Processing equipment

Abstract

To immediately notify an operator of the occurrence of abnormality when abnormality occurs in air exhaustion of a treatment chamber.SOLUTION: A processing device for processing a workpiece includes: a chuck table for holding a workpiece; a processing unit for processing the workpiece held by the chuck table; a processing chamber for storing the chuck table and the processing unit; a duct connected to an air exhauster at one end and connected to the processing chamber at the other end; a measurement unit arranged outside the duct and measuring a value corresponding to a flow rate of gas flowing in the inside of the duct; a control unit; and a notification unit. The control unit determines whether the flow rate of gas inside the duct is normal or abnormal based on a value measured by the measurement unit and a previously set threshold value, and the notification unit emits error when it is determined that the flow rate of gas inside the duct is abnormal.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a processing apparatus for processing a workpiece.

Background Art

[0002] When processing a workpiece such as a semiconductor wafer, a resin package substrate, a ceramic substrate, or a glass substrate, various processing apparatuses are used. The processing apparatus includes a chuck table for holding the workpiece and a processing unit for processing the workpiece held by the chuck table.

[0003] For example, when dividing a workpiece into a plurality of chips, a cutting apparatus including a processing unit (cutting unit) to which an annular cutting blade for cutting the workpiece is attached is used. In addition, for a process of thinning a workpiece, a grinding apparatus including a grinding wheel including a plurality of grinding wheels for grinding the workpiece and having a processing unit (grinding unit) attached thereto, or a polishing apparatus including a processing unit (polishing unit) to which a polishing pad for polishing the workpiece is attached is used. Then, the workpiece is processed by the processing unit in the processing chamber of the processing apparatus while being held by the chuck table.

[0004] When processing a workpiece with a processing apparatus, a liquid (processing liquid) such as pure water is supplied to the processing unit and the workpiece. The processing liquid cools the processing unit and the workpiece, and at the same time, chips (processing chips) generated by the processing are washed away.

[0005] During the machining of a workpiece, the machining fluid comes into contact with the high-speed rotating machining unit and the workpiece, causing it to scatter. As a result, the machining chamber becomes filled with a mist-like machining fluid containing machining debris. If machining continues in such a state, the machining fluid containing the debris may adhere to the workpiece, contaminating it and potentially degrading the quality of the products (device chips, etc.) manufactured by the machining process. In addition, the mist-like machining fluid may leak from the machining chamber and adhere to components of the machining equipment (actuators, electrical wiring, etc.), potentially causing deterioration or malfunction of these components.

[0006] Therefore, a duct for exhausting the processing chamber is connected to the processing apparatus. For example, Patent Document 1 discloses an exhaust system connected to a cutting apparatus via a duct. This exhaust system discharges any mist-like processing fluid remaining in the processing chamber through the duct.

[0007] However, due to various reasons such as malfunction of the exhaust system connected to the duct or deterioration of the fan that generates airflow within the duct, the exhaust from the processing chamber may not function properly. Similarly, when the workpiece is being cleaned with cleaning fluid in the cleaning chamber of the processing equipment, the exhaust from the cleaning chamber may become insufficient due to the same reasons.

[0008] If a processing machine continues to operate without recognizing that the exhaust from its processing chambers (processing chamber, cleaning chamber, etc.) is not being properly performed, various problems can arise, such as the generation of large quantities of workpieces contaminated by foreign matter (processing dust, etc.) remaining in the processing chamber, or the deterioration of components of the processing machine due to mist-like processing fluids or cleaning fluids adhering to those components. As a result, the quality of workpieces processed by the processing machine will deteriorate, and the processing machine will be more prone to failure.

[0009] Therefore, a processing device was developed that includes a measuring unit inside the processing chamber to measure a value corresponding to the gas flow velocity inside the chamber, detects abnormalities in gas flow based on the value measured by the measuring unit, and promptly notifies the operator of the occurrence of the abnormality (see Patent Document 2). [Prior art documents] [Patent Documents]

[0010] [Patent Document 1] Japanese Patent Application Publication No. 11-188568 [Patent Document 2] Japanese Patent Publication No. 2022-41448 [Overview of the project] [Problems that the invention aims to solve]

[0011] However, within the processing chamber of an operating processing machine, various structures are constantly moving, resulting in complex airflow with unpredictable flow rates, velocity, and direction, regardless of whether the processing chamber's exhaust is functioning correctly. Measuring the values ​​corresponding to the velocity of this complex airflow and detecting abnormalities in the processing chamber's exhaust quickly, accurately, and with high sensitivity based on these measurements is not easy.

[0012] This invention has been made in view of the above problems, and aims to provide a processing apparatus that can quickly, accurately, and sensitively detect the occurrence of an abnormality in the exhaust of the processing chamber and promptly notify the operator. [Means for solving the problem]

[0013] According to one aspect of the present invention, a processing apparatus for processing a workpiece comprises a chuck table for holding the workpiece, a processing unit for processing the workpiece held by the chuck table, a processing chamber housing the chuck table and the processing unit, a duct having one end connected to an exhaust device and the other end connected to the processing chamber, and the duct external surface The gas flow inside the duct is arranged in such a manner. The speed is transmitted through the pipe wall of the duct.A processing apparatus is provided, comprising a measuring unit, a control unit, and a notification unit, wherein the control unit determines whether the gas flow inside the duct is normal or abnormal based on the value measured by the measuring unit and a preset threshold, and the notification unit issues an error when it is determined that the gas flow inside the duct is abnormal.

[0014] Furthermore, according to another aspect of the present invention, a processing apparatus for processing a workpiece, comprising: a chuck table for holding the workpiece; a processing unit for processing the workpiece held by the chuck table; a spinner table for holding the workpiece; a cleaning unit for cleaning the workpiece held by the spinner table; a cleaning chamber housing the spinner table and the cleaning unit; a duct having one end connected to an exhaust device and the other end connected to the cleaning chamber; and the duct external surface The gas flow inside the duct is arranged in such a manner. The speed is transmitted through the pipe wall of the duct. A processing apparatus is provided, comprising a measuring unit, a control unit, and a notification unit, wherein the control unit determines whether the gas flow inside the duct is normal or abnormal based on the value measured by the measuring unit and a preset threshold, and the notification unit issues an error when it is determined that the gas flow inside the duct is abnormal.

