Transceiver module
The transceiver module enhances isolation between transmitting and receiving circuits by using separate housing sections with non-contacting metal covers, addressing signal degradation issues in high-frequency applications and enabling miniaturization.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- YAZAKI CORP
- Filing Date
- 2022-06-27
- Publication Date
- 2026-07-07
Smart Images

Figure 0007886202000001 
Figure 0007886202000002 
Figure 0007886202000003
Abstract
Description
Technical Field
[0001] The present invention relates to a transmission and reception module.
Background Art
[0002] Conventionally, there is a transmission and reception module incorporating a transmission circuit and a reception circuit. In such a transmission and reception module, there is a concern that so-called crosstalk occurs, where the electricity on the transmission circuit side mixes into the reception circuit, or the electricity on the reception circuit side mixes into the transmission circuit. Therefore, Patent Document 1 discloses a technique related to an optical transmission and reception module that improves isolation to suppress crosstalk that may occur between a transmission-side circuit element and a reception-side circuit element mounted on a Si substrate.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0004] In the optical transmission and reception module disclosed in Patent Document 1, in order to improve isolation in the transmission path on the substrate, the reception-side circuit element is mounted on the Si substrate via an insulator sub-substrate. However, since there is a dielectric film at the interface between the mounting component as a circuit element and the Si substrate, there is a concern that isolation deteriorates through the thickness of the dielectric.
[0005] Furthermore, in the optical transceiver module disclosed in Patent Document 1, a shielding plate is provided on the Si substrate to improve isolation in the spatial path. However, when handling high-frequency signals of GHz class or higher, for example, a shielding plate that partially covers the Si substrate as disclosed may not provide sufficient isolation. On the other hand, even if the shielding plate covers the entire Si substrate, an insulating film is formed between the shielding plate and the surface of the Si substrate, so there is room for further improvement to suppress the deterioration of isolation in the spatial path.
[0006] This invention has been made in view of the problems of the prior art. The object of this invention is to provide a transceiver module that improves isolation between a transmitting circuit and a receiving circuit. [Means for solving the problem]
[0007] A transceiver module according to an aspect of the present invention, comprising a transmitting circuit and a receiving circuit, the module comprising a main body case having a first housing section for housing the transmitting circuit and a second housing section for housing the receiving circuit, a first cover covering the first housing section and a second cover covering the second housing section, wherein the first housing section and the second housing section are provided separately from each other, and the first cover and the second cover are mounted on the main body case in a non-contact state with each other. [Effects of the Invention]
[0008] According to the present invention, a transceiver module that improves isolation between a transmitting circuit and a receiving circuit can be provided. [Brief explanation of the drawing]
[0009] [Figure 1A] This is a perspective view of the transmit / receive module according to the first embodiment. [Figure 1B] This is a partially exploded view of the transmitting and receiving module according to the first embodiment. [Figure 2A] This is a perspective view of the transmit / receive module related to the comparative example. [Figure 2B]This is a cross-sectional view corresponding to IIB-IIB shown in Figure 2A. [Figure 3A] This is a perspective view of the transceiver module according to the second embodiment. [Figure 3B] This is a partially exploded view of the transmitting and receiving module according to the second embodiment. [Figure 4] This is a perspective view of the transceiver module according to the third embodiment. [Figure 5A] This graph shows the isolation between the transmitting and receiving circuits in a comparative example. [Figure 5B] This graph shows the isolation between the transmitting and receiving circuits in the third embodiment. [Figure 6A] This is a perspective view of the transmitting and receiving module according to the fourth embodiment. [Figure 6B] This is a partially exploded view of the transceiver module according to the fourth embodiment. [Figure 7A] This is a perspective view of the transmitting and receiving module according to the fifth embodiment. [Figure 7B] This is a partially exploded view of the transmitting and receiving module according to the fifth embodiment. [Modes for carrying out the invention]
[0010] The following describes in detail the transmitting and receiving modules according to each embodiment using the drawings. Note that the dimensional ratios in the drawings are exaggerated for illustrative purposes and may differ from the actual ratios.
[0011] (First Embodiment) Figure 1A is a perspective view of the transceiver module 10 according to the first embodiment. Figure 1B is a partially exploded view of the transceiver module 10.
[0012] The transceiver module 10 is, for example, an optical transceiver module that handles high-frequency signals of the GHz class or higher. These high-frequency signals include, for example, signals in the quasi-millimeter wave band, such as the 28 GHz band. The overall shape of the transceiver module 10 is a flat, rectangular parallelepiped. Furthermore, the dimensions of each side defining the overall shape of the transceiver module 10 are assumed to be several centimeters, in accordance with recent miniaturization requirements.
[0013] The transmission / reception module 10 includes a main body case 11, a first cover 12, a second cover 13, a transmission circuit 14, a reception circuit 15, a light emitting part 16, a light receiving part 17, a first connector 18, and a second connector 19.
[0014] The main body case 11 is a metal housing that defines part of the appearance of the transmission / reception module 10. The main body case 11 has a first accommodation part 11a that houses the transmission circuit 14 and a second accommodation part 11b that houses the reception circuit 15. The first accommodation part 11a and the second accommodation part 11b are provided separately from each other in the main body case 11.
[0015] Here, in order to describe the shapes and installation positions, etc. of the first accommodation part 11a and the second accommodation part 11b in the main body case 11, each direction is defined. First, assume that the overall shape of the transmission / reception module 10 is flat as shown in FIG. 1A, and define the thickness direction of the transmission / reception module 10 as the Z direction. Also, define the plane of the transmission / reception module 10 as an XY plane perpendicular to the Z direction, and define the X direction and the Y direction as two directions perpendicular to each other on the XY plane. In this case, in the present embodiment, the direction along the Z direction corresponds to the formation direction of the first accommodation part 11a and the second accommodation part 11b in the main body case 11, and the mounting direction of the first cover 12 and the second cover 13. Also, in the present embodiment, the dimension in the Z direction of the transmission / reception module 10 is set smaller than the dimension of each side in the X direction or the Y direction.
