Grounding technology for ESD polymer fluid lines

Abstract

A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid supply conduit that carries fluid from the fluid source into the chemical mechanical polishing system. The polishing system includes a platen that supports a polishing pad, a carrier head that supports a substrate and places the substrate in contact with the polishing pad, and a motor that causes relative motion between the platen and the carrier head. The fluid supply conduit includes a conductive wire that extends through the interior of the conduit for conducting electrostatic discharge to ground, and a conductive wire lead-out fixture that covers and seals where the conductive wire passes through the wall of the fluid supply conduit.

Description

Technical Field

[0001] This disclosure relates to chemical mechanical polishing (CMP), and more particularly to fluid supply in CMP.

Background Art

[0002] Integrated circuits are typically formed on a substrate by sequentially depositing conductive, semiconductor, or insulating layers on a semiconductor wafer. Various manufacturing processes require planarization of the layers on the substrate. For example, one manufacturing step involves depositing a fill layer on a non-planar surface and planarizing this fill layer. In some applications, the fill layer is planarized until the top surface of the patterned layer is exposed or until a predetermined thickness of material remains on the underlying layer.

[0003] Chemical mechanical polishing (CMP) is one accepted planarization method. This planarization method typically requires that the substrate be mounted on a carrier head. The exposed surface of the substrate is typically placed against a rotating polishing pad. The carrier head applies a controllable load on the substrate to press the carrier head against the polishing pad. A polishing slurry having abrasive particles is typically supplied to the surface of the polishing pad. A cleaning fluid, such as deionized water, can be sprayed on the polishing pad to remove debris generated during the polishing process.

Summary of the Invention

[0004] A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid supply conduit that transports fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen that supports a polishing pad, a carrier head that supports a substrate and brings the substrate into contact with the polishing pad, and a motor that causes relative movement between the platen and the carrier pad. The fluid supply conduit includes a conductive wire that extends through the interior of the conduit for conducting electrostatic discharge to ground, and a conductive wire lead attachment that covers and seals the location where the conductive wire penetrates the wall of the fluid supply conduit.

[0005] The embodiments may include one or more of the following features: The conductive wire may be made of a precious metal. The fluid supply conduit may be a flexible pipe. Conductive lugs may be screwed into the threaded portion of the passage. The plastic body may be screwed into the threaded opening of the fluid supply conduit.

[0006] In another embodiment, a method for manufacturing a fluid conduit includes arranging conductive wires through a pipe such that the pipe is configured to carry a fluid into a chemical mechanical polishing assembly, and coupling the conductive wires to a ground source to form an electrostatic discharge protection assembly to guide static charge.

[0007] The embodiments may include one or more of the following features: an electrostatic discharge protection assembly may be installed on a chemical mechanical polishing assembly; piping may be fluidly coupled to a fluid source to allow fluid to flow from the fluid source to the chemical mechanical polishing assembly; conductive wires may be coupled to a common earth source.

[0008] In another embodiment, an assembly for electrically connecting to a volume containing fluid includes a wall forming the boundary of the volume to contain the fluid, a conductive wire extending through the volume, and a pull-out fixture providing a sealed electrical connection through the wall. The pull-out fixture includes an annular plastic body having a passage through which it penetrates. The plastic body has a threaded outer surface that is screwed into a threaded opening in the wall, the conductive wire is inserted into one end of the passage, and a conductive lug is inserted into the opposite end of the passage and in contact with the conductive wire. The conductive lug has a threaded outer surface that is screwed into a threaded portion at the opposite end of the passage.

[0009] The embodiments may include one or more of the following features: The sealant may be placed between the threaded outer surface of the plastic body and the threaded opening in the wall. The sealant may be placed between the threaded outer surface of the lug body and the threaded portion of the passage. In any case, the sealant may be a polytetrafluoroethylene (PTFE) tape. The plastic body may be made of polytetrafluoroethylene (PTFE). The wall may be made of plastic. The fluid may be steam. The conductive wire may be made of a precious metal.

[0010] Possible advantages may include, but are not limited to, one or more of the following:

[0011] The risk of electrostatic discharge from the fluid supply line, and therefore the risk of damaging the fluid supply line or other components in the chemical mechanical polishing system, can be reduced. The components of the grounding mechanism can be manufactured easily and at low cost. The fluid flowing through the piping does not pose a risk of further contamination when the fluid interacts with precious metals. Furthermore, the systems and methods disclosed herein are safe even at high temperatures and are suitable for semiconductor cleanrooms.

