Cleaning method for the processing device

Abstract

To provide a cleaning method for processing equipment, the method enabling foreign substance in the processing equipment to be easily and surely removed, thereby enabling the inside of the processing equipment to be kept clean.SOLUTION: Processing equipment is provided, comprising: a holding table 10 including a mounting surface 11 on which an object is mounted; a processing unit processing the object held by the holding table 10; and a conveyance unit which includes a holding section holding the object, and which conveys the object held by the holding section. A cleaning method for the processing equipment is provided, implementing: a holding step of holding a resin member 200 having a tack force by means of the holding section of the conveyance unit; a conveyance step of conveying the resin member 200 held by the holding section of the conveyance unit to the holding table 10; and a mounting step of mounting the resin member 200 conveyed by the conveyance unit on the holding table 10. A foreign substance 300 adhered to at least any one of the holding section of the conveyance unit and the mounting surface 11 of the holding table 10 is removed by the tack force of the resin member 200.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for cleaning a processing device. [Background technology]

[0002] The processing equipment used in the semiconductor device manufacturing process includes a holding table for holding semiconductor wafers, a processing unit for processing the wafers, a cleaning unit for cleaning the processed wafers, and a transport unit for transporting the wafers (see, for example, Patent Document 1). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2001-007058 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] In the processing apparatus described above, if foreign matter such as processing debris generated during processing adheres to the holding table, there is a risk that cracks may occur starting from the processing debris when a wafer to be processed next is placed on it. To eliminate this risk, methods have been devised to clean the holding table by supplying liquid using a water curtain, etc. However, there is a problem that the liquid makes it easier for the porous parts of the holding table to peel off. Furthermore, cleaning the holding table by supplying gas such as air blow has a different problem in that foreign matter cannot be completely removed. In addition, if foreign matter adheres to the transport unit, there is a risk that it may fall off during transport and contaminate the wafer, or that the wafer may not be transported properly due to the foreign matter and may fall. Currently, the operator has to clean after a problem occurs, which is a reactive approach.

[0005] This invention has been made in view of the above problems, and its purpose is to provide a cleaning method for a processing device that can easily and reliably remove foreign matter inside the processing device and maintain a clean state. [Means for solving the problem]

[0006] To solve the above-mentioned problems and achieve the objective, the present invention provides a cleaning method for a processing apparatus comprising: a holding table having a mounting surface on which an object is placed; a processing unit that performs processing on an object held on the holding table; and a transport unit having a holding part for holding the object and transporting the object held by the holding part between its constituent elements, wherein the cleaning method for a processing apparatus comprises: a holding step of holding a resin member having tack force with the holding part of the transport unit; a transport step of transporting the resin member having tack force held by the holding part of the transport unit to the holding table; and a mounting step of placing the resin member having tack force that has been transported to the holding table by the transport unit onto the holding table, thereby removing foreign matter adhering to the holding part of the transport unit due to the tack force of the resin member. death, The resin member having the tack force is integrated with a frame having an opening in the center, and the holding part of the transport unit holds the frame. Characterized by .

[0007] Furthermore, in order to solve the above-mentioned problems and achieve the objective, the present invention provides a cleaning method for a processing apparatus comprising: a holding table having a mounting surface on which an object is placed; a processing unit for processing an object held on the holding table; and a transport unit having a holding part for holding the object and transporting the object held by the holding part between its constituent elements, wherein the cleaning method for a processing apparatus comprises: a holding step of holding a resin member having tack force with the holding part of the transport unit; a transport step of transporting the resin member having tack force held by the holding part of the transport unit to the holding table; and a mounting step of placing the resin member having tack force that has been transported to the holding table by the transport unit onto the holding table, thereby removing foreign matter adhering to at least one of the holding part of the transport unit and the mounting surface of the holding table by the tack force of the resin member, wherein the resin member having tack force is integrated with a frame having an opening in the center, and the holding part of the transport unit holds the frame.

[0008] The frame may be made of a resin member that has tack properties.

[0009] The resin member having tack force, which is placed on the holding table, may be brought into close contact with the holding table by applying negative pressure to the mounting surface.

[0010] The resin member having tack force is integrated with one side of the plate-like object, and the holding portion of the transport unit may hold the side of the plate-like object that is integrated with the resin member having tack force.

[0011] The resin member having tackiness may contain a metal-catching group. [Effects of the Invention]

[0012] The present invention allows for the easy and reliable removal of foreign matter from within the processing apparatus by transporting a resin member with tack force along the transport path of an object within the processing apparatus. This allows the resin member's tack force to adsorb and remove foreign matter adhering to the transport path of the object, thus maintaining a clean state. Furthermore, by applying negative pressure to the mounting surface of a holding table, the present invention ensures close contact between the resin member placed on the mounting surface and the mounting surface, allowing the resin member to more reliably adsorb and remove foreign matter adhering to the mounting surface. Additionally, in the present invention, if the resin member with tack force is integrated with a frame having an opening in the center, and the holding part of the transport unit holds the frame, the resin member with the frame attached can be easily transported in the same manner as when the processing apparatus transports and processes an object with the frame attached. Moreover, in the present invention, if the frame is made of the same material as the resin member with tack force, the tack force of the frame can adsorb and remove foreign matter adhering to the holding part of the transport unit that holds the frame. Furthermore, in the present invention, when a tacky resin member is integrated with a plate-shaped object, it has a shape similar to that of an object to which adhesive tape is attached. Therefore, the processing device can easily transport the tacky resin member integrated with the plate-shaped object in the same manner as when transporting and processing an object to which adhesive tape is attached. In addition, in the present invention, when the tacky resin member contains a metal-catching group, the metal-catching group can adsorb metal contamination in the transport path of the object at the molecular level. [Brief explanation of the drawing]