[0016] And the main body case 11 has an intermediate wall part 11g provided at an intermediate position between the first accommodation part 11a and the second accommodation part 11b. Here, the intermediate position is not limited to being set as an intermediate value as strict dimensions, but refers to a broad intermediate position located between the first accommodation part 11a and the second accommodation part 11b.
[0017] In this embodiment, the first housing section 11a and the second housing section 11b are each formed in a box shape with one surface parallel to the XY plane as an opening. The opening end that defines the opening surface of the first housing section 11a is the first opening end 11c. The first opening end 11c is open in the Z direction (hereinafter referred to as the "first direction") and is the part to which the first cover 12 is attached. On the other hand, the opening end that defines the opening surface of the second housing section 11b is the second opening end 11d. The second opening end 11d is open in the direction opposite to the Z direction (hereinafter referred to as the "second direction") and is the part to which the second cover 13 is attached.
[0018] The intermediate wall portion 11g has a main plane along the XZ plane, and includes a first surface 11h corresponding to one main plane and a second surface 11i corresponding to the other main plane on the opposite side of the first surface 11h. At least a portion of the first surface 11h faces the first housing portion 11a. That is, with respect to the intermediate wall portion 11g, the first open end 11c of the first housing portion 11a is open in a first direction along the first surface 11h. On the other hand, at least a portion of the second surface 11i faces the second housing portion 11b. That is, with respect to the intermediate wall portion 11g, the second open end 11d of the second housing portion 11b is open in a second direction along the second surface 11i. Furthermore, the dimensions of the first housing portion 11a and the second housing portion 11b are set to be equal to each other. Furthermore, the first open end 11c and the second open end 11d are aligned on the same XY plane, with the intermediate wall portion 11g in between.
[0019] Furthermore, the main case 11 has a first semi-cylindrical portion 11e and a first notch portion 11f for each of the first housing portion 11a and the second housing portion 11b. The first semi-cylindrical portion 11e is a through-hole through which the first optical cable 16a or the second optical cable 17a passes between each housing portion and the outside. The first notch portion 11f is a through-hole through which the first connector 18 or the second connector 19 passes between each housing portion and the outside. The first semi-cylindrical portion 11e is formed on one side of the main case 11 parallel to the YZ plane, and the first notch portion 11f is formed on the other side of the main case 11 parallel to the YZ plane. In other words, the opening of the first semi-cylindrical portion 11e and the opening of the first notch portion 11f are open to the outside in opposite directions along the X direction. The opening shape of the first notch 11f may be set to match at least a part of the outer shape of the first connector 18 or second connector 19 to which it is installed, so as to make close contact with the connector.
[0020] The first cover 12 is made of metal and is attached to the main case 11 so as to cover the first housing portion 11a. The first cover 12 has a first inner wall portion 12a and is formed in a box shape with one surface parallel to the XY plane as an opening surface. The frame end that defines the opening surface of the first inner wall portion 12a is the first frame end 12b. When the first cover 12 is attached to the main case 11, the first frame end 12b is in contact with the first opening end 11c. The size of the first cover 12 is set so that when the first frame end 12b and the first opening end 11c are in contact, it faces the portion of the main case 11 where the second housing portion 11b is formed in the Y direction. As a result, the first cover 12 is attached to the main case 11 so that the outer surfaces of the main case 11 and the first cover 12 are continuous, as shown in Figure 1A. When the first cover 12 is attached to the main body case 11, a first internal space S1 is formed by combining the first housing portion 11a on the main body case 11 side and the first inner wall portion 12a on the first cover 12 side.
[0021] Furthermore, the first cover 12 has a second semi-cylindrical portion 12c and a second notch portion 12d. The second semi-cylindrical portion 12c is a through-hole that combines with one of the first semi-cylindrical portions 11e provided in the main body case 11 when the first cover 12 is mounted on the main body case 11. The second notch portion 12d is a through-hole that combines with one of the first notches 11f provided in the main body case 11 when the first cover 12 is mounted on the main body case 11. The opening shape of the second notch portion 12d may also be set to match at least a part of the outer shape of the first connector 18 so as to make close contact with the first connector 18 to be installed. In other words, in this embodiment, the first connector 18 is exposed to the outside through a first through-hole formed by combining the first notch portion 11f and the second notch portion 12d.
[0022] The second cover 13 is made of metal and is attached to the main case 11 so as to cover the second housing portion 11b. The second cover 13 has a second inner wall portion 13a and is formed in a box shape with one surface parallel to the XY plane as an opening surface. The frame end that defines the opening surface of the second inner wall portion 13a is the second frame end 13b. When the second cover 13 is attached to the main case 11, the second frame end 13b is in contact with the second opening end 11d. When the second frame end 13b and the second opening end 11d are in contact, the size of the second cover 13 is set so that it faces the portion of the main case 11 where the first housing portion 11a is formed in the Y direction. As a result, the second cover 13 is attached to the main case 11 so that the outer surfaces of the main case 11 and the second cover 13 are continuous, as shown in Figure 1A. When the second cover 13 is attached to the main case 11, a second internal space S2 is formed by combining the second housing portion 11b on the main case 11 side and the second inner wall portion 13a on the second cover 13 side.
[0023] Furthermore, the second cover 13 has a third semi-cylindrical portion (not shown) and a third notch portion 13d. The third semi-cylindrical portion is a through-hole that, like the second semi-cylindrical portion 12c of the first cover 12, is combined with one of the first semi-cylindrical portions 11e provided in the main body case 11 when the second cover 13 is mounted on the main body case 11. The third notch portion 13d is a through-hole that, when the second cover 13 is mounted on the main body case 11, is combined with one of the first notches 11f provided in the main body case 11. The opening shape of the third notch portion 13d may also be set to match at least a part of the outer shape of the second connector 19 so as to make close contact with the second connector 19 to be installed. In other words, in this embodiment, the second connector 19 is exposed to the outside through a second through-hole formed by combining the first notch portion 11f and the third notch portion 13d.
