Method for manufacturing a polishing apparatus and a charged particle beam apparatus

Abstract

To realize co-rubbing with high accuracy for many kinds of cylindrical members.SOLUTION: A polishing device 100 for co-rubbing of cylindrical first member and second member has: a rotary table 109 on which the first member is placed, and which rotates around a rotation axis C extending in a vertical direction; an upper part gripping mechanism (102, 103) which fits the second member to the first member with a step, and grips the same stacked on the first member; a pressurizing part 110 which pressurizes the second member in the vertical direction by a pressing plate 110P; and a horizontal movable mechanism (105, 106, 112) to which the upper part gripping mechanism is coupled, and which enables horizontal movement of the upper part gripping mechanism independently from the pressurizing part.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a polishing device and a charged particle beam device, and more particularly to a method for manufacturing a charged particle beam device by polishing the joint surfaces between a plurality of members constituting an electron gun by co-polishing.

Background Art

[0002] Patent Document 1 discloses a co-polishing method for an annular member, and Patent Document 2 discloses a lapping machine capable of adjusting the pressing force. Patent Document 3 discloses an end face polishing device that presses a rod-shaped member W held via a support arm 30, a pressing member 37, and a fixing jig plate 27 against a polishing member 25a by pressing downward with a compression spring 36 (FIG. 3). These pressing parts are provided on a slide table 50 and are movable in the left-right horizontal direction by a slide mechanism.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] The electron gun of a charged particle beam device is manufactured by stacking a plurality of metal cylindrical members. In order to reduce mechanical vibrations of the electron gun, the members need to be sufficiently sealed. Conventionally, the co-polishing process for polishing the joint surfaces between the members has been performed manually.

[0005] Examples of polishing targets include annular mechanical seals in Patent Document 1, and gauges, optical instrument parts such as lenses, steel balls, and electronic component substrates such as liquid crystal substrates and semiconductor substrates in Patent Document 2. All of these are small parts, and the surfaces to be polished have relatively simple shapes such as flat surfaces, cylinders, holes, and spheres.

[0006] In contrast, in the case of components that make up the barrel of a charged particle beam apparatus, fitting parts are provided at the joint surface to accurately combine the components. If the fitting surface is polished along with the joint surface, there is a risk of reducing the sealing performance between the components. Not only the weight of the components, but also their size and side shape vary, making it difficult for machines to grip them stably when applying pressure, and making it difficult to control the polishing to only the joint surface, thus hindering the automation of the joint grinding process.

[0007] Patent Document 3 discloses an end-face polishing apparatus in which the pressurizing section is movable in the horizontal direction. However, this is intended to improve the utilization efficiency of the polishing member 25a and does not take into consideration the control of the horizontal component of the force applied to the rod-shaped member that is pressurized. [Means for solving the problem]

[0008] A polishing apparatus according to one embodiment of the present invention is a polishing apparatus for grinding together a cylindrical first member and a second member, comprising: a turntable on which the first member is placed and which rotates around a rotation axis extending in the vertical direction; an upper gripping mechanism that grips the second member which is fitted to the first member at a step and stacked on top of the first member; a pressing section that applies vertical pressure to the second member with a pressing plate; and a horizontal movable mechanism to which the upper gripping mechanism is connected and which allows the upper gripping mechanism to move horizontally independently of the pressing section. [Effects of the Invention]

[0009] The present invention enables highly accurate joint grinding of various cylindrical members. Other issues, configurations, and effects will be clarified by the following description of the embodiments. [Brief explanation of the drawing]

[0010] [Figure 1] This is a front view showing the main parts of the polishing device. [Figure 2] This is an example of a cross-sectional view of a cylindrical processed component. [Figure 3] This diagram shows a polishing machine used for grinding. [Figure 4] This diagram shows the grinding process using a polishing device. [Figure 5] This diagram shows the polishing apparatus after the lower component has been removed following the joint grinding process. [Figure 6] This diagram shows a polishing machine used for grinding. [Figure 7] This is a front view showing the main parts of the polishing device. [Figure 8] This diagram shows a polishing machine used for grinding. [Modes for carrying out the invention]

[0011] Embodiments of this invention will be described below with reference to the drawings. [Examples]

[0012] Figure 1 is a front view showing the main parts of a polishing device (lapping device) 100 that polishes the components constituting the barrel of a charged particle beam apparatus by grinding them together (mutual grinding). The polishing device 100 has a housing 101, gripping chucks (gripping parts) 102, 103, and 104 inside the housing 101, a rotating base 109 which is a base that rotates around a rotation axis C, and a pressurizing part 110.

