a plan view of the wiring material in a state where it has been cut apart, according to embodiment D1. [Figure 57] Figure 55 is a cross-sectional view of the line dd. [Figure 58] This is an explanatory diagram regarding the mounting of wiring materials according to embodiment D1. [Figure 59] This is an explanatory diagram of the effects of the fourth embodiment. [Figure 60]This is an explanatory diagram of the effects of the fourth embodiment. [Figure 61] This is an explanatory diagram of the effects of the fourth embodiment. [Figure 62] This is a plan view of the wiring material in embodiment D2 of the fourth embodiment. [Figure 63] This is a plan view focusing on the low-strength portion in embodiment D3 of the fourth embodiment. [Figure 64] This is a plan view of the low-strength portion in a modified example of embodiment D3. [Figure 65] This is a plan view of the wiring material in embodiment D4 of the fourth embodiment. [Figure 66] This is a cross-sectional view of the wiring material in embodiment D5 of the fourth embodiment. [Figure 67] This is an example of a low-strength section in the fourth embodiment. [Figure 68] This is an example of a low-strength section in the fourth embodiment. [Figure 69] This is an example of a low-strength section in the fourth embodiment. [Figure 70] This is an example of a low-strength section in the fourth embodiment. [Figure 71] This is an example of a low-strength section in the fourth embodiment. [Figure 72] This is an enlarged plan view of the end of the low-strength portion in aspect D6 of the fourth embodiment. [Figure 73] This is an enlarged plan view of the end of the low-strength portion in a modified example of embodiment D6. [Figure 74] This is an enlarged plan view of the end of the low-strength portion in a modified example of embodiment D6. [Figure 75] This is an enlarged plan view of the end of the low-strength portion in a modified example of embodiment D6. [Figure 76] This is an enlarged plan view of the end of the low-strength portion in aspect D7 of the fourth embodiment. [Figure 77] This is a plan view of the low-strength portion in a modified example of embodiment D7. [Figure 78] This is a plan view of the low-strength portion in a modified example of embodiment D7. [Figure 79]This is an enlarged plan view of the end of the low-strength portion in aspect D8 of the fourth embodiment. [Figure 80] This is an enlarged plan view of the end of the low-strength portion in a modified example of embodiment D8. [Figure 81] This is an enlarged plan view of the end of the low-strength portion in a modified example of embodiment D8. [Figure 82] This is an enlarged plan view of the end of the low-strength portion in a modified example of embodiment D8. [Figure 83] This is an enlarged plan view of the end of the low-strength portion in a modified example of embodiment D8. [Figure 84] This is an enlarged plan view of the end of the low-strength portion in aspect D9 of the fourth embodiment. [Figure 85] This is a plan view of the wiring material in embodiment D10. [Figure 86] This is a plan view of the wiring material in embodiment D10. [Figure 87] This is a plan view of the wiring material in embodiment D10. [Figure 88] This is a plan view of the wiring material in embodiment D10. [Figure 89] This is a plan view of the wiring material in embodiment D10. [Figure 90] This is a plan view of the wiring material in embodiment D10. [Figure 91] This is a plan view of the wiring material in embodiment D10. [Modes for carrying out the invention]

[0007] The embodiments for implementing this disclosure will be described with reference to the drawings. Note that the dimensions and scale of the elements in each drawing may differ from those of the actual product. Furthermore, the embodiments described below are illustrative examples of embodiments that may be envisioned when implementing this disclosure. Therefore, the scope of this disclosure is not limited to the embodiments exemplified below.

[0008] Basic configuration of wiring material 100 Prior to describing the various embodiments of this disclosure, the configuration of the wiring material 100 relating to the basic form of each embodiment (hereinafter referred to as the "basic form") will be described. Each embodiment described below is a form to which the characteristics of the basic form of the wiring material 100 described below are applied.

[0009] Figure 1 is a plan view illustrating the configuration of the wiring material 100 in its basic form, and Figure 2 is a cross-sectional view of a part of line aa in Figure 1. The wiring material 100 is a mounting component (wiring board) for electrically connecting multiple elements. In the following description, we assume three mutually orthogonal axes (X axis, Y axis, and Z axis). The wiring material 100 is a flat wiring material (i.e., a flat cable) formed in a long length along the Y axis. That is, the direction of the Y axis corresponds to the longitudinal direction of the wiring material 100. The direction of the X axis is the short direction (i.e., the width direction) of the wiring material 100. The direction of the Z axis corresponds to the thickness direction of the wiring material 100. In the following description, observing an element from a line of sight along the Z axis is referred to as "plan view". The direction of the Y axis is an example of the "first direction", and the direction of the X axis is an example of the "second direction".

[0010] As illustrated in Figures 1 and 2, the wiring material 100 comprises a base material 30 and a plurality of wires 40. The base material 30 is a flat member that is elongated in the direction of the Y axis and is flexible. The base material 30 of each embodiment includes a first base material 10 and a second base material 20. The first base material 10 and the second base material 20 can be easily deformed (elastically or plastically) by the action of an external force. Specifically, the first base material 10 and the second base material 20 are composed of a flat plate or film parallel to the XY plane.

[0011] The first substrate 10 and the second substrate 20 are formed from insulating materials. Examples of insulating materials used for the first substrate 10 and the second substrate 20 include polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), or polyvinyl chloride (PVC). However, the materials of the first substrate 10 and the second substrate 20 are not limited to the above examples and may be changed as desired. Furthermore, the materials of the first substrate 10 and the second substrate 20 may be the same or different.

[0012] The first base material 10 is a plate-like member including an inner surface S11 and an outer surface S12 located on opposite sides of each other. The inner surface S11 is the surface of the first base material 10 facing in the negative direction of the Z axis. The outer surface S12 is the surface of the first base material 10 facing in the positive direction of the Z axis. The second base material 20 is a plate-like member including an inner surface S21 and an outer surface S22 located on opposite sides of each other. The inner surface S21 is the surface of the second base material 20 facing in the positive direction of the Z axis. The outer surface S22 is the surface of the second base material 20 facing in the negative direction of the Z axis.

[0013] The first base material 10 and the second base material 20 are joined with a gap between them. The first base material 10 and the second base material 20 are joined with their inner surfaces S11 and S21 facing each other. The width of the first base material 10 and the width of the second base material 20 are substantially the same. Therefore, in a plan view, each edge of the first base material 10 and each edge of the second base material 20 overlap each other. Multiple wirings 40 and joining materials 31 are installed between the first base material 10 and the second base material 20. That is, multiple wirings 40 and joining materials 31 are installed inside the base material 30 composed of the first base material 10 and the second base material 20.

[0014] As illustrated in Figure 1, the region of the second substrate 20 that includes the end Ea2 located in the positive direction of the Y-axis (hereinafter referred to as "end region 21a") extends in the positive direction of the Y-axis from the end Ea1 located in the positive direction of the Y-axis of the first substrate 10. On the other hand, the region of the second substrate 20 that includes the end Eb2 located in the negative direction of the Y-axis (hereinafter referred to as "end region 21b") extends in the negative direction of the Y-axis from the end Eb1 located in the negative direction of the Y-axis of the first substrate 10. In other words, end regions 21a and 21b of the second substrate 20 are exposed from the first substrate 10.

[0015] The multiple wirings 40 are linear wiring materials formed from a low-resistance conductive material. Examples of conductive materials used to form each wiring 40 include, for example, a single metal such as copper or aluminum, or an alloy containing a low-resistance metal (e.g., copper or aluminum). The multiple wirings 40 may be thin-film conductive patterns formed by, for example, patterning a conductive film, or they may be flat wiring materials that can maintain their shape individually. In Figure 1, hatching has been added to the wirings 40 for convenience. The same applies to the following drawings.

[0016] Each of the multiple wires 40 is a conductor extending linearly in the direction of the Y-axis. The width of each wire 40 is substantially the same throughout the entire wire 40. The multiple wires 40 are installed in parallel with spacing between them in the direction of the X-axis. The spacing between each wire 40 is substantially the same throughout the entire wire 40. However, the shape and position of each wire 40 may be arbitrarily changed.

[0017] As illustrated in Figure 2, multiple wires 40 are interposed between the first substrate 10 and the second substrate 20. Specifically, one surface of each wire 40 contacts the inner surface S11 of the first substrate 10, and the other surface of each wire 40 contacts the inner surface S21 of the second substrate 20. Each wire 40 is formed, for example, on either the inner surface S11 of the first substrate 10 or the inner surface S21 of the second substrate 20.

[0018] As illustrated in Figure 1, each wiring 40 extends in the direction of the Y-axis across the end region 21a and end region 21b of the second base material 20. The end 41a of each wiring 40 located in the positive direction of the Y-axis is located in the end region 21a of the second base material 20 in a plan view. That is, the end 41a extends in the positive direction of the Y-axis from the end Ea1 of the first base material 10 in a plan view. On the other hand, the end 41b of each wiring 40 located in the negative direction of the Y-axis is located in the end region 21b of the second base material 20 in a plan view. That is, the end 41b extends in the negative direction of the Y-axis from the end Eb1 of the first base material 10 in a plan view.

[0019] The bonding material 31 is an insulating adhesive for joining the first substrate 10 and the second substrate 20. Specifically, various adhesives such as acrylic resin, epoxy resin, phenolic resin, silicone resin, or polyurethane resin are exemplified as materials for the bonding material 31. The bonding material 31 may be omitted.

[0020] As illustrated in Figure 2, the bonding material 31 is filled between the first base material 10 and the second base material 20, in the spacing between each adjacent wiring 40 in the direction of the X axis. The first base material 10 and the second base material 20 are joined together by the bonding material 31 joining the inner surface S11 of the first base material 10 and the inner surface S21 of the second base material 20. It should be noted that configurations in which the bonding material 31 is interposed between the inner surface S11 of the first base material 10 and each wiring 40, or between the inner surface S21 of the second base material 20 and each wiring 40, are also conceivable.

[0021] As described above, the wiring material 100 is flat and deformable. Therefore, it has the advantage of being easier to lighten compared to a wire harness, for example, which is composed of bundles of multiple wires, and also reduces the space required for installation. Considering these characteristics, the wiring material 100 according to each embodiment of the present disclosure can be suitably adopted as a substitute for a wire harness in a mobile device such as an electric vehicle.

[0022] The configuration of the wiring material 100 in the basic form is as described above. The embodiments illustrated below are forms to which various features are applied to the wiring material 100 in the basic form. In the embodiments illustrated below, elements similar to those of the wiring material 100 in the basic form illustrated in Figures 1 and 2 are given the same reference numerals as in Figures 1 and 2.

[0023] A: First Embodiment A-1: Pattern A1 Figure 3 is a plan view of the wiring material 100 in embodiment A1 of the first embodiment, and Figure 4 is a cross-sectional view of line bb in Figure 3.

[0024] As illustrated in Figures 3 and 4, the base material 30 in the wiring material 100 of the first embodiment includes a base region Qa (Qa1, Qa2) and a deformation region Qb. The deformation region Qb is a part of the base material 30 in the direction of the Y axis. Specifically, the deformation region Qb is the region of the base material 30 located between both ends. The base region Qa is the region of the base material 30 other than the deformation region Qb in the direction of the Y axis. The base region Qa and the deformation region Qb are arranged alternately in the direction of the Y axis. Specifically, base region Qa1 is located in the positive direction of the Y axis when viewed from the deformation region Qb, and base region Qa2 is located in the negative direction of the Y axis when viewed from the deformation region Qb. That is, the deformation region Qb is located between base region Qa1 and base region Qa2.

[0025] Multiple slits 32 are formed in the deformation region Qb of the base material 30. As illustrated in Figure 4, each of the multiple slits 32 is a through-hole (cut) of a predetermined width that penetrates the base material 30 in the Z-axis direction. Specifically, each slit 32 penetrates the first base material 10, the second base material 20, and the joining material 31. As illustrated in Figure 3, each slit 32 extends linearly in the Y-axis direction in a plan view, similar to each wiring 40. Specifically, the slits 32 are located within the spacing between two adjacent wirings 40 in the X-axis direction. On the other hand, no slits 32 are formed in the base region Qa.

[0026] The method for forming the slits 32 in the substrate 30 is arbitrary. For example, each slit 32 may be formed by cutting using a cutting tool such as a grinder or cutter. Alternatively, each slit 32 may be formed by laser processing, for example, by irradiating the substrate 30 with a laser.

[0027] Multiple slits 32 are formed in parallel with a gap between them in the direction of the X-axis. The spacing between adjacent slits 32 in the direction of the X-axis is substantially the same throughout the entire slit 32. In a plan view, one wire is located between two adjacent slits 32 in the direction of the X-axis. Multiple wires 40 may be located between two adjacent slits 32.

[0028] Each of the multiple slits 32 includes an end Fa located in the positive direction of the Y-axis and an end Fb located in the negative direction of the Y-axis. The position of end Fa in the direction of the Y-axis is common to all of the multiple slits 32. Similarly, the position of end Fb in the direction of the Y-axis is common to all of the multiple slits 32.

[0029] As described above, in the first embodiment (Aspect A1), a plurality of slits 32 are formed in the deformation region Qb of the base material 30. In this configuration, the mechanical strength of the deformation region Qb of the base material 30 is lower than the mechanical strength of the other parts of the base material 30 (base region Qa). Therefore, according to the first embodiment, it is possible to deform the wiring material 100 into various shapes in the deformation region Qb, as illustrated below.

[0030] As illustrated in Figure 5, the wiring material 100 can be twisted in the deformation region Qb. Specifically, the base region Qa1 of the base material 30, which is located in the positive direction of the Y-axis relative to the deformation region Qb, can rotate about an axis parallel to the Y-axis with respect to the base region Qa2 of the base material 30, which is located in the negative direction of the Y-axis relative to the deformation region Qb. As described above, according to the first embodiment, by deforming the deformation region Qb of the base material 30, a torsional deformation about an axis along the Y-axis can be easily imparted to the wiring material 100.

[0031] As illustrated in Figure 6, it is possible to twist the wiring material 100 together in the deformation region Qb. Specifically, the width of the deformation region Qb of the base material 30 can be reduced by comparing it with the width of the base region Qa of the base material 30. That is, the wiring material 100 can be bundled in the deformation region Qb. With the width of the deformation region Qb reduced as described above, as illustrated in Figure 7, the wiring material 100 can be deformed along the XY plane (in-plane direction) with the deformation region Qb as the boundary. Specifically, it is possible to easily bend the wiring material 100 in the XY plane within the deformation region Qb so that the base region Qa1 and the base region Qa2 form a predetermined angle.

