Electronic components and their mounting boards

Abstract

To provide an electronic component having improved durability against vibration and deformation, and having improved bonding force of a metal frame of an electronic component and a board, and a mounting board thereof.SOLUTION: An electronic component according to the present invention includes a capacitor body, a pair of external electrodes arranged at both ends of the capacitor body, a pair of connecting portions connected to the pair of external electrodes, respectively, and a pair of metal frames each containing a pair of mounting portions with protrusions on the lower side, and the bottom surface of the mounting portion has a roughness, and there is also provided a mounting board thereof.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] This invention relates to electronic components and their mounting substrates. [Background technology]

[0002] Multilayer capacitors are small yet capable of achieving high capacitance, and are used in a variety of electronic devices.

[0003] Recently, environmentally friendly automobiles and electric vehicles have been attracting attention, and the importance of the electric drive systems inside these vehicles is increasing. Consequently, the demand for multilayer capacitors, which are necessary for these electric drive systems, is also rising.

[0004] For multilayer capacitors to be used as automotive components, high levels of thermal reliability, electrical reliability, and mechanical reliability are required.

[0005] In particular, as the mounting density of components inside automobiles increases, there is a demand for multilayer capacitors that are easy to install in limited spaces, can achieve high capacity, and have excellent durability against vibration and deformation.

[0006] Furthermore, as a way to improve the durability of multilayer capacitors against vibration and deformation, there is a method of mounting the multilayer capacitors separately from the substrate using a metal frame.

[0007] However, with electronic components that utilize such metal frames, a problem can arise during circuit board mounting: because the surface of the metal frame is smooth, the area where the metal frame contacts the electrode pads on the circuit board is prone to deterioration. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Korean Published Patent Publication No. 2015-062215 [Patent Document 2] Korean Registered Patent Publication No. 10-1548804 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] The object of the present invention is to provide an electronic component and a mounting substrate that improve the durability of a multilayer capacitor against vibration and deformation, and improve the bonding strength between the metal frame and substrate of the electronic component. [Means for solving the problem]

[0010] One aspect of the present invention provides an electronic component comprising a capacitor body, a pair of external electrodes arranged at both ends of the capacitor body, a pair of connection parts connected to the pair of external electrodes, and a pair of mounting parts each having a protruding part on the lower side, wherein the mounting parts have a rough bottom surface.

[0011] In one embodiment of the present invention, the roughness of the bottom surface of the mounting portion can be 5 to 75 μm.

[0012] In one embodiment of the present invention, the bottom surface of the mounting portion may have an uneven shape.

[0013] In one embodiment of the present invention, the bottom surface of the mounting portion may have a mesh pattern.

[0014] In one embodiment of the present invention, the thickness of the mounting portion can be 125 μm.

[0015] In one embodiment of the present invention, the capacitor body may include a dielectric layer and a plurality of internal electrodes that are alternately arranged with the dielectric layer in between.

[0016] In one embodiment of the present invention, the external electrode may include a head portion disposed on one surface of the capacitor body, and a band portion extending from the head portion to a part of the upper and lower surfaces and both side surfaces of the capacitor body.

[0017] In one embodiment of the present invention, the metal frame may be such that the connecting portion is connected to the head portion, and the mounting portion may be bent and extended at the lower stage of the connecting portion.

[0018] Another aspect of the present invention includes a substrate, a pair of external electrodes respectively disposed at both ends of a capacitor body, a pair of connecting portions respectively connected to the pair of external electrodes, and a pair of metal frames each including a pair of mounting portions having protrusions on the lower side, and a pair of electrode pads disposed on the upper surface of the substrate so that the pair of metal frames are respectively connected thereto, and provides a mounting substrate for an electronic component in which the bottom surface of the mounting portion has roughness and the upper surface of the electrode pad has roughness.

[0019] In one embodiment of the present invention, the roughness of the bottom surface of the mounting portion and the roughness of the electrode pad may be 5 to 75 μm.

[0020] In one embodiment of the present invention, the bottom surface of the mounting portion and the upper surface of the electrode pad may have an uneven shape.

[0021] In one embodiment of the present invention, the bottom surface of the mounting portion and the upper surface of the electrode pad may have a mesh pattern.

