Plasma processing apparatus and plasma processing method
By employing a drive unit to raise and lower a cover and object separately in the plasma processing apparatus, the apparatus minimizes the gap between the object and support member, effectively reducing abnormal discharge occurrences.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
- Filing Date
- 2022-09-22
- Publication Date
- 2026-07-03
Smart Images
Figure 0007884210000001 
Figure 0007884210000002 
Figure 0007884210000003
Abstract
Description
Technical Field
[0001] The present disclosure relates to a plasma processing apparatus and a plasma processing method.
Background Art
[0002] Conventionally, a plasma processing apparatus for plasma-processing an object to be processed has been known (for example, Patent Document 1). The plasma processing apparatus of Patent Document 1 includes a stage on which an object to be processed is placed, a cover provided above the stage and covering the outer edge of the object to be processed on the stage, a first elevating member for elevating the object to be processed, and a second elevating member for elevating the cover, and the first elevating member and the second elevating member are configured to be elevated and lowered integrally.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] By the way, in the plasma processing apparatus of Patent Document 1, in a state where the first and second elevating members are lowered to perform plasma processing, a space is formed between the first elevating member and the object to be processed (or below the object to be processed). If such a space exists, abnormal discharge may occur during plasma processing of the object to be processed. In such a situation, one of the purposes of the present disclosure is to make abnormal discharge less likely to occur.
Means for Solving the Problems
[0005] One aspect of the present disclosure relates to a plasma processing apparatus. The plasma processing apparatus comprises: a chamber in which a workpiece is subjected to plasma processing; a stage provided within the chamber on which the workpiece is placed; a cover provided above the stage and covering the outer edge of the workpiece placed on the stage; a first support member provided so as to penetrate the stage, with its upper end protruding from the stage to support the workpiece and to raise and lower the workpiece; a second support member that supports and raises the cover; and a drive unit that drives the second support member to raise and lower the cover supported by the second support member between a lowered position and an raised position. When the drive unit raises the cover from the lowered position to the raised position, in the first process from the lowered position until the cover reaches an intermediate position between the lowered position and the raised position, the drive unit raises the cover without raising the object to be processed by raising the second support member without raising the first support member, and in the second process from the intermediate position until the cover reaches the raised position, the drive unit raises the cover from the start of the second process and raises the object to be processed from the start of the second process or after the start of the second process.
[0006] Another aspect of this disclosure relates to a plasma processing method. The plasma processing method is performed in a plasma processing apparatus comprising: a chamber in which a workpiece is subjected to plasma processing; a stage provided in the chamber on which the workpiece is placed; a cover provided above the stage and covering the outer edge of the workpiece placed on the stage; a first support member provided so as to penetrate the stage, with its upper end protruding from the stage to support the workpiece and to raise and lower the workpiece; and a second support member to support and raise and lower the cover, the plasma processing method being performed in a plasma processing apparatus comprising: a processing step of plasma processing the workpiece placed on the stage; and a step of driving the second support member. The apparatus includes a raising step of raising the cover supported by the second support member from a lowered position to an raised position, the raising step comprising: a first step of raising the cover without raising the first support member until the cover reaches an intermediate position between the lowered position and the raised position, thereby raising the cover without raising the object to be processed; and a second step of raising the first support member and the second support member together until the cover reaches the raised position from the intermediate position, thereby raising the cover from the start and raising the object to be processed from the start or after the start. [Effects of the Invention]
[0007] According to this disclosure, abnormal discharge can be made less likely to occur. [Brief explanation of the drawing]
[0008] [Figure 1] This is a schematic cross-sectional view showing the plasma processing apparatus of Embodiment 1. [Figure 2] This is a cross-sectional view showing the main parts of the plasma processing apparatus. (a) shows the cover in the lowered position, (b) shows the cover in the intermediate position, and (c) shows the cover in the raised position. [Figure 3] This is a schematic cross-sectional view showing the plasma processing apparatus of Embodiment 2. [Modes for carrying out the invention]
[0009] Embodiments of the plasma processing apparatus and plasma processing method relating to this disclosure will be described below with examples. However, this disclosure is not limited to the examples described below. In the following description, specific numerical values and materials may be given as examples, but other numerical values and materials may be applied as long as the effects of this disclosure are obtained.
[0010] (Plasma treatment device) The plasma processing apparatus according to this disclosure may be, for example, a plasma etching apparatus, a plasma cleaning apparatus, a plasma dicer, a plasma ashing apparatus, or a plasma CVD apparatus. The plasma processing apparatus according to this disclosure comprises a chamber, a stage, a cover, a first support member, a second support member, and a drive unit.
