Light-emitting device

Abstract

To realize a light-emitting device in which light not used as emission light is prevented from affecting the emission light.SOLUTION: A light-emitting device comprises: a base part; one or a plurality of light emission elements that are arranged on an upper surface of the base part, inject light traveling in a side direction; and a wavelength conversion member that is arranged on the upper surface of the base part, and is arranged at the side of each light emission element. The wavelength conversion member comprises: a wavelength conversion part that includes an incident side surface into which the light emitted from an emission end surface of each light emission element and traveling to the side is incident, and an emission surface that emits the light obtained by converting a wavelength of the light incident on the incident side surface; and a surrounding part that is provided at the circumference of the wavelength conversion part. The surrounding part comprises: a projection part that is projected to a side of the light emission element than the incident side surface above the emission element, and the projection part is arranged so as to be overlapped with the emission end surface in top view.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device.

Background Art

[0002] Patent Document 1 discloses a light-emitting device having a semiconductor laser element as a light-emitting element, in which laser light emitted from the semiconductor laser element is reflected by a reflecting member and incident on a wavelength conversion member, and is converted into different wavelengths by the wavelength conversion unit. The wavelength-converted light passes through the through-hole of the holding member and the translucent member and is emitted to the outside. For example, the holding member also functions as a light-shielding member when the optical path of the laser light is deviated.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When not all of the light emitted from the light-emitting element is used as the emitted light but only a desired portion is used, it is preferable to suppress the influence of the light not used as the emitted light on the emitted light.

Means for Solving the Problems

[0005] A light-emitting device according to one embodiment of the present disclosure comprises a base, one or more light-emitting elements disposed on the upper surface of the base and emitting light that travels laterally, and a wavelength conversion member disposed on the upper surface of the base and positioned laterally to the light-emitting elements, wherein the wavelength conversion member has a wavelength conversion section having an incident side surface into which light emitted from the exit end surface of the light-emitting elements and traveling laterally is incident, and an exit surface that emits light obtained by wavelength conversion of the light incident on the incident side surface, and a surrounding section provided around the wavelength conversion section, wherein the surrounding section has a projection above the light-emitting elements and projecting toward the light-emitting elements from the incident side surface, and the projection is positioned so as to overlap with the exit end surface in a top view. The device further comprises a frame portion that is joined to the base portion and surrounds the light-emitting element and the wavelength conversion member, and a lid portion that is supported by the frame portion and forms a sealing space in which the light-emitting element and the wavelength conversion member are arranged. ru. [Effects of the Invention]

[0007] According to one embodiment of the present disclosure, it is possible to realize a light-emitting device that suppresses the influence of light not used as emitted light on the emitted light. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a perspective view of the light-emitting device according to the first and second embodiments. [Figure 2] Figure 2 is a perspective view of the light-emitting device according to the first embodiment shown in Figure 1, with the lid removed. [Figure 3] Figure 3 is a top view of the light-emitting device shown in Figure 2. [Figure 4] Figure 4 is a cross-sectional view of the light-emitting device according to the first embodiment, taken along the cross-sectional line IV-IV in Figure 1. [Figure 5] Figure 5 is a cross-sectional view of the light-emitting device according to the first embodiment along the VV section line in Figure 1. [Figure 6] Figure 6 is a perspective view showing an example of the structure of the wavelength conversion unit according to this disclosure. [Figure 7] Figure 7 is a perspective view showing an example of the structure of a wavelength conversion member according to this disclosure. [Figure 8] Figure 8 is a cross-sectional view of the wavelength conversion member along the VIII-VIII section in Figure 7. [Figure 9]Figure 9 is an enlarged cross-sectional view of the light-emitting device shown in Figure 5, showing the light-emitting element, the wavelength conversion member, and its vicinity. [Figure 10] Figure 10 is an enlarged top view of the light-emitting device shown in Figure 3, showing the light-emitting element, wavelength conversion member, and their vicinity. [Figure 11] Figure 11 is a cross-sectional view showing a modified example of the light-emitting device according to the first embodiment along the cross-sectional line XI-XI in Figure 1. [Figure 12] Figure 12 is an enlarged cross-sectional view of the light-emitting device according to the second embodiment, showing the light-emitting element, wavelength conversion member, light-transmitting member, and their vicinity along the cross-sectional line XII-XII shown in Figure 1. [Figure 13] Figure 13 is an enlarged cross-sectional view showing a modified example of the light-emitting device according to the second embodiment, along the cross-sectional line XIII-XIII shown in Figure 1, with the light-emitting element, wavelength conversion member, light-transmitting member, and their vicinity magnified. [Modes for carrying out the invention]

[0009] The following description will explain embodiments for carrying out the invention with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "up," "down," and other terms including these) will be used as needed. However, the use of these terms is solely to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not excessively limit the technical scope of the present invention. For example, if "top surface" is mentioned, the invention must not always be used in a way that it faces upwards. Also, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or components.

[0010] Furthermore, in this disclosure, the term "polygon" refers to polygons such as triangles and quadrilaterals, including shapes where the corners of the polygon have been rounded, chamfered, or otherwise modified. Similarly, shapes where modifications have been made not only to the corners (ends of the sides) but also to the middle parts of the sides will also be referred to as polygons. In other words, shapes that retain the shape of a polygon but have been partially modified are included in the interpretation of "polygon" as described in this disclosure.

[0011] Moreover, not only for polygons, but also for words representing specific shapes such as trapezoids, circles, concavities and convexities, etc., the same applies. Also, the same applies when dealing with each side forming the shape. That is, even if a side has been processed at its corner or middle part, the processed part is included in the interpretation of "side". When distinguishing a "polygon" or "side" without partial processing from the processed shape, "strict" shall be added, for example, described as "strict square", etc.

[0012] Furthermore, the embodiments shown below illustrate a light-emitting device or the like for embodying the technical idea of the present invention, and do not limit the present invention below. Also, the dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention only to those, but are intended to be illustrative unless otherwise specifically described. Also, the content described in one embodiment is applicable to other embodiments and modified examples. Also, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid the drawings becoming overly complex, a schematic diagram omitting the illustration of some elements may be used, or an end view showing only the cut surface as a cross-sectional view may be used.

[0013] <First Embodiment> The light-emitting device of the first embodiment includes one or more light-emitting elements, a wavelength conversion member, and a base on which the one or more light-emitting elements and the wavelength conversion member are arranged. Referring to FIGS. 1 to 10, a structural example of the light-emitting device 200 according to the first embodiment will be described.

[0014] FIG. 1 is a perspective view illustrating a light-emitting device 200 according to the first embodiment. FIG. 2 is a perspective view of the light-emitting device 200 shown in FIG. 1 with the lid portion 213 removed. In the perspective view of FIG. 2, for convenience of explanation, the metal film 221 and the wiring 270 provided on the upper surface of the light-emitting element 220 are omitted. FIG. 3 is a top view of the light-emitting device 200 shown in FIG. 2. FIG. 4 is a cross-sectional view of the light-emitting device 200 taken along the IV-IV cross-sectional line in FIG. 1. FIG. 5 is a cross-sectional view of the light-emitting device 200 taken along the V-V cross-sectional line in FIG. 1. For convenience of explanation, the metal film 221 provided on the upper surface of the light-emitting element 220, the first metal film 232a, the second metal film 232b, and the wiring 270 provided on the upper surface of the submount 230 are omitted. FIG. 6 is a perspective view of the wavelength conversion portion 241 according to the present disclosure. FIG. 7 is a perspective view of the wavelength conversion member 240 according to the present disclosure. FIG. 8 is a cross-sectional view of the wavelength conversion member 240 taken along the VIII-VIII cross-sectional line in FIG. 7. FIG. 9 is an enlarged cross-sectional view of the light-emitting device 200 shown in FIG. 5, with the light-emitting element 220 and the wavelength conversion member 240 and their vicinity enlarged. For convenience of explanation, the metal film 221 provided on the upper surface of the light-emitting element 220, the first metal film 232a, the second metal film 232b, and the wiring 270 provided on the upper surface of the submount 230 are omitted. FIG. 10 is an enlarged top view of the light-emitting device 200 shown in FIG. 3, with the light-emitting element 220 and the wavelength conversion member 240 and their vicinity enlarged.

[0015] The light-emitting device 200 according to the present embodiment includes a base portion 211, one or more light-emitting elements 220, and a wavelength conversion member 240. In the illustrated example, the light-emitting device 200 further includes a frame portion 212, a lid portion 213, a submount 230, a protective element 250, and wiring 270. Note that the light-emitting device 200 does not necessarily include all of these components.

[0016] Each component of the light-emitting device 200 will be described.

