Circuit board cleaning device

Abstract

To provide a board cleaning device with which, while reducing down time due to brush replacement, it is possible to clean one surface of the board depending on a state of contamination.SOLUTION: In a board cleaning device 100, a distance between one surface of a board W and a first cleaning surface is set to be smaller than a distance between one surface of the board and a second cleaning surface in a state of first and second cleaning surfaces being separate from one surface of the board W and first and second brushes being not pressed by a pressure unit. The pressure unit changes loads on the first and second cleaning brushes so as to move a cleaning unit that is rotated by a rotation drive unit to a first state in which the first cleaning surface contacts the one surface of the board W and a second state in which the first and second cleaning surfaces contact the one surface of the board W.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a substrate cleaning apparatus.

Background Art

[0002] In the cleaning of a substrate, the substrate is rotated while being held, and the substrate is cleaned by bringing a cleaning brush into contact with the rotated substrate. When the substrate is warped in a concave or convex shape, it is not easy to clean the entire substrate without omission. Therefore, Patent Document 1 describes a removal treatment body (hereinafter referred to as a cleaning brush) including a sponge-like reference hardness treatment part and a low hardness treatment part having different hardnesses.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The contamination state such as the amount and adhesion strength of contaminants adhering to the substrate may vary depending on the region of the substrate. When the cleaning brush described in Patent Document 1 is used, the substrate may be damaged by bringing the cleaning brush with high hardness into contact with a region where contact is not necessary. Therefore, it is necessary to replace the type of brush according to the contamination state. As a result, the downtime due to brush replacement increases.

[0005] An object of the present invention is to provide a substrate cleaning apparatus capable of cleaning one surface of a substrate according to the contamination state while reducing the downtime due to brush replacement.

Means for Solving the Problems

[0006] (2) A substrate cleaning apparatus according to another aspect of the present invention comprises a substrate holding section for holding a substrate, a cleaning section integrally configured such that a first cleaning brush having a first cleaning surface that can contact one surface of the substrate held by the substrate holding section and a second cleaning brush having a second cleaning surface that can contact the one surface of the substrate are movable relative to each other in a direction intersecting the first and second cleaning surfaces, and a drive section for moving one of the first and second cleaning brushes relative to the other such that either one or both of the first and second cleaning surfaces contact the one surface of the substrate. The drive unit moves one of the first and second cleaning brushes relative to the other by magnetic force. . Furthermore, a substrate cleaning apparatus according to other aspects includes a substrate holding section for holding a substrate, a cleaning section integrally configured such that a first cleaning brush having a first cleaning surface that can contact one surface of the substrate held by the substrate holding section and a second cleaning brush having a second cleaning surface that can contact one surface of the substrate are movable relative to each other in a direction intersecting the first and second cleaning surfaces, and a drive section for moving one of the first and second cleaning brushes relative to the other so that either one or both of the first and second cleaning surfaces contact one surface of the substrate, the drive section including a first magnet which is an electromagnet attached to one of the first and second cleaning brushes, and a second magnet attached to the other of the first and second cleaning brushes so as to receive the magnetic force generated by the first magnet.

[0007] (2) A substrate cleaning apparatus according to another aspect of the present invention comprises a substrate holding section for holding a substrate, a cleaning section integrally configured such that a first cleaning brush having a first cleaning surface that can contact one surface of the substrate held by the substrate holding section and a second cleaning brush having a second cleaning surface that can contact the one surface of the substrate are movable relative to each other in a direction intersecting the first and second cleaning surfaces, and a drive section for moving one of the first and second cleaning brushes relative to the other such that either one or both of the first and second cleaning surfaces contact the one surface of the substrate. [Effects of the Invention]

[0008] According to the present invention, it becomes possible to clean one side of a substrate according to its level of contamination while reducing downtime caused by brush replacement. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic side view of a substrate cleaning apparatus according to the first embodiment of the present invention. [Figure 2] This is an exploded perspective view illustrating the configuration of the cleaning unit according to this embodiment. [Figure 3] This diagram shows the state of the cleaning area that came into contact with the circuit board during cleaning. [Figure 4]It is a diagram showing the state of the cleaning part that contacted the substrate during cleaning of the substrate. [Figure 5] It is a schematic cross-sectional view for explaining the cleaning operation of the cleaning surface. [Figure 6] It is a schematic cross-sectional view for explaining the cleaning operation of the cleaning surface. [Figure 7] It is a schematic cross-sectional view for explaining the cleaning operation of the cleaning surface. [Figure 8] It is a schematic cross-sectional view for explaining the cleaning operation of the cleaning surface. [Figure 9] It is a diagram showing another example of the cleaning part. [Figure 10] It is a diagram showing another example of the cleaning part. [Figure 11] It is a schematic side view of a substrate cleaning apparatus according to a second embodiment. [Figure 12] It is a schematic cross-sectional view of the cleaning part of FIG. 11. [Figure 13] It is a schematic bottom view of the cleaning part of FIG. 11. [Figure 14] It is a schematic cross-sectional view for explaining the operation of the cleaning part of FIG. 11. [Figure 15] It is a schematic cross-sectional view for explaining the cleaning operation of the cleaning surface of the cleaning part according to the second embodiment. [Figure 16] It is a schematic cross-sectional view for explaining the cleaning operation of the cleaning surface of the cleaning part according to the second embodiment. [Figure 17] It is a schematic cross-sectional view for explaining the cleaning operation of the cleaning surface of the cleaning part according to the second embodiment. [Figure 18] It is a schematic cross-sectional view for explaining the cleaning operation of the cleaning surface of the cleaning part according to the second embodiment.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, a board substrate cleaning apparatus and a substrate cleaning method according to an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate (semiconductor wafer), a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, or the like. Further, the substrate described below has a circular shape in a plan view except for the notch forming portion.

[0011] 〈1〉First Embodiment (1) Substrate cleaning apparatus FIG. 1 is a schematic side view of a substrate cleaning apparatus 100 according to a first embodiment of the present invention. As shown in FIG. 1, the substrate cleaning apparatus 100 includes a spin chuck 10, a cleaning unit 20, an arm 30, an arm driving unit 40, a brush rotation driving unit 50, a pressing driving unit 60, a standby pod 70, and a control unit 90.

[0012] In the substrate cleaning apparatus 100, the substrate W is carried into and out of the substrate cleaning apparatus 100 by a transfer robot (not shown). The spin chuck 10 includes a holding unit 11 and a chuck rotation driving unit 12. The substrate W carried in by the transfer robot is placed on the holding unit 11. A plurality of intake passages (not shown) are formed in the holding unit 11, and the lower surface of the substrate W is vacuum-sucked to the holding unit 11 by exhausting the inside of the intake passages. Thereby, the holding unit 11 holds the substrate W in a horizontal posture. The chuck rotation driving unit 12 is connected to the holding unit 11 via a connection member. The chuck rotation driving unit 12 includes, for example, an electric motor and is configured to be able to rotate the holding unit 11. Thereby, the substrate W held in a horizontal posture by the holding unit 11 rotates.

