Inspection method and inspection apparatus

Abstract

To provide a substrate inspection device and an inspection method for more accurately aligning a substrate and a probe of a probe card.SOLUTION: An inspection method for inspecting a substrate by means of an inspection device includes: a step S1 of moving a mounting member on which a substrate is mounted below a probe card held by a holding section; a step S4 of imaging, by means of a first imaging unit from a gap between the probe card and the mounting member, the substrate mounted on the mounting member, while imaging, by means of a second imaging unit, a probe of the probe card; a step S21 of moving the mounting member to a contact position being a reference position with respect to a horizontal direction; a step S22d of moving the mounting member upward from the reference position and imaging, by means of an aligner side imaging unit moving together with the mounting member, a target provided in the holding section; and a step S23 of correcting the contact position calculated from imaging results of the first imaging unit and the second imaging unit in the step S4 based on an imaging result of the aligner side imaging unit.SELECTED DRAWING: Figure 13

Description

Technical Field

[0001] The present disclosure relates to an inspection method and an inspection apparatus.

Background Art

[0002] Patent Document 1 discloses an inspection apparatus that moves a wafer placed on an alignment stage to a position where it contacts the probes of a probe card. This inspection apparatus executes a process including a step of acquiring the card center-of-gravity coordinates of the probe card by a first acquisition unit on the aligner side, and a step of acquiring, by the first acquisition unit, the reference coordinates in the target coordinate system of a reference target provided on the pogo frame. Further, the inspection apparatus executes a process including a step of acquiring the common coordinates between a second acquisition unit on the pogo frame side and the first acquisition unit, a step of acquiring the wafer center-of-gravity coordinates by the second acquisition unit, and a step of moving the aligner with a command including the contact coordinates obtained based on the card center-of-gravity coordinates, the common coordinates, and the wafer center-of-gravity coordinates.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The technology according to the present disclosure more accurately aligns the positions of a substrate and the probes of a probe card in an inspection apparatus for inspecting the substrate.

Means for Solving the Problems

[0005] One aspect of the present disclosure is an inspection method for inspecting a substrate using an inspection device, comprising: (A) moving a mounting member on which a substrate is placed below a probe card held in a holding unit; (B) thereafter imaging the substrate placed on the mounting member with a first imaging unit from between the probe card and the mounting member, and imaging the probe of the probe card with a second imaging unit; (C) moving the mounting member to a reference position in the horizontal direction; (D) raising the mounting member from the reference position and imaging a target provided in the holding unit with a third imaging unit that moves together with the mounting member; and (E) correcting the contact position calculated from the imaging results of the first imaging unit and the second imaging unit in step (B) based on the imaging results of the third imaging unit in step (D). [Effects of the Invention]

[0006] According to this disclosure, in an inspection device for inspecting a substrate, the alignment between the substrate and the probes of the probe card can be made more accurate. [Brief explanation of the drawing]

[0007] [Figure 1] This is a diagram illustrating the alignment method for comparison forms. [Figure 2] This is a diagram illustrating the alignment method for comparison forms. [Figure 3] This is a cross-sectional view showing a schematic configuration of the inspection device according to this embodiment. [Figure 4] This is a longitudinal cross-sectional view showing a schematic configuration of the inspection device according to this embodiment. [Figure 5] This is a side cross-sectional view of one of the divided regions of the inspection area. [Figure 6] This is a perspective view of the housing of the imaging unit. [Figure 7] This is a cross-sectional view of the periphery of the pogo frame. [Figure 8] This is a top view of the imaging unit. [Figure 9]This flowchart shows an example 1 of an inspection process involving a contact position determination process according to this embodiment. [Figure 10] This is a diagram illustrating Example 1 of the above inspection process. [Figure 11] This is a diagram illustrating Example 1 of the above inspection process. [Figure 12] This is a diagram illustrating Example 1 of the above inspection process. [Figure 13] This is a flowchart showing example 2 of an inspection process that involves determining the contact position. [Figure 14] This figure shows an example of an image of a correction target captured by the second imaging unit. [Figure 15] This figure shows an example of an image of a correction target captured by the aligner-side imaging unit. [Figure 16] This figure shows an example of a target that can also be used for angle discrimination. [Figure 17] This figure shows an example of an image of a target used for angle discrimination, captured by the first imaging unit. [Figure 18] This figure shows another example of an aligner-side imaging unit. [Modes for carrying out the invention]

[0008] In the semiconductor manufacturing process, a large number of semiconductor devices with predetermined circuit patterns are formed on a substrate such as a semiconductor wafer (hereinafter referred to as "wafer"). The formed semiconductor devices are inspected for electrical characteristics and other factors, and sorted into good and defective products. The inspection of semiconductor devices is performed, for example, using inspection equipment while the wafer is still in its original state before it is divided into individual semiconductor devices.

[0009] The inspection device is provided with a probe card having a large number of probes which are a large number of needle-like contact terminals. When inspecting electrical characteristics, first, the wafer and the probe card are brought close to each other, and the probes of the probe card contact each electrode of the semiconductor device formed on the wafer. In this state, an electrical signal is supplied from a tester provided above the probe card to the semiconductor device through each probe. Then, based on the electrical signal received by the tester from the semiconductor device through each probe, it is determined whether the semiconductor device is a defective product or not.

[0010] In order to appropriately perform such an electrical characteristic inspection, in the inspection device, alignment of the probes of the probe card and the wafer is performed, specifically, alignment of the probes and the electrodes on the wafer is performed.

[0011] As shown in FIG. 1, the inspection device 500 has, for example, a pogo frame 502 that holds a probe card 501, a chuck top 503 on which a wafer W is placed, and an aligner 504 that moves the chuck top 503. Further, the inspection device 500 is provided with an upper camera 510 for wafer recognition in a region that does not overlap with the probe card 501 in a plan view, and a lower camera 511 for probe card recognition is fixed to the aligner 504. In this inspection device 500, for example, alignment of the probe 501a of the probe card 501 and the wafer W on the chuck top 503 is performed based on the following imaging results. · The imaging result of the probe card 501 by the lower camera 511 in a state where the lower camera 511 is moved below the probe card 501 as shown in FIG. 1 · The imaging result of the wafer W on the chuck top 503 by the upper camera 510 in a state where the chuck top 503 is moved below the upper camera 510 located in a region that does not overlap with the probe card 501 in a plan view as shown in FIG. 2

[0012] However, the above alignment method has room for improvement in terms of alignment accuracy.

[0013] The technology described herein enables more accurate alignment between a substrate and the probes on a probe card in a substrate inspection apparatus.

[0014] The inspection method and inspection apparatus according to this embodiment will be described below with reference to the drawings. In this specification and the drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant explanations will be omitted.

[0015] <Inspection equipment> Figures 3 and 4 are a cross-sectional view and a longitudinal cross-sectional view, respectively, illustrating the schematic configuration of the inspection apparatus according to this embodiment.

[0016] The inspection apparatus 1 shown in Figures 3 and 4 is used to inspect a wafer W as a substrate, and specifically, to perform electrical characteristic testing of a semiconductor device formed on the wafer W as the device to be inspected. The inspection apparatus 1 has a housing 10, which is provided with an loading / unloading area 11, a transport area 12, and an inspection area 13. The loading / unloading area 11 is the area where the wafer W is loaded into and out of the inspection apparatus 1. The transport area 12 is the area connecting the loading / unloading area 11 and the inspection area 13. The inspection area 13 is the area where the electrical characteristic testing of the semiconductor device formed on the wafer W is performed.

[0017] The loading / unloading area 11 is provided with a port 20 for receiving a cassette C containing multiple wafers W, a loader 21 for housing probe cards (described later), and a control unit 22 for controlling each component of the inspection apparatus 1. The control unit 22 is composed of a computer, for example, equipped with a CPU and memory, and has a storage unit (not shown) for storing various information. The storage unit stores, for example, a program including instructions for inspection processing. The program may have been recorded on a storage medium readable by the computer and installed from that storage medium to the control unit 22. The storage medium may be temporary or permanent. Part or all of the program may be implemented on dedicated hardware (circuit board). The storage unit may be, for example, a storage device such as an HDD, a memory such as RAM for temporarily storing information necessary for program calculations, or a combination of these.

[0018] A transport device 30, capable of freely moving while holding a wafer W, is positioned in the transport area 12. This transport device 30 transports the wafer W between the cassette C in the port 20 of the loading / unloading area 11 and the inspection area 13. The transport device 30 also transports probe cards that require maintenance, which are fixed to the pogo frame described later in the inspection area 13, to the loader 21 in the loading / unloading area 11. Furthermore, the transport device 30 transports new or maintained probe cards from the loader 21 into the inspection area 13.

