Release aid tape

The release assist tape with a semi-transparent adhesive and recognizable boundary addresses the challenge of accurate attachment and malfunctions, facilitating smooth peeling operations on diverse component supply tapes.

JP7884208B2Active Publication Date: 2026-07-03PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Filing Date
2022-07-20
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Existing release assist tapes are difficult to accurately attach to narrow component supply tapes, and there is a risk of malfunction due to adhesive protrusion.

Method used

A release assist tape with a semi-transparent adhesive portion and a non-adhesive portion that precedes the leading edge, featuring a recognizable boundary, allowing for precise attachment and preventing adhesive protrusion.

Benefits of technology

Enables accurate attachment to various component supply tapes, reducing the risk of malfunctions and ensuring smooth peeling operations.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007884208000001
    Figure 0007884208000001
  • Figure 0007884208000002
    Figure 0007884208000002
  • Figure 0007884208000003
    Figure 0007884208000003
Patent Text Reader

Abstract

To provide a peeling aid tape and a substrate manufacturing method that can be applied accurately to various component supply tapes.SOLUTION: A peeling aid tape 40 is attached to a component supply tape 13, which has a base tape 13a having a housing portion 13c that accommodates a component D, and a cover tape 13b that covers the housing portion 13c. The peeling aid tape 40 includes an adhesive portion 40a that sticks to the cover tape 13b, a non-adhesive portion 40b that precedes the tip 13e of the component supply tape with the adhesive portion 40a stuck to the cover tape 13b, and a mark (border 40c) that allows a user to distinguish between the adhesive portion 40a and the non-adhesive portion 40b.SELECTED DRAWING: Figure 5
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to a peeling assist tape for assisting in peeling a cover tape of a component supply tape that supplies components to a component mounting device. Pu It relates thereto.

Background Art

[0002] As a component supply device that supplies components to a component mounting device, a tape feeder that positions components at a component take-out position by pitch-feeding a component supply tape that houses components in a housing portion is widely used (for example, Patent Document 1). Patent Document 1 discloses a tape feeder provided upstream of the component take-out position with a tape peeling mechanism that peels a cover tape attached to the component supply tape to cover the housing portion and exposes the components in the housing portion. Further, Patent Document 1 discloses a peeling assist tape that assists in peeling the cover tape by the tape peeling mechanism by being attached to the cover tape. This peeling assist tape is attached to the upper surface of the cover tape with an adhesive so that the tip portion of the peeling assist tape protrudes by a predetermined length from the tip of the component supply tape. Then, the tape peeling mechanism captures the tip portion of the peeling assist tape and peels the cover tape from the component supply tape.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the prior art, including Patent Document 1, while the removal of the cover tape can be easily achieved by attaching a release assist tape to the cover tape, it is difficult to accurately attach the release assist tape to the cover tape of a narrow parts supply tape. Furthermore, there are problems such as the risk of malfunction in the tape release mechanism if the adhesive protrudes from the cover tape. Therefore, there was room for further improvement in order to accurately attach the release assist tape to various parts supply tapes.

[0005] Therefore, the present invention provides a peel-off assist tape that can be accurately attached to various parts supply tapes. Pu The purpose is to provide. [Means for solving the problem]

[0006] The release assist tape of the present invention is a release assist tape to be attached to a component supply tape having a base tape having a housing portion for housing a component and a cover tape attached to the base tape and covering the housing portion, the release assist tape having an adhesive portion that adheres to the cover tape and a non-adhesive portion that precedes the leading edge of the component supply tape when the adhesive portion is attached to the cover tape, It has, The adhesive portion and the non-adhesive portion The boundary is recognizable because it is semi-transparent and has a color that allows light to pass through to one side. .

