Busbar structure

Abstract

To provide a bus bar structure in which an external connection unit of a bus bar has a suitable structure for an external connection.SOLUTION: A bus bar 2 has a bus bar body 4 and an extremely-connected external connection unit 6. The bus bar body unit 4 and the external connection unit 6 are divided as separate components. In that way, the components of the external connection unit 6 can be components necessary for external connection without being affected by the structure of the components of the bus bar body unit 4. With the above structure, the external connection unit 6 of the bus bar 2 can be suitable for the external connection.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a bus bar structure.

Background Art

[0002] In a substrate or the like, a bus bar is used as a path for flowing current to electronic components, terminals, etc. (for example, Patent Document 1). One end of the bus bar may be connected to the substrate, and the other end may be connected to an external connection terminal.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, the bus bar may be composed of an integral metal material from one end to the other end. In this case, it was necessary to make the externally connected external connection part and other parts have the same configuration (thickness, plating pattern, etc.). Therefore, it has been required to make the external connection part have a configuration suitable for external connection.

[0005] An object of the present disclosure is to provide a bus bar structure capable of making an external connection part of a bus bar have a configuration suitable for external connection.

Means for Solving the Problems

[0006] A bus bar structure according to one aspect of the present disclosure is Fixed to the circuit board a conductive bus bar and resin cover and a bus bar structure including the same, wherein the bus bar has a bus bar main body part and an externally connected external connection part, and the bus bar main body part and the external connection part are divided as separate components and The busbar body has, when the Z-axis direction is defined as the thickness direction of the substrate and the X-axis, Y-axis, and Z-axis directions are mutually orthogonal, an extended portion that extends in a rising state in the Z-axis direction, and a fixed portion that bends at the end of the extended portion in the direction of extension and protrudes in the Y-axis direction and has a bolt hole, and the external connection portion has a thickness thinner than the busbar body and has a first bolt hole that overlaps the bolt hole of the fixed portion, a second bolt hole that is located away from the first bolt hole in the Y-axis direction, and a stress relaxation structure located between the first bolt hole and the second bolt hole, have The resin cover covers a portion of the busbar body and includes a support portion that covers the area between the first and second bolt holes in the external connection portion, while leaving the first and second bolt holes exposed to the resin, so that the busbar body, external connection portion, and resin cover can be treated as a single component when they are fixed together. .

[0007] In a busbar structure according to one embodiment of this disclosure, the busbar comprises a busbar body and an external connection portion that is connected to an external device. Of these, the busbar body and the external connection portion are separated as separate parts. Therefore, the components of the external connection portion can be configured to have the performance required for an external connection point, without being affected by the configuration of the components of the busbar body. Thus, the external connection portion of the busbar can be configured to be suitable for external connection.

[0008] The external connection section may be equipped with a stress-relieving structure. In this case, the stress acting on the external connection section can be relieved.

[0009] The thickness of the external connection portion can be thinner than the thickness of the busbar body. In this case, making the external connection portion thinner makes processing easier, and thus makes it easier to construct a stress-relieving structure. Furthermore, the stress-relieving structure also becomes more easily deformable, thus enabling stress relief.

[0010] Plating may be applied to the surface of either the external connection part or the busbar body. In this case, since the busbar body is separate from the external connection part, it is possible to partially improve the performance required for the external connection part or the busbar body, such as solderability, contactability (conductivity), and reliability over time (rust prevention), without applying plating to the entire busbar.

[0011] The busbar body and the external connection part may be integrally molded from resin in their combined state, at least one part of which may be molded together. In this case, when fixing the busbar structure to the circuit board, the busbar body and the external connection part can be treated as a single component.

[0012] The busbar body and the external connection part may be connected to each other by fastening them together when fixing the busbar structure to the circuit board. This reduces the number of screws required to fasten the busbar to the circuit board. [Effects of the Invention]

[0013] According to this disclosure, it is possible to provide a busbar structure in which the area near the external connection portion of the busbar can be configured to be suitable for external connection. [Brief explanation of the drawing]

[0014] [Figure 1] This is a plan view showing how the busbar structure 1 according to this embodiment of the disclosure is mounted on a substrate 50. [Figure 2] This is a perspective view of busbar structure 1. [Figure 3] This is an unfolded perspective view of busbar structure 1. [Figure 4] This is a perspective view showing the busbar structure of a comparative example. [Figure 5] This is a schematic diagram illustrating the board layout of a busbar. [Modes for carrying out the invention]

[0015] The busbar structure 1 according to the embodiment of this disclosure will be described with reference to Figures 1 to 3. Figure 1 is a plan view showing the busbar structure 1 according to the embodiment of this disclosure mounted on a substrate 50. Figure 2 is a perspective view of the busbar structure 1. Figure 3 is an exploded perspective view of the busbar structure 1.

