Transfer device and transfer method

Abstract

The present invention is a transfer device for transferring an object provided on a starting substrate from the starting substrate to a destination substrate using a laser, the transfer device comprising: a laser light source configured to oscillate a laser; a first optical system; a second optical system having a different optical configuration from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system. The first optical system is configured to transfer the object to the destination substrate surface by sequentially irradiating the laser from the back side of the starting substrate, and the second optical system is configured to remove the object from the starting substrate or to transfer the object to the destination substrate surface by selectively irradiating the laser from the back side of the starting substrate. This makes is possible to provide a transfer device that can transfer the object with a minimal footprint and capital investment, and with high productivity.

Description

[Technical Field]

[0001] The present invention relates to a transfer device and a transfer method. [Background technology]

[0002] With the practical application of high-brightness blue light-emitting diodes (LEDs), all three primary colors of light are now available, and light-emitting diodes are being used in a wide variety of fields. Their applications are too numerous to list, ranging from displays and monitors for televisions and personal computers to large displays such as digital signage on street corners and large screens at live music venues, as well as small displays such as those for smartwatches.

[0003] In the mass production process of displays, a technique is used to transfer LED chips formed on a starting substrate to a circuit board. Figures 12 to 14 show a part of an example of the manufacturing flow of an LED chip-mounted device, including the transfer process. However, the manufacturing flow to which the transfer apparatus and transfer method of the present invention are applied is not limited to the manufacturing flow shown in Figures 12 to 14.

[0004] First, as shown in Figure 12(a), a sapphire substrate 110 is prepared as the starting substrate. Multiple LED chips 6, which are the objects to be transferred, are placed on the surface of the sapphire substrate 110.

[0005] If a defective LED chip 6D is included among the multiple LED chips 6, as shown in Figure 12(b), a laser L that penetrates the sapphire substrate 110 will be applied to the interface between the defective LED chip 6D and the sapphire substrate 110. T The laser light source 3 irradiates the back surface of the sapphire substrate 110 (the back surface relative to the surface on which the LED chip 6 is installed) to detect the defective LED chip 6. D The LED chips are peeled off and removed from the sapphire substrate 110. This process can be called, for example, a trimming process. Note that if there are no defective LED chips 6D, this trimming process can be omitted.

[0006] Next, the first intermediate substrate 210, which is the target substrate as shown in Figure 12(c), is prepared. The first intermediate substrate 210 has an adhesive layer 211 on its surface. The first intermediate substrate 210 and the sapphire substrate 110, which has undergone a trimming process as necessary, are placed facing each other so that the LED chip 6 and the adhesive layer 211 are facing each other. In this state, a laser L is directed from the laser light source 3 towards the back surface of the sapphire substrate 110. L The laser is used to irradiate the sapphire substrate 110 and the first intermediate substrate 210. This allows for sequential irradiation of multiple LED chips 6. As a result, multiple LED chips 6 are irradiated from the sapphire substrate 110 to the first intermediate substrate 210 by the laser L L It is transported by [a specific method]. This process can be called, for example, a laser lift-off process.

[0007] Ga may remain on the surface of each of the multiple LED chips 6 that have been transferred to the first intermediate substrate 210. Therefore, as shown in Figure 12(d), cleaning is performed. tank Perform Ga washing in 60°C.

[0008] Next, a second intermediate substrate (release substrate) 120 is prepared, as shown in the lower right of Figure 13(e). The second intermediate substrate 120 has an adhesive layer 121 on its surface. The first intermediate substrate 210 and the second intermediate substrate 120 are bonded together to form a composite 300, such that multiple LED chips 6 are in contact with the adhesive layer 121 of the second intermediate substrate 120. This composite 300 is then pressed vertically in the transfer device 20 shown in the upper left of Figure 13(e). Next, as shown in the lower right of Figure 13(e), the first intermediate substrate 210 is peeled off while the second intermediate substrate 120 is held down by the restraining device 30. This completes the transfer of the LED chips 6 from the first intermediate substrate 210 to the second intermediate substrate 120. This process can be called the chip transfer process.

[0009] If there are defective LED chips 6D among the LED chips 6 transferred onto the second intermediate substrate 120, the defective LED chips 6D are removed as shown in Figure 13(f). This process can be carried out in the same manner as the trimming process shown in Figure 12(b). Therefore, this process can also be called a trimming process. If there are no defective LED chips 6D on the second intermediate substrate 120, this trimming process can, of course, be omitted.

[0010] Next, as shown in Figure 13(g), the LED chip 6 on the second intermediate substrate 120, which serves as the starting substrate, is transferred to the finished substrate 220 (which has an adhesive layer 221 on its surface) as the target substrate using a laser L M It is transported using [a specific method / tool]. This process can also be called a transfer process.

[0011] The completed substrate 220 may be wafer-shaped, as shown in the lower left of Figure 13(g), or rectangular, as shown in the lower right. In this transfer process, multiple LED chips 6 can be transferred at various pitches.

[0012] If there are missing LED chips 6 in the finished substrate 220 obtained after the transfer process (for example, in the area where LED chips 6 removed in the trimming process were to be transferred), see Figure 13. 14 As shown in (h), replacement chips 6R can be used to replenish the missing LED chips on the finished substrate 220, which is the target substrate, from the repair substrate 130, which is the starting substrate and is equipped with normal replacement chips 6R. This process can also be called a repair process.

[0013] Next, as shown in Figure 14(i), multiple LED chips 6 are transferred at once from the completed substrate 220 obtained as described above to the circuit board 230 using a mounter 400.

[0014] Then, as shown in Figure 14(j), by subjecting the circuit board 230 to a reflow process in the reflow apparatus 40, electrode bonding can be performed between the circuit of the circuit board 230 and the multiple LED chips 6.

[0015] In the trimming process, laser lift-off process, and repair process, the starting substrate and the LED chip are separated by irradiating a part of the LED chip with a laser for ablation or irradiating the interface between the starting substrate and the LED chip with a laser to ablate the adhesive layer. For example, Patent Document 1 describes using a line beam during multiple chip transfers. Further, Patent Document 2 discloses a technique of irradiating a specific irradiation object with laser light using a galvanometer scanner in a re-transfer method and a lift-off method.