[0032] As illustrated in Figure 8, it is also possible to bend the wiring material 100 in the deformation region Qb, and to flex the wiring material 100 such that one part of the bend curve of the wiring material 100 forms a predetermined angle in the in-plane direction with respect to the other part.

[0033] As illustrated in Figure 9, a bending tendency 38 may be imparted to the deformation region Qb. The bending tendency 38 is a state in which deformation remains in the wiring material 100 even after the external force is removed following deformation (bending) of the wiring material 100 due to an external force, and refers to long-term or steady deformation caused by, for example, plastic deformation or viscoelastic deformation. The angle of the bending tendency 38 is, for example, 60° or more and 120° or less (more preferably 80° or more and 100° or less).

[0034] Figure 9 illustrates a configuration in which a bend crease 38 is formed at one location on the wiring material 100, but bend creases 38 may be formed at multiple locations on the wiring material 100. As a result of forming bend creases 38 at multiple locations on the wiring material 100, when the wiring material 100 is bent, the deformation is distributed to each bend crease 38, and consequently, the in-plane tensile deformation occurring throughout the wiring material 100 may be reduced. With the above configuration, the wiring material 100 can be easily deformed in various directions.

[0035] As illustrated in Figure 9, the portion of the deformation region Qb other than the portion to which the bending tendency 38 is applied may be deformed into any shape (e.g., curved). The deformation region Qb curves starting from the bending tendency 38. Therefore, the configuration in which the bending tendency 38 is formed in the deformation region Qb has the advantage of suppressing excessive deformation of the wiring material 100 (especially excessive expansion of the width of the wiring material 100) compared to the configuration in which the bending tendency 38 is not formed.

[0036] Figure 10 is an explanatory diagram of a method for imparting a bend crease 38 to a wiring material 100. A jig 38a and a jig 38b are used to form the bend crease 38. Jig 38a has a protrusion that corresponds to the recess (valley fold portion) of the bend crease 38, and jig 38b has a recess that corresponds to the protrusion (mountain fold portion) of the bend crease 38. By clamping and holding the deformed region Qb of the wiring material with jig 38a and jig 38b, a bend crease 38 is formed in the deformed region Qb. Note that in the process of forming the bend crease 38, one or both of jig 38a and jig 38b may be heated.

[0037] Figure 11 is a perspective view of a manufacturing apparatus 80 for manufacturing wiring material 100 according to the first embodiment. As illustrated in Figure 11, the manufacturing apparatus 80 comprises a conductive roll 81, a conveying roll 82, a first base material roll 831, a second base material roll 832, a first processing roller 841, a second processing roller 842, a first recovery roller 851, a second recovery roller 852, a first support roller 861, a second support roller 862, a first crimping roller 871, a second crimping roller 872, and a third crimping roller 873.

[0038] The conductive roll 81 is a cylindrical member on which a strip-shaped conductive sheet 81a, which is the material for the wiring 40, is wound around a rotating shaft. The conveying roll 82 is a cylindrical member on which a strip-shaped conveying sheet 82a for conveying the wiring 40 is wound around a rotating shaft. The first crimping rollers 871 are a pair of rollers that crimp the conductive sheet 81a, which is fed out from the conductive roll 81, and the conveying sheet 82a, which is fed out from the conveying roll 82.

[0039] The first processing roller 841 includes a pair of rollers on which multiple cutting blades are formed on the outer surface, spaced apart in the axial direction and running circumferentially. The conductive sheet 81a, placed on the conveying sheet 82a, is divided into multiple linear portions as it passes through the first processing roller 841. The portions of the conductive sheet 81a other than the wiring 40 are recovered by the first recovery roller 851 via the first support roller 861. The multiple wirings 40 are conveyed while remaining on the conveying sheet 82a.

[0040] The first base material roll 831 is a cylindrical member on which the first base material 10 is wound around a rotating shaft. Multiple wires 40 conveyed together with the conveying sheet 82a are pressed onto the first base material 10 being delivered from the first base material roll 831 by passing through the second crimping roller 872. The second crimping roller 872 includes a pair of rollers that press the first base material 10 and the multiple wires 40 in the thickness direction. Downstream of the first crimping roller 871, the conveying sheet 82a is recovered by the second recovery roller 852 via the second support roller 862.

[0041] The second base material roll 832 is a cylindrical member on which the second base material 20 is wound around a rotating shaft. The first base material 10 and the multiple wirings 40 are pressed onto the second base material 20 as it is fed out from the second base material roll 832 by passing through the third crimping roller 873. The third crimping roller 873 includes a pair of rollers that press the first base material 10, the multiple wirings 40, and the second base material 20 in the thickness direction. The wiring material 100 is manufactured when the multiple wirings 40 are installed on the base material 30 (first base material 10 and second base material 20).

[0042] The second processing roller 842 includes a pair of rollers on which multiple cutting blades are formed on the outer surface, spaced apart in the axial direction and running circumferentially. As the wiring material 100 processed by the third crimping roller 873 passes through the second processing roller 842, multiple slits 32 running along the Y-axis are formed in the deformation region Qb of the base material 30.

[0043] A-2: Pattern A2 Figure 12 is a plan view of the wiring material 100 in embodiment A2 of the first embodiment. As illustrated in Figure 12, in embodiment A2, as in embodiment A1, a plurality of slits 32 are formed in the deformation region Qb of the base material 30. In the wiring material 100 of embodiment A2, the position of the end Fa of each slit 32 in the direction of the Y axis differs for each slit 32. Specifically, the slit 32 that is located in the positive direction of the X axis has its end Fa located in the negative direction of the Y axis. For example, if we focus on any one slit 32 among the plurality of slits 32 (hereinafter referred to as "first slit 32a") and a slit 32 other than the first slit 32a (hereinafter referred to as "second slit 32b"), the position of the end Fa of the first slit 32a and the end Fa of the second slit 32b are different in the direction of the Y axis.

[0044] Similarly, the position of the end Fb of each slit 32 in the Y-axis direction differs for each slit 32. Specifically, the slit 32 located in the positive X-axis direction has its end Fb located in the negative Y-axis direction. That is, the end Fb of the first slit 32a and the end Fb of the second slit 32b are in different positions in the Y-axis direction. The length of the multiple slits 32 in the Y-axis direction is constant.

[0045] As illustrated above, in embodiment A2, the position of the end F(Fa,Fb) in the direction of the Y axis differs for each slit 32, making it easy to deform the wiring material 100 into a predetermined shape in the deformation region Qb. For example, in the embodiment illustrated in Figure 12, the base region Qa can be easily bent in the direction of the arrow relative to the deformation region Qb in the XY plane. For example, the base material 30 can be easily deformed such that the portion of each slit 32 where the end Fa is located in the negative direction of the Y axis is located on the inside of the bend, and the portion of each slit 32 where the end Fb is located in the positive direction of the Y axis is located on the inside of the bend.

[0046] A-3: Pattern A3 Figure 13 is a plan view of the wiring material 100 in embodiment A3 of the first embodiment. As illustrated in Figure 13, in embodiment A3, as in embodiment A1, a plurality of slits 32 are formed in the deformation region Qb of the base material 30. In the wiring material 100 of embodiment A3, the length of each slit 32 in the Y-axis direction differs. Specifically, the slits 32 closer to the edge of the base material 30 are longer. That is, the length of the first slit 32a and the length of the second slit 32b are different.

[0047] As described above, due to the differing lengths of each slit 32, in embodiment A3, as in embodiment A2, the positions of the ends (Fa, Fb) of each slit 32 in the Y-axis direction differ for each slit 32. Specifically, the closer a slit 32 is to the edge of the base material 30, the more its end Fa is located in the positive direction of the Y-axis. On the other hand, the closer a slit 32 is to the edge of the base material 30, the more its end Fb is located in the negative direction of the Y-axis.

[0048] As illustrated above, in embodiment A3, the length in the Y-axis direction differs for each slit 32, making it easier to deform the wiring material 100 into a specific shape in the deformation region Qb. For example, in the embodiment illustrated in Figure 13, as shown by the arrows, it is easy to reduce the width of the deformation region Qb compared to the base region Qa.

[0049] A-4: Pattern A4 Figure 14 is a plan view of the wiring material 100 in embodiment A4 of the first embodiment. As illustrated in Figure 14, in embodiment A4, as in embodiment A1, a plurality of slits 32 are formed in the deformation region Qb of the base material 30. In the wiring material 100 of embodiment A4, the distance between two adjacent slits 32 in the direction of the X axis changes according to their position in the direction of the X axis. For example, in the configuration illustrated in Figure 14, the distance between two adjacent slits 32 decreases toward the positive direction of the X axis.

[0050] For example, we consider an arbitrary first slit 32a among the multiple slits 32, a second slit 32b adjacent to the first slit 32a, and a third slit 32c adjacent to the second slit 32b on the opposite side from the first slit 32a. That is, the second slit 32b is located between the first slit 32a and the third slit 32c. In embodiment A4, the distance between the first slit 32a and the second slit 32b is different from the distance between the second slit 32b and the third slit 32c. Specifically, the distance between the first slit 32a and the second slit 32b is less than the distance between the second slit 32b and the third slit 32c.

[0051] The number of wires 40 located between two adjacent slits 32 in a plan view may vary depending on the dimension of that interval. Specifically, one wire is formed in the portion where the distance between each slit 32 is narrow, and multiple wires 40 are formed in the portion where the distance between each slit 32 is wide.

[0052] As illustrated above, in embodiment A4, since the spacing between each slit 32 is different, it is easy to deform the wiring material 100 into a specific shape in the deformation region Qb. For example, in the configuration shown in the example of Figure 14, where the spacing between each slit 32 decreases toward the positive direction of the X axis, it is easy to bend each base region Qa (Qa1, Qa2) in the direction of the arrow relative to the deformation region Qb in the XY plane. For example, it is possible to easily deform the base material 30 so that the part of the base material 30 where the spacing between each slit 32 is narrow is located on the inside of the bend.

[0053] A-5: Pattern A5 Figure 15 is a plan view of the wiring material 100 in embodiment A5 of the first embodiment. As illustrated in Figure 15, the base material 30 in embodiment A5 includes a plurality of deformation regions Qb (Qb1, Qb2). Deformation regions Qb1 and Qb2 are different parts of the base material 30 in the direction of the Y axis. Specifically, deformation regions Qb1 and Qb2 are arranged in the direction of the Y axis with a gap between them. A base region Qa3 is interposed between deformation regions Qb1 and Qb2. That is, deformation region Qb1 is located between base region Qa1 and base region Qa3, and deformation region Qb2 is located between base region Qa2 and base region Qa3. As described above, in embodiment A5, a plurality of base regions Qa and a plurality of deformation regions Qb are arranged alternately in the direction of the Y axis.

[0054] Multiple slits 32 are formed in each of the deformation region Qb1 and deformation region Qb2. That is, similar to the deformation region Qb in embodiment A1, in embodiment A5, multiple slits 32 along the Y-axis are formed in parallel in the X-axis direction in each of the deformation region Qb1 and deformation region Qb2.

[0055] As described above, in embodiment A5, since multiple deformable regions Qb are formed on the base material 30, it is possible to deform the wiring material 100 into various shapes in each deformable region Qb. For example, it is possible to twist the deformable region Qb1 of the wiring material 100 as shown in the example in Figure 5, and to bend the deformable region Qb2 as shown in the example in Figure 7.

[0056] A-6: Pattern A6 In the configuration in which a plurality of slits 32 are formed in the base material 30, as in the first embodiment, it is conceivable that cracks may occur in the base material 30 starting from the end F (Fa, Fb) of each slit 32 and extending along the extension of the slit 32. In embodiments A6 to A9 illustrated below, a structure for suppressing fracture of the base material 30 at the end F of each slit 32 (hereinafter referred to as "fracture suppression structure 33") is formed. In the configuration in which the fracture suppression structure 33 is formed at the end F of the slit 32, excessive fracture of the base material 30 starting from the end F of each slit 32 can be suppressed compared to a configuration in which the fracture suppression structure 33 is not formed at the end F. The aforementioned bending curvature 38 is formed at a position separated by a predetermined distance (for example, 1 mm) in the X-axis direction from the fracture suppression structure 33.

[0057] Figure 16 is an enlarged plan view of the end F(Fa,Fb) of each slit 32 in embodiment A6. As illustrated in Figure 16, the fracture suppression structure 33 in embodiment A6 is a through hole 33a that penetrates the base material 30. The through hole 33a is connected to the end F of the slit 32. The through hole 33a is formed in a circular shape in plan view. The external dimensions (i.e., outer diameter) of the through hole 33a in the direction of the X axis exceed the width of the slit 32. The through hole 33a in embodiment A6 is formed, for example, by the cutting edge of the second processing roller 842 illustrated in Figure 11.

[0058] According to embodiment A6, the simple structure of forming a through hole 33a in the base material 30 effectively suppresses fracture of the base material 30 starting from the end F(Fa,Fb) of the slit 32. The planar shape of the through hole 33a, which functions as a fracture suppression structure 33, is not limited to the circular shape exemplified in Figure 16. The planar shape of the through hole 33a may be, for example, an ellipse exemplified in Figure 17, or an oblong shape exemplified in Figure 18. Furthermore, the planar shape of the through hole 33a may be a non-circular shape such as a fan shape exemplified in Figure 19, or a polygonal shape.

[0059] In FIGS. 17 and 18, the outer dimensions Wx and Wy of the through hole 33a are shown. The outer dimension Wx is the outer diameter of the through hole 33a in the direction of the X-axis. The outer dimension Wy is the outer diameter of the through hole 33a in the direction of the Y-axis. From the viewpoint of sufficiently ensuring the effect of suppressing the breakage of the base material 30 at the end F of each slit 32, as illustrated in FIGS. 17 and 18, a configuration in which the outer dimension Wx is less than the outer dimension Wy (Wx < Wy) is preferable.

[0060] In addition, in a configuration where the outer dimension Wx is excessively small with respect to the outer dimension Wy, the radius of curvature of the through hole 33a becomes extremely small. For example, in the second processing roller 842 in the manufacturing apparatus 80 of FIG. 11, it is difficult to form a through hole 33a having an excessively small radius of curvature. Considering the above circumstances, for example, a configuration in which the aspect ratio Rxy (Rxy = Wy / Wx), which is the ratio of the outer dimension Wy to the outer dimension Wx, is 1.3 or more (more preferably 1.5 or more) so that the radius of curvature of the through hole 33a is, for example, 2 mm or more is preferable.

