Processing equipment

Abstract

To prevent an adhesion of dust adhered to a spinner table to a wafer.SOLUTION: A processing device comprises: a spinner cleaning unit 80 of cleaning a wafer held by a spinner table 81; a robot that conveys the wafer to a cassette by approaching a robot hand holding the wafer as well as conveying the wafer from the cassette by approaching the robot hand into the cassette; and a dust suction work cassette that houses a dust suction work 90 providing a cleaning surface 93 having a tack force to at least a lower surface. The lower surface of the dust suction work 90 housed in the dust suction work cassette conveys the dust suction work 90 so as to be mounted to an adsorption surface 831 of the spinner table 80, the lower surface 93 of the dust suction work 90 is adsorbed to the adsorption surface 831 by communicating the adsorption surface 831 of the spinner table 80 with a suction source 896, the dust suction work 90 is separated from the adsorption surface 831, and the dust work cassette is housed.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a processing apparatus that generates dust such as processing chips by processing.

Background Art

[0002] In a processing apparatus that processes a wafer held on a chuck table using a processing tool such as a grinding wheel or a polishing pad, a cassette placed on a cassette stage houses the wafer to be processed, and the wafer is taken out of the cassette by a robot and conveyed to a position table. Then, after the wafer is centered on the position table, the wafer is carried into the chuck table by a loading mechanism. When the wafer held on the chuck table is processed by a processing tool, the processed wafer is conveyed to a spinner cleaning mechanism by an unloading mechanism and cleaned, and the wafer is housed in a cassette by a robot (see, for example, Patent Document 1).

[0003] The processing apparatus is covered by a cover, and an opening / closing port is provided on the side surface of the cover. During maintenance work such as replacing the processing tool, the operator opens the opening / closing port, generating an air flow inside the apparatus, causing dust such as dry and fine processing chips to rise inside the processing apparatus and adhere to the upper surface of the spinner table provided in the spinner cleaning mechanism, the upper surface of the position table, and the upper surface of the robot hand of the robot. Then, if the wafer is held after dust adheres to these, the dust adheres to the wafer. Therefore, after washing the lower surface of the wafer, the wafer is conveyed to the chuck table (see, for example, Patent Document 2). Performing downward blow with clean air with the holding surface of the robot hand facing vertically (see, for example, Patent Document 3), closing the cover of the spinner table (see, for example, Patent Document 4), etc. are being carried out.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

[0005] However, even with the above measures in place, dust can still adhere to the spinner table. This dust then adheres to the tape surface attached to the underside of the wafer that has been held and cleaned on the spinner table, and the wafer is then stored in the cassette in this state. Therefore, while some spinner cleaning units can clamp the edges of thicker wafers to clean the underside, for thin wafers, the wafer is held in place by the suction surface on the top of the spinner table and the top surface is cleaned.

[0006] Therefore, in wafer processing equipment, there is a challenge in preventing dust from adhering to the wafers stored in the cassette. [Means for solving the problem]

[0007] The present invention relates to a wafer processing apparatus comprising: a cassette stage on which a cassette containing wafers is placed; a chuck table for holding wafers on a holding surface; a loading unit for loading wafers onto the chuck table; a processing unit for processing wafers held on the holding surface; an unloading unit for unloading wafers from the chuck table; a spinner cleaning unit for cleaning the upper surface of wafers by rotating a spinner table that has adsorbed the lower surface of the wafers transported by the unloading unit on an adsorption surface; a robot for inserting a robot hand into the cassette placed on the cassette stage to unload wafers from the cassette, or for inserting the robot hand holding a wafer into the cassette to load wafers into the cassette; and a control unit, wherein the cleaning surface has a size that covers the adsorption surface of the spinner table and has a polyolefin resin sheet attached to one side of the base material, providing tack force. And a second cleaning surface made of the polyolefin resin sheet adhered to the other side of the base material. The control unit controls the following actions: a dust-collecting workpiece cassette containing a dust-collecting workpiece, the robot transports the dust-collecting workpiece so that the cleaning surface on one side of the dust-collecting workpiece contained in the dust-collecting workpiece cassette is adsorbed by the adsorption surface of the spinner table; the adsorption surface of the spinner table communicates with a suction source and adsorbs the cleaning surface on one side of the dust-collecting workpiece to the adsorption surface; and the robot separates the dust-collecting workpiece from the adsorption surface and places it in the dust-collecting workpiece cassette. death, The spinner cleaning unit, under the control of the control unit, cleans the second cleaning surface when the suction surface of the spinner table sucks and holds the cleaning surface of the dust-collecting workpiece, and cleans the cleaning surface when the suction surface of the spinner table sucks and holds the second cleaning surface of the dust-collecting workpiece. . [Effects of the Invention]