Prior Art Documents

Patent Documents

[0016]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0017] Conventionally, the trimming process, laser lift-off process, transfer process, and repair process each had to be performed using different laser devices. This was because the beam energy and beam shape of the laser to be irradiated, as well as the laser irradiation method, were different for each process.

[0018] Laser devices are generally large-scale and expensive. Therefore, in the conventional manufacturing of LED-mounted devices in the above flow, a large footprint and a large amount of equipment investment were required for the equipment for transferring the LED chips.

[0019] Also, when moving one workpiece between multiple laser devices, removal and attachment of the substrate and alignment adjustment of the optical system are required each time, resulting in a decrease in productivity.

[0020] The present invention was made to solve the above problems and aims to provide a transfer device and transfer method that can transfer objects with minimal footprint and capital investment, and with high productivity. [Means for solving the problem]

[0021] To solve the above problems, the present invention, in a first aspect, provides a transfer device for transferring an object placed on a starting substrate from the starting substrate to a target substrate using a laser, A laser light source configured to oscillate the aforementioned laser, The first optical system, A second optical system having an optical configuration different from that of the first optical system, A switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system, It is equipped with, The first optical system is configured to transfer the object to the target substrate surface by sequentially irradiating the starting substrate with the laser from the back side, The present invention provides a transfer device in which the second optical system is configured to remove the object from the starting substrate or transfer the object to the target substrate surface by selectively irradiating the starting substrate with the laser from the back side of the starting substrate.

[0022] With this type of transfer device, all or part of the trimming, laser lift-off, transfer, and repair processes can be performed in a single device. Therefore, for laser processing processes performed on the same starting substrate, removal and installation of the starting substrate and alignment adjustment, i.e., setup changes, are unnecessary, enabling high productivity in the transfer of the object. Furthermore, since all or part of the trimming, laser lift-off, transfer, and repair processes can be performed with a single transfer device, both the footprint and capital investment can be reduced.

[0023] Furthermore, in a second aspect of the present invention, a transfer device for transferring an object placed on a starting substrate from the starting substrate to a target substrate using a laser, A laser light source configured to oscillate the aforementioned laser, The first optical system, A second optical system having an optical configuration different from that of the first optical system, A switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system, It is equipped with, The first optical system is configured to simultaneously transfer multiple objects to the target substrate surface by simultaneously irradiating them with the laser from the back side of the starting substrate. The present invention provides a transfer device in which the second optical system is configured to remove one object from the starting substrate or transfer one object to the target substrate surface by irradiating one object with the laser from the back side of the starting substrate.

[0024] In this configuration of the transfer device, all or part of the trimming process, laser lift-off process, transfer process, and repair process can be performed in a single device. Therefore, both footprint and capital investment can be reduced. Furthermore, for laser processing processes performed on the same starting substrate, at least substrate setup changes are unnecessary, enabling high productivity in the transfer of objects.

[0025] For example, the switching mechanism may include a mirror.

[0026] In either of the first and second embodiments described above, the switching mechanism may include, for example, a mirror.

[0027] Furthermore, the switching mechanism is A first stage configured to at least hold the starting substrate, A moving mechanism configured to move the first stage between the first optical system and the second optical system in accordance with the change in the optical path of the laser, It may also be equipped with

[0028] With such a switching mechanism, the laser transfer process using the same starting substrate in both the first and second optical systems can be performed without removing and reattaching the substrate, thereby increasing productivity.

[0029] Alternatively, a first stage configured to hold the starting substrate, A second stage configured to hold a target substrate opposite the first stage, A projection lens configured to focus the aforementioned laser, It further comprises, The switching mechanism may also include a moving mechanism configured to move the first stage, the second stage, and the projection lens between the first optical system and the second optical system in accordance with the change in the optical path of the laser.

[0030] Even with these modified examples, the transfer process using the same starting substrate in both the first and second optical systems can be performed without changing the starting substrate setup, thereby increasing productivity.

[0031] Furthermore, the irradiation shape of the laser is set to a line beam and irradiated onto multiple objects. molding patterns and A pattern that shapes the laser irradiation shape so as to irradiate one of the target objects. The mask may further include the following:

[0032] With such a device, for example, the laser lift-off and transfer processes can be performed using a line beam in the first optical system, and the trimming and repair processes can be performed by irradiating a single object with a laser in the second optical system.

[0033] For example, the second optical system may include a galvanoscanner as a means for selectively irradiating the starting substrate or the object supported on the starting substrate with the laser, or for selectively irradiating the starting substrate or the object with the laser from the back side of the starting substrate.

[0034] The second optical system may include, for example, a galvanometer scanner.

[0035] Alternatively, the first optical system further comprises a mask having a pattern that shapes the irradiation shape of the laser into a line beam so as to irradiate multiple objects simultaneously. The second optical system may further include a mask having a pattern that shapes the laser irradiation shape to irradiate each object in a shape individually corresponding to that shape.

[0036] Thus, the first optical system and the second optical system may each be equipped with a mask.

[0037] Furthermore, the present invention provides a transfer method for transferring multiple objects from a starting substrate to a target substrate using a laser, A starting substrate preparation step for preparing a starting substrate equipped with the aforementioned plurality of objects, A target substrate preparation step in which the target substrate to which the aforementioned multiple objects are to be transferred is prepared, A device preparation step of preparing a transfer device comprising a laser light source configured to oscillate the aforementioned laser, a first optical system and a second optical system, A trimming step in which it is determined in advance whether or not defective objects are included among the plurality of objects on the starting substrate, and if defective objects are included, the defective objects are selectively removed by the laser passed through the second optical system, A transfer process in which the plurality of objects are transferred from the starting substrate to the target substrate by the laser through the first optical system, Includes, The present invention provides a transfer method that performs the trimming process and the transfer process in a series of operations without changing the setup of the starting substrate.

[0038] This transfer method allows the trimming and transfer processes to be performed consistently in a single transfer device. Therefore, for laser transfer processes performed on the same starting substrate, substrate removal and installation are unnecessary, enabling highly productive transfer of the object. Furthermore, since this transfer method can be performed with a single device, both the footprint and capital investment can be reduced.

