Substrate processing system and transport method

Abstract

To provide a substrate processing system and a conveying method for selectively replacing consumable members having different replacement timings.SOLUTION: A plasma processing apparatus 1 comprises: a vacuum conveying module; a plasma processing module connected with the vacuum conveying module; and a control unit 90. The plasma processing module includes a plasma processing chamber 10, a stage that is arranged in the plasma processing chamber and has a substrate support surface and a ring support surface, a cover ring CR that is arranged on the ring support surface of the stage, an edge ring FR that is arranged on the cover ring to surround a substrate on the substrate support surface of the stage and has an inner diameter smaller than the inner diameter of the cover ring, a plurality of first support pins 521 that are arranged below the ring support surface, a plurality of second support pins 511 that are arranged below the substrate support surface, a first actuator 522 that moves the plurality of first support pins in the vertical direction, and a second actuator 512 that moves the plurality of second support pins in the vertical direction.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a substrate processing system and a transfer method.

Background Art

[0002] There is known a technique in which an edge ring and a cover ring disposed around a wafer placed on an electrostatic chuck on a susceptor provided in a processing chamber where plasma processing is performed are respectively lifted and lowered by a set of lifter pins and transferred one by one (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of selectively replacing consumable members having different replacement timings.

Means for Solving the Problems

[0005] A substrate processing system according to one aspect of the present disclosure comprises a vacuum transport module, a plasma processing module connected to the vacuum transport module, and a controller, wherein the vacuum transport module includes a vacuum transport chamber and a transport robot disposed within the vacuum transport chamber; the plasma processing module includes a plasma processing chamber, a stage disposed within the plasma processing chamber and having a substrate support surface and a ring support surface, a first ring disposed on the ring support surface of the stage so as to surround a substrate on the substrate support surface of the stage, a second ring placed on the first ring, and a lifter configured to raise and lower the first ring and the second ring relative to the stage; the controller is configured to control the transport robot to selectively execute a simultaneous transport mode in which the first ring and the second ring are transported simultaneously, and a single transport mode in which the second ring is transported alone; the single transport mode is executed at the timing of the replacement of the second ring, and the second ring is replaced; and the simultaneous transport mode is executed at the timing of the replacement of the first ring, and both the first ring and the second ring are replaced. death , The outermost diameter of the second ring is smaller than the outermost diameter of the first ring. . [Effects of the Invention]

[0006] According to this disclosure, consumable parts with different replacement timings can be selectively replaced. [Brief explanation of the drawing]

[0007] [Figure 1] A diagram showing an example of a processing system in an embodiment. [Figure 2] Schematic cross-sectional view showing the process module [Figure 3] A magnified view of a portion of Figure 2. [Figure 4] Front cross-sectional view showing an example of a storage module. [Figure 5] Side cross-sectional view showing an example of a storage module. [Figure 6] Schematic plan view showing the upper fork not holding the object being transported. [Figure 7] Schematic plan view showing the upper fork holding the first assembly [Figure 8] Schematic plan view showing the upper fork holding the second assembly [Figure 9] Schematic plan view showing the upper fork holding only the transfer jig [Figure 10] Schematic perspective view showing an example of a cassette in the storage module [Figure 11A] Figure showing an example of an edge ring positioning mechanism [Figure 11B] Figure showing an example of an edge ring positioning mechanism [Figure 11C] Figure showing an example of an edge ring positioning mechanism [Figure 12A] Figure showing an example of a cover ring positioning mechanism [Figure 12B] Figure showing an example of a cover ring positioning mechanism [Figure 12C] Figure showing an example of a cover ring positioning mechanism [Figure 13A] Figure showing an example of an edge ring and cover ring positioning mechanism [Figure 13B] Figure showing an example of an edge ring and cover ring positioning mechanism [Figure 13C] Figure showing an example of an edge ring and cover ring positioning mechanism [Figure 14] Schematic plan view showing an example of the second assembly stored in the cassette [Figure 15] Schematic plan view showing an example of the transfer jig stored in the cassette [Figure 16] Schematic perspective view showing another example of a cassette in the storage module [Figure 17A] Schematic view showing an electrostatic chuck on which an edge ring and a cover ring are placed [Figure 17B] Schematic view showing an electrostatic chuck on which an edge ring and a cover ring are placed <00时00092>Figure showing an example of the simultaneous transfer mode [Figure 18B] Figure showing an example of the simultaneous transfer mode [Figure 18C]Figure showing an example of the simultaneous conveyance mode [Figure 18D] Figure showing an example of the simultaneous conveyance mode [Figure 19A] Figure showing an example of the simultaneous conveyance mode [Figure 19B] Figure showing an example of the simultaneous conveyance mode [Figure 19C] Figure showing an example of the simultaneous conveyance mode [Figure 19D] Figure showing an example of the simultaneous conveyance mode [Figure 20A] Figure showing an example of the individual conveyance mode [Figure 20B] Figure showing an example of the individual conveyance mode [Figure 20C] Figure showing an example of the individual conveyance mode [Figure 20D] Figure showing an example of the individual conveyance mode [Figure 21A] Figure showing an example of the individual conveyance mode [Figure 21B] Figure showing an example of the individual conveyance mode [Figure 21C] Figure showing an example of the individual conveyance mode [Figure 21D] Figure showing an example of the individual conveyance mode [Figure 22A] Figure showing an example of the individual conveyance mode [Figure 22B] Figure showing an example of the individual conveyance mode [Figure 22C] Figure showing an example of the individual conveyance mode [Figure 22D] Figure showing an example of the individual conveyance mode [Figure 23A] Figure showing an example of the individual conveyance mode [Figure 23B] Figure showing an example of the individual conveyance mode [Figure 23C] Figure showing an example of the individual conveyance mode [Figure 23D] Figure showing an example of the individual conveyance mode [Figure 24] Flowchart showing an example of the method for replacing the consumable member of the embodiment [Figure 25] Flowchart showing an example of the simultaneous conveyance mode [Figure 26] Flowchart showing an example of the individual conveyance mode [Figure 27] A flowchart showing another example of a method for replacing consumable components in the embodiment. [Figure 28] A flowchart showing another example of the standalone transport mode. [Figure 29] Schematic cross-sectional view showing a process module according to the first modified embodiment. [Figure 30] This figure shows the state of the lifter in the simultaneous transport mode in the first modified example. [Figure 31] This figure shows the state of the lifter in the single-transport mode in the first modified example. [Figure 32] Schematic cross-sectional view showing a process module relating to a second modified embodiment. [Figure 33A] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 33B] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 33C] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 34A] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 34B] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 34C] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 35A] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 35B] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 35C] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 36A] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 36B] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 36C] A flowchart showing an example of a simultaneous transport mode in the second modified example. [Figure 37A] A flowchart showing an example of a single-unit transport mode in the second modified example. [Figure 37B] A flowchart showing an example of a single-unit transport mode in the second modified example. [Figure 37C] A flowchart showing an example of a single-unit transport mode in the second modified example. [Figure 37D] A flowchart showing an example of a single-unit transport mode in the second modified example. [Figure 38A] A flowchart showing an example of a single-unit transport mode in the second modified example. [Figure 38B] A flowchart showing an example of a single-unit transport mode in the second modified example. [Figure 38C] A flowchart showing an example of a single-unit transport mode in the second modified example. [Figure 38D] A flowchart showing an example of a single-unit transport mode in the second modified example. [Figure 39] Schematic cross-sectional view showing a process module according to a third modified example of the embodiment. [Figure 40A] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 40B] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 41A] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 41B] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 42A] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 42B] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 43A] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 43B] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 44A] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 44B]A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 45A] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 45B] A flowchart showing an example of a simultaneous transport mode in the third modified example. [Figure 46A] A flowchart showing an example of a single-unit transport mode in the third variant. [Figure 46B] A flowchart showing an example of a single-unit transport mode in the third variant. [Figure 47A] A flowchart showing an example of a single-unit transport mode in the third variant. [Figure 47B] A flowchart showing an example of a single-unit transport mode in the third variant. [Figure 48A] A flowchart showing an example of a single-unit transport mode in the third variant. [Figure 48B] A flowchart showing an example of a single-unit transport mode in the third variant. [Figure 49A] A flowchart showing an example of a single-unit transport mode in the third variant. [Figure 49B] A flowchart showing an example of a single-unit transport mode in the third variant. [Modes for carrying out the invention]

[0008] Hereinafter, exemplary embodiments of the present disclosure, not limited to those described herein, will be described with reference to the attached drawings. In all attached drawings, identical or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] [Processing System] Referring to Figure 1, an example of a processing system according to the embodiment will be described. As shown in Figure 1, the processing system PS is a system capable of performing various processes such as plasma processing on a substrate. The substrate may be, for example, a semiconductor wafer.

[0010] The processing system PS includes vacuum transport modules TM1, TM2, process modules PM1 to PM12, load lock modules LL1, LL2, atmospheric transport module LM, storage module SM, etc.

[0011] The vacuum transport modules TM1 and TM2 each have a roughly rectangular shape in plan view. Process modules PM1 to PM6 are connected to two opposing sides of vacuum transport module TM1. Of the other two opposing sides of vacuum transport module TM1, load lock modules LL1 and LL2 are connected to one side, and a path (not shown) for connecting to vacuum transport module TM2 is connected to the other side. The side of vacuum transport module TM1 to which load lock modules LL1 and LL2 are connected is angled according to the two load lock modules LL1 and LL2. Process modules PM7 to PM12 are connected to two opposing sides of vacuum transport module TM2. Of the other two opposing sides of vacuum transport module TM2, a path (not shown) for connecting to vacuum transport module TM1 is connected to one side, and a storage module SM is connected to the other side. Vacuum transport modules TM1 and TM2 have a vacuum chamber (vacuum transport chamber), inside which transport robots TR1 and TR2 are located, respectively.

[0012] The transport robots TR1 and TR2 are configured to rotate, extend, and move up and down. Transport robot TR1 holds and transports substrates and consumable materials with its upper fork (first fork) FK11 and lower fork (second fork) FK12 located at its tip. In the example in Figure 1, transport robot TR1 holds the substrates and consumable materials with its upper fork FK11 and lower fork FK12 and transports them between load lock modules LL1 and LL2, process modules PM1 to PM6 and a path (not shown). Transport robot TR2 holds and transports substrates and consumable materials with its upper fork FK21 and lower fork FK22 located at its tip. In the example in Figure 1, transport robot TR2 holds the substrates and consumable materials with its upper fork FK21 and lower fork FK22 and transports them between process modules PM7 to PM12, storage module SM and a path (not shown). Consumable parts are components that are replaceably installed within process modules PM1 to PM12 and are consumed as various processes such as plasma processing are performed within process modules PM1 to PM12. Consumable parts include, for example, the edge ring FR, the covering ring CR, and the top plate 121 of the upper electrode 12, which will be described later.

[0013] Process modules PM1 to PM12 have a processing chamber (plasma processing chamber) and a stage (mounting platform) located inside. After a substrate is placed on the stage, process modules PM1 to PM12 reduce the pressure inside, introduce a processing gas, apply RF power to generate plasma, and perform plasma processing on the substrate with the plasma. The vacuum transport modules TM1 and TM2 and process modules PM1 to PM12 are separated by a gate valve G1 that can be opened and closed. Edge rings FR, covering rings CR, etc. are arranged on the stage. An upper electrode 12 for applying RF power is located above the stage.

[0014] Load lock modules LL1 and LL2 are positioned between the vacuum transport module TM1 and the atmospheric transport module LM. Load lock modules LL1 and LL2 have a variable internal pressure chamber that can be switched between vacuum and atmospheric pressure. Load lock modules LL1 and LL2 have a stage located inside. When transporting a substrate from the atmospheric transport module LM to the vacuum transport module TM1, load lock modules LL1 and LL2 maintain an internal pressure of atmospheric pressure to receive the substrate from the atmospheric transport module LM, then reduce the internal pressure to transport the substrate to the vacuum transport module TM1. When transporting a substrate from the vacuum transport module TM1 to the atmospheric transport module LM, load lock modules LL1 and LL2 maintain an internal pressure of vacuum to receive the substrate from the vacuum transport module TM1, then increase the internal pressure to atmospheric pressure to transport the substrate to the atmospheric transport module LM. Load lock modules LL1 and LL2 and the vacuum transport module TM1 are separated by a gate valve G2 that can be opened and closed. Load lock modules LL1 and LL2 and the atmospheric transport module LM are separated by a gate valve G3 that can be opened and closed.

[0015] The atmospheric transport module LM is positioned opposite the vacuum transport module TM1. The atmospheric transport module LM may be, for example, an EFEM (Equipment Front End Module). The atmospheric transport module LM is rectangular in shape, equipped with an FFU (Fan Filter Unit), and is an atmospheric transport chamber maintained at atmospheric pressure. Two load lock modules LL1 and LL2 are connected to one side of the atmospheric transport module LM along its longitudinal direction. Load ports LP1 to LP5 are connected to the other side of the atmospheric transport module LM along its longitudinal direction. Containers (not shown) for accommodating multiple (e.g., 25) substrates are placed on the load ports LP1 to LP5. The containers may be, for example, FOUPs (Front-Opening Unified Pods). A transport robot (not shown) for transporting substrates is located inside the atmospheric transport module LM. The transport robot transports substrates between the FOUP and the pressure-variable chambers of the load lock modules LL1 and LL2.

[0016] The storage module SM is detachably connected to the vacuum transport module TM2. The storage module SM has a storage chamber for storing consumable parts. The storage module SM is connected to the vacuum transport module TM2, for example, when replacing consumable parts in process modules PM1 to PM12, and is removed from the vacuum transport module TM2 after the replacement of the consumable parts is complete. This allows for effective use of the area surrounding the processing system PS. However, the storage module SM may always be connected to the vacuum transport module TM2. The storage module SM has a position detection sensor that detects the position of the consumable parts stored in the storage chamber. The consumable parts are transported between process modules PM1 to PM12 and the storage module SM by transport robots TR1 and TR2. The vacuum transport module TM2 and the storage module SM are separated by a gate valve G4 that can be opened and closed.

[0017] The processing system PS is equipped with a control unit CU. The control unit CU controls various parts of the processing system, such as the transport robots TR1 and TR2 installed in the vacuum transport modules TM1 and TM2, the transport robot installed in the atmospheric transport module LM, and the gate valves G1 to G4. For example, the control unit CU is configured to select between a simultaneous transport mode in which the transport robots TR1 and TR2 transport both the edge ring FR and the covering ring CR at the same time, and a single transport mode in which the transport robots TR1 and TR2 transport only the edge ring FR. The simultaneous transport mode and the single transport mode will be described later. In one example, the control unit CU performs the single transport mode more frequently than the simultaneous transport mode.

[0018] The control unit (CU) may be, for example, a computer. The control unit (CU) includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), auxiliary storage device, etc. The CPU operates based on programs stored in the ROM or auxiliary storage device and controls each part of the processing system PS.

[0019] [Plasma Processing Equipment] Referring to Figures 2 and 3, an example of a plasma processing apparatus used as process modules PM1 to PM12 in the processing system PS of Figure 1 will be described.

[0020] The plasma processing apparatus 1 includes a plasma processing chamber 10, a gas supply unit 20, an RF power supply unit 30, an exhaust system 40, a lifter 50, and a control unit 90.

[0021] The plasma processing chamber 10 includes a substrate support 11 and an upper electrode 12. The substrate support 11 is located in the lower region of the plasma processing space 10s within the plasma processing chamber 10. The upper electrode 12 is located above the substrate support 11 and may function as part of the top plate of the plasma processing chamber 10.

[0022] The substrate support section 11 supports the substrate W in the plasma processing space 10s. The substrate support section 11 includes a lower electrode 111, an electrostatic chuck 112, a ring assembly 113, an insulator 115, and a base 116. The electrostatic chuck 112 is positioned on the lower electrode 111.

