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Abstract

To provide a housing which inhibits a member for fixing a heat sink to the housing from protruding to the outer side of the housing while securing a contact area between the heat sink and the housing.SOLUTION: A housing according to an embodiment houses a substrate. The housing includes a contact part and a drawing part. The contact part contacts with a heat sink which contacts with an element provided at the substrate. The drawing part is provided so as to protrude inward from the housing and contacts with the contact part.SELECTED DRAWING: Figure 2

Description

Technical Field

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[0001] The present invention relates to a housing for accommodating a substrate.

Background Art

[0002] Conventionally, there is known a housing in which heat generated by elements of a substrate is transmitted by a heat sink (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above prior art, the heat sink is fixed to the housing by screws, and the screws protrude outside the side surface of the housing.

[0005] The present invention has been made in view of the above, and an object thereof is to provide a housing that suppresses protrusion of a member for fixing a heat sink and a housing outside the housing while ensuring a contact area between the heat sink and the housing.

Means for Solving the Problems

[0006] A housing according to one aspect of an embodiment is a housing for accommodating a substrate. The housing includes a contact portion and a constriction portion. The contact portion abuts on a heat sink that contacts an element provided on the substrate. The constriction portion is provided so as to face inward from the housing and is connected to the contact portion.

Effects of the Invention

[0007] According to one aspect of the embodiment, it is possible to suppress protrusion of a member for fixing a heat sink and a housing outside the housing while ensuring a contact area between the heat sink and the housing. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view showing a part of the housing according to the first embodiment. [Figure 2] Figure 2 is a schematic diagram showing a cross-section of the housing according to the first embodiment. [Figure 3] Figure 3 is a schematic diagram showing a cross-section of a modified housing according to the first embodiment. [Figure 4] Figure 4 is a schematic diagram showing a cross-section of the housing according to the second embodiment. [Figure 5] Figure 5 is a view of a part of the housing according to the third embodiment, seen from the outside. [Figure 6] Figure 6 is a schematic diagram of the VI-VI section in Figure 5. [Figure 7] Figure 7 is a view of a part of the housing according to the third embodiment, seen from the inside. [Figure 8] Figure 8 is a schematic diagram of the section VIII-VIII in Figure 7. [Figure 9] Figure 9 is a view of a part of the housing according to the fourth embodiment, seen from the inside. [Figure 10] Figure 10 is a schematic diagram of the XX cross-section in Figure 9. [Modes for carrying out the invention]

[0009] The housing according to this embodiment will be described in detail below with reference to the attached drawings. However, this embodiment does not limit the present invention.

[0010] (First Embodiment) The housing 1 according to the first embodiment will be described with reference to Figures 1 and 2. Figure 1 is a perspective view showing a part of the housing 1 according to the first embodiment. Figure 2 is a schematic diagram showing a cross-section of the housing 1 according to the first embodiment.

[0011] The enclosure 1 houses, for example, equipment mounted in a vehicle. Examples of vehicle-mounted equipment include a dashcam and an audio system. The enclosure 1 is not limited to housing equipment mounted in a vehicle. The enclosure 1 is made of metal. The enclosure 1 houses a circuit board 2. The circuit board 2 includes components 2a. Components 2a include heat-generating components. Components 2a include, for example, a CPU.

[0012] The substrate 2 is held in the housing 1 by the holder 3. Heat generated by the element 2a is transferred to the housing 1 via the heat sink 4. The housing 1 dissipates the heat generated by the element 2a and transferred via the heat sink 4. The heat sink 4 is, for example, a metal plate. This cools the element 2a and suppresses the temperature rise of the element 2a. The heat sink 4 has a bent portion 4a.

[0013] The housing 1 comprises a contact portion 10 and an aperture portion 11. The contact portion 10 and the aperture portion 11 are provided on the side surface 1a of the housing 1. The side surface 1a of the housing 1 includes the top surface and the bottom surface of the housing 1. In other words, the side surface 1a of the housing 1 is the outer wall surface of the housing 1.

