Manufacturing method of metal-clad laminates

Abstract

To provide a manufacturing method of a metal clad laminate with few pin holes.SOLUTION: A manufacturing method of a metal clad laminate has a vacuum film deposition step in which a metal thin film layer is deposited on a surface of a base film by a vacuum film deposition method while transporting the base film by roll-to-roll manner, and a film-deposited article D2 is wound up to a roll with an interleaving paper 40 sandwiched. A winding up point P1 of the film-deposited article D2 on a roll is different from a winding up point P2 of the interleaving paper 40. A tension difference that is obtained by subtracting a winding tension of the interleaving paper 40 from a winding tension of the film-deposited article D2 is 0 - 130 N / m. A partial peeling of the metal thin film layer attributed to a lag is suppressed because the lag between the film-deposited article D2 and the interleaving paper is suppressed 40 when winding up to a roll. Therefore, the metal clad laminate with less pinholes is obtained.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a metal-clad laminate. More specifically, the present invention relates to a method for manufacturing a metal-clad laminate used in the manufacture of flexible printed wiring boards (FPCs) and the like.

Background Art

[0002] Flexible printed wiring boards in which wiring patterns are formed on the surface of a resin film are used in electronic devices such as liquid crystal panels, notebook computers, digital cameras, and mobile phones. A flexible printed wiring board is manufactured from a metal-clad laminate in which the surface of a resin film is covered with a metal layer.

[0003] A metallizing method is known as a method for manufacturing a metal-clad laminate. The manufacture of a metal-clad laminate by the metallizing method is performed, for example, by the following procedure. First, a metal thin film layer is formed on the surface of a resin film by a vacuum film forming method. Next, a plating film is formed on the metal thin film layer by an electrolytic plating method. By electrolytic plating, the metal layer is thickened until it reaches a film thickness suitable for forming a wiring pattern. By the metallizing method, a metal-clad laminate of a type called a so-called two-layer substrate, in which a metal layer is directly formed on a resin film, is obtained.

[0004] The manufacture of a metal-clad laminate by the metallizing method is performed in two steps using different apparatuses. That is, in a vacuum film forming apparatus, a metal thin film layer is formed on the surface of a resin film, and the obtained intermediate product is wound into a roll shape. The intermediate product roll taken out from the vacuum film forming apparatus is set in an electrolytic plating apparatus, and a plating film is formed while feeding out the intermediate product from the intermediate product roll.

[0005] Immediately after film formation, the surface of the metal thin film layer is not oxidized and its activity is high. Therefore, if the intermediate product is wound into a roll shape without the intervention of air in the vacuum film forming apparatus, a blocking phenomenon in which the metal thin film layer adheres occurs. Then, when the intermediate product is unwound from the intermediate product roll, the metal thin film layer may be locally peeled off.

[0006] To avoid this phenomenon, a method has been adopted in which, when winding the intermediate product into a roll shape in a vacuum deposition apparatus, interleaving paper made of resin film or the like is sandwiched between the intermediate products while winding (Patent Document 1). [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Japanese Patent Publication No. 2020-132960 [Overview of the project] [Problems that the invention aims to solve]

[0008] The presence of pinholes in metal-clad laminates can lead to cosmetic defects in flexible printed circuit boards (PCBs), such as "indentations" where the wiring thickness is partially reduced, and "chips" where the wiring width is partially narrowed. In severe cases, the wiring may even break. Therefore, pinholes in metal-clad laminates reduce the yield of flexible printed circuit boards. In particular, with the increasing sophistication of electronic devices in recent years, flexible printed circuit boards are increasingly characterized by finer wiring, making the effects of pinholes more pronounced. Consequently, there is a demand for metal-clad laminates with fewer pinholes.

[0009] In view of the above circumstances, the present invention aims to provide a method for manufacturing metal-clad laminates with fewer pinholes. [Means for solving the problem]

[0010] The present invention relates to a method for manufacturing a metal-clad laminate, comprising a vacuum deposition step in which a base film is transported by roll-to-roll while a thin metal film layer is deposited on the surface of the base film by a vacuum deposition method, and the deposited product is wound onto a roll while interleaving paper is sandwiched between the layers, wherein the winding point of the deposited product on the roll and the winding point of the interleaving paper are different, and the tension difference obtained by subtracting the winding tension of the interleaving paper from the winding tension of the deposited product is 0 to 130 N / m. [Effects of the Invention]