[0019] The inspection area 13 is equipped with multiple testers 40. Specifically, the inspection area 13 is divided into three sections vertically (Z direction in the figure) and two sections horizontally (X direction in the figure), as shown in Figure 4, for example, and each divided area 13a is equipped with two testers 40 arranged horizontally. In addition, each divided area 13a is equipped with an aligner 50 as a moving mechanism for each tester 40. Furthermore, each divided area 13a is equipped with one imaging unit 60. That is, in each divided area 13a, the imaging unit 60 is provided to be shared between horizontally adjacent testers 40. The number and arrangement of the testers 40, aligners 50, and imaging units 60 can be selected arbitrarily.

[0020] The tester 40 transmits and receives electrical signals for electrical characteristic testing to and from the wafer W. The aligner 50 is configured to hold the chuck top 70 (described later) and move horizontally (the X and Y directions in Figure 4, and the θ direction around the Z axis in Figure 3) and vertically (the Z direction in Figures 3 and 4). The aligner 50 is also used to align the wafer W placed on the chuck top 70 with the probes of the probe card (described later).

[0021] The imaging unit 60 images both the probe on the probe card and the wafer W placed on the chuck top 70.

[0022] The chuck top 70 is an example of a mounting member on which a wafer W is placed. The chuck top 70 can hold the placed wafer W by means of suction or other means.

[0023] In this inspection apparatus 1, while the transport device 30 is transporting a wafer W toward one tester 40, the other tester 40 can perform an inspection of the electrical characteristics of an electronic device formed on another wafer W.

[0024] <Inspection Area> Next, the more detailed configuration of the inspection area 13 will be explained using Figures 5 to 8. Figure 5 is a side cross-sectional view of one of the divided areas 13a of the inspection area 13. Figure 6 is a perspective view of the housing of the imaging unit 60, which will be described later. Figure 7 is a cross-sectional view of the periphery of the pogo frame, which will be described later. Figure 8 is a top view of the imaging unit 60.

[0025] As described above, each divided region 13a of the examination area 13 is provided with an aligner 50 and an imaging unit 60. In addition, as shown in Figure 5, each divided region 13a is provided with a pogo frame 80 and a probe card 90, which will be described later.

[0026] The aligner 50 includes, for example, an X stage 51, a Y stage 52, and a Z stage 53.

[0027] The X-stage 51 moves along a guide rail 51a that extends horizontally (in the X direction in the figure). A drive unit (not shown) is provided for the X-stage 51 to drive the above movement. The drive unit has, for example, a motor as a drive source that generates the driving force for the above movement. The X-stage 51 is also provided with a position detection mechanism (not shown) that detects the position of the X-stage 51 in the X direction, that is, the position of the chuck top 70 in the X direction. The position detection mechanism is, for example, a linear encoder.

[0028] The Y-stage 52 moves along the X-stage 51. Specifically, the Y-stage 52 moves along a guide rail 52a that extends horizontally (in the Y-direction in the figure). A drive unit (not shown) is provided for the Y-stage 52 to drive the above movement. The drive unit has, for example, a motor as a drive source that generates the driving force for the above movement. The Y-stage 52 is also provided with a position detection mechanism (not shown) that detects the position of the Y-stage 52 in the Y-direction, that is, the position of the chuck top 70 in the Y-direction. The position detection mechanism is, for example, a linear encoder.

[0029] The Z-stage 53 moves vertically via an extendable shaft 53a that is extendable and retractable in the vertical direction (Z-direction in the figure). A drive unit (not shown) is provided for the Z-stage 53 to drive the above movement. The drive unit has, for example, a motor as a drive source that generates the driving force for the above movement. The Z-stage 53 is also provided with a position detection mechanism (not shown) that detects the position of the Z-stage 53 in the Z-direction, that is, the position of the chuck top 70 in the Z-direction. The position detection mechanism is, for example, a linear encoder.

[0030] Furthermore, the chuck top 70 is detachably held by suction on the Z stage 53. The suction holding of the chuck top 70 by the Z stage 53 is performed by vacuum suction or the like using a suction holding mechanism (not shown). Furthermore, the Z-stage 53 is provided with a rotation mechanism (not shown) that rotates the Z-stage 53 around the Z-axis. This rotation mechanism has a drive unit that drives the rotation, and the drive unit has, for example, a motor as a drive source that generates the driving force for the rotation.

[0031] The aligner 50 is controlled by the control unit 22. Specifically, the aforementioned drive units of the X stage 51, Y stage 52, and Z stage 53 of the aligner 50 are controlled by the control unit 22. In addition, the position detection results from the aforementioned position detection mechanisms provided in the X stage 51, Y stage 52, and Z stage 53 are output to the control unit 22.

[0032] Furthermore, in this embodiment, the aligner 50 has an aligner-side imaging unit 54 (the third imaging unit according to this disclosure) fixed to it. Specifically, the aligner-side imaging unit 54 is fixed to the Z-stage 53 of the aligner 50. Therefore, when the aligner 50 moves the chuck top 70 it holds, the aligner-side imaging unit 54 also moves. In other words, the aligner 50 moves the aligner-side imaging unit 54 together with the chuck top 70.

[0033] The aligner-side imaging unit 54 recognizes the correction target 84 provided on the pogo frame 80, which will be described later. Specifically, in order to recognize the correction target 84, the aligner-side imaging unit 54 images the correction target 84.

[0034] The aligner-side imaging unit 54 has a camera that includes an optical system such as a lens and a light-receiving device (specifically, a photoelectric conversion device). The aligner-side imaging unit 54 is controlled by the control unit 22. The imaging results from the aligner-side imaging unit 54 are output to the control unit 22.

[0035] Furthermore, the aligner 50 is provided with a projection target 110 (see Figure 11, described later) configured to move back and forth in a direction intersecting the optical axis of the aligner-side imaging unit 54 relative to the focal plane of the aligner-side imaging unit 54. The projection target 110 is positioned so that when it moves upward above the aligner-side imaging unit 54, the center of the projection target 110 coincides with the optical axis and focal point of the camera of the aligner-side imaging unit 54. The projection target 110, like the aligner-side imaging unit 54, moves integrally with the chuck top 70 by the aligner 50.

[0036] As described above, the imaging unit 60 images both the probe 91 of the probe card 90 and the wafer W placed on the chuck top 70. This imaging unit 60 has a housing 60a. As shown in Figure 6, both the first imaging unit 61 and the second imaging unit 62 are fixed to the housing 60a. In other words, in the imaging unit 60, the first imaging unit 61 and the second imaging unit 62 are fixed to a common housing 60a. The first imaging unit 61 is located at the bottom of the housing 60a, and the second imaging unit 62 is located at the top of the housing 60a.

[0037] The first imaging unit 61 recognizes the wafer W placed on the chuck top 70. Specifically, the first imaging unit 61 images the wafer W in order to recognize the wafer W placed on the chuck top 70.

[0038] The second imaging unit 62 recognizes the probe 91 of the probe card 90. Specifically, the second imaging unit 62 images the probe 91 in order to recognize the probe 91 of the probe card 90.

[0039] Furthermore, the first imaging unit 61 and the second imaging unit 62 each have a camera that includes an optical system such as a lens and a light-receiving device (specifically, a photoelectric conversion device). In the imaging unit 60, the first imaging unit 61 and the second imaging unit 62 are arranged coaxially. Specifically, the optical axes P1 and P2 of the camera of the first imaging unit 61 and the camera of the second imaging unit 62 are coaxial. The imaging unit 60 is controlled by the control unit 22. The imaging results from the imaging unit 60 are output to the control unit 22.

[0040] Furthermore, the imaging unit 60 is configured to be movable in the horizontal direction (XY direction as shown in Figure 5, etc.) and the vertical direction (Z direction as shown in Figure 5, etc.) by the imaging movement mechanism 100 (see Figure 8). Specifically, the housing 60a of the imaging unit 60 is configured to be movable in the horizontal direction and the vertical direction by the imaging movement mechanism 100. The imaging movement mechanism 100 will be described later.

[0041] As shown in Figure 7, the tester 40 has a tester motherboard 41 at its bottom. Multiple test circuit boards (not shown) are mounted upright on the tester motherboard 41. In addition, multiple electrodes (not shown) are provided on the bottom surface of the tester motherboard 41. Furthermore, a pogo frame 80 is provided below the tester 40.

[0042] The pogo frame 80 is an example of a holding unit and holds the probe card 90. The pogo frame 80 also electrically connects the probe card 90 and the tester 40. For the aforementioned electrical connection, the pogo frame 80 has pogo pins 81, and specifically has a pogo block 82 that holds a number of pogo pins 81. The probe card 90 is fixed to the underside of the pogo frame 80, positioned in a predetermined location.

