Conveying device and surface treatment device

Abstract

To provide a transport device and a surface treatment device, capable of stably transporting a treatment material in a whole region of a chamber with a simple structure.SOLUTION: A transport device comprises: guide rails extended in parallel; a first slider and a second slider that are slidably provided in different directions from each other along the guide rails; a mounting table that is connected to the first or second slider and integrally moved with the first or second slider; and an engagement pin that is projected from the first nad second sliders toward an engagement hole provided in the mounting table, and is moved to a position engaged with the engagement hole and a position separated from the engagement hole. By switching between a state where the mounting table is engaged with the first slider and a state where the mounting table is engaged with the second slider, the mounting table is transported along the guide rails.SELECTED DRAWING: Figure 6A

Description

Technical Field

[0001] The present invention relates to a conveying device and a surface treatment device that perform surface treatment on a workpiece while stably conveying the workpiece in a chamber.

Background Art

[0002] Conventionally, surface treatment devices that form a metal catalyst layer, a SiOx film, etc. by cleaning or modifying the surface of a workpiece using plasma, and surface treatment devices that form a thin film on the surface of a workpiece using a sputtering device are known.

[0003] When performing surface treatment on a workpiece using such a surface treatment device, generally, it is necessary to convey the workpiece in a chamber. A conveying device that can be used for conveying such articles has been proposed (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In Patent Document 1, since a three-stage rack gear and a pinion gear are required as structural parts of the conveying device, the space in the height direction becomes large, and the accuracy also decreases due to the cantilever indication. In addition, the number of parts increases and the structure is complicated. Further, when performing surface treatment while conveying the workpiece placed on the conveying device disclosed in Patent Document 1, film pieces generated due to the surface treatment may scatter and adhere to various parts of the conveying device, and there is a problem that it takes time and effort to maintain and manage a conveying device with a complicated structure.

[0006] The present invention has been made in view of the above, and aims to provide a conveying device and a surface treatment device that have a simple structure and can stably convey a material to be treated throughout the entire chamber. [Means for solving the problem]

[0007] To solve the above-mentioned problems and achieve the objective, the conveying device according to the present invention comprises: parallel guide rails; a first slider and a second slider installed along the guide rails so as to be slidable in different directions from each other; a mounting base that moves integrally with the first slider or the second slider by being connected to the first slider or the second slider; and engagement pins that protrude from the first slider and the second slider toward engagement holes provided in the mounting base and move between a position engaged with the engagement holes and a position disengaged from the engagement holes, wherein the mounting base is conveyed along the guide rails by switching between a state in which the mounting base is engaged with the first slider and a state in which the mounting base is engaged with the second slider.

[0008] Furthermore, the surface treatment apparatus according to the present invention is characterized by comprising a chamber for housing a transport device, a surface treatment unit for performing at least one type of surface treatment on a material to be treated placed on the transport device housed in the chamber, and the surface treatment being performed on the material to be treated while transporting the material along the guide rail. [Effects of the Invention]

[0009] The conveying device and surface treatment device according to the present invention have the effect of being able to stably convey the material to be treated throughout the entire chamber. [Brief explanation of the drawing]

[0010] [Figure 1] Figure 1 is a schematic diagram of a surface treatment apparatus using the conveying device of this embodiment. [Figure 2]Figure 2 is a perspective view showing the schematic structure of the conveying device of this embodiment. [Figure 3] Figure 3 is a cross-sectional view showing the main structure of the conveying device according to this embodiment. [Figure 4] Figure 4 is a cross-sectional view illustrating the structure that controls the vertical movement of the transport pins in the transport device of this embodiment. [Figure 5A] Figure 5A is the first diagram illustrating the flow of the connection operation between the slider and the jig base in the conveying device of the embodiment. [Figure 5B] Figure 5B is a second diagram illustrating the flow of the connection operation between the slider and the jig base in the conveying device of the embodiment. [Figure 5C] Figure 5C is a third diagram illustrating the flow of the connection operation between the slider and the jig base in the conveying device of the embodiment. [Figure 6A] Figure 6A is the first diagram illustrating the method of transporting a jig base using the transport device of the embodiment. [Figure 6B] Figure 6B is a second diagram illustrating the method of transporting a jig base using the transport device of the embodiment. [Figure 6C] Figure 6C is a third diagram illustrating the method of transporting a jig base using the transport device of the embodiment. [Figure 6D] Figure 6D is a fourth diagram illustrating the method of transporting a jig base using the transport device of the embodiment. [Figure 6E] Figure 6E is a fifth diagram illustrating the method of transporting a jig base using the transport device of the embodiment. [Figure 7] Figure 7 is a top view of the inside of the chamber of the surface treatment apparatus according to the embodiment. [Figure 8] Figure 8 is a cross-sectional view showing an example of the structure of a plasma processing apparatus. [Figure 9] Figure 9 is a cross-sectional view showing an example of the structure of a sputtering apparatus. [Figure 10] Figure 10 is a top view of the inside of a chamber in a surface treatment apparatus, which is a modified example of the embodiment and is constructed by connecting two chambers. [Figure 11]FIG. 11 is a diagram showing an example of a connection method of a base member when connecting chambers.

Embodiments for Carrying out the Invention

[0011] Hereinafter, embodiments of the conveying device and the surface treatment device according to the present disclosure will be described in detail based on the drawings. Note that the present invention is not limited by this embodiment. In addition, the components in the following embodiments include those that can be replaced by those skilled in the art and can be easily conceived, or those that are substantially the same.

[0012] (Embodiment) An embodiment of the present disclosure performs a desired surface treatment on the surface of a workpiece W by a surface treatment device 10 that performs surface treatment on one or both sides of a workpiece W (work) formed of a resin material such as plastic resin. Note that the surface treatment of the workpiece W is, for example, a film-forming treatment.

[0013] (Schematic Structure of Surface Treatment Device) The schematic configuration of the surface treatment device 10 will be described with reference to FIG. 1. FIG. 1 is a schematic configuration diagram of a surface treatment device using the conveying device of the present embodiment.