[0013] When polishing by rubbing the first member (lower member) and the second member (upper member), the turntable 109 is pulled out from the housing 101, and the first member and the second member are stacked on the turntable 109. The stacked members and the turntable 109 are housed in the housing 101. The first member is gripped by the lower gripping chuck 104, the second member is gripped by the upper gripping chucks 102 and 103, and the turntable 109 rotates the first member while the first member and the second member are brought into close contact with each other by the pressing portion 110, thereby performing polishing. Here, an example of gripping the second member by two upper gripping chucks is shown, but the upper gripping mechanism for gripping the second member is not limited to this configuration as long as it can stably grip the second member. For example, the second member may be gripped by three or more upper gripping chucks.

[0014] The member on which the polishing device 100 performs polishing is cylindrical, but the diameter and height are diverse. Therefore, the support portions of the upper gripping chucks 102 and 103 are configured such that the positions where the respective gripping members 102M and 103M contact the second member can be adjusted according to the member. That is, the support portion of the upper gripping chuck 102 (103) has a cylinder structure and can be adjusted in the vertical direction (Z direction) by adjusting the amount of the rod 102R (103R) pulled out from the cylinder 102S (103S). After the height is adjusted, the second member is gripped by pressing the gripping member 102M and the gripping member 103M against each other in the Y direction. Further, during polishing, the pressing plate 110P that contacts the second member is configured to be vertically movable via the rod 110R from the cylinder 110S so that the first member and the second member can be brought into close contact with each other with an appropriate pressure.

[0015] The central axis of the cylinder 110S of the pressing portion 110 is arranged to coincide with the rotation axis C of the turntable 109, and the cylinder 110S is fixed to the housing 101.

[0016] The cylinders 102S and 103S of the upper gripping chucks 102 and 103 are attached to the chuck mounting plate 106. A recess 105 is provided on the surface of the chuck mounting plate 106 facing the housing 101, and a sliding roller 112 is provided on the housing 101 facing the recess 105. Thereby, the chuck mounting plate 106 can slide in the horizontal direction (X direction and / or Y direction) within the range of the size of the recess 105. A plurality of combinations of the sliding roller 112 and the recess 105 are provided so that the chuck mounting plate 106 is maintained horizontally and stably. The housing 101 is provided with holes for passing the upper gripping chucks 102 and 103, and the chuck mounting plate 106 is provided with holes for passing the pressing portion 110 so as not to hinder the movement of the chuck mounting plate 106. Thus, the chuck mounting plate 106 provided with the recess 105 and the sliding roller 112 function as a horizontal movement mechanism, and the relative positions of the pressing plate 110P and the gripping chucks 102 and 103 can be adjusted.

[0017] When the chuck mounting plate 106 is in a predetermined position (for example, the position where each sliding roller 112 is located at the center of each recess 105), the upper gripping chucks 102 and 103 are arranged symmetrically with respect to the rotation axis C. However, by moving the chuck mounting plate 106, within the range of the size of the recess 105, the symmetry axis of the upper gripping chucks 102 and 103 is allowed to deviate from the rotation axis C intentionally.

[0018] After the member to be processed is accommodated in the housing 101, the controller 111 controls the upper gripping chucks 102 and 103, the turntable 109, and the pressing portion 110 to perform polishing.

[0019] FIG. 2 shows a cross-sectional view example of a cylindrical member to be processed that is polished by the polishing apparatus 100. The member to be processed is a member that constitutes the lens barrel of a charged particle beam apparatus.