[0017] (Base portion 211) The base portion 211 has an upper surface 211a and a lower surface 211b. The base portion 211 has a rectangular shape when viewed from above. This rectangle may have a long side and a short side. However, the shape of the base portion 211 when viewed from above does not have to be rectangular. Unless otherwise specified, a square may be included in the definition of a rectangle.

[0018] The base 211 can be formed using, for example, a metal as the main material. For example, copper, copper alloys, etc., can be used as the metal. However, the base 211 may also be formed from a main material other than metal, for example, from ceramics.

[0019] (Frame section 212) The frame portion 212 has an upper surface 212a, a lower surface 212b, one or more inner surfaces 212c, and one or more outer surfaces 212d. The frame portion 212 is, for example, rectangular in shape when viewed from above. One or more inner surfaces 212c of the frame portion 212 intersect with the upper surface 212a and extend downward from the upper surface 212a. One or more outer surfaces 212d of the frame portion 212 intersect with the upper surface 212a and the lower surface 212b of the frame portion 212.

[0020] The frame portion 212 may further have a stepped portion 214 having an upper surface 214a located above the upper surface 211a of the base portion 211 and below the upper surface 212a of the frame portion 212. The stepped portion 214 further has an inner surface that intersects the upper surface 214a and extends downward. The upper surface 214a intersects with one or more inner surfaces 212c of the frame portion 212. The upper surface 214a may be parallel to, for example, the upper surface 211a of the base portion 211. The inner surface of the stepped portion 214 intersects with, for example, the upper surface 211a of the base portion 211. In the illustrated example, the stepped portion 214 is provided along two opposing inner surfaces 212c in a top view. The stepped portion 214 may be provided along only one of the inner surfaces 212c. Furthermore, the frame portion 212 does not necessarily have to have a stepped portion 214.

[0021] One or more metal films may be provided on the upper surface 214a of the stepped portion 214. Furthermore, one or more metal films may be provided on the lower surface 211b of the base portion 211 and / or the lower surface 212b of the frame portion 212. The one or more metal films provided on the upper surface 214a of the stepped portion 214 and the metal films provided on the lower surface 211b and / or lower surface 212b can be electrically connected, for example, through vias. Examples of metal films that can be used include Ni / Au (metal films stacked in the order of Ni, Au) and Ti / Pt / Au (metal films stacked in the order of Ti, Pt, Au).

[0022] The stepped portion 214 may further have a lower surface 214b that intersects with the inner surface of the stepped portion 214. The lower surface 214b may be a plane parallel to the upper surface 214a. The lower surface 214b is located above the lower surface 212b of the frame portion 212. The lower surface 214b of the stepped portion 214 joins with the upper surface 211a of the base portion 211. In the illustrated example, the frame portion 212 further has a side surface that intersects with the lower surface 214b and extends downward. The side surface intersects with the lower surface 212b of the frame portion 212. The side surface may also be in contact with the side surface of the base portion 211.

[0023] The base portion 211 and the frame portion 212 form a concave shape that is recessed from the upper surface 212a of the frame portion 212 toward the upper surface 211a of the base portion 211. The concave shape is formed on the inside of the outer shape of the frame portion 212 when viewed from above. When viewed from above, the upper surface 211a of the base portion 211 is surrounded by a frame formed by one or more inner surfaces 212c of the frame portion 212 and / or the inner surface of the stepped portion 214. The outer shape of this frame is a rectangle with a long side and a short side. In the illustrated example, the base portion 211 and the frame portion 212 are formed separately and then joined together. The base portion 211 and the frame portion 212 may be formed integrally, which will be explained in the modified example.

[0024] The frame portion 212 can be formed using a different material as its main material, for example, than the base portion 211. Examples of main materials for forming the frame portion 212 include ceramics. For example, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide can be used as ceramics.

[0025] (Lid part 213) The lid 213 has an upper surface 213a, a lower surface 213b, and one or more side surfaces 213c that intersect the upper surface 213a and the lower surface 213b. The one or more side surfaces 213c connect the outer edge of the upper surface 213a and the outer edge of the lower surface 213b. The lid 213 is, for example, a rectangular parallelepiped or a cube. In this case, both the upper surface 213a and the lower surface 213b of the lid 213 are rectangular, and the lid 213 has four rectangular side surfaces 213c.

[0026] However, the lid 213 is not limited to a rectangular prism or a cube. In other words, the lid 213 is not limited to a rectangle when viewed from above, and can be any shape such as a circle, ellipse, or polygon.

[0027] The lid portion 213 is supported by the frame portion 212. The lid portion 213 is positioned above the upper surface 211a of the base portion 211. The outer periphery of the lower surface 213b of the lid portion 213 is joined, for example, to the upper surface 212a of the frame portion 212. By joining the lid portion 213 to the frame portion 212, a sealed space is formed surrounded by the base portion 211, the frame portion 212, and the lid portion 213.

[0028] The lid portion 213 has a light-transmitting region that transmits light of a predetermined wavelength. The light-transmitting region constitutes at least a part of the upper surface 213a and the lower surface 213b of the lid portion 213. The light-transmitting region of the lid portion 213 can be formed using, for example, sapphire as the main material. Sapphire is a material with relatively high transmittance and relatively high strength. In addition to sapphire, other translucent materials such as quartz, silicon carbide, or glass may be used as the main material for the light-transmitting region of the lid portion 213. The parts of the lid portion 213 other than the light-transmitting region may be formed integrally with the light-transmitting region using the same material.

[0029] (Light-emitting element 220) In the illustrated example of the light-emitting device 200, one light-emitting element 220 is mounted. The light-emitting device 200 may be equipped with multiple light-emitting elements. The light-emitting element 220 is, for example, a semiconductor laser element. The light-emitting element 220 is not limited to a semiconductor laser element, but may also be, for example, a light-emitting diode (LED) or an organic light-emitting diode (OLED). In the light-emitting device 200 illustrated exemplarily in Figures 1 to 5, and Figures 9 and 10, a semiconductor laser element is used as the light-emitting element 220.

[0030] The light-emitting element 220 has, for example, a rectangular shape when viewed from above. The side where it intersects with one of the two shorter sides of the rectangle becomes the light-emitting end face from which light is emitted. The top and bottom surfaces of the light-emitting element 220 have a larger area than the light-emitting end face.

[0031] A metal film 221 may be provided on the upper surface of the light-emitting element 220. The metal film 221 may have, for example, wiring for electrical connection with other components. In the illustrated example, the metal film 221 provided on the upper surface of the light-emitting element 220 does not cover the entire upper surface of the light-emitting element 220. The metal film 221 is provided so as to extend in the direction of the long side of the upper surface of the light-emitting element 220. Note that the metal film 221 does not necessarily have to be provided on the upper surface of the light-emitting element 220.

[0032] Here, we will explain the case where the light-emitting element 220 is a semiconductor laser element. The light (laser light) emitted from the light-emitting element 220 has a broadened shape and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the exit end face. Here, FFP refers to the shape and light intensity distribution of the emitted light at a position away from the exit end face.

[0033] Based on the elliptical light emitted from the light-emitting element 220, the direction passing through the major axis of the ellipse is defined as the fast axis direction of the FFP, and the direction passing through the minor axis of the ellipse is defined as the slow axis direction of the FFP. The fast axis direction of the FFP in the light-emitting element 220 may coincide with the stacking direction in which the multiple semiconductor layers, including the active layer of the light-emitting element 220, are stacked.

[0034] Furthermore, based on the light intensity distribution of the FFP of the light-emitting element 220, 1 / e of the peak intensity value 2 Light with the above intensity will be called the main portion of light. Also, in this light intensity distribution, 1 / e 2 The angle corresponding to the intensity of the FFP is called the spreading angle. The spreading angle of the FFP in the fast axis direction is greater than the spreading angle of the FFP in the slow axis direction.

[0035] Furthermore, the light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, will be referred to as light traveling along the optical axis, or light passing through the optical axis. The optical path of the light traveling through the center of the elliptical shape of the FFP will also be referred to as the optical axis of that light.

[0036] As the light-emitting element 220, a light-emitting element that emits blue light can be used. "Light-emitting element that emits blue light" refers to a light-emitting element whose emitted light peak wavelength is in the range of 405 nm to 494 nm. Furthermore, it is preferable to use a light-emitting element 220 whose emitted light peak wavelength is in the range of 430 nm to 480 nm. Examples of such light-emitting elements 220 include semiconductor laser elements containing nitride semiconductors. For example, GaN, InGaN, or AlGaN can be used as nitride semiconductors.

[0037] The emission peak of the light emitted from the light-emitting element 220 is not limited to this. For example, the light emitted from the light-emitting element 220 may be blue light, as well as visible light including green light and red light having wavelengths outside the aforementioned wavelength range, ultraviolet light, and infrared light.