[0011] The chamber is used for plasma processing of the object to be processed. The chamber may be formed in the shape of a hollow cylinder with an opening at the top. The opening of the chamber may be closed by a dielectric member. A coil for generating plasma inside the chamber may be placed above the dielectric member.
[0012] The stage is provided within the chamber and on which the object to be processed is placed. The stage may have a horizontal mounting surface on which the object to be processed is placed. The stage may have a channel through which a coolant flows to cool the object to be processed during plasma processing. The stage may have an electrostatic adsorption mechanism for adsorbing the object to be processed. The stage may have a lower electrode to which high-frequency power is applied. The object to be processed may be, for example, a semiconductor substrate that is pieced by plasma etching. The semiconductor substrate comprises a plurality of element regions and dividing regions that define the element regions. The element regions include, for example, a semiconductor layer and a wiring layer. By etching the dividing regions, an element chip having a semiconductor layer and a wiring layer is obtained. The object to be processed may be placed on the stage while supported by a carrier. The carrier may be, for example, a holding sheet whose outer periphery is held by a frame.
[0013] The cover is positioned above the stage. The cover covers the outer edge of the object to be processed placed on the stage. The cover has a window that exposes the portion of the object to be plasma-treated. When plasma processing is being performed, the distance between the cover and the object to be processed (minimum vertical distance) may be, for example, 1 mm or more and 4 mm or less.
[0014] The first support member is provided so as to penetrate the stage. The first support member may also penetrate the stage vertically. The upper end of the first support member protrudes from the stage to support the object to be processed. The first support member raises and lowers the object to be processed. The first support member may be driven by a drive unit. The first support member may be a rod-shaped member extending vertically. The maximum distance (maximum vertical distance) between the upper end of the first support member and the object to be processed may be 2 mm or less, preferably 1 mm or less, and ideally 0 mm.
[0015] The second support member supports and raises the cover. The second support member may support the cover at its upper end. The second support member may be a rod-shaped member extending vertically. The second support member may be provided so as to penetrate the stage on the outer circumference side of the first support member. The second support member may penetrate the stage vertically.
[0016] The drive unit drives the second support member to raise and lower the cover supported by the second support member between a lowered position and an raised position. The drive unit may also drive the second support member by being raised and lowered by any type of actuator.
[0017] The drive unit goes through a first process and a second process when raising the cover from the lowered position to the raised position. The first process is the process of the cover reaching an intermediate position (a predetermined position between the lowered position and the raised position) from the lowered position. In the first process, the drive unit raises the cover without raising the object to be processed by raising the second support member without raising the first support member. The second process is the process of the cover reaching the raised position from the intermediate position. In the second process, the drive unit raises the cover from the start of the second process and raises the object to be processed from the start or after the start of the second process by raising the first and second support members together. In other words, the first and second support members can be raised by the same drive unit. There is no need to provide separate drive units for driving the first support member and for driving the second support member.
[0018] The drive unit may raise the cover from the lowered position to the raised position by going through the first and second processes after the plasma treatment of the object to be processed is completed. As described above, in the first process, the cover rises without the object to be processed rising. This widens the difference between the height position of the object to be processed and the height position of the cover. In the second process following the first process, both the object to be processed and the cover rise. Here, in the second process, if the maximum distance between the object to be processed and the upper end of the first support member is 0 mm (i.e., there is no space between the object to be processed and the upper end of the first support member during plasma processing), the object to be processed rises from the start of the second process. On the other hand, in the second process, if the maximum distance between the object to be processed and the upper end of the first support member is greater than 0 mm (i.e., there is a small space between the object to be processed and the upper end of the first support member during plasma processing), immediately after the start of the second process, the object to be processed will not rise until the first support member rises by that maximum distance, and the object to be processed will rise together with the cover after the upper end of the first support member contacts the object to be processed. When the second process is complete (the cover has reached the raised position), the object to be processed is lifted from the stage, and a wide space (hereinafter also referred to as the access space) is created between the height of the object to be processed and the height of the cover. This access space can be used by a transport mechanism (for example, a transport arm that moves in a horizontal plane) to access the object to be processed. The formation of the access space when the cover is in the raised position is essential for the transport mechanism to be able to access the object to be processed.
[0019] Here, in the plasma processing apparatus of Patent Document 1, as described above, the first lifting member (corresponding to the first support member of the present disclosure) and the second lifting member (corresponding to the second support member of the present disclosure) always move up and down integrally. In order to form an access space when raising the first and second lifting members in such a configuration, as shown in, for example, FIG. 2 of Patent Document 1, it is necessary to leave a certain distance (for example, about 10 mm) between the object to be processed and the first lifting member. This distance causes abnormal discharge during plasma processing. On the other hand, in the plasma processing apparatus of the present disclosure, the first support member does not rise in the first process in which the access space is formed. Therefore, when performing plasma processing, the distance between the object to be processed and the first support member can be reduced (theoretically, it can be made 0 mm). This makes it possible to reduce the occurrence of abnormal discharge during plasma processing.
