Correction device and correction method

Abstract

To provide a correction device and a correction method that can virtually determine points necessary for estimating the curved shape of a deformed member to be corrected.SOLUTION: A correction device includes an acquisition unit that measures and acquires the positions of a first mark and a second mark attached to one of a reference member and a corrected member, respectively, using a measuring device provided on the other of the reference member and the corrected member, and an estimation unit that calculates the position of a third mark that can be determined virtually on the member using the measured positions of the first mark and the second mark, and estimates the shape of the corrected member deformed relative to the reference member on the basis of the positions of the first mark, the second mark, and the third mark.SELECTED DRAWING: Figure 4

Description

Technical Field

[0003]

[0001] This specification relates to a correction device and a correction method.

Background Art

[0002] Conventionally, for example, a component mounting device disclosed in Patent Document 1 has been known. In a conventional component mounting device, three reference marks set on a reference fixing rail are imaged by a CCD camera that moves on a shaft-shaped member to be corrected integrally with a mounting head. And in a conventional component mounting device, the three reference marks are imaged twice, at the time of manufacturing and assembly and at the time of installation, and the difference in the position change of each reference mark is calculated as the warpage amount of the member to be corrected, and coordinate correction is performed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in the above-described conventional component mounting device, three reference marks preset on a reference fixing rail are imaged, and the warpage amount of the member to be corrected with warpage is calculated using the coordinates of each of the three imaged reference marks. In this case, when the CCD camera is moved, if three reference marks necessary for calculating the warpage amount, in other words, necessary for grasping the curved shape of the deformed member to be corrected, can be imaged, the curved shape of the deformed member to be corrected can be grasped and the warpage amount can be calculated. However, if it is difficult to image even one of the three set reference marks even when the CCD camera is moved, it becomes difficult to grasp the curved shape of the deformed member to be corrected, that is, to calculate the warpage amount.

[0005] This specification aims to provide a correction device and a correction method that can virtually determine the points necessary when estimating the curve shape of a deformed member to be corrected. [Means for solving the problem]

[0006] This specification discloses a correction device comprising: an acquisition unit that measures and acquires the positions of a first mark and a second mark attached to one of the reference member and the member to be corrected, respectively, using measuring devices provided on the other member of the reference member and the member to be corrected; and an estimation unit that uses the measured positions of the first mark and the second mark to calculate the position of a third mark that can be virtually determined on the one member, and estimates the shape of the member to be corrected as deformed relative to the reference member based on the positions of the first mark, the second mark, and the third mark.

[0007] Furthermore, this specification discloses a correction method comprising: an acquisition step of measuring and acquiring the positions of a first mark and a second mark attached to one of the reference member and the member to be corrected, respectively, using measuring devices provided on the other member of the reference member and the member to be corrected; an estimation step of calculating the position of a virtually determinable third mark on the one member using the measured positions of the first mark and the second mark, and estimating the shape of the member to be corrected as deformed relative to the reference member based on the positions of the first mark, the second mark, and the third mark; and a correction amount calculation step of calculating a correction amount to correct an arbitrary point on the member to be corrected that has moved due to the deformation of the member to be corrected to coincide with the starting point where the arbitrary point was located before it moved.

[0008] This specification also discloses the technical idea behind changing "the correction device described in claim 1 or 2" to "the correction device described in any one of claims 1-3" in claim 4 of the original application. Furthermore, this specification also discloses the technical idea behind changing "the correction device described in claim 1 or 2" to "the correction device described in any one of claims 1-4" in claim 5 of the original application. Furthermore, this specification also discloses the technical idea behind changing "the correction device described in claim 1 or 2" to "the correction device described in any one of claims 1-9" in claim 10 of the original application. In addition, this specification also discloses the technical idea behind changing "the correction device described in claim 1 or 2" to "the correction device described in any one of claims 1-10" in claim 11 of the original application. [Effects of the Invention]

[0009] According to these methods, the correction device can virtually determine a third mark corresponding to a point necessary for estimating the shape of the deformed member to be corrected, using the acquired first and second marks. Then, based on the estimated shape of the member to be corrected, the correction device can correct the deformed member to its shape before deformation. [Brief explanation of the drawing]

[0010] [Figure 1] This is a plan view showing an example configuration of a parts mounting machine. [Figure 2] This is a perspective view showing an example of a member to be corrected. [Figure 3] This is a schematic diagram illustrating the deformation (thermal deformation) of the component being corrected. [Figure 4] This is a block diagram showing an example of a control block for a correction device. [Figure 5] This is a schematic diagram illustrating the first and second marks before deformation (before thermal deformation). [Figure 6] This is a schematic diagram illustrating the first and second marks after deformation (thermal deformation). [Figure 7] This is a schematic diagram illustrating the line symmetry of the deformation (thermal deformation) of the corrected member. [Figure 8] This is a schematic diagram to explain the hypothetical decision of the third mark. [Figure 9] This is a schematic diagram illustrating the estimation of the shape of the component to be corrected. [Figure 10] This is a schematic diagram to illustrate a variation. [Modes for carrying out the invention]

[0011] The correction device and correction method will be described below with reference to the drawings. In this embodiment, the correction device and correction method will be exemplified by using a substrate camera provided in a component mounting machine that performs mounting work to attach components (e.g., electronic components, etc.) to a substrate. In this embodiment, the correction device and correction method will be described as the X-axis direction for transporting the substrate K, the Y-axis direction being perpendicular to the X-axis direction, and the Z-axis direction being perpendicular to both the X-axis and Y-axis directions. In the following description, the "first direction" will correspond to the Y-axis direction, the "second direction" will correspond to the X-axis direction, and the "third direction" will correspond to the Z-axis direction.

[0012] 1. Configuration of the parts mounting machine 10 The configuration of the component mounting machine 10 will be explained with reference to Figure 1. The component mounting machine 10 mounts multiple components B onto a substrate K. For this purpose, the component mounting machine 10 is equipped with a substrate transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15 as a measuring device, and a control device 16.