[0014] The surface treatment device 10 includes a workpiece placement unit 45, a workpiece conveyance unit 40, an HCD (Hollow Cathode Discharge) electrode 210, and a sputter electrode 220, which are enclosed in a chamber 20.

[0015] The chamber 20 is a sealed reaction vessel that performs surface treatment on the workpiece W accommodated therein. The chamber 20 has a rectangular parallelepiped shape with the X-axis direction as the longitudinal direction in the XYZ coordinate system shown in FIG. 1.

[0016] <{ The workpiece placement unit 45 places the workpiece W in a state where it is substantially erected along the Y-axis. Note that the workpiece placement unit 45 includes a jig base 41, a mounting base 42, and a mounting shaft 43.

[0017] The jig base 41 is a base on which the material to be processed W is placed. The jig base 41 is an example of a mounting platform in this disclosure.

[0018] The mounting base 42 is installed on the jig base 41 and serves as the base for attaching the material to be processed W.

[0019] The mounting shaft 43 is a shaft-shaped member that supports the material to be processed W on the mounting base 42.

[0020] The material transport unit 40 transports the material W placed on the material placement unit 45 along the direction of arrow A, i.e., the longitudinal direction (X-axis) of the chamber 20. The material transport unit 40 is an example of a transport device in this disclosure. The structure of the material transport unit 40 will be described in detail later (see Figure 2).

[0021] Since the material to be processed W is placed on the jig base 41 via the mounting base 42 and the mounting shaft 43, the material to be processed W is transported along the X axis by the material to be processed transport unit 40.

[0022] A plasma processing apparatus 21 and a sputtering apparatus 22 are installed on the side of the chamber 20 that aligns with the XY plane.

[0023] The plasma processing apparatus 21 performs surface treatment on the material W by irradiating it with plasma generated by the HCD electrode 210. This surface treatment creates, for example, an SiO2 layer on the surface of the material W. This improves the environmental resistance of the surface of the material W. Note that the plasma processing apparatus 21 is an example of a surface treatment apparatus in this disclosure.

[0024] The HCD electrode 210 is movable along an axis Z1 parallel to the Z-axis. This allows for more uniform film deposition by setting the distance between the material to be treated W and the HCD electrode 210 to an optimal value.

[0025] The sputtering apparatus 22 performs sputtering by ejecting atoms to be used for film formation from a target placed on the sputtering electrode 220 and adhering the ejected atoms to the surface of the material to be treated W. Through sputtering, a thin film is formed on the surface of the material to be treated W, for example, which serves as a base for plating. The sputtering apparatus 22 is an example of a surface treatment device in this disclosure.

[0026] The sputtering electrode 220 is movable along an axis Z2 parallel to the Z-axis. This allows for more uniform film deposition by setting the distance between the workpiece W and the sputtering electrode 220 to an optimal value.

[0027] An exhaust device 50 is installed at the bottom of the chamber 20. The exhaust device 50 reduces the pressure inside the chamber 20 to create a vacuum. The exhaust device 50 also discharges gas (e.g., reaction gas) that has filled the inside of the chamber 20 due to the surface treatment to the outside of the chamber 20. The exhaust device 50 includes, for example, a pump unit (not shown) and a lifting valve. The pump unit is attached to the bottom of the chamber 20 and adjusts the pressure inside the chamber 20 and exhausts the gas that has filled the inside of the chamber 20 due to the operation of the plasma processing device 21 and the sputtering device 22. The lifting valve moves, for example, between a state in contact with the bottom of the chamber 20 and a state moved to the negative side of the Y axis, thereby opening an opening (not shown) formed in the bottom of the chamber 20 to the atmosphere.

[0028] At least one side of the chamber 20 along the YZ plane is provided with an opening / closing door 23a or an opening / closing door 23b. The opening / closing doors 23a and 23b can be opened and closed by a hinge mechanism or a sliding mechanism. The operator of the surface treatment apparatus 10 opens and closes the opening / closing doors 23a and 23b to place the material to be treated W and remove the material W after surface treatment is complete.

[0029] The surface treatment apparatus 10 further includes a cooling device, a control device, a power supply device, a gas supply device, an operation panel, etc., but these are omitted from the illustration for the sake of simplicity.

[0030] The cooling device generates cooling water to cool the equipment and power supply. The control unit controls the entire surface treatment apparatus 10. The power supply unit houses the power supplied to each part of the surface treatment apparatus 10. The gas supply unit supplies film formation gas and reaction gas to the chamber 20. The control panel receives operation instructions for the surface treatment apparatus 10. The control panel also has a function to display the operating status of the surface treatment apparatus 10.

[0031] (Structure of the conveying device) The schematic structure of the material transport section 40 (transport device) will be explained using Figure 2. Figure 2 is a perspective view showing the schematic structure of the transport device in this embodiment.

[0032] The material transport unit 40 (transport device) comprises a base member 60, a jig base 41, a guide rail 61 for the jig base, a guide rail 62 for the slider, a first slider 63, a second slider 64, a first locating pin 65, a second locating pin 66, a first allocating device 67, and a second allocating device 68.

[0033] The base member 60 is a pedestal to which each component constituting the material transport section 40 is attached.

[0034] The jig base guide rail 61 is installed parallel to the longitudinal direction of the base member 60 and is a guide rail that forms the movement path of the jig base 41.

[0035] The slider guide rail 62 is formed parallel to the jig base guide rail 61 and forms the movement path between the first slider 63 and the second slider 64, which will be described later. The slider guide rail 62 and the jig base guide rail 61 are formed parallel to each other. Note that the slider guide rail 62 is an example of a guide rail in this disclosure.

[0036] The first slider 63 and the second slider 64 move in different directions along the slider guide rail 62. Both the first slider 63 and the second slider 64 are equipped with a connection function to the jig base 41, and move along the longitudinal direction of the base member 60, accompanied by the connected jig base 41. The first slider 63 and the second slider 64 are moved by the rotational driving force of a servo motor (not shown in Figure 2). Further details will be described later (see Figures 6A to 6E).

