Composition containing hexafluoropropene dimer

Abstract

To provide a hexafluoropropene dimer-containing composition as a novel mixture. [Solution] C6F 12 A composition comprising a hexafluoropropene dimer represented by and (A), (B), or (C) below. (A) The C6F 12 (B) The C6F 12 For a total amount of 100 parts by mass of the hexafluoropropene dimer represented by [formula], add 0.0001 to 0.1 parts by mass of C6HF. 11 A compound represented by (C) the above C6F 12 A concentration of 0.0001 to 0.1 parts by mass of water per 100 parts by mass of the total amount of hexafluoropropene dimer represented by [formula].

Description

[Technical Field]

[0001] The present invention relates to a hexafluoropropene dimer-containing composition, a foaming agent, a lubricant, a cleaning agent, and a heat transfer fluid containing the same, as well as a heat transfer apparatus and a heat transfer method. [Background technology]

[0002] Hexafluoropropene (HFP) dimers are known to be usable as heat transfer fluid compositions (Patent Document 1).

[0003] Because HFP dimers have a low global warming potential (GWP), they are attracting attention as a substitute for chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs). [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Chinese Patent No. 115706279 Specification [Overview of the project] [Problems that the invention aims to solve]

[0005] In view of the circumstances described above, the object of this disclosure is to provide a novel hexafluoropropene dimer-containing composition as a mixture. [Means for solving the problem]

[0006] The inventors of this invention have diligently conducted research to solve the above problems and have found a solution involving a predetermined amount of fluoride ions and a predetermined amount of C6HF. 11 A compound represented by C6F, or a predetermined amount of water 12It has been found that by coexisting with the compound represented by [the formula], a hexafluoropropene dimer-containing composition as a novel mixture can be provided. Based on such findings, the inventors have further conducted research and completed the present disclosure.

[0007] That is, the present disclosure provides the following hexafluoropropene dimer-containing composition, as well as a heat transfer fluid, a foaming agent, a lubricant, and a cleaning agent containing the same. [Item 1] C6F 12 A composition comprising a hexafluoropropene dimer represented by [the formula] and the following (A), (B), or (C). (A) Fluoride ions at a concentration of 0.0000001 to 5 parts by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene dimer represented by C6F 12 (B) A compound represented by C6HF at a concentration of 0.0001 to 0.1 parts by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene dimer represented by C6F 12 (C) Water at a concentration of 0.0001 to 0.1 parts by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene dimer represented by C6F 11 12 <​​​​​​​​​​​​​​​​​​​​​​​​​​ The aforementioned C6F 12 The composition according to claim 3 or claim 4, wherein the compound represented by formula (I) is contained in an amount of 95% by mass or more relative to the total amount of hexafluoropropene dimers represented by the formula. [Section 6] The aforementioned C6HF 11 The composition according to any one of claims 1 to 5, wherein the compound represented by is at least one selected from the group consisting of compounds represented by the following formula. [ka] [Section 7] A heat transfer fluid comprising the composition described in any one of items 1 to 6. [Section 8] A heat transfer apparatus comprising a device and a mechanism for transferring heat from or to the device, the heat transfer fluid being described in item 7. [Section 9] A heat transfer method comprising the steps of preparing a device and transferring heat to or from the device using a heat transfer fluid as described in item 7. [Section 10] A foaming agent comprising the composition described in any one of items 1 to 6. [Section 11] A lubricant comprising the composition described in any one of items 1 to 6. [Section 12] A cleaning agent comprising the composition described in any one of items 1 to 6. [Effects of the Invention]

[0008] The composition relating to the present disclosure as described above can provide a novel hexafluoropropene dimer-containing composition (hereinafter also simply referred to as "the composition") as a mixture. [Modes for carrying out the invention]

[0009] In this specification, "contains" is a concept that encompasses all of the following: "contains," "consist essentially of," and "consist of." Furthermore, in this specification, when a numerical range is indicated as "A~B," it means A or greater and B or less. Also, when a structural formula in this disclosure includes a structure represented by the following formula, unless otherwise specified, the compound represented by that structural formula is a concept that encompasses both the E and Z geometric isomers. Here, A, B, C, and D represent substituents and not element symbols. [ka]

[0010] [Embodiment 1] (Hexafluoropropene dimer-containing composition) The composition of this embodiment is C6F 12 It contains a compound represented by . Furthermore, the composition of this embodiment further contains fluoride ions, and the C6F 12 The fluoride ion concentration is 0.0000001 to 5 parts by mass per 100 parts by mass of the total amount of hexafluoropropene dimer represented by [formula].

[0011] C6F 12 Compounds represented by C6F 12 A wide range of known methods represented by can be adopted, and there are no particular limitations. However, C6F in this specification may be used. 12 The compound represented by [formula] preferably does not contain a cycloalkane, and more preferably is a hexafluoropropene (HFP) dimer.

[0012] C6F 12 Examples of compounds represented by include hexafluoropropene dimers, and more specifically, dimers containing at least one compound selected from the group consisting of compounds represented by the following formulas (I) and (II).

[0013] [ka]

[0014] In this specification, the above C6F 12 The compounds represented by [formula] preferably include both the E and Z geometric isomers, unless otherwise specified.

[0015] C6F included in the composition of this embodiment 12 The compound represented by the above formulas (I) and (II) may contain only one of the compounds represented by the above formulas, or it may be a mixture containing both.

[0016] When the composition of this embodiment contains the compound represented by formula (I) above, the ratio of the E-isomer to the Z-isomer of the compound, E / (E+Z), is preferably greater than 0.5 (i.e., the ratio of the E-isomer is greater than that of the Z-isomer), more preferably 0.67 or higher, even more preferably 0.8 or higher, even more preferably 0.91 or higher, particularly preferably 0.95 or higher, and most preferably 0.965 or higher. Since the E-isomer of the compound represented by formula (I) is more thermodynamically stable than the Z-isomer, if E / (E+Z) is within the above range, decomposition during long-term use can be suppressed.

[0017] Furthermore, in this embodiment, E / (E+Z) of the compound represented by formula (I) may be 1.

[0018] C6F 12 The content of the compound represented by formula (I) in the compound represented by (for example, the total of compounds represented by formulas (I) and (II) is C6F 12 The content of the compound represented by formula (I) is preferably 10% by mass or more, more preferably 50% by mass or more, even more preferably 80% by mass or more, even more preferably 90% by mass or more, particularly preferably 95% by mass or more, and particularly more preferably 98% by mass or more. 12With respect to the total amount of HFP dimer expressed by mass% or less, 90 mass% or more and 100 mass% or less, 10 mass% or more and 98 mass% or less, 30 mass% or more and 98 mass% or less, 50 mass% or more and 98 mass% or less, 70 mass% or more and 98 mass% or less, 9 0 mass% or more and 98 mass% or less, 10 mass% or more and 96 mass% or less, 30 mass% or more and 96 mass% or less, 50 mass% or more and 96 mass% or less, 70 mass% or more and 96 mass% or less, 90 mass% or more9 6 mass% or less, 40 mass% or more and 95 mass% or less, 60 mass% or more and less than 95 mass%, 80 mass% or more and less than 95 mass%, 30 mass% or more and less than 85 mass%, 50 mass% or more and less than 85 mass%, 7 It may be 0% by mass or more and less than 85% by mass, 40% by mass or more and 80% by mass or less, 55% by mass or more and 80% by mass or less, 60% by mass or more and 75% by mass or less, 65% by mass or more and 70% by mass or less, 35% by mass or more and 60% by mass or less, 50% by mass or more and 60% by mass or less, 70% by mass or more and 90% by mass or less, 80% by mass or more and 100% by mass or less, 80% by mass or more and 95% by mass or less, 80% by mass or more and 90% by mass or less, 85% by mass or more and 100% by mass or less, 90% by mass or more and 100% by mass or less, or 85% by mass or more and 95% by mass or less, preferably 50% by mass or more and 100% by mass or less, preferably 60% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, and even more preferably 95% by mass or more and 100% by mass or less.

[0019] Similarly, regarding the content of the compound represented by formula (II), C6F 12 The amount of the total amount of HFP dimers represented by is preferably 1% by mass or less, more preferably 0.5% by mass or less, and even more preferably 0.2% by mass or less.

[0020] C6F contained in the composition of this embodiment 12The content of the compound represented by is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 60% by mass or more, and particularly preferably 80% by mass or more, relative to the total composition of this embodiment. Also, C6F is included in the composition of this embodiment. 12 The content of the compound represented by is preferably 99.9999% by mass or less of the total composition of this embodiment.

[0021] The compounds represented by formulas (I) and (II) above may be produced by conventional methods, for example, by the method described in Chinese Patent Application Publication No. 103787824, and are not limited thereto. They may also be obtained by dimerization using HFP as a raw material, and are not limited thereto; they may be obtained by employing a wide range of known methods.

[0022] The composition of this embodiment contains C6F compounds other than those represented by formula (I) or (II). 12 It may contain a hexafluoropropene dimer represented by .

[0023] The composition of this embodiment may contain a hexafluoropropene trimer, and may contain, for example, one or more compounds represented by the following formulas (A) to (C). [ka]

[0024] The composition of this embodiment may contain a hexafluoropropene tetramer.

[0025] The hexafluoropropene tetramer may contain 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0026] The composition of this embodiment further contains fluoride ions. The amount of fluoride ions is the same as C6F. 12The fluoride ion concentration is 0.0000001 parts by mass or more, more preferably 0.000001 parts by mass or more, and even more preferably 0.00001 parts by mass or more, per 100 parts by mass of the total amount of hexafluoropropene dimer represented by . By setting the fluoride ion concentration to 0.0000001 parts by mass or more, the stability of the composition can be maintained and the charging of the composition can be suppressed.

[0027] Furthermore, the amount of fluoride ions contained in the composition of this embodiment is the same as C6F 12 The amount of fluoride ions is 5 parts by mass or less, preferably 1 part by mass or less, more preferably 0.1 parts by mass or less, more preferably 0.01% by mass or less, even more preferably 0.001% by mass or less, and particularly preferably 0.0001% by mass or less, relative to 100 parts by mass of the total amount of hexafluoropropene dimer represented by . By setting the amount of fluoride ions to 5 parts by mass or less, C6F 12 This can suppress the decomposition of the compound represented by [formula].

[0028] In one embodiment, the amount of fluoride ions is preferably 0.0000001% by mass or more, more preferably 0.000001% by mass or more, and even more preferably 0.00001% by mass or more, relative to the entire composition.

[0029] In one embodiment, the amount of fluoride ions is preferably 5% by mass or less, more preferably 1% by mass or less, more preferably 0.1% by mass or less, more preferably 0.01% by mass or less, even more preferably 0.001% by mass or less, and particularly preferably 0.0001% by mass or less, relative to the entire composition.

[0030] The amount of fluoride ions can be measured, for example, by adding 1:1 volume (by weight) of distilled water to the sample, shaking for about 20 seconds to extract fluoride ions into the aqueous layer, then withdrawing 2.5-3.0 mL of the aqueous layer with a dropper, and mixing it with twice the volume of TISAB solution (total ion strength adjustment buffer solution). This mixture can then be used as a sample and measured with a fluoride ion meter.

[0031] Any known fluoride ion source can be widely used as the fluoride ion source, and there are no particular limitations. Specifically, examples include ions of hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride. Only one of these may be included, or multiple types may be included. Preferably, the fluoride ion source is hydrogen fluoride.

[0032] The composition of this embodiment is further C6HF 11 It may contain the compound represented by C6HF. 11 The concentration of the compound represented by the above C6F 12 The amount is 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, and even more preferably 0.001 parts by mass or more, per 100 parts by mass of the total amount of hexafluoropropene dimer represented by C6HF. 11 By setting the concentration of the compound represented by to 0.0001 parts by mass or more, C6F 12 The decomposition of the hexafluoropropene dimer represented by [formula] can be suppressed.

[0033] Furthermore, C6HF is included in the composition of this embodiment. 11 The concentration of the compound represented by the above C6F 12 The amount of C6HF is preferably 0.1 parts by mass or less, more preferably 0.05 parts by mass or less, and even more preferably 0.01 parts by mass or less, relative to 100 parts by mass of the total amount of hexafluoropropene dimer represented by C6HF. 11 By setting the concentration of the compound represented by to 0.1 parts by mass or less, C6F12 The decomposition of the hexafluoropropene dimer represented by [formula] can be suppressed.

[0034] C6HF 11 Examples of compounds represented by C6HF include 11 A wide range of known methods represented by can be adopted, and there are no particular limitations. However, C6HF in this specification 11 The compound represented by preferably does not contain a cycloalkane, and more preferably is a compound in which one of the fluorine atoms of a hexafluoropropene (HFP) dimer is replaced by a hydrogen atom.

[0035] C6HF 11 Examples of specific structures of compounds represented by the formula are shown below. [ka]

[0036] In a preferred embodiment, the composition of this embodiment is C6HF 11 The compound represented by includes at least one of the following: [ka]

[0037] In this specification, the above C6HF 11 The compounds represented by include both the E and Z geometric isomers unless otherwise specified.

[0038] C6HF contained in the composition of this embodiment 11 The compound represented by the above formula may contain only one of the compounds represented by the above formula, or it may be a mixture containing two or more compounds.

[0039] In addition to the above, the composition of this embodiment also includes C m F 2m and / or C n F (2n-2)The formula may include the following: [wherein m is an integer between 4 and 12, not 6; and n is an integer between 4 and 12, not 6.]

[0040] m is an integer greater than or equal to 4, preferably greater than or equal to 5, and more preferably greater than or equal to 6. Also, n is an integer less than or equal to 12, preferably less than or equal to 11, and more preferably less than or equal to 10. However, m does not include 6.

[0041] n is an integer greater than or equal to 4, preferably greater than or equal to 5, and more preferably greater than or equal to 6. Furthermore, n is an integer less than or equal to 12, preferably less than or equal to 11, and more preferably less than or equal to 10. In addition, n is particularly preferably 6.

[0042] C m F 2m This may be a linear compound or a cyclic compound that may have a substitutional structure. The linear compound may be a so-called alkene, and may be linear or branched.

[0043] C n F (2n-2) This may be a linear compound or a cyclic compound that may have a substitutional structure. The linear compound may be a so-called diene or an alkyne, and may be linear or branched.

[0044] Also, C m F 2m and / or C n F (2n-2) The content of is preferably 0.0001% by mass or more relative to the entire composition of this embodiment.

[0045] On the other hand, C m F 2m and / or C n F (2n-2) The content of is preferably 10% by mass or less, preferably 5% by mass or less, and more preferably 1% by mass or less, relative to the total composition of this embodiment.

[0046] In one aspect, in the composition of this embodiment, C m F 2m and / or C n F (2n-2) The content is C6F 12 The amount is preferably 0.0001 parts by mass or more, more preferably 0.01 parts by mass or more, and even more preferably 0.1 parts by mass or more, based on a total of 100 parts by mass of the compounds represented by .

[0047] On the other hand, in the composition of this embodiment, C m F 2m and / or C n F (2n-2) The content is C6F 12 It is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, based on a total of 100 parts by mass of the compounds represented by [formula].

[0048] Note C m F 2m and / or C n F (2n-2) If multiple types are included, the above content refers to the total amount of each.

[0049] C m F 2m and / or C n F (2n-2) By setting the content of C6F within the above range, 12 This can suppress the decomposition of the HFP dimer represented by [formula], and consequently, it can suppress the increase in fluoride ions and the rise in acidity.

[0050] The composition of this embodiment may further contain water. The water content is as described above for C6F. 12The amount of water is 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, and even more preferably 0.001 parts by mass or more, per 100 parts by mass of the total amount of hexafluoropropene dimer represented by . By setting the concentration of water to 0.0001 parts by mass or more, the stability of the composition can be maintained and the charging of the composition can be suppressed.

[0051] Furthermore, the water content in the composition of this disclosure is the same as that of C6F. 12 For every 100 parts by mass of the total amount of hexafluoropropene dimer represented by , the amount of water is preferably 0.1 parts by mass or less, more preferably 0.05 parts by mass or less, even more preferably 0.01 parts by mass or less, particularly preferably 0.005 parts by mass or less, and most preferably 0.004 parts by mass or less. By making the water content 0.1 parts by mass or less, C6F is released during heating. 12 This can suppress the decomposition of the compound represented by [formula], thereby suppressing the increase in fluoride ions and the rise in acidity. Furthermore, by reducing the water content to 0.004 parts by mass or less, rusting of the container can be suppressed.

[0052] In one embodiment, the water content is preferably 0.0001% by mass or more, more preferably 0.0005% by mass or more, and even more preferably 0.001% by mass or more, relative to the entire composition.

[0053] In one embodiment, the water content is preferably 0.1% by mass or less, more preferably 0.05% by mass or less, even more preferably 0.01% by mass or less, and particularly preferably 0.005 parts by mass or less, relative to the entire composition.

[0054] The composition of this embodiment has improved dielectric strength by including a predetermined amount of water. The dielectric strength of the composition of this embodiment may preferably be 40kV or higher, preferably 50kV or higher, and more preferably 60kV or higher.

[0055] The composition of this embodiment is C6F 12It may contain additional compounds different from the compound represented by . The additional compounds may be one or more. Examples of the additional compounds include perfluoropolyethers.

[0056] The perfluoropolyether preferably has the general formula: RO-Rf 1 -R’ and is represented by wherein R and R’ are the same or different and are monovalent groups represented by -C m F 2m+1 where m is an integer from 1 to 8, and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, and the repeating units are: (i) -CFXO- (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O-, or Rf 1 is (vi) -(CF2) n -CFY-O- (where n is an integer from 0 to 3, and Y is a monovalent group represented by the general formula -ORf 2 Z, where Rf 2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different and is F or CF3, and Z is a monovalent C 1-5 perfluoroalkyl group).

[0057] Specific examples of the perfluoropolyether include the product name GALDEN (registered trademark) "HT55" (manufactured by Solvay) and the like.

[0058] (Heat transfer fluid) This embodiment also relates to a heat transfer fluid.

[0059] The heat transfer fluid of this embodiment includes or consists of the composition of this embodiment.

[0060] If the heat transfer fluid of this embodiment includes the perfluoropolyether described above, then these and C6F 12 Since the compounds represented by have similar properties as heat transfer fluids, the properties as heat transfer fluids remain basically unchanged regardless of their content ratio. Therefore, in this case, the entire heat transfer fluid of this embodiment is C6F 12 The compound represented by is preferably present in an amount of 40% to 99.9% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total heat transfer fluid.

[0061] The heat transfer fluid of this embodiment may contain any additives other than those described above, as long as they do not hinder its effects and purpose. Examples of such additives include stabilizers.

[0062] Stabilizers exert their functions as so-called acid acceptors or antioxidants by exhibiting stabilizing effects. Major stabilizing effects include preventing the decomposition of HFP dimers by capturing radicals generated in the system, and preventing further decomposition of HFP dimers by acids generated in the system.

[0063] A wide range of known stabilizers can be used as such stabilizers. In particular, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers, as these can effectively suppress the occurrence of metal corrosion caused by the composition.

[0064] A wide range of known unsaturated alcohol-based stabilizers can be used. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadiene-1-ol, and oleyl alcohol can be used.