[0013] The substrate transfer device 11 includes a first guide rail 111 and a second guide rail 112. The first guide rail 111 and the second guide rail 112 extend in the X-axis direction (second direction) and are assembled to a base (not shown) so as to be parallel to each other in the Y-axis direction (first direction). Here, the first guide rail 111 is fixed to the base, and particularly, deformation (including thermal deformation) in the Y-axis direction (first direction) is unlikely to occur. On the other hand, the second guide rail 112 can approach or separate from the first guide rail 111 along the Y-axis direction (first direction) according to, for example, the size (width size) of the substrate K to be transferred.

[0014] Therefore, in the present embodiment, the first guide rail 111 will be described as the "reference member". And in the present embodiment, as shown in FIG. 1, the first guide rail 111, which is the reference member as "one of the reference member and the member to be corrected", is provided with a first mark M1 and a second mark M2.

[0015] In addition, the substrate transfer device 11 is provided with a pair of conveyor belts arranged parallel to each other and spaced apart along the first guide rail 111 and the second guide rail 112. The pair of conveyor belts rotate with the substrate K placed on the conveyor transfer surface and transfer the substrate K along the X-axis direction (second direction). Here, the substrate K is a circuit board, and for example, an electronic circuit, an electric circuit, a magnetic circuit, etc. are formed. The substrate transfer device 11 carries the substrate K into the machine of the component mounting machine 10 and positions the substrate K at a predetermined position inside the machine. After the mounting process of a plurality of components B by the component mounting machine 10 is completed, the substrate transfer device 11 carries the substrate K out of the machine of the component mounting machine 10.

[0016] The component supply device 12 supplies multiple components B to be mounted on the substrate K. The component supply device 12 is equipped with multiple feeders 121 arranged along the transport direction (X-axis direction) of the substrate K. Each of the multiple feeders 121 is equipped with a reel. A carrier tape containing multiple components B is wound around the reel. The feeders 121 feed the carrier tape in a pitch, supplying the components B in a pickable manner at the supply position located on the tip side of the feeder 121. The component supply device 12 can also supply leaded components, which are relatively larger than chip components, in a state arranged on a tray.

[0017] The component transfer device 13 mainly comprises a pair of Y-axis rails 131, a Y-slide 132, and an X-slide 133. The pair of Y-axis rails 131 are provided extending along the Y-axis direction (first direction). The axial Y-slide 132, which is the member to be corrected, extends along the transport direction of the substrate K corresponding to the X-axis direction (second direction) and is suspended from the pair of Y-axis rails 131. The Y-slide 132 is supported at both ends by the pair of Y-axis rails 131. The Y-slide 132 moves in the Y-axis direction (first direction) by a linear motion mechanism (not shown). The X-slide 133 is suspended from the Y-slide 132. The X-slide 133 moves in the X-axis direction (second direction) by a linear motion mechanism (not shown).

[0018] Here, as shown in Figure 2, the Y-slide 132 has a rectangular cross-sectional shape and is formed by bonding together a first slide member 132A and a second slide member 132B made of different materials, for the purpose of weight reduction, etc. The first slide member 132A is made of, for example, a metal material (iron, aluminum, aluminum alloy, etc.). The second slide member 132B is made of, for example, a carbon material, a fiber-reinforced resin including carbon fiber reinforced resin or aramid resin reinforced fiber. For this reason, the thermal expansion coefficients of the first slide member 132A and the second slide member 132B are different. For example, the thermal expansion coefficient of the second slide member 132B, which is made of carbon material, is smaller than that of the first slide member 132A, which is made of iron material.

[0019] Then, as shown in FIGS. 1 and 2, the Y slide 132 has a first slide member 132A disposed on one side along the Y-axis direction (first direction) and a second slide member 132B disposed on the back side. Therefore, as will be described later, the Y slide 132 has a larger deformation amount due to thermal deformation accompanying the thermal expansion of the first slide member 132A than the deformation amount due to thermal deformation accompanying the thermal expansion of the second slide member 132B in response to a temperature change inside the component mounting machine 10, specifically, a temperature rise. As a result, the Y slide 132 tends to have a deformed shape caused by the difference in the deformation amounts of the generated thermal deformations, for example, a curved shape that is convex along the Y-axis direction (first direction) that is curved like an arch (see FIG. 3). Incidentally, the first slide member 132A and the second slide member 132B are thermally deformed so as to expand also in the X-axis direction (second direction) while being constrained by a pair of Y-axis rails 131, respectively.

[0020] Further, the mounting head 20 is detachably (replaceably) provided on the X slide 132 suspended by a clamp member. That is, the Y slide 132 supports the mounting head 20 via the X slide 133. The mounting head 20 picks up and holds the component B supplied by the component supply device 12 using at least one holding member 21, and mounts the component B on the substrate K positioned by the substrate transfer device 11. The holding member 21 can use, for example, a suction nozzle, a chuck, or the like. Incidentally, the suction nozzle is capable of moving up and down along the vertical direction, that is, the Z-axis direction (third direction), and performs a suction operation of sucking and picking up the component B from the supply position of the feeder 121 by supplying a negative pressure, and a mounting operation of mounting the component B on the substrate K by supplying a positive pressure.

[0021] The component camera 14 is supported by, for example, a first guide rail 111 fixed to the base of the component mounting machine 10 so that the optical axis faces upward in the Z-axis direction (third direction), that is, the vertical direction. Therefore, the component camera 14 can image the component B or the like held by the holding member 21 such as a suction nozzle from below in the vertical direction.

[0022] The substrate camera 15, acting as a measuring device, is mounted on the Y slide 132 of the component transfer device 13, which is the corrected member acting as the "other member of the reference member and the member to be corrected," more specifically on the X slide 133 suspended from the Y slide 132, such that its optical axis is directed downward in the Z-axis direction (third direction), i.e., the vertical direction. Therefore, the substrate camera 15 moves together with the Y slide 132 and the X slide 133 in the Y-axis direction (first direction) and the X-axis direction (second direction) to image the substrate K, the component B mounted on the substrate K, and the first mark M1 and second mark M2 attached to the first guide rail 111 from above in the vertical direction.