[0007] This invention Other release-aid tapes teeth, A release assist tape is attached to a component supply tape having a base tape having a storage portion for storing components and a cover tape attached to the base tape and covering the storage portion, wherein the release assist tape has an adhesive portion that adheres to the cover tape, a non-adhesive portion that precedes the leading edge of the component supply tape when the adhesive portion is attached to the cover tape, and a mark that can distinguish the adhesive portion and the non-adhesive portion, wherein the mark is a fold provided between the adhesive portion and the non-adhesive portion. . [Effects of the Invention]

[0008] According to the present invention, it is possible to accurately attach it to various component supply tapes. [Brief explanation of the drawing]

[0009] [Figure 1] An explanatory diagram showing the configuration of a component mounting device according to one embodiment of the present invention. [Figure 2] An explanatory diagram showing the configuration of the main part of a parts supply device according to one embodiment of the present invention. [Figure 3] Enlarged view showing the configuration of the main part of the tape peeling section of a parts supply device according to one embodiment of the present invention. [Figure 4] (a)(b) Operational diagram of a component supply device according to one embodiment of the present invention [Figure 5] (a) Plan view (b) Side cross-sectional view of a parts supply tape to which a peel-off assist tape according to one embodiment of the present invention is attached. [Figure 6] (a)(b)(c) Diagram illustrating the process of attaching a peel-off assist tape according to one embodiment of the present invention to a parts supply tape. [Figure 7] (a) Explanatory diagram showing the configuration of a continuous peel-off assist tape according to one embodiment of the present invention (b) Plan view of a peel-off assist tape cut from a continuous peel-off assist tape according to one embodiment of the present invention (c) Side view of a peel-off assist tape cut from a continuous peel-off assist tape according to one embodiment of the present invention [Figure 8] (a)(b)(c) Explanatory diagrams showing the configuration of another embodiment of the peel-off assist tape continuous body of one embodiment of the present invention. [Figure 9] Flowchart of a substrate manufacturing method according to one embodiment of the present invention [Modes for carrying out the invention]

[0010] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the component mounting device, component supply device, component supply tape, and peeling aid tape. In the following, corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 1 and in some parts described later, two axes that are orthogonal to each other in the horizontal plane are shown: the X-axis in the substrate transport direction (perpendicular to the plane of the paper in Figure 1) and the Y-axis perpendicular to the substrate transport direction (left-right direction in Figure 1). Also, in Figure 1 and in some parts described later, the Z-axis perpendicular to the horizontal plane (up-down direction in Figure 1) is shown.

[0011] First, the configuration of the component mounting apparatus 1 will be explained with reference to Figure 1. The component mounting apparatus 1 has the function of mounting components supplied from the component supply device 20 onto a substrate 4 to manufacture mounted substrates. A substrate transport unit 3 is positioned along the X-axis in the center of the base 2. The substrate transport unit 3 transports the substrate 4, which has been transported from upstream, to the mounting work position, positions it, and holds it. The substrate transport unit 3 also transports the substrate 4, after the component mounting work is completed, downstream.

[0012] A component supply unit 5 is located to the side (forward along the Y-axis) of the substrate transport unit 3. A trolley 12 equipped with a feeder base 10 and a reel holding unit 11 is mounted on the component supply unit 5. Multiple component supply devices 20 are arranged along the X-axis on the upper part of the feeder base 10. Multiple reels 14, which wind and store component supply tapes 13 having a storage section for storing components, are placed on the reel holding unit 11 along the X-axis. The component supply devices 20 transport the component supply tapes 13 pulled out from the reels 14 internally and supply the components stored on the component supply tapes 13 to a component retrieval position P where they are picked up by the work head 6.

[0013] In Figure 1, a work head 6, which has a suction nozzle 7 for picking up components at its lower end, is positioned above the base 2. The work head 6 moves in the X-axis and Y-axis directions by a head movement mechanism (not shown) controlled by a control unit 8 of the component mounting device 1. The work head 6 has the function of moving the suction nozzle 7 up and down in the Z-axis direction. The work head 6 picks up components supplied by the component supply device 20 to the component removal position P using the suction nozzle 7 and mounts them on the substrate 4 held at the mounting work position of the substrate transport unit 3. The operation of the substrate transport unit 3, the head movement mechanism, and the work head 6 is controlled by a control unit 8 of the component mounting device 1.