[0012] Details of one or more embodiments are described in the accompanying drawings and the following description. Other embodiments, features, and advantages will become apparent from this specification and the drawings, and from the claims. [Brief explanation of the drawing]

[0013] [Figure 1] This is a schematic cross-sectional view of an example of a polishing station in a polishing apparatus. [Figure 2] This is a top view of an example of a polishing station for a chemical mechanical polishing apparatus. [Figure 3A] This is a schematic diagram of a fluid supply line with conductive wires in a chemical mechanical polishing system. [Figure 3B] Figure 3A is a schematic cross-sectional view of the fluid supply line. [Figure 3C] This is a schematic cross-sectional view of the ground pull-out fitting assembly. [Figure 4] This is a schematic cross-sectional view of a ground lead fitting assembly attached to a pipe. [Figure 5] This is a schematic cross-sectional view of an electrical connection lead fitting assembly attached to a conduit for a semiconductor processing system. [Figure 6] This is a schematic cross-sectional view of an electrical connection lead fitting assembly attached to the processing chamber of a semiconductor processing system. [Modes for carrying out the invention]

[0014] Similar reference numerals in various drawings indicate the same elements.

[0015] Chemical mechanical polishing systems include a considerable number of fluid supply lines to provide a fair number of fluids, such as deionized water, steam, and nitrogen gas. For example, a typical system may include fluid supply lines to carry slurry to the polishing pad, fluid supply lines to carry cleaning fluid to the polishing pad to remove polishing debris, fluid supply lines to carry heated or cooled fluid to the polishing pad to control the temperature of the polishing process, and fluid supply lines to carry pressurized gas for pneumatic pressure control within the carrier head. Static electricity can accumulate in these fluid supply lines, for example, due to triboelectric charging or electrostatic induction. If the accumulated static electricity becomes excessive, electrostatic discharge can damage components and piping along the fluid supply lines. Static electricity is particularly likely to occur in fluid lines carrying high-temperature gases, such as steam. The combination of steam and temperature can result in triboelectric charging not seen in conventional systems that do not use steam.

[0016] Conventional methods for electrostatic discharge (ESD) piping involve placing a conductive layer, such as carbon, on the inside of the piping. However, particles of the coating material on the inside of the piping can be carried by the fluid into the polishing system, potentially resulting in substrate contamination and defects on the substrate. Furthermore, the polishing environment can be humid and wet with polishing slurry, and therefore the conductive layer on the outside of the piping can oxidize or be worn down by the environment.

[0017] Other commercially available options for grounding technology, such as piping impregnated with integrated carbon on both the inside and outside, fail to adequately dissipate ESD charges from polymer fluid lines. Furthermore, these methods tend to leak at the ends of the piping. These problems worsen at high temperatures, becoming unpredictable issues in chemical mechanical polishing systems, making temperature control even more crucial for process management.

[0018] Conductive wires made of conductive precious metals and extending through the interior of the piping can alleviate these problems. Precious metals such as platinum and gold do not interact with steam even at high temperatures. Therefore, placing precious metal wires inside the piping will not result in particulate matter and is unlikely to cause defects in integrated circuit products. Grounding lead fitting assemblies can be designed to maintain leak-free piping pathways while also appropriately introducing grounding paths for the internal precious metal wires. The precious metal wires can be coupled to a ground source and thus dissipate the charge generated by friction between the fluid flow and the surrounding polymer piping.

[0019] Figures 1 and 2 show an example of a polishing system 20 of a chemical mechanical polishing system. The polishing system 20 includes a rotatable disc-shaped platen 24, on which a polishing pad 30 is placed. The platen 24 is operable to rotate around an axis 23 (see arrow A in Figure 2). For example, a motor 22 can rotate the platen 24 by turning a drive shaft 26. The polishing pad 30 can be a two-layer polishing pad having an outer polishing layer 34 and a soft backing layer 32.

[0020] The polishing system 20 can include a supply port 40, for example, at an end of a slurry dispenser arm 43 to dispense a polishing liquid 42, such as a polishing slurry, onto the polishing pad 30. The polishing liquid 42 can be supplied, for example, by a pump, from a reservoir 44 (see FIG. 2) via a fluid supply line 46.