[0037] The first locating pin 65 is installed on the first slider 63 and connects the first slider 63 to the jig base 41. The first locating pin 65 is an example of an engaging pin in this disclosure.

[0038] The second locating pin 66 is installed on the second slider 64 and connects the second slider 64 to the jig base 41. The second locating pin 66 is an example of an engaging pin in this disclosure.

[0039] The first allocating device 67 releases the connection between the first slider 63 and the jig base 41 by forcibly pulling down the first locating pin 65.

[0040] The second allocating device 68 releases the connection between the second slider 64 and the jig base 41 by forcibly pulling down the second locating pin 66.

[0041] Although not shown in Figure 2, the first allocating device 67 and the second allocating device 68 are also installed near at least one of the ends of the base member 60 in the Z-axis direction. These allocating devices are used to transfer the jig base 41 between different material handling units 40 when connecting multiple material handling units 40 to expand the transport range of the jig base 41. Further details will be explained in the modified embodiments described later (see Figure 10).

[0042] (Jig base connecting structure) The connection structure between the first slider 63 and the second slider 64 and the jig base 41 will be explained using Figures 3 and 4. Figure 3 is a cross-sectional view showing the main structure of the conveying device of this embodiment. Figure 4 is a cross-sectional view illustrating the structure for the vertical movement of the conveying pin of the conveying device of this embodiment.

[0043] An inclined plate 69 and an engagement hole 70 are provided on the back side of the jig base 41. The inclined plate 69 forms the most protruding slope at the position of the engagement hole 70 along the extending direction of the jig base 41. Note that the inclined plate 69 is an example of an inclined portion in this disclosure.

[0044] As the jig base 41 moves along the guide rail 61 for the jig base, the tip of the first locating pin 65 comes into contact with the inclined plate 69. The second locating pin 66, which is installed on the second slider 64, is biased upward (negative Y-axis) by the spring 71, so the inclined plate 69 pushes the second locating pin 66 downward (positive Y-axis) overcoming the biasing force of the spring 71.

[0045] Then, when the jig base 41 moves to a position where the second locating pin 66 and the engagement hole 70 align, the tip of the second locating pin 66 engages with the engagement hole 70 by the biasing force of the spring 71, as shown in Figure 3. This connects the second slider 64 and the jig base 41.

[0046] Although not shown in the diagram, the first slider 63 also has an inclined plate and engagement holes on its back side, and connects to the jig base 41 in the same manner as in Figure 3.

[0047] Next, using Figure 4, we will explain the structure for releasing the connection between the second slider 64 and the jig base 41.

[0048] Below the second locating pin 66, a roller receiver 72 is provided coaxially with the second locating pin 66. A groove is formed in the roller receiver 72, and a roller hook 74, which will be described later, provided by the second allocating device 68, engages with this groove.

[0049] The second allocating device 68 comprises a cylinder 73, a roller hook 74, and an output shaft 75.

[0050] The cylinder 73 is driven by hydraulic or pneumatic pressure, electric force, or electromagnetic force to move the output shaft 75 to the positive side of the Y-axis. Specifically, the cylinder 73 moves the second locating pin 66, which is engaged in the engagement hole 70, to a position where it is detached from the engagement hole 70 by overcoming the biasing force of the spring 71 and pulling it out of the engagement hole 70.

[0051] The roller hook 74 is installed at the tip of the output shaft 75 and engages with the groove of the roller receiver 72.

[0052] As the cylinder 73 moves the output shaft 75 downward (towards the positive Y-axis), the roller hook 74 overcomes the biasing force of the spring 71 and pushes the roller receiver 72 downward. This pushes the second locating pin 66, which is coaxial with the roller receiver 72, downward, causing the second locating pin 66 to be pulled out of the engagement hole 70. This releases the connection between the second slider 64 and the jig base 41.

[0053] Although not shown in the diagram, the connection and disconnection of the first slider 63 and the jig base 41 are also performed by the first allocating device 67, which has a structure similar to that of the second allocating device 68.

[0054] (Flow of the connection operation between the jig base and the slider) Figures 5A to 5C illustrate the flow of the connection operation between the jig base 41 and the second slider 64. Figure 5A is the first diagram illustrating the flow of the connection operation between the slider and the jig base in the conveying device of the embodiment. Figure 5B is the second diagram illustrating the flow of the connection operation between the slider and the jig base in the conveying device of the embodiment. Figure 5C is the third diagram illustrating the flow of the connection operation between the slider and the jig base in the conveying device of the embodiment.

[0055] As shown in Figure 5A, the jig base 41, while connected to a first slider 63 (not shown), moves along the jig base guide rail 61 in the direction indicated by arrow B, i.e., in the negative X-axis direction. At this time, the second locating pin 66 is in a state of protruding in the negative Y-axis direction due to the biasing force of the spring 71.

[0056] As the jig base 41 moves further in the negative X-axis direction, the tip of the second locating pin 66 comes into contact with the inclined plate 69 installed on the back side of the jig base 41, as shown in Figure 5B.

[0057] Then, as the jig base 41 moves further in the direction of arrow B, the tip of the second locating pin 66 is pressed down by the inclined plate 69, overcoming the biasing force of the spring 71 and moving in the direction of arrow C, i.e., in the positive Y-axis direction. At this time, since there is no force acting on the cylinder 73 of the second allocating device 68 to move the output shaft 75 upward or downward, the tip of the second locating pin 66 is pressed down by the inclined plate 69 and moves downward (towards the positive Y-axis).

[0058] As the jig base 41 moves further in the direction of arrow B, the position of the second locating pin 66 and the position of the engagement hole 70 coincide, as shown in Figure 5C. Then, due to the biasing force of the spring 71, the tip of the second locating pin 66 rises in the direction of arrow D, i.e., in the negative Y-axis direction. As a result, the tip of the second locating pin 66 engages with the engagement hole 70, connecting the jig base 41 and the second slider 64. At this time, although not shown in Figure 5C, the roller hook 74 (see Figure 4), which is connected to the cylinder 73 via the output shaft 75 (see Figure 4), enters the roller receiver 72 located below the second locating pin 66.