[0061] A-7: Aspect A7 FIG. 20 is an enlarged plan view of the ends F (Fa, Fb) of each slit 32 in Aspect A7 of the first embodiment. As illustrated in FIG. 20, the breakage suppression structure 33 in Aspect A7 is a linear end line 33b that penetrates the base material 30. The end line 33b is formed in a curved shape in plan view. Specifically, the end line 33b includes a first end 331, a second end 332, and a connecting portion 333 in plan view.

[0062] The first end 331 is one end of the end line 33b. The first end 331 is connected to the end F of the slit 32. The second end 332 is the end of the end line 33b opposite to the first end 331. The connecting portion 333 is a curved (specifically, arc-shaped) portion that connects the first end 331 and the second end 332. Specifically, the connecting portion 333 intersects the extension line Le1 of the slit 32 at a position spaced apart from the end F of the slit 32 in a plan view. The first end 331 and the second end 332 face in a direction approaching the slit 32 from the connecting portion 333 (specifically, in the negative direction of the Y axis). The end line 33b in embodiment A7 is formed, for example, by the cutting edge of the second processing roller 842 illustrated in Figure 11.

[0063] According to embodiment A7, a simple structure in which a curved end line 33b is formed on the base material 30 effectively suppresses the fracture of the base material 30 starting from the end F(Fa,Fb) of the slit 32. In embodiment A6, a through hole 33a is formed by removing a part of the base material 30 (hereinafter referred to as the "removed portion"). That is, a large number of removed portions are generated during the manufacturing process of the wiring material 100. Therefore, there is a possibility that the removed portions may unintentionally adhere to the wiring material 100 or the manufacturing apparatus 80. In embodiment A7, since a linear end line 33b penetrating the base material 30 is formed as a fracture suppression structure 33, no removed portions of the base material 30 are generated during the manufacturing process of the wiring material 100. Therefore, according to embodiment A7, it is possible to resolve the aforementioned problems caused by the removed portions.

[0064] The planar shape of the end line 33b, which functions as a fracture suppression structure 33, is not limited to the arc shape illustrated in Figure 20. For example, as illustrated in Figure 21, an arc-shaped (specifically semi-circular) end line 33b in which the first end 331 is continuously connected to the slit 32 may be formed on the base material 30. Furthermore, although the above description has illustrated a form in which the first end 331 of the end line 33b is connected to the slit 32, a form in which the end line 33b is not connected to the slit 32 is also conceivable, as illustrated in Figure 22. The end line 33b in Figure 22 includes a connecting portion 333 that intersects the extension line Le1 of the slit 32 at a position spaced apart from the end F of the slit 32 in a plan view, and a first end 331 and a second end 332 that face in a direction approaching the slit 32 from the connecting portion 333.

[0065] A-8: Pattern A8 Figure 23 is an enlarged plan view of the ends F(Fa,Fb) of each slit 32 in embodiment A8 of the first embodiment. As illustrated in Figure 23, the fracture suppression structure 33 in embodiment A8 is a linear end line 33b that penetrates the base material 30, similar to embodiment A7. The end line 33b is formed in a curved shape in plan view. In plan view, the end line 33b includes a first end 331, a second end 332, and a connecting portion 333. The end line 33b in embodiment A8 is formed, similar to embodiment A7, by, for example, the cutting edge of the second processing roller 842 illustrated in Figure 11.

[0066] In embodiment A8, the end line 33b is formed in a spiral shape in plan view. That is, the spiral defining the end line 33b is a curve formed in the same plane by a radius (dynamic radius) centered at a specific point C increasing or decreasing monotonically in accordance with the change in the angle of the radius. For example, the end line 33b is formed in a spiral shape such as an Archimedean spiral, a logarithmic spiral, or a hyperbolic spiral. Specifically, from the first end 331 connected to the end F of the slit 32 to the second end 332 on the opposite side, the radius of the connecting portion 333 curves in an arc shape so as to continuously decrease. Therefore, in plan view, the connecting portion 333 intersects the extension line Le1 of the slit 32 at a position spaced apart from the end F of the slit 32.

[0067] In the end line 33b illustrated in Figure 23, the spiral rotation angle (the angle of rotation from the first end 331 to the second end 332) is greater than 360°. Specifically, the rotation angle θ of the end line 33b is greater than or equal to one rotation (360°) and less than or equal to 1.25 times one rotation (2π ≤ θ ≤ 2.5π).

[0068] According to embodiment A8, similar to embodiment A7, a simple structure is used to form a curved end line 33b on the base material 30, which effectively suppresses the breakage of the base material 30 starting from the end F(Fa,Fb) of the slit 32. Furthermore, according to embodiment A8, since a linear end line 33b penetrating the base material 30 is formed as a breakage suppression structure 33, no removal of the base material 30 occurs during the manufacturing process of the wiring material 100. Therefore, according to embodiment A8, similar to embodiment A7, the aforementioned problems caused by the removal portion can be resolved.

[0069] The planar shape of the spiral end line 33b is not limited to the shape illustrated in Figure 23. For example, in addition to the configuration in which the first end 331 is curved at a predetermined angle (e.g., 90°) relative to the end F of the slit 32, as illustrated in Figure 23, a configuration in which the first end 331 is continuous with the end F of the slit 32 can also be adopted, as illustrated in Figure 24. In the configuration of Figure 24, the connecting portion 333 does not intersect the extension line Le1 of the slit 32.

[0070] Furthermore, while Figure 23 illustrates a configuration in which the spiral angle of the end line 33b is greater than or equal to one rotation (360°) and less than or equal to 1.25 times one rotation, the spiral angle of the end line 33b is not limited to the above example. For example, as illustrated in Figure 25, a configuration in which the spiral angle of the end line 33b is less than one rotation can also be adopted. In the configuration of Figure 25, the spiral angle θ of the end line 33b is, for example, greater than or equal to 1 / 2 of a rotation and less than one rotation (π≦θ<2π). According to the configuration of Figure 25, the formation of the end line 33b can be made easier compared to a configuration in which the spiral angle θ is greater than one rotation. Also, as illustrated in Figure 26, a configuration in which the spiral angle of the end line 33b is greater than 1.25 times one rotation (2.5π<θ) may also be adopted.

[0071] In FIGS. 23 to 26, the outer dimensions Wx and Wy of the end line 33b are shown. The outer dimension Wx is the outer diameter of the end line 33b in the X-axis direction. The outer dimension Wy is the outer diameter of the end line 33b in the Y-axis direction. From the viewpoint of sufficiently ensuring the effect of suppressing the breakage of the base material 30 at the end F of each slit 32, as illustrated in FIGS. 23 to 26, a configuration in which the outer dimension Wx is less than the outer dimension Wy (Wx < Wy) is preferable.

[0072] In a configuration where the outer dimension Wx is excessively small with respect to the outer dimension Wy, the radius of curvature of the end line 33b becomes extremely small. For example, in the second processing roller 842 in the manufacturing apparatus 80 of FIG. 11, it is difficult to form an end line 33b with an excessively small radius of curvature. Considering the above circumstances, for example, a configuration in which the aspect ratio Rxy (Rxy = Wy / Wx), which is the ratio of the outer dimension Wy to the outer dimension Wx, is 1.3 or more (more preferably 1.5 or more) so that the radius of curvature of the end line 33b is, for example, 2 mm or more is preferable. In the above description, attention has been paid to the end line 33b of aspect A8, but also for the end line 33b of aspect A7, a configuration in which the same conditions are satisfied regarding the relationship between the outer dimension Wx and the outer dimension Wy is preferable.

[0073] FIG. 23 illustrates an end line 33b having a planar shape in which the second end 332 is closer to the first end 331 (the end F of the slit 32) than the center C of the spiral. FIG. 27 illustrates an end line 33b having a planar shape in which the second end 332 is closer to the center C of the spiral than the first end 331.

[0074] As shown in Figure 27, the configuration in which the second end 332 is close to the center C of the helix allows for sufficient spacing between the first end 331 and the second end 332. Compared to the configuration in Figure 23, where the first end 331 and the second end 332 are close together, this configuration has the advantage of making it easier to secure a processing margin when forming the end line 33b with a laser. On the other hand, as shown in Figure 23, the configuration in which the second end 332 is close to the first end 331 allows for a larger radius of curvature of the helix of the end line 33b. Compared to the configuration in Figure 27, this configuration has the advantage of making it easier to suppress localized stress concentration in the substrate 30.

[0075] The stress acting on the wiring material 100 is examined. As illustrated in Figure 28, a sample is assumed in which multiple slits 32 are formed from one end of the wiring material 100 over a predetermined length. As shown by the dashed lines in Figure 28, the ends of the wiring material 100 divided by the slits 32, portions 141 and 142, are deformed in opposite directions along the Z axis. Specifically, the end of portion 141 is displaced in the positive Z direction, and the end of portion 142 is displaced in the negative Z direction. In the state in which the wiring material 100 is deformed as described above, the stress distribution near the end F of the slit 32 located between portions 141 and 142 was measured. The displacement of each portion 141 and 142 is 20 mm (total 40 mm). The Young's modulus of the wiring material 100 is 6.231 GPa, and the Poisson's ratio of the wiring material 100 is 0.3.

[0076] Figure 29 shows the measurement results of the stress distribution in the in-plane direction of the wiring material 100. Specifically, Figure 29 shows, (1) Embodiment A6 (Figure 16) in which a circular through hole 33a is formed as a fracture suppression structure 33, (2) Embodiment A8 (Figure 23) in which the spiral end line 33b is formed as a fracture suppression structure 33, and, (3) A configuration in which the fracture suppression structure 33 is not formed (Figure 3) For each of these, the stress distribution in the in-plane direction is illustrated.

[0077] As can be seen from Figure 29, in embodiment A1, a stress of 967 MPa is concentrated near the end F of the slit 32. In contrast to embodiment A1, the maximum stress in embodiment A6 is 237 MPa, and the maximum stress in embodiment A8 is 260 MPa. As described above, embodiments A6 and A8 can effectively reduce the stress concentration near the end F compared to embodiment A1. Furthermore, the effect of reducing stress concentration is generally the same in embodiments A6 and A8.

[0078] A-9: Pattern A9 Figure 30 is an enlarged plan view of the end F(Fa,Fb) of each slit 32 in embodiment A9 of the first embodiment. As illustrated in Figure 30, the fracture suppression structure 33 in embodiment A9 includes a fracture suppression member 33c installed on the base material 30 on the extension line Le1 of the slit 32 in a plan view. Specifically, the fracture suppression member 33c is a member formed between the first base material 10 and the second base material 20 together with the plurality of wirings 40. One surface of the fracture suppression member 33c contacts the inner surface S11 of the first base material 10, and the other surface of the fracture suppression member 33c contacts the inner surface S21 of the second base material 20. Specifically, the fracture suppression member 33c is formed in an elongated length along the X-axis at a position spaced apart in the Y-axis direction from the end F(Fa,Fb) of the slit 32. For example, the fracture suppression member 33c is formed using the same material as the plurality of wirings 40 in a common process.

[0079] With the above configuration, the simple structure of forming the fracture-suppressing member 33c on the base material 30 effectively suppresses fracture of the base material 30 starting from the end F(Fa,Fb) of the slit 32. Note that the shape of the fracture-suppressing member 33c is not limited to the linear or rectangular shape exemplified in Figure 30.

[0080] A-10: Mode A10 As described above, the fracture suppression structure 33 illustrated in embodiments A6 to A9 is formed for each of the multiple slits 32. In a configuration where the position of the end F in the Y-axis direction is common to all of the multiple slits 32, the position of the fracture suppression structure 33 in the Y-axis direction is also common to all of the multiple slits 32, as illustrated in Figure 31. On the other hand, in a configuration where the position of the end F in the Y-axis direction differs for all of the multiple slits 32, as illustrated in Figure 12, the position of the fracture suppression structure 33 in the Y-axis direction may differ for all of the multiple slits 32, as illustrated in Figure 32. Note that in Figures 31 and 32, the through hole 33a of embodiment A6 is illustrated as the fracture suppression structure 33, but the fracture suppression structure 33 may be changed to any of embodiments A7 to A9.

[0081] In a configuration where the position of the fracture suppression structure 33 (e.g., through hole 33a) in the Y-axis direction differs for each slit 32, as illustrated in Figure 33, a configuration in which each wiring 40 is bent at a position corresponding to each fracture suppression structure 33 makes it possible to increase the density of multiple wirings 40 (i.e., reduce the array pitch).

[0082] As illustrated in Figure 33, each of the multiple wires 40 includes a portion that bends in a direction inclined with respect to the Y-axis (hereinafter referred to as the "bent portion 48"). That is, the bent portion 48 of each wire 40 is inclined with respect to the portions of the wire 40 located on both sides of the bent portion 48 in the direction of the Y-axis (i.e., the portions other than the bent portion 48). The position of the bent portion 48 of each wire 40 in the direction of the Y-axis differs. Specifically, the position of each bent portion 48 in the direction of the Y-axis differs between two wires 40 that are adjacent to each other in the direction of the X-axis. For example, the bent portion 48 of a wire 40 located in the positive direction of the X-axis is located in the positive direction of the Y-axis.

[0083] The fracture-suppressing structure 33 of the slit 32 formed between two adjacent wirings 40 is located between the respective bent portions 48 of the two wirings 40. For example, considering a first wiring 40 and a second wiring 40 adjacent in the direction of the X-axis, the fracture-suppressing structure 33 between the first wiring 40 and the second wiring 40 is located in a plan view between the bent portion 48 of the first wiring 40 and the bent portion 48 of the second wiring 40. In other words, of the wiring 40 extending along the Y-axis, the portion (bent portion 48) located between each adjacent fracture-suppressing structure 33 is inclined with respect to the Y-axis. Therefore, the positions of each fracture-suppressing structure 33 in the direction of the Y-axis differ.

[0084] According to the configuration shown in Figure 33, since the number of wires 40 is increased in density, the outer width (dimension in the X-axis direction) of the wiring material 100 required to form the number of wires 40 can be reduced.

[0085] In Figure 33, a configuration is shown in which the bent portion 48 of each wiring 40 is inclined with respect to the Y-axis. However, as illustrated in Figure 34, the bent portion 48 of each wiring 40 may extend along the X-axis. That is, each bent portion 48 may be perpendicular to the other parts of the wiring 40. As described above, the bent portion 48 is represented as a portion that bends in a direction intersecting the direction of the Y-axis along which the wiring 40 extends.