[0020] In this example, the outermost steps on the upper surface of the first member 201 and the lower surface of the second member 202 form the joining surfaces 203a and 203b, and the inner fitting surfaces 205a and 205b engage at a step. The shape is designed so that horizontal displacement does not occur between the members when assembled by overlapping and fitting the first and second members. In this example, a recess for fitting is formed in the first member 201 and a convex portion is formed in the second member 202, but the reverse is also possible. The bottom surface of the recess and the top surface of the convex portion are the joining surfaces.

[0021] Furthermore, while the basic shape of each component is axially symmetrical around the central axis D, it is common for notches or D-cuts to form recesses 204 on the sides.

[0022] During polishing (lapping) in the polishing apparatus 100, an abrasive compound corresponding to the desired smoothness is applied between the joint surfaces 203a and 203b to improve machinability and lubricity.

[0023] Figure 3 shows the polishing apparatus 100 for performing a joint grinding process on members 201 and 202. The members to be processed are the first and second members shown in Figure 2. During processing, the two members are stacked on the turntable 109 so that the rotation axis C of the turntable 109 coincides with the central axis D of the members. The lower member (first member) 201 is gripped by the lower gripping chuck 104, and the upper member (second member) 202 is gripped by the upper gripping chucks 102 and 103. To perform the joint grinding, the second member 202 is pressed vertically (Z direction) by the pressurizing unit 110.

[0024] Suppose the upper gripping chucks 102 and 103 are fixed to the housing 101 in the same way as the pressurizing section 110. If one gripping member comes into contact with a recess 204 provided on the side of the second member 202, the load on the second member 202 from the left and right upper gripping chucks 102 and 103 will be uneven. In this case, in addition to friction between the joint surfaces 203a and 203b (see Figure 2) due to pressure from the pressing plate 110P, unintended friction occurs at the mating surfaces 205a and 205b due to the second member receiving horizontal pressure, leading to a decrease in sealing performance.

[0025] In the polishing apparatus 100 of this embodiment, the chuck mounting plate 106 slides passively on the sliding roller 112 on the housing 101, independently of the pressurizing unit 110, in response to the uneven load on the left and right upper gripping chucks 102 and 103, thereby equalizing the load on the upper gripping chucks 102 and 103. As a result, no horizontal force acts on the mating surfaces 205a and 205b, so that the mating surfaces 205a and 205b do not rub against each other, and only the joining surfaces 203a and 203b can be machined with high precision.

[0026] Figure 4 shows the grinding process using the polishing device 100. Here, in order to further suppress the effects of uneven load on the upper gripping chuck, an example is shown in which the grinding process is performed while changing the gripping position of the upper member by the upper gripping chuck.

[0027] Step S01: The operator places the first member (lower member) 201 and the second member (upper member) 202 on the rotating base 109. In response to the operator's operation on the touch panel, the controller 111 secures the first member 201 with the lower gripping chuck 104.

[0028] Step S02: The controller 111 presses the pressing plate 110P against the second member 202, applying an appropriate load to the joint surfaces 203a and 203b between the members.

[0029] Step S03: The controller 111 grips the second member 202 with the upper gripping chucks 102 and 103. This suppresses the rotation of the second member 202 during processing.

[0030] Step S04: The controller 111 polishes the joint surfaces 203a and 203b between the first member 201 and the second member 202 by rotating the turntable 109. At this time, the turntable 109 is rotated at a speed that does not put a load on the motor.

[0031] Step S05: The controller 111 stops the turntable 109.

[0032] Step S06: The controller 111 opens the upper gripping chucks 102 and 103 and removes the gripping member from the second member 202.

[0033] Step S07: The controller 111 releases the pressurizing section 110 and removes the pressing plate from the second member 202.

[0034] Step S08: The controller 111 rotates the turntable 109 by a predetermined angle, for example, 30°.

[0035] Subsequently, steps S02 to S08 are repeated several times. In step S03, when the second member 202 is gripped by the upper gripping chucks 102 and 103, if the gripping members come into contact with the recess 204 of the second member 202, depending on the shape of the recess 204, the load may not be perfectly evenly distributed on the chuck mounting plate 106. For this reason, by performing polishing while changing the gripping position of the second member 202 by the upper gripping chucks 102 and 103 multiple times, the unevenness of the load is averaged out, thereby achieving polishing with a higher degree of parallelism on the joint surface.