[0059] Furthermore, although not shown in the diagram, the same operation as described above also occurs when the jig base 41, while connected to the second slider 64, moves along the guide rail 61 for the jig base and connects with the first locating pin 65 of the first slider 63.

[0060] Furthermore, although not shown in the diagram, to release the connected second locating pin 66, a force should be applied to the cylinder 73 to push the output shaft 75 downward (towards the positive Y-axis). At this time, the aforementioned roller hook 74 pushes the roller receiver 72 downward (towards the positive Y-axis). As the roller receiver 72 is pushed downward, the second locating pin 66 overcomes the biasing force of the spring 71 and moves downward. This releases the connection of the second locating pin 66.

[0061] (Jig base transport method) The method for transporting the jig base 41 will be explained step by step using Figures 6A to 6E. Figure 6A is the first diagram illustrating the method for transporting the jig base using the transport device of the embodiment. Figure 6B is the second diagram illustrating the method for transporting the jig base using the transport device of the embodiment. Figure 6C is the third diagram illustrating the method for transporting the jig base using the transport device of the embodiment. Figure 6D is the fourth diagram illustrating the method for transporting the jig base using the transport device of the embodiment. Figure 6E is the fifth diagram illustrating the method for transporting the jig base using the transport device of the embodiment.

[0062] Figures 6A to 6E show how the jig base 41 is transported from the right end to the left end of the base member 60.

[0063] In Figure 6A, the jig base 41 is connected to the second slider 64. That is, the second locating pin 66 is engaged with the engagement hole 70 provided in the jig base 41.

[0064] Rack gears 77 are formed on the opposing sides of the first slider 63 and the second slider 64, and the rack gears 77 mesh with a pinion gear 76 installed on the base member 60. The pinion gear 76 is rotationally driven by a servo motor (not shown). In Figure 6A, the pinion gear 76 rotates clockwise, i.e., in the direction of arrow E.

[0065] In response to the rotation of the pinion gear 76, the first slider 63 moves along the slider guide rail 62 in the direction of arrow F. The second slider 64 moves along the slider guide rail 62 in the direction of arrow G, accompanying the jig base 41. That is, the jig base 41 moves in the direction of arrow H. The servo motor that rotates the pinion gear 76 is equipped with an encoder that detects the rotation angle of the servo motor. The material transport unit 40 can recognize the current position of the jig base 41 on the base member 60 by resetting the counter when the jig base 41 is in a predetermined position (for example, the left or right end of the base member 60) and then counting the number of pulses generated by the encoder.

[0066] In Figure 6A, when the first slider 63 and the second slider 64 move in opposite directions, as shown in Figure 6B, the first locating pin 65 installed on the first slider 63 engages with the engagement hole 70 of the jig base 41 near the center of the base member 60. As a result, the first locating pin 65 and the second locating pin 66 are engaged with the two engagement holes 70 of the jig base 41, respectively.

[0067] The material transport unit 40 counts the number of pulses generated by the encoder and, when it detects that the jig base 41 has reached the vicinity of the center of the base member 60, it disengages the second locating pin 66 and releases the connection between the jig base 41 and the second slider 64 (Figure 6C). Alternatively, the material transport unit 40 may electrically detect that the first locating pin 65 has engaged with the engagement hole 70, and that the second locating pin 66 has engaged with the engagement hole 70, thereby detecting that the state shown in Figure 6B has been reached.

[0068] After this, the material transport unit 40 rotates the pinion gear 76 in the reverse direction, that is, counterclockwise. As a result, as shown in Figure 6D, the first slider 63 moves along the slider guide rail 62 in the direction of arrow I, accompanied by the jig base 41. That is, the jig base 41 moves in the direction of arrow K. The second slider 64 also moves along the slider guide rail 62 in the direction of arrow J.

[0069] When the number of pulses generated by the encoder reaches a predetermined value, the material transport unit 40 determines that the jig base 41 has reached the left end of the base member 60. The material transport unit 40 then reverses the rotation direction of the pinion gear 76, rotating it in the direction of arrow L, i.e., clockwise. As a result, as shown in Figure 6E, the first slider 63 moves along the slider guide rail 62 in the direction of arrow M, accompanied by the jig base 41. That is, the jig base 41 moves in the direction of arrow O. The second slider 64 also moves along the slider guide rail 62 in the direction of arrow N.

[0070] In this way, the material transport unit 40 transports the jig base 41 over the entire area of ​​the base member 60, from the left end to the right end, by transferring the jig base 41 from the second slider 64, which is the transfer side, to the first slider 63, which is the receiving side. Although not shown in Figures 6A to 6E, it is also possible to transfer the jig base 41 in the reverse direction, from the first slider 63, which is the transfer side, to the second slider 64, which is the receiving side.

[0071] (Detailed structure of surface treatment apparatus) The detailed structure of the surface treatment apparatus 10 will be explained using Figure 7. Figure 7 is a top view of the inside of the chamber of the surface treatment apparatus according to this embodiment.

[0072] The chamber 20 includes shutters 24 and 25 as shown in Figure 7.

[0073] The shutter 24 moves to the positive X-axis side, exposing the HCD electrode 210 of the plasma processing apparatus 21 when performing plasma processing on the material W to be processed. The shutter 24 also moves to the negative X-axis side along arrow P, retracting the HCD electrode 210 when performing sputtering processing on the material W to be processed. This prevents contamination of unused electrodes.

[0074] The shutter 25 moves to the negative side of the X-axis, exposing the sputtering electrode 220 of the sputtering apparatus 22 when sputtering is performed on the material W to be processed. The shutter 25 also moves to the positive side of the X-axis along arrow Q, retracting the sputtering electrode 220 when plasma is performed on the material W to be processed. This prevents contamination of electrodes that are not in use.