[0014] The contact portion 10 and the diaphragm portion 11 are formed by processing a part of the housing 1. The contact portion 10 and the diaphragm portion 11 are formed by processing a part of the side surface 1a of the housing 1. The contact portion 10 and the diaphragm portion 11 are formed by performing a drawing process on a part of the side surface 1a of the housing 1. The contact portion 10 and the diaphragm portion 11 are formed by performing a drawing process on a part of the side surface 1a of the housing 1 so that it protrudes inward. The contact portion 10 and the diaphragm portion 11 are formed integrally with the side surface 1a of the housing 1.

[0015] The contact portion 10 is parallel to the side surface 1a of the housing 1. Here, "parallel" includes a completely parallel state and a state that can be regarded as parallel. That is, "parallel" includes a state substantially parallel to the side surface 1a of the housing 1. The contact portion 10 may be inclined with respect to the side surface 1a of the housing 1. The contact portion 10 contacts the bent portion 4a of the heat sink 4. Specifically, the outer surface of the contact portion 10 contacts the inner surface of the heat sink 4.

[0016] A cylindrical portion 10a is provided in the contact portion 10. For example, the cylindrical portion 10a is formed by performing a flanging process on the contact portion 10. A screw hole 10b is formed at a location where the cylindrical portion 10a is provided in the contact portion 10. The inner peripheral wall of the cylindrical portion 10a forms the screw hole 10b. A screw groove is formed in the screw hole 10b. The contact portion 10 and the bent portion 4a are fixed by a screw 12.

[0017] The constriction portion 11 is provided so as to face inward from the housing 1. The constriction portion 11 is formed so as to extend inward from the side surface 1a of the housing 1. The constriction portion 11 is connected to the contact portion 10. The constriction portion 11 connects the side surface 1a of the housing 1 and the contact portion 10. The constriction portion 11 is provided around the contact portion 10. The constriction portion 11 is provided, for example, so as to be connected to the contact portion 10 in three directions (in FIGS. 1 and 2, downward and left and right directions). An insertion hole 11a is formed in the constriction portion 11. The insertion hole 11a is formed, for example, on one side (upward in FIGS. 1 and 2) with respect to the contact portion 10. The bent portion 4a of the heat sink 4 is inserted into the insertion hole 11a. The insertion hole 11a may be formed, for example, in a part of the constriction portion 11 on one side with respect to the contact portion 10. Note that the position where the insertion hole 11a is formed is not limited to the positions shown in FIGS. 1 and 2. For example, the insertion hole 11a may be formed in the constriction portion 11 in the left and right directions.

[0018] The heat generated by the element 2a on the substrate 2 is transmitted to the heat sink 4. The heat transmitted to the heat sink 4 is transmitted to the contact portion 10. The heat transmitted to the contact portion 10 is transmitted to the side surface 1a of the housing 1 through the throttle portion 11. Thus, the heat generated by the element 2a on the substrate 2 is transmitted to the side surface 1a of the housing 1 through the heat sink 4, the contact portion 10, and the throttle portion 11, and is dissipated by the housing 1.

[0019] Since the throttle portion 11 is formed around the contact portion 10, an increase in the hole communicating the inside and the outside of the housing 1 is suppressed. Therefore, a decrease in the EMC (Electromagnetic Compatibility) performance in the housing 1 is suppressed.

[0020] The housing 1 houses the substrate 2. The housing 1 includes a contact portion 10 and a throttle portion 11. The contact portion 10 contacts the heat sink 4 that contacts the element 2a provided on the substrate 2. The throttle portion 11 is provided so as to face inward from the housing 1 and is connected to the contact portion 10.