[0039] The transfer method of the present invention may further include, for example, a repair step in which, after the transfer step in which the plurality of objects are transferred from the starting substrate to the target substrate by the laser through the first optical system, the laser is selectively irradiated onto the objects on the starting substrate by the laser through the second optical system to transfer the objects to the locations where they are missing, and the transfer step from the transfer step to the repair step can be performed in a series of operations without changing the setup of the starting substrate.

[0040] Thus, the transfer method of the present invention can further include a repair step, and even with the repair step included, it can be performed with a single device.

[0041] For example, the transfer process is A laser lift-off process is performed in which the object is transferred from the starting substrate to a first intermediate substrate placed on a second stage, which is the target substrate, by irradiating the object with the laser through the substrate of a chip supply substrate on which the object is formed on the substrate surface placed on a first stage, which is the starting substrate, thereby decomposing a part of the object, and A transfer process in which the object is transferred from the second intermediate substrate to the finished substrate placed on the second stage, which is the target substrate, by irradiating the adhesive layer formed between the second intermediate substrate and the object with the laser through the second intermediate substrate placed on the first stage, which is the starting substrate, thereby ablating the adhesive layer. It can include, The second intermediate substrate includes the adhesive layer, The transfer method of the present invention may further include a step of transferring the object from the first intermediate substrate to the second intermediate substrate between the laser lift-off step and the transfer step.

[0042] In the transfer method of the present invention, the transfer step may further include the transfer step and the handover step. [Effects of the Invention]

[0043] As described above, with the transfer device of the present invention, in either the first or second embodiment, all or part of the trimming process, laser lift-off process, transfer process, and repair process can be performed consistently in a single transfer device, and as a result, the object can be transferred with high productivity. Furthermore, since all or part of the trimming process, laser lift-off process, transfer process, and repair process can be performed in a single transfer device of the present invention, both the footprint and capital investment can be reduced.

[0044] Furthermore, with the transfer method of the present invention, the trimming process and the transfer process can be performed consistently in a single transfer device. Therefore, with the transfer method of the present invention, objects can be transferred with high productivity. In addition, since it can be done with a single device, both the footprint and capital investment can be reduced. [Brief explanation of the drawing]

[0045] [Figure 1] This is a schematic diagram showing an example of the transfer device of the present invention. [Figure 2] This figure illustrates an example of a first optical system in a first embodiment of the transfer device of the present invention. [Figure 3] This figure illustrates an example of the first optical system in a second embodiment of the transfer device of the present invention. [Figure 4] This figure illustrates another example of the first optical system in a second embodiment of the transfer device of the present invention. [Figure 5] This figure illustrates an example of a second optical system in a first embodiment of the transfer device of the present invention. [Figure 6] This is another figure illustrating an example of a second optical system in a first embodiment of the transfer device of the present invention. [Figure 7] This is a schematic diagram showing another example of the transfer device of the present invention. [Figure 8] This is a schematic diagram showing another example of the transfer device of the present invention. [Figure 9] This figure illustrates the alignment during the gap laser lift-off process, transfer process, and repair process that can be performed with the transfer device of the present invention. [Figure 10] This figure illustrates the alignment during the trimming process that can be performed with the transfer device of the present invention. [Figure 11] This figure illustrates the alignment in the contact laser lift-off process that can be performed with the transfer device of the present invention. [Figure 12] This is a portion of the manufacturing flow diagram for an example of a device equipped with an LED chip. [Figure 13]Figure 12 is a partial manufacturing flow diagram of an example of an LED chip-equipped device. [Figure 14] Figure 13 is a continuation of a manufacturing flow diagram of an example of an LED chip-equipped device. [Modes for carrying out the invention]

[0046] As mentioned above, there was a need to develop a transfer device and transfer method that could transport objects with a minimal footprint and capital investment, as well as with high productivity.

[0047] As a result of diligent research into the above-mentioned problems, the inventors of the present invention have found that if the laser lift-off process and the transfer process are performed in the same first optical system, and the trimming process and the repair process are performed in the same second optical system, and if the transfer device is equipped with the first optical system, the second optical system, and a switching mechanism configured to switch the optical path of the laser from the laser light source between the optical path to the first optical system and the optical path to the second optical system, then the object can be transferred with minimal footprint and capital investment, and with high productivity, and thus the present invention has been completed.

[0048] In other words, the present invention is a transfer device for transferring an object placed on a starting substrate from the starting substrate to a target substrate using a laser, A laser light source configured to oscillate the aforementioned laser, The first optical system, A second optical system having an optical configuration different from that of the first optical system, A switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system, It is equipped with, The first optical system is configured to transfer the object to the target substrate surface by sequentially irradiating the starting substrate with the laser from the back side, The second optical system is a transfer device configured to remove the object from the starting substrate or transfer the object to the target substrate surface by selectively irradiating the starting substrate with the laser from the back side of the starting substrate.

[0049] Furthermore, the present invention relates to a transfer device for transferring an object placed on a starting substrate from the starting substrate to a target substrate using a laser, A laser light source configured to oscillate the aforementioned laser, The first optical system, A second optical system having an optical configuration different from that of the first optical system, A switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system, It is equipped with, The first optical system is configured to simultaneously transfer multiple objects to the target substrate surface by simultaneously irradiating them with the laser from the back side of the starting substrate. The second optical system is a transfer device configured to remove one object from the starting substrate or transfer one object to the target substrate surface by irradiating one object with the laser from the back side of the starting substrate.

[0050] Furthermore, the present invention relates to a transfer method for transferring multiple objects from a starting substrate to a target substrate using a laser, A starting substrate preparation step for preparing a starting substrate equipped with the aforementioned plurality of objects, A target substrate preparation step in which the target substrate to which the aforementioned multiple objects are to be transferred is prepared, A device preparation step of preparing a transfer device comprising a laser light source configured to oscillate the aforementioned laser, a first optical system and a second optical system, A trimming step in which it is determined in advance whether or not defective objects are included among the plurality of objects on the starting substrate, and if defective objects are included, the defective objects are selectively removed by the laser passed through the second optical system, A transfer process in which the plurality of objects are transferred from the starting substrate to the target substrate by the laser through the first optical system, Includes, This is a transfer method in which the trimming process and the transfer process are performed in a series of operations without changing the setup of the starting substrate.