[0075] During film deposition, the HCD electrode 210 is moved in the direction of axis Z1 according to the vacuum level inside the chamber 20, gas flow rate, transport speed of the material to be processed W, power, voltage value, current value, discharge state, and temperature inside the chamber 20, thereby maintaining an appropriate distance between the material to be processed W and the HCD electrode 210. Similarly, the sputter electrode 220 is also moved in the direction of axis Z2 to maintain an appropriate distance between the material to be processed W and the sputter electrode 220.

[0076] An opening / closing door 23a is installed on one of the two sides of the chamber 20 that are aligned with the YZ plane, specifically on the side on the negative X axis. The opening / closing door 23a is attached to a door frame 27 by hinges (not shown) so that it can be opened and closed. The door frame 27 is fastened to a flange 26 formed at the end of the chamber 20 by bolts and nuts (not shown). As a result, the opening / closing door 23a opens and closes in the direction of arrow R. The opening / closing door 23a may also be configured as a shutter that is movable in the vertical direction (Y axis direction).

[0077] On the other hand, a fixed blank panel 29 is installed on the side of the chamber 20 that lies along the YZ plane, specifically on the side facing the positive X axis. The blank panel 29 is fastened to a flange 26 formed at the end of the chamber 20 by bolts and nuts (not shown).

[0078] As shown in Figure 7, the material transport unit 40 is housed inside the chamber 20 and transports the material W placed on the jig base 41 between the left and right ends of the chamber 20 as described above. The plasma processing unit 21 performs plasma processing on the material W while it is being transported. The sputtering unit 22 performs sputtering on the material W while it is being transported. Note that the surface processing units provided in the surface processing unit 10 are not limited to the plasma processing unit 21 and the sputtering unit 22, and other surface processing units may also be provided. Furthermore, the number of surface processing units installed in the chamber 20 is not limited to the example in Figure 7. That is, the chamber 20 may be equipped with only one plasma processing unit 21, or only one sputtering unit 22.

[0079] (Structure of plasma processing equipment) The structure of the plasma processing apparatus 21 will be explained using Figure 8. Figure 8 is a cross-sectional view showing an example of the structure of the plasma processing apparatus.

[0080] The plasma processing apparatus 21 includes a gas supply pipe 89 for supplying a reaction gas such as argon used when generating plasma gas, and a pair of plate-shaped conductive parts 84 and 85 that generate plasma gas from the reaction gas supplied from the gas supply pipe 89 using a high-frequency voltage. As the reaction gas, for example, oxygen, argon, nitrogen, etc., can be used individually or in mixtures.

[0081] The gas supply pipe 89 penetrates the support plate 87, which is supported on the side wall of the chamber 20 so as to be movable along the Z-axis (Z1 axis), in the thickness direction and is attached to the support plate 87 by a gas supply pipe mounting member 82. Inside the gas supply pipe 89, a gas flow path 80 is formed along the direction in which the gas supply pipe 89 extends, and reaction gas is supplied into the chamber 20 from the outside through the gas flow path 80. At the end of the gas supply pipe 89 on the outside of the support plate 87 (outside the chamber 20), a gas supply unit 96 is connected to supply reaction gas to the gas supply pipe 89. At the other end of the gas supply pipe 89 (inside the chamber 20), a gas supply hole 81 is formed, which is a hole for introducing the reaction gas that has flowed through the gas flow path 80 into the chamber 20. The reaction gas is supplied to the gas supply unit 96 via a mass flow controller (MFC) (not shown), which has a flow rate control function in addition to a mass flow meter.

[0082] The pair of plate-shaped conductor sections 84 and 85 are both formed in a flat plate shape, and are created by arranging metal plates such as aluminum or other conductor plates in parallel. The plate-shaped conductor sections 84 and 85 are supported by a support plate 88. The pair of plate-shaped conductor sections 84 and 85 form the HCD electrode 210. The support plate 88 is made of an insulating material such as glass or ceramic.

[0083] The support plate 88 is supported by a support member 83. The support member 83 has a cylindrical member and mounting members located at both ends of the cylindrical member, with the end on the negative side of the Z1 axis attached to the support plate 87 and the end on the positive side of the Z1 axis attached to the support plate 88.

[0084] The gas supply pipe 89, which penetrates the support plate 87, extends through the inside of the support member 83 to the position of the support plate 88, and penetrates the support plate 88. The gas supply hole 81 formed in the gas supply pipe 89 is located in the portion of the support plate 88 where the recess 90 is formed.

[0085] The pair of plate-shaped conductors 84 and 85 are arranged on the side of the support plate 88 where the recess 90 is formed, covering the recess 90. In this arrangement, the pair of plate-shaped conductors 84 and 85 are spaced apart from each other, forming a gap 86 between them. The spacing of the gap 86 is preferably set appropriately according to the reaction gas introduced into the plasma processing apparatus 21, the frequency of the supplied power, and the size of the electrodes, but is typically about 3 mm to 12 mm.

[0086] The pair of plate-shaped conductor sections 84 and 85 are held in place by the holding member 97 in an overlapping state. A space is formed between the recess 90 of the support plate 88 and the plate-shaped conductor sections 84 and 85.

[0087] The space thus formed functions as a gas inlet 98 into which the reaction gas supplied by the gas supply pipe 89 is introduced. The gas supply hole 81 of the gas supply pipe 89 opens toward the gas inlet 98.

[0088] Furthermore, numerous through-holes 91 and 92 extending in the thickness direction are formed in each of the pair of plate-shaped conductor sections 84 and 85. Specifically, the plate-shaped conductor section 85, located on the inflow side of the reaction gas supplied by the gas supply pipe 89, has multiple through-holes 92 formed at predetermined intervals in a matrix pattern, while the plate-shaped conductor section 84, located on the outflow side of the reaction gas supplied by the gas supply pipe 89, has multiple through-holes 91 formed at predetermined intervals in a matrix pattern.