[0036] In Figure 4, the method for changing the gripping position using the upper gripping chuck is pre-set and the controller 111 automatically controls it. However, the operator may also stop the device and change the gripping position as needed. [Examples]

[0037] In the case of a charged particle beam apparatus, the barrel is constructed by stacking the workpiece components in multiple layers, as shown in Figure 2, and the joint surface of each of the multi-layer workpiece components needs to be polished. When there are three or more layers of workpiece components, it is more efficient in the assembly process that follows the polishing process to proceed with the polishing process from the lower workpiece components to the upper workpiece components as a barrel. Therefore, in the polishing apparatus 100, the workpiece components are sequentially transferred from the lower workpiece components to the upper workpiece components and polished.

[0038] Figure 3 shows the state immediately after the completion of processing on the joint surface between the first member (lower member) 201 and the second member (upper member) 202. After this, the pressing plate 110P and the lower gripping chuck 104 are removed from the workpiece, and with the second member 202 lifted by the upper gripping chucks 102 and 103, the first member 201 is removed from the polishing device 100. This state is shown in Figure 5.

[0039] Next, the upper gripping chucks 102 and 103 are lowered to place the second member 202 on the turntable 109. Then, the operator places the third member 206, which will be the upper member of the second member, on top of the second member 202. This state is shown in Figure 6. In order to perform polishing of the joint surface between the second member (lower member) 202 and the third member (upper member) 206, the upper gripping mechanism grips the third member (upper member) 206, as in Figure 3, and with the third member (upper member) 206 being pressed vertically by the pressurizing unit 110, the turntable 109 rotates the second member (lower member) 202. If necessary, the method of changing the gripping position using the upper gripping chuck as shown in Figure 4 may also be performed. After the transfer process shown in Figures 5 and 6, the polishing process shown in Figures 3 and 4 is performed to polish the joint surface between the second member (lower member) 202 and the third member (upper member) 206. This allows for continuous polishing of the joint surfaces of the components and assembly of the components together, enabling rapid assembly of the microscope tube of the charged particle beam apparatus. [Examples]

[0040] In Example 1, an example was described in which the joint surface is pressed vertically by a pressure unit while lapping is performed. However, it is also possible to perform lapping without pressure from the pressure unit. In this case, the joint surface is pressed vertically by the weight of the upper member. Figure 7 shows a front view of the main part of the polishing device (lapping device) 100b that performs lapping by pressure from the weight of the upper member. The difference from the polishing device 100 in Figure 1 is the presence or absence of the pressure unit 110; otherwise, they are the same. Figure 8 shows the polishing device 100b performing lapping of members 201 and 202. The lapping process by the polishing device 100b is the same as the flow shown in Figure 4, but with steps S02 and S07 related to the pressure unit removed. In Example 3, the chuck mounting plate 106 slides passively on the sliding roller 112 on the housing 101 in accordance with the uneven load on the left and right upper gripping chucks 102 and 103 during lapping. As a result, the mating surfaces 205a and 205b do not experience friction, and only the joining surfaces 203a and 203b can be machined with high precision, enabling high-precision friction machining for various cylindrical members. The configuration of this embodiment should be used when the weight of the upper member (second member) 202 is sufficient to apply the load necessary for polishing to the joining surface, while the configuration of Embodiment 1 should be used when the weight of the upper member (second member) 202 is insufficient to provide the necessary load.

[0041] The present invention has been described above based on examples. The above-described examples can be modified in various ways without changing the gist of the invention. For example, in order to allow horizontal freedom between the positions of the upper gripping chucks 102 and 103 and the position of the pressurizing part 110 during polishing, a horizontal movable mechanism is provided by a chuck mounting plate 106 having a recess 105 and a sliding roller 112, but the invention is not limited to this configuration. For example, the chuck mounting plate 106 can be attached to the housing 101 in a state that is movable in the horizontal direction via an elastic body such as rubber. Furthermore, the polishing device 100 is not limited to polishing the members of the lens barrel of a charged particle beam device, but can be used as a polishing device for members of similar size and shape in general. [Explanation of Symbols]

[0042] 100,100b: Polishing device (lapping device), 101: Housing, 102,103: Upper gripping chuck, 102S,103S: Cylinder, 102R,103R: Rod, 102M,103M: Gripping member, 104: Lower gripping chuck, 105: Recess, 106: Chuck mounting plate, 109: Rotary table, 110: Pressing section, 110S: Cylinder, 110R: Rod, 110P: Pressing plate, 111: Controller, 112: Sliding roller, 201: First member, 202: Second member, 203: Joining surface, 204: Recess, 205: Fitting surface, 206: Third member.