[0021] Thereby, when the contact portion 10 and the bent portion 4a of the heat sink 4 are fixed by the screw 12, it is suppressed that the screw 12 protrudes outside the side surface 1a of the housing 1. Further, the housing 1 can transmit the heat transmitted from the bent portion 4a of the heat sink 4 to the side surface 1a of the housing 1 through the throttle portion 11. Therefore, the housing 1 can secure the contact area between the heat sink 4 and the housing 1 and increase the amount of heat transfer per unit time transmitted to the side surface 1a of the housing 1. Therefore, the housing 1 can suppress the temperature rise of the element 2a of the substrate 2. That is, the housing 1 can improve the heat dissipation property in the housing 1.

[0022] The throttle portion 11 is formed by subjecting a part of the housing 1 to a throttling process.

[0023] As a result, the housing 1 can transfer heat from the constricted portion 11 to the side surface 1a of the housing 1 through a single component. Therefore, the housing 1 can increase the amount of heat transferred per unit time to the side surface 1a of the housing 1. Consequently, the housing 1 can suppress the temperature rise of the element 2a of the substrate 2.

[0024] The contact portion 10 is integrally formed with the housing 1. This allows the housing 1 to transfer heat from the contact portion 10 to the constricted portion 11 and to the side surface 1a of the housing 1 through a single component. As a result, the housing 1 can increase the amount of heat transferred per unit time to the side surface 1a of the housing 1. Consequently, the housing 1 can suppress the temperature rise of the element 2a on the substrate 2.

[0025] For example, if the contact portion is positioned perpendicular to the side of the housing, the hole formed in the side of the housing will be larger. When the hole formed in the side of the housing is large, the EMC performance of the housing deteriorates.

[0026] The contact portion 10 according to this embodiment is parallel to the side surface 1a of the housing 1. This prevents the hole formed in the side surface 1a of the housing 1 from becoming larger. Therefore, the housing 1 can improve its EMC performance.

[0027] The constricted portion 11 is provided around the contact portion 10. The heat sink 4 has a bent portion 4a. An insertion hole 11a is formed in the constricted portion 11. The bent portion 4a is inserted into the insertion hole 11a.

[0028] As a result, the enclosure 1 can suppress the enlargement of the holes formed in the enclosure 1. Therefore, the enclosure 1 can improve its EMC performance.

[0029] The contact portion 10 and the bent portion 4a are fixed by a screw 12. The contact portion 10 includes a cylindrical portion 10a into which the screw 12 is inserted.

[0030] This allows the housing 1 to increase the length of the screw hole 10b into which the screw 12 is inserted. For example, the housing 1 can increase the length of the screw hole 10b into which the screw groove is formed. As a result, the housing 1 can be fixed with the screw 12 while ensuring that the contact portion 10 and the bent portion 4a are in secure contact. Consequently, the housing 1 can reliably transfer heat from the bent portion 4a to the contact portion 10.

[0031] Note that the contact portion 10 is not limited to the shape described above, and may have a shape as shown in Figure 3. Figure 3 is a schematic diagram showing a cross-section of a housing 100 according to a modified example of the first embodiment. The contact portion 101 is formed by bending the tip side so that the cross-sectional shape is L-shaped. The contact portion 101 is formed so that the tip side faces the inside of the housing 100. A cylindrical portion 101a is provided on the tip side of the contact portion 101. The contact portion 101 and the heat sink 103 are fixed together inside the housing 100 by screws 104. The heat sink 103 may be formed in an L-shape to match the shape of the contact portion 101.

[0032] (Second Embodiment) The housing 20 according to the second embodiment will be described with reference to Figure 4. Figure 4 is a schematic diagram showing a cross-section of the housing 20 according to the second embodiment. The following describes configurations that differ from the first embodiment. Components that are the same as in the first embodiment are denoted by the same reference numerals as in the first embodiment, and detailed descriptions are omitted.

[0033] The housing 20 according to the second embodiment includes a plurality of contact portions 10 and a plurality of aperture portions 11. For example, the housing 20 includes two contact portions 10 and two aperture portions 11.