[0089] The through-hole 91 in the plate-shaped conductor portion 84 and the through-hole 92 in the plate-shaped conductor portion 85 are both cylindrical holes, and both through-holes 91 and 92 are arranged coaxially. Furthermore, the diameter of the through-hole 91 in the plate-shaped conductor portion 84 is smaller than the diameter of the through-hole 92 in the plate-shaped conductor portion 85 on the reaction gas inflow side. In this way, the pair of plate-shaped conductor portions 84 and 85 form a hollow electrode structure with multiple through-holes 91 and 92, and the generated plasma gas flows at high density through these multiple through-holes 91 and 92.

[0090] A gap 86 is interposed between the plate-shaped conductor sections 84 and 85, and the gap 86 functions as a capacitor with capacitance. Conductive sections (not shown) are formed on the support plate 88 and the plate-shaped conductor sections 84 and 85 using a conductive material, and the support plate 88 is grounded 95 by these conductive sections, and the plate-shaped conductor sections 85 are also grounded 95. One end of the high-frequency power supply (RF) 94 is grounded 95, and the other end of the high-frequency power supply 94 is electrically connected to the plate-shaped conductor section 84 via a matching box (MB) 93 for adjusting capacitance, etc., to achieve matching with the plasma. Therefore, when the high-frequency power supply 94 is operated, the potential of the plate-shaped conductor section 84 swings between positive and negative at a predetermined frequency, such as 13.56 MHz.

[0091] The generated plasma gas flows out from the through hole 91. The flowing plasma gas then reacts with the film-forming gas that is injected toward the positive Z1 axis from multiple gas supply holes 100 formed in the gas supply pipe 99b, which extends parallel to the plate-shaped conductors 84 and 85, i.e., along the X axis, on the positive Z1 axis side of the through hole 91.

[0092] The deposition gas is introduced into the chamber 20 via a mass flow controller (MFC) (not shown). The deposition gas is supplied by a gas supply pipe 99a extending along the Z1 axis and a gas supply pipe 99b extending along the X axis.

[0093] The gas used for film formation is a substance appropriate to the surface treatment performed by the plasma processing apparatus 21. For example, methane, acetylene, butadiene, titanium tetraisopropoxide (TTIP), hexamethyldisiloxane (HMDSO), tetraethoxysilane (TEOS), hexamethyldisilazane (HMDS), tetramethylsilane (TMS), etc. are used. The precursor generated by the reaction of the plasma gas and the film formation gas is used to perform surface treatment such as film formation and cleaning of the material W to be treated in the chamber 20.

[0094] (Structure of plasma processing equipment) The structure of the sputtering apparatus 22 will be explained using Figure 9. Figure 9 is a cross-sectional view showing an example of the structure of a sputtering apparatus.

[0095] The sputtering apparatus 22 includes a cooling water pipe 101, a magnet 104, a target 107, a cooling jacket 105, and a support plate 103.

[0096] The cooling water pipe 101 forms a flow path for cooling water supplied to the cooling jacket 105.

[0097] Magnet 104 generates a magnetic field.

[0098] The target 107 is placed inside a magnetic field generated by the magnet 104, and an inert gas (e.g., argon) supplied from a gas supply device (not shown in Figure 1) and introduced from a gas inlet (not shown in Figure 9) is ionized and collided with the target 107, thereby ejecting atoms to be used for film formation. The target 107 is, for example, a copper plate, and the copper atoms ejected from the target 107 adhere to the surface of the material to be treated W, thereby forming a thin copper film on the surface of the material W. The magnet 104 and the target 107 form a sputtering electrode 220.

[0099] The cooling jacket 105 cools the target 107 with cooling water supplied through the cooling water pipe 101.

[0100] The support plate 103 supports the magnet 104, the target 107, and the cooling jacket 105. The cooling water pipe 101 passes through the support plate 103, which is supported on the side wall of the chamber 20 so as to be movable along the Z axis (Z2 axis), in the thickness direction.

[0101] A cooling water channel 102 is formed inside the cooling water pipe 101, running along the direction of its extension. Although not shown in Figure 9, the cooling water channel 102 includes a channel for supplying cooling water from outside the chamber 20 to the cooling jacket 105, and a channel for discharging the used cooling water from the cooling jacket 105 to the outside of the chamber 20. In this way, the cooling water pipe 101 circulates the cooling water between the outside of the chamber 20 and the cooling jacket 105 located inside the chamber 20. The outer end of the cooling water pipe 101, which is outside the chamber 20, is connected to a cooling water inlet and outlet channel, which are not shown in Figure 9. On the other hand, the other end of the cooling water pipe 101 (inside the chamber 20) is connected to the cooling jacket 105. The cooling jacket 105 has a cooling water flow path formed inside, through which the cooling water flows. This causes the cooling water to circulate between the outside of the chamber 20 and the cooling jacket 105. The cooling water is supplied from a cooling device not shown in Figure 1.

[0102] A retaining member 108 is attached to the lower part of the support plate 103. The retaining member 108 holds the outer circumference and bottom surface of the target 107 in the order of magnet 104, cooling jacket 105, and target 107 stacked from the negative side of the Z2 axis toward the positive side.

[0103] An insulating material 106 is placed between the support plate 103 and the magnet 104. The insulating material 106 is also placed on the outer periphery of the magnet 104 in a plan view. In other words, the magnet 104 is held by the support plate 103 and the holding member 108 via the insulating material 106.

[0104] The sputtering apparatus 22 performs sputtering, which is the process of forming a thin film on the surface of the material W to be processed. When the sputtering apparatus 22 performs sputtering, the inside of the chamber 20 is depressurized by the exhaust device 50 (see Figure 1), and then the gas used for sputtering is introduced into the chamber 20 from a gas supply device (not shown in Figure 1). The magnetic field generated by the magnet 104 of the sputtering apparatus 22 ionizes the gas inside the chamber 20, causing the ions to collide with the target 107. This ejects atoms from the surface of the target 107.