[0020] When the drive unit lowers the cover from the raised position to the lowered position, in the third process until the cover reaches the intermediate position from the raised position, the first support member and the second support member are integrally lowered to lower the object to be processed and the cover and place the object to be processed on the stage. In the fourth process until the cover reaches the lowered position from the intermediate position, the second support member may be lowered without lowering the first support member to lower the cover while maintaining the distance between the object to be processed and the upper end of the first support member. That is, the first support member and the second support member can be lowered by the same drive unit. There is no need to separately provide a drive unit for driving the first support member and a drive unit for driving the second support member. When raising and lowering the first support member and the second support member, the same drive unit may be driven in the reverse direction.
[0021] After the loading of the object to be processed into the chamber is completed, the drive unit may lower the cover from the raised position to the lowered position through the third process and the fourth process. As described above, in the third process, both the object to be processed and the cover descend, and the object to be processed is placed on the stage. In this state, there is an access space. In the fourth process following the third process, the cover descends while the object to be processed does not descend. As the cover descends, the access space becomes smaller. In the state where the fourth process is completed (the state where the cover has reached the lowered position), the object to be processed is placed on the stage, the access space disappears, and the cover comes sufficiently close to the object to be processed.
[0022] Here, in the plasma processing apparatus of Patent Document 1, as described above, the first lifting member (corresponding to the first support member of the present disclosure) and the second lifting member (corresponding to the second support member of the present disclosure) always move up and down integrally. When trying to bring the cover sufficiently close to the object to be processed when lowering the first and second lifting members in such a configuration, as shown in, for example, FIG. 2 of Patent Document 1, a certain distance (for example, about 10 mm) is created between the object to be processed and the first lifting member. This distance causes abnormal discharge during plasma processing. In contrast, in the plasma processing apparatus of the present configuration, the first support member does not descend in the fourth process of bringing the cover closer to the object to be processed. Therefore, when performing plasma processing, the distance between the object to be processed and the first support member can be reduced (theoretically, it can be made 0 mm).
[0023] The plasma processing apparatus may further include a first liftable base to which a first support member is directly or indirectly connected, and a second liftable base provided below the first base and to which a second support member is directly or indirectly connected. The first base moves away from the second base when the cover is between the lowered position and the intermediate position, and moves up and down together with the second base when the cover is between the intermediate position and the raised position. With this configuration, when the cover is between the lowered position and the intermediate position, only the second base moves up and down, and the first base does not. In other words, when the cover is between the intermediate position and the raised position, only the second support member moves up and down, and the first support member does not, and therefore only the cover moves up and down, and the object to be processed does not move up or down. The second base may be moved up and down by a drive unit. The first base may be pushed up by the rising second base and rise. The first base may also descend following the descending second base. The first base and the second base may each be formed in a ring shape.
[0024] The plasma processing apparatus may further include a fixed third base located below the second base, and a spacer provided between the first base and the third base. The spacer may separate the first base and the second base while maintaining the distance between the first base and the third base when the cover is between the lowered position and the intermediate position. In this configuration, when the cover is between the lowered position and the intermediate position, the first base rests on the third base via the spacer. The spacer may be integrated with the first base. In this case, when the cover is between the intermediate position and the raised position, the spacer moves up and down together with the first and second bases, away from the third base. Alternatively, the spacer may be integrated with the third base. In this case, the spacer remains in a fixed position regardless of the movement of the first and second bases. There may be only one spacer or there may be multiple spacers.
[0025] The object to be processed may include a substrate, a retaining sheet for holding the substrate, and a frame for supporting the retaining sheet. The cover may cover the area outside the substrate in the frame and the retaining sheet. The first support member may support the portion of the object to be processed that corresponds to the frame. In this configuration, the substrate is held by the frame and the retaining sheet, and the frame and retaining sheet are protected from plasma by the cover. The area outside the substrate in the frame and the retaining sheet corresponds to the outer edge of the object to be processed.
[0026] The object to be processed may be a substrate. The cover may cover the outer edge of the substrate. In this configuration, the cover protects the outer edge of the substrate from the plasma.
[0027] When the cover is in the lowered position, the distance between the upper end of the first support member and the object to be processed may be 1 mm or less. In this configuration, almost no unnecessary space is formed below the object to be processed during plasma processing. Therefore, abnormal discharges during plasma processing can be made even less likely to occur.
[0028] (Plasma treatment method) The plasma processing method according to this disclosure can be implemented, for example, in the plasma processing apparatus described above, and comprises a processing step and an upward step.