[0013] Above the holding unit 11, a cleaning nozzle 13 is provided to supply a cleaning liquid WL toward the upper surface of the substrate W held in a horizontal posture. The cleaning liquid discharged from the cleaning nozzle 13 spreads outward by the centrifugal force caused by the rotation of the substrate W.

[0014] The cleaning unit 20 includes cleaning brushes 21 and 22. Figure 1 shows cross-sections of the cleaning brushes 21 and 22. The cleaning brushes 21 and 22 each have cleaning surfaces 21A and 22A, respectively. The cleaning surfaces 21A and 22A constitute the cleaning surface 20A of the cleaning unit 20.

[0015] The cleaning surface 20A faces one surface of the substrate W, which is held in a horizontal position by the holding part 11. This surface may be the bottom surface or the top surface of the substrate W. In this embodiment, the surface of the substrate W is the top surface. Details of the configuration of the cleaning unit 20 will be described later. The cleaning unit 20 is supported by the arm 30 so as to be rotatable around an axis in a direction intersecting the cleaning surface 20A. In this embodiment, the cleaning unit 20 is rotatable around a vertical axis. Furthermore, the cleaning unit 20 is supported by the arm 30 so as to be movable between a cleaning position where the substrate W held by the holding part 11 is cleaned and a standby position outside the substrate W held by the holding part 11.

[0016] The arm drive unit 40 includes, for example, an actuator and is configured to move the cleaning unit 20, which is supported by the arm 30, in three dimensions. The brush rotation drive unit 50 includes, for example, an electric motor and rotates the cleaning unit 20, which is supported by the arm 30, around a vertical axis. In this embodiment, the brush rotation drive unit 50 rotates the cleaning unit 20 in the direction opposite to the direction in which the substrate W, held by the holding unit 11, rotates. The pressing drive unit 60 is configured to press the cleaning brushes 21 and 22 of the cleaning unit 20 downward. The pressing drive unit 60 is, for example, an electro-pneumatic regulator. In this state, the substrate W is cleaned by the contact between the rotated substrate W and the cleaning surface 20A of the rotated cleaning unit 20.

[0017] A cylindrical standby pod 70, for example, is provided in the standby position of the cleaning unit 20. The cleaning unit 20 is housed in the standby pod 70 when not cleaning the substrate W. Figure 1 shows a cross-section of the standby pod 70. The standby pod 70 is provided with cleaning nozzles 71 and 72, respectively. The cleaning nozzles 71 and 72 are connected to a cleaning liquid supply unit 73 and supply cleaning liquid to the cleaning surface 20A of the cleaning unit 20 housed (standby) in the standby pod 70. As the cleaning unit 20 rotates, the cleaning surface 20A is cleaned. Details of the cleaning of the cleaning surface 20A will be described later. A waste liquid hole (not shown) is formed at the bottom of the standby pod 70, and a waste liquid channel (not shown) is connected to the waste liquid hole. The cleaning liquid in the standby pod 70 is discharged through the waste liquid hole and the waste liquid channel.

[0018] Furthermore, multiple removal sections 81, 82, and 83 are provided at the bottom of the standby pod 70. In this embodiment, three removal sections 81, 82, and 83 are provided. The removal sections 81, 82, and 83 are used to transfer liquid adhering to the cleaning surface 20A (cleaning surfaces 21A, 22A). The removal sections 81, 82, and 83 are formed from a hydrophilic material (for example, quartz glass). This makes it easier for liquid adhering to members adjacent to the removal sections 81, 82, and 83 to transfer to the removal sections 81, 82, and 83. The removal sections 81, 82, and 83 have a shape that protrudes upward. The height and position of the removal sections 81, 82, and 83 are set so that the cleaning surface 22A can be close to the removal section 81 and the cleaning surface 21A can be close to the removal sections 82, and 83. The transfer of liquid to the removal sections 81, 82, and 83 will be described later.

[0019] The control unit 90 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read-Only Memory), and storage devices. The control unit 90 controls the operation of the chuck rotation drive unit 12, arm drive unit 40, brush rotation drive unit 50, pressing drive unit 60, and cleaning fluid supply unit 73 described above.

[0020] (2) Configuration of the cleaning unit 20 Figure 2 is an exploded perspective view illustrating the configuration of the cleaning unit 20 according to this embodiment. The cleaning unit 20 includes cleaning brushes 21, 22, housing members 23, 24, and a pressing member 25.

[0021] The cleaning brush 21 is made of a relatively soft and porous resin material such as polyvinyl alcohol (PVA). The cleaning brush 21 includes a cylindrical body portion 21a and a cylindrical protrusion portion 21b. The outer diameter of the body portion 21a is larger than the outer diameter of the protrusion portion 21b. Also, the inner diameter of the body portion 21a is larger than the inner diameter of the protrusion portion 21b. The body portion 21a has a lower surface 21c and an upper surface 21d. The height of the body portion 21a is T2. The height T2 of the body portion 21a corresponds to the distance between the lower surface 21c and the upper surface 21d. The protrusion portion 21b is formed integrally and coaxially (in the example of Figure 2, on the rotation axis AX of the cleaning portion 20) on the lower surface 21c of the body portion 21a. The annular lower surface of the protrusion portion 21b described above is the cleaning surface 21A. The height of the protrusion portion 21b is T3. The height of the protrusion 21b corresponds to the distance between the cleaning surface 21A and the lower surface 21c of the main body 21a.

[0022] The cleaning brush 22 is formed from a relatively hard (resin) material such as PTFE (polytetrafluoroethylene). As a result, the cleaning brush 22 has higher rigidity than the cleaning brush 21. The cleaning brush 22 includes a cylindrical body portion 22a and a cylindrical protrusion portion 22b. The outer diameter of the body portion 22a is larger than the outer diameter of the protrusion portion 22b. The body portion 22a has a lower surface 22c and an upper surface 22d. The height of the body portion 22a of the cleaning brush 21 is the same T2 as the height T2 of the body portion 21a of the cleaning brush 21. The height T2 of the body portion 21a corresponds to the distance between the lower surface 22c and the upper surface 22d. The protrusion portion 22b is formed integrally and coaxially (on the rotation axis AX of the cleaning unit 20 in the example in Figure 2) on the lower surface 22c of the body portion 22a. The circular lower surface of the protrusion portion 22b is the cleaning surface 22A. The height of the protrusion 22b is T1. The height T1 of the protrusion 22b of the cleaning brush 22 is smaller than the height T3 of the protrusion 21b of the cleaning brush 21.