[0011] According to the present invention, misalignment between the film-formed product and the laminated paper during winding onto a roll can be suppressed, and partial peeling of the metal thin film layer caused by misalignment can be suppressed. As a result, a metal-clad laminate with fewer pinholes can be obtained. [Brief explanation of the drawing]

[0012] [Figure 1] This is a cross-sectional view of a copper-clad laminate according to one embodiment. [Figure 2] This is an explanatory diagram of a vacuum film deposition apparatus according to one embodiment. [Figure 3] This is an explanatory diagram of a winding section according to one embodiment. [Figure 4] This is an explanatory diagram of the winding mechanism in another example. [Modes for carrying out the invention]

[0013] Next, embodiments of the present invention will be described based on the drawings. (Metal-clad laminate) As shown in Figure 1, the metal-clad laminate 1 consists of a base film 10 and a metal layer 20 formed on the surface of the base film 10. As shown in Figure 1, the metal layer 20 may be formed on only one side of the base film 10, or it may be formed on both sides of the base film 10. A metal-clad laminate 1 in which the composition of the metal layer 20 is mainly copper is called a copper-clad laminate.

[0014] A resin film such as a polyimide film or a liquid crystal polymer (LCP) film can be used as the base film 10.

[0015] The metal layer 20 has a metal thin film layer 21 formed by a vacuum film forming method. The metal thin film layer 21 may be a single layer composed of one type of metal or alloy, or may be a laminate of a plurality of layers composed of different types of metals or alloys. In the case of a copper-clad laminate, the metal thin film layer 21 is composed of an underlayer metal layer 22 and a copper thin film layer 23. The underlayer metal layer 22 and the copper thin film layer 23 are laminated in this order on the surface of the base film 10. Generally, the underlayer metal layer 22 is made of nickel, chromium, or a nickel-chromium alloy. The underlayer metal layer 22 may not be provided. The copper thin film layer 23 may be formed on the surface of the base film 10 via the underlayer metal layer 22, or may be directly formed on the surface of the base film 10 without passing through the underlayer metal layer 22.

[0016] The metal layer 20 may have a plating film 24 formed by electrolytic plating. In the case of a copper-clad laminate, the plating film 24 is a copper plating film. The metal thin film layer 21 and the plating film 24 are laminated in this order on the surface of the base film 10. Note that the metal layer 20 may be composed only of the metal thin film layer 21 without having the plating film 24.

[0017] Although not particularly limited, the thickness of the base film 10 is generally 10 to 100 μm. The thickness of the underlayer metal layer 22 is generally 5 to 50 nm, and the thickness of the copper thin film layer 23 is generally 50 to 400 nm. The thickness of the plating film 24 is generally 8 to 12 μm in the case of the metal-clad laminate 1 processed by the subtractive method, and generally 0.1 to 5 μm in the case of the metal-clad laminate 1 processed by the semi-additive method.

[0018] (Manufacturing Method) Next, a method for manufacturing the metal-clad laminate 1 according to an embodiment of the present invention will be described. The manufacturing method of the present embodiment has (1) a vacuum film forming step and, if necessary, (2) an electrolytic plating step. Each step will be described below. <000​​​In the vacuum film forming process, a metal thin film layer 21 is formed on the surface of the base film 10 by a vacuum film forming method. The vacuum film forming method is divided into a physical vapor deposition method and a chemical vapor deposition method. Further, the physical vapor deposition method is divided into an evaporation method and a sputtering method. Among these, the sputtering method is preferably used.

[0020] The vacuum film forming process is performed while conveying the long strip-shaped base film 10 by roll-to-roll. The vacuum film forming process is performed using, for example, the vacuum film forming apparatus 2 shown in FIG. 2. Note that FIG. 2 illustrates the configuration of a sputtering apparatus.

[0021] The vacuum film forming apparatus 2 is an apparatus that manufactures a film-formed product D2 by performing vacuum film forming on a film-forming product D1 while conveying the long strip-shaped film-forming product D1 by roll-to-roll.

[0022] The vacuum film forming apparatus 2 has a vacuum chamber 30. Inside the vacuum chamber 30, an unwinding section 31 and a winding section 33 are arranged. The unwinding section 31 unwinds the film-forming product D1 from the film-forming product roll R1 in which the film-forming product D1 is wound in a roll shape. The winding section 33 winds up the film-formed product D2 to form a film-formed product roll R2. The film-forming product D1 is conveyed from the unwinding section 31 toward the winding section 33.