[0038] (Submount 230) The submount 230 is, for example, constructed in the shape of a rectangular parallelepiped and has a bottom surface, a top surface, and one or more sides. The submount 230 has the smallest width in the vertical direction. Note that the shape is not limited to a rectangular parallelepiped. The submount 230 is formed using, for example, aluminum nitride or silicon carbide, but other materials may be used.

[0039] In the illustrated example, a first metal part 231a is provided on the upper surface of the submount 230, and a second metal part 231b is provided on the lower surface. Examples of materials for forming the first metal part 231a and the second metal part 231b include metals such as copper. In a top view, the area of ​​the first metal part 231a is smaller than the area of ​​the second metal part 231b. The first metal part 231a is provided on a part of the upper surface of the submount 230. The first metal part 231a is not provided on the entire upper surface of the submount 230. In the illustrated example, the first metal part 231a is rectangular in a top view. If the upper surface of the submount 230 is rectangular, the first metal part 231a is provided along a part of the direction of the longer side of the rectangle. The first metal part 231a is located closer to one of the two opposing shorter sides of the rectangle. Furthermore, the second metal part 231b is provided on the lower surface of the submount 230. The second metal portion 231b, when viewed from above, is located directly beneath the entire first metal portion 231a via the submount 230, and directly beneath at least a portion of the second metal film 232b, which will be described later.

[0040] A first metal film 232a is provided on the first metal part 231a. The first metal film 232a is provided, for example, on a part of the upper surface of the first metal part 231a. In the illustrated example, the first metal film 232a is positioned so as to be sandwiched between the areas of the first metal part 231a where the first metal film 232a is not provided, when viewed from above. When viewed from above, the area of ​​the first metal film 232a is smaller than the area of ​​the areas of the first metal part 231a where the first metal film is not provided. Furthermore, a second metal film 232b is provided on the upper surface of the submount 230 in an area where the first metal part 231a is not provided. When viewed from above, the area of ​​the second metal film 232b is larger than the area of ​​the first metal film 232a. The first metal film 232a and the second metal film 232b are formed from a metal such as gold.

[0041] Although the metal parts and metal films provided on the submount 230 have been described, for example, the metal parts may not be provided, and only metal films may be provided. However, by providing metal parts on the upper and lower surfaces of the submount, heat dissipation can be improved. In particular, heat from the member positioned directly above the first metal part 231a can be efficiently dissipated. Furthermore, the first metal part 231a and the second metal part 231b are thicker in the direction perpendicular to the upper surface of the submount than the first metal film 232a and the second metal film 232b.

[0042] (Wavelength conversion member 240) The wavelength conversion member 240 has a wavelength conversion section 241 and a surrounding section 242. The wavelength conversion section 241 has an upper surface 241a, a lower surface 241b which is the opposite surface of the upper surface 241a, and a plurality of side surfaces. Figure 6 is a perspective view showing an example of the wavelength conversion section. In the example of Figure 6, the wavelength conversion section 241 has a plurality of side surfaces, namely an incident side surface 241i, a first side surface 241c, a second side surface 241d, a third side surface 241e, and a fourth side surface 241f.

[0043] The first side 241c, the second side 241d, the third side 241e, and the fourth side 241f are connected to the outer edge of the upper surface 241a and the outer edge of the lower surface 241b. The third side 241e is connected to the first side 241c and the fourth side 241f, respectively. The fourth side 241f is connected to the second side 241d and the third side 241e, respectively. The first side 241c and the fourth side 241f are not connected. The second side 241d and the third side 241e are not connected.

[0044] The first side surface 241c and the second side surface 241d are connected to each other on the upper side, and each is connected to the incident side surface 241i on the lower side. The first side surface 241c and the second side surface 241d are connected to each other above the midpoint between the upper surface 241a and the lower surface 241b in a direction perpendicular to the upper surface 241a. They are also connected to the incident side surface 241i below the midpoint. For example, this midpoint is the uppermost point of the incident side surface 241i. The lower side of the incident side surface 241i is connected to the outer edge of the lower surface 241b. The lower side of the incident side surface 241i is recessed inward from the connection point between the first side surface 241c and the second side surface 241d. In other words, the lower side of the incident side surface 241i is recessed from the connection point between the first side surface 241c and the second side surface 241d toward the connection point between the third side surface 241e and the fourth side surface 241f.

[0045] In a top view, the first side 241c and the fourth side 241f may be parallel. Also, in a top view, the second side 241d and the third side 241e may be parallel. Furthermore, in a top view, the first side 241c and the second side 241d, the first side 241c and the third side 241e, the third side 241e and the fourth side 241f, and the fourth side 241f and the second side 241d may each be perpendicular.

[0046] Since the wavelength conversion unit 241 is irradiated with light, it is preferable that the base material of the wavelength conversion unit 241 be formed using an inorganic material that is not easily decomposed by light irradiation as the main material. The main material is, for example, ceramics. When the main material of the wavelength conversion unit 241 is ceramics, examples of ceramics include aluminum oxide, aluminum nitride, silicon oxide, yttrium oxide, zirconium oxide, or magnesium oxide. For the main ceramic material, it is preferable to select a material with a melting point of 1300°C to 2500°C so that the wavelength conversion unit 241 does not undergo deterioration such as deformation or discoloration due to heat. Here, the "main material" of a particular component is the material that accounts for the largest proportion by mass ratio or volume ratio in its constituent elements. Furthermore, the "main material" may also include cases where no other materials are included, that is, the constituent elements are formed only of the main material. Note that the wavelength conversion unit 241 may be formed using a material other than ceramics as the main material.

[0047] The wavelength conversion section 241 contains a phosphor. The wavelength conversion section 241 can be formed, for example, by sintering a phosphor with aluminum oxide or the like. The phosphor content can be 0.05% to 50% by volume relative to the total volume of the ceramics. Alternatively, for example, ceramics consisting substantially only of phosphor, obtained by sintering phosphor powder, may be used. Furthermore, the wavelength conversion section 241 may be formed from a single crystal of phosphor.

[0048] Examples of phosphors include cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), europium-activated silicate ((Sr,Ba)2SiO4), α-sialon phosphors, and β-sialon phosphors. Among these, YAG phosphors exhibit good heat resistance.

[0049] The enclosing portion 242 has an upper surface 242a, a first lower surface 242b and a second lower surface 242c which are opposite to the upper surface 242a, a plurality of inner surfaces connecting the inner edge of the upper surface 242a and the inner edge of the first lower surface 242b, and a plurality of outer surfaces connecting the outer edge of the upper surface 242a and the outer edge of the first lower surface 242b and / or the outer edge of the second lower surface 242c. The enclosing portion 242 further has a connecting surface 242d which intersects with the first lower surface 242b and connects with the second lower surface 242c. The second lower surface 242c and the connecting surface 242d are connected via a rounded edge in a side view. Preferably, the reflectivity to light of the plurality of inner surfaces of the enclosing portion 242 is 80% or more and 100% or less.

[0050] The surrounding portion 242 is provided around the wavelength conversion portion 241. The surrounding portion 242 covers the sides of the wavelength conversion portion 241 other than the incident side 241i. The incident side 241i is exposed and not covered by the surrounding portion 242. In the illustrated example, the incident side 241i is connected to the connecting side 242d of the surrounding portion 242 and is located on the same plane. Multiple inner surfaces of the surrounding portion 242 cover the first side 241c, second side 241d, third side 241e, and fourth side 241f of the wavelength conversion portion 241.

[0051] The upper surface 242a of the surrounding portion 242 lies on the same plane as the upper surface 241a of the wavelength conversion portion 241. Similarly, the first lower surface 242b of the surrounding portion 242 lies on the same plane as the lower surface 241b of the wavelength conversion portion 241. Note that the upper surface 242a does not necessarily have to be on the same plane as the upper surface 241a of the wavelength conversion portion 241. Similarly, the first lower surface 242b of the surrounding portion 242 does not necessarily have to be on the same plane as the lower surface 241b of the wavelength conversion portion 241. In the illustrated example, in a top view, the four sides where the four outer surfaces of the surrounding portion 242 intersect with the upper surface 242a are all nonparallel to the four sides where the upper surface 241a of the wavelength conversion portion 241 intersects with the four sides. Here, "nonparallel" means that two sides of the object have an angle of 5 degrees or more.

[0052] The surrounding portion 242 further includes a protruding portion 242t. In this specification, the portion of the surrounding portion 242 that is above the incident side 241i and protrudes from the incident side 241i in a direction perpendicular to the incident side 241i is referred to as the "protruding portion 242t". The protruding portion 242t also protrudes outward from the incident side 241i.

