Mounting device and mounting method

Abstract

To provide a mounting device that can suppress the generation of a mounting failure and is in a compact, and provide a mounting method using them.SOLUTION: A mounting device 1 comprises: a first metal molding 10 that is constructed by holding substrates SB1 and SB2 onto which electron components CH11, CH12, CH21, and CH22 are mounted; a second metal molding 20 that includes at least one of movable mechanisms 22A, 22B, 22C, and 22D connected to an internal space 23; and a pressing force transmission mechanism PR that presses a viscous member 23V sealed into the internal space 23 of the second metal molding 20. In a state where the first metal molding 10 and the second metal molding 20 are molded, the electron components CH11, CH12, CH21, and CH22 are pressed by the movable mechanisms 22A, 22B, 22C, and 22D via the viscous member 23V on the basis of a pressing force for pressing the viscous member 23V by the pressing force transmission mechanism PR.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a mounting device and a mounting method.

Background Art

[0002] When mounting electronic components on a substrate via a bonding material, a mounting device that simultaneously applies pressure to a plurality of electronic components with respect to at least one substrate is known. In such a mounting device, each of the plurality of electronic components may be individually pressurized so that mounting defects do not occur due to insufficient or excessive pressure on the electronic components caused by differences in the dimensions of the plurality of electronic components.

[0003] For example, Patent Document 1 discloses a semiconductor mounting device including a plurality of pressing blocks that individually press a plurality of semiconductor elements, a plurality of shafts for linearly moving the plurality of pressing blocks, a plurality of pressurizing blocks for pressurizing the plurality of blocks via the plurality of shafts, and an elastic body for collectively pressurizing the plurality of pressurizing blocks. Pressure by pneumatic pressure or compressed gas is supplied to a pressure valve, and the elastic body is expanded toward the plurality of pressurizing blocks side to pressurize the plurality of pressurizing blocks.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the semiconductor mounting device described in Patent Document 1 needs to include a compressor or a high-pressure tank for supplying pressure of pneumatic pressure or compressed gas, and piping through which air or compressed gas passes. Therefore, the device may be enlarged.

[0006] The present invention has been made in view of these circumstances, and aims to provide a compact mounting device and a mounting method using the same that can suppress the occurrence of mounting defects. [Means for solving the problem]

[0007] A mounting apparatus according to one aspect of the present invention is a mounting apparatus for mounting one or more electronic components on at least one substrate, comprising: a first mold configured to hold a substrate on which electronic components are mounted; a second mold disposed opposite to the first mold and having at least one movable mechanism connected to the internal space of the second mold; and a pressure transmission mechanism for pressing a viscous member sealed in the internal space of the second mold, wherein, when the first mold and the second mold are closed, the electronic components are pressurized by the movable mechanism via the viscous member based on the pressing force applied by the pressure transmission mechanism to the viscous member.

[0008] Another aspect of the present invention relates to a mounting method for mounting one or more electronic components on at least one substrate, comprising: providing a first mold configured to hold a substrate on which the electronic components are mounted; providing a second mold positioned opposite the first mold, the second mold having at least one movable mechanism connected to the internal space of the second mold; and providing a pressure transmission mechanism for pressing a viscous member sealed in the internal space of the second mold, the mounting method further comprising: closing the first mold and the second mold; pressing the viscous member with the pressure transmission mechanism; and, with the first mold and the second mold closed, pressurizing the electronic components via the viscous member by the movable mechanism based on the pressing force applied by the pressure transmission mechanism to the viscous member. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a compact mounting device and a mounting method using the same that can suppress the occurrence of mounting defects. [Brief explanation of the drawing]

[0010] [Figure 1] This figure shows an overall overview of the mounting device according to one embodiment of the present invention. [Figure 2] This is a flowchart showing part of the implementation method for one embodiment of the present invention. [Figure 3] This is a flowchart showing part of the implementation method for one embodiment of the present invention. [Figure 4] This graph shows the temperature profile of the implementation method according to one embodiment of the present invention. [Figure 5] This figure shows the mounting device in one step of the mounting method. [Figure 6] This figure shows the mounting device in one step of the mounting method. [Figure 7] This figure shows the mounting device in one step of the mounting method. [Figure 8] This figure shows the mounting device in one step of the mounting method. [Figure 9] This figure shows the mounting device in one step of the mounting method. [Figure 10] This figure shows the mounting device in one step of the mounting method. [Figure 11] This figure shows the mounting device in one step of the mounting method. [Figure 12] This figure shows an overall overview of an implementation device according to one modified example of the present invention. [Figure 13] This figure shows an overall overview of an implementation device according to one modified example of the present invention. [Modes for carrying out the invention]

[0011] Embodiments of the present invention are described below. In the following drawings, identical or similar components are denoted by identical or similar reference numerals. The drawings are illustrative, and the dimensions, shapes, and numbers of each part are schematic; the technical scope of the present invention should not be limited to these embodiments.

[0012] <Mounting device> First, while referring to FIG. 1, the configuration of the mounting device 1 according to an embodiment of the present invention will be described. FIG. 1 is a diagram showing an overall overview of the mounting device according to an embodiment of the present invention.

[0013] The mounting device 1 performs mounting processing on the workpieces W1 and W2. The workpiece W1 includes electronic components CH11 and CH12, bonding materials SN11 and SN12, and a substrate SB1. The workpiece W2 includes electronic components CH21 and CH22, bonding materials SN21 and SN22, and a substrate SB2. That is, the mounting device 1 mounts the electronic component CH11 on the substrate SB1 via the bonding material SN11, mounts the electronic component CH12 on the substrate SB1 via the bonding material SN12, mounts the electronic component CH21 on the substrate SB2 via the bonding material SN21, and mounts the electronic component CH22 on the substrate SB2 via the bonding material SN22. Inside the mounting device 1, the workpiece W1 is installed such that the substrate SB1 faces the lower mold 10 and the electronic components CH11 and CH12 face the upper mold 20, and the workpiece W2 is installed such that the substrate SB2 faces the lower mold 10 and the electronic components CH21 and CH22 face the upper mold 20. Before the mounting processing by the mounting device 1 is performed, the electronic components CH11 and CH12 are placed on the substrate SB1, and the electronic components CH21 and CH22 are placed on the substrate SB2. After the mounting processing by the mounting device 1 is performed, the electronic components CH11 and CH12 are bonded to the substrate SB1, and the electronic components CH21 and CH22 are bonded to the substrate SB2. In the following description, the side on which the electronic components CH11, CH12, CH21, and CH22 are provided is defined as the front surface of the substrates SB1 and SB2, and the opposite side is defined as the back surface of the substrates SB1 and SB2.

[0014] Multiple electronic components CH11, CH12, CH21, CH22 are, for example, semiconductor chips. Substrates SB1, SB2 are DBA (Direct Bonded Aluminum) substrates (high heat dissipation ceramic insulating substrates with aluminum circuits) or DBC (Direct Bonded Copper) substrates (high heat dissipation ceramic insulating substrates with copper circuits). Bonding materials SN11, SN12, SN21, SN22 are, for example, sintering materials containing silver (Ag) nanoparticles. Mounting apparatus 1 is a sintering apparatus that heats and pressurizes the bonding materials SN11, SN12, SN21, SN22 to sinter them. The thicknesses of substrates SB1 and SB2 may be different from each other, for example, but may also be the same. The heights of electronic components CH11 and CH12 may be different from each other, for example, but may also be the same height. The heights of electronic components CH21 and CH22 may be different from each other, for example, but may also be the same height. The thicknesses of the bonding materials SN11, SN12, SN21, and SN22 may be the same. Also, the number of electronic components on a single substrate is at least one, but not limited to two.

[0015] Furthermore, the mounting apparatus according to one embodiment of the present invention is not limited to a sintering apparatus as long as it pressurizes the electronic components, but may be any suitable apparatus such as a flip-chip bonder. Also, the electronic components according to one embodiment of the present invention are not limited to semiconductor chips, but may be passive elements such as resistors, inductors, capacitors and crystal oscillators, or active elements such as tide diodes, transistors, thyristors or operational amplifiers.