[0013] [Figure 1] Figure 1 is a perspective view showing an example of the configuration of a processing apparatus to which the cleaning method for the processing apparatus according to Embodiment 1 is to be implemented. [Figure 2] Figure 2 is a flowchart showing the processing procedure for the cleaning method of the processing device according to Embodiment 1. [Figure 3] Figure 3 is a perspective view showing an example of a resin component used in the cleaning method of the processing apparatus shown in Figure 2. [Figure 4] Figure 4 is a perspective view illustrating an example of the holding and conveying steps shown in Figure 2. [Figure 5] FIG. 5 is a cross-sectional view for explaining an example of the placement step of FIG. 2. [Figure 6] FIG. 6 is a perspective view showing a configuration example of a processing apparatus which is an object to be cleaned by the cleaning method of the processing apparatus according to Embodiment 2. [Figure 7] FIG. 7 is a perspective view showing an example of a resin member used in the cleaning method of the processing apparatus according to Embodiment 2. [Figure 8] FIG. 8 is a perspective view for explaining an example of the holding step and the transfer step according to Embodiment 2. [Figure 9] FIG. 9 is a cross-sectional view for explaining an example of the placement step according to Embodiment 2. DETAILED DESCRIPTION OF THE INVENTION

[0014] A mode (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the content described in the following embodiments. Further, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention. [[ID=2​​​​​​​​In Embodiment 1, the object 100 to be processed by the processing apparatus 1 is, for example, a disc-shaped semiconductor wafer or optical device wafer made of silicon, sapphire, silicon carbide (SiC), gallium arsenide, etc. as a base material, as shown in Figure 1. The object 100 has chip-sized semiconductor devices or optical devices formed in areas demarcated by multiple division lines formed in a grid pattern on its flat surface. In Embodiment 1, the object 100 has adhesive tape attached to its back surface, and an annular frame with an opening in the center is attached to the outer edge of the adhesive tape, but the present invention is not limited to this. In addition, the object 100 in the present invention may be a rectangular package substrate having multiple devices sealed with resin, a ceramic plate, or a glass plate, etc.

[0017] The holding table 10 comprises a disc-shaped frame with a recess formed therein, and a disc-shaped suction part fitted into the recess. The suction part of the holding table 10 has a porous section formed from porous ceramic or the like, which has numerous porous holes, and is connected to a vacuum suction source 15 (see Figure 5) via a suction passage 13 (see Figure 5). In Embodiment 1, the porous section is formed from, for example, alumina ceramics. The upper surface of the suction part of the holding table 10 is a mounting surface 11 on which the object 100 is placed, as shown in Figure 1. The mounting surface 11 is held in close contact with the placed object 100 by negative pressure introduced from the vacuum suction source 15 through the suction passage 13 formed in the holding table 10. In this embodiment, the object 100 is placed on the mounting surface 11 with its surface facing upward, and the placed object 100 is held in place by suction from the back side via adhesive tape. The mounting surface 11 and the upper surface of the frame of the holding table 10 are arranged on the same plane and are formed parallel to the horizontal XY plane. The holding table 10 is provided to be movable in the X-axis direction parallel to the horizontal direction by an X-axis direction movement unit (not shown), and is provided to be rotatable around the Z-axis which is perpendicular to the horizontal plane (XY plane) and parallel to the vertical direction by a rotation drive source (not shown).

[0018] Furthermore, as shown in Figure 1, the holding table 10 is equipped with a plurality of clamp-like frame holding parts 12 (two in the example shown in Figure 1) arranged on the outer periphery of the frame, which hold and fix the frame attached to the object 100 at a position where the upper surface of the frame is lower in the vertical direction than the mounting surface 11.

[0019] The processing unit 20 performs processing on the object 100 held on the holding table 10. In Embodiment 1, as shown in Figure 1, the processing unit 20 is a cutting unit that cuts the object 100 held on the holding table 10, and is equipped with a spindle to which a cutting blade is attached at its tip. The processing unit 20 is provided to be movable in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction, by a Y-axis direction movement unit (not shown), and is provided to be movable in the Z-axis direction by a Z-axis direction movement unit (not shown). In the processing unit 20, the cutting blade attached to the tip of the spindle is subjected to rotational motion around an axis parallel to one direction in the horizontal direction (the Y-axis direction in Figure 1) by the rotational motion of the spindle, and cuts the object 100 held on the holding table 10 along the planned division line. As shown in Figure 1, the processing device 1 is equipped with two sets of processing units 20 (cutting units), that is, a two-spindle dicer, a so-called facing dual type processing device (cutting device).

[0020] The transport unit 30 holds the object 100 and transports it between the components of the processing device 1. In this embodiment 1, the components specifically refer to the space between the holding table 10, the cassette 45 placed on the cassette mounting base 40, and the washing unit 50. In embodiment 1, the transport unit 30 has a first transport unit 31 and a second transport unit 32, as shown in Figure 1.

[0021] As shown in Figure 1, the first transport unit 31 is provided so as to be movable along the Y-axis direction, which is the loading and unloading direction, in front of the loading and unloading section for loading and unloading the object 100 of the cassette 45 placed on the cassette mounting table 40. The first transport unit 31 has a holding part 35 that holds the portion of the frame attached to the object 100 on the loading and unloading section side from the +Y direction. In Embodiment 1, the holding part 35 is a gripping clip that grips the frame, and is formed by covering stainless steel with nitrile rubber, silicone rubber, natural rubber, polyurethane rubber, fluororubber, etc. The first transport unit 31 holds the frame attached to the object 100 contained in the cassette 45 with the holding part 35 and loads it along the Y-axis direction, transporting it onto a pair of guide rails (not shown) provided in front of the loading and unloading section of the cassette 45 placed on the cassette mounting table 40. Furthermore, the first transport unit 31 holds the frame attached to the object 100 on a pair of guide rails with the holding part 35 and transports it into the cassette 45 along the Y-axis direction.