[0023] The component camera 14 and the circuit board camera 15 perform imaging based on control signals sent from the control device 16. The image data G, including the image captured by the component camera 14 and the images of the first mark M1 and second mark M2 (described later) captured by the circuit board camera 15, is transmitted to the control device 16. Since the component camera 14 and the circuit board camera 15 can use known digital imaging devices having image sensors such as CCD or CMOS, a detailed explanation of their structure is omitted.

[0024] The control device 16 is equipped with a computer device having a CPU, ROM, RAM, various interfaces, etc., and a storage device for storing various information. The control device 16 receives detected values ​​and information output from various sensors provided on the component mounting machine 10, or image data G of various images from the component camera 14 and the circuit board camera 15. The control device 16 executes a control program and sends control signals to each device according to, for example, a specified mounting position and specified mounting angle of component B which are set in advance as predetermined mounting conditions, or based on the input image data G.

[0025] For example, the control device 16 causes the substrate K, positioned by the substrate transport device 11, to be imaged by the substrate camera 15. The control device 16 then processes the image data G of the image captured by the substrate camera 15 to recognize the positioning state of the substrate K. The control device 16 also causes the component B supplied by the component supply device 12 to be picked up and held by the holding member 21, and then causes the held component B to be imaged by the component camera 14. The control device 16 then processes the image data G of the image captured by the component camera 14 to recognize the orientation of the component B.

[0026] The control device 16 executes a control program and drives the Y slide 132 and X slide 133 of the component transfer device 13 to move the holding member 21 upwards to the designated mounting position for mounting component B on the substrate K. The control device 16 also corrects the designated mounting position and mounting angle based on the positioning state of the substrate K and the orientation of component B, and sets the actual mounting position and mounting angle for mounting component B.

[0027] The control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the holding member 21 according to the mounting position and mounting angle. Then, the control device 16 lowers the holding member 21 at the corrected target position and the corrected rotation angle, and mounts the component B onto the substrate K. The control device 16 performs the mounting process of mounting multiple components B onto the substrate K by repeating the pick-and-place cycle as described above.

[0028] 2. Configuration of the correction device 30 The Y-slide 132 of the component transfer device 13, which is positioned inside the component mounting machine 10 and repeats the pick-and-place cycle of component B, may be affected by temperature changes inside the machine and may undergo thermal deformation as the temperature rises. When thermal deformation due to thermal expansion occurs, the position of the holding member 21, such as the suction nozzle, supported by the Y-slide 132 may be shifted by the amount of thermal deformation relative to the command value from the control device 16, for example.

[0029] Incidentally, as mentioned above, the Y-slide 132 of the component transfer device 13 in the component mounting machine 10 of this embodiment is formed using, for example, a first slide member 132A mainly made of metal material and a second slide member 132B mainly made of carbon material, in order to achieve weight reduction. That is, the Y-slide 132 is formed by bonding a first slide member 132A and a second slide member 132B, which are made of materials with different coefficients of thermal expansion, adjacent to each other in the Y-axis direction (first direction).

[0030] Therefore, in the Y-slide 132 illustrated in this embodiment, as shown in Figure 3, in addition to thermal deformation in the longitudinal direction of the Y-slide 132 due to temperature changes inside the component mounting machine 10, thermal deformation of the Y-slide 132 due to differences in thermal expansion occurs, specifically, thermal deformation that results in a convex curve shape along the Y-axis direction (first direction). Note that in Figure 3, the thermal deformation (deformation) of the Y-slide 132 is exaggerated to facilitate understanding.

[0031] In this case, as shown in Figure 3, the retaining member 21, which is held via the X-slide 133 suspended from the Y-slide 132, is also affected by the arching thermal deformation that occurs in the Y-axis direction (first direction). In this state, even if a well-known linear correction is performed, there is a risk that accurate linear correction, in other words, accurate correction of the mounting position of the retaining member 21, will not be possible. Therefore, in order to improve the accuracy of the conventionally performed well-known linear correction and accurately correct the mounting position of the retaining member 21, it is necessary to correct the Y-slide 132, which has been thermally deformed into an arching shape due to thermal expansion, back to its shape before thermal deformation (for example, a straight line).

[0032] Here, in order to correct the Y-slide 132, which has been thermally deformed into an arc shape, so that it can be considered as the straight Y-slide 132 before thermal deformation, it is necessary to estimate the curve shape of the Y-slide 132. In this case, it is generally effective to use a quadratic curve approximation method.

[0033] However, while estimating the curve shape requires measuring (imaging) three points, as in the conventional component mounting device described above, if only two points can be measured (imaging), the curve shape cannot be approximated using the quadratic curve approximation method. Furthermore, even if three points can be measured (imaging), if, for example, the measurement (imaging) of the three points takes time, it becomes difficult to quickly correct the positional deviation of the retaining member to its mounting position using linear correction.

[0034] Therefore, in this embodiment, the correction device 30 comprises an acquisition unit 31 and an estimation unit 32, as shown in Figure 4. Furthermore, in this embodiment, the correction device 30 comprises a correction amount calculation unit 33. With these, the correction device 30 can virtually determine a third mark M3 using two points, a first mark M1 and a second mark M2, measured based on image data G captured by the substrate camera 15. In addition, the correction device 30 can estimate the shape of the Y slide 132 that has been thermally deformed due to the difference in thermal expansion, more specifically, the curved shape that is convex along the Y axis direction (first direction), using the measured first mark M1 and second mark M2 and the virtually determined third mark M3.

[0035] The correction device 30 can then calculate a correction amount A based on the estimated curve shape of the Y slide 132, so that the Y slide 132 after thermal deformation along the Y axis direction (first direction) is considered to be the Y slide 132 before thermal deformation. Therefore, the correction device 30 can improve the accuracy of the correction by linear correction, and as a result, it becomes possible to accurately correct the mounting position of the retaining member 21.