[0043] Furthermore, the tester motherboard 41 is vacuum-suctioned to the pogo frame 80 by an exhaust mechanism (not shown), and the probe card 90 is also vacuum-suctioned to the pogo frame 80. Due to the vacuum suction force used for these vacuum suctions, the lower end of each pogo pin 81 of the pogo frame 80 contacts the corresponding electrode on the upper surface of the card body 92 of the probe card 90 (described later), and the upper end of each pogo pin 81 is pressed against the corresponding electrode on the lower surface of the tester motherboard 41.

[0044] The probe card 90 has a disc-shaped card body 92 with multiple electrodes on its upper surface. Multiple needle-shaped contact terminals, called probes 91, are provided on the lower surface of the card body 92, extending downward. The multiple electrodes provided on the upper surface of the card body 92 are each electrically connected to a corresponding probe 91. During testing, each probe 91 also contacts an electrode (not shown) of a semiconductor device formed on the wafer W. Therefore, during electrical characteristic testing, electrical signals for testing are transmitted and received between the tester motherboard 41 and the semiconductor device on the wafer W via the pogo pins 81, the electrodes provided on the upper surface of the card body 92, and the probes 91.

[0045] Furthermore, in order to perform electrical characteristic testing of multiple semiconductor devices formed on a wafer W all at once, the inspection device 1 is equipped with numerous probes 91 that cover substantially the entire lower surface of the card body 92.

[0046] Furthermore, a bellows 83 is attached to the lower surface of the pogo frame 80. The bellows 83 is a cylindrical, expandable and retractable member that hangs down to surround the probe card 90. Also, as shown by the dotted line in Figure 7, the bellows 83 suction-holds the chuck top 70 at a position below the probe card 90.

[0047] The bellows 83 holds the chuck top 70 by adsorption, forming a sealed space S surrounded by the pogo frame 80 including the probe card 90, the bellows 83, and the chuck top 70. By reducing the pressure in the sealed space S using a depressurization mechanism (not shown), the contact state between the wafer W and the probe 91 can be maintained.

[0048] Furthermore, the pogo frame 80 is provided with a correction target 84. The correction target 84 is used to determine the contact position. The contact position is the position on the chuck top 70 in the horizontal direction (X and Y directions as shown in Figure 5, etc.) when the wafer W supported by the chuck top 70 and the probe 91 are brought into contact.

[0049] The height of the correction target 84 is such that when the aligner-side imaging unit 54 is raised together with the chuck top 70 so that the wafer W placed on the chuck top 70 is close to the probe 91 of the probe card 90 but does not make contact with it.

[0050] Furthermore, the horizontal position of the correction target 84 is, for example, the following position. That is, when the aligner-side imaging unit 54 is moved together with the chuck top 70 so that the horizontal position of the aligner-side imaging unit 54 is directly below the target, the entire wafer W placed on the chuck top 70 is the position where it overlaps with the probe 91 in a plan view. The position directly below the target on the aligner-side imaging unit 54 is the position where the optical axis of the aligner-side imaging unit 54 coincides with the correction target 84 (specifically, its center).

[0051] As described above, the housing 60a of the imaging unit 60 is configured to be movable in the horizontal and vertical directions by the imaging movement mechanism 100 shown in Figure 8.

[0052] The imaging movement mechanism 100 includes a pair of guide rails 101 and a pair of movement rails 102.

[0053] Each guide rail 101 is provided to extend horizontally (in the X direction in the figure). In one embodiment, the guide rail 101 is provided to connect a partition wall 10a separating divided regions 13a of the same height with the side wall of the housing 10 of the inspection device 1. Furthermore, a pair of guide rails 101 are spaced apart from each other so that the chuck top 70 can pass between them.

[0054] A pair of movable rails 102 are provided so as to extend horizontally and perpendicular to the guide rail 101 (the Y direction in the figure), and are configured to move along the guide rail 101 while supporting the housing 60a of the imaging unit 60. A drive unit (not shown) is provided for this pair of movable rails 102 to drive the movement. The drive unit has, for example, a motor as a drive source that generates the driving force for the movement. A position detection mechanism (not shown) is also provided for the pair of movable rails 102 to detect the position of the pair of movable rails 102 in the X direction, that is, the position of the housing 60a of the imaging unit 60 in the X direction. The position detection mechanism is, for example, a linear encoder.

[0055] Furthermore, the pair of movable rails 102 support the housing 60a of the imaging unit 60 so that it can move along the direction in which the movable rails 102 extend (Y direction in the figure) and the vertical direction (Z direction in the figure). Between the housing 60a of the imaging unit 60 and the pair of movable rails 102, there is a drive unit (not shown) that drives the movement of the movable rails 102 in the direction in which they extend and in the vertical direction. The drive unit has, for example, a motor as a drive source that generates the driving force for the above movement. In addition, a position detection mechanism (not shown) is provided with respect to the housing 60a of the imaging unit 60 to detect the position of the housing 60a in the direction in which the movable rails 102 extend and in the vertical direction. The position detection mechanism is, for example, a linear encoder.

[0056] The imaging movement mechanism 100 is controlled by the control unit 22. Specifically, the aforementioned drive unit for the moving rail 102 and the housing 60a is controlled by the control unit 22. In addition, the position detection results from the aforementioned position detection mechanism provided on the moving rail 102 and the housing 60a are output to the control unit 22.

[0057] <Example 1 of inspection process using inspection device 1> Next, an example of an inspection process involving the determination of the contact position using the inspection device 1 will be explained using Figures 9 to 12. Figure 9 is a flowchart of inspection process example 1. Figures 10 to 12 are diagrams illustrating inspection process example 1.

[0058] (Step S1: Transport) First, as shown in Figure 9, the wafer W to be inspected is transported to the desired tester 40. Specifically, the transport device 30 and the like are controlled by the control unit 22, and the wafer W is taken out from the cassette C in the port 20 of the loading / unloading area 11 and loaded, for example, into the upper divided area 13a, and placed on the chuck top 70 which is held by suction on the aligner 50 corresponding to the desired tester 40.

[0059] (Step S2: Move Chuck Top 70) Next, as shown in Figure 10, the chuck top 70 on which the wafer W is placed is moved below the probe card 90. Specifically, the control unit 22 controls the aligner 50, and the chuck top 70 on which the wafer W is placed is moved to a predetermined temporary contact position. When the chuck top 70 is at the temporary contact position, for example, in a plan view, all of the probes 91 of the probe card 90 overlap with the wafer W placed on the chuck top 70.

[0060] (Step S3: Movement of the first imaging unit 61 and the second imaging unit 62) Furthermore, the first imaging unit 61 and the second imaging unit 62 are moved to a position between the probe card 90 and the chuck top 70 below the probe card 90. Specifically, the control unit 22 controls the imaging movement mechanism 100, and the housing 60a of the imaging unit 60 is moved to the above position. The order of steps S2 and S3 does not matter, and steps S2 and S3 may be performed simultaneously.

[0061] (Step S4: Imaging) Subsequently, the first imaging unit 61 images the wafer W placed on the chuck top 70 from between the probe card 90 and the chuck top 70, and the second imaging unit 62 images the probe 91 of the probe card 90. In other words, the control unit 22 uses the first imaging unit 61, located between the probe card 90 and the chuck top 70, to acquire a representative position of the wafer W, and uses the second imaging unit 62, also located between the probe card 90 and the chuck top 70, to acquire a representative position of the probe 91.

[0062] The representative position of the wafer W is specifically obtained based on the imaging results of the first imaging unit 61 and the detection results of the position detection mechanism of the imaging movement mechanism 100. Furthermore, the representative position of the wafer W is, for example, the centroid position of a predetermined number of electrodes on the wafer W. The position of each electrode (specifically, its position coordinates) can be obtained, for example, based on the output from the position detection mechanism of the imaging movement mechanism 100 when the center of the electrode is located at the center of the image obtained by the first imaging unit 61.

[0063] The representative position of the probe 91 is specifically obtained based on the imaging results of the second imaging unit 62 and the detection results of the position detection mechanism of the imaging movement mechanism 100. Furthermore, the representative position of the probe 91 is, for example, the centroid position of a predetermined number of probes 91 on the probe card 90. The position (specifically, the position coordinates) of each probe 91 can be obtained, for example, based on the output from the position detection mechanism of the imaging movement mechanism 100 when the tip of the probe 91 is located at the center of the image obtained by the second imaging unit 62.

