Multilayer electronic components
The multilayer electronic component uses a laminate with stacked dielectric layers and through-hole rows to maintain isolation between regions, addressing the issue of decreased isolation in miniaturized demultiplexers.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- TDK CORP
- Filing Date
- 2022-11-10
- Publication Date
- 2026-07-08
AI Technical Summary
The miniaturization of demultiplexers in small mobile communication devices has led to a decrease in isolation between first and second filters, which is a common issue in all multilayer electronic components requiring isolation between two regions.
A multilayer electronic component design featuring a laminate with stacked dielectric layers and through-hole rows that separate regions, including a conductor layer connected to ground, ensuring isolation through a plurality of second through-hole rows.
The design maintains isolation between regions, enhancing the performance of multilayer electronic components by ensuring effective separation of signals in miniaturized devices.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a multilayer electronic component including a plurality of resonators.
Background Art
[0002] In small mobile communication devices, a configuration is widely used in which an antenna commonly used in a plurality of applications having different systems and operating frequency bands is provided, and a plurality of signals transmitted and received by this antenna are separated using a diplexer.
[0003] Generally, a diplexer that separates a first signal having a frequency within a first frequency band and a second signal having a frequency within a second frequency band higher than the first frequency band includes a common port, a first signal port, a second signal port, a first filter provided in a first signal path from the common port to the first signal port, and a second filter provided in a second signal path from the common port to the second signal port.
[0004] As the first filter, for example, a band-pass filter including a plurality of resonators configured to be electromagnetically coupled to each other is used. Hereinafter, such a band-pass filter is also referred to as a resonator-type band-pass filter. Patent Document 1 discloses a resonator-type band-pass filter.
[0005] As the second filter, for example, a high-pass filter or a band-pass filter in which a high-pass filter and a low-pass filter are connected in series can be used.
Prior Art Documents
Patent Documents
[0006]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0007] In recent years, there has been a market demand for smaller and more space-saving small mobile communication devices, and this has also led to a demand for smaller demultiplexers used in these devices. Demultiplexers suitable for miniaturization are known to use laminates containing multiple stacked dielectric layers and multiple conductor layers. However, miniaturizing the demultiplexer has resulted in a problem where the isolation between the first and second filters decreases.
[0008] The above problem applies not only to demultiplexers, but to all multilayer electronic components that include two regions where isolation needs to be ensured.
[0009] This invention has been made in view of the above problems, and its object is to provide a stacked electronic component that can ensure isolation between two regions. [Means for solving the problem]
[0010] The multilayer electronic component of the present invention comprises a plurality of resonators and a laminate for integrating the plurality of resonators, the laminate including a plurality of stacked dielectric layers. Each of the plurality of resonators includes a first through-hole row, a second through-hole row, and a conductor layer connecting the first through-hole row and the second through-hole row. Each of the first and second through-hole rows is formed by two or more through-holes connected in series. The second through-hole row is provided between the conductor layer and ground in the circuit configuration. The laminate includes a first region and a second region, each of which at least one element is arranged. The first region and the second region are divided by a plurality of second through-hole rows. [Effects of the Invention]
[0011] In the multilayer electronic component of the present invention, the second row of through-holes is provided between the conductor layer and the ground in the circuit configuration. The first region and the second region are separated by a plurality of second rows of through-holes. As a result, according to the present invention, isolation can be ensured between the first region and the second region. [Brief explanation of the drawing]
[0012] [Figure 1] This is a circuit diagram showing the circuit configuration of a stacked electronic component according to one embodiment of the present invention. [Figure 2] This is a perspective view showing the appearance of a stacked electronic component according to one embodiment of the present invention. [Figure 3] This is an explanatory diagram showing the pattern formation surface of the first to third dielectric layers in a laminate of a stacked electronic component according to one embodiment of the present invention. [Figure 4] This is an explanatory diagram showing the pattern formation surface of the fourth to sixth dielectric layers in a laminate of a stacked electronic component according to one embodiment of the present invention. [Figure 5] This is an explanatory diagram showing the pattern formation surface of the 7th to 17th dielectric layers in a laminate of a stacked electronic component according to one embodiment of the present invention. [Figure 6] This is an explanatory diagram showing the pattern formation surface of the 18th to 20th dielectric layers in a laminate of a stacked electronic component according to one embodiment of the present invention. [Figure 7] This is an explanatory diagram showing the pattern formation surfaces of the 21st and 22nd dielectric layers in a laminate of a multilayer electronic component according to one embodiment of the present invention. [Figure 8] This is a perspective view showing the inside of a laminated structure of a multilayer electronic component according to one embodiment of the present invention. [Figure 9] This is a plan view showing the inside of a laminated structure of a multilayer electronic component according to one embodiment of the present invention. [Figure 10] This is a side view showing the inside of a laminated structure of a laminated electronic component according to one embodiment of the present invention. [Modes for carrying out the invention]
[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, referring to FIG. 1, an outline of the configuration of a stacked electronic component (hereinafter simply referred to as an electronic component) 1 according to an embodiment of the present invention will be described. The electronic component 1 according to the present embodiment includes at least a plurality of resonators.