[0036] Furthermore, the acquisition unit 31, estimation unit 32, and correction amount calculation unit 33 can be provided in various control devices, management devices, computing devices, image processing devices, etc. For example, at least one of the acquisition unit 31, estimation unit 32, and correction amount calculation unit 33 can be provided in the control device 16 of the component mounting machine 10. Alternatively, at least one of the acquisition unit 31, estimation unit 32, and correction amount calculation unit 33 can be provided in a management device that is communicatively connected to the control device 16. Moreover, at least one of the acquisition unit 31, estimation unit 32, and correction amount calculation unit 33 can be formed on the cloud.

[0037] In this embodiment, as shown in Figures 1 and 4, the acquisition unit 31, the estimation unit 32, and the correction amount calculation unit 33 are provided in the control device 16 of the component mounting machine 10. That is, the correction device 30 is provided in the component mounting machine 10.

[0038] 2-1. Acquisition part 31 The acquisition unit 31 acquires image data G of the first mark M1 and the second mark M2 attached to the first guide rail 111 of the substrate transport device 11, which is one of the components transport devices 11, which is captured by the Y slide 132, which is the other component of the components transfer device 13, or more specifically, by the substrate camera 15 suspended from the Y slide 132 and supported by the X slide 133. That is, the acquisition unit 31 (control device 16) moves the Y slide 132 of the components transfer device 13 in the Y axis direction (first direction) and moves the X slide 133 in the X axis direction (second direction), thereby moving the substrate camera 15 in the X axis direction and the Y axis direction.

[0039] The acquisition unit 31 then causes the moved substrate camera 15 to image the first mark M1 and the second mark M2 attached to the first guide rail 111 of the substrate transport device 11, and acquires image data G representing the captured images Gs (see Figures 5 and 6). The image data G is associated with the position information of the Y slide 132 and the X slide 133 (more specifically, the position information of the substrate camera 15).

[0040] Here, the acquisition unit 31 acquires image data G of the first mark M1 and the second mark M2 by having the substrate camera 15 image them before thermal deformation occurs in the Y slide 132 due to thermal expansion, for example, before the component mounting machine 10 is in operation. In this case, the acquisition unit 31 acquires image data G from the substrate camera 15 supported by the Y slide 132 before thermal deformation, so that the center position of the image Gs represented by the image data G, i.e., the reference position of the substrate camera 15, is aligned with the reference position of the substrate camera 15, as shown in Figure 5.

[0041] Then, the acquisition unit 31, depending on the situation in which thermal deformation may occur in the Y slide 132, for example, when the predetermined conditions described later are met, causes the substrate camera 15 to image the first mark M1 and the second mark M2 respectively and acquires the respective image data G. In this case, the acquisition unit 31 moves the Y slide 132 (and X slide 133) to the imaging position in which the first mark M1 and the second mark M2 were each imaged before thermal deformation, and causes the substrate camera 15 to image the first mark M1 and the second mark M2 respectively.

[0042] In this case, the Y-slide 132 is thermally deformed into a curved shape that is convex along the Y-axis direction (first direction) (see Figure 3). Therefore, even if the substrate camera 15 supported by the Y-slide 132 images the first mark M1 and the second mark M2 at the same imaging position as before thermal deformation, the reference position of the substrate camera 15 moves along with the Y-slide 132 from its position before thermal deformation. As a result, in the image Gs, as shown in Figure 6, the first mark M1 and the second mark M2 are imaged shifted from the center position of the image Gs. The positional shift of the first mark M1 and the second mark M2 from the center position on the image Gs, that is, the amount of movement from before thermal deformation to after thermal deformation, corresponds to the amount of change (absolute value) due to the thermal deformation of the Y-slide 132.

[0043] Specifically, as shown in Figure 3, when the Y-slide 132 undergoes thermal deformation into a curved shape that is convex downwards in the plane of the paper in Figure 3 along the Y-axis direction (first direction), the substrate camera 15 will move in a direction that is relatively closer to the first mark M1 and the second mark M2 (downwards in the plane of the paper in Figure 3). That is, as shown in Figure 6, the center position of the image Gs corresponding to the intersection of the dashed lines (i.e., the reference position of the substrate camera 15) will move downwards in Figure 6 along with the thermal deformation of the Y-slide 132. In this case, in the image Gs, as shown by the black circles in Figure 6, the positions of the first mark M1 and the second mark M2 will be located above the center position of the image Gs.

[0044] On the other hand, although not shown in the illustration, if the Y slide 132 is thermally deformed into a curved shape that is convex upwards in the Y-axis direction (first direction) as shown in Figure 3, the substrate camera 15 will move in a direction that separates it from the first mark M1 and the second mark M2 (upwards in Figure 3). In this case, as shown in Figure 6, the center position of the image Gs moves upwards along with the thermal deformation of the Y slide 132, so the positions of the first mark M1 and the second mark M2, indicated by the white circles of the dashed lines, will be located below the center position of the image Gs.

[0045] In other words, when the substrate camera 15 supported by the Y slide 132 images the first mark M1 and the second mark M2 attached to the first guide rail 111, the direction of movement of the first mark M1 and the second mark M2 on the image Gs is opposite to the direction in which the Y slide 132 is thermally deformed into a curved shape that is convex along the Y axis direction (first direction).

[0046] Here, when the acquisition unit 31 acquires image data G from the substrate camera 15, it can perform image processing such as point symmetry (rotation by 180 degrees around the center position of the image Gs) on the first mark M1 and the second mark M2 on the image Gs with respect to the center position of the image Gs (which coincides with the reference position of the substrate camera 15). This makes it possible to match the direction in which the first mark M1 and the second mark M2 moved from before thermal deformation to after thermal deformation with the direction in which they thermally deform into a curved shape that is convex along the Y axis direction (first direction) of the Y slide 132.

[0047] In the following description of this embodiment, the acquisition unit 31 acquires image data G without performing the above-mentioned image processing, that is, in which the movement directions of the first mark M1 and the second mark M2 are opposite to the direction of thermal deformation of the Y slide 132. This eliminates the time required for image processing.