[0023] The electrostatic chuck 112 has an upper surface including a substrate support surface 112a and a ring support surface 112b. The electrostatic chuck 112 supports the substrate W on the substrate support surface 112a. The electrostatic chuck 112 supports the edge ring FR on the ring support surface 112b. The electrostatic chuck 112 has an insulating material 112c, a first adsorption electrode 112d and a second adsorption electrode 112e. The first adsorption electrode 112d and the second adsorption electrode 112e are embedded in the insulating material 112c. The first adsorption electrode 112d is located below the substrate support surface 112a. The electrostatic chuck 112 adsorbs and holds the substrate W on the substrate support surface 112a by applying a voltage to the first adsorption electrode 112d. The second adsorption electrode 112e is located below the ring support surface 112b. The electrostatic chuck 112 holds the edge ring FR on the ring support surface 112b by adsorption and retention of the edge ring FR by applying a voltage to the second adsorption electrode 112e. In the examples shown in Figures 2 and 3, the electrostatic chuck 112 includes a unipolar electrostatic chuck for adsorption and retention of the substrate W and a bipolar electrostatic chuck for adsorption and retention of the edge ring FR. However, a bipolar electrostatic chuck may be used instead of a unipolar electrostatic chuck, or a unipolar electrostatic chuck may be used instead of a bipolar electrostatic chuck.

[0024] The ring assembly 113 includes an edge ring FR and a covering ring CR. The edge ring FR is an example of a second ring. The edge ring FR has a ring shape and is positioned around the substrate W on the upper surface of the peripheral edge of the lower electrode 111. The edge ring FR improves the uniformity of plasma treatment on the substrate W. The edge ring FR is formed of a conductive material such as silicon (Si) or silicon carbide (SiC). The covering ring CR is an example of a first ring. The covering ring CR has a ring shape and is positioned on the outer periphery of the edge ring FR. The covering ring CR protects the upper surface of the insulator 115 from plasma, for example. The covering ring CR is formed of an insulating material such as quartz. In the example in Figure 2, the inner periphery of the covering ring CR is inward of the outer periphery of the edge ring FR, and the outer periphery of the edge ring FR is outward of the inner periphery of the covering ring CR, so that the edge ring FR and the covering ring CR partially overlap. The outer periphery of the edge ring FR is placed on the inner periphery of the covering ring CR. As a result, when the multiple support pins 521, described later, move up and down, the covering CR and the edge ring FR move up and down together. The insulator 115 is positioned on the base 116 so as to surround the lower electrode 111. The base 116 is fixed to the bottom of the plasma processing chamber 10 and supports the lower electrode 111 and the insulator 115.

[0025] The upper electrode 12, together with the insulating member 13, constitutes the plasma processing chamber 10. The upper electrode 12 supplies one or more types of processing gas from the gas supply unit 20 to the plasma processing space 10s. The upper electrode 12 includes a top plate 121 and a support 122. The lower surface of the top plate 121 defines the plasma processing space 10s. The top plate 121 has a plurality of gas inlets 121a formed therein. Each of the plurality of gas inlets 121a penetrates the top plate 121 in the thickness direction (vertical direction). The support 122 detachably supports the top plate 121. A gas diffusion chamber 122a is provided inside the support 122. A plurality of gas inlets 122b extend downward from the gas diffusion chamber 122a. The plurality of gas inlets 122b communicate with each of the plurality of gas inlets 121a. The support 122 has a gas supply port 122c formed therein. The upper electrode 12 supplies one or more processing gases from the gas supply port 122c to the plasma processing space 10s via the gas diffusion chamber 122a, a plurality of gas inlets 122b, and a plurality of gas inlets 121a.

[0026] An inlet / outlet 10p is formed in the side wall of the plasma processing chamber 10. The substrate W is transported between the plasma processing space 10s and the outside of the plasma processing chamber 10 via the inlet / outlet 10p. The inlet / outlet 10p is opened and closed by a gate valve G1.

[0027] The gas supply unit 20 includes one or more gas sources 21 and one or more flow controllers 22. The gas supply unit 20 supplies one or more types of processing gas from each gas source 21 to the gas supply port 122c via each flow controller 22. The flow controllers 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Furthermore, the gas supply unit 20 may include one or more flow modulation devices that modulate or pulse the flow rate of one or more processing gases.

[0028] The RF power supply unit 30 includes two RF power supplies (a first RF power supply 31a and a second RF power supply 31b) and two matching units (a first matching unit 32a and a second matching unit 32b). The first RF power supply 31a supplies first RF power to the lower electrode 111 via the first matching unit 32a. The frequency of the first RF power may be, for example, 13 MHz to 150 MHz. The second RF power supply 31b supplies second RF power to the lower electrode 111 via the second matching unit 32b. The frequency of the second RF power may be, for example, 400 kHz to 13.56 MHz. Note that a DC power supply may be used instead of the second RF power supply 31b.

[0029] The exhaust system 40 may be connected to, for example, a gas exhaust port 10e located at the bottom of the plasma processing chamber 10. The exhaust system 40 may include a pressure regulating valve and a vacuum pump. The pressure regulating valve regulates the pressure in the plasma processing space 10s. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0030] The lifter 50 raises and lowers the substrate W, edge ring FR, and covering ring CR. The lifter 50 includes a first lifter 51 and a second lifter 52.

[0031] The first lifter 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 are inserted through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112, and are retractable relative to the upper surface of the electrostatic chuck 112. By protruding relative to the upper surface of the electrostatic chuck 112, the plurality of support pins 511 support the substrate W by bringing their upper ends into contact with the lower surface of the substrate W. The actuator 512 raises and lowers the plurality of support pins 511. As the actuator 512, for example, a motor such as a DC motor, stepping motor, or linear motor, an air-driven mechanism such as an air cylinder, or a piezo actuator can be used. The first lifter 51 raises and lowers the plurality of support pins 511 when transferring the substrate W between the transport robots TR1, TR2 and the substrate support part 11.

[0032] The second lifter 52 includes a plurality of support pins 521 and an actuator 522. The plurality of support pins 521 are inserted through holes H2 formed in the insulator 115 and are retractable relative to the upper surface of the insulator 115. By protruding relative to the upper surface of the insulator 115, the plurality of support pins 521 support the covering CR by bringing their upper ends into contact with the lower surface of the covering CR. The actuator 522 raises and lowers the plurality of support pins 521. For example, the same actuator as the actuator 512 can be used as the actuator 522. The second lifter 52 raises and lowers the plurality of support pins 521 when transferring the edge ring FR and the covering CR between the transport robots TR1, TR2 and the substrate support part 11. In the example in Figure 2, the outer circumference of the edge ring FR is placed on the inner circumference of the covering CR. As a result, when the actuator 522 raises and lowers the plurality of support pins 521, the covering CR and the edge ring FR move up and down together.

[0033] The control unit 90 controls each part of the plasma processing apparatus 1. The control unit 90 includes, for example, a computer 91. The computer 91 includes, for example, a CPU 911, a memory unit 912, a communication interface 913, etc. The CPU 911 may be configured to perform various control operations based on a program stored in the memory unit 912. The memory unit 912 includes at least one memory type selected from a group consisting of auxiliary storage devices such as RAM, ROM, HDD (Hard Disk Drive), SSD (Solid State Drive), etc. The communication interface 913 may communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network). The control unit 90 may be provided separately from the control unit CU, or it may be included in the control unit CU.

[0034] [Storage Module] Referring to Figures 4 and 5, an example of a storage module SM included in the processing system PS of Figure 1 will be described.

[0035] The storage module SM has a chamber 70 mounted on a frame 60, with a machine room 81 above the chamber 70. The chamber 70 can be depressurized by an exhaust section 72 connected to an exhaust port 71 located at the bottom. In addition, the chamber 70 is supplied with a purge gas, such as N2 gas, which allows the pressure inside the chamber 70 to be regulated. The machine room 81 is, for example, under atmospheric pressure.

[0036] A storage unit 75 is installed inside the chamber 70, which includes a stage 73 and a basket 74 located below the stage 73. The storage unit 75 can be raised and lowered by a ball screw 76. Inside the machine room 81 are a line sensor 82 for detecting the position and orientation of consumable parts and a motor 77 for driving the ball screw 76. A window 84 made of quartz or the like is provided between the chamber 70 and the machine room 81 so that the line sensor 82 can receive light from a light-emitting unit 83, which will be described later.

[0037] The stage 73 holds the consumable component. The stage 73 has a light-emitting section 83 facing the line sensor 82. The stage 73 is rotatable in the θ direction and rotates the placed consumable component, such as the edge ring FR, to a predetermined orientation. That is, the stage 73 performs alignment of the edge ring FR. In the alignment, the orientation flat (OF) of the edge ring FR is aligned to a predetermined orientation. Alternatively, the center position of the edge ring FR may be aligned during the alignment.

[0038] The line sensor 82 detects the amount of light emitted from the light-emitting unit 83 and outputs the detected amount of light to the control unit CU. The control unit CU detects the orientation flat of the edge ring FR by utilizing the fact that the detected amount of light changes depending on the presence or absence of an orientation flat of the edge ring FR. Based on the detected orientation flat, the control unit CU detects the orientation of the edge ring FR. The line sensor 82 is, for example, a line sensor such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor).

[0039] The basket 74 is located at the bottom of the stage 73. A cassette 78 is placed inside the basket 74. The cassette 78 is a storage container that can be removed from the basket 74. The cassette 78 stores multiple consumable parts with vertical spacing between them. In the example shown in Figure 4, the cassette 78 stores multiple edge rings FR. The cassette 78 is open on the front side of the storage module SM. Details of the cassette 78 will be described later.

[0040] In addition to the stage 73 and basket 74, the storage 75 has guides 79 on its sides that are supported by a ball screw 76. The ball screw 76 connects the top and bottom surfaces of the chamber 70, passes through the top surface of the chamber 70, and is connected to a motor 77 in the machine room 81. The passage through the top surface of the chamber 70 is sealed to allow the ball screw 76 to rotate. The ball screw 76 is rotated by the motor 77, which allows the storage 75 to move vertically (in the Z-axis direction).

[0041] The storage module SM is detachably connected to the vacuum transfer module TM2 via a gate valve G4. The upper fork FK21 and lower fork FK22 of the transfer robot TR2 of the vacuum transfer module TM2 can be inserted into the chamber 70 via the gate valve G4. The upper fork FK21 and lower fork FK22 are used, for example, to load edge rings FR into the cassette 78, to unload edge rings FR placed in the cassette 78, to place edge rings FR onto the stage 73, and to retrieve edge rings FR placed on the stage 73. The door 80 is opened and closed, for example, when removing the cassette 78 from inside the chamber 70 and when installing the cassette 78 inside the chamber 70.

[0042] The light-emitting unit 85 and the count detection sensor 86 detect the number of edge rings FR placed on the cassette 78 when the storage 75 moves the cassette 78 from the bottom side of the chamber 70 to an upper position such as facing the gate valve G4. The light-emitting unit 85 is, for example, an LED (Light Emitting Diode), a semiconductor laser, etc. The count detection sensor 86 detects the amount of light emitted from the light-emitting unit 85 and outputs the detected amount of light to the control unit CU. Based on the detected amount of light, the control unit CU detects the number of edge rings FR by measuring the number of times the light emitted from the light-emitting unit 85 is blocked by the edge rings FR. The count detection sensor 86 is, for example, a photodiode, a phototransistor, etc. Alternatively, the count detection sensor 86 may be a line sensor such as a CCD or CMOS.

[0043] In the above example, the case in which the control unit CU calculates the position information of the edge ring FR based on the amount of light detected by the line sensor 82 in the storage module SM was described, but this disclosure is not limited to this. For example, a position detection sensor including an inner circumference sensor that detects the position of the inner circumference of the edge ring FR and an outer circumference sensor that detects the position of the outer circumference of the edge ring FR may be used. In this case, the control unit CU calculates the position information of the edge ring FR based on the position of the outer circumference of the edge ring FR detected by the inner circumference sensor and the position of the outer circumference of the edge ring FR detected by the outer circumference sensor. Alternatively, for example, another optical sensor or a camera may be used instead of the line sensor 82. In this case, the control unit CU calculates the position information of the edge ring FR based on the image captured by the camera, for example, by using image processing technology.

[0044] [Transport robot] Referring to Figures 6 to 9, the upper fork FK21 of the transport robot TR2 will be described. Note that the lower fork FK22 of the transport robot TR2 may have the same configuration as the upper fork FK21. Also, the upper fork FK11 and lower fork FK12 of the transport robot TR1 may have the same configuration as the upper fork FK21 of the transport robot TR2.

[0045] Figure 6 is a schematic plan view showing the upper fork FK21 when it is not holding an object to be transported. As shown in Figure 6, the upper fork FK21 has a roughly U-shape in plan view. The upper fork FK21 is configured to hold, for example, a substrate W, a transport jig CJ, an edge ring FR, a covering ring CR, a first assembly A1, and a second assembly A2.

[0046] The conveying jig CJ is a jig that supports the edge ring FR from below and can be used when only the edge ring FR needs to be replaced. The conveying jig CJ is configured to support only the edge ring FR without supporting the covering ring CR. For example, the conveying jig CJ is a plate-shaped member having a portion that is longer than the inner diameter of the edge ring FR and shorter than the inner diameter of the covering ring CR. Specifically, the conveying jig CJ is a substantially rectangular plate-shaped member having a diagonal that is longer than the inner diameter of the edge ring FR and shorter than the inner diameter of the covering ring in a plan view. Alternatively, the conveying jig CJ may be a disc-shaped member having a diameter that is longer than the inner diameter of the edge ring FR and shorter than the inner diameter of the covering ring CR.

[0047] The first assembly A1 is an assembly in which the edge ring FR and the covering CR are integrated by placing the edge ring FR on top of the covering CR.

[0048] The second assembly A2 is an assembly in which the transport jig CJ and the edge ring FR are integrated by placing the edge ring FR on top of the transport jig CJ.

[0049] Figure 7 is a schematic plan view showing the upper fork FK21 holding the first assembly A1 (edge ​​ring FR and covering ring CR). As shown in Figure 7, the upper fork FK21 is configured to hold the first assembly A1. This allows the transport robot TR2 to transport the edge ring FR and covering ring CR simultaneously.

[0050] Figure 8 is a schematic plan view showing the upper fork FK21 holding the second assembly A2 (transport jig CJ and edge ring FR). As shown in Figure 8, the upper fork FK21 is configured to hold the second assembly A2. This allows the transport robot TR2 to transport the transport jig CJ and edge ring FR simultaneously.

[0051] Figure 9 is a schematic plan view showing the upper fork FK21 holding only the transport jig CJ. As shown in Figure 9, the upper fork FK21 is configured to hold the transport jig CJ, which does not support the edge ring FR. This allows the transport robot TR2 to transport the transport jig CJ independently.

[0052] 〔cassette〕 Referring further to Figure 10, an example of a cassette 78 in the storage module SM will be described, specifically a cassette 78 that houses the edge ring FR. Figure 10 is a schematic perspective view showing an example of a cassette 78 in the storage module SM. Note that Figure 10 shows the cassette 78 without the edge ring FR stored inside.

[0053] Cassette 78 houses the edge ring FR. Cassette 78 has multiple base plates 781 and multiple guide pins 782.

[0054] Multiple base plates 781 are arranged in multiple stages in the vertical direction. The multiple base plates 781 support the edge ring FR. Each base plate 781 has a substantially rectangular plate shape. Each base plate 781 is made of, for example, resin or metal. Each base plate 781 includes a mounting surface 781a, an outer frame portion 781b, and a fork insertion groove 781c.

[0055] The mounting surface 781a is where the edge ring FR is mounted.

[0056] The outer frame portion 781b (recess) protrudes upward from the mounting surface 781a on the outer circumference of three of the four sides of the mounting surface 781a, excluding the front side into which the upper fork FK21 and lower fork FK22 are inserted. Another base plate 781 is placed on the outer frame portion 781b.

[0057] The fork insertion groove 781c is formed in the mounting surface 781a. The fork insertion groove 781c is recessed relative to the mounting surface 781a and has a roughly U-shape when viewed from above. The upper fork FK21 or lower fork FK22 of the transport robot TR2 is inserted into the fork insertion groove 781c. In one example, when the edge ring FR positioned on the mounting surface 781a is discharged from the cassette 78, the upper fork FK21 or lower fork FK22 of the transport robot TR2 is inserted into the fork insertion groove 781c.