[0065] As nitro-based stabilizers, a wide range of known types can be used. Examples of aliphatic nitro compounds include nitromethane, nitroethane, 1-nitropropane, and 2-nitropropane. As aromatic nitro compounds, one or more selected from the group consisting of nitrobenzene, o-, m-, or p-dinitrobenzene, o-, m-, or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m-, or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole can be used.

[0066] A wide range of known amine-based stabilizers can be used. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dibentilyamine, tribentilyamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine, and diethylhydroxylamine can be used.

[0067] As the phenolic stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of 2,6-di-tert-butyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0068] As the epoxy stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0069] By using a combination of stabilizers having different stabilizing effects, the decomposition of the compound represented by C6F 12 which may occur due to various causes can be more effectively prevented. Therefore, it is preferably composed of one or more selected from the above-mentioned epoxy stabilizer, and the group consisting of unsaturated alcohol stabilizer, nitro stabilizer, and phenolic stabilizer.

[0070] From the perspective of effectively suppressing the acid dissociation from the compound represented by the above C6F 12 and suppressing the corrosion of metal by the liquid composition, the content of the stabilizer in the whole heat transfer fluid is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, considering avoiding the unfavorable physical property change of the liquid composition due to excessive addition of the stabilizer, the content of the stabilizer in the whole heat transfer fluid is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0071] The heat transfer fluid of this embodiment is used to remove heat from or supply heat to various objects to be heated, and can be applied, for example, as a medium for immersion cooling such as single-phase immersion cooling and two-phase immersion cooling, as well as for chiller fluids, Rankine cycle working fluids, and the like.

[0072] In this embodiment, the objects to which heat is transferred are articles, devices, and atmospheres that are cooled, heated, or maintained at a temperature to be controlled. Examples of such objects to which heat is transferred include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of objects to which heat is transferred in this embodiment are not particularly limited, but include wafers used to manufacture semiconductor devices, microprocessors, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components.

[0073] The heat transfer fluids of this embodiment can be used as a substitute for the heat transfer fluid currently in use in equipment designed to transfer heat using these fluids.

[0074] The heat transfer fluid of this embodiment can be used as a drop-in replacement, nearly drop-in replacement, or retrofit replacement for a heat transfer fluid that is currently in use. "Drop-in replacement" means that the replacement can be done without any changes to the equipment. "Nearly drop-in replacement" means that the replacement can be done with little to no changes to the equipment. "Retrofit replacement" means that the replacement can be done with minimal changes to the equipment (without significant changes). Preferably, the heat transfer fluid of this embodiment can be used as a drop-in replacement or nearly drop-in replacement for the heat transfer fluid described above.

[0075] Whether a drop-in alternative, a near-drop-in alternative, or a retrofit alternative is possible can be determined by whether all of the following conditions are met. (i) The boiling point of the heat transfer fluid is at least about 80% of the boiling point of the heat transfer fluid before replacement, preferably at least about 85%. (ii) The freezing point of the heat transfer fluid is equal to or lower than the freezing point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement. (iv) The heat transfer fluid is compatible with the heat transfer fluid before replacement in any proportion.

[0076] By setting the boiling point of the heat transfer fluid in this embodiment to at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, the occurrence of cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but for example, it may be at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0077] By setting the pour point of the heat transfer fluid in this embodiment to be equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it at temperatures below the conventional operating temperature, thereby widening the operating temperature range. There is no particular upper limit to the pour point of the heat transfer fluid, but for example, it may be 30°C higher or lower than the pour point of the heat transfer fluid before replacement.

[0078] By setting the kinematic viscosity of the heat transfer fluid in this embodiment to at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement, it is possible to suppress an increase in power consumption or reduce power consumption. It is preferable to compare the kinematic viscosity at the operating temperature, but is not limited to this, and for example, it can be compared at any temperature between -20°C and -40°C, specifically at -20°C.

[0079] The heat transfer fluid of this embodiment is compatible with the heat transfer fluid used before replacement in any ratio, which facilitates the replacement process.

[0080] Furthermore, the heat transfer fluid of this embodiment is more suitable as a drop-in replacement, nearly drop-in replacement, or retrofit replacement if it satisfies the following conditions. (v) The heat transfer fluid in this embodiment has a dielectric constant of 120% or less of the heat transfer fluid before replacement. (vi) The heat transfer fluid in this embodiment has an dielectric strength of 90% or more of the heat transfer fluid before replacement. (vii) The heat transfer fluid in this embodiment has a specific heat of 90% or more of the specific heat of the heat transfer fluid before replacement. (viii) The heat transfer fluid in this embodiment has a thermal conductivity of 90% or more of the heat transfer fluid before replacement.

[0081] By setting the dielectric constant of the heat transfer fluid in this embodiment to 120% or less of the dielectric constant of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the dielectric constant of the heat transfer fluid, but for example, it may be 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0082] By setting the dielectric strength of the heat transfer fluid in this embodiment to 90% or more of the dielectric strength of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0083] By setting the specific heat of the heat transfer fluid in this embodiment to 90% or more of the specific heat of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the specific heat of the heat transfer fluid, but for example, it may be 120% or less of the specific heat of the heat transfer fluid before replacement.

[0084] By setting the thermal conductivity of the heat transfer fluid in this embodiment to 90% or more of the thermal conductivity of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the thermal conductivity of the heat transfer fluid, but for example, it may be 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0085] The boiling point of the heat transfer fluid in this embodiment is preferably 40°C or higher, more preferably 45°C or higher. Furthermore, the upper limit of the boiling point of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, 80°C or lower, 70°C or lower, or 60°C or lower.

[0086] The pour point of the heat transfer fluid in this embodiment is preferably -80°C or lower, more preferably -90°C or lower, and even more preferably -100°C or lower. Furthermore, the lower limit of the pour point of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, -160°C or higher, or -140°C or higher.

[0087] The kinematic viscosity of the heat transfer fluid in this embodiment is preferably 4.0 cSt or less, more preferably 3.0 cSt or less, even more preferably 2.0 cSt or less, and even more preferably 1.5 cSt or less at -20°C. Furthermore, the lower limit of the kinematic viscosity of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, 0.2 cSt or more.

[0088] The dielectric constant of the heat transfer fluid in this embodiment is preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. Furthermore, the lower limit of the dielectric constant of the heat transfer fluid in this embodiment is not particularly limited, but it may be, for example, 1.1 or more.

[0089] The dielectric strength of the heat transfer fluid in this embodiment is preferably 40kV or higher, more preferably 50kV or higher, and even more preferably 50kV or higher. Furthermore, there is no particular upper limit to the dielectric strength of the heat transfer fluid in this embodiment, but it may be, for example, 150kV or less, or 100kV or less.

[0090] The specific heat of the heat transfer fluid in this embodiment is preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and even more preferably 1000 J / kg·K or more at 30°C. Furthermore, there is no particular upper limit to the specific heat of the heat transfer fluid in this embodiment, but it may be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0091] The thermal conductivity of the heat transfer fluid in this embodiment is preferably 0.055 W / mK or higher, more preferably 0.060 W / mK or higher, at 30°C. Furthermore, there is no particular upper limit to the thermal conductivity of the heat transfer fluid in this embodiment, but it may be, for example, 0.090 W / mK or lower, or 0.080 W / mK or lower.

[0092] The boiling point of the heat transfer fluid in this embodiment is the temperature at which a peak originating from endothermic heating was observed when the temperature was increased from 25°C at a rate of 5°C / min, using DSC (Dynamic Scanning Calorimetry).

[0093] The pour point of the heat transfer fluid in this embodiment is the temperature at which a peak originating from endothermic heating is observed when the fluid is cooled to below its freezing point with liquid nitrogen using DSC, and then heated at a rate of 5°C / min.

[0094] The dielectric constant of the heat transfer fluid in this embodiment is the value observed at a frequency of 1 kHz under conditions of 25°C and 60% humidity, using the capacitance method.

[0095] The kinematic viscosity and density of the heat transfer fluid in this embodiment were measured using an Anton Paar SVM3001 kinematic viscometer.

[0096] The dielectric strength of the heat transfer fluid in this embodiment is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined interval and the voltage is increased at a constant rate. The measurement conditions are as follows. Electrode shape: Spherical (φ12.5mm) Electrode spacing: 2.5mm Boost speed: 2kV / second Measurement environment: Air (22°C, 57%RH)

[0097] The specific heat of the heat transfer fluid in this embodiment is a value obtained using DSC under the following conditions. Measurement device: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10°C / min Standard sample: Sapphire (-Al2O3) Atmosphere: Dry nitrogen stream Sample container: Aluminum airtight container

[0098] The thermal conductivity of the heat transfer fluid in this embodiment is a value obtained by the transient nanowire method.

[0099] The compatibility of the heat transfer fluid in this embodiment is determined by whether or not it becomes compatible when mixed with the target solvent. Here, compatibility means that when the two are mixed, they become a uniform state, that is, the phases do not separate.

[0100] (Heat transfer device) This embodiment further discloses a heat transfer device comprising a device and a mechanism for transferring heat to or from the device, which includes the heat transfer fluid described above.

[0101] Examples of devices include computers, server computers, servers including blade servers; disk arrays / storage systems; storage area networks; network-connected storage; storage communication systems; workstations; routers; telecommunications infrastructure / switches; wired, optical and wireless communication equipment; cell processing equipment; printers; power supplies; displays; optical devices; measurement systems including handheld systems; and military electronic equipment.

[0102] In different terms, the device may be a component, workpiece, assembly, etc., that is cooled, heated, or maintained at a predetermined temperature or temperature range. Examples of such devices include electrical components, mechanical components, and optical components. Specifically, examples include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, power distribution switches, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, lasers, chemical reactors, fuel cells, heat exchangers, and electrochemical cells. In some embodiments, the device may include a cooler, a heater, or a combination thereof.

[0103] Semiconductor elements are heat-generating elements mounted in devices, such as CPUs, GPUs, and SSDs. These semiconductor elements are composed of single elements such as silicon and germanium, and compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC).

[0104] If the device is a server computer, one or more logic boards are located within its internal space. A logic board contains numerous heat-generating electronic components, including at least one processor such as a CPU or GPU. In addition, other heat-generating components of the computer may also be used, such as chipsets; memory, graphics chips, network chips, RAM, power supplies, daughter cards; and storage drives such as solid-state drives and mechanical hard disks.

[0105] A heat transfer device is a device that uses the above-mentioned heat transfer fluid to transfer heat between itself and an object to be heated. Heat is exchanged (transferred) through thermal contact with the object to be heated. For example, removing heat from an object to be heated is called cooling, and supplying heat is called heating. Different mechanisms may be used depending on the case, but a single heat transfer device may be used to handle both cooling and heating.

[0106] There are no particular limitations on the heat transfer devices, and examples include pumps, valves, fluid confinement systems, pressure control systems, coolers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, and passive temperature control systems.

[0107] More specifically, these include temperature-controlled wafer chucks in plasma-enhanced chemical vapor deposition (PECVD) tools, temperature-controlled test heads for die performance testing, temperature-controlled work areas in semiconductor process equipment, thermal shock test bath reservoirs, and constant temperature baths.

[0108] The object to be subjected to heat transfer, which is brought into thermal contact with the heat transfer device, is an article, device, or atmosphere that is cooled, heated, or maintained at a temperature to be controlled. Examples of such objects to be subjected to heat transfer include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of objects to be subjected to heat transfer in this embodiment include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components.

[0109] When using the heat transfer device of this embodiment, the temperature conditions for the composition of this embodiment are preferably -100 to 45°C, more preferably -90 to 45°C, and even more preferably -70 to 45°C. The heat transfer fluid of this embodiment has the advantage of exhibiting low kinematic viscosity even at low temperatures below -20°C, and especially low kinematic viscosity at -70 to -60°C, so the device can be suitably used even in the above temperature range.

[0110] (Heat Transfer Method) This embodiment further discloses a heat transfer method comprising the steps of preparing a device and transferring heat to or from the device using the heat transfer fluid described above. Here, heat can be transferred by positioning a heat transfer device in thermal contact with the device. When the heat transfer device is positioned in thermal contact with the device, it removes heat from the device, supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of the heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer device.

[0111] (Foaming agent) This embodiment also relates to a foaming agent.

[0112] The foaming agent of this embodiment comprises or consists of the composition of this embodiment.

[0113] The foaming agent in this embodiment is C6F 12 The compound may include additional compounds different from the compound represented by . The additional compounds may be one or more types. For example, C6F 12 Other examples include fluorine-substituted olefins, substituted or unsubstituted olefins other than fluorine-substituted olefins, halogenated hydrocarbons other than olefins, other organic compounds, or inorganic compounds.

[0114] C6F 12 Other fluorine-substituted olefins may include, for example, hydrofluoroolefins or hydrochlorofluoroolefins having 1 to 30 carbon atoms, specifically 1,3,3,3-tetrafluoropropene, 1,1,3,3-tetrafluoropropene, 1,2,3,3,3-pentafluoropropene, 1,1,1-trifluoropropene, 1,1,1,3,3-pentafluoropropene (HFO-1225zc), and 1,1,1,3,3,3-hexafluorobut-2-e Examples include octafluoro-2-butene, 1,1,2,3,3-pentafluoropropene, 1,1,1,2,3-pentafluoropropene, trans-1,2-dichloroethylene, 1-chloro-2,3,3,3-tetrafluoropropene, 2-chloro-1,3,3,3-tetrafluoropropene, 1-chloro-2,3,3,4,4,5,5-heptafluoropentene, 1,1-dichloro-2-fluoroethylene, and 1-chloro-3,3,3-trifluoropropene.

[0115] Other substituted or unsubstituted olefins besides fluorine-substituted olefins may include, for example, halogenated olefins having 1 to 30 carbon atoms, with specific examples including tetrachloroethylene, ethylene, propylene, and n-butene.

[0116] Examples of halogenated hydrocarbons other than olefins include difluoromethane, pentafluoroethane, 1,1,2,2-tetrafluoroethane, 1,1,1,2-tetrafluoroethane, difluoroethane, 1,1,1,2,3,3,3-heptafluoropropane, 1,1,1,3,3,3-hexafluoropropane, 1,1,1,3,3-pentafluoropropane, 1,1,1,3,3-pentafluorobutane, trichlorofluoromethane, dichlorodifluoromethane, trichlorotrifluoroethane, dichlorohexafluoropropane, 2,2,3-3-tetrachlorohexafluorobutane, dichlorooctafluorobutane, dichloromethane, trichloroethane, octafluoropropane, and 1,1,1,2,2,3,3-heptafluoropropane.

[0117] Other organic compounds include, for example, hydrocarbons such as methane, ethane, propane, n-butane, isobutane, n-pentane, isopentane, neopentane, cyclopentane, n-hexane, isohexane, n-heptane or n-octane, CHF2-O-CHF2, CHF2-O-CH2F, CHF2-CF2-O-CH3, CH2F-O-CHF-CH2F, CHF2-CHF-O-CH2F, CF3-O-CHF-CH3, CF3-CHF-O-CH3, CHF2-O-CH2-CHF2, CF3-O-CH2-CH2F, CF3-CH2-O-CH2F, CF2H-CF2-CF2-O-CH3, CF3CF2CF2-O-CH3, C4H9-O-CF3, and C4F9-O-C2 Examples include hydrofluoroethers such as H5 or C3F7-O-C3F7, methanol, ethanol, propanol, isopropanol, alcohols such as 1-hexanol, 2-hexanol, 2-ethylhexanol or 1-octanol, ethers such as dimethyl ether, methyl ethyl ether, diethyl ether, methyl propyl ether, methyl isopropyl ether, ethyl propyl ether, ethyl isopropyl ether, dipropyl ether or diisopropyl ether, ketones such as methyl ethyl ketone, methyl isobutyl ketone or perfluoroethyl isopropyl ketone, and organic acids such as methyl formate, ethyl formate or formic acid.

[0118] Examples of inorganic compounds include water, nitrogen, oxygen, argon, and carbon dioxide.

[0119] The foaming agent of this embodiment may contain the compounds listed above for any reason, such as for the purpose of being a co-foaming agent or vapor pressure regulator, or as a by-product during manufacturing.

[0120] C6F in the foaming agent of this embodiment 12 The content of the compound represented by may be any value depending on the intended use of the blowing agent in this embodiment. However, among the compounds listed above, if GWP is C6F 12 A compound with a higher value than the compound represented by C6F 12 This also includes compounds that promote the decomposition of C6F in the foaming agent of this embodiment. 12 The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total amount of the blowing agent.

[0121] The foaming agent of this embodiment may contain a foam stabilizer (bubble stabilizer) for the purpose of improving foaming properties. Examples of foam stabilizers include polyoxyalkylene foam stabilizers such as polyoxyalkylene alkyl ethers, and surfactants such as silicone foam stabilizers such as octamethylcyclotetrasiloxane and organopolysiloxane. These foam stabilizers may be used individually or in combination of two or more.

[0122] From the viewpoint of improving foaming properties, the content of the foam stabilizer relative to the total foaming agent in this embodiment is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and even more preferably 1% by mass or more. On the other hand, from the viewpoint of obtaining homogeneous foaming, the content of the foam stabilizer relative to the total foaming agent in this embodiment is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0123] The blowing agent of this embodiment may contain a flame retardant for the purpose of improving flame retardancy. Examples of flame retardants include phosphate esters, phosphate-containing flame retardants, bromine-containing flame retardants, and metal hydroxides.

[0124] As the phosphate ester, it is preferable to use monophosphate esters, condensed phosphate esters, etc. For example, trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri(2-ethylhexyl) phosphate, tributoxyethyl phosphate, triphenyl phosphate, tris(phenylphenyl) phosphate, trinaphthyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, 2-methacryloyloxyethyl acid phosphate, diphenyl-2-methacryloyloxyethyl phosphate Examples include tyl phosphate, melamine phosphate, dimelamine phosphate, melamine pyrophosphate, triphenylphosphine oxide, tricresylphosphine oxide, diethyl phenylphosphonate, resylcinol bis(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), trialkyl polyphosphate, resorcinol polyphenyl phosphate, resorcinol poly(di-2,6-xylyl) phosphate, hydroquinone poly(2,6-xylyl) phosphate, and condensates thereof.

[0125] Specific examples of phosphate-containing flame retardants include monophosphates and polyphosphates. Monophosphates are not particularly limited, but examples include ammonium salts such as ammonium phosphate, ammonium dihydrogen phosphate, and diammonium hydrogen phosphate; sodium salts such as monosodium phosphate, disodium phosphate, disodium phosphite, and sodium hypophosphite; potassium salts such as monopotassium phosphate, dipotassium phosphate, tripotassium phosphate, monopotassium phosphite, dipotassium phosphite, and potassium hypophosphite; lithium salts such as monolithium phosphate, dilithium phosphate, trilithium phosphate, monolithium phosphite, dilithium phosphite, and lithium hypophosphite; barium salts such as barium hydrogen phosphate and barium hypophosphite; magnesium salts such as magnesium monohydrogen phosphate, magnesium hydrogen phosphate, trimagnesium phosphate, and magnesium hypophosphite; calcium salts such as calcium dihydrogen phosphate, calcium hydrogen phosphate, tricalcium phosphate, and calcium hypophosphite; and zinc salts such as zinc phosphate, zinc phosphite, and zinc hypophosphite. Polyphosphates are not particularly limited, but examples include ammonium polyphosphate, piperazine polyphosphate, melamine polyphosphate, ammonium polyphosphate amide, and aluminum polyphosphate. One or more types of phosphate-containing flame retardants may be used.