[0014] FIG. 1 shows a diplexer as an example of the electronic component 1 having a plurality of resonators. The diplexer, that is, the electronic component 1, includes a first filter 10 that selectively passes a first signal having a frequency within a first passband, and a second filter 20 that selectively passes a second signal having a frequency within a second passband higher than the first passband. The first filter 10 corresponds to the "first circuit portion" of the present invention. The second filter 20 corresponds to the "second circuit portion" of the present invention.
[0015] The electronic component 1 further includes a first port 2, a second port 3, a third port 4, a signal path 5 connecting the first port 2 and the second port 3, and a signal path 6 connecting the first port 2 and the third port 4. The first filter 10 is provided between the first port 2 and the second port 3 in terms of circuit configuration. The second filter 20 is provided between the first port 2 and the third port 4 in terms of circuit configuration. In the present application, the expression "in terms of circuit configuration" is used to refer to the arrangement on the circuit diagram rather than the arrangement in the physical configuration.
[0016] The signal path 5 is a path from the first port 2 through the first filter 10 to the second port 3. The signal path 6 is a path from the first port 2 through the second filter 20 to the third port 4. The first signal having a frequency within the first passband selectively passes through the signal path 5 provided with the first filter 10. The second signal having a frequency within the second passband selectively passes through the signal path 6 provided with the second filter 20. In this way, the electronic component 1 separates the first signal and the second signal.
[0017] In this embodiment, the first filter 10 is a band-pass filter circuit including a plurality of resonators. The second filter 20 includes a high-pass filter circuit 21 and a low-pass filter circuit 22 provided between the high-pass filter circuit 21 and the third port 4. The high-pass filter circuit 21 and the low-pass filter circuit 22 constitute a band-pass filter.
[0018] Since the first and second filters 10 and 20 are components of the electronic component 1, it can also be said that the electronic component 1 includes a band-pass filter circuit, a high-pass filter circuit 21, and a low-pass filter circuit 22.
[0019] Next, referring to FIG. 1, an example of the configuration of the first and second filters 10 and 20 will be described. First, the first filter 10 will be described. The first filter 10 includes resonators 11, 12, 13, 14 and capacitors C11, C12, C13, C14, C15, C16, C17, C18.
[0020] The resonators 11 to 14 are arranged in this order from the side of the first port 2 in terms of circuit configuration. The resonators 11 to 14 are configured such that the resonators 11 and 12 are adjacent to each other in the circuit configuration and are electromagnetically coupled, the resonators 12 and 13 are adjacent to each other in the circuit configuration and are electromagnetically coupled, and the resonators 13 and 14 are adjacent to each other in the circuit configuration and are electromagnetically coupled. In this embodiment, each of the resonators 11 to 14 is a 1 / 4 wavelength resonator.
[0021] Each of the resonators 11 to 14 has a first end and a second end. The first end of the resonator 11 is connected to the first port 2. The first end of the resonator 14 is connected to the second port 3. The second end of each of the resonators 11 to 14 is connected to the ground.
[0022] Capacitor C11 is positioned between the first end of resonator 11 and ground in the circuit configuration. Capacitor C12 is positioned between the first end of resonator 12 and ground in the circuit configuration. Capacitor C13 is positioned between the first end of resonator 13 and ground in the circuit configuration. Capacitor C14 is positioned between the first end of resonator 14 and ground in the circuit configuration.
[0023] Resonator 11 and resonator 12 are capacitively coupled via capacitor C15. Resonator 13 and resonator 14 are capacitively coupled via capacitor C16.
[0024] The resonators 11-14 are connected in parallel with each other. That is, any two of the resonators 11-14 are connected at their first ends and at their second ends, either directly or via a capacitor.
[0025] One end of capacitor C17 is connected to the first end of resonator 11. One end of capacitor C18 is connected to the other end of capacitor C17. The other end of capacitor C18 is connected to the first end of resonator 14.
[0026] Next, the high-pass filter circuit 21 of the second filter 20 will be described. The high-pass filter circuit 21 includes inductors L21 and L22, and capacitors C21, C22, C23, C24, and C25.
[0027] One end of capacitor C21 is connected to the first port 2. One end of capacitor C22 is connected to the other end of capacitor C21. One end of capacitor C23 is connected to the other end of capacitor C22.
[0028] One end of inductor L21 is connected to the junction point between capacitors C21 and C22. One end of capacitor C24 is connected to the other end of inductor L21. The other end of capacitor C24 is connected to ground.
[0029] One end of capacitor C25 is connected to the junction point between capacitors C22 and C23. One end of inductor L22 is connected to the other end of capacitor C25. The other end of inductor L22 is connected to ground.
[0030] Next, the low-pass filter circuit 22 of the second filter 20 will be described. The low-pass filter circuit 22 includes an inductor L23 and capacitors C26 and C27. One end of the inductor L23 is connected to the other end of the capacitor C23 of the high-pass filter circuit 21. The other end of the inductor L23 is connected to the third port 4.
[0031] One end of capacitor C26 is connected to one end of inductor L23. The other end of capacitor C26 is connected to ground. Capacitor C27 is connected in parallel with inductor L23.