[0058] Multiple guide pins 782 are provided on the mounting surface 781a. Each guide pin 782 may have a tapered conical tip. When the edge ring FR is placed on the mounting surface 781a, the multiple guide pins 782 contact the outer circumference of the edge ring FR to guide it so that it is placed in a predetermined position on the mounting surface 781a. Each guide pin 782 may be made of resin or metal, etc. If made of resin, the generation of particles due to friction when in contact with the outer circumference of the edge ring FR can be suppressed.

[0059] In Figure 10, a cassette 78 housing the edge ring FR is shown as an example, but a cassette 78 housing the transport jig CJ, the covering ring CR, the first assembly A1, and the second assembly A2 may have a similar configuration, except for the multiple guide pins 782.

[0060] For example, in a cassette 78 that houses a covering CR, multiple guide pins 782 are provided at positions that contact the inner circumference of the covering CR. This guides the covering CR to a predetermined position on the mounting surface 781a.

[0061] For example, in a cassette 78 that houses the edge ring FR and the covering ring CR, a plurality of guide pins 782 are provided at positions that contact the outer circumference of the edge ring FR and the inner circumference of the covering ring CR, which are placed on the mounting surface 781a. This guides and places the edge ring FR and the covering ring CR in predetermined positions on the mounting surface 781a.

[0062] An example of the positioning mechanism for the edge ring FR will be described with reference to Figures 11A to 11C. Figures 11A to 11C are diagrams illustrating an example of the positioning mechanism for the edge ring FR. Figure 11A is a top view when the upper fork FK21 is inserted below the edge ring FR placed on the base plate 781. Figure 11B shows a cross-section taken along the dashed line B1-B1 in Figure 11A. Figure 11C is a cross-sectional view when the edge ring FR placed on the base plate 781 is lifted by the upper fork FK21.

[0063] As shown in Figures 11A and 11B, the edge ring FR has a notch FRa on its outer circumference. The notch FRa has, for example, a V-shape in plan view. The opening angle of the V-shape may be set as appropriate, for example, 90°. The notch FRa may also have a curved shape, such as a U-shape, in plan view.

[0064] First, as shown in Figures 11A and 11B, the upper fork FK21 is inserted below the edge ring FR which is placed on the base plate 781.

[0065] Next, as shown in Figure 11C, the upper fork FK21 is raised. This allows the upper fork FK21 to hold the edge ring FR, which is stored in the cassette 78, while positioned on the base plate 781, and transport it to process modules PM1 to PM12.

[0066] In this manner, the upper fork FK21 holds the edge ring FR stored in the cassette 78 while positioned on the base plate 781, and transports it to process modules PM1 to PM12. Therefore, the edge ring FR can be transported to process modules PM1 to PM12 in a precisely positioned state without the need for a separate aligner to position the edge ring FR. As a result, downtime caused by transporting the edge ring FR to an aligner can be reduced. Furthermore, equipment introduction costs can be reduced. In addition, space efficiency can be improved. However, an aligner may be provided separately to more precisely position and transport the edge ring FR using the aligner.

[0067] In the examples shown in Figures 11A to 11C, the edge ring FR is shown having one notch FRa on its outer circumference, but the number of notches FRa is not limited to this. For example, the edge ring FR may have multiple notches FRa on its outer circumference that are spaced apart from each other in the circumferential direction. In this case, it is preferable to provide guide pins 782 corresponding to each of the multiple notches FRa. This reduces angular errors.

[0068] Furthermore, while the examples in Figures 11A to 11C illustrate the use of the upper fork FK21, the lower fork FK22 may also be used.

[0069] Referring to Figures 12A to 12C, an example of the positioning mechanism for the covering CR will be described. Figures 12A to 12C are diagrams illustrating an example of the positioning mechanism for the covering CR. Figure 12A is a top view when the upper fork FK21 is inserted below the covering CR placed on the base plate 781. Figure 12B shows a cross-section taken along the dashed line B2-B2 in Figure 12A. Figure 12C is a cross-sectional view when the covering CR placed on the base plate 781 is lifted by the upper fork FK21.

[0070] As shown in Figures 12A and 12B, the covering CR has a notch CRa on its inner circumference. The notch CRa has, for example, a V-shape in plan view. The opening angle of the V-shape may be set as appropriate, for example, 90°. The notch CRa may also have a curved shape, such as a U-shape, in plan view.

[0071] First, as shown in Figures 12A and 12B, the upper fork FK21 is inserted below the covering CR which is placed on the base plate 781.

[0072] Next, as shown in Figure 12C, the upper fork FK21 is raised. This allows the upper fork FK21 to hold the covering CR, which is stored in the cassette 78, while positioned on the base plate 781, and transport it to process modules PM1 to PM12.

[0073] In this manner, the upper fork FK21 holds the covering CR stored in the cassette 78 while positioned on the base plate 781 and transports it to process modules PM1 to PM12. Therefore, the covering CR can be transported to process modules PM1 to PM12 in a precisely positioned state without the need for a separate aligner to position the covering CR. As a result, downtime caused by transporting the covering CR to an aligner can be reduced. Furthermore, equipment introduction costs can be reduced. In addition, space efficiency can be improved. However, an aligner may be provided separately to more precisely position and transport the covering CR using the aligner.

[0074] In the examples shown in Figures 12A to 12C, the covering CR is shown to have one notch CRa on its inner circumference, but the number of notches CRa is not limited to this. For example, the covering CR may have multiple notches CRa on its inner circumference that are spaced apart from each other in the circumferential direction. In this case, it is preferable to provide guide pins 782 corresponding to each of the multiple notches CRa. This can reduce angular errors.

[0075] Furthermore, while the examples in Figures 12A to 12C illustrate the use of the upper fork FK21, the lower fork FK22 may also be used.

[0076] The positioning mechanism for the edge ring FR and covering ring CR will be described with reference to Figures 13A to 13C. Figures 13A to 13C show an example of the positioning mechanism for the edge ring FR and covering ring CR. Figure 13A is a top view when the upper fork FK21 is inserted below the edge ring FR and covering ring CR placed on the base plate 781. Figure 13B shows a cross-section taken along the dashed line B3-B3 in Figure 13A. Figure 13C is a cross-sectional view when the edge ring FR and covering ring CR placed on the base plate 781 are lifted by the upper fork FK21.

[0077] The positioning mechanism shown in Figures 13A and 13B can be used, for example, when the inner circumference of the covering ring CR is smaller than the outer circumference of the edge ring FR, or when the inner circumference of the covering ring CR is the same as the outer circumference of the edge ring FR, and the process modules PM1 to PM12 are plasma processing apparatuses as shown in Figure 29, which will be described later.

[0078] As shown in Figures 13A and 13B, the edge ring FR has a notch FRa on its outer circumference, and the covering ring CR has a notch CRa on its inner circumference. The notches FRa and CRa have a V-shape in a plan view, for example. The opening angle of the V-shape may be, for example, 90°. The notches FRa and CRa may also have a curved shape, such as a U-shape, in a plan view, for example.

[0079] First, as shown in Figures 13A and 13B, the upper fork FK21 is inserted below the edge ring FR and covering ring CR which are placed on the base plate 781.

[0080] Next, as shown in Figure 13C, the upper fork FK21 is raised. This allows the upper fork FK21 to hold the edge ring FR and covering ring CR, which are stored in the cassette 78, while positioned on the base plate 781, and transport them to process modules PM1 to PM12.

[0081] In this manner, the upper fork FK21, positioned on the base plate 781, holds the edge ring FR and covering ring CR stored in the cassette 78 and transports them to process modules PM1 to PM12. Therefore, the edge ring FR and covering ring CR can be transported to process modules PM1 to PM12 in a precisely positioned state without the need for a separate aligner to position them. As a result, downtime caused by transporting the edge ring FR and covering ring CR to an aligner can be reduced. Furthermore, equipment introduction costs can be reduced. In addition, space efficiency can be improved. However, an aligner may be provided separately to more precisely position and transport the edge ring FR and covering ring CR using the aligner.

[0082] In the examples shown in Figures 13A to 13C, the edge ring FR has one notch FRa on its outer circumference and the covering ring CR has one notch CRa on its inner circumference, but the number of notches FRa and CRa is not limited to these. For example, the edge ring FR may have multiple notches FRa on its outer circumference that are spaced apart from each other in the circumferential direction, and the covering ring CR may have multiple notches CRa on its inner circumference that are spaced apart from each other in the circumferential direction. In this case, it is preferable to provide guide pins 782 corresponding to each of the multiple notches FRa and CRa. This reduces angular errors.

[0083] Furthermore, while the examples in Figures 13A to 13C illustrate the use of the upper fork FK21, the lower fork FK22 may also be used.

[0084] Furthermore, while the examples in Figures 13A to 13C describe the positioning of the edge ring FR and the covering ring CR on their outer or inner circumference, the case is not limited to these. For example, the edge ring FR and the covering ring CR may be positioned by providing recesses (or protrusions) on their back surfaces (the surfaces that are placed on the mounting surface 781a).

[0085] Furthermore, while the examples in Figures 13A to 13C describe a configuration in which the outer circumference of the edge ring FR and the inner circumference of the covering ring CR do not overlap, the system is not limited to this configuration, and the outer circumference of the edge ring FR and the inner circumference of the covering ring CR may overlap. In this case, the edge ring FR may be held in a position relative to the covering ring CR, and in one example, the edge ring FR may be positioned by providing a positioning part on the outer circumference of the covering ring CR to position the covering ring CR. In another example, when the outer circumference of the edge ring FR and the inner circumference of the covering ring CR overlap, recesses (or protrusions) for positioning may be provided in the non-overlapping regions of the edge ring FR and the covering ring CR. In this case, the guide pin 782 should be positioned to engage with the recess. This allows for the positioning of both the edge ring FR and the covering ring CR.

[0086] The above describes the case in which the transport robot TR2 uses the upper fork FK21 to unload the edge ring FR and / or covering ring CR from the cassette 78, with reference to Figures 11A to 13C.

[0087] When loading the edge ring FR and / or covering ring CR into the cassette 78, the upper fork FK21 of the transport robot TR2 may be used to place the edge ring FR and / or covering ring CR onto the base plate 781 of the cassette 78. Alternatively, when the storage module SM is not in operation, for example, an operator may open the door 80 located on the side of the storage module SM facing the gate valve G4 and place the edge ring FR and / or covering ring CR onto the base plate 781 of the cassette 78. Alternatively, another robot may be used to place them.

[0088] Referring to Figure 14, the case in which the second assembly A2 (transport jig CJ and edge ring FR), which is positioned and placed in the storage module SM, is unloaded from the cassette 78 by the upper fork FK21 will be described. The operation shown in Figure 14 is performed, for example, when the outer circumference of the edge ring FR and the inner circumference of the covering ring CR overlap when placed on the electrostatic chuck 112 of the plasma processing apparatus 1, and when the control unit CU selects and executes the single transport mode described later. Figure 14 is a schematic top view showing an example of the second assembly A2 stored in the cassette 78.

[0089] First, as shown in Figure 14, the upper fork FK21 is inserted below the second assembly A2, which is placed on the base plate 781. Next, the upper fork FK21 is raised. As a result, the upper fork FK21 holds the second assembly A2, which is stored in the cassette 78, and transports it to process modules PM1 to PM12.

[0090] In this manner, the transport robot TR2 holds the second assembly A2 (transport jig CJ and edge ring FR) stored in the cassette 78 with its upper fork FK21 and simultaneously transports the transport jig CJ and edge ring FR to process modules PM1 to PM12.

[0091] Note that while Figure 14 illustrates the case using the upper fork FK21, the lower fork FK22 may also be used.

[0092] Referring to Figure 15, the case in which the transport jig CJ, positioned and placed in the storage module SM by the upper fork FK21, is unloaded from the cassette 78 will be described. The operation shown in Figure 15 is performed, for example, when the outer circumference of the edge ring FR and the inner circumference of the covering ring CR overlap when placed on the electrostatic chuck 112 of the plasma processing apparatus 1, and when the control unit CU selects and executes the single transport mode described later. Figure 15 is a schematic plan view showing an example of the transport jig CJ stored in the cassette 78.

[0093] First, as shown in Figure 15, the upper fork FK21 is inserted below the transport jig CJ placed on the base plate 781. Next, the upper fork FK21 is raised. As a result, the upper fork FK21 holds the transport jig CJ stored in the cassette 78 and transports it to process modules PM1 to PM12.

[0094] In this manner, the transport robot TR2 holds the transport jig CJ stored in the cassette 78 with its upper fork FK21 and transports the transport jig CJ independently to process modules PM1 to PM12.

[0095] Note that while Figure 15 illustrates the case using the upper fork FK21, the lower fork FK22 may also be used.

[0096] Referring to Figure 16, another example of the cassette 78 contained in the storage module SM of Figures 4 and 5 will be described. Figure 16 is a schematic perspective view showing another example of the cassette 78 in the storage module SM, and shows cassette 78X which houses an edge ring FR, which is an example of a consumable component.

[0097] The cassette 78X shown in Figure 16 differs from the cassette 78 shown in Figure 10 in that, instead of multiple guide pins 782, it has an inclined block 782b having an inclined surface that contacts the outer circumference of the edge ring FR and holds the edge ring FR in a predetermined position. The other configurations may be the same as those of the cassette 78 shown in Figure 10.

[0098] As yet another example, the cassette 78 may have an inclined block (not shown) having an inclined surface that contacts the inner circumference of the covering CR to hold the covering CR in a predetermined position. As yet another example, the cassette 78 may have an inclined block (not shown) having an inclined surface that contacts the outer circumference of the edge ring FR and the inner circumference of the covering CR to hold the edge ring FR and the covering CR in a predetermined position. The inclined block may also be configured to contact the inner circumference of the edge ring FR to hold the edge ring FR in a predetermined position. The inclined block may also be configured to contact the outer circumference of the covering CR to hold the covering CR.

[0099] [Method for transporting consumable parts] Referring to Figures 17A to 19D, an example of a method for transporting consumable components in the processing system PS of the embodiment will be described, in which the control unit CU selects and executes a simultaneous transport mode in which the transport robot TR2 transports the edge ring FR and the covering ring CR simultaneously. In the following description, it will be assumed that the control unit 90 is included in the control unit CU and that the control unit CU controls the transport robot TR2 and the lifter 50. However, the control unit 90 may be provided separately from the control unit CU, with the control unit CU controlling the transport robot TR2 and the control unit 90 controlling the lifter 50. The outer circumference of the edge ring FR and the inner circumference of the covering ring CR will be assumed to overlap in a plan view. In the initial state, the edge ring FR and the covering ring CR will be placed on the electrostatic chuck 112 as shown in Figures 17A and 17B.

[0100] First, as shown in Figure 18A, the control unit CU raises the multiple support pins 521 from the standby position to the support position. As a result, the upper ends of the multiple support pins 521 come into contact with the lower surface of the covering CR, and the covering CR is lifted by the multiple support pins 521, separating the covering CR from the electrostatic chuck 112. At this time, the outer circumference (outer annular portion) of the edge ring FR is placed on the inner circumference of the covering CR. Therefore, when the covering CR is lifted by the multiple support pins 521, the edge ring FR is also lifted together with the covering CR. In other words, the edge ring FR and the covering CR separate from the electrostatic chuck 112 as a single unit.

[0101] Next, as shown in Figure 18B, the control unit CU inserts the lower fork FK22, which is not holding the object to be conveyed, between the edge ring FR and covering ring CR, which are supported by a plurality of support pins 521, and the electrostatic chuck 112.

[0102] Next, as shown in Figure 18C, the control unit CU lowers the multiple support pins 521 from the support position to the standby position. As a result, the edge ring FR and covering ring CR, which are supported by the multiple support pins 521, are placed on the lower fork FK22.

[0103] Next, as shown in Figure 18D, the control unit CU retracts the lower fork FK22, which holds the edge ring FR and the covering ring CR.

[0104] Next, as shown in Figure 19A, the control unit CU inserts the upper fork FK21, which holds the replacement edge ring FR and the replacement covering ring CR, above the electrostatic chuck 112. The replacement edge ring FR may be new (unused) or used but not heavily worn. The replacement covering ring CR may be new (unused) or used but not heavily worn.