[0034] For example, the two contact portions 10 and the two aperture portions 11 are provided on opposite sides 20a and 20b of the housing 20. However, the number of sides on which the two contact portions 10 and the two aperture portions 11 are provided is not limited to these. For example, the sides on which the two contact portions 10 and the two aperture portions 11 are provided may be two orthogonal sides.

[0035] The housing 20 may also be provided with three or more contact portions 10 and three or more aperture portions 11. The sides on which the three or more contact portions 10 and three or more aperture portions 11 are provided may be three or more sides. Multiple contact portions 10 and multiple aperture portions 11 may be provided on a single side.

[0036] The heat sink 4 is provided with multiple bent portions 4a and 4b. The bent portions 4a and 4b abut against the contact portion 10. The bent portion 4a and the contact portion 10 are fixed together by a screw 12a. The bent portion 4b and the contact portion 10 are fixed together by a screw 12b.

[0037] Multiple contact portions 10 and aperture portions 11 are provided. The housing 20 can transfer the heat generated by the elements 2a on the substrate 2 to the sides 20a and 20b of the housing 20 through the multiple contact portions 10 and aperture portions 11. Therefore, the housing 20 can suppress the temperature rise of the elements 2a on the substrate 2.

[0038] (Third embodiment) The housing 30 according to the third embodiment will be described with reference to Figures 5 to 8. Figure 5 is a view of a part of the housing 30 according to the third embodiment from the outside. Figure 6 is a schematic diagram of the cross section VI-VI in Figure 5. Figure 7 is a view of a part of the housing 30 according to the third embodiment from the inside. Figure 8 is a schematic diagram of the cross section VIII-VIII in Figure 7. The following describes configurations that differ from the first embodiment. Components that are the same as in the first embodiment are denoted by the same reference numerals as in the first embodiment, and detailed explanations are omitted.

[0039] The housing 30 comprises a contact portion 31, a constricted portion 32, and a heat transfer member 33. The contact portion 31 and the constricted portion 32 are formed, for example, by forming a U-shaped hole 34 in a part of the side surface 30a of the housing 30, and then drawing the side surface 30a of the housing 30 surrounded by the U-shaped hole 34. A screw hole is formed in the contact portion 31 into which a screw 35 is inserted. The inner surface of the contact portion 31 contacts the outer surface of the bent portion 4a.

[0040] The heat transfer member 33 faces the contact portion 31 with the bent portion 4a in between, and is fixed to the side surface 30a of the housing 30. The heat transfer member 33 is made of metal. The heat transfer member 33 is formed by bending or other processes on a metal plate-shaped member. The heat transfer member 33 includes a clamping portion 36, a guide portion 37, a fixing portion 38, and a connecting portion 39.

[0041] The clamping portion 36 is located inside the housing 30, beyond the bending portion 4a. The clamping portion 36 is positioned so that it faces the contact portion 31. The bending portion 4a is inserted between the clamping portion 36 and the contact portion 31. The outer surface of the clamping portion 36 contacts the inner surface of the bending portion 4a.

[0042] A cylindrical portion 36a is provided in the clamping portion 36. For example, the cylindrical portion 36a is formed by burring the clamping portion 36. A screw hole 36b is formed in the clamping portion 36 where the cylindrical portion 36a is provided. The inner circumferential wall of the cylindrical portion 36a forms the screw hole 36b. A screw groove is formed in the screw hole 36b. The clamping portion 36, the bent portion 4a, and the contact portion 31 are fixed by screws 35. The clamping portion 36 is provided so as to cover a U-shaped hole 34 formed in the side surface 30a of the housing 30. The clamping portion 36 is provided so as to cover at least a part of the hole 34.