[0064] (Step S5: Move Chuck Top 70 to the reference position) Next, the chuck top 70 is moved so that its horizontal position becomes the reference position, that is, it is moved to the horizontal reference position. The reference position is the position where the horizontal position of the aligner-side imaging unit 54 is a predetermined position relative to the correction target 84, and the predetermined position is, for example, the position directly below the target mentioned above.

[0065] (Step S5a: Movement to the contact position) In step S5, for example, the chuck top 70 is first moved to a contact position calculated based on a representative position of the wafer W placed on the chuck top 70 and a representative position of the probe 91. In other words, the wafer W placed on the chuck top 70 and the probe 91 of the probe card 90 are aligned.

[0066] Specifically, the control unit 22 corrects the provisional contact position based on the imaging results from the first imaging unit 61 and the second imaging unit 62, and the corrected provisional contact position is determined as the contact position. Then, the control unit 22 controls the aligner 50, and the chuck top 70 is moved to the determined contact position.

[0067] The provisional contact position is corrected, for example, based on the representative position of the wafer W and the representative position of the probe 91 acquired in step S4. More specifically, the provisional contact position is corrected so that the positional deviation of the representative position of the wafer W from the representative position of the probe 91 is offset.

[0068] (Step S5b: Movement to the reference position based on imaging results) Subsequently, based on the imaging results from the first imaging unit 61 and the second imaging unit 62, the chuck top 70 is moved, and its horizontal position is set as the reference position.

[0069] Specifically, based on the imaging results of the second imaging unit 62, the control unit 22 controls the imaging movement mechanism 100. First, as shown in Figure 11, the housing 60a of the imaging unit 60 is moved so that the optical axis P2 of the camera of the second imaging unit 62 coincides with the correction target 84. This movement is performed, for example, so that the center of the correction target 84 is at the center of the image obtained by the second imaging unit 62.

[0070] Subsequently, based on the imaging results from the first imaging unit 61, the control unit 22 controls the aligner 50, and the chuck top 70 is moved so that the aligner-side imaging unit 54 and the first imaging unit 61 are coaxial. More specifically, under the control of the control unit 22, the projection target 110 is advanced or projected above the aligner-side imaging unit 54 to a position that is in focus with the aligner-side imaging unit 54 (i.e., a position where the optical axis P3 of the camera of the aligner-side imaging unit 54 coincides with the center of the projection target 110). Then, based on the imaging result of the projection target 110 by the first imaging unit 61, the control unit 22 controls the aligner 50 and moves the aligner-side imaging unit 54 and the projection target 110 together with the chuck top 70 so that the optical axis P1 of the camera of the first imaging unit 61 coincides with the projection target 110. This movement is performed, for example, so that the center of the projection target 110 is at the center of the image obtained by the first imaging unit 61.

[0071] As a result, the horizontal position of the chuck top 70 becomes the reference position, and the horizontal position of the aligner-side imaging unit 54 becomes the position directly below the target.

[0072] (Step S5c: Calculation of displacement) Next, the control unit 22 calculates the amount of movement of the chuck top 70 from the contact position to the reference position. This amount of movement is the amount of movement in the horizontal direction and is calculated, for example, based on the output from the position detection mechanism of the aligner 50.

[0073] (Step S6: Retract the first imaging unit 61 and the second imaging unit 62) After step S5, the first imaging unit 61 and the second imaging unit 62 are moved out of the area between the probe card 90 and the chuck top 70. Specifically, the control unit 22 controls the imaging movement mechanism 100 so that the parts of the housing 60a of the imaging unit 60 to which the first imaging unit 61 and the second imaging unit 62 are fixed, and the parts of the imaging movement mechanism 100 that may interfere with the chuck top 70 are moved out into the area between adjacent chuck tops 70 within the same divided area 13a. Step S6 may be performed before step S5c, or step S6 and step S5c may be performed simultaneously.

[0074] (Step S7: Raise the chuck top 70 and calibrate the reference position) Subsequently, the chuck top 70 is raised from the reference position, and the aligner-side imaging unit 54 images the correction target 84. The reference position is then calibrated based on the image of the correction target 84 taken by the aligner-side imaging unit 54.

[0075] Specifically, first, the aligner 50 is controlled by the control unit 22, and as shown in Figure 12, the chuck top 70 is raised from the reference position to the focusing height. The focusing height is the height at which the aligner-side imaging unit 54, which rises together with the chuck top 70, focuses on the correction target 84. Subsequently, the correction target 84 is imaged by the aligner-side imaging unit 54.

[0076] If the upward direction of the chuck top 70 and the aligner-side imaging unit 54 is appropriate and perpendicular to the correction target 84, the horizontal position of the aligner-side imaging unit 54 will remain unchanged before and after the chuck top 70 rises to the focus height, remaining directly below the target. However, due to distortion of the housing 10 on which the aligner 50 is installed, the upward direction of the chuck top 70 and the aligner-side imaging unit 54 may not be perpendicular to the correction target 84, but may be tilted. In this case, while the chuck top 70 and the aligner-side imaging unit 54 are rising, the horizontal position of the aligner-side imaging unit 54 will gradually shift from the position directly below the target. This means that as the chuck top 70 and the aligner-side imaging unit 54 rise, the horizontal reference position of the chuck top 70 shifts relative to the probe card 90 fixed to the pogo frame 80 on which the correction target 84 is provided.

[0077] Therefore, in this embodiment, the reference position of the chuck top 70 at the focusing height is calibrated as follows. Specifically, based on the imaging result of the correction target 84 by the aligner-side imaging unit 54, the control unit 22 controls the aligner 50 and moves the chuck top 70 so that the horizontal position of the aligner-side imaging unit 54 is directly below the target. This movement is performed so that the center of the correction target 84 is at the center of the image obtained by the aligner-side imaging unit 54. Then, the control unit 22 calculates the horizontal position of the chuck top 70 after the above movement based on the output from the position detection mechanism of the aligner 50 and acquires it as the calibrated reference position of the chuck top 70 at the focus height.

[0078] As a result, the reference position of the chuck top 70 before it is raised to the focusing height and the reference position of the chuck top 70 after calibration at the focusing height are approximately the same relative to the probe card 90 fixed to the pogo frame 80. In other words, the reference position is calibrated based on the horizontal displacement of the reference position of the chuck top 70 during the rise to the focusing height, and the aforementioned displacement is eliminated.

[0079] (Step S8: Correction of contact position) Next, the control unit 22 corrects the contact position calculated from the imaging results of the first imaging unit 61 and the second imaging unit 62 in step S4 based on the imaging results of the aligner-side imaging unit 54 in step S5. Specifically, the control unit 22 corrects, for example, the contact position determined in step S5 based on the calibrated reference position. More specifically, the control unit 22 calculates the corrected contact position based on the following formula, using the calibrated reference position of the chuck top 70 at the focus height obtained in step S7 and the amount of movement of the chuck top 70 from the contact position to the reference position calculated in step S5c. X2 = X1 - dx Y2 = Y1 - dy X1: X-coordinate of the reference position of the chuck top 70 after calibration at the focusing height. Y1: Y-coordinate of the reference position of the chuck top 70 after calibration at the focusing height. dx: Amount of movement of the chuck top 70 in the +X direction from the contact position (before correction) to the reference position (before calibration). dy: Amount of movement of the chuck top 70 in the +y direction from the contact position (before correction) to the reference position (before calibration). X2: X coordinate of the contact position after correction Y2: Y coordinate of the contact position after correction

[0080] In addition, in steps S7 and S8, the calibration of the reference position of the chuck top 70 and the correction of the contact position based on the calibrated reference position may also be performed in the direction around the Z axis.

[0081] (Step S9: Movement to the corrected contact position and upward movement) Subsequently, the control unit 22 controls the aligner 50, and after the chuck top 70 is moved to the corrected contact position, it is raised. The raising continues until the wafer W and the probe 91 make contact.

[0082] At this time, the reference height of the chuck top 70, which serves as the basis for determining how high to raise the chuck top 70, is determined as follows, for example. In other words, for example, when a representative position of the wafer W is acquired in step S4, the height of the wafer W placed on the chuck top 70 (specifically, the height of the electrodes) and the height of the probe 91 are also acquired, and the control unit 22 determines the reference height of the chuck top 70 from these heights. The height of the wafer W placed on the chuck top 70 is obtained based on the imaging results of the first imaging unit 61 and the detection results of the position detection mechanism relating to the vertical position of the imaging movement mechanism 100. Furthermore, the height of the probe 91 is obtained based on the imaging results of the second imaging unit 62 and the detection results of the position detection mechanism relating to the vertical position of the imaging movement mechanism 100.