[0032] Next, with reference to Figure 2, the other components of electronic component 1 will be described. Figure 2 is a perspective view showing the appearance of the laminate of electronic component 1.
[0033] The electronic component 1 further comprises a laminate 50 including a plurality of stacked dielectric layers and a plurality of conductors (a plurality of conductor layers and a plurality of through-holes). The laminate 50 is intended to integrate a first filter 10, which is a bandpass filter circuit including first to third ports 2 to 4 and resonators 11 to 14, and a second filter 20, which includes a high-pass filter circuit 21 and a low-pass filter circuit 22.
[0034] The laminate 50 has a bottom surface 50A and an upper surface 50B located at both ends of the stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the bottom surface 50A and the upper surface 50B. Side surfaces 50C and 50D face opposite each other, and side surfaces 50E and 50F also face opposite each other. Side surfaces 50C to 50F are perpendicular to the upper surface 50B and the bottom surface 50A.
[0035] Here, as shown in Figure 2, we define the X, Y, and Z directions. The X, Y, and Z directions are orthogonal to each other. In this embodiment, the direction parallel to the stacking direction T is defined as the Z direction. The direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. Furthermore, the expression "when viewed from the stacking direction T" means viewing the object from a position away in the Z or -Z direction.
[0036] As shown in Figure 2, the bottom surface 50A is located at the -Z edge of the laminate 50. The top surface 50B is located at the Z edge of the laminate 50. The side surface 50C is located at the -X edge of the laminate 50. The side surface 50D is located at the X edge of the laminate 50. The side surface 50E is located at the -Y edge of the laminate 50. The side surface 50F is located at the Y edge of the laminate 50.
[0037] The planar shape of the laminate 50 when viewed from the stacking direction T, that is, the shape of the bottom surface 50A or the top surface 50B, is elongated in one direction. In this embodiment in particular, the planar shape of the laminate 50 when viewed from the stacking direction T is a rectangular shape that is elongated in the direction parallel to the X direction.
[0038] The electronic component 1 further includes terminals 111, 112, 113, 114, 115, and 116 provided on the bottom surface 50A of the laminate 50. Terminals 111, 112, and 113 are arranged in this order in the X direction at a position closer to side surface 50E than to side surface 50F. Terminals 114, 115, and 116 are arranged in this order in the -X direction at a position closer to side surface 50F than to side surface 50E.
[0039] Terminal 112 is a signal terminal corresponding to the first port 2. Terminal 114 is a signal terminal corresponding to the third port 4. Terminal 116 is a signal terminal corresponding to the second port 3. Therefore, the first to third ports 2 to 4 are located on the bottom surface 50A of the laminate 50. Terminals 111, 113, and 115 are each connected to ground.
[0040] Next, with reference to Figures 3(a) to 7(b), an example of multiple dielectric layers and multiple conductors constituting the laminate 50 will be described. In this example, the laminate 50 has 22 stacked dielectric layers. Hereinafter, these 22 dielectric layers will be referred to as the 1st to 22nd dielectric layers, from bottom to top. The 1st to 22nd dielectric layers will also be denoted by reference numerals 51 to 72.
[0041] In Figures 3(a) to 6(c), multiple circles represent multiple through-holes. Multiple through-holes are formed in each of the dielectric layers 51 to 70. Each of the multiple through-holes is formed by filling the through-hole holes with conductive paste. Each of the multiple through-holes is connected to a conductive layer or other through-holes. In Figures 3(a) to 6(c), multiple specific through-holes among the multiple through-holes are labeled with reference numerals.
[0042] Figure 3(a) shows the pattern formation surface of the first dielectric layer 51. Terminals 111 to 116 are formed on the pattern formation surface of the dielectric layer 51. Figure 3(b) shows the pattern formation surface of the second dielectric layer 52. Conductor layers 521, 522, 523, and 524 are formed on the pattern formation surface of the dielectric layer 52.
[0043] Figure 3(c) shows the pattern formation surface of the third dielectric layer 53. Conductor layers 531, 532, 533, and 534 are formed on the pattern formation surface of the dielectric layer 53. The four through-holes labeled 53T1b, 53T2b, 53T3b, and 53T4b in Figure 3(c) are connected to the conductor layer 531. In the following description, the through-hole labeled 53T1b will simply be referred to as through-hole 53T1b. Through-holes labeled with other symbols will also be referred to in the same way as through-hole 53T1b.
[0044] Figure 4(a) shows the pattern formation surface of the fourth dielectric layer 54. Conductor layers 541, 542, and 543 are formed on the pattern formation surface of the dielectric layer 54.
[0045] The through-holes 54T1b, 54T2b, 54T3b, and 54T4b shown in Figure 4(a) are connected to the through-holes 53T1b, 53T2b, 53T3b, and 53T4b formed in the dielectric layer 53, respectively. The through-hole 54T4a shown in Figure 4(a) is connected to the conductor layer 541.
[0046] Figure 4(b) shows the pattern formation surface of the fifth dielectric layer 55. Conductor layers 551, 552, 553, and 554 are formed on the pattern formation surface of the dielectric layer 55.