[0051] The present invention will be described in detail below, but the present invention is not limited to these descriptions.

[0052] [Transfer device] Figure 1 schematically shows an example of the transfer device of the present invention. The transfer device 10 shown in Figure 1 is a transfer device for transferring an object placed on a starting substrate from the starting substrate to a target substrate using a laser.

[0053] The transfer device 10 comprises a laser light source 3, a first optical system 1, a second optical system 2, and a switching mechanism 4.

[0054] The laser light source 3 is configured to emit a laser. specific The embodiment is not particularly limited, but for example, it can be an excimer laser.

[0055] In the first embodiment, the first optical system 1 is, for example, as schematically shown in Figure 2, a laser L L The first optical system 1A is configured to transfer the object 6 to the target substrate 200 surface by sequentially irradiating the starting substrate 100 from the back side. The sequential irradiation is performed, for example, as shown in Figure 2, by irradiating the laser L from the laser light source 3. L The optical path of the laser L is directed to the object 6 formed on the starting substrate 100. LIt can be carried out by moving (scanning) so that they are sequentially irradiated. At this time, as shown in FIG. 2, the starting substrate 100 and the target substrate 200 can also be moved relative to the movement of the optical path. Further, as shown in FIG. 2, by making the moving speed of the starting substrate 100 different from the moving speed of the target substrate 200, the object 6 can be arranged on the target substrate 200 at a pitch different from the pitch of the object 6 provided on the starting substrate 100.

[0056] In the second aspect, the first optical system 1 is, for example, as schematically shown in FIGS. 3 and 4, a laser L L which is a first optical system 1A' configured to simultaneously transfer a plurality of objects 6 onto the surface of the target substrate 200 by simultaneously irradiating the plurality of objects 6 from the back side of the starting substrate 100. FIG. 3 is an example in which a laser L L having a linear irradiation shape irradiates a plurality of (1×m (m>2)) objects 6 arranged in a row, and FIG. 4 is an example in which a laser L L having a rectangular irradiation shape irradiates a plurality of (n×m (n>2, m>2)) objects 6 arranged in a plurality of rows and a plurality of columns. The irradiation shape can be appropriately changed by, for example, a mask described later.

[0057] In both the first aspect and the second aspect, in the first optical system 1, both the laser lift-off process and the transfer process described above can be performed.

[0058] The second optical system 2 shown in FIG. 1 has an optical configuration different from that of the first optical system.

[0059] In the first aspect, the second optical system 2 is, for example, as shown in FIG. 5 or FIG. 6, a laser L T ? or L R which is a second optical system 2B configured to selectively irradiate from the back side of the starting substrate 100, thereby removing an object (defective object) 6D from the starting substrate 100 (that is, performing a trimming process) as shown in FIG. 5, or transferring an object (replenishment chip) onto the surface of the target substrate 200 (that is, performing a repair process).

[0060] In a second aspect, which is a different facet, the laser L is shown, for example, in Figure 5 or Figure 6. T or L R The second optical system 2B' is configured to irradiate one object 6D or 6R from the back side of the starting substrate 100 to remove one object (defective object) 6D from the starting substrate 100 (i.e., perform a trimming process), or to transfer one object (replenishment chip) 6R to the surface of the target substrate 200.

[0061] The switching mechanism 4 shown in Figure 1 is configured to switch the laser's optical path L between the optical path L1 to the first optical system 1 and the optical path L2 to the second optical system 2.

[0062] In the example shown in Figure 1, the switching mechanism 4 comprises a controller 41 and a mirror 42 electrically connected to the controller 41. The controller 41 is configured to move the mirror 42 to switch the laser's optical path L between the optical path L1 to the first optical system 1 and the optical path L2 to the second optical system 2.

[0063] The transfer device 10 in the example shown in Figure 1 further includes an optional homogenizer 5. The homogenizer 5 is configured to homogenize the intensity distribution of the laser emitted from the laser light source 3.

[0064] The transport device 10 in the example shown in Figure 1 further includes a mirror M in addition to the mirror 42 of the switching mechanism 4. The multiple mirrors 42 and M play a role in aligning the optical path of the laser.

[0065] With the transfer device 10 of the present invention described above, the laser lift-off process and the transfer process can be performed in the same first optical system 1, and the trimming process and the repair process can be performed in the same second optical system 2. Furthermore, since the transfer device 10 is equipped with a switching mechanism 4 configured to switch the optical path L of the laser from the laser light source 3 between the optical path L1 to the first optical system 1 and the optical path L2 to the second optical system 2, the trimming process, laser lift-off process, transfer process and repair process can be performed with a single transfer device 10.

[0066] Furthermore, in conventional individual devices for each function, for example, after the trimming process, the starting substrate was temporarily removed, moved to a laser lift-off device, mounted, and the laser lift-off process was performed there. The same procedure was followed for the transfer process and the preceding trimming process. In this case, the starting substrate was temporarily removed from the trimming process, mounted to the laser lift-off device or transfer device, and after alignment to determine the object to be laser-irradiated, the laser lift-off process or transfer process was performed. This series of operations not only reduced productivity but also created the possibility of variations between processes depending on the accuracy of the alignment adjustment.

[0067] By using the transfer device 10 of the present invention, the laser lift-off process and the preceding trimming process, for which the starting substrate 100 is the same, can be performed in a series of operations by simply switching the optical path, without changing the setup of the starting substrate. Similarly, the transfer process and the preceding trimming process can also be performed in a series of operations by simply switching the optical path, without changing the setup of the starting substrate 100, since the starting substrate 100 is the same. Therefore, at least between the laser lift-off process and the preceding trimming process, and between the transfer process and the preceding trimming process, removal, movement, mounting, and alignment of the starting substrate 100 are unnecessary. As a result, a decrease in productivity can be suppressed, and variations between processes caused by the accuracy of alignment can be prevented.