[0022] As shown in Figure 1, the second transport unit 32 is provided so as to be movable along the Y-axis and Z-axis directions between a pair of guide rails, a holding table 10, and a washing unit 50. The second transport unit 32 has a holding part 36 that holds the upper surface of the frame attached to the object 100 from above (+Z direction). In Embodiment 1, the second transport unit 32 has four holding parts 36, but the present invention is not limited to this, and may have one to three or five or more. In Embodiment 1, the holding part 36 is an adsorption pad that adsorbs and holds the frame, and is made of, for example, nitrile rubber, silicone rubber, natural rubber, polyurethane rubber, fluororubber, etc. The second transport unit 32 transports the object 100 between the pair of guide rails, the holding table 10, and the washing unit 50.

[0023] The cassette mounting base 40 is a mounting base on which a cassette 45, which is a container for housing multiple objects 100, is placed, and the mounted cassette 45 is raised and lowered in the Z-axis direction. The cleaning unit 50 cleans the processed objects 100 and removes foreign matter 300 (see Figure 5), such as processing debris, that has adhered to the objects 100. In Embodiment 1, the cleaning unit 50 includes, for example, a spinner table that holds the processed objects 100 via adhesive tape and rotates them, and a nozzle that supplies cleaning liquid to the objects 100 held on the spinner table.

[0024] The control unit 60 controls the operation of each component of the processing unit 1 to cause the processing unit 1 to perform processing on the object 100 and the cleaning method of the processing unit according to Embodiment 1. In this embodiment, the control unit 60 includes a computer system. The computer system included in the control unit 60 includes an arithmetic processing unit having a microprocessor such as a CPU (Central Processing Unit), a storage device having memory such as ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface device. The arithmetic processing unit of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device of the control unit 60 and outputs control signals for controlling the processing unit 1 to each component of the processing unit 1 via the input / output interface device of the control unit 60.

[0025] Next, this specification will describe a cleaning method for the processing apparatus according to Embodiment 1 with reference to the drawings. Figure 2 is a flowchart showing the processing procedure for the cleaning method for the processing apparatus according to Embodiment 1. Figure 3 is a perspective view showing an example of a resin member 200 used in the cleaning method for the processing apparatus in Figure 2. The cleaning method for the processing apparatus according to Embodiment 1 involves using a resin member 200 having the tack force shown in Figure 3 on the processing apparatus 1, and performing a holding step 1001, a transport step 1002, and a placement step 1003 as shown in Figure 2.

[0026] Here, the resin member 200 having tack force means, in this specification, that the resin member 200 adheres more strongly to foreign matter 300 such as processing waste generated by processing by the processing unit 20 than the material used in the transport path of the object 100, and that even if the surface of the resin member 200 to which the foreign matter 300 is attached is tilted, the foreign matter 300 does not detach from the surface of the resin member 200. The transport path of the object 100 refers to the part that comes into contact with the object 100 or the adhesive tape attached to the object 100 and the frame mounted on the object 100 when the object 100 is transported in the processing apparatus 1. In Embodiment 1, for example, this is the mounting surface 11 of the holding table 10 and the holding parts 35, 36 of the transport unit 30. The transport path of the object 100 may also include the spinner table of the washing unit 50. The transport path of the object 100 is a part that comes into contact with the object 100, etc., and is therefore a region to which foreign matter 300 is likely to adhere.

[0027] The resin member 200 having tack force used in the cleaning method of the processing apparatus according to Embodiment 1 has a storage modulus (dynamic storage modulus) of 1 × 10⁻¹⁰ in the environment when used in the cleaning method of the processing apparatus according to Embodiment 1. 6 Pa or more 1×10 9 It is below Pa.

[0028] The storage modulus is measured by dynamic mechanical analysis (DMA) along with the loss modulus (dynamic loss modulus) and loss tangent. Specifically, the storage modulus is measured according to one of the following Japanese Industrial Standards (JIS) specifications: JIS K 7244-4 (non-resonant forced vibration method), JIS K 7244-5 (bending mode), and JIS K 7244-6 (shear mode). According to the Japanese Industrial Standards, the storage modulus is 0.01 GPa (1 × 10⁻¹⁶). 7 If the reading is less than 0.01 GPa, it is preferable to measure it according to the method in accordance with JIS K 7244-6 (shear mode), and the reading should be between 0.01 GPa and 5 GPa (1 × 10⁻¹⁰). 7 GPa or higher 5x10 9When it is below GPa, it is preferably measured by a method according to JIS K 7244-4 (non-resonant forced vibration method). When it is greater than 5 GPa (5 × 10 9 GPa), it is preferably measured by a method according to JIS K 7244-5 (bending mode).

[0029] The storage elastic modulus generally varies depending on the temperature during measurement and the frequency (velocity) of the deformation applied during measurement. The resin member 200 having a tack force used in the cleaning method of the processing apparatus according to Embodiment 1, more specifically, has a storage elastic modulus measured under the conditions that the temperature is the use environment temperature and the frequency of deformation is 0.01 Hz or more and 10 Hz or less of 1 × 10 6 Pa or more and 1 × 10 9 Pa or less. Hereinafter, the conditions that the temperature is the use environment temperature (here, for example, 20°C) and the frequency of deformation is 0.01 Hz or more and 10 Hz or less are abbreviated as predetermined conditions.

[0030] The resin member 200 has a storage elastic modulus measured under predetermined conditions of 1 × 10 6 Pa or more and 1 × 10 9 Pa or less, so it has a tack force. That is, it adheres more strongly to foreign matters 300 such as processing scraps generated by the processing by the processing unit 20 than the material used for the conveyance path of the object 100, and even if the surface of the resin member 200 to which the foreign matter 300 adheres is tilted, the foreign matter 300 does not separate from the surface of the resin member 200. It has the property of being able to sufficiently adsorb the foreign matter 300 adhering to the conveyance path when the resin member 200 is brought into contact with the conveyance path of the object 100.