[0023] Here, the outer diameter of the main body portion 22a of the cleaning brush 22 is approximately equal to or slightly smaller than the inner diameter of the main body portion 21a of the cleaning brush 21. Also, the outer diameter of the protrusion 22b is approximately equal to or slightly smaller than the inner diameter of the protrusion 21b of the cleaning brush 21. When assembling the cleaning unit 20, the main body portion 22a of the cleaning brush 22 is fitted into the opening of the main body portion 21a of the cleaning brush 21, and the protrusion 22b of the cleaning brush 22 is fitted into the opening of the protrusion 21b of the cleaning brush 21. In this case, since the height T2 of the main body portion 21a and the height T2 of the main body portion 22a are equal, the upper surface 21d of the cleaning brush 21 and the upper surface 22d of the cleaning brush 22 are flush. Furthermore, since the height T3 of the protrusion 21b is greater than the height T1 of the protrusion 22b, the annular cleaning surface 21A (soft) protrudes downward from the circular hard cleaning surface 22A (hard) of the cleaning brush 22. The cleaning surface 21A of the cleaning brush 21 is positioned to surround the rotation axis AX of the cleaning unit 20 and the cleaning surface 22A of the cleaning brush 22. The cleaning surface 22A of the cleaning brush 22 is perpendicular to the rotation axis AX.

[0024] The housing member 23 has a cylindrical shape with a bottom surface 23a. The housing member 23 has an inner diameter capable of accommodating the main body portion 21a of the cleaning brush 21. A hole 23b is formed in the center of the bottom surface 23a, into which the protrusion 21b of the cleaning brush 21 can be fitted.

[0025] The housing member 24 has a cylindrical shape with an upper surface 24a. The inner diameter of the housing member 24 is equal to the inner diameter of the housing member 23. A hole is formed in the upper surface 24a through which a cylindrical connecting member 25a can be inserted. The connecting member 25a is inserted through the hole in the upper surface 24a so as to be movable in the vertical direction. Screw-type threaded portions (not shown) are formed on the sides of the housing member 23 and the housing member 24. By screwing the respective threaded portions of the housing member 23 and the housing member 24 together, the cleaning brush 21 and the cleaning brush 22 are housed inside the housing member 23 and the housing member 24.

[0026] The pressing member 25 is formed from a circular flat plate having the same outer diameter as the upper surface 21d of the cleaning brush 21. The pressing member 25 is housed inside the housing member 24. The pressing member 25 is connected to the lower end of the connecting member 25a.

[0027] During the assembly of the cleaning unit 20, the cleaning brush 22 is fitted onto the cleaning brush 21, and the fitted cleaning brushes 21 and 22 are housed within the housing member 23. As a result, the protrusions 21b of the cleaning brush 21 and 22b of the cleaning brush 22 protrude downward from the holes 23b in the bottom surface 23a. In this state, the upper end surface of the peripheral wall of the housing member 23 and the lower end surface of the peripheral wall of the housing member 24 are joined together. The pressing member 25 is supported by the connecting member 25a so as to face the upper surface 21d of the cleaning brush 21 and the upper surface 22d of the cleaning brush 22.

[0028] The aforementioned pressing drive unit 60 is connected to the connecting member 25a. As a result, the pressing drive unit 60 moves the pressing member 25 downward via the connecting member 25a, thereby evenly pressing the upper surface 21d of the cleaning brush 21 and the upper surface 22d of the cleaning brush 22. In this case, by changing the driving force of the pressing drive unit 60, it becomes possible to change the load applied to the cleaning brushes 21 and 22.

[0029] (3) Operation of the cleaning unit 20 Figures 3 and 4 show the state of the cleaning unit 20 in contact with the substrate W during cleaning of the substrate W. The upper part of Figures 3 and 4 shows a vertical cross-section of a part of the cleaning unit 20, and the lower part of Figures 3 and 4 shows a horizontal cross-section of the cleaning unit 20.

[0030] In the example shown in Figure 3, during the cleaning of the substrate W, the cleaning brushes 21 and 22 are pressed with a relatively small force by the pressing member 25 shown in Figure 2, thereby applying a first load to the cleaning brushes 21 and 22. As a result, only the cleaning surface 21A of the cleaning surfaces 21A and 22A of the cleaning unit 20 is in contact with the upper surface WU of the substrate W. The cleaning surface 22A is separated from the upper surface WU of the substrate W. Hereinafter, the state in which only the cleaning surface 21A is in contact with the upper surface WU of the substrate W will be referred to as the first state.

[0031] In this embodiment, the first load on the cleaning brushes 21 and 22 required for the cleaning unit 20 to enter the first state is determined experimentally in advance. The first load on the cleaning brushes 21 and 22 required for the cleaning unit 20 to enter the first state may also be determined, for example, by a teaching operation performed by an operator during the installation or maintenance of the substrate cleaning device 100. In this state, the rotation of the cleaning unit 20 makes it possible to clean the upper surface WU of the substrate W using only the cleaning surface 21A of the cleaning brush 21, which is made of a relatively soft material.

[0032] In the example shown in Figure 4, during cleaning of the substrate W, the cleaning brushes 21 and 22 are pressed with a relatively large force by the pressing member 25 shown in Figure 2, thereby applying a second load greater than the first load to the cleaning brushes 21 and 22. In this case, the pressing force applied from the pressing member 25 to the upper surface 21d of the cleaning brush 21 and the reaction force applied from the upper surface WU of the substrate W to the cleaning surface 21A of the cleaning brush 21 cause the cleaning brush 21 to contract vertically. On the other hand, the pressing force applied from the pressing member 25 to the upper surface 22d of the cleaning brush 22 causes the cleaning surface 22A of the cleaning brush 22 to move downward as the cleaning brush 21 contracts vertically. As a result, both the cleaning surfaces 21A and 22A of the cleaning unit 20 come into contact with the upper surface WU of the substrate W. Hereinafter, the state in which both the cleaning surfaces 21A and 22A come into contact with the upper surface WU of the substrate W during cleaning will be referred to as the second state.

[0033] In this embodiment, the second load on the cleaning brushes 21 and 22 required for the cleaning unit 20 to enter the second state has been determined experimentally in advance. The load on the cleaning brushes 21 and 22 required for the cleaning unit 20 to enter the second state may also be determined, for example, by a teaching operation performed by an operator during the installation or maintenance of the substrate cleaning device 100. In this state, the rotation of the cleaning unit 20 makes it possible to clean the substrate W on both the cleaning surface 22A of the cleaning brush 22, which is made of a relatively hard material, and the cleaning surface 21A, which is made of a relatively soft material.

[0034] Here, the pressing drive unit 60 changes the load on the cleaning brushes 21 and 22 of the cleaning unit 20 by changing the pressing force applied to the cleaning brushes 21 and 22 by the pressing member 25 according to the contamination state of the substrate W. The contamination state of the substrate W includes the amount of contamination (contamination density or thickness of contaminant) or the adhesion strength of the contaminant. In this embodiment, as described above, the pressing drive unit 60 changes the load on the cleaning brushes 21 and 22 of the cleaning unit 20 to a first load and a second load according to the contamination state of the substrate W.