[0068] Furthermore, the transfer device 10 of the present invention can perform functions that were previously performed by four devices with different laser beam energy densities, beam energy, beam shape, and irradiation methods, all in a single device. Moreover, it eliminates the need for multiple devices to each have their own laser light source, enabling efficient utilization of laser energy. As a result, the footprint and capital investment can be minimized.

[0069] In other words, with the transfer device 10 of the present invention, the object can be transferred with minimal footprint and capital investment, and with high productivity. 6 It can be transported.

[0070] Furthermore, maintenance costs can be reduced compared to using four separate devices.

[0071] Furthermore, the transfer device 10 of the present invention is not simply obtained by combining four conventional devices. Rather, the device configuration consists of a first optical system 1 capable of performing two processes, a laser lift-off process and a transfer process, and a second optical system 2 capable of performing two processes, a trimming process and a repair process. By further including a switching mechanism 4 for switching the optical path between these optical systems, the inventors have discovered that setup changes such as removal, movement, mounting, and alignment of the starting substrate 100 are unnecessary between the laser lift-off process and the preceding trimming process, and between the transfer process and the preceding trimming process.

[0072] The transfer device 10 of the present invention can be configured in various ways and may include further components. Examples of further components include a mask, a first stage for holding at least the starting substrate 100, a second stage for the target substrate 200, a projection lens, and a moving mechanism.

[0073] Figure 7 shows one embodiment of the transfer device 10 of the present invention.

[0074] In the transfer device 10 shown in Figure 7, the first optical system 1 comprises an optical path 11 and a mask 12. The mask 12 is a laser L L The irradiation shape is formed into a line-shaped beam, for example, as shown in Figure 3, and has a pattern that allows it to irradiate multiple objects 6 simultaneously.

[0075] Furthermore, in the transfer device 10 shown in Figure 7, the second optical system 2 comprises an optical path 21, an AP 22, a galvanometer scanner (scanner) 23, and a mask 24. The AP 22 is an aperture for forming a laser beam of a size that allows the scanner 23 to operate properly. The galvanometer scanner 23 uses a laser L T or L R The laser L is selectively irradiated onto the starting substrate 100 or the object 6D or 6R supported on the starting substrate 100, or the laser L T or L R This is a means of selectively irradiating the starting substrate 100 or the target object 6D or 6R from the back side of the starting substrate 100. The mask 24 is a means of laser L T or L R It has a pattern that shapes the irradiation shape to irradiate the target object 6D or 6R in a shape that corresponds to each object individually.

[0076] The transport device 10 shown in Figure 7 further comprises a stage 7, a projection lens 8, and a moving mechanism 43.

[0077] Stage 7 comprises a first stage configured to hold at least the starting substrate 100, which will be described in detail later, and a second stage configured to hold the target substrate 200 opposite the first stage.

[0078] The projection lens 8 is configured to focus the laser onto the target of irradiation on the starting substrate 100 on the stage 7.

[0079] The moving mechanism 43 is part of the switching mechanism 4 and is configured to move the stage 7 (for example, the first stage and the second stage) and the projection lens 8 between the first optical system 1 and the second optical system 2 in accordance with the change in the laser's optical path.

[0080] The projection lens 8 may be provided in both the first optical system 1 and the second optical system 2. Furthermore, the moving mechanism 43 may not move the second stage for the target substrate 200. In such a case, the switching mechanism 4 includes the first stage, and the moving mechanism 43 is configured to move the first stage between the first optical system 1 and the second optical system 2 in accordance with the change in the laser's optical path.

[0081] If the moving mechanism 43 is configured to move the second stage, then the second stage is also part of the switching mechanism 4.

[0082] The moving mechanism 43 can move the first stage, or the first and second stages, within the same plane as appropriate. Therefore, by providing such a moving mechanism 43, the arrangement of multiple objects within the same plane after transport can be arbitrarily changed.

[0083] Figure 8 shows another embodiment of the transfer device 10 of the present invention. The transfer device 10 shown in Figure 8 differs from the transfer device 10 shown in Figure 7 in that the first optical system 1 and the second optical system 2 share a mask 9.

[0084] Mask 9 is Laser L L The irradiation shape is formed into a line-shaped beam, for example as shown in Figure 3, and the pattern is designed to irradiate multiple objects 6 simultaneously, and the laser L T or L R It has a pattern that shapes the irradiation shape to irradiate the target object 6D or 6R in a shape that corresponds to each object individually.

[0085] The switching mechanism 4 is not limited to the examples described above. For example, it may be configured to switch between inserting the first optical system 1 and the second optical system 2 between the optical path L and the projection lens 8 while the optical path L from the laser light source 3, the stage 7, and the projection lens 8 are fixed in a straight line.

[0086] [Optical System Alignment] Next, we will describe the alignment of the optical system in each of the laser lift-off, trimming, transfer, and repair processes.

[0087] Laser lift-off can be broadly classified into two types: Contact LLO, which is performed with the starting substrate 100 and the target substrate 200 in contact with an object 6 in between, and Gap LLO, which is performed with a space between the starting substrate 100 and the target substrate 200 facing each other.

[0088] Figure 9 shows examples of alignments used in gap laser lift-off, transfer, and repair processes.

[0089] In the gap laser lift-off process (see the previous explanation of Figure 12(c) for details), a starting substrate 100, such as a sapphire substrate 110, is held on the first stage 71. A first intermediate substrate 210, which is the target substrate 200, is held on the second stage 72. A space is also provided between the sapphire substrate 110 and the first intermediate substrate 210.

[0090] The first stage, stage 71, is laser L L It has an opening so that light can be shone onto the back surface of the sapphire substrate 110.

[0091] The projection lens 8 is positioned above the first stage 71.

[0092] In the transfer process (see the previous explanation of Figure 13(g) for details), the alignment is the same as for the gap laser lift-off process, except that the second intermediate substrate 120, which serves as the starting substrate 100, is held in the first stage 71, and the finished substrate 220, which serves as the target substrate 200, is held in the second stage 72.

[0093] In the repair process (see the previous explanation of Figure 14(h) for details), the alignment is the same as for the gap laser lift-off process, except that the first stage 71 holds the repair substrate 130 as the starting substrate 100, and the second stage 72 holds the finished substrate 220 as the target substrate 200.