[0029] In the processing step, the object to be processed, placed on the stage, is subjected to plasma treatment. The plasma treatment may be, for example, plasma etching.
[0030] In the lifting process, the cover supported by the second support member is raised from the lowered position to the raised position by driving the second support member. The lifting process has a first step and a second step. In the first step, the cover is raised without raising the object to be processed by raising the second support member without raising the first support member until the cover reaches an intermediate position (a predetermined position between the lowered position and the raised position) from the lowered position. In the first step, an access space is formed between the cover and the object to be processed. In the second step, the first support member and the second support member are raised together until the cover reaches the raised position from the intermediate position, thereby raising the cover from the start and raising the object to be processed from the start or after the start.
[0031] In the plasma processing method of this disclosure, the first support member does not rise in the first step in which the access space is formed. Therefore, when performing plasma processing in the processing step, the distance between the object to be processed and the first support member can be reduced (theoretically, it can be reduced to 0 mm). This makes it possible to reduce the likelihood of abnormal discharge occurring during plasma processing.
[0032] The plasma processing method may further include a lowering step of driving the second support member to lower the cover supported by the second support member from a raised position to a lowered position. The lowering step may include a third step of lowering the object to be processed and the cover by lowering the first support member and the second support member together until the cover reaches an intermediate position from the raised position, thereby lowering the object to be processed and placing the object to be processed on a stage, and a fourth step of lowering the cover while maintaining the distance between the object to be processed and the upper end of the first support member by lowering the second support member without lowering the first support member until the cover reaches a lower position from the intermediate position.
[0033] In this plasma processing method, the first support member does not descend in the fourth step, when the cover is brought closer to the object to be processed. Therefore, when performing plasma processing in the processing step, the distance between the object to be processed and the first support member can be reduced (theoretically, it can be reduced to 0 mm). This makes it possible to reduce the likelihood of abnormal discharge occurring during plasma processing.
[0034] The plasma treatment method may further include a replacement step between the raising step and the lowering step for replacing the object to be treated. After the raising step is completed, an access space is formed between the cover and the object to be treated. In the replacement step, the treated object may be replaced with an untreated object through this access space. For example, a transport arm moving in a horizontal plane may be used to replace the object to be treated. The lowering step may be performed after the replacement step is completed.
[0035] As described above, according to this disclosure, by reducing the maximum distance between the object to be processed and the upper end of the first support member, it is possible to make abnormal discharges less likely to occur during plasma processing.
[0036] Hereinafter, an example of a plasma processing apparatus and plasma processing method according to this disclosure will be specifically described with reference to the drawings. The components and processes described above can be applied to the components and processes of the example plasma processing apparatus and plasma processing method described below. The components and processes of the example plasma processing apparatus and plasma processing method described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above embodiments. Among the components and processes of the example plasma processing apparatus and plasma processing method described below, components and processes that are not essential to the plasma processing apparatus and plasma processing method according to this disclosure may be omitted. Note that the figures shown below are schematic and do not accurately reflect the actual shape and number of components.
[0037] Embodiment 1 Embodiment 1 of this disclosure will be described below. First, a plasma processing apparatus 10 will be described, and then a plasma processing method that can be performed using the plasma processing apparatus 10 will be described.
[0038] (Plasma treatment device) The plasma processing apparatus 10 of this embodiment is a plasma etching apparatus, but is not limited thereto. The plasma processing apparatus 10 comprises a chamber 20, a stage 60, a cover 70, a first support member 81, a second support member 82, a first base 91, a second base 92, a third base 93, a spacer 110, and a drive unit 120.
[0039] The chamber 20 is used to perform plasma treatment on the object 200 to be processed. The chamber 20 is formed in a hollow cylindrical shape with an opening at the top. The chamber 20 has a bottom wall portion 21 and side wall portions 22 rising from the periphery of the bottom wall portion 21. The opening of the chamber 20 is closed by a plate-shaped dielectric member 30. The dielectric member 30 may be made of ceramics such as quartz, alumina, or aluminum nitride. Above the dielectric member 30, a coil 40 for generating plasma inside the chamber 20 is arranged. The coil 40 may be formed in a spiral shape.
[0040] An inlet / outlet 22a for loading and unloading the material to be processed 200 is formed in the side wall portion 22 of the chamber 20. This inlet / outlet 22a is opened and closed by a gate valve 50. The gate valve 50 is movable between a closed position that closes the inlet / outlet 22a (shown by a solid line in Figure 1) and an open position that opens the inlet / outlet 22a (shown by a dashed line in Figure 1).
[0041] The object to be processed 200 in this embodiment includes a substrate 201, a holding sheet 202 for holding the substrate 201, and a frame 203 for supporting the holding sheet 202. The substrate 201 is a semiconductor substrate that is fragmented by plasma etching. The holding sheet 202 is made of a resin sheet larger than the substrate 201 and has an adhesive layer for holding the substrate 201. The frame 203 is a ring-shaped member made of metal or resin and is fixed to the outer edge of the holding sheet 202.