[0047] The through-holes 55T1b, 55T2b, 55T3b, 55T4a, and 55T4b shown in Figure 4(b) are formed in the dielectric layer 54. Through-hole 54T1b, 54T2b, 54T3b, 54T4a, and 54T4b are connected. The through-holes 55T2a and 55T3a shown in Figure 4(b) are connected to conductor layers 551 and 552, respectively.
[0048] Figure 4(c) shows the pattern formation surface of the sixth dielectric layer 56. Conductor layers 561, 562, 563, 564, 565, and 566 are formed on the pattern formation surface of the dielectric layer 56. Conductor layer 564 is connected to conductor layer 563. In Figure 4(c), the boundary between conductor layer 563 and conductor layer 564 is shown by a dotted line.
[0049] The through-holes 56T1a and 56T5b shown in Figure 4(c) are connected to the conductor layers 561 and 566, respectively. The through-holes 56T1b, 56T2a, 56T2b, 56T3a, 56T3b, 56T4a, and 56T4b shown in Figure 4(c) are formed in the dielectric layer 55, respectively. Through-hole 55T1b, 55T2a, 55T2b, 55T3a, 55T3b, 55T4a, and 55T4b were connected.
[0050] Figure 5(a) shows the pattern formation surface of the seventh dielectric layer 57. A conductive layer 571 is formed on the pattern formation surface of the dielectric layer 57. The through holes 57T1a, 57T1b, 57T2a, 57T2b, 57T3a, 57T3b, 57T4a, 57T4b, and 57T5b shown in Figure 5(a) are formed in the dielectric layer 56, respectively. Through-hole 56T1a, 56T1b, 56T2a, 56T2b, 56T3a, 56T3b, 56T4a, 56T4b, and 56T5b are connected.
[0051] Figure 5(b) shows the pattern formation surface of the eighth dielectric layer 58. Conductor layers 581, 582, and 583 are formed on the pattern formation surface of the dielectric layer 58.
[0052] The through-holes 58T1a, 58T1b, 58T2a, 58T2b, 58T3a, 58T3b, 58T4a, 58T4b, and 58T5b shown in Figure 5(b) are each formed in the dielectric layer 57. Through-hole These are connected to 57T1a, 57T1b, 57T2a, 57T2b, 57T3a, 57T3b, 57T4a, 57T4b, and 57T5b. The through holes 58T5a, 58T6a, and 58T6b shown in Figure 5(b) are connected to conductor layers 581, 582, and 583, respectively.
[0053] Figure 5(c) shows the pattern formation surfaces of the 9th to 17th dielectric layers 59-67. Through holes 59T1a, 59T1b, 59T2a, 59T2b, 59T3a, 59T3b, 59T4a, 59T4b, 59T5a, 59T5b, 59T6a, and 59T6b are formed in each of the dielectric layers 59-67. The through-holes 59T1a, 59T1b, 59T2a, 59T2b, 59T3a, 59T3b, 59T4a, 59T4b, 59T5a, 59T5b, 59T6a, and 59T6b formed in dielectric layer 59 are connected to the through-holes 58T1a, 58T1b, 58T2a, 58T2b, 58T3a, 58T3b, 58T4a, 58T4b, 58T5a, 58T5b, 58T6a, and 58T6b formed in dielectric layer 58, respectively. In addition, in dielectric layers 59 to 67, through-holes with the same sign that are adjacent to each other vertically are connected to each other.
[0054] Figure 6(a) shows the pattern formation surface of the 18th dielectric layer 68. A conductor layer 681 for the inductor is formed on the pattern formation surface of the dielectric layer 68.
[0055] The through-holes 68T1a, 68T1b, 68T2a, 68T2b, 68T3a, 68T3b, 68T4a, 68T4b, 68T5b, 68T6a, and 68T6b shown in Figure 6(a) are connected to the through-holes 59T1a, 59T1b, 59T2a, 59T2b, 59T3a, 59T3b, 59T4a, 59T4b, 59T5b, 59T6a, and 59T6b formed in the dielectric layer 67, respectively.
[0056] The conductor layer 681 has a first end and a second end. The through-hole 68T5a shown in Figure 6(a) and the through-hole 59T5a formed in the dielectric layer 67 are connected to the vicinity of the first end of the conductor layer 681. The through-hole 68T5c shown in Figure 6(a) is connected to the vicinity of the second end of the conductor layer 681.
[0057] Figure 6(b) shows the pattern formation surface of the 19th dielectric layer 69. A conductor layer 691 for the inductor is formed on the pattern formation surface of the dielectric layer 69.
[0058] The through-holes 69T1a, 69T1b, 69T2a, 69T2b, 69T3a, 69T3b, 69T4a, 69T4b, 69T5b, 69T6a, and 69T6b shown in Figure 6(b) are connected to the through-holes 68T1a, 68T1b, 68T2a, 68T2b, 68T3a, 68T3b, 68T4a, 68T4b, 68T5b, 68T6a, and 68T6b formed in the dielectric layer 68, respectively.
[0059] The conductor layer 691 has a first end and a second end. The through-hole 68T5a formed in the dielectric layer 68 is connected to the vicinity of the first end in the conductor layer 691. The through-hole 69T5c shown in Figure 6(b) and the through-hole 68T5c formed in the dielectric layer 68 are connected to the vicinity of the second end in the conductor layer 681.
