Method for forming a protective film
The described drying mechanism rapidly dries protective films using a gas injection system, addressing the long drying times that hinder laser processing throughput.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2022-06-16
- Publication Date
- 2026-07-07
AI Technical Summary
The drying time required for protective films formed from protective film agents is often long, leading to decreased throughput in laser processing of workpieces.
A drying mechanism that utilizes a protective film agent with a light absorber, a rotatable holding table, and a gas injection nozzle system to quickly dry moisture-containing films by spraying dehumidified gas onto the film.
The mechanism enables rapid drying of moisture-containing films, enhancing the throughput of laser processing by reducing the time required for film drying.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to a drying mechanism for injecting a gas toward a film containing moisture to dry it.
Background Art
[0002] Chips of devices such as ICs (Integrated Circuits) are essential components in various electronic devices such as mobile phones and personal computers. Such chips are manufactured, for example, by dividing a workpiece such as a wafer (e.g., a silicon wafer) having a large number of devices formed on its surface into regions each containing an individual device.
[0003] Examples of the device used for dividing the workpiece include a laser processing device. This laser processing device processes (laser processes) the workpiece by irradiating the workpiece with a laser beam having a wavelength of 355 nm, for example, to cause ablation (laser ablation).
[0004] However, when laser ablation occurs in the workpiece, the melt (debris) of the material (e.g., silicon) constituting the workpiece may scatter and adhere to the processed surface of the workpiece. And when the debris adheres to the processed surface of the workpiece, the quality of the chips obtained by dividing the workpiece may deteriorate.
[0005] In view of this point, it has been proposed to form a protective film on the processed surface of the workpiece prior to laser processing of the workpiece (see, for example, Patent Documents 1 and 2). Specifically, this protective film is formed by rotating the workpiece in a state where a liquid protective film agent is dropped onto the processed surface of the workpiece to cover the entire processed surface with a film made of the protective film agent, and then drying this film.
Prior Art Documents
Patent Documents
[0006] [Patent Document 1] Japanese Patent Publication No. 2004-188475 [Patent Document 2] Japanese Patent Publication No. 2004-322168 [Overview of the project] [Problems that the invention aims to solve]
[0007] As described above, when forming a protective film, the drying time required for the film made of the protective film agent is often long. And when this time is long, the throughput of laser processing on the workpiece decreases. In view of this, the object of the present invention is to provide a drying mechanism that can rapidly dry a film containing moisture (for example, a film made of a protective film agent). [Means for solving the problem]
[0008] According to the present invention, It consists of a protective film agent to which a light absorber has been added. A rotatable holding table that holds the lower side of a plate-shaped object with a membrane on its upper surface, and a device capable of injecting gas toward the membrane on the upper surface of the plate-shaped object held by the holding table. Gas injection Nozzle and A dryer is provided. via the gas supply path Gas injection A drying mechanism comprising a gas supply source capable of supplying the gas to a nozzle. and , A coating apparatus comprising a protective film supply nozzle capable of dropping the protective film agent onto the upper surface of a plate-shaped object held by a holding table, wherein a method for forming a protective film on the upper surface of the plate-shaped object is to drop a predetermined amount of the protective film agent from the protective film supply nozzle onto the upper surface of the plate-shaped object while the holding table holds the lower surface of the plate-shaped object, and rotate the holding table while the lower surface of the plate-shaped object on which the protective film agent has been dropped onto the upper surface is covered with the film, While the holding table is rotated with the film attached to the upper surface of the plate-shaped object, the dehumidified gas by the dryer is... Gas injection By spraying from the nozzle towards the film, the film is dried. and form the protective film ru thing and , A method that includes It will be provided. [Effects of the Invention]
[0009] In the drying mechanism of the present invention, a moisture-containing film is dried by spraying dehumidified gas from a dryer onto the film. This makes it possible to quickly dry a moisture-containing film. [Brief explanation of the drawing]
[0010] [Figure 1] Figure 1 is a schematic, partially broken perspective view showing an example of a coating apparatus with a cleaning function that includes a drying mechanism. [Figure 2] Figure 2 is a schematic block diagram showing the components that communicate with the gas injection nozzle. [Figure 3] Figure 3 is a schematic perspective view showing an example of a laser processing apparatus incorporating a coating device. [Modes for carrying out the invention]
[0011] Embodiments of the present invention will be described with reference to the attached drawings. Figure 1 is a schematic partially cutaway perspective view showing an example of a coating apparatus with a cleaning function including a drying mechanism. The coating apparatus 2 shown in Figure 1 has a holding table 4. This holding table 4 has a disc-shaped porous plate 4a with an exposed upper surface and has the function of suction-holding a frame unit 11 placed on this porous plate 4a.