[0105] Next, as shown in Figure 19B, the control unit CU raises the multiple support pins 521 from the standby position to the support position. As a result, the upper ends of the multiple support pins 521 come into contact with the lower surface of the covering CR held by the upper fork FK21, and the covering CR is lifted by the multiple support pins 521, separating from the upper fork FK21. At this time, the outer circumference of the edge ring FR rests on the inner circumference of the covering CR. Therefore, the multiple support pins 521 lift the edge ring FR and the covering CR together. In other words, the edge ring FR and the covering CR separate from the upper fork FK21 as a single unit.

[0106] Next, as shown in Figure 19C, the control unit CU retracts the upper fork FK21 that is not holding the object to be transported.

[0107] Next, as shown in Figure 19D, the control unit CU lowers the multiple support pins 521 from the support position to the standby position. As a result, the edge ring FR and the covering ring CR, supported by the multiple support pins 521, are placed on the electrostatic chuck 112. Thus, as shown in Figures 17A and 17B, the edge ring FR and the covering ring CR are simultaneously transported into the plasma processing chamber 10 and placed on the electrostatic chuck 112.

[0108] Thus, when removing the edge ring FR and covering ring CR, which are placed on the electrostatic chuck 112, from the plasma processing chamber 10, the control unit CU performs the reverse operation of the loading of the edge ring FR and covering ring CR as described above.

[0109] As described above, the processing system PS of this embodiment can transport the edge ring FR and the covering ring CR simultaneously.

[0110] Referring to Figures 20A to 23D, another example of a consumable component transport method in the processing system PS of the embodiment will be described, in which the control unit CU selects and executes a single transport mode in which only the edge ring FR is transported by the transport robot TR2. In the following description, it will be assumed that the control unit 90 is included in the control unit CU and that the control unit CU controls the transport robot TR2 and the lifter 50. However, the control unit 90 may be provided separately from the control unit CU, with the control unit CU controlling the transport robot TR2 and the control unit 90 controlling the lifter 50. It will be assumed that the outer circumference of the edge ring FR and the inner circumference of the covering ring CR have an overlapping configuration in plan view. Also, in the initial state, it will be assumed that the edge ring FR and the covering ring CR are placed on the electrostatic chuck 112 as shown in Figures 17A and 17B.

[0111] First, as shown in Figure 20A, the control unit CU raises the multiple support pins 521 from the standby position to the support position. As a result, the upper ends of the multiple support pins 521 come into contact with the lower surface of the covering CR, and the covering CR is lifted by the multiple support pins 521, separating it from the electrostatic chuck 112. At this time, the outer circumference of the edge ring FR is resting on the inner circumference of the covering CR. Therefore, when the covering CR is lifted by the multiple support pins 521, the edge ring FR is also lifted together with the covering CR. In other words, the edge ring FR and the covering CR separate from the electrostatic chuck 112 as a single unit.

[0112] Next, as shown in Figure 20B, the control unit CU inserts the lower fork FK22, which holds the transport jig CJ, between the edge ring FR and covering ring CR, which are supported by a plurality of support pins 521, and the electrostatic chuck 112.

[0113] Next, as shown in Figure 20C, the control unit CU raises the multiple support pins 511 from the standby position to the support position. As a result, the upper ends of the multiple support pins 511 come into contact with the lower surface of the transport jig CJ, the transport jig CJ is lifted by the multiple support pins 511, and the transport jig CJ moves away from the lower fork FK22.

[0114] Next, as shown in Figure 20D, the control unit CU retracts the lower fork FK22 that is not holding the object to be transported.

[0115] Next, as shown in Figure 21A, the control unit CU lowers the multiple support pins 521 from the support position to the standby position. At this time, since the inner circumference (inner annular portion) of the edge ring FR is supported by the transport jig CJ, only the covering ring CR supported by the multiple support pins 521 is placed on the electrostatic chuck 112.

[0116] Next, as shown in Figure 21B, the control unit CU inserts the lower fork FK22, which is not holding the object to be transported, between the transport jig CJ and edge ring FR, which are supported by a plurality of support pins 511, and the electrostatic chuck 112.

[0117] Next, as shown in Figure 21C, the control unit CU lowers the multiple support pins 511 from the support position to the standby position. As a result, the transport jig CJ and edge ring FR, which are supported by the multiple support pins 511, are placed on the lower fork FK22.

[0118] Next, as shown in Figure 21D, the control unit CU retracts the lower fork FK22, which holds the transport jig CJ and the edge ring FR.

[0119] Next, as shown in Figure 22A, the control unit CU inserts the upper fork FK21, which holds the transport jig CJ holding the replacement edge ring FR, above the electrostatic chuck 112.

[0120] Next, as shown in Figure 22B, the control unit CU controls the multiple support pins 511 to raise them from the standby position to the support position. As a result, the upper ends of the multiple support pins 511 come into contact with the lower surface of the transport jig CJ held by the upper fork FK21, and the transport jig CJ is lifted by the multiple support pins 511, moving away from the upper fork FK21. At this time, the inner circumference of the edge ring FR is placed on the transport jig CJ. Therefore, when the transport jig CJ is lifted by the multiple support pins 511, the edge ring FR is also lifted together with the transport jig CJ. In other words, the transport jig CJ and the edge ring FR move away from the upper fork FK21 as a single unit.

[0121] Next, as shown in Figure 22C, the control unit CU retracts the upper fork FK21 that is not holding the object to be transported.

[0122] Next, as shown in Figure 22D, the control unit CU raises the multiple support pins 521 from the standby position to the support position. As a result, the upper ends of the multiple support pins 521 come into contact with the lower surface of the covering ring CR placed on the electrostatic chuck 112, and the covering ring CR is lifted by the multiple support pins 521, separating the covering ring CR from the electrostatic chuck 112. In addition, the outer circumference of the edge ring FR placed on the transport jig CJ is placed on the inner circumference of the covering ring CR.

[0123] Next, as shown in Figure 23A, the control unit CU inserts the upper fork FK21, which does not hold the object to be conveyed, between the conveying jig CJ, edge ring FR and covering ring CR and the electrostatic chuck 112.

[0124] Next, as shown in Figure 23B, the control unit CU lowers the multiple support pins 511 from the support position to the standby position. At this time, since the outer circumference of the edge ring FR is placed on the inner circumference of the covering ring CR, only the transport jig CJ supported by the multiple support pins 511 is placed on the upper fork FK21.

[0125] Next, as shown in Figure 23C, the control unit CU moves the upper fork FK21, which is holding the transport jig CJ, out of the way.

[0126] Next, as shown in Figure 23D, the control unit CU lowers the multiple support pins 521 from the support position to the standby position. As a result, the edge ring FR and covering ring CR, supported by the multiple support pins 521, are placed on the electrostatic chuck 112.

[0127] As described above, according to the processing system PS of this embodiment, the edge ring FR can be transported independently without replacing the covering CR. As a result, only the edge ring FR is brought into the plasma processing chamber 10 and placed on the electrostatic chuck 112 on which the covering CR is placed.

[0128] Thus, when only the edge ring FR of the edge ring FR and covering ring CR placed on the electrostatic chuck 112 is to be removed from the plasma processing chamber 10, the control unit CU performs the reverse operation of the loading of the edge ring FR as described above.

[0129] [Method for replacing consumable parts] Referring to Figure 24, an example of a method for replacing consumable parts in the embodiment will be described. Figure 24 is a flowchart showing an example of a method for replacing consumable parts in the embodiment. Below, the case of replacing consumable parts in the aforementioned process module PM12 will be used as an example. Note that the method for replacing consumable parts in the embodiment shown in Figure 24 is performed by the control unit CU controlling each part of the processing system PS.

[0130] In step S10, the control unit CU determines whether or not the covering CR needs to be replaced. In this embodiment, the control unit CU determines whether or not the covering CR needs to be replaced based on, for example, the RF integrated time, the RF integrated power, and the integrated value of a specific step in the recipe. The RF integrated time, RF integrated power, and the integrated value of a specific step in the recipe will be described later. Alternatively, the control unit CU may determine whether or not the covering CR needs to be replaced by detecting the height position of the covering CR using, for example, optical means. In another example, the control unit CU may count the number of times the edge ring FR has been replaced and replace the covering CR when a predetermined value is reached. For example, the covering CR may be replaced once when the edge ring FR has been replaced three times. In this case, the covering CR is replaced at the same time as the third replacement of the edge ring FR. In yet another example, the control unit CU may replace the edge ring FR and the covering CR simultaneously in the covering CR replacement cycle. The flowchart in Figure 24 shows an example where the edge ring FR and the covering CR are replaced simultaneously in the covering CR replacement cycle.

[0131] If the control unit CU determines in step S10 that the covering CR needs to be replaced, it proceeds to step S20. On the other hand, if the control unit CU determines in step S10 that the covering CR does not need to be replaced, it proceeds to step S40.

[0132] In step S20, the control unit CU determines whether the edge ring FR and the covering ring CR can be replaced. The determination of whether the edge ring FR and the covering ring CR can be replaced can be made using the same determination method as the determination of whether the edge ring FR can be replaced, as described later. However, a different determination method may be used. If the control unit CU determines in step S20 that the edge ring FR and the covering ring CR can be replaced, it proceeds to step S30. On the other hand, if the control unit CU determines in step S20 that the edge ring FR and the covering ring CR cannot be replaced, it repeats step S20.

[0133] In step S30, the control unit CU selects the simultaneous transport mode and instructs the transport robot TR2 to transport the edge ring FR and the covering ring CR simultaneously. Details of step S30 will be described later.

[0134] In step S40, the control unit CU determines whether or not the edge ring FR needs to be replaced. In this embodiment, the control unit CU determines whether or not the edge ring FR needs to be replaced based, for example, on the RF integration time, RF integration power, and the integrated value of a specific step in the recipe.

[0135] RF integrated time is the integrated value of the time during which high-frequency power was supplied to the process module PM12 during a predetermined plasma treatment. RF integrated power is the integrated value of the high-frequency power supplied to the process module PM12 during a predetermined plasma treatment. The integrated value of a specific step in the recipe is the integrated value of the time during which high-frequency power was supplied or the integrated value of the high-frequency power during the step in the process performed by the process module PM12 in which the edge ring FR is machined. Note that the RF integrated time, RF integrated power, and the integrated value of a specific step in the recipe are calculated starting from the point in time when the edge ring FR was replaced, such as when the equipment was installed or when maintenance was performed.

[0136] When determining whether or not the edge ring FR needs to be replaced based on the RF integration time, the control unit (CU) determines that the edge ring FR needs to be replaced if the RF integration time reaches a threshold. Conversely, the control unit (CU) determines that the edge ring FR does not need to be replaced if the RF integration time has not reached a threshold. The threshold is a value determined based on preliminary experiments, etc., according to the type of material of the edge ring FR.

[0137] When determining whether or not the edge ring FR needs to be replaced based on the RF integrated power, the control unit (CU) determines that the edge ring FR needs to be replaced if the RF integrated power reaches a threshold. Conversely, the control unit (CU) determines that the edge ring FR does not need to be replaced if the RF integrated power does not reach a threshold. The threshold is a value determined through preliminary experiments, etc., depending on the type of material of the edge ring FR.

[0138] When determining whether or not the edge ring FR needs to be replaced based on the integrated values ​​of a specific step in the recipe, the control unit (CU) determines that the edge ring FR needs to be replaced if the RF integrated time or RF integrated power in that specific step reaches a threshold. Conversely, the control unit (CU) determines that the edge ring FR does not need to be replaced if the RF integrated time or RF integrated power in that specific step does not reach a threshold. When determining whether or not the edge ring FR needs to be replaced based on the integrated values ​​of a specific step in the recipe, the timing for replacing the edge ring FR can be calculated based on the step in which high-frequency power is applied and the edge ring FR is worn down. Therefore, the timing for replacing the edge ring FR can be calculated with particularly high accuracy. The threshold value is determined according to the type of material of the edge ring FR through preliminary experiments, etc.

[0139] Furthermore, the control unit CU may determine whether or not the edge ring FR needs to be replaced by detecting its height position, for example, using optical means.

[0140] If the control unit CU determines in step S40 that the edge ring FR needs to be replaced, it proceeds to step S50. On the other hand, if the control unit CU determines that the edge ring FR does not need to be replaced, it returns to step S10.

[0141] In step S50, the control unit CU determines whether or not the edge ring FR can be replaced. In this embodiment, the control unit CU determines that the edge ring FR can be replaced if, for example, no processing has been performed on the substrate W in the process module PM12 that performs the edge ring FR replacement. Conversely, the control unit CU determines that the edge ring FR cannot be replaced if processing has been performed on the substrate W in the process module PM12. The control unit CU may also determine that the edge ring FR can be replaced if, for example, processing of substrate W of the same lot as the substrate W being processed in the process module PM12 has been completed. In this case, the control unit CU determines that the edge ring FR cannot be replaced until processing of substrate W of the same lot as the substrate W being processed in the process module PM12 has been completed.

[0142] If the control unit CU determines in step S50 that the edge ring FR can be replaced, it proceeds to step S60. On the other hand, if the control unit CU determines that the edge ring FR cannot be replaced, it repeats step S50.

[0143] In step S60, the control unit CU selects the single-unit transport mode and instructs the transport robot TR2 to transport only the edge ring FR. Details of step S60 will be described later.

[0144] Next, referring to Figure 25, the details of step S30 will be described. Step S30 includes a first cleaning step S31, a removal step S32, a second cleaning step S33, a receiving step S34, and a seasoning step S35. Each step will be described below.

[0145] The first cleaning step S31 is a step in which the process module PM12 is cleaned. In the first cleaning step S31, the control unit CU cleans the process module PM12 by controlling the gas introduction system, exhaust system, power introduction system, etc. The cleaning process is a process in which deposits generated in the process module PM12 by plasma treatment are removed by the plasma of the treatment gas, etc., and the inside of the process module PM12 is stabilized in a clean state. By performing the first cleaning step S31, when the edge ring FR and covering CR are discharged from the stage in the discharge step S32, it is possible to suppress the stirring up of deposits inside the process module PM12. As the treatment gas, for example, oxygen (O2) gas, carbon fluoride (CF) gas, nitrogen (N2) gas, argon (Ar) gas, helium (He) gas, or a mixture of two or more of these can be used. Furthermore, when cleaning the process module PM12, depending on the processing conditions, a substrate W such as a dummy wafer may be placed on the upper surface of the electrostatic chuck 112 to protect the electrostatic chuck 112 of the stage while the cleaning process is being performed. Note that if there are no deposits in the process module PM12, or if there is no risk of deposits being stirred up, the first cleaning step S31 may be omitted. Also, if the edge ring FR and covering CR are adsorbed to the stage by the electrostatic chuck 112, static discharge processing should be performed before the next unloading step S32. In order to remove deposits from the back surface of the edge ring FR and covering CR, the edge ring FR and covering CR may be lifted away from the electrostatic chuck 112 and the insulator 115 during the execution of the first cleaning step S31. Also, during the execution of the first cleaning step S31, the state of the edge ring FR and covering CR may be changed between a lifted state and a non-lifted state. Thus, in the first cleaning step S31, the cleaning process may be performed with the edge ring FR and the covering ring CR lifted up and / or not lifted up.

[0146] The unloading step S32 is a step in which the edge ring FR and covering CR are unloaded from the process module PM12 without exposing the process module PM12 to the atmosphere. In unloading step S32, the control unit CU controls each part of the processing system PS to unload the edge ring FR and covering CR from the process module PM12 without exposing the process module PM12 to the atmosphere. Specifically, the gate valve G1 is opened, and the transport robot TR2 unloads the edge ring FR and covering CR, which are placed on a stage inside the process module PM12, from the process module PM12. For example, the control unit CU controls each part of the processing system PS to unload the edge ring FR and covering CR, which are placed on a stage inside the process module PM12. Subsequently, the gate valve G4 is opened, and the transport robot TR2 stores the edge ring FR and covering CR unloaded from the process module PM12 into the storage module SM. For example, the control unit CU controls each part of the processing system PS and, using the transport method shown in Figures 18A to 18D, transports the edge ring FR and covering ring CR out of the process module PM2 and stores them in the storage module SM.