[0042] The stage 60 is located inside the chamber 20 and on which the object to be processed 200 is placed. The stage 60 is fixed to the bottom wall 21 of the chamber 20. The stage 60 has a horizontal mounting surface 61 on which the object to be processed 200 is placed. The stage 60 has an electrostatic adsorption electrode (ESC electrode) 62 for adsorbing the object to be processed 200. The stage 60 has a high-frequency electrode (RF electrode) 63 for controlling the incident energy of ions on the object to be processed 200. The stage 60 has a coolant channel (not shown) for cooling the object to be processed 200 during plasma processing.
[0043] The cover 70 is positioned above the stage 60. The cover 70 covers the outer edge of the object to be processed 200 placed on the stage 60 (in this example, the area outside the substrate 201 in the frame 203 and holding sheet 202). The cover 70 has a window portion 70W that exposes the substrate 201 of the object to be processed 200 placed on the stage 60.
[0044] The first support member 81 is provided so as to penetrate the stage 60 vertically. That is, the stage 60 has a plurality of first through holes 64 that penetrate it vertically, and the rod-shaped first support member 81 is inserted through the first through holes 64. The upper end of the first support member 81 protrudes from the stage 60 and supports the object to be processed 200. In this embodiment, the first support member 81 supports the portion of the object to be processed 200 that corresponds to the frame 203. In other words, the first support member 81 in this embodiment is positioned below the frame 203 of the object to be processed 200. The first support member 81 is driven up and down by the drive unit 120 to raise and lower the object to be processed 200. The maximum distance between the upper end of the first support member 81 and the object to be processed 200 (distance in the state shown in Figure 1) is 2 mm or less, preferably 1 mm or less. Multiple first support members 81 are provided in a row (four in this example) in the circumferential direction of the chamber 20, but the number and arrangement of the first support members 81 are not particularly limited.
[0045] The second support member 82 is provided so as to penetrate the stage 60 vertically. That is, the stage 60 has a plurality of second through holes 65 that penetrate it vertically, and the rod-shaped second support member 82 is inserted through the second through holes 65. The upper end of the second support member 82 protrudes from the stage 60 and supports the cover 70. The second support member 82 is driven up and down by the drive unit 120 to raise and lower the cover 70. Multiple second support members 82 (four in this example) are provided in a row in the circumferential direction of the chamber 20 on the outer circumference side of the first support member 81. However, the number and arrangement of the second support members 82 are not particularly limited.
[0046] The first base 91 is a plate-shaped member to which the lower end of the first support member 81 is connected. The first base 91 is placed in a base space BS formed below the bottom wall portion 21 of the chamber 20, and moves up and down within this base space BS. When the first base 91 moves up and down, the first support member 81 connected to it also moves up and down. In the state shown in Figure 1, the first base 91 rests on the third base 93 via a spacer 110.
[0047] The second base 92 is a plate-shaped member to which the lower end of the second support member 82 is connected. The second base 92 is positioned below the first base 91 in the base space BS. The second base 92 is raised and lowered within the base space BS by the drive unit 120. When the second base 92 is raised and lowered, the second support member 82 connected to it also moves up and down. The second base 92 has a plurality of spacer holes 92a formed therein, through which spacers 110 are inserted.
[0048] The third base 93 is located below the second base 92. The third base 93 is a fixed member and, together with the bottom wall 21 of the chamber 20 and the peripheral wall 101 located below it, defines the base space BS. A third through-hole 93a is formed in the center of the third base 93, penetrating the third base 93 vertically.
[0049] The spacer 110 is provided between the first base 91 and the third base 93. The spacer 110 is a cylindrical or cylindrical member extending in the vertical direction, but the shape of the spacer 110 is not limited to this. The spacer 110 defines the minimum vertical distance between the first base 91 and the third base 93. In this embodiment, the spacer 110 is fixed to the first base 91 and moves up and down together with the first base 91 within the base space BS.
[0050] The drive unit 120 is composed of a rod-shaped member inserted through the third through hole 93a. The drive unit 120 is fixed to the second base 92. The drive unit 120 drives the second support member 82 via the second base 92, thereby raising and lowering the cover 70 supported by the second support member 82 between a lowered position (the position shown in Figure 1) and an raised position (the position shown in Figure 2(c)). The drive unit 120 is raised and lowered by any type of actuator (not shown).