Advantages of the Invention

[0022] According to one embodiment of the present invention, it is possible to enhance the durability of the multilayer capacitor against vibration and deformation, improve the bonding force between the metal frame and the substrate, and improve the reliability of the electronic component mounted on the substrate.

Brief Description of the Drawings

[0023] [Figure 1] This is a schematic perspective view showing a multilayer capacitor applied to an embodiment of the present invention. [Figure 2a] Figure 1 is a separated perspective view showing the first internal electrode. [Figure 2b] Figure 1 is a separated perspective view showing the second internal electrode. [Figure 3] This is a cross-sectional view along the line I-I' in Figure 1. [Figure 4] This is a schematic perspective view of an electronic component according to one embodiment of the present invention. [Figure 5] Figure 4 is a separated perspective view showing the bonding structure of the electronic components and substrate. [Figure 6] This is a schematic cross-sectional view showing an electronic component mounted on a substrate according to one embodiment of the present invention. [Figure 7] This is a schematic perspective view showing an electronic component according to another embodiment of the present invention. [Figure 8] Figure 7 is a separated perspective view showing the bonding structure of the electronic components and the substrate. [Figure 9] This is a schematic cross-sectional view showing an electronic component according to another embodiment of the present invention mounted on a substrate. [Figure 10] This graph compares the adhesion force of electronic components as the roughness of the bottom surface of the mounting area changes. [Modes for carrying out the invention]

[0024] Preferred embodiments of the present invention will be described below with reference to the attached drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person with average skill in the art. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numeral in the drawings are the same elements. Also, the same reference numeral is used throughout the drawings for parts that have similar functions and operations.

[0025] Furthermore, throughout the specification, the phrase "includes" a certain component means, unless otherwise specifically contradicted, that other components may be included rather than excluded.

[0026] To clearly illustrate embodiments of the present invention, directions are defined as follows: X, Y, and Z shown in the drawings represent the length, width, and thickness directions of the multilayer capacitor and electronic component, respectively.

[0027] Furthermore, in this embodiment, the Z-direction is used as the same concept as the stacking direction in which the dielectric layers are stacked.

[0028] Figure 1 is a schematic perspective view showing a multilayer capacitor applied to an embodiment of the present invention, Figures 2a and 2b are separate perspective views showing the first and second internal electrodes of Figure 1, respectively, and Figure 3 is a cross-sectional view along the line I-I' in Figure 1.

[0029] The structure of the multilayer capacitor 100 applied to the electronic component of this embodiment will be described with reference to Figures 1 to 3.

[0030] The multilayer capacitor 100 of this embodiment includes a capacitor body 110 and first and second external electrodes 131 and 132, respectively, which are arranged at both ends of the capacitor body 110 in the X direction.

[0031] The capacitor body 110 is formed by stacking multiple dielectric layers 111 in the Z direction and firing them. The boundaries between adjacent dielectric layers 111 of the capacitor body 110 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0032] Furthermore, the capacitor body 110 includes a plurality of dielectric layers 111 and first and second internal electrodes 121 and 122 that are alternately arranged in the Z direction with the dielectric layers 111 in between. In this case, the first and second internal electrodes 121 and 122 have different polarities from each other.

[0033] Furthermore, the capacitor body 110 may include an active region and cover regions 112 and 113.

[0034] The active region described above is the part that contributes to the formation of capacitance in a multilayer capacitor.

[0035] Furthermore, the cover regions 112 and 113 can be provided as margin portions above and below the active region in the Z direction, respectively.

[0036] Such cover regions 112 and 113 can be provided by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the active region, respectively.

[0037] Furthermore, the cover regions 112 and 113 can serve to prevent damage to the first and second internal electrodes 121 and 122 due to physical or chemical stress.

[0038] Furthermore, while there are no particular restrictions on the shape of the capacitor body 110, it can be approximately hexahedral in shape.

[0039] In this embodiment, the capacitor body 110 may include first and second surfaces 1 and 2 facing each other in the Z direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the X direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other. Here, the first surface 1 may be the mounting surface.

[0040] Furthermore, the shape, dimensions, and number of dielectric layers 111 of the capacitor body 110 are not limited to those shown in the drawings of this embodiment.