[0147] The second cleaning step S33 is a step of cleaning the surface on which the edge ring FR and covering CR of the stage of the process module PM12 are placed. In the second cleaning step S33, the control unit CU performs cleaning on the surface on which the edge ring FR and covering CR of the stage of the process module PM12 are placed by controlling the gas introduction system, exhaust system, power introduction system, etc. The cleaning process in the second cleaning step S33 can be carried out in the same manner as the first cleaning step S31, for example. That is, as the processing gas, for example, O2 gas, CF-based gas, N2 gas, Ar gas, He gas, or a mixture of two or more of these gases can be used. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, a substrate W such as a dummy wafer may be placed on the upper surface of the electrostatic chuck 112 of the stage in order to protect it, and the cleaning process may be performed with the substrate W placed on the upper surface of the electrostatic chuck 112. Note that the second cleaning step S33 may be omitted.

[0148] Step S34 is the step of loading the edge ring FR and covering CR into the process module PM12 without exposing the process module PM12 to the atmosphere and placing them on the stage. In step S34, the control unit CU controls each part of the processing system PS to load the edge ring FR and covering CR into the process module PM12 without exposing the process module PM12 to the atmosphere. Specifically, the gate valve G4 is opened and the transport robot TR2 unloads the replacement edge ring FR and covering CR housed in the storage module SM. Subsequently, the gate valve G1 is opened and the transport robot TR2 loads the replacement edge ring FR and covering CR into the process module PM12 and places them on the stage. For example, the control unit CU controls each part of the processing system PS and places the edge ring FR and covering CR housed in the storage module SM onto the stage inside the process module PM12 using the transport method shown in Figures 19A to 19D.

[0149] The seasoning step S35 is a step in which the process module PM12 is seasoned. In the seasoning step S35, the control unit CU performs the seasoning process on the process module PM12 by controlling the gas introduction system, exhaust system, power introduction system, etc. The seasoning process is a process to stabilize the temperature and deposit state inside the process module PM12 by performing a predetermined plasma treatment. In addition, after the seasoning process on the process module PM12 in the seasoning step S35, a quality control wafer may be brought into the process module PM12 and a predetermined treatment may be performed on the quality control wafer. This makes it possible to confirm whether the state of the process module PM12 is normal or not. Note that the seasoning step S35 may be omitted.

[0150] As described above, according to the processing system PS of the embodiment, the edge ring FR and covering CR are removed from the process module PM12 by the transport robot TR2 without exposing the process module PM12 to the atmosphere. Subsequently, the inside of the process module PM12 is cleaned, and then the edge ring FR and covering CR are brought into the process module PM12 by the transport robot TR2. This allows the edge ring FR and covering CR to be replaced simultaneously without the need for an operator to manually replace them. Therefore, the time required to replace the edge ring FR and covering CR can be reduced, and productivity can be improved. In addition, since the surface on which the edge ring FR and covering CR are placed is cleaned before they are brought in, the presence of deposits between the edge ring FR and covering CR and the surface on which they are placed can be suppressed. As a result, good contact between the two can be maintained, and the temperature controllability of the edge ring FR and covering CR can be maintained well.

[0151] Next, referring to Figure 26, the details of step S60 will be described. Step S60 includes a first cleaning step S61, a removal step S62, a second cleaning step S63, a receiving step S64, and a seasoning step S65. Each step will be described below.

[0152] The first cleaning step S61 is a step in which the process module PM12 is cleaned. In the first cleaning step S61, the control unit CU cleans the process module PM12 by controlling the gas introduction system, exhaust system, power introduction system, etc. The cleaning process is a process in which deposits generated in the process module PM12 by plasma processing are removed by the plasma of the processing gas, etc., and the inside of the process module PM12 is stabilized in a clean state. By performing the first cleaning step S61, when the edge ring FR is unloaded from the stage in the unloading step S62, it is possible to suppress the stirring up of deposits inside the process module PM12. As the processing gas, for example, O2 gas, CF-based gas, N2 gas, Ar gas, He gas, or a mixture of two or more of these can be used. Also, when cleaning the process module PM12, depending on the processing conditions, a substrate W such as a dummy wafer may be placed on the upper surface of the electrostatic chuck 112 of the stage in order to protect the electrostatic chuck 112, and the cleaning process may be performed with the substrate W placed on the upper surface of the electrostatic chuck 112. If there is no deposit in the process module PM12, or if there is no risk of deposits being stirred up, the first cleaning step S61 may be omitted. Also, if the edge ring FR is adsorbed to the stage by the electrostatic chuck 112, static discharge treatment should be performed before the next unloading step S62. In order to remove deposits from the back surface of the edge ring FR and / or covering ring CR, the edge ring FR and / or covering ring CR may be lifted away from the electrostatic chuck 112 and the insulator 115 during the execution of the first cleaning step S61. Also, during the execution of the first cleaning step S61, the state of the edge ring FR and covering ring CR may be changed between a lifted state and a restrained state. Thus, in the first cleaning step S61, the cleaning process may be performed with the edge ring FR and covering ring CR lifted and / or restrained.

[0153] Step S62 is the step of unloading the edge ring FR from inside the process module PM12 without exposing the process module PM12 to the atmosphere. In step S62, the control unit CU controls each part of the processing system PS to unload the edge ring FR from inside the process module PM12 without exposing the process module PM12 to the atmosphere. Specifically, the gate valve G1 is opened and the transport robot TR2 unloads the edge ring FR, which is placed on a stage inside the process module PM12, from the process module PM12. For example, the control unit CU controls each part of the processing system PS to unload the edge ring FR, which is placed on a stage inside the process module PM12. Subsequently, the gate valve G4 is opened and the transport robot TR2 stores the edge ring FR unloaded from the process module PM12 into the storage module SM. For example, the control unit CU controls each part of the processing system PS and unloads the edge ring FR from inside the process module PM2 and stores it in the storage module SM using the transport method shown in Figures 20A to 21D.

[0154] The second cleaning step S63 is a step of cleaning the surface on which the edge ring FR of the stage of the process module PM12 is placed. In the second cleaning step S63, the control unit CU performs cleaning on the surface on which the edge ring FR of the stage of the process module PM12 is placed by controlling the gas introduction system, exhaust system, power introduction system, etc. The cleaning process in the second cleaning step S63 can be carried out in the same manner as the first cleaning step S61, for example. That is, as the processing gas, for example, O2 gas, CF-based gas, N2 gas, Ar gas, He gas, or a mixture of two or more of these gases can be used. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, a substrate W such as a dummy wafer may be placed on the upper surface of the electrostatic chuck 112 of the stage in order to protect it, and the cleaning process may be performed with the substrate W placed on the upper surface of the electrostatic chuck 112. Note that the second cleaning step S63 may be omitted.

[0155] Step S64 involves loading the edge ring FR into the process module PM12 and placing it on the stage without exposing the process module PM12 to the atmosphere. In step S64, the control unit CU controls each part of the processing system PS to load the edge ring FR into the process module PM12 without exposing the process module PM12 to the atmosphere. Specifically, the gate valve G4 is opened, and the transport robot TR2 unloads the replacement edge ring FR housed in the storage module SM. Subsequently, the gate valve G1 is opened, and the transport robot TR2 loads the replacement edge ring FR into the process module PM12 and places it on the stage. For example, the control unit CU controls each part of the processing system PS and places the edge ring FR housed in the storage module SM onto the stage inside the process module PM12 using the transport method shown in Figures 22A to 23D.

[0156] The seasoning step S65 is a step in which the process module PM12 is seasoned. In the seasoning step S65, the control unit CU performs the seasoning process on the process module PM12 by controlling the gas introduction system, exhaust system, power introduction system, etc. The seasoning process is a process to stabilize the temperature and deposit state inside the process module PM12 by performing a predetermined plasma treatment. In addition, after the seasoning process on the process module PM12 in the seasoning step S65, a quality control wafer may be brought into the process module PM12 and a predetermined treatment may be performed on the quality control wafer. This makes it possible to confirm whether the state of the process module PM12 is normal or not. Note that the seasoning step S65 may be omitted.

[0157] As described above, according to the processing system PS of the embodiment, the edge ring FR is removed from the process module PM12 by the transport robot TR2 without exposing the process module PM12 to the atmosphere. Subsequently, the inside of the process module PM12 is cleaned, and then the edge ring FR is brought into the process module PM12 by the transport robot TR2. This allows the edge ring FR to be replaced independently without the operator having to manually replace it. Therefore, the time required to replace the edge ring FR can be reduced, and productivity can be improved. In addition, since the surface on which the edge ring FR is placed is cleaned before the edge ring FR is brought in, the presence of deposits between the edge ring FR and the surface on which it is placed can be suppressed. As a result, good contact between the two can be maintained, and the temperature controllability of the edge ring FR can be maintained well.

[0158] Referring to Figure 27, another example of a method for replacing consumable parts in the embodiment will be described. Figure 27 is a flowchart showing another example of a method for replacing consumable parts in the embodiment. Below, the case of replacing consumable parts in the process module PM12 described above will be used as an example. Note that the method for replacing consumable parts in the embodiment shown in Figure 27 is performed by the control unit CU controlling each part of the processing system PS.

[0159] In step S110, the control unit CU determines whether or not the covering CR needs to be replaced. In step S110, for example, the same determination method as in step S10 described above can be used.

[0160] If the control unit CU determines in step S110 that the covering CR needs to be replaced, it proceeds to step S120. On the other hand, if the control unit CU determines in step S110 that the covering CR does not need to be replaced, it proceeds to step S170.

[0161] In step S120, the control unit CU determines whether or not the edge ring FR needs to be replaced. In this embodiment, the control unit CU determines whether or not the edge ring FR needs to be replaced based, for example, on the RF integration time, RF integration power, and the integrated value of a specific step in the recipe. Alternatively, the control unit CU may determine whether or not the edge ring FR needs to be replaced by detecting the height position of the edge ring FR using, for example, optical means.

[0162] If the control unit CU determines in step S120 that the edge ring FR needs to be replaced, it proceeds to step S130. On the other hand, if the control unit CU determines in step S120 that the edge ring FR does not need to be replaced, it proceeds to step S150.

[0163] In step S130, the control unit CU determines whether the edge ring FR and the covering ring CR can be replaced. In step S130, for example, the same determination method as in step S20 described above can be used.

[0164] If the control unit CU determines in step S130 that the edge ring FR and the covering ring CR can be replaced, it proceeds to step S140. On the other hand, if the control unit CU determines in step S130 that the edge ring FR and the covering ring CR cannot be replaced, it repeats step S130.

[0165] In step S140, the control unit CU selects the simultaneous transport mode and has the transport robot TR2 transport the edge ring FR and the covering ring CR simultaneously. In step S140, for example, the same transport method as in step S30 described above can be used.

[0166] In step S150, the control unit CU determines whether or not the covering CR can be replaced. In this embodiment, the control unit CU determines that the covering CR can be replaced if, for example, no processing has been performed on the substrate W in the process module PM12 that performs the covering CR replacement. Conversely, the control unit CU determines that the covering CR cannot be replaced if processing has been performed on the substrate W in the process module PM12. The control unit CU may also determine that the covering CR can be replaced if, for example, processing of substrate W of the same lot as the substrate W being processed in the process module PM12 has been completed. In this case, the control unit CU determines that the covering CR cannot be replaced until processing of substrate W of the same lot as the substrate W being processed in the process module PM12 has been completed.

[0167] If the control unit CU determines in step S150 that the covering CR can be replaced, it proceeds to step S160. On the other hand, if the control unit CU determines in step S150 that the covering CR cannot be replaced, it repeats step S150.

[0168] In step S160, the control unit CU instructs the transport robot TR2 to perform an operation to replace only the covering CR. Details of step S160 will be described later.

[0169] In step S170, the control unit CU determines whether or not the edge ring FR needs to be replaced. In this embodiment, the control unit CU determines whether or not the edge ring FR needs to be replaced based, for example, on the RF integration time, RF integration power, and the integrated value of a specific step in the recipe. Alternatively, the control unit CU may determine whether or not the edge ring FR needs to be replaced by detecting the height position of the edge ring FR using, for example, optical means.

[0170] If the control unit CU determines in step S170 that the edge ring FR needs to be replaced, it proceeds to step S180. On the other hand, if the control unit CU determines that the edge ring FR does not need to be replaced, it returns to step S110.

[0171] In step S180, the control unit CU determines whether or not the edge ring FR can be replaced. In step S180, for example, the same determination method as in step S50 described above can be used.

[0172] If the control unit CU determines in step S180 that the edge ring FR can be replaced, it proceeds to step S190. On the other hand, if the control unit CU determines in step S180 that the edge ring FR cannot be replaced, it repeats step S180.

[0173] In step S190, the control unit CU selects the single-unit transport mode and has the transport robot TR2 transport only the edge ring FR. In step S190, for example, the same transport method as in step S60 described above can be used.

[0174] Next, referring to Figure 28, the details of step S160 will be described. Step S160 includes a first cleaning step S161, a removal step S162, a second cleaning step S163, a receiving step S164, and a seasoning step S165. Each step will be described below.

[0175] The first cleaning step S161 is a step in which the process module PM12 is cleaned. In the first cleaning step S161, the control unit CU cleans the process module PM12 by controlling the gas introduction system, exhaust system, power introduction system, etc. The cleaning process is a process in which deposits generated in the process module PM12 by plasma processing are removed by the plasma of the processing gas, etc., and the inside of the process module PM12 is stabilized in a clean state. By performing the first cleaning step S161, when the edge ring FR and covering ring CR are unloaded from the stage in the unloading step S162, it is possible to suppress the stirring up of deposits inside the process module PM12. As the processing gas, for example, O2 gas, CF-based gas, N2 gas, Ar gas, He gas, or a mixture of two or more of these can be used. Also, when cleaning the process module PM12, depending on the processing conditions, a substrate W such as a dummy wafer may be placed on the upper surface of the electrostatic chuck 112 of the stage in order to protect the electrostatic chuck 112, and the cleaning process may be performed with the substrate W placed on the upper surface of the electrostatic chuck 112. Furthermore, if there is no deposit in the process module PM12, or if there is no risk of deposits being stirred up, the first cleaning step S161 may be omitted. Also, if the edge ring FR is adsorbed to the stage by the electrostatic chuck 112, static discharge treatment should be performed before the next unloading step S162. In order to remove deposits from the back surface of the edge ring FR and / or covering ring CR, the edge ring FR and / or covering ring CR may be lifted away from the electrostatic chuck 112 and the insulator 115 during the execution of the first cleaning step S161. Also, during the execution of the first cleaning step S161, the state of the edge ring FR and covering ring CR may be changed between a lifted state and a restrained state. Thus, in the first cleaning step S161, the cleaning process may be performed with the edge ring FR and covering ring CR lifted and / or restrained.

[0176] The unloading step S162 is a step in which the edge ring FR and covering ring CR are unloaded from the process module PM12 without exposing the process module PM12 to the atmosphere. In unloading step S162, the control unit CU controls each part of the processing system PS to unload the edge ring FR and covering ring CR from the process module PM12 without exposing the process module PM12 to the atmosphere. Specifically, the gate valve G1 is opened, and the transport robot TR2 simultaneously unloads the edge ring FR and covering ring CR, which are placed on a stage inside the process module PM12, from the process module PM12. For example, the control unit CU controls each part of the processing system PS to simultaneously unload the edge ring FR and covering ring CR, which are placed on a stage inside the process module PM12. Subsequently, the gate valve G4 is opened, and the transport robot TR2 simultaneously stores the edge ring FR and covering ring CR, which have been unloaded from the process module PM12, into the storage module SM. For example, the control unit CU controls each part of the processing system PS and, using the transport method shown in Figures 18A to 18D, transports the edge ring FR and covering ring CR out of the process module PM2 and stores them in the storage module SM.

[0177] Furthermore, in the discharge step S162, the edge ring FR and the covering ring CR may be discharged separately. For example, the control unit CU may control each part of the processing system PS and, after dischargeing the edge ring FR placed on the stage inside the process module PM12, discharge the covering ring CR placed on the stage inside the process module PM12.