[0053] The protruding portion 242t has at least a part of the upper surface 242a of the surrounding portion 242, a second lower surface 242c, and a plurality of outer surfaces connecting the upper surface 242a and the second lower surface 242c. The protruding portion 242t does not have a first lower surface 242b. The protruding portion 242t is the portion located on the side that does not come into contact with the first surface 241c and the second surface 241d, when the surrounding portion 242 is divided by a plane parallel to the planar portion of the incident surface 241i and passing through the connection portion between the first surface 241c and the second surface 241d, excluding the connection portion.

[0054] In a top view, the protrusion extends beyond the incident side 241i across both ends of the wavelength conversion member 240 in the planar direction of the incident side 241i and the connecting side 242d. Of the multiple outer surfaces of the protrusion 242t, the outer surface that faces the same direction as the incident side 241i and / or the connecting side 242d is called the protruding surface 242e. In the illustrated example, the protruding surface 242e is parallel to the incident side 241i and the connecting side 242d. The protruding surface 242e is, for example, perpendicular to the first lower surface 242b and the upper surface 242a. Here, "parallel" means that the angle at which the two surfaces of the object intersect is within ±5 degrees. Here, "perpendicular" means that the angle at which the two surfaces of the object intersect is between 85 degrees and 95 degrees. In all cases, even if the faces of the object do not intersect, if the virtual faces that are extensions of each face intersect, the angle at which these two virtual faces intersect can be considered as the "angle at which the two faces of the object intersect."

[0055] The surrounding portion 242 is, for example, a sintered body formed primarily from ceramics. Examples of ceramics that can be used as the main material include aluminum oxide, aluminum nitride, silicon oxide, yttrium oxide, zirconium oxide, and magnesium oxide. However, the surrounding portion 242 does not necessarily have to be made primarily from ceramics. The surrounding portion 242 may be formed using, for example, metal, a composite of ceramics and metal, or resin.

[0056] In the wavelength conversion member 240, the wavelength conversion section 241 and the surrounding section 242 can be formed integrally. Alternatively, the wavelength conversion section 241 and the surrounding section 242 may be formed separately and then joined together to form the wavelength conversion member 240. The wavelength conversion section 241 and the surrounding section 242 are, for example, a single sintered body.

[0057] The wavelength conversion member 240 may have an anti-reflective coating on its upper surface. Here, the upper surface of the wavelength conversion member 240 refers to the upper surface 241a of the wavelength conversion section 241 and / or the upper surface 242a of the surrounding section 242. In the illustrated example, the upper surface of the wavelength conversion member 240 includes the upper surfaces 241a and 242a. In other words, the anti-reflective coating can be provided on the upper surface 241a of the wavelength conversion section 241 and / or the upper surface 242a of the surrounding section 242. The wavelength conversion member 240 also has a metal film on its lower surface. Here, the lower surface of the wavelength conversion member 240 refers to the lower surface 241b of the wavelength conversion section 241 and / or the first lower surface 242b of the surrounding section 242. In the illustrated example, the lower surface of the wavelength conversion member 240 includes the lower surface 241b and the first lower surface 242b. The lower surface of the wavelength conversion member 240 does not include the second lower surface 242c of the surrounding portion 242. In other words, the lower surface 241b of the wavelength conversion portion 241 and / or the first lower surface 242b of the surrounding portion 242 may have a metal film. The wavelength conversion member 240 may also have a reflective film on the incident side surface 241i.

[0058] (Protection element 250) The protective element 250 is a component for protecting a specific element, such as a semiconductor laser element. For example, the protective element 250 is a component for preventing excessive current from flowing through and damaging a specific element, such as a semiconductor laser element. As the protective element 250, for example, a Zener diode made of Si can be used. Alternatively, for example, the protective element 250 may be a component for measuring temperature to prevent the specific element from failing due to the temperature environment. A thermistor can be used as such a temperature measuring element. The temperature measuring element is preferably placed near the emission end face of the light-emitting element 220.

[0059] (Wiring 270) The wiring 270 is composed of a conductor having a linear shape with joints at both ends. In other words, the wiring 270 has joints at both ends of the linear portion for joining with other components. The wiring 270 is used for electrical connection between two components. As the wiring 270, for example, a metal wire can be used. Examples of metals include gold, aluminum, silver, copper, and tungsten.

[0060] (Light-emitting device 200) Next, the light-emitting device 200 will be described.

[0061] One or more light-emitting elements 220 are arranged on the upper surface 211a of the base 211. In the illustrated example, one light-emitting element 220 is arranged on the upper surface 211a. In a top view taken from the direction perpendicular to the upper surface 211a of the base 211, the light-emitting element 220 is further surrounded on the sides by a frame 212. Hereafter, "top view" refers to a "top view" in the direction perpendicular to the upper surface 211a of the base 211 unless otherwise specified. The light-emitting element 220 emits light that travels laterally. The light emitted from the light-emitting element 220 is, for example, blue light. However, the light emitted from the light-emitting element 220 is not limited to blue light. Also, in the illustrated example, the light-emitting element 220 is a semiconductor laser element.

[0062] The light-emitting element 220 is placed on a submount 230 positioned on the upper surface 211a of the base 211. More specifically, it is positioned in the region on the upper surface of the submount 230 where the first metal portion 231a is provided. Even more specifically, the light-emitting element 220 is bonded to the first metal film 232a provided on the first metal portion 231a, for example, via a metal adhesive. The submount 230 is also bonded to the upper surface 211a of the base 211 on its lower side, where the second metal portion 231b is provided, for example, via a metal adhesive. An example of a metal adhesive used for these bonding is AuSn.

[0063] The light-emitting element 220 is positioned such that its emission end face faces the same direction as one side of the submount 230. Furthermore, the emission end face of the light-emitting element 220 may be parallel or perpendicular to, for example, one inner surface 212c or one outer surface 212d of the frame 212.

[0064] The wavelength conversion member 240 is positioned on the upper surface 211a of the base 211. The wavelength conversion member 240 is positioned to the side of the light-emitting element 220. More specifically, the wavelength conversion member 240 is positioned where light emitted from the light-emitting element 220 and traveling laterally is incident. Furthermore, the wavelength conversion member 240 is positioned on the optical axis of the light emitted laterally from the light-emitting element 220. In the illustrated example, the direction of the optical axis of the emitted light is not converted between the time it is emitted from the light-emitting element 220 and the time it is incident on the wavelength conversion section 241 of the wavelength conversion member 240. In the illustrated example, no other members are interposed between the light-emitting element 220 and the wavelength conversion section 241. This makes it possible to miniaturize the light-emitting device 200. Note that other members such as a collimating lens may be placed between the light-emitting element 220 and the wavelength conversion section 241.

[0065] The wavelength conversion member 240 is positioned on the upper surface 211a of the base, for example, via a submount 230. In the illustrated example, the wavelength conversion member 240 is positioned on the submount on which the light-emitting element 220 is positioned. By positioning the light-emitting element 220 and the wavelength conversion member 240 on the same submount 230, the light-emitting element 220 and the wavelength conversion member 240 can be positioned close together. As a result, the emitted light with a broad spread from the light-emitting element 220 can be efficiently incident on the wavelength conversion member 240. Furthermore, the light-emitting device 200 can be miniaturized. Note that the wavelength conversion member 240 may be positioned on a submount different from the submount on which the light-emitting element 220 is positioned. In that case, the upper surface of the submount on which the wavelength conversion member 240 is positioned is not above the lower surface of the light-emitting element 220.

[0066] In the illustrated example, the wavelength conversion member 240 is positioned in the region of the upper surface of the submount 230 where the first metal portion 231a is not provided. More specifically, the metal film provided on the lower surface of the wavelength conversion member 240 and the second metal film 232b provided on the upper surface of the submount 230 are joined together, for example, via a metal adhesive. An example of a metal adhesive is AuSn. On the lower surface of the submount 230, a portion of the second metal portion 231b is provided in at least a portion of the region directly below the wavelength conversion member 240. In other words, the lower surface of the wavelength conversion member 240 and the second metal film 232b overlap with the second metal portion 231b when viewed from above.

[0067] The wavelength conversion member 240 has an incident side surface into which light emitted from the output end face of the light-emitting element 220 and traveling laterally is incident, and an output surface from which the wavelength-converted light is emitted. In the illustrated example, the incident side surface 241i and the top surface 241a of the wavelength conversion unit 241 are the incident side surface and the output surface, respectively. The top surface 241a of the wavelength conversion unit 241 emits upward the wavelength-converted light from the light-emitting element by the wavelength conversion unit 241. The surrounding portion 242 of the wavelength conversion member 240 is provided around the wavelength conversion unit 241. The surrounding portion 242 reflects light that is incident on the wavelength conversion unit 241 and further incident on the inner surface of the surrounding portion 242. The light reflected by the surrounding portion 242 travels within the wavelength conversion unit 241. This allows light incident on the incident side surface 241i to be efficiently emitted from the output surface, the top surface 241a.