[0041] The dielectric layer 111 can contain ceramic powder, for example, BaTiO3-based ceramic powder and the like.

[0042] Examples of the BaTiO3-based ceramic powder include (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, or Ba(Ti 1-y Zr y )O3 and the like, but the ceramic powder of the present invention is not limited thereto.

[0043] In addition, a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like can be further added to the dielectric layer 111.

[0044] The ceramic additive can contain a transition metal oxide or a transition metal carbide, a rare earth element, magnesium (Mg), aluminum (Al), or the like.

[0045] The first and second internal electrodes 121 and 122 are electrodes to which different polarities are applied.

[0046] The first and second internal electrodes 121 and 122 can be formed on the respective dielectric layers 111 and laminated in the Z direction.

[0047] In addition, the first and second internal electrodes 121 and 122 can be alternately arranged so as to face each other along the Z direction inside the capacitor body 110 with one dielectric layer 111 interposed therebetween.

[0048] At this time, the first and second internal electrodes 121 and 122 can be electrically insulated from each other by the dielectric layer 111 disposed in the middle.

[0049] On the other hand, although this embodiment is illustrated and described as having multiple internal electrodes stacked in the Z direction, the present invention is not limited thereto, and can be applied to structures in which the internal electrodes are stacked in the Y direction as needed.

[0050] One end of the first internal electrode 121 can be exposed through the third surface 3 of the capacitor body 110.

[0051] In this way, the end of the first internal electrode 121 exposed through the third surface 3 of the capacitor body 110 can be connected to and electrically coupled with the first external electrode 131 located at one end of the capacitor body 110 in the X direction.

[0052] One end of the second internal electrode 121 can be exposed through the fourth surface 4 of the capacitor body 110.

[0053] In this way, the end of the second internal electrode 122 exposed through the fourth surface 4 of the capacitor body 110 can be connected to and electrically coupled with the second external electrode 132 located at one end of the capacitor body 110 in the X direction.

[0054] With the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132, charge accumulates between the first and second internal electrodes 121 and 122.

[0055] At this time, the capacitance of the multilayer capacitor 100 becomes proportional to the overlapping area of ​​the first and second internal electrodes 121 and 122 that overlap each other along the Z direction in the active region.

[0056] Furthermore, the materials used to form the first and second internal electrodes 121 and 122 are not particularly limited.

[0057] For example, the first and second internal electrodes 121 and 122 can be formed using a conductive paste made of one or more materials selected from precious metals, nickel (Ni), and copper (Cu).

[0058] The above-mentioned precious metal materials can be platinum (Pt), palladium (Pd), and palladium-silver (Pd-Ag) alloys, etc.

[0059] Furthermore, the printing method for the conductive paste described above can be screen printing or gravure printing, but the present invention is not limited to these methods.

[0060] The first and second external electrodes 131 and 132 are supplied with voltages of different polarities from each other, are located at both ends of the main body 110 in the X direction, and can be electrically connected to the exposed ends of the first and second internal electrodes 121 and 122, respectively.

[0061] The first external electrode 131 may include a first head portion 131a and a first band portion 131b.

[0062] The first head portion 131a is positioned on the third surface 3 of the capacitor body 110.

[0063] The first head portion 131a contacts the end of the first internal electrode 121, which is exposed to the outside through the third surface 3 of the capacitor body 110, and serves to electrically connect the first internal electrode 121 and the first external electrode 131.

[0064] The first band section 131b is the portion that extends from the first head section 131a to parts of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the capacitor body 110.

[0065] The first band portion 131b can serve a role such as improving the adhesion strength of the first external electrode 131.

[0066] The second external electrode 132 may include a second head portion 132a and a second band portion 132b.

[0067] The second head portion 132a is positioned on the fourth surface 4 of the capacitor body 110.

[0068] The second head portion 132a contacts the end of the second internal electrode 122, which is exposed to the outside through the fourth surface 4 of the capacitor body 110, and serves to electrically connect the second internal electrode 122 and the second external electrode 132.

[0069] The second band section 132b is the portion that extends from the second head section 132a to parts of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the capacitor body 110.

[0070] The second band portion 132b can play a role in improving the adhesion strength of the second external electrode 132.

[0071] On the other hand, the first and second external electrodes 131 and 132 may further include a plating layer.