[0016] The substrate according to an embodiment of the present invention is not limited to a ceramic substrate, and may be, for example, a semiconductor substrate such as a silicon substrate, a metal substrate such as a lead frame, or an insulator substrate such as a PCB (Printed Circuit Board) substrate. Further, the substrate may be an electronic component, and in this case, the mounting device according to an embodiment of the present invention is a device for joining electronic components to each other. The bonding material according to an embodiment of the present invention is not limited to a sintering material, and may be a semi-sintering material, a metal solder, an organic adhesive, or an inorganic adhesive. The form of the bonding material is, for example, an aggregate of powders, but may also be liquid, semi-solid, solid, or film-like.

[0017] The number of substrates according to an embodiment of the present invention is not limited to two, and may be at least one. Similarly, the number of electronic components is not limited to four, and there may be at least one on one substrate. One or more electronic components are mounted on one substrate. [[ID=~]]

[0018] As shown in FIG. 1, the mounting device 1 includes a press device 3 and a mold 2 attached to the press device 3. In the illustrated example, the mounting device 1 further includes degassing chambers 31, 32, but this is not necessarily required. The press device 3 includes a pair of upper and lower platens 4, 5 connected by tie bars and a lower plunger PR1.

[0019] The mold 2 includes an upper mold base 21E fixed to the upper platen 5 and a lower mold base 11F fixed to the lower platen 4. Between the upper mold base 21E and the lower mold base 11F, the main plates constituting the mold 2 (support plates 21D, 21C, upper mold chase 21B, lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, etc.) are fixed.

[0020] In the following description, the various plates and their components fixed to the lower mold base 11F will be collectively referred to as the lower mold 10, and the various plates and their components fixed to the upper mold base 21E will be collectively referred to as the upper mold 20. The lower mold 10 is an example of the "first mold," and the upper mold 20 is an example of the "second mold."

[0021] The lower mold 10 mainly includes the lower mold base 11F, support pillars 11E, retainer plate 11D, ejector pin plate 11C, lower mold chase 11B, etc. The lower mold chase 11B is fixed above the lower mold base 11F via a plurality of support pillars 11E that protrude columnarly from the lower mold base 11F.

[0022] Below the lower die chase 11B are the ejector pin plate 11C and the retainer plate 11D. The ejector pin plate 11C and the retainer plate 11D have holes through which the support pillar 11E passes. The ejector pin plate 11C and the retainer plate 11D are fixed to each other and are configured to slide vertically between the lower die chase 11B and the lower die base 11F.

[0023] Various components, including the cavity plate 11A, are fixed to the lower die chase 11B. In the illustrated example, the cavity plate 11A, the side block 18 that fixes the cavity plate 11A, the heat insulating member 15 that surrounds the bottom and sides of the cavity plate 11A, and the spring 17B and spring sleeve 17A are fixed to the lower die chase 11B.

[0024] The ejector pin plate 11C and the retainer plate 11D are fixed with a plurality of lifter pins 12A and 12B that can protrude from and retract from the cavity plate 11A, and a set pin 16 that contacts the upper mold 20 when the mold is clamped.

[0025] The cavity plate 11A is positioned closest to the upper mold 20 and is in contact with the space between the lower mold 10 and the upper mold 20 when the mold is opened. A heater 14 is provided inside the cavity plate 11A. When the lower mold 10 and the upper mold 20 are closed, the heater 14 heats the substrates SB1 and SB2 via the cavity plate 11A. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0026] The heat insulating member 15 is provided between the cavity plate 11A and the lower mold chase 11B, and between the cavity plate 11A and the side block 18. The heat insulating member 15 suppresses direct heat conduction from the cavity plate 11A to the lower mold chase 11B and suppresses heat conduction from the cavity plate 11A to the lower mold chase 11B via the side block 18.

[0027] In other words, the insulating member 15 is positioned to separate the gas piping and heater 14 provided in the lower mold chase 11B, thereby suppressing the temperature rise of the nitrogen gas supplied from the gas supply port 13. Furthermore, the insulating member 15 is positioned to separate the spring 17B and heater 14, thereby suppressing the decrease in the elastic force of the spring 17B. In short, the insulating member 15 limits the target of heating to the cavity plate 11A, thereby accelerating the temperature rise by the heater 14 and making other components less susceptible to the effects of heat.

[0028] The side block 18 is located on the side of the lower mold chase 11B facing the upper mold 20. When viewed from above from the upper mold 20, the side block 18 is located on the outside of the cavity plate 11A. The side block 18 contacts the upper mold 20 when the lower mold 10 and upper mold 20 are closed. In the illustrated example, a gas supply port 13 for supplying gas such as nitrogen (N2) gas is provided on the side of the insulation plate 15 outside the heater 14 of the cavity plate 11A.

[0029] The gas supply port 13 supplies gas such as nitrogen (N2) to the electronic components CH11, CH12, CH21, CH22 and the substrates SB1, SB2. The gas supply port 13 is located on the surface of the cavity plate 11A facing the upper mold 20 and opens toward the upper mold 20. Therefore, the gas supply port 13 quickly removes oxidizing gases from around the workpieces W1, W2 during heating, placing the workpieces W1, W2 in a nitrogen atmosphere.

[0030] Furthermore, the gas supply port 13 cools the workpieces W1 and W2 by applying nitrogen gas to them during cooling. When viewed from above from the upper mold 20, multiple gas supply ports 13 are provided on the outside of the workpieces W1 and W2. The gas piping that passes the nitrogen gas supplied by the gas supply ports 13 is provided in the lower mold chase 11B. The gas supply port 13 is an example of a "gas supply mechanism" that supplies inert gas to the space between the lower mold 10 and the upper mold 20.

[0031] The inert gas supplied by the gas inlet is not limited to nitrogen gas; for example, it may be carbon dioxide, fluorocarbon, or a noble gas. The gas inlet may also open towards the electronic components, bonding material, or substrate, and the inert gas may be blown directly onto the electronic components, bonding material, or substrate. The gas inlet may be provided in the cavity plate of the upper mold, or in the cavity plates of both the lower and upper molds. The gas inlet may be provided in at least one of the side blocks of the lower and upper molds, or in the degassing chamber described later. Furthermore, the inert gas may be omitted.

[0032] The spring 17B constantly biases the ejector pin plate 11C and retainer plate 11D upward toward the lower die chase 11B. The spring sleeve 17A has a stepped bolt (or washer, sleeve, and bolt) at its base end (upper end) and is fixed to the lower surface of the lower die chase 11B. A flange is provided at the tip (lower end) of the spring sleeve 17A.

[0033] The retainer plate 11D has a through hole that is larger than the tip of the spring sleeve 17A. The ejector pin plate 11C has a counterbore the same diameter as the through hole, and a through hole in the center of the counterbore through which the base end of the spring sleeve 17A is inserted. The spring sleeve 17A is inserted through the through hole in the retainer plate 11D and the through hole in the ejector pin plate 11C.

[0034] The spring 17B is spirally positioned around the spring sleeve 17A between the flange of the spring sleeve 17A and the counterbore of the ejector pin plate 11C. In other words, the spring sleeve 17A is inserted into the spiral spring 17B. The spring 17B acts as an elastic force that separates the ejector pin plate 11C and the flange at the tip of the spring sleeve 17A from each other.

[0035] In other words, the spring 17B constantly biases the ejector pin plate 11C and the retainer plate 11D toward the lower die chase 11B via the spring sleeve 17A. The spring 17B is just one example of an elastic member, and the elastic member is not limited to a spring as long as it can exert the above-mentioned elastic force. The elastic member may be, for example, rubber or a leaf spring.