[0105] For example, if aluminum is used for target 107, when ions from a gas ionized near target 107 collide with target 107, target 107 ejects aluminum atoms. The aluminum atoms ejected from target 107 move toward the positive Z2 axis. Since the material to be treated W is located opposite the surface of target 107 in chamber 20, the aluminum atoms ejected from target 107 move toward the material to be treated W, adhere to it, and deposit on its surface. As a result, a thin film corresponding to the material forming target 107 is formed on the surface of the material to be treated W.

[0106] (Effects of the embodiment) As described above, the material transport unit 40 (transport device) of the embodiment includes a slider guide rail 62 (guide rail) extending in parallel, a first slider 63 and a second slider 64 installed along the slider guide rail 62 so as to be slidable in different directions from each other, a jig base 41 (mounting platform) that moves integrally with the first slider 63 or the second slider 64 by being connected to the first slider 6 or the second slider 64, and the first slider 63 and The jig base 41 is transported along the slider guide rail 62 by switching between a state in which the jig base 41 is engaged with the first slider 63 and a state in which the jig base 41 is engaged with the second slider 64. This is achieved by having a first locating pin 65 (engaging pin) and a second locating pin 66 (engaging pin) that protrude from the second slider 64 toward the engagement hole 70 of the jig base 41 and move toward a position in which it is engaged with the engagement hole 70 and a position in which it is disengaged from the engagement hole 70. Therefore, the jig base 41 can be transported along the slider guide rail 62 with a simple structure.

[0107] Furthermore, in the material transport section 40 (transport device) of the embodiment, the first slider 63 and the second slider 64 move in different directions along the parallel slider guide rail 62 (guide rail) by the rack gears 77 formed on their respective opposing sides meshing with a rotationally driven pinion gear 76. Therefore, the first slider 63 and the second slider 64 can be reliably moved in different directions with a simple structure.

[0108] Furthermore, in the material transport section 40 (transport device) of the embodiment, the jig base 41 (mounting platform) moves integrally with either the first slider 63 or the second slider 64, which is the transfer side of the jig base 41, and the tip of the first locating pin 65 (engaging pin) or the second locating pin 66 (engaging pin), which is biased in the direction to engage with the engagement hole 70, forms an inclination on the back side of the jig base 41 that protrudes most at the position of the engagement hole 70 along the direction of movement of the jig base 41. The jig base 41 is transferred between the first slider 63 and the second slider 64 by moving while in contact with the plate 69 (inclined portion) and engaging with the other of either the first slider 63 or the second slider 64 at the position of the engagement hole 70, thereby moving the tip of the first locating pin 65 (engaging pin) or the second locating pin 66 (engaging pin), which is engaged with either the first slider 63 or the second slider 64 (the transfer side of the jig base 41), to a position where it is disengaged from the engagement hole 70. Thus, the jig base 41 can be easily and reliably transferred between the first slider 63 and the second slider 64. Furthermore, this allows the jig base 41 to be transported over the entire extension direction of the material transport section 40, and the stroke can be increased.

[0109] Furthermore, the surface treatment apparatus 10 of this embodiment includes a material transport unit 40 (transportation device), a chamber 20 housing the material transport unit 40, and a surface treatment unit (for example, a plasma treatment apparatus 21 or a sputtering apparatus 22) that performs at least one type of surface treatment on the material W placed on the material transport unit 40 housed in the chamber 20. The surface treatment is performed on the material W while it is transported along a slider guide rail 62 (guide rail). Therefore, a uniform surface treatment can be performed on the material W being transported inside the chamber 20.

[0110] (Modified examples of the embodiment) A modified example of the embodiment, the surface treatment apparatus 10c, will be described using Figures 10 and 11. Figure 10 is a top view of the inside of a chamber in a surface treatment apparatus configured by connecting two chambers, which is a modified example of the embodiment. Figure 11 is a diagram showing an example of a method for connecting the base members when connecting the chambers.

[0111] The surface treatment apparatus 10c shown in Figure 10 is formed by connecting surface treatment apparatus 10a and surface treatment apparatus 10b along the X-axis. Surface treatment apparatuses 10a and 10b are the same as the surface treatment apparatus 10 described above.

[0112] The surface treatment apparatus 10b is connected to the surface treatment apparatus 10a by bringing the flanges 26 together while the surface treatment apparatus 10a is rotated 180 degrees around the Y axis. For the purposes of this explanation, the surface treatment apparatus 10a is equipped with a material transport section 40a (transport device), and the surface treatment apparatus 10b is equipped with a material transport section 40b (transport device).

[0113] The material transport section 40a and the material transport section 40b are connected by a jig base guide rail 61 and a slider guide rail 62, respectively. Of the jig bases 41 provided in the surface treatment apparatus 10a and the surface treatment apparatus 10b, one of them is removed, and the surface treatment apparatus 10c is equipped with one jig base 41.

[0114] Furthermore, since the surface treatment apparatus 10b is the surface treatment apparatus 10a rotated 180 degrees around the Y axis, the first slider 63 of the surface treatment apparatus 10a and the second slider 64 of the surface treatment apparatus 10b are on the same connected slider guide rail 62.

[0115] Near the connection point between the material transport section 40a and the material transport section 40b, a first allocating device 67 and a second allocating device 68 (not shown in Figure 10) are installed. Through the action of the first allocating device 67 and the second allocating device 68 (see Figures 5A to 5C), the jig base 41 is transferred between the connected material transport section 40a and the material transport section 40b. Therefore, the jig base 41 can move along the X-axis over a range spanning the connected material transport section 40a and the material transport section 40b.

[0116] Since the surface treatment apparatus 10c is a combination of the surface treatment apparatus 10a and the surface treatment apparatus 10b which is obtained by rotating the surface treatment apparatus 10a 180 degrees around the Y axis, the surface treatment apparatus 10c can perform surface treatment on both sides of the material to be treated W placed on the jig base 41.

[0117] Note that the connection configuration of the surface treatment apparatus is not limited to the example shown in Figure 10. For example, the same surface treatment apparatus 10 may be connected in the same orientation without being rotated 180 degrees around the Y-axis.