[0178] The second cleaning step S163 is a step of cleaning the surface on which the edge ring FR and covering CR of the stage of the process module PM12 are placed. In the second cleaning step S163, the control unit CU performs cleaning on the surface on which the edge ring FR and covering CR of the stage of the process module PM12 are placed by controlling the gas introduction system, exhaust system, power introduction system, etc. The cleaning process in the second cleaning step S163 can be carried out in the same manner as the first cleaning step S161, for example. That is, as the processing gas, for example, O2 gas, CF-based gas, N2 gas, Ar gas, He gas, or a mixture of two or more of these gases can be used. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, a substrate W such as a dummy wafer may be placed on the upper surface of the electrostatic chuck 112 of the stage in order to protect it, and the cleaning process may be performed with the substrate W placed on the upper surface of the electrostatic chuck 112. Note that the second cleaning step S163 may be omitted.

[0179] Step S164 is the step of loading the edge ring FR and replacement covering CR, which were unloaded in step S162, into the process module PM12 without exposing the process module PM12 to the atmosphere, and placing them on the stage. In step S164, the control unit CU controls each part of the processing system PS to load the edge ring FR and replacement covering CR, which were unloaded in step S162, into the process module PM12 without exposing the process module PM12 to the atmosphere. Specifically, the gate valve G4 is opened, and the transport robot TR2 unloads the used edge ring FR, which was unloaded from the process module PM12 in step S162 and stored in the storage module SM, and the replacement covering CR, which is stored in the storage module SM. Subsequently, the gate valve G1 is opened, and the transport robot TR2 loads the used edge ring FR and replacement covering CR into the process module PM12 and places them on the stage. For example, the control unit CU controls each part of the processing system PS and places the used edge ring FR and replacement covering ring CR stored in the storage module SM onto the stage in the process module PM12 using the transport method shown in Figures 19A to 19D.

[0180] Furthermore, in the loading step S164, the edge ring FR and the covering ring CR may be loaded separately. For example, the control unit CU may control each part of the processing system PS, place the covering ring CR on a stage inside the process module PM12, and then place the edge ring FR on a stage inside the process module PM12.

[0181] The seasoning step S165 is a step in which the process module PM12 is seasoned. In the seasoning step S165, the control unit CU performs the seasoning process on the process module PM12 by controlling the gas introduction system, exhaust system, power introduction system, etc. The seasoning process is a process to stabilize the temperature and deposit state inside the process module PM12 by performing a predetermined plasma treatment. In addition, after the seasoning process on the process module PM12 in the seasoning step S165, a quality control wafer may be brought into the process module PM12 and a predetermined treatment may be performed on the quality control wafer. This makes it possible to confirm whether the state of the process module PM12 is normal or not. Note that the seasoning step S165 may be omitted.

[0182] [First variation] Referring to Figures 29 to 31, another example of a plasma processing device used as process modules PM1 to PM12 in the processing system PS of Figure 1 will be described.

[0183] Plasma processing apparatus 1X includes a plasma processing chamber 10X and a lifter 50X, replacing the plasma processing chamber 10 and lifter 50 in plasma processing apparatus 1. Other configurations may be the same as those of plasma processing apparatus 1.

[0184] The plasma processing chamber 10X includes a substrate support 11X and an upper electrode 12. The substrate support 11X is located in the lower region of the plasma processing space 10s within the plasma processing chamber 10X. The upper electrode 12 is located above the substrate support 11X and may function as part of the top plate of the plasma processing chamber 10X.

[0185] The substrate support section 11X supports the substrate W in the plasma processing space 10s. The substrate support section 11X includes a lower electrode 111, an electrostatic chuck 112, a ring assembly 113X, an insulator 115, and a base 116. The electrostatic chuck 112 is positioned on the lower electrode 111. The electrostatic chuck 112 supports the substrate W on its upper surface. The ring assembly 113X includes an edge ring FRX and a covering ring CRX. The edge ring FRX has an annular shape and is positioned around the substrate W on the upper surface of the peripheral edge of the lower electrode 111. The edge ring FRX improves, for example, the uniformity of the plasma processing. The covering ring CRX has an annular shape and is positioned on the outer periphery of the edge ring FRX. The covering ring CRX protects, for example, the upper surface of the insulator 115 from the plasma. In the example of Figure 29, the outer diameter of the edge ring FRX is the same as, or smaller than, the inner diameter of the covering ring CRX. In other words, in a plan view, the edge ring FRX and the covering ring CRX do not overlap. As a result, the edge ring FRX and the covering ring CRX move up and down independently. The insulator 115 is positioned on the base 116 so as to surround the lower electrode 111. The base 116 is fixed to the bottom of the plasma processing chamber 10X and supports the lower electrode 111 and the insulator 115.

[0186] The lifter 50X raises and lowers the substrate W, edge ring FRX, and covering ring CRX. The lifter 50X includes a first lifter 51, a third lifter 53, and a fourth lifter 54.

[0187] The first lifter 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 are inserted through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112, and are retractable relative to the upper surface of the electrostatic chuck 112. By protruding relative to the upper surface of the electrostatic chuck 112, the plurality of support pins 511 support the substrate W by bringing their upper ends into contact with the lower surface of the substrate W. The actuator 512 raises and lowers the plurality of support pins 511. As the actuator 512, a motor such as a DC motor, stepping motor, or linear motor, an air-driven mechanism such as an air cylinder, or a piezo actuator can be used. The first lifter 51 raises and lowers the plurality of support pins 511 when transferring the substrate W between the transport robots TR1, TR2 and the substrate support part 11.

[0188] The third lifter 53 includes a plurality of support pins 531 and an actuator 532. The plurality of support pins 531 are inserted through holes H3 formed in the insulator 115 and are retractable relative to the upper surface of the insulator 115. By protruding relative to the upper surface of the insulator 115, the plurality of support pins 531 support the edge ring FRX by bringing their upper ends into contact with the lower surface of the edge ring FRX. The actuator 532 raises and lowers the plurality of support pins 531. For example, the same actuator as actuator 512 can be used as actuator 532.

[0189] The fourth lifter 54 includes a plurality of support pins 541 and an actuator 542. The plurality of support pins 541 are inserted through holes H4 formed in the insulator 115 and are retractable relative to the upper surface of the insulator 115. By protruding relative to the upper surface of the insulator 115, the plurality of support pins 541 support the covering CRX by bringing their upper ends into contact with the lower surface of the covering CRX. The actuator 542 raises and lowers the plurality of support pins 541. For example, the same actuator as the actuator 512 can be used as the actuator 542.

[0190] In the lifter 50X, when transferring the edge ring FRX and covering ring CRX between the transport robots TR1 and TR2 and the substrate support section 11, multiple support pins 531 and 541 are raised and lowered. For example, when the transport robots TR1 and TR2 unload the edge ring FRX and covering ring CRX placed on the electrostatic chuck 112, the multiple support pins 531 and 541 are raised as shown in Figure 30. As a result, the edge ring FRX is lifted by the multiple support pins 531, and the covering ring CRX is lifted by the multiple support pins 541, allowing the transport robots TR1 and TR2 to unload the edge ring FRX and covering ring CRX simultaneously.

[0191] Furthermore, in the lifter 50X, when only the edge ring FRX is being transferred between the transport robots TR1 and TR2 and the substrate support section 11, the multiple support pins 531 are raised and lowered. For example, when the transport robots TR1 and TR2 are to unload only the edge ring FRX placed on the electrostatic chuck 112, the multiple support pins 531 are raised as shown in Figure 31. As a result, only the edge ring FRX is lifted by the multiple support pins 531, and the transport robots TR1 and TR2 can unload the edge ring FRX individually.

[0192] [Second variation] (composition) Referring to Figure 32, another example of a plasma processing apparatus used as process modules PM1 to PM12 in the processing system PS of Figure 1 will be described. The following description will focus on the differences from plasma processing apparatus 1.

[0193] The plasma processing apparatus includes a lifter 50Y. The lifter 50Y includes a first lifter 51 and a fifth lifter 55.

[0194] The fifth lifter 55 includes a plurality of support pins 551 and an actuator (not shown).

[0195] The support pin 551 is a stepped support pin formed from a cylindrical (solid rod-shaped) member. The support pin 551 has a lower rod portion 552 and an upper rod portion 553, in order from bottom to top. The outer diameter of the lower rod portion 552 is larger than the outer diameter of the upper rod portion 553. As a result, a stepped portion is formed by the upper end surface 552a of the lower rod portion 552. The lower rod portion 552 and the upper rod portion 553 are integrally molded.

[0196] The support pin 551 is inserted through a through hole H11 formed in the lower electrode 111, a through hole H12 formed in the insulator 115, and a through hole H13 formed in the covering CR, and is capable of protruding into and out of the upper surface of the insulator 115 and the upper surface of the covering CR. The inner diameters of the through holes H11 and H12 are slightly larger than the outer diameter of the lower rod portion 552. The inner diameter of the through hole H13 is slightly larger than the outer diameter of the upper rod portion 553 and smaller than the outer diameter of the lower rod portion 552.

[0197] The support pin 551 is displaceable between a standby position, a first support position, and a second support position.

[0198] The standby position is when the upper end surface 553a of the upper rod portion 553 is below the lower surface of the edge ring FR. When the support pin 551 is in the standby position, the edge ring FR and the covering ring CR are supported on the electrostatic chuck 112 and the insulator 115, respectively, without being lifted by the support pin 551.

[0199] The first support position is a position above the standby position. The first support position is a position where the upper end surface 553a of the upper rod portion 553 protrudes above the upper surface of the covering CR, and the upper end surface 552a of the lower rod portion 552 is below the lower surface of the covering CR. By moving to the first support position, the support pin 551 supports the edge ring FR by bringing the upper end surface 553a of the upper rod portion 553 into contact with the recess FRr formed on the lower surface of the edge ring FR.

[0200] The second support position is located above the first support position. The second support position is the position where the upper end surface 552a of the lower rod portion 552 protrudes above the upper surface of the insulator 115. By moving to the second support position, the support pin 551 supports the edge ring FR by bringing the upper end surface 553a of the upper rod portion 553 into contact with the recess FRr, and supports the covering ring CR by bringing the upper end surface 552a of the lower rod portion 552 into contact with the lower surface of the covering ring CR.

[0201] The actuator raises and lowers multiple support pins 551. Examples of actuators that can be used include motors such as DC motors, stepping motors, and linear motors, air-driven mechanisms such as air cylinders, and piezo actuators.

[0202] When the fifth lifter 55 is transferring the edge ring FR between the transport robots TR1, TR2 and the substrate support section 11, it lifts the edge ring FR by moving the multiple support pins 551 to a first support position. Furthermore, when the fifth lifter 55 is transferring the edge ring FR and the covering ring CR between the transport robots TR1, TR2 and the substrate support section 11, it lifts the covering ring CR and the edge ring FR by moving the multiple support pins 551 to a second support position.

[0203] (Method for transporting consumable parts: Simultaneous transport mode) Referring to Figures 33A to 36C, we will describe another example of a method for transporting consumable components in the processing system PS of the embodiment, in which the control unit CU selects and executes a simultaneous transport mode in which the transport robot TR2 transports the edge ring FR and the covering ring CR simultaneously. Specifically, we will describe the case in which, after simultaneously unloading the edge ring FR and the covering ring CR from the plasma processing apparatus shown in Figure 32, the replacement edge ring FR and the covering ring CR are simultaneously loaded into the plasma processing apparatus.

[0204] In the following description, the control unit 90 is included in the control unit CU, and the control unit CU controls the transport robot TR2 and the lifter 50Y. However, the control unit 90 may be provided separately from the control unit CU, with the control unit CU controlling the transport robot TR2 and the control unit 90 controlling the lifter 50Y. Furthermore, the outer circumference of the edge ring FR and the inner circumference of the covering ring CR are assumed to overlap in a plan view.

[0205] First, as shown in Figure 33A, the control unit CU raises the multiple support pins 551 from their standby positions. As a result, the upper end surface 553a of the upper rod portion 553 comes into contact with the lower surface of the edge ring FR, the edge ring FR is lifted by the multiple support pins 551, and the edge ring FR moves away from the electrostatic chuck 112.

[0206] Next, as shown in Figure 33B, the control unit CU further raises the multiple support pins 551 to the second support position. As a result, the upper end surface 552a of the lower rod portion 552 contacts the lower surface of the covering CR, the covering CR is lifted by the multiple support pins 551, and the covering CR is separated from the insulator 115. In this way, when the multiple support pins 551 are raised from the standby position to the second support position, the edge ring FR and the covering CR are lifted and supported by the multiple support pins 551 while separated from each other.

[0207] Next, as shown in Figure 33C, the control unit CU inserts the lower fork FK22, which is not holding the object to be conveyed, between the edge ring FR and covering ring CR, which are supported by a plurality of support pins 551, and the electrostatic chuck 112.

[0208] Next, as shown in Figure 34A, the control unit CU lowers the multiple support pins 551 from the second support position. As a result, the covering CR, supported by the multiple support pins 551, is placed on the lower fork FK22.

[0209] Next, as shown in Figure 34B, the control unit CU lowers the multiple support pins 551 further to the standby position. As a result, the edge ring FR, supported by the multiple support pins 551, is placed on the covering ring CR. In this way, when the multiple support pins 551 have lowered from the second support position to the standby position, the edge ring FR and the covering ring CR are placed on the lower fork FK22.

[0210] Next, as shown in Figure 34C, the control unit CU retracts the lower fork FK22, which holds the edge ring FR and the covering ring CR.

[0211] Next, as shown in Figure 35A, the control unit CU inserts the upper fork FK21, which holds the replacement edge ring FR and the replacement covering ring CR, above the electrostatic chuck 112.

[0212] Next, as shown in Figure 35B, the control unit CU raises the multiple support pins 551 from their standby positions. As a result, the upper end surface 553a of the upper rod portion 553 comes into contact with the lower surface of the edge ring FR held by the upper fork FK21, the edge ring FR is lifted by the multiple support pins 551, and the edge ring FR moves away from the upper fork FK21.

[0213] Next, as shown in Figure 35C, the control unit CU further raises the multiple support pins 551 to the second support position. As a result, the upper end surface 552a of the lower rod portion 552 contacts the lower surface of the covering CR held by the upper fork FK21, the covering CR is lifted by the multiple support pins 551, and the covering CR moves away from the upper fork FK21.

[0214] Next, as shown in Figure 36A, the control unit CU retracts the upper fork FK21 that is not holding the object to be transported.

[0215] Next, as shown in Figure 36B, the control unit CU lowers the multiple support pins 551 from the second support position. As a result, the covering CR, supported by the multiple support pins 551, is placed on the insulator 115.

[0216] Next, as shown in Figure 36C, the control unit CU lowers the multiple support pins 551 further to the standby position. As a result, the edge ring FR, supported by the multiple support pins 551, is placed on the electrostatic chuck 112.

[0217] As explained above, in the plasma processing apparatus shown in Figure 32, the edge ring FR and covering ring CR can be simultaneously removed from the plasma processing apparatus, and then the replacement edge ring FR and covering ring CR can be simultaneously loaded into the plasma processing apparatus.

[0218] (Method for transporting consumable parts: Single-unit transport mode) Referring to Figures 37A to 38D, we will describe another example of a consumable component transport method in the processing system PS of the embodiment, in which the control unit CU selects and executes a single transport mode in which only the edge ring FR is transported by the transport robot TR2. Specifically, we will describe the case in which the edge ring FR is transported alone from the plasma processing apparatus shown in Figure 32, and then a replacement edge ring FR is transported alone into the plasma processing apparatus.

[0219] In the following description, the control unit 90 is included in the control unit CU, and the control unit CU controls the transport robot TR2 and the lifter 50Y. However, the control unit 90 may be provided separately from the control unit CU, with the control unit CU controlling the transport robot TR2 and the control unit 90 controlling the lifter 50Y. Furthermore, the outer circumference of the edge ring FR and the inner circumference of the covering ring CR are assumed to overlap in a plan view.

[0220] First, as shown in FIG. 37A, the control unit CU raises a plurality of support pins 551 from the standby position to the first support position. As a result, the upper end surface 553a of the upper bar portion 553 abuts against the lower surface of the edge ring FR, the edge ring FR is lifted by the plurality of support pins 551, and the edge ring FR is separated from the electrostatic chuck 112.