[0083] (Step S10: Suction of Chuck Top 70) Subsequently, under the control of the control unit 22, the chuck top 70 is attracted to the pogo frame 80. Specifically, while the wafer W and the probe 91 are in contact, a depressurization mechanism (not shown) is controlled and the Z-stage 53 of the aligner 50 is lowered, thereby separating the chuck top 70 from the aligner 50 and adsorbing it onto the pogo frame 80.

[0084] (Step S11: Examination) After the chuck top 70 and aligner 50 are separated, the electrical characteristics of the electronic device formed on the wafer W are tested. Electrical signals for electrical characteristic testing are input from the tester 40 to the electronic device via pogo pins 81, probes 91, etc.

[0085] (Step S12: Removal) Afterward, the inspected wafer W is removed. Specifically, the chuck top 70, which was held in place by the pogo frame 80, is transferred to and held by the aligner 50. The inspected wafer W, which is held by the aligner 50 on the chuck top 70, is then removed from the inspection area 13 by the transport device 30 and returned to the cassette C in the port 20 of the loading / unloading area 11. During inspection at one tester 40, the aligner 50 or the like transfers the wafer W to be inspected to another tester 40 and retrieves the wafer W after inspection from the other tester 40.

[0086] <Main effects of this embodiment> In the configuration described using Figures 1 and 2 (hereinafter referred to as the comparative configuration), the imaging results of the wafer W are used to align the wafer W on the chuck top 503 of the inspection apparatus 500 with the probe 501a of the probe card 501, similar to the embodiment. However, in the comparative configuration, unlike the embodiment, when imaging the wafer W, the chuck top 503 is located in a region that does not overlap with the probe card 501 in a plan view, and there is a distance to the lower contact position of the probe card 501. Therefore, if there is distortion in the frame on which the aligner 504 is installed, in the comparative configuration, aligning the wafer W and the probe 501a based on the imaging results of the wafer W may not be accurate. In contrast, in this embodiment, when imaging the wafer W on the chuck top 70, the chuck top 70 is located at the lower contact position of the probe card 90. Therefore, even if there is distortion in the housing 10 on which the aligner 50 is installed, the wafer W and the probe 91 can be brought into contact more appropriately than in the comparative configuration. In other words, according to this embodiment, the alignment between the wafer W and the probe 91 of the probe card 90 can be performed more accurately. The distortion of the housing 10 and the like described above may occur on the order of μm, for example, due to expansion or contraction of the housing 10 due to temperature changes, or changes in the center of gravity of the multiple aligners 50 inside the housing 10.

[0087] Furthermore, in this embodiment, when the chuck top 70 is raised from the reference position, the aligner-side imaging unit 54 first images the correction target 84, and based on the imaging result, the reference position of the horizontal position of the chuck top 70 is calibrated. The uncalibrated reference position at the height before the chuck top 70 rises and the calibrated reference position at the height after the chuck top 70 rises (specifically, the focusing height) are approximately the same relative to the probe card 90 fixed to the pogo frame 80. Therefore, the uncorrected contact position based on the uncalibrated reference position at the height before rises and the corrected contact position based on the calibrated reference position at the height after rises are approximately the same relative to the probe card 90 fixed to the pogo frame 80. In this way, the horizontal displacement of the chuck top 70 during its rise is taken into account, and according to this embodiment, the alignment between the wafer W and the probe 91 of the probe card 90 can be made even more accurate.

[0088] <Example 2 of inspection process using inspection device 1> Figure 13 is a flowchart of example 2 of an inspection process that includes a contact position determination process using inspection device 1.

[0089] In the second example of the inspection process, steps S1 to S4 are performed, similar to the first example of the inspection process.

[0090] (Step S21: Movement to the contact position as the reference position) In addition, in the second example of the inspection process, following step S4, the chuck top 70 is moved to a reference position in the horizontal direction (step S21), similar to the first example of the inspection process. However, in this example, unlike the first example of the inspection process, the reference position is the contact position calculated from the imaging results by the first imaging unit 61 and the second imaging unit 62 in step S4, specifically, the contact position calculated based on the representative position of the wafer W and the representative position of the probe 91 acquired in step S4.

[0091] (Step S22: Raising the chuck top 70 and imaging the correction target 84) Next, similar to step S7 of example 1 of the inspection process, the chuck top 70 is raised from the reference position, and the correction target 84 is imaged by the aligner-side imaging unit 54.

[0092] (Step S22a: Alignment of the second imaging unit 62) However, in step S22, unlike step S7 described above, for example, first, before the chuck top 70 rises from its reference position, the control unit 22 controls the imaging movement mechanism 100 so that the housing 60a of the imaging unit 60 is moved so that the first imaging unit 61 and the aligner-side imaging unit 54 are coaxial. In other words, the second imaging unit 62, which moves together with the housing 60a, is aligned.

[0093] Specifically, under the control of the control unit 22, the projection target 110 is advanced to a position above the aligner-side imaging unit 54 and in focus with the aligner-side imaging unit 54. Then, based on the imaging result of the projection target 110 by the first imaging unit 61, the control unit 22 controls the imaging movement mechanism 100, and the housing 60a of the imaging unit 60 is moved so that the optical axis P1 of the camera of the first imaging unit 61 coincides with the projection target 110. This movement is performed, for example, so that the center of the projection target 110 is at the center of the image obtained by the first imaging unit 61.

[0094] (Step S22b: Imaging of the correction target 84 by the second imaging unit 62) Subsequently, the correction target 84 is imaged by the aligned second imaging unit 62. Specifically, with the housing 60a of the imaging unit 60 moved to a position where the optical axis P1 of the camera of the first imaging unit 61 coincides with the projection target 110, the correction target 84 provided on the pogo frame 80 is imaged by the second imaging unit 62. As a result, an image Im1 including the mark M1 on the correction target 84 is obtained, as shown in Figure 14.

[0095] (Step S22c: Retract the first imaging unit 61 and the second imaging unit 62) Next, similar to step S6 of Example 1 of the inspection process, the first imaging unit 61 and the second imaging unit 62 are retracted from the area between the probe card 90 and the chuck top 70.

[0096] (Step S22d: Raising the chuck top 70 and imaging the correction target 84) Subsequently, the chuck top 70 is raised from its reference position, and the correction target 84 is imaged by the aligner-side imaging unit 54. Specifically, first, the aligner 50 is controlled by the control unit 22, and the chuck top 70 is raised from the reference position to the focusing height. Then, the correction target 84 is imaged by the aligner-side imaging unit 54. This results in an image Im2 including the mark M1 on the correction target 84, as shown in Figure 15.

[0097] (Step S23: Correction of contact position) Next, the control unit 22 corrects the contact position calculated from the imaging results of the first imaging unit 61 and the second imaging unit 62 in step S4, based on the imaging results of the correction target 84 by the second imaging unit 62 and the aligner-side imaging unit 54.

[0098] Specifically, the control unit 22 corrects the contact position based on the imaging result of the correction target 84 by the second imaging unit 62 in step S22b and the imaging result of the correction target 84 by the aligner-side imaging unit 54 in step S22d. More specifically, the control unit 22 corrects the contact position based on the imaging result of the correction target 84 by the second imaging unit 62 in step S22b and the imaging result of the correction target 84 by the aligner-side imaging unit 54 in step S22d, so that the two imaging results match. That is, the control unit 22 corrects the contact position in the X direction, Y direction, and around the Z axis based on the image Im1 in Figure 14 and the image Im2 in Figure 15, so that the image obtained when the correction target 84 is imaged by the aligner-side imaging unit 54 after correction matches the image Im1.

[0099] Subsequently, similar to step S9 of Example 1 of the inspection process, the control unit 22 controls the aligner 50, and after the chuck top 70 is moved to the corrected contact position, it is raised. The raising continues until the wafer W and the probe 91 make contact. Furthermore, with the chuck top 70 in the corrected contact position, the aligner-side imaging unit 54 may perform imaging of the correction target 84 again, similar to step S22d. The degree of agreement between the imaging result of the correction target 84 by the second imaging unit 62 in step S22b and the re-imaging result of the correction target 84 by the aligner-side imaging unit 54 may be determined. Specifically, it may be determined whether the degree of positional displacement of the correction target 84 in the image obtained by the aligner-side imaging unit 54 relative to the position of the correction target 84 in the image obtained by the second imaging unit 62 falls within a predetermined range. If the degree of agreement is insufficient, that is, if the degree of positional displacement does not fall within the predetermined range, the contact position may be readjusted until it falls within that range.

[0100] After correcting the contact position, steps S10 to S12 are performed, similar to example 1 of the inspection process.