[0023] Inside the vacuum chamber 30, various rolls that define the conveyance path of the film-forming product D1 are provided. Examples of this type of roll include a free roll, a tension sensor roll, and a feed roll. The film-forming product D1 is wound around these rolls and conveyed.

[0024] A film deposition unit 32 is located in the transport path of the product D1 to be coated. The film deposition unit 32 deposits a thin metal film layer 21 on the surface of the product D1. In the case of a sputtering apparatus, the film deposition unit 32 consists of a can roll for cooling the product D1 and a plurality of sputtering cathodes provided around the can roll. A target is attached to the surface of each sputtering cathode that faces the can roll. Film deposition is performed by depositing sputtered particles ejected from the target onto the surface of the product D1. Therefore, a metal or alloy with the same composition as the thin metal film layer 21 is usually selected as the target.

[0025] A paper unwinding unit 34 is located inside the vacuum chamber 30. The paper unwinding unit 34 unwinds the paper 40 from a paper roll 40R, which is a roll formed by winding a long strip of paper 40 into a roll. The winding unit 33 winds the film-formed product D2 and the paper 40 together. That is, the paper 40 is sandwiched between the film-formed product D2 as it is wound onto the roll. As the paper 40, resin films such as polyethylene terephthalate film, polyimide film, and liquid crystal polymer (LCP) film can be used.

[0026] Immediately after deposition, the metal thin film layer 21 is not oxidized on the surface and is highly reactive. Therefore, when the deposited product D2 is wound into a roll without air in the vacuum deposition apparatus 2, a blocking phenomenon occurs where the metal thin film layer 21 sticks to the roll. When this happens, the metal thin film layer 21 may be locally peeled off when the deposited product D2 is unwound from the product roll R2. By winding the deposited product D2 with interleaving paper 40 in between, the occurrence of the blocking phenomenon can be prevented.

[0027] The vacuum deposition apparatus 2 shown in Figure 2 is a single-sided deposition apparatus that deposits a film on one side of the product to be deposited D1 in a single transport. By setting a roll with a long strip-shaped base film 10 wound around it as the product to be deposited roll R1 in the unwinding section 31, a metal-clad laminate 1 with only a thin metal film layer 21 deposited on one side of the base film 10 is obtained as the product D2.

[0028] If necessary, the film-coated product roll R2 is removed from the winding section 33, the film-coated surface is reversed, and it is set again in the unwinding section 31. This results in a metal-clad laminate 1 in which a thin metal film layer 21 is formed on the other side of the base film 10. In this case, the transport path of the film-coated product D1 (the metal-clad laminate 1 in which only the thin metal film layer 21 is formed on one side of the base film 10) and the interleaving paper 40 unwound from the film-coated product roll R1 is shown by the dashed line in Figure 2. The interleaving paper 40 unwound from the film-coated product roll R1 is wound up in the interleaving paper winding section 35.

[0029] Thus, when using a single-sided film deposition vacuum deposition apparatus 2, the metal thin film layer 21 can be deposited on both sides of the base film 10 by performing the vacuum deposition process in two stages.

[0030] A double-sided vacuum deposition apparatus can be used to deposit a film on both sides of the product D1 in a single transport. The double-sided vacuum deposition apparatus has two deposition sections in the transport path of the product D1. That is, a first deposition section that deposits a metal thin film layer 21 on the first surface of the product D1 and a second deposition section that deposits a metal thin film layer 21 on the second surface of the product D1 are arranged in the transport path of the product D1. By using a double-sided vacuum deposition apparatus, a metal-clad laminate 1 with metal thin film layers 21 deposited on both sides of the base film 10 can be obtained in a single vacuum deposition process.

[0031] As shown in Figure 3, it is preferable that the winding point P1 of the film-coated product D2 and the winding point P2 of the interleaving paper 40 on the film-coated product roll R2 are different. Here, winding point P1 is the position where the film-coated product D2 begins to be wound onto the film-coated product roll R2. Winding point P2 is the position where the interleaving paper 40 begins to be wound onto the film-coated product roll R2. The film-coated product D2 and the interleaving paper 40 have separate transport paths defined on different rolls and do not overlap until they reach the film-coated product roll R2. The film-coated product D2 and the interleaving paper 40 only overlap after they are wound onto the film-coated product roll R2.