[0014] A touch panel 9 is installed in front of the component mounting device 1 at the position where the worker works. The touch panel 9 is an operation / input unit that displays various information on its display and allows the worker to input data and operate the component mounting device 1 using operation buttons displayed on the display.

[0015] In FIG. 1, the component supply device 20 includes a component supply control unit 21 that controls each part of the component supply device 20 described later. The component supply control unit 21 of the component supply device 20 arranged on the carriage 12 mounted on the component supply unit 5 and the touch panel 9 are connected to the control unit 8 of the component mounting device 1 by wire or wirelessly, and exchange various information and commands with each other. An operation panel 22 connected to the component supply control unit 21 is arranged on the upper surface of the component supply device 20. Operation switches, lamps, etc. are arranged on the operation panel 22. The operation switches receive commands from the operator, and the lamps notify the operator of various information.

[0016] Next, referring to FIGS. 2 and 3, the configuration of the component supply device 20 (tape feeder) will be described. The component supply device 20 is mounted on and used with a component mounting device 1 that mounts components on a substrate 4, and has a function of supplying the components accommodated in the component supply tape 13 to the component taking-out position P by the work head 6 of the component mounting device 1.

[0017] In FIG. 2, the main body 20a is a frame portion that forms the outer shape of the component supply device 20. Inside the main body 20a, a tape conveyance path 23 for conveying the component supply tape 13 is formed, which communicates from a tape inlet 23a opening upstream in the tape conveyance direction to a tape outlet 23c opening downstream. The component supply tape 13 has a configuration in which the upper surface of a base tape 13a provided with a housing portion 13c, which is a recess for housing the component D, is sealed by a cover tape 13b (see FIG. 5(a)). Note that the housing portion 13c may also be referred to as an embossed portion or a pocket.

[0018] The middle portion of the tape conveyance path 23 is an inclined portion 23b provided obliquely upward. Downstream in the tape conveyance path 23, a component taking-out position P is provided on the upper surface of the main body 20a. Around the component taking-out position P, the tape conveyance path 23 is covered from above by a cover member 27, and the component supply tape 13 conveyed along the tape conveyance path 23 is guided on the upper surface side by the cover member 27.

[0019] In Figure 2, a first tape transport means 26A, consisting of a first sprocket 24A and a first drive mechanism 25A, is positioned below the component removal position P in the tape transport path 23. A second tape transport means 26B, consisting of a second sprocket 24B and a second drive mechanism 25B, is positioned near the downstream side of the tape input opening 23a in the tape transport path 23. The first sprocket 24A and the second sprocket 24B are equipped with feed pins on their outer circumference that engage with feed holes 13d (see Figure 5(a)) formed in the base tape 13a.

[0020] In Figure 2, the first drive mechanism 25A and the second drive mechanism 25B are equipped with motors that serve as drive sources and have the function of transmitting the rotation of the motors to the first sprocket 24A and the second sprocket 24B via drive transmission mechanisms such as gears. By controlling the first drive mechanism 25A and the second drive mechanism 25B with the parts supply control unit 21, the first tape transport means 26A and the second tape transport means 26B transport the parts supply tape 13 along the tape transport path 23.

[0021] In this tape transport, the second tape transport means 26B has the function of sending the parts supply tape 13 inserted from the tape input port 23a downstream along the tape transport path 23. The first tape transport means 26A has the function of sending the storage portion 13c provided on the lower side of the base tape 13a to the parts removal position P by engaging the first sprocket 24A with the base tape 13a of the parts supply tape 13 sent from upstream.

[0022] In Figure 2, in the tape transport path 23, a pull-in section 28 consisting of a pair of tape feed rollers 28a and 28b and a roller drive mechanism 29 that drives the pull-in section 28 are arranged diagonally below and upstream of the component removal position P. The roller drive mechanism 29 is equipped with a motor as a drive source and has the function of transmitting the rotation of the motor to the tape feed rollers 28a and 28b via a drive transmission mechanism such as gears.