[0094] Furthermore, after the transfer process, as shown on the right side of Figures 3 and 4, for example, the untransferred objects 6 remain on the starting substrate 100 (second intermediate substrate 120). This starting substrate 100, which has the untransferred objects 6 (excess objects), can also be used as the repair substrate 130 in the repair process.

[0095] The transfer process (also called the mass transfer process) is a relatively final step in the transport process (chip alignment process). However, if defective objects (LEDs) 6D are removed in the laser lift-off process or the trimming process before the transfer process, the finished substrate obtained after the transport process will be different. 220 A chip defect occurs. The repair process involves replacing this defect with a single 6R chip.

[0096] At this time, replacement chips 6R are replenished from the repair substrate, but since the transfer device and the repair device are devices with different optical systems, conventionally they were composed of separate devices. In this case, the object 6 supplied in the transfer process and the replacement chips 6R replenished in the repair process were supplied from different substrates. In such cases, since the production lots of the chips used in the transfer process and the replacement chips 6R replenished in the repair process are different, non-uniformity such as partial luminescence may occur.

[0097] On the other hand, in the repair process, the utilization efficiency of the chips is high because the surplus objects 6R remaining after the transfer process are replenished. Furthermore, since the objects 6 transferred in the transfer process and the replenishment chips 6R replenished in the repair process are from the same lot, and their optical systems utilize lasers from the same light source, it is possible to construct uniformly aligned chips across the entire surface.

[0098] Figure 10 shows examples of alignment used in the trimming process before the laser lift-off process and the trimming process before the transfer process.

[0099] In the trimming process prior to the laser lift-off process (see the explanation of Figure 12(b) for details), the first stage 71 holds, for example, a sapphire substrate 110 as the starting substrate 100.

[0100] In the trimming process before the transfer process (see the explanation of Figure 13(f) for details), the second intermediate substrate 120, which serves as the starting substrate 100, is held in the first stage 71.

[0101] Aside from the absence of the second stage, the alignment is the same as shown in Figure 9.

[0102] Figure 11 shows an example of alignment used in the contact laser lift-off process.

[0103] The alignment shown in Figure 11 is the same as the alignment for the gap laser lift-off process shown in Figure 9, except that the starting substrate 100 and the target substrate 200 are in contact with the object 6 in between, and the first stage 71 supports the starting substrate 100 and the target substrate 200, and there is no second stage.

[0104] As explained earlier, and as is clear from the above explanation in Figures 9 to 11, the same sapphire substrate 110 is used as the starting substrate 100 for both the alignment in the laser lift-off process and the alignment in the preceding trimming process. Therefore, by using the transfer device 10 of the present invention, the trimming process before the laser lift-off process and the laser lift-off process can be performed in a series of operations without changing the setup of the starting substrate 100.

[0105] Furthermore, the same second intermediate substrate 120 is used as the starting substrate 100 for both the alignment in the transfer process and the alignment in the preceding trimming process. Therefore, by using the transfer device 10 of the present invention, the trimming process before the transfer process and the transfer process can be performed in a series of operations without changing the setup of the starting substrate 100. Moreover, in the repair process, if the second intermediate substrate 120 used in the transfer process is used as the repair substrate 130, which is the starting substrate 100, the trimming process before the transfer process, the transfer process, and the repair process can be performed in a series of operations without changing the setup of the starting substrate 100.

[0106] [Transfer method] Next, the transfer method of the present invention will be described. The transfer method of the present invention can be applied to the manufacturing flow of LED-equipped devices described with reference to Figures 12 to 14, so parts of Figures 12 to 14 will be referred to again during the explanation. However, the transfer method of the present invention can also be applied to manufacturing flows other than the example manufacturing flows shown in Figures 12 to 14.

[0107] The transfer method of the present invention uses a laser to transport multiple objects 6 to a starting substrate (for example, the sapphire substrate 110 shown in Figure 12(a) or Figure 13 This is a transfer method for transferring from the second intermediate substrate 120 shown in (g) to the target substrate (for example, the first intermediate substrate 210 shown in Figure 12(c) or the finished substrate 220 shown in Figure 13(g)).

[0108] First, a starting substrate equipped with multiple objects 6 (for example, the sapphire substrate 110 shown in Figure 12(a) or Figure 1 3 ( gPrepare the second intermediate substrate 120 shown in (starting substrate preparation step).

[0109] Meanwhile, a target substrate (for example, the first intermediate substrate 210 shown in Figure 12(c) or the finished substrate 220 shown in Figure 13(g)) to which multiple objects 6 are to be transported is prepared (target substrate preparation step).

[0110] Furthermore, a transfer device 10 is prepared, which includes a laser light source 3 configured to emit a laser, a first optical system 1, and a second optical system 2, as shown in Figure 1 (device preparation step).

[0111] Next, as shown in Figure 12(b) or Figure 13(f), it is determined in advance whether any defective objects 6D are included among the multiple objects 6 on the starting substrate (e.g., sapphire substrate 110 or second intermediate substrate 120), and if defective objects 6D are included, a laser L passed through the second optical system 2 is used. T Defective object 6 D Selectively remove (trimming process).

[0112] Then, as shown in Figure 12(c) or Figure 13(g), multiple objects 6 are passed through the first optical system 1 by a laser L from the starting substrate (e.g., sapphire substrate 110 or second intermediate substrate 120) to the target substrate (e.g., first intermediate substrate 210 or finished substrate 220). L or L M The vehicle is transported by (transportation process (laser lift-off process or transfer process)).

[0113] Furthermore, in the transfer method of the present invention, the trimming step and the transfer step are performed in a series of operations without changing the setup of the starting substrate. Specifically, the laser lift-off step and the preceding trimming step are performed in a series of operations without changing the setup of the sapphire substrate 110, which is the starting substrate. Also, the transfer step and the preceding trimming step are performed in a series of operations without changing the setup of the sapphire substrate 110, which is the starting substrate, or the second intermediate substrate 120.

[0114] In this transfer method of the present invention, at least between the laser lift-off process and the preceding trimming process, and between the transfer process and the preceding trimming process, it is possible to suppress the decrease in productivity caused by the changeover of the starting substrate, and to prevent variations between processes caused by the accuracy of alignment.