[0060] Figure 6(c) shows the pattern formation surface of the 20th dielectric layer 70. Conductor layers 701, 702, 703, and 704 for resonators and conductor layers 705 and 706 for inductors are formed on the pattern formation surface of the dielectric layer 70. Each of the conductor layers 701 to 706 has a first end and a second end.
[0061] The through-hole 70T1a shown in Figure 6(c) and the through-hole 69T1a formed in the dielectric layer 69 are connected to the vicinity of the first end of the conductor layer 701. The through-hole 70T1b shown in Figure 6(c) and the through-hole 69T1b formed in the dielectric layer 69 are connected to the vicinity of the second end of the conductor layer 701.
[0062] The through-hole 70T2a shown in Figure 6(c) and the through-hole 69T2a formed in the dielectric layer 69 are connected to the vicinity of the first end of the conductor layer 702. The through-hole 70T2b shown in Figure 6(c) and the through-hole 69T2b formed in the dielectric layer 69 are connected to the vicinity of the second end of the conductor layer 702.
[0063] The through-hole 70T3a shown in Figure 6(c) and the through-hole 69T3a formed in the dielectric layer 69 are connected to the vicinity of the first end of the conductor layer 703. The through-hole 70T3b shown in Figure 6(c) and the through-hole 69T3b formed in the dielectric layer 69 are connected to the vicinity of the second end of the conductor layer 703.
[0064] The through-hole 70T4a shown in Figure 6(c) and the through-hole 69T4a formed in the dielectric layer 69 are connected to the vicinity of the first end of the conductor layer 704. The through-hole 70T4b shown in Figure 6(c) and the through-hole 69T4b formed in the dielectric layer 69 are connected to the vicinity of the second end of the conductor layer 704.
[0065] The through-hole 70T5b shown in Figure 6(c) and the through-hole 69T5b formed in the dielectric layer 69 are connected to the vicinity of the first end of the conductor layer 705. The through-hole 70T5c shown in Figure 6(c) and the through-hole 69T5c formed in the dielectric layer 69 are connected to the vicinity of the second end of the conductor layer 705.
[0066] The through-hole 70T6a shown in Figure 6(c) and the through-hole 69T6a formed in the dielectric layer 69 are connected to the vicinity of the first end of the conductor layer 706. The through-hole 70T6b shown in Figure 6(c) and the through-hole 69T6b formed in the dielectric layer 69 are connected to the vicinity of the second end of the conductor layer 706.
[0067] Figure 7(a) shows the pattern formation surface of the 21st dielectric layer 71. Conductor layers 711, 712, 713, and 714 for resonators and conductor layers 715 and 716 for inductors are formed on the pattern formation surface of the dielectric layer 71. Each of the conductor layers 711 to 716 has a first end and a second end.
[0068] The through-hole 70T1a formed in the dielectric layer 70 is connected to the vicinity of the first end of the conductor layer 711. The through-hole 70T1b formed in the dielectric layer 70 is connected to the vicinity of the second end of the conductor layer 711.
[0069] The through-hole 70T2a formed in the dielectric layer 70 is connected to the vicinity of the first end of the conductor layer 712. The through-hole 70T2b formed in the dielectric layer 70 is connected to the vicinity of the second end of the conductor layer 712.
[0070] The through-hole 70T3a formed in the dielectric layer 70 is connected to the vicinity of the first end of the conductor layer 713. The through-hole 70T3b formed in the dielectric layer 70 is connected to the vicinity of the second end of the conductor layer 713.
[0071] The through-hole 70T4a formed in the dielectric layer 70 is connected to the vicinity of the first end of the conductor layer 714. The through-hole 70T4b formed in the dielectric layer 70 is connected to the vicinity of the second end of the conductor layer 714.
[0072] The through-hole 70T5b formed in the dielectric layer 70 is connected to the vicinity of the second end of the conductor layer 715. The through-hole 70T5c formed in the dielectric layer 70 is connected to the vicinity of the second end of the conductor layer 715.
[0073] The through-hole 70T6a formed in the dielectric layer 70 is connected to the vicinity of the first end of the conductor layer 716. The through-hole 70T6b formed in the dielectric layer 70 is connected to the vicinity of the second end of the conductor layer 716.
[0074] Figure 7(b) shows the pattern formation surface of the 22nd dielectric layer 72. A mark 721 is formed on the pattern formation surface of the dielectric layer 72.
[0075] The laminate 50 shown in Figure 2 is constructed by stacking dielectric layers 51 to 72, with the pattern-forming surface of the first dielectric layer 51 becoming the bottom surface 50A of the laminate 50, and the surface of the 22nd dielectric layer 72 opposite to the pattern-forming surface becoming the top surface 50B of the laminate 50.
[0076] Each of the multiple through-holes shown in Figures 3(a) to 6(c) is connected to a conductor layer or another through-hole that overlaps in the stacking direction T when the first to 21st dielectric layers 51 to 71 are stacked. Furthermore, among the multiple through-holes shown in Figures 3(a) to 6(c), those located within a terminal or a conductor layer are connected to that terminal or conductor layer.