Claims

1. In a polishing apparatus that grinds together a first member, which is cylindrical and has a circumferential recess or protrusion, and a second member, which has a circumferential protrusion or recess that fits into the recess or protrusion of the first member, The first member is placed on a rotating platform that rotates around a vertically extending axis, An upper gripping mechanism that grips the second member, which is stacked on top of the first member, at multiple points on its side by fitting a recess provided on either the first member or the second member with a protrusion provided on the other member, A pressing section that applies vertical pressure to the second member using a pressing plate, The upper gripping mechanism is coupled to a horizontal movable mechanism that allows the upper gripping mechanism to move horizontally independently of the pressurizing section, The controller includes an upper gripping mechanism that grips the second member, and while the joint surface between the first member and the second member is pressed vertically by the pressurizing part, the controller rotates the first member on the rotating table to polish the joint surface. The polishing apparatus includes a horizontal movable mechanism that, when a horizontal unevenness occurs in the gripping of the second member by the upper gripping mechanism during polishing of the joint surface, moves horizontally to eliminate the unevenness, thereby preventing the second member from being subjected to horizontal pressure.

2. In claim 1, The upper gripping mechanism comprises a first upper gripping portion and a second upper gripping portion. The first upper gripping portion and the second upper gripping portion each include a gripping member that contacts the side surface of the second member and a support portion that allows adjustment of the height at which the gripping member contacts the second member. A polishing device in which, when the horizontal movable mechanism is in a predetermined position, the first upper gripping portion and the second upper gripping portion are coupled to the horizontal movable mechanism such that they are symmetrical with respect to the rotation axis.

3. In claim 2, The horizontal movable mechanism includes a mounting plate to which the support portion of the first upper gripping portion and the support portion of the second upper gripping portion are attached, a sliding roller attached to the housing, and a recess provided on the surface of the mounting plate facing the housing. The sliding roller is a polishing device positioned so as to contact the recess of the mounting plate.

4. In claim 3, The pressurizing section is attached to the housing. A polishing device in which the mounting plate is provided with a hole for passing the pressurizing part through, and the housing is provided with a hole for passing the first upper gripping part and the second upper gripping part through.

5. In a polishing apparatus that grinds together a first member, which is cylindrical and has a circumferential recess or protrusion, and a second member, which has a circumferential protrusion or recess that fits into the recess or protrusion of the first member, The first member is placed on a rotating platform that rotates around a vertically extending axis, An upper gripping mechanism that grips the second member, which is stacked on top of the first member, at multiple points on its side by fitting a recess provided on either the first member or the second member with a protrusion provided on the other member, The controller includes an upper gripping mechanism that grips the second member, and rotates the first member on the rotating platform while it is under pressure from the weight of the second member, thereby polishing the joint surface between the first member and the second member. The polishing device is characterized in that, when a horizontal unevenness occurs in the gripping of the second member by the upper gripping mechanism during polishing of the joint surface, the upper gripping mechanism moves horizontally to eliminate the unevenness, thereby preventing the second member from being subjected to horizontal pressure.

6. In claim 5, The upper gripping mechanism is coupled to a horizontal movable mechanism that allows the upper gripping mechanism to move horizontally, The upper gripping mechanism comprises a first upper gripping portion and a second upper gripping portion. The first upper gripping portion and the second upper gripping portion each include a gripping member that contacts the side surface of the second member and a support portion that allows adjustment of the height at which the gripping member contacts the second member. A polishing device in which, when the horizontal movable mechanism is in a predetermined position, the first upper gripping portion and the second upper gripping portion are coupled to the horizontal movable mechanism such that they are symmetrical with respect to the rotation axis.