[0051] As shown in Figure 2, the drive unit 120 goes through a first process and a second process when raising the cover 70 from the lowered position (position in Figure 2(a)) to the raised position (position in Figure 2(c)). The first process is the process until the cover 70 reaches the intermediate position (position in Figure 2(b)) from the lowered position. In the first process, the drive unit 120 raises the cover 70 without raising the object to be processed 200 by raising the second support member 82 without raising the first support member 81. In the first process, the first base 91 does not move away from the second base 92. At this time, the distance between the first base 91 and the third base 93 is maintained by the spacer 110. The second process is the process until the cover 70 reaches the raised position from the intermediate position. In the second process, the drive unit 120 raises the cover 70 from the start of the second process and raises the object to be processed 200 from the start or after the start of the second process by integrally raising the first support member 81 and the second support member 82. In the second process, the first base 91 rises together with the second base 92.
[0052] As shown in Figure 2, the drive unit 120 goes through a third and fourth process when lowering the cover 70 from the raised position (position in Figure 2(c)) to the lowered position (position in Figure 2(a)). The third process is the process until the cover 70 reaches the intermediate position (position in Figure 2(b)) from the raised position. In the third process, the drive unit 120 lowers the object to be processed 200 and the cover 70 by lowering the first support member 81 and the second support member 82 together, thereby placing the object to be processed 200 on the stage. In the third process, the first base 91 lowers together with the second base 92. The fourth process is the process until the cover 70 reaches the lowered position from the intermediate position. In the fourth process, the drive unit 120 lowers the cover 70 while maintaining the distance between the object to be processed 200 and the upper end of the first support member 81 by lowering the second support member 82 without lowering the first support member 81. In the fourth process, the first base 91 remains stationary, separated from the second base 92. At this time, the spacer 110 maintains the distance between the first base 91 and the third base 93.
[0053] (Plasma treatment method) The plasma processing method of this embodiment is performed using the plasma processing apparatus 10 described above. However, the plasma processing method may be performed using other apparatus or systems. The plasma processing method comprises a processing step, an upward step, an exchange step, and a downward step.
[0054] In the processing step, the object to be processed 200 (specifically, the substrate 201) placed on the stage 60 is subjected to plasma processing (for example, plasma etching).
[0055] In the lifting process, the cover 70 supported by the second support member 82 is raised from the lowered position (position in Figure 2(a)) to the raised position (position in Figure 2(c)) by driving the second support member 82. The lifting process has a first step and a second step. In the first step, the cover 70 is raised without raising the object to be processed 200 by raising the second support member 82 without raising the first support member 81 until the cover 70 reaches the intermediate position (position in Figure 2(b)) from the lowered position. In the first step, an access space AS is formed between the cover 70 and the object to be processed 200. In the second step, the cover 70 is raised from the start and the object to be processed 200 is raised from the start or after the start by raising the first support member 81 and the object to be processed 200 from the start until the cover 70 reaches the raised position from the intermediate position.
[0056] In the exchange process, the object to be processed 200 is replaced. In the exchange process, the processed object to be processed 200 is replaced with an unprocessed object to be processed 200 via an access space AS formed through the lifting process. A transport arm that can enter and exit the chamber 20 via an open loading / unloading port 22a is used for the exchange of the object to be processed.
[0057] In the lowering process, the cover 70 supported by the second support member 82 is lowered from the raised position (position in Figure 2(c)) to the lowered position (position in Figure 2(a)) by driving the second support member 82. The lowering process has a third step and a fourth step. In the third step, the first support member 81 and the second support member 82 are lowered together until the cover 70 reaches the intermediate position (position in Figure 2(b)) from the raised position, thereby lowering the object to be processed 200 and the cover 70 and placing the object to be processed 200 on the stage 60. In the fourth step, the second support member 82 is lowered without lowering the first support member 81 until the cover 70 reaches the lowered position from the intermediate position, thereby lowering the cover 70 while maintaining the distance between the object to be processed 200 and the upper end of the first support member 81.
[0058] Embodiment 2 Embodiment 2 of this disclosure will now be described. This embodiment differs from Embodiment 1 in the configuration of the object to be processed 200. The differences from Embodiment 1 will be mainly described below.
[0059] As shown in Figure 3, the object to be processed 200 in this embodiment is a substrate 201. The cover 70 covers the outer edge of the substrate 201. The central region of the substrate 201 (the region to be subjected to plasma processing) is exposed through the window portion 70W of the cover 70. The other configurations and operations are the same as in Embodiment 1 described above.