[0021] The polishing system 20 can include a pad conditioner 90 having a conditioner disk 92 (see FIG. 2) to maintain the surface roughness of the polishing pad 30. The conditioner disk 92 can be disposed within a conditioner head 93 at an end of an arm 94. Pressing the conditioner disk 92 against the polishing pad 30 can be controlled pneumatically, for example, by a pressurized gas, such as N2, within a fluid supply line 96.

[0022] The carrier head 50 is operable to hold the substrate 10 against the polishing pad 30. The carrier head 50 can also include a holding ring 56 to maintain the lateral position of the substrate 10 under the carrier head. The carrier head 50 is suspended from a support structure 60, such as a carousel or a track, and is connected to a carrier head rotation motor 64 by a drive shaft 62 so that the carrier head can rotate about a central axis 51. Optionally, the carrier head 50 can vibrate laterally, for example, on a slider on the carousel, by moving along a track or by the rotational vibration of the carousel itself.

[0023] The carrier head 50 can include a flexible film 54 having a substrate mounting surface that contacts the back surface of the substrate 10, and a plurality of pressurizable chambers 52a - 52c that apply different pressures to different zones on the substrate 10, for example, zones in different radial directions. The pressure to the chambers 52a - 52c can be controlled by pressure regulators 58a - 58c. The pressure regulators 58a - 58c can be inserted through a rotary union and a drive shaft 62 and coupled to their respective chambers 52a - 52c via pneumatic lines 59 that carry a pressurized gas, for example, N2, to their respective chambers 52a - 52c.

[0024] During operation, the platen is rotated about the central axis 23 of the platen, and the carrier head is rotated about the central axis 51 of the carrier head (see arrow B in FIG. 2), and is laterally translated across the upper surface of the polishing pad 30 (see arrow C in FIG. 2).

[0025] When the carrier head 50 and the conditioner head 93 move across the polishing pad 30, the exposed surfaces are likely to be covered with slurry. For example, the slurry can adhere to the outer diameter surface or the inner diameter surface of the retaining ring 56. Generally, if there are surfaces that are not kept in a wet state, the slurry tends to coagulate and / or completely dry out, resulting in corrosion of components and fine particles and defects on the substrate. One solution is to clean components, such as the carrier head 50 and the conditioner head 92, with jets of, for example, water or steam. A carrier head cleaner for the carrier head, such as a steam treatment assembly, can be part of the load cup in the polishing system. Similarly, a conditioner head cleaner for the conditioner head, such as a steam treatment assembly, can be part of the conditioner head cleaning cup. In any case, piping is required to carry a cleaning fluid, such as liquid water or steam, to the cleaner.

[0026] In some embodiments, the polishing system 20 includes a temperature sensor 80 to monitor the temperature within the polishing station or its components, for example, the temperature of the polishing pad 30 and / or the polishing fluid 38 on the polishing pad. For example, the temperature sensor 80 may be an infrared (IR) sensor, such as an IR camera. Alternatively or additionally, the temperature sensor may be a contact sensor other than a non-contact sensor. For example, the temperature sensor 80 may be a thermocouple or IR thermometer on / in the platen 24. In addition, the temperature sensor 80 may be in direct contact with the polishing pad.

[0027] The polishing system 20 may also include a temperature control system 100 that controls the temperature of the polishing pad 30 and / or the polishing fluid 38 on the polishing pad. The temperature control system 100 may include a cooling system 102 and / or a heating system 104. At least one of the cooling system 102 and the heating system 104, or both in some embodiments, operates by supplying a temperature control medium, such as a liquid, vapor, or spray, onto the polishing surface 36 of the polishing pad 30 (or onto the polishing fluid already present on the polishing pad).

[0028] As shown in Figure 1, the temperature control system example 100 includes one or more arms 110 extending over the platen 24 and the polishing pad 30. A number of nozzles 120 are suspended from or formed within each arm 110, and each nozzle 120 is configured to spray a fluid onto the polishing pad 30, for example, to supply a temperature control fluid onto the polishing pad 30.

[0029] To function as a cooling system, the temperature-controlled fluid is a coolant. The coolant is a gas, such as air, or a liquid, such as water. The coolant can be at room temperature or below, for example, 5-15°C. The coolant used in the cooling system 102 can include, for example, chilled water, liquid nitrogen, or a gas formed from liquid nitrogen and / or dry ice. In some embodiments, droplets of liquid, such as water, ethanol, or isopropyl alcohol, can be added to the gas stream. In some embodiments, the cooling system uses air and liquid sprays, for example, an aerosolized spray of liquid, such as water. In particular, the cooling system may have a nozzle that produces an aerosolized spray of water cooled below room temperature.