[0101] <Main effects of this embodiment> In the same way as in the first example of the inspection process, the second example of the inspection process allows for more accurate alignment between the wafer W and the probe 91 of the probe card 90. Furthermore, the second example of the inspection process also takes into account the horizontal displacement of the chuck top 70 while it is rising, thus enabling even more accurate alignment between the wafer W and the probe 91 of the probe card 90.

[0102] <Modified example of inspection process using inspection device 1 (Example 2)> As a projection target for aligning the second imaging unit 62 in step S22a, that is, a projection target for aligning the first imaging unit 61 and the aligner-side imaging unit 54, the angle-determining target 110A illustrated in Figure 16 may be used. The angle-determining target 110A is capable of determining the angle of the aligner-side imaging unit 54 with respect to the housing 60a of the imaging unit 60 in a top view (hereinafter referred to as the "relative angle of the aligner-side imaging unit 54"), and for example has two marks M2, M2 that are spaced apart from each other. Specifically, the angle-determining target 110A is formed such that, for example, the center of the line segment connecting the two marks M2, M2 is located at the center of the image Im3 captured by the aligner-side imaging unit 54, and that the line segment is parallel to the horizontal direction in the image Im3.

[0103] When using the angle discrimination target 110A described above, in step S22a, when the first imaging unit 61 and the aligner-side imaging unit 54 are made coaxial, the housing 60a of the imaging unit 60 is moved as follows. That is, based on the imaging result of the angle discrimination target 110A by the first imaging unit 61, the imaging movement mechanism 100 is controlled by the control unit 22, and the housing 60a of the imaging unit 60 is moved so that the optical axis P1 of the camera of the first imaging unit 61 coincides with the angle discrimination target 110A. As shown in Figure 17, this movement is performed so that the center of the line segment L connecting the two marks M2, M2 is at the center of the image Im4 obtained by the first imaging unit 61.

[0104] Furthermore, when using the angle discrimination target 110A, the first imaging unit 61 and the aligner-side imaging unit 54 are coaxial in step S22a, and the angle discrimination target 110A is imaged by the first imaging unit 61.

[0105] Furthermore, the control unit 22 acquires the relative angle of the aligner-side imaging unit 54 based on the imaging result of the angle discrimination target 110A by the first imaging unit 61. Specifically, the control unit 22 calculates the angle θ of the line segment L from the image Im4 obtained by the first imaging unit 61 while the first imaging unit 61 and the aligner-side imaging unit 54 are coaxially aligned, and acquires it as the relative angle of the aligner-side imaging unit 54.

[0106] Then, when correcting the contact position in step S23, the control unit 22 performs the correction based on the imaging results of the correction target 84 by the second imaging unit 62 and the aligner-side imaging unit 54, and the relative angle of the aligner-side imaging unit 54.

[0107] Specifically, the control unit 22 corrects the imaging result of the correction target 84 by the second imaging unit 62 based on the relative angle. Then, the control unit 22 corrects the contact position so that the corrected imaging result of the correction target 84 by the second imaging unit 62 matches the imaging result of the correction target 84 by the aligner-side imaging unit 54. In other words, the control unit 22 corrects the image Im1 in Figure 14 so that it is tilted by the aforementioned relative angle. Then, based on the corrected image Im1 and the image Im2 in Figure 15, the control unit 22 corrects the contact position in the X, Y, and Z directions so that the image obtained when the correction target 84 is captured by the aligner-side imaging unit 54 after correction matches the corrected image Im1.

[0108] Furthermore, the control unit 22 may correct the imaging result of the correction target 84 by the aligner-side imaging unit 54 based on the above relative angle, and the contact position may be corrected so that the corrected imaging result of the correction target 84 by the aligner-side imaging unit 54 matches the imaging result of the correction target 84 by the second imaging unit 62.

[0109] According to a modified example of the inspection process using the inspection device 1, the contact position is corrected by taking into account the relative angle of the aligner-side imaging unit 54, thereby enabling more accurate alignment between the wafer W and the probe 91 of the probe card 90.

[0110] <Modified example of inspection process using inspection device 1> In Example 1 of the inspection process using the inspection device 1, similar to the modification of Example 2 of the inspection process described above, the relative angle of the aligner-side imaging unit 54 may be acquired using the angle discrimination target 110A, and the contact position may be corrected using this relative angle as well.

[0111] <Other variations> In the above example, the first imaging unit 61 and the second imaging unit 62 were housed in the same housing, but they may be housed in separate housings. However, it is preferable that they be housed in the same housing because it eliminates the need to associate the coordinate system based on imaging by the first imaging unit 61 with the coordinate system based on imaging by the second imaging unit 62.

[0112] Furthermore, in the above example, when the first imaging unit 61 and the second imaging unit 62 are housed in the same housing, the optical axes of the first imaging unit 61 and the second imaging unit 62 coincided, but they may be misaligned. In this case, information on the positional relationship between the optical axes of the first imaging unit 61 and the second imaging unit 62 is also used for calibration of the reference position. However, if they are misaligned, it is difficult to accurately determine the positional relationship between the optical axes of the first imaging unit 61 and the second imaging unit 62, and this relationship changes due to distortion of the housing 10 caused by temperature changes, etc. Therefore, if the first imaging unit 61 and the second imaging unit 62 are mounted coaxially, it is possible to more reliably obtain the appropriate contact position, that is, to more reliably perform proper alignment.

[0113] In the above example, only one aligner-side imaging unit 54 and one correction target 84 were provided, but as shown in Figure 18, multiple units (two in the example shown) may be provided for each. Specifically, multiple aligner-side imaging units 54 and correction targets 84 may be provided along the circumferential direction of the chuck top 70 and probe card 90, respectively.

[0114] In this case, the chuck top 70 is raised from the reference position, and in the step where the correction target 84 is imaged by the aligner-side imaging unit 54, the corresponding correction target 84 is imaged for each aligner-side imaging unit 54. Furthermore, in the step where the contact position is corrected based on the image result of the correction target 84 by the aligner-side imaging unit 54, the contact position is corrected based on the image results from multiple third imaging units.

[0115] Specifically, in the aforementioned example 1 of the inspection process, each of the multiple aligner-side imaging units 54 is used when moving the chuck top 70 to the reference position in step S5. Then, in step S7, when calibrating the reference position, each of the multiple aligner-side imaging units 54 images the corresponding correction target 84, and the calibration is performed based on these imaging results.

[0116] Furthermore, in the aforementioned example 2 of the inspection process, in steps S22a and S22b, the second imaging unit 62 is aligned and the corresponding correction target 84 is imaged by the aligned second imaging unit 62 for each aligner-side imaging unit 54. In addition, in step S22d, the corresponding correction target 84 is imaged by each of the multiple aligner-side imaging units 54. Then, in step S23, the contact position is corrected for each aligner-side imaging unit 54 so that the image result of the corresponding correction target 84 by the second imaging unit 62 in step S22b matches the image result of the corresponding correction target 84 in step S22d.

[0117] Furthermore, when using the relative angles of the aligner-side imaging units 54 as described above, the above relative angles are acquired for each aligner-side imaging unit 54. In addition, in step S23, for each aligner-side imaging unit 54, either the imaging result in step S22b or the imaging result in step S22d is corrected based on the above relative angles. Then, for each aligner-side imaging unit 54, the contact position is corrected so that the corrected result matches the uncorrected result.

[0118] As described above, by providing multiple aligner-side imaging units 54 and correction targets 84, the alignment between the wafer W and the probe 91 of the probe card 90 can be made more accurate.

[0119] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the constituent elements of the embodiments described above can be combined in any way. Such any combination will naturally yield the functions and effects of each constituent element in the combination, as well as other functions and effects that will be apparent to those skilled in the art from the description herein.

[0120] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that will be apparent to those skilled in the art from the description herein, in addition to or instead of the effects described herein.