[0086] In Figure 33, a configuration is shown in which the direction of the bent portion 48 is common to all wirings 40. However, as illustrated in Figure 35, the direction of the bent portion 48 in each wiring 40 may differ from one wiring 40 to another. For example, in the configuration of Figure 35, multiple wirings 40 are formed symmetrically with respect to a center line extending in the direction of the Y axis. Also, as illustrated in Figure 36, a bent portion 48 may be formed in only some of the multiple wirings 40. That is, as mentioned above, when focusing on the first wiring 40 and the second wiring 40 among the multiple wirings 40, the fracture suppression structure 33 between the first wiring 40 and the second wiring 40 only needs to be located between the bent portion 48 of the first wiring 40 and the bent portion 48 of the second wiring 40 in a plan view, and the positional relationship between the other wirings 40 and the fracture suppression structure 33 is arbitrary in embodiment A10.

[0087] Figure 37 illustrates a configuration in which the fracture suppression structure 33 is unevenly distributed on one side in the X-axis direction (negative direction of the X-axis) relative to the slit 32 along the Y-axis. Specifically, the fracture suppression structure 33 in Figure 37 is an arc-shaped end line 33b that is continuous with the slit 32, as illustrated in Figure 21. The configuration in Figure 37 allows for a higher density of multiple wires 40 than the configuration in Figure 33. In other words, the configuration in Figure 37 allows for a reduction in the outer width of the wiring material 100.

[0088] Furthermore, when a tensile force is applied to the central part of the wiring material 100 in the direction of the X-axis at both ends, a bending moment due to the tensile force acts on the edge of the wiring material 100 along the Y-axis (for example, the long side). In a configuration where the outer width of the wiring material 100 is large, the distance from the point where the tensile force is applied to the long side is large at both ends, resulting in a large bending moment acting on the long side. According to embodiment A10, as described above, the outer width of the wiring material 100 is reduced, so the distance from the point where the tensile force is applied to the long side can be reduced. Therefore, the bending moment acting on the long side of the wiring material 100 can be suppressed. As a result of suppressing the bending moment as described above, according to embodiment A10, the concentration of stress acting on the wiring material 100 (especially the slit 32 or the fracture suppression structure 33) is suppressed, and it is possible to improve durability against tensile force (especially fracture resistance). As described above, according to embodiment A10, as a result of reducing the outer width of the wiring material 100, it is possible to improve the overall mechanical strength of the wiring material 100. Therefore, according to the wiring material 100 of embodiment A10 (Figures 33 to 37), stable performance can be maintained even with repeated use over a long period of time.

[0089] For example, in the process of installing terminal components such as connectors on the end of a wiring material 100, the worker connects the terminal components to the end while holding the wiring material 100. Because the wiring material 100 has a smaller cross-sectional area compared to a wire harness, it tends to deform easily during the terminal component installation process. As mentioned above, the configuration shown in Figures 33 to 37 makes it possible to improve the overall mechanical strength of the wiring material 100, so that terminal components can be installed on the end of the wiring material 100 without using any special jigs or tools. Therefore, the productivity of the wiring material 100 can be improved.

[0090] B: Second Embodiment B-1: Pattern B1 Figure 38 is a plan view of the wiring material 100 in embodiment B1 of the second embodiment. Figure 38 shows the end Ea of the base material 30 of the wiring material 100. End Ea is end Ea1 of the first base material 10 and end Ea2 of the second base material 20. In the second embodiment, end Ea1 and end Ea2 overlap each other in plan view. The structure near end Eb1 of the first base material 10 and end Eb2 of the second base material 20 is the same as in Figures 1 and 2. However, the same configuration as end Ea may be applied to the end of the base material 30 opposite to end Ea.

[0091] As illustrated in Figure 38, a portion of each wire 40 in the wiring material 100 extends in the direction of the Y axis from the end Ea of the base material 30. Specifically, each of the multiple wires 40 includes an extended portion 42 and an exposed portion 43. The exposed portion 43 is the part that extends in the positive direction of the Y axis from the end Ea of the base material 30. That is, the exposed portion 43 includes one end 41a of each wire 40 and is the part exposed from the base material 30. Therefore, the exposed portion 43 does not overlap with the base material 30 in a plan view. The extended portion 42 is the part that overlaps with the base material 30 in a plan view. Specifically, the extended portion 42 is the part of the wire 40 other than the exposed portion 43 and extends in the direction of the Y axis between the first base material 10 and the second base material 20.

[0092] The method for manufacturing the above structure is arbitrary. For example, by cutting one end of the base material 30 that covers the entirety of each of the multiple wires 40 using a cutting technique such as a laser, a portion of each wire 40 is exposed from the base material 30 as an exposed portion 43. Connection terminals may be installed at the end 41a of the exposed portion 43 of each wire 40. The connection terminals are connector pins for external connection. For example, the connection terminals are installed at the end 41a of each wire 40 using a processing technique such as crimping.

[0093] Figure 39 shows an example of the use of the wiring material 100 according to embodiment B1. As illustrated in Figure 39, terminal components 50 are connected to the wiring material 100. The terminal components 50 are connectors for electrically connecting each wire 40 of the wiring material 100 to an external device. Specifically, the terminal components 50 consist of a support housing 51 and a plurality of connection terminals 52. The support housing 51 is a structure that supports the plurality of connection terminals 52. The external shape of the support housing 51 is shown with a dashed line for convenience. The same applies to the following figures.

[0094] Each of the multiple wires 40 has an exposed portion 43 which is connected to the terminal component 50. Specifically, the end portion 41a of the exposed portion 43 of each wire 40 is connected to the connection terminal 52 of the terminal component 50. The terminal component 50 may also be understood as an element that constitutes the wiring material 100.

[0095] In conventional flexible wiring boards, the ends of multiple wires are arranged along the periphery of the base material. Therefore, there is a problem in that the degree of freedom of the shape of each wire is low when the wires are connected to terminal components (connectors), for example. In the second embodiment (Aspect B1), each of the multiple wires 40 includes an exposed portion 43 that is exposed from the edge Ea of the base material 30. Therefore, when connecting the end 41a of each wire 40 to the terminal component 50, it is possible to deform the exposed portion 43 of each wire 40 into various shapes without being constrained by the shape of the base material 30 (first base material 10 and second base material 20). In other words, the degree of freedom of the shape of the end 41a of each wire 40 in the wiring material 100 can be ensured.

[0096] B-2: Mode B2 Figure 40 is a plan view of the wiring material 100 in embodiment B2 of the second embodiment. Figure 41 is a cross-sectional view of line cc in Figure 40. As illustrated in Figures 40 and 41, the wiring material 100 in embodiment B2 includes a covering portion 45 for each wire 40. The covering portion 45 corresponding to each wire 40 is a tubular portion that covers the exposed portion 43 of the wire 40. The covering portions 45 are formed spaced apart from each other for each wire 40. The end portion 41a of each wire 40 is exposed from the covering portion 45. The end portion 41a of the wire 40 that is exposed from the covering portion 45 is connected to the terminal component 50 in Figure 39.

[0097] The covering portion 45 is formed from an elastic material such as rubber. Examples of rubber materials used for the covering portion 45 include chloroprene rubber (CR), silicone rubber (SR), acrylic rubber (ACM), urethane rubber (U), polyurethane rubber (PUR), vinyl methyl silicone rubber (VMQ), ethylene propylene diene rubber (EPDM), or fluororubber (FKM).

[0098] The method for forming the covering portion 45 is arbitrary. For example, as illustrated in Figure 42, in the first step Pb1, a covering rubber 46 is formed to cover the exposed portion 43 over multiple wirings 40. In step Pb2, which follows step Pb1, each covering portion 45 is formed by dividing the covering rubber 46 for each wiring 40. For dividing the covering rubber 46 in step Pb2, cutting tools such as cutters or processing technologies such as lasers can be used.

[0099] With the above configuration, the exposed portion 43 of each wire 40 is covered by the covering portion 45, thereby suppressing damage such as corrosion or breakage to each exposed portion 43. The covering portion 45 may be continuous across multiple wires 40. That is, the covering rubber 46 in Figure 42 may be used as the covering portion 45.

[0100] B-3: Mode B3 Figure 43 is a plan view of the wiring material 100 in embodiment B3 of the second embodiment. Embodiment B1 illustrates a configuration in which the length of the exposed portion 43 is common across multiple wirings 40. In embodiment B3, the length of the exposed portion 43 may differ for each of the multiple wirings 40.

[0101] Specifically, the multiple wirings 40 in embodiment B3 are distinguished into first wirings 40a and second wirings 40b. The first wirings 40a are two or more wirings located in the positive direction of the X-axis among the multiple wirings 40. On the other hand, the second wirings 40b are two or more wirings located in the negative direction of the X-axis among the multiple wirings 40.

[0102] The length of the exposed portion 43 of each first wiring 40a is different from the length of the exposed portion 43 of each second wiring 40b. Specifically, the length of the exposed portion 43 of the first wiring 40a is greater than the length of the exposed portion 43 of the second wiring 40b. Therefore, the position of the end portion 41a of the exposed portion 43 in the Y-axis direction of each first wiring 40a is different from the position of the end portion 41a of the exposed portion 43 in the Y-axis direction of each second wiring 40b. Specifically, the end portion 41a of the first wiring 40a is located in the positive Y-axis direction more than the end portion 41a of the second wiring 40b.

[0103] Figure 44 shows an example of the use of the wiring material 100 according to embodiment B3. As illustrated in Figure 44, terminal components 50 are connected to the wiring material 100. The terminal components 50 are connectors for electrically connecting each wire 40 of the wiring material 100 to an external device, and consist of a support housing 51 and a plurality of connection terminals 52.

[0104] The multiple connection terminals 52 are distinguished as connection terminals 52a and connection terminals 52b. The arrangement of the multiple connection terminals 52a and the multiple connection terminals 52b relative to the support housing 51 differs. For example, the positions of the multiple connection terminals 52a and the multiple connection terminals 52b differ in the direction of the Y axis or the Z axis.

[0105] Of the multiple wires 40 of the wiring material 100, each first wire 40a is connected to each of the multiple connection terminals 52 of the terminal component 50, specifically to each connection terminal 52a. On the other hand, of the multiple wires 40 of the wiring material 100, each second wire 40b is connected to each of the multiple connection terminals 52 of the terminal component 50, specifically to each connection terminal 52b.

[0106] Figure 45 shows another example of the use of the wiring material 100 according to embodiment B3. As illustrated in Figure 45, terminal components 50a and 50b are connected to the wiring material 100. Terminal components 50a and 50b are connectors for electrically connecting each wire 40 of the wiring material 100 to an external device. Specifically, each of terminal components 50a and 50b consists of a support housing 51 and a plurality of connection terminals 52, similar to terminal component 50 in Figure 39. For convenience, the external shape of the support housing 51 in each of terminal components 50a and 50b is shown with a dashed line.

[0107] Of the multiple wires 40 of the wiring material 100, each first wire 40a is connected to each connection terminal 52 of the terminal component 50a. On the other hand, each second wire 40b of the wiring material 100 is connected to each connection terminal 52 of the terminal component 50b.

[0108] As described above, in embodiment B3, the positions of the ends in the Y-axis direction differ between each first wiring 40a and each second wiring 40b. Therefore, as illustrated in the examples in Figures 44 and 45, it is possible to easily connect multiple first wirings 40a and multiple second wirings 40b to the terminal component 50 in different configurations.

[0109] B-4: Aspect B4 Figure 46 is a partial plan view of the wiring material 100 according to embodiment B4. As illustrated in Figure 46, the wiring material 100 of embodiment B4 is divided into a base portion 351, a plurality of branch portions 352, and a plurality of terminal portions 353. The base portion 351, each branch portion 352, and each terminal portion 353 are arranged in the direction of the Y axis. The plurality of terminal portions 353 are portions that include the end portion 41a of each wiring 40. The plurality of branch portions 352 are located between the base portion 351 and the plurality of terminal portions 353.

[0110] The base portion 351 is the part where the base material 30 (first base material 10 and second base material 20) is continuous over multiple wirings 40. Each of the multiple branch portions 352 is a part where the base material 30 is divided for each wiring 40. Therefore, multiple branch portions 352 along the Y axis are arranged in the direction of the X axis. Each of the multiple terminal portions 353 is a part of each wiring 40 that is exposed from the base material 30, and corresponds to the exposed portion 43 in embodiment B1. In the above configuration, a connection terminal 52 is connected to each terminal portion 353.

[0111] In Figure 46, an example is shown in which each terminal section 353 is composed only of wiring 40 (exposed portion 43). However, as illustrated in Figure 47, each terminal section 353 may be composed of a second base material 20 and wiring 40. That is, the second base material 20 is divided for each wiring 40 and extends continuously in the Y-axis direction from the branch section 352 to the terminal section 353. The first base material 10 is removed at each terminal section 353. As described above, the base section 351 is the portion where the base material 30 is continuous across multiple wirings 40, each branch section 352 is the portion where the base material 30 is divided for each wiring 40, and each terminal section 353 is the portion where the wiring 40 installed on the second base material 20 is exposed from the first base material 10. The configuration illustrated in Figure 46 or Figure 47 can also be similarly applied to the negative Y-axis end of the wiring material 100.

[0112] B-5: Manifestation B5 Figure 48 shows an example of the use of the wiring material 100 according to embodiment B5. In Figure 39, a configuration in which a terminal component 50 including a support housing 51 that supports a plurality of connection terminals 52 is connected to the wiring material 100 is illustrated. In embodiment B5, as illustrated in Figure 48, each of the plurality of mutually independent connection terminals 52 is connected to the end 41a of the wiring 40. Each connection terminal 52 is connected to the wiring 40 by a connection technique such as crimping. As described above, the support housing 51 of the terminal component 50 may be omitted.

[0113] In Figure 48, a configuration is shown in which each connection terminal 52 is connected to the wiring 40 at an angle along the Y-axis. However, as illustrated in Figure 49, the angle of each connection terminal 52 may differ for each piece of wiring 40. The configurations illustrated in Figure 48 or Figure 49 are also applied to the ends of the wiring material 100 located in the negative direction of the Y-axis.

[0114] C: Third Embodiment C-1: Aspect C1 Figure 50 is a side view of the wiring material 100 in embodiment C1 of the third embodiment. As illustrated in Figure 50, the wiring material 100 in embodiment C1 comprises a base material 30, a plurality of wires 40, and a retaining member 60. The retaining member 60 is an element that maintains the shape of the base material 30 by covering at least a portion of the base material 30 of the wiring material 100. The retaining member 60 is made of a material that is more rigid than the base material 30. In embodiment C1, the retaining member 60 is wound around the base material 30 so as to cover the entire circumference of the cross-section of the wiring material 100. In the following description, the retaining member 60 will be described as an element of the wiring material 100, but the retaining member 60 may also be interpreted as an external element of the wiring material 100.