[0023] The parts supply control unit 21 controls the roller drive mechanism 29, causing the pull-in unit 28 to pull in the cover tape 13b that has been peeled off from the base tape 13a of the parts supply tape 13 by sandwiching it between the tape feed rollers 28a, 28b (Figure 4(a)). The pulled-in cover tape 13b is sent in the tape feed direction away from the parts supply tape 13 and is housed in the cover tape retrieval unit 31 provided in the main body 20a (Figure 4(b)). In other words, the pull-in unit 28 and the roller drive mechanism 29 constitute a cover tape peeling mechanism 30 that sends the cover tape 13b that has been peeled off from the parts supply tape 13 in the tape feed direction away from the parts supply tape 13.

[0024] In Figure 2, a tape detection unit 32 is positioned upstream of the tape feeding position where the retraction unit 28 is located in the inclined section 23b of the tape transport path 23. The tape detection unit 32 is a transmissive optical sensor that detects the leading edge of the component supply tape 13 (or peel-off assist tape) transported along the tape transport path 23. If the component supply tape 13 (or peel-off assist tape) is transparent, a dog that can mechanically contact the leading edge of the component supply tape 13 is provided, and the leading edge of the component supply tape 13 (or peel-off assist tape) can be detected by detecting the movement of the dog that occurs when the component supply tape 13 comes into contact with the dog using the optical sensor.

[0025] In Figure 3, the parts supply device 20 is equipped with an air nozzle 33 positioned opposite the retraction section 28 below the inclined section 23b of the tape transport path 23, which sprays air toward the retraction section 28. The air nozzle 33 sprays air to capture the non-adhesive portion 40b (see also Figure 5) of the peel-off assist tape 40, which will be described later, ahead of the leading edge of the parts supply tape 13, in the retraction section 28. The air nozzle 33 is connected to a solenoid valve 35 via an air circuit 34. Air is supplied to the solenoid valve 35 from the air supply section 36 via the air circuit 34. The air nozzle 33 acts as an assisting means to guide the non-adhesive portion 40b toward the retraction section 28.

[0026] The component supply control unit 21 controls the solenoid valve 35, allowing the air supplied from the air supply unit 36 ​​to be injected into the intake unit 28 at any desired timing. In this embodiment, the component supply control unit 21 controls the timing of air injection from the air nozzle 33 based on the detection result of the tape detection unit 32.

[0027] In Figure 3, at the timing when the retraction section 28 can capture the non-adhesive portion 40b at the tip of the component supply tape 13, the air nozzle 33 blows air onto the tip of the non-adhesive portion 40b. This guides the non-adhesive portion 40b to the retraction section 28, making it easier for it to be captured by the pair of tape feed rollers 28a, 28b. The pair of tape feed rollers 28a, 28b then wrap around the captured non-adhesive portion 40b. By blowing air from the air nozzle 33 in this way, the cover tape peeling mechanism 30 can more reliably peel the cover tape 13b from the base tape 13a.

[0028] Next, with reference to Figure 5, the parts supply tape 13 to which the peel-off assist tape 40 is attached will be described. Figure 5(b) is a cross-section AA shown in Figure 5(a). The parts supply tape 13 has a base tape 13a having a housing portion 13c for housing parts D, and a cover tape 13b that is attached to the base tape 13a and covers the housing portion 13c. The base tape 13a has feed holes 13d that engage with the feed pins of the first sprocket 24A and the second sprocket 24B.

[0029] The release assist tape 40, which is attached to the parts supply tape 13, is made of a resin material such as PET. The release assist tape 40 is guided to the pull-in section 28 by air sprayed from the air nozzle 33, captured by a pair of tape feed rollers 28a and 28b, and has elasticity (appropriate stiffness) suitable for being stored in the cover tape retrieval section 31. The release assist tape 40 is processed into a rectangular shape, and the width W of the release assist tape is the same as or slightly narrower than the width of the cover tape.