[0015] Preferably, the measuring unit comprises a transmitter that emits ultrasonic waves and a receiver that receives the ultrasonic waves, and measures the time it takes for the ultrasonic waves to travel from the transmitter to the receiver.

[0016] Furthermore, according to another aspect of the present invention, a processing apparatus for processing a workpiece, comprising: a chuck table for holding the workpiece; a processing unit for processing the workpiece held by the chuck table; a spinner table for holding the workpiece; a cleaning unit for cleaning the workpiece held by the spinner table; a processing chamber housing the chuck table and the processing unit; a cleaning chamber housing the spinner table and the cleaning unit; a first duct having one end connected to a first exhaust device and the other end connected to the processing chamber; a second duct having one end connected to a second exhaust device and the other end connected to the cleaning chamber; and the first duct external surface It is installed in the first duct, and the flow of gas inside the duct The speed is transmitted through the pipe wall of the first duct. A first measuring unit to measure and the second duct external surface It is installed in the second duct, and the flow of gas inside the duct The speed is transmitted through the pipe wall of the second duct. A processing apparatus is provided, comprising a second measuring unit for taking measurements, a control unit, and a notification unit, wherein the control unit determines whether the gas flow inside the first duct is normal or abnormal based on a value measured by the first measuring unit and a preset first threshold, and determines whether the gas flow inside the second duct is normal or abnormal based on a value measured by the second measuring unit and a preset second threshold, and the notification unit generates an error when it is determined that the gas flow inside the first duct or the gas flow inside the second duct is abnormal.

[0017] Preferably, the first measurement unit and the second measurement unit each include a transmitter that emits ultrasonic waves and a receiver that receives the ultrasonic waves, and measure the time it takes for the ultrasonic waves to travel from the transmitter to the receiver. [Effects of the Invention]

[0018] In a processing apparatus according to one aspect of the present invention, a measurement unit for measuring a value corresponding to the flow velocity of a gas flowing inside a duct is provided outside the duct. Then, based on the value measured by the measurement unit, it is determined whether the gas flow inside the duct is normal or abnormal, and when the gas flow is abnormal, an error is transmitted from the notification unit.

[0019] When an abnormality occurs in the exhaust of the processing chamber, the gas flow inside the duct is directly affected. Moreover, the influence on the gas flow inside the duct due to the operation of various mechanisms arranged inside the processing chamber is extremely small. Therefore, an abnormality in the exhaust of the processing chamber can be detected quickly, with high precision, and with high sensitivity based on the value measured by the measurement unit, enabling the operator to promptly recognize the exhaust abnormality.

[0020] Therefore, according to one aspect of the present invention, there is provided a processing apparatus capable of promptly, highly accurately, and highly sensitively notifying an operator of the occurrence of an abnormality when an abnormality occurs in the exhaust of the processing chamber.

Brief Description of the Drawings

[0021] [Figure 1] It is a perspective view showing a processing apparatus. [Figure 2] It is a partially sectional side view showing a processing apparatus. [Figure 3] It is a partially sectional side view showing a duct partially. [Figure 4] It is a partially sectional front view showing a cleaning chamber.

Embodiments for Carrying Out the Invention

[0022] Hereinafter, an embodiment of one aspect of the present invention will be described with reference to the attached drawings. First, an example of the configuration of the processing apparatus according to this embodiment will be described. Figure 1 is a perspective view showing a processing apparatus (cutting apparatus) 2 that performs cutting on a workpiece. In Figure 1, the X-axis direction (processing feed direction, front-back direction, first horizontal direction) and the Y-axis direction (indexing feed direction, left-right direction, second horizontal direction) are perpendicular to each other. Also, the Z-axis direction (vertical direction, up-down direction, height direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0023] The processing device 2 includes a rectangular parallelepiped base 4 that supports and accommodates each component of the processing device 2. A rectangular opening 4a is provided at the front corner of the base 4. Inside the opening 4a is a cassette support base 6 that moves up and down by a lifting mechanism (not shown). A cassette 8 capable of accommodating multiple workpieces 11 to be processed by the processing device 2 is placed on the upper surface of the cassette support base 6. In Figure 1, the outline of the cassette 8 is shown by a dashed line.

[0024] The workpiece 11 is a disc-shaped wafer made of a semiconductor material such as silicon, and has a front and a back surface. The workpiece 11 is divided into multiple rectangular regions by multiple division lines (streets) arranged in a grid pattern so as to intersect each other. Furthermore, devices such as ICs (Integrated Circuits), LSIs (Large Scale Integrations), LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) are formed in each of the multiple regions demarcated by the division lines on the front side of the workpiece 11.

[0025] A circular tape 13 with a larger diameter than the workpiece 11 is attached to the back side of the workpiece 11. The tape 13 includes a film-like base material and an adhesive (glue layer) on the base material. For example, the base material is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive is made of an epoxy, acrylic, or rubber-based adhesive. Alternatively, an ultraviolet-curing resin that hardens when exposed to ultraviolet light may be used as the adhesive.

[0026] The outer periphery of the tape 13 is attached to an annular frame 15 made of metal or the like. The frame 15 has a circular opening in its center that is larger in diameter than the workpiece 11, and the workpiece 11 is placed inside the opening of the frame 15. When the central part of the tape 13 is attached to the workpiece 11 and the outer periphery of the tape 13 is attached to the frame 15, the workpiece 11 is supported by the frame 15 via the tape 13.

[0027] The workpiece 11 is housed in a cassette 8 while supported by a frame 15 and processed by a processing device 2. For example, by cutting and dividing the workpiece 11 along a planned division line using the processing device 2, multiple device chips, each containing a device, can be obtained.

[0028] However, there are no restrictions on the type, material, shape, structure, size, etc., of the workpiece 11. For example, the workpiece 11 may be a wafer (substrate) made of semiconductors other than silicon (GaAs, InP, GaN, SiC, etc.), glass, sapphire, ceramics, resin, metal, etc. Also, the workpiece 11 may be a resin package substrate. For example, a resin package substrate comprises a base substrate, a plurality of device chips mounted on the base substrate, and a resin layer that covers and seals the plurality of device chips.