[0016] As shown in FIG. 1, the bus bar structure 1 includes a bus bar 2 and is a structure mounted on a substrate 50. The bus bar structure 1 is applied to an electronic unit 100 configured by housing the substrate 50, electronic components 51, etc. in the internal space of, for example, a box-shaped housing. Examples of the electronic unit 100 include a DC / DC converter, a charger, an ECU (engine control unit), etc. In FIG. 1, a part of such an electronic unit 100 is shown. The electronic unit 100 includes a substrate 50, electronic components 51, and a base plate 52. Further, the electronic unit 100 includes the bus bar structure 1 at least in part. The bus bar structure 1 is provided at the edge portions of the substrate 50 and the base plate 52 where external connection is made. In the following description, the XYZ coordinates may be used for the description. The X-axis direction and the Y-axis direction are perpendicular to each other and are the planar directions in which the substrate 50 and the base plate 52 extend. The direction in which the edges of the substrate 50 and the base plate 52 extend is the X-axis direction. The Z-axis direction is perpendicular to the X-axis direction and the Y-axis and is the thickness direction of the substrate 50 and the base plate 52. Among the Z-axis direction, the main surface side where the bus bar structure 1 is provided is the positive side. One side of the X-axis direction and the Y-axis direction is defined as the positive side, and the other side is defined as the negative side, respectively.

[0017] As shown in FIGS. 1 to 3, the bus bar structure 1 includes a bus bar 2 and a resin cover 3. The bus bar 2 is a conductive member and a member constituting a current path. The material of the bus bar 2 is not particularly limited, and copper or the like may be adopted. The resin cover 3 is a resinous cover that insulates the bus bar 2 from other conductors and supports the bus bar 2 by covering a part of the bus bar 2.

[0018] The bus bar 2 has a bus bar main body portion 4 and an external connection portion 6 that is externally connected. The bus bar main body portion 4 and the external connection portion 6 are divided as separate parts. The bus bar main body portion 4 and the external connection portion 6 are formed by bending a member cut out into a desired shape from a metal plate.

[0019] The bus bar main body 4 has an extending portion 11 and fixing portions 12 and 13. The extending portion 11 is a portion that extends substantially along the X-axis direction. The extending portion 11 extends substantially along the X-axis direction in a state of rising in the Z-axis direction. The fixing portion 12 is provided at the negative-side end of the extending portion 11 in the X-axis direction. The fixing portion 12 bends at the lower end portion of the extending portion 11 and protrudes toward the positive side in the Y-axis direction. The fixing portion 13 is provided at the positive-side end of the extending portion 11 in the X-axis direction. The fixing portion 13 bends at the lower end portion of the extending portion 11 and protrudes toward the positive side in the X-axis direction. The fixing portions 12 and 13 extend parallel to the XY plane. The fixing portions 12 and 13 have bolt holes 12a and 13a and are portions fixed to a substrate 50 or the like by bolts (see FIG. 1).

[0020] As shown in FIG. 3, the extending portion 11 has, in order from the negative side to the positive side in the X-axis direction, a first portion 14, a second portion 16, a third portion 17, a fourth portion 18, and a fifth portion 19. The first portion 14 extends parallel to the positive side in the X-axis direction from the negative-side end of the extending portion 11 in the X-axis direction. The fixing portion 12 is provided at the lower end portion of the negative-side end of the first portion 14 in the X-axis direction. The first portion 14 is provided at a position spaced apart from the edge portion of the substrate 50 toward the negative side in the Y-axis direction, and the fixing portion 12 is fixed near the edge portion of the substrate 50 (see FIG. 1).