[0077] Figure 8 shows the interior of the laminate 50, which is constructed by stacking dielectric layers 51 to 72 from the first to the 22nd layer. As shown in Figure 8, multiple conductor layers and multiple through-holes, as shown in Figures 3(a) to 7(a), are stacked inside the laminate 50. Note that mark 721 is omitted in Figure 8.
[0078] The following describes the correspondence between the circuit components of electronic component 1 shown in Figure 1 and the internal components of the laminate 50 shown in Figures 3(a) to 7(b). First, the components of the first filter 10 will be described. The resonator 11 is composed of conductive layers 701, 711, through-holes 56T1a, 57T1a, 58T1a, 59T1a, 68T1a, 69T1a, 70T1a, and through-holes 53T1b, 54T1b, 55T1b, 56T1b, 57T1b, 58T1b, 59T1b, 68T1b, 69T1b, 70T1b.
[0079] The resonator 12 is composed of conductor layers 702 and 712, through-holes 55T2a, 56T2a, 57T2a, 58T2a, 59T2a, 68T2a, 69T2a, and 70T2a, and through-holes 53T2b, 54T2b, 55T2b, 56T2b, 57T2b, 58T2b, 59T2b, 68T2b, 69T2b, and 70T2b.
[0080] The resonator 13 is composed of conductor layers 703 and 713, through-holes 55T3a, 56T3a, 57T3a, 58T3a, 59T3a, 68T3a, 69T3a, and 70T3a, and through-holes 53T3b, 54T3b, 55T3b, 56T3b, 57T3b, 58T3b, 59T3b, 68T3b, 69T3b, and 70T3b.
[0081] The resonator 14 is composed of conductor layers 704 and 714, through-holes 54T4a, 55T4a, 56T4a, 57T4a, 58T4a, 59T4a, 68T4a, 69T4a, and 70T4a, and through-holes 53T4b, 54T4b, 55T4b, 56T4b, 57T4b, 58T4b, 59T4b, 68T4b, 69T4b, and 70T4b.
[0082] Capacitor C11 is composed of conductive layers 521, 531 and dielectric layers 52 between these conductive layers. Capacitor C12 is composed of conductive layers 531, 551 and dielectric layers 53, 54 between these conductive layers. Capacitor C13 is composed of conductive layers 531, 552 and dielectric layers 53, 54 between these conductive layers. Capacitor C14 is composed of conductive layers 531, 541 and dielectric layers 53 between these conductive layers.
[0083] Capacitor C15 is composed of conductive layers 551, 561 and a dielectric layer 55 between these conductive layers. Capacitor C16 is composed of conductive layers 552, 562 and a dielectric layer 55 between these conductive layers. Capacitor C17 is composed of conductive layers 561, 571 and a dielectric layer 56 between these conductive layers. Capacitor C18 is composed of conductive layers 562, 571 and a dielectric layer 56 between these conductive layers.
[0084] Next, the components of the high-pass filter circuit 21 of the second filter 20 will be described. The inductor L21 is composed of conductor layers 681, 691, 705, 715, through-holes 58T5a, 59T5a, 68T5a, through-holes 56T5b, 57T5b, 58T5b, 59T5b, 68T5b, 69T5b, 70T5b, and through-holes 68T5c, 69T5c, 70T5c.
[0085] Inductor L22 is composed of conductor layers 706 and 716, through-holes 58T6a, 59T6a, 68T6a, 69T6a, and 70T6a, and through-holes 58T6b, 59T6b, 68T6b, 69T6b, and 70T6b.
[0086] Capacitor C21 is composed of conductive layers 553, 563 and a dielectric layer 55 between these conductive layers. Capacitor C22 is composed of conductive layers 554, 564 and a dielectric layer 55 between these conductive layers. Capacitor C23 is composed of conductive layers 543, 554 and a dielectric layer 54 between these conductive layers. Capacitor C24 is composed of conductive layers 532, 542 and a dielectric layer 53 between these conductive layers. Capacitor C25 is composed of conductive layers 554, 565 and a dielectric layer 55 between these conductive layers.
[0087] Next, the components of the low-pass filter circuit 22 of the second filter 20 will be described. The inductor L23 is made up of a conductor layer 522. The capacitor C26 is made up of conductor layers 533, 543 and a dielectric layer 53 between these conductor layers. The capacitor C27 is made up of conductor layers 534, 543 and a dielectric layer 53 between these conductor layers.
[0088] Next, the structural features of the electronic component 1 according to this embodiment will be described with reference to Figures 1, 8 to 10. Figure 9 is a plan view showing the inside of the laminate 50. Figure 10 is a side view showing the inside of the laminate 50.
[0089] The resonator 11 includes two through-hole rows T1a and T1b, and a conductor layer 11a connecting the two through-hole rows T1a and T1b. The through-hole row T1a is formed by connecting through-holes 56T1a, 57T1a, 58T1a, 59T1a, 68T1a, and 69T1a in series. The through-hole row T1b is formed by connecting through-holes 53T1b, 54T1b, 55T1b, 56T1b, 57T1b, 58T1b, 59T1b, 68T1b, and 69T1b in series. The conductor layer 11a is formed by two conductor layers 701 and 711 connected to each other by through-holes 70T1a and 70T1b. The two through-hole rows T1a and T1b and the conductor layer 11a are connected in the order of through-hole row T1a, conductor layer 11a, and through-hole row T1b, so as to circle around an axis parallel to the Y direction.