[0029] A rectangular opening 4b is provided in plan view in the area of ​​the upper surface of the base 4 located to the side of the opening 4a, with its longitudinal direction aligned with the X-axis. Inside the opening 4b is a ball screw type moving unit (moving mechanism) 10. The moving unit 10 includes a flat plate-shaped moving table 12 positioned to cover the top of the moving unit 10. In addition, bellows-shaped dustproof and splashproof covers 14 are provided on the front and rear of the moving table 12 to cover the top of the moving unit 10.

[0030] A chuck table (holding table) 16 for holding the workpiece 11 is provided on the moving table 12. The upper surface of the chuck table 16 is a flat surface formed approximately parallel to the horizontal direction (XY plane direction), and constitutes a holding surface 16a for holding the workpiece 11. The holding surface 16a is connected to a suction source (not shown), such as an ejector, via a flow path (not shown), a valve (not shown), etc., provided inside the chuck table 16.

[0031] The moving unit 10 moves the chuck table 16 along the X-axis direction together with the moving table 12. A rotational drive source (not shown), such as a motor, is connected to the chuck table 16, and the rotational drive source rotates the chuck table 16 around a rotation axis that is roughly parallel to the Z-axis direction. Furthermore, multiple clamps 18 are provided around the chuck table 16 to grip and fix the frame 15 that supports the workpiece 11.

[0032] Near the openings 4a and 4b, a transport unit (not shown) is provided for transporting the workpiece 11 between the cassette 8 and the chuck table 16. The workpiece 11 is pulled out of the cassette 8 by the transport unit and transported to the chuck table 16. At this time, the workpiece 11 is placed on the holding surface 16a of the chuck table 16 via the tape 13. The frame 15 is also held by a plurality of clamps 18. In this state, when negative pressure from a suction source is applied to the holding surface 16a, the workpiece 11 is held by the chuck table 16 via the tape 13.

[0033] Above the chuck table 16, a pair of processing units (cutting units) 20a and 20b for processing the workpiece 11 are provided. Each of the processing units 20a and 20b is equipped with an annular cutting blade 60 (see Figure 2) for cutting the workpiece 11.

[0034] On the upper surface of the base 4, a gate-shaped support structure 22 supporting the processing units 20a and 20b is positioned so as to straddle the opening 4b. At both ends on the front side of the support structure 22, there are moving units (moving mechanisms) 24a for moving the processing unit 20a along the Y-axis and Z-axis directions, and moving units (moving mechanisms) 24b for moving the processing unit 20b along the Y-axis and Z-axis directions. The moving units 24a and 24b are mounted on a pair of guide rails 26 positioned along the Y-axis direction on the front side of the support structure 22.

[0035] The moving unit 24a includes a flat moving plate 28a. The moving plate 28a is slidably mounted on a pair of guide rails 26. A nut portion (not shown) is provided on the back side (rear side) of the moving plate 28a, and a ball screw 30a, which is positioned approximately parallel to the guide rails 26, is screwed into the nut portion. A pulse motor 32 is connected to the end of the ball screw 30a. When the pulse motor 32 rotates the ball screw 30a, the moving plate 28a moves along the guide rails 26 in the Y-axis direction.

[0036] A pair of guide rails 34a are fixed to the front surface of the movable plate 28a along the Z-axis direction. A flat movable plate 36a is slidably mounted on the pair of guide rails 34a. A nut portion (not shown) is provided on the back surface of the movable plate 36a, and a ball screw 38a, which is positioned approximately parallel to the guide rails 34a, is screwed into the nut portion. A pulse motor 40 is connected to the end of the ball screw 38a. When the ball screw 38a is rotated by the pulse motor 40, the movable plate 36a moves along the guide rails 34a in the Z-axis direction.

[0037] On the other hand, the moving unit 24b includes a flat moving plate 28b. The moving plate 28b is slidably mounted on a pair of guide rails 26. A nut portion (not shown) is provided on the back side (rear side) of the moving plate 28b, and a ball screw 30b, which is positioned roughly parallel to the guide rails 26, is screwed into the nut portion. A pulse motor 32 is connected to the end of the ball screw 30b. When the pulse motor 32 rotates the ball screw 30b, the moving plate 28b moves along the guide rails 26 in the Y-axis direction.

[0038] A pair of guide rails 34b are fixed to the front surface of the movable plate 28b along the Z-axis direction. A flat movable plate 36b is slidably mounted on the pair of guide rails 34b. A nut portion (not shown) is provided on the back surface of the movable plate 36b, and a ball screw 38b, which is positioned approximately parallel to the guide rails 34b, is screwed into the nut portion. A pulse motor 40 is connected to the end of the ball screw 38b. When the pulse motor 40 rotates the ball screw 38b, the movable plate 36b moves along the guide rails 34b in the Z-axis direction.

[0039] The processing units 20a and 20b are fixed to the lower part of the movable plates 36a and 36b, respectively. An imaging unit 42 is also provided adjacent to the processing unit 20a for imaging the workpiece 11 held by the chuck table 16.

[0040] For example, the imaging unit 42 includes a visible light camera equipped with an image sensor that receives visible light and converts it into an electrical signal, and an infrared camera equipped with an image sensor that receives infrared light and converts it into an electrical signal. The images acquired by the imaging unit 42 are used for aligning the workpiece 11 held by the chuck table 16 with the processing units 20a and 20b, etc.

[0041] On the upper surface of the base 4, on the side opposite to the opening 4a of the opening 4b, there is a circular opening 4c in plan view. Inside the opening 4c, there is a spinner table (chuck table) 44 that holds and rotates the workpiece 11, and a cleaning unit 46 that cleans the workpiece 11 held by the spinner table 44.

[0042] Near the openings 4b and 4c, a transport unit (not shown) is provided to transport the workpiece 11 between the chuck table 16 and the cleaning unit 46. After the workpiece 11 is processed by the processing units 20a and 20b, it is transported from the chuck table 16 to the spinner table 44 by the transport unit and cleaned by the cleaning unit 46. Details of the configuration and function of the spinner table 44 and the cleaning unit 46 will be described later (see Figure 4).

[0043] A cover 48 is provided on the upper side of the base 4 to cover the components mounted on the base 4. In Figure 1, the outline of the cover 48 is shown by a dashed line. A display unit (display section, display device) 50 that displays various information related to the processing device 2 is provided on the side of the cover 48.