[0024] When attaching the first cover 12 and the second cover 13 to the main body case 11, they may be fixed to each other by fastening with screws (not shown), for example, or by crimping separately provided crimping parts.
[0025] The transmitting circuit 14 is located near the first connector 18 and converts electrical signals input from the outside via the first connector 18, causing the light-emitting unit 16 to transmit optical signals to the outside. The transmitting circuit 14 includes, for example, a first signal line 14b and a first mounted component 14c mounted on the first substrate 14a. The first signal line 14b transmits signals between the elements of the first connector 18, the first mounted component 14c, and the light-emitting unit 16. The first mounted component 14c is, for example, a driver IC. Hereinafter, the side of the first substrate 14a on which the first signal line 14b or the first mounted component 14c is mounted will be referred to as the "surface side" of the transmitting circuit 14.
[0026] The receiving circuit 15 is located near the second connector 19 and converts the optical signal input from the outside via the light receiving unit 17, causing the second connector 19 to transmit an electrical signal to the outside. The receiving circuit 15 includes, for example, a second signal line 15b and a second mounted component 15c mounted on the second substrate 15a. The second signal line 15b transmits signals between the elements of the second connector 19, the second mounted component 15c, and the light receiving unit 17. The second mounted component 15c is, for example, an amplifier IC. Hereinafter, the side of the second substrate 15a on which the second signal line 15b or the second mounted component 15c is mounted will be referred to as the "surface side" of the receiving circuit 15.
[0027] The light-emitting unit 16 is a light-emitting element that emits light as an optical signal transmitted to the outside via a first optical cable 16a made of optical fiber, based on input from the transmission circuit 14. The light-emitting element is, for example, a semiconductor laser. In this embodiment, the light-emitting unit 16 is configured separately from the transmission circuit 14, but it may be mounted on the first substrate 14a as part of the transmission circuit 14. In this embodiment, the first optical cable 16a is directly connected to the light-emitting unit 16 from the outside through a through-hole consisting of a combination of a first semi-cylindrical section 11e and a second semi-cylindrical section 12c, but it may also be connected to the light-emitting unit 16 via an optical connector, for example.
[0028] The light-receiving unit 17 is a light-receiving element that receives light as an optical signal transmitted from the outside via a second optical cable 17a made of optical fiber. The light-receiving element is, for example, a photodiode. In this embodiment, the light-receiving unit 17 is configured separately from the receiving circuit 15, but it may be mounted on the second substrate 15a as part of the receiving circuit 15. In this embodiment, the second optical cable 17a is in direct communication with the light-receiving unit 17 from the outside through a through-hole consisting of a combination of a first semi-cylindrical portion 11e and a third semi-cylindrical portion (not shown), but it may also be connected to the light-receiving unit 17 via an optical connector, for example.
[0029] The first connector 18 is electrically connected to the transmitting circuit 14 and also connects to the connector on the external input wire side. Similarly, the second connector 19 is electrically connected to the receiving circuit 15 and also connects to the connector on the external output wire side.
[0030] Next, the operation and effects of the transmitting / receiving module 10 will be explained.
[0031] The transceiver module 10, which includes a transmitting circuit 14 and a receiving circuit 15, comprises a main body case 11 having a first housing section 11a for housing the transmitting circuit 14 and a second housing section 11b for housing the receiving circuit 15. The transceiver module 10 also comprises a first cover 12 covering the first housing section 11a and a second cover 13 covering the second housing section 11b. The first housing section 11a and the second housing section 11b are provided separately from each other, and the first cover 12 and the second cover 13 are mounted on the main body case 11 in a non-contact state with each other.
[0032] Generally, in transceiver modules that incorporate both transmitting and receiving circuits, signal loss in the transmission path or spatial path is greater when the signal being handled is in the quasi-millimeter wave band compared to when it is in the low-frequency band. Therefore, it is necessary to compensate for the signal that has been attenuated in each path and reduced to a low level with an amplifier with a large gain, and as a result, the difference in signal levels between the transmitting and receiving circuits becomes large. Consequently, while the distance between the transmitting and receiving circuits is reduced in response to the demand for miniaturization of transceiver modules, a higher level of isolation is required.
[0033] To facilitate understanding the operation and effects of the transmit / receive module 10 according to this embodiment in response to such requirements, we will first illustrate a transmit / receive module as a comparative example that does not adopt the features of this embodiment.
[0034] Figure 2A is a perspective view of a comparative example transceiver module 100, drawn to correspond to Figure 1A of this embodiment. Figure 2B is a cross-sectional view corresponding to IIB-IIB shown in Figure 2A. Parts identical in configuration to the transceiver module 10 shown in Figures 1A and 1B are denoted by the same reference numerals, and their descriptions are omitted.
[0035] As a basic configuration of the transmitting / receiving module 100, the general shape and size of the transmitting / receiving module 100 shall be the same as those of the transmitting / receiving module 10 according to this embodiment. Furthermore, the transmitting / receiving module 100 shall include the transmitting circuit 14 and the receiving circuit 15 in this embodiment, and connectors and the like associated with them.
[0036] The transceiver module 100 comprises a metal lower case 110 that replaces the main body case 11 in this embodiment, and a metal upper case 120 that replaces the first cover 12 and the second cover 13 in this embodiment. In the transceiver module 100, the lower case 110 has a first housing section 110a that houses the transmitting circuit 14 and a second housing section 110b that houses the receiving circuit 15, separated from each other by an intermediate wall section 110c. On the other hand, the upper case 120 has a first inner wall section 120a and a second inner wall section 120b that are separated from each other by a fitting section 120c that fits a part of the intermediate wall section 110c. Then, when the lower case 110 and the upper case 120 are combined, a first internal space S11 is formed by combining the first housing section 110a and the first inner wall section 120a, and a second internal space S12 is formed by combining the second housing section 110b and the second inner wall section 120b.