[0012] The frame unit 11, held by the holding table 4, has a workpiece 13. This workpiece 13 has a circular surface 13a and a back surface 13b, and is a wafer made of a semiconductor material such as silicon (Si). The workpiece 13 is divided into multiple regions by a plurality of division lines 15 arranged in a grid pattern, and a device 17 such as an IC is formed in each region.
[0013] Furthermore, the back surface 13b of the workpiece 13 is attached to the central region of a disc-shaped tape 19 whose diameter is longer than the diameter of the workpiece 13. This tape 19 has, for example, a flexible film-like base layer and an adhesive layer (glue layer) provided on one side of the base layer (the side facing the workpiece 13).
[0014] Specifically, this base material layer is made of polyolefin (PO), polypropylene (PP), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polystyrene (PS), or the like. Also, this adhesive layer is made of an ultraviolet curable silicone rubber, an acrylic material, an epoxy material, or the like.
[0015] Also, an annular frame 21 is adhered to the outer peripheral region of the tape 19, and a circular opening 21a having a diameter longer than that of the workpiece 13 is formed therein. This frame 21 is made of a metal material such as aluminum or stainless steel, for example.
[0016] Further, a chamber 6 surrounding the holding table 4 is provided around the holding table 4. This chamber 6 has a cylindrical outer peripheral wall 6a, an annular bottom wall 6b extending radially inward from the lower end portion of the outer peripheral wall 6a, and a cylindrical inner peripheral wall 6c erected from the inner end portion of the bottom wall 6b.
[0017] A drain port 8 is formed in the bottom wall 6b, and a drain pipe (not shown) extending downward is connected to this drain port 8. Also, a plurality (for example, two) of support legs 10 are fixed to the lower surface of the bottom wall 6b. The plurality of support legs 10 are provided at substantially equal angular intervals along the circumferential direction of the bottom wall 6b and support the chamber 6.
[0018] Also, a spindle 12 passes vertically through a cylindrical space existing inside the inner peripheral wall 6c. The upper end portion of this spindle 12 is connected to the holding table 4 so as to support the holding table 4. Also, a rotary drive source such as a motor is connected to the lower end portion of the spindle 12, and this rotary drive source is housed in the housing 14.
[0019] When this rotary drive source is operated, the spindle 12 and the holding table 4 rotate about a straight line passing through the center of the upper surface of the holding table 4 and along the vertical direction as the rotation axis. Also, the housing 14 is supported by a support mechanism 16 in a manner capable of ascending and descending.
[0020] This support mechanism 16 has, for example, a plurality (e.g., three) of air cylinders 18 attached to the housing 14, with support legs 20 connected to the lower part of each air cylinder 18. When the plurality of air cylinders 18 are operated simultaneously, the housing 14, spindle 12, and holding table 4 move up and down.
[0021] Furthermore, three support shafts 22a, 24a, and 26a are passed through the bottom wall 6b at approximately equal angular intervals along the circumferential direction of the bottom wall 6b. Each support shaft 22a, 24a, and 26a is a pipe-shaped member extending vertically. In addition, a rotational drive source (not shown), such as a motor, for rotating the support shafts 22a, 24a, and 26a is connected to the portion of each support shaft 22a, 24a, and 26a located below the bottom wall 6b.
[0022] Furthermore, the base ends of the arms 22b, 24b, and 26b are connected to the upper ends of the respective support shafts 22a, 24a, and 26a. Each arm 22b, 24b, and 26b is a pipe-shaped member that extends in a direction perpendicular to the vertical direction, with a length corresponding to the distance from the upper ends of the support shafts 22a, 24a, and 26a to the center of the holding table 4 in a plan view. The tips of each arm 22b, 24b, and 26b are provided with downward-facing nozzles 22c, 24c, and 26c.