[0090] The resonator 12 includes two through-hole rows T2a and T2b, and a conductor layer 12a connecting the two through-hole rows T2a and T2b. The through-hole row T2a is formed by connecting through-holes 55T2a, 56T2a, 57T2a, 58T2a, 59T2a, 68T2a, and 69T2a in series. The through-hole row T2b is formed by connecting through-holes 53T2b, 54T2b, 55T2b, 56T2b, 57T2b, 58T2b, 59T2b, 68T2b, and 69T2b in series. The conductor layer 12a is formed by two conductor layers 702 and 712 connected to each other by through-holes 70T2a and 70T2b. The two through-hole rows T2a and T2b and the conductor layer 12a are connected in the order of through-hole row T2a, conductor layer 12a, and through-hole row T2b, so as to circle around an axis parallel to the Y direction.
[0091] The resonator 13 includes two through-hole rows T3a and T3b, and a conductor layer 13a connecting the two through-hole rows T3a and T3b. The through-hole row T3a is formed by connecting through-holes 55T3a, 56T3a, 57T3a, 58T3a, 59T3a, 68T3a, and 69T3a in series. The through-hole row T3b is formed by connecting through-holes 53T3b, 54T3b, 55T3b, 56T3b, 57T3b, 58T3b, 59T3b, 68T3b, and 69T3b in series. The conductor layer 13a is formed by two conductor layers 703 and 713 connected to each other by through-holes 70T3a and 70T3b. The two through-hole rows T3a and T3b and the conductor layer 13a are connected in the order of through-hole row T3a, conductor layer 13a, and through-hole row T3b, so as to circle around an axis parallel to the Y direction.
[0092] The resonator 14 includes two through-hole rows T4a and T4b, and a conductor layer 14a connecting the two through-hole rows T4a and T4b. The through-hole row T4a is formed by connecting through-holes 54T4a, 55T4a, 56T4a, 57T4a, 58T4a, 59T4a, 68T4a, and 69T4a in series. The through-hole row T4b is formed by connecting through-holes 53T4b, 54T4b, 55T4b, 56T4b, 57T4b, 58T4b, 59T4b, 68T4b, and 69T4b in series. The conductor layer 14a is formed by two conductor layers 704 and 714 connected to each other by through-holes 70T4a and 70T4b. The two through-hole rows T4a and T4b and the conductor layer 14a are connected in the order of through-hole row T4a, conductor layer 14a, and through-hole row T4b, so as to circle around an axis parallel to the Y direction.
[0093] The inductor L21 includes two through-hole rows T5a and T5b, and a conductor layer L21a connecting the two through-hole rows T5a and T5b. The through-hole row T5a is formed by connecting through-holes 58T5a and 59T5a in series. The through-hole row T5b is formed by connecting through-holes 56T5b, 57T5b, 58T5b, 59T5b, 68T5b, and 69T5b in series. The conductor layer L21a is formed by four conductor layers 681, 691, 705, and 715 connected to each other by through-holes 68T5a, 68T5c, 69T5c, 70T5b, and 70T5c.
[0094] The inductor L22 includes two through-hole rows T6a and T6b, and a conductor layer L22a connecting the two through-hole rows T6a and T6b. The through-hole row T6a is formed by connecting through-holes 58T6a, 59T6a, 68T6a, and 69T6a in series. The through-hole row T6b is formed by connecting through-holes 58T6b, 59T6b, 68T6b, and 69T6b in series. The conductor layer L22a is formed by two conductor layers 706 and 716 connected to each other by through-holes 70T6a and 70T6b.
[0095] In terms of circuit configuration, the through-hole rows T1b, T2b, T3b, and T4b are provided between the conductor layers 11a, 12a, 13a, and 14a and the ground, respectively. The through-hole rows T1b, T2b, T3b, and T4b are aligned along the shorter side, i.e., the Y direction, of the planar shape of the laminate 50 when viewed from the stacking direction T.
[0096] The internal regions of the laminate 50 are through-hole rows T1b, T2b, T3b, T4 b This allows the area to be divided into a first region R1 and a second region R2, each containing at least one element. The first region R1 consists of through-hole rows T1b, T2b, T3b, T4 b The first region R1 and the second region R2 are the regions on the X-direction side of the through-hole rows T1b, T2b, T3b, T4. b It may or may not include. In this embodiment, the first region R1 is a through-hole row T1b, T2b, T3b, T4 b This shall include: through-hole rows T1b, T2b, T3b, T4 b This effectively divides the majority of the first region R1 (the essential part of the first region R1) from the second region R2. The first region R1 and the second region R2 are arranged in this order along the longitudinal direction, i.e., the X direction, of the planar shape of the laminate 50 when viewed from the stacking direction T.