[0037] Thus, in the transmitting / receiving module 100, the first internal space S11 and the second internal space S12 are provided separately. However, in this case, the first housing section 110a and the second housing section 110b provided in the lower case 110 are both covered by the upper case 120 alone. Furthermore, even if a part of the intermediate wall section 110c is fitted into the fitting section 120c, as shown in Figure 2B, a minute gap may occur between the intermediate wall section 110c and the front end surface 110d, and between the bottom surface 120d of the fitting section 120c facing the front end surface 110d.
[0038] For example, consider a case where the signal modulation scheme is 64QAM, the received signal power at the receiving circuit 15 is about -70 dBm, and the output signal power at the transmitting circuit 14 is about +10 dBm. In this case, to maintain sufficient signal quality at the receiving circuit 15, an isolation of about 100 dB between the transmitting circuit 14 and the receiving circuit 15 may be necessary. However, considering that the wavelength of the signal is also shortened to a few centimeters, unwanted electric fields are more likely to penetrate gaps such as the front surface 110d and the bottom surface 120d of the transmitting / receiving module 100. In other words, depending on the configuration of the transmitting / receiving module 100, the isolation between the transmitting circuit 14 and the receiving circuit 15 may be more prone to deterioration.
[0039] In contrast, in the transceiver module 10 according to this embodiment, the first housing section 11a, which houses the transmitting circuit 14, is covered by the first cover 12. On the other hand, the second housing section 11b, which houses the receiving circuit 15, is covered by the second cover 13, which is not in contact with the first cover 12. In other words, the first internal space S1 formed by the first housing section 11a and the first cover 12 and the second internal space S2 formed by the second housing section 11b and the second cover 13 are separated from each other and therefore cannot be continuous inside the transceiver module 10.
[0040] Therefore, since the transmission path between the transmitting circuit 14 and the receiving circuit 15 is not directly continuous, isolation can be improved without providing a special cancellation circuit such as an insulating sub-board in the receiving circuit 15. On the other hand, as for the spatial path between the transmitting circuit 14 and the receiving circuit 15, no gaps like those that may exist in the transmitting / receiving module 100 mentioned as a comparative example can occur inside the transmitting / receiving module 10. Therefore, the transmitting / receiving module 10 can be configured without pre-providing any parts where unwanted electric fields can enter, thus improving isolation.
[0041] As described above, this embodiment provides a transceiver module 10 that improves isolation between the transmitting circuit 14 and the receiving circuit 15.
[0042] Furthermore, in the transmitting / receiving module 10, the main body case 11 may have an intermediate wall portion 11g including a first surface 11h and a second surface 11i located opposite the first surface 11h. At least a portion of the first surface 11h may face the first housing portion 11a. At least a portion of the second surface 11i may face the second housing portion 11b.
[0043] With this transmitting / receiving module 10, the first housing section 11a and the second housing section 11b are arranged to face each other with respect to the intermediate wall section 11g, which can be advantageous for miniaturizing the main case 11 and, consequently, the entire transmitting / receiving module 10.
[0044] Furthermore, in the transmitting / receiving module 10, the first open end 11c of the first housing portion 11a to which the first cover 12 is attached may be open in a first direction along the first surface 11h of the intermediate wall portion 11g. The second open end 11d of the second housing portion 11b to which the second cover 13 is attached may be open in a second direction along the second surface 11i of the intermediate wall portion 11g. The first direction and the second direction may be opposite to each other.
[0045] In the main case 11, the intermediate wall 11g functions as a barrier that blocks the transmission path and spatial path between the transmitting circuit 14 and the receiving circuit 15 in the transmitting / receiving module 10. Therefore, referring to Figure 1B, the spatial path between the transmitting circuit 14 housed in the first housing 11a and the receiving circuit 15 housed in the second housing 11b becomes a path that exits the transmitting / receiving module 10, as indicated by the white arrow in the figure. At this time, because the first open end 11c and the second open end 11d are open in opposite directions, the spatial path indicated by the white arrow becomes a path inclined with respect to the XY plane when viewed in the X direction. In other words, the spatial distance connecting the transmitting circuit 14 and the receiving circuit 15 can be increased compared to a configuration like the transmitting / receiving module 100. Therefore, with this transmitting / receiving module 10, even if there is a gap based on dimensional tolerances between, for example, the first cover 12 and the main case 11 when the first cover 12 etc. is attached to the main case 11, it is easier to suppress the deterioration of isolation.
[0046] In particular, the receiving circuit 15 includes a second mounted component such as an amplifier IC, and therefore generates strong power in the second signal line 15b, etc. In contrast, the first signal line 14b of the transmitting circuit 14 handles relatively weak signals. Therefore, the spatial distance between the transmitting circuit 14 and the receiving circuit 15, which should be as roundabout as possible, may specifically be the spatial distance between the first signal line 14b of the transmitting circuit 14 and the second signal line 15b of the receiving circuit 15.
[0047] Furthermore, in the transmitting / receiving module 10, the signals handled by the transmitting circuit 14 and the receiving circuit 15 may be high-frequency signals of GHz class or higher.
[0048] This transmit / receive module 10 makes it easier to obtain the desired isolation even when dealing with high-frequency signals in the quasi-millimeter wave band.
[0049] Furthermore, in the transmitting / receiving module 10, the main body case 11, the first cover 12, and the second cover 13 may be made of metal.