[0115] As illustrated in Figure 50, the retaining member 60 of embodiment C1 covers at least a portion of the base material 30 of the wiring material 100 that has been deformed from its initial flat state (hereinafter referred to as the "deformed portion"). That is, the retaining member 60 maintains the deformed shape of the deformed portion. The deformed portion is, for example, the deformed region Qb of the base material 30 in the first embodiment in which a plurality of slits 32 are formed. That is, the retaining member 60 covers at least a portion of the deformed region Qb of the base material 30.

[0116] The retaining member 60 contains a curable polymer that hardens when certain conditions are met. Specifically, the curable polymer contained in the retaining member 60 is a water-curable polymer that hardens upon contact with water. For example, the retaining member 60 is made of a fabric or the like impregnated with the water-curable polymer. For example, the retaining member 60 is formed by winding a long piece of material around the base material 30. The rigidity of the retaining member 60 after the water-curable polymer has hardened exceeds the rigidity of the base material 30.

[0117] Figure 51 is an explanatory diagram of a method for manufacturing a wiring material 100 according to embodiment C1. In step Pc1, a retaining member 60 containing a flexible curable polymer before curing is placed on the base material 30 in its initial state. The retaining member 60 is, for example, a piece of fabric wrapped around the portion of the base material 30 that is to be deformed.

[0118] In step Pc2, following step Pc1, the deformed portion of the base material 30 is deformed using a mold 65 of a predetermined shape. Since the holding member 60 is in a flexible state before hardening, pressing the base material 30 against the mold 65 causes the deformed portion of the base material 30 to deform into a three-dimensional shape that conforms to the mold 65.

[0119] In step Pc3, following step Pc2, the base material 30, which is pressed against the mold 65, is immersed in water 67 stored in the storage container 66. In step Pc3, the holding member 60 absorbs the water 67. After step Pc3, the mold 65 and base material 30 are removed from the storage container 66, and then the base material 30 is removed from the mold 65. The holding member 60 hardens upon drying after removal. The shape of the base material 30 is maintained by the hardened holding member 60.

[0120] As described above, in the third embodiment, at least a portion of the deformed portion of the base material 30 is held by the holding member 60. That is, the shape of the deformed portion of the wiring material 100 can be held with a simple configuration. In particular, in embodiment C1, since the holding member 60 contains a water-curable polymer, a highly rigid holding member 60 can be formed by a simple process of attaching water to the water-curable polymer.

[0121] Figure 52 shows an example of the use of the wiring material 100 according to embodiment C1. As illustrated in Figure 52, the wiring material 100 is installed on the support member 200. The support member 200 is a structure that supports the wiring material 100. For example, the body frame of a mobile vehicle such as an electric vehicle, or a sheet metal member that constitutes the exterior of a mobile vehicle, can be exemplified as the support member 200.

[0122] As illustrated in Figure 52, the wiring material 100 is installed on the support member 200 by joining the holding member 60 to the support member 200. For joining the holding member 60 to the support member 200, for example, an adhesive 61 is used. The adhesive 61 is, for example, various resin materials such as epoxy or acrylic.

[0123] As described above, in embodiment C1, the retaining member 60 that holds the shape of the deformed portion of the base material 30 is joined to the support member 200. That is, the retaining member 60 serves both to hold the shape of the deformed portion and to support the wiring material 100 on the support member 200. Therefore, compared to an embodiment in which the structure for supporting the wiring material 100 on the support member 200 is installed separately from the retaining member 60, the configuration for mounting the wiring material 100 can be simplified.

[0124] In particular, in embodiment C1, a retaining member 60 is formed in the deformation region Qb of the base material 30. Since multiple slits 32 are formed in the deformation region Qb, its mechanical strength is lower compared to other parts such as the base region Qa. In embodiment C1, since the retaining member 60 covers the deformation region Qb, the mechanical strength of the deformation region Qb of the base material 30 can be reinforced by the retaining member 60.

[0125] C-2: Aspect C2 Figure 53 is a plan view of the wiring material 100 in embodiment C2 of the third embodiment. As illustrated in Figure 53, the holding member 60 in embodiment C2 has a plurality of through holes 62 formed along the thickness direction (i.e., the Z-axis direction) of the base material 30. Each through hole 62 is an opening that penetrates the holding member 60.

[0126] The through-hole 62 of the retaining member 60 is used in the process of installing the wiring material 100 on the support member 200 using adhesive 61. Specifically, fluid adhesive 61 is injected into the through-hole 62 of the retaining member 60, and the adhesive 61 flows between the retaining member 60 and the support member 200. The adhesive 61 spread between the retaining member 60 and the support member 200 bonds the wiring material 100 to the support member 200.

[0127] As described above, according to embodiment C2, the wiring material 100 can be joined to the support member 200 by injecting adhesive 61 into the through hole 62 of the holding member 60. Therefore, excessive spreading of the adhesive 61 can be suppressed.

[0128] C-3: Aspect C3 Figure 54 is an explanatory diagram of a method for forming the retaining member 60. The processing apparatus 300 shown in Figure 54 is used to form the retaining member 60. The processing apparatus 300 comprises a storage container 301, a conveyor roller 302, and a conveyor roller 303. The conveyor rollers 302 and 303 convey the substrate 30 on which the retaining member 60, which contains a water-curable polymer, is installed before curing. Specifically, the conveyor rollers 302 are a pair of rollers installed on one side wall of the storage container 301, and the conveyor rollers 303 are a pair of rollers installed on the other side wall of the storage container 301. The storage container 301 is a container for storing water used for curing the curable polymer.

[0129] The substrate 30 to be processed is transported into the storage container 301 by the transport roller 302. Water from inside the storage container 301 adheres to the holding member 60 installed on the substrate 30. The substrate 30 is then transported to the outside of the storage container 301 by the transport roller 303. Through the above procedure, the water-curable polymer hardens as the wiring material 100 passes through the storage container 301 and dries, thereby forming the holding member 60.

[0130] D: Fourth Embodiment D-1: Mode D1 Figure 55 is a plan view of the wiring material 100 in embodiment D1 of the fourth embodiment. As illustrated in Figure 55, the base material 30 of the wiring material 100 of the fourth embodiment has a low-strength portion 70 formed along the Y-axis direction. The low-strength portion 70 is a part of the base material 30 that has lower mechanical strength than other parts. Specifically, the low-strength portion 70 extends from the end Ea of the base material 30 in the negative Y-axis direction to a part of the base material 30. In a plan view, each low-strength portion 70 is located within the spacing between two adjacent wirings 40 in the X-axis direction.

[0131] As illustrated in Figure 56, the wiring material 100 can be divided along the low-strength portion 70. The planar shape of the wiring material 100 after division is a branched shape originating from the negative Y-axis end G of the low-strength portion 70. As described above, the wiring material 100 of embodiment D1 can be mounted in a state where the base material 30 is continuous in the low-strength portion 70 (Figure 55) and in a state where the base material 30 is divided in the low-strength portion 70 (Figure 56). In other words, a wiring material 100 that can accommodate various mounting methods can be realized.

[0132] For example, Figure 58 illustrates a case in which the base material 30 is divided into a first part 30a and a second part 30b with the low-strength portion 70 as the boundary. As illustrated in Figure 58, the end of the first part 30a (end region 21a) and the end of the second part 30b (end region 21a) are mounted at different heights.

[0133] In contrast to conventional flexible wiring boards formed in a simple flat shape, the shape and dimensions are fixed, so if the length is insufficient during the installation process, a design change and new manufacturing are required. In contrast to conventional flexible wiring boards, the low-strength section 70 in the fourth embodiment can be divided as needed during the installation process of the wiring material 100, allowing for flexible changes to the shape or dimensions of the wiring material 100. Therefore, the possibility of insufficient length of the wiring material 100 during the installation process is reduced. In other words, according to the fourth embodiment, it is possible to flexibly respond to various conditions in the installation process, such as the position or shape of the member on which the wiring material 100 is installed. Furthermore, by dividing the low-strength section 70, it is also possible to flexibly respond to dimensional errors in the member on which the wiring material 100 is installed.

[0134] Furthermore, by appropriately dividing the low-strength section 70, the wiring material 100 can be deformed into various shapes, thereby suppressing localized stress concentration caused by excessive deformation. In other words, as stress is distributed throughout the entire wiring material 100, damage to the wiring material 100 caused by stress concentration can be suppressed.

[0135] As illustrated in Figure 55, the low-strength portion 70 of embodiment D1 includes a plurality of divided portions 71 arranged at intervals from each other in the direction of the Y axis. Figure 57 is a cross-sectional view of the line dd in Figure 55. As illustrated in Figure 57, each of the plurality of divided portions 71 is a bottomed hole formed in the base material 30. Specifically, each divided portion 71 is a groove formed between the first base material 10 and the joining material 31. The divided portions 71 do not reach the second base material 20. Each divided portion 71 is formed in an elongated shape along the Y axis.

[0136] Furthermore, the low-strength portion 70 of embodiment D1 can also be described as a portion of the wiring material 100 where the portion located between two adjacent divided portions 71 in the Y-axis direction (hereinafter referred to as the "continuous portion 72") is arranged in the Y-axis direction. In other words, in the low-strength portion 70, multiple divided portions 71 and multiple continuous portions 72 are arranged alternately in the Y-axis direction. As described above, the low-strength portion 70 of embodiment D1 is a perforation in which multiple cuts (divided portions 71) are arranged in the Y-axis direction.

[0137] As described above, with the low-strength section 70 having a configuration that includes multiple division sections 71, the wiring material 100 can be divided up to a desired position within the low-strength section 70. Furthermore, since the multiple division sections 71 and multiple continuous sections 72 are arranged alternately, when the low-strength section 70 is partially divided, each divided section remains connected by the continuous sections 72. In other words, the separation of the wiring material 100 into multiple parts due to division by the low-strength section 70 can be suppressed. With the above configuration, the possibility of local deformation or damage to the wiring material 100 spreading to the entire wiring material 100 can be reduced. Therefore, it is easier to ensure the robustness of the wiring material 100.

[0138] As described above, the fourth embodiment can achieve a variety of effects, such as suppression of stress concentration, improvement of deformation-following ability, flexible deformation during the installation process, absorption of dimensional errors, and suppression of damage to the entire wiring material 100.

[0139] The method for forming the divisions 71 in the wiring material 100 is arbitrary. For example, each division 71 can be formed by cutting using a cutting tool such as a cutter or drill. Alternatively, each division 71 may be formed by laser processing, for example, by irradiating the wiring material 100 with a laser.

[0140] According to the above configuration, the low-strength portion 70 can be easily formed by creating a bottomed hole in the base material 30. Each divided portion 71 may also be a through hole extending from the first base material 10 to the joining material 31 to the second base material 20. Furthermore, bottomed holes and through holes may be mixed in multiple divided portions 71.

[0141] Each of the multiple divided sections 71 may be formed by a through hole in the base material 30, and each of the multiple continuous sections 72 may be formed by a bottomed hole in the base material 30. The low-strength section 70, in which through holes (divided sections 71) and bottomed holes (continuous sections 72) are mixed, is formed by a two-stage laser processing process including, for example, a first step and a second step. In the first step, a bottomed hole extending along the entire length of the low-strength section 70 is formed in the base material 30 by laser processing (half-cut). In the second step, the portion of the low-strength section 70 corresponding to each divided section 71 is cut by laser processing, thereby forming multiple divided sections 71 in the base material 30.

[0142] Figures 59 to 61 are explanatory diagrams illustrating the effects realized by the fourth embodiment. Figure 59 illustrates the manufacturing process of the wiring material 400 in relation to proportionality. The wiring material 400 has a planar shape including multiple branches, and a connection terminal is formed at the tip of each branch. As illustrated in Figure 59, two wiring materials 400 are manufactured from a single base material M. As illustrated in Figure 59, since the wiring material 400 includes multiple branches, a large gap must be secured between the two wiring materials 400 in the base material M. In other words, in proportionality, a large amount of waste material is inevitably generated from the base material M during the manufacturing of the wiring material 400.

[0143] As illustrated in Figure 60, the same functionality as a proportionally sized wiring material 400 is achieved by a combination of multiple wiring materials 100 (100a, 100b, 100c) according to the fourth embodiment. Each wiring material 100 is initially manufactured in a straight line, and branches corresponding to the wiring material 400 can be formed by dividing it at the low-strength section 70.

[0144] Since each wiring material 100 is linear during the manufacturing process, multiple wiring materials 100 can be manufactured from the base material M in close proximity to each other, as illustrated in Figure 61. Therefore, according to the fourth embodiment, the amount of waste material generated from the base material M can be significantly reduced compared to the proportional method in Figure 59. Furthermore, as a result of the reduction in waste material, according to the fourth embodiment, even when using a base material M of the same size as in Figure 59, it is possible to increase the number of wiring materials that can be manufactured. On the other hand, if a predetermined number of wiring materials are to be manufactured, it is possible to reduce the size of the required base material M. As described above, according to the fourth embodiment, it is possible to effectively and efficiently manufacture wiring materials compared to the proportional method.

[0145] D-2: Mode D2 Figure 62 is a plan view of the wiring material 100 in embodiment D2 of the fourth embodiment. As illustrated in Figure 62, the wiring material 100 of embodiment D2 has a plurality of low-strength sections 70 (70a, 70b, 70c) formed thereon. Specifically, a plurality of low-strength sections 70 are formed in parallel with a distance between them in the direction of the X axis.

[0146] The length of the low-strength section 70 in the Y-axis direction differs for each low-strength section 70. That is, the position of the end of the low-strength section 70 in the negative direction of the Y-axis differs for each low-strength section 70. For example, the length of low-strength section 70b is greater than the length of low-strength section 70c, and the length of low-strength section 70c is greater than the length of low-strength section 70a. Also, the distance between two adjacent low-strength sections 70 in the X-axis direction differs for each pair of low-strength sections 70. For example, the distance between low-strength section 70a and low-strength section 70b is smaller than the distance between low-strength section 70b and low-strength section 70c.

[0147] By dividing the wiring material 100 at each low-strength section 70 in Figure 62, the divided wiring material 100 takes on a complex shape with branches at multiple different points. Each branch of the wiring material 100 is set to a width corresponding to the spacing between each low-strength section 70.

[0148] As described above, in embodiment D2, since multiple low-strength sections 70 are formed in parallel on the wiring material 100, it is possible to realize wiring materials 100 with various shapes that branch at different points.