[0036] The lifter pins 12A and 12B are inserted into through holes that penetrate the cavity plate 11A, the lower die chase 11B, the ejector pin plate 11C, and the heat insulating member 15. The lifter pins 12A and 12B are the same length, and three or more pins are used to hold the workpiece W1 in parallel. The end on the upper die 20 side is the tip, and the end on the lower die base 11F side is the base. The base ends of the lifter pin 12B and the set pin 16 are sandwiched between the ejector pin plate 11C and the retainer plate 11D and secured with screws. The lifter pin 12B and the set pin 16 move up and down in conjunction with the ejector pin plate 11C and the retainer plate 11D.

[0037] Lifter pin 12A supports substrate SB1 by contacting its tip with the back surface of substrate SB1, and lifter pin 12B supports substrate SB2 by contacting its tip with the back surface of substrate SB2. Lifter pins 12A and 12B are configured to move up and down, bringing substrates SB1 and SB2 and cavity plate 11A into and out of contact.

[0038] Specifically, the lifter pins 12A and 12B are configured to move forward and backward relative to the upper mold 20 from the cavity plate 11A. When the lifter pins 12A and 12B are advanced into the space between the lower mold 10 and the upper mold 20 (mold opening), the workpieces W1 and W2 supported by the lifter pins 12A and 12B move away from the cavity plate 11A. When the lifter pins 12A and 12B are retracted from the space between the lower mold 10 and the upper mold 20 (mold closing), the workpieces W1 and W2 are supported in contact with the cavity plate 11A.

[0039] When the ejector pin plate 11C and retainer plate 11D move towards (upward from) the cavity plate 11A, the tips of the lifter pins 12A and 12B protrude from the cavity plate 11A. That is, the tips of the lifter pins 12A and 12B advance into the space between the lower mold 10 and the upper mold 20.

[0040] When the ejector pin plate 11C and retainer plate 11D move away from (downward from) the cavity plate 11A, the tips of the lifter pins 12A and 12B are retracted into the cavity plate 11A, and the surfaces of the ends of the lifter pins 12A and 12B become flush with the surface of the cavity plate 11A. In other words, the lifter pins 12A and 12B are exiting the space between the lower mold 10 and the upper mold 20. The lifter pins 12A and 12B are an example of a "holding part". Note that the holding part is not limited to lifter pins. The holding part may be an elongated plate-shaped member that holds the end of the workpiece.

[0041] The set pin 16 is inserted through a through hole that penetrates the side block 18, the lower mold chase 11B, and the ejector pin plate 11C. The set pin 16 has its tip end on the upper mold 20 side and its base end on the lower mold base 11F side. The base end of the set pin 16 is sandwiched between the ejector pin plate 11C and the retainer plate 11D. The tip of the set pin 16 faces the side block 28 of the upper mold 20.

[0042] When the lower mold 10 and upper mold 20 are closed, the set pins 16 are pressed against the side block 28, pushing down the ejector pin plate 11C and the retainer plate 11D. By pushing down the ejector pin plate 11C and the retainer plate 11D, the lifter pins 12B are pushed down in conjunction, causing the substrates SB1 and SB2 on the lifter pins 12B to move downward. Furthermore, in order to push down the ejector pin plate 11C and the retainer plate 11D in parallel, it is preferable to arrange about four set pins 16 at the four corners.

[0043] The upper die 20 mainly includes the upper die base 21E, upper support plate 21D, lower support plate 21C, upper die chase 21B, pressure adjustment mechanism 9, etc. The upper and lower support plates 21B and 21C are fixed to the upper die base 21E. The upper die chase 21B is fixed to the upper die base 21E via the upper support plate 21D and the lower support plate 21C. The pressure adjustment mechanism 9 adjusts the pressing force of the lower plunger PR1 of the press device 3 and transmits it to the workpieces W1 and W2.

[0044] Various components, including the cavity plate 21A, are fixed to the upper chase 21B. In the illustrated example, the upper chase 21B is provided with the cavity plate 21A, side blocks 28 for fixing the cavity plate 21A, heat insulating members 25 arranged to surround the top and sides of the cavity plate 21A, and a part of the pressure regulating mechanism 9.

[0045] The cavity plate 21A is located closest to the lower mold 10. A heater 24 is provided inside the cavity plate 21A. The heater 24 heats the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc, which will be described later, via the cavity plate 21A. When the lower mold 10 and the upper mold 20 are closed, the heater 24 heats the electronic components CH11, CH12, CH21, and CH22 via the movable pieces 22Ac, 22Bc, 22Cc, 22Dc, and the film F. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0046] The side block 28 is located on the side of the upper mold chase 21B that faces the lower mold 10. When viewed from above from the upper mold 20, the side block 28 is located on the outside of the cavity plate 21A. The side block 28 is the part of the upper mold 20 that contacts the lower mold 10 when the lower mold 10 and upper mold 20 are closed. In other words, when the lower mold 10 and upper mold 20 are closed, the side block 28 contacts the set pin 16. However, when the lower mold 10 and upper mold 20 are closed, the side block 28 may be spaced apart from the set pin 16.

[0047] The heat insulating member 25 is provided between the cavity plate 21A and the upper mold chase 21B, and between the cavity plate 21A and the side block 28. The heat insulating member 25 suppresses direct heat conduction from the cavity plate 21A to the upper mold chase 21B and suppresses heat conduction from the cavity plate 21A to the upper mold chase 21B via the side block 28. The heat insulating member 25 partitions the heater 24 and the internal space 23, thereby suppressing changes in the properties and thermal degradation of the viscous member 23V due to the rise in temperature. In other words, the heat insulating member 25 speeds up the temperature rise by the heater 24 by limiting the target of heating to the cavity plate 21A, and makes other components less susceptible to the effects of heat.

[0048] During the assembly process, a film F is stretched across the surface of the cavity plate 21A facing the lower mold 10. A suction hole (not shown) is provided on the lower surface of the cavity plate to attract the film F. The suction hole is connected to an external vacuum suction pump for on / off control of the suction.

[0049] Examples of film F include film materials with excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), fluorine-impregnated glass cloth, PP (polypropylene), and PVDC (polyvinyl chloride).

[0050] Film F prevents powder and gas generated from the bonding materials SN11, SN12, SN21, and SN22 from entering the gaps in the upper mold 20, thereby suppressing malfunctions of the upper mold 20. In addition, film F functions as a buffer between the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc and the electronic components CH11, CH12, CH21, and CH22, and has the effect of suppressing damage to the electronic components CH11, CH12, CH21, and CH22 when pressurized.

[0051] The pressure regulating mechanism 9 includes an upper plunger PR2 driven by the lower plunger PR1 of the press device 3, a viscous member 23V compressed by the upper plunger PR2, and movable mechanisms 22A, 22B, 22C, 22D that pressurize the workpieces W1 and W2 by receiving pressure from the viscous member 23V. The various components constituting the pressure regulating mechanism 9 are arranged across the upper die chase 21E and the upper and lower support plates 21B and 21C.

[0052] The movable mechanisms 22A, 22B, 22C, and 22D are connected to the internal space 23 and are configured to move up and down. The movable mechanisms 22A, 22B, 22C, and 22D have their base end on the upper mold base 21E side and their tip end on the lower mold 10 side. Movable mechanism 22A receives the internal pressure of the internal space 23, which rises when the plunger PR presses the viscous member 23V, at its base end connected to the internal space 23 and moves up and down. Movable mechanism 22A contacts the electronic component CH11 at its tip end via the film F, and pressurizes the electronic component CH11 with the internal pressure of the internal space 23 transmitted from the base end to the tip end. In other words, the electronic component CH11 is pressurized by the movable mechanism 22A via the viscous member 23V based on the pressing force applied by the plunger PR to the viscous member 23V. As a result, the bonding material SN11 is pressurized by the movable mechanism 22A via the electronic component CH11.