[0035] During substrate cleaning, the transition of the cleaning unit 20 to the first and second states may be performed, for example, based on a processing recipe pre-set in a substrate processing apparatus (not shown). Depending on the processing recipe, the degree of contamination on the upper surface of the substrate W may differ. For example, depending on the processing recipe, the amount of contamination or the adhesion strength of contaminants may differ depending on the region of the upper surface of the substrate W. For example, for a substrate W processed according to a certain processing recipe, the degree of contamination is low in the central region of the upper surface and high in the peripheral region of the upper surface. In that case, the control unit 90 controls the pressing drive unit 60 so that the cleaning unit 20 enters the first state when cleaning the central region of the upper surface of the substrate W, and enters the second state when cleaning the peripheral region of the upper surface of the substrate W.

[0036] Furthermore, if the contamination status of each region on the upper surface of the substrate W can be predicted, the cleaning unit 20 may be switched between the first and second states based on the predicted contamination status of each region on the upper surface of the substrate W. For example, it may be known in advance that the adhesion strength of contaminants attached to the central region of the upper surface of the substrate W that is brought into the substrate cleaning apparatus 100 is low, while the adhesion strength of contaminants attached to the peripheral region of the upper surface of the substrate W is high. In such a case, the control unit 90 controls the pressing drive unit 60 so that the cleaning unit 20 enters the first state when cleaning the central region of the upper surface of the substrate W, and enters the second state when cleaning the peripheral region of the upper surface of the substrate W.

[0037] (4) Effects of the cleaning unit 20 With the above configuration, the cleaning unit 20 can be selectively switched between a first state and a second state by selectively changing the load on the cleaning brushes 21 and 22 of the cleaning unit 20. This allows the top surface WU of the substrate W to be cleaned according to the degree of contamination of the top surface WU of the substrate W. As a result, it becomes unnecessary to replace the cleaning unit 20 according to the degree of contamination of the top surface WU of the substrate W.

[0038] Furthermore, since the cleaning surface 21A is positioned to surround the rotating shaft AX and the cleaning surface 22A, it becomes possible to clean a wide area with the relatively soft cleaning surface 21A. In addition, since the cleaning brush 21 is made of a porous material, the cleaning brush 21 easily contracts in the vertical direction when pressed by the pressing member 25. This makes it possible to easily switch between the first state and the second state.

[0039] (5) Example of standby pod 70 After the cleaning unit 20 cleans the substrate W, the cleaning unit 20 moves into the standby pod 70. Here, the cleaning surfaces 21A and 22A of the cleaning unit 20 are cleaned. Figures 5 to 8 are schematic cross-sectional views illustrating the cleaning operation of the cleaning surfaces 21A and 22A.

[0040] As shown in Figure 5, cleaning liquid WL is supplied from the cleaning nozzle 71 to the cleaning surface 21A of the cleaning unit 20, which is waiting in a predetermined position within the standby pod 70. In this state, the cleaning unit 20 rotates, cleaning the cleaning surface 21A. In addition, cleaning liquid WL is supplied from the cleaning nozzle 72 to the cleaning surface 22A. In this state, the cleaning unit 20 rotates, cleaning the cleaning surface 22A.

[0041] With this configuration, if the contamination state of the cleaning surface 21A and the cleaning surface 22A are different, the cleaning nozzles 71 and 72 can independently clean the cleaning surfaces 21A and 22A under different conditions. This makes it possible to restore the cleaning surfaces 21A and 22A to a sufficiently clean state.

[0042] When cleaning surface 22A is finished, the rotation of the cleaning unit 20 stops. In this case, as shown in Figure 6, droplets WD of the cleaning liquid WL adhere to the cleaning surfaces 21A and 22A due to the surface tension of the liquid. Therefore, as shown in Figure 7, the control unit 90 controls the arm drive unit 40 to lower the cleaning unit 20 so that the removal unit 81 fixed to the bottom of the standby pod 70 and the cleaning surface 22A maintain a predetermined distance ΔTa, and the removal units 82 and 83 and the cleaning surface 21A maintain a predetermined distance ΔTa. The distance ΔTa is set to be greater than 0 and less than or equal to the vertical thickness of the droplets WD adhering to the cleaning surfaces 21A and 22A. In this embodiment, the height of the upper end of the removal unit 81 is higher than the height of the upper ends of the removal units 82 and 83 so as to correspond to the positions of the cleaning surfaces 21A and 22A.

[0043] As a result, as shown in Figure 8, the droplets WD adhering to the cleaning surfaces 21A and 22A are transferred to the removal units 81, 82, and 83. Subsequently, the cleaning unit 20 moves above the other substrates W held by the spin chuck 10, and cleaning is performed on the other substrates W.

[0044] With this configuration, when the cleaning unit 20 moves above the other substrate W held by the spin chuck 10, droplets WD adhering to the cleaning surfaces 21A and 22A are removed. This prevents the droplets WD from falling onto the surface of the other substrate W and scattering.

[0045] (6) Other examples of the cleaning unit 20 Figures 9 and 10 show other examples of the cleaning unit 20. The upper part of Figures 9 and 10 shows a vertical cross-section of the cleaning unit 20, and the lower part of Figures 9 and 10 shows a horizontal cross-section of the cleaning unit 20.

[0046] In the example shown in Figure 9, the cleaning unit 20 includes a cleaning brush 26 that is harder than the cleaning brush 21 and softer than the cleaning brush 22. The cleaning brush 26 has an annular cleaning surface 26A that faces the substrate W. The cleaning brush 26 is positioned such that the cleaning surface 26A is located between the circular cleaning surface 22A and the annular cleaning surface 21A. In this case, the pressing member 25 by the pressing drive unit 60 makes it possible to transition the cleaning unit 20 to a state where the cleaning surface 21A is in contact with the substrate W, a state where the cleaning surfaces 21A and 26A are in contact with the substrate W, and a state where the cleaning surfaces 21A, 26A, and 22A are in contact with the substrate W.

[0047] In the embodiments shown in Figures 1 to 8, the cleaning surface 22A of the cleaning brush 22 is formed in a circular shape, but the present invention is not limited thereto. The cleaning surface 22A may be formed in other shapes, such as an elliptical shape. In the example shown in Figure 10, the cleaning surface 22A has a shape that extends radially around the rotation axis AX. In this case, it is possible to increase the contact area between the substrate W and the cleaning surface 22A when cleaning the substrate W.

[0048] <2> Second Embodiment (1) Substrate cleaning device 100a Figure 11 is a schematic side view of a substrate cleaning apparatus 100a according to a second embodiment. The substrate cleaning apparatus 100a in Figure 11 differs from the substrate cleaning apparatus 100 in Figure 1 in the following ways.