[0068] In a view from below, the extension of the edge where the first side surface 241c and the bottom surface 241b of the wavelength conversion section 241 intersects and the extension of the edge where the second side surface 241d and the bottom surface 241b intersect intersect in a second direction, which is opposite to the direction of light propagation from the incident side surface 241i. In other words, the two extensions intersect in a second direction, which is on the side of the incident side surface 241i, i.e., on the side of the light-emitting element 220. Also, in a view from below, the third side surface 241e and the fourth side surface 241f of the wavelength conversion section 241 intersect in a first direction, which is on the side of the direction of light propagation from the incident side surface 241i, i.e., on the side opposite to the light-emitting element 220.

[0069] Here, we will explain the terms "first direction" and "second direction." In this specification, the direction in which light travels through the optical axis of the light emitted from the light-emitting element 220 is called the first direction. In the illustrated example, the first direction is defined as the direction in which light travels through the optical axis of the light emitted from the light-emitting element 220 and the virtual line OA, which is its virtual extension. In this specification, when comparing two or more members, if one member is located on the positive side of the first direction than the other member, then one member is said to be located on the "first direction side" than the other member. Conversely, the direction opposite to the first direction is called the "second direction," and if one member is located on the positive side of the second direction than the other member, then one member is said to be located on the "second direction side" than the other member. In the illustrated example, the wavelength conversion member 240 is located on the first direction side with respect to the light-emitting element 220, and the light-emitting element 220 is located on the second direction side with respect to the wavelength conversion member 240.

[0070] The protruding portion 242t of the surrounding portion 242 of the wavelength conversion member 240 protrudes above the light-emitting element 220 and in a second direction (towards the light-emitting element 220) beyond the incident side surface 241i. Furthermore, the protruding portion 242t protrudes in a second direction (towards the light-emitting element 220) beyond the end of the lower surface of the wavelength conversion member 240 in the second direction (towards the light-emitting element 220). More specifically, it protrudes in a second direction (towards the light-emitting element 220) beyond the lower surface 241b of the wavelength conversion portion 241 and / or the end of the first lower surface 242b of the surrounding portion 242 on the light-emitting element side. In a top view, the protruding portion 242t is positioned to overlap with the exit end surface 220a of the light-emitting element 220. More specifically, in a top view, the exit end surface 220a overlaps with the second lower surface 242c of the protruding portion 242t. Furthermore, the protruding surface 242e of the protruding portion 242t is located on the second direction side of the emission end surface 220a. In a top view, the emission end surface 220a of the light-emitting element 220 is hidden from view by the protruding portion 242t.

[0071] Of the light emitted from the light-emitting element 220, the main portion of the light travels laterally and is incident on the wavelength conversion unit 241. More specifically, the region in which the main portion of the light emitted from the light-emitting element 220 irradiates the wavelength conversion unit 241 is included in the incident side surface 241i. The wavelength conversion unit 241 converts the wavelength of the incident light and emits the wavelength-converted light upward from the upper surface 241a. On the other hand, some of the light leaking from the active layer of the light-emitting element 220, and / or some of the light other than the main portion of the light emitted from the light-emitting element 220, can become leaky light traveling upward from the exit end surface 220a and its vicinity. Since the leaky light does not enter the wavelength conversion unit 241, it travels upward without wavelength conversion. As described above, by positioning the protruding portion 242t of the surrounding portion 242 so as to overlap the output end face 220a of the light-emitting element 220 when viewed from above, the stray light traveling upward can be reflected by the protruding portion 242t and prevented from being emitted outside the light-emitting device 200. This prevents stray light that does not enter the wavelength conversion portion 241 from mixing with the light emitted from the light-emitting device 200 that enters the wavelength conversion portion 241. As a result, a light-emitting device 200 can be realized in which the influence of light not used as the emitted light of the light-emitting element 220 on the light that enters the wavelength conversion member 240 and is extracted is suppressed.

[0072] Furthermore, it is preferable that the protrusion 242t is positioned so as to overlap the entire output end face 220a of the light-emitting element 220 when viewed from above. Specifically, the protrusion surface 242e is located second to the output end face 220a when viewed from above. Also, in the direction parallel to the output end face 220a when viewed from above, the length of the protrusion surface 242e is longer than the total length of the output end face 220a. By arranging it in this way, the effect of suppressing the aforementioned leaked light can be improved. Furthermore, when the light-emitting device 200 comprises multiple light-emitting elements 220, it is preferable that the output end faces 220a of all light-emitting elements 220 and the protrusion 242t overlap when viewed from above. This makes it possible to suppress leaked light traveling upward from the output end faces 220a of all light-emitting elements 220. Furthermore, when comprising multiple light-emitting elements 220, the protrusion 242t overlaps the entire output end face 220a of each light-emitting element 220 when viewed from above. Specifically, the protruding surface 242e is located on the second direction side of the entire output end face 220a. Also, in a top view, in a direction parallel to the output end face 220a, the length of the protruding surface 242e is longer than the straight line connecting the respective endpoints of the output end faces 220a of the light-emitting elements 220 located at both ends. Although not shown in the diagram, the protruding surface 242e is longer than the longest of the aforementioned "straight lines connecting the endpoints".

[0073] Here, as a specific example, we will explain the case where the light emitted from the light-emitting element 220 is blue light. The main portion of the light emitted from the light-emitting element 220 is emitted to the side and incident on the wavelength conversion unit 241. A portion of the light incident on the wavelength conversion unit 241 is wavelength-converted to, for example, yellow light and emitted from the upper surface 241a of the wavelength conversion unit 241. The yellow light mixes with the blue light that is emitted from the upper surface 241a without wavelength conversion, resulting in, for example, white light, which is emitted from the light-emitting device 200. On the other hand, the leaked light incident upward from the emission end surface 220a of the light-emitting element 220 is blue light and may be emitted from the light-emitting device 200 and mixed with the white light. White light mixed with leaked light may result in color unevenness. By positioning the protruding portion 242t of the surrounding portion 242 so as to overlap with the emission end surface 220a when viewed from above, it is possible to suppress the interference of leaked light with the light emitted from the upper surface 241a of the wavelength conversion portion 241, thereby preventing color mixing and suppressing the occurrence of color unevenness.

[0074] As shown in Figures 7 and 8, the wavelength conversion unit 241 is arranged such that, for example, in a top view, the optical axis of the light emitted from the light-emitting element 220 passes through the incident side 241i. In a top view, the upper surface 241a of the wavelength conversion unit 241 may be symmetric with respect to a virtual line OA passing through the optical axis until it is incident on the incident side 241i. Similarly, in a top view, the upper surface of the surrounding unit 242 may be symmetric with respect to a virtual line OA.

[0075] In the illustrated example, the imaginary line OA passes through the midpoint of the incident side surface 241i in a direction perpendicular to the upper surface 211a and intersects with one of the inner surfaces 212c of the frame portion 212. With this structure, even if the wavelength conversion unit 241 is damaged and light emitted laterally from the light-emitting element 220 no longer enters the wavelength conversion unit 241, the light emitted laterally from the light-emitting element 220 will still hit the frame portion 212 located in its optical path. For example, by making the portion of the frame portion 212 that intersects with the imaginary line OA and its vicinity a light-shielding portion made of a light-absorbing material, the light will be absorbed by the light-shielding portion, reducing the risk of it emitting outside the light-emitting device 200.

[0076] In a top view, in a direction parallel to the virtual line OA, the length L1 from the center of the wavelength conversion section 241 to the tip of the projection 242t is longer than the length L2 from the center of the wavelength conversion section 241 to the end of the surrounding section 242 opposite to the projection 242t. Here, the center of the wavelength conversion section 241 is the midpoint of the line segment connecting the point where the first side surface 241c and the second side surface 241d intersect and the point where the third side surface 241e and the fourth side surface 241f intersect, in a top view. The tip of the projection 242t is any point selected from the side where the projection surface 242e and the top surface 242a intersect. Since length L1 is longer than length L2, the length of the projection 242t toward the second direction from the emission end surface 220a can be increased while maintaining the length of the wavelength conversion section 241 in the direction of the virtual line OA, thereby further reducing the amount of stray light emitted to the outside of the light-emitting device 200. Note that length L1 may be the same as length L2.