[0053] Similarly, electronic component CH12 is pressurized by the movable mechanism 22B via the viscous member 23V based on the pressing force applied by the plunger PR against the viscous member 23V, and bonding material SN12 is pressurized by the movable mechanism 22B via electronic component CH12. Electronic component CH21 is pressurized by the movable mechanism 22C via the viscous member 23V based on the pressing force applied by the plunger PR against the viscous member 23V, and bonding material SN21 is pressurized by the movable mechanism 22C via electronic component CH21. Electronic component CH21 is pressurized by the movable mechanism 22D via the viscous member 23V based on the pressing force applied by the plunger PR against the viscous member 23V, and bonding material SN21 is pressurized by the movable mechanism 22D via electronic component CH21. The internal pressure in the internal space 23 acting on each of the movable mechanisms 22A, 22B, 22C, and 22D is approximately equal regardless of the position of the movable mechanisms 22A, 22B, 22C, and 22D in the direction in which the lower mold 10 and upper mold 20 face each other. Therefore, regardless of the differences in the thickness of the substrates SB1 and SB2, the differences in the height of the electronic components CH11, CH12, CH21, and CH22, and the differences in the thickness of the bonding materials SN11, SN12, SN21, and SN22, the bonding materials SN11, SN12, SN21, and SN22 are pressurized with approximately equal pressure.

[0054] The movable mechanism 22A has a piston 22Aa, a rod 22Ab, and a movable piece 22Ac. The movable mechanism 22B has a piston 22Ba, a rod 22Bb, and a movable piece 22Bc. The movable mechanism 22C has a piston 22Ca, a rod 22Cb, and a movable piece 22Cc. The movable mechanism 22D has a piston 22Da, a rod 22Db, and a movable piece 22Dc.

[0055] The piston 22Aa is located at the base end of the movable mechanism 22A. The piston 22Aa is connected to the internal space 23. In other words, the piston 22Aa is in contact with the viscous member 23V. The piston 22Aa is slidably mounted relative to the upper chase 21B and the lower support plate 21C. The piston 22Aa and the lower support plate 21C are in liquid-tight contact to prevent leakage of the viscous member 23V. The piston 22Aa receives the internal pressure of the internal space 23, which is changed by the pressure of the viscous member 23V by the plunger RP, and moves in the vertical direction.

[0056] The rod 22Ab is provided between the piston 22Aa and the movable piece 22Ac. The rod 22Ab is slidably mounted relative to the cavity plate 21A, the upper mold chase 21B, and the heat insulating member 25. The rod 22Ab is connected to the piston 22Aa at its base end, and its tip is rounded in a bullet shape and makes point contact with the movable piece 22Ac. The rod 22Ab transmits pressure between the piston 22Aa and the movable piece 22Ac.

[0057] The movable piece 22Ac is located at the tip of the movable mechanism 22A. The movable piece 22Ac is slidably mounted relative to the cavity plate 21A. The tip of the movable piece 22Ac protrudes from the cavity plate 21A. The movable piece 22Ac is a movable, drop-proof, vertically moving nest. When the lower mold 10 and upper mold 20 are closed, the tip of the movable piece 22Ac contacts the upper surface of the electronic component CH11 via a film, applying pressure transmitted from the piston 22Aa to the electronic component CH11.

[0058] The structure and function of pistons 22Ba, 22Ca, and 22Da are the same as those of piston 22Aa, so the description of pistons 22Ba, 22Ca, and 22Da is omitted. The structure and function of rods 22Bb, 22Cb, and 22Db are the same as those of rod 22Ab, so the description of rods 22Bb, 22Cb, and 22Db is omitted. The structure and function of movable pieces 22Bc, 22Cc, and 22Dc are the same as those of movable piece 22Ac, so the description of movable pieces 22Bc, 22Cc, and 22Dc is omitted. The side of movable pieces 22Ac, 22Bc, 22Cc, and 22Dc that contacts the electronic components CH11, CH12, CH21, and CH22 is covered with a continuous film F.

[0059] The internal space 23 is formed between the lower support plate 21C and the upper support plate 21D. The pistons 22Aa, 22Ba, 22Ca, and 22D of the movable mechanisms 22A, 22B, 22C, and 22D, and the upper plunger PR2 of the plunger PR are connected to the internal space 23. In other words, the inner wall of the internal space 23 is composed of the lower support plate 21C, the upper support plate 21D, the pistons 22Aa, 22Ba, 22Ca, and 22Da, and the upper plunger PR2. The internal space 23 is independent of the external space of the upper mold 20. That is, the internal space 23 is a closed system in which the viscous member 23V does not enter or leave the upper mold 20.

[0060] The viscous member 23V is sealed in the internal space 23. The viscous member 23V is a fluid with a higher viscosity than water. For example, the viscosity coefficient of the viscous member 23V at 25°C is between 1 Pa·s and 200 Pa·s. This ensures that even if the viscous member 23V is heated by the heater 24, it can maintain sufficient viscosity. However, the viscosity coefficient of the viscous member 23V may be between 1 Pa·s and 200 Pa·s in the operating temperature range. The material of the viscous member 23V is, for example, silicone oil, but is not limited to this. Due to its viscosity, the viscous member 23V is less likely to leak out than water or air from the gap between the lower support plate 21C and the upper plunger PR2, and from the gap between the lower support plate 21C and the pistons 22Aa, 22Ba, 22Ca, and 22Da. Furthermore, since the compressibility of the viscous member 23V is lower than that of gases such as air, sealing the internal space 23 with the viscous member 23V instead of gas reduces the loss of pressure in the internal space 23 due to the pressing force from the plunger PR. The material of the viscous member 23V is preferably a material with excellent heat resistance. Specifically, the material of the viscous member 23V is preferably a material that exhibits little change in viscosity in the temperature range of the upper mold chase 21B, lower support plate 21C, and upper support plate 21D when the heater 24 heats the cavity plate 21A.

[0061] The plunger PR is an example of a "pressure transmission mechanism" that presses against a viscous member 23V sealed in the internal space 23 of the upper mold 20. The plunger PR has a lower plunger PR1 and an upper plunger PR2.

[0062] The lower plunger PR1 is detachably mounted on a plunger unit, which is a known transfer drive source (not shown; see, for example, Japanese Patent Publication Nos. 9-155911, 2013-26360, and 2019-1122) located at the bottom of the movable platen that moves the lower mold 10 up and down. In the case of normal transfer molding, a pressure equalization mechanism is incorporated into the plunger unit, but in the present invention, a pressure equalization mechanism is not required. The lower plunger PR1 is inserted through a through hole that penetrates the cavity plate 11A, the lower mold chase 11B, the ejector pin plate 11C, the retainer plate 11D, the heat insulating member 15, the support pillar 11E, and the lower mold base 11F. The lower plunger PR1 has its tip end on the side facing the upper mold 20 and its base end on the opposite side. The tip end of the lower plunger PR1 has a larger diameter than the base end of the lower plunger PR1. Alternatively, a pot (not shown) may be provided in the lower mold 10, and the tip of the lower plunger PR1 may be positioned inside the pot to guide it. The lower plunger PR1 is configured to move up and down by a plunger unit (not shown). When the lower plunger PR1 moves down to the limit of its range of motion, the tip of the lower plunger PR1 is housed in, for example, the cavity plate 11A, but the upper surface of the tip of the lower plunger PR1 may be at the same surface height as the upper surface of the cavity plate 11A. The lower plunger PR1 and the upper plunger PR2 are positioned opposite each other, and when the lower plunger PR1 moves upward, the tip of the lower plunger PR1 protrudes from the cavity plate 11A. When the lower mold 10 and the upper mold 20 are closed and the lower plunger PR1 moves upward, the tip of the lower plunger PR1 comes into contact with the tip of the upper plunger PR2. When the lower plunger PR1 moves further upward, the lower plunger PR1 presses the upper plunger PR2 upward. The base end of the lower plunger PR1 is connected to a plunger unit (not shown). The lower plunger PR1 is an example of the "first pressure transmission unit".