[0050] With this transmit / receive module 10, the main case 11, the first cover 12, and the second cover 13 themselves function as shielding plates in the spatial path between the transmit circuit 14 and the receive circuit 15. Therefore, it may be advantageous to miniaturize the entire transmit / receive module 10, for example, by making the width of each side along the X or Y direction about 3 cm each.
[0051] (Second Embodiment) In the first embodiment, the main body case 11 has an intermediate wall portion 11g. In contrast, the second embodiment illustrates a case in which the shape of the intermediate wall portion 11g in the first embodiment is modified.
[0052] Figure 3A is a perspective view of the transceiver module 20 according to the second embodiment. Figure 3B is a partially exploded view of the transceiver module 20.
[0053] The transceiver module 20 comprises a main body case 21, a first cover 22, a second cover 23, a transmitting circuit 14, a receiving circuit 15, a light-emitting unit 16, a light-receiving unit 17, a first connector 18, and a second connector 19. Parts identical in configuration to those of the transceiver module 10 shown in Figures 1A and 1B of the first embodiment are denoted by the same reference numerals, and their descriptions are omitted. Furthermore, the general shape and size of the transceiver module 20 are equivalent to those of the transceiver module 10.
[0054] The main body case 21 is a component corresponding to the main body case 11 in the first embodiment, and has a first housing section 21a for housing the transmitting circuit 14 and a second housing section 21b for housing the receiving circuit 15. Specifically, with respect to the first housing section 21a, the main body case 21 has a first open end 21c, a first semi-cylindrical section 21e, and one first notch 21f. Furthermore, with respect to the second housing section 21b, the main body case 21 has a second open end 21d, a first semi-cylindrical section (not shown), and the other first notch 21f.
[0055] Furthermore, the main case 21 has an intermediate wall portion 21g corresponding to the intermediate wall portion 11g in the first embodiment, and is provided at an intermediate position between the first housing portion 21a and the second housing portion 21b. The intermediate wall portion 21g includes a first surface 21h corresponding to one main plane and a second surface 21i corresponding to the other main plane on the opposite side of the first surface 21h. At least a portion of the first surface 21h faces the first housing portion 21a. On the other hand, at least a portion of the second surface 21i faces the second housing portion 21b.
[0056] Here, the first connector 18 is exposed to the outside through a first through-hole formed by combining the first notch 21f on the first housing portion 21a side and the second notch 22d provided in the first cover 22. Similarly, the second connector 19 is exposed to the outside through a second through-hole formed by combining the first notch 21f on the second housing portion 21b side and the third notch 23d provided in the second cover 23. In this embodiment, the width W in the Y direction of the intermediate wall portion 21g corresponds to the width W of the portion of the intermediate wall portion 21g sandwiched between the first through-hole and the second through-hole, and is set to match the distance between the first through-hole and the second through-hole. In other words, the width W of the intermediate wall portion 21g is set to be wider than the width of the same portion of the intermediate wall portion 11g in the first embodiment. In this example, the first surface 21h of the intermediate wall portion 21g is also one end of the first notch 21f on the first housing portion 21a side. Similarly, the second surface 21i of the intermediate wall portion 21g is also one end of the first notch portion 21f on the second housing portion 21b side.
[0057] Furthermore, as the width W of the intermediate wall portion 21g is set to be wider, the volume of the first housing portion 21a and the second housing portion 21b becomes smaller than the volume of the first housing portion 11a or the second housing portion 11b in the first embodiment. For this reason, each component housed in the first housing portion 21a or the second housing portion 21b, such as the transmitting circuit 14 and the receiving circuit 15, may also be made smaller.
[0058] Furthermore, as the width W is set to be wider, the intermediate wall portion 21g may have two grooves that face the first cover 22 and the second cover 23 in the Z direction. In this embodiment, the intermediate wall portion 21g has a first groove portion 21j that contacts a part of the first inner wall portion 22a of the first cover 22 in the Z direction, and a second groove portion 21k that contacts a part of the second inner wall portion 23a of the second cover 23 in the Z direction.
[0059] On the other hand, the first cover 22 has a shape such that a portion facing the first groove 21j is cut out from the first cover 12 in the first embodiment. For example, the first cover 22 may have a first frame end 12b that contacts the first open end 11c of the first housing portion 21a, as well as a first end face 22e that faces the first surface 21h of the intermediate wall portion 21g when mounted on the main body case 21. Similarly, the second cover 23 has a shape such that a portion facing the second groove 21k is cut out from the second cover 13 in the first embodiment. For example, the second cover 23 may have a second frame end 23b that contacts the second open end 21d of the second housing portion 21b, as well as a second end face 23e that faces the second surface 21i of the intermediate wall portion 21g when mounted on the main body case 21.
[0060] Next, the operation and effects of the transmitting / receiving module 20 will be explained.
[0061] The transmitting / receiving module 20 is electrically connected to the transmitting circuit 14 and includes a first connector 18 that is exposed to the outside through a first through-hole provided in the main body case 21 or the first cover 22. The transmitting / receiving module 20 is also electrically connected to the receiving circuit 15 and includes a second connector 19 that is exposed to the outside through a second through-hole provided in the main body case 21 or the second cover 23. The width W of the portion of the intermediate wall 21g sandwiched between the first through-hole and the second through-hole may be set to match the distance between the first through-hole and the second through-hole.
[0062] In the transmitting / receiving module 20, the width W of the intermediate wall portion 21g that defines the distance between the first housing portion 21a housing the transmitting circuit 14 and the second housing portion 21b housing the receiving circuit 15 is set to be wider than the width of the intermediate wall portion 11g at the same position in the first embodiment. Therefore, with respect to the spatial path shown by the white arrow in Figure 1B, the spatial distance connecting the transmitting circuit 14 and the receiving circuit 15 can be made longer than in the first embodiment, thus further improving isolation.