[0115] Furthermore, the transport method of the present invention allows a single device to perform the functions that were previously performed by four devices, and eliminates the need for multiple devices to each have their own laser light source, enabling efficient use of laser energy. As a result, the footprint and capital investment can be minimized.

[0116] The transfer method of the present invention first determines whether or not there are areas on the target substrate (e.g., finished substrate 220) where the object 6 is missing. If there are areas where the object 6 is missing, the laser L passes through the first optical system 1 to transfer multiple objects 6 from the starting substrate (e.g., second intermediate substrate) to the target substrate (e.g., finished substrate 220). M After the transfer process (Figure 13(g)) in which the substrate is transported, a laser L is selectively applied to the target object 6R of the starting substrate (for example, the repair substrate 130 shown in Figure 14(h)) through the second optical system 2. R The process can further include a repair step (Figure 14(h)) in which the object 6 is irradiated and the object (replacement chip 6R) is transferred to the damaged area. Furthermore, by using the second intermediate substrate 120 after the transfer step as the repair substrate 130, the transfer step in Figure 13(g) to the repair step in Figure 14(h) can be performed in a series of operations without changing the setup of the starting substrate (second intermediate substrate 120).

[0117] More specifically, the transfer process involves the alignment described with reference to Figure 9, using the laser L LA laser lift-off process (Figure 12(c)) is performed in which the object 6 is transferred from the starting substrate to the first intermediate substrate 210 placed on the second stage 72 as the target substrate by irradiating the object 6 through the substrate of the chip supply substrate (sapphire substrate 110) on which the object 6 is formed on the substrate surface of the substrate placed on the first stage 71 as the starting substrate, thereby decomposing a part of the object 6, and in the alignment described with reference to Figure 9, the laser L M The process may include a transfer step (Figure 13(g)) in which the object 6 is transferred from the second intermediate substrate 120 to the finished substrate 220 placed on the second stage 72, which serves as the target substrate, by irradiating the adhesive layer 121 formed between the second intermediate substrate 120 and the object 6 through the second intermediate substrate 120 placed on the first stage 71, which serves as the starting substrate, thereby ablating the adhesive layer 121.

[0118] Furthermore, the transfer method of the present invention may further include a step between the laser lift-off step and the transfer step of transferring the object 6 from the first intermediate substrate 210 to the second intermediate substrate 120, as shown in Figure 13(e).

[0119] It should be noted that the present invention is not limited to the embodiments described above. The embodiments described above are illustrative, and any configuration that is substantially identical to the technical idea described in the claims of the present invention and achieves similar effects is included within the technical scope of the present invention. The invention described in the claims at the time of filing is listed below. [1] A transfer device for transferring an object provided on a starting substrate from the starting substrate to a target substrate using a laser, comprising: a laser light source configured to oscillate the laser; a first optical system; a second optical system having an optical configuration different from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between an optical path to the first optical system and an optical path to the second optical system, wherein the first optical system is configured to transfer the object to the target substrate surface by sequentially irradiating the starting substrate with the laser from the back side, and the second optical system is configured to remove the object from the starting substrate or transfer the object to the target substrate surface by selectively irradiating the starting substrate with the laser from the back side. [2] A transfer device for transferring an object provided on a starting substrate from the starting substrate to a target substrate using a laser, comprising: a laser light source configured to oscillate the laser; a first optical system; a second optical system having an optical configuration different from the optical configuration of the first optical system; and a switching mechanism configured to switch the optical path of the laser between an optical path to the first optical system and an optical path to the second optical system, wherein the first optical system is configured to simultaneously transfer a plurality of objects to the target substrate surface by simultaneously irradiating the laser onto a plurality of objects from the back side of the starting substrate; and the second optical system is configured to remove one object from the starting substrate or transfer one object to the target substrate surface by irradiating one object from the back side of the starting substrate with the laser. [3] The transfer device according to [1] or [2], wherein the switching mechanism is equipped with a mirror. [4] The switching mechanism includes a first stage configured to hold at least the starting substrate, and a moving mechanism configured to move the first stage between the first optical system and the second optical system in accordance with a change in the optical path of the laser. A transfer device according to any one of [1] to [3], which is equipped with [1] to [3]. [5] A transfer device according to any one of [1] to [3], further comprising: a first stage configured to hold the starting substrate; a second stage configured to hold a target substrate opposite to the first stage; and a projection lens configured to image the laser, wherein the switching mechanism includes a moving mechanism configured to move the first stage, the second stage, and the projection lens between the first optical system and the second optical system in accordance with a change in the optical path of the laser. [6] A transfer device according to any one of [1] to [5], further comprising a mask having a pattern for shaping the laser irradiation shape into a line beam to irradiate a plurality of objects, and a pattern for shaping the laser irradiation shape to irradiate a single object. [7] The transfer device according to any one of [1] to [6], wherein the second optical system has a galvanoscanner as a means for selectively irradiating the starting substrate or the object supported on the starting substrate with the laser, or for selectively irradiating the starting substrate or the object from the back side of the starting substrate with the laser. [8] The transfer device according to any one of [1] to [7], wherein the first optical system further comprises a mask having a pattern that shapes the irradiation shape of the laser into a line beam and irradiates a plurality of objects simultaneously, and the second optical system further comprises a mask having a pattern that shapes the irradiation shape of the laser into shapes that correspond individually to each of the objects. [9] A transfer method for transferring multiple objects from a starting substrate to a target substrate using a laser, comprising: a starting substrate preparation step of preparing a starting substrate having the multiple objects; a target substrate preparation step of preparing a target substrate to which the multiple objects are to be transferred; an apparatus preparation step of preparing a transfer apparatus comprising a laser light source configured to oscillate the laser, a first optical system and a second optical system; a trimming step of determining in advance whether or not defective objects are included among the multiple objects on the starting substrate, and selectively removing the defective objects with the laser through the second optical system if defective objects are included; and a transfer step of transferring the multiple objects from the starting substrate to the target substrate with the laser through the first optical system, wherein the trimming step to the transfer step is performed in a series of operations without changing the setup of the starting substrate.