[0063] The upper plunger PR2 is provided in the upper mold 20. The upper plunger PR2 is inserted through a through hole that penetrates the cavity plate 21A, the upper mold chase 21B, the lower support plate 21C, and the heat insulating member 25. The upper plunger PR2 has its tip end on the side facing the lower mold 10 and its base end on the opposite side. The base end (upper end face) of the upper plunger PR2 has a larger diameter than the tip end and is slidably mounted relative to the upper mold chase 21B and the lower support plate 21C. Alternatively, a pot (not shown) may be provided in the upper mold 20, and the base end of the upper plunger PR2 may be placed inside the pot to guide it. The base end of the upper plunger PR2 is connected to the internal space 23. The tip end (lower end face) of the upper plunger PR2 is exposed to the cavity plate 21A. The upper plunger PR2 is pressed by the lower plunger PR1 to press against the viscous member 23V. The upper plunger PR2 is an example of a "second pressure transmission section". The upper plunger PR2 is paired with the lower plunger PR1 to form a pair of plungers.

[0064] Although only one lower plunger and one upper plunger are shown in the cross-section of Figure 1, the plunger may have multiple lower plungers and multiple upper plungers. Such multiple lower plungers and multiple upper plungers may be arranged in the depth direction of the drawing in Figure 1, for example. Each of the multiple upper plungers is paired with the same number of lower plungers, forming multiple pairs of plungers. Multiple pairs of plungers can transmit pressure independently of each other. However, the number of lower plungers may differ from the number of upper plungers. One upper plunger may be pressed by multiple lower plungers, or multiple upper plungers may be pressed by one lower plunger. Multiple upper plungers may be pressed by fewer multiple lower plungers, or multiple upper plungers may be pressed by more multiple lower plungers. Therefore, the plunger may have at least one lower plunger and at least one upper plunger. Furthermore, if the plunger has multiple upper plungers, the upper mold may have multiple internal spaces partitioned from each other, and multiple viscous members enclosed in each of the multiple internal spaces. The multiple internal spaces may be arranged in the depth direction of the drawing as shown in Figure 1. Each of the multiple viscous members may be pressed by a separate upper plunger. In such a configuration, even if electronic components are mounted on a single substrate, the amount of pressure applied to the electronic components can be changed depending on the mounting position, because the pressure is applied through different viscous members.

[0065] The pressure transmission mechanism is not limited to a plunger PR1 and an upper plunger PR2 that press the viscous member 23V from below in the internal space 23. The pressure transmission mechanism may be configured to press the viscous member 23V from above in the internal space 23, or to press the viscous member 23V from the lateral direction of the internal space 23. Here, the lateral direction is the direction that intersects with the direction in which the lower mold 10 and the upper mold 20 face each other. The pressure transmission mechanism may be configured to press the viscous member 23V from multiple directions in the internal space 23.

[0066] The degassing chambers 31 and 32 are openable and closable annular vacuum chambers surrounding the lower mold 10 and the upper mold 20. Degassing chamber 31 is erected on the lower mold base 11F of the lower mold 10. When viewed from above from the upper mold 20, the degassing chamber 31 is located outside the side block 18. A degassing path 33 is provided between the degassing chamber 31 and the lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, support pillar 11E, and side block 18 through which the degassing gas passes. Degassing chamber 32 is erected facing downwards on the upper mold base 21E of the upper mold 20. When viewed from above from the lower mold 10, the degassing chamber 32 is located outside the side block 28. A degassing path 34 is provided between the degassing chamber 32 and the upper mold chase 21B, lower support plate 21C, upper support plate 21D, and side block 28 through which the degassing gas passes. The degassing path 34 is connected to the degassing path 27 provided in the upper mold base 21E. The degassing path 27 is connected to the degassing port 29 provided in the upper mold base 21E. The degassing port 29 is connected to a vacuum pump outside the mold. The atmosphere inside the lower mold 10 and upper mold 20 in the degassing chambers 31 and 32 is degassed by the degassing port 29.

[0067] <Implementation Method> Next, a mounting method using the mounting apparatus 1 according to this embodiment will be described with reference to Figures 2 to 11. Figures 2 and 3 are flowcharts showing a part of the mounting method according to one embodiment of the present invention. Figure 4 is a graph showing the temperature profile of the mounting method according to one embodiment of the present invention. Figures 5 to 11 are diagrams showing the mounting apparatus in one step of the mounting method. In the graph of Figure 4, the horizontal axis represents time, and the vertical axis represents the temperature of the workpiece.

[0068] First, the lower mold 10 and the upper mold 20 are prepared (S11), and preheating of the lower mold 10 and the upper mold 20 is started (S12). As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is room temperature (RT).

[0069] Next, workpieces W1 and W2 are placed on the lifter pins 12A and 12B (S13). Then, the degassing chambers 31 and 32 are closed to start degassing (S14), and nitrogen gas is supplied (S15). By degassing the bonding materials SN11, SN12, SN21, and SN22 before raising them to the sintering temperature and creating a nitrogen gas atmosphere, oxidation of the bonding materials SN11, SN12, SN21, and SN22 is suppressed. As shown in Figure 5, when the degassing chambers 31 and 32 are closed, the tip of the set pin 16 contacts the side block 28 of the upper mold 20. However, since the side blocks 18 and 28 of the lower mold 10 and the upper mold 20 are spaced apart from each other, the workpieces W1 and W2 are spaced apart above the cavity plate 11A. The substrates SB1 and SB2 are heated by thermal radiation from the cavity plate 11A of the lower mold 10, and the electronic components CH11, CH12, CH21, and CH22 are heated little by little by thermal radiation, although they are not in contact with the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc of the upper mold 20. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is approximately 100°C to 150°C.

[0070] Next, the mold closes a little further, lowering the lifter pins 12A and 12B and bringing the substrates SB1 and SB2 into contact with the cavity plate 11A of the lower mold 10 (S16). As shown in Figure 6, as the lower mold 10 and the upper mold 20 move closer to each other, the tips of the set pins 16 come into contact with the side blocks 28 of the upper mold 20, and the set pins 16 are pushed down. The pushed-down set pins 16 push down the ejector pin plate 11C and retainer plate 11D, which are connected to the base ends of the set pins 16, and push down the lifter pins 12A and 12B, whose base ends are connected to the ejector pin plate 11C and retainer plate 11D. As a result, the workpieces W1 and W2 come into contact with the cavity plate 11A. The substrates SB1 and SB2 are heated by heat conduction from the cavity plate 11A of the lower mold 10, and the electronic components CH11, CH12, CH21, and CH22 are heated by thermal radiation, although they do not come into contact with the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc of the upper mold 20. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is raised from the preheating temperature of 100°C to 150°C to the sintering temperature of 250°C to 300°C.

[0071] Next, the lower mold 10 and the upper mold 20 are further closed, and the movable mechanisms 22A, 22B, 22C, and 22D come into contact with the electronic components CH11, CH12, CH21, and CH22 (S21). As shown in Figure 7, the side blocks 18 and 28 of the lower mold 10 and the upper mold 20 come into contact with each other, and once the mold closing is complete, the set pin 16 is pushed down to its maximum extent. The movable piece 22Ac of the movable mechanism 22A comes into contact with the electronic component CH11 via the film, and the piston 22Aa of the movable mechanism 22A is pushed up. The movable piece 22Bc of the movable mechanism 22B comes into contact with the electronic component CH12 via the film, and the piston 22Ba of the movable mechanism 22B is pushed up. The movable piece 22Cc of the movable mechanism 22C comes into contact with the electronic component CH21 via the film, and the piston 22Ca of the movable mechanism 22C is pushed up. The movable piece 22Dc of the movable mechanism 22D comes into contact with the electronic component CH22 via the film, and the piston 22Da of the movable mechanism 22D is pushed up. The penetration depth of the pistons 22Aa, 22ba, 22Ca, and 22Da into the internal space 23 differs from one another due to the dimensional differences of the substrates SB1, SB2, bonding materials SN11, SN12, SN21, SN22, and electronic components CH11, CH12, CH21, CH22. The contact of the movable mechanisms 22A, 22B, 22C, and 22D with the electronic components CH11, CH12, CH21, CH22 improves the adhesion between the cavity plate 11A of the lower mold 10 and the substrates SB1, SB2. Therefore, compared to step S16, when the substrates SB1 and SB2 were placed on the cavity plate 11A, the efficiency of heat conduction from the lower mold 10 to the substrates SB1 and SB2 is improved, and the heating efficiency of the bonding materials SN11, SN12, SN21, and SN22 by the lower mold 10 is improved. In addition, the electronic components CH11, CH12, CH21, and CH22 are heated by heat conduction from the movable pieces 22Ac, 22Bc, 22Cc, and 22Dc of the upper mold 20. Therefore, compared to steps S13 to S16, when the electronic components CH11, CH12, CH21, and CH22 were heated by thermal radiation, the heating efficiency of the bonding materials SN11, SN12, SN21, and SN22 by the upper mold 20 is improved. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is raised from the preheating temperature of 100°C to 150°C to the sintering temperature of 250°C to 300°C.