[0063] In this embodiment, the example given is that the width W in the Y direction of the intermediate wall portion 21g is set to a uniform dimension overall, but the embodiment is not limited to this. For example, the width W of the portion of the intermediate wall portion 21g sandwiched between the first and second through-holes may be set to match the distance between the first and second through-holes, while the width W in the Y direction of the other portions may be set to be thinner.
[0064] (Third embodiment) In the third embodiment, an example is given of adding a new part to the main body case 21 of the transmitting / receiving module 20 according to the second embodiment.
[0065] Figure 4 is a perspective view of the transceiver module 30 according to the third embodiment.
[0066] The transceiver module 30 comprises a main body case 31, a first cover 22, a second cover 23, a transmitting circuit 14, a receiving circuit 15, a light-emitting unit 16, a light-receiving unit 17, a first connector 18, and a second connector 19. Note that parts identical in configuration to the transceiver module 20 shown in Figures 3A and 3B of the second embodiment are denoted by the same reference numerals, and their descriptions are omitted. In the transceiver module 30, only the shape of the main body case 31 is different from the transceiver module 20 according to the second embodiment.
[0067] The main body case 31 has a shape that is newly added to the main body case 21 in the second embodiment, with a protruding portion 31m added. The protruding portion 31m protrudes outward from the side surface on which a first through-hole that exposes the first connector 18 (see Figure 3A) to the outside and a second through-hole that exposes the second connector 19 (see Figure 3A) to the outside are provided. The first through-hole corresponds to the combination of the first notch 21f on the first housing portion 21a side and the second notch 22d provided on the first cover 22, as described in the second embodiment. Similarly, the second through-hole corresponds to the combination of the first notch 21f on the second housing portion 21b side and the third notch 23d provided on the second cover 23, as described in the second embodiment.
[0068] The protruding portion 31m is a part that extends along the X direction, with one end, the first end 31p, being exposed to the outside, and the other end, the second end 31q, being integrated with the side surface of the main body case 31 where the first and second through-holes are provided. The protruding portion 31m also has a first hole 31r and a second hole 31s, both of which penetrate along the extension direction of the protruding portion 31m. The first hole 31r is continuous with the first through-hole and allows the connector on the external input wire side, which is connected to the first connector 18, to be inserted. The second hole 31s is continuous with the second through-hole and allows the connector on the external output wire side, which is connected to the second connector 19, to be inserted.
[0069] Next, the operation and effects of the transmitting / receiving module 30 will be explained.
[0070] The transmitting / receiving module 30 is electrically connected to the transmitting circuit 14 and includes a first connector 18 that is exposed to the outside through a first through-hole provided in the main body case 31 or the first cover 22. The transmitting / receiving module 30 is also electrically connected to the receiving circuit 15 and includes a second connector 19 that is exposed to the outside through a second through-hole provided in the main body case 31 or the second cover 23. The main body case 31 may have a protruding portion 31m that protrudes outward from the side surface on the side where the first and second through-holes are provided. The protruding portion 31m may have a first hole portion 31r that is continuous with the first through-hole and a second hole portion 31s that is continuous with the second through-hole.
[0071] According to the transmitting / receiving module 30, the spatial path between the first through-hole and the second through-hole is a path that passes through both the first hole 31r and the second hole 31s. Therefore, not only the spatial distance related to the spatial path shown by the white arrow in Figure 1B, but also the spatial distance connecting the first through-hole and the second through-hole can be made longer than in the case of the second embodiment. Consequently, even if there is a gap between the first through-hole and the first connector 18, or between the second through-hole and the second connector 19, when the first cover 22 etc. is attached to the main body case 31, isolation can be further improved.
[0072] As an example, Figure 5A is a graph showing the isolation between the transmitting circuit 14 and the receiving circuit 15 for each frequency in the GHz class, for the transmitting / receiving module 100 as a comparative example illustrated using Figures 2A and 2B. In the configuration of the transmitting / receiving module 100, the gap between the upper case 120 and the lower case 110 is 0.1 mm, which is a commonly required dimensional tolerance. In this case, around 28 GHz, the isolation exceeds -50 dB, and it is difficult to say that sufficient isolation has been obtained.
[0073] In contrast, Figure 5B is a graph showing the isolation between the transmitting circuit 14 and the receiving circuit 15 obtained for each frequency in the GHz class for the transmitting / receiving module 30 according to this embodiment. Furthermore, in the configuration of the transmitting / receiving module 30, the gap between the main body case 31 and the first cover 22 and the second cover 23 is 0.1 mm, which is required as a general dimensional tolerance. In this case, isolation of less than -80 dB is obtained around 28 GHz. Moreover, isolation of about -100 dB can be obtained by fixing the main body case 31 and the first cover 22 and the second cover 23 by crimping, or by using conductive sheets or conductive paint in combination.
[0074] In this embodiment, an example is given in which a protrusion 31m is added to the main body case 21 of the transmitting / receiving module 20 according to the second embodiment, but the embodiment is not limited to this. For example, isolation can be further improved by adding a protrusion 31m to the main body case 11 of the transmitting / receiving module 10 according to the first embodiment.
[0075] (Fourth Embodiment) In the first embodiment, the first open end 11c on the first housing section 11a side and the second open end 11d on the second housing section 11b side of the main case 11 are open in opposite directions. In contrast, the fourth embodiment illustrates a case in which the first open end on the first housing section side and the second open end on the second housing section side are open in the same direction.
[0076] Figure 6A is a perspective view of the transceiver module 40 according to the fourth embodiment. Figure 6B is a partially exploded view of the transceiver module 40.
[0077] The transceiver module 40 comprises a main body case 41, a first cover 42, a second cover 43, a transmitting circuit 14, a receiving circuit 15, a light-emitting unit 16, a light-receiving unit 17, a first connector 18, and a second connector 19. Parts identical in configuration to those of the transceiver module 10 shown in Figures 1A and 1B of the first embodiment are denoted by the same reference numerals, and their descriptions are omitted. Furthermore, the general shape and size of the transceiver module 40 are equivalent to those of the transceiver module 10.