[0023] Furthermore, the nozzle (protective film supply nozzle) 22c is connected to a protective film supply source (not shown) that supplies liquid protective film via the arm 22b, support shaft 22a, and protective film supply passage (not shown). This protective film is, for example, a solution containing a water-soluble resin such as polyvinylpyrrolidone or polyvinyl alcohol and an organic solvent such as propylene glycol monomethyl ether.
[0024] Furthermore, the water-soluble resin is the main component of the protective film formed by drying the film made of the protective film agent. The organic solvent reduces the surface tension of the protective film agent, thereby reducing unevenness when the protective film agent is applied to the workpiece. Additionally, the protective film agent may contain a light absorber such as ferulic acid.
[0025] Furthermore, the nozzle (gas injection nozzle) 24c is connected to a gas supply source that supplies gases such as air, oxygen, nitrogen, or argon via the arm 24b, support shaft 24a, and gas supply passage. Figure 2 is a schematic block diagram showing the components connected to the nozzle 24c.
[0026] The gas supply source 24d, which can communicate with the nozzle 24c, includes, for example, a tank for storing high-pressure gas, a filter for removing foreign matter mixed in with the gas supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank. The gas supply source 24d is connected to a valve 24e that controls the flow rate of the gas supplied to the gas supply path.
[0027] Furthermore, a dryer 24f is provided in the gas supply passage located between the valve 24e and the support shaft 24a to dehumidify the gas passing through this gas supply passage. This dryer 24f lowers the dew point temperature of the gas that has passed through it to, for example, -60°C or lower.
[0028] There are no restrictions on the configuration of this dryer 24f. For example, the dryer 24f is a membrane dryer containing a hollow fiber membrane. Alternatively, the dryer 24f may be a refrigerated dryer containing a heat exchanger or an adsorption dryer containing a desiccant such as silica gel.
[0029] Furthermore, the nozzle (cleaning fluid spray nozzle) 26c shown in Figure 1 is connected to a cleaning fluid supply source that supplies a cleaning fluid such as pure water via an arm 26b, a support shaft 26a, and a cleaning fluid supply passage (not shown).
[0030] In the coating apparatus 2 described above, a protective film is formed on the surface 13a of the workpiece 13 in the following order, for example. Specifically, first, the support shafts 22a, 24a, and 26a are rotated so that the nozzles 22c, 24c, and 26c are positioned outside the holding table 4 in a plan view.
[0031] Next, multiple air cylinders 18 are operated to raise the holding table 4 so that it is positioned at the loading / unloading position, which is a position that facilitates the loading and unloading of the frame unit 11. Figure 1 schematically shows the appearance of the coating apparatus 2 at this point.
[0032] Next, the frame unit 11 is placed on the holding table 4 with the tape 19 facing downwards. The frame unit 11 is then held in place by suction using the holding table 4. The holding table 4 is then lowered by operating the multiple air cylinders 18 so that the surface 13a of the workpiece 13 is positioned lower than the nozzles 22c, 24c, and 26c.
[0033] Next, the support shaft 22a is rotated so that the nozzle (protective film supply nozzle) 22c is positioned above the workpiece 13. Then, a predetermined amount of protective film is supplied from the protective film supply source to the nozzle 22c via the protective film supply path, support shaft 22a, and arm 22b, and is dripped onto the surface 13a of the workpiece 13.
[0034] Next, the motor housed in the housing 14 is operated to rotate the holding table 4 so that the entire surface 13a of the workpiece 13 is covered with a film made of a protective coating agent. Then, the operation of this motor is stopped, and the support shaft 22a is rotated so that, in a plan view, the nozzle 22c is positioned outside the holding table 4.
[0035] Next, the support shaft 24a is rotated so that the nozzle (gas injection nozzle) 24c is positioned above the workpiece 13. Then, the motor housed in the housing 14 is operated to rotate the holding table 4 again, and the gas supplied from the gas supply source 24d to the nozzle 24c via the gas supply passage equipped with a valve 24e and a dryer 24f, the support shaft 24a and the arm 24b is injected toward the protective film made of the protective film agent formed on the surface 13a of the workpiece 13.