[0021] The second portion 16 is inclined so as to face the positive side in the Y-axis direction as it faces the positive side in the X-axis direction. The third portion 17 extends parallel to the positive side in the X-axis direction. The third portion 17 is arranged so as to pass through the electronic component 51 (see FIG. 1). The fourth portion 18 is inclined so as to face the negative side in the Y-axis direction as it faces the positive side in the X-axis direction. The fifth portion 19 bends so as to extend toward the negative side in the Y-axis direction. The fixing portion 13 is provided at the lower end portion of the fifth portion 19, and the fixing portion 13 is fixed to the substrate 50 at that position (see FIG. 1).

[0022] The external connection portion 6 is a member that extends from the negative end in the X-axis direction of the busbar body portion 4 to the positive end in the Y-axis direction. The external connection portion 6 extends parallel to the XY plane. The negative end in the Y-axis direction of the external connection portion 6 is fixed to the base plate 50 with the same bolt as the fixing portion 12 (see Figure 1). In this way, the busbar body portion 4 and the external connection portion 6 are connected to each other by being fastened together at the fixing portion 12 when fixing the busbar structure 1 to the base plate 50. The external connection portion 6 extends from the position of the fixing portion 12 to the positive end in the Y-axis direction and extends outward beyond the edge of the base plate 52 (see Figure 1).

[0023] A bolt hole 6a is formed on the negative side of the external connection part 6 in the Y-axis direction, coaxial with the bolt hole 12a of the fixing part 12. When the external connection part 6 is fixed to the base plate 50, the external connection part 6 is superimposed on the upper surface of the fixing part 12 such that the bolt holes 12a and 6a are coaxial, and is fixed together with the fixing part 12 by bolts (see Figure 1). A fixing part 20 is formed at the positive end of the external connection part 6 in the Y-axis direction, which is fixed to an external terminal or the like. A bolt hole 20a is formed in the fixing part 20. The fixing part 20 is positioned outside the edge of the base plate 52 (see Figure 1). A stress relaxation structure 21 is formed between the bolt hole 6a and the bolt hole 20a. The stress relaxation structure 21 is a part of the plate material of the external connection part 6 that is made elastically deformable by curving a part of the plate material. The stress relaxation structure 21 has an arched shape when the plate material is viewed from the X-axis direction.

[0024] Since the external connection part 6 and the busbar body part 4 are separated as distinct parts, they may be manufactured using different sheet materials of different materials, or (if they are made of the same material) sheet materials of different thicknesses, and may also be subjected to different surface treatments. Specifically, the thickness of the external connection part 6 is thinner than that of the busbar body part 4. That is, the external connection part 6 is formed from a sheet material that is thinner than the busbar body part 4. The thickness is not particularly limited, but if the thickness of the busbar body part 4 is 0.3 to 3.0 mm, the external connection part 6 may be 10 to 50% of the thickness of the busbar body part 4. Note that this thickness is merely an example and can be changed as appropriate.

[0025] Furthermore, the surface of the external connection part 6 is plated. The external connection part 6 is cut from a sheet material to form the stress-relieving structure 21, and then plated. The busbar body part 4 may be plated as needed, but it is not required.

[0026] The resin cover 3 is a molded resin part that covers at least a portion of the busbar 2. The resin cover 3 comprises cover portions 23 and 24 and a support portion 26. Cover portion 23 is the portion that covers the second portion 16 of the busbar body portion 4 (see Figures 2 and 3). Cover portion 24 is the portion that covers the third portion 17 of the busbar body portion 4 (see Figures 2 and 3). The support portion 26 is the portion that supports the external connection portion 6. The support portion 26 covers at least a portion of the external connection portion 6 at a position between the bolt holes 6a and 20a of the external connection portion 6 and extends in the X-axis direction (see Figures 2 and 3). The support portion 26 has a fixing portion 27 adjacent to the negative side of the external connection portion 6 in the X-axis direction and a fixing portion 28 adjacent to the positive side of the external connection portion 6 in the X-axis direction. The fixing portions 27 and 28 have bolt holes 27a and 28a and are fixed to the base plate 52 by bolts (see Figure 1). As a result, the external connection part 6 is fixed to the base plate 52 via the fixing parts 27 and 28.