[0078] The main body case 41 is a component corresponding to the main body case 11 in the first embodiment, and has a first housing section 41a for housing the transmitting circuit 14 and a second housing section 41b for housing the receiving circuit 15. Specifically, with respect to the first housing section 41a, the main body case 41 has a first open end 41c, a first semi-cylindrical section 41e, and one first notch 41f. Furthermore, with respect to the second housing section 41b, the main body case 41 has a second open end 41d, a first semi-cylindrical section (not shown), and the other first notch 41f.
[0079] Furthermore, the main case 41 has an intermediate wall portion 41g corresponding to the intermediate wall portion 11g in the first embodiment, and is provided at an intermediate position between the first housing portion 41a and the second housing portion 41b. The intermediate wall portion 41g includes a first surface 41h corresponding to one main plane and a second surface 41i corresponding to the other main plane on the opposite side of the first surface 41h. At least a portion of the first surface 41h faces the first housing portion 41a. On the other hand, at least a portion of the second surface 41i faces the second housing portion 41b.
[0080] In this embodiment, with respect to the intermediate wall portion 41g, the first open end 41c of the first housing portion 41a is open in a first direction along the first surface 41h, and the second open end 41d of the second housing portion 41b is also open in a first direction along the second surface 41i. Furthermore, the first open end 41c and the second open end 41d are aligned on the same XY plane, with the intermediate wall portion 41g in between. In addition, a portion of the first surface 41h faces the first cover 42 after installation, and a portion of the second surface 41i faces the second cover 43 after installation.
[0081] On the other hand, the first cover 42, like the first cover 12 in the first embodiment, has a first inner wall portion 42a, a first frame end portion 42b, a second semi-cylindrical portion 42c, and a second notch portion 42d. The second cover 43, like the second cover 13 in the first embodiment, has a second inner wall portion 43a, a second frame end portion 43b, a third semi-cylindrical portion 43c, and a third notch portion 43d. When the first cover 42 is attached to the main body case 41, the first frame end portion 42b contacts the first open end portion 41c of the first housing portion 41a. On the other hand, when the second cover 43 is attached to the main body case 41, the second frame end portion 43b contacts the second open end portion 41d of the second housing portion 41b.
[0082] Next, the operation and effects of the transmitting / receiving module 40 will be explained.
[0083] In the transceiver module 40, the first open end 41c of the first housing section 41a to which the first cover 42 is attached and the second open end 41d of the second housing section 41b to which the second cover 43 is attached may be open to each other in the same direction. A portion of the first surface 41h of the intermediate wall section 41g may face the first cover 42 after it has been attached. A portion of the second surface 41i of the intermediate wall section 41g may face the second cover 43 after it has been attached.
[0084] According to the transmit / receive module 40, a space S between the cover and the second cover 43 is formed between the first cover 42 and the second cover 43 after they are mounted on the main body case 41, as shown in Figure 6A. A portion of the intermediate wall 41g is positioned in the space S between the cover and the second cover. Therefore, even if the first cover 42 and the second cover 43 are mounted close to the main body case 41, the intermediate wall 41g can function as a barrier that blocks the spatial path between the transmit circuit 14 and the receive circuit 15 in the space S between the cover and the second cover 43. Thus, even if there is a gap between the main body case 41 and the first cover 42 or the second cover 43 based on dimensional tolerances when the first cover 42 etc. are mounted on the main body case 41, it is possible to suppress the deterioration of isolation.
[0085] Furthermore, in the transceiver module 40, since the first open end 41c of the first housing section 41a and the second open end 41d of the second housing section 41b are open in the same direction, the mounting direction of the transmitting circuit 14 and the receiving circuit 15, etc., to the main case 41 is also the same direction. Therefore, this may also be advantageous in terms of improving the manufacturing efficiency of the transceiver module 40.
[0086] (Fifth embodiment) In each of the above embodiments, the components related to the transmitting circuit 14 and the components related to the receiving circuit 15 are arranged inside the transmitting / receiving module 10, etc., so that they face the same direction, a first direction. In contrast, the fifth embodiment illustrates a case in which the components related to the transmitting circuit 14 and the components related to the receiving circuit 15 are arranged so that they face opposite directions.
[0087] Figure 7A is a perspective view of the transceiver module 50 according to the fifth embodiment. Figure 7B is a partially exploded view of the transceiver module 50.
[0088] The transceiver module 50 comprises a main body case 51, a first cover 22, a second cover 53, a transmitting circuit 14, a receiving circuit 15, a light-emitting unit 16, a light-receiving unit 17, a first connector 18, and a second connector 19. Note that parts identical in configuration to the transceiver module 20 shown in Figures 3A and 3B of the second embodiment are denoted by the same reference numerals, and their descriptions are omitted. The transceiver module 50 differs from the transceiver module 20 of the second embodiment in that the components related to the receiving circuit 15 are arranged inverted in the Z direction. Furthermore, due to this inverted arrangement, the shape of the second through-hole that exposes the second connector 19 to the outside is changed in the transceiver module 50 compared to the transceiver module 20.
[0089] The basic shape of the main body case 51 is the same as that of the main body case 21 in the second embodiment. The main body case 51, particularly with respect to the second housing section 51b that houses the receiving circuit 15, has a second open end 51d, a first semi-cylindrical section (not shown), and a first notch 51f as part of the second through-hole. In the main body case 51, as the second connector 19 is arranged in a reversed position, the shape of the first notch 51f differs from the shape of the first notch 21f in the main body case 21 in the second embodiment. The main body case 51 also has an intermediate wall section 51g that includes a second surface 51i and a second groove 21k, which is the same as the intermediate wall section 21g in the second embodiment. The first housing section 51a that houses the transmitting circuit 14 in the main body case 51 has the same shape as the first housing section 21a of the main body case 21 in the second embodiment, and therefore is not shown in Figure 7B.