[0126] From the viewpoint of improving flame retardancy, the flame retardant content relative to the total blowing agent in this embodiment is preferably 0.5% by mass or more, more preferably 2% by mass or more, and even more preferably 5% by mass or more. On the other hand, from the viewpoint of preventing foaming inhibition due to an excessive amount of flame retardant, the flame retardant content relative to the total blowing agent in this embodiment is preferably 50% by mass or less, and more preferably 30% by mass or less.

[0127] There are no particular limitations on bromine-containing flame retardants as long as they are compounds that contain bromine in their molecular structure, but examples include aromatic brominated compounds. Specific examples of aromatic brominated compounds include monomer-based organic bromine compounds such as hexabromobenzene, pentabromotoluene, hexabromobiphenyl, decabromobiphenyl, hexabromocyclodecane, hexabromodiphenyl ether, bis(pentabromphenoxy)ethane, ethylene-bis(tetrabromophthalimide), and tetrabromobisphenol A; brominated polycarbonates such as copolymers of polycarbonate oligomers and bisphenol A; poly(brominated benzyl acrylate), brominated polyphenylene ether, brominated bisphenol A, cyanuryl chloride, and brominated phenol condensates; brominated (polystyrene), poly(brominated styrene), and cross-linked brominated polystyrene. One or more types of bromine-containing flame retardants can be used.

[0128] Examples of metal hydroxides include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, iron hydroxide, nickel hydroxide, zirconium hydroxide, zinc hydroxide, titanium hydroxide, copper hydroxide, tin hydroxide, and vanadium hydroxide. One or more types of metal hydroxides can be used.

[0129] The blowing agent of this embodiment may be used alone as a physical blowing agent, or in combination with a known chemical blowing agent. Examples of the above chemical blowing agents include 4,4'-oxybis(benzenesulfonyl hydrazide), diphenylsulfon-3,3'-disulfonylhydrazide arylbis(sulfonyl hydrazide), p-toluenesulfonyl hydrazide, azodicarbonamide (ADCA), azobisformamide, azobisisobutyronitrile, p-toluenesulfonyl semicarbazide, 5-morpholyl-1,2,3,4-thiatriazole, N,N-dinitrosoterephthalamide, water, ammonium carbonate, ammonium bicarbonate, ammonium nitrite, ammonium borohydride, azides, etc. In addition to the above compounds, the above chemical blowing agent may also contain urea or the like as a blowing aid.

[0130] The blowing agent of this embodiment can be used in a variety of products in which physical blowing agents are generally used in the manufacturing process. A specific application is as a blowing agent used in the manufacture of rigid polyurethane foam. Conventionally, CFCs and HCFCs have been widely used as blowing agents for rigid polyurethane foam, and this is one area where the demand for alternative materials is increasing. The blowing agent of this embodiment can be suitably used as a substitute for CFCs and HCFCs as a blowing agent for rigid polyurethane foam.

[0131] (Lubricant) This embodiment also relates to a lubricant.

[0132] The lubricant of this embodiment comprises the composition of this embodiment. In a preferred embodiment, the lubricant of this embodiment comprises the composition of this embodiment as a diluent solvent for diluting the lubricant component.

[0133] The lubricant component may be in liquid, grease, or solid form. The lubricant component may be any of the known lubricants, such as mineral oil-based, synthetic oil-based, fluorine-based, or silicone-based lubricants. There may be one lubricant component or two or more.

[0134] As the mineral oil-based lubricant component, various commercially available lubricant components such as paraffin oil-based or naphthenic oil-based components may be used.

[0135] As components of the synthetic oil-based lubricant, alkylbenzene, poly(α-olefin), ester, polyol ester, polyalkylene glycol, polyvinyl ether, etc. may be used.

[0136] Specific examples of alkylbenzenes include n-octylbenzene, n-nonylbenzene, n-decylbenzene, n-undecylbenzene, n-dodecylbenzene, n-tridecylbenzene, 2-methyl-1-phenylheptane, 2-methyl-1-phenyloctane, 2-methyl-1-phenylnonane, 2-methyl-1-phenyldecane, 2-methyl-1-phenylundecane, 2-methyl-1-phenyldodecane, and 2-methyl-1-phenyltridecane.

[0137] Specific examples of esters include aromatic esters such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, and mixtures thereof, as well as dibasic acid esters, polyol esters, complex esters, and carbonate esters.

[0138] Examples of alcohols used as raw materials for polyol esters include polyhydric alcohols such as neopentyl glycol, trimethylolethane, trimethylolpropane, trimethylolbutane, di(trimethylolpropane), tri(trimethylolpropane), pentaerythritol, di(pentaerythritol), and tri(pentaerythritol). Examples of carboxylic acids used as raw materials for polyol esters include valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, oleic acid, isopentanoic acid, 2-methylhexanoic acid, 2-ethylpentanoic acid, 2-ethylhexanoic acid, and 3,5,5-trimethylhexanoic acid.

[0139] Examples of polyalkylene glycols include compounds obtained by addition polymerization of alkylene oxides (e.g., ethylene oxide, propylene oxide, butylene oxide, etc.) with an alcohol having 1 to 18 carbon atoms (e.g., aliphatic alcohols such as methanol, ethanol, linear or branched propanol, linear or branched butanol, linear or branched pentanol, linear or branched hexanol, etc.).

[0140] Examples of polyvinyl ethers include polymethyl vinyl ether, polyethyl vinyl ether, poly-n-propyl vinyl ether, and polyisopropyl vinyl ether.

[0141] Examples of fluorine-based lubricant components include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-ethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), and perfluoropolyether.

[0142] Examples of silicone-based lubricant components include dimethyl silicone, methyl hydrogen silicone, methylphenyl silicone, cyclic dimethyl silicone, and modified silicone oil.

[0143] From the viewpoint of appropriately adjusting the film thickness of the lubricant coating, the content of the above-mentioned lubricant components is preferably 0.01 to 50% by mass, more preferably 0.1 to 30% by mass, and even more preferably 0.2 to 20% by mass, relative to the total lubricant of this embodiment.

[0144] The lubricant of this embodiment is C6F, depending on the application. 12 The lubricant of this embodiment may contain additional compounds other than the compound represented by as other solvent components. The type of such solvent component is not particularly limited and may include various solvent components that are generally used as solvents or diluents for lubricants. When the lubricant of this embodiment contains other solvent components, from the viewpoint of compatibility with fluorine-based lubricant components or silicone-based lubricant components, and from the viewpoint of reducing the GWP of the lubricant, the other solvent component is preferably a hydrofluoroolefin, a hydrofluoroether, or a hydrofluorocarbon. Also from a similar viewpoint, C6F in the lubricant of this embodiment 12The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total amount of the solvent component.

[0145] The lubricant of this embodiment may contain other additives besides the solvent and lubricant components described above, depending on the application, as long as the properties of the lubricant are not impaired. These other additives may be various additives known in the art, such as antioxidants, wear inhibitors, rust inhibitors, thickeners, structural stabilizers, fluorescent agents, colorants, and surfactants. The lubricant may contain one or more of these additives.

[0146] The lubricant of this embodiment can be applied to any sliding parts such as metal, resin, and rubber to prevent frictional heat and wear on the contact surface.

[0147] (Cleaning agent) This embodiment also relates to a cleaning agent.

[0148] The cleaning agent of this embodiment comprises or consists of the composition of this embodiment.

[0149] The cleaning agent of this embodiment may contain the composition of this embodiment as a cleaning agent component, or as a solvent for the cleaning agent component, depending on the application. In either case, the composition of this embodiment is C6F 12The product may also contain additional compounds different from the compound represented by as a detergent or solvent component.Examples of such additional cleaning agent or solvent components include halogenated hydrocarbons such as 1-bromo-2-methylpropane, trichlorofluoromethane, dichlorodifluoromethane, trichlorotrifluoroethane, 1,1,1,4,4,4-hexafluorobutane, 1,1,1,3,3-pentafluorobutane, 1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane, 1,1,1,2,2,3,3,4,4-nonafluorohexane, and 1,1,2,2,3,3,4-heptafluorocyclopentane, 2,3,3,4,4, 5,5-heptafluoro-1-pentene, 3,3,4,4,5,5,6,6,6-nonafluoro-1-hexene, 1-fluorooctane, 1-chloro-2,3,3,3-tetrafluoropropene, tetrachloroethylene, 1,1-dichloro-2-fluoroethylene, 1-chloro-3,3,3-trifluoropropene, and other halogenated olefins, CHF2-O-CHF2, CHF2-O-CH2F, CHF2-CF2-O-CH3, CH2F-O-CHF-CH2F, CHF2-CHF-O-CH2F, CF3-O-CHF-CH3, CF3-CHF-O Hydrofluoroethers such as -CH3, CHF2-O-CH2-CHF2, CF3-O-CH2-CH2F, CF3-CH2-O-CH2F, CF2H-CF2-CF2-O-CH3, CF3CF2CF2-O-CH3, C4H9-O-CF3, C4F9-O-C2H5 or C3F7-O-C3F7, hydrocarbons such as n-hexane, isohexane, cyclohexane, ethylcyclohexane, methylcyclohexane, n-heptane, isoheptane, n-octane, isooctane, n-nonane, isononane, n-decane, isodecane, methanol, etc. Examples include alcohols such as tanol, propanol, isopropanol, 1-hexanol, 2-hexanol, 2-ethylhexanol, or 1-octanol; ethers such as dimethyl ether, methyl ethyl ether, diethyl ether, methyl propyl ether, methyl isopropyl ether, ethyl propyl ether, ethyl isopropyl ether, dipropyl ether, or diisopropyl ether; ketones such as methyl ethyl ketone, methyl isobutyl ketone, or perfluoroethyl isopropyl ketone; or water.

[0150] C6F in the detergent of this embodiment 12 The content of the compound represented by may be any value depending on the intended use of the detergent in this embodiment. However, among the compounds listed above, GWP is C6F 12 A compound with a higher value than the compound represented by C6F 12 This also includes compounds that promote the decomposition of C6F in the detergent of this embodiment. 12 The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total detergent.

[0151] The cleaning agent of this embodiment may contain one or more stabilizers, additives, and other components, as long as they do not impair its performance as a cleaning agent.

[0152] Examples of stabilizers that may be included in the detergent of the present invention include 1,2-butylene oxide, 2,3-butylene oxide, propylene oxide, pentene oxide, epichlorohydrin, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, glycidyl acetate, glycidyl propionate, 1,2-epoxycyclopentane, styrene oxide, nitromethane, nitroethane, 1-nitropropane, 1,3-dioxolane, 1,4-dioxane, tetrahydrofuran, and the like. These may be used individually or in combination of two or more.

[0153] The additives may be various additives known in the art, such as water, ultraviolet absorbers, antioxidants, polymerization inhibitors, rust inhibitors, defoamers, surfactants, and chelating agents. These may be used individually or in combination of two or more.

[0154] Examples of UV absorbers include benzotriazole-based UV absorbers, benzophenone-based UV absorbers, and hindered amine-based UV absorbers.

[0155] Examples of the antioxidant include phenolic antioxidants such as 2,6-di-t-butyl-4-methylphenol, triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], amine antioxidants such as alkylated diphenylamine, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, N,N-di-sec-butyl-p-phenylenediamine, and the like.

[0156] Examples of the rust inhibitor include cyclohexylamine, dicyclohexylamine, N,N-bis(2-hydroxyethyl)-N-cyclohexylamine, and the like.

[0157] Examples of the surfactant include higher alcohol ethylene oxide adducts, alkylphenol ethylene oxide adducts, fatty acid ethylene oxide adducts, higher alkylamine ethylene oxide adducts, fatty acid esters of sorbitol and sorbitan, sucrose fatty acid esters, silicone surfactants, fluorine surfactants, and the like.

[0158] Other components that the cleaning agent of the present embodiment may contain include ethanol, methanol, 1-propanol, isopropyl alcohol, 1-butanol, methyl acetate, ethyl acetate, normal propyl acetate, amyl acetate, ethyl lactate, γ-butyrolactone, dimethyl carbonate, dimethyl oxalate, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether, limonene, pinene, myrcene, linalool, terpineol, and the like. The cleaning agent of the present embodiment may contain these components as fragrances or as impurities or the like.

[0159] The cleaning agent of this embodiment can be suitably used as a cleaning agent for dirt such as oils and fats adhering to various substrates. Specific types of dirt include oil dirt such as mineral oil, vegetable oil, animal oil, heavy oil, wax, silicone oil, and fluorine oil, dirt derived from rosin-based flux, resin dirt such as urethane resin, epoxy resin, acrylic resin, silicone resin, ABS resin, polyamide resin, polyvinyl chloride resin, polyester resin, acrylic resin, and polylactic acid resin, etc. The above-mentioned dirt components are derived from, for example, cutting oil, press oil, drawing oil, heat treatment oil, rust preventive oil, lubricating oil, metal processing oil, plastic processing oil, grease, asphalt, water-soluble oil, solder, heat insulating material, coating for electronic substrate, adhesive, etc., and can be used for various articles where these can be used, such as glass, window, substrate, display, lens, lighting fixture, automobile parts, interior of automobiles, industrial valves, gears, bearings, pump parts, pipes, building materials, paint filaments, etc.

[0160] [Embodiment 2] (Composition containing hexafluoropropene dimer) The composition of this embodiment contains a compound represented by C6F 12 Further, the composition of this embodiment further contains a compound represented by C6HF 11 and, with respect to 100 parts by mass of the total amount of the hexafluoropropene dimer represented by the said C6F 12 , the concentration of the compound represented by the said C6HF 11 is 0.0001 to 0.1 part by mass.

[0161] C6F 12 As the compound represented by, known compounds represented by C6F 12 can be widely adopted, and there is no particular limitation. However, it is preferable that the compound represented by C6F 12 in this specification does not contain cycloalkane, and it is more preferably a hexafluoropropene (HFP) dimer.

[0162] Such C6F 12Examples of compounds represented by include hexafluoropropene dimers, and more specifically, dimers containing at least one compound selected from the group consisting of compounds represented by the following formulas (I) and (II).

[0163] [ka]

[0164] In this specification, the above C6F 12 The compounds represented by [formula] preferably include both the E and Z geometric isomers, unless otherwise specified.

[0165] C6F included in the composition of this embodiment 12 The compound represented by the above formulas (I) and (II) may contain only one of the compounds represented by the above formulas, or it may be a mixture containing both.

[0166] When the composition of this embodiment contains the compound represented by formula (I) above, the ratio of the E-isomer to the Z-isomer of the compound, E / (E+Z), is preferably greater than 0.5 (i.e., the ratio of the E-isomer is greater than that of the Z-isomer), more preferably 0.67 or higher, even more preferably 0.8 or higher, even more preferably 0.91 or higher, particularly preferably 0.95 or higher, and most preferably 0.965 or higher. Since the E-isomer of the compound represented by formula (I) is more thermodynamically stable than the Z-isomer, if E / (E+Z) is within the above range, decomposition during long-term use can be suppressed.

[0167] Furthermore, in this embodiment, E / (E+Z) of the compound represented by formula (I) may be 1.

[0168] C6F 12 The content of the compound represented by formula (I) in the compound represented by (for example, the total of compounds represented by formulas (I) and (II) is C6F 12The content of the compound represented by formula (I) is preferably 10% by mass or more, more preferably 50% by mass or more, even more preferably 80% by mass or more, even more preferably 90% by mass or more, particularly preferably 95% by mass or more, and particularly more preferably 98% by mass or more. 12 With respect to the total amount of HFP dimer expressed by mass% or less, 90 mass% or more and 100 mass% or less, 10 mass% or more and 98 mass% or less, 30 mass% or more and 98 mass% or less, 50 mass% or more and 98 mass% or less, 70 mass% or more and 98 mass% or less, 9 0 mass% or more and 98 mass% or less, 10 mass% or more and 96 mass% or less, 30 mass% or more and 96 mass% or less, 50 mass% or more and 96 mass% or less, 70 mass% or more and 96 mass% or less, 90 mass% or more9 6 mass% or less, 40 mass% or more and 95 mass% or less, 60 mass% or more and less than 95 mass%, 80 mass% or more and less than 95 mass%, 30 mass% or more and less than 85 mass%, 50 mass% or more and less than 85 mass%, 7 It may be 0% by mass or more and less than 85% by mass, 40% by mass or more and 80% by mass or less, 55% by mass or more and 80% by mass or less, 60% by mass or more and 75% by mass or less, 65% by mass or more and 70% by mass or less, 35% by mass or more and 60% by mass or less, 50% by mass or more and 60% by mass or less, 70% by mass or more and 90% by mass or less, 80% by mass or more and 100% by mass or less, 80% by mass or more and 95% by mass or less, 80% by mass or more and 90% by mass or less, 85% by mass or more and 100% by mass or less, 90% by mass or more and 100% by mass or less, or 85% by mass or more and 95% by mass or less, preferably 50% by mass or more and 100% by mass or less, preferably 60% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, and even more preferably 95% by mass or more and 100% by mass or less.

[0169] Similarly, regarding the content of the compound represented by formula (II), C6F 12The amount of the total amount of HFP dimers represented by is preferably 1% by mass or less, more preferably 0.5% by mass or less, and even more preferably 0.2% by mass or less.

[0170] C6F contained in the composition of this embodiment 12 The content of the compound represented by is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 60% by mass or more, and particularly preferably 80% by mass or more, relative to the total composition of this embodiment. Also, C6F is included in the composition of this embodiment. 12 The content of the compound represented by is preferably 99.9999% by mass or less of the total composition of this embodiment.

[0171] The compounds represented by formulas (I) and (II) above may be produced by conventional methods, for example, by the method described in Chinese Patent Application Publication No. 103787824, and are not limited thereto. They may also be obtained by dimerization using HFP as a raw material, and are not limited thereto; they may be obtained by employing a wide range of known methods.

[0172] The composition of this embodiment contains C6F compounds other than those represented by formula (I) or (II). 12 It may contain a hexafluoropropene dimer represented by .

[0173] The composition of this embodiment may contain a hexafluoropropene trimer, and may contain, for example, one or more compounds represented by the following formulas (A) to (C). [ka]

[0174] The composition of this embodiment may contain a hexafluoropropene tetramer.

[0175] The hexafluoropropene tetramer may include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0176] The composition of this embodiment further contains a compound represented by C6HF 11 The composition contains a compound represented by C6HF 11 The concentration of the compound represented by C6HF 12 is 0.0001 part by mass or more, more preferably 0.0005 part by mass or more, and still more preferably 0.001 part by mass or more with respect to 100 parts by mass of the total amount of the hexafluoropropene dimer represented by C6F 11 By setting the concentration of the compound represented by C6HF 12 to 0.0001 part by mass or more, the decomposition of the hexafluoropropene dimer represented by C6F

[0177] Also, the concentration of the compound represented by C6HF 11 contained in the composition of this embodiment is preferably 0.1 part by mass or less, more preferably 0.05 part by mass or less, and still more preferably 0.01 part by mass or less with respect to 100 parts by mass of the total amount of the hexafluoropropene dimer represented by C6F 12 By setting the concentration of the hexafluoropropene dimer represented by C6HF 11 to 0.1 part by mass or less, the decomposition of the hexafluoropropene dimer represented by C6F 12 can be suppressed.