[0044] For example, the display unit 50 is composed of a touch panel display. In this case, the display unit 50 also functions as an input unit (input section, input device) for inputting various information into the processing device 2, and the operator can input information such as processing conditions into the processing device 2 by touching the display unit 50. In other words, the display unit 50 functions as a user interface.

[0045] An alert unit (alert section, alert device) 52 is provided on the upper side of the cover 48 to inform the operator of predetermined information. For example, an indicator light (warning light) is provided as the alert unit 52, and the indicator light lights up or flashes when an abnormality occurs in the processing device 2 to inform the operator of the error.

[0046] However, there are no restrictions on the notification unit 52. For example, the notification unit 52 may be a speaker that emits a sound (warning sound) to notify of an error when an abnormality occurs in the processing device 2. Alternatively, the display unit 50 can be made to function as a notification unit by displaying information (messages, etc.) that indicates the occurrence of an abnormality on the display unit 50.

[0047] The components of the processing apparatus 2 (cassette support base 6, moving unit 10, chuck table 16, clamp 18, processing units 20a, 20b, moving units 24a, 24b, imaging unit 42, spinner table 44, cleaning unit 46, display unit 50, notification unit 52, etc.) are connected to a control unit (control unit, control device) 54. The control unit 54 controls the operation of each component of the processing apparatus 2.

[0048] For example, the control unit 54 is composed of a computer and includes a calculation unit 56 that performs calculations necessary for the operation of the processing device 2, and a storage unit 58 that stores various information (data, programs, etc.). The calculation unit 56 is composed of a processor such as a CPU (Central Processing Unit). The storage unit 58 is composed of various types of memory that function as main memory, auxiliary memory, etc.

[0049] The workpieces 11 contained in the cassette 8 are transported one by one to the chuck table 16 by a transport unit (not shown). Then, the workpieces 11 are processed by processing units 20a and 20b while being held in place by the chuck table 16. After that, the workpieces 11 are transported to the spinner table 44 by a transport unit (not shown) and washed by a washing unit 46. Finally, the washed workpieces 11 are placed back into the cassette 8.

[0050] Figure 2 is a partial cross-sectional side view showing a processing apparatus 2 for processing a workpiece 11. As an example, Figure 2 shows the processing apparatus 2 when a workpiece 11 held by a chuck table 16 is processed by a processing unit 20a. Note that some components of the processing apparatus 2 are not shown in Figure 2. Furthermore, the configuration and function of the processing unit 20a will be mainly described below, but the processing unit 20b can be configured in the same way as the processing unit 20a.

[0051] The machining unit 20a includes a cylindrical spindle (not shown) arranged along the Y-axis. An annular cutting blade 60 for cutting the workpiece 11 is mounted on the tip (one end) of the spindle. A rotational drive source (not shown), such as a motor, for rotating the spindle is connected to the base (other end) of the spindle. Power transmitted from the rotational drive source via the spindle causes the cutting blade 60 to rotate around a rotation axis that is approximately parallel to the Y-axis.

[0052] As the cutting blade 60, for example, a hub-type cutting blade (hub blade) can be used. A hub blade is composed of an annular base made of metal or the like, and an annular cutting edge formed along the outer edge of the base, integrated together. The cutting edge of the hub-type cutting blade is made of an electroformed grinding wheel in which abrasive grains made of diamond or the like are fixed by a binder such as a nickel plating layer. However, a washer-type cutting blade (washer blade) can also be used as the cutting blade 60. A washer blade is composed of an annular cutting edge in which abrasive grains are fixed by a binder made of metal, ceramics, resin, etc.

[0053] Furthermore, the processing unit 20a includes a blade cover 62 that covers the cutting blade 60 mounted on the tip of the spindle. The blade cover 62 includes a connection part 64 that is connected to a tube to which a liquid (processing fluid) such as pure water is supplied, and a pair of nozzles 66 connected to the connection part 64.

[0054] The pair of nozzles 66 are positioned to sandwich the lower end of the cutting blade 60 from both the front and back sides. In addition, supply ports (not shown) for supplying processing fluid toward the cutting blade 60 are provided at positions on the pair of nozzles 66 facing the cutting blade 60. The processing fluid supplied from the tube to the pair of nozzles 66 via the connection part 64 is sprayed from the supply ports of the pair of nozzles 66 toward the front and back sides of the cutting blade 60.

[0055] The blade cover 62 also includes a connection part 68 connected to a tube to which a liquid (processing fluid) such as pure water is supplied, and a nozzle 70 connected to the connection part 68. The tip of the nozzle 70 opens toward the outer circumference of the cutting blade 60. The processing fluid supplied from the tube to the nozzle 70 via the connection part 68 is sprayed from the tip of the nozzle 70 toward the outer circumference of the cutting blade 60.

[0056] The workpiece 11 is processed inside a processing chamber (processing room) 80 that is formed to cover the chuck table 16 and processing units 20a and 20b. For example, the processing chamber 80 is formed in the shape of a rectangular parallelepiped, comprising an upper wall 80a and a side wall 80b connected to the upper wall 80a, and houses the chuck table 16 and processing units 20a and 20b. The interior of the processing chamber 80 corresponds to a processing space 82 in which the cutting of the workpiece 11 by the processing units 20a and 20b is performed.

[0057] An opening 80c is provided in the upper wall 80a of the processing chamber 80, which connects the inside and outside of the processing chamber 80. The processing unit 20a and the imaging unit 42 are inserted into the processing chamber 80 through the opening 80c and placed in the processing space 82. A protective cover 84 is also provided near the opening 80c on the inside of the processing chamber 80 so as to overlap with the opening 80c. The protective cover 84 prevents processing debris and processing fluid scattered inside the processing chamber 80 during processing of the workpiece 11 from scattering outside the processing chamber 80 through the opening 80c.

[0058] On the front side of the processing unit 20a (right side in Figure 2), a partition member 86 is provided that divides the inside of the processing chamber 80 (processing space 82) into a processing area 82a and a transport area 82b. Processing of the workpiece 11 is performed in the processing area 82a, and the transport of the workpiece 11 onto the chuck table 16 and the removal of the workpiece 11 from the chuck table 16 are performed in the transport area 82b. In addition, the partition member 86 blocks the diffusion of processing debris and processing fluid scattered in the processing area 82a into the transport area 82b.