[0097] The first region R1 contains at least one first element. The first filter 10 includes at least one first element. In this embodiment in particular, the first region R1 contains at least one first element, which is the resonators 11-14 and capacitors C11-C18 of the first filter 10. More specifically, the first region R1 contains a plurality of conductive layers and a plurality of through-holes for forming the resonators 11-14 and capacitors C11-C18.
[0098] The second region R2 contains at least one second element. The second filter 20 includes at least one second element. In this embodiment in particular, the second region R2 contains at least one second element, which is the inductors L21 to L23 and capacitors C21 to C27 of the second filter 20. More specifically, the second region R2 contains a plurality of conductive layers and a plurality of through-holes for forming the inductors L21 to L23 and capacitors C21 to C27.
[0099] Next, the operation and effects of the electronic component 1 according to this embodiment will be described. In this embodiment, the laminate 50 includes a first region R1 and a second region R2, each of which at least one element is arranged. The first region R1 and the second region R2 are through-hole rows T1b, T2b, T3b, T4 b It is divided by [the following]. In terms of circuit configuration, the through-hole rows T1b, T2b, T3b, and T4b are provided between the conductor layers 11a, 12a, 13a, and 14a and the ground, respectively. That is, the through-hole rows T1b, T2b, T3b, and T4b are the components of the resonators 11 to 14 that are closer to the ground. As a result, according to this embodiment, isolation can be ensured between the first region R1 and the second region R2.
[0100] Furthermore, in this embodiment, multiple components of the first filter 10 are arranged in the first region R1, and multiple components of the second filter 20 are arranged in the second region R2. According to this embodiment, as described above, isolation can be ensured between the first region R1 and the second region R2, and therefore isolation can be ensured between the first filter 10 and the second filter 20.
[0101] Furthermore, in this embodiment, the resonators 11 to 14 are connected in parallel with each other. This allows for the provision of multiple components that are closer to ground.
[0102] It should be noted that the present invention is not limited to the above embodiments, and various modifications are possible. For example, the first filter 10 may include two, three, or four or more resonators having a similar configuration to resonators 11-14 instead of resonators 11-14.
[0103] As described above, the multilayer electronic component of the present invention comprises a plurality of resonators and a laminate for integrating the plurality of resonators, the laminate including a plurality of stacked dielectric layers. Each of the plurality of resonators includes a first through-hole row, a second through-hole row, and a conductor layer connecting the first through-hole row and the second through-hole row. Each of the first and second through-hole rows is formed by two or more through-holes connected in series. The second through-hole row is provided between the conductor layer and ground in the circuit configuration. The laminate includes a first region and a second region, each of which at least one element is arranged. The first region and the second region are divided by a plurality of second through-hole rows.
[0104] In the multilayer electronic component of the present invention, multiple resonators may be connected in parallel to one another.
[0105] Furthermore, the multilayer electronic component of the present invention may further comprise a first circuit portion including at least one first element arranged in a first region, and a second circuit portion including at least one second element arranged in a second region. The first circuit portion may further comprise a plurality of resonators.
[0106] Furthermore, in the stacked electronic component of the present invention, the first region and the second region may be aligned in the longitudinal direction of the planar shape of the stacked material when viewed from the stacking direction of the plurality of dielectric layers. The plurality of second through-hole rows may be aligned in the short direction of the planar shape. [Explanation of Symbols]
[0107] 1...Stacked electronic component, 2...First port, 3...Second port, 4...Third port, 5,6...Signal path, 10...First filter, 11~14...Resonator, 20...Second filter, 21...High-pass filter circuit, 22...Low-pass filter circuit, 50...Laminate, 50A...Bottom surface, 50B...Top surface, 50C~50F...Side surface, 51~72...Dielectric layer, C11~C18,C21~C27...Capacitors, L21~L23...Inductors, R1...First region, R2...Second region.
Claims
1. Multiple resonators, A laminate for integrating the plurality of resonators, comprising a laminate including a plurality of stacked dielectric layers, The laminate has two surfaces located at both ends in the stacking direction of the plurality of dielectric layers, Each of the plurality of resonators includes a first row of through-holes, a second row of through-holes, and a conductor layer connecting the first row of through-holes and the second row of through-holes. Each of the first through-hole row and the second through-hole row is formed by connecting two or more through-holes in series. The first row of through-holes and the second row of through-holes are arranged between the conductor layer and one of the two surfaces. The second row of through-holes is provided between the conductor layer and the ground in the circuit configuration. The laminate includes a first region and a second region, each of which at least one element is arranged. A stacked electronic component characterized in that the first region and the second region are separated by a plurality of second through-hole rows.
2. The multilayer electronic component according to claim 1, characterized in that the plurality of resonators are connected in parallel with one another.
3. Furthermore, a first circuit portion including at least one first element arranged in the first region, The stacked electronic component according to claim 1, further comprising a second circuit portion including at least one second element arranged in the second region.
4. The multilayer electronic component according to claim 3, characterized in that the first circuit portion further includes the plurality of resonators.
5. The stacked electronic component according to any one of claims 1 to 4, characterized in that the first region and the second region are aligned in the longitudinal direction of the planar shape of the stacked body when viewed from the stacking direction.
6. The stacked electronic component according to claim 5, characterized in that the plurality of second through-hole rows are arranged in the short direction of the planar shape.