[0030] As shown in Figure 2, the cooling system 102 may include a source 130 of a liquid coolant medium and / or a source 132 of a gaseous coolant medium. The liquid from source 130 and the gas from source 132 may be delivered by piping 132, 136 to and within the arm 110 before being directed through the nozzle 120 to form, for example, a spray 122. The coolant may be below room temperature when dispensed, for example -100 to 20°C, or below 0°C.

[0031] Gas from a gas source 132, such as compressed gas, may be connected to a vortex tube 133 that separates the compressed gas into a low-temperature stream and a high-temperature stream, directing the low-temperature stream to the nozzle 120 onto the polishing pad 30. In some embodiments, the nozzle 120 is the lower end of the vortex tube that directs the low-temperature stream of compressed gas onto the polishing pad 30.

[0032] To function as a heating system, the temperature-controlled fluid is the heating fluid. The heating fluid can be a gas, such as steam or heated air, or a liquid, such as heated water, or a mixture of gas and liquid. The heating fluid is above room temperature, for example, 40–120°C, or for example, 90–110°C. The fluid can be water, such as substantially pure deionized water or water containing additives or chemicals. In some embodiments, the heating system uses a spray of steam, or a spray of a mixture of steam and liquid water. The steam may contain additives or chemicals.

[0033] As shown in Figure 2, the heating system 104 may include a source 140 of a heated liquid, such as hot water, and / or a source 142 of a heated gas, such as steam. For example, source 142 may be a boiler. The liquid from source 140 and the gas from source 142 may be transported by pipes 144, 146 to and within the arm 110 before being directed to form a spray 122 through the nozzle 120.

[0034] Along the rotational direction of the platen 24, the arm 110b of the heating system 104 may be positioned between the arm 110a of the cooling system 102 and the carrier head 70. Along the rotational direction of the platen 24, the arm 111b of the heating system 104 may be positioned between the arm 110a of the cooling system 102 and the slurry dispenser arm 43. For example, the arm 110a of the cooling system 102, the arm 110b of the heating system 104, the slurry dispenser arm 43, and the carrier head 70 may be positioned in that order along the rotational direction of the platen 24.

[0035] The temperature control system 100 may include a single arm that dispenses both the coolant and the heating fluid, rather than separate arms.

[0036] Other techniques may be used by the temperature control system 100 to control the temperature of the polishing process, either selectively or in addition. For example, a heating or cooling fluid, such as steam or cold water, may be injected into the polishing fluid 42 (e.g., slurry) to raise or lower the temperature of the polishing fluid 42 before it is dispensed. As another example, a resistance heater may be supported within the platen 22 to heat the polishing pad 30 and / or within the carrier head 50 to heat the substrate 10.

[0037] By easing the temperature of the slurry and polishing pad during layer polishing, it becomes possible to increase the interaction between charge-carrying abrasives such as cerium oxide. Using temperature control, the material removal rate can be beneficially increased by both adjusting the physical parameters of the polishing pad and altering the chemical interaction characteristics between the charged ceria and the packing layer.

[0038] In some embodiments, the controller 90 receives a signal from the temperature sensor 80 and executes a closed-loop control algorithm to control the temperature control system 100, for example, the flow rate, mixing ratio, pressure, or temperature of the coolant or heating fluid components, in order to maintain the polishing process at a desired temperature.

[0039] In some embodiments, a field monitoring system measures the polishing speed of the substrate, and the controller 90 executes a closed-loop control algorithm to control the flow rate or temperature of a temperature control system, such as a coolant or heating fluid, to maintain the polishing speed at a desired rate.

[0040] The polishing system 20 may also include a high-pressure rinsing system 106. The high-pressure rinsing system 106 includes a number of nozzles 150, e.g., 3 to 20 nozzles, that direct a cleaning fluid, such as water, onto the polishing pad 30 with high force to wash the pad 30 and remove used slurry, polishing debris, etc. The cleaning fluid can flow from a cleaning fluid source 156, e.g., a reservoir of deionized water, through piping 152 to the nozzles 150.