[0072] The above-mentioned plating layer may include first and second nickel (Ni) plating layers disposed on the capacitor body 110, and first and second tin (Sn) plating layers covering the first and second nickel plating layers, respectively.

[0073] Figure 4 is a schematic perspective view showing an electronic component according to one embodiment of the present invention.

[0074] Referring to Figure 4, the electronic component 101 of this embodiment includes a multilayer capacitor 100 comprising a capacitor body 110 and first and second external electrodes 131 and 132, and first and second metal frames 140 and 150 connected to the first and second external electrodes 131 and 132, respectively.

[0075] The first metal frame 140 may include a first connecting portion 141 and a first mounting portion 142.

[0076] The first connection portion 141 is a part that is joined to and physically connected to the first head portion 131a of the first external electrode 131, and is electrically connected to the first head portion 131a of the first external electrode 131.

[0077] In this case, the first conductive bonding layer 160 can be placed between the first head portion 131a of the first external electrode 131 and the first connecting portion 141.

[0078] The first conductive bonding layer 160 may be made of high-temperature solder or a conductive bonding material, but the present invention is not limited thereto.

[0079] The first mounting portion 142 is a portion that is bent inward in the X direction and extended below the first connecting portion 141, and is formed horizontally with respect to the mounting surface.

[0080] The first mounting section 142 serves as a connection terminal when mounting the electronic component 101 onto the substrate 210.

[0081] In this case, the first mounting section 142 can be positioned so as to be separated from the lower end of the stacked capacitor 100.

[0082] Furthermore, the first mounting portion 142 is formed with a rough surface 142a on its bottom surface. This allows the first mounting portion 142 to have a relatively larger surface area compared to when its bottom surface is flat.

[0083] Furthermore, this rough surface 142a on the bottom surface of the first mounting portion 142 can be formed to have a mesh pattern by processing methods such as patterning.

[0084] In this case, as shown in Figure 4, the rough surface 142a of the first mounting portion 142 is formed only in the central part of the bottom surface of the first mounting portion 142, and the edge portion of the first mounting portion 142 can be formed in a flat shape without roughness.

[0085] However, the present invention is not necessarily limited thereto, and if necessary, the entire bottom surface of the first mounting portion 142 may be formed as a rough surface, taking into consideration the difficulty of the processing steps and manufacturing costs.

[0086] Furthermore, the rough surface of the bottom surface of the first mounting section 142 can have various shapes.

[0087] For example, as shown in Figure 7, the rough surface 142a' on the bottom surface of the first mounting portion 142' can be formed to have an uneven, bumpy shape by processing methods such as etching or sputtering.

[0088] In this case, the uneven shape may have a regular pattern or consist of an irregular pattern.

[0089] The second metal frame 150 may include a second connecting portion 151 and a second mounting portion 152.

[0090] The second connection portion 151 is a part that is joined to and physically connected to the second head portion 132a of the second external electrode 132, and is electrically connected to the second head portion 132a of the second external electrode 132.

[0091] In this case, a second conductive bonding layer 170 can be placed between the second head portion 132a of the second external electrode 132 and the second connecting portion 151.

[0092] The second conductive bonding layer 170 may be made of high-temperature solder or a conductive bonding material, but the present invention is not limited thereto.

[0093] The second mounting portion 152 is a portion that is bent inward in the X direction and extended below the second connecting portion 151, and is formed horizontally with respect to the mounting surface.

[0094] The second mounting section 152 serves as a connection terminal when mounting the electronic component 101 onto the circuit board 210.

[0095] In this case, the second mounting section 152 can be positioned so as to be separated from the lower end of the stacked capacitor 100.

[0096] Furthermore, the second mounting portion 152 is formed with a rough surface 152a on its bottom surface. This allows the second mounting portion 152 to have a relatively larger surface area compared to the case where the bottom surface of the second mounting portion 152 is flat.

[0097] Furthermore, this rough surface 152a on the bottom surface of the second mounting portion 152 can be formed to have a mesh pattern.

[0098] In this case, as shown in Figure 4, the rough surface 152a of the second mounting portion 152 is formed only in the central portion of the bottom surface of the second mounting portion 152, and the edge portions of the second mounting portion 152 can be formed in a flat shape without roughness.