[0072] Next, the plunger PR presses the viscous member 23V (S22). As shown in Figure 8, when the lower mold 10 and the upper mold 20 are closed, a known transfer mechanism pushes up the lower plunger PR1, causing the tip of the upper plunger PR2 to contact the tip of the lower plunger PR1, and the upper plunger PR2 is pushed up by the lower plunger PR1. Note that even if the lower plunger PR1 is not pushed up by the transfer mechanism when the lower mold 10 and the upper mold 20 are closed, the tip of the upper plunger PR2 may still contact the tip of the lower plunger PR1. The lower plunger PR1 presses the viscous member 23V with a predetermined pressing force via the upper plunger PR2. The internal pressure of the internal space 23, which has risen due to being pressed by the upper plunger PR2, is applied equally to the pistons 22Aa, 22ba, 22Ca, and 22Da. The movable mechanism 22A moves based on the internal pressure of the internal space 23 applied to the piston 22Aa, i.e., the pressing force of the plunger PR, and pressurizes the electronic component CH11. Similarly, the movable mechanisms 22B, 22C, and 22D pressurize the electronic components CH12, CH21, and CH22. As the electronic components CH11, CH12, CH21, and CH22 are pressurized, the bonding materials SN11, SN12, SN21, and SN22 are also pressurized. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is approximately 250°C to 300°C, which is the sintering temperature. The bonding materials SN11, SN12, SN21, and SN22 are sintered by heating and pressurizing for a predetermined time. The sintered bonding material SN11 bonds electronic component CH11 to substrate SB1, the sintered bonding material SN12 bonds electronic component CH12 to substrate SB1, the sintered bonding material SN21 bonds electronic component CH21 to substrate SB2, and the sintered bonding material SN22 bonds electronic component CH22 to substrate SB2. In other words, electronic components CH11 and CH12 are mounted on substrate SB1, and electronic components CH21 and CH22 are mounted on substrate SB2.

[0073] Next, the plunger PR is lowered (S23). As shown in Figure 9, the lower plunger PR1 is pulled down. The tip of the lower plunger PR1 separates from the tip of the upper plunger PR2. The viscous member 23V is released from the pressing force of the plunger PR and pushes down the upper plunger PR2. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is approximately 250°C to 300°C, which is the sintering temperature. Note that the contact between the lower plunger PR1 and the upper plunger PR2 may be maintained during this process, and the contact between the two plungers may be released during the die opening process described later.

[0074] Next, the mold is opened to raise the lifter pins 12A and 12B, separating the substrates SB1 and SB2 from the cavity plate 11A of the lower mold 10 (S24). As shown in Figure 10, the side block 28 of the upper mold 20 is separated from the side block 18 of the lower mold 10. The spring 17B applies an elastic force to the lower mold chase 11B, to which the base end of the spring sleeve 17A (the side that is screwed in by the stepped bolt, the upper side) is screwed, in a direction that brings the ejector pin plate 11C closer. Since the lower mold chase 11B is fixed in position by the support pillar 11E, the ejector pin plate 11C and the retainer plate 11D connected to the ejector pin plate 11C are pushed upward. As a result, the ejector pin plate 11C and the retainer plate 11D are lifted, and the lifter pins 12A and 12B, whose base ends are sandwiched between the ejector pin plate 11C and the retainer plate 11D, are also lifted. The tips of the lifter pins 12A and 12B protrude from the cavity plate 11A and contact the substrates SB1 and SB2, and the workpieces W1 and W2 are separated from the cavity plate 11A. The gas supply port 13 supplies nitrogen gas to the workpieces W1 and W2. By being separated from the heat source, the cavity plate 11A, and receiving nitrogen gas, the workpieces W1 and W2 are cooled. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is about 250°C to 300°C, which is the sintering temperature.

[0075] Next, the supply of nitrogen gas is stopped and degassing is stopped (S25). As shown in Figure 4, when the workpieces W1 and W2 have cooled to approximately 100°C to 150°C, the supply of nitrogen gas from the gas supply port 13 is stopped, as shown in Figure 10, and then degassing from the degassing port 29 is stopped. This completes the cooling of the workpieces W1 and W2 within the mounting device 1.

[0076] Finally, the mold is opened further, and the degassing chambers 31 and 32 are opened to remove the workpieces W1 and W2 (S26). As shown in Figure 11, the degassing chambers 31 and 32 are separated, and the workpieces W1 and W2 are released. The workpieces W1 and W2 are recovered from above the lifter pins 12A and 12B.

[0077] Next, with reference to Figures 12 and 13, the configuration of a modified example of the mounting device according to one embodiment of the present invention will be described. Figures 12 and 13 are diagrams showing an overall overview of the mounting device according to one modified example of the present invention. The same or similar reference numerals are used for identical or similar components, and their descriptions are omitted as appropriate. Furthermore, similar effects and benefits due to similar configurations will not be mentioned sequentially.

[0078] The mounting apparatus 200 shown in Figure 12 mounts one electronic component CH3 to one substrate SB3 via one bonding material SN3. The mounting apparatus 300 shown in Figure 13 mounts multiple electronic components CH41 and CH42 to one substrate SB4 using one movable mechanism 22E. The movable mechanism 22E pressurizes multiple electronic components CH41 and CH42 simultaneously. With the mounting apparatus 300, even when the gap between electronic components CH41 and 42 is narrow and it is difficult to provide multiple movable mechanisms to individually pressurize multiple electronic components CH41 and CH42, multiple electronic components CH41 and CH42 can be pressed simultaneously. The tip surface of the movable piece of the movable mechanism 22E may be provided with irregularities corresponding to the heights of the multiple electronic components CH41 and CH42. This makes it possible to reduce the difference in pressure applied to each of the multiple electronic components CH41 and CH42 by the movable mechanism 22E when the heights of electronic component CH41 and electronic component CH42 are different. Furthermore, the tip surface of the movable piece of the movable mechanism 22E may be made of an elastic material. In this case, when the heights of electronic component CH41 and electronic component CH42 are different, the tip surface of the movable piece deforms according to the heights of the multiple electronic components CH41 and CH42, thereby reducing the difference in pressure applied to each of the multiple electronic components CH41 and CH42 by the movable mechanism 22E.

[0079] Thus, the mounting apparatus according to one embodiment of the present invention is not limited to a configuration in which multiple electronic components are mounted on a single substrate, but is sufficient if it is configured in which one or more electronic components are mounted on at least one substrate. Furthermore, the mounting apparatus according to one embodiment of the present invention is not limited to a configuration in which multiple electronic components are pressurized by a corresponding number of movable mechanisms, but is sufficient if it is configured in which multiple electronic components are pressurized by at least one movable mechanism.

[0080] Some or all embodiments of the present invention are described below. However, the present invention is not limited to the embodiments described below.

[0081] [Note 1] A mounting apparatus for mounting one or more electronic components on at least one substrate, comprising: a first mold configured to hold the substrate; a second mold positioned opposite the first mold and having at least one movable mechanism connected to the internal space of the second mold; and a pressure transmission mechanism for pressing a viscous member sealed in the internal space of the second mold, wherein, in a closed mold state, the electronic components are pressurized by the movable mechanism via the viscous member based on the pressing force applied by the pressure transmission mechanism to the viscous member.