[0036] This causes the protective film to dry and form. Next, the motor is stopped and the support shaft 24a is rotated so that the nozzle 24c is positioned outside the holding table 4 in a plan view. Then, the holding table 4 is raised by operating the multiple air cylinders 18 so that the holding table 4 is positioned in the loading / unloading position.
[0037] Next, the suction of the frame unit 11 by the holding table 4 is stopped. Then, the frame unit 11, including the workpiece 13 with the protective film formed on its surface 13a, is removed from the holding table 4. With this, the formation of the protective film in the coating apparatus 2 is completed.
[0038] The frame unit 11, which includes the workpiece 13 with a protective film formed on its surface 13a, is transported to a laser processing device. In this laser processing device, the workpiece 13 is laser-processed to divide it along multiple division lines 15. After the laser processing is performed, the surface 13a of the workpiece 13 is cleaned in the coating device 2, for example, in the following order, to wash away the protective film.
[0039] Specifically, first, the support shafts 22a, 24a, and 26a are rotated so that the nozzles 22c, 24c, and 26c are positioned outside the holding table 4 in a plan view. Next, the holding table 4 is raised by operating multiple air cylinders 18 so that it is positioned at the loading / unloading position.
[0040] Next, the frame unit 11 is placed on the holding table 4 with the tape 19 facing downwards. The frame unit 11 is then held in place by suction using the holding table 4. The holding table 4 is then lowered by operating the multiple air cylinders 18 so that the surface 13a of the workpiece 13 is positioned lower than the nozzles 22c, 24c, and 26c.
[0041] Next, the support shaft 26a is rotated so that the nozzle (cleaning fluid supply nozzle) 26c is positioned above the workpiece 13. Then, the motor housed in the housing 14 is operated to rotate the holding table 4, and the cleaning fluid supplied from the cleaning fluid supply source to the nozzle 26c via the cleaning fluid supply passage, support shaft 26a and arm 26b is sprayed toward the protective film formed on the surface 13a of the workpiece 13.
[0042] This washes away the protective film and wets the surface 13a of the workpiece 13 with the cleaning solution. Next, the motor is stopped and the support shaft 26a is rotated so that, in a plan view, the nozzle 26c is positioned outside the holding table 4.
[0043] Next, the support shaft 24a is rotated so that the nozzle (gas injection nozzle) 24c is positioned above the workpiece 13. Then, the motor housed in the housing 14 is operated to rotate the holding table 4 again, and the gas supplied from the gas supply source 24d to the nozzle 24c via the gas supply passage equipped with a valve 24e and a dryer 24f, the support shaft 24a and the arm 24b is injected toward the surface 13a of the workpiece 13.
[0044] This dries the surface 13a of the workpiece 13. Next, the motor is stopped, and the support shaft 24a is rotated so that the nozzle 24c is positioned outside the holding table 4 in a plan view. Then, the holding table 4 is raised by operating multiple air cylinders 18 so that the holding table 4 is positioned at the loading / unloading position.
[0045] Next, the suction of the frame unit 11 by the holding table 4 is stopped. Then, the frame unit 11, including the workpiece 13 whose protective film has been cleaned and whose surface 13a has dried, is removed from the holding table 4. With this, the cleaning of the surface 13a of the workpiece 13 in the coating device 2 is completed.
[0046] In the coating apparatus 2 described above, the protective film is dried by spraying dehumidified gas from a dryer onto the film. This makes it possible to quickly dry the protective film.
[0047] Similarly, in the coating apparatus 2 described above, the surface 13a of the workpiece 13, which has become wet due to the cleaning of the protective film, is dried by spraying dehumidified gas from a dryer onto the workpiece 13. This makes it possible to quickly dry the surface 13a of the workpiece 13.
[0048] It should be noted that the above description represents only one aspect of the present invention, and the present invention is not limited to the above description. For example, in the present invention, the film to be dried is not limited to a film made of a protective film agent, but can be any film that contains moisture. Also, in the present invention, the object to which this film is applied is not limited to a workpiece, but can be a plate-like object that is not intended to be processed.