[0099] However, the present invention is not necessarily limited thereto, and the entire bottom surface of the second mounting portion 152 may be formed into a rough surface if necessary.

[0100] Furthermore, the rough surface of the bottom surface of the second mounting section 152 can have various shapes.

[0101] For example, as shown in Figure 7, the rough surface 152a' on the bottom surface of the second mounting portion 152' can be formed to have an uneven, bumpy shape.

[0102] Figure 5 is a separated perspective view showing the bonding structure of the electronic component and substrate in Figure 4, and Figure 6 is a schematic cross-sectional view showing the state in which the electronic component according to one embodiment of the present invention is mounted on the substrate.

[0103] Referring to Figures 5 and 6, the mounting substrate for the electronic component of the present invention includes a substrate 210 and first and second electrode pads 221 and 222 arranged on the upper surface of the substrate 210 so as to be spaced apart from each other.

[0104] The first and second electrode pads 221 and 222 can be arranged on the upper surface of the substrate 210 so as to be spaced apart from each other in the X direction, and the bottom surfaces of the first and second mounting portions 142 and 152 of the first and second metal frames 140 and 150 can be in contact with each other and electrically connected.

[0105] At this time, the first mounting portion 142 can be physically connected to the first electrode pad 221 by solder 231, and the second mounting portion 152 can be physically connected to the second electrode pad 222 by solder 232.

[0106] The first electrode pad 221 has a rough upper surface 221a, which corresponds to the rough lower surface 142a of the first mounting portion 142, which is rough.

[0107] Furthermore, the rough surface 221a on the upper surface of the first electrode pad 221 is formed in a form substantially similar to the rough surface 142a on the bottom surface of the first mounting portion 142, and in this embodiment, it can be formed to have a mesh pattern.

[0108] In this case, as shown in Figures 5 and 6, the rough surface 221a on the upper surface of the first electrode pad 221 is formed only in the central portion of the upper surface of the first electrode pad 221, and the edge portions of the upper surface of the first electrode pad 221 can be formed in a flat shape without roughness.

[0109] As another example, the rough surface 221a' on the upper surface of the first electrode pad 221' can be modified in various ways as needed, such as having an uneven, bumpy shape as shown in Figures 8 and 9.

[0110] Furthermore, the upper surface of the second electrode pad 222 is formed to be a rough surface 222a, corresponding to the rough surface 152a of the bottom surface of the second mounting portion 152, which has a rough surface.

[0111] Furthermore, the rough surface 222a on the upper surface of the second electrode pad 222 is formed in a form substantially similar to the rough surface 152a on the bottom surface of the second mounting portion 152, and in this embodiment, it can be formed to have a mesh pattern.

[0112] In this case, the rough surface 222a on the upper surface of the second electrode pad 222 is formed only in the central portion of the upper surface of the second electrode pad 222, as shown in Figures 5 and 6, while the edge portions of the upper surface of the second electrode pad 222 can be formed in a flat shape without roughness.

[0113] As another example, the rough surface 222a' on the upper surface of the second electrode pad 222' can be modified in various ways as needed, such as having an uneven, bumpy shape as shown in Figures 8 and 9.

[0114] Conventional multilayer capacitors have a structure in which the external electrodes of the multilayer capacitor and the substrate come into direct contact via solder when mounted on a circuit board.

[0115] As a result, heat and mechanical deformation generated from the substrate are directly transmitted to the multilayer capacitor, making it difficult to ensure a high level of reliability in the multilayer capacitor.

[0116] In this embodiment, the electronic component can secure a gap between the multilayer capacitor 100 and the substrate 210 by joining the first and second metal frames 140 and 150 to both ends of the multilayer capacitor 100, respectively.

[0117] This prevents stress from the substrate 210 from being directly transmitted to the multilayer capacitor 100 when mounting the electronic component 101 onto the substrate 210, thereby improving the thermal reliability, electrical reliability, and mechanical reliability of the electronic component 101.

[0118] However, in the case of electronic components that utilize such metal frames, a problem can arise during circuit board mounting: because the surface of the metal frame is smooth, the part of the metal frame that comes into contact with the electrode pads on the circuit board is prone to deterioration.