[0027] As shown in Figure 2, the resin cover 3 is formed by integrally molding resin with the busbar body 4 and the external connection part 6 combined. Therefore, the resin cover 3 can support the busbar body 4 and the external connection part 6 while they are fixed to each other. Thus, the busbar structure 1 can be treated as a single component with the busbar body 4, the external connection part 6, and the resin cover 3 fixed to each other. When mounting the busbar structure 1 onto the substrate 50 and base plate 52, the busbar body 4 and the external connection part 6 can be treated as a single component, but during integral molding manufacturing including the resin cover 3, the busbar body 4 and the external connection part 6 are separated as separate parts. This state is one in which they are divided as separate components.

[0028] Next, the operation and effects of the busbar structure 1 according to this embodiment will be described.

[0029] First, with reference to Figure 4, the busbar structure 200 according to the comparative example will be described. The busbar structure 200 comprises a busbar 202 and a resin cover 203. The busbar 202 is formed as a single component, with the busbar body 4 and the external connection part 6 being integrally formed. That is, the external connection part 6, the fixing part 12, the extending part 11, and the fixing part 13 are integrally formed to constitute a single component. There are no gaps between the external connection part 6 and the fixing part 12, and the plate material is fixed to each other in a continuous state. In the busbar structure 200 according to the comparative example, the external connection part 6 and the busbar body part 4 are punched out from the same plate material by pressing or the like and formed by processing. Therefore, the thickness of the external connection part 6 is the same as the thickness of the busbar body part 4. In this case, if the external connection part 6 is too thick, stress relief at the fastening part with the external component may be insufficient, or it may be difficult to process the stress relief structure 21. Alternatively, thinning the external connection portion 6 may reduce the strength of the busbar body portion 4 and increase voltage drop and heat generation due to increased resistance. Furthermore, if plating is applied to improve the performance required for the external connection portion 6, such as solderability, contactability (conductivity), and reliability over time at the connection portion, it is necessary to apply plating to the entire busbar 202, which leads to increased costs related to plating.

[0030] In contrast, in the busbar structure 1 according to this embodiment, the busbar 2 has a busbar body 4 and an external connection part 6 that is connected to the outside. Of these, the busbar body 4 and the external connection part 6 are separated as separate parts. Therefore, the components of the external connection part 6 can be configured to meet the performance requirements for an externally connected location without being affected by the configuration of the components of the busbar body 4. Thus, the external connection part 6 of the busbar 2 can be configured to be suitable for external connection.

[0031] The external connection part 6 may be equipped with a stress-relieving structure 21. In this case, the stress acting on the external connection part 6 can be relieved.

[0032] The thickness of the external connection portion 6 may be thinner than the thickness of the busbar body portion 4. In this case, by making the external connection portion 6 thinner, processing becomes easier, and the stress-relieving structure 21 can be easily constructed. Furthermore, the stress-relieving structure 21 also becomes more easily deformable, which allows for stress relief at the fastening portion with external components.

[0033] Plating may be formed on the surface of the external connection part 6. In this case, since the busbar body part 4 is separated from the external connection part 6, it is possible to partially improve the performance required of the external connection part 6, such as solderability, contactability (conductivity), and reliability over time at the connection part (rust prevention), without forming plating on the entire busbar 2. Furthermore, by not forming plating on the entire busbar 2, it is possible to suppress the increase in costs related to plating.

[0034] Furthermore, while there is a demand to omit plating at the external connection part 6, which is the connection point with the user, in order to reduce plating costs, the busbar body part 4 may require plating due to the requirement to solder other electronic components inside the electronic unit. In this case as well, since the busbar body part 4 is separated from the external connection part 6, it is possible to reduce the increase in plating costs by configuring the busbar as a whole 2 without forming plating.

[0035] The busbar body 4 and the external connection part 6 may be integrally molded from resin in at least one part when assembled. In this case, when fixing the busbar structure 1 to the substrate 50, the busbar body 4 and the external connection part 6 can be treated as a single component.

[0036] The busbar body 4 and the external connection part 6 may be connected to each other by fastening them together when fixing the busbar structure 1 to the circuit board 50. This reduces the number of screw fastening points to the circuit board 50.

[0037] Furthermore, by connecting the busbar fastening points to the substrate 50, it becomes possible to connect the output terminal of the electronic unit to other circuits (such as various filter circuits) configured within the substrate 50 within the electronic unit.