[0008] In this invention, by adsorbing a dust-adsorbing workpiece on the spinner table, dust attached to the adsorption surface of the spinner table is transferred to the dust-adsorbing workpiece, and by separating the dust-adsorbing workpiece from the adsorption surface, dust can be removed from the adsorption surface. This prevents dust from adhering to the wafers adsorbed on the spinner table, and allows the cleaned wafers to be stored in the cassette in a clean state. Furthermore, if the dust-adsorbing work cassette is a cassette that houses wafers, there is no need to install a new stage on which to place the dust-adsorbing work cassette, thus eliminating the need to modify conventional processing equipment. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing an example of a processing apparatus. [Figure 2] This is a schematic cross-sectional view showing a dust-collecting workpiece being held in place by a spinner table. [Figure 3] This is a schematic cross-sectional view showing the state in which dust-adsorbing workpieces are separated from the spinner table to remove dust. [Modes for carrying out the invention]

[0010] The grinding apparatus 1 shown in Figure 1 is an example of a processing apparatus, and is a processing apparatus that grinds a wafer 10 held in a chuck table 20 using a grinding mechanism 30. This grinding apparatus 1 is divided into an loading / unloading area 11 where the wafer 10 is loaded and unloaded from the chuck table 20, and a processing area 12 where the wafer 10 is processed.

[0011] The front of the grinding apparatus 1 is equipped with cassette stages 61 and 62 on which cassettes 610 and 620, which house wafers 10 in a shelf-like arrangement, are mounted. For example, wafers 10 before grinding are housed in cassette 610, and wafers 10 after grinding are housed in cassette 620.

[0012] A robot 63 is positioned behind the cassette stage (+Y side) to load and unload wafers 10 into cassettes 610 and 620. The robot 63 comprises a robot hand 631 for suction and holding the wafers 10, a reversing drive unit 632 for reversing the front and back of the robot hand 631, an arm 633 connected to the reversing drive unit 632, and an arm drive unit 634 for moving the arm 633 back and forth, rotating it, and raising and lowering it.

[0013] A centering device 70 for aligning the center of the wafer 10 before grinding to a specific position is provided within the range of motion of the robot hand 631. The centering device 70 consists of a position table 71 on which the wafer 10 is placed, and multiple pins 72 arranged in an arc shape around the position table 71, each of which is movable toward the center of the position table 71.

[0014] Within the range of motion of the robot hand 631, a spinner cleaning unit 80 for cleaning the wafer 10 after grinding is positioned in the same direction as the centering device 70 in the X-axis direction. The spinner cleaning unit 80 includes a spinner table 81 for suction and holding the wafer 10 after grinding, and a nozzle 82 for spraying cleaning fluid onto the wafer 10 held on the spinner table 81. The surface of the spinner table 81 is an adsorption surface 813 that adsorbs the lower surface 101 of the wafer 10.

[0015] The chuck table 20 comprises a suction unit 21 having a holding surface 210 on its surface for suction holding of the wafer 10, and a frame 22 housing the suction unit 21, with the holding surface 210 exposed from the inner circumference of the frame 22. The holding surface 210 and the upper surface 220 of the frame 22 are formed flush. The suction unit 21 is in communication with a suction source (not shown). The chuck table 20 is driven by a horizontal movement mechanism (not shown) to move in the Y-axis direction, and is also rotatable about a rotation axis that passes through the center of the holding surface 210 and is perpendicular to the holding surface 210.