[0119] In this embodiment, the bottom surface of the mounting portion of the metal frame is formed as a rough surface with a rough texture.

[0120] This allows the mounting portion of the metal frame to come into contact with the electrode pads and be soldered, thereby relatively increasing the contact area with the solder compared to when the bottom surface of the mounting portion is flat, and consequently improving the adhesion force of the mounting portion to the electrode pads.

[0121] This allows electronic components to have robust durability against horizontal deformation of the substrate, and reduces the problem of electronic components separating from the substrate due to environmental changes such as mechanical shocks after mounting on the substrate or vibrations during transport.

[0122] In this case, the upper surface of the electrode pads on the substrate can also be formed to have a rough texture.

[0123] As a result, the rough surface on the bottom of the mounting section of the metal frame engages with the rough surface on the top of the electrode pad, allowing the metal frame to be mounted on the substrate. This creates a structure that supports the electronic components so that they do not shake in the horizontal direction (X or Y) of the substrate.

[0124] This further reduces the problem of electronic components separating from the circuit board due to environmental changes such as mechanical shocks after mounting and vibrations during transport.

[0125] The adhesion force of electronic components to the substrate is calculated by mounting 40 electronic components on the substrate under different conditions, then applying a mechanical force to the midpoint of the Z-direction on one side of each electronic component using an adhesion force measuring device, measuring the force (N) at the point when the metal frame of the electronic component separates from the electrode pads on the substrate, and calculating the average value.

[0126] Figure 10 is a graph comparing the adhesion force of electronic components with respect to changes in the roughness of the bottom surface of these mounting areas. Here, the thickness of the mounting area of ​​the metal frame was assumed to be 125 μm.

[0127] The generally required adhesion force for electronic components to a substrate is 20N or more. Here, surface roughness (Rmax) is a value based on the distance between the lowest and highest points of the cross-section of the rough surface, i.e., the maximum height.

[0128] Referring to Figure 10, the adhesion force was evaluated while changing the surface roughness (Rmax) of the bottom surface of the mounting area from 0 to 90 μm. The results showed that when the surface roughness of the bottom surface of the mounting area was 5 μm or more, the adhesion force of the electronic component was higher than 20 N, and when the surface roughness of the bottom surface of the mounting area was 60 μm, the adhesion force of the electronic component reached its highest value of 50 N.

[0129] Furthermore, it has been confirmed that when the surface roughness of the bottom surface of the mounting area exceeds 60 μm, the thickness of the mounting area of ​​the metal frame becomes too thin, causing tearing and actually reducing the adhesion strength of the electronic components.

[0130] In particular, the bonding force between the metal frame and the substrate is preferably 20N or higher, but when the surface roughness of the bottom surface of the mounting area was 80μm, the bonding force was less than 20N.

[0131] Therefore, a preferred numerical range for the surface roughness (Rmax) of the bottom surface of the mounting area, which can optimize the adhesion force of electronic components to the substrate, can be 5 ≤ Rmax ≤ 75.

[0132] In this case, if a higher bonding force is required, the preferred numerical range for the surface roughness (Rmax) of the upper surface of the electrode pad on the substrate can be 5 ≤ Rmax ≤ 75, similar to the numerical range for the surface roughness of the bottom surface of the mounting area of ​​the metal frame.

[0133] The present invention is not limited by the embodiments described above or the accompanying drawings, but is limited by the claims provided herein.

[0134] Therefore, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, without departing from the technical idea of ​​the present invention as described in the claims, and these also fall within the scope of the present invention. [Explanation of Symbols]

[0135] 100 Multilayer Capacitors 101 Electronic Components 110 Capacitor body 111 Dielectric layer 121, 122 First and second internal electrodes 131, 132 First and second external electrodes 131a, 132a First and second heads 131b, 132b First and Second Band Sections 140, 140' 1st Metal Frame 150, 150' 2nd metal frame 141 First connection section 142 First Implementation Section 151 Second connection section 152 Second Implementation Section 160 First conductive bonding layer 170 Second conductive bonding layer 210 circuit boards 221, 221' First electrode pad 222, 222' Second electrode pad 231, 232 solder