[0149] D-3: Mode D3 Figure 63 is a plan view focusing on the low-strength portion 70 of the wiring material 100 in embodiment D3 of the fourth embodiment. As illustrated in Figure 63, in embodiment D3, the distance D between two adjacent divided portions 71 in the Y-axis direction of the multiple divided portions 71 of the low-strength portion 70 changes along the Y-axis direction. The distance D can also be expressed as the length of each continuous portion 72 in the Y-axis direction.

[0150] Specifically, among the multiple divisions 71 of the low-strength section 70, the closer the division is to the positive direction of the Y-axis, the smaller the interval D between each division 71. For example, consider any one division 71 among the multiple divisions 71 (hereinafter referred to as the "first division 71a"), a division 71 adjacent to the first division 71a in the negative direction of the Y-axis (hereinafter referred to as the "second division 71b"), and a division 71 adjacent to the second division 71b on the opposite side of the first division 71a (negative direction of the Y-axis) (hereinafter referred to as the "third division 71c"). The interval D between the first division 71a and the second division 71b is different from the interval between the second division 71b and the third division 71c. Specifically, the distance D between the first division section 71a and the second division section 71b is less than the distance D between the second division section 71b and the third division section 71c.

[0151] In the low-strength section 70, the larger the spacing D between each divided section 71, the greater the force required to divide the wiring material 100. In embodiment D3, the spacing D of the divided sections 71 changes along the direction of the Y axis. Therefore, it is possible to vary the force required to divide the low-strength section 70 depending on the position in the direction of the Y axis. For example, as illustrated in Figure 63, in the embodiment where the spacing D of the divided sections 71 is smaller in the wiring material 100 closer to the end Ea in the positive direction of the Y axis, the required force is small when the division of the wiring material 100 starts from the end Ea, and the force required for division increases as the division progresses toward the negative direction of the Y axis. Therefore, there is an advantage in that excessive division of the wiring material 100 in the low-strength section 70 can be suppressed.

[0152] In Figure 63, an example is shown in which the spacing D between each division section 71 changes according to its position in the Y-axis direction. However, as illustrated in Figure 64, an example is also conceivable in which the length L of the division section 71 changes according to its position in the Y-axis direction. Specifically, the division section 71 located in the negative direction of the Y-axis within the low-strength section 70 has a longer length L in the Y-axis direction.

[0153] D-4: Mode D4 Figure 65 is a plan view of the wiring material 100 in embodiment D4 of the fourth embodiment. In embodiment D1, a dashed line-shaped low-strength portion 70 in which a plurality of division portions 71 are arranged in the direction of the Y axis was illustrated. The low-strength portion 70 in embodiment D4 is a bottomed hole that extends linearly in the direction of the Y axis. That is, the low-strength portion 70 is continuous from the end Ea of the wiring material (end Ea2 of the second base material 20) to the end G in the negative direction of the Y axis, which is the starting point of the branch after division. According to embodiment D4, the wiring material 100 can be divided up to any position in the direction of the Y axis within the low-strength portion 70.

[0154] D-5: Mode D5 Figure 66 is a cross-sectional view of the wiring material 100 in embodiment D5 of the fourth embodiment. Figure 66 shows a cross-section (a cross-section parallel to the XZ plane) passing through one of the divisions 71 of the low-strength portion 70. As illustrated in Figure 66, in the low-strength portion 70 of embodiment D5, an opening 73 is formed in the joining material 31 between the first base material 10 and the second base material 20. The opening 73 is a through hole extending in the direction of the Y axis in the joining material 31. As a result of the formation of the opening 73 in the joining material 31, the portion of the wiring material 100 whose mechanical strength is reduced functions as the low-strength portion 70. In addition to the configuration in Figure 66, a plurality of divisions 71 may be formed.

[0155] The specific configuration of the low-strength portion 70 is not limited to the examples given above. For example, the configurations shown below can also be adopted for the low-strength portion 70. (1) A configuration in which a portion of the first base material 10 or the second base material 20 made of a material with lower mechanical strength than the other parts is used as the low-strength portion 70. (2) A configuration in which the portion of the first base material 10 or the second base material 20 having a bottomed hole formed on its surface along the Y axis is used as the low-strength portion 70. (3) A configuration in which the base material 30 is formed from an anisotropic material that is easily divided along the direction of the Y axis. (4) A configuration in which folds formed in the first base material 10 or the second base material 20 by repeated bending are used as low-strength parts 70.

[0156] As illustrated above, the low-strength portion 70 is composed of any form such as through holes (single or multiple / continuous or discontinuous), cuts, notches, grooves (recesses), or thin-walled portions. In addition, portions where the mechanical strength of the base material 30 is reduced according to the surface shape, or portions where the mechanical strength is reduced due to lamination of another material, can also be used as low-strength portions 70. For example, portions of the base material 30 that have been cut or brittle due to various processing treatments such as laser treatment, mechanical treatment (e.g., cutting), heat treatment, or chemical treatment can also be used as low-strength portions 70.

[0157] In embodiments D1 to D5, a configuration was illustrated in which multiple divisions 71 of the low-strength portion 70 are arranged at intervals from one another in the direction of the Y axis. However, the shape and positional relationship of the multiple divisions 71 are not limited to the above examples. For example, as illustrated in Figures 67 and 68, the low-strength portion 70 may be composed of multiple divisions 71 arranged in multiple rows (L1, L2). That is, each of the first row L1 and the second row L2 is composed of multiple divisions 71 arranged in the direction of the Y axis. In the configuration of Figure 67, the positions of each division 71 in the first row L1 and each division 71 in the second row L2 differ in the direction of the X axis. In the configuration of Figure 68, each division 71 in the first row L1 and each division 71 in the second row L2 are formed at the same position in the direction of the X axis.

[0158] In the above examples, a configuration in which each division portion 71 extends along the Y axis was illustrated, but as illustrated in Figure 69, each division portion 71 of the low-strength portion 70 may extend in a direction inclined at a predetermined angle with respect to the Y axis. Each division portion 71 of the low-strength portion 70 may form a closed figure as illustrated in Figure 70, or an open figure as illustrated in Figure 71.

[0159] D-6: Mode D6 In a configuration in which a low-strength portion 70 is formed on the wiring material 100, it is conceivable that cracks may occur in the base material 30, starting from the end G of the low-strength portion 70 and extending along the extension of the low-strength portion 70. In embodiments D6 to D9 illustrated below, a structure for suppressing fracture of the base material 30 at the end G of the low-strength portion 70 (hereinafter referred to as the "fracture suppression structure 74") is formed at the end G of the low-strength portion 70. In the embodiment in which the fracture suppression structure 74 is formed at the end G of the low-strength portion 70, excessive fracture of the base material 30 starting from the end G of the low-strength portion 70 can be suppressed compared to a configuration in which the fracture suppression structure 74 is not formed at the end G. The aforementioned bending curvature 38 is formed at a position separated by a predetermined distance (for example, 1 mm) in the X-axis direction from the fracture suppression structure 74.

[0160] FIG. 72 is an enlarged plan view of the end G of the low-strength portion 70 in Embodiment D6. As illustrated in FIG. 72, the fracture suppression structure 74 in Embodiment D6 is a through-hole 74a penetrating the base material 30. The through-hole 74a is connected to the end G of the low-strength portion 70 (for example, the divided portion 71). The through-hole 74a is formed in a circular shape in plan view. The outer dimension (i.e., outer diameter) of the through-hole 74a in the direction of the X-axis exceeds the lateral width of the low-strength portion 70. The through-hole 74a of Embodiment D6 is formed, for example, by the cutting edge of the second processing roller 842 illustrated in FIG. 11.

[0161] According to Embodiment D6, by means of a simple structure for forming the through-hole 74a in the base material 30, the fracture of the base material 30 starting from the end G of the low-strength portion 70 can be effectively suppressed. Note that the planar shape of the through-hole 74a functioning as the fracture suppression structure 74 is not limited to the circular shape illustrated in FIG. 72. The planar shape of the through-hole 74a may be an elliptical shape illustrated in FIG. 73, or an oval shape illustrated in FIG. 74. Further, the planar shape of the through-hole 74a may be a non-circular shape such as a fan shape or a polygonal shape illustrated in FIG. 75.

[0162] In FIGS. 73 and 74, the outer dimension Wx and the outer dimension Wy of the through-hole 74a are illustrated. The outer dimension Wx is the outer diameter of the through-hole 74a in the direction of the X-axis. The outer dimension Wy is the outer diameter of the through-hole 74a in the direction of the Y-axis. From the viewpoint of sufficiently ensuring the effect of suppressing the fracture of the base material 30 at the end G of each low-strength portion 70, as illustrated in FIGS. 73 and 74, a configuration (Wx < Wy) in which the outer dimension Wx is smaller than the outer dimension Wy is preferable.

[0163] Note that in a configuration where the outer dimension Wx is excessively smaller than the outer dimension Wy, the radius of curvature of the through-hole 74a becomes extremely small. For example, in the second processing roller 842 in the manufacturing apparatus 80 of FIG. 11, it is difficult to form the through-hole 74a having an excessively small radius of curvature. Considering the above circumstances, for example, a configuration in which the aspect ratio Rxy (Rxy = Wy / Wx), which is the ratio of the outer dimension Wy to the outer dimension Wx of the through-hole 74a, is 1.3 or more (more preferably 1.5 or more) so that the radius of curvature of the through-hole 74a is, for example, 2 mm or more is preferable.

[0164] D-7: Pattern D7 Figure 76 is an enlarged plan view of the end portion G of the low-strength portion 70 in embodiment D7 of the fourth embodiment. As illustrated in Figure 76, the fracture suppression structure 74 in embodiment D7 is a linear end line 74b that penetrates the base material 30. The end line 74b is formed in a curved shape in plan view. Specifically, the end line 74b includes a first end portion 741, a second end portion 742, and a connecting portion 743 in plan view.

[0165] The first end 741 is one end of the end line 74b. The first end 741 is connected to the end G of the low-strength section 70. The second end 742 is the end of the end line 74b opposite to the first end 741. The connecting section 743 is a curved (specifically, arc-shaped) portion that connects the first end 741 and the second end 742. Specifically, the connecting section 743 intersects the extension line Le2 of the low-strength section 70 at a position spaced apart from the end G of the low-strength section 70 in a plan view. The first end 741 and the second end 742 face in a direction approaching the low-strength section 70 from the connecting section 743 (specifically, in the negative direction of the Y-axis). In embodiment D7, the end line 74b is formed, for example, by the cutting edge of the second processing roller 842 illustrated in Figure 11.

[0166] According to embodiment D7, a simple structure in which a curved end line 74b is formed on the base material 30 effectively suppresses the fracture of the base material 30 starting from the end G of the low-strength portion 70. In embodiment D6, a through hole 74a is formed by removing a part of the base material 30 (hereinafter referred to as the "removed portion"). That is, a large number of removed portions are generated during the manufacturing process of the wiring material 100. Therefore, there is a possibility that the removed portions may unintentionally adhere to the wiring material 100 or the manufacturing apparatus 80. In embodiment D7, since a linear end line 74b penetrating the base material 30 is formed as a fracture suppression structure 74, no removed portions of the base material 30 are generated during the manufacturing process of the wiring material 100. Therefore, according to embodiment D7, it is possible to resolve the aforementioned problems caused by the removed portions.

[0167] The planar shape of the end line 74b, which functions as a fracture suppression structure 74, is not limited to the arc shape illustrated in Figure 76. For example, as illustrated in Figure 77, an arc-shaped (specifically semi-circular) end line 74b in which the first end 741 is continuously connected to the low-strength portion 70 may be formed on the base material 30. Furthermore, although the above description has illustrated a form in which the first end 741 of the end line 74b is connected to the low-strength portion 70, a form in which the end line 74b is not connected to the low-strength portion 70 is also conceivable, as illustrated in Figure 78. The end line 74b in Figure 78 includes a connecting portion 743 that intersects the extension line Le2 of the low-strength portion 70 at a position spaced apart from the end G of the low-strength portion 70 in a plan view, and a first end 741 and a second end 742 that face in a direction approaching the low-strength portion 70 from the connecting portion 743.

[0168] D-8: Aspect D8 Figure 79 is an enlarged plan view of the end G of each low-strength portion 70 in embodiment D8 of the fourth embodiment. As illustrated in Figure 79, the fracture suppression structure 74 in embodiment D8 is a linear end line 74b that penetrates the base material 30, similar to embodiment D7. The end line 74b is formed in a curved shape in plan view. In plan view, the end line 74b includes a first end 741, a second end 742, and a connecting portion 743. The end line 74b in embodiment D8 is formed, similar to embodiment D7, for example, by the cutting edge of the second processing roller 842 illustrated in Figure 11.

[0169] In embodiment D8, the end line 74b is formed in a spiral shape in plan view. That is, the spiral defining the end line 74b is a curve formed in the same plane by a radius (dynamic radius) centered at a specific point C increasing or decreasing monotonically in accordance with the change in the angle of the radius. For example, the end line 74b is formed in a spiral shape such as an Archimedean spiral, a logarithmic spiral, or a hyperbolic spiral. Specifically, from the first end 741 connected to the end G of the low-strength section 70 to the second end 742 on the opposite side, the radius of the connecting section 743 curves in an arc shape so as to continuously decrease. Therefore, in plan view, the connecting section 743 intersects the extension line Le2 of the low-strength section 70 at a position spaced apart from the end G of the low-strength section 70.

[0170] In the end line 74b illustrated in Figure 79, the spiral rotation angle (the angle of rotation from the first end 741 to the second end 742) is greater than 360°. Specifically, the rotation angle θ of the end line 74b is greater than or equal to one rotation (360°) and less than or equal to 1.25 times one rotation (2π ≤ θ ≤ 2.5π).

[0171] According to embodiment D8, similar to embodiment D7, a simple structure in which a curved end line 74b is formed on the base material 30 effectively suppresses the fracture of the base material 30 starting from the end G of the low-strength portion 70. Furthermore, according to embodiment D8, since a linear end line 74b penetrating the base material 30 is formed as a fracture suppression structure 74, no removal of the base material 30 occurs during the manufacturing process of the wiring material 100. Therefore, according to embodiment D8, similar to embodiment D7, the aforementioned problems caused by the removal portion can be resolved.