[0041] An example of the rinsing system 106 includes an arm 110c extending over the platen 24 and the polishing pad 30. Along the rotational direction of the platen 24, the arm 110c of the rinsing system 106 can be positioned between the arm 110a of the cooling system 102 and the arm 110b of the heating system 104.

[0042] In some embodiments, the polishing system 20 includes a wiper blade or body 170 to evenly distribute the polishing fluid 42 across the entire polishing pad 30. Along the rotational direction of the platen 24, the wiper blade 170 can be positioned between the slurry dispenser 40 and the carrier head 70.

[0043] Figure 2 shows separate arms for each subsystem, such as the heating system 104, the cooling system 102, and the rinsing system 106, but various subsystems may be contained within a single assembly supported by a common arm. Various fluid supply components, such as piping and passages, may extend into the interior of each body.

[0044] Figures 3A and 3B show a fluid supply line 300 that may be suitable for use in a chemical mechanical polishing system, such as polishing system 20. The fluid supply line 300 can function as a fluid supply line 44 for polishing fluid, a pneumatic line 59 for carrier heads, a fluid supply line 96 for conditioner heads, piping 134 or 136 for cooling systems, piping 144 or 146 for heating systems, piping 152 for high-pressure rinsing systems, and piping for transporting pneumatic fluid and / or cleaning fluid to load cups and / or conditioner cleaner cups, such as liquid water or steam to cleaners.

[0045] The fluid line 300 can be particularly well suited for transporting high-temperature gases, such as steam, because combining steam and high temperature can lead to the accumulation of static charge that may not occur in gases or liquids at room temperature. For example, the fluid supply line 300 can be used as a pipe 146 supplying high-temperature gas, such as steam, from a source 142, such as a boiler, or as a pipe supplying steam for cleaning carrier heads and / or conditioner heads in load cups and / or conditioner cleaner cups.

[0046] The fluid supply line 300 includes polymer piping 310, which can be made of a material that is electrically insulating, resistant to temperatures up to 100°C, inert to the fluid passing through the supply line 300, and inert to the polishing process. For example, the polymer piping can be made of perfluoroalkoxyalkane (PFA). The polymer piping 310 has an internal channel 312 through which the fluid flows. The polymer piping 310 may have an inlet 314 and an outlet 316 through which the fluid flows. The fluid supply line 300 can be formed of multiple parts, for example, one part having a threaded outer surface screwed into another part having a threaded inner surface. For additional sealing between parts, polytetrafluoroethylene (PTFE) (e.g., Teflon®) tape or sealing compound can be provided. In addition, although Figure 3A shows the fluid supply line 300 as a straight line, the fluid supply line may have one or more bends or curves.

[0047] A conductive wire 340 extends through an internal channel 312 of the polymer conduit 310. This conductive wire 340 can be connected to a common ground. For example, the conductive wire 340 can pass through a liquid-tight ground lead-out fitting assembly 350 and be connected to a grounding wire 342. The conductive wire 340 can be made of a precious metal such as gold or platinum. Precious metals such as platinum or gold do not interact with steam even at high temperatures, and therefore the risk of particulate matter and corresponding defects is low. Within the conduit 310, the conductive wire is "bare," i.e., not coated or covered by an insulating sheath, and therefore static charge can flow through the conductive wire 340. In contrast, the grounding wire 342 can be made of most conductive wires, for example, copper wire with an insulating sheath that is stripped when connected to the ground lead-out fitting assembly 350, such as a plastic sheath.

[0048] The conductive wire 340 does not need to extend through the fluid inlet and outlet of the piping, but can extend along at least half of the distance between the inlet and outlet, for example, at least 50%, at least 75%, or at least 90%. Therefore, the ground lead fitting assembly 350 should be positioned near the inlet and outlet, for example, within the last 10%, or at least 5%, of the distance between the inlet and outlet. This prevents increased electrostatic discharge along more than half of the fluid path.

[0049] Figure 3A shows a fluid supply line 300 having two ground lead fitting assemblies 350 and a conductive wire 340 extending between the two ground lead fitting assemblies 350 and connected to the two ground lead fitting assemblies 350. However, this is not necessary. In some embodiments, the fluid supply line 300 may have a single ground lead fitting assembly 350, with one end of the conductive wire 340 attached to the ground lead fitting assembly 350 and the other end of the conductive wire hanging "loosely" in the fluid supply line 300. In some embodiments, the fluid supply line 300 may have a single ground lead fitting assembly 350, with the conductive wire 340 forming a loop within the fluid supply line 300 with both ends attached to the single ground lead fitting assembly 350. The loop of the conductive wire 340 may extend through the loop of the fluid supply line itself.