[0082] In this embodiment, the internal pressure of the second mold's internal space changes by pressing a viscous member sealed within the second mold's internal space using a pressure transmission mechanism. At least one movable mechanism moves based on the internal pressure of the second mold's internal space, pressurizing at least one electronic component. Therefore, by adjusting the pressing force of the pressure transmission mechanism, the pressure applied by at least one movable mechanism to at least one electronic component can be adjusted. Consequently, mounting defects caused by excessive or insufficient pressure applied to the electronic component can be suppressed. For example, even when the heights of multiple electronic components or the thicknesses of multiple substrates change, appropriate pressure can be applied to the electronic component. Furthermore, the viscous member that moves the movable mechanism is sealed within the second mold's internal space and does not flow in from or out of the second mold. Therefore, it can be miniaturized compared to mounting devices that move the movable mechanism via a fluid supplied from outside the second mold.

[0083] [Note 2] The mounting device described in [Appendix 1] comprises a first pressing transmission section provided in the first mold and a second pressing transmission section provided in the second mold and connected to the internal space of the second mold, wherein the second pressing transmission section is pressed by the first pressing transmission section to press the viscous member.

[0084] According to this embodiment, a mold and press device used for transfer molding can be used as the second mold.

[0085] [Note 3] The mounting apparatus according to [Appendix 1] or [Appendix 2], wherein at least one electronic component is a plurality of electronic components including a first electronic component and a second electronic component adjacent to the first electronic component, and at least one movable mechanism is a plurality of movable mechanisms including a first movable mechanism and a second movable mechanism, and in a state in which the first mold and the second mold are closed, the first electronic component is pressurized by the first movable mechanism and the second electronic component is pressurized by the second movable mechanism via the viscous member based on the pressing force that the pressing transmission mechanism presses on the viscous member, thereby mounting the plurality of electronic components on a single substrate.

[0086] According to this embodiment, since the first movable mechanism and the second movable mechanism move based on the internal pressure of the internal space of the second mold, the pressure applied by the first movable mechanism and the second movable mechanism to the first electronic component and the second electronic component does not depend on the position of the first movable mechanism and the second movable mechanism. In other words, even if the positions of the first movable mechanism and the second movable mechanism are different, the first movable mechanism and the second movable mechanism receive approximately equal internal pressure in the internal space and pressurize the first electronic component and the second electronic component simultaneously based on the internal pressure received. Therefore, the difference between the pressure applied to the first electronic component and the pressure applied to the second electronic component can be reduced. For example, even if the heights of the first electronic component and the second electronic component are different, or if the thickness of the substrate varies depending on the position of the first electronic component and the second electronic component, the first electronic component and the second electronic component can be pressed simultaneously with approximately equal pressure.

[0087] [Note 4] The mounting apparatus according to [Note 1] or [Note 2], wherein at least one electronic component is a plurality of electronic components including a first electronic component and a second electronic component adjacent to the first electronic component, and at least one movable mechanism is a plurality of movable mechanisms including a first movable mechanism, and in a state in which the first mold and the second mold are closed, the first electronic component and the second electronic component are pressed by the first movable mechanism via the viscous member based on the pressing force that the pressing transmission mechanism presses the viscous member, thereby mounting the plurality of electronic components onto a single substrate.

[0088] According to this embodiment, even if the distance between the first electronic component and the second electronic component is narrow, the first and second electronic components can be mounted simultaneously.

[0089] [Note 5] The viscous component is silicone oil, and the mounting device is as described in any one of [Appendix 1] to [Appendix 4].

[0090] [Note 6] The mounting apparatus according to any one of [Appendix 1] to [Appendix 5], wherein at least one movable mechanism is connected to the internal space of the second mold and has at least one piston that moves in response to the internal pressure of the internal space, and at least one movable piece that applies the pressure transmitted from the at least one piston to at least one electronic component, and the second mold further has a heater for heating the at least one movable piece and an insulating member that separates the heater from the internal space.

[0091] According to this embodiment, when the heater heats at least one movable piece, the temperature rise of the viscous member can be suppressed. Therefore, changes in the properties of the viscous member and thermal degradation can be suppressed.

[0092] [Note 7] The mounting apparatus according to any one of [Appendix 1] to [Appendix 6], wherein at least one of the first mold and the second mold has a gas supply port for supplying an inert gas to at least one electronic component and at least one substrate.

[0093] According to this embodiment, when heating at least one electronic component and at least one substrate, oxidizing gases can be quickly removed from the vicinity of the at least one electronic component and at least one substrate, creating an inert gas atmosphere. Therefore, bonding defects due to oxidation of the bonding material can be suppressed. Furthermore, when cooling at least one electronic component and at least one substrate, gas cooling can be performed by applying an inert gas to the at least one electronic component and at least one substrate. As the cooling rate of the mounted product is improved, the time required to remove the mounted product from the mounting equipment is shortened, and production efficiency can be improved.

[0094] [Note 8] The mounting apparatus according to any one of [Appendix 1] to [Appendix 7] further comprises an openable and closable degassing chamber surrounding the first mold and the second mold.

[0095] According to this embodiment, at least one electronic component and at least one substrate can be placed in a vacuum atmosphere or an inert gas atmosphere, thereby suppressing oxidation. Consequently, at least one electronic component and at least one substrate can be heated to a high temperature.

[0096] [Note 9] The mounting apparatus according to any one of [Note 1] to [Note 8], wherein the first mold has a cavity plate provided on the side facing the second mold, and a holding portion configured to be able to move forward and backward from the cavity plate toward the second mold and to hold at least one substrate, and when the first mold and the second mold are open, the holding portion moves forward into the space between the first mold and the second mold, and at least one substrate supported by the holding portion moves away from the cavity plate, and when the first mold and the second mold are closed, the holding portion retracts from the space between the first mold and the second mold, and at least one substrate is supported in contact with the cavity plate.

[0097] [Note 10] The mounting apparatus described in any one of [Appendix 1] to [Appendix 9], wherein, when performing the mounting process, a film is stretched across the surface of the second mold facing the first mold, and the movable mechanism contacts the electronic component at its tip via the film.

[0098] [Note 11] The mounting device as described in [Appendix 2], wherein the first pressing transmission section has one or more lower plungers, the second pressing transmission section has the same number of upper plungers as the lower plungers, and the lower plungers and upper plungers are arranged opposite each other to form a pair.

[0099] [Note 12] The mounting device is a sintering device, the mounting device described in any one of [Appendix 1] to [Appendix 11].

[0100] According to this embodiment, even in a sintering apparatus that requires high temperature and high pressure, the difference between the pressure applied to the first electronic component and the pressure applied to the second electronic component can be reduced, thereby suppressing the occurrence of mounting defects.

[0101] [Note 13] A mounting method for mounting one or more electronic components on at least one substrate, comprising: providing a first mold configured to hold a substrate on which the electronic components are mounted; providing a second mold positioned opposite the first mold, the second mold having a plurality of movable mechanisms connected to the internal space of the second mold; and providing a pressure transmission mechanism for pressing a viscous member sealed in the internal space of the second mold, wherein the plurality of electronic components include a first electronic component and a second electronic component, and the plurality of movable mechanisms include a first movable mechanism and a second movable mechanism, and the mounting method further comprises: closing the first mold and the second mold; pressing the viscous member with the pressure transmission mechanism; and, with the first mold and the second mold closed, pressurizing the electronic components through the viscous member with the movable mechanism based on the pressing force applied by the pressure transmission mechanism to the viscous member.

[0102] In this embodiment, the internal pressure of the second mold's internal space changes by pressing a viscous member sealed within the second mold's internal space using a pressure transmission mechanism. At least one movable mechanism moves based on the internal pressure of the second mold's internal space, pressurizing at least one electronic component. Therefore, by adjusting the pressing force of the pressure transmission mechanism, the pressure applied by at least one movable mechanism to at least one electronic component can be adjusted. Consequently, mounting defects caused by excessive or insufficient pressure applied to the electronic component can be suppressed. For example, even when the heights of multiple electronic components or the thicknesses of multiple substrates change, appropriate pressure can be applied to the electronic component. Furthermore, the viscous member that moves the movable mechanism is sealed within the second mold's internal space and does not flow in from outside the second mold, nor does it flow out of the second mold. Therefore, compared to mounting devices that move the movable mechanism via a fluid supplied from outside the second mold, miniaturization can be achieved.