[0059] An opening 86a is provided at the lower end of the partition member 86. The chuck table 16 moves along the X-axis direction between the processing area 82a and the transport area 82b through the opening 86a.

[0060] The cutting blade 60 mounted on the processing unit 20a is rotated to cut into the workpiece 11 held by the chuck table 16, thereby cutting the workpiece 11. During the cutting of the workpiece 11, a processing fluid such as pure water is supplied from nozzles 66 and 70 to the cutting blade 60 and the workpiece 11. The processing fluid cools the cutting blade 60 and the workpiece 11, and washes away the cutting debris generated by the cutting process.

[0061] Furthermore, when the workpiece 11 is cut by the cutting blade 60, processing chips and processing fluid come into contact with the rapidly rotating cutting blade 60 and are scattered. As a result, the inside of the processing chamber 80 is filled with an atmosphere containing processing chips and processing fluid in mist form. If processing of the workpiece 11 continues under such an atmosphere, the workpiece 11 may be contaminated with processing fluid containing processing chips. In addition, the processing fluid in mist form may flow out from gaps in the processing chamber 80 (for example, openings 80c, etc.) and adhere to components of the processing device 2 located outside the processing chamber 80, potentially causing deterioration or malfunction of the components.

[0062] Therefore, during processing of the workpiece 11, the inside of the processing chamber 80 is exhausted. Specifically, a duct opening 88 is provided inside the processing chamber 80. One end of a duct 90, which discharges the gas inside the processing chamber 80, is connected to the duct opening 88. The other end of the duct 90 is connected to an exhaust device (exhaust equipment) 92 that draws in the gas inside the processing chamber 80 via the duct 90.

[0063] For example, a fan 94 is provided inside the duct 90 to generate an airflow from inside the processing chamber 80 through the duct 90 toward the exhaust device 92. When the exhaust device 92 is running and the fan 94 is rotated, dust and mist-like processing fluid remaining inside the processing chamber 80 are sucked into the duct 90 along with the atmosphere inside the processing chamber 80 and removed.

[0064] However, due to various reasons such as malfunctions in the exhaust system 92 or failures in the fan 94, the processing chamber 80 may not be properly exhausted. If the processing apparatus 2 continues to operate without recognizing that the processing chamber 80 is not being properly exhausted, a large amount of workpiece 11 contaminated with processing debris may be generated, or mist-like processing fluid leaking from the processing chamber 80 may adhere to the components of the processing apparatus 2, accelerating the deterioration of those components.

[0065] Therefore, in this embodiment, a measuring unit is installed outside the duct 90 to measure a value corresponding to the flow velocity of the gas flowing inside the duct 90, and the measuring unit is used to monitor whether the processing chamber 80 is being properly exhausted while the processing device 2 is in operation. If an abnormality is detected in the exhaust of the processing chamber 80, an error is sent from the processing device 2. As a result, when an exhaust abnormality occurs in the processing device 2, the operator can quickly recognize the abnormality and take appropriate measures, thereby minimizing damage caused by the exhaust abnormality.

[0066] Figure 3 is a schematic partial cross-sectional side view of the duct 90. Specifically, as shown in Figure 3, measuring units 100a and 100b, which measure values ​​corresponding to the gas flow velocity inside the duct 90, are provided on the outer surface of the duct 90. Figure 3 shows an example in which the upstream measuring unit 100a and the downstream measuring unit 100b are provided on the outer wall surface of the duct 90. The measuring units 100a and 100b are each connected to a control unit 54 (see Figure 1) and output the measured values ​​to the control unit 54.

[0067] The measurement units 100a and 100b measure a value corresponding to the gas flow velocity inside the duct 90 based on the propagation time of ultrasonic waves. Specifically, the measurement units 100a and 100b each include a transmitter 102 that emits ultrasonic waves and a receiver 104 that receives ultrasonic waves. The transmitter 102 and receiver 104 include piezoelectric elements containing, for example, lead zirconate titanate (PZT). In each measurement unit 100a and 100b, one piezoelectric element may serve the functions of both the transmitter 102 and the receiver 104.

[0068] The ultrasonic waves 106 emitted by the transmitter 102 of the upstream measuring unit 100a propagate through the gas flowing inside the duct 90 and reach the receiver 104 of the downstream measuring unit 100b, where they are received. The control unit 54 then measures the time it takes for the ultrasonic waves 106 to travel from the upstream measuring unit 100a to the downstream measuring unit 100b (arrival time). This arrival time varies depending on the flow velocity of the gas flowing through the duct 90.

[0069] Furthermore, the ultrasonic waves 108 emitted by the transmitter 102 of the downstream measuring unit 100b propagate through the gas flowing inside the duct 90 and reach the receiver 104 of the upstream measuring unit 100a, where they are received. The control unit 54 then measures the time it takes for the ultrasonic waves 108 to travel from the downstream measuring unit 100b to the upstream measuring unit 100a (arrival time). This arrival time varies depending on the flow velocity of the gas flowing through the duct 90.

[0070] Specifically, the time it takes for the ultrasonic waves 106 traveling downstream to reach the receiver 104 from the transmitter 102 is shorter than the time it takes for the ultrasonic waves 108 traveling upstream to reach the receiver 104 from the transmitter 102. The difference between these two arrival times depends on the flow velocity of the gas flowing through the duct 90.

[0071] Therefore, by continuously measuring the arrival time of ultrasonic waves 106 and 108 using measurement units 100a and 100b, it is possible to monitor whether the gas is flowing at an appropriate velocity inside the duct 90. In particular, installing measurement units 100a and 100b in the duct 90 rather than in the processing room 80 allows for a more direct evaluation of the detailed condition of the exhaust system 92 and fan 94.

[0072] Furthermore, the values ​​measured by the measurement units 100a and 100b are not limited to the arrival time of the ultrasonic waves 106 and 108. For example, the measurement unit may measure the velocity of the ultrasonic waves 106 and 108 based on their arrival time.

[0073] When the exhaust of the processing chamber 80 is functioning normally, the values ​​measured by the measurement units 100a and 100b (such as the arrival time of ultrasonic waves 106 and 108, and the gas flow velocity) are maintained within a predetermined tolerance range. On the other hand, if an abnormality occurs in the exhaust of the processing chamber 80 for any reason, the values ​​measured by the measurement units 100a and 100b will fall outside the tolerance range.