[0050] In some embodiments, the ground lead fitting assembly 350 may include a valve having an adjustable inner diameter. A conductive wire can be supplied through an opening that penetrates the valve, and the valve can then be tightened, for example, by rotating it from the outside of the piping, so that its inner surface tightens and seals against the conductive wire. The valve may be made of a plastic that is non-reactive to steam and can withstand high temperatures, such as PFA or polytetrafluoroethylene (PTFE).

[0051] In some embodiments, the ground lead fitting assembly 350 is easily provided by a fine drilled hole that penetrates the piping. In some embodiments, the hole is just large enough for one or more conductive wires to pass through so that the hole is efficiently sealed when the conductive wires are inserted. If necessary, a sealant can be applied to the area where the conductive wires emerge from the hole and then cured to reduce the possibility of leakage. The ends of the conductive wires can be tapered to aid in the insertion and guidance of the conductive wires through the hole.

[0052] In some embodiments, the drawer mounting assembly 350 includes a conductive grounding lug that enables an electrical connection to the conductive wire 340.

[0053] Figures 3C and 4 show a mechanism for connecting an external grounding wire 342 to a conductive wire 340 in a fluid supply line 300. The grounding lead fitting assembly 350 includes a fitting 352, which is an annular body having a passage 354 through which the fitting passes. In some embodiments, the passage 354 has a narrow portion 354a and a wide portion 354b. The inner surface of the wide portion 354b of the passage 354 can be threaded.

[0054] The fitting 352 can be made of a plastic material that does not corrode or decompose when exposed to the fluid in the fluid supply line 310, such as steam. For example, the fitting 352 can be made of polytetrafluoroethylene (PTFE) (e.g., Teflon®). The lower outer portion 358 of the fitting 352 is threaded and screwed into the corresponding threaded receiving hole in the piping 310 to form a seal between the piping 310 and the fitting 352. For additional sealing between the part of the fitting 352 and the part of the piping 310, polytetrafluoroethylene (PTFE) (e.g., Teflon®) tape or sealing compound can be provided between the threads.

[0055] The conductive wire 340 extends through the lower part 354a of the passage 354 and contacts the conductive lug 360, which is inserted into the upper part 354b of the passage 354. In some embodiments, the fitting 352 is a tapered body with the lower end being the narrower side of the taper. In this case, when the fitting 352 is screwed into the piping 310, the passage 354 is clamped inward (at 355) such that the plastic of the fitting 352 provides a firm contact and seals around the conductive wire 340. This forms a primary seal that prevents fluid in the fluid supply line 300 from leaking through the passage 354.

[0056] The lug 360 may have a threaded outer surface 362 that is screwed into the corresponding threaded area 354c of the upper part 354b of the passage to form a seal between the lug 360 and the fitting 352. This can provide a secondary seal to prevent fluid leakage through the passage 354. For additional sealing between the piece of fitting 352 and the piece of piping 310, polytetrafluoroethylene (PTFE) (e.g., Teflon®) tape or sealing compound may be provided between the threads.

[0057] Two lug nuts 356 can be screwed onto the lug 360, and the external ground wire 342 can be wrapped around the shaft of the lug 360 and captured and compressed between the two lug nuts 356.

[0058] One technique for assembling a conductive wire 340 into a fluid supply line 300 is as follows: First, the conductive wire is inserted and run through the piping 310. This can be done before the inlet, outlet, and lead-out fitting assemblies are installed. For example, the conductive wire may be fixed to a guide tube having an outer diameter slightly smaller than the inner diameter of the internal channel 312. This guide tube may be used to guide the conductive wire through the piping 310, for example, around bends or curves within the piping 310.

[0059] Next, a portion of the conductive wire 340 extending past the end of the pipe can be inserted into the passage 354 within the fitting 352. The narrow section 354a can be just wide enough for one or more conductive wires to pass through, for example, a conductive wire seating within the narrow section 354a in contact with the side wall of the narrow section 354a of the passage 354. The conductive wire 340 can be inserted from the passage 354 until the conductive wire extends into the wider section 354b of the passage 354. Optionally, if the conductive wire 340 extends past the top surface 357 of the fitting 352, the conductive wire 350 can be trimmed so that it does not substantially extend past the top surface 357 of the fitting, for example, by more than 1 mm.