[0031] On the other hand, when the storage elastic modulus of the resin member measured under predetermined conditions is less than 1 × 10 6 Pa, the resin member is too sticky, and there is a risk that residues derived from the material of the resin member will remain on the conveyance path when the resin member is brought into contact with the conveyance path of the object 100. Also, when the storage elastic modulus of the resin member measured under predetermined conditions is 1 × 10 9If the Pa value is higher, the resin component may be too hard, and when the resin component is brought into contact with the transport path of the object 100, it may not be able to adequately adsorb any foreign matter 300 attached to the transport path.

[0032] In Embodiment 1, the resin member 200 is made of a thermoplastic resin. Specifically, the thermoplastic resins that make up the resin member 200 include acrylic resin, methacrylic resin, vinyl resin, polyacetal, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, polyolefins such as polyethylene, polypropylene, poly(4-methyl-1-pentene), and poly(1-butene), polyesters such as polyethylene terephthalate and polybutylene terephthalate, polyamides such as nylon-6, nylon-66, and polymetaxylene adipamide, polyacrylate, polymethacrylate, polyvinyl chloride, polyetherimide, and polyacrylonitrile. Examples include one or more selected from polycarbonate, polystyrene, polysulfone, polyethersulfone, polyphenylene, etherpolybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, thermoplastic polyurethane resin, phenoxy resin, polyamideimide resin, fluororesin, ethylene-unsaturated carboxylic acid copolymer resin, ethylene-vinyl acetate copolymer resin, ionomer, ethylene-vinyl acetate-maleic anhydride ternary copolymer resin, ethylene-vinyl acetate copolymer saponified resin, and ethylene-vinyl alcohol copolymer resin.

[0033] Examples of unsaturated carboxylic acids that constitute the ethylene-unsaturated carboxylic acid copolymer resin used in the thermoplastic resin constituting the resin member 200 include acrylic acid, methacrylic acid, maleic acid, itaconic acid, monomethyl maleate, monoethyl maleate, maleic anhydride, and itaconic anhydride. Here, the ethylene-unsaturated carboxylic acid copolymer resin includes not only a binary copolymer of ethylene and an unsaturated carboxylic acid, but also a polypolymer in which other monomers are copolymerized. Examples of other monomers that may be copolymerized in the ethylene-unsaturated carboxylic acid copolymer resin include vinyl esters such as vinyl acetate and vinyl propionate, and unsaturated carboxylic acid esters such as methyl acrylate, ethyl acrylate, isobutyl acrylate, n-butyl acrylate, methyl methacrylate, isobutyl methacrylate, dimethyl maleate, and diethyl maleate.

[0034] The resin member 200 is made of the thermoplastic resin described above, and the storage modulus measured under predetermined conditions is 1 × 10⁻⁶ 6 Pa or more 1×10 9 The storage modulus of the resin member 200, measured under predetermined conditions, is 1 × 10⁻⁶. 6 Pa or more 1×10 9 The thermoplastic resin used in the resin member 200, its molecular weight, and its combination are appropriately selected from the above-mentioned thermoplastic resins so as to be less than or equal to Pa, and the mixing ratio is appropriately determined.

[0035] Furthermore, the resin member 200 may also contain a metal-capturing group. The metal-capturing group used in combination with the resin member 200 is a material that can adsorb metal contamination at the molecular level along the transport path of the object 100. Examples include chelating agents, calixarenes, zeolites, activated carbon, mesoporous silica, and crown ethers.

[0036] In particular, some chelating agents, calixarenes, and crown ethers among the metal-capturing groups have functional groups that can bond with the thermoplastic resin constituting the resin member 200. By bonding with the thermoplastic resin, the detachment of the metal-capturing groups from the resin member 200 during the detachment of the object 100 from the transport path can be suppressed.

[0037] Furthermore, among the thermoplastic resins constituting the resin member 200, ethylene-unsaturated carboxylic acid copolymer resins, ethylene-vinyl acetate copolymer resins, ionomers, ethylene-vinyl acetate-maleic anhydride ternary copolymer resins, ethylene-vinyl acetate copolymer saponified resins, and ethylene-vinyl alcohol copolymer resins have reactive groups that react with the metal-catching groups described above. Therefore, by using these thermoplastic resins in the resin member 200, it is possible to suppress the detachment of the metal-catching groups from the resin member 200 when the object 100 is peeled off the transport path.

[0038] In Embodiment 1, the resin member 200 is formed in a shape similar to adhesive tape attached to the object 100, i.e., in a sheet shape, as shown in Figure 3. In Embodiment 1, it is preferable that the sheet-shaped resin member 200 is further integrated with the frame 201, which has a frame 201 with an opening 202 in the center and a shape similar to a frame attached to the object 100, and is used as an integral part of the resin member 200. In this case, the sheet-shaped resin member 200 with the frame 201 attached can be transported along the transport path of the object 100 within the processing apparatus 1 in the same manner as the object 100 with the frame attached.

[0039] In Embodiment 1, the frame 201 has a storage modulus of elasticity of 1 × 10, measured under predetermined conditions, similar to the material constituting the resin member 200 which has tack force. 6 Pa or more 1×10 9It is preferable that the frame is made of a material with a Pa of less than or equal to Pa. In this case, the frame 201 will have tack force similar to that of the sheet-shaped resin member 200, and the exposed surface 203 and the surface 204 to which the sheet-shaped resin member 200 is attached will be able to adsorb foreign matter 300 that has adhered to the transport path of the object 100.

[0040] The holding step 1001 is a step in which the resin member 200 having tack force is held by the holding parts 35 and 36 of the transport unit 30. The holding step 1001 is performed in multiple steps as appropriate, and in Embodiment 1, for example, it is performed in two steps. In the first holding step 1001, the control unit 60 holds the frame 201 attached to the sheet-like resin member 200 contained in the cassette 45 placed on the cassette mounting table 40 by the holding part 35 of the first transport unit 31. By performing the first holding step 1001, if the frame 201 is made of the same material as the resin member 200 having tack force and has tack force, the portion of the frame 201 held by the holding part 35 of the first transport unit 31 can adsorb and remove foreign matter 300 adhering to the holding part 35 of the first transport unit 31.