[0016] A loading unit 51 is provided near the centering device 70 for loading the wafer 10 from the centering device 70 to the chuck table 20. The loading unit 51 includes a holding part 510 that holds the upper surface 100 of the wafer 10 before grinding by suction, an arm part 511 to which the holding part 510 is connected at its tip, a lifting drive unit (not shown) that raises and lowers the holding part 510 and the arm part 511, and a swivel drive unit (not shown) that swivels the holding part 510 and the arm part 511.

[0017] In the vicinity of the spinner cleaning unit 80, a transfer unit 52 for transferring the wafer 10 after grinding from the chuck table 20 to the spinner table 81 is arranged. The transfer unit 52 includes a holding portion 520 that sucks and holds the upper surface 100 of the wafer 10 after grinding, an arm portion 521 to which the holding portion 520 is connected at the tip, a lifting drive portion (not shown) that raises and lowers the holding portion 520 and the arm portion 521, and a turning drive portion (not shown) that turns the holding portion 520 and 521.

[0018] The grinding mechanism 30 is a processing unit that grinds the wafer 10 held on the chuck table 20, and includes a spindle 31 having a rotation axis extending in the Z-axis direction, a spindle rotation mechanism 32 that rotates the spindle 31, a spindle housing 33 that rotatably supports the spindle 31, a mount 34 connected to the lower end of the spindle 31, and a grinding wheel 35 mounted on the mount 34. When the spindle rotation mechanism 32 rotates the spindle 31, the grinding wheel 35 also rotates. The grinding wheel 35 is composed of a base 350 fixed to the mount 34 and a plurality of grinding wheels 351 annularly fixed to the lower surface of the base 350.

[0019] The grinding mechanism 30 is supported so as to be able to move up and down by a grinding feed mechanism 40. The grinding feed mechanism 40 includes a ball screw 41 having a rotation axis in the Z-axis direction, a motor 42 that rotates the ball screw 41, a pair of guide rails 43 arranged in parallel with the ball screw 41, a lifting plate 44 having a nut (not shown) inside whose side portion is in sliding contact with the guide rail 43 and is screwed to the ball screw 41, and a holder 45 connected to the lifting plate 44 and supporting the spindle housing 33. When the motor 42 is driven and the ball screw 41 rotates, the lifting plate 44 is guided by the guide rail 43 and moves in the Z-axis direction, and accordingly, the grinding mechanism 30 also moves in the Z-axis direction.

[0020] A thickness measuring device 53 for measuring the thickness of the wafer 10 is positioned to the side of the Y-axis movement path of the chuck table 20. The thickness measuring device 53 includes a first measuring unit 531 that contacts the upper surface 220 of the frame 22 of the chuck table 20 to measure the height of the upper surface 220, and a second measuring unit 532 that contacts the upper surface 100 of the wafer 10 held on the holding surface 210 to measure the height of the upper surface 100. The thickness of the wafer 10 is calculated from the difference between the measurement value of the first measuring unit 531 and the measurement value of the second measuring unit 532.

[0021] A gate-shaped wall 75 with an opening 750 is erected at the boundary between the loading / unloading area 11 and the processing area 12. A dust-collecting work cassette 74 for housing dust-collecting workpieces 90 is provided on the side of the wall 75 facing the loading / unloading area 11. In the illustrated example, the dust-collecting work cassette 74 has two housing sections 741 that open towards the robot 63.

[0022] The dust-adsorbing workpiece 90 consists of a base material 91, a cleaning surface 92 provided on the upper surface of the base material 91, and a cleaning surface 93 provided on the lower surface of the base material 91. The cleaning surfaces 92 and 93 are made of a material having tack force. Examples of materials having tack force include flexible resins and silicones. In the illustrated example, cleaning surfaces 92 and 93 are provided on both sides of the base material 91, but it is also possible to have only the cleaning surface 93 on the lower surface of the base material 91. For example, the dust-adsorbing workpiece 90 can be constructed by attaching a tape made of polyolefin as the base material to one or both sides of the base material 91. Alternatively, the dust-adsorbing workpiece can be constructed by heat-welding a polyolefin sheet to the base material 91. Furthermore, the base material 91 may be made of a polyolefin resin, and the dust-adsorbing workpiece 90 may be constructed using only the base material. The dust-adsorbing workpiece cassette 74 in the example of Figure 1 has two storage compartments 741, so it can accommodate two dust-adsorbing workpieces 90.