[0103] As explained above, it is possible to provide a compact mounting device and a mounting method using the same that can suppress the occurrence of mounting defects.

[0104] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of Symbols]

[0105] 1…Implementation device 10…Lower mold 11A... Cavity Plate 11B... Lower type chase 11C…Ejector pin plate 11D…Retainer plate 11E...Support pillar 11F…Lower base 12A, 12B... Lifter pins 13...Gas supply port 14… Heater 15…Insulation material 16…Set pins 17A... Spring sleeve 17B... Spring 18…Side block 20…Upper mold 21A... Cavity Plate 21B... Upper type chase 21C... Lower support plate 21D…Upper support plate 21E… Upper base 22A, 22B, 22C, 22D…Movable mechanism 22Aa, 22Ba, 22Ca, 22Da… Piston 22Ab, 22Bb, 22Cb, 22Db... Rods 22Ac, 22Bc, 22Cc, 22Dc...Movable pieces 23…Interior space 23V... Viscous material 24... Heater 25…Insulation material 27… Degassing pathway 28... Side Block 29...Ventilation vent 31, 32… Degassing chamber 33,34… Degassing pathways PR... Plunger PR1... Lower plunger PR2... Upper plunger

Claims

1. A mounting device for mounting one or more electronic components onto at least one substrate, A first mold configured to hold the substrate on which the aforementioned electronic components are mounted, A second mold is positioned opposite the first mold and has at least one movable mechanism connected to the internal space of the second mold, A pressing transmission mechanism for pressing a viscous member sealed in the internal space of the second mold and Equipped with, The aforementioned pressure transmission mechanism is The first pressing transmission section provided in the first mold, A second pressing transmission unit is provided in the second mold and connected to the internal space of the second mold. It has, With the first mold and the second mold closed, the electronic component is pressurized by the movable mechanism via the viscous member based on the pressing force exerted by the second pressing transmission unit, which is pressed by the first pressing transmission unit, on the viscous member. Mounting device.

2. A mounting device for mounting one or more electronic components onto at least one substrate, A first mold configured to hold the substrate on which the aforementioned electronic components are mounted, A second mold is positioned opposite the first mold and has at least one movable mechanism connected to the internal space of the second mold, A pressing transmission mechanism for pressing a viscous member sealed in the internal space of the second mold and Equipped with, With the first mold and the second mold closed, the electronic component is pressurized by the movable mechanism via the viscous member based on the pressing force applied by the pressing transmission mechanism to the viscous member. The aforementioned at least one movable mechanism is Connected to the internal space of the second mold, at least one piston that moves in response to the internal pressure of the internal space, At least one movable piece that applies the pressure transmitted from the at least one piston to the at least one electronic component It has, The second mold is, A heater for heating at least one of the movable pieces, A heat insulating member that separates the heater from the internal space. It further possesses, Mounting device.

3. A mounting device for mounting one or more electronic components onto at least one substrate, A first mold configured to hold the substrate on which the aforementioned electronic components are mounted, A second mold is positioned opposite the first mold and has at least one movable mechanism connected to the internal space of the second mold, A pressing transmission mechanism for pressing a viscous member sealed in the internal space of the second mold, A degassing chamber that can be opened and closed surrounds the first mold and the second mold, Equipped with, With the first mold and the second mold closed, the electronic component is pressurized by the movable mechanism via the viscous member based on the pressing force applied by the pressing transmission mechanism to the viscous member. Mounting device.

4. A mounting device for mounting one or more electronic components onto at least one substrate, A first mold configured to hold the substrate on which the aforementioned electronic components are mounted, A second mold is positioned opposite the first mold and has at least one movable mechanism connected to the internal space of the second mold, A pressing transmission mechanism for pressing a viscous member sealed in the internal space of the second mold and Equipped with, With the first mold and the second mold closed, the electronic component is pressurized by the movable mechanism via the viscous member based on the pressing force applied by the pressing transmission mechanism to the viscous member. The first mold is A cavity plate provided on the side facing the second mold, A holding portion configured to move back and forth from the cavity plate relative to the second mold, and which holds the at least one substrate It has, With the first mold and the second mold in the open state, the holding portion extends into the space between the first mold and the second mold, and the at least one substrate supported by the holding portion separates from the cavity plate. When the first mold and the second mold are closed, the holding portion retracts from the space between the first mold and the second mold, and the at least one substrate is supported in contact with the cavity plate. Mounting device.

5. A mounting apparatus which is a sintering apparatus for mounting one or more electronic components onto at least one substrate, A first mold configured to hold the substrate on which the aforementioned electronic components are mounted, A second mold is positioned opposite the first mold and has at least one movable mechanism connected to the internal space of the second mold, A pressing transmission mechanism for pressing a viscous member sealed in the internal space of the second mold and Equipped with, With the first mold and the second mold closed, the electronic component is pressurized by the movable mechanism via the viscous member based on the pressing force applied by the pressing transmission mechanism to the viscous member. Mounting device.

6. The aforementioned at least one electronic component is a plurality of electronic components including a first electronic component and a second electronic component adjacent to the first electronic component. The aforementioned at least one movable mechanism is a plurality of movable mechanisms including a first movable mechanism and a second movable mechanism, With the first mold and the second mold closed, based on the pressing force applied by the pressing transmission mechanism to the viscous member, the first electronic component is pressurized by the first movable mechanism via the viscous member, and the second electronic component is pressurized by the second movable mechanism. Multiple electronic components are mounted on a single circuit board. The mounting apparatus according to any one of claims 1 to 5.

7. The aforementioned at least one electronic component is a plurality of electronic components including a first electronic component and a second electronic component adjacent to the first electronic component. The aforementioned at least one movable mechanism is a plurality of movable mechanisms including a first movable mechanism, With the first mold and the second mold closed, the first electronic component and the second electronic component are pressurized by the first movable mechanism via the viscous member based on the pressing force applied by the pressing transmission mechanism to the viscous member. Multiple electronic components are mounted on a single circuit board. The mounting apparatus according to any one of claims 1 to 5.

8. The viscous member is silicone oil. The mounting apparatus according to any one of claims 1 to 5.

9. At least one of the first mold and the second mold has a gas supply port for supplying an inert gas to the at least one electronic component and the at least one substrate. The mounting apparatus according to any one of claims 1 to 5.

10. When the mounting process is performed, a film is stretched over the surface of the second mold facing the first mold. The movable mechanism contacts the electronic component at its tip via the film. The mounting apparatus according to any one of claims 1 to 5.

11. The first pressing transmission section has one or more lower plungers, The second pressing transmission section has the same number of upper plungers as the lower plungers, The lower plunger and the upper plunger are arranged opposite each other to form a pair. The mounting device according to claim 1.

12. A mounting method for mounting one or more electronic components on at least one substrate, A first mold is prepared which is configured to hold the substrate on which the aforementioned electronic components are mounted, The present invention provides a second mold positioned opposite the first mold, wherein the second mold has at least one movable mechanism connected to the internal space of the second mold. The present invention provides a pressure transmission mechanism for pressing a viscous member sealed in the internal space of the second mold, wherein the pressure transmission mechanism comprises a first pressure transmission unit provided in the first mold and a second pressure transmission unit provided in the second mold and connected to the internal space of the second mold. Includes, The aforementioned implementation method is, Closing the first mold and the second mold, The pressing transmission mechanism presses the viscous member, With the first mold and the second mold closed, the second pressing transmission unit, pressed by the first pressing transmission unit, presses the viscous member, and based on the pressing force applied by the second pressing transmission unit to the viscous member, the movable mechanism pressurizes the electronic component via the viscous member. Further including, Implementation method.

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