[0060] [Note] The above description of embodiments discloses the following technologies. (Technology 1) A chamber in which the object to be processed is subjected to plasma treatment, A stage is provided within the chamber on which the object to be processed is placed, A cover provided above the stage and covering the outer edge of the object to be processed placed on the stage, A first support member is provided so as to penetrate the stage, with its upper end protruding from the stage to support the object to be processed and to raise and lower the object to be processed. A second support member that supports and raises the cover, A drive unit that drives the second support member to raise and lower the cover supported by the second support member between a lowered position and an raised position, Equipped with, When the drive unit raises the cover from the lowered position to the raised position, In the first process from the lowered position to an intermediate position between the lowered position and the raised position, the cover is raised without raising the first support member by raising the second support member, thereby raising the object to be processed. Plasma processing apparatus, wherein in the second process in which the cover reaches the raised position from the intermediate position, the first support member and the second support member are raised integrally, thereby raising the cover from the start of the second process and raising the object to be processed from the start of the second process or after the start of the second process. (Technology 2) When the drive unit lowers the cover from the raised position to the lowered position, In the third process, from the raised position to the intermediate position, the first support member and the second support member are lowered together, thereby lowering the object to be processed and the cover, and placing the object to be processed on the stage. In the fourth step from the intermediate position to the lowered position of the cover, the second support member is lowered without lowering the first support member, thereby lowering the cover while maintaining the distance between the object to be processed and the upper end of the first support member, as described in Technical 1. (Technology 3) The first support member is directly or indirectly connected to a liftable first base, A second base, which is provided below the first base and is directly or indirectly connected to the second support member, is a liftable second base. Furthermore, The plasma processing apparatus according to Art 1 or 2, wherein the first base separates from the second base when the cover is between the lowered position and the intermediate position, and moves up and down together with the second base when the cover is between the intermediate position and the raised position. (Technology 4) A fixed third base is provided below the second base, A spacer provided between the first base and the third base, Furthermore, The plasma processing apparatus according to Art 3, wherein the spacer separates the first base and the second base while maintaining the distance between the first base and the third base when the cover is between the lowered position and the intermediate position. (Technology 5) The object to be processed comprises a substrate, a holding sheet for holding the substrate, and a frame for supporting the holding sheet. The cover covers the area outside the substrate in the frame and the retaining sheet. The plasma processing apparatus according to any one of the technologies 1 to 4, wherein the first support member supports the portion of the object to be processed that corresponds to the frame. (Technology 6) The object to be processed is a substrate, The cover covers the outer edge of the substrate, as described in any one of the technologies 1 to 4. (Technology 7) When the cover is in the lowered position, the distance between the upper end of the first support member and the object to be processed is 1 mm or less, as described in any one of the technologies 1 to 6. (Technology 8) A chamber in which the object to be processed is subjected to plasma treatment, A stage is provided within the chamber on which the object to be processed is placed, A cover provided above the stage and covering the outer edge of the object to be processed placed on the stage, A first support member is provided so as to penetrate the stage, with its upper end protruding from the stage to support the object to be processed and to raise and lower the object to be processed. A second support member that supports and raises the cover, A plasma processing method performed in a plasma processing apparatus comprising: A processing step of plasma-treating the object to be processed placed on the stage, The process involves driving the second support member to raise the cover supported by the second support member from a lowered position to an elevated position, Equipped with, The aforementioned lifting process is The first step involves raising the cover without raising the object to be processed by raising the second support member without raising the first support member until the cover reaches an intermediate position between the lowered position and the raised position from the lowered position, The second step involves raising the cover from the start and raising the object to be processed from the start or after the start by integrally raising the first support member and the second support member until the cover reaches the raised position from the intermediate position, A plasma treatment method having the following characteristics. (Technology 9) The system further includes a lowering step in which the cover supported by the second support member is lowered from the raised position to the lowered position by driving the second support member, The aforementioned descent process is, The third step involves lowering the object to be processed and the cover by integrally lowering the first support member and the second support member until the cover reaches the intermediate position from the raised position, thereby lowering the object to be processed and the cover and placing the object to be processed on the stage. A fourth step involves lowering the cover while maintaining the distance between the object to be processed and the upper end of the first support member, by lowering the second support member without lowering the first support member until the cover reaches the lowered position from the intermediate position, A plasma treatment method according to Technical 8, comprising the characteristics described above. (Technology 10) The plasma treatment method according to Technical Reference 9, further comprising a replacement step of replacing the object to be treated between the raising step and the lowering step. [Industrial applicability]
[0061] This disclosure can be used in plasma processing apparatus and plasma processing methods. [Explanation of Symbols]
[0062] 10: Plasma processing equipment 20: Chamber 21: Bottom wall section 22: Side wall section 22a: Loading / unloading exit 30: Dielectric material 40: Coil 50: Gate valve 60: Stage 61: Mounting surface 62:ESC electrode 63:RF electrode 64: First through hole 65: Second through hole 70: Cover 70W: Window section 81: First support member 82: Second support member 91: 1st Base 92: Second base 92a: Spacer hole 93: Third base 93a: Third through hole 101: Peripheral wall part 110: Spacer 120: Drive unit 200: Object to be processed 201: Circuit board 202: Retaining Sheet 203: Frame AS: Access Space BS: Base Space
Claims
1. A chamber in which the object to be processed is subjected to plasma treatment, A stage is provided within the chamber on which the object to be processed is placed, A cover provided above the stage and covering the outer edge of the object to be processed placed on the stage, A first support member is provided so as to penetrate the stage, with its upper end protruding from the stage to support the object to be processed and to raise and lower the object to be processed. A second support member that supports and raises the cover, A drive unit that drives the second support member to raise and lower the cover supported by the second support member between a lowered position and an raised position, The first support member is directly or indirectly connected to a liftable first base, A second base, which is provided below the first base and is directly or indirectly connected to the second support member, is a liftable second base, Equipped with, The first base moves apart from the second base when the cover is between the lowered position and an intermediate position between the lowered position and the raised position, while moving up and down together with the second base when the cover is between the intermediate position and the raised position. When the drive unit raises the cover from the lowered position to the raised position, In the first process from the lowered position to the intermediate position of the cover, the cover is raised without raising the object to be processed by raising the second support member without raising the first support member. A plasma processing apparatus in which, in the second process in which the cover reaches the raised position from the intermediate position, the first support member and the second support member are raised integrally, thereby raising the cover from the start of the second process and raising the object to be processed from the start of the second process or after the start of the second process.