[0049] The substrate cleaning apparatus 100a in Figure 11 includes a switching drive unit 61 instead of the pressing drive unit 60 of the substrate cleaning apparatus 100 in Figure 1, and includes a cleaning unit 2 with a different configuration from the cleaning unit 20. The standby pod 70 includes a single cleaning nozzle 71. Of the removal units 81, 82, and 83, the height of the upper end of removal unit 81 is lower than the height of the upper ends of removal units 82 and 83.

[0050] (2) Configuration and operation of the cleaning unit 2 Figure 12 is a schematic cross-sectional view of the cleaning unit 2 in Figure 11. Figure 13 is a schematic bottom view of the cleaning unit 2 in Figure 11. Figure 14 is a schematic cross-sectional view illustrating the operation of the cleaning unit 2 in Figure 11. Each part in Figure 13 is hatched in the same way as the corresponding part in Figure 12 to clarify its relationship with the parts in Figure 12.

[0051] The cleaning unit 2 includes a cylindrical holding part 2a that holds a cylindrical cleaning brush 22 downwards and an annular holding part 2b that holds an annular cleaning brush 21 downwards. The annular cleaning brush 21 is attached to the lower surface of the holding part 2b. The cylindrical cleaning brush 22 is attached to the lower surface of the holding part 2a. The lower surface of the cleaning brush 21 is the cleaning surface 21A, and the lower surface of the cleaning brush 22 is the cleaning surface 22A. The cleaning brushes 21 and 22 are made of different materials. In the second embodiment, similar to the first embodiment, the cleaning brush 21 is made of a relatively soft material, and the cleaning brush 22 is made of a relatively hard material.

[0052] Furthermore, the cleaning brush 21 may be made of a relatively hard material, and the cleaning brush 22 may be made of a relatively soft material. Also, the surface roughness of the cleaning surface 21A of the cleaning brush 21 and the surface roughness of the cleaning surface 22A of the cleaning brush 22 may be different.

[0053] As shown in Figure 13, multiple electromagnets EM are provided on the outer surface of the holding portion 2a at equal intervals in the circumferential direction. Each electromagnet EM can be switched between a state in which a north pole is formed on the outer portion, as shown in Figure 12, and a state in which a south pole is formed on the outer portion, as shown in Figure 14, depending on the direction of the applied current.

[0054] As shown in Figures 12 and 14, the retaining portion 2b is arranged coaxially with the retaining portion 2a so as to surround the outer circumferential surface of the retaining portion 2a. Furthermore, the retaining portion 2b is configured to be movable in the vertical direction relative to the retaining portion 2a.

[0055] Multiple magnets MG are provided on the inner circumferential surface of the holding portion 2b so as to face the electromagnet EM of the holding portion 2a. A gap gp exists between the opposing electromagnets EM and magnets MG. The magnets MG are made of, for example, permanent magnets. Each magnet MG is arranged such that its upper and lower halves have magnetic poles of opposite polarity. In the example in Figure 12, the upper half of each magnet MG is the south pole (s) and the lower half is the north pole (n). The switching drive unit 61 in Figure 11 includes multiple electromagnets EM and multiple magnets MG.

[0056] In the state shown in Figure 12, an N pole (n) is formed on the outer part of each electromagnet EM. As a result, the N pole (n) on the outer part of the electromagnet EM and the S pole (s) on the upper part of the magnet MG attract each other, causing the cleaning surface 22A of the cleaning brush 22 to be positioned above the cleaning surface 21A of the cleaning brush 21. In other words, when cleaning the substrate W, it becomes possible to bring only the cleaning surface 21A into contact with the substrate W. This makes it possible to clean areas on the upper surface WU of the substrate W that are less contaminated or areas where the adhesion strength of contaminants is low.

[0057] In the state shown in Figure 14, an S pole (s) is formed on the outer part of each electromagnet EM. As a result, the S pole (s) on the outer part of the electromagnet EM and the N pole (n) on the lower half of the magnet MG attract each other, causing the cleaning surface 21A of the cleaning brush 21 to be positioned above the cleaning surface 22A of the cleaning brush 22. In other words, when cleaning the substrate W, it becomes possible to bring only the cleaning surface 22A into contact with the substrate W. This makes it possible to clean areas on the upper surface WU of the substrate W that are highly contaminated or areas where the adhesion strength of contaminants is high. Hereinafter, the operation of changing the position of the cleaning surfaces 21A and 22A by switching the polarity of each electromagnet EM will be referred to as the switching operation.

[0058] During substrate cleaning, the switching operation of the cleaning unit 20 may be performed, for example, based on a processing recipe pre-set in a substrate processing apparatus (not shown). In this case, the control unit 90 controls the switching drive unit 61 so that the switching operation is performed for each region of the upper surface of the substrate W based on the processing recipe.

[0059] Furthermore, if the contamination status of each region on the upper surface of the substrate W can be predicted, a switching operation may be performed so that cleaning brush 21 or cleaning brush 22 is selected for each region on the upper surface of the substrate. In this case, the control unit 90 controls the switching drive unit 61 so that the cleaning unit 20 performs a predetermined switching operation for each region on the upper surface of the substrate W.

[0060] (3) Effects of the cleaning unit 20 This configuration allows for selective switching between the cleaning surfaces 21A and 22A of the cleaning unit 2 that contact the substrate W during cleaning. Therefore, it becomes possible to clean the substrate W according to its level of contamination. Furthermore, it eliminates the need to change brushes depending on the level of contamination of the substrate W.

[0061] Furthermore, since the switching operation of the cleaning unit 2 is performed without contact, the generation of particles due to the sliding of mechanical components is suppressed. This prevents re-contamination of the substrate W by particles.

[0062] (4) Example of standby pod 70 Figures 15 to 18 are schematic cross-sectional views illustrating the cleaning operation of the cleaning surfaces 21A and 22A of the cleaning unit 2 according to the second embodiment. In Figures 15 to 18, the configuration of the cleaning unit 2 is shown in a simplified manner.

[0063] As shown in Figure 15, during the cleaning of the cleaning unit 2, the cleaning unit 2 rotates while the cleaning surface 21A of the cleaning unit 2 is at a height where cleaning liquid WL is supplied from the cleaning nozzle 71. As a result, the cleaning surface 21A is cleaned. Next, after the switching operation described above is performed, as shown in Figure 16, the cleaning unit 2 rotates while the cleaning surface 22A is at a height where cleaning liquid WL is supplied from the cleaning nozzle 71. As a result, the cleaning surface 22A is cleaned.

[0064] Subsequently, as shown in Figure 17, with droplets WD adhering to the cleaning surfaces 21A and 22A, the cleaning unit 20 moves downward so that the cleaning surfaces 21A and 22A and the removal units 81, 82, and 83 maintain a predetermined distance ΔTa. As a result, as shown in Figure 18, the droplets WD adhering to the cleaning surfaces 21A and 22A are transferred to the removal units 81, 82, and 83. The subsequent operation is the same as that of the substrate cleaning apparatus 100 in the first embodiment.