[0032] As shown in Figure 4, it is also possible to overlap the film-coated product D2 and the interleaving paper 40 beforehand and wind them onto the film-coated product roll R2. In this case, the winding point P1 of the film-coated product D2 and the winding point P2 of the interleaving paper 40 will be the same. In this case, due to the difference in winding radii between the film-coated product D2 and the interleaving paper 40, a misalignment will occur between the film-coated product D2 and the interleaving paper 40 immediately after winding. For example, assuming that the thickness of the film-coated product D2 is 35 μm and the thickness of the interleaving paper 40 is 25 μm, a 30° winding will result in a misalignment of approximately 15 μm.

[0033] Generally, the resin film used as the base film 10 or the interleaving paper 40 contains fillers, and these fillers create irregularities on the surface of the resin film. If misalignment occurs between the film-formed product D2 and the interleaving paper 40, the portion of the metal thin film layer 21 that is formed on the protrusions of the base film 10, or the portion that comes into contact with the protrusions of the interleaving paper 40, may be rubbed and peeled off. This can cause pinholes to form in the metal thin film layer 21.

[0034] In contrast, as shown in Figure 3, if the winding point P1 of the film-formed product D2 and the winding point P2 of the interleaving paper 40 are different, the misalignment between the film-formed product D2 and the interleaving paper 40 can be suppressed, and partial peeling of the metal thin film layer 21 caused by the misalignment can be suppressed. As a result, the number of pinholes can be reduced.

[0035] The misalignment that occurs between the film-coated product D2 and the interleaving paper 40 when winding onto a roll is also influenced by the winding tension of both the film-coated product D2 and the interleaving paper 40. If the tension difference between the winding tension of the film-coated product D2 and the winding tension of the interleaving paper 40 is large, that is, if the winding tension of the interleaving paper 40 is too weak compared to the winding tension of the film-coated product D2, the interleaving paper 40 will stretch when the film-coated product D2 is placed on top of the interleaving paper 40 and wound, making it likely that misalignment will occur between the film-coated product D2 and the interleaving paper 40. Furthermore, if the tension difference is large, it is likely that misalignment will occur between the film-coated product D2 and the interleaving paper 40 when winding tightening occurs. For this reason, a smaller tension difference is preferable.

[0036] Specifically, the tension difference is preferably 0 to 130 N / m. Furthermore, the winding tension of the film-formed product D2 is preferably 140 to 230 N / m, and the winding tension of the laminated paper 40 is preferably 70 to 130 N / m.

[0037] In this way, by reducing the tension difference, the misalignment between the film-formed product D2 and the laminated paper 40 when winding onto the roll can be reduced, and partial peeling of the metal thin film layer 21 caused by misalignment can be suppressed. As a result, a metal-clad laminate 1 with fewer pinholes can be obtained.

[0038] While not particularly limited, the winding tension of the film-formed product D2 and the interleaving paper 40 can be individually adjusted, for example, by the following method. The film-formed product roll R2 is wound with the sum of the set winding tension of the film-formed product D2 and the set winding tension of the interleaving paper 40 (e.g., 260 N / m). Here, the sum of the winding tension of the film-formed product D2 and the interleaving paper 40 is controlled by a powder clutch provided between the winding roller of the film-formed product roll R2 and the drive motor. For this tension control, the tension of the film-formed product D2 detected by a tension sensor roll 35 provided in the transport path is fed back to the film-formed product D2. In addition, back tension is applied to the interleaving paper roll 40R by torque control, so that the interleaving paper 40 is pulled against the film-formed product roll R2. Here, the back tension of the interleaving paper 40 is set to the set winding tension of the interleaving paper 40 (e.g., 70 N / m) by torque control based on the thickness, winding diameter, and length of the interleaving paper 40. In this case, the winding tension of the film-formed product D2 will be the tension obtained by subtracting the winding tension of the interleaving paper 40 from the winding tension of the film-formed product roll R2 (for example, 190 N / m).

[0039] (2) Electrolytic plating process The electroplating process is performed as needed. In the electroplating process, a plating film 24 is formed on the surface of the thin metal layer 21 by electroplating. A metal-clad laminate 1 is obtained in which the metal layer 20 is thickened by electroplating.

[0040] Electroplating is performed while conveying the intermediate product (metal-clad laminate 1, in which only a thin metal film layer 21 is formed on one or both sides of the base film 10) by a roll-to-roll method. A roll-to-roll plating apparatus is an apparatus that performs electroplating on an intermediate product while conveying a long, strip-shaped intermediate product. The electroplating apparatus has a supply device that unwinds the intermediate product from the intermediate product roll. The intermediate product is wound with a long, strip-shaped interleaving paper 40 sandwiched in between. The interleaving paper 40 is separated from the intermediate product when it is unwinded and wound up by an interleaving paper winding device. The electroplating apparatus has a winding device that winds the electroplated metal-clad laminate 1 into a roll shape.