[0023] A cleaning surface cleaning unit 77 is provided in the vicinity of the dust-collecting work cassette 74, within the range of motion where the holding part 520 of the discharge unit 52 rotates by the swivel drive unit, to clean the cleaning surfaces 92 and 93 of the dust-collecting work 90. ​​The cleaning surface cleaning unit 77 is, for example, a cylindrical sponge member that can rotate about a rotation axis in the XY axis direction intersecting the rotation direction of the holding part 520 of the discharge unit 52. The cleaning surface cleaning unit 77 may also be provided within the range of motion of the robot hand 631. For example, it may be provided adjacent to the spinner cleaning unit 80, so that the dust-collecting work 90 is cleaned when the robot hand 631 holds and discharges the dust-collecting work 90 from the spinner table 81. The rotation axis for rotating the sponge member may also be in the Z axis direction. Alternatively, two sponge members may be provided so that both sides of the dust-collecting work 90 are cleaned when it passes between the two sponge members.

[0024] The grinding device 1 is entirely covered by a cover 76. An opening 760 is provided on the side of the cover 76. A gripping portion 761 for the operator to grasp is formed in the opening 760.

[0025] A display 78 is located at the front (-Y direction side) of the cover 76. This display 78 is, for example, a touch panel and is used for displaying and inputting machining conditions.

[0026] The grinding apparatus 1 is equipped with a control unit 79 that has memory elements such as a CPU and memory. The control unit 79 controls the operation of the robot 63, the centering device 70, the loading unit 51, the unloading unit 52, the chuck table 20, the grinding mechanism 30, the grinding feed mechanism 40, and the spinner cleaning unit 80.

[0027] As shown in Figure 2, the nozzle 82 is connected to the cleaning fluid supply source 821. The spinner table 81 also includes a suction section 83 made of a porous material and a frame 84 that supports the suction section 83. The frame 84 is supported from below by a disc 85. A recess 841 is formed in the frame 84, and the suction section 83 is housed in the recess 841.

[0028] A rotating shaft 86 is connected to the lower part of the disc 85. The rotating shaft 86 is connected to a motor 881 via a rotary joint 87. The motor 881 is also equipped with an encoder 882 for detecting the rotation angle of the motor 881. A flow path 870, which serves as an air passage, is formed inside the frame 84, disc 85, rotating shaft 86, and rotary joint 87. One end of the flow path 870 opens on the upper surface of the recess 841 of the frame 84 and communicates with the suction section 83. The other end of the flow path 870 branches into two outside the rotary joint 87. One is connected to an air supply source 893 via a variable orifice 891 and an on-off valve 892, and the other is connected to a suction source 896 via a variable orifice 894 and an on-off valve 895. A pressure gauge 897 is connected to the flow path 870. On the suction surface 831 on the upper surface of the suction unit 83, a wafer 10 or dust-adsorbing workpiece 90 can be adsorbed by closing the on-off valve 892 and opening the on-off valve 895 to connect the flow path 870 to the suction source 896. On the other hand, by closing the on-off valve 895 and opening the on-off valve 892 to connect the flow path 870 to the air supply source 893, air can be ejected from the suction surface 831.

[0029] In the grinding apparatus 1 shown in Figure 1, multiple wafers 10 to be ground are housed in a cassette 610. The robot hand 631 of the robot 63 enters the cassette 610 and picks up one wafer 10. The robot hand 631 then retracts from the cassette 610 and transports the wafer 10 to the centering device 70, where it is placed on the position table 71. Next, the pin 72 moves toward the center of the position table 71, thereby aligning the center of the wafer 10 to a specific position.