Claims

1. An electronic component, The capacitor body and External electrodes are arranged at both ends of the capacitor body, The capacitor comprises a metal frame including connection portions connected to the external electrodes and mounting portions that are positioned away from the lower end of the capacitor body and have a protruding portion on the lower side. The aforementioned mounting portion has a rough bottom surface. The bottom surface of the mounting portion has a rough interior region, and the edge portion surrounding the interior region has a lower roughness than the interior region. An electronic component wherein the internal region on the bottom surface of the mounting portion and the end portion surrounding the internal region are formed so as to face the rough internal region and the end portion surrounding the internal region, respectively, on the upper surface of the electrode pad on the mounting substrate to which the bottom surface of the mounting portion of the metal frame is connected when the electronic component is mounted on the mounting substrate.

2. The electronic component according to claim 1, wherein the maximum height roughness (Rmax) of the bottom surface of the mounting portion is 5 to 75 μm.

3. The electronic component according to claim 1 or 2, wherein the bottom surface of the mounting portion has an uneven shape.

4. The electronic component according to any one of claims 1 to 3, wherein the bottom surface of the mounting portion has a mesh pattern.

5. The electronic component according to any one of claims 1 to 4, wherein only the internal region of the bottom surface of the mounting portion has roughness, and the end portion of the mounting portion is formed in a flat shape without roughness.

6. The electronic component according to any one of claims 1 to 5, wherein the thickness of the mounting portion is 125 μm.

7. The capacitor body comprises a dielectric layer and a plurality of internal electrodes arranged alternately with the dielectric layer in between, according to any one of claims 1 to 6.

8. The aforementioned external electrode is A head portion is positioned on one side of the capacitor body, The electronic component according to any one of claims 1 to 7, comprising a band portion extending from the head portion to a portion of the upper and lower surfaces and both sides of the capacitor body.

9. The aforementioned metal frame is The aforementioned connecting portion is connected to the head, The electronic component according to claim 8, wherein the mounting portion is bent and extended below the connecting portion.

10. circuit board and The capacitor body and External electrodes are arranged at both ends of the capacitor body, A metal frame including connection parts connected to the external electrodes and mounting parts positioned away from the lower end of the capacitor body and having a protruding part on the lower side, The substrate comprises electrode pads arranged such that the bottom surfaces of the mounting portions of the metal frame are connected to the upper surfaces of the substrate, A mounting substrate for electronic components, wherein the mounting portion has a rough bottom surface, the internal region of the bottom surface of the mounting portion has a rough surface, the edge portion of the bottom surface surrounding the internal region is less rough than the internal region, the upper surface of the electrode pad in contact with the bottom surface of the mounting portion has a rough surface, the internal region of the upper surface of the electrode pad has a rough surface, and the edge portion of the upper surface surrounding the internal region is less rough than the internal region.

11. The mounting substrate for electronic components according to claim 10, wherein the maximum height roughness (Rmax) of the bottom surface of the mounting portion and the maximum height roughness (Rmax) of the electrode pad are 5 to 75 μm.

12. The mounting substrate for electronic components according to claim 10 or 11, wherein the bottom surface of the mounting portion and the upper surface of the electrode pad have an uneven shape.

13. The mounting substrate for electronic components according to any one of claims 10 to 12, wherein the bottom surface of the mounting portion and the upper surface of the electrode pad have a mesh pattern.

14. Of the bottom surface of the mounting portion, only the internal region has roughness, and the end portion of the mounting portion is formed in a flat shape without roughness. A mounting substrate for an electronic component according to any one of claims 10 to 13, wherein only the internal region of the upper surface of the electrode pad is rough, and the end portion of the upper surface of the electrode pad is formed in a flat shape without roughness.

15. The capacitor body comprises a dielectric layer and a plurality of internal electrodes arranged alternately with the dielectric layer in between, the mounting substrate for an electronic component according to any one of claims 10 to 14.

16. The aforementioned external electrode is A head portion is positioned on one side of the capacitor body, A mounting substrate for an electronic component according to any one of claims 10 to 15, comprising a band portion extending from the head portion to a portion of the upper and lower surfaces and both sides of the capacitor body.

17. The aforementioned metal frame is The aforementioned connecting portion is connected to the head, The mounting portion is bent and extended below the connection portion, as described in claim 16, for mounting electronic components on a substrate.

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