[0178] As the compound represented by C6HF 11 widely known compounds represented by C6HF 11 can be widely adopted and are not particularly limited. However, the compound represented by C6HF 11 in this specification preferably does not contain cycloalkanes, and more preferably is a compound in which one fluorine atom of any one of the hexafluoropropene (HFP) dimers is substituted with a hydrogen atom.

[0179] C6HF11 Examples of specific structures of compounds represented by the formula are shown below. [ka]

[0180] In a preferred embodiment, the composition of this embodiment is C6HF 11 The compound represented by includes at least one of the following: [ka]

[0181] In this specification, the above C6HF 11 The compounds represented by include both the E and Z geometric isomers unless otherwise specified.

[0182] C6HF contained in the composition of this embodiment 11 The compound represented by the above formula may contain only one of the compounds represented by the above formula, or it may be a mixture containing two or more compounds.

[0183] The composition of this embodiment may further contain water. The water content is as described above for C6F. 12 The amount of water is 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, and even more preferably 0.001 parts by mass or more, per 100 parts by mass of the total amount of hexafluoropropene dimer represented by . By setting the concentration of water to 0.0001 parts by mass or more, the stability of the composition can be maintained and the charging of the composition can be suppressed.

[0184] Furthermore, the water content in the composition of this embodiment is the same as C6F. 12For every 100 parts by mass of the total amount of hexafluoropropene dimer represented by , the amount of water is preferably 0.1 parts by mass or less, more preferably 0.05 parts by mass or less, even more preferably 0.01 parts by mass or less, particularly preferably 0.005 parts by mass or less, and most preferably 0.004 parts by mass or less. By making the water content 0.1 parts by mass or less, C6F is released during heating. 12 This can suppress the decomposition of the compound represented by [formula], thereby suppressing the increase in fluoride ions and the rise in acidity. Furthermore, by reducing the water content to 0.004 parts by mass or less, rusting of the container can be suppressed.

[0185] In one embodiment, the water content is preferably 0.0001% by mass or more, more preferably 0.0005% by mass or more, and even more preferably 0.001% by mass or more, relative to the entire composition.

[0186] In one embodiment, the water content is preferably 0.1% by mass or less, more preferably 0.05% by mass or less, even more preferably 0.01% by mass or less, and particularly preferably 0.005 parts by mass or less, relative to the entire composition.

[0187] The composition of this embodiment has improved dielectric strength by including a predetermined amount of water. The dielectric strength of the composition of this embodiment may preferably be 40kV or higher, preferably 50kV or higher, and more preferably 60kV or higher.

[0188] The composition of this embodiment may further contain fluoride ions. The amount of fluoride ions in the composition is preferably 0.0000001% by mass or more, more preferably 0.000001% by mass or more, and particularly preferably 0.00001% by mass or more, relative to the entire composition.

[0189] Furthermore, the amount of fluoride ions contained in the composition of this embodiment is preferably 5% by mass or less, more preferably 1% by mass or less, more preferably 0.1% by mass or less, more preferably 0.01% by mass or less, even more preferably 0.001% by mass or less, and particularly preferably 0.0001% by mass or less, relative to the entire composition.

[0190] Any known fluoride ion source can be widely used as the fluoride ion source, and there are no particular limitations. Specifically, examples include ions of hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride. Only one of these may be included, or multiple types may be included. Preferably, the fluoride ion source is hydrogen fluoride.

[0191] In addition to the above, the composition of this embodiment also includes C m F 2m and / or C n F (2n-2) The formula may include the following: [wherein m is an integer between 4 and 12, not 6; and n is an integer between 4 and 12, not 6.]

[0192] m is an integer greater than or equal to 4, preferably greater than or equal to 5, and more preferably greater than or equal to 6. Also, n is an integer less than or equal to 12, preferably less than or equal to 11, and more preferably less than or equal to 10. However, m does not include 6.

[0193] n is an integer greater than or equal to 4, preferably greater than or equal to 5, and more preferably greater than or equal to 6. Furthermore, n is an integer less than or equal to 12, preferably less than or equal to 11, and more preferably less than or equal to 10. In addition, n is particularly preferably 6.

[0194] C m F 2mThis may be a linear compound or a cyclic compound that may have a substitutional structure. The linear compound may be a so-called alkene, and may be linear or branched.

[0195] C n F (2n-2) This may be a linear compound or a cyclic compound that may have a substitutional structure. The linear compound may be a so-called diene or an alkyne, and may be linear or branched.

[0196] Also, C m F 2m and / or C n F (2n-2) The content of is preferably 0.0001% by mass or more relative to the entire composition of this embodiment.

[0197] On the other hand, C m F 2m and / or C n F (2n-2) The content of is preferably 10% by mass or less, preferably 5% by mass or less, and more preferably 1% by mass or less, relative to the total composition of this embodiment.

[0198] In one embodiment, in the composition, C m F 2m and / or C n F (2n-2) The content is C6F 12 The amount is preferably 0.0001 parts by mass or more, more preferably 0.01 parts by mass or more, and even more preferably 0.1 parts by mass or more, based on a total of 100 parts by mass of the compounds represented by .

[0199] On the other hand, in the composition, C m F 2m and / or C n F (2n-2) The content is C6F 12 It is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, based on a total of 100 parts by mass of the compounds represented by [formula].

[0200] Note C m F 2m and / or C n F (2n-2) If multiple types are included, the above content refers to the total amount of each.

[0201] C m F 2m and / or C n F (2n-2) By setting the content of C6F within the above range, 12 This can suppress the decomposition of the HFP dimer represented by [formula], and consequently, it can suppress the increase in fluoride ions and the rise in acidity.

[0202] The composition of this embodiment is C6F 12 The compound may include additional compounds other than those represented by [the formula]. These additional compounds may be one or more types. Examples of additional compounds include perfluoropolyethers.

[0203] Perfluoropolyethers are preferably of the general formula: RO-RF 1 -R' It is represented as, During the ceremony, R and R' are the same or different, -C m F 2m+1 It is a single-valued base represented by , where m is an integer from 1 to 8, and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, wherein the repeating units are: (i) -CFXO-, (wherein X is F or CF3); (ii) -CF2CFXO-(wherein X is F or CF3); (iii) -CFXCF2O-(wherein X is F or CF3); (iv) -CF2CF2CF2O-; or (v) Represented as -CF2CF2CF2CF2O-, or Rf1 teeth, (vi) -(CF2) n -CFY-O-(wherein n is an integer from 0 to 3, and Y is the general formula -ORf 2 A monovalent group represented by Z, where Rf 2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, represented as -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different F or CF3, and Z is a monovalent C 1-5 It is a divalent group represented as a perfluoroalkyl group.

[0204] Examples of perfluoropolyethers include the product name GALDEN® "HT55" (manufactured by Solvay).

[0205] (Heat transfer fluid) This embodiment also relates to a heat transfer fluid.

[0206] The heat transfer fluid of this embodiment includes or consists of the composition of this embodiment.

[0207] If the heat transfer fluid of this embodiment includes the above-mentioned perfluorotripropylamine, perfluoropolyether, and methoxytridecafluoroheptene isomer mixture, then these and C6F 12 Since the compounds represented by have similar properties as heat transfer fluids, the properties as heat transfer fluids remain basically unchanged regardless of their content ratio. Therefore, in this case, the entire heat transfer fluid of this embodiment is C6F 12 The compound represented by is preferably present in an amount of 40% to 99.9% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total heat transfer fluid.

[0208] The heat transfer fluid of this embodiment may contain any additives other than those described above, as long as they do not hinder its effects and purpose. Examples of such additives include stabilizers.

[0209] Stabilizers exert their functions as so-called acid acceptors or antioxidants by exhibiting stabilizing effects. Major stabilizing effects include preventing the decomposition of HFP dimers by capturing radicals generated in the system, and preventing further decomposition of HFP dimers by acids generated in the system.

[0210] A wide range of known stabilizers can be used as such stabilizers. In particular, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers, as these can effectively suppress the occurrence of metal corrosion caused by the composition.

[0211] A wide range of known unsaturated alcohol-based stabilizers can be used. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadiene-1-ol, and oleyl alcohol can be used.

[0212] As nitro-based stabilizers, a wide range of known types can be used. Examples of aliphatic nitro compounds include nitromethane, nitroethane, 1-nitropropane, and 2-nitropropane. As aromatic nitro compounds, one or more selected from the group consisting of nitrobenzene, o-, m-, or p-dinitrobenzene, o-, m-, or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m-, or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole can be used.

[0213] A wide range of known amine-based stabilizers can be used. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dibentilyamine, tribentilyamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine, and diethylhydroxylamine can be used.

[0214] A wide range of known phenolic stabilizers can be used. For example, one or more selected from the group consisting of 2,6-ditterybutyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0215] A wide range of known epoxy stabilizers can be used. For example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0216] By using a combination of stabilizers with different stabilizing effects, C6F that can occur due to various causes can be controlled. 12 For the reason that it more effectively prevents the decomposition of the compound represented by the above, it is preferable that the stabilizer consists of one or more selected from the group consisting of epoxy-based stabilizers, unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers.

[0217] C6F 12 From the viewpoint of effectively suppressing acid liberation from the compound represented by and inhibiting metal corrosion by the liquid composition, the stabilizer content relative to the total heat transfer fluid is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, considering the need to avoid undesirable changes in the physical properties of the liquid composition due to excessive addition of stabilizers, the stabilizer content relative to the total heat transfer fluid is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0218] The heat transfer fluid of this embodiment is used to remove heat from or supply heat to various objects to be heated, and can be applied, for example, as a medium for immersion cooling such as single-phase immersion cooling and two-phase immersion cooling, as well as for chiller fluids, Rankine cycle working fluids, and the like.

[0219] In this embodiment, the objects to which heat is transferred are articles, devices, and atmospheres that are cooled, heated, or maintained at a temperature to be controlled. Examples of such objects to which heat is transferred include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of objects to which heat is transferred in this embodiment are not particularly limited, but include wafers used to manufacture semiconductor devices, microprocessors, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components.

[0220] The heat transfer fluids of this embodiment can be used as a substitute for the heat transfer fluid currently in use in equipment designed to transfer heat using these fluids.

[0221] The heat transfer fluid of this embodiment can be used as a drop-in replacement, nearly drop-in replacement, or retrofit replacement for a heat transfer fluid that is currently in use. "Drop-in replacement" means that the replacement can be done without any changes to the equipment. "Nearly drop-in replacement" means that the replacement can be done with little to no changes to the equipment. "Retrofit replacement" means that the replacement can be done with minimal changes to the equipment (without significant changes). Preferably, the heat transfer fluid of this embodiment can be used as a drop-in replacement or nearly drop-in replacement for the heat transfer fluid described above.

[0222] Whether a drop-in alternative, a near-drop-in alternative, or a retrofit alternative is possible can be determined by whether all of the following conditions are met. (i) The boiling point of the heat transfer fluid is at least about 80% of the boiling point of the heat transfer fluid before replacement, preferably at least about 85%. (ii) The freezing point of the heat transfer fluid is equal to or lower than the freezing point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement. (iv) The heat transfer fluid is compatible with the heat transfer fluid before replacement in any proportion.

[0223] By setting the boiling point of the heat transfer fluid in this embodiment to at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, the occurrence of cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but for example, it may be at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0224] By setting the pour point of the heat transfer fluid in this embodiment to be equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it at temperatures below the conventional operating temperature, thereby widening the operating temperature range. There is no particular upper limit to the pour point of the heat transfer fluid, but for example, it may be 30°C higher or lower than the pour point of the heat transfer fluid before replacement.

[0225] By setting the kinematic viscosity of the heat transfer fluid in this embodiment to at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement, it is possible to suppress an increase in power consumption or reduce power consumption. It is preferable to compare the kinematic viscosity at the operating temperature, but is not limited to this, and for example, it can be compared at any temperature between -20°C and -40°C, specifically at -20°C.

[0226] The heat transfer fluid of this embodiment is compatible with the heat transfer fluid used before replacement in any ratio, which facilitates the replacement process.

[0227] Furthermore, the heat transfer fluid of this embodiment is more suitable as a drop-in replacement, nearly drop-in replacement, or retrofit replacement if it satisfies the following conditions. (v) The heat transfer fluid in this embodiment has a dielectric constant of 120% or less of the heat transfer fluid before replacement. (vi) The heat transfer fluid of this embodiment has an dielectric strength of 90% or more of the heat transfer fluid before replacement. (vii) The heat transfer fluid of this embodiment has an specific heat of 90% or more of the heat transfer fluid before replacement. (viii) The heat transfer fluid in this embodiment has a thermal conductivity of 90% or more of the heat transfer fluid before replacement.

[0228] By setting the dielectric constant of the heat transfer fluid in this embodiment to 120% or less of the dielectric constant of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the dielectric constant of the heat transfer fluid, but for example, it may be 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0229] By setting the dielectric strength of the heat transfer fluid in this embodiment to 90% or more of the dielectric strength of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0230] By setting the specific heat of the heat transfer fluid in this embodiment to 90% or more of the specific heat of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the specific heat of the heat transfer fluid, but for example, it may be 120% or less of the specific heat of the heat transfer fluid before replacement.

[0231] By setting the thermal conductivity of the heat transfer fluid in this embodiment to 90% or more of the thermal conductivity of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the thermal conductivity of the heat transfer fluid, but for example, it may be 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0232] The boiling point of the heat transfer fluid in this embodiment is preferably 40°C or higher, more preferably 45°C or higher. Furthermore, the upper limit of the boiling point of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, 80°C or lower, 70°C or lower, or 60°C or lower.

[0233] The pour point of the heat transfer fluid in this embodiment is preferably -80°C or lower, more preferably -90°C or lower, and even more preferably -100°C or lower. Furthermore, the lower limit of the pour point of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, -160°C or higher, or -140°C or higher.

[0234] The kinematic viscosity of the heat transfer fluid in this embodiment is preferably 4.0 cSt or less, more preferably 3.0 cSt or less, even more preferably 2.0 cSt or less, and even more preferably 1.5 cSt or less at -20°C. Furthermore, the lower limit of the kinematic viscosity of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, 0.2 cSt or more.

[0235] The dielectric constant of the heat transfer fluid in this embodiment is preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. Furthermore, the lower limit of the dielectric constant of the heat transfer fluid in this embodiment is not particularly limited, but it may be, for example, 1.1 or more.

[0236] The dielectric strength of the heat transfer fluid in this embodiment is preferably 40kV or higher, more preferably 50kV or higher, and even more preferably 50kV or higher. Furthermore, there is no particular upper limit to the dielectric strength of the heat transfer fluid in this embodiment, but it may be, for example, 150kV or less, or 100kV or less.

[0237] The specific heat of the heat transfer fluid in this embodiment is preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and even more preferably 1000 J / kg·K or more at 30°C. Furthermore, there is no particular upper limit to the specific heat of the heat transfer fluid in this embodiment, but it may be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0238] The thermal conductivity of the heat transfer fluid in this embodiment is preferably 0.055 W / mK or higher, more preferably 0.060 W / mK or higher, at 30°C. Furthermore, there is no particular upper limit to the thermal conductivity of the heat transfer fluid in this embodiment, but it may be, for example, 0.090 W / mK or lower, or 0.080 W / mK or lower.

[0239] The boiling point of the heat transfer fluid in this embodiment is the temperature at which a peak originating from endothermic heating was observed when the temperature was increased from 25°C at a rate of 5°C / min, using DSC (Dynamic Scanning Calorimetry).

[0240] The pour point of the heat transfer fluid in this embodiment is the temperature at which a peak originating from endothermic heating is observed when the fluid is cooled to below its freezing point with liquid nitrogen using DSC, and then heated at a rate of 5°C / min.

[0241] The dielectric constant of the heat transfer fluid in this embodiment is the value observed at a frequency of 1 kHz under conditions of 25°C and 60% humidity, using the capacitance method.

[0242] The kinematic viscosity and density of the heat transfer fluid in this embodiment were measured using an Anton Paar SVM3001 kinematic viscometer.

[0243] The dielectric strength of the heat transfer fluid in this embodiment is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined interval and the voltage is increased at a constant rate. The measurement conditions are as follows. Electrode shape: Spherical (φ12.5mm) Electrode spacing: 2.5mm Boost speed: 2kV / second Measurement environment: Air (22°C, 57%RH)

[0244] The specific heat of the heat transfer fluid in this embodiment is a value obtained using DSC under the following conditions. Measurement device: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10°C / min Standard sample: Sapphire (-Al2O3) Atmosphere: Dry nitrogen stream Sample container: Aluminum airtight container

[0245] The thermal conductivity of the heat transfer fluid in this embodiment is a value obtained by the transient nanowire method.

[0246] The compatibility of the heat transfer fluid in this embodiment is determined by whether or not it becomes compatible when mixed with the target solvent. Here, compatibility means that when the two are mixed, they become a uniform state, that is, the phases do not separate.

[0247] (Heat transfer device) This embodiment further discloses a heat transfer device comprising a device and a mechanism for transferring heat to or from the device, which includes the heat transfer fluid described above.

[0248] Examples of devices include computers, server computers, servers including blade servers; disk arrays / storage systems; storage area networks; network-connected storage; storage communication systems; workstations; routers; telecommunications infrastructure / switches; wired, optical and wireless communication equipment; cell processing equipment; printers; power supplies; displays; optical devices; measurement systems including handheld systems; and military electronic equipment.

[0249] In different terms, the device may be a component, workpiece, assembly, etc., that is cooled, heated, or maintained at a predetermined temperature or temperature range. Examples of such devices include electrical components, mechanical components, and optical components. Specifically, examples include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, power distribution switches, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, lasers, chemical reactors, fuel cells, heat exchangers, and electrochemical cells. In some embodiments, the device may include a cooler, a heater, or a combination thereof.

[0250] Semiconductor elements are heat-generating elements mounted in devices, such as CPUs, GPUs, and SSDs. These semiconductor elements are composed of single elements such as silicon and germanium, and compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC).

[0251] If the device is a server computer, one or more logic boards are located within its internal space. A logic board contains numerous heat-generating electronic components, including at least one processor such as a CPU or GPU. In addition, other heat-generating components of the computer may also be used, such as chipsets; memory, graphics chips, network chips, RAM, power supplies, daughter cards; and storage drives such as solid-state drives and mechanical hard disks.

[0252] A heat transfer device is a device that uses the above-mentioned heat transfer fluid to transfer heat between itself and an object to be heated. Heat is exchanged (transferred) through thermal contact with the object to be heated. For example, removing heat from an object to be heated is called cooling, and supplying heat is called heating. Different mechanisms may be used depending on the case, but a single heat transfer device may be used to handle both cooling and heating.

[0253] There are no particular limitations on the heat transfer devices, and examples include pumps, valves, fluid confinement systems, pressure control systems, coolers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, and passive temperature control systems.

[0254] More specifically, these include temperature-controlled wafer chucks in plasma-enhanced chemical vapor deposition (PECVD) tools, temperature-controlled test heads for die performance testing, temperature-controlled work areas in semiconductor process equipment, thermal shock test bath reservoirs, and constant temperature baths.

[0255] The object to be subjected to heat transfer, which is brought into thermal contact with the heat transfer device, is an article, device, or atmosphere that is cooled, heated, or maintained at a temperature to be controlled. Examples of such objects to be subjected to heat transfer include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of objects to be subjected to heat transfer in this embodiment include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components.