[0172] The planar shape of the spiral end line 74b is not limited to the shape illustrated in Figure 79. For example, in addition to the configuration in which the first end 741 is curved at a predetermined angle (e.g., 90°) relative to the end G of the low-strength portion 70, as illustrated in Figure 79, a configuration in which the first end 741 is continuous with the end G of the low-strength portion 70 can also be adopted, as illustrated in Figure 80. In the configuration of Figure 80, the connecting portion 743 does not intersect the extension line Le2 of the low-strength portion 70.

[0173] Furthermore, while Figure 79 illustrates a configuration in which the spiral angle of the end line 74b is greater than or equal to one rotation (360°) and less than or equal to 1.25 times one rotation, the spiral angle of the end line 74b is not limited to the above example. For example, as illustrated in Figure 81, a configuration in which the spiral angle of the end line 74b is less than one rotation can also be adopted. In the configuration of Figure 81, the spiral angle θ of the end line 74b is, for example, greater than or equal to 1 / 2 of a rotation and less than one rotation (π≦θ<2π). According to the configuration of Figure 81, the formation of the end line 74b can be made easier compared to a configuration in which the spiral angle θ is greater than one rotation. Also, as illustrated in Figure 82, a configuration in which the spiral angle of the end line 74b is greater than 1.25 times one rotation (2.5π<θ) may also be adopted.

[0174] In FIGS. 79 to 82, the outer dimensions Wx and Wy of the end line 74b are illustrated. The outer dimension Wx is the outer diameter of the end line 74b in the X-axis direction. The outer dimension Wy is the outer diameter of the end line 74b in the Y-axis direction. From the viewpoint of sufficiently ensuring the effect of suppressing the breakage of the base material 30 at the end G of each low-strength portion 70, as illustrated in FIGS. 79 to 82, a configuration (Wx < Wy) in which the outer dimension Wx is less than the outer dimension Wy is preferable.

[0175] In a configuration where the outer dimension Wx is excessively smaller than the outer dimension Wy, the radius of curvature of the end line 74b becomes extremely small. For example, in the second processing roller 842 in the manufacturing apparatus 80 of FIG. 11, it is difficult to form an end line 74b having an excessively small radius of curvature. Considering the above circumstances, for example, a configuration in which the aspect ratio Rxy (Rxy = Wy / Wx), which is the ratio of the outer dimension Wy to the outer dimension Wx, is 1.3 or more (more preferably 1.5 or more) so that the radius of curvature of the end line 74b is, for example, 2 mm or more is preferable. In the above description, attention has been paid to the end line 74b of the embodiment D8, but also in the end line 74b of the embodiment D7, a configuration in which the same conditions are satisfied regarding the relationship between the outer dimension Wx and the outer dimension Wy is preferable.

[0176] FIG. 79 illustrates an end line 74b having a planar shape in which the second end 742 is closer to the first end 741 (the end G of the low-strength portion 70) than the center C of the spiral. FIG. 83 illustrates an end line 74b having a planar shape in which the second end 742 is closer to the center C of the spiral than the first end 741.

[0177] As shown in Figure 83, the configuration in which the second end 742 is close to the center C of the helix allows for sufficient spacing between the first end 741 and the second end 742. Compared to the configuration in Figure 79, where the first end 741 and the second end 742 are close together, this configuration has the advantage of making it easier to secure a processing margin when forming the end line 74b with a laser. On the other hand, as shown in Figure 79, the configuration in which the second end 742 is close to the first end 741 allows for a larger radius of curvature of the helix of the end line 74b. Compared to the configuration in Figure 83, this configuration has the advantage of making it easier to suppress localized stress concentration in the base material 30.

[0178] D-9: Pattern D9 Figure 84 is an enlarged plan view of the end G of the low-strength portion 70 in embodiment D9 of the fourth embodiment. As illustrated in Figure 84, the fracture suppression structure 74 in embodiment D9 includes a fracture suppression member 74c installed on the base material 30 on the extension line Le2 of the low-strength portion 70 in a plan view. Specifically, the fracture suppression member 74c is a member formed between the first base material 10 and the second base material 20 together with the plurality of wirings 40. One surface of the fracture suppression member 74c contacts the inner surface S11 of the first base material 10, and the other surface of the fracture suppression member 74c contacts the inner surface S21 of the second base material 20. Specifically, the fracture suppression member 74c is formed in an elongated manner along the X-axis at a position spaced apart in the Y-axis direction from the end G of the low-strength portion 70. For example, the fracture suppression member 74c is formed using the same material as the plurality of wirings 40 in a common process.

[0179] With the above configuration, the simple structure of forming the fracture-suppressing member 74c on the base material 30 effectively suppresses fracture of the base material 30 starting from the end G of the low-strength portion 70. Note that the shape of the fracture-suppressing member 74c is not limited to the linear or rectangular shape exemplified in Figure 84.

[0180] D-10: Mode D10 As described above, the fracture suppression structure 74 illustrated in embodiments D6 to D9 is formed for each of the multiple low-strength parts 70. In a configuration where the position of the end G in the Y-axis direction is common to the multiple low-strength parts 70, the position of the fracture suppression structure 74 in the Y-axis direction is also common to the multiple low-strength parts 70, as illustrated in Figure 85. On the other hand, in a configuration where the position of the end G in the Y-axis direction differs for the multiple low-strength parts 70, as illustrated in Figure 86, for example, the position of the fracture suppression structure 74 in the Y-axis direction may differ for the multiple low-strength parts 70. Note that in Figures 85 and 86, the through hole 74a of embodiment D6 is illustrated as the fracture suppression structure 74, but the fracture suppression structure 74 may be changed to any of embodiments D7 to D9.

[0181] In a configuration where the position of the fracture suppression structure 74 (e.g., through hole 74a) in the Y-axis direction differs for each low-strength section 70, as illustrated in Figure 87, a configuration in which each wiring 40 is bent at a position corresponding to each fracture suppression structure 74 can be used to achieve high density of multiple wirings 40 (i.e., reduction of the array pitch).

[0182] As illustrated in Figure 87, each of the multiple wires 40 includes a bent portion 48 that bends in a direction inclined with respect to the Y-axis. That is, the bent portion 48 of each wire 40 is inclined with respect to the portions of the wire 40 located on both sides of the bent portion 48 in the Y-axis direction (i.e., the portions other than the bent portion 48). The position of the bent portion 48 of each wire 40 differs in the Y-axis direction. Specifically, the position of the bent portion 48 in the Y-axis direction differs between two wires 40 that are adjacent to each other in the X-axis direction. For example, the more a wire 40 is located in the positive X-axis direction, the more its bent portion 48 is located in the negative Y-axis direction.

[0183] The fracture-suppressing structure 74 of the low-strength section 70 formed between two adjacent wirings 40 is located between the respective bent portions 48 of the two wirings 40. For example, considering a first wiring 40 and a second wiring 40 adjacent in the direction of the X-axis, the fracture-suppressing structure 74 between the first wiring 40 and the second wiring 40 is located in a plan view between the bent portion 48 of the first wiring 40 and the bent portion 48 of the second wiring 40. In other words, of the wiring 40 extending along the Y-axis, the portion (bent portion 48) located between each adjacent fracture-suppressing structure 74 is inclined with respect to the Y-axis. Therefore, the positions of each fracture-suppressing structure 74 in the direction of the Y-axis differ.

[0184] According to the configuration shown in Figure 87, since the number of wires 40 is increased in density, the outer width (dimension in the X-axis direction) of the wiring material 100 required to form the number of wires 40 can be reduced.

[0185] In Figure 87, a configuration is shown in which the bent portion 48 of each wiring 40 is inclined with respect to the Y-axis. However, as illustrated in Figure 88, the bent portion 48 of each wiring 40 may extend along the X-axis. That is, each bent portion 48 may be perpendicular to the other parts of the wiring 40. As described above, the bent portion 48 is represented as a portion that bends in a direction intersecting the direction of the Y-axis along which the wiring 40 extends.

[0186] In Figure 87, a configuration is shown in which the direction of the bent portion 48 is common to all wirings 40. However, as illustrated in Figure 89, the direction of the bent portion 48 in each wiring 40 may differ from one wiring 40 to another. Specifically, in the configuration of Figure 89, multiple wirings 40 are formed symmetrically with respect to a center line extending in the direction of the Y axis. Also, as illustrated in Figure 90, a bent portion 48 may be formed on only some of the multiple wirings 40. That is, as mentioned above, when focusing on the first wiring 40 and the second wiring 40 among the multiple wirings 40, the fracture suppression structure 74 between the first wiring 40 and the second wiring 40 only needs to be located between the bent portion 48 of the first wiring 40 and the bent portion 48 of the second wiring 40 in a plan view, and the positional relationship between the other wirings 40 and the fracture suppression structure 74 is arbitrary in embodiment D10.

[0187] Figure 91 illustrates a configuration in which the fracture suppression structure 74 is unevenly distributed on one side in the X-axis direction (negative direction of the X-axis) relative to the low-strength section 70 along the Y-axis. Specifically, the fracture suppression structure 74 in Figure 91 is an arc-shaped end line 74b that is continuous with the low-strength section 70, as illustrated in Figure 21. The configuration in Figure 91 allows for a higher density of multiple wirings 40 than the configuration in Figure 87.

[0188] E: Variation The following are examples of specific modifications that may be added to the embodiments exemplified above. Two or more embodiments may be arbitrarily selected from the following examples and merged as appropriate, provided they do not contradict each other.

[0189] (1) In each of the above-mentioned forms, the following configurations were provided as examples. A: First Embodiment In this configuration, a plurality of slits 32 are formed in parallel in the direction of the X axis, with the Y axis oriented in the deformation region Qb, which is a part of the base material 30 in the direction of the Y axis. B: Second Embodiment Each of the multiple wirings 40 includes an extended portion 42 that overlaps the base material 30 in a plan view, and an exposed portion 43 that extends in the direction of the Y axis from the end Ea of the base material 30 in the direction of the Y axis. C: Third Embodiment The wiring material 100 includes a retaining member 60 that maintains the shape of the base material 30 by covering at least a portion of the deformed part of the base material 30. D: Fourth Embodiment A configuration in which a low-strength section 70, which has lower mechanical strength than other parts, is formed along the Y-axis direction.

[0190] Two or more configurations, arbitrarily selected from the multiple configurations exemplified above, may be merged with each other. In other words, the embodiments described above can be combined in any way.

[0191] (2) The notation "nth" (where n is a natural number) in this application is used solely as a formal and convenient label to distinguish each element in notation and has no substantive meaning whatsoever. Therefore, there is no room for restrictive interpretation of the position or manufacturing order of each element based on the notation "nth".

[0192] F: Note From the forms exemplified above, the following configuration can be understood, for example.

[0193] F-1: Appendix A Conventional flexible wiring boards can be easily bent in the out-of-plane direction (a direction intersecting the in-plane direction), but other forms of deformation, such as bending or twisting in the in-plane direction, are not easily achievable. Considering these circumstances, one aspect of this disclosure (Appendix A) aims to deform the wiring material into various shapes.

[0194] A wiring material according to one aspect of the present disclosure (Appendix A1) comprises a base material that is long and flexible in a first direction, and a plurality of wirings installed on the base material and extending in the first direction, wherein a first region of the base material, which is a part in the first direction, has a plurality of slits formed along the first direction in parallel in a second direction intersecting the first direction. In this embodiment, since a plurality of slits are formed in the first region of the base material of the wiring material, it is possible to deform the wiring material into various shapes in the first region. The "first region" is a region that is a part of the total length of the base material in the first direction.

[0195] In the specific example of Appendix A1 (Appendix A2), the end of the first slit in the first direction and the end of the second slit, which is different from the first slit, in the first direction are at different positions in the first direction. In the above embodiment, since the positions in the first direction differ between the end of the first slit and the end of the second slit, it is easy to deform the wiring material into a specific shape in the first region.

[0196] In specific examples of Appendix A1 or Appendix A2 (Appendix A3), the length of the first slit in the first direction is different from the length of the second slit in the first direction. In the above embodiment, since the positions in the first direction differ between the first slit and the second slit, it is easy to deform the wiring material into a specific shape in the first region.

[0197] In any specific example from Appendix A1 to Appendix A3 (Appendix A4), the plurality of slits include a first slit, a second slit adjacent to the first slit, and a third slit adjacent to the second slit on the opposite side from the first slit, and the spacing between the first slit and the second slit is different from the spacing between the second slit and the third slit. In the above embodiment, since the spacing between the first slit and the second slit is different from the spacing between the second slit and the third slit, it is easy to deform the wiring material into a specific shape in the first region.

[0198] In any specific example from Appendix A1 to Appendix A4 (Appendix A5), the spacing between two adjacent slits in the second direction among the plurality of slits changes along the second direction. In the above embodiment, since the spacing between each slit changes along the second direction, it is easy to deform the wiring material into a specific shape in the first region.

[0199] In any specific example from Appendix A1 to Appendix A5 (Appendix A6), in the second region of the substrate, which is a separate part from the first region in the first direction, a plurality of slits along the first direction are formed in parallel in the second direction intersecting the first direction. In the above embodiment, it is possible to deform the wiring material into various shapes in each of the first and second regions.

[0200] In any specific example from Appendix A1 to Appendix A6 (Appendix A7), a fracture suppression structure is formed at each end of the plurality of slits to suppress fracture of the substrate at that end. According to the above embodiment, fracture of the substrate originating from the end of the slit can be suppressed.

[0201] In the specific example of Appendix A7 (Appendix A8), the fracture suppression structure includes a through hole connected to the slit, and the external dimensions of the through hole in the second direction exceed the width of the slit. According to the above embodiment, fracture of the substrate starting from the end of the slit can be effectively suppressed by a simple structure that forms a through hole in the substrate.

[0202] In a specific example of Appendix A7 or Appendix A8 (Appendix A9), the fracture suppression structure includes a linear end line that penetrates the substrate, the end line includes a first end, a second end opposite to the first end, and a connecting portion that connects the first end and the second end, the connecting portion intersects the extension of the slit at a position spaced apart from the end of the slit in a plan view, and the first end and the second end face in a direction approaching the slit from the connecting portion. According to the above embodiment, fracture of the substrate starting from the end of the slit can be effectively suppressed by a simple structure that forms a curved end line on the substrate.

[0203] In any specific example from Appendix A7 to A9 (Appendix A10), the fracture suppression structure includes a linear end line that penetrates the substrate, and the end line is spiral in plan view. According to the above embodiment, a simple structure that forms a curved end line on the substrate can effectively suppress fracture of the substrate starting from the end of the slit.

[0204] In any specific example from Appendix A7 to Appendix A10 (Appendix A11), the fracture suppression structure includes a fracture suppression member installed on the substrate along the extension of the slit. According to the above embodiment, fracture of the substrate originating from the end of the slit can be effectively suppressed by the fracture suppression member.