[0221] Subsequently, as shown in FIG. 37B, the control unit CU causes the lower fork FK22 that does not hold the conveyance object to enter between the edge ring FR supported by the plurality of support pins 551 and the electrostatic chuck 112.

[0222] Subsequently, as shown in FIG. 37C, the control unit CU lowers the plurality of support pins 511 from the first support position to the standby position. As a result, the edge ring FR supported by the plurality of support pins 511 is placed on the lower fork FK22.

[0223] Subsequently, as shown in FIG. 37D, the control unit CU causes the lower fork FK22 holding the edge ring FR to exit.

[0224] Subsequently, as shown in FIG. 38A, the control unit CU causes the upper fork FK21 holding the replacement edge ring FR to enter above the electrostatic chuck 112.

[0225] Subsequently, as shown in FIG. 38B, the control unit CU controls the plurality of support pins 511 to raise them from the standby position to the first support position. As a result, the upper end surface 553a of the upper bar portion 553 abuts against the lower surface of the edge ring FR held by the upper fork FK21, the edge ring FR is lifted by the plurality of support pins 511, and the edge ring FR is separated from the upper fork FK21.

[0226] Subsequently, as shown in FIG. 38C, the control unit CU causes the upper fork FK21 that does not hold the conveyance object to exit.

[0227] Next, as shown in Figure 38D, the control unit CU lowers the multiple support pins 551 from the first support position to the standby position. As a result, the edge ring FR, supported by the multiple support pins 551, is placed on the electrostatic chuck 112.

[0228] As explained above, in the plasma processing apparatus shown in Figure 32, the edge ring FR can be removed from the plasma processing apparatus by itself, and then a replacement edge ring FR can be loaded into the plasma processing apparatus by itself.

[0229] [Third variation] (composition) Referring to Figure 39, another example of a plasma processing apparatus used as process modules PM1 to PM12 in the processing system PS of Figure 1 will be described. The following description will focus on the differences from plasma processing apparatus 1.

[0230] The plasma processing apparatus includes a ring assembly 113Z. The ring assembly 113Z includes an edge ring FR, a covering ring CR, and a transport ring HR.

[0231] The edge ring FR has a ring shape and is positioned around the substrate W on the upper surface of the peripheral edge of the lower electrode 111. The edge ring FR improves the uniformity of plasma treatment on the substrate W. The edge ring FR is formed of a conductive material such as Si or SiC. A refrigerant channel 117 is formed inside the lower electrode 111. Cooling water, a refrigerant such as Garden is supplied to the refrigerant channel 117 from a chiller unit (not shown).

[0232] The covering CR has a ring shape and is positioned on the outer periphery of the edge ring FR. The covering CR protects the upper surface of the insulator 115 from, for example, plasma. The covering CR is formed from a conductive material such as Si or SiC.

[0233] The transport ring HR is placed on the insulator 115. In a plan view, the inner circumference of the transport ring HR overlaps with the outer circumference of the edge ring FR, and the outer circumference of the transport ring HR overlaps with the inner circumference of the covering ring CR. The edge ring FR is placed on the upper surface of the inner circumference of the transport ring HR. The covering ring CR is placed on the outer circumference of the transport ring HR. The transport ring HR has a through hole H22 through which the upper rod portion 563 of the support pin 561, which will be described later, is inserted. The transport ring HR is made of, for example, silicon dioxide (SiO2). The transport ring HR may also be made of a ceramic material such as alumina (Al2O3). The transport ring HR may also be made of a conductive material such as Si or SiC with a higher electrical resistivity than the edge ring FR, that is, a conductive material such as Si or SiC whose impurity concentration is adjusted so that it has a higher electrical resistivity than the material that makes up the edge ring FR.

[0234] The plasma processing apparatus includes a lifter 50Z. The lifter 50Z includes a first lifter 51 and a sixth lifter 56. The sixth lifter 56 includes a plurality of support pins 561 and actuators (not shown).

[0235] The support pin 561 is a stepped support pin formed from a cylindrical (solid rod-shaped) member. The support pin 561 has a lower rod portion 562 and an upper rod portion 563, in order from bottom to top. The outer diameter of the lower rod portion 562 is larger than the outer diameter of the upper rod portion 563. As a result, a stepped portion is formed by the upper end surface 562a of the lower rod portion 562. The lower rod portion 562 and the upper rod portion 563 are integrally molded.

[0236] The support pin 561 is inserted through the through holes H21 and H22 and is capable of protruding from the upper surface of the insulator 115 and the upper surface of the transport ring HR. The inner diameter of the through hole H21 is slightly larger than the outer diameter of the lower rod portion 562. The inner diameter of the through hole H22 is slightly larger than the outer diameter of the upper rod portion 563 and smaller than the outer diameter of the lower rod portion 562.

[0237] The support pin 561 is displaceable between a standby position, a first support position, and a second support position.

[0238] The standby position is when the upper end surface 563a of the upper rod portion 563 is below the lower surface of the edge ring FR. When the support pin 561 is in the standby position, the edge ring FR, the covering ring CR, and the transport ring HR are supported on the electrostatic chuck 112 or the insulator 115 without being lifted by the support pin 561.

[0239] The first support position is a position above the standby position. The first support position is a position where the upper end surface 563a of the upper rod portion 563 protrudes above the upper surface of the conveying ring HR, and the upper end surface 562a of the lower rod portion 562 is below the lower surface of the conveying ring HR. By moving to the first support position, the support pin 561 supports the edge ring FR by bringing the upper end surface 563a of the upper rod portion 563 into contact with the lower surface of the edge ring FR.

[0240] The second support position is located above the first support position. The second support position is where the upper end surface 562a of the lower rod portion 562 protrudes above the upper surface of the insulator 115. By moving to the second support position, the support pin 561 supports the edge ring FR by bringing the upper end surface 563a of the upper rod portion 563 into contact with the lower surface of the edge ring FR, and supports the transport ring HR by bringing the upper end surface 562a of the lower rod portion 562 into contact with the lower surface of the transport ring HR. At this time, the inner circumference of the covering ring CR rests on the upper surface of the outer circumference of the transport ring HR. Therefore, when the transport ring HR is lifted by the multiple support pins 561, the covering ring CR is also lifted together with the transport ring HR. That is, the transport ring HR and the covering ring CR move away from the insulator 115 as a single unit.

[0241] The actuator raises and lowers multiple support pins 561. The actuator can be a motor such as a DC motor, stepping motor, or linear motor, an air-driven mechanism such as an air cylinder, or a piezo actuator.

[0242] When the sixth lifter 56 transfers the edge ring FR between the transfer robots TR1 and TR2 and the substrate support portion 11, it lifts the edge ring FR by moving a plurality of support pins 561 to the first support position. Further, when the sixth lifter 56 transfers the edge ring FR and the cover ring CR between the transfer robots TR1 and TR2 and the substrate support portion 11, it lifts the cover ring CR, the edge ring FR, and the transfer ring HR by moving a plurality of support pins 561 to the second support position.

[0243] (Method for transporting consumable members: Simultaneous transport mode) Referring to FIGS. 40A to 45B, as another example of the method for transporting consumable members in the processing system PS of the embodiment, a case where the control unit CU selects and executes a simultaneous transport mode in which the transfer robot TR2 simultaneously transports the edge ring FR, the cover ring CR, and the transfer ring HR will be described. Specifically, a case where the edge ring FR, the cover ring CR, and the transfer ring HR are simultaneously unloaded from the plasma processing apparatus shown in FIG. 39 and then the edge ring FR, the cover ring CR, and the transfer ring HR for replacement are simultaneously loaded into the plasma processing apparatus will be described.

[0244] Hereinafter, it will be described on the assumption that the control unit 90 is included in the control unit CU and the control unit CU controls the transfer robot TR2 and the lifter 50Z. However, the control unit 90 may be provided separately from the control unit CU, the control unit CU may control the transfer robot TR2, and the control unit 90 may control the lifter 50Z.

[0245] First, as shown in FIG. 40A, the control unit CU raises a plurality of support pins 561 from the standby position. As a result, the upper end surface 563a of the upper rod portion 563 abuts on the lower surface of the edge ring FR, the edge ring FR is lifted by the plurality of support pins 561, and the edge ring FR is separated from the electrostatic chuck 112.

[0246] Next, as shown in Figure 40B, the control unit CU further raises the multiple support pins 561 to the second support position. As a result, the upper end surface 562a of the lower rod portion 562 contacts the lower surface of the transport ring HR, and the transport ring HR is lifted by the multiple support pins 561, separating it from the insulator 115. At this time, the outer circumference of the covering ring CR is resting on the outer circumference of the transport ring HR. Therefore, when the transport ring HR is lifted by the multiple support pins 561, the covering ring CR is also lifted together with the transport ring HR. That is, the transport ring HR and the covering ring CR separate from the insulator 115 as a single unit. In this way, when the multiple support pins 561 are raised from the standby position to the second support position, the edge ring FR, the transport ring HR and the covering ring CR are lifted and supported by the multiple support pins 561 while separated from each other.

[0247] Next, as shown in Figure 41A, the control unit CU inserts the lower fork FK22, which is not holding the object to be transported, between the transport ring HR, which is supported by a plurality of support pins 561, and the electrostatic chuck 112.

[0248] Next, as shown in Figure 41B, the control unit CU lowers the multiple support pins 561 from the second support position. As a result, the covering ring CR and the transport ring HR, which are supported by the multiple support pins 561, are placed on the lower fork FK22.

[0249] Next, as shown in Figure 42A, the control unit CU lowers the multiple support pins 561 further to the standby position. As a result, the edge ring FR, supported by the multiple support pins 561, is placed on the transport ring HR. In this way, when the multiple support pins 561 have lowered from the second support position to the standby position, the edge ring FR, the covering ring CR, and the transport ring HR are placed on the lower fork FK22.

[0250] Next, as shown in Figure 42B, the control unit CU retracts the lower fork FK22, which holds the edge ring FR, the covering ring CR, and the transport ring HR.

[0251] Next, as shown in Figure 43A, the control unit CU inserts the upper fork FK21, which holds the replacement edge ring FR, the replacement cover ring CR, and the replacement transport ring HR, above the electrostatic chuck 112. Note that the transport ring HR that has been unloaded may be used instead of the replacement transport ring HR.

[0252] Next, as shown in Figure 43B, the control unit CU raises the multiple support pins 561 from their standby positions. As a result, the upper end surface 563a of the upper rod portion 563 comes into contact with the lower surface of the edge ring FR held by the upper fork FK21, the edge ring FR is lifted by the multiple support pins 561, and the edge ring FR moves away from the upper fork FK21.

[0253] Next, as shown in Figure 44A, the control unit CU further raises the multiple support pins 561 to the second support position. As a result, the upper end surface 562a of the lower rod portion 562 contacts the lower surface of the transport ring HR held by the upper fork FK21, and the transport ring HR is lifted by the multiple support pins 561, separating it from the upper fork FK21. At this time, the outer circumference of the covering ring CR is placed on the outer circumference of the transport ring HR. Therefore, when the transport ring HR is lifted by the multiple support pins 561, the covering ring CR is also lifted together with the transport ring HR. That is, the transport ring HR and the covering ring CR are lifted together by the multiple support pins 561, separating them from the upper fork FK21. In this way, when the multiple support pins 561 are raised from the standby position to the second support position, the edge ring FR, the transport ring HR and the covering ring CR are lifted and supported by the multiple support pins 561 while separated from each other.

[0254] Next, as shown in Figure 44B, the control unit CU retracts the upper fork FK21 that is not holding the object to be transported.

[0255] Next, as shown in Figure 45A, the control unit CU lowers the multiple support pins 561 from the second support position. As a result, the transport ring HR and the covering ring CR, which are supported by the multiple support pins 561, are placed on the insulator 115.

[0256] Next, as shown in Figure 45B, the control unit CU lowers the multiple support pins 561 further to the standby position. As a result, the edge ring FR, supported by the multiple support pins 561, is placed on the electrostatic chuck 112.

[0257] As explained above, in the plasma processing apparatus shown in Figure 39, the edge ring FR and covering ring CR can be simultaneously removed from the plasma processing apparatus, and then replacement edge ring FR and covering ring CR can be simultaneously loaded into the plasma processing apparatus.

[0258] (Method for transporting consumable parts: Single-unit transport mode) Referring to Figures 46A to 49B, we will describe another example of a consumable component transport method in the processing system PS of the embodiment, in which the control unit CU selects and executes a single transport mode in which only the edge ring FR is transported by the transport robot TR2. Specifically, we will describe the case in which the edge ring FR is transported alone from the plasma processing apparatus shown in Figure 39, and then a replacement edge ring FR is transported alone into the plasma processing apparatus.

[0259] In the following description, the control unit 90 is included in the control unit CU, and the control unit CU controls the transport robot TR2 and the lifter 50Z. However, the control unit 90 may be provided separately from the control unit CU, with the control unit CU controlling the transport robot TR2 and the control unit 90 controlling the lifter 50Z. Furthermore, the outer circumference of the edge ring FR and the inner circumference of the covering ring CR are assumed to overlap in a plan view.

[0260] First, as shown in Figure 46A, the control unit CU raises the multiple support pins 561 from the standby position to the first support position. As a result, the upper end surface 563a of the upper rod portion 563 comes into contact with the lower surface of the edge ring FR, the edge ring FR is lifted by the multiple support pins 561, and the edge ring FR moves away from the electrostatic chuck 112.

[0261] Next, as shown in Figure 46B, the control unit CU inserts the lower fork FK22, which is not holding the object to be conveyed, between the edge ring FR, which is supported by a plurality of support pins 561, and the electrostatic chuck 112.

[0262] Next, as shown in Figure 47A, the control unit CU lowers the multiple support pins 511 from the first support position to the standby position. As a result, the edge ring FR, supported by the multiple support pins 511, is placed on the lower fork FK22.

[0263] Next, as shown in Figure 47B, the control unit CU retracts the lower fork FK22 that holds the edge ring FR.

[0264] Next, as shown in Figure 48A, the control unit CU inserts the upper fork FK21, which holds the replacement edge ring FR, above the electrostatic chuck 112.

[0265] Next, as shown in Figure 48B, the control unit CU controls the multiple support pins 511 to raise them from the standby position to the first support position. As a result, the upper end surface 563a of the upper rod portion 563 comes into contact with the lower surface of the edge ring FR held by the upper fork FK21, the edge ring FR is lifted by the multiple support pins 511, and the edge ring FR moves away from the upper fork FK21.

[0266] Next, as shown in Figure 49A, the control unit CU retracts the upper fork FK21 that is not holding the object to be transported.

[0267] Next, as shown in Figure 49B, the control unit CU lowers the multiple support pins 561 from the first support position to the standby position. As a result, the edge ring FR, supported by the multiple support pins 561, is placed on the electrostatic chuck 112.

[0268] As explained above, in the plasma processing apparatus shown in Figure 39, the edge ring FR can be removed from the plasma processing apparatus by itself, and then a replacement edge ring FR can be loaded into the plasma processing apparatus by itself.

[0269] In the above embodiment, the edge rings FR and FRX and the covering rings CR and CRX are examples of annular members, the edge rings FR and FRX are examples of inner rings, and the covering rings CR and CRX are examples of outer rings. Also, the transport robots TR1 and TR2 are examples of transport devices. Furthermore, the support pin 521 is an example of a first support pin, the support pin 511 is an example of a second support pin, the support pin 531 is an example of a third support pin, and the support pin 541 is an example of a fourth support pin.

[0270] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.

[0271] In the above embodiment, lifters 50, 50X~50Z were described as a mechanism for raising and lowering the edge ring FR and / or the covering ring CR, but the invention is not limited thereto. For example, when the outer circumference of the edge ring FR and the inner circumference of the covering ring CR overlap, a through hole can be formed in the covering ring CR, and the edge ring FR and the covering ring CR can be raised and lowered independently by a support pin having a first retaining part that fits into the through hole and a second retaining part that is axially connected to the first retaining part and has a protruding part that protrudes from the outer circumference of the first retaining part. For example, the edge ring FR can be lifted independently by passing the first retaining part through the through hole of the covering ring CR and bringing the tip of the first retaining part into contact with the back surface of the covering ring CR. Alternatively, the covering ring CR can be lifted independently by passing the first retaining part through the through hole of the covering ring CR and bringing the protruding part of the second retaining part into contact with the bottom surface of the covering ring CR. Details of this configuration are described in U.S. Patent Application Publication No. 2020 / 0219753.