[0049] Furthermore, the present invention may also be a drying mechanism obtained by removing the nozzle (protective film supply nozzle) 22c and its communicating components, and the nozzle (cleaning liquid supply nozzle) 26c and its communicating components from the coating apparatus 2 described above. Alternatively, the coating apparatus 2 described above can be described as comprising this drying mechanism, the nozzle (protective film supply nozzle) 22c and its communicating components, and the nozzle (cleaning liquid supply nozzle) 26c and its communicating components.
[0050] Furthermore, the present invention may also be a laser processing apparatus incorporating the coating apparatus 2 described above. Figure 3 is a schematic perspective view showing an example of such a laser processing apparatus. Note that the X-axis direction (front-back direction) and Y-axis direction (left-right direction) shown in Figure 3 are orthogonal directions on the horizontal plane, and the Z-axis direction (up-down direction) is orthogonal to the X-axis direction and Y-axis direction (vertical direction).
[0051] The laser processing apparatus 28 shown in Figure 3 has a base 30 that supports each component. A rectangular recess is formed in the corner of the base 30, and a cassette table 34 on which a cassette 32 is placed is provided inside this recess. The cassette 32 contains multiple frame units 11 shown in Figure 1.
[0052] Furthermore, a lifting unit (not shown) is provided inside this recess, and this lifting unit is connected to the cassette table 34. When this lifting unit is operated, the cassette table 34 and the cassette 32 move up and down. In addition, a pair of adjustment guide rails 36 are provided on the side of the cassette table 34, each extending along the Y-axis.
[0053] One of the pair of adjustable guide rails 36 comprises a bottom wall that is generally parallel to the horizontal plane and a side wall that is erected from the end of the bottom wall that is farther from the other of the pair of adjustable guide rails 36. Similarly, the other of the pair of adjustable guide rails 36 comprises a bottom wall that is generally parallel to the horizontal plane and a side wall that is erected from the end of the bottom wall that is farther from the other of the pair of adjustable guide rails 36. Furthermore, the spacing between the pair of adjustable guide rails 36 in the X-axis direction is adjustable.
[0054] Furthermore, a transport unit 38 is provided above the pair of adjustment guide rails 36. This transport unit 38 is equipped with multiple suction pads capable of holding the frame 21 of the frame unit 11. In addition, a gripping portion is provided at the end of the transport unit 38 on the cassette table 34 side, which is capable of gripping the frame 21.
[0055] This gripping part is used when removing the frame unit 11 from the cassette 32, etc. Specifically, with the frame 21 of the frame unit 11 gripped by the gripping part, the transport unit 38 moves along the Y-axis, thereby unloading the frame unit 11 from the cassette 32 and placing it on a pair of adjustment guide rails 36.
[0056] Furthermore, the pair of adjustment guide rails 36 are used to align the frame unit 11. Specifically, the frame unit 11 is aligned by adjusting the distance between the pair of adjustment guide rails 36 in the X-axis direction so that the side walls of the pair of adjustment guide rails 36 come into contact with the frame unit 11 while the frame unit 11 is placed on the bottom walls of the pair of adjustment guide rails 36.
[0057] Furthermore, the suction pad of the transport unit 38 is used when transporting the aligned frame unit 11 to the coating device 2, which is located on the side of the pair of adjustment guide rails 36. Specifically, the frame unit 11 is transported to the coating device 2 by the transport unit 38 moving along the Y-axis and Z-axis directions while the frame 21 of the frame unit 11 holds the suction pad.
[0058] Furthermore, a horizontal movement mechanism 40 is provided behind the cassette table 34, a pair of adjustment guide rails 36, and the coating device 2. This horizontal movement mechanism 40 is fixed to the upper surface of the base 30 and has a pair of Y-axis guide rails 42, each extending along the Y-axis direction.
[0059] A Y-axis moving plate 44 is connected to the upper surface of a pair of Y-axis guide rails 42 in a manner that allows it to slide along the pair of Y-axis guide rails 42. A screw shaft 46 extending along the Y-axis direction is positioned between the pair of Y-axis guide rails 42. A motor 48 for rotating the screw shaft 46 is connected to one end of this screw shaft 46.