[0048] Based on the image Gs before thermal deformation shown in Figure 5 and the position information at the time of acquisition, the acquisition unit 31 measures the coordinates (Xrt, Yrt) of the first origin point P1b corresponding to the first mark M1, which is captured so as to coincide with the center position of the image Gs, and the coordinates (Xct, Yct) of the second origin point P2b corresponding to the second mark M2 (see Figure 9). Then, based on the image Gs acquired after thermal deformation shown in Figure 6 and the position information at the time of acquisition, the acquisition unit 31 calculates the amount of change Δr(Xrd, Yrd) that has moved from the first origin point P1b due to the thermal deformation of the Y slide 132, and measures (calculates) the coordinates (Xrt+Xrd, Yrd) of the first point P1m corresponding to the first mark M1 (see Figure 9).

[0049] Furthermore, the acquisition unit 31 calculates the amount of change Δc(Xcd,Ycd) that moves from the second starting point P2b due to the thermal deformation of the Y slide 132, and measures (calculates) the coordinates (Xct+Xcd,Ycd) of the second point P2m corresponding to the second mark M2 (see Figure 9). Then, as shown in Figure 4, the acquisition unit 31 outputs the coordinates (Xrt+Xrd,Yrd) of the first point P1m corresponding to the first mark M1, which were measured and acquired, and the coordinates (Xct+4Xcd,Ycd) of the second point P2m corresponding to the second mark M2, to the estimation unit 32 and the correction amount calculation unit 33.

[0050] 2-2.Estimation part 32 The estimation unit 32 acquires the coordinates (Xrt+Xrd, Yrd) of the first point P1m of the first mark M1 and the coordinates (Xct+Xcd, Ycd) of the second point P2m of the second mark M2, which are measured by the acquisition unit 31. Then, using the coordinates (Xrt+Xrd, Yrd) of the first point P1m of the first mark M1 and the coordinates (Xct+Xcd, Ycd) of the second point P2m of the second mark M2, the estimation unit 32 calculates the coordinates of the third point P3m of the third mark M3, which can be virtually determined on the first guide rail 111.

[0051] Here, various experiments were conducted to complete the correction device 30. As a result, it was found that the Y-slide 132 of the component transfer device 13 in the component mounting machine 10, more specifically the Y-slide 132 formed from a first slide member 132A and a second slide member 132B with both ends supported by a pair of Y-axis rails 131, undergoes symmetrical thermal deformation in the X-axis direction (second direction), i.e., at the center in the extension direction of the Y-slide 132, as shown in Figure 7. In other words, as shown in Figure 7, it was found that a symmetry axis O can be set as an axis of symmetry passing through the center in the extension direction of the Y-slide 132 (a position where the distance from each end of the Y-slide 132 is L). It should be noted that the setting of the symmetry axis O does not necessarily have to pass through the center of the Y-slide 132, but can be set between the positions of both ends of the Y-slide 132.

[0052] Therefore, as shown in Figure 8, the estimation unit 32 virtually determines the third mark M3, indicated by the dashed circle, as the line symmetry of the first mark M1. Specifically, using the coordinates (Xrt+Xrd,Yrd) of the first point P1m of the first mark M1, the estimation unit 32 calculates the coordinates (-Xrt-Xrd,Yrd) of the third point P3m of the third mark M3 as the line symmetry with respect to the axis of symmetry O.

[0053] Here, the third point P3m of the third mark M3 is virtually determined by the line symmetry with the first point P1m of the first mark M1. Therefore, the third starting point P3b of the third mark M3 (see Figure 9) can also be virtually determined by the line symmetry with the first starting point P1b of the first mark M1. That is, the coordinates of the starting point P3b of the third mark M3 can be virtually determined as coordinates (-Xrt, Yrt). Furthermore, the change amount Δl of the third mark M3 (see Figure 9) can also be virtually determined as the change amount Δl(-Xrd, Yrd) based on the change amount Δr, as it corresponds to the line symmetry with the first mark M1. Thus, it can also be said that the third point P3m of the third mark M3 is determined based on the third starting point P3b and the change amount Δl.

[0054] In this embodiment, the second mark M2 is attached so as to correspond to the center of the Y slide 132, which is the member to be corrected, in the X-axis direction (second direction), and is shown in Figure 8 as being on the axis of symmetry O. However, as described above, if the axis of symmetry O is set to be offset from the center of the Y slide 132, it is also possible to virtually determine the third mark M3 as the line symmetry of the second mark M2.

[0055] The estimation unit 32 then performs quadratic curve approximation using a well-known quadratic curve approximation method that utilizes the coordinates (Xrt+Xrd,Yrd) of the first point P1m of the first mark M1, the coordinates (Xct+Xcd,Ycd) of the second point P2m of the second mark M2, and the coordinates (-Xrt-Xrd,Yrd) of the third point P3m of the third mark M3, which are virtually calculated and determined. The estimation unit 32 then estimates the shape of the Y slide 132, specifically the curve shape that is convex along the Y axis direction (first direction), using quadratic curve approximation. Since quadratic curve approximation is performed using the change amounts before and after thermal deformation, the first starting point P1b, the second starting point P2b, and the third starting point P3b do not necessarily have to be placed in exactly the same position along the Y axis direction (first direction).

[0056] Specifically, as shown in Figure 9, the estimation unit 32 calculates an approximate curve in which the first point P1m, second point P2m, and third point P3m exist, calculated using the first starting point P1b, second starting point P2b, and third starting point P3b, and the calculated change amounts Δr, Δc, and Δl. Since the quadratic curve approximation method is well known, a brief explanation will be given below with the provided equations.

[0057] In the quadratic curve approximation method of this embodiment, quadratic curve approximation is performed using an approximation curve, specifically the quadratic function shown in Equation 1 below.

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[0058] Therefore, in order to determine the coefficients a, b, and c in equation 1, the estimation unit 32, for example, associates (x1, y1) in equation 1 with the coordinates (Xrt+Xrd, Yrd) of the first point P1m, (x2, y2) in equation 1 with the coordinates (Xct+Xcd, Ycd) of the second point P2m, and (x3, y3) in equation 1 with the coordinates (-Xrt-Xrd, Yrd) of a virtually determined third point P3m.