[0077] Furthermore, in a top view, the length L3 from the emission end face 220a of the light-emitting element 220 to the tip of the protrusion 242t in a direction parallel to the imaginary line OA is preferably 0 μm or more and 400 μm or less. By setting the length L3 to 0 μm or more, the protrusion 242t can be overlapped with the emission end face 220a, thereby suppressing light leakage. Also, by setting the length L3 to 400 μm or less, an area can be secured for arranging the wiring 270 for connecting to the light-emitting element 220.

[0078] Light emitted from the light-emitting element 220 travels toward the wavelength conversion member 240 and enters the incident side surface 241i of the wavelength conversion unit 241, which is exposed from the surrounding portion 242. At least a portion of the incident side surface 241i of the wavelength conversion unit 241 is located below the virtual line OA. This allows the light emitted from the light-emitting element 220 that travels below the virtual line OA to be efficiently captured by the wavelength conversion unit 241 from the incident side surface 241i. Based on the light incident on the incident side surface 241i, light is emitted from the upper surface 241a of the wavelength conversion unit 241. Here, the light emitted based on the incident light is, for example, the incident light, or for example, the light obtained by wavelength conversion of the incident light.

[0079] The exit end face 220a of the light-emitting element 220 faces the incident side face 241i of the wavelength conversion section 241. The exit end face 220a of the light-emitting element 220 is, for example, parallel to the incident side face 241i of the wavelength conversion section 241. The length between the incident side face 241i of the wavelength conversion section 241 and the exit end face 220a is, for example, 20 μm or more and 1000 μm or less. The length from the incident side face 241i to the end of the protruding portion 242t on the second direction side (light-emitting element 220 side) is, for example, 50 μm or more and 800 μm or less. More preferably, it is 100 μm or more and 500 μm or less. By setting it to 100 μm or more, the effect of the protruding portion 242t in shielding leaked light from the exit end face 220a that advances upward can be improved. Also, by setting it to 500 μm or less, the area of ​​the upper surface of the light-emitting element 220 to which the wiring 270 is joined can be secured.

[0080] Light emitted from the light-emitting element and incident on the wavelength conversion unit 241 from the incident side 241i is reflected by the inner surface of the surrounding unit 242 and travels toward the upper surface 241a of the wavelength conversion unit 241, where it is emitted. This allows light to be efficiently emitted from the upper surface 241a.

[0081] One of the two sides of the light-emitting element 220 that intersects the exit end face 220a faces one of the two opposing inner surfaces 212c or the side of the stepped portion 214 provided along one of the inner surfaces 212c. One of the two sides of the light-emitting element 220 that intersects the exit end face 220a is parallel to, for example, one of the inner surfaces 212c or the side of the stepped portion 214 provided along one of the inner surfaces 212c. The other side of the two sides of the light-emitting element 220 that intersects the exit end face faces the other inner surface 212c or the side of the stepped portion 214 provided along the other inner surface 212c. The other side of the two sides of the light-emitting element 220 that intersects the exit end face is parallel to, for example, the other inner surface 212c or the side of the stepped portion 214 provided on the other inner surface 212c. The upper surface 214a of the stepped portion 214 is positioned lower than the height of the upper surface 241a of the wavelength conversion portion 241, for example, with reference to the upper surface 211a of the base portion 211. By setting it to this height, light emitted upward from the upper surface 241a does not directly irradiate the stepped portion 214.

[0082] The upper surface 214a of the stepped portion 214 is, for example, higher than the height of the upper surface 211a of the base portion 211, compared to the height of the upper surface 220 of the light-emitting element 220.

[0083] In the light-emitting device 200, the light-emitting element 220 and the protective element 250 are electrically connected to the base 211 and / or frame 212 by wiring 270. The wiring 270 in the illustrated light-emitting device 200 is an example where the protective element 250 is a Zener diode, but if the protective element 250 is a temperature measuring element, the wiring connection may differ from that shown in the figure.

[0084] The light-emitting element 220 is electrically connected to a metal film provided on the upper surface 214a of the stepped portion 214 via wiring 270. In the illustrated example, one end of the wiring 270 is joined to the metal film 221 provided on the upper surface of the light-emitting element 220. The light-emitting device 200 has, for example, a further plurality of wirings 270. The plurality of wirings 270 include wiring 270 whose one end is joined to the upper surface 214a of the stepped portion 214 and whose other end is joined to the submount 230. In the illustrated example, the other end is joined to the upper surface of the first metal portion 231a provided on the submount.

[0085] The wiring 270 for connecting to the light-emitting element 220 is joined to the upper surface of the light-emitting element 220 and to the metal film provided on the upper surface 214a of the stepped portion 214, on the second direction side of the center of the light-emitting element 220 (opposite side of the wavelength conversion member 240). By arranging the wiring 270 for connecting to the light-emitting element 220 in this way, the area in which the wiring 270 and the protrusion 242t do not overlap when viewed from above can be expanded, thereby increasing the amount of protrusion of the protrusion 242t toward the second direction side (towards the light-emitting element 220).

[0086] For the electrical connection between the light-emitting element 220 and the external power supply, for example, a metal film provided on the lower surface 211b of the base 211 can be used. This allows the light-emitting element 220 and the external power supply to be electrically connected via a metal film on the upper surface 212a of the frame 212, which is electrically connected to a metal film provided on the upper surface 214a of the stepped portion 214 via a metal material provided in the via hole.

[0087] The lid portion 213 is positioned on the upper surface 212a of the frame portion 212. More specifically, the lid portion 213 is supported by the upper surface 212a of the frame portion 212 and positioned above the light-emitting element 220 surrounded by the frame portion 212. The outer periphery of the lower surface of the lid portion 213 is joined to, for example, the upper surface 212a of the frame portion 212. For example, a metal film provided on the outer periphery of the lower surface of the lid portion 213 and a metal film provided on the upper surface 212a of the frame portion 212 are joined and fixed via Au-Sn or the like.

[0088] The lid portion 213 is joined to the upper surface 212a of the frame portion 212, forming a sealed space in which the light-emitting element 220 and the wavelength conversion member 240 are arranged. This sealed space may also be formed in an hermetically sealed state. Hermetically sealing this sealed space can suppress the accumulation of organic matter and other particles on the emission end surface 220a of the light-emitting element 220.

[0089] The lid portion 213 has a light-transmitting region that allows light emitted from the upper surface 241a of the wavelength conversion unit 241 to pass through and exit to the outside. In other words, light emitted from the upper surface 241a of the wavelength conversion unit 241 towards the lid portion 213 may pass through the light-transmitting region of the lid portion 213 and exit to the outside of the light-emitting device 200. The entire lid portion 213 may be a light-transmitting region. The light-transmitting region of the lid portion 213 transmits 70% or more of the light emitted from the light-emitting element 220 and the light emitted from the wavelength conversion member 240.

[0090] (modified version) Next, a modified example of the light-emitting device 201 will be described with reference to Figures 1 to 3 and Figure 11.

[0091] Figure 1 is a perspective view of a modified light-emitting device 201 according to the first embodiment. Figure 2 is a perspective view of the light-emitting device 201 shown in Figure 1 with the cover portion 213 removed. Figure 3 is a top view of the light-emitting device 201 shown in Figure 2. Figure 11 is a cross-sectional view of the light-emitting device 201 along the cross-sectional line XI-XI in Figure 1.

[0092] In the modified light-emitting device 201, the base portion 211 and the frame portion 212 are integrally formed. The base portion 211 also has a protrusion 211t on its upper surface 211a side. In the illustrated example, the upper surface 211a of the base portion 211 includes the upper surface of the protrusion 211t and the upper surface located below the upper surface of the protrusion 211t. The light-emitting element 220 is directly placed on the upper surface of the protrusion 211t. The wavelength conversion member 240 is directly placed on the upper surface located below the upper surface of the protrusion 211t. The light-emitting element 220 and the wavelength conversion member 240 are not placed on a submount. Note that the base portion 211 does not necessarily have to have a protrusion 211t.

[0093] As the main material used for the integrally formed base portion 211 and frame portion 212, examples include ceramics. Examples of ceramics include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide. However, the main material forming the base portion 211 and frame portion 212 is not limited to ceramics and may be formed from a metal such as copper, for example.

[0094] <Second Embodiment> Next, the light-emitting device 300 according to the second embodiment will be described with reference to Figures 1, 12, and 13. The light-emitting device 300 according to the second embodiment differs from the light-emitting device 200 according to the first embodiment in that it includes a light-transmitting member 313 having a light-shielding film 380 on its lower surface 313b.