[0060] Furthermore, a nut is provided on the surface of the screw shaft 46, where a helical groove is formed, to accommodate a large number of balls that roll on the surface of the rotating screw shaft 46, thus forming a ball screw. That is, as the screw shaft 46 rotates, the large number of balls circulate within the nut, causing the nut to move along the Y-axis.
[0061] Furthermore, this nut is fixed to the underside of the Y-axis moving plate 44. Therefore, when the screw shaft 46 is rotated by the motor 48, the Y-axis moving plate 44 moves along the Y-axis direction together with the nut. In addition, a pair of X-axis guide rails 50, each extending along the X-axis direction, are fixed to the upper surface of the Y-axis moving plate 44.
[0062] An X-axis moving plate 52 is connected to the upper surface of a pair of X-axis guide rails 50 in a manner that allows it to slide along the pair of X-axis guide rails 50. A screw shaft 54 extending along the X-axis direction is positioned between the pair of X-axis guide rails 50. A motor (not shown) for rotating the screw shaft 54 is connected to one end of this screw shaft 54.
[0063] Furthermore, a nut (not shown) is provided on the surface of the screw shaft 54, where a helical groove is formed, to accommodate a large number of balls that roll on the surface of the rotating screw shaft 54, thus forming a ball screw. That is, as the screw shaft 54 rotates, the large number of balls circulate within the nut, causing the nut to move along the X-axis direction.
[0064] Furthermore, this nut is fixed to the underside of the X-axis moving plate 52. Therefore, when the screw shaft 54 is rotated by the motor, the X-axis moving plate 52 moves along the X-axis direction together with the nut.
[0065] A cylindrical table base 56 is positioned on the upper side of the X-axis moving plate 52. A holding table 58 that holds the frame unit 11 by suction is positioned on the upper part of this table base 56. This holding table 58 has, for example, a circular upper surface (holding surface) parallel to the X-axis and Y-axis directions, and a porous plate 58a is exposed on this holding surface.
[0066] Furthermore, a rotational drive source (not shown), such as a motor, is connected to the lower part of the holding table 58. When this rotational drive source is operated, the holding table 58 rotates around a straight line passing through the center of the holding surface and parallel to the Z-axis direction as its axis of rotation. Also, when the horizontal movement mechanism 40 described above is operated, the holding table 58 moves along the X-axis direction and / or the Y-axis direction.
[0067] Furthermore, the porous plate 58a is in communication with a suction source (not shown), such as an ejector, via a flow path or the like provided inside the holding table 58. When this suction source is activated, a suction force acts on the space near the holding surface of the holding table 58. As a result, for example, the frame unit 11 placed on the holding table 58 with the tape 19 facing downwards can be held by the holding table 58.
[0068] Furthermore, a support structure 60 is provided on the side of the horizontal movement mechanism 40. The base end of the arm 62 is fixed to the side of this support structure 60 (the side facing the horizontal movement mechanism 40). The head 64 of the laser beam irradiation unit is provided at the tip of the arm 62.
[0069] This laser beam irradiation unit includes a laser oscillator (not shown). The laser oscillator contains a rod-shaped laser medium formed of, for example, Nd:YAG, Nd:YVO4, etc., and emits a pulsed laser beam with a wavelength (e.g., 355 nm) that is absorbed by the workpiece 13. The laser beam emitted from the laser oscillator is then incident on the head 64 via a predetermined optical system.
[0070] Furthermore, the head 64 houses an optical system including a mirror (not shown) and a focusing lens (not shown), as well as an adjustment mechanism such as a voice coil motor for adjusting the position (height) of the focusing lens. When a laser beam enters the head 64, it is reflected downward by the mirror and then focused by the focusing lens. The position (height) of the focusing point of the laser beam is adjusted by the adjustment mechanism.
[0071] This laser beam is irradiated onto the workpiece 13, for example, with the focal point of the laser beam positioned near the surface 13a of the workpiece 13, which is contained in a frame unit 11 held by a holding table 58. As a result, laser ablation occurs on the workpiece 13, and a portion of the workpiece 13 is removed.