[0041] Various rollers are positioned between the supply device and the winding device, defining the transport path for the intermediate product. A pre-treatment tank, a plating tank, and a post-treatment tank are located along the transport path for the intermediate product.

[0042] Furthermore, it is preferable to place an atmospheric pressure plasma processing device in the transport path of the intermediate product. Components of the interleaving paper 40 may be locally transferred to the surface (metal thin film layer 21) of the intermediate product. When a plating film 24 is formed on the surface of the metal thin film layer 21 on which components of the interleaving paper 40 have been locally transferred, defects such as pinholes may occur in the metal layer 20 due to the components of the interleaving paper 40. Therefore, it is preferable to irradiate the surface of the intermediate product with atmospheric pressure plasma to remove the components of the interleaving paper 40 before performing electroplating. After the intermediate product is surface-cleaned with an atmospheric pressure plasma processing device, electroplating is performed in a plating tank.

[0043] A plating solution is stored inside the plating tank. When forming a copper plating film, a copper plating solution is used. The copper plating solution contains a water-soluble copper salt. Any water-soluble copper salt commonly used in copper plating solutions can be used without particular limitations. The copper plating solution may also contain sulfuric acid. The pH and sulfate ion concentration of the copper plating solution can be adjusted by adjusting the amount of sulfuric acid added. The copper plating solution may also contain additives that are commonly added to plating solutions. As additives, one type selected from brightener components, leveler components, polymer components, chlorine components, etc., may be used alone, or two or more types may be used in combination.

[0044] An anode is provided inside the plating tank. Electroplating is performed by passing an electric current between the anode and the intermediate product. A plating film 24 is formed on the surface of the intermediate product by electroplating, and a metal-clad laminate 1 is obtained.

[0045] If an intermediate product in which a thin metal film layer 21 is formed on only one side of the base film 10 is subjected to electroplating, a metal-clad laminate 1 can be obtained in which a metal layer 20 consisting of a thin metal film layer 21 and a plating film 24 is formed on only one side of the base film 10. If an intermediate product in which a thin metal film layer 21 is formed on both sides of the base film 10 is subjected to electroplating, a metal-clad laminate 1 can be obtained in which a metal layer 20 consisting of a thin metal film layer 21 and a plating film 24 is formed on both sides of the base film 10. [Examples]

[0046] (Common conditions) A polyimide film (Toray DuPont 150EN) with a width of 570 mm and a thickness of 37.5 μm was prepared as the base film. The base film was set in a magnetron sputtering apparatus. A nickel-chromium alloy target and a copper target were installed inside the magnetron sputtering apparatus. The nickel-chromium alloy target was composed of 20 mass% Cr and 80 mass% Ni. Under a vacuum atmosphere, a 25 nm thick underlayer metal layer made of nickel-chromium alloy was formed on one side of the base film, and a 150 nm thick copper thin film layer was formed on top of it. The intermediate product was wound up inside the magnetron sputtering apparatus with interleaving paper in between to obtain an intermediate product roll.

[0047] Next, the intermediate product roll was set in a roll-to-roll electrolytic plating apparatus. After unloading the intermediate product from the intermediate product roll and separating the interleaving paper, a 2.1 μm thick copper plating film was deposited on one side of the intermediate product.

[0048] Here, the copper plating solution contains 120 g / L of copper sulfate, 70 g / L of sulfuric acid, 16 mg / L of a brightener component, 20 mg / L of a leveler component, 1,100 mg / L of a polymer component, and 50 mg / L of a chlorine component. Bis(3-sulfopropyl) disulfide (reagent manufactured by RASCHIG GmbH) was used as the brightener component. Diallyldimethylammonium chloride-sulfur dioxide copolymer (PAS-A-5 manufactured by Nitto Boseki Medical Co., Ltd.) was used as the leveler component. Polyethylene glycol-polypropylene glycol copolymer (Unilube 50MB-11 manufactured by NOF Corporation) was used as the polymer component. Hydrochloric acid (35% hydrochloric acid manufactured by Wako Pure Chemical Industries, Ltd.) was used as the chlorine component.

[0049] In the electroplating process, the temperature of the copper plating solution was set to 31°C. Furthermore, during the electroplating process, the copper plating solution was agitated by spraying it from a nozzle approximately perpendicular to the surface of the intermediate product.