[0074] Therefore, the control unit 54 (see Figure 1) determines whether the gas flow inside the duct 90 is normal or abnormal based on the values ​​measured by the measurement units 100a and 100b and a preset threshold.

[0075] The following describes the specific operation of the processing apparatus 2. First, the memory unit 58 of the control unit 54 (see Figure 1) stores threshold values ​​(reference values) that define the acceptable range of values ​​measured by the measurement units 100a and 100b. For example, the memory unit 58 stores the lower and upper limits of the normal value range.

[0076] There are no restrictions on how the thresholds are set. For example, the processing device 2 is operated experimentally in advance, and while maintaining proper exhaust of the processing chamber 80, the values ​​corresponding to the gas flow velocity are measured by the measurement units 100a and 100b. Then, the lower and upper limits of the allowable range are set so that the measured values ​​fall within the allowable range.

[0077] When the workpiece 11 is cut by the cutting blade 60, the exhaust device 92 and fan 94 shown in Figure 2 are activated to exhaust the processing chamber 80. While the exhaust device 92 and fan 94 are operating (during cutting), the values ​​corresponding to the gas flow velocity inside the duct 90 are continuously measured by the measuring units 100a and 100b.

[0078] For example, measurement units 100a and 100b measure the arrival time T of ultrasonic waves 106 and 108, and calculate the velocity V of ultrasonic wave 106 based on the arrival time T. The velocity V is expressed as V = L / T, where L is the distance (known value) between the transmitter 102 and the receiver 104.

[0079] Then, the velocity Vave of the ultrasonic waves in a still gas can be calculated from the average value of the velocity Va of the ultrasonic waves 106 propagating from measurement unit 100a to measurement unit 100b and the velocity Vb of the ultrasonic waves 108 propagating from measurement unit 100b to measurement unit 100a. Then, by subtracting Vave from Va, or Vb from Vave, the velocity Vgas of the gas flowing through duct 90 can be calculated.

[0080] The values ​​measured by the measurement units 100a and 100b are input to the control unit 54 (see Figure 1). The control unit 54 then calculates the velocity Vgas of the gas flowing through the duct 90 from the values ​​input from the measurement units 100a and 100b and compares it with a threshold value stored in the memory unit 58. For example, the control unit 54 compares the velocity Vgas of the gas flowing through the duct 90 with the upper limit value V of the allowable range of velocity Vave. tha and lower limit V thbBy comparing this with the other value, it is determined whether the speed Vave is within an acceptable range.

[0081] The determination method using measurement units 100a and 100b can be changed as appropriate. For example, the control unit 54 uses the velocity Va of the ultrasonic waves 106 propagated downstream as measured by measurement units 100a and 100b, and a preset reference value V of the ultrasonic waves 106 velocity. ref Alternatively, the difference from (the value of the ideal velocity V, etc.) can be calculated and compared with a threshold value.

[0082] Furthermore, for example, the control unit 54 uses the velocity Vb of the ultrasonic waves 108 propagating upstream, measured by the measurement units 100a and 100b, and a preset reference value V of the ultrasonic waves 108 velocity. ref You can also calculate the difference and compare that difference with the threshold. In these cases, V ref It is preferable that this be registered in advance in the memory unit 58 of the control unit 54.

[0083] If the value measured by the measurement unit 100 is within the acceptable range, the control unit 54 determines that the gas flow inside the processing chamber 80 is normal. On the other hand, if the value measured by the measurement unit 100 is outside the acceptable range, the control unit 54 determines that the gas flow inside the processing chamber 80 is abnormal.

[0084] When the control unit 54 determines that the gas flow inside the processing chamber 80 is abnormal, it outputs a control signal to the display unit 50 and the notification unit 52, causing the display unit 50 and the notification unit 52 to send an error. For example, the display unit 50 displays a message or image indicating an exhaust abnormality. The notification unit 52 lights up in a color that indicates an exhaust abnormality, or flashes in a pattern that indicates an exhaust abnormality. This notifies the operator that an exhaust abnormality has occurred in the processing device 2.

[0085] As described above, the control unit 54 monitors the exhaust status of the duct 90 based on a value corresponding to the flow velocity of the gas flowing through the duct 90. When an abnormality occurs in the gas flow in the duct 90, the display unit 50 or notification unit 52 notifies the operator of the abnormality in the exhaust status.

[0086] In the processing apparatus 2 according to this embodiment, measuring units 100a and 100b are provided on the outside of the duct 90 to measure a value corresponding to the flow velocity of the gas flowing inside the duct 90. Based on the values ​​measured by the measuring units 100a and 100b, it is determined whether the gas flow inside the duct 90 is normal or abnormal, and if the gas flow is abnormal, an error is transmitted from the notification unit 52.

[0087] When an abnormality occurs in the exhaust of the processing chamber 80, the gas flow inside the duct 90 is directly affected by this abnormality. On the other hand, the influence on the gas flow inside the duct 90 due to the operation of various mechanisms located inside the processing chamber 80 is extremely small. Therefore, the values ​​measured by the measurement units 100a and 100b allow for rapid, highly accurate, and sensitive detection of abnormalities in the exhaust of the processing chamber 80, without being affected by the operation status of the various mechanisms installed in the processing chamber 80, enabling the operator to quickly recognize the abnormality in the exhaust.

[0088] In the above embodiment, an example was described in which the exhaust state of a duct 90 connected to the processing chamber 80 is monitored. However, the destination to which the duct 90 whose exhaust state is monitored is not limited to the processing chamber 80. For example, instead of the processing chamber 80, or in addition to the processing chamber 80, the exhaust state of a duct 90 connected to a washing chamber where the workpiece 11 is washed may be monitored.

[0089] Figure 4 is a partial cross-sectional front view showing the washing chamber (processing chamber) 110 where the workpiece 11 is washed. The washing chamber 110 is a processing chamber defined by an opening 4c formed in the base 4 (see Figure 1) of the processing apparatus 2. In other words, the washing chamber 110 corresponds to a cylindrical area surrounded by the inner wall of the opening 4c.