[0065] <3> Other Embodiments (1) In the first and second embodiments described above, examples are shown in which the upper surface of the substrate W is cleaned as one surface of the substrate W, but the present invention is not limited thereto. One surface of the substrate may be the lower surface of the substrate, the bevel region of the substrate, or the edge surface of the substrate.

[0066] (2) In the second embodiment described above, either the cleaning brush 21 or the cleaning brush 22 can selectively contact one surface of the substrate W, but the switching drive unit 61 may be configured so that both the cleaning brush 21 and the cleaning brush 22 can contact one surface of the substrate W.

[0067] (3) In the second embodiment described above, the switching drive unit 61 is configured so that the cleaning brush 21 and the cleaning brush 22 can move relative to each other by magnetic force, but the present invention is not limited thereto. For example, the switching drive unit 61 may be configured so that the cleaning brush 21 and the cleaning brush 22 can move relative to each other by other forces such as air pressure.

[0068] <4> Correspondence between each component of the claim and each part of the embodiment The following describes an example of the correspondence between each component of the claims and each element of the embodiment. In the above embodiment, the spin chuck 10 is an example of a substrate holding part, the cleaning surface 21A is an example of a first cleaning surface, the cleaning brush 21 is an example of a first cleaning brush, the cleaning surface 22A is an example of a second cleaning surface, and the cleaning brush 22 is an example of a second cleaning brush. Also, the housing member 24 and the pressing drive unit 60 are examples, the rotation drive unit is an example of a brush rotation drive unit 50 is an example of a pressing part, the arm 30 and the arm drive unit 40 are examples of moving parts, the cleaning nozzle 71 is an example of a first supply unit and a supply unit, and the cleaning nozzle 72 is an example of a second supply unit. Also, the switching drive unit 61 is an example of a drive unit, the electromagnet EM is an example of a first magnet, and the magnet MG is an example of a second magnet.

[0069] <5> Summary of Embodiments (Article 1) A substrate cleaning apparatus according to one embodiment is: A substrate holding section that holds the substrate, A cleaning unit comprising a first cleaning brush having a first cleaning surface that can contact one surface of a substrate held by the substrate holding unit, and a second cleaning brush having a second cleaning surface that can contact the one surface of the substrate, is integrally configured. A pressing section capable of pressing the first and second cleaning brushes and configured to vary the load applied to the first and second cleaning brushes, The cleaning unit is further equipped with a rotary drive unit configured to rotate the cleaning unit around a rotation axis that intersects the first and second cleaning surfaces, The first cleaning brush is made of a material that is softer and more flexible than the second cleaning brush. In a state where the first and second cleaning surfaces are spaced apart from one surface of the substrate and the first and second cleaning brushes are not pressed by the pressing portion, the distance between the one surface of the substrate and the first cleaning surface is set to be smaller than the distance between the one surface of the substrate and the second cleaning surface. The pressing unit is configured to change the load on the first and second cleaning brushes, thereby causing the cleaning unit, which is rotated by the rotary drive unit, to transition between a first state in which the first cleaning surface is in contact with one surface of the substrate and a second state in which both the first and second cleaning surfaces are in contact with one surface of the substrate.

[0070] According to the substrate cleaning apparatus described in paragraph 1, when the load on the first and second cleaning brushes of the cleaning unit is relatively small, the first cleaning surface, which is closer to one surface of the substrate, contacts that surface of the substrate. When the load on the first and second cleaning brushes of the cleaning unit is relatively large, the first cleaning brush contracts, causing the first cleaning surface of the first cleaning brush and the second cleaning surface of the second cleaning brush to contact one surface of the substrate. Therefore, by changing the load on the first and second cleaning brushes, the cleaning unit can be switched between a first state in which the first cleaning surface of the soft first cleaning brush contacts one surface of the substrate, and a second state in which the first cleaning surface and the second cleaning surface of the hard second cleaning brush contact one surface of the substrate. This makes it possible to clean one surface of the substrate according to its level of contamination. In this case, there is no need to change the brushes according to the level of contamination of one surface of the substrate. Therefore, it becomes possible to clean one surface of the substrate according to its level of contamination while reducing downtime due to brush replacement.

[0071] (Clause 2) In the substrate cleaning apparatus described in paragraph 1, the first and second cleaning brushes may be configured such that when pressed by the pressing part so as to apply a first load, the cleaning part enters the first state, and when pressed by the pressing part so as to apply a second load greater than the first load, the cleaning part enters the second state.

[0072] According to the substrate cleaning apparatus described in paragraph 2, by selectively applying a first load and a second load to the first and second cleaning brushes, the cleaning section can be easily selectively transitioned between a first state and a second state.

[0073] (3) In the substrate cleaning apparatus described in paragraph 1 or 2, the second cleaning surface may be arranged to intersect the rotation axis, and the first cleaning surface may be arranged to continuously or intermittently surround the rotation axis.

[0074] According to the substrate cleaning apparatus described in paragraph 3, a wide area can be cleaned by the first cleaning surface of the rotating cleaning unit in both the first and second states.

[0075] (Clause 4) In the substrate cleaning apparatus described in any one of paragraphs 1 to 3, the first cleaning brush may be made of a porous material.

[0076] According to the substrate cleaning apparatus described in paragraph 4, the first cleaning brush can be easily retracted with a relatively low load. Therefore, it is possible to easily switch between the first state and the second state.

[0077] (Article 5) The substrate cleaning apparatus described in any one of paragraphs 1 to 4 includes a moving unit configured to move the cleaning unit between a standby position outside the substrate and a cleaning position in which the substrate is cleaned, In the standby position, a first supply unit supplies cleaning fluid to the first cleaning surface, The standby position may also include a second supply unit that supplies cleaning fluid to the second cleaning surface.

[0078] According to the substrate cleaning apparatus described in paragraph 5, the first and second cleaning surfaces can be independently cleaned under different conditions by the first and second supply units. This makes it possible to restore the first and second cleaning surfaces to a sufficiently clean state if the contamination state of the first cleaning surface and the contamination state of the second cleaning surface after cleaning the substrate are different.

[0079] (Clause 6) A substrate cleaning apparatus according to any one of paragraphs 1 to 5 may further include a control unit that controls the pressing unit so that the cleaning unit selectively transitions between the first state and the second state.

[0080] According to the substrate cleaning apparatus described in paragraph 6, the transition between the first state and the second state of the cleaning unit can be appropriately controlled according to the type of substrate to be cleaned or the type of treatment applied to the substrate.

[0081] (Clause 7) In the substrate cleaning apparatus described in paragraph 6, the control unit may control the pressing unit so that the cleaning unit transitions to the first state or the second state based on a preset processing recipe.

[0082] According to the substrate cleaning apparatus described in Section 7, the cleaning unit transitions between a first state and a second state based on the processing recipe. As a result, if the contamination status of one side of the substrate can be predicted by the processing recipe, that side of the substrate can be properly cleaned.