[0038] Furthermore, by separating the busbar body 4 and the external connection part 6, the number of sheets of material cut from the sheet material (material cost) is improved. Figure 5(a) shows the busbar 202 before bending, after being cut from the sheet material. When the busbar 202 is cut from the sheet material, the length of the fixed part 12 and the external connection part 6 that bends from the extended part 11 is longer than the length of the fixed part 13. Therefore, it is necessary to set the cutting range E1 based on the length of the external connection part 6, which results in a wider cutting range E1. On the other hand, in the busbar 2 according to this embodiment, as shown in Figure 5(b), the external connection part 6 is separate from the fixed part 12, so the amount of protrusion of the busbar body 4 on the fixed part 12 side can be kept short. Therefore, the cutting range E2 of the busbar body 4 can be narrowed. This improves the number of sheets of material cut and reduces material costs, thereby reducing overall costs.

[0039] Furthermore, since the busbar structure 1 has a resin cover 3, it can be made into an integrated structure, thereby improving the ease of assembly of the busbar structure 1 to the substrate 50 and base plate 52. Also, since the busbar structure 1 has a resin cover 3, an insulating distance can be ensured between the busbar 2 and other components. In addition, since the resin cover 3 has fixing parts 27 and 28, it can be fixed to the base plate 52, thereby improving vibration damping.

[0040] This disclosure is not limited to the embodiments described above.

[0041] The arrangement and shape of each component shown in each drawing are merely examples and can be modified as appropriate without departing from the spirit of this disclosure. For example, the shape of the busbar 2 is not limited to those shown in Figures 1 to 3 and may be changed as appropriate. Also, the mounting position of the busbar structure 1 on the substrate 50 may be changed as appropriate.

[0042] [Form 1] A busbar structure comprising a conductive busbar, The busbar comprises a busbar body and an external connection part that is connected to the outside. A busbar structure in which the busbar body and the external connection part are separated as separate components. [Form 2] The external connection portion is a busbar structure according to Embodiment 1, comprising a stress-relieving structure. [Form 3] The busbar structure according to Embodiment 1 or 2, wherein the thickness of the external connection portion is thinner than the thickness of the busbar body portion. [Form 4] A busbar structure according to any one of embodiments 1 to 3, wherein plating is formed on the surface of either the external connection portion or the busbar body portion. [Form 5] The busbar structure according to any one of the embodiments 1 to 4, wherein, when the busbar body and the external connection part are combined, at least one part of either is integrally molded from resin. [Form 6] The busbar structure according to embodiments 1 to 5, wherein the busbar body and the external connection part are connected to each other by fastening them together when fixing the busbar structure to the circuit board. [Explanation of Symbols]

[0043] 1...Busbar structure, 2...Busbar, 4...Busbar body, 6...External connection part.

Claims

1. A busbar structure comprising a conductive busbar fixed to a substrate and a resin cover, The busbar comprises a busbar body and an external connection part that is connected to the outside. The busbar body and the external connection part are separated as separate components. The busbar body portion is, When the Z-axis direction is defined as the thickness direction of the substrate, and mutually orthogonal X-axis, Y-axis, and Z-axis directions are defined, An extended portion that extends in a vertical position along the Z-axis, The extended portion bends at its end in the direction of extension and protrudes in the Y-axis direction, and has a fixing portion with a bolt hole, It has, The aforementioned external connection part is, Having a thinner thickness than the main body of the busbar, A first bolt hole that overlaps the bolt hole of the fixing part, A second bolt hole located at a distance in the Y-axis direction from the first bolt hole, A stress-relieving structure located between the first bolt hole and the second bolt hole, It has, The aforementioned resin cover is The busbar body, the external connection part, and the resin cover are provided with a support part that covers a portion of the busbar body, while exposing the first bolt hole and the second bolt hole to the resin, so that they can be treated as a single component with the busbar body, the external connection part, and the area between the first bolt hole and the second bolt hole. Busbar structure.

2. The busbar structure according to claim 1, wherein plating is formed on the surface of either the external connection portion or the busbar body portion.

3. The busbar structure according to claim 1, wherein at least a part of the busbar body and the external connection part, when combined, is integrally molded from resin.

4. The busbar structure according to claim 1, wherein the busbar body and the external connection part are connected to each other by fastening them together when fixing the busbar structure to the substrate.

Images