Plasma processing equipment
By configuring the plasma processing apparatus with a first coil surrounded by a second coil with more conductors and a larger diameter, the impedance difference is reduced, simplifying the distribution circuit and enhancing power control.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
- Filing Date
- 2022-07-06
- Publication Date
- 2026-07-03
AI Technical Summary
The impedance difference between multiple coils in a plasma processing apparatus is significant due to the larger length of the second coil, complicating the distribution circuit for high-frequency power.
The plasma processing apparatus includes a first coil with multiple first conductors connected in parallel and a second coil surrounding it with more second conductors, reducing impedance by configuring the second coil to have a larger diameter and more conductors, and using a simpler distribution circuit with fewer components.
This configuration reduces the impedance difference between coils, simplifying the distribution circuit and enabling effective power control.
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