[0090] The cleaning chamber 110 houses a spinner table 44 and a cleaning unit 46. The upper surface of the spinner table 44 is a flat surface formed approximately parallel to the horizontal direction (XY plane direction) and constitutes a holding surface 44a for holding the workpiece 11. The holding surface 44a is connected to a suction source (not shown), such as an ejector, via a flow path (not shown), a valve (not shown), etc., provided inside the spinner table 44. In addition, a plurality of clamps 112 are provided around the spinner table 44 to grip and fix the frame 15 that supports the workpiece 11.

[0091] The lower part of the spinner table 44 is connected to a rotational drive source 114, such as a motor, which rotates the spinner table 44 around a rotation axis that is generally parallel to the Z-axis direction. The rotational drive source 114 has a cylindrical output shaft (rotation axis) 116 arranged along the Z-axis direction, and rotates the output shaft 116 around a rotation axis that is generally parallel to the Z-axis direction. The rotational drive source 114 may also be connected to a lifting mechanism (not shown) that raises and lowers the rotational drive source 114 along the Z-axis direction.

[0092] The spinner table 44 is covered by a hollow cylindrical liquid receiving member 118. The liquid receiving member 118 comprises an annular outer wall 118a arranged to surround the spinner table 44 and the clamp 112, an annular bottom surface 118b projecting radially inward from the lower end of the outer wall 118a, and an annular inner wall 118c projecting upward from the radially inward end of the bottom surface 118b.

[0093] The area inside the inner wall 118c of the liquid receiving member 118 corresponds to the through hole 118d into which the output shaft 116 of the rotary drive source 114 is inserted. The lower surface of the spinner table 44 is fixed to the upper end of the output shaft 116 inserted into the through hole 118d.

[0094] Furthermore, an annular cover 120 is provided inside the liquid receiving member 118, covering the upper end of the inner wall 118c. The cover 120 surrounds the output shaft 116 of the rotary drive source 114 and is positioned to block the area of ​​the through hole 118d where the output shaft 116 is not provided. The cover 120 prevents the liquid inside the liquid receiving member 118 from flowing out to the outside through the through hole 118d. In addition, a waste liquid port (not shown) is provided at the bottom of the liquid receiving member 118 for discharging the cleaning liquid stored in the liquid receiving member 118.

[0095] The cleaning unit 46 comprises an L-shaped arm 122 and a nozzle 124 attached to the tip of the arm 122. The nozzle 124 supplies cleaning fluid toward the holding surface 44a of the spinner table 44. As the cleaning fluid, a liquid such as pure water or a mixed fluid of a liquid (such as pure water) and a gas (such as air) can be used.

[0096] A rotary drive source 126, such as a motor, is connected to the arm 122 of the cleaning unit 46. By rotating the arm 122 with the rotary drive source 126, the nozzle 124 can be positioned in a position that overlaps with the spinner table 44 (supply position) and in a position that does not overlap with the spinner table 44 (retracted position).

[0097] The workpiece 11 processed by the processing units 20a and 20b (see Figure 1) is transported to the spinner table 44 by a transport unit (not shown) and placed on the holding surface 44a of the spinner table 44 via the tape 13 (see Figure 1). In this state, when negative pressure from a suction source is applied to the holding surface 44a, the workpiece 11 is held in place by the spinner table 44 via the tape 13.

[0098] Then, the spinner table 44 holding the workpiece 11 is rotated by the rotary drive source 114, and cleaning fluid is dripped from the nozzle 124 and supplied to the workpiece 11. As a result, the cleaning fluid flows along the upper surface of the workpiece 11, washing away any foreign matter (machining debris, etc.) adhering to the workpiece 11.

[0099] When the workpiece 11 is cleaned by the cleaning unit 46, the cleaning solution supplied to the workpiece 11 and any processing debris adhering to the workpiece 11 are scattered by the rotation of the workpiece 11. As a result, the inside of the cleaning chamber 110 is filled with an atmosphere containing processing debris dust and mist-like cleaning solution. Therefore, the inside of the cleaning chamber 110 is vented while the workpiece 11 is being cleaned.

[0100] Specifically, a duct opening 128 is provided inside the washing chamber 110. One end of a duct 130, which discharges gas from inside the washing chamber 110, is connected to the duct opening 128. The other end of the duct 130 is connected to an exhaust device (exhaust equipment) 132, which draws gas from inside the washing chamber 110 via the duct 130.

[0101] Inside the duct 130, there is a fan 134 that generates an airflow from the washing chamber 110 through the duct 130 toward the exhaust device 132. When the exhaust device 132 is running and the fan 134 is rotated, any processing debris dust and mist-like cleaning solution remaining inside the washing chamber 110 are sucked into the duct 130 along with the atmosphere inside the washing chamber 110 and removed.

[0102] Furthermore, as shown in Figure 3, measuring units 100a and 100b are provided in the duct 130 connected to the washing chamber 110 to measure a value corresponding to the flow velocity of the gas flowing through the duct 130. The measuring units 100a and 100b then output the measured values ​​to the control unit 54 (see Figure 1).

[0103] The control unit 54 determines whether the gas flow inside the washing chamber 110 is normal or abnormal by comparing the values ​​measured by the measurement units 100a and 100b (second measurement units) installed in the duct 130 connected to the washing chamber 110 with a threshold (second threshold). This determination method is the same as when the values ​​measured by the measurement units 100a and 100b (first measurement units) installed in the duct 90 connected to the processing chamber 80 (see Figure 2) are input to the control unit 54.

[0104] When the control unit 54 determines that the gas flow in the duct 130 is abnormal, it outputs a control signal to the display unit 50 and the notification unit 52, causing the display unit 50 and the notification unit 52 to send an error message.

[0105] When measurement units 100a and 100b are installed in duct 90 (first duct) and duct 130 (second duct), respectively, the values ​​measured by each measurement unit 100a and 100b are compared with the corresponding thresholds (first threshold and second threshold). If it is determined that the gas flow is abnormal in at least one of duct 90 and duct 130, an error is transmitted from the display unit 50 and the notification unit 52.

[0106] In this case, adjustment is required in either the exhaust device 92 (first exhaust device) connected to duct 90 (first duct) or the exhaust device 132 (second exhaust device) connected to duct 130 (second duct). Therefore, for example, the display unit 50 displays information that identifies the processing room where the exhaust abnormality is occurring (name of the processing room, location, etc.).