[0083] (Clause 8) In the substrate cleaning apparatus described in any one of paragraphs 1 to 7, the control unit may control the pressing unit so that the cleaning unit is in the first state when cleaning a predetermined first area on one surface of the substrate, and control the pressing unit so that the cleaning unit is in the second state when cleaning a predetermined second area on one surface of the substrate.

[0084] According to the substrate cleaning apparatus described in paragraph 8, the cleaning unit transitions between a first state and a second state when cleaning the first region and when cleaning the second region. Therefore, if the contamination status of the first and second regions on one side of the substrate can be predicted, one side of the substrate can be properly cleaned.

[0085] (Clause 9) A substrate cleaning apparatus relating to another embodiment is: A substrate holding section that holds the substrate, A cleaning unit comprising a first cleaning brush having a first cleaning surface capable of contacting one surface of a substrate held by the substrate holding unit, and a second cleaning brush having a second cleaning surface capable of contacting the one surface of the substrate, integrally configured so as to be movable relative to each other in a direction intersecting the first and second cleaning surfaces, The system includes a drive unit that moves one of the first and second cleaning brushes relative to the other such that either or both of the first and second cleaning surfaces come into contact with one surface of the substrate.

[0086] According to the substrate cleaning apparatus described in paragraph 9, by moving one of the first and second cleaning brushes of the cleaning unit relative to the other, either or both of the first cleaning surface of the first cleaning brush and the second cleaning surface of the second cleaning brush come into contact with one surface of the substrate. This allows one surface of the substrate to be cleaned according to its level of contamination. In this case, there is no need to replace the brushes according to the level of contamination on one surface of the substrate. Therefore, it is possible to clean one surface of the substrate according to its level of contamination while reducing downtime due to brush replacement.

[0087] (Clause 10) In the substrate cleaning apparatus described in paragraph 9, the drive unit may move one of the first and second cleaning brushes relative to the other by magnetic force.

[0088] According to the substrate cleaning apparatus described in paragraph 10, one of the first and second cleaning brushes is moved relative to the other by magnetic force. Therefore, a mechanical configuration for moving the first and second cleaning brushes relative to each other is unnecessary. As a result, the generation of particles due to the sliding of mechanical components is suppressed. In this case, re-contamination of the substrate by particles is prevented.

[0089] (Paragraph 11) In the substrate cleaning apparatus described in paragraph 9 or 10, The aforementioned drive unit is A first magnet, which is an electromagnet, is attached to one of the first and second cleaning brushes, The system may also include a second magnet attached to the other of the first and second cleaning brushes so as to receive the magnetic force generated by the first magnet.

[0090] According to the substrate cleaning apparatus described in paragraph 11, the relative direction and amount of movement of the first and second cleaning brushes can be controlled by changing the current supplied to the first magnet.

[0091] (Item 12) In a substrate cleaning apparatus described in any one of items 9 to 11, The drive unit may be configured such that when a current is supplied to the first magnet in a first direction, the first magnet and the second magnet repel each other, causing one of the first and second cleaning brushes to move in one direction relative to the other, and when a current is supplied to the first magnet in a second direction opposite to the first direction, the first magnet and the second magnet attract each other, causing one of the first and second cleaning brushes to move in the opposite direction relative to the other.

[0092] According to the substrate cleaning apparatus described in paragraph 12, by changing the direction of the current supplied to the first magnet, the direction in which one of the first and second cleaning brushes moves relative to the other is switched between one direction and the opposite direction. This makes it possible to easily switch the relative direction of movement of the first and second cleaning brushes.

[0093] (Item 13) The substrate cleaning apparatus described in any one of items 9 to 12 is: The system may further include a control unit that controls the drive unit so that the first and second cleaning brushes are selectively set to one of a plurality of positional relationships by the relative movement of the first and second cleaning brushes.

[0094] According to the substrate cleaning apparatus described in paragraph 13, the first and second cleaning brushes of the cleaning section can be set to an appropriate positional relationship from among multiple positional relationships.

[0095] (Item 14) The substrate cleaning apparatus described in any one of items 9 to 13 is: A moving unit configured to move the cleaning unit between a standby position outside the substrate and a cleaning position for cleaning the substrate, The aforementioned standby position further includes a supply unit that supplies cleaning fluid to a predetermined cleaning position, The control unit may control the drive unit so that the supply unit selectively supplies cleaning fluid to the first and second cleaning surfaces by changing the relative positions of the first and second cleaning brushes.

[0096] According to the substrate cleaning apparatus described in paragraph 14, the supply unit can independently clean the first and second cleaning surfaces under different conditions. This allows the first and second cleaning surfaces to be restored to a sufficiently clean state if the contamination levels of the first and second cleaning surfaces differ after cleaning the substrate.

[0097] (Paragraph 15) In the substrate cleaning apparatus described in paragraph 13 or 14, The control unit may control the pressing unit so that the first and second cleaning brushes are selectively set to one of a plurality of positional relationships based on a preset processing recipe.

[0098] According to the substrate cleaning apparatus described in paragraph 15, the relative positional relationship between the first and second cleaning brushes in the cleaning section can be appropriately switched based on the processing recipe. As a result, if the contamination state of one side of the substrate can be predicted from the processing recipe, that side of the substrate can be appropriately cleaned.

[0099] (Item 16) In a substrate cleaning apparatus described in any one of items 13 to 15, The control unit may control the pressing unit so that the relative positions of the first and second cleaning brushes are in a first relationship when cleaning a predetermined first area on one surface of the substrate, and may control the pressing unit so that the relative positions of the first and second cleaning brushes are in a second relationship when cleaning a predetermined second area on one surface of the substrate.

[0100] According to the substrate cleaning apparatus described in paragraph 16, the cleaning unit can be appropriately switched between a first and second configuration depending on the contamination state when cleaning the first and second regions. As a result, if the contamination state of the first and second regions on one side of the substrate can be predicted, one side of the substrate can be appropriately cleaned.

[0101] (Item 17) In a substrate cleaning apparatus described in any one of items 9 to 16, The first and second cleaning brushes may be made of different materials.

[0102] According to the substrate cleaning apparatus described in paragraph 17, depending on the degree of contamination on one surface of the substrate, one surface of the substrate can be selectively cleaned using the cleaning surface of the cleaning brush made of an appropriate material from among the first cleaning surface of the first cleaning brush and the second cleaning surface of the second cleaning brush.