[0118] Furthermore, although Figure 10 shows an example of connecting surface treatment devices of the same size, a configuration in which multiple surface treatment devices of different sizes are connected is also possible. In other words, it is not necessary for the size of the material transport section (transport device) to be the same. Moreover, the connected surface treatment devices may not have a surface treatment section, such as a load lock chamber that allows access to the chamber 20 without exposing the material to be treated W to the atmosphere.

[0119] Figure 11 shows an example of the connection structure of the base members 60 that constitute the material transport section 40. When connecting the base members 60, the ends of the base members 60 are brought together and a connecting plate 79 that spans both base members 60 is fixed with bolts. This forms a connecting section 78 in which different base members 60 are connected. Note that when connecting different base members 60, the jig base guide rail 61 (see Figure 2) may be replaced with a longer one that can cover the entire stroke.

[0120] (Effects of modified embodiments of the embodiment) As described above, the modified material transport units 40a and 40b (transport devices) of the embodiment expand the transport range of the jig base 41 (mounting platform) by connecting multiple material transport units 40a and 40b (transport devices), each equipped with a first slider 63 and a second slider 64, so that guide rails 62 (guide rails) for the sliders are connected. Therefore, the transport range of the material W can be easily extended by connecting multiple chambers 20 in accordance with changes in the film deposition conditions or film deposition process for the material W. Furthermore, there is no need to add additional drive devices such as motors.

[0121] Furthermore, in the modified surface treatment apparatus 10c of the embodiment, a plurality of chambers 20 housing a transport device are connected so as to be connected by a slider guide rail 62 (guide rail), and the material to be treated W is transported inside the plurality of chambers 20 while surface treatment is performed on the material to be treated W.Therefore, surface treatment according to the film formation conditions and film formation process for the material to be treated W can be easily realized.

[0122] While embodiments of the present invention have been described above, these embodiments are presented as examples only and are not intended to limit the scope of the invention. This novel embodiment can be implemented in various other forms. Furthermore, various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. This embodiment is included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]

[0123] 10, 10a, 10b, 10c…Surface treatment apparatus, 20…Chamber, 21…Plasma treatment apparatus (surface treatment section), 22…Sputtering apparatus (surface treatment section), 23a, 23b…Opening / closing door, 24, 25…Shutter, 26…Flange, 27…Door frame section, 29…Blank panel, 40, 40a, 40b…Material transport section (transport apparatus), 41…Jig base (mounting platform), 42…Mounting base, 43…Mounting shaft, 45… 50... Exhaust device, 60... Base member, 61... Guide rail for jig base, 62... Guide rail for slider (guide rail), 63... First slider, 64... Second slider, 65... First locating pin (engaging pin), 66... ​​Second locating pin (engaging pin), 67... First allocating device, 68... Second allocating device, 69... Inclined plate (inclined part), 70... Engaging hole, 71... Sp Ring, 72...Roller support, 73...Cylinder, 74...Roller hook, 75...Output shaft, 76...Pinion gear, 77...Rack gear, 78...Connecting part, 79...Connecting plate, 80...Gas passage, 81...Gas supply hole, 82...Gas supply pipe mounting member, 83...Support member, 84,85...Plate-shaped conductor part, 86...Gap part, 87,88...Support plate, 89...Gas supply pipe, 90...Recess, 91,92...Through hole, 93...Matching box S (MB), 94...High-frequency power supply (RF), 95...Grounding, 96...Gas supply unit, 97...Holding member, 98...Gas introduction unit, 99a, 99b...Gas supply pipe, 100...Gas supply hole, 101...Cooling water pipe, 102...Cooling water channel, 103...Support plate, 104...Magnet, 105...Cooling jacket, 106...Insulating material, 107...Target, 108...Holding member, 210...HCD electrode, 220...Sputtering electrode, W...Material to be processed

Claims

1. Parallel guide rails, A first slider and a second slider are installed along the guide rail so as to be slidable in different directions from each other, A mounting platform that moves integrally with the first slider or the second slider by being connected to the first slider or the second slider, The first slider and the second slider each include an engagement pin that protrudes toward an engagement hole in the aforementioned mounting base and moves between a position engaged with the engagement hole and a position disengaged from the engagement hole, A conveying device that transports the aforementioned mounting platform along the guide rail by switching between a state in which the mounting platform is engaged with the first slider and a state in which the aforementioned mounting platform is engaged with the second slider.

2. The first slider and the second slider move in different directions along the parallel guide rails, as rack gears formed on their respective opposing sides mesh with rotationally driven pinion gears. The conveying device according to claim 1.

3. The mounting platform moves integrally with either the first slider or the second slider, which is the transfer side of the mounting platform. The tip of the engagement pin, biased in a direction to engage with the engagement hole, moves while contacting an inclined portion formed on the back side of the aforementioned base, which forms the most protruding slope at the position of the engagement hole along the direction of movement of the aforementioned base, and engages with the other of either the first slider or the second slider at the position of the engagement hole. The mounting base is transferred between the first slider and the second slider by moving the tip of the engagement pin, which is engaged with either the first slider or the second slider on the transfer side of the mounting base, to a position where it is disengaged from the engagement hole. The conveying device according to claim 1 or claim 2.

4. By connecting multiple transport devices, each equipped with both the first slider and the second slider, so that the guide rails are connected, the transport range of the aforementioned platform is expanded. The conveying device according to claim 1.

5. A surface treatment apparatus comprising the conveying device described in claim 1, A chamber housing the aforementioned transport device, The device comprises a surface treatment unit that performs at least one type of surface treatment on a material to be treated placed on the conveying device housed in the chamber, The material to be treated is transported along the guide rail while surface treatment is performed on the material to be treated. Surface treatment equipment.

6. The multiple chambers containing the transport device are connected by the guide rails, and the material to be processed is transported inside the multiple chambers while surface treatment is performed on the material to be processed. The surface treatment apparatus according to claim 5.

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