[0095] Figure 1 is a perspective view of the light-emitting device 300 according to the second embodiment and the light-emitting device 301 according to a modified example of the second embodiment. Figure 12 is an enlarged cross-sectional view of the light-emitting device 300 according to the second embodiment, showing the light-emitting element 220, the wavelength conversion member 240, the light-transmitting member 313 and its vicinity along the cross-sectional line XII-XII shown in Figure 1. Figure 13 is an enlarged cross-sectional view of the light-emitting device 301 according to a modified example of the second embodiment, showing the light-emitting element 220, the wavelength conversion member 240, the light-transmitting member 313 and its vicinity along the cross-sectional line XIII-XIII shown in Figure 1.

[0096] First, we will explain each component. Note that any content that overlaps with the first embodiment will be omitted as appropriate.

[0097] (Translucent member 313) The translucent member 313 is formed from a translucent main material. Here, "translucent" means that the transmittance of light of a specific wavelength is 80% or more. Examples of main materials for forming the translucent member 313 include sapphire, silicon oxide, silicon nitride, and other types of glass.

[0098] The translucent member 313 has an upper surface, a lower surface 313b, and one or more side surfaces that intersect the upper surface and the lower surface 313b. The one or more side surfaces connect the outer edge of the upper surface and the outer edge of the lower surface 313b. The translucent member 313 is, for example, a rectangular parallelepiped. However, the translucent member 313 is not limited to a rectangular parallelepiped and may have, for example, a polygonal prism shape.

[0099] The translucent member 313 is positioned above the wavelength conversion member 240 and the light-emitting element. Furthermore, in the illustrated example, the translucent member 313 is supported by the frame portion 212. More specifically, the translucent member 313 is joined to the upper surface 212a of the frame portion 212 at its lower surface 313b. Here, when the translucent member 313 is supported by the frame portion 212, the translucent member 313 may be referred to as the "lid portion." In this case, the "lid portion" corresponds to the "lid portion 213" in the first embodiment. The translucent member 313, the frame portion 212, and the base portion 211 form a sealing space in which the light-emitting element 220 and the wavelength conversion member 240 are sealed.

[0100] (Light-shielding film 380) The light-shielding film 380 may be provided on the upper and / or lower surface 313b of the light-transmitting member 313. In the example shown in Figures 12 and 13, the light-shielding film 380 is provided on the lower surface 313b of the light-transmitting member 313.

[0101] The light-shielding film 380 is formed from a material that reflects or absorbs incident light. The light-shielding film 380 may be a metal film formed from a metal. Examples of metal films that can be used include titanium, aluminum, gold, silver, copper, platinum, chromium, nickel, iron, zinc, cobalt, palladium, tantalum, tungsten, and alloys containing one or more metals selected from these. The material used as the light-shielding film 380 is not limited to a metal film, but can also be formed from a material that reflects or absorbs light, such as a resin, a dielectric film using oxides such as SiO2, Ta2O5, or TiO2, or a dielectric multilayer film.

[0102] (Light-emitting device 300) Next, the light-emitting device 300 according to the second embodiment will be described. Parts that overlap with the first embodiment will be omitted as appropriate, and the description will focus on the light-shielding film 380 and the wavelength conversion member 240.

[0103] In the light-emitting device 300 shown in Figure 12, similar to the first embodiment, the protruding portion 242t of the wavelength conversion member 240 and the output end face 220a of the light-emitting element 220 overlap when viewed from above. In the illustrated example, at least a portion of the light-shielding film 380 provided on the lower surface 313b of the light-transmitting member 313 overlaps with the protruding portion 242t. Because at least a portion of the light-shielding film 380 overlaps with the protruding portion 242t, even if some of the light leaking from near the output end face 220a of the light-emitting element 220 reaches above the wavelength conversion member 240, it is reflected / absorbed by the light-shielding film 380, thus suppressing emission to the outside of the light-emitting device 300. As a result, color unevenness is reduced, and a light-emitting device 300 with high uniformity of emitted light can be realized. In the illustrated example, the output end face 220a of the light-emitting element 220 and the light-shielding film 380 do not overlap when viewed from above.

[0104] In this embodiment, the lower surface 313b of the light-transmitting member 313 has a light-shielding region where the light-shielding film 380 is provided, and a light-transmitting region where the light-shielding film 380 is not provided. The light-transmitting region transmits light emitted from the upper surface 241a of the wavelength conversion unit 241. As shown in Figure 12, in a side view, the light-shielding region is located on a hypothetical straight line V1 (hereinafter referred to as the hypothetical line V1) connecting an arbitrary point on the edge where the emission end surface 220a and the upper surface of the light-emitting element 220 intersect with the end of the protruding portion 242t. No light-transmitting region is located on the hypothetical line V1. By providing the light-shielding film 380 in such a position, it is possible to suppress light emission from unintended areas of the light-emitting device 300. On the lower surface 313b of the light-transmitting member 313, the light-shielding region is located on the second direction side (towards the light-emitting element 220) from the hypothetical line V1. The light-shielding region and the light-transmitting region are located in this order on the first direction side (wavelength conversion member 240 side) of the virtual line V1. Note that a light-shielding region does not necessarily have to be provided on the first direction side (wavelength conversion member 240 side) of the virtual line V1. In addition, in the direction of the virtual line OA, the light-shielding region may be located on a straight line connecting an arbitrary point on the upper surface of the light-emitting element 220, which is 30 μm or more away from the exit end face 220a, and the end of the protruding portion 242t. By providing a light-shielding region in such a position, the shielding of leaked light from near the exit end face 220a can be further improved.

[0105] Next, a modified light-emitting device 301 will be described with reference to Figure 13. Unlike the light-emitting device 300 according to the second embodiment, the light-emitting device 301 shown in Figure 13 is arranged such that the protruding portion 242t of the wavelength conversion member 240 does not overlap with the emission end face 220a of the light-emitting element 220 when viewed from above. In this case, the light-shielding film 380 overlaps with the protruding portion 242t of the wavelength conversion member 240 at least in part when viewed from above. Also, the emission end face 220a of the light-emitting element 220 and the light-shielding film 380 overlap when viewed from above.

[0106] In Figure 13, a light-shielding region where the light-shielding film 380 is provided is located at a position through which a hypothetical straight line V2 (hereinafter referred to as the hypothetical line V2) connecting the upper end of the emission end face 220a of the light-emitting element 220 and the upper end of the side surface of the protruding part 242t located on the second direction side (light-emitting element 220 side) passes. No light-transmitting region is located on the hypothetical line V2. On the lower surface 313b of the light-transmitting member 313, a light-shielding region is located on the second direction side (light-emitting element 220 side) from the hypothetical line V2. The light-shielding region and the light-transmitting region are located on the first direction side (wavelength conversion member 240 side) from the hypothetical line V2 in this order. Note that a light-shielding region does not have to be located on the first direction side (wavelength conversion member 240 side) from the hypothetical line V2.

[0107] By providing the light-shielding film 380 in this position, even when the protruding portion 242t does not overlap with the emission end face 220a of the light-emitting element 220 in a top view, leakage light can be suppressed from being emitted outside the light-emitting device 301. As a result, color unevenness is reduced, and a light-emitting device 301 with high uniformity of emitted light can be realized. In addition, the safety of the light-emitting element 220 can be improved.

[0108] In addition, in both of the structural examples shown in Figures 12 and 13, the light-shielding film 380 does not overlap with the upper surface 241a of the wavelength conversion unit 241 when viewed from above. In other words, when viewed from above, the wavelength conversion unit 241 and the light-transmitting region overlap, but the wavelength conversion unit 241 and the light-shielding region do not overlap. By arranging it in this way, the light-transmitting region is narrowed, and a portion of the light emitted from the wavelength conversion unit 241 is shielded, which can suppress the risk of a decrease in the light extraction efficiency of the light-emitting devices 300 and 301.

[0109] Light-emitting devices 200, 201, 300, and 301 can be used, for example, in automotive headlights. Furthermore, these devices can be used as light sources for lighting, projectors, head-mounted displays, and other displays such as backlights.