[0059] Thus, the coefficient a of the approximation curve passing through the first point P1m, the second point P2m, and the third point P3m can be determined by equation 5 below, the coefficient b can be determined by equation 6 below, and the coefficient c can be determined according to equation 7 below.

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[0060] In this way, by determining the coefficients a, b, and c in Equation 1, the estimation unit 32 can approximate and estimate the curve shape of the Y slide 132 that is convex in the Y-axis direction (first direction) according to Equation 1. Although not shown in the figures, the curve shape estimated by the estimation unit 32 can be output to an external device, for example, via a display device.

[0061] Here, as described above, in this embodiment, the movement directions of the first mark M1, the second mark M2, and the estimated third mark M3 are opposite to the direction of thermal deformation of the Y slide 132. For this reason, when the estimation unit 32 of this embodiment estimates the shape of the Y slide 132 (i.e., the curved shape that is convex along the Y axis direction (first direction)), it obtains coefficients a, b, and c by multiplying both sides of equation 1 by a negative sign, for example. As described above, when the acquisition unit 31 performs image processing and aligns the movement directions of the first mark M1, the second mark M2, and the estimated third mark M3 with the direction of thermal deformation of the Y slide 132, the estimation unit 32 can obtain coefficients a, b, and c according to equation 1.

[0062] 2-3. Correction amount calculation unit 33 As shown in Figure 3, the correction amount calculation unit 33 calculates a correction amount A to correct an arbitrary point Pa(Xa,Ya) set on the Y slide 132 that has moved due to the thermal deformation of the Y slide 132, so that the arbitrary point Pa(Xa,Ya) coincides with the starting point Pab(Xab,Yab) that was located before the arbitrary point Pa(Xa,Ya) moved. Here, as described above, the correction amount calculation unit 33 calculates the correction amount A by quadratic curve approximation, which is represented by a quadratic function that is an approximation curve calculated by the estimation unit 32 using the change amounts Δr, Δc, and Δl from the first point P1m, second point P2m, and third point P3m, i.e., the first starting point P1b, second starting point P2b, and third starting point P3b, respectively, to the first point P1m, second point P2m, and third point P3m. In other words, the correction amount calculation unit 33 calculates the correction amount A based on the above equation 1, which reflects the obtained coefficients a, b, and c, and in this embodiment is a quadratic function.

[0063] Specifically, the correction amount calculation unit 33 calculates the correction amount A for an arbitrary point Pa(Xa,Ya) set on the Y slide 132 according to the following equation 8.

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[0064] In other words, the arbitrary point Pa is set on the Y-slide 132 after thermal deformation. Therefore, at the arbitrary point Pa, the Y-slide 132 is shifted along the Y-axis direction (first direction) by a correction amount A relative to the starting point Pab(Xab,Yab) before thermal deformation, due to thermal deformation along the Y-axis direction (first direction) of the Y-slide 132.

[0065] Therefore, the correction amount calculation unit 33 uses the calculated correction amount A to calculate the Y coordinate value as (Ya-A), thereby allowing the Y slide 132 after thermal deformation along the Y axis direction (first direction) to be considered as the linear Y slide 132 before thermal deformation. As a result, even if thermal deformation occurs in the Y slide 132 in the form of a curved shape that is convex along the Y axis direction (first direction), the accuracy of the correction by linear correction can be improved, and as a result, the mounting position of the retaining member 21 can be accurately corrected.

[0066] Here, the correction amount calculation unit 33 can calculate the correction amount A each time a predetermined condition is met. The predetermined condition can be, for example, at least one of the following: a predetermined time has elapsed since the last calculation of the correction amount A; the number of substrates K produced by the component mounting machine 10 has reached a predetermined number; or the internal temperature of the component mounting machine 10 has reached a predetermined temperature. This allows the correction amount calculation unit 33 to calculate the correction amount A at a timing when thermal deformation of the Y slide 132 is likely to occur. Therefore, by correcting using the correction amount A calculated at the appropriate timing, the accuracy of the correction by linear correction can be effectively improved.

[0067] As mentioned above, in this embodiment, the movement directions of the first mark M1, the second mark M2, and the estimated third mark M3 are opposite to the direction of thermal deformation of the Y slide 132. Therefore, if the estimation unit 32 obtains coefficients a, b, and c without multiplying both sides of equation 1 by a negative sign, the correction amount calculation unit 33 changes the sign of the correction amount A calculated according to equation 8 (positive to negative, negative to positive). This allows the correction amount calculation unit 33 to calculate a correction amount A corresponding to the direction of thermal deformation of the Y slide 132.

[0068] 3. Correction method using the correction device 30 The same applies to the correction method performed by the correction device 30 as described above. Specifically, the correction method comprises an acquisition step, an estimation step, and a correction amount calculation step. The processing performed by the acquisition unit 31 corresponds to the acquisition step. The processing performed by the estimation unit 32 corresponds to the estimation step. The processing performed by the correction amount calculation unit 33 corresponds to the correction amount calculation step.

[0069] As can be understood from the above explanation, the correction device 30 of this embodiment includes an acquisition unit 31 that measures and acquires the positions of a first mark M1 and a second mark M2 attached to the first guide rail 111, which is one of the first guide rails 111, which is a reference member, and the Y slide 132, which is a member to be corrected, using a substrate camera 15, which is a measuring device provided on the Y slide 132, which is the other member of the Y slide 132, along with the first guide rail 111. Furthermore, the correction device 30 of this embodiment includes an estimation unit 32 that calculates the position of a virtually determinable third mark M3 on the first guide rail 111 using the measured positions of the first mark M1 and the second mark M2, and estimates the shape of the Y slide 132 that has been deformed relative to the first guide rail 111 based on the positions of the first mark M1, the second mark M2, and the third mark M3. Furthermore, the correction device 30 of this embodiment includes a correction amount calculation unit 33 that calculates a correction amount A to correct an arbitrary point Pa of the Y slide 132, which has moved due to the deformation of the Y slide 132, so that it coincides with the starting point Pab that was located before the arbitrary point Pa moved.