[0090] On the other hand, the basic shape of the second cover 53 is the same as that of the second cover 23 in the second embodiment. The second cover 53 has a second frame end 53b that contacts the second open end 51d of the second housing portion 51b, as well as a second end face 53e that faces the second surface 51i of the intermediate wall portion 51g when mounted on the main body case 51. The second cover 53 also has a third semi-cylindrical portion 53c and a third notch portion 53d. In the second cover 53, as the second connector 19 is arranged in a reversed position, the shape of the third notch portion 53d differs from the shape of the third notch portion 23d in the second cover 23 in the second embodiment.
[0091] Next, the operation and effects of the transmitting / receiving module 50 will be explained.
[0092] In the transmitting / receiving module 50, the first housing section 51a may house the transmitting circuit 14 such that the surface side on which the first signal line 14b or the first mounted component 14c is mounted faces the first direction. The second housing section 51b may house the receiving circuit 15 such that the surface side on which the second signal line 15b or the second mounted component 15c is mounted faces the second direction.
[0093] In the transmitting / receiving module 50, the transmitting circuit 14 and the receiving circuit 15 are arranged so as to be inversely related to each other. Here, it is considered that noise radiation is greater from the surface side where the signal lines or mounted components are mounted in each circuit. Therefore, by arranging the transmitting circuit 14 and the receiving circuit 15 so as to be inversely related to each other, the surface side of the transmitting circuit 14 on which the first signal line 14b etc. is mounted and the surface side of the receiving circuit 15 on which the second signal line 15b etc. is mounted are oriented in opposite directions. This makes it easier to suppress the deterioration of isolation between the transmitting circuit 14 and the receiving circuit 15.
[0094] In this embodiment, an example is given in which the transmitting circuit 14 and the receiving circuit 15 are arranged in inverse order relative to each other in the transmitting / receiving module 20 according to the second embodiment, but the embodiment is not limited to this. For example, even in a configuration in which the transmitting circuit 14 and the receiving circuit 15 are arranged in inverse order relative to each other in the transmitting / receiving module 10 according to the first embodiment, it is possible to suppress the deterioration of isolation between the transmitting circuit 14 and the receiving circuit 15.
[0095] Although each embodiment has been described above, the embodiments are not limited to these, and various modifications are possible within the scope of the gist of each embodiment. [Explanation of Symbols]
[0096] 10, 20, 30, 40, 50 Transceiver Modules 11, 21, 31, 41, 51 Main unit case 11a, 21a, 41a, 51a First containment unit 11b, 21b, 41b, 51b Second containment section 11c,21c,41c 1st opening end 11d,21d,41d,51d 2nd open end 11g,21g,41g,51g Intermediate wall part 11h,21h,41h 1st surface 11i,21i,41i,51i 2nd surface 12,22,42 First Cover 13, 23, 43, 53 Second Cover 14. Transmitter Circuit 14b First signal line 14c First mounting component 15 Receiving circuit 15b 2nd signal line 15c Second mounting component 18. First connector 19. Second connector 21f 1st notch 22d 2nd notch 23d 3rd notch 31m protrusion 31r 1st hole 31s 2nd hole W width of the intermediate wall
Claims
1. A transmitting and receiving module comprising a transmitting circuit and a receiving circuit, A main body case having a first housing section for housing the transmitting circuit and a second housing section for housing the receiving circuit, A first cover covering the first housing section, It comprises a second cover that covers the second housing section, The first housing section and the second housing section are provided separately from each other. The first cover and the second cover are attached to the main body case in a non-contact state with each other. The main body case has an intermediate wall portion including a first surface and a second surface on the opposite side of the first surface. At least a portion of the first surface faces the first housing, At least a portion of the second surface faces the second housing, The first open end of the first housing portion to which the first cover is attached is open in a first direction along the first surface of the intermediate wall portion, The second open end of the second housing portion to which the second cover is attached is open in a second direction along the second surface of the intermediate wall portion, A transmit / receive module in which the first direction and the second direction are opposite to each other.
2. A first connector is electrically connected to the transmission circuit and is exposed to the outside through a first through-hole provided in the main body case or the first cover, It comprises a second connector that is electrically connected to the receiving circuit and is exposed to the outside through a second through-hole provided in the main body case or the second cover, The transceiver module according to claim 1, wherein the width of the portion of the intermediate wall between the first through-hole and the second through-hole is set to match the distance between the first through-hole and the second through-hole.
3. A first connector is electrically connected to the transmission circuit and is exposed to the outside through a first through-hole provided in the main body case or the first cover, It comprises a second connector that is electrically connected to the receiving circuit and is exposed to the outside through a second through-hole provided in the main body case or the second cover, The main body case has a protruding portion that projects outward from the side surface on which the first through-hole and the second through-hole are provided. The transmitting and receiving module according to claim 1, wherein the protruding portion has a first hole continuous with the first through-hole and a second hole continuous with the second through-hole.
4. The first housing houses the transmitting circuit such that the surface side on which the first signal line or the first mounted component is mounted faces the first direction. The transmitting and receiving module according to claim 1, wherein the second housing houses the receiving circuit such that the surface side on which the second signal line or second mounting component is mounted faces the second direction.
5. The first open end of the first housing portion to which the first cover is attached and the second open end of the second housing portion to which the second cover is attached are open to each other in the same direction. A portion of the first surface of the intermediate wall portion faces the first cover after it has been installed. The transmitting and receiving module according to claim 1, wherein a portion of the second surface of the intermediate wall portion faces the second cover after installation.
6. The transmitting and receiving module according to claim 1, wherein the signals handled by the transmitting circuit and the receiving circuit are high-frequency signals of GHz class or higher.
7. The transmitting and receiving module according to claim 1, wherein the main body case, the first cover, and the second cover are made of metal.