[0060] Next, the conductive lug 360 is inserted into the wide portion 354b of the passage 354. In particular, the conductive lug 360 may have a threaded shaft 362, which is screwed into the threaded wide portion 354b of the passage so that the lug 360 makes firm contact with and electrically connects to the conductive wire 340. The end of the conductive wire 340 can be compressed (at 344) between the bottom of the lug 360 and the bottom of the wide portion 354b of the passage 354 to provide an electrical connection.

[0061] Finally, the fitting 350 can be attached either directly to the piping 312 or to the inlet 314 or outlet 316. In particular, the lower part 358 of the outer surface of the fitting can be threaded and screwed into the corresponding threaded receiving hole in the piping 312, inlet 314, or outlet 316.

[0062] The assembly process may include pre-rotating the fluid supply line 300 to prevent clamping beyond a 90° turn, cutting the conductive wires flush, locking the nuts so as to press the conductive wires against them, and taping the locking nuts with, for example, Teflon tape to prevent them from moving.

[0063] In some embodiments, the dimensions of the PFA piping can be 1 / 8 inch thick and up to 7 feet long.

[0064] This fluid supply line can provide a grounding path for accumulated charge, and thus can reduce the risk of component damage while still remaining suitable for the polishing process.

[0065] While the above description has focused on fluid supply lines for chemical mechanical polishing systems, as shown in Figures 5 and 6, the ground lead fitting assembly 350 can be adapted for other uses as a general conductive circuit lead fitting assembly when a sealed conductive connection is required between the internal volume 502 of a processing system, such as a semiconductor processing system 500, and the external environment 504, particularly where the internal volume 502 contains steam. A semiconductor processing system typically includes a chamber 510, supports 512 for supporting a substrate 10 inside the chamber 510, such as a pedestal, edge support ring, or lift pin, and a gas source 514, such as a boiler or equipment gas line for generating steam or hot water. Examples of processing systems include steam processing systems, but also rapid heat treatment systems, etching systems, and film deposition systems where steam is required for temperature control of components or as a processing gas.

[0066] As shown in Figure 5, the connection can pass through the wall of a line 520 that carries a fluid, such as steam, from the source 514 to, for example, the processing chamber 510, or to another component of the processing system 500, such as a wall, support pedestal, etc., for temperature control. Alternatively, as shown in Figure 6, the connection can pass directly through the wall of the processing chamber 510 into the internal volume 502 of the chamber. In any case, the conductive wire 340' can be used for grounding, but can also be used for other electrical purposes, for example, to carry a DC or AC current from a voltage source 530 to an antenna 540, a sensor 542, or other component in the internal volume 502, or to carry a signal, such as a DC or AC current, from an antenna 540, a sensor 542, or other component in the internal volume 502 to an external monitoring system or controller 532.

[0067] Several embodiments of the present invention have been described. Nevertheless, it should be understood that various modifications can be made without departing from the spirit and scope of the invention. Accordingly, other embodiments are within the scope of the following claims.

Claims

1. A chemical mechanical polishing assembly, A chemical mechanical polishing system comprising a platen that supports a polishing pad, a carrier head that supports a substrate and brings the substrate into contact with the polishing pad, and a motor that causes relative motion between the platen and the carrier head, A polishing liquid source containing polishing liquid, A polishing liquid conduit configured to transport the polishing liquid from the polishing liquid source to the surface of the polishing pad, A steam source configured to generate steam, A fluid supply conduit, separate from the polishing fluid conduit, is configured to transport the steam from the steam source to the surface of the polishing pad. The fluid supply conduit is equipped with, A conductive wire extending through the inside of the conduit for conducting electrostatic discharge to the ground, A ground pull-out fitting provides a sealed electrical connection between the conductive wire and the ground that penetrates the wall of the fluid supply conduit. A chemical mechanical polishing assembly equipped with the following features.