[0030] After the wafer 10 is centered in this way, the arm portion 511 of the loading unit 51 rotates and descends, and the holding portion 510 sucks and holds the upper surface 100 of the wafer 10. The arm portion 511 rotates and transports the wafer 10 above the chuck table 20, and the holding portion 510 descends and places the lower surface 101 of the wafer 10 on the holding surface 210 of the chuck table 20. Then, a suction force is applied to the holding surface 210 to suck and hold the wafer 10.

[0031] Next, the chuck table 20 moves in the +Y direction to position the wafer 10 below the grinding mechanism 30. Then, the spindle rotation mechanism 32 rotates the grinding wheel 35, and the grinding feed mechanism 40 lowers the grinding mechanism 30, bringing the rotating grinding wheel 351 into contact with the upper surface 100 of the wafer 10 to perform grinding. During grinding, the thickness measuring instrument 53 measures the thickness of the wafer 10 by the difference between the measurements of the first measuring section 531 and the second measuring section 532. When the wafer 10 reaches a predetermined thickness, the grinding feed mechanism 40 raises the grinding mechanism 30 to end the grinding.

[0032] After grinding is complete, the chuck table 20 moves in the -Y direction, and the arm portion 521 of the transfer unit 52 rotates so that the holding portion 520 is positioned above the wafer 10. Then, the holding portion 520 descends to hold the upper surface 100 of the wafer 10 by suction, and after the holding portion 520 rises, the arm portion 521 rotates so that the wafer 10 moves above the spinner table 81 of the spinner cleaning unit 80. Then, the holding portion 520 descends so that the lower surface 101 of the wafer 10 is placed on the spinner table 81. Subsequently, by opening the on / off valve 895 shown in Figure 2 and closing the on / off valve 892, the wafer 10 is held by suction on the suction surface 831 of the suction portion 83. After that, as the spinner table 81 rotates, cleaning fluid is sprayed from the nozzle 82, and the upper surface 100 of the wafer 10 is cleaned. After cleaning, the spinner table 81 rotates and high-pressure air is sprayed from the nozzle 82 to dry the wafer 10.

[0033] Next, the robot hand 631 of the robot 63 moves above the wafer 10, and the robot hand 631 descends to suck and hold the upper surface 100 of the wafer 10. Then, by closing the on / off valve 895 and opening the on / off valve 892, air is blown out from the suction surface 831, and the rising of the robot hand 631 separates the wafer 10 from the suction surface 831, and the rotation and forward movement of the arm 633 places the wafer 10 into the cassette 620. For all wafers 10 stored in the cassette 610, the upper surface 100 is ground, cleaned by the spinner cleaning unit 80, and stored in the cassette 620 in the manner described above.

[0034] During maintenance of the grinding machine 1, the operator grips the gripping part 761 shown in Figure 1 to open and close the opening 760. This generates an airflow inside the area enclosed by the cover 76, causing dust such as grinding debris to be stirred up inside the area enclosed by the cover 76, and particularly adhering to the suction surface 831 of the spinner table 81. Therefore, under the control of the control unit 79, the dust adhering to the suction surface 831 of the spinner table 81 is removed as follows.

[0035] The robot hand 631 of robot 63 enters the housing section 741 of the dust collection work cassette 74 and sucks and holds, for example, the cleaning surface 92 of the dust collection work 90. ​​Next, the robot hand 631 retracts from the housing section 741 and moves the dust collection work 90 above the spinner table 81. Then, the robot hand 631 is lowered so that the cleaning surface 93 side of the dust collection work 90 is placed on the suction surface 831 of the spinner table 81.

[0036] Next, as shown in Figure 2, by opening the on-off valve 895 and closing the on-off valve 892, the suction unit 83 and the suction source 896 are connected, and an adhesive force is applied to the suction surface 831 to adsorb the cleaning surface 93, causing the cleaning surface 93 and the suction surface 831 to be in close contact. As a result, the dust 95 that was attached to the suction surface 831 is held in place by the tack force of the cleaning surface 93. Here, the cleaning surface 93 of the dust-adsorbing workpiece 90 is formed to have a larger diameter than the suction surface 831 of the spinner table 81 and covers the entire surface of the suction surface 831, so it can hold dust from the entire surface of the suction surface 831.