[0043] The guide portion 37 is provided at one end of the clamping portion 36. The guide portion 37 is formed to incline inward of the housing 30 from the base end side connected to the clamping portion 36 to the tip end side. The guide portion 37 guides the bent portion 4a between the clamping portion 36 and the contact portion 31 when the bent portion 4a is inserted between the clamping portion 36 and the contact portion 31. The constricting portion 32 is formed opposite the guide portion 37, and the constricting portion 32 guides the bent portion 4a between the clamping portion 36 and the contact portion 31 when the bent portion 4a is inserted.

[0044] The fixing portion 38 is provided on both ends in a direction perpendicular to the direction in which the bent portion 4a is inserted between the clamping portion 36 and the contact portion 31. That is, a pair of fixing portions 38 are provided relative to the clamping portion 36. The fixing portion 38 is provided on the side surface 30a of the housing 30, closer to the clamping portion 36. The fixing portion 38 contacts the side surface 30a of the housing 30. A hole is formed in the fixing portion 38. A cylindrical portion 30b provided in the housing 30 is inserted into the hole. The cylindrical portion 30b is formed by burring a part of the housing 30. The fixing portion 38 is fixed to the housing 30 by crimping the cylindrical portion 30b inserted into the hole.

[0045] The connecting portion 39 connects the fixing portion 38 and the clamping portion 36. The connecting portion 39 extends from the end of the fixing portion 38 into the inside of the housing 30. The end of the connecting portion 39 inside the housing 30 connects to the clamping portion 36.

[0046] The heat transferred to the heat sink 4 is transferred to the contact portion 31 and the clamping portion 36. The heat transferred to the contact portion 31 is transferred to the side surface 30a of the housing 30 via the constricted portion 32. The heat transferred to the clamping portion 36 is transferred to the side surface 30a of the housing 30 via the connecting portion 39 and the fixing portion 38. The heat transferred to the heat sink 4 is transferred to the side surface 30a of the housing 30 via the contact portion 31 and the clamping portion 36 that clamp the heat sink 4. In other words, the housing 30 dissipates the heat transferred to the heat sink 4 from both sides of the heat sink 4 by the contact portion 31 and the heat transfer member 33.

[0047] The housing 30 includes a heat transfer member 33. The heat transfer member 33 faces the contact portion 31 with the bent portion 4a in between, and is fixed to the side surface 1a of the housing 30. The heat transfer member 33 contacts the bent portion 4a.

[0048] As a result, the housing 30 can transfer heat to the housing 30 from both sides of the bent portion 4a via the contact portion 31 and the heat transfer member 33, and dissipate heat from both sides of the heat sink 4. Therefore, the housing 30 can increase the amount of heat transferred per unit time to the side surface 30a of the housing 30. Consequently, the housing 30 can suppress the temperature rise of the element 2a of the substrate 2.

[0049] The contact portion 31, the bent portion 4a, and the heat transfer member 33 are fixed by screws 35. The heat transfer member 33 includes a cylindrical portion 36a into which the screws 35 are inserted.

[0050] This allows the housing 30 to increase the length of the screw hole 36b into which the screw 35 is inserted. For example, the housing 30 can increase the length of the screw hole 36b into which the screw groove is formed. As a result, the housing 30 can be fixed with the screw 35 while ensuring that the bent portion 4a is in secure contact with the contact portion 31 and the heat transfer member 33. Therefore, the housing 30 can reliably transfer heat from the bent portion 4a to the contact portion 31 and the heat transfer member 33.

[0051] The heat transfer member 33 is provided so as to cover the hole 34 formed in the side surface 30a of the housing 30. This allows the housing 30 to improve its EMC performance.

[0052] (Fourth Embodiment) The housing 50 according to the fourth embodiment will be described with reference to Figures 9 and 10. Figure 9 is a view of a part of the housing 50 according to the fourth embodiment from the inside. Figure 10 is a schematic diagram of the XX cross-section of Figure 9. The following describes configurations that differ from the first or third embodiment. Configurations that are the same as those in the first or third embodiment are denoted by the same reference numerals as in the first or third embodiment, and detailed descriptions are omitted.