7. In claim 6, The horizontal movable mechanism includes a mounting plate to which the support portion of the first upper gripping portion and the support portion of the second upper gripping portion are attached, a sliding roller attached to the housing, and a recess provided on the surface of the mounting plate facing the housing. The sliding roller is a polishing device positioned so as to contact the recess of the mounting plate.

8. In claim 1 or claim 5, The controller is a polishing device that controls the upper gripping mechanism to polish the joint surface while changing the position in which it grips the second member.

9. In claim 8, The controller is a polishing device that rotates the turntable by a predetermined angle in order to change the position in which the upper gripping mechanism grips the second member.

10. In claim 1 or claim 5, A polishing apparatus having a lower gripping portion that grips the first member on the rotating table such that the rotation axis and the central axis of the first member coincide.

11. In claim 1 or claim 5, The first and second members are polishing devices that constitute the lens barrel of a charged particle beam apparatus.

12. A method for manufacturing a charged particle beam apparatus, The polishing apparatus for grinding together multiple cylindrical members that constitute the barrel of the charged particle beam apparatus comprises a turntable on which a first member having a circumferential recess or protrusion is placed and which rotates around a rotation axis extending vertically, and an upper gripping mechanism having a circumferential protrusion or recess that fits into the recess or protrusion of the first member and grips a second member stacked on top of the first member. The plurality of cylindrical members constituting the lens barrel include, in order from bottom to top, a lower member, a first upper member, and a second upper member when configured as a lens barrel. The lower member is placed on the rotating platform as the first member, and the first upper member is stacked on top of the lower member as the second member. The upper gripping mechanism grips the first upper member, and the joint surface between the lower member and the first upper member is pressed vertically by the pressure section of the polishing device or the weight of the first upper member. The rotating table rotates the lower member, thereby polishing the joint surface between the lower member and the first upper member. After polishing the joint surface between the lower member and the first upper member, the lower member is removed from the polishing device while the first upper member is lifted by the upper gripping mechanism. The upper gripping mechanism places the first upper member as the first member on the rotating table, and the second upper member as the second member is stacked on top of the first upper member. The upper gripping mechanism grips the second upper member, and the joint surface between the first upper member and the second upper member is pressed vertically by the pressure unit of the polishing device or the weight of the second upper member. The rotating table rotates the first upper member, thereby polishing the joint surface between the first upper member and the second upper member. If, during polishing of the joint surface between the lower member and the first upper member, horizontal unevenness occurs in the gripping of the first upper member by the upper gripping mechanism, the upper gripping mechanism moves horizontally to eliminate the unevenness, thereby preventing the first upper member from being subjected to horizontal pressure. A method for manufacturing a charged particle beam apparatus, characterized in that, when the upper gripping mechanism is polishing the joint surface between the first upper member and the second upper member, if horizontal unevenness occurs in the gripping of the second upper member by the upper gripping mechanism, it moves horizontally to eliminate the unevenness, thereby suppressing horizontal pressure on the second upper member.

13. In claim 12, The upper gripping mechanism grips the second member at multiple points on its side, A method for manufacturing a charged particle beam apparatus, characterized in that when polishing the joint surface between the first member and the second member, the upper gripping mechanism grips the second member in a state that allows it to move horizontally.

14. In claim 12 or claim 13, The controller of the polishing apparatus is When polishing the joint surface between the lower member and the first upper member, the upper gripping mechanism releases its grip on the first upper member, rotates the turntable by a predetermined angle, and then the upper gripping mechanism grips the first upper member again. This process is repeated, thereby polishing the joint surface while changing the position in which the upper gripping mechanism grips the first upper member. A method for manufacturing a charged particle beam apparatus, characterized in that when polishing the joint surface between the first upper member and the second upper member, the gripping mechanism releases its grip on the second upper member, rotates the turntable by a predetermined angle, and then repeatedly grips the second upper member again with the upper gripping mechanism, thereby polishing the joint surface while changing the position in which the upper gripping mechanism grips the second upper member.

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