[0041] The transport step 1002 is the step of transporting the resin member 200 having tack force, which is held by the holding parts 35 and 36 of the transport unit 30, to the holding table 10. The transport step 1002 is performed in the same number of steps as the holding step 1001, and in Embodiment 1, for example, it is performed in two steps. In the first transport step 1002, the control unit 60 first uses the first transport unit 31 to transport the sheet-like resin member 200, to which the frame 201 held by the holding part 35 in the first holding step 1001 is attached, from inside the cassette 45 placed on the cassette mounting table 40 onto a pair of guide rails (not shown). By performing the first holding step 1001, if the frame 201 is made of the same material as the resin member 200 having tack force and has tack force, the portion of the frame 201 held by the pair of guide rails can adsorb and remove foreign matter 300 attached to the pair of guide rails.

[0042] Figure 4 is a perspective view illustrating an example of the holding step 1001 and transport step 1002 in Figure 2. Figure 4 shows an example of the second holding step 1001 and transport step 1002. In the second holding step 1001, as shown in Figure 4, the control unit 60 holds the frame 201, which is mounted on a sheet-like resin member 200 placed on a pair of guide rails, by the holding part 36 of the second transport unit 32. By performing the second holding step 1001, if the frame 201 is made of the same material as the resin member 200 which has tack force and has tack force, the portion of the frame 201 held by the holding part 36 of the second transport unit 32 can adsorb and remove foreign matter 300 adhering to the holding part 36 of the second transport unit 32.

[0043] In the second transport step 1002, the control unit 60 uses the second transport unit 32 to transport the sheet-like resin member 200, to which the frame 201 held by the holding unit 36 ​​in the second holding step 1001 is attached, from a pair of guide rails (not shown) to the holding table 10.

[0044] Thus, in Embodiment 1, the transport unit 30 has a first transport unit 31 and a second transport unit 32, so the holding step 1001 and the transport step 1002 are each performed in two separate steps by the holding and transport by the first transport unit 31 and the holding and transport by the second transport unit 32. However, the present invention is not limited to this, and it is sufficient to include at least one holding step 1001 and one transport step 1002 each. For example, the holding step 1001 and the transport step 1002 may each be performed in one step by one transport unit, or the holding step 1001 and the transport step 1002 may each be performed in three or more separate steps by three or more transport units.

[0045] The placement step 1003 is the step of placing the tack-force resin member 200, which has been transported to the holding table 10 by the transport unit 30, onto the holding table 10. In the placement step 1003, in Embodiment 1, the control unit 60 places the sheet-like resin member 200, to which the frame 201 has been attached, which was transported to the holding table 10 in the second transport step 1002 by the second transport unit 32, onto the holding table 10.

[0046] In the placement step 1003, the control unit 60 also uses the frame holding portion 12 to hold and fix the frame 201, which is attached to the sheet-like resin member 200 placed on the placement surface 11 of the holding table 10, at a position where the upper surface 203 of the frame 201 is lower in the vertical direction than the placement surface 11. As a result, if the frame 201 is made of the same material as the resin member 200 which has tack force and has tack force, the portion of the frame 201 held by the frame holding portion 12 can adsorb and remove foreign matter 300 adhering to the frame holding portion 12.

[0047] Figure 5 is a cross-sectional view illustrating an example of the placement step 1003 in Figure 2. In the placement step 1003, as shown in Figure 5, the control unit 60 further switches the on / off valve 14 to the open state, introducing and applying negative pressure from the vacuum suction source 15 to the placement surface 11 through the suction passage 13, thereby causing the sheet-like resin member 200 placed on the placement surface 11 of the holding table 10 to adhere closely to the placement surface 11. This allows foreign matter 300 adhering to the placement surface 11 to be more reliably adsorbed and removed by the sheet-like resin member 200.

[0048] In the first embodiment, the control unit 60 may further transport and place the sheet-shaped resin member 200 with the frame 201 attached to it onto the spinner table of the cleaning unit 50 using the second transport unit 32, thereby using the sheet-shaped resin member 200 to adsorb and remove foreign matter 300 adhering to the spinner table of the cleaning unit 50.

[0049] The cleaning method for the processing apparatus according to Embodiment 1, having the above configuration, involves transporting a resin member 200 with tack force along the transport path of the object 100 inside the processing apparatus 1. The tack force of the resin member 200 adsorbs and removes foreign matter 300 adhering to the transport path of the object 100, specifically the mounting surface 11 of the holding table 10 and the holding parts 35, 36 of the transport unit 30, thus providing the effect of easily and reliably removing foreign matter 300 inside the processing apparatus 1 and maintaining a clean state.

[0050] Furthermore, the cleaning method for the processing apparatus according to Embodiment 1 involves applying negative pressure to the mounting surface 11 of the holding table 10, thereby bringing the sheet-like resin member 200 placed on the mounting surface 11 of the holding table 10 into close contact with the mounting surface 11. This allows foreign matter 300 adhering to the mounting surface 11 to be more reliably adsorbed and removed by the sheet-like resin member 200.

[0051] Furthermore, in the cleaning method for the processing apparatus according to Embodiment 1, the tack-force resin member 200 is integrated with a frame 201 having an opening 202 in the center, and the holding parts 35 and 36 of the transport unit 30 hold the frame 201, so the sheet-like resin member 200 with the frame 201 attached can be easily transported in the same way as when the processing apparatus 1 transports and processes an object 100 with the frame attached. Moreover, in the cleaning method for the processing apparatus according to Embodiment 1, since the frame 201 is made of the same material as the material that constitutes the tack-force resin member 200, foreign matter 300 adhering to the holding parts 35 and 36 of the transport unit 30 that holds the frame 201 can be adsorbed and removed by the tack force of the frame 201.

[0052] The cleaning method for the processing apparatus according to Embodiment 1 further includes a resin member 200 having tack force that contains a metal-capturing group, which allows for the adsorption of metal contamination in the transport path of the object 100 at a molecular level.