[0030] In Figure 5, the release assist tape 40 is divided into an adhesive portion 40a that adheres to the cover tape 13b and a non-adhesive portion 40b that, with the adhesive portion 40a attached to the cover tape 13b, precedes the leading edge 13e of the parts supply tape. Adhesive 41 is pre-placed (applied, etc.) on the back surface of the adhesive portion 40a, and the adhesive portion 40a adheres to the surface of the cover tape 13b by the adhesive 41. The adhesive portion 40a and the adhesive 41 are semi-transparent. This makes it easy to recognize the position of the cover tape 13b when attaching the release assist tape 40 to the parts supply tape 13.

[0031] Furthermore, either the adhesive portion 40a or the non-adhesive portion 40b is colored. This creates a color-recognizable boundary 40c between the adhesive portion 40a and the non-adhesive portion 40b. In this example, the adhesive portion 40a is colored and semi-transparent, and the non-adhesive portion 40b is colorless and semi-transparent. By using different colors for the adhesive portion 40a and the non-adhesive portion 40b to form the boundary 40c, the positions of the leading edge 13e of the component supply tape, the adhesive portion 40a, and the non-adhesive portion 40b can be easily recognized by the boundary 40c when attaching the release assist tape 40 to the component supply tape 13.

[0032] In Figure 5, the length Lb of the non-adhesive portion along the transport direction of the component supply tape 13 is set to a length suitable for the non-adhesive portion 40b to be caught by the tape feed rollers 28a, 28b during the peeling operation of the cover tape 13b, which will be described later. The length La of the adhesive portion along the transport direction of the component supply tape 13 is set to a length that provides sufficient adhesive force so that the adhesive portion 40a does not peel off from the cover tape 13b due to the force applied during the peeling operation of the cover tape 13b. In this example, by setting the length La of the adhesive portion to be greater than the length Lb of the non-adhesive portion, the peeling operation of the cover tape 13b is performed appropriately.

[0033] Next, with reference to Figure 6, a method for attaching the release assist tape 40 to the parts supply tape 13 will be described. In Figure 6(a), it is assumed that the release assist tape 40 is pre-processed to a width W and supplied with release paper 42 attached to the surface of the adhesive 41. When attaching the release assist tape 40 to the parts supply tape 13, the release paper 42 is first peeled off. In Figure 6(b), the boundary 40c between the adhesive part 40a and the non-adhesive part 40b coincides with the leading edge 13e of the parts supply tape, and the release assist tape 40 is brought closer to the parts supply tape 13 so that the adhesive part 40a does not protrude from the cover tape 13b (arrow f).

[0034] In Figure 6(c), the adhesive portion 40a of the release assist tape 40 is then brought into contact with the cover tape 13b of the parts supply tape 13, and appropriate pressure is applied, causing the adhesive portion 40a to adhere to the cover tape 13b by the adhesive 41. In this way, the boundary 40c formed by the translucent color applied to either the adhesive portion 40a or the non-adhesive portion 40b is a mark that allows identification of the adhesive portion 40a and the non-adhesive portion 40b. This allows the release assist tape 40 to be accurately attached to the parts supply tape 13, and prevents problems caused by adhesive 41 that has seeped out from the cover tape 13b adhering to the tape feed rollers 28a, 28b, etc.

[0035] Next, with reference to Figures 2 to 4, the transport operation of the parts supply tape 13 and the peeling operation of the cover tape 13b will be described. The transport operation and peeling operation are controlled by the parts supply control unit 21. In Figure 2, when the parts supply tape 13 with the peeling assist tape 40 attached is inserted from the tape input port 23a of the parts supply device 20, the second tape transport means 26B is activated. The second tape transport means 26B transports the parts supply tape 13 downstream along the tape transport path 23 (arrow a in Figure 3). In Figure 3, when the tape detection unit 32 detects the leading edge (or non-adhesive portion 40b) of the transported parts supply tape 13, the tape feed rollers 28a and 28b begin to rotate (arrows b and c).