[0121] Furthermore, the following configuration examples also fall within the technical scope of this disclosure. (1) An inspection method for inspecting a substrate using an inspection device, (A) A step of moving a mounting member on which a substrate is placed below the probe card held in the holding part, (B) Subsequently, the first imaging unit images the substrate placed on the aforementioned mounting member from between the probe card and the aforementioned mounting member, and the second imaging unit images the probe of the probe card, (C) A step of moving the aforementioned mounting member to a reference position in the horizontal direction, (D) A step of raising the aforementioned mounting member from the reference position and imaging the target provided in the holding portion with a third imaging unit that moves together with the aforementioned mounting member, (E) An inspection method comprising the step of correcting the contact position calculated from the imaging results of the first imaging unit and the second imaging unit in step (B) based on the imaging results of the third imaging unit in step (D). (2) The reference position of the mounting member described above is a position in which the horizontal position of the third imaging unit is a predetermined position with respect to the target, The (D) step further involves calibrating the reference position based on the imaging result of the target by the third imaging unit, The inspection method according to (1), wherein step (E) is to correct the contact position based on the calibrated reference position. (3) The first imaging unit and the second imaging unit are fixed to a common housing, The above step (C) is, A step of moving the housing so that the optical axis of the second imaging unit coincides with the target, The inspection method according to (2), further comprising the step of moving the mounting member described above so that the third imaging unit and the first imaging unit are coaxial. (4) The inspection method according to (2) or (3), wherein the predetermined position is a position directly below the target where the optical axis of the third imaging unit coincides with the target. (5) The above step (C) is, The process of moving the mounting member to the contact position and then to the reference position, The process includes calculating the amount of movement of the aforementioned mounting member from the contact position to the reference position, The aforementioned (D) step is, The process of raising the aforementioned mounting member from the aforementioned reference position to a focusing height at which the third imaging unit focuses on the target, The process includes moving the mounting member so that the position of the third imaging unit is directly below the target when the mounting member has risen to the focusing height, and acquiring the position of the mounting member after the move as the reference position after calibration. The inspection method according to (4), wherein step (E) includes a step of calculating a corrected contact position based on the calibrated reference position and the amount of movement of the mounting member from the contact position to the reference position. (6) The inspection method according to (1), wherein the reference position of the mounting member described above is the contact position before correction. (7) The first imaging unit and the second imaging unit are fixed to a common housing, The aforementioned (D) step is, With the mounting member moved to the contact position before correction, the housing is moved so that the first imaging unit and the third imaging unit are coaxial. Subsequently, with the first imaging unit and the third imaging unit coaxial, the second imaging unit is used to image the target. The process then includes raising the aforementioned mounting member from the contact position before correction and imaging the target with the third imaging unit, The inspection method according to (6), wherein step (E) is to correct the contact position based on the imaging results of the target by the second imaging unit and the third imaging unit. (8) The inspection method according to (7), wherein step (E) is the inspection method according to (7), wherein the contact position is corrected so that the imaging result of the target by the second imaging unit matches the imaging result of the target by the third imaging unit. (9) The step of moving the housing in step (D) includes the step of moving the housing based on the result of imaging another target located between the first imaging unit and the third imaging unit by the first imaging unit, The inspection method further includes the step of obtaining the angle of the third imaging unit relative to the housing in a top view, based on the imaging result of the first imaging unit of the other target, The inspection method according to (7) or (8), wherein step (E) is to correct the contact position based on the imaging results from the second imaging unit and the third imaging unit and the angle of the third imaging unit with respect to the housing in the top view. (10) The inspection method according to (9), wherein step (E) is to correct either the imaging result of the first imaging unit and the third imaging unit of the other target based on the angle of the third imaging unit with respect to the housing in the top view, and correct the contact position so that the corrected one matches the other that has not been corrected. (11) The inspection method according to (9) or (10), wherein the other target has two marks spaced apart from each other. (12) The inspection apparatus has a plurality of the third imaging units, The (D) step involves imaging the corresponding target for each of the third imaging units. The inspection method according to any one of (1) to (11), wherein step (E) is to correct the contact position based on the imaging results from a plurality of third imaging units. (13) An inspection device for inspecting a substrate, A mounting member on which the substrate is placed, A holder for holding a probe card having probes that contact electrodes on a substrate, A first imaging unit that recognizes a substrate placed on the mounting member, A second imaging unit that recognizes the probe on the probe card held in the holding section, A target provided in the holding part, A third imaging unit that recognizes the aforementioned target, A moving mechanism that detachably holds and moves the mounting member, and also moves the third imaging unit together with the mounting member, An imaging movement mechanism for moving the first imaging unit and the second imaging unit, It comprises a control unit and, (A) A step of moving the aforementioned mounting member, which has a substrate placed below the probe card held in the holding part, (B) Subsequently, the first imaging unit images the substrate placed on the aforementioned mounting member from between the probe card and the aforementioned mounting member, and the second imaging unit images the probe of the probe card, (C) A step of moving the aforementioned mounting member to a reference position in the horizontal direction, (D) A step of raising the aforementioned mounting member from the reference position and imaging the target with the third imaging unit, An inspection apparatus configured to perform the following steps: (E) Correct the contact position calculated from the position of the probe based on the imaging results by the first imaging unit and the second imaging unit in step (B) based on the imaging results by the third imaging unit in step (D). (14) The reference position of the mounting member described above is a position in which the horizontal position of the third imaging unit is a predetermined position with respect to the target, The (D) step further involves calibrating the reference position based on the imaging result of the target by the third imaging unit, The inspection apparatus according to (13), wherein step (E) corrects the contact position based on the calibrated reference position. (15) The first imaging unit and the second imaging unit are further comprising an imaging unit fixed to a common housing, The imaging movement mechanism moves the first imaging unit and the second imaging unit by moving the housing of the imaging unit. The above step (C) is, A step of moving the housing so that the optical axis of the second imaging unit coincides with the target, The inspection apparatus according to (14), further comprising the step of moving the aforementioned mounting member so that the third imaging unit and the first imaging unit are coaxial. (16) The inspection apparatus according to (14) or (15), wherein the predetermined position is a position directly below the target where the optical axis of the third imaging unit coincides with the target. (17) The above step (C) is, The process of moving the mounting member to the contact position and then to the reference position, The process includes calculating the amount of movement of the aforementioned mounting member from the contact position to the reference position, The aforementioned (D) step is, A step of raising the aforementioned mounting member from the aforementioned reference position to a focusing height at which the third imaging unit aligns with the target, The process includes moving the mounting member so that the position of the third imaging unit is directly below the target when the mounting member has risen to the focusing height, and acquiring the position of the mounting member after the move as the reference position after calibration. The inspection apparatus according to (16), wherein step (E) includes a step of calculating a corrected contact position based on the calibrated reference position and the amount of movement of the mounting member from the contact position to the reference position. (18) The inspection apparatus according to (13), wherein the reference position of the mounting member described above is the contact position before correction. (19) The first imaging unit and the second imaging unit further comprise an imaging section fixed to a common housing, The imaging movement mechanism moves the first imaging unit and the second imaging unit by moving the housing of the imaging unit. The aforementioned (D) step is, With the mounting member moved to the contact position before correction, the housing is moved so that the first imaging unit and the third imaging unit are coaxial. Subsequently, with the first imaging unit and the third imaging unit coaxial, the second imaging unit is used to image the target. The process then includes raising the aforementioned mounting member from the contact position before correction and imaging the target with the third imaging unit, The inspection apparatus according to (18), wherein step (E) is performed to correct the contact position based on the imaging results of the target by the second imaging unit and the third imaging unit. (20) The inspection apparatus according to (19), wherein step (E) is performed to correct the contact position so that the imaging result of the target by the second imaging unit matches the imaging result of the target by the third imaging unit. (21) The step of moving the housing in step (D) includes the step of moving the housing based on the result of imaging another target located between the first imaging unit and the third imaging unit by the first imaging unit, The control unit is configured to further perform the step of obtaining the angle of the third imaging unit relative to the housing in a top view, based on the imaging result of the first imaging unit of the other target. The inspection apparatus according to (19) or (20), wherein step (E) corrects the contact position based on the imaging results from the second imaging unit and the third imaging unit and the angle of the third imaging unit with respect to the housing in the top view. (22) The inspection apparatus according to (21), wherein step (E) is performed by correcting either the imaging result of the first imaging unit and the third imaging unit of the other target based on the angle of the third imaging unit with respect to the housing in the top view, and correcting the contact position so that the corrected one matches the other that has not been corrected. (23) The inspection apparatus according to (21) or (22), wherein the other target has two marks spaced apart from each other. (24) Having a plurality of the third imaging units, The (D) step involves imaging the corresponding target for each of the third imaging units. The inspection apparatus according to any one of items (13) to (23), wherein step (E) corrects the contact position based on the imaging results from a plurality of third imaging units. [Explanation of Symbols]

[0122] 1. Inspection device 22 Control Unit 50 Alaina 54 Aligner-side imaging unit 61 First Imaging Unit 62 Second Imaging Unit 70 Chuck Top 80 Pogo Frame 84 Correction Target 90 Probe Card 91 probes 100 Imaging Movement Mechanism W wafer

Claims

1. An inspection method for inspecting a substrate using an inspection device, (A) A step of moving a mounting member on which a substrate is placed below the probe card held in the holding part, (B) Subsequently, the first imaging unit images the substrate placed on the aforementioned mounting member from between the probe card and the aforementioned mounting member, and the second imaging unit images the probe of the probe card, (C) A step of moving the aforementioned mounting member to a reference position in the horizontal direction, (D) A step of raising the aforementioned mounting member from the reference position and imaging the target provided in the holding portion with a third imaging unit that moves together with the aforementioned mounting member, (E) An inspection method comprising the step of correcting the contact position calculated from the imaging results of the first imaging unit and the second imaging unit in step (B) based on the imaging results of the third imaging unit in step (D).