[0037] Next, the robot hand 631 is lowered to suck and hold the cleaning surface 92 of the dust-collecting workpiece 90. Then, as shown in Figure 3, the on-off valve 892 is opened and the on-off valve 895 is closed, connecting the suction unit 83 and the air supply source 893, and the robot hand 631 is raised while air is blown out from the suction surface 831. As a result, as shown in Figure 3, the dust-collecting workpiece 90 held by the robot hand 631 rises and separates from the suction surface 831. At this time, the dust 95 remains held on the cleaning surface 93, and the dust 95 is removed from the suction surface 831.

[0038] The dust-collecting workpiece 90, which has thus held the dust 95, is housed in the storage section 741 of the dust-collecting workpiece cassette 74 while being held by the robot hand 631. Since the dust-collecting workpiece 90 has cleaning surfaces 92 and 93 on both sides, when cleaning the suction surface 831 of the spinner table 81 with the cleaning surface 93, the robot hand 631 holds the cleaning surface 92 of the dust-collecting workpiece 90 by suction. Therefore, if dust is attached to the holding surface of the robot hand 631, the dust is held by the cleaning surface 92, and thus the dust is removed from the holding surface of the robot hand 631.

[0039] The cleaning of the spinner table 81 in this manner is performed each time the opening 760 is opened for maintenance. Therefore, for example, after the suction surface 831 of the spinner table 81 is cleaned by the cleaning surface 93, the reversal drive unit 632 shown in Figure 1 flips the robot hand 631 over to reverse the front and back sides of the dust-collecting workpiece 90, thereby allowing the cleaning surface 92 to remove dust from the suction surface 831 of the spinner table 81.

[0040] Furthermore, if dust adheres to the position table 71 shown in Figure 1, the robot hand 631 can clean the position table 71 by sucking up and holding the dust-collecting workpiece 90, transporting it to the position table 71, and placing it on top.

[0041] It is also possible to clean a dust-adsorbing workpiece 90 with dust adhering to its cleaning surfaces 92 and 93. For example, the robot hand 631 can suck and hold either the cleaning surface 92 or 93 of the dust-adsorbing workpiece 90, and the reversing drive unit 632 rotates the robot hand 631 90 degrees around a horizontal axis. Then, by bringing it into contact with the side surface cleaning unit 77 extending in the Z-axis direction and moving it forward and backward, the cleaning surface not held by the robot hand 631 can be cleaned.

[0042] Alternatively, the cleaning surfaces 92 and 93 of the dust-collecting workpiece 90 may be cleaned using the spinner cleaning unit 80. That is, the robot hand 631 may suction and hold either the cleaning surface 92 or 93 of the dust-collecting workpiece 90 and transport the dust-collecting workpiece 90 from the dust-collecting workpiece cassette 74 to the spinner table 81, and while suctioning and holding one of the cleaning surfaces of the dust-collecting workpiece 90 on the suction surface 831, the cleaning solution may be sprayed onto the other cleaning surface while the spinner table 81 is rotated to perform the cleaning. Alternatively, a cleaning surface cleaning unit 77 may be placed within the movable range of the holding portion 520 of the discharge unit 52. Then, as described above, the discharge unit 52 may hold the dust-adsorbing workpiece 90 that has cleaned the other cleaning surface, move it away from the adsorption surface 831, and clean the other cleaning surface with the cleaning surface cleaning unit 77 placed within the movable range of the holding portion 520.

[0043] In this way, the dust adhering workpiece 90 can be used to remove dust adhering to the adsorption surface 831 of the spinner table 81, thereby preventing dust from adhering to the underside 101 of the wafer 10 during cleaning, and allowing the wafer 10 to be stored in the cassette 620 in a clean state. In addition, if protective tape is attached to the underside 101 of the wafer 10, dust can be prevented from adhering to the protective tape.