[0036] In Figure 4(a), after a predetermined time has elapsed since the tape detection unit 32 detected the leading edge, air is ejected from the air nozzle 33 toward the non-adhesive portion 40b. This causes the non-adhesive portion 40b to be pressed against the tape feed roller 28a. Furthermore, as the component supply tape 13 is transported along the tape transport path 23 (arrow d), the non-adhesive portion 40b is captured by the tape feed rollers 28a, 28b and guided to the cover tape retrieval unit 31. Following the non-adhesive portion 40b, the cover tape 13b attached to the peeling assist tape 40 is peeled from the base tape 13a and retrieved in the cover tape retrieval unit 31.

[0037] In Figure 4(b), the base tape 13a from which the cover tape 13b has been peeled off is transported downstream along the tape transport path 23 and pitch-feeded by the first tape transport means 26A (arrow e). As a result, the exposed components D of the housing section 13c are sequentially supplied to the component removal position P. In this way, the peeling assist tape 40 attached to the component supply tape 13 makes it easy to peel off the cover tape 13b. When the base tape 13a is pitch-feeded by the first tape transport means 26A, the roller drive mechanism 29 drives the tape feed rollers 28a and 28b in accordance with the pitch-feeding. That is, the rollers 28a and 28b collect the cover tape 13b in the cover tape recovery section 31 to the same amount as the amount of base tape 13a that has been fed by the first tape transport means 26A.

[0038] Referring to Figure 7, an example of the supply method of the peel-off assist tape 40 will be described. Figure 7(a) shows an example in which the peel-off assist tape continuous 40R is supplied wound in a roll before being cut to a width W to match the width of the cover tape 13b of the parts supply tape 13. The peel-off assist tape 40 is cut from the peel-off assist tape continuous 40R at position B, which is a length W from the end of the peel-off assist tape continuous 40R. That is, in this example, the peel-off assist tape 40 is supplied as a peel-off assist tape continuous 40R that is wider than the cover tape 13b of the parts supply tape 13 to which it is attached. This makes it possible to easily provide peel-off assist tapes 40 with different widths W to accommodate various parts supply tapes 13 with different cover tape widths 13b.

[0039] Next, with reference to Figure 8, another embodiment of the release aid tape will be described. The release aid tape 43 (continuous release aid tape) shown in Figure 8(a) has a line 43c drawn between the adhesive portion 43a and the non-adhesive portion 43b. The release aid tape 43 is attached to the cover tape 13b such that the line 43c coincides with the leading edge 13e of the component supply tape.

[0040] The peel-off assist tape 44 (continuous peel-off assist tape) shown in Figure 8(b) has a continuous cross 44c drawn between the adhesive portion 44a and the non-adhesive portion 44b. The peel-off assist tape 44 is attached to the cover tape 13b so that the intersection of the cross 44c coincides with the leading edge 13e of the component supply tape. In other words, the line 43c drawn on the peel-off assist tape 43 and the cross 44c drawn on the peel-off assist tape 44 are figures provided between the adhesive portions 43a,44a and the non-adhesive portions 43b,44b, and are marks that can distinguish the adhesive portions 43a,44a from the non-adhesive portions 43b,44b. Note that the figures are not limited to lines 43c and cross 44c, and may also be dotted lines or circles (〇, ●), etc.

[0041] The release assist tape 45 (continuous release assist tape) shown in Figure 8(c) has a fold 45c between the adhesive portion 45a and the non-adhesive portion 45b. The release assist tape 45 is attached to the cover tape 13b so that the fold 45c coincides with the leading edge 13e of the parts supply tape. In other words, the fold 45c provided between the adhesive portion 45a and the non-adhesive portion 45b is a mark that allows identification of the adhesive portion 45a and the non-adhesive portion 45b. Note that the marks on the release assist tape (boundary 40c, line 43c, cross 44c, fold 45c) are not limited to the above example and can be any mark that allows identification of the adhesive portion and the non-adhesive portion.