[0050] (Example 1) As shown in Figure 3, when winding the film-deposited product (intermediate product) in the magnetron sputtering apparatus, the winding point of the film-deposited product and the winding point of the interleaving paper were set to be different. In addition, the winding tension of the film-deposited product was set to 110N, and the winding tension of the interleaving paper was set to 40N.

[0051] After depositing a copper plating film on the surface of the intermediate product, the number of pinholes was evaluated. The number of pinholes was evaluated in a darkroom under fluorescent backlighting (luminance 2300 cd / m²). 2 A 300 x 170 mm sample (copper-clad laminate) was placed on top of the surface, and the number of transmitted light points was counted visually. As a result, the number of pinholes was found to be 2.

[0052] (Comparative Example 1) As shown in Figure 4, when winding the film-deposited product (intermediate product) in the magnetron sputtering apparatus, the winding point of the film-deposited product and the winding point of the interleaving paper were made to coincide. Furthermore, the winding tension of the film-deposited product was set to 110N, and the winding tension of the interleaving paper was set to 40N.

[0053] After depositing a copper plating film on the surface of the intermediate product, the number of pinholes was evaluated. As a result, the number of pinholes was 42.

[0054] From the above, it was confirmed that in a magnetron sputtering apparatus, the number of pinholes can be reduced if the winding point of the deposited film and the winding point of the interleaving paper are different when winding the deposited film.

[0055] (Evaluation of winding tension) Next, the relationship between the winding tension of the deposited film and the interleaving paper and the number of pinholes was evaluated in the magnetron sputtering apparatus. As shown in Figure 3, when winding the deposited film in the magnetron sputtering apparatus, the winding point of the deposited film and the winding point of the interleaving paper were made to be different. Samples were prepared by setting the winding tension of the deposited film and the winding tension of the interleaving paper to various tensions. After depositing a copper plating film on each sample, the number of pinholes was evaluated.

[0056] The winding tension and pinhole count for each sample are shown in Table 1. Note that in Table 1, the winding tension is converted to the tension per unit width of both the film-deposited product and the interleaving paper. The tension difference is the value obtained by subtracting the winding tension of the interleaving paper from the winding tension of the film-deposited product.

[0057] [Table 1]

[0058] Table 1 shows that in the positive tension difference range, i.e., when the winding tension of the film-formed product is greater than the winding tension of the laminated paper, a smaller tension difference tends to result in fewer pinholes. Specifically, it can be said that if the tension difference is between 0 and 130 N / m, the number of pinholes can be reduced to 10 or less.

[0059] While the direct effect of the winding tension on the number of pinholes in the deposited film is not entirely clear, comparing Sample 1 and Sample 2, it appears that a lower winding tension tends to result in fewer pinholes. Based on the results in Table 1, it is considered preferable to use a winding tension of 140-230 N / m for the deposited film to minimize the number of pinholes.

[0060] The results in Table 1 do not indicate a direct effect of the winding tension of the laminated paper on the number of pinholes. Table 1 suggests that the number of pinholes can be suppressed at least when the winding tension of the laminated paper is in the range of 70 to 130 N / m. [Explanation of Symbols]

[0061] 1 Metal-clad laminate 10 base film 20 metal layer 21 Metal thin film layer 24 Plating film 2 Vacuum deposition equipment 30 Vacuum Chamber 31. Outlet 32 Film forming section 33 Winding section 34. Paper unwinding section 40 slip paper

Claims

1. The system includes a vacuum deposition process in which a base film is transported by roll-to-roll, a thin metal film layer is deposited on the surface of the base film by a vacuum deposition method, and the deposited product is wound onto a roll while interleaving paper is sandwiched between the layers. The winding point of the film-formed product on the roll and the winding point of the interleaving paper are different. The tension difference obtained by subtracting the winding tension of the laminated paper from the winding tension of the film-formed product is 17 to 130 N / m. The winding tension of the aforementioned laminated paper is 70 to 130 N / m. A method for manufacturing a metal-clad laminate, characterized by the following:

2. The winding tension of the aforementioned film-formed product is 140 to 230 N / m. A method for manufacturing a metal-clad laminate according to claim 1.

3. The system further comprises an electrolytic plating step of forming a plating film on the surface of the metal thin film layer by electrolytic plating. A method for manufacturing a metal-clad laminate according to claim 1 or 2, characterized by the above.

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