2. The assembly according to claim 1, wherein the steam source comprises a boiler that generates the steam.

3. A cleaning fluid source, A dispenser that supplies the cleaning fluid to the polishing pad, conditioner head, or carrier head, A cleaning fluid supply conduit is connected to the cleaning fluid source in the dispenser, The assembly according to claim 1, further comprising:

4. The assembly according to claim 1, further comprising a pressure line, wherein the carrier head includes one or more pressurizable chambers, and the pressure line is coupled to the carrier head.

5. A pressure line and A conditioner head including one or more pressurizable chambers, A pressurizable conduit connecting the pressure line to the conditioner head, The assembly according to claim 1, further comprising:

6. The assembly according to claim 1, wherein the fluid supply conduit comprises an inlet and an outlet for the steam, and the conductive wire extends along at least 75% of the distance from the inlet to the outlet.

7. The assembly according to claim 1, wherein the ground lead-out fitting covers and seals the location where the conductive wire passes through the wall of the fluid supply conduit.

8. The assembly according to claim 7, wherein the ground lead-out fitting comprises a plastic body having a passage through its interior, the conductive wire is inserted into one end of the passage, and a conductive lug is inserted into the opposite end of the passage and in contact with the conductive wire.

9. A wall that forms a volume boundary to contain a fluid, A conductive wire extending through the aforementioned volume, A drawer mounting fixture that provides a sealed electrical connection that penetrates the aforementioned wall. Equipped with, The drawer mounting fixture comprises an annular plastic body having a passage through its interior, the plastic body having a threaded outer surface into which a threaded opening in the wall is screwed, the conductive wire is inserted into one end of the passage, the conductive lug is inserted into the opposite end of the passage and in contact with the conductive wire, and the conductive lug has a threaded outer surface into which a threaded portion at the opposite end of the passage is screwed.

10. The assembly according to claim 9, wherein the plastic body is tapered so that one end of the passage is compressed to form a seal between the conductive wire and the inner surface of the passage.

11. The assembly according to claim 9, wherein the passage includes a lower portion extending from one end and an upper portion extending from the opposite end, the upper portion being narrower than the lower portion.

12. The assembly according to claim 11, wherein the conductive wire is compressed between the bottom of the lug and the bottom of the upper part of the passage.

13. The assembly according to claim 9, wherein the wall forms a conduit for flowing the fluid to the semiconductor processing system, or the wall forms a processing chamber for the semiconductor processing system.

14. The assembly according to claim 13, wherein the semiconductor processing system comprises a film deposition system, an etching system, or a heat treatment system.

15. The assembly according to claim 13, wherein the conductive wire is coupled to an antenna or sensor inside the processing chamber.

16. The assembly according to claim 9, comprising a monitoring system or controller, and a second conductive wire connecting the monitoring system or controller to the conductive lug.

17. The assembly according to claim 9, further comprising a second conductive wire connecting the conductive lug to an electrical ground.

18. A chemical mechanical polishing assembly, A chemical mechanical polishing system comprising a platen that supports a polishing pad, a carrier head that supports a substrate and brings the substrate into contact with the polishing pad, and a motor that causes relative motion between the platen and the carrier head, A reservoir for holding the polishing fluid, A steam source configured to generate steam, A fluid supply conduit is connected to the reservoir and the steam source so that the steam is injected into the polishing fluid. A dispenser connected to the fluid supply conduit and configured to supply the abrasive fluid into which the steam has been injected to the abrasive pad, The fluid supply conduit is equipped with, A conductive wire extending through the inside of the conduit for conducting electrostatic discharge to the ground, A ground pull-out fitting provides a sealed electrical connection between the conductive wire and the ground that penetrates the wall of the fluid supply conduit, A chemical mechanical polishing assembly equipped with the following features.

19. A chemical mechanical polishing assembly, A chemical mechanical polishing system comprising a platen that supports a polishing pad, a carrier head that supports a substrate and brings the substrate into contact with the polishing pad, and a motor that causes relative motion between the platen and the carrier head, A fluid source and A fluid supply conduit that transports fluid from the fluid source into the chemical mechanical polishing system. The fluid supply conduit is equipped with, A conductive wire extending through the inside of the conduit for conducting electrostatic discharge to the ground, A ground pull-out fitting provides a sealed electrical connection between the conductive wire and the ground that penetrates the wall of the fluid supply conduit. Equipped with, A chemical mechanical polishing assembly comprising a plastic body having a passage through its interior, wherein a conductive wire is inserted into one end of the passage, and a conductive lug is inserted into the opposite end of the passage and in contact with the conductive wire.

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