[0042] Next, following the flow chart in Figure 9, and referring to Figures 1, 4, 6, and 7, a substrate manufacturing method will be described in which components D are supplied from a component supply device 20 to a component mounting device 1 using a component supply tape 13 and mounted on a substrate 4. First, a peel-off assist tape 40 with a width W corresponding to the width of the cover tape 13b is cut from the peel-off assist tape continuous body 40R (ST1) (Figure 7). Then, the peel-off assist tape 40 is attached to the cover tape 13b of the component supply tape 13 based on a mark (boundary 40c) such that the non-adhesive portion 40b precedes the leading edge 13e of the component supply tape (ST2) (Figure 6).

[0043] Next, the component supply tape 13 with the peel-off assist tape 40 attached is inserted into the tape input port 23a from the peel-off assist tape 40 side and supplied to the component supply device 20 (ST3). The component supply device 20 captures the non-adhesive portion 40b of the peel-off assist tape 40 from the component supply tape 13 with the peel-off assist tape 40 attached, peels off the cover tape 13b, and supplies the component D to the component mounting device 1 (ST4) (Figure 4). The component mounting device 1 mounts the supplied component D onto the substrate 4 (ST5) (Figure 1).

[0044] As described above, the release assist tape 40 of this embodiment is a release assist tape 40 that is attached to a component supply tape 13 having a base tape 13a having a housing portion 13c for housing a component D, and a cover tape 13b that is attached to the base tape 13a and covers the housing portion 13c. The release assist tape 40 has an adhesive portion 40a that adheres to the cover tape 13b, a non-adhesive portion 40b that precedes the leading edge 13e of the component supply tape when the adhesive portion 40a is attached to the cover tape 13b, and a mark (boundary 40c) that can distinguish between the adhesive portion 40a and the non-adhesive portion 40b. This makes it possible to accurately attach the release assist tape 40 to various component supply tapes 13.

[0045] In the above embodiment, a component supply tape 13 (carrier tape) with embossing (storage portion 13c) was described as an example, but this technology can also be applied to component supply tapes without embossing (for example, a carrier tape with punch holes for storing component D). [Industrial applicability]

[0046] The present invention's peeling assist tape Pu is It has the advantage of being able to be accurately attached to various component supply tapes, making it useful in the field of mounting components onto circuit boards. [Explanation of Symbols]

[0047] 1. Component mounting equipment 4 circuit boards 13. Parts supply tape 13a Base Tape 13b Cover Tape 13c Storage area 13e Tip of component supply tape 20. Parts supply device 40, 43-45 Release aid tape 40a, 43a~45a Adhesive part 40b, 43b~45b Non-adhesive part 40c Boundary (Mark) 43c line (mark) 44c Cross (mark) 45c fold (mark) D parts La Adhesive part length Lb Length of the non-adhesive part W width of release aid tape

Claims

1. A release assist tape is attached to a component supply tape having a base tape having a housing portion for housing components and a cover tape that is attached to the base tape and covers the housing portion, The adhesive portion that adheres to the cover tape, The adhesive portion is attached to the cover tape, and the non-adhesive portion is located ahead of the tip of the component supply tape. A peel-off aid tape in which the adhesive portion and the non-adhesive portion are semi-transparent, and a recognizable boundary is formed by applying a translucent color to either one of them.

2. A peel-off assist tape to be attached to a component supply tape having a base tape having a housing portion for housing a component and a cover tape attached to the base tape and covering the housing portion, The adhesive portion that adheres to the cover tape, With the adhesive portion attached to the cover tape, the non-adhesive portion that precedes the tip of the component supply tape, A peel-off aid tape having marks that can distinguish between the adhesive portion and the non-adhesive portion, The aforementioned mark is a release aid tape, which is a fold provided between the adhesive portion and the non-adhesive portion.

3. A peel-off assisting tape according to claim 1, In the peel-off assist tape, the length of the adhesive portion and the non-adhesive portion along the transport direction of the component supply tape is such that the length of the adhesive portion is greater than the length of the non-adhesive portion.

4. The peel-off assist tape according to Claim 1, A release-assist tape supplied as a continuous strip of release-assist tape, and cut from the end of the continuous strip of release-assist tape to a length corresponding to the width of the cover tape to be applied.