[0272] The above embodiment describes the transport of an edge ring between a storage module and a process module, but the disclosure is not limited thereto. For example, the same applies to transporting other consumable members installed in the process module, such as a covering ring or the top plate of an upper electrode, instead of an edge ring.

[0273] The following additional information is disclosed regarding the embodiments described above.

[0274] (Note 1) A processing system for applying plasma treatment to a substrate, Chamber and, A vacuum transfer module connected to the chamber, A transport device provided inside the vacuum transport module, A mounting platform is provided inside the chamber around the substrate, on which an outer ring and an inner ring with different inner and outer diameters are placed. A lifter for raising and lowering the outer ring and the inner ring relative to the mounting base, Controller and Equipped with, The controller is configured to select between a simultaneous transport mode, in which the transport device transports the inner ring and the outer ring simultaneously, and a single transport mode, in which the transport device transports only the inner ring. Processing system.

[0275] (Note 2) The inner ring is at least partially resting on the outer ring. The processing system described in Appendix 1.

[0276] (Note 3) The aforementioned lifter is A plurality of first support pins that contact the lower surface of the outer ring and cause the outer ring and the inner ring to move up and down together, A second support pin that contacts the lower surface of a jig that supports the inner ring from below, thereby raising and lowering the jig and the inner ring together as a single unit, including, The processing system described in Appendix 2.

[0277] (Note 4) The second support pin contacts the lower surface of the substrate to raise and lower the substrate. The processing system described in Appendix 3.

[0278] (Note 5) The simultaneous transport mode includes the step of transferring the outer ring and the inner ring between the first support pin and the transport device while the first support pin is raised. The processing system described in Appendix 3 or 4.

[0279] (Note 6) The single-transport mode includes the step of transferring the jig and the inner ring between the second support pin and the transport device while the second support pin is raised. The processing system described in any one of the items in Appendix 3 to 5.

[0280] (Note 7) The vacuum transport module is connected to the storage module and further comprises a storage module that houses the outer ring and the inner ring. The processing system described in any one of the items in Appendix 3 to 6.

[0281] (Note 8) The storage module houses a first assembly in which the inner ring is placed on the outer ring. The processing system described in Appendix 7.

[0282] (Note 9) The storage module houses a second assembly in which the inner ring is placed on the jig. The processing system described in Appendix 7 or 8.

[0283] (Note 10) The outer diameter of the inner ring is the same as, or smaller than, the inner diameter of the outer ring. The processing system described in Appendix 1.

[0284] (Note 11) The aforementioned lifter is A third support pin that contacts the lower surface of the inner ring and raises and lowers the inner ring, A fourth support pin that contacts the lower surface of the outer ring and raises and lowers the outer ring, including, The processing system described in Appendix 10.

[0285] (Note 12) The simultaneous transport mode includes the step of transferring the outer ring and the inner ring between the third support pin and the fourth support pin and the transport device while the third support pin and the fourth support pin are raised. The processing system described in Appendix 11.

[0286] (Note 13) The single-transport mode includes the step of transferring the inner ring between the third support pin and the transport device while the third support pin is raised. The processing system described in Appendix 11 or 12.

[0287] (Note 14) The inner ring is an edge ring that is placed on the upper surface of the stand described above so as to surround the periphery of the substrate. The outer ring is a covering ring that is placed around the edge ring. The processing system described in any one of the items 1 through 13 of the appendix.

[0288] (Note 15) A processing system comprising a chamber, a vacuum transfer module connected to the chamber, a transfer device provided inside the vacuum transfer module, a mounting platform provided inside the chamber around a substrate and on which an outer ring and an inner ring with different inner and outer diameters are placed, and a lifter for raising and lowering the outer ring and the inner ring relative to the mounting platform, wherein a transfer method for transferring the outer ring and the inner ring is provided, The conveying device has a simultaneous conveying mode in which the inner ring and the outer ring are conveyed at the same time, The transport device has a single transport mode in which it transports only the inner ring, Having, Method of transport.

[0289] (Note 16) Vacuum transport module and A plasma processing module connected to the vacuum transfer module, Controller and Equipped with, The vacuum transport module is Vacuum transfer chamber and The transfer robot is positioned within the vacuum transfer chamber, The aforementioned plasma processing module is Plasma processing chamber and A stage is placed inside the plasma processing chamber and has a substrate support surface and a ring support surface, A first ring is positioned on the ring support surface of the stage, A second ring is positioned on the first ring so as to surround the substrate on the substrate support surface of the stage, and has an inner diameter smaller than the inner diameter of the first ring. A plurality of first support pins are arranged below the ring support surface, A plurality of second support pins are arranged below the substrate support surface, A first actuator configured to move the plurality of first support pins vertically relative to the stage, The set includes a second actuator configured to move the plurality of second support pins vertically relative to the stage, The controller is configured to selectively execute a simultaneous transport mode in which the transport robot transports the first ring and the second ring simultaneously, and a single transport mode in which the transport robot transports the second ring alone. The aforementioned simultaneous transport mode is, A step of raising the plurality of first support pins so that the first ring and the second ring are lifted together by the plurality of first support pins, The process includes the step of transferring the first ring and the second ring together between the plurality of first support pins and the transfer robot while the plurality of first support pins are raised, The aforementioned single-transport mode is, A step of raising the plurality of first support pins so that the first ring and the second ring are lifted together by the plurality of first support pins, A step of raising the plurality of second support pins so that the transport jig is supported by the plurality of second support pins at a height lower than the height of the second ring, The steps include lowering the plurality of second support pins so that the second ring is supported by the transport jig while the first ring is supported by the plurality of first support pins, and the second ring is lowered to a position lower than the height of the transport jig, The process includes the step of transferring the transport jig and the second ring together between the plurality of second support pins and the transport robot while the plurality of second support pins are raised, PCB processing system.

[0290] (Note 17) The first ring is formed of an insulating material, The second ring is formed of a conductive material. The substrate processing system described in Appendix 16.

[0291] (Note 18) The first ring is formed of quartz, The second ring is made of Si or SiC. The substrate processing system described in Appendix 16.

[0292] (Note 19) The second ring has an outer annular portion that can be supported by the first ring and an inner annular portion that can be supported by the conveying jig. A substrate processing system as described in any one of the appendices 16 to 18.

[0293] (Note 20) Vacuum transport module and A plasma processing module connected to the vacuum transfer module, Controller and Equipped with, The vacuum transport module is Vacuum transfer chamber and The transfer robot is positioned within the vacuum transfer chamber, The aforementioned plasma processing module is Plasma processing chamber and A stage is placed inside the plasma processing chamber and has a substrate support surface and a ring support surface, A first ring and a second ring are arranged on the ring support surface of the stage so as to surround the substrate on the substrate support surface of the stage, The lifter is configured to raise and lower the first ring and the second ring relative to the stage, The controller is configured to selectively execute a simultaneous transport mode in which the transport robot transports the first ring and the second ring simultaneously, and a single transport mode in which the transport robot transports the second ring alone. PCB processing system.

[0294] (Note 21) At least a portion of the second ring is placed on the first ring. The substrate processing system described in Appendix 20.

[0295] (Note 22) The aforementioned lifter is A plurality of first support pins are arranged below the ring support surface, A plurality of second support pins are arranged below the substrate support surface, including, The substrate processing system described in Appendix 21.

[0296] (Note 23) The plurality of second support pins are configured to raise and lower the substrate on the substrate support surface. The substrate processing system described in Appendix 22.

[0297] (Note 24) The simultaneous transport mode includes the step of transferring the first ring and the second ring together between the plurality of first support pins and the transport robot while the plurality of first support pins are raised. Note 22 refers to the substrate processing system described in 23.

[0298] (Note 25) The single-unit transport mode includes the step of transferring the transport jig and the second ring together between the plurality of second support pins and the transport robot while the plurality of second support pins are raised. A substrate processing system as described in any one of the appendices 22 to 24.

[0299] (Note 26) The vacuum transport module is connected to the storage module and further comprises a storage module for housing the first ring and the second ring, A substrate processing system as described in any one of the appendices 21 to 25.

[0300] (Note 27) The storage module is configured to house a first assembly including the first ring and the second ring placed on the first ring. The substrate processing system described in Appendix 26.

[0301] (Note 28) The storage module is configured to house a second assembly, which includes a transport jig and the second ring placed on the transport jig. A substrate processing system as described in Appendix 26 or 27.

[0302] (Note 29) The outer diameter of the second ring is the same as the inner diameter of the first ring, or smaller than the inner diameter of the first ring. The substrate processing system described in Appendix 27.

[0303] (Note 30) The aforementioned lifter is A plurality of third support pins are positioned below the second ring, A plurality of fourth support pins are located below the first ring, including, The substrate processing system described in Appendix 29.

[0304] (Note 31) The simultaneous transport mode includes the step of transferring the first ring and the second ring between the plurality of third support pins and the plurality of fourth support pins and the transport robot while the plurality of third support pins and the plurality of fourth support pins are raised. The substrate processing system described in Appendix 30.

[0305] (Note 32) The single-unit transport mode includes the step of transferring the second ring between the plurality of third support pins and the transport robot while the plurality of third support pins are raised. A substrate processing system as described in Appendix 30 or 31.

[0306] (Note 33) The preceding 2nd ring is an edge ring formed of a conductive material. The first ring is a covering made of insulating material. A substrate processing system as described in any one of the appendices 20 to 32.

[0307] (Note 34) A processing system comprising a chamber, a vacuum transfer module connected to the chamber, a transfer device provided inside the vacuum transfer module, a mounting platform provided inside the chamber around a substrate and on which an outer ring and an inner ring with different inner and outer diameters are placed, and a lifter for raising and lowering the outer ring and the inner ring relative to the mounting platform, wherein a transfer method for transferring the outer ring and the inner ring is provided, The conveying device has a simultaneous conveying mode in which the inner ring and the outer ring are conveyed at the same time, The transport device has a single transport mode in which it transports only the inner ring, Having, Method of transport.

[0308] This international application claims priority based on Japanese Patent Application No. 2021-018937, filed on 9 February 2021, and the entire contents of said application are incorporated herein by reference. [Explanation of Symbols]

[0309] 10 Plasma processing chamber 11. Substrate support section 112 Electrostatic Chuck 113 Ring Assembly 50 Lifter 78 cassettes 781 Base Plate 782 Guide pin CR Covering CRa notch CU Control Unit FR Edge Ring FRa notch PS Processing System TM1, TM2 Vacuum Transfer Modules TR1, TR2 Transport Robots W board

Claims

1. Vacuum transport module and A plasma processing module connected to the vacuum transfer module, Controller and Equipped with, The vacuum transport module is Vacuum transfer chamber and The transfer robot is positioned within the vacuum transfer chamber, The aforementioned plasma processing module is Plasma processing chamber and A stage is placed inside the plasma processing chamber and has a substrate support surface and a ring support surface, A first ring is positioned on the ring support surface of the stage so as to surround the substrate on the substrate support surface of the stage, A second ring placed on the first ring, The lifter is configured to raise and lower the first ring and the second ring relative to the stage, The controller is configured to control the transport robot and selectively execute a simultaneous transport mode in which the first ring and the second ring are transported simultaneously, and a single transport mode in which the second ring is transported alone. At the timing of the replacement of the second ring, the single transport mode is executed, and the second ring is replaced. At the timing of the replacement of the first ring, the simultaneous transport mode is executed, and both the first ring and the second ring are replaced. The innermost diameter of the second ring is smaller than the innermost diameter of the first ring. PCB processing system.

2. Vacuum transport module and A plasma processing module connected to the vacuum transfer module, Controller and Equipped with, The vacuum transport module is Vacuum transfer chamber and The transfer robot is positioned within the vacuum transfer chamber, The aforementioned plasma processing module is Plasma processing chamber and A stage is placed inside the plasma processing chamber and has a substrate support surface and a ring support surface, A first ring is positioned on the ring support surface of the stage so as to surround the substrate on the substrate support surface of the stage, A second ring placed on the first ring, The lifter is configured to raise and lower the first ring and the second ring relative to the stage, The controller is configured to control the transport robot and selectively execute a simultaneous transport mode in which the first ring and the second ring are transported simultaneously, and a single transport mode in which the second ring is transported alone. At the timing of the replacement of the second ring, the single transport mode is executed, and the second ring is replaced. At the timing of the replacement of the first ring, the simultaneous transport mode is executed, and both the first ring and the second ring are replaced. The outermost diameter of the second ring is smaller than the outermost diameter of the first ring. PCB processing system.

3. The aforementioned lifter is A plurality of first support pins are arranged below the ring support surface, A plurality of second support pins are arranged below the substrate support surface, including, A substrate processing system according to claim 1 or 2.

4. The simultaneous transport mode includes the step of transferring the first ring and the second ring together between the plurality of first support pins and the transport robot while the plurality of first support pins are raised. The substrate processing system according to claim 3.

5. The single-unit transport mode includes the step of transferring the transport jig and the second ring together between the plurality of second support pins and the transport robot while the plurality of second support pins are raised. The substrate processing system according to claim 3.

6. The vacuum transport module is connected to the storage module and further comprises a storage module for housing the first ring and the second ring. A substrate processing system according to claim 1 or 2.

7. The storage module is configured to house a first assembly including the first ring and the second ring placed on the first ring. The substrate processing system according to claim 6.

8. The storage module is configured to house a second assembly, which includes a transport jig and the second ring placed on the transport jig. The substrate processing system according to claim 6.

9. The outermost diameter of the second ring is larger than the innermost diameter of the first ring. A substrate processing system according to claim 1 or 2.

10. The preceding second ring is an edge ring formed of a conductive material, The first ring is a covering made of an insulating material. A substrate processing system according to claim 1 or 2.

11. The first ring is formed of quartz, The second ring described above is formed of Si or SiC, The substrate processing system according to claim 10.

12. A transport method in a substrate processing system comprising a vacuum transport module and a plasma processing module connected to the vacuum transport module, The vacuum transport module is Vacuum transfer chamber and The transfer robot is positioned within the vacuum transfer chamber, The aforementioned plasma processing module is Plasma processing chamber and A stage is placed inside the plasma processing chamber and has a substrate support surface and a ring support surface, A first ring is positioned on the ring support surface of the stage so as to surround the substrate on the substrate support surface of the stage, A second ring placed on the first ring, The lifter is configured to raise and lower the first ring and the second ring relative to the stage, The transport method includes controlling the transport robot to selectively execute a simultaneous transport mode in which the first ring and the second ring are transported simultaneously, and a single transport mode in which the second ring is transported alone. At the timing of the replacement of the second ring, the single transport mode is executed, and the second ring is replaced. At the timing of the replacement of the first ring, the simultaneous transport mode is executed, and both the first ring and the second ring are replaced. The innermost diameter of the second ring is smaller than the innermost diameter of the first ring. Method of transport.

13. A transport method in a substrate processing system comprising a vacuum transport module and a plasma processing module connected to the vacuum transport module, The vacuum transport module is Vacuum transfer chamber and The transfer robot is positioned within the vacuum transfer chamber, The aforementioned plasma processing module is Plasma processing chamber and A stage is placed inside the plasma processing chamber and has a substrate support surface and a ring support surface, A first ring is positioned on the ring support surface of the stage so as to surround the substrate on the substrate support surface of the stage, A second ring placed on the first ring, The lifter is configured to raise and lower the first ring and the second ring relative to the stage, The transport method includes controlling the transport robot to selectively execute a simultaneous transport mode in which the first ring and the second ring are transported simultaneously, and a single transport mode in which the second ring is transported alone. At the timing of the replacement of the second ring, the single transport mode is executed, and the second ring is replaced. At the timing of the replacement of the first ring, the simultaneous transport mode is executed, and both the first ring and the second ring are replaced. The outermost diameter of the second ring is smaller than the outermost diameter of the first ring. Method of transport.

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