2. When the drive unit lowers the cover from the raised position to the lowered position, In the third process, from the raised position to the intermediate position, the first support member and the second support member are lowered together, thereby lowering the object to be processed and the cover, and placing the object to be processed on the stage. The plasma processing apparatus according to claim 1, wherein in the fourth process from the intermediate position to the lowered position, the cover is lowered while maintaining the distance between the object to be processed and the upper end of the first support member by lowering the second support member without lowering the first support member.
3. A fixed third base is provided below the second base, A spacer provided between the first base and the third base, Furthermore, The plasma processing apparatus according to claim 1 or 2, wherein the spacer separates the first base and the second base while maintaining the distance between the first base and the third base when the cover is between the lowered position and the intermediate position.
4. The object to be processed comprises a substrate, a holding sheet for holding the substrate, and a frame for supporting the holding sheet. The cover covers the area outside the substrate in the frame and the retaining sheet. The plasma processing apparatus according to claim 1 or 2, wherein the first support member supports the portion of the object to be processed that corresponds to the frame.
5. The object to be processed is a substrate, The plasma processing apparatus according to claim 1 or 2, wherein the cover covers the outer edge of the substrate.
6. The plasma processing apparatus according to claim 1 or 2, wherein when the cover is in the lowered position, the distance between the upper end of the first support member and the object to be processed is 1 mm or less.
7. A chamber in which the object to be processed is subjected to plasma treatment, A stage is provided within the chamber on which the object to be processed is placed, A cover provided above the stage and covering the outer edge of the object to be processed placed on the stage, A first support member is provided so as to penetrate the stage, with its upper end protruding from the stage to support the object to be processed and to raise and lower the object to be processed. A second support member that supports and raises the cover, The first support member is directly or indirectly connected to a liftable first base, A second base, which is provided below the first base and is directly or indirectly connected to the second support member, is a liftable second base, A plasma processing method performed in a plasma processing apparatus, comprising: the first base separates from the second base when the cover is in a lowered position and an intermediate position between the lowered position and the raised position, while the cover moves up and down together with the second base when the cover is in an intermediate position and the raised position; A processing step of plasma-treating the object to be processed placed on the stage, A lifting step in which the cover supported by the second support member is raised from the lowered position to the raised position by driving the second support member, Equipped with, The aforementioned lifting process is The first step involves raising the cover without raising the object to be processed by raising the second support member without raising the first support member until the cover reaches the intermediate position from the lowered position, The second step involves raising the first support member and the second support member together until the cover reaches the raised position from the intermediate position, thereby raising the cover from the start and raising the object to be processed from the start or after the start, A plasma treatment method having the following characteristics.
8. The system further includes a lowering step in which the cover supported by the second support member is lowered from the raised position to the lowered position by driving the second support member, The aforementioned descent process is, The third step involves lowering the object to be processed and the cover by integrally lowering the first support member and the second support member until the cover reaches the intermediate position from the raised position, thereby lowering the object to be processed and the cover and placing the object to be processed on the stage. A fourth step involves lowering the cover while maintaining the distance between the object to be processed and the upper end of the first support member, by lowering the second support member without lowering the first support member until the cover reaches the lowered position from the intermediate position, A plasma treatment method according to claim 7, comprising:
9. The plasma treatment method according to claim 8, further comprising a replacement step of replacing the object to be treated between the raising step and the lowering step.