[0053] [Embodiment 2] A cleaning method for an apparatus according to Embodiment 2 of the present invention will be described based on the drawings. Figure 6 is a perspective view showing an example of the configuration of apparatus 1-2, which is the subject of the cleaning method for an apparatus according to Embodiment 2. Figure 7 is a perspective view showing an example of a resin member 200 used in the cleaning method for an apparatus according to Embodiment 2. Figure 8 is a perspective view illustrating an example of a holding step 1001 and a transport step 1002 according to Embodiment 2. Figure 9 is a cross-sectional view illustrating an example of a placement step 1003 according to Embodiment 2. Figures 6 to 9 use the same reference numerals as Embodiment 1 for the same parts and their descriptions are omitted.

[0054] As shown in Figure 6, the processing unit 1-2 comprises a holding table 10-2, a processing unit 20-2, a transport unit 30-2, a cassette mounting base 40, a washing unit 50, a control unit 60, and a positioning unit 70. The processing unit 1-2 is the same as the processing unit 1, but with the holding table 10, processing unit 20, and transport unit 30 replaced by the holding table 10-2, processing unit 20-2, and transport unit 30-2 respectively, and with the addition of a positioning unit 70.

[0055] Processing apparatus 1-2 processes the object 100 in the same manner as processing apparatus 1. In Embodiment 2, the object 100 processed by processing apparatus 1-2 does not have adhesive tape attached to its back surface, unlike the object 100 processed by processing apparatus 1 in Embodiment 1, but instead has adhesive tape attached to its surface, and does not have an annular frame attached, however, the present invention is not limited to these.

[0056] The holding table 10-2 is a modified version of the holding table 10, without the frame holding section 12. The alignment unit 70 is a table on which an object 100, removed from a cassette 45 placed on a cassette mounting base 40, is temporarily placed and its center is aligned.

[0057] The processing unit 20-2 performs processing on, for example, the back surface of the object 100 held on the holding table 10-2. In Embodiment 2, as shown in Figure 6, the processing unit 20-2 is a grinding unit that grinds the object 100 held on the holding table 10-2, and is equipped with a spindle at its tip that has a grinding wheel with grinding wheels arranged in an annular shape. The processing unit 20-2 is provided to be movable in the Z-axis direction by a Z-axis direction movement unit. The processing unit 20-2 grinds the object 100 held on the holding table 10-2 below by the grinding wheel attached to the tip of the spindle being pressed downward by the rotational movement of the spindle, which causes a rotational movement around an axis parallel to the vertical direction (Z-axis direction in Figure 6).

[0058] The transport unit 30-2 holds the object 100 and transports it between the components of the processing device 1-2. Here, in Embodiment 2, the spaces between the components specifically refer to the spaces between the holding table 10-2, the cassette 45 placed on the cassette mounting base 40, and the washing unit 50. In Embodiment 2, as shown in Figure 6, the transport unit 30-2 has a first transport unit 31-2, a second transport unit 32-2, and a third transport unit 33-2.

[0059] As shown in Figure 6, the first transport unit 31-2 is located in front of the loading / unloading section for loading and unloading the object 100 of the cassette 45 placed on the cassette mounting table 40. The first transport unit 31-2 has a holding section 37-2 for holding the object 100. In the examples shown in Figures 6 and 8, the holding section 37-2 holds the upper surface of the object 100 from above (+Z direction), but the present invention is not limited to this, and may also hold the object 100 from below (-Z direction). The holding section 37-2 is, for example, a suction pad that holds the object 100 by suction, and is made of the same material as the holding section 36 in Embodiment 1. The first transport unit 31-2 holds the object 100 contained in the cassette 45 placed on the cassette mounting table 40 with the holding section 37-2, loads it out, and transports it to the alignment unit 70. The first transport unit 31-2 holds the object 100, which has been cleaned by the washing unit 50, in the holding unit 37-2 and transports it into the cassette 45 placed on the cassette mounting table 40. When the first transport unit 31-2 transports the object 100 between the cassette 45 placed on the cassette mounting table 40 and the alignment unit 70 or the washing unit 50, it can appropriately reverse the front and back sides of the object 100.

[0060] As shown in Figure 6, the second transport unit 32-2 is provided between the alignment unit 70 and the holding table 10-2. The second transport unit 32-2 has a holding part 38-2 for holding the object 100. In the example shown in Figure 6, the holding part 38-2 holds the upper surface of the object 100 from above (+Z direction), but the present invention is not limited to this, and may also hold the object 100 from below (-Z direction). The holding part 38-2 is, for example, a suction pad similar to the holding part 37-2. The second transport unit 32-2 holds the object 100, which has been center-aligned by the alignment unit 70, with the holding part 38-2 and transports it to the holding table 10-2. When transporting the object 100 between the alignment unit 70 and the holding table 10-2, the second transport unit 32-2 can appropriately reverse the front and back sides of the object 100.

[0061] As shown in Figure 6, the third transport unit 33-2 is provided between the holding table 10-2 and the washing unit 50. The third transport unit 33-2 has a holding part 39-2 for holding the object 100. In the example shown in Figure 6, the holding part 39-2 holds the upper surface of the object 100 from above (+Z direction), but the present invention is not limited to this, and may also hold the object 100 from below (-Z direction). The holding part 39-2 is, for example, a suction pad similar to the holding parts 37-2 and 38-2. The third transport unit 33-2 holds the processed object 100 on the holding table 10-2 with the holding part 39-2, carries it out, and transports it to the washing unit 50. When transporting the object 100 between the holding table 10-2 and the washing unit 50, the third transport unit 33-2 can appropriately reverse the front and back sides of the object 100.