2. The reference position of the mounting member is a position where the horizontal position of the third imaging unit is a predetermined position with respect to the target. The (D) step further involves calibrating the reference position based on the imaging result of the target by the third imaging unit, The inspection method according to claim 1, wherein step (E) is to correct the contact position based on the calibrated reference position.

3. The first imaging unit and the second imaging unit are fixed to a common housing. The above step (C) is, A step of moving the housing so that the optical axis of the second imaging unit coincides with the target, The inspection method according to claim 2, further comprising the step of moving the aforementioned mounting member so that the third imaging unit and the first imaging unit are coaxial.

4. The inspection method according to claim 2 or 3, wherein the predetermined position is a position directly below the target where the optical axis of the third imaging unit coincides with the target.

5. The above step (C) is, The process of moving the mounting member to the contact position and then to the reference position, The process includes calculating the amount of movement of the aforementioned mounting member from the contact position to the reference position, The aforementioned step (D) is, The process of raising the aforementioned mounting member from the aforementioned reference position to the focusing height at which the third imaging unit focuses on the target, The process includes moving the mounting member so that the position of the third imaging unit is directly below the target when the mounting member has risen to the focusing height, and acquiring the position of the mounting member after the move as the reference position after calibration. The inspection method according to claim 4, wherein step (E) includes a step of calculating a corrected contact position based on the calibrated reference position and the amount of movement of the aforementioned mounting member from the contact position to the reference position.

6. The inspection method according to claim 1, wherein the reference position of the mounting member is the contact position before correction.

7. The first imaging unit and the second imaging unit are fixed to a common housing. The aforementioned step (D) is, With the mounting member moved to the contact position before correction, the housing is moved so that the first imaging unit and the third imaging unit are coaxial. Subsequently, with the first imaging unit and the third imaging unit coaxial, the second imaging unit is used to image the target. The process then includes raising the aforementioned mounting member from the contact position before correction and imaging the target with the third imaging unit, The inspection method according to claim 6, wherein step (E) is to correct the contact position based on the imaging results of the target by the second imaging unit and the third imaging unit.

8. The inspection method according to claim 7, wherein step (E) is to correct the contact position so that the imaging result of the target by the second imaging unit matches the imaging result of the target by the third imaging unit.

9. The step of moving the housing in step (D) above includes the step of moving the housing based on the result of imaging another target located between the first imaging unit and the third imaging unit by the first imaging unit, The inspection method further includes the step of obtaining the angle of the third imaging unit relative to the housing in a top view, based on the imaging result of the other target by the first imaging unit. The inspection method according to claim 7, wherein step (E) is to correct the contact position based on the imaging results from the second imaging unit and the third imaging unit and the angle of the third imaging unit with respect to the housing in the top view.

10. The inspection method according to claim 9, wherein step (E) modifies either the imaging result of the first imaging unit and the third imaging unit of the other target based on the angle of the third imaging unit with respect to the housing in the top view, and corrects the contact position so that the modified one matches the unmodified one.

11. The inspection method according to claim 9, wherein the other target has two marks spaced apart from each other.

12. The inspection apparatus has a plurality of the third imaging units, The (D) step involves imaging the corresponding target for each of the third imaging units. The inspection method according to any one of claims 1 to 3, 6 to 11, wherein step (E) is to correct the contact position based on the imaging results from a plurality of third imaging units.

13. An inspection device for inspecting circuit boards, A mounting member on which the substrate is placed, A holder for holding a probe card having probes that contact electrodes on a substrate, A first imaging unit that recognizes a substrate placed on the mounting member, A second imaging unit that recognizes the probe on the probe card held in the holding part, A target provided in the holding part, A third imaging unit that recognizes the aforementioned target, A moving mechanism that detachably holds and moves the mounting member, and also moves the third imaging unit together with the mounting member, An imaging movement mechanism for moving the first imaging unit and the second imaging unit, It comprises a control unit and, (A) A step of moving the aforementioned mounting member, which has a substrate placed below the probe card held in the holding part, (B) Subsequently, the first imaging unit images the substrate placed on the aforementioned mounting member from between the probe card and the aforementioned mounting member, and the second imaging unit images the probe of the probe card, (C) A step of moving the aforementioned mounting member to a reference position in the horizontal direction, (D) A step of raising the aforementioned mounting member from the reference position and imaging the target with the third imaging unit, An inspection apparatus configured to perform the following steps: (E) correct the contact position calculated from the position of the probe based on the imaging results by the first imaging unit and the second imaging unit in step (B) based on the imaging results by the third imaging unit in step (D).

14. The reference position of the mounting member is a position where the horizontal position of the third imaging unit is a predetermined position with respect to the target. The (D) step further involves calibrating the reference position based on the imaging result of the target by the third imaging unit, The inspection apparatus according to claim 13, wherein step (E) is to correct the contact position based on the calibrated reference position.

15. The system further comprises an imaging unit in which the first imaging unit and the second imaging unit are fixed to a common housing, The imaging movement mechanism moves the first imaging unit and the second imaging unit by moving the housing of the imaging unit. The above step (C) is, A step of moving the housing so that the optical axis of the second imaging unit coincides with the target, The inspection apparatus according to claim 14, further comprising the step of moving the aforementioned mounting member so that the third imaging unit and the first imaging unit are coaxial.

16. The inspection apparatus according to claim 14 or 15, wherein the predetermined position is a position directly below the target where the optical axis of the third imaging unit coincides with the target.

17. The above step (C) is, The process of moving the mounting member to the contact position and then to the reference position, The process includes calculating the amount of movement of the aforementioned mounting member from the contact position to the reference position, The aforementioned step (D) is, The process of raising the aforementioned mounting member from the aforementioned reference position to a focusing height at which the third imaging unit aligns with the target, The process includes moving the mounting member so that the position of the third imaging unit is directly below the target when the mounting member has risen to the focusing height, and acquiring the position of the mounting member after the move as the reference position after calibration. The inspection apparatus according to claim 16, wherein step (E) includes a step of calculating a corrected contact position based on the calibrated reference position and the amount of movement of the aforementioned mounting member from the contact position to the reference position.

18. The inspection apparatus according to claim 13, wherein the reference position of the mounting member is the contact position before correction.

19. The first imaging unit and the second imaging unit further comprise an imaging section fixed to a common housing, The imaging movement mechanism moves the first imaging unit and the second imaging unit by moving the housing of the imaging unit. The aforementioned step (D) is, With the mounting member moved to the contact position before correction, the housing is moved so that the first imaging unit and the third imaging unit are coaxial. Subsequently, with the first imaging unit and the third imaging unit coaxial, the second imaging unit is used to image the target. The process then includes raising the aforementioned mounting member from the contact position before correction and imaging the target with the third imaging unit, The inspection apparatus according to claim 18, wherein step (E) is to correct the contact position based on the imaging results of the target by the second imaging unit and the third imaging unit.

20. The inspection apparatus according to claim 19, wherein step (E) is to correct the contact position so that the imaging result of the target by the second imaging unit matches the imaging result of the target by the third imaging unit.

21. The step of moving the housing in step (D) above includes the step of moving the housing based on the result of imaging another target located between the first imaging unit and the third imaging unit by the first imaging unit, The control unit is configured to further perform the step of obtaining the angle of the third imaging unit relative to the housing in a top view, based on the imaging result of the other target by the first imaging unit. The inspection apparatus according to claim 19, wherein step (E) is to correct the contact position based on the imaging results from the second imaging unit and the third imaging unit and the angle of the third imaging unit with respect to the housing in the top view.

22. The inspection apparatus according to claim 21, wherein step (E) modifies either the imaging result of the first imaging unit and the third imaging unit of the other target based on the angle of the third imaging unit with respect to the housing in the top view, and corrects the contact position so that the modified one matches the unmodified one.

23. The inspection apparatus according to claim 21, wherein the other target has two marks spaced apart from each other.

24. The system has multiple of the aforementioned third imaging units, The (D) step involves imaging the corresponding target for each of the third imaging units. The inspection apparatus according to any one of claims 13 to 15, 18 to 23, wherein the (E) step corrects the contact position based on the imaging results from a plurality of third imaging units.

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