[0103] Furthermore, according to the substrate cleaning apparatus of the above-described embodiment, one side of the substrate can be cleaned according to the contamination state of that side, thereby improving the yield of products obtained by substrate processing. Consequently, unnecessary substrate processing is reduced, enabling energy savings in substrate processing. In addition, the use of unnecessary chemicals and other substances can be reduced, contributing to the reduction of pollution of the global environment. [Explanation of Symbols]

[0104] 2...Cleaning section, 2a, 2b...Holding section, 10...Spin chuck, 11...Holding section, 12...Chuck rotation drive section, 13...Cleaning nozzle, 20...Cleaning section, 21, 22...Cleaning brush, 20A, 21A, 22A...Cleaning surface, 21a, 22a...Main body section, 21b, 22b...Protrusions, 21c, 22c...Bottom surface, 21d, 22d...Top surface, 23...Housing member, 23a...Bottom surface, 23b...Hole, 24...Housing member, 24a...Top surface, 25...Pressing section Material, 25a…Connecting member, 26…Cleaning brush, 26A…Cleaning surface, 30…Arm, 40…Arm drive unit, 50…Brush rotation drive unit, 60…Pressing drive unit, 61…Switching drive unit, 70…Standby pod, 71, 72…Cleaning nozzle, 73…Cleaning liquid supply unit, 81, 82, 83…Removal unit, 90…Control unit, 100, 100a…Substrate cleaning device, AX…Rotating shaft, EM…Electromagnet, MG…Magnet, W…Substrate, WD…Droplet, WL…Cleaning liquid

Claims

1. A substrate holding section that holds the substrate, A cleaning unit comprising a first cleaning brush having a first cleaning surface that can contact one surface of a substrate held by the substrate holding unit, and a second cleaning brush having a second cleaning surface that can contact the one surface of the substrate, is integrally configured. A pressing section capable of pressing the first and second cleaning brushes and configured to vary the load applied to the first and second cleaning brushes, The cleaning unit is further equipped with a rotary drive unit configured to rotate the cleaning unit around a rotation axis that intersects the first and second cleaning surfaces, The first cleaning brush is made of a material that is softer and more flexible than the second cleaning brush. In a state where the first and second cleaning surfaces are spaced apart from one surface of the substrate and the first and second cleaning brushes are not pressed by the pressing portion, the distance between the one surface of the substrate and the first cleaning surface is set to be smaller than the distance between the one surface of the substrate and the second cleaning surface. A substrate cleaning apparatus, wherein the pressing unit is configured to change the load on the first and second cleaning brushes, thereby causing the cleaning unit, which is rotated by the rotary drive unit, to transition between a first state in which the first cleaning surface is in contact with one surface of the substrate and a second state in which the first and second cleaning surfaces are in contact with one surface of the substrate.

2. The substrate cleaning apparatus according to claim 1, wherein the first and second cleaning brushes are configured such that when pressed by the pressing portion to apply a first load, the cleaning portion enters the first state, and when pressed by the pressing portion to apply a second load greater than the first load, the cleaning portion enters the second state.

3. The substrate cleaning apparatus according to claim 1 or 2, wherein the second cleaning surface is arranged to intersect the rotation axis, and the first cleaning surface is arranged to continuously or intermittently surround the rotation axis.

4. The substrate cleaning apparatus according to claim 1 or 2, wherein the first cleaning brush is formed of a porous material.

5. A moving unit configured to move the cleaning unit between a standby position outside the substrate and a cleaning position for cleaning the substrate, In the standby position, a first supply unit supplies cleaning liquid to the first cleaning surface, The substrate cleaning apparatus according to claim 1 or 2, further comprising a second supply unit that supplies cleaning liquid to the second cleaning surface in the standby position.

6. The substrate cleaning apparatus according to claim 1 or 2, further comprising a control unit that controls the pressing unit so that the cleaning unit selectively transitions between the first state and the second state.

7. The substrate cleaning apparatus according to claim 6, wherein the control unit controls the pressing unit so that the cleaning unit transitions to the first state or the second state based on a preset processing recipe.

8. The substrate cleaning apparatus according to claim 6, wherein the control unit controls the pressing unit so that the cleaning unit is in the first state when cleaning a predetermined first area on one surface of the substrate, and controls the pressing unit so that the cleaning unit is in the second state when cleaning a predetermined second area on one surface of the substrate.

9. A substrate holding section that holds the substrate, A cleaning unit comprising a first cleaning brush having a first cleaning surface that can contact one surface of a substrate held by the substrate holding unit, and a second cleaning brush having a second cleaning surface that can contact the one surface of the substrate, integrally configured so as to be movable relative to each other in a direction intersecting the first and second cleaning surfaces, The system includes a drive unit that moves one of the first and second cleaning brushes relative to the other such that one or both of the first and second cleaning surfaces come into contact with one surface of the substrate, The drive unit is a substrate cleaning device that moves one of the first and second cleaning brushes relative to the other by magnetic force.

10. A substrate holding part for holding a substrate, A cleaning unit comprising a first cleaning brush having a first cleaning surface that can contact one surface of a substrate held by the substrate holding unit, and a second cleaning brush having a second cleaning surface that can contact the one surface of the substrate, integrally configured so as to be movable relative to each other in a direction intersecting the first and second cleaning surfaces, The system includes a drive unit that moves one of the first and second cleaning brushes relative to the other such that one or both of the first and second cleaning surfaces come into contact with one surface of the substrate, The aforementioned drive unit is A first magnet, which is an electromagnet attached to one of the first and second cleaning brushes, A substrate cleaning apparatus comprising a second magnet attached to the other of the first and second cleaning brushes so as to receive the magnetic force generated by the first magnet.

11. The substrate cleaning apparatus according to claim 10, wherein the drive unit is configured such that when a current in a first direction is supplied to the first magnet, the first magnet and the second magnet repel each other, causing one of the first and second cleaning brushes to move in one direction relative to the other, and when a current in a second direction opposite to the first direction is supplied to the first magnet, the first magnet and the second magnet attract each other, causing one of the first and second cleaning brushes to move in the opposite direction relative to the other.

12. The substrate cleaning apparatus according to claim 9 or 10, further comprising a control unit that controls the drive unit so that the first and second cleaning brushes are selectively set to one of a plurality of positional relationships by the relative movement of the first and second cleaning brushes.

13. A moving unit configured to move the cleaning unit between a standby position outside the substrate and a cleaning position for cleaning the substrate, The aforementioned standby position further includes a supply unit that supplies cleaning fluid to a predetermined cleaning position, The substrate cleaning apparatus according to claim 12, wherein the control unit controls the drive unit so that the cleaning liquid is selectively supplied to the first and second cleaning surfaces by the supply unit by changing the relative positions of the first and second cleaning brushes.

14. The substrate cleaning apparatus according to claim 12, wherein the control unit controls the drive unit so that the first and second cleaning brushes are selectively set to one of a plurality of positional relationships based on a preset processing recipe.

15. The substrate cleaning apparatus according to claim 12, wherein the control unit controls the drive unit so that the relative positional relationship of the first and second cleaning brushes becomes a first relationship when cleaning a predetermined first area on one surface of the substrate, and controls the drive unit so that the relative positional relationship of the first and second cleaning brushes becomes a second relationship when cleaning a predetermined second area on one surface of the substrate.

16. A substrate cleaning apparatus according to claim 9 or 10, wherein the first cleaning brush and the second cleaning brush are made of different materials.

Images