[0062] Next, this specification will describe a cleaning method for the processing apparatus according to Embodiment 2 with reference to the drawings. The cleaning method for the processing apparatus according to Embodiment 2 is a modification of Embodiment 1, in which the object to be cleaned is changed from processing apparatus 1 to processing apparatus 1-2, and accordingly, the holding step 1001, the transport step 1002, and the placement step 1003 are modified. The cleaning method for the processing apparatus according to Embodiment 2 uses a resin member 200 having tack force as shown in Figure 7 for processing apparatus 1-2. The resin member 200 having tack force used for processing apparatus 1-2 is made of the same material as the resin member 200 having tack force used for processing apparatus 1 in Embodiment 1 and has the same storage modulus. Furthermore, the resin member 200 having tack force used for processing apparatus 1-2 may also contain metal-trapping groups, similar to the resin member 200 having tack force used for processing apparatus 1 in Embodiment 1.

[0063] In Embodiment 2, the resin member 200 is formed in a sheet shape, as shown in Figure 7, similar to Embodiment 1. In Embodiment 2, it is preferable that the sheet-shaped resin member 200 is further attached to one side of a plate-shaped object 210 having the same shape as the object 100, and used as an integrated unit. In this case, the sheet-shaped resin member 200 to which the plate-shaped object 210 is attached can be transported along the transport path of the object 100 within the processing apparatus 1-2 in the same manner as the object 100 to which adhesive tape is attached. In Embodiment 2, the plate-shaped object 210 to which the resin member 200 is attached to one side is transported along the transport path of the object 100 by the transport unit 30-2, while appropriately flipping its front and back sides. This allows the resin member 200 to come into contact with all desired locations along the transport path of the object 100 in a single transport, thereby removing foreign matter 300.

[0064] Here, in Embodiment 2, the transport path for the object 100 refers to the portion that comes into contact with the object 100 or the adhesive tape attached to the object 100 when the object 100 is transported in the processing apparatus 1-2, and is, for example, the mounting surface 11 of the holding table 10-2 and the holding portions 37-2, 38-2, and 39-2 of the transport unit 30-2. The transport path for the object 100 may also include the spinner table of the washing unit 50.

[0065] The holding step 1001 in Embodiment 2 is performed multiple times, for example, in two steps, similar to Embodiment 1. In the first holding step 1001, as shown in Figure 8, the control unit 60 holds one side of the plate-shaped object 210, which is housed in the cassette 45 placed on the cassette mounting table 40 and is integrated with the sheet-shaped resin member 200, with the sheet-shaped resin member 200 attached, by the holding portion 37-2 of the first transport unit 31-2. By performing the first holding step 1001, the portion of the sheet-shaped resin member 200 held by the holding portion 37-2 of the first transport unit 31-2 can adsorb and remove foreign matter 300 adhering to the holding portion 37-2 of the first transport unit 31-2.

[0066] The transport step 1002 in Embodiment 2 is performed in the same number of steps as the holding step 1001, similar to Embodiment 1. In the first transport step 1002, the control unit 60 first uses the first transport unit 31-2 to transport the plate-shaped object 210, which is integrated with the sheet-shaped resin member 200 held by the holding unit 37-2 in the first holding step 1001, from inside the cassette 45 placed on the cassette mounting base 40 to the alignment unit 70.

[0067] In the second holding step 1001, the control unit 60 uses the holding portion 38-2 of the second transport unit 32-2 to hold one side of the plate-shaped object 210, which is integrated with the sheet-shaped resin member 200 and placed on the alignment unit 70, on which the sheet-shaped resin member 200 is attached. By performing the second holding step 1001, the portion of the sheet-shaped resin member 200 held by the holding portion 38-2 of the second transport unit 32-2 can adsorb and remove any foreign matter 300 adhering to the holding portion 38-2 of the second transport unit 32-2.

[0068] In the second transport step 1002, the control unit 60 uses the second transport unit 32-2 to transport the plate-shaped object 210, which is integrated with the sheet-shaped resin member 200 held by the holding unit 38-2 in the second holding step 1001, from the alignment unit 70 to the holding table 10-2.

[0069] In the placement step 1003 according to Embodiment 2, the control unit 60 places the plate-shaped object 210, which is integrated with the sheet-shaped resin member 200 that was transported to the holding table 10-2 in the second transport step 1002 by the second transport unit 32-2, with one side to which the sheet-shaped resin member 200 is attached, facing the placement surface 11 of the holding table 10-2.

[0070] In the placement step 1003, as shown in Figure 9, the control unit 60 further switches the on / off valve 14 to the open state, introducing and applying negative pressure from the vacuum suction source 15 to the placement surface 11 through the suction passage 13. This causes one side of the plate-shaped object 210, which is integrated with the sheet-shaped resin member 200 placed on the placement surface 11 of the holding table 10-2, to be closely attached to the placement surface 11. This allows foreign matter 300 adhering to the placement surface 11 to be more reliably adsorbed and removed by the sheet-shaped resin member 200.

[0071] In the second embodiment, the control unit 60 may further transport and place the plate-shaped object 210, which is integrated with the sheet-shaped resin member 200, onto the spinner table of the cleaning unit 50 using the third transport unit 33-2, thereby using the sheet-shaped resin member 200 to adsorb and remove foreign matter 300 adhering to the spinner table of the cleaning unit 50.

[0072] In Embodiment 2, the resin member 200, which is formed in a sheet shape, may be attached to both sides of a plate-shaped object 210 to form an integrated unit for transport. In this case, even without the transport unit 30-2 appropriately flipping the front and back sides of the plate-shaped object 210 to which the resin member 200 is attached, the resin member 200 can be brought into contact with all desired locations along the transport path of the object 100 during a single transport of the object 100, thereby removing foreign matter 300.

[0073] Furthermore, in Embodiment 2, the system may be modified to transport two plate-shaped objects 210, each with a resin member 200 attached to a different side. Even in this case, the transport unit 30-2 does not need to appropriately reverse the front and back sides of the plate-shaped objects 210 to which the resin member 200 is attached. In a total of two transports of the object 100, one object at a time, the resin member 200 can be brought into contact with all desired locations along the transport path of the object 100, thereby removing the foreign matter 300.