[0070] According to this, the correction device 30 can use the acquired first mark M1 and second mark M2 to virtually determine the third mark M3, which corresponds to the third point P3m, that is necessary when estimating the curved shape of the Y slide 132 that has been deformed, specifically due to thermal deformation caused by the difference in thermal expansion coefficients. Then, based on the estimated curved shape of the Y slide 132, the correction device 30 can correct the Y slide 132 that has been thermally deformed into a curved shape back to its shape before thermal deformation (straight shape).

[0071] 4. Modified Examples of Embodiments In the embodiment described above, the acquisition unit 31 uses a substrate camera 15 supported on the Y slide 132, which is both the member to be corrected and the other member, as a measuring device to image and measure the first mark M1 and the second mark M2 attached to the first guide rail 111, which is both the reference member and the other member. Alternatively, the acquisition unit 31 may use a component camera 14 supported on the first guide rail 111, which is both the reference member and the other member, as a measuring device to image and measure the first mark M1 and the second mark M2 attached to the Y slide 132, which is both the member to be corrected and the other member.

[0072] In this case, the acquisition unit 31 uses images Gs of the first mark M1 and the second mark M2 attached to the Y slide 132 before and after thermal deformation, respectively, which are captured by the component camera 14. Similar to the embodiment described above, the acquisition unit 31 measures the coordinates (Xrt, Yrt) of the first starting point P1b corresponding to the first mark M1 and the coordinates (Xrt+Xrd, Yrd) of the first point P1m, and the coordinates (Xct, Yct) of the second starting point P2b corresponding to the second mark M2 and the coordinates (Xct+Xcd, Ycd) of the second point P2m. The acquisition unit 31 then outputs the coordinates of the first point P1m (Xrt+Xrd, Yrd) and the coordinates of the second point P2m (Xct+Xcd, Ycd) to the estimation unit 32 and the correction amount calculation unit 33.

[0073] As a result, even in this modified example, the estimation unit 32 can virtually determine the third mark M3 based on the line symmetry relationship, similar to the embodiment described above, and can also estimate the shape of the Y slide 132 (specifically, a curved shape that is convex along the Y axis direction (first direction)). Furthermore, the correction amount calculation unit 33 can calculate the correction amount A according to the shape of the Y slide 132 estimated by the estimation unit 32 (specifically, the aforementioned equation 8). Therefore, the same effects as in the embodiment described above can be obtained in this modified example as well.

[0074] Furthermore, in the image Gs captured by the component camera 14 of the first mark M1 and second mark M2 attached to the Y slide 132, the direction of thermal deformation (deformation) of the Y slide 132 and the direction of movement of the first mark M1 and second mark M2 coincide. Therefore, in this modified example, the acquisition unit 31 does not need to change the signs in equations 1 and 8 as described in the above embodiment, nor does it need to perform image processing (for example, point-symmetric movement with respect to the center position of image Gs or rotation of image Gs).

[0075] 5. Other Modifications of the Embodiments In the embodiment described above, the estimation unit 32 multiplies both sides of equation 1 by a negative sign to obtain coefficients a, b, and c, or the correction amount calculation unit 33 changes the sign of the correction amount A calculated according to equation 8. This is because when the substrate camera 15 supported by the Y slide 132 images the first mark M1 and the second mark M2 attached to the first guide rail 111, the respective movement directions of the first mark M1 and the second mark M2 on the image Gs are opposite to the direction in which the Y slide 132 is thermally deformed into a curved shape that is convex in the Y axis direction (first direction).

[0076] By the way, when aligning the movement directions of the first mark M1 and the second mark M2 on the image Gs with the direction of thermal deformation of the Y slide 132, for example, the calculated change amounts Δr(Xrd,Yrd) and Δc(Xcd,Ycd) may be multiplied by a negative sign. In this way, by changing the signs of the change amounts Δr and Δc (positive to negative, negative to positive), the movement directions of the first mark M1 and the second mark M2 can be aligned with the direction of thermal deformation of the Y slide 132.

[0077] Alternatively, in the embodiment described above, the center position of the image Gs before thermal deformation and the center position of the image Gs after thermal deformation are made to coincide. In contrast, as shown in Figure 10, when the first mark M1 (second mark M2) on the image Gs is superimposed on the image Gs before thermal deformation (for example, the black circle in Figure 5) and the image Gs after thermal deformation (for example, the black circle in Figure 6), the direction of movement of the center position of each image Gs (indicated by the arrow in Figure 10) can be aligned with the direction of thermal deformation of the Y slide 132. In this case, the amount of movement required to align the first mark M1 (second mark M2) of the image Gs after thermal deformation with the first mark M1 (second mark M2) of the image Gs before thermal deformation can be defined as the amount of change.

[0078] Furthermore, in the component mounting machine 10 of the above-described embodiment, the substrate transport device 11 transports one substrate K along one transport path formed by one conveyor belt or the like. Alternatively, the component mounting machine may be equipped with a substrate transport device capable of independently transporting two substrates K along two transport paths formed by, for example, two conveyor belts or the like.

[0079] Furthermore, in the component mounting machine 10 of the above-described embodiment, the component transfer device 13 is equipped with only one set of Y-axis rails 131 and Y-slides 132, and one mounting head 20 is provided on the Y-slide 132. Alternatively, the component transfer device may be equipped with two sets of Y-axis rails and Y-slides arranged facing each other, and each Y-slide is equipped with a mounting head, in a so-called opposing (double) type component mounting machine.

[0080] Furthermore, in the above-described embodiment, the case in which the member to be corrected is an axial Y-slide 132 was illustrated. However, the member to be corrected does not have to be axial like the Y-slide 132; it may be of other shapes, such as a block-shaped or spherical member that can be deformed due to differences in thermal expansion coefficients.

[0081] Furthermore, in the embodiments described above, the case in which a substrate camera 15 provided on the component mounting machine 10 is used as the measuring device was illustrated. In the modified examples described above, the case in which a component camera 14 provided on the component mounting machine 10 is used as the measuring device was illustrated. However, the measuring device is not limited to the substrate camera 15, and a separately provided imaging device (camera, etc.) may also be used.