[0256] When using the heat transfer device of this embodiment, the temperature conditions for the composition of this embodiment are preferably -100 to 45°C, more preferably -90 to 45°C, and even more preferably -70 to 45°C. The heat transfer fluid of this embodiment has the advantage of exhibiting low kinematic viscosity even at low temperatures below -20°C, and especially low kinematic viscosity at -70 to -60°C, so the device can be suitably used even in the above temperature range.

[0257] (Heat Transfer Method) This embodiment further discloses a heat transfer method comprising the steps of preparing a device and transferring heat to or from the device using the heat transfer fluid described above. Here, heat can be transferred by positioning a heat transfer device in thermal contact with the device. When the heat transfer device is positioned in thermal contact with the device, it removes heat from the device, supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of the heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer device.

[0258] (Foaming agent) This embodiment also relates to a foaming agent.

[0259] The foaming agent of this embodiment comprises or consists of the composition of this embodiment.

[0260] The foaming agent in this embodiment is C6F 12 The compound may include additional compounds different from the compound represented by . The additional compounds may be one or more types. For example, C6F 12 Other examples include fluorine-substituted olefins, substituted or unsubstituted olefins other than fluorine-substituted olefins, halogenated hydrocarbons other than olefins, other organic compounds, or inorganic compounds.

[0261] C6F 12 Other fluorine-substituted olefins may include, for example, hydrofluoroolefins or hydrochlorofluoroolefins having 1 to 30 carbon atoms, specifically 1,3,3,3-tetrafluoropropene, 1,1,3,3-tetrafluoropropene, 1,2,3,3,3-pentafluoropropene, 1,1,1-trifluoropropene, 1,1,1,3,3-pentafluoropropene (HFO-1225zc), and 1,1,1,3,3,3-hexafluorobut-2-e Examples include octafluoro-2-butene, 1,1,2,3,3-pentafluoropropene, 1,1,1,2,3-pentafluoropropene, trans-1,2-dichloroethylene, 1-chloro-2,3,3,3-tetrafluoropropene, 2-chloro-1,3,3,3-tetrafluoropropene, 1-chloro-2,3,3,4,4,5,5-heptafluoropentene, 1,1-dichloro-2-fluoroethylene, and 1-chloro-3,3,3-trifluoropropene.

[0262] Other substituted or unsubstituted olefins besides fluorine-substituted olefins may include, for example, halogenated olefins having 1 to 30 carbon atoms, with specific examples including tetrachloroethylene, ethylene, propylene, and n-butene.

[0263] Examples of halogenated hydrocarbons other than olefins include difluoromethane, pentafluoroethane, 1,1,2,2-tetrafluoroethane, 1,1,1,2-tetrafluoroethane, difluoroethane, 1,1,1,2,3,3,3-heptafluoropropane, 1,1,1,3,3,3-hexafluoropropane, 1,1,1,3,3-pentafluoropropane, 1,1,1,3,3-pentafluorobutane, trichlorofluoromethane, dichlorodifluoromethane, trichlorotrifluoroethane, dichlorohexafluoropropane, 2,2,3-3-tetrachlorohexafluorobutane, dichlorooctafluorobutane, dichloromethane, trichloroethane, octafluoropropane, and 1,1,1,2,2,3,3-heptafluoropropane.

[0264] Other organic compounds include, for example, hydrocarbons such as methane, ethane, propane, n-butane, isobutane, n-pentane, isopentane, neopentane, cyclopentane, n-hexane, isohexane, n-heptane or n-octane, CHF2-O-CHF2, CHF2-O-CH2F, CHF2-CF2-O-CH3, CH2F-O-CHF-CH2F, CHF2-CHF-O-CH2F, CF3-O-CHF-CH3, CF3-CHF-O-CH3, CHF2-O-CH2-CHF2, CF3-O-CH2-CH2F, CF3-CH2-O-CH2F, CF2H-CF2-CF2-O-CH3, CF3CF2CF2-O-CH3, C4H9-O-CF3, and C4F9-O-C2 Examples include hydrofluoroethers such as H5 or C3F7-O-C3F7, methanol, ethanol, propanol, isopropanol, alcohols such as 1-hexanol, 2-hexanol, 2-ethylhexanol or 1-octanol, ethers such as dimethyl ether, methyl ethyl ether, diethyl ether, methyl propyl ether, methyl isopropyl ether, ethyl propyl ether, ethyl isopropyl ether, dipropyl ether or diisopropyl ether, ketones such as methyl ethyl ketone, methyl isobutyl ketone or perfluoroethyl isopropyl ketone, and organic acids such as methyl formate, ethyl formate or formic acid.

[0265] Examples of inorganic compounds include water, nitrogen, oxygen, argon, and carbon dioxide.

[0266] The foaming agent of this embodiment may contain the compounds listed above for any reason, such as for the purpose of being a co-foaming agent or vapor pressure regulator, or as a by-product during manufacturing.

[0267] C6F in the foaming agent of this embodiment 12 The content of the compound represented by may be any value depending on the intended use of the blowing agent in this embodiment. However, among the compounds listed above, if GWP is C6F 12 A compound with a higher value than the compound represented by C6F 12 This also includes compounds that promote the decomposition of C6F in the foaming agent of this embodiment. 12 The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total amount of the blowing agent.

[0268] The foaming agent of this embodiment may contain a foam stabilizer (bubble stabilizer) for the purpose of improving foaming properties. Examples of foam stabilizers include polyoxyalkylene foam stabilizers such as polyoxyalkylene alkyl ethers, and surfactants such as silicone foam stabilizers such as octamethylcyclotetrasiloxane and organopolysiloxane. These foam stabilizers may be used individually or in combination of two or more.

[0269] From the viewpoint of improving foaming properties, the content of the foam stabilizer relative to the total foaming agent in this embodiment is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and even more preferably 1% by mass or more. On the other hand, from the viewpoint of obtaining homogeneous foaming, the content of the foam stabilizer relative to the total foaming agent in this embodiment is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0270] The blowing agent of this embodiment may contain a flame retardant for the purpose of improving flame retardancy. Examples of flame retardants include phosphate esters, phosphate-containing flame retardants, bromine-containing flame retardants, and metal hydroxides.

[0271] As the phosphate ester, it is preferable to use monophosphate esters, condensed phosphate esters, etc. For example, trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri(2-ethylhexyl) phosphate, tributoxyethyl phosphate, triphenyl phosphate, tris(phenylphenyl) phosphate, trinaphthyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, 2-methacryloyloxyethyl acid phosphate, diphenyl-2-methacryloyloxyethyl phosphate Examples include tyl phosphate, melamine phosphate, dimelamine phosphate, melamine pyrophosphate, triphenylphosphine oxide, tricresylphosphine oxide, diethyl phenylphosphonate, resylcinol bis(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), trialkyl polyphosphate, resorcinol polyphenyl phosphate, resorcinol poly(di-2,6-xylyl) phosphate, hydroquinone poly(2,6-xylyl) phosphate, and condensates thereof.

[0272] Specific examples of phosphate-containing flame retardants include monophosphates and polyphosphates. Monophosphates are not particularly limited, but examples include ammonium salts such as ammonium phosphate, ammonium dihydrogen phosphate, and diammonium hydrogen phosphate; sodium salts such as monosodium phosphate, disodium phosphate, disodium phosphite, and sodium hypophosphite; potassium salts such as monopotassium phosphate, dipotassium phosphate, tripotassium phosphate, monopotassium phosphite, dipotassium phosphite, and potassium hypophosphite; lithium salts such as monolithium phosphate, dilithium phosphate, trilithium phosphate, monolithium phosphite, dilithium phosphite, and lithium hypophosphite; barium salts such as barium hydrogen phosphate and barium hypophosphite; magnesium salts such as magnesium monohydrogen phosphate, magnesium hydrogen phosphate, trimagnesium phosphate, and magnesium hypophosphite; calcium salts such as calcium dihydrogen phosphate, calcium hydrogen phosphate, tricalcium phosphate, and calcium hypophosphite; and zinc salts such as zinc phosphate, zinc phosphite, and zinc hypophosphite. Polyphosphates are not particularly limited, but examples include ammonium polyphosphate, piperazine polyphosphate, melamine polyphosphate, ammonium polyphosphate amide, and aluminum polyphosphate. One or more types of phosphate-containing flame retardants may be used.

[0273] From the viewpoint of improving flame retardancy, the flame retardant content relative to the total blowing agent in this embodiment is preferably 0.5% by mass or more, more preferably 2% by mass or more, and even more preferably 5% by mass or more. On the other hand, from the viewpoint of preventing foaming inhibition due to an excessive amount of flame retardant, the flame retardant content relative to the total blowing agent in this embodiment is preferably 50% by mass or less, and more preferably 30% by mass or less.

[0274] There are no particular limitations on bromine-containing flame retardants as long as they are compounds that contain bromine in their molecular structure, but examples include aromatic brominated compounds. Specific examples of aromatic brominated compounds include monomer-based organic bromine compounds such as hexabromobenzene, pentabromotoluene, hexabromobiphenyl, decabromobiphenyl, hexabromocyclodecane, hexabromodiphenyl ether, bis(pentabromphenoxy)ethane, ethylene-bis(tetrabromophthalimide), and tetrabromobisphenol A; brominated polycarbonates such as copolymers of polycarbonate oligomers and bisphenol A; poly(brominated benzyl acrylate), brominated polyphenylene ether, brominated bisphenol A, cyanuryl chloride, and brominated phenol condensates; brominated (polystyrene), poly(brominated styrene), and cross-linked brominated polystyrene. One or more types of bromine-containing flame retardants can be used.

[0275] Examples of metal hydroxides include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, iron hydroxide, nickel hydroxide, zirconium hydroxide, zinc hydroxide, titanium hydroxide, copper hydroxide, tin hydroxide, and vanadium hydroxide. One or more types of metal hydroxides can be used.

[0276] The blowing agent of this embodiment may be used alone as a physical blowing agent, or in combination with a known chemical blowing agent. Examples of the above chemical blowing agents include 4,4'-oxybis(benzenesulfonyl hydrazide), diphenylsulfon-3,3'-disulfonylhydrazide arylbis(sulfonyl hydrazide), p-toluenesulfonyl hydrazide, azodicarbonamide (ADCA), azobisformamide, azobisisobutyronitrile, p-toluenesulfonyl semicarbazide, 5-morpholyl-1,2,3,4-thiatriazole, N,N-dinitrosoterephthalamide, water, ammonium carbonate, ammonium bicarbonate, ammonium nitrite, ammonium borohydride, azides, etc. In addition to the above compounds, the above chemical blowing agent may also contain urea or the like as a blowing aid.

[0277] The blowing agent of this embodiment can be used in a variety of products in which physical blowing agents are generally used in the manufacturing process. A specific application is as a blowing agent used in the manufacture of rigid polyurethane foam. Conventionally, CFCs and HCFCs have been widely used as blowing agents for rigid polyurethane foam, and this is one area where the demand for alternative materials is increasing. The blowing agent of this embodiment can be suitably used as a substitute for CFCs and HCFCs as a blowing agent for rigid polyurethane foam.

[0278] (Lubricant) This embodiment also relates to a lubricant.

[0279] The lubricant of this embodiment comprises the composition of this embodiment. In a preferred embodiment, the lubricant of this embodiment comprises the composition of this embodiment as a diluent solvent for diluting the lubricant component.

[0280] The lubricant component may be in liquid, grease, or solid form. The lubricant component may be any of the known lubricants, such as mineral oil-based, synthetic oil-based, fluorine-based, or silicone-based lubricants. There may be one lubricant component or two or more.

[0281] As the mineral oil-based lubricant component, various commercially available lubricant components such as paraffin oil-based or naphthenic oil-based components may be used.

[0282] As components of the synthetic oil-based lubricant, alkylbenzene, poly(α-olefin), ester, polyol ester, polyalkylene glycol, polyvinyl ether, etc. may be used.

[0283] Specific examples of alkylbenzenes include n-octylbenzene, n-nonylbenzene, n-decylbenzene, n-undecylbenzene, n-dodecylbenzene, n-tridecylbenzene, 2-methyl-1-phenylheptane, 2-methyl-1-phenyloctane, 2-methyl-1-phenylnonane, 2-methyl-1-phenyldecane, 2-methyl-1-phenylundecane, 2-methyl-1-phenyldodecane, and 2-methyl-1-phenyltridecane.

[0284] Specific examples of esters include aromatic esters such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, and mixtures thereof, as well as dibasic acid esters, polyol esters, complex esters, and carbonate esters.

[0285] Examples of alcohols used as raw materials for polyol esters include polyhydric alcohols such as neopentyl glycol, trimethylolethane, trimethylolpropane, trimethylolbutane, di(trimethylolpropane), tri(trimethylolpropane), pentaerythritol, di(pentaerythritol), and tri(pentaerythritol). Examples of carboxylic acids used as raw materials for polyol esters include valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, oleic acid, isopentanoic acid, 2-methylhexanoic acid, 2-ethylpentanoic acid, 2-ethylhexanoic acid, and 3,5,5-trimethylhexanoic acid.

[0286] Examples of polyalkylene glycols include compounds obtained by addition polymerization of alkylene oxides (e.g., ethylene oxide, propylene oxide, butylene oxide, etc.) with an alcohol having 1 to 18 carbon atoms (e.g., aliphatic alcohols such as methanol, ethanol, linear or branched propanol, linear or branched butanol, linear or branched pentanol, linear or branched hexanol, etc.).

[0287] Examples of polyvinyl ethers include polymethyl vinyl ether, polyethyl vinyl ether, poly-n-propyl vinyl ether, and polyisopropyl vinyl ether.

[0288] Examples of fluorine-based lubricant components include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-ethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), and perfluoropolyether.

[0289] Examples of silicone-based lubricant components include dimethyl silicone, methyl hydrogen silicone, methylphenyl silicone, cyclic dimethyl silicone, and modified silicone oil.

[0290] From the viewpoint of appropriately adjusting the film thickness of the lubricant coating, the content of the above-mentioned lubricant components is preferably 0.01 to 50% by mass, more preferably 0.1 to 30% by mass, and even more preferably 0.2 to 20% by mass, relative to the total lubricant of this embodiment.

[0291] The lubricant of this embodiment is C6F, depending on the application. 12 The lubricant of this embodiment may contain additional compounds other than the compound represented by as other solvent components. The type of such solvent component is not particularly limited and may include various solvent components that are generally used as solvents or diluents for lubricants. When the lubricant of this embodiment contains other solvent components, from the viewpoint of compatibility with fluorine-based lubricant components or silicone-based lubricant components, and from the viewpoint of reducing the GWP of the lubricant, the other solvent component is preferably a hydrofluoroolefin, a hydrofluoroether, or a hydrofluorocarbon. Also from a similar viewpoint, C6F in the lubricant of this embodiment 12The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total amount of the solvent component.

[0292] The lubricant of this embodiment may contain other additives besides the solvent and lubricant components described above, depending on the application, as long as the properties of the lubricant are not impaired. These other additives may be various additives known in the art, such as antioxidants, wear inhibitors, rust inhibitors, thickeners, structural stabilizers, fluorescent agents, colorants, and surfactants. The lubricant may contain one or more of these additives.

[0293] The lubricant of this embodiment can be applied to any sliding parts such as metal, resin, and rubber to prevent frictional heat and wear on the contact surface.

[0294] (Cleaning agent) This embodiment also relates to a cleaning agent.

[0295] The cleaning agent of this embodiment comprises or consists of the composition of this embodiment.

[0296] The cleaning agent of this embodiment may contain the composition of this embodiment as a cleaning agent component, or as a solvent for the cleaning agent component, depending on the application. In either case, the composition of this embodiment is C6F 12The product may also contain additional compounds different from the compound represented by as a detergent or solvent component.Examples of such additional cleaning agent or solvent components include halogenated hydrocarbons such as 1-bromo-2-methylpropane, trichlorofluoromethane, dichlorodifluoromethane, trichlorotrifluoroethane, 1,1,1,4,4,4-hexafluorobutane, 1,1,1,3,3-pentafluorobutane, 1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane, 1,1,1,2,2,3,3,4,4-nonafluorohexane, and 1,1,2,2,3,3,4-heptafluorocyclopentane, 2,3,3,4,4, 5,5-heptafluoro-1-pentene, 3,3,4,4,5,5,6,6,6-nonafluoro-1-hexene, 1-fluorooctane, 1-chloro-2,3,3,3-tetrafluoropropene, tetrachloroethylene, 1,1-dichloro-2-fluoroethylene, 1-chloro-3,3,3-trifluoropropene, and other halogenated olefins, CHF2-O-CHF2, CHF2-O-CH2F, CHF2-CF2-O-CH3, CH2F-O-CHF-CH2F, CHF2-CHF-O-CH2F, CF3-O-CHF-CH3, CF3-CHF-O Hydrofluoroethers such as -CH3, CHF2-O-CH2-CHF2, CF3-O-CH2-CH2F, CF3-CH2-O-CH2F, CF2H-CF2-CF2-O-CH3, CF3CF2CF2-O-CH3, C4H9-O-CF3, C4F9-O-C2H5 or C3F7-O-C3F7, hydrocarbons such as n-hexane, isohexane, cyclohexane, ethylcyclohexane, methylcyclohexane, n-heptane, isoheptane, n-octane, isooctane, n-nonane, isononane, n-decane, isodecane, methanol, etc. Examples include alcohols such as tanol, propanol, isopropanol, 1-hexanol, 2-hexanol, 2-ethylhexanol, or 1-octanol; ethers such as dimethyl ether, methyl ethyl ether, diethyl ether, methyl propyl ether, methyl isopropyl ether, ethyl propyl ether, ethyl isopropyl ether, dipropyl ether, or diisopropyl ether; ketones such as methyl ethyl ketone, methyl isobutyl ketone, or perfluoroethyl isopropyl ketone; or water.

[0297] C6F in the detergent of this embodiment 12 The content of the compound represented by may be any value depending on the intended use of the detergent in this embodiment. However, among the compounds listed above, GWP is C6F 12 A compound with a higher value than the compound represented by C6F 12 This also includes compounds that promote the decomposition of C6F in the detergent of this embodiment. 12 The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total detergent.

[0298] The cleaning agent of this embodiment may contain one or more stabilizers, additives, and other components, as long as they do not impair its performance as a cleaning agent.

[0299] Examples of stabilizers that may be included in the detergent of the present invention include 1,2-butylene oxide, 2,3-butylene oxide, propylene oxide, pentene oxide, epichlorohydrin, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, glycidyl acetate, glycidyl propionate, 1,2-epoxycyclopentane, styrene oxide, nitromethane, nitroethane, 1-nitropropane, 1,3-dioxolane, 1,4-dioxane, tetrahydrofuran, and the like. These may be used individually or in combination of two or more.

[0300] The additives may be various additives known in the art, such as water, ultraviolet absorbers, antioxidants, polymerization inhibitors, rust inhibitors, defoamers, surfactants, and chelating agents. These may be used individually or in combination of two or more.

[0301] Examples of UV absorbers include benzotriazole-based UV absorbers, benzophenone-based UV absorbers, and hindered amine-based UV absorbers.

[0302] Examples of antioxidants include phenolic antioxidants such as 2,6-di-t-butyl-4-methylphenol, triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], and 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], and amine-based antioxidants such as alkylated diphenylamine, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, and N,N-di-sec-butyl-p-phenylenediamine.

[0303] Examples of rust inhibitors include cyclohexylamine, dicyclohexylamine, and N,N-bis(2-hydroxyethyl)-N-cyclohexylamine.