[0072] Furthermore, the laser processing apparatus 28 is provided with a cover 66 that surrounds the coating device 2, the horizontal movement mechanism 40, and the laser beam irradiation unit including the head 64. In Figure 3, for convenience, only the edges of the cover 66 are shown with dashed lines. A touch panel 68 is also provided on the side of the cover 66.
[0073] This touch panel 68 is composed of, for example, an input unit such as a capacitive or resistive touch sensor and a display unit (notification unit) such as a liquid crystal display or an organic EL (Electro-Luminescence) display, and functions as a user interface.
[0074] Furthermore, the structures and methods of the embodiments described above can be modified as appropriate without departing from the scope of the present invention. [Explanation of Symbols]
[0075] 2: Coating device 4: Holding table (4a: Porous plate) 6: Chamber (6a: outer wall, 6b: bottom wall, 6c: inner wall) 8: Drain port 10: Support leg 11: Frame Unit 12: Spindle 13: Workpiece (13a: front side, 13b: back side) 14: Housing 15: Planned division line 16:Support mechanism 17: Device 18: Air Cylinder 19: Tape 20: Support leg 21: Frame (21a: Opening) 22a: Support shaft, 22b: Arm, 22c: Nozzle (protective film supply nozzle) 24a: Support shaft, 24b: Arm, 24c: Nozzle (gas injection nozzle) 24d: Gas supply source, 24e: Valve, 24f: Dryer 26a: Support shaft, 26b: Arm, 26c: Nozzle (cleaning fluid spray nozzle) 28: Laser processing equipment 30: Base 32: Cassette 34: Cassette Table 36: Adjustment Guide Rail 38: Conveyor Unit 40: Horizontal movement mechanism 42: Y-axis guide rail 44: Y-axis moving plate 46: Screw shaft 48: Motor 50: X-axis guide rail 52: X-axis movement plate 54: Screw shaft 56: Table base 58: Holding table (58a: Porous plate) 60:Support structure 62: Arm 64: Head 66: Cover 68: Touch panel
Claims
1. A drying mechanism comprising: a rotatable holding table that holds the lower side of a plate-shaped object having a protective film made of a light-absorbing agent added to its upper surface; a gas injection nozzle capable of injecting gas toward the film provided on the upper surface of the plate-shaped object held by the holding table; and a gas supply source capable of supplying the gas to the gas injection nozzle via a gas supply passage on which a dryer is provided; A protective film agent supply nozzle capable of dropping the protective film agent onto the upper surface of the plate-shaped object held by the holding table, A method for forming a protective film on the upper surface of a plate-like object in a coating apparatus including the following: With the holding table holding the lower surface of the plate-shaped object, a predetermined amount of the protective film agent is dropped from the protective film agent supply nozzle onto the upper surface of the plate-shaped object. The protective film agent is dropped onto the upper surface of the plate-shaped object, and the holding table is rotated while the lower surface of the plate-shaped object is being held to cover the entire upper surface of the plate-shaped object with the film. The protective film is formed by drying the film and forming it by rotating the holding table while the film is holding the lower side of the plate-shaped object on which the film is provided on the upper surface, and spraying the dehumidified gas from the dryer towards the film from the gas injection nozzle. A method that includes [a certain feature].
2. The method according to claim 1, further comprising laser processing the plate-like object via a protective film that covers the entire upper surface of the plate-like object so as to divide the plate-like object along a plurality of planned division lines.
3. The coating apparatus further includes a cleaning liquid spray nozzle capable of spraying cleaning liquid toward the protective film formed on the upper surface of the plate-shaped object held by the holding table, In the coating apparatus, While holding the lower surface of the laser-processed plate-like object, the holding table is rotated, and the cleaning solution is sprayed from the cleaning solution nozzle toward the protective film formed on the upper surface of the plate-like object, thereby washing away the protective film. The upper surface of the plate-like object is dried by rotating the holding table while holding the lower surface of the plate-like object, with the protective film washed off the upper surface, and spraying the dehumidified gas from the dryer towards the upper surface of the plate-like object from the gas injection nozzle. The method according to claim 2, further comprising:
4. The method according to any one of claims 1 to 3, wherein all steps are carried out using a laser processing apparatus incorporating the coating apparatus.