[0110] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0111] In addition to the embodiments described above, the following further notes are disclosed. (Note 1) The base and, One or more light-emitting elements are arranged on the upper surface of the base and emit light that travels laterally, The base is positioned on the upper surface and is positioned to the side of the light-emitting element, and comprises a wavelength conversion member, The wavelength conversion member is A wavelength conversion unit having an incident side surface into which light emitted from the emission end surface of the light-emitting element and traveling laterally is incident, and an emission surface into which light obtained by wavelength conversion of the light incident on the incident side surface is emitted, It has a surrounding portion provided around the wavelength conversion portion, The surrounding portion is provided with a projection that is above the light-emitting element and protrudes toward the light-emitting element from the incident side, The light-emitting device is such that the protruding portion overlaps with the emission end surface when viewed from above. (Note 2) The light-emitting device according to Appendix 1, wherein the protruding portion protrudes toward the light-emitting side from the end of the lower surface of the wavelength conversion member toward the light-emitting side. (Note 3) The light-emitting device according to Appendix 1 or 2, wherein the emission surface is provided on the upper surface of the wavelength conversion member and emits wavelength-converted light upward. (Note 4) The wavelength conversion section comprises a first side surface and a second side surface, which are connected to each other on the upper side and each is connected to the incident side surface on the lower side. The light-emitting device according to any one of appendices 1 to 3, wherein the wavelength conversion section has the first and second sides covered by the surrounding portion and not exposed, and the incident side is exposed without being covered by the surrounding portion. (Note 5) The light-emitting device according to any one of appendices 1 to 4, wherein at least a portion of the incident side surface of the wavelength conversion section is located below the optical axis of the light emitted from the light-emitting element. (Note 6) The light-emitting device according to any one of appendices 1 to 5, wherein the protruding portion is arranged to overlap the respective emission end faces of the one or more light-emitting elements when viewed from above. (Note 7) The light-emitting device according to any one of appendices 1 to 6, wherein the protruding portion is arranged to overlap the entire emission end face of each of the one or more light-emitting elements when viewed from above. (Note 8) The light-emitting device according to any one of appendices 1 to 7, wherein, in a top view, the length from the center of the wavelength conversion section to the tip of the protrusion is longer than the length from the center of the wavelength conversion section to the end of the surrounding section opposite to the protrusion. (Note 9) The light-emitting device according to any one of Appendix 1 to 8, wherein, in a top view, the length from the emission end face to the tip of the protrusion in a direction parallel to the optical axis of the light emitted from the light-emitting element is 400 μm or less. (Note 10) The submount further comprises a submount on which the wavelength conversion member is arranged on the upper surface, The light-emitting device according to any one of the appendices 1 to 9, wherein the upper surface of the submount is not located above the lower surface of the light-emitting element. (Note 11) The light-emitting device according to Appendix 10, wherein the light-emitting element is disposed on the submount on which the wavelength conversion member is arranged. (Note 12) The wiring for connecting to the light-emitting element is further provided, In a top view, the wiring is joined to the light-emitting element on the side opposite to the wavelength conversion member from the center of the light-emitting element, as described in any one of appendices 1 to 11. (Note 13) A frame portion is joined to the base portion and surrounds the light-emitting element and the wavelength conversion member, The system further comprises a lid supported by the frame portion and forming a sealing space in which the light-emitting element and the wavelength conversion member are arranged, A metal film is provided on the lid portion. In a top view, the light-emitting device according to any one of appendices 1 to 12, wherein at least a portion of the metal film overlaps with the protruding portion. (Note 14) The lower surface of the lid further has a light-transmitting region in the area where the metal film is not provided, which transmits light emitted from the emission surface of the wavelength conversion unit. The light-emitting device according to Appendix 13, wherein, in a top view, the metal film is located on the opposite side of the direction of light propagation from the imaginary straight line connecting the emission end surface and the end of the protrusion, and the light-transmitting region is located on the side of the direction of light propagation. (Note 15) The base and, One or more light-emitting elements are arranged on the upper surface of the base and emit light that travels laterally, A wavelength conversion member is disposed on the upper surface of the base and positioned to the side of the light-emitting element, The wavelength conversion member comprises a light-transmitting member positioned above the wavelength conversion member, The wavelength conversion member is The wavelength conversion unit has an incident side surface into which light emitted from the emission end surface of the light-emitting element and traveling laterally is incident, and an emission surface into which light incident on the incident side surface is emitted, and a surrounding portion provided around the wavelength conversion unit, The surrounding portion includes a projection on the upper side of the wavelength conversion member that protrudes toward the light-emitting element side more than the incident side, The light-transmitting member has a light-shielding region where a light-shielding film is provided and a light-transmitting region where a light-shielding film is not provided. A light-emitting device in which the light-shielding film is provided at a position through which a virtual line connecting the upper end of the emission end surface and the upper end of the side surface of the protrusion that is closest to the light-emitting element passes. [Explanation of Symbols]

[0112] 200, 201, 300, 301 Light-emitting devices 211 Base 211a Top side 211b Bottom surface 211t Protrusion 212 Frame part 212a Upper surface 212b Bottom surface 212c Inner surface 212d Outer surface 213 Cover part 213a Upper surface 213b Bottom surface 213c Side surface 214 Step part 214a Upper surface 214b Bottom surface 220 Light-emitting element 221 Metal film 220a Emission end face 230 Submount 231a First metal part 231b Second metal part 232a First metal film 232b Second metal film 240 Wavelength conversion member 241 Wavelength conversion part 241a Upper surface 241b Bottom surface 241c First side surface 241d Second side surface 241e Third side surface 241f Fourth side surface 241i Incident side surface 242 Enclosing part 242a Upper surface 242b First bottom surface 242c Second bottom surface 242d Connection side surface 242e Protruding surface 242t Protrusion 250 Protection element 270 Wiring 313 Translucent member 313b Bottom surface 380 Light-shielding film

Claims

1. The base and, One or more light-emitting elements are arranged on the upper surface of the base and emit light that travels laterally, The base is positioned on the upper surface and is positioned to the side of the light-emitting element, and comprises a wavelength conversion member, The wavelength conversion member is A wavelength conversion unit having an incident side surface into which light emitted from the emission end surface of the light-emitting element and traveling laterally is incident, and an emission surface into which light obtained by wavelength conversion of the light incident on the incident side surface is emitted, It has a surrounding portion provided around the wavelength conversion portion, The surrounding portion is provided with a projection that is above the light-emitting element and protrudes toward the light-emitting element from the incident side, The aforementioned protrusion is positioned so as to overlap with the ejection end face when viewed from above. A frame portion is joined to the base portion and surrounds the light-emitting element and the wavelength conversion member, A light-emitting device comprising: a lid supported by the frame portion and forming a sealing space in which the light-emitting element and the wavelength conversion member are arranged.

2. The light-emitting device according to claim 1, wherein the protruding portion protrudes toward the light-emitting side more than the end of the lower surface of the wavelength conversion member toward the light-emitting side.

3. The light-emitting device according to claim 1 or 2, wherein the emission surface is provided on the upper surface of the wavelength conversion member and emits wavelength-converted light upward.

4. The wavelength conversion section comprises a first side surface and a second side surface, which are connected to each other on the upper side and each is connected to the incident side surface on the lower side. The light-emitting device according to claim 1 or 2, wherein the wavelength conversion section has its first and second sides covered by the surrounding portion and not exposed, and its incident side is exposed without being covered by the surrounding portion.

5. The light-emitting device according to claim 1 or 2, wherein at least a portion of the incident side surface of the wavelength conversion section is located below the optical axis of the light emitted from the light-emitting element.

6. The light-emitting device according to claim 1 or 2, wherein the protruding portion is arranged to overlap the respective emission end faces of the one or more light-emitting elements when viewed from above.

7. The light-emitting device according to claim 1 or 2, wherein the protruding portion is arranged to overlap the entire emission end face of each of the one or more light-emitting elements when viewed from above.

8. The light-emitting device according to claim 1 or 2, wherein, in a top view, the length from the center of the wavelength conversion section to the tip of the protrusion in a direction parallel to the optical axis of the light emitted from the light-emitting element is longer than the length from the center of the wavelength conversion section to the end of the surrounding section opposite to the protrusion.

9. The light-emitting device according to claim 1 or 2, wherein, in a top view, the length from the emission end face to the tip of the protrusion in a direction parallel to the optical axis of the light emitted from the light-emitting element is 400 μm or less.

10. The submount further comprises a submount on which the wavelength conversion member is arranged on the upper surface, The light-emitting device according to claim 1 or 2, wherein the upper surface of the submount is not located above the lower surface of the light-emitting element.

11. The light-emitting device according to claim 10, wherein the light-emitting element is arranged on the submount on which the wavelength conversion member is arranged.

12. The wiring for connecting to the light-emitting element is further provided, The light-emitting device according to claim 1 or 2, wherein, in a top view, the wiring is joined to the light-emitting element on the side opposite to the wavelength conversion member from the center of the light-emitting element.

13. The lid portion is provided with a metal film, The light-emitting device according to claim 1 or 2, wherein, in a top view, at least a portion of the metal film overlaps with the protruding portion.

14. The lower surface of the lid further has a light-transmitting region in the area where the metal film is not provided, which transmits light emitted from the emission surface of the wavelength conversion unit. The light-emitting device according to claim 13, wherein, in a top view, the metal film is located on the opposite side of the direction of light propagation from the imaginary straight line connecting the emission end surface and the end of the protrusion, and the light-transmitting region is located on the side of the direction of light propagation.

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