[0304] Examples of surfactants include higher alcohol ethylene oxide adducts, alkylphenol ethylene oxide adducts, fatty acid ethylene oxide adducts, higher alkylamine ethylene oxide adducts, fatty acid esters of sorbitol and sorbitan, sucrose fatty acid esters, silicone-based surfactants, and fluorine-based surfactants.

[0305] Other components that the detergent of this embodiment may contain include ethanol, methanol, 1-propanol, isopropyl alcohol, 1-butanol, methyl acetate, ethyl acetate, n-propyl acetate, amyl acetate, ethyl lactate, γ-butyrolactone, dimethyl carbonate, dimethyl oxalate, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether, limonene, pinene, myrcene, linalool, terpineol, and the like. The detergent of this embodiment may contain these components as fragrances or as impurities.

[0306] The cleaning agent of this embodiment can be suitably used as a cleaning agent for oil and grease stains adhering to various substrates. Specific types of stains include oil stains such as mineral oil, vegetable oil, animal oil, heavy oil, wax, silicone oil, and fluorine oil; stains derived from rosin-based flux; and resin stains such as urethane resin, epoxy resin, acrylic resin, silicone resin, ABS resin, polyamide resin, polyvinyl chloride resin, polyester resin, acrylic resin, and polylactic acid resin. The above-mentioned stain components originate from, for example, cutting oil, pressing oil, drawing oil, heat treatment oil, rust-preventive oil, lubricating oil, metalworking oil, plastic working oil, grease, asphalt, water-soluble oil, solder, heat insulating material, coatings for electronic circuit boards, adhesives, etc., and can be used on various articles in which these may be used, such as glass, windows, substrates, displays, lenses, lighting fixtures, automobile parts, automobile interiors, industrial valves, gears, bearings, pump parts, pipes, building materials, paint filaments, etc.

[0307] [Embodiment 3] (Hexafluoropropene dimer-containing composition) The composition of this embodiment is C6F 12 It contains the compound represented by . The composition of this embodiment further contains water and the C6F 12 The concentration of water is 0.0001 to 0.1 parts by mass per 100 parts by mass of the total amount of hexafluoropropene dimer represented by [formula].

[0308] C6F 12 Compounds represented by C6F 12 A wide range of known methods represented by can be adopted, and there are no particular limitations. However, C6F in this specification may be used. 12 The compound represented by [formula] preferably does not contain a cycloalkane, and more preferably is a hexafluoropropene (HFP) dimer.

[0309] C6F 12 Examples of compounds represented by include hexafluoropropene dimers, and more specifically, dimers containing at least one compound selected from the group consisting of compounds represented by the following formulas (I) and (II).

[0310] [ka]

[0311] In this specification, the above C6F 12 The compounds represented by include both the E and Z geometric isomers unless otherwise specified.

[0312] C6F included in the composition of this embodiment 12 The compound represented by the above formulas (I) and (II) may contain only one of the compounds represented by the above formulas, or it may be a mixture containing both.

[0313] When the composition of this embodiment contains the compound represented by formula (I) above, the ratio of the E-isomer to the Z-isomer of the compound, E / (E+Z), is preferably greater than 0.5 (i.e., the ratio of the E-isomer is greater than that of the Z-isomer), more preferably 0.67 or higher, even more preferably 0.8 or higher, even more preferably 0.91 or higher, particularly preferably 0.95 or higher, and most preferably 0.965 or higher. Since the E-isomer of the compound represented by formula (I) is more thermodynamically stable than the Z-isomer, if E / (E+Z) is within the above range, decomposition during long-term use can be suppressed.

[0314] Furthermore, in this embodiment, E / (E+Z) of the compound represented by formula (I) may be 1.

[0315] C6F 12 The content of the compound represented by formula (I) in the compound represented by (for example, the total of compounds represented by formulas (I) and (II) is C6F 12The content of the compound represented by formula (I) is preferably 10% by mass or more, more preferably 50% by mass or more, even more preferably 80% by mass or more, even more preferably 90% by mass or more, particularly preferably 95% by mass or more, and particularly more preferably 98% by mass or more. 12 With respect to the total amount of HFP dimer expressed by mass% or less, 90 mass% or more and 100 mass% or less, 10 mass% or more and 98 mass% or less, 30 mass% or more and 98 mass% or less, 50 mass% or more and 98 mass% or less, 70 mass% or more and 98 mass% or less, 9 0 mass% or more and 98 mass% or less, 10 mass% or more and 96 mass% or less, 30 mass% or more and 96 mass% or less, 50 mass% or more and 96 mass% or less, 70 mass% or more and 96 mass% or less, 90 mass% or more9 6 mass% or less, 40 mass% or more and 95 mass% or less, 60 mass% or more and less than 95 mass%, 80 mass% or more and less than 95 mass%, 30 mass% or more and less than 85 mass%, 50 mass% or more and less than 85 mass%, 7 It may be 0% by mass or more and less than 85% by mass, 40% by mass or more and 80% by mass or less, 55% by mass or more and 80% by mass or less, 60% by mass or more and 75% by mass or less, 65% by mass or more and 70% by mass or less, 35% by mass or more and 60% by mass or less, 50% by mass or more and 60% by mass or less, 70% by mass or more and 90% by mass or less, 80% by mass or more and 100% by mass or less, 80% by mass or more and 95% by mass or less, 80% by mass or more and 90% by mass or less, 85% by mass or more and 100% by mass or less, 90% by mass or more and 100% by mass or less, or 85% by mass or more and 95% by mass or less, preferably 50% by mass or more and 100% by mass or less, preferably 60% by mass or more and 100% by mass or less, more preferably 80% by mass or more and 100% by mass or less, and even more preferably 95% by mass or more and 100% by mass or less.

[0316] Similarly, regarding the content of the compound represented by formula (II), C6F 12The amount of the total amount of HFP dimers represented by is preferably 1% by mass or less, more preferably 0.5% by mass or less, and even more preferably 0.2% by mass or less.

[0317] C6F contained in the composition of this embodiment 12 The content of the compound represented by is preferably 20% by mass or more, more preferably 40% by mass or more, even more preferably 60% by mass or more, and particularly preferably 80% by mass or more, relative to the total composition of this embodiment. Also, C6F is included in the composition of this embodiment. 12 The content of the compound represented by is preferably 99.9999% by mass or less of the total composition of this embodiment.

[0318] The compounds represented by formulas (I) and (II) above may be produced by conventional methods, for example, by the method described in Chinese Patent Application Publication No. 103787824, and are not limited thereto. They may also be obtained by dimerization using HFP as a raw material, and are not limited thereto; they may be obtained by employing a wide range of known methods.

[0319] The composition of this embodiment contains C6F compounds other than those represented by formula (I) or (II). 12 It may contain a hexafluoropropene dimer represented by .

[0320] The composition of this embodiment may contain a hexafluoropropene trimer, and may contain, for example, one or more compounds represented by the following formulas (A) to (C). [ka]

[0321] The composition of this embodiment may contain a hexafluoropropene tetramer.

[0322] The hexafluoropropene tetramer may contain 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0323] The composition of this embodiment further contains water. The water content is as described above for C6F 12 The amount of water is 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, and even more preferably 0.001 parts by mass or more, per 100 parts by mass of the total amount of hexafluoropropene dimer represented by . By setting the concentration of water to 0.0001 parts by mass or more, the stability of the composition can be maintained and the charging of the composition can be suppressed.

[0324] Furthermore, the water content in the composition of this embodiment is the same as C6F. 12 The amount of water is 0.1 parts by mass or less, preferably 0.05 parts by mass or less, more preferably 0.01 parts by mass or less, particularly preferably 0.005 parts by mass or less, and most preferably 0.004 parts by mass or less, relative to 100 parts by mass of the total amount of hexafluoropropene dimer represented by . By setting the water content to 0.1 parts by mass or less, C6F is released during heating. 12 This can suppress the decomposition of the compound represented by [formula], thereby suppressing the increase in fluoride ions and the rise in acidity. Furthermore, by reducing the water content to 0.004 parts by mass or less, rusting of the container can be suppressed.

[0325] In one embodiment, the water content is preferably 0.0001% by mass or more, more preferably 0.0005% by mass or more, and even more preferably 0.001% by mass or more, relative to the entire composition.

[0326] In one embodiment, the water content is preferably 0.1% by mass or less, more preferably 0.05% by mass or less, even more preferably 0.01% by mass or less, and particularly preferably 0.005 parts by mass or less, relative to the entire composition.

[0327] The composition of this embodiment has improved dielectric strength by including a predetermined amount of water. The dielectric strength of the composition of this embodiment may preferably be 40kV or higher, preferably 50kV or higher, and more preferably 60kV or higher.

[0328] The composition of this embodiment may further contain fluoride ions. The amount of fluoride ions in the composition is preferably 0.0000001% by mass or more, more preferably 0.000001% by mass or more, and even more preferably 0.00001% by mass or more, relative to the entire composition.

[0329] Furthermore, the amount of fluoride ions contained in the composition of this embodiment is preferably 5% by mass or less, more preferably 1% by mass or less, more preferably 0.1% by mass or less, more preferably 0.01% by mass or less, even more preferably 0.001% by mass or less, and particularly preferably 0.0001% by mass or less, relative to the entire composition.

[0330] Any known fluoride ion source can be widely used as the fluoride ion source, and there are no particular limitations. Specifically, examples include ions of hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride. Only one of these may be included, or multiple types may be included. Preferably, the fluoride ion source is hydrogen fluoride.

[0331] The composition of this embodiment is further C6HF 11 It may contain the compound represented by C6HF. 11 The content of the compound represented by the above C6F 12 The amount is 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, and even more preferably 0.001 parts by mass or more, per 100 parts by mass of the total amount of hexafluoropropene dimer represented by C6HF. 11By setting the concentration of the compound represented by to 0.0001 parts by mass or more, C6F 12 The decomposition of the hexafluoropropene dimer represented by [formula] can be suppressed.

[0332] Furthermore, C6HF is included in the composition of this embodiment. 11 The content of the compound represented by the above C6F 12 The amount of C6HF is preferably 0.1 parts by mass or less, more preferably 0.05 parts by mass or less, and even more preferably 0.01 parts by mass or less, relative to 100 parts by mass of the total amount of hexafluoropropene dimer represented by C6HF. 11 By limiting the content to 0.1 parts by mass or less, C6F 12 The decomposition of the hexafluoropropene dimer represented by [formula] can be suppressed.

[0333] C6HF 11 Examples of compounds represented by C6HF include 11 A wide range of known methods represented by can be adopted, and there are no particular limitations. However, C6HF in this specification 11 The compound represented by preferably does not contain a cycloalkane, and more preferably is a compound in which one of the fluorine atoms of a hexafluoropropene (HFP) dimer is replaced by a hydrogen atom.

[0334] C6HF 11 Examples of specific structures of compounds represented by the formula are shown below. [ka]

[0335] In a preferred embodiment, the composition of this embodiment is C6HF 11 The compound represented by includes at least one of the following: [ka] In this specification, the above C6HF 11The compounds represented by include both the E and Z geometric isomers unless otherwise specified.

[0336] C6HF contained in the composition of this embodiment 11 The compound represented by the above formula may contain only one of the compounds represented by the above formula, or it may be a mixture containing two or more compounds.

[0337] In addition to the above, the composition of this embodiment also includes C m F 2m and / or C n F (2n-2) The formula may include the following: [wherein m is an integer between 4 and 12, not 6; and n is an integer between 4 and 12, not 6.]

[0338] m is an integer greater than or equal to 4, preferably greater than or equal to 5, and more preferably greater than or equal to 6. Also, n is an integer less than or equal to 12, preferably less than or equal to 11, and more preferably less than or equal to 10. However, m does not include 6.

[0339] n is an integer greater than or equal to 4, preferably greater than or equal to 5, and more preferably greater than or equal to 6. Furthermore, n is an integer less than or equal to 12, preferably less than or equal to 11, and more preferably less than or equal to 10. In addition, n is particularly preferably 6.

[0340] C m F 2m This may be a linear compound or a cyclic compound that may have a substitutional structure. The linear compound may be a so-called alkene, and may be linear or branched.

[0341] C n F (2n-2) This may be a linear compound or a cyclic compound that may have a substitutional structure. The linear compound may be a so-called diene or an alkyne, and may be linear or branched.

[0342] Also, C m F 2m and / or C n F (2n-2) The content of is preferably 0.0001% by mass or more relative to the entire composition of this embodiment.

[0343] On the other hand, C m F 2m and / or C n F (2n-2) The content of is preferably 10% by mass or less, preferably 5% by mass or less, and more preferably 1% by mass or less, relative to the total composition of this embodiment.

[0344] In one embodiment, in the composition, C m F 2m and / or C n F (2n-2) The content is C6F 12 The amount is preferably 0.0001 parts by mass or more, more preferably 0.01 parts by mass or more, and even more preferably 0.1 parts by mass or more, based on a total of 100 parts by mass of the compounds represented by .

[0345] On the other hand, in the composition, C m F 2m and / or C n F (2n-2) The content is C6F 12 It is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, based on a total of 100 parts by mass of the compounds represented by [formula].

[0346] Note C m F 2m and / or C n F (2n-2) If multiple types are included, the above content refers to the total amount of each.

[0347] C m F 2m and / or C n F (2n-2) By setting the content of C6F within the above range, 12This can suppress the decomposition of the HFP dimer represented by [formula], and consequently, it can suppress the increase in fluoride ions and the rise in acidity.

[0348] The composition of this embodiment is C6F 12 The compound may include additional compounds other than those represented by [the formula]. These additional compounds may be one or more types. Examples of additional compounds include perfluoropolyethers.

[0349] Perfluoropolyethers are preferably of the general formula: RO-RF 1 -R' It is represented as, During the ceremony, R and R' are the same or different, -C m F 2m+1 It is a single-valued base represented by , where m is an integer from 1 to 8, and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, wherein the repeating units are: (i) -CFXO-, (wherein X is F or CF3); (ii) -CF2CFXO-(wherein X is F or CF3); (iii) -CFXCF2O-(wherein X is F or CF3); (iv) -CF2CF2CF2O-; or (v) Represented as -CF2CF2CF2CF2O-, or Rf 1 teeth, (vi) -(CF2) n -CFY-O-(wherein n is an integer from 0 to 3, and Y is the general formula -ORf 2 A monovalent group represented by Z, where Rf 2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, represented as -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different F or CF3, and Z is a monovalent C 1-5It is a divalent group represented as a perfluoroalkyl group.

[0350] Examples of perfluoropolyethers include the product name GALDEN® "HT155" (manufactured by Solvay).

[0351] (Heat transfer fluid) This embodiment also relates to a heat transfer fluid.

[0352] The heat transfer fluid of this embodiment includes or consists of the composition of this embodiment.

[0353] If the heat transfer fluid of this embodiment includes the perfluoropolyether described above, then these and C6F 12 Since the compounds represented by have similar properties as heat transfer fluids, the properties as heat transfer fluids remain basically unchanged regardless of their content ratio. Therefore, in this case, the heat transfer fluid of this embodiment is C6F 12 The compound represented by is preferably present in an amount of 40% to 99.9% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total heat transfer fluid.

[0354] The heat transfer fluid of this embodiment may contain any additives other than those described above, as long as they do not hinder its effects and purpose. Examples of such additives include stabilizers.

[0355] Stabilizers exert their functions as so-called acid acceptors or antioxidants by exhibiting stabilizing effects. Major stabilizing effects include preventing the decomposition of HFP dimers by capturing radicals generated in the system, and preventing further decomposition of HFP dimers by acids generated in the system.

[0356] A wide range of known stabilizers can be used as such stabilizers. In particular, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers, as these can effectively suppress the occurrence of metal corrosion caused by the composition.

[0357] A wide range of known unsaturated alcohol-based stabilizers can be used. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadiene-1-ol, and oleyl alcohol can be used.

[0358] As nitro-based stabilizers, a wide range of known types can be used. Examples of aliphatic nitro compounds include nitromethane, nitroethane, 1-nitropropane, and 2-nitropropane. As aromatic nitro compounds, one or more selected from the group consisting of nitrobenzene, o-, m-, or p-dinitrobenzene, o-, m-, or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m-, or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole can be used.

[0359] A wide range of known amine-based stabilizers can be used. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dibentilyamine, tribentilyamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine, and diethylhydroxylamine can be used.

[0360] A wide range of known phenolic stabilizers can be used. For example, one or more selected from the group consisting of 2,6-ditterybutyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0361] A wide range of known epoxy stabilizers can be used. For example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0362] By using a combination of stabilizers with different stabilizing effects, C6F that can occur due to various causes can be controlled. 12For the reason that it more effectively prevents the decomposition of the compound represented by the above, it is preferable that the stabilizer consists of one or more selected from the group consisting of epoxy-based stabilizers, unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers.

[0363] C6F 12 From the viewpoint of effectively suppressing acid liberation from the compound represented by and inhibiting metal corrosion by the liquid composition, the stabilizer content relative to the total heat transfer fluid is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, considering the need to avoid undesirable changes in the physical properties of the liquid composition due to excessive addition of stabilizers, the stabilizer content relative to the total heat transfer fluid is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0364] The heat transfer fluid of this embodiment is used to remove heat from or supply heat to various objects to be heated, and can be applied, for example, as a medium for immersion cooling such as single-phase immersion cooling and two-phase immersion cooling, as well as for chiller fluids, Rankine cycle working fluids, and the like.

[0365] In this embodiment, the objects to which heat is transferred are articles, devices, and atmospheres that are cooled, heated, or maintained at a temperature to be controlled. Examples of such objects to which heat is transferred include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of objects to which heat is transferred in this embodiment are not particularly limited, but include wafers used to manufacture semiconductor devices, microprocessors, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components.

[0366] The heat transfer fluids of this embodiment can be used as a substitute for the heat transfer fluid currently in use in equipment designed to transfer heat using these fluids.

[0367] The heat transfer fluid of this embodiment can be used as a drop-in replacement, nearly drop-in replacement, or retrofit replacement for a heat transfer fluid that is currently in use. "Drop-in replacement" means that the replacement can be done without any changes to the equipment. "Nearly drop-in replacement" means that the replacement can be done with little to no changes to the equipment. "Retrofit replacement" means that the replacement can be done with minimal changes to the equipment (without significant changes). Preferably, the heat transfer fluid of this embodiment can be used as a drop-in replacement or nearly drop-in replacement for the heat transfer fluid described above.

[0368] Whether a drop-in alternative, a near-drop-in alternative, or a retrofit alternative is possible can be determined by whether all of the following conditions are met. (i) The boiling point of the heat transfer fluid is at least about 80% of the boiling point of the heat transfer fluid before replacement, preferably at least about 85%. (ii) The freezing point of the heat transfer fluid is equal to or lower than the freezing point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement. (iv) The heat transfer fluid is compatible with the heat transfer fluid before replacement in any proportion.

[0369] By setting the boiling point of the heat transfer fluid in this embodiment to at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, the occurrence of cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but for example, it may be at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0370] By setting the pour point of the heat transfer fluid in this embodiment to be equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it at temperatures below the conventional operating temperature, thereby widening the operating temperature range. There is no particular upper limit to the pour point of the heat transfer fluid, but for example, it may be 30°C higher or lower than the pour point of the heat transfer fluid before replacement.