[0082] Furthermore, in the embodiments and modified examples described above, the acquisition unit 31 acquires image data G by imaging the first mark M1 and the second mark M2 before and after thermal deformation, and uses the image Gs represented by the image data G to measure the first starting point P1b, the second starting point P2b, the first point P1m, and the second point P2m. Alternatively, or in addition to this, the acquisition unit 31 may also directly measure and acquire the first starting point P1b, the second starting point P2b, the first point P1m, and the second point P2m using, for example, a sensor device capable of measuring the first mark M1 and the second mark M2 electromagnetically or optically as a measuring device. In this case as well, the same effects as in the embodiments and modified examples described above can be obtained.

[0083] Furthermore, in the embodiments and modifications described above, examples were given in which the Y-slide 132, which is the member to be corrected, undergoes thermal deformation due to a difference in thermal expansion coefficients. However, the deformation of the member to be corrected is not limited to thermal deformation due to a difference in thermal expansion coefficients. For example, the member to be corrected may undergo elastic deformation when an external force is applied from both ends toward the center along the axis to the member to be corrected, which is supported at both ends. In this case, the deformed shape of the Y-slide 132, which is the member to be corrected, is not limited to a curved shape symmetrical with respect to the axis of symmetry located at the center of the Y-slide 132, but may also be a rib shape that is symmetrical in the elastic region, or a shape that is symmetrical by elastic buckling (such as Euler buckling or S-shaped buckling). [Explanation of Symbols]

[0084] 10...Component mounting machine, 111...First guide rail (reference member), 132...Y slide (member to be corrected), 15...Substrate camera (measuring device), 30...Correction device, 31...Acquisition unit, 32...Estimation unit, 33...Correction amount calculation unit, G...Image data, Gs...Image, K...Substrate, B...Component, M1...First mark, M2...Second mark, M3...Third mark, P1b...First starting point (starting point), P2b...Second starting point (starting point), P3b...Third starting point (starting point), P1m...First point, P2m...Second point, P3m...Third point, Pa...Arbitrary point, Pab...Starting point, A...Correction amount, O...Symmetric axis (symmetric axis)

Claims

1. An acquisition unit that acquires the positions of a first mark and a second mark attached to one of the reference member and the member to be corrected, respectively, by measuring the position using a measuring device provided on the other member of the reference member and the member to be corrected, An estimation unit that calculates the position of a virtually determinable third mark on the one member using the measured positions of the first and second marks, and estimates the shape of the corrected member deformed relative to the reference member based on the positions of the first, second, and third marks, Equipped with, The member to be corrected is supported at both ends, The estimation unit is a correction device that calculates a third mark that is symmetrical to the first mark or the second mark with respect to a symmetry axis that can be set between the two ends of the member to be corrected.

2. The corrected member has a thermal expansion coefficient on one side that differs from the thermal expansion coefficient on the back side relative to the one side in the first direction of deformation. The correction device according to claim 1, wherein the shape of the member to be corrected is a curved shape that is convex along the first direction due to the difference in thermal expansion coefficients.

3. The correction device according to claim 1 or 2, wherein the acquisition unit measures and acquires the first mark and the second mark by the measuring device before the member to be corrected is thermally deformed and after the member to be corrected is thermally deformed.

4. The correction device according to claim 1 or 2, further comprising a correction amount calculation unit that calculates a correction amount for correcting an arbitrary point of the member to be corrected, which has moved due to the deformation of the member to be corrected, so that it coincides with the starting point where the arbitrary point was located before it moved.

5. The correction device according to claim 4, wherein the correction amount is calculated by quadratic curve approximation using the respective amounts of change from the starting points of the first point corresponding to the first mark, the second point corresponding to the second mark, and the third point corresponding to the third mark to the first point, the second point, and the third point, respectively.

6. The correction amount is calculated according to claim 5, wherein the correction amount is determined by determining three coefficients in a quadratic function representing the quadratic curve approximation using the respective amounts of change corresponding to the first point, the second point, and the third point, and the quadratic function using the three determined coefficients.

7. The correction device according to claim 4, wherein the correction amount calculation unit calculates the correction amount each time a predetermined condition is met.

8. The aforementioned predetermined conditions are: The correction device according to claim 7, wherein a predetermined time has elapsed since the previous calculation of the correction amount, the number of substrates produced by the component mounting machine for mounting components onto substrates has reached a predetermined number, and the internal temperature of the component mounting machine has reached a predetermined temperature, at least one of these conditions.

9. The acquisition unit is, A component mounting machine that mounts components onto a substrate uses a substrate camera, which is provided on the substrate and captures images of the substrate, as the measuring device. The correction device according to claim 1 or 2, wherein the first mark and the second mark attached to the reference member are measured and acquired based on an image of the reference member captured by the substrate camera.

10. The reference member and the member to be corrected are, The correction device according to claim 1 or 2, wherein the member to be corrected extends in a second direction perpendicular to the first direction in which it is deformed, and is arranged apart from each other in a third direction perpendicular to the first and second directions.

11. The member to be corrected is, The correction device according to claim 10, which is provided in a component mounting machine for mounting components onto a substrate, and is a Y-slide that extends along the transport direction of the substrate corresponding to the second direction and supports the mounting head of the component mounting machine.

12. An acquisition step in which the positions of the first mark and the second mark attached to one of the reference member and the member to be corrected are measured and acquired by measuring the other member of the reference member and the member to be corrected, An estimation step of calculating the position of a third mark that can be virtually determined on the one member using the measured positions of the first mark and the second mark, and estimating the shape of the corrected member that has been deformed relative to the reference member based on the positions of the first mark, the second mark, and the third mark, A correction amount calculation step, which calculates a correction amount to correct an arbitrary point of the member to be corrected that has moved due to the deformation of the member to be corrected to coincide with the starting point where the arbitrary point was located before it moved, Equipped with, The member to be corrected is supported at both ends, The estimation step is a correction method that calculates a third mark that is symmetrical to the first mark or the second mark with respect to a symmetry axis that can be set between the positions of both ends of the member to be corrected.

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