[0053] A protruding portion 52 is provided on the contact portion 51 of the housing 50. The protruding portion 52 is provided on the surface facing the bent portion 4a. The protruding portion 52 protrudes toward the bent portion 4a. The protruding portion 52 comes into contact with the bent portion 4a. The protruding portion 52 biases the bent portion 4a toward the heat transfer member 60. That is, the bent portion 4a is held between the protruding portion 52 and the clamping portion 61 of the heat transfer member 60.

[0054] The housing 50 biases the bent portion 4a toward the heat transfer member 33 by the protruding portion 52, thereby allowing the bent portion 4a to come into contact with the heat transfer member 33 and the contact portion 51 without using screws, for example. For example, even if it is difficult to provide space on the side surface 50a of the housing 50 for fixing the contact portion 51, the bent portion 4a, and the clamping portion 61 with screws, the housing 50 can still bring the contact portion 51 and the clamping portion 61 into contact with the bent portion 4a. Furthermore, the housing 50 can stabilize its grounding by bringing the housing 50 into contact with the bent portion 4a of the heat sink 4 without using screws, for example. As a result, the housing 50 can improve its EMC performance.

[0055] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents. [Explanation of Symbols]

[0056] 1, 20, 30, 50, 100 units 1a, 20a, 20b, 30a, 50a side 2 circuit boards 2a element 4, 103 Heat sink 4a Bend part 10, 31, 51, 101 Contact part 11, 32 Aperture section 12, 12a, 12b, 35 screws 33, 60 Heat transfer components 36, 61 Clamping part 36a, 101a Cylindrical part 37 Guide Section 38 Fixed part 39 Connection part 52 Protrusion

Claims

1. A housing for a circuit board, A contact portion that contacts a heat sink that contacts an element provided on the substrate, A diaphragm is provided so as to extend inward from the housing and is connected to the contact portion. Equipped with, The aforementioned diaphragm is formed such that a part of the side surface of the housing protrudes inward. A housing in which a hole is formed in the aforementioned diaphragm portion.

2. The housing according to claim 1, wherein the contact portion is integrally formed with the housing.

3. A housing for housing a substrate, A contact portion that contacts a heat sink that contacts an element provided on the substrate, A diaphragm is provided so as to extend inward from the housing and is connected to the contact portion. Equipped with, The aforementioned diaphragm portion is provided around the aforementioned contact portion, The heat sink has a bent portion, The housing has an insertion hole formed in the constricted portion into which the bent portion is inserted.

4. A housing for housing a substrate, A contact portion that contacts a heat sink that contacts an element provided on the substrate, A diaphragm is provided so as to extend inward from the housing and is connected to the contact portion. Equipped with, The heat sink has a bent portion, The contact portion and the bent portion are fixed by screws. A housing in which the contact portion is provided with a cylindrical portion into which the screw is inserted.

5. The housing according to any one of claims 1 to 4, wherein a plurality of the contact portion and the diaphragm portion are provided.

6. A housing for housing a substrate, A contact portion that contacts a heat sink that contacts an element provided on the substrate, A diaphragm is provided so as to extend inward from the housing and is connected to the contact portion. Equipped with, The heat sink has a bent portion, The heat transfer member is provided, which faces the contact portion with the bent portion in between and is fixed to the housing, The heat transfer member is a housing that abuts against the bent portion.

7. The contact portion, the bent portion, and the heat transfer member are fixed by screws. The housing according to claim 6, wherein the heat transfer member is provided with a cylindrical portion into which the screw is inserted.

8. The housing according to claim 6, wherein the heat transfer member is provided so as to cover a hole formed in the housing.

9. The housing according to claim 6, wherein the contact portion includes a protruding portion that protrudes toward the bent portion and biases the bent portion toward the heat transfer member.

Images