[0044] Alternatively, the dust-collecting work cassette 74 may be placed on either the cassette stage 61 or 62, or the dust-collecting work 90 may be housed in a portion of the cassettes 610 and 620 placed on the cassette stages 61 and 62. In other words, either the cassette 610 or 620 may be designated as the dust-collecting work cassette.

[0045] Furthermore, although a grinding device was used as an example of a processing device in this embodiment, processing devices also include polishing devices that polish wafers using a rotating polishing pad. [Explanation of symbols]

[0046] 1: Grinding device 10: Wafer 100: Top surface 101: Bottom surface 11: Loading / unloading area 12: Processing area 20: Chuck Table 21: Suction part 210: Holding surface 22: Frame body 220: Top surface 30: Grinding mechanism 31: Spindle 32: Spindle rotation mechanism 33: Spindle housing 34: Mount 35: Grinding wheel 350: Base 351: Grinding wheel 40: Grinding feed mechanism 41: Ball screw 42: Motor 43: Guide rail 44: Lifting plate 45: Holder 51: Loading unit 510: Holding unit 511: Arm unit 52: Discharge unit 520: Holding unit 521: Arm unit 53: Thickness measuring instrument 531: First measuring section 532: Second measuring section 61: Cassette stage 610: Cassette 62: Cassette stage 620: Cassette 63: Robot 631: Robot Hand 632: Reversing Drive Unit 633: Arm section 634: Arm drive section 70: Centering device 71: Position table 72: Pin 74: Dust-collecting work cassette 741: Storage compartment 75: Wall 750: Opening 76: Cover 760: Opening / closing part 761: Grip part 77: Cleaning surface cleaning unit 78: Display 79: Control unit 80: Spinner cleaning unit 81: Spinner table 82: Nozzle 821: Cleaning fluid supply source 83: Suction part 831: Suction surface 84: Frame 841: Recess 85: Disc 86: Rotating axis 87: Rotary joint 870: Flow channel 881: Motor 882: Encoder 891: Variable orifice 892: On / off valve 893: Air supply source 894: Variable orifice 895: On / off valve 896: Suction source 897: Pressure gauge 90: Dust adsorption workpiece 91: Substrate 92: Cleaning surface 93: Cleaning surface 95: Dust

Claims

[Claim 1] A processing apparatus for processing wafers, The system comprises a cassette stage on which a cassette containing wafers is placed, a chuck table for holding wafers on a holding surface, a loading unit for loading wafers onto the chuck table, a processing unit for processing wafers held on the holding surface, a loading unit for unloading wafers from the chuck table, a spinner cleaning unit for cleaning the upper surface of wafers by rotating a spinner table that has a suction surface attached to the lower surface of wafers transported by the unloading unit, a robot for inserting a robot hand into the cassette placed on the cassette stage to unload wafers from the cassette, or for inserting a robot hand holding a wafer into the cassette to load wafers into the cassette, and a control unit. The dust-adsorbing workpiece cassette contains a dust-adsorbing workpiece having a cleaning surface having tackiness due to a polyolefin resin sheet being attached to one side of the base material and having a size that covers the adsorption surface of the spinner table, and a second cleaning surface made of the same polyolefin resin sheet attached to the other side of the base material. The control unit is The robot is to transport the dust-collecting workpiece, which is housed in the dust-collecting workpiece cassette, such that the cleaning surface on one side of the dust-collecting workpiece is adsorbed by the adsorption surface of the spinner table. The suction surface of the spinner table is connected to a suction source, and the cleaning surface of one side of the dust-collecting workpiece is adsorbed onto the suction surface. The robot separates the dust-collecting workpiece from the suction surface and places it into the dust-collecting workpiece cassette. To make them do, Control, The spinner cleaning unit is controlled by the control unit, When the suction surface of the spinner table suction and holds the cleaning surface of the dust-collecting workpiece, the second cleaning surface is cleaned, and when the suction surface of the spinner table suction and holds the second cleaning surface of the dust-collecting workpiece, the cleaning surface is cleaned. Processing equipment.

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