[0371] By setting the kinematic viscosity of the heat transfer fluid in this embodiment to at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement, it is possible to suppress an increase in power consumption or reduce power consumption. It is preferable to compare the kinematic viscosity at the operating temperature, but is not limited to this, and for example, it can be compared at any temperature between -20°C and -40°C, specifically at -20°C.

[0372] The heat transfer fluid of this embodiment is compatible with the heat transfer fluid used before replacement in any ratio, which facilitates the replacement process.

[0373] Furthermore, the heat transfer fluid of this embodiment is more suitable as a drop-in replacement, nearly drop-in replacement, or retrofit replacement if it satisfies the following conditions. (v) The heat transfer fluid in this embodiment has a dielectric constant of 120% or less of the heat transfer fluid before replacement. (vi) The heat transfer fluid of this embodiment has an dielectric strength of 90% or more of the heat transfer fluid before replacement. (vii) The heat transfer fluid of this embodiment has an specific heat of 90% or more of the heat transfer fluid before replacement. (viii) The heat transfer fluid in this embodiment has a thermal conductivity of 90% or more of the heat transfer fluid before replacement.

[0374] By setting the dielectric constant of the heat transfer fluid in this embodiment to 120% or less of the dielectric constant of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the dielectric constant of the heat transfer fluid, but for example, it may be 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0375] By setting the dielectric strength of the heat transfer fluid in this embodiment to 90% or more of the dielectric strength of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited, but for example, it may be 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0376] By setting the specific heat of the heat transfer fluid in this embodiment to 90% or more of the specific heat of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the specific heat of the heat transfer fluid, but for example, it may be 120% or less of the specific heat of the heat transfer fluid before replacement.

[0377] By setting the thermal conductivity of the heat transfer fluid in this embodiment to 90% or more of the thermal conductivity of the heat transfer fluid before replacement, it can be suitably used as a substitute composition. There is no particular upper limit to the thermal conductivity of the heat transfer fluid, but for example, it may be 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0378] The boiling point of the heat transfer fluid in this embodiment is preferably 40°C or higher, more preferably 45°C or higher. Furthermore, the upper limit of the boiling point of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, 80°C or lower, 70°C or lower, or 60°C or lower.

[0379] The pour point of the heat transfer fluid in this embodiment is preferably -80°C or lower, more preferably -90°C or lower, and even more preferably -100°C or lower. Furthermore, the lower limit of the pour point of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, -160°C or higher, or -140°C or higher.

[0380] The kinematic viscosity of the heat transfer fluid in this embodiment is preferably 4.0 cSt or less, more preferably 3.0 cSt or less, even more preferably 2.0 cSt or less, and even more preferably 1.5 cSt or less at -20°C. Furthermore, the lower limit of the kinematic viscosity of the heat transfer fluid in this embodiment is not particularly limited, but could be, for example, 0.2 cSt or more.

[0381] The dielectric constant of the heat transfer fluid in this embodiment is preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. Furthermore, the lower limit of the dielectric constant of the heat transfer fluid in this embodiment is not particularly limited, but it may be, for example, 1.1 or more.

[0382] The dielectric strength of the heat transfer fluid in this embodiment is preferably 40kV or higher, more preferably 50kV or higher, and even more preferably 50kV or higher. Furthermore, there is no particular upper limit to the dielectric strength of the heat transfer fluid in this embodiment, but it may be, for example, 150kV or less, or 100kV or less.

[0383] The specific heat of the heat transfer fluid in this embodiment is preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and even more preferably 1000 J / kg·K or more at 30°C. Furthermore, there is no particular upper limit to the specific heat of the heat transfer fluid in this embodiment, but it may be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0384] The thermal conductivity of the heat transfer fluid in this embodiment is preferably 0.055 W / mK or higher, more preferably 0.060 W / mK or higher, at 30°C. Furthermore, there is no particular upper limit to the thermal conductivity of the heat transfer fluid in this embodiment, but it may be, for example, 0.090 W / mK or lower, or 0.080 W / mK or lower.

[0385] The boiling point of the heat transfer fluid in this embodiment is the temperature at which a peak originating from endothermic heating was observed when the temperature was increased from 25°C at a rate of 5°C / min, using DSC (Dynamic Scanning Calorimetry).

[0386] The pour point of the heat transfer fluid in this embodiment is the temperature at which a peak originating from endothermic heating is observed when the fluid is cooled to below its freezing point with liquid nitrogen using DSC, and then heated at a rate of 5°C / min.

[0387] The dielectric constant of the heat transfer fluid in this embodiment is the value observed at a frequency of 1 kHz under conditions of 25°C and 60% humidity, using the capacitance method.

[0388] The kinematic viscosity and density of the heat transfer fluid in this embodiment were measured using an Anton Paar SVM3001 kinematic viscometer.

[0389] The dielectric strength of the heat transfer fluid in this embodiment is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined interval and the voltage is increased at a constant rate. The measurement conditions are as follows. Electrode shape: Spherical (φ12.5mm) Electrode spacing: 2.5mm Boost speed: 2kV / second Measurement environment: Air (22°C, 57%RH)

[0390] The specific heat of the heat transfer fluid in this embodiment is a value obtained using DSC under the following conditions. Measurement device: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10°C / min Standard sample: Sapphire (-Al2O3) Atmosphere: Dry nitrogen stream Sample container: Aluminum airtight container

[0391] The thermal conductivity of the heat transfer fluid in this embodiment is a value obtained by the transient nanowire method.

[0392] The compatibility of the heat transfer fluid in this embodiment is determined by whether or not it becomes compatible when mixed with the target solvent. Here, compatibility means that when the two are mixed, they become a uniform state, that is, the phases do not separate.

[0393] (Heat transfer device) This embodiment further discloses a heat transfer device comprising a device and a mechanism for transferring heat to or from the device, which includes the heat transfer fluid described above.

[0394] Examples of devices include computers, server computers, servers including blade servers; disk arrays / storage systems; storage area networks; network-connected storage; storage communication systems; workstations; routers; telecommunications infrastructure / switches; wired, optical and wireless communication equipment; cell processing equipment; printers; power supplies; displays; optical devices; measurement systems including handheld systems; and military electronic equipment.

[0395] In different terms, the device may be a component, workpiece, assembly, etc., that is cooled, heated, or maintained at a predetermined temperature or temperature range. Examples of such devices include electrical components, mechanical components, and optical components. Specifically, examples include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, power distribution switches, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, lasers, chemical reactors, fuel cells, heat exchangers, and electrochemical cells. In some embodiments, the device may include a cooler, a heater, or a combination thereof.

[0396] Semiconductor elements are heat-generating elements mounted in devices, such as CPUs, GPUs, and SSDs. These semiconductor elements are composed of single elements such as silicon and germanium, and compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC).

[0397] If the device is a server computer, one or more logic boards are located within its internal space. A logic board contains numerous heat-generating electronic components, including at least one processor such as a CPU or GPU. In addition, other heat-generating components of the computer may also be used, such as chipsets; memory, graphics chips, network chips, RAM, power supplies, daughter cards; and storage drives such as solid-state drives and mechanical hard disks.

[0398] A heat transfer device is a device that uses the above-mentioned heat transfer fluid to transfer heat between itself and an object to be heated. Heat is exchanged (transferred) through thermal contact with the object to be heated. For example, removing heat from an object to be heated is called cooling, and supplying heat is called heating. Different mechanisms may be used depending on the case, but a single heat transfer device may be used to handle both cooling and heating.

[0399] There are no particular limitations on the heat transfer devices, and examples include pumps, valves, fluid confinement systems, pressure control systems, coolers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, and passive temperature control systems.

[0400] More specifically, these include temperature-controlled wafer chucks in plasma-enhanced chemical vapor deposition (PECVD) tools, temperature-controlled test heads for die performance testing, temperature-controlled work areas in semiconductor process equipment, thermal shock test bath reservoirs, and constant temperature baths.

[0401] The object to be subjected to heat transfer, which is brought into thermal contact with the heat transfer device, is an article, device, or atmosphere that is cooled, heated, or maintained at a temperature to be controlled. Examples of such objects to be subjected to heat transfer include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of objects to be subjected to heat transfer in this embodiment include, but are not limited to, microprocessors, wafers used to manufacture semiconductor devices, power control semiconductors, electrical branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, and missile components.

[0402] When using the heat transfer device of this embodiment, the temperature conditions for the heat transfer fluid are preferably -100 to 45°C, more preferably -90 to 45°C, and even more preferably -70 to 45°C. The heat transfer fluid of this embodiment has the advantage of exhibiting low kinematic viscosity even at low temperatures below -20°C, and especially low kinematic viscosity at -70 to -60°C, so the device can be suitably used even in the above temperature range.

[0403] (Heat Transfer Method) This embodiment further discloses a heat transfer method comprising the steps of preparing a device and transferring heat to or from the device using the heat transfer fluid described above. Here, heat can be transferred by positioning a heat transfer device in thermal contact with the device. When the heat transfer device is positioned in thermal contact with the device, it removes heat from the device, supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of the heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer device.

[0404] (Foaming agent) This embodiment also relates to a foaming agent.

[0405] The foaming agent of this embodiment comprises or consists of the composition of this embodiment.

[0406] The foaming agent in this embodiment is C6F 12 The compound may include additional compounds different from the compound represented by . The additional compounds may be one or more types. For example, C6F 12 Other examples include fluorine-substituted olefins, substituted or unsubstituted olefins other than fluorine-substituted olefins, halogenated hydrocarbons other than olefins, other organic compounds, or inorganic compounds.

[0407] C6F 12 Other fluorine-substituted olefins may include, for example, hydrofluoroolefins or hydrochlorofluoroolefins having 1 to 30 carbon atoms, specifically 1,3,3,3-tetrafluoropropene, 1,1,3,3-tetrafluoropropene, 1,2,3,3,3-pentafluoropropene, 1,1,1-trifluoropropene, 1,1,1,3,3-pentafluoropropene (HFO-1225zc), and 1,1,1,3,3,3-hexafluorobut-2-e Examples include octafluoro-2-butene, 1,1,2,3,3-pentafluoropropene, 1,1,1,2,3-pentafluoropropene, trans-1,2-dichloroethylene, 1-chloro-2,3,3,3-tetrafluoropropene, 2-chloro-1,3,3,3-tetrafluoropropene, 1-chloro-2,3,3,4,4,5,5-heptafluoropentene, 1,1-dichloro-2-fluoroethylene, and 1-chloro-3,3,3-trifluoropropene.

[0408] Other substituted or unsubstituted olefins besides fluorine-substituted olefins may include, for example, halogenated olefins having 1 to 30 carbon atoms, with specific examples including tetrachloroethylene, ethylene, propylene, and n-butene.

[0409] Examples of halogenated hydrocarbons other than olefins include difluoromethane, pentafluoroethane, 1,1,2,2-tetrafluoroethane, 1,1,1,2-tetrafluoroethane, difluoroethane, 1,1,1,2,3,3,3-heptafluoropropane, 1,1,1,3,3,3-hexafluoropropane, 1,1,1,3,3-pentafluoropropane, 1,1,1,3,3-pentafluorobutane, trichlorofluoromethane, dichlorodifluoromethane, trichlorotrifluoroethane, dichlorohexafluoropropane, 2,2,3-3-tetrachlorohexafluorobutane, dichlorooctafluorobutane, dichloromethane, trichloroethane, octafluoropropane, and 1,1,1,2,2,3,3-heptafluoropropane.

[0410] Other organic compounds include, for example, hydrocarbons such as methane, ethane, propane, n-butane, isobutane, n-pentane, isopentane, neopentane, cyclopentane, n-hexane, isohexane, n-heptane or n-octane, CHF2-O-CHF2, CHF2-O-CH2F, CHF2-CF2-O-CH3, CH2F-O-CHF-CH2F, CHF2-CHF-O-CH2F, Hydrofluoroethers such as CF3-O-CHF-CH3, CF3-CHF-O-CH3, CHF2-O-CH2-CHF2, CF3-O-CH2-CH2F, CF3-CH2-O-CH2F, CF2H-CF2-CF2-O-CH3, CF3CF2CF2-O-CH3, C4H9-O-CF3, C4F9-O-C2H5 or C3F7-O-C3F7, methanol, ethanol, propanol, Examples include alcohols such as isopropanol, 1-hexanol, 2-hexanol, 2-ethylhexanol, or 1-octanol; ethers such as dimethyl ether, methyl ethyl ether, diethyl ether, methyl propyl ether, methyl isopropyl ether, ethyl propyl ether, ethyl isopropyl ether, dipropyl ether, or diisopropyl ether; ketones such as methyl ethyl ketone, methyl isobutyl ketone, or perfluoroethyl isopropyl ketone; and organic acids such as methyl formate, ethyl formate, or formic acid.

[0411] Examples of inorganic compounds include water, nitrogen, oxygen, argon, and carbon dioxide.

[0412] The foaming agent of this embodiment may contain the compounds listed above for any reason, such as for the purpose of being a co-foaming agent or vapor pressure regulator, or as a by-product during manufacturing.

[0413] C6F in the foaming agent of this embodiment 12 The content of the compound represented by may be any value depending on the intended use of the blowing agent in this embodiment. However, among the compounds listed above, if GWP is C6F 12 A compound with a higher value than the compound represented by C6F 12 This also includes compounds that promote the decomposition of C6F in the foaming agent of this embodiment. 12 The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total amount of the blowing agent.

[0414] The foaming agent of this embodiment may contain a foam stabilizer (bubble stabilizer) for the purpose of improving foaming properties. Examples of foam stabilizers include polyoxyalkylene foam stabilizers such as polyoxyalkylene alkyl ethers, and surfactants such as silicone foam stabilizers such as octamethylcyclotetrasiloxane and organopolysiloxane. These foam stabilizers may be used individually or in combination of two or more.

[0415] From the viewpoint of improving foaming properties, the content of the foam stabilizer relative to the total foaming agent in this embodiment is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and even more preferably 1% by mass or more. On the other hand, from the viewpoint of obtaining homogeneous foaming, the content of the foam stabilizer relative to the total foaming agent in this embodiment is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0416] The blowing agent of this embodiment may contain a flame retardant for the purpose of improving flame retardancy. Examples of flame retardants include phosphate esters, phosphate-containing flame retardants, bromine-containing flame retardants, and metal hydroxides.

[0417] As the phosphate ester, it is preferable to use monophosphate esters, condensed phosphate esters, etc. For example, trimethyl phosphate, triethyl phosphate, tributyl phosphate, tri(2-ethylhexyl) phosphate, tributoxyethyl phosphate, triphenyl phosphate, tris(phenylphenyl) phosphate, trinaphthyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, 2-methacryloyloxyethyl acid phosphate, diphenyl-2-methacryloyloxyethyl phosphate Examples include tyl phosphate, melamine phosphate, dimelamine phosphate, melamine pyrophosphate, triphenylphosphine oxide, tricresylphosphine oxide, diethyl phenylphosphonate, resylcinol bis(diphenyl phosphate), bisphenol A bis(diphenyl phosphate), trialkyl polyphosphate, resorcinol polyphenyl phosphate, resorcinol poly(di-2,6-xylyl) phosphate, hydroquinone poly(2,6-xylyl) phosphate, and condensates thereof.

[0418] Specific examples of phosphate-containing flame retardants include monophosphates and polyphosphates. Monophosphates are not particularly limited, but examples include ammonium salts such as ammonium phosphate, ammonium dihydrogen phosphate, and diammonium hydrogen phosphate; sodium salts such as monosodium phosphate, disodium phosphate, disodium phosphite, and sodium hypophosphite; potassium salts such as monopotassium phosphate, dipotassium phosphate, tripotassium phosphate, monopotassium phosphite, dipotassium phosphite, and potassium hypophosphite; lithium salts such as monolithium phosphate, dilithium phosphate, trilithium phosphate, monolithium phosphite, dilithium phosphite, and lithium hypophosphite; barium salts such as barium hydrogen phosphate and barium hypophosphite; magnesium salts such as magnesium monohydrogen phosphate, magnesium hydrogen phosphate, trimagnesium phosphate, and magnesium hypophosphite; calcium salts such as calcium dihydrogen phosphate, calcium hydrogen phosphate, tricalcium phosphate, and calcium hypophosphite; and zinc salts such as zinc phosphate, zinc phosphite, and zinc hypophosphite. Polyphosphates are not particularly limited, but examples include ammonium polyphosphate, piperazine polyphosphate, melamine polyphosphate, ammonium polyphosphate amide, and aluminum polyphosphate. One or more types of phosphate-containing flame retardants may be used.

[0419] From the viewpoint of improving flame retardancy, the flame retardant content relative to the total blowing agent in this embodiment is preferably 0.5% by mass or more, more preferably 2% by mass or more, and even more preferably 5% by mass or more. On the other hand, from the viewpoint of preventing foaming inhibition due to an excessive amount of flame retardant, the flame retardant content relative to the total blowing agent in this embodiment is preferably 50% by mass or less, and more preferably 30% by mass or less.

[0420] There are no particular limitations on bromine-containing flame retardants as long as they are compounds that contain bromine in their molecular structure, but examples include aromatic brominated compounds. Specific examples of aromatic brominated compounds include monomer-based organic bromine compounds such as hexabromobenzene, pentabromotoluene, hexabromobiphenyl, decabromobiphenyl, hexabromocyclodecane, hexabromodiphenyl ether, bis(pentabromphenoxy)ethane, ethylene-bis(tetrabromophthalimide), and tetrabromobisphenol A; brominated polycarbonates such as copolymers of polycarbonate oligomers and bisphenol A; poly(brominated benzyl acrylate), brominated polyphenylene ether, brominated bisphenol A, cyanuryl chloride, and brominated phenol condensates; brominated (polystyrene), poly(brominated styrene), and cross-linked brominated polystyrene. One or more types of bromine-containing flame retardants can be used.

[0421] Examples of metal hydroxides include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, iron hydroxide, nickel hydroxide, zirconium hydroxide, zinc hydroxide, titanium hydroxide, copper hydroxide, tin hydroxide, and vanadium hydroxide. One or more types of metal hydroxides can be used.

[0422] The blowing agent of this embodiment may be used alone as a physical blowing agent, or in combination with a known chemical blowing agent. Examples of the above chemical blowing agents include 4,4'-oxybis(benzenesulfonyl hydrazide), diphenylsulfon-3,3'-disulfonylhydrazide arylbis(sulfonyl hydrazide), p-toluenesulfonyl hydrazide, azodicarbonamide (ADCA), azobisformamide, azobisisobutyronitrile, p-toluenesulfonyl semicarbazide, 5-morpholyl-1,2,3,4-thiatriazole, N,N-dinitrosoterephthalamide, water, ammonium carbonate, ammonium bicarbonate, ammonium nitrite, ammonium borohydride, azides, etc. In addition to the above compounds, the above chemical blowing agent may also contain urea or the like as a blowing aid.

[0423] The blowing agent of this embodiment can be used in a variety of products in which physical blowing agents are generally used in the manufacturing process. A specific application is as a blowing agent used in the manufacture of rigid polyurethane foam. Conventionally, CFCs and HCFCs have been widely used as blowing agents for rigid polyurethane foam, and this is one area where the demand for alternative materials is increasing. The blowing agent of this embodiment can be suitably used as a substitute for CFCs and HCFCs as a blowing agent for rigid polyurethane foam.

[0424] (Lubricant) This embodiment also relates to a lubricant.