[0205] In any specific example from Appendix A7 to Appendix A11 (Appendix A12), the plurality of wirings include a first wiring and a second wiring that are adjacent to each other in the second direction, each of the first wiring and the second wiring includes a bent portion that bends in a direction intersecting the first direction, the bent portion of the first wiring and the bent portion of the second wiring are in different positions in the first direction, and the fracture suppression structure in the slit between the first wiring and the second wiring among the plurality of slits is located between the bent portion of the first wiring and the bent portion of the second wiring in a plan view. In the above embodiment, since the fracture suppression structure is located between the bent portion of the first wiring and the bent portion of the second wiring, the distance between the first wiring and the second wiring can be reduced compared to a configuration in which the first wiring and the second wiring are simply straight. Therefore, it is possible to increase the density of the plurality of wirings.

[0206] In any specific example from Appendix A1 to Appendix A12 (Appendix A13), by deforming the base material in the first region, the portion of the base material located in one of the first regions in the first direction can rotate about an axis extending in the first direction relative to the portion of the base material located in the other of the first regions. According to the above embodiment, torsional deformation about the axis in the first direction can be easily imparted to the wiring material.

[0207] In any specific example from Appendix A1 to Appendix A13 (Appendix A14), by deforming the substrate in the first region, the width of the first region of the substrate can be reduced by comparing it with the width of the portion of the substrate located on one side of the first region in the first direction. According to the above embodiment, by deforming the substrate so as to reduce the width of the first region, the wiring material can be easily bent in the in-plane direction.

[0208] F-2: Appendix B In conventional flexible wiring boards, the ends of multiple wires are arranged along the periphery of the substrate. Therefore, there is a problem in that the degree of freedom of the shape of each wire is low when the wires are connected to terminal components (connectors), for example. Taking these circumstances into consideration, one aspect of this disclosure aims to ensure the degree of freedom of the shape of the ends of each wire in the wiring material.

[0209] A wiring material according to one aspect of the present disclosure (Appendix B1) comprises a base material that is elongated and flexible in a first direction, and a plurality of wirings installed on the base material and extending in the first direction, wherein each of the plurality of wirings includes an extending portion that overlaps the base material in a plan view, and an exposed portion that extends in the first direction from the end of the base material in the first direction. In the above embodiment, each of the plurality of wirings includes an exposed portion that extends from the end of the base material. Therefore, when connecting the end of each wiring to an external element such as a terminal component, the exposed portion of each wiring can be deformed into various shapes without being restricted by the shape of the base material. In other words, a degree of freedom in the shape of the end of each wiring in the wiring material can be ensured.

[0210] In the specific example of Appendix B1 (Appendix B2), the device further comprises terminal components connected to the exposed portions of each of the plurality of wires. In this embodiment, the exposed portion of each wire is connected to a terminal component (for example, a connector for external connection). Since the exposed portion of each wire extends from the end of the base material, it is possible to connect each exposed portion to the terminal component in a state where it has been deformed into various shapes.

[0211] In specific examples of Appendix B1 or Appendix B2 (Appendix B3), the position of the end of the exposed portion of the first wiring among the plurality of wirings in the first direction is different from the position of the end of the exposed portion of the second wiring, which is different from the first wiring among the plurality of wirings, in the first direction. In the above embodiment, the position of the end of the exposed portion differs between the first wiring and the second wiring. Therefore, the first wiring and the second wiring can be easily connected to terminal components in different configurations.

[0212] F-3: Appendix C Conventional flexible printed circuit boards have their respective ends mounted on external elements such as other printed circuit boards in a state of being deformed into various shapes. In the state of being mounted on the external elements, the shape of the flexible printed circuit board can change. However, from the perspective of suppressing deterioration, etc. of the flexible printed circuit board caused by vibrations propagated from the external elements, etc., there are cases where it is required to maintain the shape of the flexible printed circuit board. Considering the above circumstances, one aspect of the present disclosure aims to maintain the shape of the wiring material with a simple configuration.

[0213] A wiring material according to one aspect (Appendix C1) of the present disclosure includes a base material that is long in the first direction and has flexibility, a plurality of wirings that are provided on the base material and extend in the first direction, and a holding member that covers at least a part of the deformed portion of the base material to maintain the shape of the base material. In the above aspect, at least a part of the deformed portion of the base material is held by the holding member. That is, the shape of the wiring material can be maintained with a simple configuration.

[0214] In a specific example (Appendix C2) of Appendix C1, the holding member includes a curable polymer. In the above aspect, the shape of the base material can be easily maintained by curing the curable polymer under predetermined conditions. A typical example of the curable polymer is a water-curable polymer that cures upon adhesion of water. However, for example, a photo-curable polymer that cures upon irradiation with light such as ultraviolet rays or visible light, a thermo-curable polymer that cures upon heating, etc. are also used as the holding member.

[0215] In a specific example (Appendix C3) of Appendix C1 or Appendix C2, the holding member is joined to a support member that supports the wiring material. In the above aspect, the holding member that maintains the shape of the deformed portion of the base material is joined to the support member. That is, the holding member is used for both maintaining the shape of the deformed portion and supporting the wiring material with respect to the support member. Therefore, compared with a form in which a structure for supporting the wiring material on the support member is installed separately from the holding member, the configuration for mounting the wiring material can be simplified.

[0216] In any specific example (Appendix C4) among Appendix C1 to Appendix C3, a through-hole extending along the thickness direction of the base material is formed in the holding member. In the above aspect, by injecting an adhesive into the through-hole of the holding member, the wiring material can be joined to the support member. Therefore, excessive spread of the adhesive can be suppressed.

[0217] In any specific example (Appendix C5) among Appendix C1 to Appendix C4, the holding member covers at least a part of the first region according to Appendix A. As described above, in the first region, the base material can be deformed in various ways. On the other hand, a plurality of slits are formed in the first region, so the mechanical strength is lower than other parts. According to the form in which at least a part of the first region is covered by the holding member, the mechanical strength of the first region of the base material can be reinforced by the holding member.

[0218] F-4: Appendix D For example, if a flexible printed circuit board is formed in a shape branched into a plurality of parts, it can be used for electrical connection of various parts, which is convenient. However, a flexible printed circuit board whose base material shape is selected assuming a specific mounting is not necessarily suitable for mounting under other conditions. Considering the above circumstances, one aspect of the present disclosure aims to realize a wiring material capable of corresponding to various mountings.

[0219] A wiring material according to one aspect (Appendix D1) of the present disclosure is a wiring material including a base material that is long in a first direction and has flexibility, and a plurality of wirings that are provided on the base material and extend in the first direction, wherein a low-strength portion having a mechanical strength lower than other parts is formed along the first direction. In the above aspect, it is possible to divide the base material at the low-strength portion. That is, it is possible to correspond to mounting in a state where the base material is continuous at the low-strength portion and mounting in a state where the base material is divided at the low-strength portion. That is, a wiring material capable of corresponding to various mountings can be realized.

[0220] In the specific example of Appendix D1 (Appendix D2), the low-strength portion includes a plurality of divided portions arranged at intervals in the first direction, and each of the plurality of divided portions is a bottomed hole or through hole formed in the base material. According to the above embodiment, the low-strength portion can be easily formed by forming a bottomed hole or through hole in the base material.

[0221] In the specific example of Appendix D2 (Appendix D3), the plurality of divisions include a first division, a second division adjacent to the first division, and a third division adjacent to the second division on the opposite side from the first division, and the distance between the first division and the second division is different from the distance between the second division and the third division. According to the above embodiment, the external force required to divide the space between the first division and the second division is different from the external force required to divide the space between the second division and the third division. In other words, it is possible to vary the strength required to divide the low-strength portion according to the position in the first direction.

[0222] In specific examples of Appendix D2 or Appendix D3 (Appendix D4), the distance between two adjacent divisions in the first direction among the plurality of divisions changes along the first direction. According to the above embodiment, it is possible to vary the force required to divide the low-strength portion depending on the position in the first direction.

[0223] In any specific example of Appendix D1 to D4 (Appendix D5), a fracture suppression structure is formed at the end of the low-strength portion to suppress fracture of the base material at that end. According to the above embodiment, excessive fracture of the base material along the extension of the low-strength portion can be suppressed. In a specific example of Appendix D5 (Appendix D6), the fracture suppression structure includes a linear end line that penetrates the base material, and the end line is spiral in plan view.

[0224] In a specific example of Appendix D5 or Appendix D6 (Appendix D7), the plurality of wirings include a first wiring and a second wiring that are adjacent to each other in the second direction, each of the first wiring and the second wiring includes a bent portion that bends in a direction intersecting the first direction, the bent portion of the first wiring and the bent portion of the second wiring are located at different positions in the first direction, and the fracture suppression structure in the low-strength portion between the first wiring and the second wiring is located between the bent portion of the first wiring and the bent portion of the second wiring in a plan view. In the above embodiment, since the fracture suppression structure is located between the bent portion of the first wiring and the bent portion of the second wiring, the distance between the first wiring and the second wiring can be reduced compared to a configuration in which the first wiring and the second wiring are simply straight. Therefore, it is possible to increase the density of the plurality of wirings. [Explanation of symbols]

[0225] 100... Wiring material, 200... Supporting member, 300... Processing device, 10... First base material, 20... Second base material, 21a... End region, 21b... End region, 30... Base material, 31... Bonding material, 32... Slit, 3 3... Fracture suppressing structure, 33a... Through hole, 33b... End line, 33c... Fracture suppressing member, 40... Wiring, 40a... First wiring, 40b... Second wiring, 42... Extension part, 43... Exposed part, 45... Covering part 46...Coating rubber, 50, 50a, 50b...Terminal parts, 51...Support housing, 52, 52a, 52b...Connecting terminals, 60...Retaining member, 61...Adhesive, 62...Through hole, 65...Mold, 66...Storage container, 67...Water, 70, 70a, 70b, 70c...Low-strength part, 71...Separated part, 72...Continuous part, 74...Breakage suppression structure, 74a...Through hole, 74b...End line, 74c...Breakage suppression member.

Claims

1. A substrate that is long in the first direction and flexible, A plurality of wires installed on the substrate and extending in the first direction A wiring material having the following features: In the first region of the substrate, which is a part in the first direction, a plurality of slits along the first direction are formed in parallel in a second direction that intersects the first direction. Each end of the plurality of slits is formed with a fracture-suppressing structure that suppresses fracture of the substrate at that end. The fracture suppression structure is, Including a linear end line that penetrates the substrate, The aforementioned end line is, The first end and, The second end opposite to the first end, It includes a connecting portion that connects the first end and the second end, The connecting portion intersects the extension line of the slit at a position spaced apart from the end of the slit in a plan view, The first end and the second end face in a direction approaching the slit from the connecting portion. Wiring material.

2. A substrate that is long in the first direction and flexible, A plurality of wires installed on the substrate and extending in the first direction A wiring material having the following features: In the first region of the substrate, which is a part in the first direction, a plurality of slits along the first direction are formed in parallel in a second direction that intersects the first direction. Each end of the plurality of slits is formed with a fracture-suppressing structure that suppresses fracture of the substrate at that end. The fracture suppression structure is, Including a linear end line that penetrates the substrate, The aforementioned end line is spiral in shape when viewed from above. Wiring material.

3. The end of the first slit in the first direction and the end of the second slit in the first direction, which is different from the first slit, are located at different positions in the first direction. Wiring material according to claim 1 or claim 2.

4. The length of the first slit in the first direction among the plurality of slits is different from the length of the second slit, which is separate from the first slit, in the first direction. Wiring material according to claim 1 or claim 2.

5. The aforementioned multiple slits are The first slit and A second slit adjacent to the first slit, This includes a third slit adjacent to the second slit on the opposite side of the first slit, The distance between the first slit and the second slit is different from the distance between the second slit and the third slit. Wiring material according to claim 1 or claim 2.

6. The spacing between two adjacent slits in the second direction among the plurality of slits changes along the second direction. Wiring material according to claim 1 or claim 2.

7. In the substrate, a second region, which is a separate part from the first region in the first direction, has a plurality of slits formed in parallel in the second direction, aligned with the first direction. Wiring material according to claim 1 or claim 2.

8. The plurality of wirings include first wirings and second wirings that are adjacent to each other in the second direction. Each of the first and second wirings includes a bent portion that bends in a direction intersecting the first direction, The bent portion of the first wiring and the bent portion of the second wiring are in different positions in the first direction. The fracture suppression structure in the slit between the first wiring and the second wiring among the plurality of slits is located between the bent portion of the first wiring and the bent portion of the second wiring in a plan view. Wiring material according to claim 1 or claim 2.

9. Each of the aforementioned plurality of wires is An extended portion that overlaps the substrate in a plan view, Including an exposed portion extending in the first direction from the end of the substrate in the first direction, The position of the end of the exposed portion of the first wiring among the plurality of wirings in the first direction is different from the position of the end of the exposed portion of the second wiring, which is separate from the first wiring among the plurality of wirings. Wiring material according to claim 1 or claim 2.

10. A low-strength portion is formed along the first direction, which has lower mechanical strength against an external force that divides the base material than other parts. The low-strength portion is a plurality of divided portions arranged at intervals in the first direction, Each of the plurality of divisions is a bottomed hole or through hole formed in the substrate. Wiring material according to claim 1 or claim 2.

11. The aforementioned multiple division sections are, The first section of separation, A second division adjacent to the first division, It includes a third division adjacent to the second division on the opposite side of the first division, The distance between the first division and the second division is different from the distance between the second division and the third division. Wiring material according to claim 10.

12. The distance between two adjacent divisions in the first direction among the plurality of divisions changes along the first direction. Wiring material according to claim 10.

13. The end of the low-strength portion is formed with a fracture-suppressing structure that suppresses fracture of the base material at that end. Wiring material according to claim 10.

14. The fracture suppression structure in the low-strength portion is Including a linear end line that penetrates the substrate, The end line of the fracture-suppressing structure in the low-strength portion is spiral in shape when viewed from above. Wiring material according to claim 13.

15. The plurality of wirings include first wirings and second wirings that are adjacent to each other in the second direction. Each of the first and second wirings includes a bent portion that bends in a direction intersecting the first direction, The bent portion of the first wiring and the bent portion of the second wiring are in different positions in the first direction. The fracture suppression structure in the low-strength portion between the first wiring and the second wiring is located between the bent portion of the first wiring and the bent portion of the second wiring in a plan view. Wiring material according to claim 13.

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