[10] The transfer method according to [9], wherein it is determined in advance whether the target substrate contains any missing parts of the object, and if there are missing parts of the object, after the transfer step of transferring the plurality of objects from the starting substrate to the target substrate by the laser through the first optical system, the transfer method further includes a repair step of selectively irradiating the objects on the starting substrate with the laser through the second optical system to transfer the objects to the missing parts of the object, and the transfer step to the repair step is performed in a series of operations without changing the setup of the starting substrate.

[11] The transfer step includes a laser lift-off step of transferring the object from the starting substrate to a first intermediate substrate installed on a second stage as a target substrate by irradiating the object with a laser through a substrate of a chip supply substrate on which the object is formed on the substrate surface installed on a first stage as a starting substrate, thereby decomposing a part of the object; and a transfer step of transferring the object from the second intermediate substrate to a finished substrate installed on a second stage as a target substrate by irradiating the adhesive layer formed between the second intermediate substrate and the object with a laser through a second intermediate substrate installed on the first stage as a starting substrate, thereby ablating the adhesive layer, wherein the second intermediate substrate includes the adhesive layer, and further includes a step of transferring the object from the first intermediate substrate to the second intermediate substrate between the laser lift-off step and the transfer step. [9] or

[10]

Claims

1. A transfer device for transferring an object placed on a starting substrate from the starting substrate to a target substrate using a laser, A laser light source configured to oscillate the aforementioned laser, The first optical system, A second optical system having an optical configuration different from that of the first optical system, A switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system, It is equipped with, The first optical system is configured to transfer the object to the target substrate surface by sequentially irradiating the starting substrate with the laser from the back side, A transfer device in which the second optical system is configured to remove the object from the starting substrate or transfer the object to the target substrate surface by selectively irradiating the starting substrate with the laser from the back side of the starting substrate.

2. A transfer device for transferring an object placed on a starting substrate from the starting substrate to a target substrate using a laser, A laser light source configured to oscillate the aforementioned laser, The first optical system, A second optical system having an optical configuration different from that of the first optical system, A switching mechanism configured to switch the optical path of the laser between the optical path to the first optical system and the optical path to the second optical system, It is equipped with, The first optical system is configured to simultaneously transfer multiple objects to the target substrate surface by simultaneously irradiating them with the laser from the back side of the starting substrate. A transfer device in which the second optical system is configured to remove one object from the starting substrate or transfer one object to the target substrate surface by irradiating one object with the laser from the back side of the starting substrate.

3. The transfer device according to claim 1 or 2, wherein the switching mechanism includes a mirror.

4. The aforementioned switching mechanism is A first stage configured to at least hold the starting substrate, A moving mechanism configured to move the first stage between the first optical system and the second optical system in accordance with the change in the optical path of the laser, The transfer device according to claim 1 or 2, comprising the following features.

5. A first stage configured to hold the starting substrate, A second stage configured to hold a target substrate opposite the first stage, A projection lens configured to focus the aforementioned laser, It further comprises, The transfer device according to claim 1 or 2, wherein the switching mechanism includes a moving mechanism configured to move the first stage, the second stage, and the projection lens between the first optical system and the second optical system in accordance with a change in the optical path of the laser.

6. A pattern is formed to shape the laser irradiation shape into a line beam so as to irradiate multiple objects, A pattern that shapes the laser irradiation shape so as to irradiate one of the target objects. The transfer device according to claim 1 or 2, further comprising a mask having the following:

7. The transfer apparatus according to claim 1 or 2, wherein the second optical system includes a galvanoscanner as a means for selectively irradiating the starting substrate or the object supported on the starting substrate with the laser, or for selectively irradiating the starting substrate or the object from the back side of the starting substrate with the laser.

8. The first optical system further comprises a mask having a pattern that shapes the laser irradiation shape into a line beam so as to irradiate multiple objects simultaneously. The transfer device according to claim 1 or 2, wherein the second optical system further comprises a mask having a pattern for shaping the laser irradiation shape to irradiate each of the objects in a shape individually corresponding to that object.

9. A transfer method for transferring multiple objects from a starting substrate to a target substrate using a laser, A starting substrate preparation step for preparing a starting substrate equipped with the aforementioned plurality of objects, A target substrate preparation step in which the target substrate to which the aforementioned multiple objects are to be transferred is prepared, A device preparation step of preparing a transfer device comprising a laser light source configured to oscillate the aforementioned laser, a first optical system, and a second optical system, A trimming step in which it is determined in advance whether or not defective objects are included among the plurality of objects on the starting substrate, and if defective objects are included, the defective objects are selectively removed by the laser passed through the second optical system, A transfer process in which the plurality of objects are transferred from the starting substrate to the target substrate by the laser through the first optical system, Includes, A transfer method that performs the trimming process to the transfer process in a series of operations without changing the setup of the starting substrate.

10. The process includes a step of first determining whether the target substrate contains any areas where the object is missing, and if such areas are present, a repair step of, after the transfer step of transferring the plurality of objects from the starting substrate to the target substrate using the laser through the first optical system, selectively irradiating the objects on the starting substrate with the laser through the second optical system to transfer the objects to the areas where they are missing, The transfer method according to claim 9, wherein the transfer process to the repair process is performed in a series of operations without changing the setup of the starting substrate.

11. The aforementioned transfer process is, A laser lift-off process is performed in which the object is transferred from the starting substrate to a first intermediate substrate placed on a second stage, which is the target substrate, by irradiating the object with the laser through the substrate of a chip supply substrate on which the object is formed on the substrate surface placed on a first stage, which is the starting substrate, thereby decomposing a part of the object, and A transfer process in which the object is transferred from the second intermediate substrate to the finished substrate installed on the second stage, which is the target substrate, by irradiating the adhesive layer formed between the second intermediate substrate and the object with the laser through the second intermediate substrate installed on the first stage, which is the starting substrate, thereby ablating the adhesive layer. Includes, The second intermediate substrate includes the adhesive layer, The transfer method according to claim 9 or 10, further comprising a step of transferring the object from the first intermediate substrate to the second intermediate substrate between the laser lift-off step and the transfer step.

Images