[0425] The lubricant of this embodiment comprises the composition of this embodiment. In a preferred embodiment, the lubricant of this embodiment comprises the composition of this embodiment as a diluent solvent for diluting the lubricant component.

[0426] The lubricant component may be in liquid, grease, or solid form. The lubricant component may be any of the known lubricants, such as mineral oil-based, synthetic oil-based, fluorine-based, or silicone-based lubricants. There may be one lubricant component or two or more.

[0427] As the mineral oil-based lubricant component, various commercially available lubricant components such as paraffin oil-based or naphthenic oil-based components may be used.

[0428] As components of the synthetic oil-based lubricant, alkylbenzene, poly(α-olefin), ester, polyol ester, polyalkylene glycol, polyvinyl ether, etc. may be used.

[0429] Specific examples of alkylbenzenes include n-octylbenzene, n-nonylbenzene, n-decylbenzene, n-undecylbenzene, n-dodecylbenzene, n-tridecylbenzene, 2-methyl-1-phenylheptane, 2-methyl-1-phenyloctane, 2-methyl-1-phenylnonane, 2-methyl-1-phenyldecane, 2-methyl-1-phenylundecane, 2-methyl-1-phenyldodecane, and 2-methyl-1-phenyltridecane.

[0430] Specific examples of esters include aromatic esters such as benzoic acid, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, and mixtures thereof, as well as dibasic acid esters, polyol esters, complex esters, and carbonate esters.

[0431] Examples of alcohols used as raw materials for polyol esters include polyhydric alcohols such as neopentyl glycol, trimethylolethane, trimethylolpropane, trimethylolbutane, di(trimethylolpropane), tri(trimethylolpropane), pentaerythritol, di(pentaerythritol), and tri(pentaerythritol). Examples of carboxylic acids used as raw materials for polyol esters include valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, oleic acid, isopentanoic acid, 2-methylhexanoic acid, 2-ethylpentanoic acid, 2-ethylhexanoic acid, and 3,5,5-trimethylhexanoic acid.

[0432] Examples of polyalkylene glycols include compounds obtained by addition polymerization of alkylene oxides (e.g., ethylene oxide, propylene oxide, butylene oxide, etc.) with an alcohol having 1 to 18 carbon atoms (e.g., aliphatic alcohols such as methanol, ethanol, linear or branched propanol, linear or branched butanol, linear or branched pentanol, linear or branched hexanol, etc.).

[0433] Examples of polyvinyl ethers include polymethyl vinyl ether, polyethyl vinyl ether, poly-n-propyl vinyl ether, and polyisopropyl vinyl ether.

[0434] Examples of fluorine-based lubricant components include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene-hexafluoropropylene copolymer (FEP), tetrafluoroethylene-ethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), and perfluoropolyether.

[0435] Examples of silicone-based lubricant components include dimethyl silicone, methyl hydrogen silicone, methylphenyl silicone, cyclic dimethyl silicone, and modified silicone oil.

[0436] From the viewpoint of appropriately adjusting the film thickness of the lubricant coating, the content of the above-mentioned lubricant components is preferably 0.01 to 50% by mass, more preferably 0.1 to 30% by mass, and even more preferably 0.2 to 20% by mass, relative to the total lubricant of this embodiment.

[0437] The lubricant of this embodiment is C6F, depending on the application. 12 The lubricant of this embodiment may contain additional compounds other than the compound represented by as other solvent components. The type of such solvent component is not particularly limited and may include various solvent components that are generally used as solvents or diluents for lubricants. When the lubricant of this embodiment contains other solvent components, from the viewpoint of compatibility with fluorine-based lubricant components or silicone-based lubricant components, and from the viewpoint of reducing the GWP of the lubricant, the other solvent component is preferably a hydrofluoroolefin, a hydrofluoroether, or a hydrofluorocarbon. Also from a similar viewpoint, C6F in the lubricant of this embodiment 12The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total amount of the solvent component.

[0438] The lubricant of this embodiment may contain other additives besides the solvent and lubricant components described above, depending on the application, as long as the properties of the lubricant are not impaired. These other additives may be various additives known in the art, such as antioxidants, wear inhibitors, rust inhibitors, thickeners, structural stabilizers, fluorescent agents, colorants, and surfactants. The lubricant may contain one or more of these additives.

[0439] The lubricant of this embodiment can be applied to any sliding parts such as metal, resin, and rubber to prevent frictional heat and wear on the contact surface.

[0440] (Cleaning agent) This embodiment also relates to a cleaning agent.

[0441] The cleaning agent of this embodiment comprises or consists of the composition of this embodiment.

[0442] The cleaning agent of this embodiment may contain the composition of this embodiment as a cleaning agent component, or as a solvent for the cleaning agent component, depending on the application. In either case, the composition of this embodiment is C6F 12The product may also contain additional compounds different from the compound represented by as a detergent or solvent component.Examples of such additional cleaning agent or solvent components include halogenated hydrocarbons such as 1-bromo-2-methylpropane, trichlorofluoromethane, dichlorodifluoromethane, trichlorotrifluoroethane, 1,1,1,4,4,4-hexafluorobutane, 1,1,1,3,3-pentafluorobutane, 1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane, 1,1,1,2,2,3,3,4,4-nonafluorohexane, and 1,1,2,2,3,3,4-heptafluorocyclopentane, 2,3,3,4,4, 5,5-heptafluoro-1-pentene, 3,3,4,4,5,5,6,6,6-nonafluoro-1-hexene, 1-fluorooctane, 1-chloro-2,3,3,3-tetrafluoropropene, tetrachloroethylene, 1,1-dichloro-2-fluoroethylene, 1-chloro-3,3,3-trifluoropropene, and other halogenated olefins, CHF2-O-CHF2, CHF2-O-CH2F, CHF2-CF2-O-CH3, CH2F-O-CHF-CH2F, CHF2-CHF-O-CH2F, CF3-O-CHF-CH3, CF3-CHF-O Hydrofluoroethers such as -CH3, CHF2-O-CH2-CHF2, CF3-O-CH2-CH2F, CF3-CH2-O-CH2F, CF2H-CF2-CF2-O-CH3, CF3CF2CF2-O-CH3, C4H9-O-CF3, C4F9-O-C2H5 or C3F7-O-C3F7, hydrocarbons such as n-hexane, isohexane, cyclohexane, ethylcyclohexane, methylcyclohexane, n-heptane, isoheptane, n-octane, isooctane, n-nonane, isononane, n-decane, isodecane, methanol, etc. Examples include alcohols such as tanol, propanol, isopropanol, 1-hexanol, 2-hexanol, 2-ethylhexanol, or 1-octanol; ethers such as dimethyl ether, methyl ethyl ether, diethyl ether, methyl propyl ether, methyl isopropyl ether, ethyl propyl ether, ethyl isopropyl ether, dipropyl ether, or diisopropyl ether; ketones such as methyl ethyl ketone, methyl isobutyl ketone, or perfluoroethyl isopropyl ketone; or water.

[0443] C6F in the detergent of this embodiment 12 The content of the compound represented by may be any value depending on the intended use of the detergent in this embodiment. However, among the compounds listed above, GWP is C6F 12 A compound with a higher value than the compound represented by C6F 12 This also includes compounds that promote the decomposition of C6F in the detergent of this embodiment. 12 The content of the compound represented by is preferably 40% to 99% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, relative to the total detergent.

[0444] The cleaning agent of this embodiment may contain one or more stabilizers, additives, and other components, as long as they do not impair its performance as a cleaning agent.

[0445] Examples of stabilizers that may be included in the detergent of the present invention include 1,2-butylene oxide, 2,3-butylene oxide, propylene oxide, pentene oxide, epichlorohydrin, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, glycidyl acetate, glycidyl propionate, 1,2-epoxycyclopentane, styrene oxide, nitromethane, nitroethane, 1-nitropropane, 1,3-dioxolane, 1,4-dioxane, tetrahydrofuran, and the like. These may be used individually or in combination of two or more.

[0446] The additives may be various additives known in the art, such as water, ultraviolet absorbers, antioxidants, polymerization inhibitors, rust inhibitors, defoamers, surfactants, and chelating agents. These may be used individually or in combination of two or more.

[0447] Examples of UV absorbers include benzotriazole-based UV absorbers, benzophenone-based UV absorbers, and hindered amine-based UV absorbers.

[0448] Examples of antioxidants include phenolic antioxidants such as 2,6-di-t-butyl-4-methylphenol, triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], and 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], and amine-based antioxidants such as alkylated diphenylamine, tris-(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, and N,N-di-sec-butyl-p-phenylenediamine.

[0449] Examples of rust inhibitors include cyclohexylamine, dicyclohexylamine, and N,N-bis(2-hydroxyethyl)-N-cyclohexylamine.

[0450] Examples of surfactants include higher alcohol ethylene oxide adducts, alkylphenol ethylene oxide adducts, fatty acid ethylene oxide adducts, higher alkylamine ethylene oxide adducts, fatty acid esters of sorbitol and sorbitan, sucrose fatty acid esters, silicone-based surfactants, and fluorine-based surfactants.

[0451] Other components that the detergent of this embodiment may contain include ethanol, methanol, 1-propanol, isopropyl alcohol, 1-butanol, methyl acetate, ethyl acetate, n-propyl acetate, amyl acetate, ethyl lactate, γ-butyrolactone, dimethyl carbonate, dimethyl oxalate, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether, limonene, pinene, myrcene, linalool, terpineol, and the like. The detergent of this embodiment may contain these components as fragrances or as impurities.

[0452] The cleaning agent of this embodiment can be suitably used as a cleaning agent for oil and grease stains adhering to various substrates. Specific types of stains include oil stains such as mineral oil, vegetable oil, animal oil, heavy oil, wax, silicone oil, and fluorine oil; stains derived from rosin-based flux; and resin stains such as urethane resin, epoxy resin, acrylic resin, silicone resin, ABS resin, polyamide resin, polyvinyl chloride resin, polyester resin, acrylic resin, and polylactic acid resin. The above-mentioned stain components originate from, for example, cutting oil, pressing oil, drawing oil, heat treatment oil, rust-preventive oil, lubricating oil, metalworking oil, plastic working oil, grease, asphalt, water-soluble oil, solder, heat insulating material, coatings for electronic circuit boards, adhesives, etc., and can be used on various articles in which these may be used, such as glass, windows, substrates, displays, lenses, lighting fixtures, automobile parts, automobile interiors, industrial valves, gears, bearings, pump parts, pipes, building materials, paint filaments, etc.

[0453] Although embodiments of the present invention have been described above, the present invention is not limited in any way to these examples, and can be implemented in various forms without departing from the spirit of the invention. [Examples]

[0454] The embodiments of the present invention will be described in more detail below based on examples, but the present invention is not limited to these.

[0455] [Example 1] (Manufacturing Example 1-1) HFP dimers were obtained based on the method described in the Journal of Synthetic Organic Chemistry, Japan (1981), Vol. 39, pp. 51-62. The obtained HFP dimers were purified by distillation to remove impurities such as hexafluoropropene trimers. The obtained HFP dimers were washed with a 1% KOH aqueous solution. The fluoride ion concentration was less than 1 ppb by mass (below the detection limit). Furthermore, the purified HFP dimers were separated by distillation into compounds represented by formulas (I) and (II). Each of the separated HFP dimers was dehydrated using silica gel.

[0456] The compounds represented by formulas (I) and (II) obtained above were mixed so that the proportions of the compounds represented by formulas (I) and (II) were 99.9% by mass and 0.1% by mass, respectively, to obtain a dimer mixture.

[0457] (Examples 1-1 to 1-14, Comparative Examples 1-1 to 1-4) A standard solution was prepared by adding hydrofluoric acid anhydrous to a 99.9 wt% pure dimer mixture. This standard solution was then diluted to prepare the compositions of Examples 1-1 to 1-14 and Comparative Examples 1-1 to 1-4, so that the fluoride ion concentration was as shown in Table 1 below.

[0458] (Fluoride ion concentration measurement) One-fold (by weight) of distilled water was added to the sample and shaken for approximately 20 seconds to extract fluorine ions into the aqueous layer. Next, 2.5-3.0 mL of the aqueous layer was withdrawn using a dropper, and the resulting mixture was combined with twice the volume of TISAB solution (Total Ion Strength Adjustment Buffer Solution: HORIBA Corporation). This mixture was then used as a sample and measured using a fluorine ion meter (HORIBA Corporation).

[0459] (Stability test) The samples were placed in a stainless steel autoclave, sealed, and heated and held under the conditions shown in Table 1 below.

[0460] (Measurement of the purity of hexafluoropropene dimer) The purity of the hexafluoropropene dimer before and after the stability test was measured by gas chromatography.

[0461] [Table 1] From the results above, it was confirmed that Examples 1-1 to 1-14, which contained a predetermined amount of fluoride ions, maintained a high purity of hexafluoropropene dimer even after long-term storage at high temperatures.

[0462] [Example 2] (Manufacturing Example 2-1) HFP dimers were obtained based on the method described in the Journal of Synthetic Organic Chemistry, Japan (1981), Vol. 39, pp. 51-62. The obtained HFP dimers were purified by distillation to remove impurities such as hexafluoropropene trimers. The obtained HFP dimers were washed with a 1% KOH aqueous solution. The fluoride ion concentration was less than 1 ppb by mass (below the detection limit). Furthermore, the purified HFP dimers were separated by distillation into compounds represented by formulas (I) and (II). Each of the separated HFP dimers was dehydrated using silica gel.

[0463] The compounds represented by formulas (I) and (II) obtained above were mixed so that the proportions of the compounds represented by formulas (I) and (II) were 99.9% by mass and 0.1% by mass, respectively, to obtain a dimer mixture.

[0464] C6HF 11 (6H-Perfluorohex-1-ene, CAS number 1767-94-8, purity 97%) was purchased as a reagent from Merck.

[0465] (Examples 2-1 to 2-6, Comparative Examples 2-1 to 2-4) A dimer mixture with a purity of 99.9%, and the above C6HF 11 These were mixed in the proportions shown in Table 2 below to obtain the heat conduction fluid compositions of Examples 2-1 to 2-6 and Comparative Examples 2-1 to 2-4.

[0466] (Stability test) The obtained heat-conducting fluid composition was placed in a stainless steel autoclave, sealed, and heated and held under the conditions shown in Table 2 below.

[0467] (Fluoride ion concentration measurement) One-fold (by weight) distilled water was added to the sample, and the mixture was shaken for approximately 20 seconds to extract fluorine ions into the aqueous layer. Next, 2.5-3.0 mL of the aqueous layer was withdrawn using a dropper, and the resulting mixture was combined with twice the volume of TISAB solution (total ion strength adjustment buffer solution: manufactured by HORIBA). This mixture was then used as a sample and measured using a fluorine ion meter (manufactured by HORIBA). The results are shown in Table 2 below.

[0468] [Table 2] Based on the above results, a predetermined amount of C6HF 11 Examples 2-1 to 2-6, which included [the specified substance], were found to be stable, as no increase in fluorine concentration was observed even after long-term storage at high temperatures.

[0469] [Example 3] (Manufacturing Example 3-1) HFP dimers were obtained based on the method described in the Journal of Synthetic Organic Chemistry, Japan (1981), Vol. 39, pp. 51-62. The obtained HFP dimers were purified by distillation to remove impurities such as hexafluoropropene trimers. The obtained HFP dimers were washed with a 1% KOH aqueous solution. The fluoride ion concentration was less than 1 ppb by mass (below the detection limit). Furthermore, the purified HFP dimers were separated by distillation into compounds represented by formulas (I) and (II). Each of the separated HFP dimers was dehydrated using silica gel.

[0470] The compounds represented by formulas (I) and (II) obtained above were mixed so that the proportions of the compounds represented by formulas (I) and (II) were 99.9% by mass and 0.1% by mass, respectively, to obtain a dimer mixture.

[0471] (Examples 3-1 to 3-10, Comparative Examples 3-1 to 3-4) A dimer mixture with a purity of 99.9 wt% was mixed with water to prepare the water content shown in Table 3 below, and compositions for Examples 3-1 to 3-10 and Comparative Examples 3-1 to 3-4 were obtained.

[0472] (Stability test) The compositions of Examples 3-1 to 3-10 and Comparative Examples 3-1 to 3-4 were placed in a SUS autoclave, sealed, and heated and held under the conditions shown in Table 3 below.

[0473] (Fluoride ion concentration measurement) One-fold (by weight) of distilled water was added to the sample and shaken for approximately 20 seconds to extract fluorine ions into the aqueous layer. Next, 2.5-3.0 mL of the aqueous layer was withdrawn using a dropper, and the resulting mixture was combined with twice the volume of TISAB solution (Total Ion Strength Adjustment Buffer Solution: HORIBA Corporation). This mixture was then used as a sample and measured using a fluorine ion meter (HORIBA Corporation).

[0474] (Corrosion test) The compositions of Examples 3-1 to 3-10 and Comparative Examples 3-1 to 3-4, along with iron test pieces, were placed in a stainless steel autoclave, sealed, and heated at the temperatures shown in Table 3 for the times shown in Table 3. After heating, the test pieces were removed and visually inspected for rust. The results obtained are recorded in the "Appearance Change" column of Table 3.

[0475] [Table 3]

[0476] From the results above, it was confirmed that Examples 3-1 to 3-10, which contained a predetermined amount of water, were stable, as no increase in fluorine concentration was observed even after long-term storage at high temperatures. Furthermore, it was confirmed that Examples 3-1 to 3-10 maintained a high level of purity after testing. In addition, it was confirmed that no rust occurred in Examples 3-1 to 3-4 even after corrosiveness testing.

Claims

1. C ６ F １２ The hexafluoropropene dimer represented by and (B) below are included, The composition wherein the hexafluoropropene dimer represented by C6F12 is at least one selected from the group consisting of compounds represented by the following formulas (I) and (II). (B) C ６ F １２ For a total amount of 100 parts by mass of the hexafluoropropene dimer represented by [formula], add 0.0001 to 0.1 parts by mass of C. ６ HF １１ A compound represented by the formula. 【Chemistry 1】

2. The water in (C) is C ６ F １２ The composition according to claim 1, wherein the hexafluoropropene dimer represented by is contained in a concentration of 0.0001 to 0.004 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene dimer represented by .

3. The above-mentioned C ６ F １２ The composition according to claim 1 or claim 2, wherein the compound represented by the formula (I) is contained in an amount of 80% by mass or more based on the total amount of the hexafluoropropene dimer represented by

4. Said C ６ F １２ The composition according to claim 1 or claim 2, wherein the compound represented by formula (I) is present in an amount of 95% by mass or more relative to the total amount of hexafluoropropene dimers represented by the formula.

5. Said C ６ HF １１ The composition according to claim 1 or claim 2, wherein the compound represented by is at least one selected from the group consisting of compounds represented by the following formula. 【Chemistry 2】

6. A heat transfer fluid comprising the composition according to claim 1 or claim 2.

7. A heat transfer device comprising a device and a mechanism for transferring heat from or to the device, the heat transfer fluid being described in claim 6.

8. A heat transfer method comprising the steps of preparing a device and transferring heat to or from the device using the heat transfer fluid described in claim 6.

9. A foaming agent comprising the composition according to claim 1 or claim 2.

10. A lubricant comprising the composition according to claim 1 or claim 2.

11. A detergent comprising the composition according to claim 1 or claim 2.

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