[0107] Furthermore, although the above embodiment described an example in which the exhaust state of a cutting device that performs cutting on a workpiece 11 is determined, there are no restrictions on the type of processing device in which the exhaust state is determined using the measurement units 100a and 100b.

[0108] Other processing devices besides cutting devices may include, for example, a grinding device equipped with a processing unit (grinding unit) that grinds the workpiece 11 with a grinding wheel having multiple grinding wheels, or a polishing device equipped with a processing unit (polishing unit) that polishes the workpiece 11 with a polishing pad. Alternatively, a laser processing device equipped with a processing unit (laser irradiation unit) that processes the workpiece 11 by irradiation with a laser beam may also be used.

[0109] The various processing devices described above may also be equipped with a processing chamber where the workpiece 11 is processed and a cleaning chamber where the workpiece 11 is cleaned. In this case, by installing measuring units 100a and 100b inside the processing chamber and cleaning chamber, the exhaust state can be determined in the same way as in the processing device 2.

[0110] Furthermore, the structures, methods, etc., according to the above embodiments can be modified as appropriate without departing from the scope of the objectives of the present invention. [Explanation of Symbols]

[0111] 11 Workpiece 13 Tapes 15 frames 2 Processing equipment (cutting equipment) 4 base 4a,4b,4c opening 6 Cassette Support Stands 8 cassettes 10 Mobile Units (Mobile Mechanisms) 12 Mobile Tables 14 Dustproof and splashproof cover 16. Chuck table (holding table) 16a Holding surface 18 clamps 20a, 20b Machining Unit (Cutting Unit) 22 Support structure 24a, 24b Mobile unit (mobile mechanism) 26 Guide rails 28a, 28b Mobile Plate 30a, 30b Ball screw 32 pulse motors 34a, 34b Guide rails 36a, 36b Mobile Plate 38a, 38b Ball screw 40 pulse motors 42 Imaging Units 44 Spinner Table (Chuck Table) 44a Holding surface 46 Washing Unit 48 Cover 50 Display unit (display unit, display device) 52. Notification Unit (Notification Section, Notification Device) 54 Control Unit (Control Unit, Control Device) 56 Arithmetic section 58 Memory section 60 cutting blades 62 Blade Cover 64 Connection part 66 nozzles 68 Connection part 70 nozzles 80 Processing Room (Processing Room) 80a Upper wall 80b side wall 80c aperture 82 Processing space 82a Processing area 82b Transport area 84 Protective Cover 86 Partition Member 86a aperture 88 Duct opening 90 duct 92 Exhaust System (Exhaust Equipment) 94 Fans 100a, 100b Measurement Unit 102 Transmitter 104 Receiver 106 Ultrasound 110 Washing Room (Processing Room) 112 Clamp 114 Rotary drive source 116 Output shaft (rotation shaft) 118 Liquid receiving member 118a Exterior wall 118b Bottom 118c interior wall 118d through hole 120 Cover 122 Arm 124 nozzles 126 Rotary drive source 128 duct opening 130 duct 132 Exhaust system (exhaust equipment) 134 Fans

Claims

1. A processing device for processing a workpiece, A chuck table for holding the workpiece, A processing unit for processing the workpiece held by the chuck table, A processing chamber housing the chuck table and the processing unit, A duct, one end of which is connected to an exhaust device and the other end of which is connected to the processing chamber, A measuring unit is provided on the outer surface of the duct to measure the flow velocity of the gas flowing inside the duct via the pipe wall of the duct, Control unit and Equipped with a notification unit, The control unit determines whether the gas flow inside the duct is normal or abnormal based on the value measured by the measuring unit and a preset threshold. The processing apparatus is characterized in that the notification unit issues an error when it is determined that the flow of gas inside the duct is abnormal.

2. A processing device for processing a workpiece, A chuck table for holding the workpiece, A processing unit for processing the workpiece held by the chuck table, A spinner table for holding the workpiece, A cleaning unit for cleaning the workpiece held by the spinner table, A washing chamber housing the spinner table and the washing unit, A duct, one end of which is connected to an exhaust device and the other end of which is connected to the washing chamber, A measuring unit is provided on the outer surface of the duct to measure the flow velocity of the gas flowing inside the duct via the pipe wall of the duct, Control unit and Equipped with a notification unit, The control unit determines whether the gas flow inside the duct is normal or abnormal based on the value measured by the measuring unit and a preset threshold. The processing apparatus is characterized in that the notification unit issues an error when it is determined that the flow of gas inside the duct is abnormal.

3. The measuring unit comprises a transmitter that emits ultrasonic waves and a receiver that receives the ultrasonic waves. The processing apparatus according to claim 1 or 2, characterized by measuring the time it takes for the ultrasonic waves to travel from the transmitter to the receiver.

4. A processing device for processing a workpiece, A chuck table for holding the workpiece, A processing unit for processing the workpiece held by the chuck table, A spinner table for holding the workpiece, A cleaning unit for cleaning the workpiece held by the spinner table, A processing chamber housing the chuck table and the processing unit, A washing chamber housing the spinner table and the washing unit, A first duct, one end of which is connected to a first exhaust device and the other end of which is connected to the processing chamber, A second duct, one end of which is connected to a second exhaust device and the other end of which is connected to the washing chamber, A first measuring unit is disposed on the outer surface of the first duct and measures the flow velocity of the gas inside the first duct via the pipe wall of the first duct. A second measuring unit is disposed on the outer surface of the second duct and measures the flow velocity of the gas inside the second duct via the pipe wall of the second duct. Control unit and Equipped with a notification unit, The control unit determines whether the gas flow inside the first duct is normal or abnormal based on the value measured by the first measuring unit and a preset first threshold, and determines whether the gas flow inside the second duct is normal or abnormal based on the value measured by the second measuring unit and a preset second threshold. The processing apparatus is characterized in that the notification unit generates an error when it is determined that the flow of gas inside the first duct or the flow of gas inside the second duct is abnormal.

5. The processing apparatus according to claim 4, wherein the first measuring unit and the second measuring unit each comprise a transmitter that emits ultrasonic waves and a receiver that receives the ultrasonic waves, and measure the time it takes for the ultrasonic waves to travel from the transmitter to the receiver.

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