[0074] Furthermore, in Embodiment 2, the plate-shaped object 210 with the resin member 200 attached to one side may be transported in the transport path of the object 100 with the side to which the resin member 200 is attached facing either upward or downward without being flipped over, and then transported with the side to which the resin member 200 is attached facing either upward or downward without being flipped over. Even in this case, the resin member 200 can be brought into contact with all desired locations in the transport path of the object 100 in a total of two transports, thereby removing the foreign matter 300.

[0075] The cleaning method for the processing apparatus according to Embodiment 2, which has the above configuration, is a modification of Embodiment 1, in which the object to be implemented is changed from processing apparatus 1 to processing apparatus 1-2, and accordingly, the frame 201 is replaced with a sheet-like resin member 200 integrated with a plate-like object 210, and the holding step 1001, the transport step 1002, and the placement step 1003 are modified. For this reason, the cleaning method for the processing apparatus according to Embodiment 2 has the same effects as Embodiment 1, except for the part relating to the frame 201. Furthermore, in the cleaning method for the processing apparatus according to Embodiment 2, the holding parts 37-2, 38-2, and 39-2 of the transport unit 30-2 hold the side of the plate-like object 210 integrated with the sheet-like resin member 200 to which the sheet-like resin member 200 is attached, so foreign matter 300 attached to the holding parts 37-2, 38-2, and 39-2 of the transport unit 30-2 that hold the side of the sheet-like resin member 200 can be adsorbed and removed by the tack force of the sheet-like resin member 200.

[0076] Furthermore, in the cleaning method of the processing apparatus according to Embodiment 2, since the resin member 200 having tack force integrated with the plate-shaped object 210 has the same shape as the object 100 to which the adhesive tape is attached, the resin member 200 having tack force integrated with the plate-shaped object 210 can be easily transported in the same manner as when the processing apparatus 1-2 transports and processes the object 100 to which the adhesive tape is attached.

[0077] It should be noted that the present invention is not limited to the embodiments described above. That is, it can be implemented with various modifications without departing from the core of the present invention. In embodiments 1 and 2 described above, the processing units 20 and 20-2 are a cutting unit that performs cutting and a grinding unit that performs grinding, respectively. However, the present invention is not limited to these, and may be any unit that performs some kind of processing on the object 100, such as a laser beam irradiation unit that irradiates the object 100 with a laser beam to perform laser processing, a plasma processing unit that irradiates the object 100 with plasma to process it, an attachment unit that attaches a protective member to the object 100 to perform protective member installation processing, an ultraviolet irradiation unit equipped with an ultraviolet irradiator that irradiates the object 100 with ultraviolet light to process the object 100, a cleaning unit equipped with a nozzle that supplies cleaning liquid or cleaning gas to the object 100 to process the object 100, or an inspection unit that inspects the object 100 (for example, inspecting for chipping, inspecting surface roughness, etc.). Furthermore, in the embodiments 1 and 2 described above, the tacky resin member 200 is brought into contact with the transport path of the object 100 to adsorb and remove foreign matter 300. However, the tacky resin member 200 can also be brought into contact with various parts of the other processing devices 1 and 1-2 (for example, parts that cannot be brought into contact with the resin member 200 during transport, such as the outer cover) to adsorb and remove foreign matter 300, including dust, with the resin member 200. In this case, residues from wiping various parts of the other processing devices 1 and 1-2 with a solvent, fiber adhesion when using gauze, and adhesive residue when applying and removing tape can be eliminated. [Explanation of Symbols]

[0078] 1,1-2 Processing device 10,10-2 Holding Table 11 Mounting surface 20,20-2 Processing Unit 30,30-2 Conveyor Unit 35,36,37-2,38-2,39-2 Holding part 100 Objects 200 Resin components 201 frames 202 Aperture 210 Plate-like material 300 Foreign object

Claims

1. A holding table having a mounting surface on which an object is placed, A processing unit that performs processing on an object held in the holding table, A transport unit having a holding part for holding the object, and transporting the object held by the holding part between its components, In a processing apparatus comprising, A holding step in which a resin member having tack force is held by the holding part of the transport unit, A transport step of transporting the resin member having tack force, which is held in the holding part of the transport unit, to the holding table, The process involves a placement step in which the resin member having tack force, which has been transported to the holding table by the transport unit, is placed on the holding table, The tack force of the resin member removes foreign matter adhering to the holding part of the transport unit. The resin member having tack force is integrated with a frame having an opening in the center. A method for cleaning a processing device, characterized in that the holding part of the transport unit holds the frame.

2. A holding table having a mounting surface on which an object is placed, A processing unit that performs processing on an object held in the holding table, A transport unit having a holding part for holding the object, and transporting the object held by the holding part between its components, In a processing apparatus comprising, A holding step in which a resin member having tack force is held by the holding part of the transport unit, A transport step of transporting the resin member having tack force, which is held in the holding part of the transport unit, to the holding table, The process involves a placement step in which the resin member having tack force, which has been transported to the holding table by the transport unit, is placed on the holding table, The tack force of the resin member removes foreign matter adhering to at least one of the holding part of the transport unit and the mounting surface of the holding table. The resin member having tack force is integrated with a frame having an opening in the center. A method for cleaning a processing device, characterized in that the holding part of the transport unit holds the frame.

3. The cleaning method for the processing apparatus according to claim 1 or 2, wherein the frame is made of a resin member having tack force.

4. A cleaning method for a processing apparatus according to any one of claims 1 to 3, characterized in that negative pressure is applied to the mounting surface of the holding table to bring the resin member having tack force, which is placed on the holding table, into close contact with the mounting surface.

5. The resin member having the tack force is integrated with one side of the plate-like object. The cleaning method for the processing apparatus according to claim 1, characterized in that the holding portion of the transport unit holds one side of the plate-shaped object which is integrated with the resin member having tack force.

6. The cleaning method for an apparatus according to any one of claims 1 to 5, characterized in that the resin member having tackiness contains a metal-capturing group.

Images